CN102026536A - Component checking device and component mounting device - Google Patents

Component checking device and component mounting device Download PDF

Info

Publication number
CN102026536A
CN102026536A CN2010102797176A CN201010279717A CN102026536A CN 102026536 A CN102026536 A CN 102026536A CN 2010102797176 A CN2010102797176 A CN 2010102797176A CN 201010279717 A CN201010279717 A CN 201010279717A CN 102026536 A CN102026536 A CN 102026536A
Authority
CN
China
Prior art keywords
parts
distance
shoot part
component
electronic unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010102797176A
Other languages
Chinese (zh)
Inventor
小仓丰
森田玲香
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
Original Assignee
Juki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010200479A external-priority patent/JP2011082506A/en
Application filed by Juki Corp filed Critical Juki Corp
Publication of CN102026536A publication Critical patent/CN102026536A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Supply And Installment Of Electrical Components (AREA)

Abstract

The invention provides a component checking device and a component mounting device, capable of reducing the cost for checking parts and shortening the checking time for the electronic parts. The component checking device is provided with a holding part for holding the component, a shooting part for shooting the component, a pixel data confirming unit, a distance data confirming unit, a storage unit and a judging unit, wherein according to a shot image shot by the shooting part, the excursion position of the component relative to the holding center is checked and the shooting part shoots a plurality of images with different distances away from the component; the pixel data confirming unit is used for confirming the pixel data aiming at a focus in the pixels at same position from the plurality of shot images; the distance data confirming unit is used for confirming a distance between the shooting part and the component when all the pixel data are confirmed by shooting aiming at all the pixel data; the storage unit is used for storing an admissible value of the distance between a set component position and an imaginary line or imaginary plane acquired according to the distance data; and the judging unit is used for judging if the distance between the set component position and the imaginary line or imaginary plane exceeds the admissible value stored in the storage unit.

