CN109257922A - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Abstract

Present invention offer is able to suppress the electronic component mounting apparatus and electronic component mounting method for installing undesirable generation.Electronic component mounting apparatus installs the electronic component with ontology and the protrusion protruded from ontology to the substrate for being provided with opening on surface.Electronic component mounting apparatus includes suction nozzle, keeps to ontology；Detection device detects the relative position between the front end of ontology and protrusion in the predetermined surface parallel with the surface of substrate；And control unit determines whether to install electronic component to substrate based on the error between target relative position and the detection relative position for indicating the relative position detected by detection device.

Description

Electronic component mounting apparatus and electronic component mounting method

Technical field

The present invention relates to electronic component mounting apparatus and electronic component mounting methods.

Background technique

Electronic component mounting apparatus has the suction nozzle that is kept to electronic component, the electronic component that suction nozzle is kept to Substrate installation.As electronic component, have as disclosed in such as patent document 1, so-called insert type electronic component (lead Type electronic component).The lead that insert type electronic component has ontology and protrudes from ontology.Insert type electronic component is by by lead It is inserted into the opening being arranged on the surface of the substrate and is installed on substrate.

Patent document 1: Japanese Unexamined Patent Application 62-143497 bulletin

The lead of electronic component base end part bending in the case where, even if the opening of front end and substrate to lead it Between relative position detected, lead is inserted into the opening of substrate while being adjusted to the relative position, is also had It is bad installation may to occur.That is, implementing only opening to the front end of lead and substrate in the case where the bending of the base end part of lead Relative position between mouthful is adjusted, and lead is forcibly inserted into the movement of the opening of substrate, and lead is possible to bear negative It carries.As a result, it is possible that lead deformation, it is bad to occur installation.

Summary of the invention

The purpose of mode of the invention is, provide be able to suppress the electronic component mounting apparatus for installing undesirable generation and Electronic component mounting method.

1st mode according to the invention, provides a kind of electronic component mounting apparatus, will have ontology and from the ontology The electronic component of the protrusion of protrusion is installed to the substrate for being provided with opening on surface, in the electronic component mounting apparatus, comprising: Suction nozzle keeps the ontology；Detection device, to described in the predetermined surface parallel with the surface of the substrate It is detected relative position between body and the front end of the protrusion；And control unit, it is based on target relative position and table Show the error between the detection relative position of the relative position detected by the detection device, determines whether the electricity Subassembly is installed to the substrate.

2nd mode according to the invention, provides a kind of electronic component mounting method, will have ontology and from the ontology The electronic component of the protrusion of protrusion is installed to the substrate for being provided with opening on surface, in the electronic component mounting method, includes Following step: to the phase between the front end of the ontology and the protrusion in the predetermined surface parallel with the surface of the substrate Position is detected；Based on target relative position and indicate between the detection relative position of the relative position detected Error determines whether to install the electronic component to the substrate；And it is being determined as the electronic component to the base Shifting when plate is installed, based on the size of the detection relative position and the protrusion, to the suction nozzle for maintaining the ontology Dynamic path is determined, makes the suction nozzle mobile based on the movement routine, the protrusion is inserted into the opening.

The effect of invention

Mode according to the present invention provides and is able to suppress the electronic component mounting apparatus for installing undesirable generation and the ministry of electronics industry Part installation method.

Detailed description of the invention

Fig. 1 is the oblique view for indicating an example of electronic component mounting apparatus involved in present embodiment.

Fig. 2 is the figure for showing schematically an example of mounting head involved in present embodiment.

Fig. 3 is the side view for showing schematically an example of electronic component involved in present embodiment.

Fig. 4 is the plan view for showing schematically an example of electronic component involved in present embodiment.

Fig. 5 is the oblique view for showing schematically an example of filming apparatus involved in present embodiment.

Fig. 6 is the functional block diagram for indicating an example of computer system involved in present embodiment.

Fig. 7 is the figure for showing schematically an example of shooting action for filming apparatus involved in present embodiment.

Fig. 8 is the schematic diagram being illustrated for the calculation method to contrast involved in present embodiment.

Fig. 9 is the schematic diagram being illustrated for the smoothing to contrast involved in present embodiment.

Figure 10 is to show schematically the distance between electronic component and filming apparatus involved in present embodiment and concern The figure of relationship between the contrast of pixel.

Figure 11 is the figure being illustrated for the calculation method to focus point position involved in present embodiment.

Figure 12 is the figure for indicating an example of pan focus image for electronic component involved in present embodiment.

Figure 13 is the side view for showing schematically an example of electronic component involved in present embodiment.

Figure 14 is the figure for indicating an example of pan focus image for electronic component involved in present embodiment.

Figure 15 is the side view for showing schematically an example of electronic component involved in present embodiment.

Figure 16 is the figure for indicating an example of pan focus image for electronic component involved in present embodiment.

Figure 17 is the figure being illustrated for the movement routine to suction nozzle involved in present embodiment.

Figure 18 is showed schematically when the lead of electronic component involved in present embodiment is inserted into the opening of substrate The figure of state.

Figure 19 is showed schematically when the lead of electronic component involved in present embodiment is inserted into the opening of substrate The figure of state.

Figure 20 is the flow chart for indicating an example of electronic component mounting method involved in present embodiment.

