JP3421966B2 - Component mounting method, multi-component mounting device, and mounting component sorting method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting time predicting method and a mounting part allocating method in an apparatus for mounting electronic parts on a printed circuit board.

[0002]

2. Description of the Related Art Recently, it has been demanded to cope with various types of component supply modes with a single equipment, and a component mounting apparatus corresponding to this is required.

FIG. 7 is a perspective view of an essential part showing an example of a component mounting apparatus which corresponds to various component supply modes by one device.
FIG. 8 is a partially omitted plan view of the device shown in FIG. This device was previously filed by the applicant as Japanese Patent Application No. 9-173922, and includes a component supply table on which a component reel having components temporarily fixed on a tape is mounted and a tray storing the components. It is a component mounting device that also has tray-type component supply devices provided in multiple stages.

In the figure, 1 is a component mounting device, 2 is a component reel, 3 is a component supply table, 4 is a component, 5 is a component tray accommodating a component 4, 6 is a component tray box, and 7 is a component supply table 3. A guide rail, 8 is a component supply cassette, 9 is a mounting head, 10 is an XY table, 11 is a printed circuit board, 12 is a component transfer head, and 13 is a mounting table.

Next, the operation of this device will be described with reference to FIG. The component mounting apparatus 1 mounts the component 4 sucked and held from the component supply cassette 8 or the mounting table 13 on which the component reel 2 is set, and the component 4 is sucked and held at the mounting position on the substrate 11 positioned by the XY table 10. When mounting a component included in the component reel 2, the component supply table 3 is moved to the component supply position P where the component is picked up by the mounting head 9. Then, the parts are adsorbed. On the other hand, when mounting the component 4 mounted on the component tray 5, the component transfer head 12 transfers the component 4 to the mounting table 13 and then moves the component supply table 3 to the component supply position P. The mounting table 13 is rotated one by one and mounted on the substrate 11 by the mounting head 9. At this time, the component supply table 3 and the mounting table 13 can be separately moved on the guide rail 7, but cannot be simultaneously present at the component supply position P. Further, it is possible to pick up components from the component supply table 3 and mount them on the substrate 11 while the components are being transferred to the placement table 13.

Further, in order to increase the number of types of components that can be mounted at the same time, a device having two component supply means shown in FIG. 8 can be considered. FIG. 9 is a partially omitted plan view showing another example of a component mounting apparatus that corresponds to various component supply modes by one device. This component mounting apparatus 1 shown in FIG. The mounting apparatus 100 has a component supply table 13
1 and the component supply table 132, and the mounting table 133 and the mounting table 134 are provided one on each side of the component supply position P. In this case, the component supply table 131 and the mounting table 133 on one side are not included in the guide rail 135.
It is located on the upper side and moves to the left and right at the same time by one ball screw. The same applies to the component supply table 132 and the placement table 134 on the opposite side. Therefore, from the component supply table 131 or the placement table 133 on one side to the mounting head 13
It is possible to move the component to the mounting table 134 on the other side in parallel while the component is being sucked at 6.
However, when the component is sucked from the component supply table 132 on the same side, the transfer to the placement table 134 cannot be performed.

As a method of allocating the mounted components to the component mounting apparatus thus configured, for example, as shown in Japanese Patent Laid-Open No. 4-275845, the mounting time of each component is standardized by the component and the model. A method of setting a value and allocating parts based on the value, and Japanese Patent Laid-Open No. 4-196
As disclosed in Japanese Patent Publication No. 296, the mounting time is calculated according to the ratio of the moving distance, and the component allocation is performed based on the calculated mounting time. The mounting time of the entire apparatus is obtained by the sum of the mounting time of each component. It was normal.

[0008]

However, in predicting the mounting time of such a multi-component mounting apparatus,
The balance between the mounting time on the component supply table side and the mounting time on the mounting table side changes depending on the number of parts to be distributed, and the waiting time until the parts are completely placed on the mounting table and the parts on the mounting table at once Since the apparatus cannot be placed, operations such as repeated movements of the placing table occur, and the mounting time of the entire apparatus becomes long, which reduces the production tact. In the mounting line including this device, if the distribution of the mounted components becomes the longest, this device becomes a bottleneck and reduces the production tact of the entire line. Therefore, it is necessary to promptly determine to which component mounting device each component should be distributed so as to minimize the production tact of the entire line.

