JP2010147041A - Substrate manufacture transfer facility - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate manufacture transfer facility that can carry a substrate into/out of the facility with no shocks applied to the substrate and can increase the transfer speed in the facility to reduce the time for substrate transfer. <P>SOLUTION: The substrate manufacture transfer facility 1 has a carry-in end P1, a process performance position P5 and a carry-out end P8 and includes a process performing device, a process transfer device 4 and a control device. The control device gradually increases a process transfer speed V of the process transfer device 4 to a higher speed than a carry-out transfer speed VM of a carry-out transfer device 8 on the carry-out end P1 side to transfer a processed substrate from the process performance position P5, gradually decreases the speed V to the carry-out transfer speed VM before the processed substrate reaches the carry-out end P8 to match the speed V with the carry-out transfer speed VM to carry the processed substrate out of the facility, then matches the speed V with a carry-in transfer speed VL of a carry-in transfer device 7 on the carry-in end P1 side to carry a substrate into the facility, gradually increases the speed V to a higher speed than the carry-in transfer speed VL after the substrate has passed the carry-in end P1 and then gradually decreases the speed V to stop the substrate at the process performance position P5. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate manufacturing transfer facility, and more particularly to a transfer device for carrying in, transferring and unloading a substrate and a control device for controlling the transfer speed.

  In order to manufacture a substrate on which a large number of electronic components are mounted, it has become common to construct a substrate manufacturing line by arranging substrate manufacturing transfer equipment for performing a predetermined manufacturing process. There are many configurations in which the substrate manufacturing and transfer facilities are connected by an intermediate transfer device, but there are also configurations in which the facilities are directly connected. For board manufacturing and transfer equipment, screen printing machines that apply cream-like solder to boards, component mounting machines that place electronic components on boards, reflow machines that fix solder, inspections that check the mounting status of electronic components There are machines. In general, each substrate manufacturing / transferring facility includes a process transfer device that transfers a substrate from the carry-in end to the carry-out end through the process execution position, in addition to the main process execution device that performs the manufacturing process. In this process transfer apparatus, it is important to accurately stop the substrate at the process execution position, and the applicant of the present application discloses an example of a substrate stop position control method and apparatus in Patent Document 1. In Patent Document 1, the substrate is transported by a specific movement distance corresponding to its size and stopped at a target position, and a positional deviation amount is obtained by a substrate camera.

In the process transfer apparatus in the substrate manufacturing transfer facility as well as Patent Document 1, the transfer speed is variable in order to accurately control the stop position and shorten the time required for the process, and further, the transfer speed according to the position of the substrate. In general, a control device for controlling the control is attached. On the other hand, as an intermediate transfer device that connects between substrate manufacturing transfer facilities, a simple device that can be switched between a transfer at a constant transfer speed and a stop is frequently used. A conveyor device that places a substrate and rotates is generally used as a transfer device inside or outside the facility. In a production line in which variable speed in-equipment transfer equipment and constant speed intermediate transfer equipment are mixed, the former transfer speed is made to match that of the latter so that there is no difference in speed when substrates are transferred during loading and unloading. ing. In addition, in a production line including a direct connection configuration without an intermediate transfer device, other process transfer devices are controlled in accordance with the slowest process transfer device. This is because if there is a speed difference, a shock may be applied to the board that moves between the transfer devices, and an instantaneous load may be applied to the electronic components placed on the board, resulting in a positional shift.
JP 2004-228326 A

  By the way, in the above-described conventional technology, the transfer speed of the variable speed in-facility transfer device is set to be low, constrained by the transfer speed of the upstream and downstream intermediate transfer devices. Moreover, in the direct connection configuration without the intermediate transfer device, the transfer speed of the production line is restricted by the slowest process transfer device. Therefore, in the process transfer apparatus having the function of the high transfer speed, the function is not utilized, and much time is required for transferring the substrate in the facility.

  The present invention has been made in view of the above problems, and when a substrate is carried into and out of the facility, the substrate is not shocked, and the transfer speed in the facility is increased to shorten the time required for substrate transfer. An object to be solved is to provide a substrate manufacturing and transporting facility.

  The invention of the substrate manufacturing and transporting facility according to claim 1 for solving the above-mentioned problems includes a loading end for loading a substrate, a process execution position for applying a predetermined manufacturing process to the substrate transferred from the loading end and stopped, and the manufacturing A process execution apparatus for carrying out a predetermined manufacturing process on the substrate at the process execution position; and a carry-out end for transferring and unloading the substrate subjected to the process from the process execution position. A substrate transfer apparatus including a process transfer device that can be transferred to the unloading end through the process execution position at a variable process transfer speed, and a control device that controls the process transfer speed of the process transfer device, The control device is arranged in series upstream of the carry-in end, and makes the process transfer speed of the process transfer apparatus coincide with a constant carry-in transfer speed of the carry-in transfer apparatus capable of transferring the substrate, and carries the substrate into the carry-in transfer apparatus When the rear end of the substrate passes through the carry-in end, the process transfer speed is gradually increased to a high-speed transfer speed higher than the carry-in transfer speed, and then the process transfer speed is gradually reduced to remove the substrate. The process is stopped at the process execution position.