The explanation of label

4 ... control units, 5 ... image processing parts, 10 ... suction nozzles, 20 ... lighting devices, 21 ... shells, 22 ... light-emitting components, 23 ... light-emitting components, 24 ... openings, 25 ... openings, 30 ... filming apparatus, 31 ... optical systems, 32 ... imaging sensors, 41 ... Arithmetic processing apparatus, 42 ... storage devices, 43 ... input/output interfaces, 100 ... electronic component mounting apparatus, 101 ... pedestals, 102 ... feeder receptacles, 103 ... base board delivery devices, 104 ... substrate clamp systems, 105 ... base plates, 106 ... installations Head, 107 ... installation head moving devices, 108 ... X-axis guide rails, 109 ... Y-axis guide rails, 110 ... X driving devices, 111 ... Y driving dress It sets, 112 ... suction nozzle mobile devices, 113 ... Z driving devices, 114 ... θ Z driving devices, 200 ... feeders, 411 ... installation controls Portion, 412 ... lighting control sections, 413 ... shooting control parts, 414 ... apart from configuration part, 421 ... planning data storage units, and 422 ... Program storage part, 423 ... parts data storage units, 424 ... feasible value storage units, 300 ... detection devices, 511 ... image datas Acquisition unit, 512 ... contrast calculation sections, 513 ... ranging processing units, 514 ... pan focus image production parts, 515 ... relative positions Calculation part, 415 ... determination units, 416 ... movement routine determination sections, 521 ... focus point position storage units, 522 ... pan focus images Storage unit, AX ... optical axis, B ... base end part, C ... electronic component, Cb ... ontology, Cl ... lead (protrusion), the 1st lead of Cl1 ... (the 1 protrusion), the 2nd lead of Cl2 ... (the 2nd protrusion), FP ... focus, H ... distance, HF ... focus point position, L ... length, the centre M ... Portion, P ... substrate, PK ... opening, PJa ... component supply position, PJb ... installation site, the front end T ....

Specific embodiment

In the following, be illustrated on one side to embodiment according to the present invention on one side referring to attached drawing, but the present invention and unlimited Due to this.The constituent element of embodiment described below can be appropriately combined.In addition, sometimes without using the structure of a part At element.

In the following description, XYZ orthogonal coordinate system is set, referring to the XYZ orthogonal coordinate system and to each portion Positional relationship is illustrated.The direction for being parallel to X-axis in predetermined surface is set as X-direction, will be parallel in predetermined surface and X The direction of the orthogonal Y-axis of axis is set as Y direction, is set as Z axis side with the direction of each self-orthogonal Z axis of X-axis and Y-axis for being parallel to To.By centered on X-axis direction of rotation or inclined direction be set as θ X-direction, by centered on Y-axis direction of rotation or inclination Direction is set as θ Y-direction, by centered on Z axis direction of rotation or inclined direction be set as θ Z-direction.Predetermined surface is X/Y plane.Z axis It is orthogonal with predetermined surface.In the present embodiment, it is specified that face is set as being parallel to horizontal plane.Z-direction is vertical direction.In addition, rule Determining face can also be inclined relative to horizontal.

[electronic component mounting apparatus]

Fig. 1 is the oblique view for indicating an example of electronic component mounting apparatus 100 involved in present embodiment.Electronics Apparatus for mounting component 100 installs electronic component C to substrate P.As shown in Figure 1, electronic component mounting apparatus 100 includes pedestal 101；Feeder receptacle 102 is configured the feeder 200 of supply electronic component C；Base board delivery device 103, it is right Substrate P is conveyed；Substrate clamp system 104 is set to the transport path of base board delivery device 103, protects to substrate P It holds；Mounting head 106 is supported the suction nozzle 10 for being able to maintain electronic component C；Head moving device 107 is installed, it is flat in XY It can be mobile by mounting head 106 in face；Suction nozzle mobile device 112 is set to mounting head 106, can be relative to mounting head 106 Suction nozzle 10 is mobile in Z-direction and θ Z-direction；Lighting device 20, the electronic component C kept to suction nozzle 10 are illuminated； Filming apparatus 30, the electronic component C kept to suction nozzle 10 are shot；And computer system 40.

Pedestal 101 is to feeder receptacle 102, base board delivery device 103, mounting head 106, installation head moving device 107 And filming apparatus 30 is supported.

Feeder receptacle 102 is supported feeder 200.Feeder 200 is supplied with the electronic component of electronic component C Feedway.Feeder 200 supplies electronic component C to component supply position PJa.Component supply position PJa is that implementation will be electric Subassembly C is supplied from feeder 200 to the position of the component supply processing of suction nozzle 10.Component supply position PJa include with from confession Give the electronic component C of the supply of device 200 opposite position.

Base board delivery device 103 includes base plate 105；And conveyer belt can be to base in the top of base plate 105 Plate P is conveyed.Substrate P passes through the conveyer belt of base board delivery device 103, conveys in X-direction.Substrate clamp system 104 exists Substrate P is kept in the transport path of base board delivery device 103.Substrate clamp system 104 is by the substrate P of Y direction Both ends clamp.

Substrate clamp system 104 keeps substrate P in the installation site PJb for implementing installation process.Substrate clamping machine Structure 104 keeps substrate P in the surface of the substrate P mode parallel with X/Y plane.Installation site PJb is implemented the ministry of electronics industry The position for the installation process that part C is installed to substrate P.Installation site PJb includes and the substrate P phase installed to electronic component C Pair position.

Mounting head 106 has the suction nozzle 10 that is kept to electronic component C, the electronic component C that suction nozzle 10 is kept to The substrate P installation that substrate clamp system 104 is kept.Mounting head 106 is by the electronic component C supplied from feeder 200 by suction nozzle 10 keep and install to the surface of substrate P.Mounting head 106 can move in X/Y plane, which includes to implement component confession The installation site PJb of component supply position PJa and implementation installation process to processing.

Head moving device 107 is installed in the top of substrate P and the top of feeder 200, by the movement of mounting head 106.Installation Head moving device 107 can be mobile by mounting head 106 in X/Y plane, which includes and the electricity that supplies from feeder 200 The subassembly C opposite component supply position PJa and installation site PJb opposite with the substrate P installed to electronic component C. By the movable range for the mounting head 106 that installation head moving device 107 is realized, the operating area comprising mounting head 106.Pass through peace The work of head moving device 107 is filled, mounting head 106 can be mobile in X/Y plane.

Installation head moving device 107 includes X-axis guide rail 108, and mounting head 106 is guided in X-direction；Y-axis is led Rail 109 guides X-axis guide rail 108 in Y direction；X driving device 110, generate for by mounting head 106 in X-axis The mobile power in direction；And Y driving device 111, it generates for the power that mounting head 106 is mobile in Y direction.