Description

Parts testing fixture and apparatus for mounting component
Technical field
The present invention relates to a kind of parts testing fixture and apparatus for mounting component.
Background technology
To substrate the electronic component mounting apparatus of electronic unit is installed, is utilized adsorption mouth attract electrons parts, adsorption mouth is moved and drop to the installation site of regulation, adsorbed electronic unit is installed to substrate.
Current, in electronic component mounting apparatus, before substrate is installed electronic unit, by the component identification camera electronic unit is taken, detection electronics is with respect to the position offset of adsorption mouth, then, electronic unit moved to be used for electrode testing fixture place that whether electrode state is normally checked, utilize the electrode testing fixture to the electrode of electronic unit bad inspection the such as float, bad if electronic unit does not exist, then install to substrate.
In addition, for example shown in patent documentation 1, known a kind of electronic component mounting apparatus, it is the configured electrodes testing fixture near the component identification camera, the electrode testing fixture is towards the electrode of the electronic unit that is positioned at component identification camera top, from oblique below irradiation directional light, parts are moved, on identical position, carry out the offset of electronic unit and the inspection of electrode.
Patent documentation 1: No. 3378077 communique of Japan Patent
Summary of the invention
But, in the electronic component mounting apparatus that above-mentioned patent documentation 1 is put down in writing, outside the component identification camera, need to be provided in addition the electronic unit electrode testing fixture that column electrode checks that advances is being installed to substrate, and be used for implementing in addition the electrode inspection, thereby there is the problem of electrode testing fixture cost cost from oblique below irradiation parallel rays etc.
In addition since for electronic unit with respect to the offset of adsorption mouth and the electrode inspection of electronic unit, use different identification or testing fixture respectively, so obtain different data.Its result, when checking electrode, there is following problems, promptly, the characteristic point of the electronic unit during the recognizing site skew (for example, the front position etc. of lead-in wire) characteristic point position of position probing and the electronic unit when checking electrode detects and must carry out respectively, the inspection operation spended time of electronic unit becomes the obstacle of installation exercise high speed.
The objective of the invention is to, a kind of parts testing fixture and apparatus for mounting component are provided, it can shorten the electronic unit that mounting object thing such as subtend substrate installs and check the time that is spent, and can realize the high speed of parts installation exercise.
In order to solve above-mentioned problem, the invention of technical scheme 1 record is a kind of parts testing fixture, and it has: maintaining part, its holding member; And shoot part, it is taken the parts that kept by described maintaining part, according to the photographic images of taking by described shoot part, described parts are checked with respect to the offset at the center of described maintaining part, it is characterized in that, described shoot part is taken from this shoot part to the different a plurality of images of distance between the described parts, this parts testing fixture has: the pixel data determining unit, it determines the pixel data of the aligning focus in the pixel of same position from a plurality of photographic images of being taken by described shoot part; The range data determining unit, it is at each described view data, determines the described shoot part when taking each pixel data of being determined by described pixel data determining unit and the range data of described parts; Metrics calculation unit, it calculates the regulation position of described parts and the distance between imaginary line or the imaginary plane based on described range data; Memory cell, the feasible value of the described distance of its storage and described imaginary line or described imaginary plane is to be used for determining whether described parts satisfy the benchmark of regulation; And identifying unit, it judges whether described distance surpasses the described feasible value that is stored in the described memory cell.
The invention of technical scheme 2 record is characterised in that in the parts testing fixture of technical scheme 1 record, to have: moving part, its make in described maintaining part and the described shoot part at least one with respect to another is approaching/away from mode move; And the shooting control unit, it makes described shoot part take described parts and described maintaining part when described maintaining part or described shoot part are moved with predetermined distance.
The invention of technical scheme 3 record is characterised in that, in the parts testing fixture of technical scheme 2 records, described shoot part is fixed, and described moving part makes described maintaining part along moving on the direction of the system optical axis direction of described shoot part.
The invention of technical scheme 4 records is a kind of apparatus for mounting component, it is characterized in that having: each described parts testing fixture in the claim 1 to 3; Delivery section, it moves described maintaining part, and described parts are carried to the installation site; And conveying control unit, it is being judged as by described identifying unit, in a plurality of regulations position and the distance between imaginary line or the imaginary plane of the described parts of obtaining according to described range data, at least one makes described delivery section that described parts are discharged and do not carried to the installation site above being stored under the situation of the feasible value in the described memory cell.
The invention of technical scheme 5 records is characterised in that, in the apparatus for mounting component of technical scheme 4 records, has the offset correcting unit, it takes the view data that obtains from this shoot part to the different a plurality of images of distance between the described parts to described shoot part, utilize center offset correction table, view data is proofreaied and correct, in this center offset correction table, precompute and center side-play amount from the corresponding image of the distance of described shoot part between the described parts.
The invention of technical scheme 6 records is characterised in that, in the apparatus for mounting component of technical scheme 4 or 5 records, has the multiplying power correcting unit, it takes the view data that obtains from this shoot part to the different a plurality of images of distance between the described parts to described shoot part, utilize center offset correction table or multiplying power checking list, view data is proofreaied and correct, in this center offset correction table, precompute and center side-play amount from the corresponding image of the distance of described shoot part between the described parts, in this multiplying power checking list, calculate in advance with from described shoot part to the size variation amount between the described parts apart from corresponding image.
The invention of technical scheme 7 records is characterised in that, in technical scheme 4 to 6 in each described apparatus for mounting component, has the suitable environment determining unit, it carries out following pre-treatment, promptly, a plurality of positions in the moving before the described maintaining part that maintains parts arrives described shoot part, take, based on this shot image data, set the optimum position of taking scope, to be used for making described pixel data determining unit obtain the pixel data in focus of the pixel of same position from described shoot part to the different a plurality of images of the distance between the described parts.
The effect of invention
Invention according to technical scheme 1 record, only be used for the shoot part of inspection part with respect to the offset at the center of maintaining part, only extract the pixel data of the aligning focus in each location of pixels (position coordinates), just can be created on all pixel position and aim at the pan focus image of focus, the range data of each pixel data by obtaining the pan focus image, can detect parts which partly exist bad.
That is,, this image is handled, thereby can be carried out parts with respect to the offset at the center of maintaining part and the inspection of parts self by take a plurality of images by shoot part.
Thus, do not need to be provided for simultaneously as prior art identification component offset device and be used for inspection part self device the two, therefore can reduce the inspection cost that mounted component spent on the mounting object thing.In addition, owing to can from identical image, detect when the skew of position component is checked and the characteristic point position of the parts during the parts autoscopy, so do not need the operation as the matching that obtains each data, can reduce the time that the inspection operation of parts is spent.
According to the invention of technical scheme 2 records, take control unit when maintaining part and shoot part are moved with predetermined distance, shoot part is taken parts and maintaining part.
Thus, can obtain photographic images, grasp the pixel data of photographic images easily and to the relation between the distance of shoot part with specified distance.
Invention according to technical scheme 3 record by shoot part is fixed, utilizes moving part that maintaining part is moved along the optical axis direction of the optical system of shoot part, can change shoot part and remain on distance between the parts on the maintaining part.
Thus, shoot part can the different a plurality of images of shooting distance.In addition, by requiring the shoot part of positioning accuracy to fix, can take thus and rock few image owing to having optical system.
