JP2002185188A - Electronic component-packaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component-packaging device that prevents deviation in a position after an electronic circuit board is conveyed and electronic components are fitted, and that improves productivity. SOLUTION: Conveyance speed is kept fixed at loader rail, Y-table, and unloader rail sections 8, 9, and 10 in a conveyance section, the state of a packaged electronic component 5 is judged, and a substrate 7 is conveyed at an optimum conveyance speed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for loading a circuit board on which electronic components are to be mounted, mounting the electronic components on the unloaded circuit board, and discharging the board after mounting the electronic components. And methods.

[0002]

2. Description of the Related Art A conventional technique will be described below with reference to the drawings.

FIG. 6 is a diagram for explaining a conventional technique. That is, FIG. 6 is an enlarged perspective view of a main part of the electronic component mounting apparatus. Nozzle 1 positioned by XY robot 101
02 provided with the electronic component 1 to be mounted.
After being sucked from the component supply unit 104 to the nozzle 102, the head unit 103 is carried to the mounting position by the movement of the head unit 103, and is fixed to a Y table unit 106 of an XY table unit that can move in two orthogonal directions, X direction and Y direction. Circuit board 107
The electronic component 10 moved upward and adsorbed to the nozzle 102
5 is mounted on a predetermined position on the circuit board 107.

[0004] Next, a description will be given of a configuration of a transfer operation of the circuit board 107. The transport unit includes a loader rail unit 108 that waits for the next board 107 when the board is mounted, a Y table unit 106 that holds the board 107 when an electronic component is mounted on the circuit board 107, and an electronic component. And an unloader rail unit 110 that waits until the mounted circuit board 107 is conveyed to the device in the next step. Each of the loader rail section 108 and the unloader rail section 110 of the transport section has a pair of transport belts 111, 111 for flowing the circuit board 107, and the pair of transport belts 111, 111 are driven by an induction motor 112A. I have. Further, the Y table section 106 of the transport section has a pair of transport belts 111, 111 through which the circuit board 107 flows, and the pair of transport belts 111, 111.
1 is driven by an AC servomotor 112B.

Next, the operation of transporting the circuit board 107 will be described. The circuit board 107 carried out from the previous process is carried in by the loader belts 111 of the loader rail section 108. The circuit board 107 carried into the loader rail section 108 stops the loader belts 111 and 111 by a reaction of the board detection sensor 109 on the loader rail section 108 and waits. The circuit board 107 on standby on the board detection sensor 109 on the loader rail section 108 waits on the loader rail section 108 if the Y table section 106 has the circuit board 107. Further, when the circuit board 107 is not present in the Y table section 106, it is carried into the Y table section 106 from the loader rail section 108. Y table section 10
The circuit board 107 carried into 6 performs the electronic component mounting operation as described above.

Next, the circuit board 107 on which the electronic components 105 are mounted is carried out to the unloader rail section 110.

The transfer of the Y table unit 106 and the unloader rail unit 110 is started by the Y table unit 1
09, each belt 1 is detected by a board detection reaction of a circuit board detection sensor at the entrance of the unloader rail section 110.
11 and 111 are started. As a result, the Y table 106 and the unloader rail 110
The start timings of the belts 111 and 111 are different.

Since the Y table 106 is driven by the AC servo motor 112B, the transport speed of the Y table 106 can be changed. However, the loader rail 108 and the unloader rail 110 are driven by the induction motor 112A. Since each is driven, the transport speeds of the loader rail unit 108 and the unloader rail unit 110 cannot be changed. In addition, even if the speed can be changed by the speed controller, there is a variation in the set amount, and the optimum transfer speed control has not been achieved.

[0009]

However, in the above-described configuration, if the transport speed of the Y table section 106 is changed, the loader rail section 108 may move the Y table section 106 to the Y position.
Transfer of the substrate 107 to the table section 106 or Y
The transfer speed of the Y table unit 106 and the unloader rail unit 110 is different from the transfer speed of the substrate 107 from the table unit 106 to the unloader rail unit 110 (see FIG. 2).
(A)), the circuit board 107 is suddenly braked or accelerated, and the electronic component 105 on the circuit board 107 is
07 may cause a position shift.