Mounting head 106 is supported in X-axis guide rail 108.X driving device 110 includes actuator as motor, and generation is used for By the mounting head 106 for being supported in X-axis guide rail 108 power mobile in X-direction.Pass through the work of X driving device 110, installation First 106 on one side guided by X-axis guide rail 108, while the X-direction that exists it is mobile.

X-axis guide rail 108 is supported in Y-axis guide rail 109.Y driving device 111 includes actuator as motor, generates use In the X-axis guide rail 108 that will be supported in Y-axis guide rail 109 power mobile in Y direction.Pass through the work of Y driving device 111, X Axis rail 108 on one side guided by Y-axis guide rail 109, while the Y direction that exists it is mobile.If X-axis guide rail 108 is moved in Y direction Dynamic, then mounting head 106 and the X-axis guide rail 108 for being supported in the X-axis guide rail 108 are mobile in Y direction together.In present embodiment In, Y driving device 111 is mobile in Y direction by mounting head 106 via X-axis guide rail 108.

[mounting head]

Fig. 2 is the figure for showing schematically an example of mounting head 106 involved in present embodiment.Mounting head 106 has There is the suction nozzle 10 for detachably keeping electronic component C.Suction nozzle 10 is the absorption suction that absorption holding is carried out to electronic component C Mouth.The suction port connecting with vacuum source is set to the front end of suction nozzle 10.It is contacted in the front end of suction nozzle 10 with electronic component C Implement the attraction formed by vacuum source under state, thus electronic component C absorption is held in suction nozzle 10.By releasing by vacuum source shape At attraction, thus from suction nozzle 10 decontrol electronic component C.In addition, suction nozzle 10 is also possible to clip electronic component C and keep Grasp suction nozzle.

Mounting head 106 can move in X/Y plane, so that suction nozzle 10 is configured at component supply position PJa and installation Each position of position PJb.The electronic component C supplied from feeder 200 is kept from suction nozzle 10 and to substrate P by mounting head 106 Installation.

Suction nozzle 10 keeps the electronic component C supplied from feeder 200 in component supply position PJa.Suction nozzle 10 exists After component supply position PJa keeps electronic component C, it is delivered to installation site PJb, is installed to substrate P.It is incited somebody to action in installation site PJb After electronic component C is installed on substrate P, suction nozzle 10 decontrols electronic component C.Electronic component C is installed on substrate P as a result,.

Mounting head 106 can movably support suction nozzle 10 in Z-direction and θ Z-direction.Mounting head 106 has and can incite somebody to action The suction nozzle mobile device 112 mobile in Z-direction and θ Z-direction of suction nozzle 10.Suction nozzle mobile device 112 includes: Z driving device 113, suction nozzle 10 is mobile in Z-direction；And θ Z driving device 114, suction nozzle 10 is mobile (rotation) in θ Z-direction.Z Driving device 113 includes actuator as motor, is generated for the power that suction nozzle 10 is mobile in Z-direction.θ Z driving Device 114 includes actuator as motor, is generated for the power that suction nozzle 10 is mobile in θ Z-direction.

Suction nozzle 10, can be in X by installation head moving device 107 and the suction nozzle mobile device 112 being arranged in mounting head 106 This 4 directions axis, Y-axis, Z axis and θ Z are mobile.In addition, suction nozzle 10 can also can be this 6 in X-axis, Y-axis, Z axis, θ X, θ Y and θ Z Direction is mobile.

[electronic component]

Fig. 3 is the side view for showing schematically an example of electronic component C involved in present embodiment.Fig. 4 is to show Meaning ground indicates the plan view of an example of electronic component C involved in present embodiment and is to observe from below electronic component C Figure.

Electronic component C is insert type electronic component.As shown in Figures 3 and 4, electronic component C includes ontology Cb；And draw Line Cl is the protrusion protruded from ontology Cb.

Ontology Cb includes plastic cover member.In the inner space of ontology Cb, such as coil is configured.Lead Cl is Metal protrusion.Lead Cl with for example ontology Cb inner space configure coil connect.Lead Cl is from ontology Cb's Following table is protruded downwards.

In the present embodiment, lead Cl includes: drawing as the 1st lead Cl1 of the 1st protrusion and as the 2nd of the 2nd protrusion Line Cl2.That is, lead Cl is arranged 2 in ontology Cb.

Suction nozzle 10 keeps ontology Cb.Electronic component mounting apparatus 100 is in the state for keeping ontology Cb by suction nozzle 10 Under, the lead Cl of electronic component C is inserted into the opening in the setting of the surface of substrate P.Lead Cl is inserted into base by electronic component C Thus the opening of plate P is installed to substrate P.

[filming apparatus]

Fig. 5 is the oblique view for showing schematically an example of filming apparatus 30 involved in present embodiment.Shooting dress Set 30 pairs be held in suction nozzle 10, the electronic component C that is illuminated by lighting device 20 is shot.Filming apparatus 30 is supported in pedestal 101.Filming apparatus 30 from below shoots the electronic component C for being held in suction nozzle 10.

Filming apparatus 30 includes optical system 31；And imaging sensor 32, the light Jing Guo optical system 31 is carried out Light.The position of the focus of optical system 31 is fixed.That is, optical system 31 is fixed-focus lens, filming apparatus 30 is Fixed-focus camera.The optical axis AX of optical system 31 is parallel to Z axis.

Imaging sensor 32 includes CCD (Couple Charged Device) imaging sensor or CMOS (Complementary Metal Oxide Semiconductor) imaging sensor.Filming apparatus 30 carries out electronic component C Shooting obtains the image data of electronic component C.

Lighting device 20 illuminates the electronic component C for being held in suction nozzle 10 by illumination light.Lighting device 20 and bat Device 30 is taken the photograph compared to being disposed above.Lighting device 20 includes shell 21；Light-emitting component 22 is set to the top of shell 21； And light-emitting component 23, it is set to the lower part of shell 21.