  According to a second aspect of the present invention, there is provided a carry-in end for carrying a substrate, a process execution position for applying a predetermined manufacturing process to the substrate transferred and stopped from the carry-in end, and the substrate subjected to the production process as the process execution position. An unloading end for transferring and unloading the substrate, and a process execution apparatus for applying the predetermined manufacturing process to the substrate at the process execution position; and the unloading end of the substrate from the carry-in end through the process execution position. A substrate manufacturing and transport facility comprising a process transfer device that can be transferred at a variable process transfer speed and a control device that controls the process transfer speed of the process transfer device, wherein the control device is downstream of the carry-out end. The process transfer speed of the process transfer device is gradually increased to a high transfer speed higher than a constant transfer speed of a carry-out transfer apparatus capable of transferring processed substrates that are arranged in series and subjected to the manufacturing process. Implementation location The processed substrate is transferred, and then the process transfer speed is gradually reduced to the unloading transfer speed before the front end of the processed substrate reaches the unloading end, and the process transfer speed is made to coincide with the unloading transfer speed. The processed substrate is carried out from the carry-out end to the carry-out transfer device.

  According to a third aspect of the present invention, there is provided a carry-in end for carrying a substrate, a process execution position for applying a predetermined manufacturing process to the substrate transferred and stopped from the carry-in end, and the substrate subjected to the production process as the process execution position. An unloading end for transferring and unloading the substrate, and a process execution apparatus for applying the predetermined manufacturing process to the substrate at the process execution position; and the unloading end of the substrate from the carry-in end through the process execution position. A substrate manufacturing transfer facility comprising: a process transfer device capable of transferring at a variable process transfer speed; and a control device for controlling the process transfer speed of the process transfer device, wherein the control device is downstream of the carry-out end. The process transfer speed of the process transfer device is gradually increased to a high transfer speed higher than a constant transfer speed of a carry-out transfer apparatus capable of transferring processed substrates that are arranged in series and subjected to the manufacturing process. Implementation location The processed substrate is transferred, and then the process transfer speed is gradually reduced to the unloading transfer speed before the front end of the processed substrate reaches the unloading end, and the process transfer speed is made to coincide with the unloading transfer speed. After the processed substrate is carried out from the carry-out end to the carry-out transfer device, the process transfer device is arranged at a constant carry-in transfer speed of the carry-in transfer device arranged in series upstream of the carry-in end and capable of transferring the substrate. When the substrate transfer is carried into the carry-in end from the carry-in transfer device, and the rear end of the substrate passes through the carry-in end, the process transfer speed is made higher than the carry-in transfer speed. The substrate is gradually increased and thereafter the process transfer speed is gradually decreased to stop the substrate at the process execution position.

  According to a fourth aspect of the present invention, in the first aspect, the control device causes the process transfer speed of the process transfer device to coincide with the carry-in transfer speed so that the substrate is carried into the carry-in end from the carry-in transfer apparatus. In parallel, the processed substrate subjected to the manufacturing process is arranged in series downstream from the carry-out end so that the processed substrate can be transferred at the same carry-out transfer speed as the carry-in transfer speed. When the rear end of the substrate passes through the carry-in end and the rear end of the processed substrate passes through the carry-out end, the process transfer speed is gradually increased to the high-speed transfer speed.

  According to a fifth aspect of the present invention, in the first aspect, the control device is a variable-speed unloading and transporting device capable of transporting the processed substrate that is arranged in series downstream of the unloading end and subjected to the manufacturing process. The variable carry-out transfer speed is made to coincide with the process transfer speed of the process transfer device, or the control device according to claim 2, wherein the control device is arranged in series upstream of the carry-in end and can transfer the substrate. The variable carry-in transfer speed of the carry-in transfer apparatus is made to coincide with the process transfer speed of the process transfer apparatus.

  According to the first aspect of the present invention, the substrate can be carried from the carry-in transfer device to the carry-in end in a state where the process transfer speed of the process transfer device coincides with the carry-in transfer speed. Therefore, there is no difference in speed when the substrate is transferred from the carry-in transfer device to the process transfer device in the facility, and no shock is applied to the substrate.

  Further, when the rear end of the substrate passes the carry-in end, the process transfer speed is gradually increased to a high-speed transfer speed higher than the carry-in transfer speed, and then the process transfer speed is gradually reduced to stop the substrate at the process execution position. it can. Therefore, after the substrate is completely transferred to the process transfer device, the process transfer speed becomes high, and the time required for transfer in the facility can be shortened. Furthermore, since the process transfer rate is gradually increased and decreased, the occurrence of shock during transfer is negligible.

  According to the second aspect of the invention, the process transfer speed of the process transfer device is gradually increased to a high speed transfer speed to transfer the processed substrate from the process execution position, and then the front end of the processed substrate reaches the unloading end. The process transfer rate can be gradually reduced to the unloading transfer rate. Therefore, it is possible to shorten the time required for transfer in the facility by increasing the process transfer speed until the processed substrate reaches the carry-out end. Furthermore, since the process transfer rate is gradually increased and decreased, the occurrence of shock during transfer is negligible.

  Further, the processed substrate can be carried out from the carry-out end to the carry-out transfer device in a state where the process transfer speed of the process transfer device coincides with the carry-out transfer speed. Therefore, there is no speed difference when the processed substrate is transferred from the process transfer device in the facility to the carry-out transfer device, and no shock is applied to the substrate.

  In the invention according to claim 3, the effects of both claim 1 and claim 2 can be obtained. That is, the processed substrate can be carried out from the carry-out end to the carry-out transfer device in a state where the process transfer speed of the process transfer device matches the carry-out transfer speed, and then the substrate in a state where the process transfer speed matches the carry-in transfer speed. Can be carried into the carry-in end from the carry-in transfer device. Therefore, the substrate can be transferred in a state where there is no difference in speed in both carrying-in and carrying-out, and no shock is applied to the substrate. Further, the time required for transfer can be shortened by increasing the process transfer speed in the facility, and the occurrence of shock during transfer can be minimized by gradually increasing and decreasing the process transfer speed.

