JP2009021640A - Component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve productivity when mounting components on substrates, by providing a component mounting device with two substrate conveying devices each of which carries in and out a substrate, and performing proper control. <P>SOLUTION: A component transfer device having two component picking heads 43a and 43b picks components from component supply devices 45a and 45b and mounts them on substrates Sa and Sb carried in by two substrate conveying devices 10a and 10b respectively. The component transfer device having two component picking heads simultaneously mounts components on two substrates carried in by two substrate conveying devices when neither of two substrate conveying devices are conveying substrates nor are changing width, and the component transfer device mounts a component only on a substrate held in a component mounting position of one of two substrate conveying devices when the other substrate conveying device is conveying a substrate or is changing width. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to a component mounting equipment for mounting electronic components on a substrate.

This type of conventional component mounting apparatus mounts components supplied from a component supply apparatus on a single board carried by a single board transport apparatus by a single component transfer apparatus. Parts were mounted on each sheet .

Thus, the component mounting equipment of the prior art is to perform the component mounting for each sheet substrate, but transferring the number of components per unit time ho Isuzu is constant, also the substrate by the substrate transfer apparatus Since the mounting of components is interrupted during transportation, there has been a limit to improving the productivity of the board .

The invention, together with each providing two substrate transfer apparatus which performs loading and unloading of the substrate to the component mounting apparatus, and aims to solve such problems by carrying out the appropriate control.

In order to solve the above-described problem, the structural feature of the invention described in claim 1 is that two substrate transfer apparatuses each for transferring a substrate and a component for supplying a plurality of types of components to be mounted on the substrate a supply device, respectively parallel to the plane in two directions of at least the substrate two parts picking head and the two parts picking head is mounted on the substrate and collect component supplied from the component supply device In the component mounting apparatus including the component transfer device including the two head transfer mechanisms that move independently , either one of the two substrate transfer devices is transferring the substrate, or the width is increased. Determining means for determining whether or not the change is in progress; and when the determining means determines that neither of the two substrate transfer devices is transferring the substrate and that the width is not being changed, the component transfer device to the two substrate transport At the same time to implement part article against two substrates are transported to the component mounting position by location, during transportation either said substrate of said judgment means the two substrate transport devices, or change the width If it is determined to be in a mounting control means for only mounting components on the substrate held by the component transfer device to the component mounting position of the other substrate transport apparatus, Ru Kotodea equipped with.

The structural feature of the invention according to claim 2 is that, in claim 1 , any one of the component sampling heads exclusively mounts a component on any one of the substrates, and the other component sampling head is the other component sampling head. The mounting of components on the board is exclusively performed.

A structural feature of the invention according to claim 3 is that, in claim 2 , when any one of the boards is being transferred after completion of component mounting, or the board transfer device that transfers one of the boards has a width. When the component is being changed, one of the component picking heads that exclusively mounts the component on the one substrate is responsible for mounting the component on the other substrate by the other component picking head, and the component on the other substrate Is to implement.

The structural feature of the invention according to claim 4 is that, in any one of claims 1 to 3, the two substrate transfer devices each have two guide rails for guiding both sides of the substrate, The component supply devices are respectively provided on the outer sides opposite to the adjacent central sides of the two substrate transfer devices, and each of the two guide rails on the outer side adjacent to the component supply device. The rails are respectively fixed to outer support legs fixed at positions close to the component supply device, and the guide rails on the center side are positioned in the width direction perpendicular to the board transport direction by the guide rail position adjusting means. It is fixed to each leg .

According to a fifth aspect of the present invention, in the configuration according to the fourth aspect , the guide rail position adjusting means includes a first screw shaft and a second screw shaft extending in the width direction of each of the two substrate transfer devices. The first screw shaft is screwed with the inner support leg of one substrate transfer device, and the second screw shaft is screwed with the inner support leg of the other substrate transfer device. Ru Kotodea being.

In the invention according to claim 1 configured as described above, when any of the two substrate transfer devices determines that neither the substrate is being transferred nor the width is being changed, the device has two component sampling heads. component transfer device simultaneously to implement part article against two substrate carried by the two substrate transport devices, while being conveyed a substrate of the two substrate transport devices, or in changing the width If it is determined that the component is mounted only on the board held at the component mounting position of the other board transfer device, it is possible to avoid interruption of component mounting during board transfer or width change . , transfer the number of components per unit time Ru can improve the productivity of the substrate be the same.

In the invention according to claim 2 configured as described above, any one of the component picking heads exclusively mounts the components on any one of the substrates, and the other component picking head mounts the components on the other substrate. Since it is performed exclusively, the program for controlling the operation of the component mounting apparatus can be simplified.

In the invention according to claim 3 configured as described above, when any one of the boards is being transported after the completion of component mounting, or the board transporting apparatus that transports one of the boards is changing the width. Sometimes, one component picking head that exclusively mounts a component on one board takes part in mounting the component on the other substrate by the other component picking head and mounts the component on the other substrate. The efficiency of component mounting on the other board can be improved.

In the invention according to Claim 4 as constructed above, among the two guide rails for guiding the sides of the formed substrate in each of the two substrate transport devices, the outer adjacent to component feeder each The guide rails are respectively fixed to outer support legs fixed at positions close to the component supply device, and the inner side guide rails are adjusted in the width direction perpendicular to the board transport direction by the guide rail position adjusting means. Since the two guide rails are fixed to each other, the two boards are separated by the surplus space between the movable guide rails on the center side of each board transfer device generated when the widths of the two guide rails are narrowed. The possibility of interference can be reduced.

In the invention according to claim 5 configured as described above, the first and second screw shafts extending in the width direction are rotatably supported by the respective outer support legs of the two substrate transfer apparatuses, One screw shaft is screwed with the inner support leg of one substrate transfer device, and the second screw shaft is screwed with the inner support leg of the other substrate transfer device. As a result, the guide rails on the center side of the two substrate transfer devices can be easily positioned with a simple configuration in the width direction orthogonal to the substrate transfer direction, and the width of the two guide rails of the substrate transfer device is reduced. The two substrates transported to each substrate transport device are separated by the extra space between the guide rails on the central side that is sometimes generated, and the possibility of interference of the component picking head can be reduced.