In X/Y plane, the shape of shell 21 is square shape.In the top of shell 21 setting opening 24.In shell 21 Lower part setting opening 25.Light-emitting component 22 is configured multiple on the top of shell 21 in a manner of it will be open 24 encirclements.Shine member Part 23 is configured multiple in the lower part of shell 21 in a manner of it will be open 25 encirclements.

The mode opposite with the optical system 31 of electronic component C and filming apparatus 30 of suction nozzle 10, can to electronic component C into Row is kept.The opposite shape of the optical system 31 of electronic component C and filming apparatus 30 that Z driving device 113 is kept in suction nozzle 10 It, can be mobile in Z-direction by suction nozzle 10 under state.

Z driving device 113 is mobile in Z-direction by the suction nozzle 10 for maintaining electronic component C, to the light with optical system 31 The distance between electronic component C and filming apparatus 30 in axis AX parallel Z-direction H is adjusted.Z driving device 113 is made Driving device to be adjusted to the distance between electronic component C and filming apparatus 30 H works.Pass through Z driving device 113 The distance between the electronic component C and filming apparatus 30 that are adjusted H, is the Z axis side parallel with the optical axis AX of optical system 31 To distance.

The distance between electronic component C and filming apparatus 30 in Z-direction H, the concern position comprising electronic component C and The distance between filming apparatus 30.The distance between electronic component C and filming apparatus 30 H, can be the concerned department of electronic component C The surface of the lens nearest with the focus FP of optical system 31 in multiple lens of the optical system 31 of position and filming apparatus 30 The distance between, it is also possible between the concern position of electronic component C and the plane of incidence of the imaging sensor 32 of filming apparatus 30 Distance, be also possible to the distance between the concern position of electronic component C and the focus FP of optical system 31 of filming apparatus 30.

As described above, optical system 31 is fixed-focus lens.In the present embodiment, the electronic component C in Z-direction The distance between filming apparatus 30 H, be set as be electronic component C concern position and filming apparatus 30 optical system 31 coke The distance between point FP.

When being shot by filming apparatus 30 to electronic component C, computer system 40 carries out Z driving device 113 The electronic component C for being held in suction nozzle 10, is moved to the inner space of shell 21 by control via opening 24.Computer system 40 is right Lighting device 20 is controlled, and respectively projects illumination light from light-emitting component 22 and light-emitting component 23.It is configured at shell 21 as a result, The illuminated optical illumination of electronic component C of inner space.Filming apparatus 30 via opening 25 from below to be held in suction nozzle 10, by shining The electronic component C that bright device 20 illuminates is shot.

[computer system]

Fig. 6 is the functional block diagram for indicating an example of computer system 40 involved in present embodiment.Department of computer science System 40 is including, for example, personal computer.Computer system 40 includes arithmetic processing apparatus 41, and it includes CPU (Central Processing Unit) as processor；Storage device 42, it is such that it includes RAM (Random Access Memory) Nonvolatile memory as volatile memory and ROM (Read Only Memory)；And input/output interface 43.

Lighting device 20, filming apparatus 30, X driving device 110, Y driving device 111, Z driving device 113 and θ Z driving Device 114 is respectively connect with the input/output interface 43 of computer system 40.In addition, filming apparatus 30 and computer system 40 are logical Cross the connection of LAN cable.Lighting device 20, filming apparatus 30, X driving device 110, Y driving device 111, Z driving device 113 and θ Each free computer system 40 of Z driving device 114 controls.

Arithmetic processing apparatus 41 includes: control unit 4 controls electronic component mounting apparatus 100；And at image Reason portion 5 carries out image procossing to the image data of the electronic component C obtained by filming apparatus 30.

Control unit 4 includes mount control part 411, and the control signal for being used to implement installation process is exported；Lighting control Portion 412 exports the control signal controlled lighting device 20；Shooting control part 413, will to filming apparatus 30 into The control signal output of row control；Electronic component C apart from configuration part 414, when to by the shooting electronic component C of filming apparatus 30 The distance between filming apparatus 30 is set；Determination unit 415, the front end based on ontology Cb and lead Cl in X/Y plane Relative position between portion T and determine whether to install electronic component C to substrate P；And movement routine determination section 416, it determines The movement routine of the fixed suction nozzle 10 being open when being inserted by lead Cl to substrate P.

Storage device 42 includes planning data storage unit 421, stores to the planning data of installation process；Program Storage unit 422 stores the computer program of control installation process；Parts data storage unit 423, to indicating to base The parts data of the shape of the electronic component C of plate P installation is stored；And feasible value storage unit 424, to whether will be electric Feasible value used in the judgement that subassembly C is installed to substrate P is stored.

Planning data includes the sequence and substrate of the list of the electronic component C installed to substrate P, the installation of electronic component C At least one of the installation site of electronic component C in P.

Parts data include X-direction, Y direction and Z-direction respectively in electronic component C ontology Cb shape ruler It is very little.In addition, parts data includes the size (length L) from the lead Cl in the Z-direction that the lower surface of ontology Cb is protruded.Separately Outside, parts data includes the target relative position between the ontology Cb in X/Y plane and the front end T of lead Cl.Ontology Cb and draw Target relative position between the front end T of line Cl is the desired relative positions between ontology Cb and the front end T of lead Cl, And be electronic component C design data in ontology Cb and lead Cl front end T between relative position.In addition, component count According to the target relative position between the front end T of front end T and the 2nd lead Cl2 comprising the 1st lead Cl1 in X/Y plane.The Target relative position between the front end T of the front end T and the 2nd lead Cl2 of 1 lead Cl1, is the front end of the 1st lead Cl1 Desired relative positions between T and the front end T of the 2nd lead Cl2, and be electronic component C design data in the 1st lead Relative position between the front end T of the front end T and the 2nd lead Cl2 of Cl1.