In general, if this distribution work is manually carried out by a worker, it takes a long time to determine it, or a skilled worker is needed to determine a mounting sequence with higher productivity. Therefore, in many cases it is automatically determined by the method shown above, but in the component mounting device as described above, loss time is generated depending on the number of components, so it is proportional to the number of components as in the conventional method. However, there is a problem that the above calculation method cannot be applied.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a mounting time predicting method that also considers the transfer time of parts and an efficient method of distributing parts based on the method. .

[0011]

[Means for Solving the Problems]Component mounting method
IsOf electronic componentsA part that mounts electronic components on a printed circuit board
Directly from the component supplier at the component supply position of the product mounting device.
From the placement device that conveys the parts to the parts supply position
And the component group that mounts the component to the mounting position on the board.
From the component feeder to the component that transfers the component to the supply position
Multi-part to operate the mechanism group that transfers the data in parallel
Product mounting equipmentThe implementation method byIn parallel at the same time
Mount components to the above two mechanism groups of the component supplier
Steps to split and separate parts by parts in each group
Steps to calculate mounting time and transfer time, and
The sum of the mounting time of the group that mounts the product and the component mounting later
Transfer the parts from the parts supplier of the group
Compare the total transfer time of
Steps to determine the estimated implementation time of the group to be mounted
ToCharacterized by including.Also, multi-component mounting of the present invention
The device is a component mounting that mounts electronic components on a printed circuit board.
Directly from the component supplier at the component supply position of the device, or
Parts are placed on the board from the placement device that conveys the parts to the parts supply position.
Mechanism group to be mounted at the upper mounting position and component supply position
Transfer the parts from the parts supply unit to the placement device that transfers the parts to
Component mounting to operate the mechanical groups that operate in parallel
The device is a component supplier that can operate in parallel at the same time.
The mounting parts are divided into two mechanical groups and each group is
Calculate the mounting time and transfer time for each part in a loop,
The sum of the mounting time of the group that mounts the parts first, and the part
Parts are mounted from the component supplier of the group to be mounted on the mounting device.
Compare the sum of the transfer time to transfer the longer time first
The actual that is determined as the estimated mounting time of the group in which the component is mounted
It is characterized in that it has a wearing time prediction means. The present invention
The method of allocating the mounted components is to mount electronic components on the printed circuit board.
At the component supply position of the component mounting equipment for mounting
Placement that conveys parts directly from or to the parts supply position
A mechanical glue that mounts components from the device to the mounting position on the board.
And the parts supply to the placement device that conveys the parts to the parts supply position.
Mechanisms in which the mechanical groups that transfer parts from the feeder operate in parallel.
Connect multiple component mounting devices, including a multi-component mounting device.
A method of allocating components on a component mounting device line,
Limitation of each component mounting device Considering the conditions, all or
Initial allocation of some mounting parts and allocation
The mounting time for each component mounting device based on
For component mounting equipment,
The mounting time and transfer time are calculated for each part in the mechanical group.
The sum of the mounting time of the group that puts out the parts first and then
From the component supplier of the group that mounts components to the mounting device
Compared with the sum of the transfer time for transferring parts, the longer time
As the mounting time of the group that mounts the parts first,
Add the mounting time of the parts to be mounted later, and other
Of calculating the mounting time for each component mounting device
And the calculated mounting time of each component mounting device is a predetermined condition
And a step of evaluating whether or not
To collect.

According to the present invention, the mounting time can be pre-estimated in consideration of the parts transfer time, and the production tact can be minimized by efficiently allocating the parts based on the prediction. Becomes

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory view showing an example of mounting time calculation in an embodiment of a mounting time prediction method of the present invention, FIG. 2 is an explanatory view showing another example of mounting time calculation, and FIG. 3 is still another mounting time calculation. It is an explanatory view showing an example of. The components shown in FIGS. 8 and 9 can be used as the component mounting device for carrying out the method of the present invention, and the case where the method of the present invention is applied to these devices will be described below.

First, it is considered that the components shown in (Table 1) are distributed to the component mounting apparatus 1 shown in FIG.