In order to improve the transport quality, even if the transport speed is reduced to the minimum speed, the productivity is deteriorated, and whether the setting is over-specified (in other words, if the transport speed is too high, ) Could not be determined. That is, there is no means for automatically judging the optimum transport speed from the mounted components with respect to the transport speed.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems, and to provide an electronic component mounting apparatus which prevents a positional shift after mounting an electronic component when the electronic circuit board is transported and improves productivity. It is in.

[0012]

In order to achieve the above object, the present invention is configured as follows.

According to a first aspect of the present invention, in an electronic component mounting apparatus for mounting an electronic component on a circuit board, a board transfer holding unit for holding the board on which the electronic component is mounted,
A loader rail section for loading the circuit board into the board transfer holding section, an unloader rail section for unloading the circuit board from the board transfer holding section, the loader rail section, the board transfer holding section, and the unloader rail section; Between the carrying side and the carrying side when carrying out the carrying out and carrying in of the substrate between the carrying out side and the carrying side, it is provided with a control unit for controlling so that the carrying out of the circuit board is performed at a constant speed or a constant acceleration state. An electronic component mounting apparatus is provided.

According to a second aspect of the present invention, the control unit changes the speed or acceleration parameter according to the board size of the circuit board, and controls the transfer of the circuit board between the unloading side and the loading side at a constant speed. Alternatively, the electronic component mounting apparatus according to the first aspect, which is performed in a state of constant acceleration, is provided.

According to a third aspect of the present invention, the control unit determines the position of the center of gravity of the electronic component based on the dimensions of the electronic component, and mounts the electronic component based on the determined position of the center of gravity of the electronic component. An electronic component mounting apparatus according to the first or second aspect, wherein the substrate transport speed is set.

According to a fourth aspect of the present invention, a plurality of the electronic component mounting apparatuses according to any one of the first to third aspects are connected and arranged, and the electronic component mounting apparatus in the front-end side electronic component mounting apparatus is arranged. Provided is an electronic component mounting system that sets a transfer speed of a board from the electronic component mounting device on the front process side to the electronic component mounting device on the post process side based on a component mounting state.

According to a fifth aspect of the present invention, there is provided the electronic component mounting apparatus according to any one of the first to third aspects, and a printing machine for printing solder on the substrate as a pre-process of the electronic component mounting apparatus. And an electronic component mounting system that sets the transport speed of the board based on the amount of solder printed on the board by the printing machine.

According to a sixth aspect of the present invention, there is provided the electronic component mounting apparatus according to any one of the first to third aspects, and the electronic component mounted on the substrate as a post-process of the electronic component mounting apparatus. An inspection machine for inspecting, based on a result of inspecting the electronic component mounted on the board with the inspection machine, based on an electronic component having the worst gravity state among the electronic components mounted on the board, Electronic component mounting system for setting the transport speed of the electronic component.

According to a seventh aspect of the present invention, in the electronic component mounting method for mounting an electronic component on a circuit board, a loader for loading the circuit board into a board transfer holding unit for holding the board on which the electronic component is mounted is provided. When the board is unloaded and transferred between the rail section, the board transfer holding section, and the unloader rail section that unloads the circuit board from the board transfer holding section, the circuit board is transferred between the unloading side and the loading side. The electronic component mounting method is characterized in that the transfer is performed at a constant speed or a constant acceleration state.

According to the eighth aspect of the present invention, the speed or acceleration parameter is changed according to the board size of the circuit board, and the transfer of the circuit board between the unloading side and the loading side is performed at a constant speed or a constant acceleration state. An electronic component mounting method according to a seventh aspect is provided.

According to a ninth aspect of the present invention, the position of the center of gravity of the electronic component is determined based on the dimensions of the electronic component, and the transfer speed of the substrate on which the electronic component is mounted is determined based on the determined position of the center of gravity of the electronic component. The electronic component mounting method according to the seventh or eighth aspect, wherein

[0022]

Embodiments of the present invention will be described below in detail with reference to the drawings.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 5, FIG. 6, and FIG.