  Hereinafter, a component mounting apparatus according to the present invention, a program for controlling the operation thereof, and a component mounting system will be described with reference to embodiments shown in the accompanying drawings. First, the component mounting apparatus according to the present invention will be described with reference to FIGS. This component mounting apparatus includes first and second substrate transfer devices 10a and 10b, a conveyor width changing device 30 associated with each of the substrate transfer devices 10a and 10b, a component transfer device 40, and first and second component supplies. It is comprised by apparatus 45a, 45b.

  Since the first and second substrate transfer apparatuses 10a and 10b have substantially the same structure, the first substrate transfer apparatus 10a will be mainly described. As shown in FIGS. 2 and 3, the pair of outer support legs 12 are erected and fixed on the base 11, and the pair of inner support legs 12 a opposed to the outer support legs 12 are the outer support legs 12. Is fixedly erected and fixed on a slider 15a guided and supported on a base 11 via a guide rail 15 orthogonal to the outer support leg 12. Both ends of the support plate 13 are fixed to the upper portions of the support legs 12 and 12a, and side rails 14 are fixed to the upper edges of the support plates 13 protruding upward from the support legs 12 and 12a. A flange portion 14 a that protrudes inward from the support rail 20 is formed at the upper edge of 14. The second substrate transfer device 10b is provided on the base 11 in parallel and symmetrically with the first substrate transfer device 10a so that the inner support legs 12a are adjacent to each other. A support plate 39 is erected and fixed to the base 11 outside the outer support legs 12 of the second substrate transport apparatus 10b.

  Both end portions of the transfer rotary shaft 16 arranged so as to be orthogonal to the support plate 13 are rotatably supported by one outer support leg 12 of each of the substrate transfer apparatuses 10a and 10b, and a spline shaft portion occupying most of the middle. 16a penetrates the corresponding inner support leg 12a so as to be rotatable and slidable in the axial direction. Outer drive pulleys 17 are fixed to both ends of the transport rotary shaft 16 in contact with the outer support legs 12. The inner driving pulley 17a is supported by a boss formed in a portion through which the spline shaft portion 16a of each inner support leg 12a passes so that the inner driving pulley 17a is freely rotatable and axial movement is restricted. 17a is slidably engaged with the spline shaft portion 16a so as to be able to transmit the rotation of the transport rotary shaft 16.

  As shown mainly in FIG. 3, the support plate 13 fixed to the inner support leg 12a has a pair of pulleys 18 and 19 that are freely rotatable at both ends slightly below the side rail 14 and below the inside. Also, pulleys 19a and 19b are rotatably provided below the intermediate portions of the pulleys 18 and 19, respectively. A conveyor belt 21 having a convex cross section is stretched between the inner driving pulley 17a and each of the pulleys 18, 19, 19a, 19b, and the pulley 17a, 18, 19a prevents the conveyor belt 21 from being detached. For this purpose, a circumferential groove is provided which engages with the convex part of the cross section of the conveyor belt 21. A part of each conveyor belt 21 stretched between the pair of pulleys 18 is maintained at a certain distance from the flange portion 14 a of each side rail 14. A longitudinal groove that engages with the convex portion of the belt 21 is formed, and a support rail 20 that supports this portion of the conveyor belt 21 is fixed to the support plate 13. A similar pulley 18, 19, 19a, 19b is also provided on the support plate 13 fixed to the outer support leg 12, and a conveyor belt is also provided between the outer drive pulley 17 and each of these pulleys 18, 19, 19a, 19b. A support rail 20 for supporting the conveyor belt 21 is provided.

  One end of the transfer rotating shaft 16 protrudes from the support plate 39 through the outer support leg 12 of the second substrate transfer apparatus 10b, and a pulley 16b is fixed to the tip thereof. A conveyor drive motor 22 is supported on the base 11 (the support structure is not shown), and a drive belt 23 is provided between a pulley 22a and a pulley 16b fixed to the output shaft of the conveyor drive motor 22 for conveying. The conveyor belt 21 is moved by rotating the driving pulleys 17 and 17 a via the rotating shaft 16. By the board transfer devices 10a and 10b described above, two linear transfer type conveyors for carrying the two boards Sa and Sb into and out of the component mounting apparatus are formed.

  Between the inner and outer support rails 20 on the upper and lower portions of the substrate transfer devices 10a and 10b, a backup plate 24a that is lifted and lowered by a lifting device (not shown) and a large number of standing and fixed on the backup plate 24a. A backup device 24 comprising a backup pin 24b is provided. The illustrated backup device 24 is not variable in width in the direction orthogonal to the conveyance direction. Therefore, whenever the width in the direction orthogonal to the conveyance direction of the substrate conveyance devices 10a and 10b is changed by the conveyor width changing device 30 described later, the backup device 24 is backed up. The plate will be replaced. However, the backup device 24 is not limited to this, and it is assumed that the width is automatically changed in conjunction with the operation of the conveyor width changing device 30, and the backup device 24 is replaced every time the width of the substrate transfer devices 10a and 10b is changed. Can be eliminated. In FIG. 2, the backup device 24 is displayed only on the second substrate transfer device 10b in order to simplify the drawing, but the backup device 24 is also provided on the first substrate transfer device 10a.

  The boards Sa and Sb are supported by the respective conveyor belts 21 of the first and second board transfer devices 10a and 10b, carried into and out of the component mounting apparatus, and transferred to a predetermined position. If it raises, each board | substrate Sa and Sb will be lifted, will contact | abut to the flange part 14a of each side rail 14, and will be located in a component mounting position.