[0015]

[Table 1]

When the mounting time is calculated by the conventional method, it becomes the sum of the total time of the parts A to H, and thus it becomes 10.5 seconds. However, this does not include the transfer time of the parts. No, it does not match the actual situation.

On the other hand, in the present embodiment, first, the components are classified into groups according to the type of the component supply body.
That is, the components A to E of the cassette reel and the components F to H supplied by the tray are divided, and next, as shown on the right side in FIG. In the case of (Table 1), it takes 7.3 seconds.

During this period, the operation of transferring the components supplied on the tray shown on the left side on the tray can be performed, but the time is 10 seconds. Therefore, since the transfer operation on the tray is not completed during the mounting time with the cassette,
Wait for the completion and move the tray to the mounting operation.

Finally, since the mounting time in the tray is 3.2 seconds from (Table 1), the total mounting time is 1
0 seconds + 3.2 seconds will be 13.2 seconds. This is a result of properly considering the transfer waiting time in comparison with the conventional method. The final mounting time is as shown in FIG.
This is often calculated by taking into consideration the loading / unloading of the board to the XY table 10 and the moving time of the component supply table 3, but this time is basically constant regardless of the number of components. is there.

Next, it is considered that the components shown in (Table 1) are distributed to the component mounting apparatus 100 shown in FIG.
In the case of the shape of the component mounting apparatus 100, the transfer operation time to the mounting table of the tray on the other side until the mounting of the cassette and tray components on the component supply table on the one side is completed depends on the entire production cycle. Does not affect. in this case,
Let us consider an operation mode in which the parts A, B, C, and F of (Table 1) are set in the left part supply table 132 and the parts D, E, G, and H are set in the right part supply table 131. It is special because the transfer parts are not mounted on both sides only in the initial state, but it is considered that the transfer parts on the left side have already been transferred considering the second and subsequent times.

In this way, as shown in FIG. 2 (a), the mounting time of the left side component is 5.3 seconds in total, while the transfer time of the right side tray component is 6 seconds. Since this is a second, it is necessary to wait 0.7 seconds until the transfer is completed before starting the next mounting operation. Next, the mounting time of the right component is 5.2 seconds in total, and the transfer time of the left tray component in the meantime is 4 seconds. Therefore, in this case, since the transfer is completed during the component mounting on the right side, the waiting time does not occur, and it becomes 11.2 seconds as a whole. Figure 2 shows the final mounting time.
As shown in (b), the production tact is calculated by taking into consideration the loading / unloading of the board to the XY table 101, the moving time of the component supply table, and the like.

Since there is a limit to the number of parts that can be placed on the transfer table at one time, when there are many transfer parts, as shown in FIG. The transfer may be performed again, and in this case, the transfer time becomes longer.

Now, a method of allocating components based on the mounting time predicted as described above will be described. FIG. 4 is a conceptual diagram showing an example of equipment combination of a mounting line capable of carrying out the component allocating method in the embodiment of the mounted component allocating method of the present invention, and FIG. 5 is an explanatory view of the component allocating method of the present invention.

As shown in FIG. 4, one component mounting apparatus 1 of this time for mounting both cassette components and tray components and a high-speed mounting apparatus 5 for mounting only conventional cassette components are provided.
Multifunctional mounting device 52 that can mount only 1 and tray parts
Considering a mounting line equipped with one each, first, while judging whether it is a component that can be mounted in each device,
Parts to be mounted are distributed to each device. Here, FIG.
As shown in (a), it is assumed that all the components A to H in (Table 1) are initially distributed to the component mounting apparatus 1.
The prediction of the mounting time of the device 51 and the device 52 at this stage considers only the standard mounting time of each component as usual. Since the device 1 has a long production tact and cannot clear the target line tact value indicated by the alternate long and short dash line, consider transferring parts to another device. First, since the tray component is a bottleneck in the apparatus 1, the production tact does not change even if the cassette component is transferred. Therefore, FIG.
As shown in (1), the tray parts are corrected so as to be transferred to reduce the production tact of the entire apparatus.

By transferring the component G to the apparatus 52 in this way, the transfer time is reduced together with the component mounting time, and the transfer waiting time T ₁ for the cassette component is eliminated. In addition,
The mounting time of the component G is different in the device 52 because the mounting method and the capability of the device are different because the mounting models are different.