Mount control part 411 is intended to data from planning data storage unit 421 and reads in, and will calculate from program storage part 422 Machine program is read in.In the installation process of electronic component C, mount control part 411 data and computer program according to schedule will be controlled Signal processed is exported at least one of X driving device 110 and Y driving device 111, and mounting head 106 is moved to feeder 200 Control signal is exported to Z driving device 113 and declines suction nozzle 10 by component supply position PJa, will be configured at component supply position The electronic component C for setting PJa is kept by suction nozzle 10.After electronic component C is kept by suction nozzle 10, mount control part 411 is according to schedule Control signal is exported at least one of X driving device 110 and Y driving device 111, will be installed by data and computer program First 106 are moved to installation site PJb, and control signal is exported to Z driving device 113 and declines suction nozzle 10, will be held in suction The electronic component C of mouth 10 is installed to substrate P.The reality for whole electronic component C specified in planning data of mount control part 411 Apply installation process.

Lighting control section 412 controls the light-emission operation of light-emitting component 22 and light-emitting component 23 to lighting device 20 Control signal output.Lighting device 20 is based on the control signal exported from lighting control section 412, in defined timing, to matching The electronic component C for being placed in the inner space of shell 21 is illuminated.

Shooting control part 413 exports the control signal controlled the shooting action of filming apparatus 30.Filming apparatus 30 electricity based on the control signal exported from shooting control part 413, in defined timing, to the inner space for being configured at shell 21 Subassembly C is shot.

Apart from configuration part 414 between the electronic component C and filming apparatus 30 when shooting electronic component C by filming apparatus 30 Distance H set.In the present embodiment, in electronic component C and filming apparatus 30 respectively with different multiple distance H points From when, electronic component C is shot by filming apparatus 30.Electronic component C is shot to by filming apparatus 30 apart from configuration part 414 When electronic component C and filming apparatus 30 between multiple distance H set.

Before the electronic component C that suction nozzle 10 is kept is installed to substrate P, the suction nozzle 10 is kept by filming apparatus 30 Electronic component C shot.Control unit 4 controls Z driving device 113, so that electronic component C is in Z-direction point It is not configured at different multiple positions.Filming apparatus 30 is from below to being respectively arranged at different multiple positions in Z-direction Electronic component C is shot.

Fig. 7 is the figure for showing schematically an example of the shooting action of filming apparatus 30 involved in present embodiment. As shown in fig. 7, implementing logical when the concern position and filming apparatus 30 of electronic component C are separated respectively with different multiple distance H Cross the shooting action of the electronic component C of the realization of filming apparatus 30.

Apart from configuration part 414 to the focus FP of the concern position of electronic component C and the optical system 31 of filming apparatus 30 it Between multiple distance H set so that the focus of the optical system 31 of the concern position of electronic component C and filming apparatus 30 FP is compared to (side-Z) on front side of being respectively arranged at and rear side (side+Z).

Filming apparatus 30 the optical system 31 of electronic component C and filming apparatus 30 focus FP respectively with different multiple When distance H is separated, electronic component C is shot, obtains the image data of electronic component C.In other words, filming apparatus 30 passes through The work of Z driving device 113, change on one side between the focus FP of the optical system 31 of electronic component C and filming apparatus 30 away from It is shot from H, on one side to the multiple images data of electronic component C.

In the present embodiment, the concern position of electronic component C includes at least the ontology Cb and electronic component of electronic component C The front end T of the lead Cl of C.Apart from configuration part 414 in the shooting action of a part in multiple shooting action, to the ministry of electronics industry The distance between the focus FP of the concern position of part C and optical system 31 H is set, so that the concerned department of electronic component C Position is configured at the front side (side-Z) of the focus FP of optical system 31, in the shooting action of another part, to electronic component C's The distance between the focus FP of concern position and optical system 31 H is set, so that the concern position of electronic component C configures In the rear side (side+Z) of the focus FP of optical system 31.

The position of the focus FP of optical system 31 in Z-direction, e.g. leads according to the specification data of optical system 31 Given data out.In addition, the position of the front end of the suction nozzle 10 in Z-direction be the drive volume based on Z driving device 113 and Detection.In addition it is also possible to the position sensor detected to the position of the front end of the suction nozzle 10 in Z-direction is set, It is detected by position of the position sensor to the front end of the suction nozzle 10 in Z-direction.In addition, the shape ruler of ontology Cb The length L of very little and electronic component C lead Cl is exported according to the parts data stored in parts data storage unit 423.Cause This, the position of the front end apart from configuration part 414 based on the suction nozzle 10 in Z-direction and the electronic component for being held in the suction nozzle 10 The parts data of C can calculate the position of the concern position of the electronic component C in Z-direction.Apart from configuration part 414 The position of focus FP based on optical system 31 and the parts data of electronic component C can set multiple distance H, with So that the concern position of electronic component C is configured near focus FP in the shooting action of a part in multiple shooting action, In the shooting action of another part, the concern position of electronic component C is respectively arranged at front side and rear side compared with focus FP.

In Fig. 6, image processing part 5 carries out image to the image data of the electronic component C obtained by filming apparatus 30 Reason.The multiple images data of electronic component C that filming apparatus 30 takes of bying while changing distance H are exported to department of computer science System 40.

Image processing part 5 while changing distance H based on bying multiple figures of electronic component C that filming apparatus 30 takes As data, the pan focus image of electronic component C is generated.In addition, pan focus image of the image processing part 5 based on electronic component C, right Relative position between ontology Cb in the X/Y plane parallel with the surface of substrate P and the front end T of lead Cl is calculated.Separately Outside, pan focus image of the image processing part 5 based on electronic component C, draws the 1st in the X/Y plane parallel with the surface of substrate P Relative position between the front end T of the front end T and the 2nd lead Cl2 of line Cl1 is calculated.

In the present embodiment, detection device 300 is constituted by filming apparatus 30 and image processing part 5, the filming apparatus 30 With optical system 31, on one side the distance between the focus FP for changing electronic component C and optical system 31 H, while be directed at the ministry of electronics industry The multiple images data of part C are shot, multiple images data of the image processing part 5 based on electronic component C and generate electronics The pan focus image of component C calculates the relative position between ontology Cb and the front end T of lead Cl, the detection device Ontology Cb in the 300 pairs of faces XY parallel with the surface of substrate P and the relative position between the front end T of lead Cl are examined It surveys.In the following description, filming apparatus 30 and image processing part 5 are merged and is properly termed as detection device 300.