  In this embodiment, the transfer rotary shaft 16 is common to the first and second substrate transfer apparatuses 10a and 10b, and the conveyor belts 21 of both the substrate transfer apparatuses 10a and 10b are driven simultaneously. However, the drive device for the conveyor belt 21 is not limited to this, and the first and second substrate transfer devices 10a and 10b are each provided with a transfer rotary shaft 16 and rotated by different conveyor drive motors 22. In this case, the conveyor belts 21 of both the substrate transfer apparatuses 10a and 10b can be driven independently of each other. In this case, the transport rotary shafts 16 may be provided on the support legs 12 and 12a on the opposite sides in FIG.

  Next, the conveyor width changing device 30 will be described with reference to FIGS. A pair of first screw shafts 31 arranged in parallel with the transport rotation shaft 16 changes the distance between the support legs 12 and 12a of the first substrate transport apparatus 10a and the support plate 13 supported by the support legs 12. It is. Both ends of each first screw shaft 31 are rotatably supported by the outer support legs 12 of both of the substrate transfer apparatuses 10a and 10b, and the middle part rotates and slides the inner support legs 12a of the second substrate transfer apparatus 10b. A thread portion that penetrates freely and is mainly formed on the first substrate transport apparatus 10a side is screwed to a boss formed on the inner support leg 12a of the first substrate transport apparatus 10a. One end of each first screw shaft 31 protrudes from the support plate 39 through the outer support leg 12 of the second substrate transfer device 10b, and a pulley 31a is fixed to each tip, and one half of both pulleys 31a are linked to each other. It is rotationally connected via a belt 32 for use. A first drive motor 33 is supported on the base 11 (the support structure is not shown), and a drive belt 34 is provided between the pulley 33a fixed to the output shaft of the first drive motor 33 and the remaining half of one pulley 31a. As a result, both first screw shafts 31 are rotated in conjunction with the first drive motor 33, and the width in the direction perpendicular to the transport direction of the first substrate transport apparatus 10a (supported by both support legs 12, 12a) is provided. The distance between the support plate 13 and the side rail 14) is changed.

A pair of second screw shafts 35 arranged in parallel with the transfer rotating shaft 16 changes the distance between the support legs 12 and 12a of the second substrate transfer apparatus 10b and the support plate 13 supported by the support legs 12. It is. Both ends of each second screw shaft 35 are rotatably supported by the outer support legs 12 of both the substrate transfer apparatuses 10a and 10b, and the intermediate part is rotatable and slidable by the inner support legs 12a of the first substrate transfer apparatus 10a. , And a threaded portion formed mainly on the second substrate transport apparatus 10b side is screwed to a boss formed on the inner support leg 12a of the second substrate transport apparatus 10b. Since the structure of the other related parts is substantially the same as that of the first screw shaft 31, the corresponding member is given a reference number 4 larger than that of the first screw shaft 31, and detailed description thereof is omitted. When the second drive motor 37 is rotated, both the second screw shafts 35 are rotated in conjunction with each other, and the width in the direction orthogonal to the transport direction of the second substrate transport apparatus 10b is the width of the first substrate transport apparatus 10a. Is changed independently.

In this embodiment, the outer support legs 12 of the substrate transfer apparatuses 10a and 10b are fixed to the base 11, and the inner support legs 12a are moved independently, so that the substrate transfer apparatuses 10a and 10b are moved. The width of can be changed independently. However, the present invention is not limited to this, and each inner support leg may be fixed to the base 11 and each outer support leg may be moved independently by two screw shafts, or one of the two substrate transfer apparatuses 10a and 10b. The other outer support leg and the other inner support leg may be fixed to the base 11, and the remaining inner support leg and outer support leg may be moved independently by two screw shafts. Alternatively , only one outer support leg of both the substrate transfer apparatuses 10a and 10b is fixed to the base 11, the two inner support legs move together by a screw shaft, and the other outer support leg is two inner support legs. You may make it move with another screw axis independently.

Next, as shown in FIG. 1, the component transfer device 40 includes a pair of fixed rails 41 arranged in parallel to each other above both end portions of both the substrate transfer devices 10 a and 10 b and supported by the base 11, Two head moving rails 42a and 42b which are arranged orthogonal to the fixed rail 41 and supported at both ends so as to be movable along the fixed rail 41, and are movable along the head moving rails 42a and 42b, respectively. It consists of two supported component picking heads 43a and 43b, and a fixed rail 41 and head moving rails 42a and 42b move the component picking heads 43a and 43b in two directions parallel to the surfaces of the substrates Sa and Sb. Two head transfer mechanisms are configured. Each of the component picking heads 43a and 43b includes a suction nozzle (not shown) that can be moved up and down to suck the component. The movements of the head moving rails 42a and 42b, the component picking heads 43a and 43b, and the suction nozzle are controlled by a servo motor, respectively, and the components supplied from the component supply devices 45a and 45b described below are sucked by the suction nozzles to As described above, the circuit board is transferred and mounted on the boards Sa and Sb held at the component mounting positions of the board transfer devices 10a and 10b.

  As shown in FIG. 1, the component supply devices 45 a and 45 b include a plurality of feeders installed side by side on a feeder table, and each feeder is, for example, a tape type. This tape-type feeder winds and holds a long and narrow tape enclosing components at a predetermined pitch around a supply reel, and the components picked up (collected) by the suction nozzle of the component picking head 43 one by one on the substrate transfer devices 10a and 10b side. It feeds into the tip of the tape type feeder. The tape consists of a tape body that holds the parts and a cover tape that covers them. The cover tape is peeled off at the tip of the feeder so that the parts can be sucked, and the tape body that has picked up the parts is folded downward and wound. It has come to be taken. In this embodiment, one component supply device 45a, 45b is provided on both outer sides of the first and second substrate transfer devices 10a, 10b, but one component supply device 45a, 45b is provided on either outer side of either of the substrate transfer devices 10a, 10b. Only one may be provided.