  According to the invention of claim 4, the carry-in transfer speed of the upstream carry-in transfer apparatus and the carry-out transfer speed of the downstream carry-out transfer apparatus are matched to carry out the removal of the processed substrate and the carry-in of the next substrate in parallel. The time required for the process can be further shortened. In addition, after the next substrate is completely transferred to the process transfer device and the processed substrate is completely transferred to the carry-out transfer device, the process transfer speed can be increased to shorten the time required for transfer in the facility.

  In the invention according to claim 5, one of the carry-in transfer speed of the carry-in transfer apparatus and the carry-out transfer speed of the carry-out transfer apparatus is a constant speed, and the other is a variable speed. The other variable transfer speed can be synchronized with the process transfer speed of the process transfer apparatus. Accordingly, as in the invention according to claim 1 or 2, the transfer speed difference is obtained by setting one of the carry-in and carry-out transfer apparatuses and the process transfer apparatus to be in a state where there is no transfer speed difference, and synchronously operating the other and the process transfer apparatus. The substrate can be transferred in a state where there is no shock, and no shock is applied to the substrate.

  The best mode for carrying out the present invention will be described with reference to FIGS. FIG. 1 is a diagram schematically illustrating a general substrate production line. In the board production line 9, a stocker 91, a screen printing machine 92, a component mounting machine 1, a reflow machine 93, and an inspection machine 94 are arranged in order from the upstream side as board production transfer equipment, and are connected by intermediate transfer devices 95 to 99. Has been configured.

  The stocker 91 temporarily stores a substrate on which a circuit pattern is formed and sequentially supplies the substrate to the supply position 913, and transfers the substrate from the supply position 913 below the stock device 911 to the unloading end 915 on the right side in the figure. And a process transfer device 916. The screen printing machine 92 has a printing device 921 for applying cream-like solder to the substrate, and a process transfer for transferring from the carry-in end 922 on the left side in the drawing to the carry-out end 925 on the right side in the drawing through the printing position 923 below the printing device 921. Device 926. The component mounting machine 1 includes a component mounting device 3 for placing an electronic component on a board, and a process of transferring from a carry-in end 21 on the left side in the drawing to a carry-out end 23 on the right side in the drawing through a mounting position 22 below the component mounting device 2. And a transfer device 4. The reflow machine 93 includes a reflow device 931 for fixing the solder, and a process transfer device 936 for transferring from the left carry-in end 932 to the right carry-out end 935 in the drawing through the reflow position 933 below the reflow device 931. Yes. The inspection device 94 inspects the mounting state of the electronic component, and a process transfer device 946 for transferring from the carry-in end 942 on the left side in the drawing to the carry-out end 945 on the right side in the drawing through the inspection position 943 below the inspection device 941. And.

  The process transfer devices 916, 926, 4, 936, and 946 in each of the facilities 91, 92, 1, 93, and 94 have variable process transfer speeds for transferring substrates, and control apparatuses (not shown) that control the process transfer speeds. Are provided. On the other hand, each of the intermediate transfer devices 95 to 99 has a constant transfer speed for transferring the substrate, and is provided with a control device (not shown) that controls switching between constant speed transfer and stop.

  The present invention can be applied to any of the above-mentioned facilities 91, 92, 1, 93, 94, and will be described in detail below by taking the component mounter 1 as an example as the first embodiment. FIG. 2 is a diagram schematically illustrating the component mounter 1 according to the first embodiment. As shown in the figure, the component mounting machine 1 includes a base 2, a component mounting device 3, a process transfer device 4, a control device 5, and three sensors 61 to 63 as main members. The base 2 is a structural material for arranging each part. A component mounting apparatus 3 is disposed substantially at the center of the base 2, and below that is a process execution position, that is, a mounting position 22. Further, the left end and the right end in the figure at the same height as the mounting position 22 of the base 2 are a carry-in end 21 and a carry-out end 23 for carrying in and out the substrate.

  The component mounting apparatus 3 is an apparatus for placing an electronic component on the board K stopped at the mounting position 22, and a known apparatus having a mounting head (not shown) and the like is used. A component supply device (not shown) for supplying electronic components to the component mounting apparatus 3 is also provided.

  The process transfer device 4 is a device that transfers the substrate K from the carry-in end 21 to the carry-out end 23 via the mounting position 22. The process transfer device 4 includes an endless annular conveyor belt 41 that runs from the carry-in end 21 to the carry-out end 23 and rotates, and a servo motor 42 that drives the conveyor belt 41. The servo motor 42 is variable in rotation speed, and the rotation speed of the conveyor belt 41, that is, the process transfer speed V is variable. In FIG. 2, the conveyor belt 41 normally rotates in the clockwise direction and transfers the placed substrate K from the carry-in end 21 toward the right carry-out end 23 in the drawing.