Since the target line tact cannot be cleared even in the state of FIG. 5 (b), it is considered to further distribute the parts of the device 1 to other devices. This time, since the cassette component becomes the neck and the mounting waiting time T ₂ is generated, the component D is moved from the component to the device 51 as shown in FIG. 5C. As a result, each device can clear the target line tact.

Here, an example in which the number of parts is reduced has been described, but in the case of increasing the number, the reverse of this example may be considered. That is,
In FIG. 5C, the component mounting apparatus 1 has the tray component as the neck, so that the component D is added to the cassette component, and the configuration becomes as shown in FIG. 5B. When the number is further increased, since the cassette component is the neck, the component G is added to the tray component. If the preset target line tact value is too low to converge, the value is changed.

In the case of a shape such as the component mounting apparatus 100, first, by the mounting time predicting method described above, first, the sum of the mounting times of the cassette and the tray component of the component supply table on the left side of the apparatus and the mounting of the tray on the right side of the apparatus. The sum of the transfer times to the table is compared, the longer one is set to the left component mounting time, and in the same manner, the right component mounting time is also obtained. here,
To reduce the number of parts, compare the sum of the mounting time of the cassette and tray parts and the sum of the transfer time of the tray on the side with the longer part mounting time, and if the transfer time is longer,
First, the tray component is transferred to another device, and if it is short, the cassette component is transferred to another device. Conversely, when increasing the number of parts, compare the sum of the mounting times of the cassette and tray parts and the sum of the transfer times of the trays on the side with the shorter part mounting time, and if the transfer time is longer, First, the cassette component may be transferred from the other device, and if it is short, the tray component may be transferred from the other device.

The overall processing flow of the component allocation method based on the mounting time prediction described above is as follows. Figure 6
3 is a flowchart showing a processing flow of component allocation correction of a mounting line capable of implementing the component allocation method according to the embodiment of the present invention. First, in step 1, components mountable in each device are initially allocated, and then step 2 In step 3, the mounting time predicted value of each device is calculated, and in step 3, it is checked whether or not the standard is cleared. If not, in step 4, the increase / decrease of components is confirmed.
Correction is performed in the next step. In the case of an increase, in step 5, the parts in the group that does not become a neck are transferred from another device, and in the case of a decrease, in step 6, the parts in the group that do not become a neck are transferred to another device. After correction, return to step 2. Repeat the shape.

In this embodiment, the target line tact is compared, but other criteria such as tact difference between the devices may be used. Also, for simplification, the substrate loading time of each device, the moving time of the component supply table, etc., which were originally considered, are cut, but the time may be evaluated by adding these times.

As described above, according to the present embodiment, the mounting device for transporting the component directly from the component supply body or to the component supply position at the component supply position of the mounting device for mounting the electronic component on the printed circuit board. Mounting time of a multi-component mounting device that operates in parallel the mechanism group that mounts the component from the component supply unit to the mounting position on the board and the mechanism group that transfers the component from the component supply unit to the mounting device that conveys the component to the component supply position Can be predicted in a form conforming to the actual situation, and based on this mounting time prediction, the parts can be efficiently distributed to the mounting line including the multi-component mounting apparatus.
In addition, since the mounting time can be predicted in advance in this way, it is possible to easily create a highly accurate production plan in advance, and also in the mounting component distribution, the time until the distribution decision is shortened and the created distribution Since the result does not depend on the skill of the worker, the productivity of the entire mounting line can be easily increased.

[0032]

As described above, according to the present invention, it is possible to predict the mounting time of electronic components in a form that matches the actual situation, and based on this mounting time estimation, efficient component allocation to the mounting line is performed. Since it can be performed, there is an advantageous effect that the productivity of the entire mounting line can be easily increased.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an example of mounting time calculation in an embodiment of a mounting time prediction method according to the present invention.

FIG. 2 is an explanatory diagram showing another example of mounting time calculation in the embodiment of the mounting time prediction method of the present invention.

FIG. 3 is an explanatory view showing still another example of mounting time calculation in the embodiment of the mounting time prediction method of the present invention.

FIG. 4 is a conceptual diagram showing an example of equipment combination of a mounting line capable of implementing the component allocation method in the embodiment of the mounted component allocation method of the present invention.