Invention according to technical scheme 4 records, in the distance of a plurality of regulations position that is judged as the parts of obtaining according to range data by identifying unit and imaginary line or imaginary plane, at least one carries control unit to make delivery section that parts are discharged and do not carried to the installation site above being stored under the situation of the feasible value in the memory cell.
Thus, because in the distance of a plurality of regulations position of the parts of obtaining according to range data and imaginary line or imaginary plane, at least one surpasses under the situation of feasible value, think that parts are undesired, so, can prevent from the mounting object thing of regulation, to install the situation of bad parts by these parts are discharged and do not installed.
Invention according to technical scheme 5 records, owing to be used for center offset correction table that the side-play amount of the picture centre position of view data is proofreaied and correct, and proofread and correct, even so produce under the inconsistent situation at the optical axis of the optical system of shoot part, the motion track of center of parts when taking with changing distance from shoot part to parts, also can eliminate the influence of the picture position skew that produces because of this reason, can carry out the higher parts inspection of precision.
According to the invention of technical scheme 6 records, even in the optical system of shoot part, use under the situation of non-telecentric lens, also can eliminate the influence of the image size variation of the position that produces because of this reason, can carry out the higher parts inspection of precision.
According to the invention of technical scheme 7 records, also can in moving, parts obtain the optimum position of the scope of the different a plurality of images of the distance of shooting from this shoot part to described parts.Thus, can automatically set the best coverage that does not rely on set point.
Description of drawings
Fig. 1 is the oblique view with apparatus for mounting component of parts testing fixture.
Fig. 2 is the block diagram of the expression structure relevant with control part.
Fig. 3 is the flow chart of the flow process of expression parts inspection.
Fig. 4 is the figure of the image pickup method of explanation parts.
Fig. 5 is the figure that expression utilizes the image that the shooting distance data of each pixel generate.
Fig. 6 is the flow chart that the expression suitable environment is determined the flow process of processing.
Fig. 7 is the figure of the parts image pickup method used of explanation suitable environment, the state that the relation of change in location that the frontal of Fig. 7 (A) expression parts when taking is observed and performed processing, Fig. 7 (B) expression component locations during from the shooting overlooking direction and observe Fig. 7 (A) changes.
Fig. 8 be explanation determine to handle (setting range) before the renewal of carrying out by suitable environment and upgrade after the figure of coverage of (optimum range).
Fig. 9 (A)~(C) is the figure of change in location of photographic images that is illustrated in the position of the Z direction under the inconsistent situation in axle center of the optical axis of shoot part and adsorption mouth.
Figure 10 is the figure towards the face of component identification camera that target is proofreaied and correct in expression.
Figure 11 (A)~(C) is the figure of size variation of the photographic images of the expression position of using the Z direction under the situation of non-telecentric lens.
Embodiment
The parts testing fixture involved in the present invention and the execution mode of apparatus for mounting component are described.In addition, because the parts testing fixture is the part of apparatus for mounting component, so describe with apparatus for mounting component.
The structure of<apparatus for mounting component 〉
As shown in Figure 1, to adorn 100 are devices that the electronic unit (parts) that will supply with from assembly supply device is installed to substrate (mounting object thing) to parts.
Apparatus for mounting component 100 has the platform portion 1 as pedestal.Upper surface in platform portion 1 is provided with substrate transport path 2, and extend along directions X at its rear slightly in upper face center portion, and B carries to substrate.Be provided with parts supply unit 3 in the place ahead of platform portion 1, it is used for electronic unit P is gone up installation to substrate B.In parts supply unit 3, contain the electronic unit P that on substrate B, installs.
Upper surface in platform portion 1 is provided with: X delivery section 5 (delivery section), and it extends along directions X, and head 4 is carried in guiding, and this lift-launch head 4 can freely be moved back and forth on directions X; And Y delivery section 6 (delivery section), it extends along the Y direction, and head 4 is carried in guiding, and this lift-launch head 4 can freely be moved back and forth on the Y direction.
X delivery section 5 is arranged on the Y delivery section 6, can move freely in Y delivery section 6 upper edge Y directions.X delivery section 5 is provided with carries head 4, and this lift-launch head 4 can move freely along directions X.That is, utilize X delivery section 5 and Y delivery section 6, boarded head portion 4 is moved along the XY direction, electronic unit P is moved to the installation site of substrate B.
Carrying head 4 is provided with: adsorption mouth 7 (maintaining part), and it keeps electronic unit P by absorption, and carries to the installation site of substrate B; And substrate identification camera 8, its top from substrate B is taken substrate B, the existence of identification substrate B.Here, carry on the head 4,, electronic unit P can be moved to the installation site of substrate B so pass through the driving of each delivery section 5,6 because adsorption mouth 7 is arranged on.
Adsorption mouth 7 links with the moving part (not shown) that the Z direction that makes this adsorption mouth 7 along Fig. 1 moves.Moving part 14 is to use the mechanism of motor that stepping motor etc. can control amount of movement, ball-screw etc.
Upper surface in platform portion 1 is provided with component identification camera 9 (shoot part), and it is adjacent with parts supply unit 3.
Component identification camera 9 is to adsorb the electronic unit P of maintenance and the camera that adsorption mouth 7 is taken from the below to being adsorbed mouth 7.Component identification camera 9 with can to directly over the posture of taking, be fixed on the upper surface of platform portion 1.That is, the optical axis of the optical system of component identification camera 9 is consistent with the Z axle.
Therefore, according to the relation between the configuration of the movable direction of adsorption mouth 7 and component identification camera 9, adsorption mouth 7 can be by moving part along moving up and down on the direction of the optical axis direction of the optical system of component identification camera 9.Thus, being adsorbed electronic unit P that mouth 7 keeps can be 9 approaching with respect to the component identification camera/away from, component identification camera 9 can change the distance with electronic unit P, and electronic unit P is taken.
Platform portion 1 is provided with cover body 11, and its covering is arranged on the each several part in the platform portion 1, and the part of this cover body 11 is provided with guidance panel 12, and it is used to carry out the operation of electronic component mounting apparatus 100.Guidance panel 12 can be imported the indication from the user, and can show the information of informing to the user.
Control part 13 is set, the driving of each drive division of its control electronic component mounting apparatus 100 in platform portion 1.
13 pairs of component identification cameras of control part, 9 captured photographic images carry out calculation process, check the offset of electronic unit P with respect to the center of adsorption mouth 7.That is, whether 13 couples of electronic unit P of control part remain on the adsorption mouth 7 with correct state and check.Its reason is, because adsorption mouth 7 conveying electronic parts P directly over the installation site of substrate B, so, then electronic unit P can't be installed on the installation site of substrate B if electronic unit P does not remain on the tram of adsorption mouth 7.
Control part 13 carries out computing by characteristic point position, for example electrode position to electronic unit P, and whether electronic unit P is normally checked.Its reason is, if the generation of the electrode of electronic unit P is damaged or crooked, then electronic unit P can't be installed on the installation site of substrate B.And, under the state condition of poor of electronic unit P, because detecting the position of electrode etc. in the photographic images exists more different, so can utilize the identical photographic images of photographic images that uses when checking electronic unit P, carry out the inspection of electronic unit P with respect to the offset of adsorption mouth 7.
As shown in Figure 2, control part 13 has: CPU 13a, and it carries out each calculation process; RAM 13b, it is the working space of CPU 13a; ROM 13c, the operation program that its storage is carried out by CPU 13a etc.; And EEPROM 13d, the data that its storage can be rewritten etc.
In order to determine whether to satisfy the benchmark that is used for electronic unit P is gone up to substrate B the regulation of installing, the regulation position of store electrons parts P (for example in EEPROM 13d, electrode) and the feasible value of the distance between imaginary line or the imaginary plane, this distance is that component identification camera 9 when taking each pixel data is obtained with the range data at the regulation position of electronic unit P.Therefore, EEPROM 13d works as memory cell.
In ROM 13c, store the shooting control program, it realizes following function by being carried out by CPU 13a, that is, at every turn by moving part with adsorption mouth 7 when the Z direction moves with predetermined distance, 9 couples of electronic unit P of component identification camera and adsorption mouth 7 are taken.By carry out taking control program by CPU 13a, can make component identification camera 9 take with electronic unit P between the different a plurality of images of distance.