  The three sensors 61 to 63 detect the presence or absence of the substrate K on the conveyor belt 41 and output detection signals S1 to S3. The detection signals S1 to S3 are turned on when the substrate K is present, and are turned off when the substrate K is absent. The carry-in end sensor 61 disposed near the carry-in end 21 can detect that the substrate K has not arrived due to the continued OFF state of the detection signal S1. Further, the passage of the rear end KR of the substrate K, that is, the completion of loading can be detected by the fall of the detection signal S1 from on to off. The pre-unloading sensor 62 disposed in front of the unloading end 23 can detect the arrival of the front end KF of the substrate K when the detection signal S2 rises from off to on. The unloading end sensor 63 disposed near the unloading end 23 can detect the passage of the rear end KR of the substrate K, that is, unloading completion, by the fall of the detection signal S3 from ON to OFF.

  The control device 5 outputs the drive control signal D1 to the servo motor 42 while referring to the detection signals S1 to S3 of the three sensors 61 to 63 to variably control the process transfer speed V. The control device 5 can be configured using an electronic control device that has a CPU, a storage unit, an input / output unit, and the like and operates by software.

  As shown in FIG. 1, intermediate transfer devices 96 and 97 are connected and arranged on the upstream side (left side in the drawing) and the downstream side (right side in the drawing) of the component mounting machine 1, respectively. Hereinafter, for the sake of clarity, the intermediate transfer device 96 on the upstream side is referred to as the carry-in transfer device 7, and the intermediate transfer device 97 on the downstream side is referred to as the carry-out transfer device 8. As shown in FIG. 2, the carry-in transfer device 7 includes an endless annular carry-in belt 71 that rotates in a clockwise direction, a carry-in motor 72 that drives the carry-in belt 71, a carry-in control device 73 that controls the carry-in motor 72, It consists of The right end of the carry-in belt 71 in the drawing is arranged at the carry-in end 21 and in the immediate vicinity of the left end of the conveyor belt 41 of the process transfer device 4 in the drawing, so that the placed substrate can be smoothly transferred and loaded. Yes. The carry-in motor 72 has a constant rotation speed, and the rotation speed of the carry-in belt 71, that is, the carry-in transfer speed VL is constant. The carry-in control device 73 outputs a drive control signal D2 to the carry-in motor 72 while exchanging the control information C2 with the control device 5 of the substrate mounting machine 1, and switches between constant speed transfer and stop.

  Similarly, the carry-out transfer device 8 includes an endless annular carry-out belt 81 that rotates clockwise, a carry-out motor 82 that drives the carry-out belt 81, and a carry-out control device 83 that controls the carry-out motor 82. . The left end of the carry-out belt 81 in the drawing is arranged at the carry-out end 23 and in the immediate vicinity of the right end in the drawing of the conveyor belt 41 of the process transfer device 4 so that the placed substrate can be smoothly transferred and carried out. Yes. The carry-out motor 82 has a constant rotation speed, and the rotation speed of the carry-out belt 81, that is, the carry-out transfer speed VM is constant. The carry-out control device 83 outputs a drive control signal D3 to the carry-out motor 82 while exchanging the control information C3 with the control device 5 of the substrate mounting machine 1, and switches between constant speed transfer and stop.

  Next, the operation and action of the component mounter 1 of the first embodiment configured as described above will be described with reference to FIGS. Although the case where the carry-in transfer speed VL is smaller than the carry-out transfer speed VM will be described, the present invention can be applied even if the magnitude relationship is reversed.

  FIG. 3 is a transfer speed characteristic diagram of the substrate K in the component mounting machine 1, the horizontal axis indicates the tip position of the substrate K in the transfer direction, and the vertical axis indicates the process transfer speed V. In the drawing, P1 represents a carry-in end position corresponding to the carry-in end 21, P5 represents a mounting position 22, and P8 represents a carry-out end position corresponding to the carry-out end 23. P2 is a position on the process transfer device 4 that is close to the mounting position 22 from the loading end position P1 by the substrate length L, that is, a loading completion position where the rear end KR of the substrate K passes the loading end position P1, This carry-in completion position P2 is detected by the fall of the detection signal S1 of the carry-in end sensor 61. P7 is a position before the unloading end position P8 on the process transfer device 4 and this position P7 is detected when the leading edge KF of the substrate K arrives at the unloading front sensor 62 and the detection signal S2 rises. P9 is a position on the unloading / transferring device 8 that is separated from the unloading end position P8 by the substrate length L, that is, the unloading completion position where the rear end KR of the substrate K passes the unloading end position P8. It is detected by the fall of the detection signal S3 of the carry-out end sensor 63.

  As shown in the drawing, the substrate K is transferred from the carry-in transfer device 7 through the carry-in end position P1 to the carry-in completion position P2 at the carry-in transfer speed VL (process transfer speed V = VL). Next, the substrate K is transferred at a high speed transfer speed VH (process transfer speed V = VH) from the position P3 to the position P4 after the process transfer speed V is gradually increased from the carry-in completion position P2, and then the process is started from the position P4. The transfer speed V is gradually reduced and stopped at the mounting position P5. The substrate K on which electronic components are mounted at the mounting position P5 is transferred from the mounting position P5 with the process transfer speed V gradually increased, and a high-speed transfer speed VH (process transfer speed V = VH) from the position P6 to the position P7. It is transported by. Next, the substrate K reaches the unloading transfer speed VM (process transfer speed V = VM) before reaching the unloading end position P8 by gradually decreasing the process transfer speed V from the position P7, and from the unloading end position P8 at the unloading transfer speed VM. It is unloaded to the unloading completion position P9.