(First Embodiment) First, an electronic component mounting apparatus and method according to a first embodiment of the present invention will be described with reference to FIG.

In FIG. 1, a head unit 3 having three nozzles 2, 2, 2 positioned by an XY robot 1 is shown.
Means that the electronic components 5, 5, 5 to be mounted are supplied from the component supply unit 4 composed of, for example, a part cassette to the nozzles 2, 2, 2
Then, the head 3 is carried to the mounting position by the movement of the head 3. Next, the XY table section, which is movable in two orthogonal directions, the X direction and the Y direction, is moved onto the circuit board 7 fixed to the Y table section 9 as an example of a board transfer holding section, and the nozzles 2 are moved. The electronic component mounting operation is performed such that each electronic component 5 sucked to the device is mounted at each mounting position on the circuit board 7.

Next, a description will be given of a configuration of a transfer operation of the circuit board 7. The transport section includes a loader rail section 8 for holding the next board 7 when the board is mounted, and a Y section for holding the board 7 when electronic components are mounted on the circuit board 7.
It is composed of a table section 9 and an unloader rail section 10 that waits until the circuit board 7 on which electronic components have been mounted is conveyed to the device in the next step. Loader rail section 8 of the transport section
And a pair of transport belts 11A, 11A; 11A, which support the widthwise end of the circuit board 7 in a direction orthogonal to the transport direction of the circuit board 7 and allow the circuit board 7 to flow.
B, 11B; 11C, 11C, and a pair of conveyor belts 11A, 11A; 11B, 11B;
Motor 18 such as an AC servo motor or a linear motor
A, 18B, and 18C drive synchronously.

As shown in FIG. 7, the control unit 25 changes the transfer speed of each of the loader rail unit 8, the Y table unit 9, and the unloader rail unit 10 of the transfer unit, and executes various programs for calculating the board transfer speed. Recording / reading / executing to / from storage unit 90 as electronic component library, motor 18
A, 18B, and 18C are activated, and execution control of a production program and the like stored in the storage unit 90 is performed.

Next, the operation of transporting the circuit board 7 will be described. The following operation is performed under the control of the control unit 25.

Under the control of the control unit 25, the circuit board 7 unloaded from the preceding process is controlled by the motor 18A of the loader rail unit 8.
Is carried into the loader rail section 8 by the rotation of the pair of loader belts 11A, 11A. The circuit board 7 carried into the loader rail section 8 is carried in until the board is detected by the board detection sensor 13 for the loader rail section on the loader rail section 8, and after the board detection by the board detection sensor 13, the board detection sensor 13 is used. The motor 1 of the loader rail unit 8 is controlled by the control unit 25 based on the detection signal from the
The drive of 8A is stopped. As a result, the substrate 7 waits on the loader rail unit 8.

Circuit board 7 waiting on loader rail section 8
Indicates that the substrate 7 is present in the Y table section 9 (when the substrate is detected by the Y table section substrate detection sensor 23).
, It stands by at the loader rail section 8 as it is. Also, Y
When there is no board in the table section 9, the motor 18 A of the loader rail section 8 is driven under the control of the control section 25, and the circuit board 7 waiting on the loader rail section 8 is moved from the loader rail section 8. It is carried into the Y table section 9. That is, when there is no substrate on the Y table section 9, the loader rail section 8 drives the pair of transport belts 1 by driving the motor 8A.
1A and 11A are turned synchronously. At this time, the controller 25 controls the motor 8B of the Y table 9 so that the pair of conveyor belts 11B and 11B of the Y table 9 are simultaneously driven.
Drive. As a result, when the board 7 is transported from the loader rail section 8 to the Y table section 9, the motor 18A of the loader rail section 8 and the motor 18B of the Y table section 9 are driven synchronously by the control of the control section 25 to perform a pair of transport. Belt 11
A, 11A and the pair of transport belts 11B, 11B are simultaneously driven, so that the acceleration state or the maximum speed state at the time of transfer of the substrate 7 is as shown in FIG.
The control unit 25 controls the pair of transport belts 11A and 11A of the loader rail unit 8 and the pair of transport belts 11B and 11B of the Y table unit 9 to be in the same speed state or the same acceleration state.