Therefore, take control program by being carried out by CPU 13a, control part 13 works as taking control unit.
Store pixel data and determine program in ROM 13c, it realizes following function by being carried out by CPU 13a,, from a plurality of photographic images by 9 shootings of component identification camera, determines the pixel data in focus in the pixel of same position that is.
Therefore, determine program by carrying out pixel data by CPU 13a, control part 13 works as the pixel data determining unit.
In ROM 13c, store range data and determine program, it realizes following function by being carried out by CPU 13a, promptly, at each pixel data, determine to take by carrying out that pixel data is determined program and component identification camera 9 during each definite pixel data and the distance between the electronic unit P.
Therefore, determine program by carrying out range data by CPU 13a, control part 13 works as the range data determining unit.
In ROM 13c, store distance computation routine, now state function in fact, that is, and according to determining program and definite range data by carrying out range data, calculate the assigned position (for example, electrode) of electronic unit P and the distance between imaginary line or the imaginary plane.
Therefore, by being carried out distance computation routine by CPU 13a, control part 13 works as metrics calculation unit.
In ROM 13c, store decision procedure, now state function in fact, that is, judge whether the regulation position of the electronic unit P that obtains by the execution distance computation routine and the distance between imaginary line or the imaginary plane surpass the feasible value that is stored among the EEPROM 13d.
Therefore, by being carried out decision procedure by CPU 13a, control part 13 works as identifying unit.
In ROM 13c, store the conveying control program, now state function in fact, promptly, be judged as by carrying out decision procedure, in the assigned position (for example, electrode) and the distance between imaginary line or the imaginary plane of the electronic unit P that obtains according to range data, at least one surpasses and is stored under the situation of the feasible value among the EEPROM 13d, X delivery section 5 and Y delivery section 6 are driven, electronic unit P is discharged and do not carry on the installation site of substrate B.
Therefore, carry control program by being carried out by CPU 13a, control part 13 is as carrying control unit to work.
In ROM 13c, store suitable environment and determine program, now state function in fact, promptly, after utilizing adsorption mouth 7 attract electrons parts P, repeatedly take in during move the position directly over component identification camera 9 along X, Y, Z direction with adsorption mouth 7, determine best coverage and best light illumination mode.
Therefore, determine program by carrying out suitable environment by CPU 13a, control part 13 conducts are to take to determine that the best shooting distance scope and the suitable environment determining unit of the illumination value of the best work.
Control part 13 is electrically connected with X delivery section 5, Y delivery section 6, substrate identification camera 8, component identification camera 9, guidance panel 12, and control part 13 mainly carries out the control relevant with the driving of each several part.
Apparatus for mounting component 100 has above-mentioned each structural element.Wherein, the component parts testing fixture 110 by having adsorption mouth 7, component identification camera 9, moving part (not shown) and control part 13.
The offset inspection of<electronic unit, the processing of bad inspection 〉
According to apparatus for mounting component 100, illustrate that electronic unit P is with respect to the inspection of the offset of adsorption mouth 7 and the bad inspection of electronic unit P (floating to check to be example with electrode).
As shown in Figure 3, at first, carry out following setting by the user from guidance panel 12, that is: carry out the electronic unit P of electrode inspection setting, utilize the scope of the shooting distance (highly) that component identification camera 9 takes to set and (the step S1) such as shooting interval settings of image.
Here, the scope of so-called shooting distance is set, be meant the scope of the shooting distance that a plurality of images are taken, in this scope, with the position of the electrode in focus of component identification camera 9 as the center, the electronic unit P direction approaching along Z direction and component identification camera 9 and away from direction on get same distance.
Specifically, as shown in Figure 4, from the focal position of component identification camera 9 along Z direction setting+0.5mm (higher limit) ,-0.5mm (lower limit).Therefore, component identification camera 9 can be along Z direction photographic images in the scope of 1mm.
In addition, shooting interval is the interval of the distance that component identification camera 9 is taken in the coverage of the 1mm of setting as noted above.
Specifically, shooting interval is set at 0.05mm.Thus, component identification camera 9 can be taken 21 images in the coverage of setting.
Finish if each is set, the user is from the indication of guidance panel 12 input installation beginnings, and then the driving of 11 pairs of each several parts of control part is controlled, and beginning is installed electronic unit P (step S2) to substrate B.
If the installation of beginning electronic unit P, then control part 13 drives X delivery section 5 and Y delivery section 6, and adsorption mouth 7 is moved to parts supply unit 3.Then, control part 13 drives moving part, and adsorption mouth 7 is descended, and electronic unit P is adsorbed, keeps (step S3).
Then, control part 13 drives X delivery section 5 and Y delivery section 6, with adsorption mouth 7 move to component identification camera 9 directly over (step S4).
At this moment, control part 13 makes adsorption mouth 7 in the process that component identification camera 9 moves, and carries out the processing (being called suitable environment determines to handle) as above-mentioned suitable environment determining unit.Handle in the back record in detail for this.
Then, control part 13 drives moving part, and the adsorption mouth 7 that maintains electronic unit P is moved up and down along the Z direction, and electronic unit P is moved to the position of the electrode of the P of electronic unit in focus of component identification camera 9.After making focus and electrode alignment, control part 13 drives moving part, electronic unit P is risen to the extreme higher position (higher limit of shooting distance (with respect to the position of focal position "+0.5mm ")) of the coverage of setting among the step S1.After rising, control part 13 is taken 9 couples of electronic unit P of component identification camera.
Then, control part 13 drives moving part, makes the corresponding and decline of the shooting interval of setting among adsorption mouth 7 and the step S1 (apart from 0.05mm) and stops, and after stopping, utilizing 9 couples of electronic unit P of component identification camera to take.Then, control part 13 drives moving part, 0.05mm on one side descends electronic unit P at every turn, until the extreme lower position that drops to coverage (lower limit of shooting distance (with respect to the position of focal position " 0.5mm ")), Yi Bian utilize 9 couples of electronic unit P of component identification camera to take (step S5).As noted above, if in the coverage of 1mm, take, then can obtain different 21 photographic images altogether of shooting distance every 0.05mm along the Z direction.After taking whole photographic images, control part 13 is with this image data storage (step S5) in EEPROM 13d.
Then, control part 13 is according to 21 images that are stored among the EEPROM 13d, the pixel of 21 same positions is compared, extract the pixel data of aiming at focus in each pixel most, and generate the pan focus image (step S6, S7) of aiming at focus at whole pixels.
Here, as the method for only extracting the pixel data of aiming at focus, realize by following method etc., promptly, to captured all images embodiment as is well known 7 * 7 difference filter, it is the view data and the position of the position of peak that option table is shown in the filter result of the same pixel position of all images obtaining.
Then, behind the location drawing picture of control part 13 generation pan focus images and shooting distance (step S8: be), the pan focus image that control part 13 uses are generated detects (step S9) to the electrode position of electronic unit P.By comparing with on every side pixel data, utilize the big this point of pixel data differences between all non-existent background of electrode and what, can easily carry out this detection.
Then, control part 13 calculates the center of electronic unit P according to detected electrode position, calculates it with respect to the offset (step S10) of adsorption mouth 7 on X-direction and Y direction.Thus, can know which direction electronic unit P with which kind of degree adsorbs to respect to adsorption mouth 7 with being tilted.
Then, control part 13 generates the location drawing picture (step S11) of the shooting distance (with respect to the height of component identification camera 9) when taking the pixel data that is extracted.
Here, the location drawing picture of shooting distance as shown in Figure 5, is to make shooting distance (highly) when obtaining the pixel data that adopts at each pixel and the data of generation corresponding with each location of pixels.Here, all do not exist under the situation of the pixel data of aiming at focus, be considered as electronic unit P and do not exist, and data are made as " 0 " for any photographic images.In addition, when checking electrode, for example under the situation of lead member, exist whether to be used to specify parameter,, shooting distance (height and position) is detected with reference to this position data to measuring to the distance of certain position from the front end of lead-in wire.
