JPH058835A - Transfer control method for printed circuit board - Google Patents
Transfer control method for printed circuit boardInfo
- Publication number
- JPH058835A JPH058835A JP3165504A JP16550491A JPH058835A JP H058835 A JPH058835 A JP H058835A JP 3165504 A JP3165504 A JP 3165504A JP 16550491 A JP16550491 A JP 16550491A JP H058835 A JPH058835 A JP H058835A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- transfer
- control method
- conveyor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Control Of Conveyors (AREA)
- Delivering By Means Of Belts And Rollers (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、部品実装機及び複数の
実装機から構成される部品実装工程におけるプリント基
板の搬送制御方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for controlling the transfer of a printed circuit board in a component mounting process including a component mounting machine and a plurality of mounting machines.
【0002】[0002]
【従来の技術】従来、部品実装機やその周辺機器等によ
って構成されている部品実装工程において基板搬送を行
う際に、あらかじめ部品厚みが厚い(部品の高さが高
い)部品が前工程で実装されている場合、また実装機自
身で同様の部品を実装した場合、その部品が搬送途中で
横倒または位置ずれを起こさないように基板を搬送しな
ければならない。2. Description of the Related Art Conventionally, when a board is carried in a component mounting process which is composed of a component mounting machine and its peripheral devices, etc., a component having a thick component thickness (high component height) is previously mounted in the preceding process. If the same component is mounted by the mounting machine itself, the substrate must be transported so that the component does not fall over or shift in position during transportation.
【0003】この課題に対して、従来は搬送速度を極端
に遅くすることで対処する方法がとられてきた。Conventionally, there has been taken a method of dealing with this problem by making the conveying speed extremely slow.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、部品実
装機の実装速度が高速化し、より一層の生産効率の向上
が求められる今日、プリント基板の搬送時間を従来のよ
うに極端に遅くすることは、部品実装機単体の稼働効率
を低下させることのみならず、工程全体の効率低下につ
ながるという課題を有している。However, in today's demand for higher mounting speed of component mounters and further improvement in production efficiency, it is necessary to extremely slow the transfer time of the printed circuit board as in the conventional case. There is a problem that not only the operating efficiency of the component mounter itself is reduced, but also the efficiency of the entire process is reduced.
【0005】本発明は、上記課題を解決するものであ
り、基板搬送速度を最適に制御することによってプリン
ト基板を効率よく搬送するプリント基板搬送制御方法を
提供することを目的とするものである。The present invention has been made to solve the above problems, and an object of the present invention is to provide a printed circuit board transport control method for efficiently transporting a printed circuit board by optimally controlling the substrate transport speed.
【0006】[0006]
【課題を解決するための手段】本発明は上記目的を達成
するために、ベルトコンベア(以下搬送コンベアと記
す)と、その搬送コンベアを駆動するための駆動装置
と、駆動装置を制御するための制御装置とから構成され
るプリント基板搬送装置において、搬送コンベアの移動
速度を制御装置内部に設定された動作パターンを用いて
時間変化させることによりプリント基板を搬送させるも
のである。In order to achieve the above object, the present invention provides a belt conveyor (hereinafter referred to as a "conveyor"), a drive device for driving the conveyer conveyor, and a drive device for controlling the drive device. In a printed circuit board carrying device including a control device, a printed circuit board is carried by changing the moving speed of a carrying conveyor with time using an operation pattern set inside the control device.
【0007】[0007]
【作用】したがって本発明によれば、上記構成によって
基板搬送速度を最適に制御しプリント基板を高速で搬送
しているために、部品実装機単体の稼働効率を著しく向
上することができるのみならず工程全体の効率向上に極
めて有効である。Therefore, according to the present invention, since the printed circuit board is conveyed at a high speed by optimally controlling the board conveying speed by the above-mentioned structure, not only the operating efficiency of the component mounting machine itself can be significantly improved. It is extremely effective in improving the efficiency of the entire process.