The substrate 7 carried into the Y table section 9
After the board is detected by the board detection sensor 23 for the table section, the board is detected by the board detection sensor 23. After the board is detected by the board detection sensor 23, the motor 18B of the Y table section 9 is Stop driving. As a result, the substrate 7 stops on the Y table 9. The mounting operation of the electronic components is performed on the stopped circuit board 7.

After the mounting operation is completed, the board 7 on which the electronic components are mounted on the Y table section 9 has the board 7 on the unloader rail section 10 (the board detection sensor 3 for the unloader rail section).
3) (when the substrate is detected), it stands by in the Y table section 9 as it is. The unloader rail unit 10
If there is no board, the motor 18B of the Y table unit 9 is driven under the control of the control unit 25 of the Y table unit 9 to carry out the circuit board 7 from the Y table unit 9 to the unloader rail unit 10. Then, the circuit board 7 on which the electronic components have been mounted, which has been stopped on the Y table 9, is carried into the unloader rail 10 from the Y table 9. That is, Y
The table unit 9 rotates the pair of conveyor belts 11B, 11B in synchronization with the driving of the motor 8B. At this time, the control unit 25 drives the motor 8C of the unloader rail unit 10 so that the pair of transport belts 11C, 11C of the unloader rail unit 10 are also driven at the same time. As a result, when the substrate 7 is transported from the Y table section 9 to the unloader rail section 10, the motor 18B of the Y table section 9 and the motor 18C of the unloader rail section 10 are synchronously driven under the control of the control section 25 to perform a pair of transports. When the belts 11B and 11B and the pair of conveyor belts 11C and 11C are simultaneously driven, the acceleration state or the maximum speed state at the time of the transfer of the substrate 7 is, as shown in FIG. The control unit 25 controls the transport belts 11B and 11B and the pair of transport belts 11C and 11C of the unloader rail unit 10 to be in the same speed state or the same acceleration state.

According to the first embodiment, the control unit 2
5, when the circuit board 7 is transferred from the loader rail section 8 of the transfer section to the Y table section 9, the loader rail section 8 and the Y table section 9 are driven synchronously and controlled to the same speed or the same acceleration state. By doing so, even if the circuit board 7 moves from the loader rail section 8 to the Y table section 9, the impact force acting on the board 7 can be minimized, and the board transfer quality and productivity can be improved. . Further, under the control of the control section 25, when the circuit board 7 is transferred from the Y table section 9 to the unloader rail section 10, the Y table section 9 and the unloader rail section 10 are driven synchronously and have the same speed or the same acceleration. By controlling the state, even if the circuit board 7 moves from the Y table section 9 to the unloader rail section 10, the impact force acting on the board 7 can be minimized, and the board transfer quality and productivity are improved. be able to.

Even if the loader rail section 108, the unloader rail section 110, and the Y table section 106 are set to the same maximum speed, depending on the size of the substrate 107, it does not reach the maximum speed (constant speed). Cases occur. That is, the size of the circuit board 7 or the circuit board 7
The friction state between the substrate and the conveyor belt differs depending on the type of the Y-table section 9 and the speed or acceleration state on the loader rail section 8 side does not match the speed or acceleration state on the Y-table section 9 side. If the speed or acceleration state on the side does not match the speed or acceleration state on the unloader rail section 10 side, a timer is set so as to delay the start-up timing of the motor from a preset board transfer operation. Alternatively, the same speed or the same acceleration state at the time of transferring each substrate may be realized as shown in FIG. The board size is input to the electronic component library in advance, and the speed is set based on the input board size information. As an example, when there is a large-sized substrate and a medium-sized substrate having an area of about half of the area of the large-sized substrate, the speed of the large-sized substrate is about half that of the medium-sized substrate. Set.

Specifically, the loader section 8 and the Y table section 9
By controlling the respective speeds of the and the unloader unit 10 in accordance with the substrate size so as to be the speed determined by a calculation formula stored in advance, a uniform speed can be realized. In this way, taking the board size into consideration,
The drive timing of each of the motors of the loader unit 8, the Y table unit 9, and the unloader unit 10 can be changed as appropriate, and control can be performed at the maximum speed or the constant acceleration state at the time of transfer. Therefore, even if the substrate size is different, the impact force acting on the substrate when the substrate is transferred between the transfer units can be minimized, the substrate transfer quality can be improved, and the productivity can be improved. it can.