Then, control part 13 is behind the shooting distance of each electrode that calculates electronic unit P, utilize for example method shown in the TOHKEMY 2003-130619 communique, calculate each lead terminal and the distance of imaginary line or the distance (step S12) of each lead terminal and imaginary plane on each limit.
Then, whether the distance that calculates among the control part 13 determination step S12 is in feasible value (step S13).Promptly, based on that calculate and distance least-squares line or least square plane, detection judges as the amount of floating of the lead-in wire of electrode whether the amount of floating of detected lead-in wire surpasses the feasible value (step S13) that is stored in the lead-in wire amount of floating among the EEPROM 13d.
In step S13, control part 13 be judged to be with the distance of imaginary line or with the distance of imaginary plane not (step S13: be) under the situation in feasible value, promptly, being judged as detected lead-in wire amount of floating at control part 13 surpasses under the situation of feasible value (step S13: be), control part 13 drives X delivery section 5 and Y delivery section 6, the electronic unit P that adsorption mouth 7 is kept discharges, discards to the determined location of outside, and do not go up to substrate B (step S14) is installed.
On the other hand, control part 13 be judged to be with the distance of imaginary line or with the distance of imaginary plane be (step S13: not) under the situation in the feasible value, promptly, be judged as detected lead-in wire amount of floating at control part 13 and surpass (step S13: deny) under the situation of feasible value, the electronic unit P that control part 13 is kept adsorption mouth 7 goes up to substrate B (step S15) is installed.
Then, control part 13 judges whether go up the installation procedure that electronic unit P is installed to substrate B finishes (step S16), if control part 13 is judged as end (step S16: be), this processing is finished, do not finish (step S16: deny) if be judged as, then control part 13 returns the processing of step S2.
<suitable environment is determined to handle 〉
Based on the flow chart of Fig. 6, illustrate in apparatus for mounting component 100, for electronic unit P determines that with respect to the bad inspection of the inspection of the offset of adsorption mouth 7 and electronic unit P the preparation of suitable environment handles.
Determine the preparation processing of suitable environment, be in the offset inspection and bad inspection processing of above-mentioned electronic unit P, behind adsorption mouth 7 attract electrons parts P, extremely directly over component identification camera 9, move (Fig. 3: implement in during till the step 4).
Behind the maintaining part attract electrons parts P in step S3, control part 13 drives X delivery section 5 and Y delivery section 6, adsorption mouth 7 is moved, till the position (as the shooting starting position that is used for determining suitable environment) in the part of adsorption mouth 7 or electronic unit P and even the whole coverage that enters component identification camera 9 (Fig. 6, step S201).
In the shooting starting position that is used for determining suitable environment, control part 13 is lit a lamp Lighting Division 10, the change illumination intensity.Then, control part 13 is taken 9 couples of electronic unit P of component identification camera.
Then, control part 13 drives X delivery section 5 and Y delivery section 6, and adsorption mouth 7 is moved with predetermined distance.In addition, moving part 14 makes adsorption mouth 7 move with predetermined distance along the Z direction.After this, control part 13 changes to the illumination intensity that is stored in advance among the EEPROM 13d, takes (step S202) repeatedly with set point number when moving.
Specifically, shown in p1, the p2 of Fig. 7, p3, when in the position of adsorption mouth 7 being the position after directions X, Y direction, Z direction move with predetermined distance respectively, carrying out the change of illumination intensity, and take.For the illumination intensity at each position p1~p3 place, prepare in EEPROM 13d being confirmed to be three suitable candidate values in a way.
Then, control part 13 carries out computing according to a plurality of images of taking among the above-mentioned steps S202 to the illumination intensity of the best, stores (step S203) as being used for the optimal illumination intensity of coarse positioning in EEPROM 13d.
For example, determine the illumination intensity computing of optimal illumination intensity, there is following method etc., promptly, to by repeatedly taking the image that obtains, obtain the brightness value of the characteristic point (for example, lead-in wire position) of electronic unit P respectively, the brightness value and the predefined upper limit brightness value of characteristic point are compared, and the illumination intensity the when brightness value of characteristic point is surpassed the image taking of upper limit brightness value is as the method for optimal illumination intensity; And for by repeatedly taking the image obtain, obtain near the contrast value the characteristic point of electronic unit P respectively, the illumination intensity when the distinct image of contrast is taken is as the method for optimal illumination intensity.
In addition, determine under the situation of method of illumination intensity adopting brightness value according to characteristic point whether to surpass upper limit brightness value,, be defined as wherein minimum illumination intensity existing under a plurality of not situations above the illumination intensity of upper limit brightness value.
Then, control part 13 is lit a lamp Lighting Division 10, changes to the optimal illumination intensity that is used for coarse positioning (illumination intensity of obtaining at step S203).Then, control part 13 is taken 9 couples of electronic unit P of component identification camera.In addition, control part 13 drives X delivery section 5 and Y delivery section 6, and adsorption mouth 7 is moved with predetermined distance.Then, make adsorption mouth 7 move (step S204) with predetermined distance by moving part 14 along the Z direction.
Specifically, as position (p4, p6, the p8 of Fig. 7 more than or equal to the even number sequence number of p4 ...) shown in, take during in the position of adsorption mouth 7 for the position behind directions X, Y direction, the mobile respectively predetermined distance of Z direction.
Then, control part 13 is lit a lamp Lighting Division 10, the change light illumination mode.Light illumination mode uses the value of pre-prepd light illumination mode table.Then, control part 13 is taken 9 couples of electronic unit P of component identification camera.In addition, control part 13 drives X delivery section 5 and Y delivery section 6, and adsorption mouth 7 is moved with predetermined distance.Then, make adsorption mouth 7 move (step S205) with predetermined distance by moving part 14 along the Z direction.
Specifically, as position (p5, p7, the p9 of Fig. 7 more than or equal to the odd indexed of p5 ...) shown in, take during in the position of adsorption mouth 7 for the position behind directions X, Y direction, the mobile respectively predetermined distance of Z direction.
After this, control part 13 is execution in step S204, step S205 repeatedly, up to the number of times of setting or move to till the shooting end position that is used for determining suitable environment (for example, component identification camera 9 directly over position).Prepare the light illumination mode of a plurality of step S205, when carrying out step S205, changing to does not successively have used light illumination mode at every turn.
Then, by above-mentioned steps S201, step S202, step S204, step S205, taken all photographic images after, with this image data storage in EEPROM 13d.
Then, control part 13 according to take among the step S204 and be stored in the image that is used for coarse positioning among the EEPROM 13d, determine best coverage, the Z-direction coverage from external setting-up with being stored among the EEPROM13d is updated to best coverage (step S206).
Specifically, as shown in Figure 8, for the later processing of the step 6 of carrying out Fig. 3, the Z-direction coverage with broad setting in advance is updated to best coverage by carrying out same treatment.
For example, best coverage can be obtained by following method etc., promptly, to the characteristic point with electronic unit P is the regional area at center, execution is stored in pixel data among the ROM 13c and determines that program and range data determine program, to be the scope that the center has Rack with the distance that obtains, as the method for best coverage; And near the contrast value of characteristic point of obtaining electronic unit P, in the front and back, position of shooting the high image of contrast value, will shoot between two positions of the low image of contrast value, as the method for best coverage.
Promptly, determine that program and range data determine under the situation of program utilizing pixel data, characteristic point for electronic unit P, according to position (p4, p6, p8 more than or equal to the even number sequence number of p4 ...) each view data of locating, use above-mentioned 7 * 7 difference filtration, obtain view data in focus, the shooting distance when calculate taking this in focus pixel data.Then, will be that the center is in the scope that has Rack up and down, as new coverage with this shooting distance.
In addition, under the situation of utilizing near the contrast value the characteristic point, be the center with the position of contrast value maximum, obtain and compare the lower to a certain extent position range up and down of contrast value with this maximum, and with it as new coverage.
In addition, control part 13 according in step S205, take, be stored in a plurality of images that are used for determining light illumination mode among the EEPROM13d, determine the optimal illumination pattern, the light illumination mode that is stored among the EEPROM 13d is updated to optimal illumination pattern (step S207).