  In order to implement the transfer speed characteristics of FIG. 3, the transfer speed control shown in FIGS. 4 and 5 is performed. FIG. 4 is a view for explaining a transfer speed control method for carrying in and transferring the pre-mounting substrate K1 before the electronic component is mounted from the carry-in transfer device 7 to the mounting position P5 of the process transfer device 4. FIG. 5 is a diagram for explaining a transfer speed control method for transferring and carrying the mounted substrate K10 after the electronic components are mounted from the mounting position P5 of the process transfer device 4 to the carry-out transfer device 8.

  As shown in FIG. 4, when there is no substrate on the process transfer device 4 and the pre-mounting substrate K1 is placed on the carry-in transfer device 7 and preparation for loading is completed, the process transfer device 4 and the carry-in transfer device 7 are loaded. It is driven at a transfer speed VL (1). The substrate K1 before mounting is transferred on the carry-in transfer device 7 and its tip KF is transferred to the process transfer device 4 beyond the carry-in end position P1, and is placed across the transfer devices 4 and 7 without any speed difference. (2) When the rear end FR of the substrate K1 before mounting reaches the carry-in end position P1 (the tip KF reaches the carry-in completion position P2), the process transfer speed V of the process transfer device 4 is gradually accelerated and gradually increased (3). . At this time, since the pre-mounting substrate K1 is completely transferred to the process transfer device 4, the carry-in transfer device 7 may subsequently operate or may be stopped. The substrate K1 before mounting is transferred at a high transfer speed VH in a section between the predetermined position P3 and the position P4 (4). This section can be set in advance in the control device 5 as a control characteristic, and can also be calculated from the history of the actual process transfer speed V. When the pre-mounting substrate K1 reaches the predetermined position P4, the process transfer speed V is gradually reduced and gradually decreased from the high-speed transfer speed VH (5). And the front-end | tip KF of the board | substrate K1 before mounting arrives at the mounting position P5, and is stopped (6). The accurate stop position is confirmed by a not-shown board camera provided in the component mounting apparatus 3.

  When a predetermined mounting process is performed on the pre-mounting board K1 at the mounting position P5 and the mounted board K10 is completed, the process transfer speed V of the process transfer device 4 is gradually increased as shown in FIG. 5 (1). The mounted substrate K10 is transferred at a high transfer speed VH in a section between the predetermined position P6 and the position P7 (2). As described above, this section can also be set as a control characteristic or calculated from the history of the actual process transfer speed V. When the mounted substrate K10 reaches the predetermined position P7, the process transfer speed V is gradually reduced from the high-speed transfer speed VH to the carry-out transfer speed VM (3). When the tip KF of the mounted substrate K10 reaches the unloading end position P8, the process transfer speed V of the process transfer device 4 has already reached the unloading transfer speed VM, while the unloading transfer device 8 is also started and unloaded. It is a VM (4). From this point, the tip KF of the mounted substrate K10 passes over the carry-out end position P8 and is transferred to the carry-out transfer device 8 and is placed across the transfer devices 4 and 8 without any speed difference (5). When the rear end FR of the mounted substrate K10 reaches the carry-out end position P8 (the front end KF reaches the carry-out completion position P9), the mounted substrate K10 is completely transferred to the carry-out transfer device 8 and moves to the downstream reflow machine 93. Be transported. On the other hand, the process transfer speed V of the process transfer device 4 is gradually reduced to the carry-in transfer speed VL and waits for the next pre-mounting board K2 to be loaded.

  Next, the effect of the component mounting machine 1 of the first embodiment will be described in comparison with the board transfer speed characteristic diagram in the conventional configuration of FIG. In the conventional configuration, the process transfer speed V of the process transfer device 4 is fixed to the carry-in transfer speed VL in order to eliminate the speed difference when the substrate K moves between the transfer devices 7 and 4 at the carry-in end position P1. The substrate K was transferred from the position P1 to the mounting position P5. Similarly, the process transfer speed V is fixed to the unloading transfer speed VM, and the substrate K is transferred from the mounting position P5 to the unloading end position P8. Therefore, despite having the function of the high speed transfer speed VH, the function was not utilized.

  On the other hand, in the component mounter 1 of the first embodiment, the boards K1 and K10 are transferred with no speed difference between the carry-in end position P1 and the carry-out end position P8, and the board K1 in the component mounter 1 is transferred. , K10 is transferred at a high transfer speed VH. Therefore, the time required for transferring the substrates K1 and K10 can be shortened, and the time required for the process can be reduced. Further, since the change in the process transfer speed V is not a steep acceleration / deceleration operation using a gear or the like, but is gradually increased and decreased gradually, the occurrence of a shock during transfer is very small.

  It should be noted that the unloading front sensor 62 and the unloading end sensor 63 can be omitted. In this case, the control device 5 estimates the timing at which the tip KF of the substrate K reaches the unloading end position P8 and the position P7 in front of it from the history of preset control characteristics or actual process transfer speed V.

  Next, a second embodiment in which the carry-in transfer speed VL and the carry-out transfer speed VM are the same will be described. The configuration of the substrate mounting machine 10 of the second embodiment is the same as that of the first embodiment, except that a carry-out transfer device 80 having a carry-out transfer speed VM equal to the carry-in transfer speed VL is connected to the downstream side. In this substrate mounting machine 10, the control device 5 controls the process transfer speed V of the process transfer device 4 in accordance with the transfer speed control method shown in FIG. 7.