The loader rail section 8 and the Y table section 9
And the feedback of the velocity waveform between the Y table section 9 and the unloader rail section, and the control section 25 can control the velocity or acceleration of the transport belt in each transport section so as to be changed. It is.

(Second Embodiment) An electronic component mounting apparatus and method according to a second embodiment of the present invention will be described below with reference to FIGS.

In the electronic component mounting apparatus and method according to the second embodiment of the present invention, the state of the center of gravity of the electronic component is stored in the storage unit 81.
This is an apparatus and method for making a determination by referring to the electronic component library together with the dimensions, shape, and weight of the electronic component, and the center of gravity of the electronic component based on the dimensions, shape, and weight of the electronic component. The position of the electronic component can be set, and the transfer speed of the board on which the electronic component is mounted can be set for each electronic component based on the obtained center of gravity such as the center of gravity of the electronic component. The substrate transfer according to the first embodiment is performed at a speed.

FIG. 3 is a perspective view of a transformer 5A as an example of an electronic component. Transformer 5A center of gravity and transformer 5
By calculating the area of the leads 51,..., 51 of A,
The displacement of the transformer 5A due to the impact force acting on the transformer 5A during the transfer of the substrate can be determined. As an example, this impact force is provided by providing a pressure sensor on a substrate stopper that abuts the substrate when positioning the substrate, and when the substrate is abutted against the substrate stopper, the impact force acting on the substrate stopper from the substrate is measured by the pressure sensor. Can be detected and calculated.

Specifically, the following operation is performed by the control unit 25.

First, in step S1 of FIG. 4, the mounting data storage unit is stored in the data storage unit or is input from a communication medium such as a LAN or a storage medium such as a floppy (registered trademark) disk and is set according to a preset production board program. The dimensions of each electronic component, which is stored in the electronic component library or input from a storage medium such as a communication or a floppy disk, is input to a calculation program of an electronic component library.

Next, at step S2 in FIG. 4, the control unit 25 executes the above-mentioned arithmetic program to determine the position of the center of gravity of each electronic component. Calculate the center of gravity of the component and the lead area.

Next, in step S3 of FIG. 4, the NC program, which is stored in the data storage unit or input from a storage medium such as a communication or a floppy disk, is the most resistant to shocks among the electronic components to be mounted on the board 7. Calculate the impact force acting on weak electronic components.

Next, in step S4 of FIG. 4, an appropriate board transfer speed is automatically set for the electronic component weakest to the calculated impact, and the board transfer operation according to the first embodiment is performed. Become. For example, the substrate transfer speed is obtained from the shock value calculated based on the detection of the pressure sensor, and when the shock value 1.5 times the expected shock value is calculated, the substrate transfer speed is set to half the speed. .

From the above description, it is possible to produce a production board at an optimum board transfer speed in consideration of the center of gravity of the electronic component, and to improve the board transfer quality.

When calculating the impact force acting on the electronic component that is most vulnerable to impact, the center of gravity and the lead area of the electronic component are calculated only for those components that are likely to be misaligned due to the position of the center of gravity without calculating all the components. The calculation may be performed. For example, the center of gravity and the lead area of the electronic component may be calculated only for an electronic component having a certain size or weight.

According to the above-described second embodiment, it is generally necessary to reduce the board transfer speed for electronic components having a bad center of gravity. Conventionally, it was unclear how much the electronic component should be reduced. According to the electronic component mounted on the board, pick up the one with the worst center of gravity, and do not apply an excessive impact force to the electronic component, in other words, the board transfer speed that does not cause displacement after mounting Can carry the substrate. Therefore, in addition to the functions and effects of the first embodiment, the impact force acting on the substrate 7 can be further minimized, and the substrate transfer quality and productivity can be improved.

(Third Embodiment) Hereinafter, an electronic component mounting apparatus and method according to a third embodiment of the present invention will be described with reference to FIGS.