Control unit 4 is based between the ontology Cb in the X/Y plane detected by detection device 300 and the front end T of lead Cl Relative position, determine whether by electronic component C to substrate P install.In the feelings for being judged to installing electronic component C to substrate P Under condition, pan focus image of the control unit 4 based on the electronic component C generated by image processing part 5, to the optical axis with optical system 31 The position of electronic component C in AX orthogonal X/Y plane is adjusted, and electronic component C is installed to substrate P.Control unit 4 is based on The pan focus image of electronic component C calculates the position of the front end of the lead Cl of the electronic component C in X/Y plane, right Installation head moving device 107 is controlled, and is adjusted to the position in the X/Y plane for the electronic component C for being held in suction nozzle 10, So that lead Cl is inserted into the opening of substrate P.

Image processing part 5 includes image data acquisition unit 511, obtains the electronic component C taken by filming apparatus 30 Image data；Contrast calculation section 512 calculates the contrast in each pixel of image data；Ranging processing Portion 513 is calculated based on focus point position HF of the calculated contrast to the concern position of electronic component C；Pan focus Image production part 514 generates the pan focus image of electronic component C based on calculated focus point position HF；And it is opposite Position calculation part 515, the pan focus image of the electronic component C based on generation and to the ontology of the electronic component C in X/Y plane Relative position between Cb and the front end T of lead Cl is calculated.

Storage device 42 includes focus point position storage unit 521, to by the calculated focus point of ranging processing unit 513 Position HF is stored；And pan focus image storage part 522, to the pan focus generated by pan focus image production part 514 Image is stored.

Image data acquisition unit 511 in electronic component C and filming apparatus 30 respectively with different multiple distance H separation when, Obtain the multiple images data of the electronic component C taken by filming apparatus 30.

It is that will be exported from filming apparatus 30 by the multiple images data for the electronic component C that image data acquisition unit 511 obtains Analog picture signal be transformed to data image signal and generate.Image data includes multiple pixels.It is obtained by image data Brightness value detected is shown respectively for multiple pixels in the image data that portion 511 obtains.

Contrast calculation section 512 is to the same concern including the concern position comprising electronic component C of multiple images data The respective contrast of pixel is calculated.

Fig. 8 is the schematic diagram being illustrated for the calculation method to contrast involved in present embodiment.Will be right It is set as (i, j) than the coordinate value in computing object, that is, concerned pixel X/Y plane of degree, the brightness value of concerned pixel (i, j) is set For I (i, j), I (i+dx, j) will be set as with the brightness value of the distance dx pixel separated to +X direction from concerned pixel (i, j), I (i-dx, j) will be set as with the brightness value of the distance dx pixel separated to -X direction from concerned pixel (i, j), it will be from concern Pixel (i, j) rises to +Y direction and is set as I (i, j+dy) with the brightness value of the distance dy pixel separated, will be from concerned pixel (i, j) It rises to -Y direction and I (i, j-dy) is set as with the brightness value of the distance dy pixel separated, it will be from concerned pixel (i, j) to the side+X It, will be from concern picture to being separated with distance dx, being set as I (i+dx, j+dy) to +Y direction with the brightness value of the distance dy pixel separated Plain (i, j) rise separated to +X direction with distance dx, to -Y direction with the brightness value of the distance dy pixel separated be set as I (i+dx, J-dy), will be separated from concerned pixel (i, j) to -X direction with distance dx, to -Y direction with the distance dy pixel separated Brightness value is set as I (i-dx, j-dy), will be separated from concerned pixel (i, j) to -X direction with distance dx, to +Y direction with When the brightness value of the pixel of distance dy separation is set as I (i-dx, j+dy), the contrast Lm (i, j) of concerned pixel (i, j) is based on (1) formula is calculated.

[formula 1]

That is, as shown in (1) formula, each brightness of 8 pixels of the contrast calculation section 512 by concerned pixel (i, j) around The summation of difference between value and the brightness value of concerned pixel, is counted as the contrast Lm (i, j) in concerned pixel (i, j) It calculates.

In addition, distance dx and distance dy are predetermined integer, as an example, the size of 1 pixel can be, It is also possible to the size of 10 pixels.

In addition, the calculation method of the contrast Lm (i, j) in concerned pixel (i, j) can also be not based on (1) formula.

After calculating the contrast Lm (i, j) in concerned pixel (i, j), contrast calculation section 512 is directed to image data In whole pixels, be based on contrast Lm (i, j), according to (2) formula implement smooth.

[formula 2]

Fig. 9 is the schematic diagram being illustrated for the smoothing to contrast involved in present embodiment.Such as Fig. 9 institute Show, for concerned pixel and in the case where implement the smoothing of contrast, during contrast calculation section 512 will be with concerned pixel The value of the contrast of whole pixels in the addition region of the heart averages, and thus smooths contrast.It is shown in Fig. 9 Example in, being added region is on one side for the region of the square of 2N+1.In addition, N is predetermined integer, for example, with point Resolution is correspondingly suitably selected.

Contrast calculation section 512 implements the calculating of contrast L for each pixel of whole pixels of multiple images data And smoothing.In the present embodiment, the processing for calculating contrast Lm based on (1) formula is equivalent to the filtering processing of 1 rank, is based on (2) The contrast Lm processing smoothed is equivalent to the filtering processing of 2 ranks by formula.

More than, for each pixel of whole pixels of multiple images data, calculate the contrast value (2 that smoothing obtains Rank filter value).

Figure 10 is to show schematically the distance between electronic component C and filming apparatus 30 and pass involved in present embodiment Infuse the figure of the relationship between the contrast of pixel.It obtains in electronic component C and filming apparatus 30 respectively with different multiple distance H The multiple images data of the electronic component C taken when separation by filming apparatus 30.