Specifically, for the optimal illumination pattern, there is following establishing method etc., promptly, obtain near the contrast value of characteristic point of electronic unit P, the light illumination mode during with contrast value and the immediate image taking of predefined benchmark contrast value is made as the optimal illumination pattern.
Light illumination mode and best coverage that reflection is obtained by above pre-treatment are carried out the processing of the step S5 of Fig. 3.
<action effect 〉
As noted above, according to parts testing fixture 110 and apparatus for mounting component 100, the different a plurality of images of distance that component identification camera 9 is taken from component identification camera 9 to electronic unit P.Then, control part 13 is determined program by carrying out pixel data, from the captured a plurality of photographic images of component identification camera 9, determines the pixel data of the aligning focus in the pixel of same position, and generates the pan focus image.
Then, control part 13 is determined program by carrying out range data, at each pixel data, and component identification camera 9 when determining to take determined each pixel data and the distance of electronic unit P.
Then, control part 13 judges by carrying out decision procedure whether the lead-in wire of the electronic unit P that obtains according to range data and the distance of imaginary line or imaginary plane surpass the feasible value that is stored among the EEPROM 13d.
Thus, only be used to check the component identification camera 9 of electronic unit P with respect to the offset at the center of adsorption mouth 7, only extract the pixel data of the aligning focus in each location of pixels (position coordinates), just can generate the pan focus image of aiming at focus for all location of pixels, the range data of each pixel data by obtaining the pan focus image, can detect parts which partly exist bad.
That is,, this image is handled, thereby can be carried out electronic unit P with respect to the offset at the center of adsorption mouth 7 and the inspection of electronic unit P self by taking a plurality of images by component identification camera 9.
Thus, the device and being used to that does not need to be provided for simultaneously as prior art to discern the offset of electronic unit P check electronic unit P self device the two, therefore can reduce inspection and go up the cost that the electronic unit P that installs is spent to substrate B.In addition, owing to can from identical image, detect when the offset of an electronic unit P is checked and the characteristic point position (position of lead-in wire etc.) of the electronic unit P during electronic unit P autoscopy, so do not need the operation as the matching that obtains each data, can reduce the time that the inspection operation of electronic unit P is spent.
In addition, control part 13 takes 9 couples of electronic unit P of component identification camera and adsorption mouth 7 when adsorption mouth 7 and component identification camera 9 are moved with predetermined distance.
Thus, can obtain photographic images, grasp the pixel data of photographic images easily and to the relation between the distance of component identification camera 9 with specified distance.
In addition,, utilize moving part that adsorption mouth 7 is moved along the optical axis direction of the optical system of component identification camera 9, can change component identification camera 9 and remain on distance between the electronic unit P on the adsorption mouth 7 by component identification camera 9 is fixing.
Thus, component identification camera 9 can the different a plurality of images of shooting distance.In addition, take the high image of precision by requiring the component identification camera 9 of positioning accuracy fixing owing to having optical system, and can reduce thus to rock.
In addition, passing through to carry out decision procedures by control part 13, and in the distance of a plurality of assigned positions (a plurality of electrode) that are judged to be the electronic unit P that obtains according to range data and imaginary line or imaginary plane, at least one is above being stored under the situation of the feasible value among the EEPROM 13d, control part 13 is carried control program by carrying out, and makes X delivery section 5 and Y delivery section 6 that electronic unit P is discharged and do not carry to the installation site of substrate B.
Thus, because in the distance of a plurality of regulations position of the electronic unit P that obtains according to range data (a plurality of electrode) and imaginary line or imaginary plane, at least one surpasses under the situation of feasible value, think that electronic unit P is undesired, so, can prevent to go up the situation that bad electronic unit P is installed to substrate B by this electronic unit P is discharged and do not install.
In addition, even the distance of regulation position and imaginary line or imaginary plane does not surpass feasible value and is normal, also can outside above-mentioned feasible value, preestablish the feasible value corresponding in addition with imaginary plane itself, it is undesired to be judged as component mounting when surpassing this feasible value, thereby gets rid of.
That is, feasible value is set in the inclination of imaginary line or imaginary plane, whether suitable by judging it, can more closely the installation of bad electronic unit be got rid of.
<other are 1 years old 〉
In addition, during shooting in above-mentioned steps S5, under the inconsistent situation in axle center of the optical axis of shoot part 9 shown in Figure 4 and adsorption mouth 7, make adsorption mouth 7 when the Z direction moves predetermined distance with respect to component identification camera 9 by moving part 14, utilize under the situation that 9 couples of electronic unit P of component identification camera and adsorption mouth 7 take, shown in Fig. 9 (A)~(C), produce skew at the center of the object of taking.
For this skew is proofreaied and correct, as shown in figure 10, correction target 100 with known a plurality of datum marks (centers of a plurality of circular marks) position carries on adsorption mouth 7 in advance, according to the image that moves with predetermined distance along the Z direction, carry out the center of gravity computing of mark, obtain the position of centre of gravity side-play amount of each mark of a plurality of positions on the Z direction, and generate they are stored in offset checking list among the EEPROM 13d.
When obtaining each image, according to the camera site on the Z direction, proofread and correct based on the data of this offset checking list, calculate the data of pan focus image.
Also can constitute, during view data during shooting in storage above-mentioned steps S5 or when in the later processing of step S6, using the view data of having stored, implement above-mentioned correction.By carrying out above-mentioned treatment for correcting, control part 13 works as the offset correcting unit.
In addition, use under the situation of far point lens at component identification camera 9, even under the situation that adsorption mouth 7 moves along the Z direction, the image size of electronic unit P and adsorption mouth 7 does not change along with moving of they yet.The component identification camera 9 of above-mentioned parts testing fixture is because this prerequisite and the treatment for correcting to the image size variation of not carrying out.
But, for example, use under the situation of non-far point lens at component identification camera 9, as shown in figure 11, because make adsorption mouth 7 and component identification camera 9 when the Z direction moves predetermined distance by moving part 14, under the situation that 9 couples of electronic unit P of component identification camera and adsorption mouth 7 are taken, the size of image changes, so when calculating pan focus, need to consider the enlargement ratio of different positions.
Therefore, under the situation of using non-far point lens, correction target same as described above 100 is carried on adsorption mouth 7, a plurality of positions on the Z direction are taken, and are corresponding with displacement, calculate mark distance in the heart in advance.And, the multiplying power of the position on the Z direction is changed, be stored among the EEPROM 13d as the multiplying power checking list.Then, when obtaining each image,, proofread and correct, calculate the data of pan focus image based on the value of this multiplying power checking list according to the camera site on the Z direction.
Also can constitute, during view data during shooting in storage above-mentioned steps S5 or when in the later processing of step S6, using the view data of having stored, implement above-mentioned correction.By carrying out above-mentioned treatment for correcting, control part 13 works as the multiplying power correcting unit.
<other are 2 years old 〉
In addition, the present invention is not limited to above-mentioned execution mode.For example, in the shooting that utilizes the component identification camera, in respect to the scope of focal position ± 0.5mm be that unit changes shooting distance, and electronic unit P is taken, but the interval of scope of taking and height can freely be changed with 0.05mm.
In addition, for the imaginary plane that is used to detect shooting distance (highly), also can calculate the imaginary plane shown in the ED-7401-4 that obtains JEITA (the team legal person Electricity of society feelings Reported Ji Intraoperative Chan Ye Association meeting) standard from the component identification camera to electronic unit.
In addition, the skew of electronic unit holding position also can be used the photographic images of specific part (electrode etc.) in focus and detects, and also can use the pan focus image and detects.
In addition, the skew of electronic unit holding position, the image that the range data (altitude information) of the shooting distance in the time of also can using according to generation pan focus image generates.At this moment,, also the predetermined specified data as the control gauge of range data can be stored among the EEPROM, will compare, after mating, position according to image and the control gauge that range data generates as the recognition methods of offset.