FIG. 5 is an explanatory diagram of a mounting line component allocating method capable of implementing the component allocating method in the embodiment of the mounted component allocating method according to the present invention.

FIG. 6 is a flowchart showing a processing flow of component distribution correction of a mounting line in the embodiment of the mounted component distribution method of the present invention.

FIG. 7 is a perspective view of an essential part showing an example of a component mounting apparatus that corresponds to various component supply modes by one device.

FIG. 8 is a partially omitted plan view of the device shown in FIG.

FIG. 9 is a partially omitted plan view showing another example of a component mounting apparatus that corresponds to various component supply modes by one device.

[Explanation of symbols]

1 Component mounting device 2 parts reel 3 parts supply table 4 parts 5 parts tray 6 parts tray box 7 Guide rail 8 parts supply cassette 9 mounting head 10 XY table 11 printed circuit boards 12 Parts transfer head 13 Placement table

─────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-3-238897 (JP, A) JP-A-4-196296 (JP, A) JP-A-4-275845 (JP, A) JP-A-4- 111728 (JP, A) JP-A-9-51193 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 13/04 B23P 21/00

Claims (5)

(57) [Claims] 1. A component mounting apparatus for mounting electronic components on a printed circuit board, at the component supply position, directly from the component supply body, or from a mounting device for transporting the component to the component supply position, transfers the component to the mounting position on the substrate. A mounting method by a multi-component mounting apparatus in which a mechanism group to be mounted and a mechanism group that transfers a component from a component supply unit to a mounting device that conveys the component to a component supply position are operated in parallel Dividing the mounting parts into the two mechanism groups of the supply body, calculating the mounting time and transfer time for each part in each group, the sum of the mounting time of the group in which the parts are mounted first, and From the component supply group of the component mounting group to the mounting device, and compare the sum of the transfer times for transferring the components from the component supply unit to the mounting device. A component mounting method comprising the step of determining the measured mounting time. 2. A component mounting device for mounting an electronic component on a printed circuit board, at a component supplying position, directly from the component supplying body or from a mounting device for conveying the component to the component supplying position to mount the component on the substrate. A multi-section that operates the mechanism group to be mounted and the mechanism group that transfers the component from the component supply unit to the placement device that conveys the component to the component supply position in parallel.
Component mounting device that can operate in parallel at the same time
The mounting parts are divided into the above two mechanical groups,
In each of these groups, the mounting time and transfer time are calculated for each component, and the sum of the mounting time of the group that mounts the component first and the transfer that transfers the component from the component supply unit of the group that mounts the component to the mounting device later. Compare the sum of the times and decide the longer time as the estimated mounting time of the group that mounts the parts first
A multi- unit equipped with a mounting time predicting means
Component mounting equipment . 3. A unit for mounting an electronic component on a printed circuit board.
Directly from the component supplier at the component supply position of the component mounting equipment.
From the placement device that conveys the parts to the parts supply position
And the component group that mounts the component to the mounting position on the board.
From the component feeder to the component that transfers the component to the supply position
Multi-component mounting in which a mechanical group that transfers components operates in parallel
Component mounting that connects multiple component mounting devices including devices
A method for allocating parts on the equipment line,
All or part of the mounting part, considering the placement restrictions
Based on the steps of initial distribution of the products and the distributed parts.
The mounting time for each component mounting device is
For each of the above mechanism groups that can operate in parallel
Calculate the mounting time and transfer time for each part by
The sum of the mounting time of the group that mounts the product and the component mounting later
Transfer the parts from the parts supplier of the group
Compare the total transfer time of
As the mounting time of the group to be mounted
The mounting time of the component
And the step of calculating the mounting time for the
Whether the mounting time of each component mounting device satisfies the predetermined condition
Implementation component allocation how to; and a step of evaluating the emergence. 4. The amount that has already been distributed based on the evaluation result.
Corrections or corrections to sort the unallocated
And then return to the step of calculating the mounting time again.
4. The method according to claim 3, further comprising:
How to sort the mounted parts described. 5. The correction step of the distribution result, etc.
H When reducing the number of parts distributed from the component mounting device,
Longer implementation time by comparing the estimated implementation time of each group
If you reduce the number of parts in the group and increase the number of parts,
Special correction is made to add from the shorter group.
The method for allocating mounted parts according to claim 4, which is a characteristic.