【0008】[0008]
【実施例】本発明の一実施例について以下、図面を参照
して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【0009】図1は本発明の一実施例におけるプリント
基板搬送制御方法の全体図である。図において、1は実
装機内部の搬送コンベア、2は実装機を連結する際の連
結用搬送コンベア、3は搬送コンベア1を駆動する第1
のインダクションモータ、4は連結用搬送コンベア2を
駆動する第2のインダクションモータ、5は減速タイミ
ング検出用の減速センサ、6は位置カウント用の位置セ
ンサ、7は制御装置、8はプリント基板、9はプリント
基板検出用の基板センサ、10はストッパーである。FIG. 1 is an overall view of a printed circuit board conveyance control method according to an embodiment of the present invention. In the figure, 1 is a transfer conveyor inside the mounting machine, 2 is a transfer transfer conveyor for connecting the mounting machines, and 3 is a first driving conveyor 1.
Induction motor, 4 is a second induction motor for driving the coupling conveyor 2, 5 is a deceleration sensor for detecting deceleration timing, 6 is a position sensor for position counting, 7 is a control device, 8 is a printed circuit board, 9 Is a substrate sensor for detecting a printed circuit board, and 10 is a stopper.
【0010】また、図2は本実施例のフローチャートで
ある。以下、図を参照しながらその動作を説明する。FIG. 2 is a flow chart of this embodiment. The operation will be described below with reference to the drawings.
【0011】搬送動作を行う際は、第2のインダクショ
ンモータ4により動作する連結用の搬送コンベア2が搬
送してきたプリント基板8が基板センサ9によって検出
され、実装機内にプリント基板8が存在する場合、また
は実装が完了していない場合は搬送コンベア1に乗り移
る前に搬送コンベア1を停止させる。プリント基板8が
存在しない場合、または実装が完了している場合に第1
のインダクションモータ3が内部の搬送コンベア1を動
作させることによってプリント基板8は実装機内部に搬
送され、ストッパー10で位置決めされる。When carrying out the carrying operation, the printed board 8 carried by the carrying conveyor 2 for connection operated by the second induction motor 4 is detected by the board sensor 9, and the printed board 8 exists in the mounting machine. Alternatively, if the mounting is not completed, the transfer conveyor 1 is stopped before moving onto the transfer conveyor 1. First when the printed circuit board 8 does not exist or when mounting is completed
The printed circuit board 8 is carried into the mounter by the induction motor 3 operating the carrying conveyor 1 therein, and is positioned by the stopper 10.
【0012】このとき、制御装置7は以下に示すように
第1および第2のインダクションモータ3,4の速度制
御を行う。At this time, the control device 7 controls the speeds of the first and second induction motors 3 and 4 as described below.
【0013】制御装置7の内部には、動作パターンとし
てモータの加速パターン・減速パターン・最高速度があ
らかじめ設定されている。パターン決定の要因は、図3
(a)および(b)に示すようにすでに実装されている
部品の重心・重量・接触面積等である。また、これらの
パターンは任意に設定が可能であり、現在、業界に存在
する部品よりも重心が高く、重量が大きな部品が発生し
た場合には、容易に設定が変更できる。In the control device 7, an acceleration pattern, a deceleration pattern, and a maximum speed of the motor are preset as operation patterns. The factors that determine the pattern are shown in Fig. 3.
As shown in (a) and (b), it is the center of gravity, weight, contact area, etc. of the components already mounted. Further, these patterns can be set arbitrarily, and the setting can be easily changed when a part having a higher center of gravity than the parts currently existing in the industry and a large weight is generated.
【0014】次に本実施例におけるプリント基板搬送制
御の手順を図2のフローチャートに基づき説明する。Next, the procedure of the printed circuit board conveyance control in this embodiment will be described with reference to the flowchart of FIG.