Claims (7)

1. parts testing fixture, it has: maintaining part, its holding member; And shoot part, it is taken the parts that kept by described maintaining part, according to the photographic images of taking by described shoot part, described parts is checked with respect to the offset at the center of described maintaining part,
It is characterized in that,
Described shoot part is taken from this shoot part to the different a plurality of images of distance between the described parts,
This parts testing fixture has:
The pixel data determining unit, it determines the pixel data of the aligning focus in the pixel of same position from a plurality of photographic images of being taken by described shoot part;
The range data determining unit, it is at each described view data, determines the described shoot part when taking each pixel data of being determined by described pixel data determining unit and the range data of described parts;
Metrics calculation unit, it calculates the regulation position of described parts and the distance between imaginary line or the imaginary plane based on described range data;
Memory cell, the feasible value of the described distance of its storage and described imaginary line or described imaginary plane is to be used for determining whether described parts satisfy the benchmark of regulation; And
Identifying unit, it judges whether described distance surpasses the described feasible value that is stored in the described memory cell.
2. parts testing fixture according to claim 1 is characterized in that having:
Moving part, its make in described maintaining part and the described shoot part at least one with respect to another is approaching/away from mode move; And
Take control unit, it makes described shoot part take described parts and described maintaining part when described maintaining part or described shoot part are moved with predetermined distance.
3. parts testing fixture according to claim 2 is characterized in that,
Described shoot part is fixed,
Described moving part makes described maintaining part along moving on the direction of the system optical axis direction of described shoot part.
4. apparatus for mounting component is characterized in that having:
Each described parts testing fixture in the claim 1 to 3;
Delivery section, it moves described maintaining part, and described parts are carried to the installation site; And
Carry control unit, it is being judged as by described identifying unit, in a plurality of regulations position and the distance between imaginary line or the imaginary plane of the described parts of obtaining according to described range data, at least one makes described delivery section that described parts are discharged and do not carried to the installation site above being stored under the situation of the feasible value in the described memory cell.
5. apparatus for mounting component according to claim 4 is characterized in that,
Has the offset correcting unit, it takes the view data that obtains from this shoot part to the different a plurality of images of distance between the described parts to described shoot part, utilize center offset correction table, view data is proofreaied and correct, in this center offset correction table, precompute and center side-play amount from the corresponding image of the distance of described shoot part between the described parts.
6. according to claim 4 or 5 described apparatus for mounting component, it is characterized in that,
Has the multiplying power correcting unit, it takes the view data that obtains from this shoot part to the different a plurality of images of distance between the described parts to described shoot part, utilize center offset correction table or multiplying power checking list, view data is proofreaied and correct, in this center offset correction table, precompute and center side-play amount from the corresponding image of the distance of described shoot part between the described parts, in this multiplying power checking list, precompute and size variation amount from the corresponding image of the distance of described shoot part between the described parts.
7. according to each described apparatus for mounting component in the claim 4 to 6, it is characterized in that,
Has the suitable environment determining unit, it carries out following pre-treatment, promptly, a plurality of positions in the moving before the described maintaining part that maintains parts arrives described shoot part, take, based on this shot image data, set the optimum position of taking scope, to be used for making described pixel data determining unit obtain the pixel data in focus of the pixel of same position from described shoot part to the different a plurality of images of the distance between the described parts.
CN2010102797176A 2009-09-09 2010-09-09 Component checking device and component mounting device Pending CN102026536A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009-207855 2009-09-09
JP2009207855 2009-09-09
JP2010-200479 2010-09-08
JP2010200479A JP2011082506A (en) 2009-09-09 2010-09-08 Device for inspecting or mounting component