  As shown in FIG. 4, the operation of the component mounting apparatus is controlled by a control device 60, and the control device 60 further includes a communication unit 61, an input unit 64, a display unit 65, a storage unit 63, and a mounting plan creation unit 62. It is connected. The communication unit 61 communicates with a host computer that manages a production line including the component mounting apparatus. For example, mounting data for each type of product to be produced (component type to be mounted and data of its mounting coordinates). Production plan data (data indicating the production order and the number of products produced for each product type) is transmitted from the host computer to the component mounting apparatus.

  The mounting plan creation unit 62 creates a mounting program that is actually executed by the component mounting apparatus based on the mounting data and production plan data for each product type transmitted from the host computer. In other words, the optimal feeder arrangement in the component supply devices 45a and 45b according to the quantity of each board type to be produced and the mounting sequence considering the respective mounting speed ratios when two types are produced simultaneously are determined. A mounting program that avoids a situation in which the production efficiency is lowered such that the two substrate transfer apparatuses 10a and 10b are both transferring the substrates Sa and Sb is created. The mounting program creation process performed by the mounting plan creation unit 62 may be executed by the host computer, and the completed mounting program may be transmitted to the component mounting apparatus.

  The storage unit 63 stores various programs, data, logs, and the like related to the component mounting apparatus. In this embodiment, the mounting data and production plan data for each product type transmitted from the host computer, and the mounting program created by the mounting plan creation unit 62 based on them are stored. The input unit 64 is a keyboard and push buttons for inputting necessary data and commands. The display unit 65 is a display device using liquid crystal or CRT for displaying necessary information.

Next, the operation of the above-described component mounting apparatus will be described.
(First embodiment)
First , the operation of the first embodiment including the component transfer device 40 having two substrate transfer devices 10a and 10b, two component supply devices 45a and 45b, and two component sampling heads 43 will be described. As described above, the component mounting apparatus according to the first embodiment is operated by a mounting program that avoids the situation where the two board transfer apparatuses 10a and 10b are both transferring the boards Sa and Sb. .

The operation of the first embodiment will be described with reference to the flowchart shown in FIG . If neither of the substrate transfer apparatuses 10a and 10b is transferring the substrates Sa and Sb to be supported and the width of each is not being changed, the control device 60 performs the control operation from step 100 to step 101 to step 101. Go through 103 to step 104. In this step 104, the component picking heads 43a and 43b of the component transfer device 40 suck the components specified from the component supply devices 45a and 45b and hold them at the component mounting positions on both the board transfer devices 10a and 10b. substrate Sa, that implements parts simultaneously in parallel at a predetermined coordinate position on Sb.

When any one of the substrate transfer devices 10a (or 10b) is transferring a substrate or changing the width, the corresponding component picking head 43a (or 43b) complicit in component picking head 43b corresponding to the conveying device 10b (or 10a) (or 43a), intends row of parts mounting to the other substrate transport device 10b (or 10a) to be held substrates Sb (or Sa) . Component mounting time for this case also the substrate Sb (or Sa) is shortened, the mounting efficiency is Ru is improved.

As shown in FIGS. 1 and 5, the component mounting apparatus equipped with the component transfer device 40 having two substrate transport devices 10a, 10b, the two component supplying devices 45a, 45b are and two component picking head 43, In order to reduce the moving distance of the mounted component and simplify the control program, the first component sampling head 43a exclusively mounts the component on the board Sa, and the second component sampling head 43b exclusively loads the component on the board Sb. It is preferable to perform the mounting. Further, in this case, when both the component sampling heads 43a and 43b are in a predetermined interference danger area Si close to the central portion between the two substrates Sa and Sb, physical interference between both the component sampling heads 43a and 43b is caused. Avoidance is difficult. Note that the central portion here refers to a point-symmetrical center point of both substrates Sa and Sb stopped at the component mounting position for component mounting, and part or all of the edge portions of both substrates Sa and Sb are arranged in parallel to each other. In this case, it is the center line of the range in which the edges are arranged, and the predetermined interference danger area Si is each substrate Sa separated from the above-mentioned central part by a distance given by the planar shape of each component sampling head 43a, 43b. , Sb. Further, the range excluding the danger interference region Si on each of the substrates Sa and Sb is an interference safety region. Next, some embodiments for avoiding this interference will be described.

(Second Embodiment)
In the second embodiment shown in FIG. 6 , the stop positions in the transport direction of the boards Sa and Sb at the time of component mounting in the two board transport apparatuses 10a and 10b are different from each other. If the stop position is more than an appropriate distance, the predetermined interference risk area Si approaching the central portion between the two boards Sa and Sb is eliminated at the time of component mounting. Therefore, when components are mounted on the boards Sa and Sb. There is no possibility that the two component picking heads 43a and 43b interfere with each other. Therefore, the efficiency of component mounting on the boards Sa and Sb is improved, and the program for controlling the operation of the component mounting apparatus is simplified.

(Third embodiment)
In the second embodiment described above, the interference between the two component sampling heads 43a and 43b described above is avoided by devising the physical arrangement of the stop positions of the substrates Sa and Sb . In the third embodiment shown in the chart and the flowchart in FIG. 20 , the interference is avoided by devising the control program of the component mounting apparatus without having to shift the positions of both the boards Sa and Sb. It is. As described above, the first component picking head 43a exclusively mounts components on the substrate Sa, and the second component picking head 43b exclusively mounts components on the substrate Sb. To do.