【0015】ステップ#1で制御装置に対して搬送の信
号が入力されると、あらかじめ設定された加速パターン
第1のインダクションモータ3または第2のインダクシ
ョンモータ4が動作を始める(ステップ#2)。このと
き、位置センサ6からの信号により、設定された加速パ
ターンとの偏差を検出し、パターンとの一致を行う。設
定された加速が終了すると(ステップ#3)、設定され
た最高速度で一定速度動作を行う(ステップ#4)。こ
の間ステップ#5で示すように減速センサ5の入力があ
ると、即座にステップ#6,ステップ#7の減速処理を
行う。この際も加速時と同様に減速パターンと実際の速
度との一致を行う。When a transportation signal is input to the control device in step # 1, the preset acceleration pattern first induction motor 3 or second induction motor 4 starts operating (step # 2). At this time, a deviation from the set acceleration pattern is detected by the signal from the position sensor 6 to match the pattern. When the set acceleration is completed (step # 3), a constant speed operation is performed at the set maximum speed (step # 4). During this time, if there is an input from the deceleration sensor 5 as shown in step # 5, the deceleration processing of steps # 6 and # 7 is immediately performed. Also in this case, the deceleration pattern and the actual speed are matched as in the case of acceleration.
【0016】このように本実施例によれば、搬送コンベ
ア1および連結用搬送コンベア2の速度管理を簡易的に
行うことにより、高速のプリント基板搬送を容易に実現
することが可能となる。As described above, according to this embodiment, high-speed printed circuit board transportation can be easily realized by simply controlling the speeds of the transportation conveyor 1 and the coupling transportation conveyor 2.
【0017】[0017]
【発明の効果】上記実施例より明らかなように、本発明
のプリント基板搬送制御方法は制御装置内に設定された
動作パターンを用いて搬送速度を時間変化させるもので
あり、部品実装機において実装動作以外の基板搬送動作
における時間短縮を行うことにより、実装機単体の稼働
率を向上させるとともに、実装工程全体の効率を上げる
ことが可能になる。また、搬送時における部品のずれ、
浮きまたは転倒を防ぐことにより実装品質が高まり、後
工程における修正等の無駄を低減することができる。加
えて、動作パターンを複数設定し、切り換えることで、
搬送するプリント基板に対して、すでに実装されている
部品に応じてより最適な搬送動作を行うことが可能とな
る。As is apparent from the above-described embodiments, the printed circuit board transportation control method of the present invention changes the transportation speed with time by using the operation pattern set in the controller, and is mounted on the component mounter. By shortening the time in the board transfer operation other than the operation, it is possible to improve the operation rate of the mounting machine alone and increase the efficiency of the entire mounting process. In addition, misalignment of parts during transportation,
By preventing floating or overturning, the mounting quality can be improved, and waste such as correction in the subsequent process can be reduced. In addition, by setting multiple operation patterns and switching them,
It becomes possible to perform a more optimal carrying operation for the printed circuit board to be carried according to the components already mounted.
【図1】本発明の一実施例を実施するためのプリント基
板搬送装置の要部斜視図FIG. 1 is a perspective view of a main part of a printed circuit board carrying device for carrying out an embodiment of the present invention.
【図2】本発明の一実施例のプリント基板搬送制御方法
におけるフローチャートFIG. 2 is a flowchart of a printed circuit board conveyance control method according to an embodiment of the present invention.
【図3】(a)同プリント基板搬送制御方法における接
触面積が大きく、かつ重心が低い場合の搬送速度のパタ
ーン図 (b)同プリント基板搬送制御方法における部品の接触
面積が小さく、かつ重心が高い場合の搬送速度のパター
ン図FIG. 3 (a) is a pattern diagram of a transfer speed when the contact area is large and the center of gravity is low in the same printed circuit board transfer control method. (B) The contact area of parts is small and the center of gravity is small in the same printed circuit board transfer control method. Pattern diagram of transport speed when high
1 コンベア 2 連結用搬送コンベア 3 第1のインダクションモータ(駆動装置) 4 第2のインダクションモータ(駆動装置) 7 制御装置 8 プリント基板 1 Conveyor 2 Conveying Conveyor for Connection 3 First Induction Motor (Drive Device) 4 Second Induction Motor (Drive Device) 7 Control Device 8 Printed Circuit Board
Claims (1)
装機から構成される部品実装工程におけるプリント基板
を搬送する複数のベルトコンベア等の搬送コンベアと、
前記搬送コンベアを駆動するための複数のインダクショ
ンモータよりなる駆動装置と、前記駆動装置を制御する
ための制御装置とから構成されるプリント基板搬送装置
において、前記搬送コンベアの移動速度を前記制御装置
内部に設定された動作パターンを用いて、搬送速度を時
間変化させることによりプリント基板を搬送させるプリ
ント基板搬送制御方法。Claim: What is claimed is: 1. A printed circuit board component mounter and a plurality of mounters, which are used to convey the printed circuit board in a component mounting process.