  In the second embodiment, when there is no substrate on the process transfer device 4, the substrate before mounting is carried in and transferred to the mounting position P5 by the same transfer speed control method as in FIG. 4 of the first embodiment. When a predetermined mounting process is performed on the substrate before mounting at the mounting position P5 and the mounted substrate K30 is completed, the process transfer speed V of the process transfer device 4 is gradually increased as shown in FIG. 7 (1). The mounted substrate K30 is transferred at a high transfer speed VH in a section between the predetermined position P6 and the position P7 (2). When the mounted substrate K30 reaches the predetermined position P7, the process transfer speed V is gradually reduced from the high-speed transfer speed VH to the carry-in transfer speed VL (3). When the front end KF of the mounted substrate K30 reaches the unloading end position P8, the process transfer speed V of the process transfer device 4 has already reached the carry-in transfer speed VL, while the carry-out transfer device 80 is also started and the transfer-in transfer speed is reached. It is VL. Furthermore, the carry-in transfer device 7 is also started to transfer the pre-mounting substrate K4 to the carry-in end position P1 at the carry-in transfer speed VL (4). From this point, the tip KF of the mounted substrate K30 passes over the carry-out end position P8 and is transferred to the carry-out transfer device 80, and is placed across the transfer devices 4 and 80 without any speed difference. In parallel, the tip KF of the pre-mounting board K4 passes over the loading end position P1 and is transferred to the process transfer device 4 and is placed across the transfer devices 4 and 7 without any speed difference (5). When the rear end FR of the mounted substrate K30 reaches the carry-out end position P8, the mounted substrate K30 is completely transferred to the carry-out transfer device 8. On the other hand, the pre-mounting board K4 is still placed across the transfer devices 4 and 7 (6). When the rear end FR of the pre-mounting board K4 reaches the carry-in end position P1, the process transfer speed V of the process transfer device 4 is gradually increased (7). Thereafter, the pre-mounting board K4 is transferred to the mounting position P5 by the same transfer speed control method as in FIG.

  In the substrate mounting machine 10 according to the second embodiment, carrying out of the mounted substrate K30 and loading of the pre-mounting substrate K4 are performed in parallel in time. Therefore, the process time can be further reduced as compared with the first embodiment in which the unmounted substrate K2 is loaded after the mounted substrate K10 is unloaded. In the above description, carrying out of the mounted substrate K30 is completed before carrying in the pre-mounting substrate K4. However, carrying in may be carried out earlier and carried out later.

  The present invention can also be applied to a configuration in which one of the carry-in transfer speed VL and the carry-out transfer speed VM is a constant speed and the other is a variable speed. In this case, as described above, the process transfer speed V can be made to coincide with a constant speed on the one side, and the variable speed can be made to always coincide with the process transfer speed V of the process transfer apparatus on the other side. Thereby, a board | substrate can be transferred as a state with no speed difference in the carrying-in end position P1 and the carrying-out end position P8.

  As an example of this, with respect to the third embodiment in which the carry-in transfer speed VL is constant and the carry-out transfer speed VV is variable, the differences from the first embodiment will be mainly described with reference to FIGS. 8 and 9. FIG. 8 is a diagram schematically illustrating the component mounting machine 11 according to the third embodiment in which the carry-out transfer speed VV is variable. In the substrate mounter 11 of the third embodiment, a variable speed servomotor is used as the carry-out motor 820 that drives the carry-out belt 81 of the variable-speed carry-out transfer device 800, and the carry-out control device 830 variably controls the carry-out transfer speed VV. It is supposed to be. In the substrate mounter 11 of the third embodiment, the control device 5 controls the process transfer speed V of the process transfer device 4 according to the transfer speed control method shown in FIG. 830 controls the carry-out transfer speed VV of the carry-out transfer device 800.

  As shown in FIG. 9, when the mounted substrate K50 is completed at the mounting position P5 on the process transfer device 4 and the pre-mounting substrate K6 is placed on the carry-in transfer device 7 and ready for loading, the carry-in transfer device 7 is ready. Is driven at the carry-in transfer speed VL, and the process phase speed V of the process transfer device 4 is gradually increased to the same carry-in transfer speed VL (1). That is, the transfer and carry-out of the mounted substrate K50 and the carry-in and transfer of the pre-mounting substrate K6 are started in parallel. The pre-mounting substrate K6 is transferred on the carry-in transfer device 7 and its tip KF exceeds the carry-in end position P1, and is placed on both transfer devices 4 and 7 without any speed difference. In parallel, the mounted substrate K50 is transferred toward the carry-out end position P8 (2). When the rear end FR of the substrate K6 before mounting reaches the carry-in end position P1, the process transfer speed V of the process transfer device 4 is gradually accelerated and gradually increased. At this time, the mounted substrate K50 approaches the unloading end position P8, and the variable unloading / transferring speed VV of the variable-speed unloading / transferring apparatus 800 is controlled to be equal to the process transfer speed V and is operated synchronously (3). The pre-mounting board K6 is transferred at a high transfer speed VH in a section between a predetermined position P3 and a position P4. In parallel, the mounted substrate K50 goes over the carry-out end position P8 and is placed across both the transfer devices 4 and 800. That is, unloading is performed in a state where there is no speed difference between the high-speed transfer speeds VH (4). When the substrate K6 before mounting reaches the predetermined position P4, the process transfer speed V is gradually decelerated and gradually decreased from the high-speed transfer speed VH. During this time, the carry-out transfer speed VV is controlled to be equal to the process transfer speed V, and the carry-out of the mounted substrate K50 is completed (5). When the front end KF of the board K6 before mounting reaches the mounting position P5 and stops, the carry-out transfer speed VV is gradually increased and the mounted board K50 is transferred to the downstream reflow machine 93. (6).