First, when neither of the first and second component picking heads 43a, 43b mounts a component in the corresponding risk area Si of the corresponding substrate Sa, Sb, the control device 60 performs the control operation in the flowchart of FIG. Proceed from step 110 to step 112 through step 111. In this step 112, the component picking heads 43a and 43b mount components in the interference safety areas of the substrates Sa and Sb of the corresponding substrate transfer apparatuses 10a and 10b. When the first component sampling head 43a mounts a component in the risk of interference area Si of the substrate Sa on the first substrate transport apparatus 10a, the control device 60 advances the control operation from step 110 to step 113 to extract the second component. The head 43b mounts components in the interference safety area of the substrate Sb on the second substrate transport apparatus 10b. Further, when the second component picking head 43b mounts components on the interference risk area Si of the substrate Sb on the second substrate transfer device 10b, the control device 60 advances the control operation from step 111 to step 114, and performs the first operation. The component picking head 43a mounts components in the interference safety area of the substrate Sa on the first substrate transport apparatus 10a. As a result, the component sampling heads 43a and 43b do not simultaneously mount components in the interference risk areas Si of both the boards Sa and Sb. Therefore, when mounting components on the boards Sa and Sb, the two component sampling heads 43a are installed. , 43b can be prevented from interfering with each other.

(Fourth embodiment)
The fourth embodiment shown in FIGS . 8 , 9, and 21 also devise a control program for the component mounting apparatus, so that the two component sampling heads 43a can be obtained without shifting the positions of both the boards Sa and Sb. 43b are avoided. Next, the operation of the fourth embodiment will be described mainly with reference to the flowchart shown in FIG .

  First, when neither of the substrate transfer apparatuses 10a and 10b is transferring the substrates Sa and Sb to be supported and the widths of the substrates are not being changed, the control device 60 performs the control operation from step 120. Go to step 124 through 121-123. In this step 124, the component picking heads 43a and 43b of the component transfer device 40 suck the components from the component supply devices 45a and 45b and interfere with the substrates Sa and Sb held by both the substrate transfer devices 10a and 10b. A component is mounted at a predetermined coordinate position within the safety area.

As shown in FIG. 9 , when the second substrate transport apparatus 10b is transporting the substrate Sb, or when the second substrate transport apparatus 10b is changing its width, the control device 60 starts the control operation from step 120. The process proceeds to step 122 or step 123 through step 121, and further proceeds to step 126. In this step 126, the first component picking head 43a sequentially picks up the components designated from the first component supply device 45a, and the interference risk area Si of the substrate Sa held at the component mounting position of the first substrate transport device 10a. The components are sequentially mounted at predetermined positions. When the second substrate transport apparatus 10b is transporting the substrate Sb, or when the second substrate transport apparatus 10b is changing its width, no component is mounted on the substrate Sb, so the second component sampling head 43b. May be retracted to a position where there is no possibility of interfering with the first component picking head 43a (see FIG. 9 ), and in that case, the first component picking head 43a for mounting the component in the interference risk area Si of the substrate Sa There is no interference. Alternatively, the components may be mounted in the interference risk area Si of the substrate Sa in addition to the first component collecting head 43a, and the production efficiency of the substrate Sa can be increased. In this case, control for avoiding interference between the two component picking heads 43a and 43b is necessary.

  Similarly, when the first substrate transport apparatus 10a is transporting the substrate Sa or when the first substrate transport apparatus 10a is changing its width, the control device 60 performs the control operation from step 120 or step 121. Proceeding to step 125, the second component picking head 43b mounts the component at a predetermined position in the interference risk area Si of the substrate Sb held by the first substrate transport apparatus 10a. Also in this case, if the first component picking head 43a that does not mount the component on the board Sa is retracted, the first component picking head 43a may interfere with the second component collecting head 43b that mounts the component in the interference risk area Si of the board Sb. If the part is mounted in the interference risk area Si of the substrate Sb by taking part in the second component sampling head 43b, the production efficiency of the substrate Sb can be improved.

  The mounting of components on the boards Sa and Sb by the component sampling heads 43a and 43b in the second to fourth embodiments is performed in the same manner as described with reference to FIGS. 5 to 7 in the first embodiment. Is called. In the second to fourth embodiments, the component sucked from the first component supply device 45a is mounted on the substrate Sa, and the component sucked from the second component supply device 45b is mounted on the substrate Sb. Depending on the case, the component sucked from the first component supply device 45a may be mounted on the substrate Sb, and the component sucked from the second component supply device 45b may be mounted on the substrate Sa. Alternatively, only one component supply device may be provided in the component mounting apparatus, and the components may be sucked and mounted on the boards Sa and Sb only from the component supply apparatus.

(Fifth embodiment)
Next, a fifth embodiment shown in FIGS . 10 to 14 will be described. This embodiment uses a component mounting apparatus including a component transfer device 40 having two substrate transfer devices 10a and 10b, two component supply devices 45a and 45b, and two component sampling heads 43a and 43b. An example of the procedure for mounting components on the three types of boards shown in Table 1 below is shown.

  As a production sequence, first, the substrate A is transported by the first substrate transport device 10a and the substrate B is transported by the second substrate transport device 10b, whereby the production of the two substrates A and B is started. After the above, the substrate C is transferred by the second substrate transfer device 10b and the substrate A is continuously transferred by the first substrate transfer device 10a to produce two substrates A and C.

In this case, prior to the start of production, as shown in FIG. 10 , each conveyor width changing device 30 sets the width of the first substrate transfer device 10a to 10 cm and the width of the second substrate transfer device 10b to 15 cm. A feeder for production A is set on the feeder table of the first component supply device 45a, a feeder for production of substrate B is set on the feeder table of the second component supply device 45b, and a feeder for production of substrate C is second. Set on the feeder table of the component supply device 45b. In the illustrated example, since the feeder for producing the substrate C cannot be set on the feeder table of the second component supply device 45b, it is also set on the feeder table of the first component supply device 45a.

At the time of production, first, as shown in FIG. 11 , the substrate A is sequentially carried by the first substrate transfer device 10a, and the components are mounted by the first component picking head 43a (not shown). The board B is sequentially carried in by the transfer device 10b, and the components are mounted by the second component collecting head 43b (not shown). In order to avoid physical interference between the component sampling heads 43a and 43b in the interference risk area Si between the substrates Sa and Sb, the substrates Sa and Sb may have different stop positions in the transport direction ( ( See FIG. 6 ).