The electronic component mounting apparatus and method according to the third embodiment of the present invention carry out a substrate loading operation (substrate loading operation from the loader belt section 8 to the Y table section 9) depending on the state of the apparatus in the pre-process and the post-process. So that the speed is optimal
The substrate is transported by the production line control unit 80. That is, the board transfer speed is determined by the electronic component mounted in the previous process with the lowest center of gravity by LAN communication or mounting data, and the board transfer speed from the loader rail section 8 to the Y table section 9 is determined. In addition, for the board unloading operation after mounting the electronic components, the board transfer speed from the Y table section 9 to the unloader rail section 10 is determined by the electronic component having the worst center of gravity state after mounting.

As a result, in the board loading operation and the board unloading operation, the board transfer speed is changed depending on the mounted electronic components.

For example, as shown in FIG. 5, when a multi-function device (multi-function electronic component mounting device) 63 is connected after a high-speed device (high-speed electronic component mounting device) 62, the high-speed device 62 The board transfer from the high-speed device 62 to the multi-function device 63 is performed at a board transfer speed that matches the electronic component with the worst center of gravity among the mounted electronic components.

FIG. 5 shows a printing machine 61, a high-speed machine 62,
The multi-function device 63, the conveyor 64, the reflow device 65, and the inspection device 66 are connected in this order. After the electronic components are mounted at high speed by the high-speed device 62 on the circuit board on which the solder is printed by the printing device 61, Various types of electronic components are mounted on the board by the multi-function device 63. Then, the conveyor 64
After being conveyed to the reflow device 65 and undergoing a reflow process, the state of the electronic components on the substrate after the reflow is inspected by the inspection device 66.

According to the third embodiment, FIG.
In the production line, for example, the substrate transfer operation from the high-speed machine 62 to the multi-function machine 63 can be optimized based on information from the high-speed machine 62 which is a process preceding the multi-function machine 63. Further, the impact force acting on the substrate 7 can be minimized, and the substrate transfer quality and productivity can be improved.

(Fourth Embodiment) Hereinafter, an electronic component mounting apparatus and method according to a fourth embodiment of the present invention will be described with reference to FIGS.

As shown in FIG. 5, the electronic component mounting apparatus and method according to the fourth embodiment of the present invention employs a method of changing the board transfer speed depending on the amount of solder with the printing machine 61 and the result of the post-process performed by the printing machine 61. The change of the substrate transfer speed is made possible by the production line control unit 80.

For example, in the case of the printing machine 61, the amount of solder (solder thickness) of the solder printed on the board varies depending on the land pattern (board circuit design) and the electronic components to be mounted.
Therefore, it is necessary to set an optimum board transfer speed according to a land pattern (board circuit design) and an electronic component to be mounted.

Therefore, first, the amount of solder thickness is stored in the storage unit 81 based on the thickness of the screen of the printing machine 61. The stored solder thickness amount is obtained for each facility by network communication such as LAN communication or input of data to the production line control unit 80 using a storage medium such as an FD (floppy disk) to obtain solder thickness data.

The control unit of each facility connected to the production line control unit 80 analyzes the solder amount data, the electronic component data to be actually mounted, and the land data obtained from the production line control unit 80. Is performed, and the board transfer speed for each electronic component is determined. In this way, the production line control unit 80 controls the substrate to be transported at the slowest speed among the substrate transport speeds for each electronic component obtained by the control unit of each facility.

As described above, according to the fourth embodiment, the optimal transfer by soldering has not been conventionally performed. However, in the board transfer operation, the production line control unit 80 controls the printing machine 6.
More optimal board transfer can be performed based on the amount of solder. Therefore, the impact force acting on the substrate 7 can be further minimized, and the substrate transport quality and productivity can be improved.

(Fifth Embodiment) An electronic component mounting apparatus and method according to a fifth embodiment of the present invention will be described below with reference to FIGS.

In the electronic component mounting apparatus and method according to the fifth embodiment of the present invention, the production line control unit 80 checks the mounting position of the electronic component on the substrate 7 in the inspection machine 66, and then shifts the position. It is determined whether or not a positional shift has occurred in the substrate transport system based on the relationship between the electronic component and the center of gravity of the electronic component.