  In the third embodiment, when the mounted substrate K50 approaches the carry-out end position P8, the carry-out transfer speed VV of the variable speed carry-out transfer apparatus 800 is made to coincide with the process transfer speed V of the process transfer apparatus 4, and the synchronous operation is performed. be able to. Therefore, even if the process transfer speed V changes due to restrictions on the carry-in end position P1 side, the condition of no speed difference on the carry-out end position P8 side is satisfied, and no shock is applied to the mounted substrate K50.

  Note that the mounted board K50 may be carried out at any time as long as it is between (3) and (5) in FIG. 9 where the condition of no speed difference on the carry-out end position P8 side is satisfied. Also, FIG. 9 is an example, and there are various variations of transfer speeds depending on the distance relationship between the carry-in end position P1, the mounting position P5, and the carry-out end position P8 and the variable ranges of the transfer speeds V and VV of the transfer devices 4 and 800. A control method can be used.

  Next, with respect to the fourth embodiment having a plurality of process transfer devices, the differences from the first embodiment will be mainly described with reference to FIG. FIG. 10 is a diagram schematically illustrating the component mounter 12 according to the fourth embodiment that can adjust the congestion state of the substrate K before and after the component mounting apparatus 3. As illustrated, the component mounting machine 12 includes a base 2, a component mounting device 3, a front transfer device 45, a mounting transfer device 46, a rear transfer device 47, and a control device 50 that constitute the process transfer device 40. It is comprised as a main member. The three transfer devices 45 to 47 are arranged in series in the base 2, each having a conveyor belt and a servo motor, and the respective process transfer speeds V5 to V7 are independently variable. The left end of the front transfer device 45 in the drawing is arranged at the carry-in end 21, the mounting transfer device 46 is arranged including the mounting position 22 below the component mounting device 3, and the right end of the rear transfer device 47 in the drawing is the carry-out end. 23. The control device 50 outputs drive control signals D5 to D7 so that the process transfer speeds V5 to V7 of the transfer devices 45 to 47 can be controlled.

  In the fourth embodiment, the control device 50 can perform transfer speed control for temporarily holding the substrate K on the pre-transfer device 45 and the post-transfer device 47. In this control, the process transfer speed V5 of the pre-transfer device 45 is made to coincide with the carry-in transfer speed VL of the carry-in transfer device 7, and the substrate K is carried into the carry-in end 21. Can be gradually increased. In addition, the substrate K can be unloaded from the unloading end 23 by making the process transfer speed V7 of the post transfer device 47 coincide with the unloading transfer speed VM of the unloading transfer device 8. Furthermore, it is possible to eliminate the speed difference when the substrate K transfers between the devices 45 to 47 by appropriately operating the three transfer devices 45 to 47 in synchronization. On the other hand, when the substrate K is not retained, the front transfer device 45 and the mounting transfer device 46 are operated synchronously to directly take the substrate K from the carry-in end 21 to the mounting position 22, and The substrate K can be discharged directly from the mounting position 22 to the carry-out end 23 by operating the transfer device 47 synchronously. These transfer speed controls produce the same effects as in the first embodiment.

  Note that the present invention is not limited to the five types of substrate manufacturing and transfer facilities 91, 92, 1, 93, and 94 shown in FIG. 1, for example, an adhesive applicator that applies an adhesive to the substrate, and other devices. It can also be applied to equipment. Further, the carry-in transfer device 7 and the carry-out transfer devices 8, 80, and 800 are not limited to the intermediate transfer devices 96 and 97, and the present invention may be applied to process transfer devices of other directly connected substrate manufacturing and transfer facilities. Can be applied.

It is a figure which illustrates a general substrate manufacturing line typically. It is a figure which illustrates the component mounting machine of a 1st embodiment typically. It is a transfer speed characteristic figure in the component mounting machine of FIG. FIG. 4 is a transfer speed characteristic diagram of FIG. 3 for explaining a transfer speed control method when a pre-mounting substrate is transferred from the transfer-in transfer apparatus to the mounting position of the process transfer apparatus. FIG. 4 is a diagram illustrating a transfer speed control method for transferring and unloading a mounted substrate from the mounting position of the process transfer apparatus to the carry-out transfer apparatus in the transfer speed characteristic diagram of FIG. 3. It is a transfer speed characteristic figure in the conventional composition. It is a figure explaining the transfer speed control method in the component mounting machine of 2nd Embodiment. It is a figure which illustrates typically the component mounting machine of 3rd Embodiment. It is a figure explaining the transfer speed control method with the component mounting machine of FIG. It is a figure which illustrates the component mounting machine of 4th Embodiment typically.

Explanation of symbols

1, 10, 11, 12: component mounting machine (board manufacturing and transfer equipment)
2: Base 21: Carry-in end 22: Mounting position (process execution position) 23: Carry-out end 3: Component mounting apparatus (process execution apparatus)
4, 40: Process transfer device
41: Conveyor belt 42: Servo motor
45: front transfer device 46: mounting transfer device 47: rear transfer device 5, 50: control device 61: carry-in end sensor 62: carry-out front sensor 63: carry-out end sensor 7: carry-in transfer device 71: carry-in belt 72: carry-in Motor 73: carry-in control device 8: carry-out transfer device 81: carry-out belt 82: carry-out motor 83: carry-out control device 80: carry-out transfer device (second embodiment)
800: Variable-speed carry-out transfer device (third embodiment)
9: Board production line
91: Stocker 92: Screen printer 93: Reflow machine
94: Inspection machine 95-99: Intermediate transfer device K: Substrate K1, K2, K4, K6: Substrate before mounting
K10, K30, K50: mounted substrate
L: Board length KF: Board front edge KR: Board rear edge P1: Carry-in end position P2: Carry-in completion position P5: Mounting position P8: Carry-out end position P9: Carry-out completion position V, V5 to V7: Process transfer device Variable process transfer speed VL: Incoming transfer speed (constant speed) VM: Unloading speed (constant speed)
VV: Variable transfer speed VH: High speed transfer speed