Ranging processing unit 513 is based on the contrast after the smoothing of concerned pixel, to the focus point position in concerned pixel HF is calculated.Ranging processing unit 513 at least to the focus point position HF of the concern position of the electronic component C in concerned pixel into Row calculates.The concern position of electronic component C is contained in concerned pixel.To the concern including the concern position comprising electronic component C Focus point position HF in pixel is calculated.

It is higher then to show contrast closer to focus point position HF for the concern position of electronic component C in concerned pixel Value.Focus point position HF refers to the concern position of electronic component C and the position that the focus FP of optical system 31 coincide.

Figure 11 is the figure being illustrated for the calculation method to focus point position HF involved in present embodiment.Figure 11 It is the chart for showing the relationship between the distance between electronic component C and filming apparatus 30 H and the contrast of concerned pixel.Figure 11 It is equivalent to the figure for extracting a part of Figure 10.In the chart shown in Figure 11, horizontal axis shows electronic component C and filming apparatus The distance between 30 H, the longitudinal axis show the contrast in the concerned pixel including the concern position comprising electronic component C.

In the present embodiment, based on the multiple contrasts for being directed to same concerned pixel, to the electronics in the concerned pixel The focus point position HF of the concern position of component C is calculated.

In the example shown in Figure 11, what the distance H between electronic component C and filming apparatus 30 was changed with multiple stages Under each state, the image data of electronic component C, the respective comparison of same concerned pixel to these multiple images data are obtained Degree is calculated.Subject is configured at the position of the focus FP closer to optical system 31, i.e., closer to focus point position HP, then Contrast shows higher value.Contrast curves are obtained by smoothing to multiple contrasts.Based on writing music in comparison The distance between electronic component C and the filming apparatus 30 that the maximum value of contrast is shown in line, to the ministry of electronics industry in concerned pixel The focus point position HF of the concern position of part C is calculated.

In the present embodiment, shape and electricity of the concern position of electronic component C including at least the ontology Cb of electronic component C The front end T of the lead Cl of subassembly C.Focus point position of the ranging processing unit 513 to the shape of the ontology Cb in concerned pixel HF is calculated.In addition, ranging processing unit 513 carries out the focus point position HF of the front end T of the lead Cl in concerned pixel It calculates.The focus point position HF of the front end T of the focus point position HF and lead Cl of the shape of calculated ontology Cb are stored in Focus point position storage unit 521.

In the present embodiment, not only to the focus point position HF and lead Cl of the shape of the ontology Cb in concerned pixel The focus point position HF of front end T is calculated, also to multiple including each position at multiple positions comprising electronic component C Focus point position in pixel is calculated.Multiple pixels respectively in the focus point position at multiple positions of electronic component C deposit It is stored in focus point position storage unit 521.

Multiple pictures including each position of the pan focus image production part 514 based on multiple positions comprising electronic component C Focus point position HF in element generates the pan focus image of electronic component C.Pan focus image production part 514 is based in focus point The multiple pixels stored in position storage unit 521 respectively in focus point position HF, generate pan focus image.As a result, for more The pan focus image of a each self-generating focus focusing of pixel.The pan focus image of generation is stored in pan focus image storage part 522.

Pan focus figure of the relative position calculation part 515 based on the electronic component C generated by pan focus image production part 514 Picture calculates the relative position between the ontology Cb in X/Y plane and the front end T of lead Cl.In the present embodiment, Pan focus image of the relative position calculation part 515 based on electronic component C, the shape of the ontology Cb kept to suction nozzle 10, the 1st are drawn Relative position in the X/Y plane of the front end T of the front end T and the 2nd lead Cl2 of line Cl1 is calculated.

Determination unit 415 is based on before by the ontology Cb and lead Cl in the calculated X/Y plane of relative position calculation part 515 Relative position between the T of end determines whether to install electronic component C to substrate P.

Determination unit 415 is based on by the calculated ontology Cb and lead Cl indicated in X/Y plane of relative position calculation part 515 Front end T between relative position detection relative position Las and the expression XY that is stored in parts data storage unit 423 Error delta a between the destination apparatus position Lar of relative position between ontology Cb in plane and the front end T of lead Cl, Determine whether to install electronic component C to substrate P.

In addition, determination unit 415 is based on expression by the 1st lead Cl1 in the calculated X/Y plane of relative position calculation part 515 Front end T and the 2nd lead Cl2 front end T between relative position detection relative position Lbs and deposited in parts data What is stored in storage portion 423 indicates the phase between the front end T of the front end T and the 2nd lead Cl2 of the 1st lead Cl1 in X/Y plane To the error delta b between the destination apparatus position Lbr of position, determine whether to install electronic component C to substrate P.

In the present embodiment, it is set as the position of the ontology Cb in the X/Y plane detected by detection device 300, is by examining Survey the position of the central point As of the lower surface of the ontology Cb in the X/Y plane that device 300 detects.It is set as storing in parts data The position of ontology Cb in the X/Y plane stored in portion 423 is the sheet in the X/Y plane stored in parts data storage unit 423 The position of the central point Ar of the lower surface of body Cb.

It is set as the position of the lead Cl in the X/Y plane detected by detection device 300, is detected by detection device 300 X/Y plane in the 1st lead Cl1 front end T and the 2nd lead Cl2 front end T between intermediate point Bs position.It is set as The position of lead Cl in the X/Y plane stored in parts data storage unit 423 is stored in parts data storage unit 423 X/Y plane in the 1st lead Cl1 front end T and the 2nd lead Cl2 front end T between intermediate point Br position.

The detection relative position Las being set as between ontology Cb and the front end T of lead Cl, is the center in pan focus image The distance between point As and intermediate point Bs.The target relative position Lar being set as between ontology Cb and the front end T of lead Cl is The distance between central point Ar and intermediate point Br in design data.It is set as the difference that error delta a is distance Las and distance Lar.