After the production of the substrate B, as shown in FIG. 12 , the width of the second substrate transfer device 10b is changed from 15 cm to 10 cm by the conveyor width changing device 30 of the second substrate transfer device 10b in parallel with the component mounting on the substrate A. Change to During this change, the second component picking head 43b may be retracted to the retracted position. However, if the components are mounted on the board A in addition to the first component picking head 43a, the production efficiency can be improved. In this case, control for avoiding interference between the two component picking heads 43a and 43b is necessary.

When the change of the width of the second substrate transfer device 10b is completed, the substrate carried in by the second substrate transfer device 10b in parallel with the component mounting on the substrate A by the first component sampling head 43a as shown in FIG. The component is mounted on C by the second component sampling head 43b. When the feeder of the component to be mounted on the substrate C is set on the feeder table on the first component supply device 45a side, the opportunity of interference between the component sampling heads 43a and 43b increases, and this interference is avoided. Measures are needed. In the example shown in the drawing, the stopping positions in the transport direction of the substrates Sa and Sb are made different from each other, and the feeder for producing the substrate A and the feeder for producing the substrate C are set on the feeder table of the first component supply device 45a. This is addressed by placing them apart. If this is not sufficient, as shown in FIG. 14 , when the second component collection head 43b collects a component from the feeder on the first component supply device 45a side, the first component collection head 43a is temporarily moved. Control such as moving to the retracted position. After the production of the substrate A is finished, such control for avoiding interference becomes unnecessary.

  After the production of the substrate A in the first substrate transport apparatus 10a, if there are different types of substrates to be continuously produced, the first component sampling head 43a is in the process until the substrate is carried into the first substrate transport apparatus 10a. Waiting at the retracted position or mounting the component on the substrate C in addition to the second component picking head 43b. Similarly, when the scheduled production plan is completed, the first component picking head 43a waits at the retracted position, or takes part in the second component picking head 43b to mount the component on the substrate C.

(Sixth embodiment)
Next, a sixth embodiment shown in FIGS. 15 and 22 will be described. This embodiment is a component mounting including a component transfer device 40 having two substrate transfer devices 10a and 10b, two component supply devices 45a and 45b, and one or two component picking heads 43 or 43a and 43b. Using the device, one of the two substrate transfer devices 10a and 10b is dedicated to the fixed production type that transfers only the product substrate of the fixed production type, and the other transfers the product substrate of the interrupt type with different substrate widths. It is intended for use with interrupt types.

  When it is planned to produce a large number of products of type A, if an instruction for interrupting production of products of type B is urgently input from the host computer to the control device 60, both the substrate transfer devices 10a and 10b are set. If the setup is changed so that the interrupted product is produced from the regular production type, the loss time required for the setup change increases. In particular, when the number of interrupted products produced is small, if both units are replaced, a large time loss occurs.

  In order to reduce the loss time of this setup change, one of the two substrate transfer devices 10a and 10b is set exclusively for the fixed production type for transferring only the fixed production type product substrate, and the other is set for the substrate width. Set for interrupt types that transport product boards of different interrupt types. As a setting means for performing this setting, for example, “1” is set in the storage unit 63 when the substrate transfer device is set exclusively for the fixed production type, and “0” is set when setting for the interrupt type. A setting area is provided for each of the substrate transfer apparatuses 10a and 10b. For example, when the substrate transfer apparatus 10a is set for a fixed production type and the substrate transfer apparatus 10b is set for an interrupt type, “1” is set in each of the setting areas of the substrate transfer apparatuses 10a and 10b. “,” “0” is input from the input unit 64 of the control device 60. Then, a feeder for product parts of a fixed production type is set over the entire surface of the parts supply device 45a on the substrate transport apparatus 10a side, and a product part of an interrupt product type is placed on the parts supply apparatus 45a on the substrate transport apparatus 10b side. Leave an empty slot to set the feeder.

  When the fixed production product board (A substrate) is transferred to the substrate transfer devices 10a and 10b and the fixed production product (A product) is normally produced (step 131), the interrupt product ( When the production of the (B product) is input from the host computer to the control device 60 (step 132), the interruption product substrate transfer device 10b performs a payout process for stopping and discharging the A substrate (step 133). The mounting program for mounting the component on the board transferred to the component mounting position by the board transfer device 10b is switched from the A product mounting program to the B product mounting program (step 134), and is orthogonal to the transfer direction of the board transfer device 10b. The width in the direction is changed to the rail width corresponding to the B board (step 135). Whether the component picking heads 43a and 43b do not interfere with each other even if components are mounted on the A substrate by the substrate transfer device 10a and components are mounted on the B substrate by the substrate transfer device 10b, it is determined whether or not simultaneous mounting is possible (step) 136) If possible, component mounting on the A board in the board transfer device 10a and component mounting on the B board in the board transfer device 10b are simultaneously performed (step 137). If simultaneous production is not possible, component mounting is halted in the board transfer device 10a, and component mounting is performed on the B board by the number specified in the board transfer device 10b (step 138). When component mounting is completed on the specified number of B boards (step 139), the board transfer device 10b is returned to A product production, and A products are normally produced by the board transfer apparatuses 10a and 10b.

(Seventh embodiment)
Next, a seventh embodiment shown in FIGS. 16 and 17 will be described. In this embodiment, when the board on which the component is mounted by the board transfer device is changed from the first type product board (A board) to the second type product board (B board), the board transfer device changes the board after the change. The component is trial mounted on the board, and if there is no problem, the actual mounting is started. Immediately after component mounting on the A substrate is completed by the substrate transport apparatus, component mounting is started on the B substrate, and if a quality defect occurs in component mounting on the B substrate, defective products and loss of production time occur. For this reason, when a production is switched at a production site, trial mounting of components on a B board in advance is performed by a board transfer device used after the change. However, after a long time has passed after trial mounting, the state of the component mounting device changes, and it is necessary to confirm that the feeder necessary for mounting the component on the B board is set in the component supply device. Considering it, it is preferable to perform trial mounting immediately before the start of component mounting on the B board. Therefore, utilizing the fact that the component mounting apparatus includes two board transfer apparatuses 10a and 10b, the B board is used in the other board transfer apparatus in parallel with the component mounting on the A board in one board transfer apparatus. Trial mount the parts.