That is, when the mounting position shift electronic component determined by the inspection machine 66 is considered based on the center of gravity of the electronic component, it is determined in what order the mounted electronic component is.

The analysis of the center of gravity by the production line control unit 80 is performed in the X, Y, and Z directions, and it is also analyzed whether the deviation matches the direction of the mounting deviation. From the above analysis,
When the production line control unit 80 determines that there is a problem with the substrate transfer system, the multifunction device 63 and the high-speed device 62 are notified (LAN or FD). The high-speed machine 62 and the multi-function machine 63 are notified by the production line control unit 80 by the production line control unit 80, that is, the board conveyance speed from the high-speed machine 62 to the multi-function machine 63 and the multi-function machine 63 from the conveyor 64. To change the substrate transfer speed to the reflow device 65 to an optimal state. For example, if the direction of displacement of the center of gravity substantially coincides with the direction of substrate transport, it is determined that the displacement of the center of gravity has occurred due to substrate transport, and it is determined that there is a problem with the substrate transport system. In this case, the impact value is reconfirmed, and a setting is made so as to further reduce the substrate transfer speed.

As described above, according to the fifth embodiment, it is determined whether or not the mounting position deviation phenomenon determined by the inspection device 66 is caused by substrate transport. The optimal substrate transfer speed can be changed. Therefore, based on the inspection result information on the downstream side of the production line, the impact force acting on the substrate 7 can be further minimized, and the substrate transport quality and productivity can be improved.

It is to be noted that by appropriately combining any of the various embodiments described above, the effects of the respective embodiments can be achieved.

[0066]

When the circuit board is transferred from the loader rail section of the transfer section to the board transfer holding section such as the Y table section or the Y rail section, the board transfer holding section is synchronously driven from the loader rail section and the same. By controlling the speed or the same acceleration state, even if the circuit board moves from the loader rail section to the board transfer holding section, the impact force acting on the board can be minimized, improving the board transfer quality and productivity. Can be planned. In addition, when the circuit board is transferred from the board transfer holding section to the unloader rail section, the board transfer holding section is driven in synchronization with the unloader rail section and controlled to the same speed or the same acceleration state, whereby the board transfer holding section is controlled. Even if the circuit board transfers to the unloader rail from
The impact force acting on the substrate can be minimized, and the substrate transfer quality and productivity can be improved.

Therefore, it is possible to prevent the displacement of the electronic circuit board at the time of transportation, thereby improving the productivity.

Also, the electronic component mounted on the substrate with the worst state of the center of gravity is picked up, and an excessive impact force is not applied to the electronic component. In other words, the substrate is transported to such an extent that no displacement occurs after mounting. When the speed is set, the substrate transfer can be more stably and reliably performed, and the substrate transfer quality and productivity can be improved.

Further, in the production line, when optimizing the board transfer operation based on information such as the displacement of the electronic component in the pre-process or post-process and the amount of solder on the board, if the entire production line is to be optimized, In addition, the substrate transfer can be performed more stably and reliably, and the substrate transfer quality and the productivity can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic configuration of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIGS. 2A and 2B show the relationship between the speed and the time when a substrate is transferred between a loader unit, a Y table unit, and an unloader unit according to the related art and the first embodiment of the present invention, respectively. FIG.

FIG. 3 is a schematic perspective view of a transformer component for explaining an electronic component mounting method according to a second embodiment of the present invention.

FIG. 4 is a flowchart for explaining an electronic component mounting method according to a second embodiment of the present invention.

FIG. 5 is a schematic configuration diagram of an electronic component mounting apparatus for describing electronic component mounting methods according to third to fifth embodiments of the present invention.

FIG. 6 is a perspective view illustrating a schematic configuration of a conventional electronic component mounting apparatus.

FIG. 7 is a block diagram related to a control unit of the electronic component mounting apparatus according to the first and second embodiments of the present invention.

FIG. 8 is a block diagram related to a control unit of the electronic component mounting apparatus according to the third to fifth embodiments of the present invention.