Claims (5)

A carry-in end for carrying in the substrate, a process execution position for applying a predetermined manufacturing process to the substrate transferred and stopped from the carry-in end, and a carry-out end for transferring and carrying out the substrate subjected to the production process from the process execution position; And a process execution apparatus for performing the predetermined manufacturing process on the substrate at the process execution position, and transferring the substrate from the carry-in end to the carry-out end through the process execution position at a variable process transfer speed. A substrate manufacturing transfer facility comprising a possible process transfer device and a control device for controlling a process transfer speed of the process transfer device,
The control device is arranged in series on the upstream side of the carry-in end so that the process transfer speed of the process transfer device coincides with a constant carry-in transfer speed of a carry-in transfer apparatus capable of transferring the substrate, and the substrate is loaded. When the rear end of the substrate passes through the carry-in end from the transfer device, the process transfer speed is gradually increased to a high-speed transfer speed higher than the carry-in transfer speed, and then the process transfer speed is gradually reduced to increase the process transfer speed. A substrate manufacturing / transferring facility, wherein the substrate is stopped at the process execution position. A carry-in end for carrying in the substrate, a process execution position for applying a predetermined manufacturing process to the substrate transferred and stopped from the carry-in end, and a carry-out end for transferring and carrying out the substrate subjected to the production process from the process execution position; And a process execution apparatus for performing the predetermined manufacturing process on the substrate at the process execution position, and transferring the substrate from the carry-in end to the carry-out end through the process execution position at a variable process transfer speed. A substrate manufacturing transfer facility comprising a possible process transfer device and a control device for controlling a process transfer speed of the process transfer device,
The control device transfers the process to a high speed transfer speed higher than a constant carry-out transfer speed of a carry-out transfer apparatus that is arranged in series downstream of the carry-out end and can transfer the processed substrate subjected to the manufacturing process. The process transfer speed of the apparatus is gradually increased to transfer the processed substrate from the process execution position, and then the process transfer speed is gradually decreased to the unloading transfer speed before the front end of the processed substrate reaches the unloading end. A substrate manufacturing and transporting facility, wherein the processed substrate is unloaded from the unloading end to the unloading / transferring device with a process transfer rate matched with the unloading / transferring rate. A carry-in end for carrying in the substrate, a process execution position for applying a predetermined manufacturing process to the substrate transferred and stopped from the carry-in end, and a carry-out end for transferring and carrying out the substrate subjected to the production process from the process execution position; And a process execution apparatus for performing the predetermined manufacturing process on the substrate at the process execution position, and transferring the substrate from the carry-in end to the carry-out end through the process execution position at a variable process transfer speed. A substrate manufacturing transfer facility comprising a possible process transfer device and a control device for controlling a process transfer speed of the process transfer device,
The control device transfers the process to a high speed transfer speed higher than a constant carry-out transfer speed of a carry-out transfer apparatus that is arranged in series downstream of the carry-out end and can transfer the processed substrate subjected to the manufacturing process. The process transfer speed of the apparatus is gradually increased to transfer the processed substrate from the process execution position, and then the process transfer speed is gradually decreased to the unloading transfer speed before the front end of the processed substrate reaches the unloading end. The process transfer speed is made to coincide with the carry-out transfer speed, the processed substrate is carried out from the carry-out end to the carry-out transfer device, and then the substrate can be transferred in series on the upstream side of the carry-in end. A step of bringing the substrate into the carry-in end from the carry-in transfer device by causing the process transfer speed of the process transfer device to coincide with a constant carry-in transfer speed of the carry-in transfer device, and passing the rear end of the substrate through the carry-in end Transfer Gradually increasing the speed to high-speed transfer rate faster than the carry transfer rate, then the substrate manufacturing transfer facility by decreasing the process transport speed, wherein the stopping the substrate to the process carried out position. In claim 1,
The control device is a process in which the manufacturing process is performed in parallel with bringing the substrate from the carry-in transfer device into the carry-in end by making the process transfer speed of the process transfer device coincide with the carry-in transfer speed. The finished substrate is arranged in series downstream from the carry-out end, and the processed substrate is carried out to a carry-out transfer device that can be transferred at the same carry-out transfer speed as the carry-in transfer speed, and the rear end of the substrate is the carry-in end And the rear end of the processed substrate passes the unloading end, the process transfer speed is gradually increased to the high speed transfer speed. 2. The control device according to claim 1, wherein the control device sets a variable carry-out transfer speed of a variable-speed carry-out transfer device that is arranged in series on the downstream side of the carry-out end and that can transfer a processed substrate subjected to the manufacturing process. Match the process transfer speed of the transfer device,
Alternatively, the control device according to claim 2, wherein the control device is arranged in series upstream of the carry-in end, and the variable carry-in transfer speed of the variable-speed carry-in transfer device capable of transferring the substrate is set to the process transfer speed of the process transfer device. A substrate manufacturing and transporting facility characterized by conforming to

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