As shown in FIG. 16 , for example, the substrate transfer device 10a is set for a fixed production type and the substrate transfer device 10b is set for an interrupt type, and the substrate transfer device 10a sets the product substrate (A substrate) of the first fixed production type. When one-sided production for mounting the product substrate (B substrate) of the second fixed production type is instructed when the component is fully mounted and one-sided production is performed in which the component mounting is not performed in the board transfer device 10b. A mounting program for mounting components on the B board is set by the board transfer device 10b, and the width of the board transfer device 10b is changed to a rail width corresponding to the B board. The component is actually mounted on the A substrate by the substrate transfer device 10a, and the component is trial-mounted on the B substrate by the substrate transfer device 10b. The timing of starting trial mounting is the production status of the product of the first fixed production type and the product of the second fixed production type when switching from the first fixed production type to the second fixed production type is determined in the production plan. It is determined in consideration of the trial production time and the time required for inspection and correction. When switching to the second production type is suddenly instructed, trial mounting on the product substrate of the second production type is started at the time when the switching command is issued. The B board on which the components are mounted is unloaded from the board transfer device 10b and subjected to reflow and inspection. The inspection is performed on items such as the mounting position and parts, incorrect feeder setting, mounting accuracy, and the like. If there is a problem as a result of the inspection, the problem portion is corrected, such as adjustment of component mounting on the B board in the board transfer device 10b and change of the set feeder. When the problem is solved, the actual mounting of the components on the B board is started by the board transfer device 10b, and the mounting is finished when the number of parts mounted on the A board by the board transfer device 10a reaches the planned number. Then, in order to change the setting of the substrate transfer device 10b for the fixed production type and the substrate transfer device 10a for the interrupt type, the setting areas of the substrate transfer devices 10a and 10b of the storage unit 63 of the control device 60 are set to “0”, “1” is input from the input unit 64.

As shown in FIG. 17 , the board transfer device 10a is set for the fixed production type, the board transfer device 10b is set for the interrupt type, and the board transfer devices 10a and 10b put the parts on the first type product board (A board). When the both-side production to perform the main mounting is instructed when the both-side production to perform the main mounting is instructed to the second type product board (B board) when the both-side production for the main mounting is performed, the parts are first applied to the B board by the board transfer device 10b. In order to perform the trial mounting, the substrate transfer apparatus 10b stops the carry-in of the A substrate and performs a payout process. The mounting program for mounting components on the board by the board transfer device 10b is switched from the mounting program for board A to the mounting program for board B, and the width of the board transfer device 10b is changed to a rail width corresponding to the board B. The component is actually mounted on the A substrate by the substrate transfer device 10a, and the component is trial-mounted on the B substrate by the substrate transfer device 10b. The B board on which the trial component is mounted is unloaded from the board transfer device 10b and subjected to reflow and inspection. If there is a problem as a result of the inspection, the problem location is corrected, and the actual mounting of the component on the B board is started by the board transfer device 10b. Next, when the number of parts mounted on the A board in the board transfer apparatus 10a reaches the planned number, the board transfer apparatus 10a performs trial mounting of the parts on the B board as in the case of the board transfer apparatus 10b. After the points are identified and resolved, the actual mounting of the components on the B board is started.

(Eighth embodiment)
Next, an eighth embodiment will be described. This embodiment uses a component mounting apparatus including a component transfer device 40 having two substrate transfer devices 10a and 10b, two component supply devices 45a and 45b, and two component sampling heads 43a and 43b. In production, interference between the two component picking heads 43a and 43b is reduced.

As shown in FIGS. 2 and 18 , two substrate transfer devices 10a and 10b for transferring substrates in parallel directions are juxtaposed, and the substrate transfer devices 10a and 10b are placed on the outer side opposite to the adjacent central side. Are provided with two component supply devices 45a and 45b. Each substrate transport apparatus 10a, 10b is provided with two guide rails 25a, 26a and 25b, 26b for guiding both sides of the substrate. The support rails 20 and the side rails 14 forming the outer guide rails 25a and 25b adjacent to the component supply devices 45a and 45b are fixed to the outer support legs 12 and 12 which are erected and fixed on the base 11, and are arranged on the center side. The support rails 20 and the side rails 14 forming the guide rails 26a and 26b are fixed to inner support legs 12a and 12a that are guided and supported on the base 11 so as to be position-adjustable in a direction orthogonal to the extending direction of the guide rails. Yes. The inner support leg 12a is moved by the first and second drive motors 33 and 37 via the first and second screw shafts 31 and 35 based on a command from the control device 60, and guide rails 26a and 26b on the center side. Is adjusted in a direction orthogonal to the extending direction of the guide rail, and the rail width of each of the substrate transfer devices 10a and 10b is changed according to the width of the substrate. The guide rail position adjusting means 27 for adjusting the position of the central guide rails 26a, 26b in the direction orthogonal to the extending direction thereof is the inner support leg 12a, the first and second drive motors 33, 37, the first, the second. It is comprised by the screw shafts 31 and 35, the control apparatus 60, etc. Thereby, an extra space is generated between each movable guide rail 26a, 26b on the center side of each substrate transport apparatus 10a, 10b generated when the width between the two guide rails 25a, 26a or 25b, 26b is narrowed, The two spaces are separated by this surplus space, and the possibility of interference between the component picking heads 43a and 43b can be reduced.