[Explanation of symbols]

1. XY robot, 2. Nozzle, 3. Head section, 4.
Component supply section, 5: electronic component, 7: circuit board, 8: loader rail section, 9: Y table section, 10: unloader rail section, 11A, 11B, 11C: transport belt, 13: board detection sensor for loader rail section , 18A, 18B, 18C
... Induction motor, 23 ... Substrate detection sensor for Y table part, 25 ... Control unit, 33 ... Substrate detection sensor for unloader rail part, 61 ... Printer, 62 ... High speed machine, 63 ...
Multi-function machine, 64: Conveyor, 65: Reflow device, 66
... Inspection machine, 80 ... Production line control unit, 81 ... Storage unit, 9
0: storage unit.

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Takeshi Kuribayashi 1006 Kadoma, Kadoma, Osaka Prefecture F-term (reference) in Matsushita Electric Industrial Co., Ltd. 5E313 AA02 AA11 CC04 CC05 DD02 DD05 DD07 DD12 DD14 DD50 EE24 EE25 EE35 FG01 FG05 FG06 FG10

Claims (9)

[Claims] 1. An electronic component mounting apparatus for mounting an electronic component (5) on a circuit board (7), comprising: a substrate transfer holding unit (9) for holding the substrate on which the electronic component is mounted; A loader rail section (8) for loading the circuit board into the unloader rail section (10), and an unloader rail section (10) for unloading the circuit board from the board transport and holding section; And a control unit (25) for controlling the transfer of the circuit board between the unloading side and the loading side so as to be performed at a constant speed or an equal acceleration state when the board is unloaded and transferred between the unloading side and the unloading side. An electronic component mounting apparatus characterized in that: 2. The control unit changes the speed or acceleration parameter according to the size of the circuit board, and performs the transfer of the circuit board between the carry-out side and the carry-in side at a constant speed or a constant acceleration state. 2. The electronic component mounting apparatus according to 1. 3. The control section determines a center of gravity of the electronic component based on the dimensions of the electronic component, and sets a transfer speed of the board on which the electronic component is mounted based on the determined center of gravity of the electronic component. The electronic component mounting apparatus according to claim 1. 4. A plurality of electronic component mounting apparatuses (62, 63) according to any one of claims 1 to 3 connected and arranged, and an electronic component mounting state in an electronic component mounting apparatus on a front process side. An electronic component mounting system that sets a transfer speed of a substrate from the electronic component mounting apparatus on the front process side to the electronic component mounting apparatus on the post process side based on the above. 5. An electronic component mounting apparatus (62) according to any one of claims 1 to 3, and a printing machine (61) for printing solder on the substrate as a pre-process of the electronic component mounting apparatus. An electronic component mounting system, comprising: setting a transfer speed of the substrate based on an amount of solder printed on the substrate by the printing machine. 6. An electronic component mounting apparatus (62) according to any one of claims 1 to 3, further comprising: an inspection machine (62) for inspecting an electronic component mounted on the substrate as a post-process of the electronic component mounting apparatus. 66) based on the result of inspecting the electronic components mounted on the board by the inspection machine, and transporting the board based on the electronic component having the worst center of gravity among the electronic components mounted on the board. An electronic component mounting system that sets the speed. 7. An electronic component mounting method for mounting an electronic component (5) on a circuit board (7), wherein the circuit board is loaded into a board transfer holding unit (9) for holding the substrate on which the electronic component is mounted. When the board is carried in and out of the loader rail section (8), the board transfer holding section, and the unloader rail section (10) for unloading the circuit board from the board transfer holding section, the board is transferred to the unloading side. An electronic component mounting method, wherein the transfer of the circuit board between the loading side and the loading side is performed at a constant speed or a constant acceleration state. 8. The electronic device according to claim 7, wherein a speed or an acceleration parameter is changed according to a board size of the circuit board, and the transfer of the circuit board between the carry-out side and the carry-in side is performed at a constant speed or a constant acceleration state. Component mounting method. 9. The method according to claim 7, wherein the position of the center of gravity of the electronic component is determined based on the size of the electronic component, and the transfer speed of the substrate on which the electronic component is mounted is set based on the determined position of the center of gravity of the electronic component. Electronic component mounting method according to the item.