In a printed circuit board transfer device configured by a drive device including a plurality of induction motors for driving the transfer conveyor, and a control device for controlling the drive device, the moving speed of the transfer conveyor is set inside the control device. A printed circuit board transport control method for transporting a printed circuit board by changing the transport speed with time by using the operation pattern set in.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3165504A JPH058835A (en) | 1991-07-05 | 1991-07-05 | Transfer control method for printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3165504A JPH058835A (en) | 1991-07-05 | 1991-07-05 | Transfer control method for printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH058835A true JPH058835A (en) | 1993-01-19 |
Family
ID=15813651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3165504A Pending JPH058835A (en) | 1991-07-05 | 1991-07-05 | Transfer control method for printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH058835A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002185188A (en) * | 2000-12-11 | 2002-06-28 | Matsushita Electric Ind Co Ltd | Electronic component-packaging device |
JP2003047203A (en) * | 2001-07-31 | 2003-02-14 | Matsushita Electric Ind Co Ltd | Motor and its controlling network and controlling method |
JP2006086261A (en) * | 2004-09-15 | 2006-03-30 | I-Pulse Co Ltd | Conveying apparatus, surface mounting machine, solder-coating device, inspecting device for printed circuit board and method of conveying the printed circuit board |
JP2009302282A (en) * | 2008-06-13 | 2009-12-24 | Panasonic Corp | Device for mounting electronic components and substrate conveying method in device for mounting electronic components |
JP2010147041A (en) * | 2008-12-16 | 2010-07-01 | Fuji Mach Mfg Co Ltd | Substrate manufacture transfer facility |
JP2011144022A (en) * | 2010-01-15 | 2011-07-28 | Sumitomo Metal Ind Ltd | Method and apparatus for manufacturing rolled shape steel |
CN103025138A (en) * | 2011-09-27 | 2013-04-03 | 雅马哈发动机株式会社 | Substrate transfer apparatus, substrate transfer method, and surface mounter |
-
1991
- 1991-07-05 JP JP3165504A patent/JPH058835A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002185188A (en) * | 2000-12-11 | 2002-06-28 | Matsushita Electric Ind Co Ltd | Electronic component-packaging device |
JP2003047203A (en) * | 2001-07-31 | 2003-02-14 | Matsushita Electric Ind Co Ltd | Motor and its controlling network and controlling method |
JP2006086261A (en) * | 2004-09-15 | 2006-03-30 | I-Pulse Co Ltd | Conveying apparatus, surface mounting machine, solder-coating device, inspecting device for printed circuit board and method of conveying the printed circuit board |
JP2009302282A (en) * | 2008-06-13 | 2009-12-24 | Panasonic Corp | Device for mounting electronic components and substrate conveying method in device for mounting electronic components |
JP2010147041A (en) * | 2008-12-16 | 2010-07-01 | Fuji Mach Mfg Co Ltd | Substrate manufacture transfer facility |
JP2011144022A (en) * | 2010-01-15 | 2011-07-28 | Sumitomo Metal Ind Ltd | Method and apparatus for manufacturing rolled shape steel |
CN103025138A (en) * | 2011-09-27 | 2013-04-03 | 雅马哈发动机株式会社 | Substrate transfer apparatus, substrate transfer method, and surface mounter |
EP2575419A3 (en) * | 2011-09-27 | 2014-12-03 | Yamaha Hatsudoki Kabushiki Kaisha | Substrate transfer apparatus, substrate transfer method, and surface mounter |
US9054145B2 (en) | 2011-09-27 | 2015-06-09 | Yamaha Hatsudoki Kabushiki Kaisha | Substrate transfer apparatus |
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