Publications (1)

Publication Number Publication Date
CN102026536A true CN102026536A (en) 2011-04-20

Family

ID=43867167

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010102797176A Pending CN102026536A (en) 2009-09-09 2010-09-09 Component checking device and component mounting device

Country Status (1)

Country Link
CN (1) CN102026536A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103512514A (en) * 2012-06-15 2014-01-15 Juki株式会社 Component examining device
CN104048976A (en) * 2013-03-15 2014-09-17 株式会社理光 Image examination apparatus, image examination system, and image examination method
CN105472960A (en) * 2014-09-29 2016-04-06 Juki株式会社 Electronic component installing device
CN107093570A (en) * 2016-02-17 2017-08-25 株式会社斯库林集团 The abnormal inspection area of substrate hold mode automatically determines method and processing unit
CN107409492A (en) * 2015-03-18 2017-11-28 富士机械制造株式会社 Identification device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6330066B1 (en) * 1999-05-20 2001-12-11 Sony Corporation Height measuring apparatus and method and testing apparatus using the height measuring apparatus
JP2003130619A (en) * 2001-10-25 2003-05-08 Juki Corp Method and apparatus for detecting defective lead terminal of electronic parts
CN1913769A (en) * 2005-08-10 2007-02-14 重机公司 Method and device for obtaining image for electronic component

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6330066B1 (en) * 1999-05-20 2001-12-11 Sony Corporation Height measuring apparatus and method and testing apparatus using the height measuring apparatus
JP2003130619A (en) * 2001-10-25 2003-05-08 Juki Corp Method and apparatus for detecting defective lead terminal of electronic parts
CN1913769A (en) * 2005-08-10 2007-02-14 重机公司 Method and device for obtaining image for electronic component

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103512514A (en) * 2012-06-15 2014-01-15 Juki株式会社 Component examining device
CN104048976A (en) * 2013-03-15 2014-09-17 株式会社理光 Image examination apparatus, image examination system, and image examination method
CN104048976B (en) * 2013-03-15 2017-04-12 株式会社理光 Image examination apparatus, image examination system, and image examination method
CN105472960A (en) * 2014-09-29 2016-04-06 Juki株式会社 Electronic component installing device
CN107409492A (en) * 2015-03-18 2017-11-28 富士机械制造株式会社 Identification device
CN107409492B (en) * 2015-03-18 2019-12-06 株式会社富士 Identification device
CN107093570A (en) * 2016-02-17 2017-08-25 株式会社斯库林集团 The abnormal inspection area of substrate hold mode automatically determines method and processing unit
CN107093570B (en) * 2016-02-17 2020-07-10 株式会社斯库林集团 Method for automatically determining inspection area with abnormal substrate holding state and processing apparatus

Similar Documents

Publication Publication Date Title
KR101263391B1 (en) Apparatus for camera module continous test and focus adjustment having position detecting function
CN102026536A (en) Component checking device and component mounting device
CN102873420B (en) Method for positioning Mark points of PCB (printed circuit board) by image matching
WO2015170645A1 (en) Bonding apparatus and bonding method
CN108401414B (en) Component mounting apparatus and component mounting method
CN102812794B (en) Component-mounting device and component-detection method
JP2010278323A (en) Electronic component mounting device
CN102812793B (en) Component-mounting device and component-detection method
KR102057918B1 (en) Component mounting device
JP2011082506A (en) Device for inspecting or mounting component
US8701275B2 (en) Surface mounting apparatus
KR101470424B1 (en) Testing apparatus for lens
US20130120762A1 (en) Diaphragm position measuring method, diaphragm position measuring apparatus, diaphragm positioning method and diaphragm positioning apparatus
US8881380B2 (en) Component mounting apparatus and method for photographing component
JP2009130034A (en) Front/back discriminating apparatus for suction component and front/back discriminating method for suction component
CN205193432U (en) Mark target image aligning device and have device's exposure machine
JP2006210705A (en) Electronic component mounting device
JP2019110259A (en) Prober
JP2012253059A (en) Electronic component mounting device
CN103673889A (en) Image processing device and image processing method
KR20100104916A (en) Chip mounter laser displacement sensor established head assembly and coordinate calibration method
CN113630522B (en) Camera adjusting method and electronic equipment
US8139842B2 (en) Device and method for inspecting rechargeable battery connection structure
KR101415942B1 (en) Camera module inspection and focus adjusting device
CN103486966A (en) Optical measuring machine and method

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20110420