The outer support leg 12 is guided and supported on the base 11 so that the position thereof can be adjusted in the same manner as the inner support leg 12a, and can be moved via a screw shaft by a drive motor, and the outer guide rails 25a and 25b are connected to the guide rail. Even when the position adjustment means 27 can adjust the position in the direction orthogonal to the extending direction, the outer guide rails 25a and 25b are positioned closest to the outside on the component supply devices 45a and 45b side by control, and the center guide If the positions of the rails 26a and 26b are adjusted so that the rail width of each of the substrate transfer devices 10a and 10b is changed according to the width of the substrate to be transferred, the excess space generated on the center side of each of the substrate transfer devices 10a and 10b The possibility of interference of the component picking heads 43a and 43b can be reduced. In this case, it is determined in advance whether or not the feeder of the component mounted on the substrate conveyed by the substrate conveying devices 10a and 10b is also set in the component supply devices 45b and 45a on the far side, and the component on the near side If the control is performed so that the outer guide rails 25a and 25b are positioned closest to the component supply devices 45a and 45b as described above only when they are set only on the supply devices 45a and 45b, the parts are collected. head 43a, Ru can be achieved moving distance shortened preventing interference 43b.

In the sixth embodiment, an example in which the component sampling heads 43a and 43b of the component transfer device 40 are of the so-called XY type that moves in two directions parallel to the surfaces of the substrates Sa and Sb has been described. These two embodiments are not limited to this, and can also be applied to a component mounting apparatus using a turret type component sampling head.

  In each of the above-described embodiments, the two board transfer apparatuses 10a and 10b are provided for each component mounting apparatus. In this way, the width of each board transfer apparatus 10a and 10b can be changed at the end of one lot. This can be done every time the substrate passes through the component mounting apparatus, and the waiting time until the production of the substrate of the next lot can be shortened. However, the present invention is not limited to this, and the substrate transfer apparatus can be implemented as one unit for the entire production line.

1 is a plan view showing a schematic structure of a component mounting apparatus according to a first embodiment of the present invention. The expanded sectional view of the 1st and 2nd board | substrate conveyance apparatus along the 2-2 line of FIG. 3-3 sectional drawing of FIG. The block diagram which shows the control system of the component mounting apparatus shown in FIG. The figure which shows the interference danger area | region with a danger that the 1st, 2nd component extraction head may interfere. The schematic plan view explaining the action | operation of the 2nd Embodiment of this invention. The time chart explaining the action | operation of the 3rd Embodiment of this invention. The time chart explaining the action | operation of the 4th Embodiment of this invention. The schematic plan view explaining the action | operation of the 4th Embodiment of this invention. The schematic plan view explaining the action | operation of the 5th Embodiment of this invention. The schematic plan view explaining the action | operation of the 5th Embodiment of this invention. The schematic plan view explaining the action | operation of the 5th Embodiment of this invention. The schematic plan view explaining the action | operation of the 5th Embodiment of this invention. The schematic plan view explaining the action | operation of the 5th Embodiment of this invention. The schematic plan view which shows the 6th Embodiment of this invention. The figure explaining the trial mounting state in the one-side production of the 7th Embodiment of this invention. The figure explaining the trial mounting state in the both-sides production of the 7th Embodiment of this invention. The schematic plan view which shows the 8th Embodiment of this invention. The flowchart explaining the action | operation of the 1st Embodiment of this invention. The flowchart explaining the action | operation of the 3rd Embodiment of this invention. The flowchart explaining the action | operation of the 4th Embodiment of this invention. The flowchart explaining the action | operation of the 6th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10a, 10b ... Board | substrate conveyance apparatus, 25a, 25b ... Outer guide rail, 26a, 26b ... Center side guide rail, 30 ... Conveyor width change apparatus, 40 ... Component transfer apparatus, 41, 42a, 42b ... Head transfer mechanism (Fixed rail, head moving rail), 43a, 43b ... component picking head, 45a, 45b ... component supply device , 60 ... control device, 63 ... storage unit, 64 ... input unit, Sa, Sb ... substrate, Si ... interference Hazardous area.

Claims (5)

Two substrate transfer devices each for transferring a substrate, a component supply device that supplies a plurality of types of components to be mounted on the substrate, and a component supplied from the component supply device is collected and mounted on the substrate A component including a component transfer head including two component extraction heads and two head transfer mechanisms that independently move the two component extraction heads in at least two directions parallel to the surface of the substrate. In mounting equipment,
Determining means for determining whether any one of the two substrate transfer devices is transferring the substrate or changing the width;
If the determination means determines that neither of the two substrate transfer devices is transferring the substrate and that the width is not being changed, the component transfer device is moved to the component mounting position by the two substrate transfer devices. at the same time to implement parts products against transported two substrates, when the determining means determines that one of the two substrate transport apparatus is being changed during transport or width the substrate And a mounting control means for mounting the component only on the substrate held at the component mounting position of the other substrate transport device by the component transfer device. The component sampling head according to claim 1 , wherein one of the component sampling heads exclusively performs component mounting on any one of the substrates, and the other component sampling head exclusively performs component mounting on the other substrate. Component mounting device. 3. The component according to claim 2 , wherein when one of the substrates is being transferred after completion of component mounting or when the substrate transfer device that transfers the one substrate is changing the width, One of the component picking heads that exclusively mounts the component is mounted on the other substrate by the other component picking head, and mounts the component on the other substrate. The said 2 board | substrate conveyance apparatus in any one of Claims 1-3 each has two guide rails which guide the both sides of a board | substrate, The said component supply apparatus is said 2 board | substrate conveyance apparatus Of the two guide rails, each of the outer guide rails adjacent to the component supply device is fixed at a position close to the component supply device. Each of the center guide rails is fixed to an inner support leg that is positioned in the width direction perpendicular to the substrate transport direction by the guide rail position adjusting means. Mounting device. 5. The guide rail position adjusting means according to claim 4, wherein the first and second screw shafts extending in the width direction are rotatably supported by the outer support legs of the two substrate transfer apparatuses, respectively. A component mounting apparatus , wherein a first screw shaft is screwed with an inner support leg of one substrate transfer device, and the second screw shaft is screwed with an inner support leg of the other substrate transfer device.

Images