The detection relative position Lbs being set as between the front end T of the front end T and the 2nd lead Cl2 of the 1st lead Cl1 is The distance between front end T and the front end T of the 2nd lead Cl2 of the 1st lead Cl1 in pan focus image.It is set as the 1st lead Target relative position Lbr between the front end T of the front end T and the 2nd lead Cl2 of Cl1 is the 1st lead in design data The distance between front end T and the front end T of the 2nd lead Cl2 of Cl1.Be set as error delta b be distance Lbs and distance Lbr it Difference.

Figure 12 is the figure for indicating an example of pan focus image of electronic component C shown in Fig. 3.Figure 12 is equivalent under Pan focus image when side observation electronic component C.

In electronic component C shown in Fig. 3, the base end part B of lead Cl is not bent, but from the lower surface of ontology Cb pen It directly protrudes downwards, the 1st lead Cl1 and the 2nd lead Cl2 are parallel.The shape of electronic component C shown in Fig. 3 is ideal form, It is approximate with the shape of electronic component C in the design data stored in parts data storage unit 423.It indicates by detection device The detection relative position Las of relative position between the 300 ontology Cb detected and the front end T of lead Cl and in component count According to the phase between the front end T of the ontology Cb and lead Cl of the electronic component C in the expression design data stored in storage unit 423 It is approximate to the target relative position Lar of position.In addition, indicating the front end T of the 1st lead Cl1 detected by detection device 300 And the 2nd lead Cl2 front end T between relative position detection relative position Lbs and in parts data storage unit 423 Relative position between the front end T of the front end T and the 2nd lead Cl2 of the 1st lead Cl1 in the expression design data of storage Destination apparatus position Lbr it is approximate.

In addition, the central point Ar in design data is consistent with intermediate point Br, target is not illustrated in Figure 12 with respect to position Set Lar.

As shown in figure 12, the front end T of the ontology Cb and lead Cl in pan focus image detected by detection device 300 Between detection relative position Las and between the ontology Cb stored in parts data storage unit 423 and the front end T of lead Cl Target relative position Lar between error delta a it is small.In addition, the in the pan focus image detected by detection device 300 the 1st Detection relative position Lbs between the front end T of the front end T and the 2nd lead Cl2 of lead Cl1 and in parts data storage unit Between target relative position Lbr between the front end T of the front end T and the 2nd lead Cl2 of the 1st lead Cl1 stored in 423 Error delta b it is small.

Figure 13 is the side view for showing schematically an example of electronic component C involved in present embodiment.Figure 14 is Indicate the figure of an example of the pan focus image of electronic component C shown in Figure 13.Figure 14, which is equivalent to, observes from below the ministry of electronics industry Pan focus image when part C.

In the electronic component C shown in Figure 13, although the 1st lead Cl1 and the 2nd lead Cl2 are parallel, the cardinal extremity of lead Cl Portion B bending, protrudes from the following table of ontology Cb towards inclined direction.The shape of electronic component C shown in Figure 13 in component count It is different according to the shape of the electronic component C in the design data stored in storage unit 423.What expression was detected by detection device 300 The detection relative position Las of relative position between ontology Cb and the front end T of lead Cl and in parts data storage unit 423 The target of relative position between the front end T of the ontology Cb and lead Cl of electronic component C in the expression design data of storage Relative position Lar is different.On the other hand, the 1st lead Cl1 and the 2nd lead Cl2 are parallel, therefore indicate to be detected by detection device 300 The detection relative position Lbs of relative position between the front end T of the front end T and the 2nd lead Cl2 of the 1st lead Cl1 out and The front end T's and the 2nd lead Cl2 of the 1st lead Cl1 in expression design data stored in parts data storage unit 423 The destination apparatus position Lbr of relative position between the T of front end is approximate.

As shown in figure 14, the front end T of the ontology Cb and lead Cl in pan focus image detected by detection device 300 Between detection relative position Las and between the ontology Cb stored in parts data storage unit 423 and the front end T of lead Cl Target relative position Lar between error delta a it is big.On the other hand, the 1st lead Cl1 and the 2nd lead Cl2 are parallel, therefore by examining It surveys between the front end T of the front end T and the 2nd lead Cl2 of the 1st lead Cl1 in the pan focus image that device 300 detects Detect the front end T's and the 2nd lead Cl2 of relative position Lbs and the 1st lead Cl1 stored in parts data storage unit 423 The error delta b between the Lbr of target relative position between the T of front end is small.

Figure 15 is the side view for showing schematically an example of electronic component C involved in present embodiment.Figure 16 is Indicate the figure of an example of the pan focus image of electronic component C shown in figure 15.Figure 16, which is equivalent to, observes from below the ministry of electronics industry Pan focus image when part C.

In electronic component C shown in figure 15, the base end part B of lead Cl is bent, from the following table of ontology Cb towards inclined Direction protrusion.In addition, the 1st lead Cl1 and the 2nd lead Cl2 are not parallel, protruded to different directions.The ministry of electronics industry shown in Figure 16 The shape of part C is different from the shape of electronic component C in the design data stored in parts data storage unit 423.Indicate by The detection relative position Las of relative position between the front end T of detection device 300 the ontology Cb detected and lead Cl and The front end T of the ontology Cb and lead Cl of the electronic component C in expression design data stored in parts data storage unit 423 it Between relative position target relative position Lar it is different.In addition, indicating the 1st lead Cl1's detected by detection device 300 The detection relative position Lbs of relative position between front end T and the front end T of the 2nd lead Cl2 and in parts data storage unit It is opposite between the front end T of the front end T and the 2nd lead Cl2 of the 1st lead Cl1 in expression design data stored in 423 The destination apparatus position Lbr of position is different.

As shown in figure 16, the front end T of the ontology Cb and lead Cl in pan focus image detected by detection device 300 Between detection relative position Las and between the ontology Cb stored in parts data storage unit 423 and the front end T of lead Cl Target relative position Lar between error delta a it is small.In addition, the in the pan focus image detected by detection device 300 the 1st Detection relative position Lbs between the front end T of the front end T and the 2nd lead Cl2 of lead Cl1 and in parts data storage unit Target relative position Δ Lbr between the front end T of the front end T and the 2nd lead Cl2 of the 1st lead Cl1 stored in 423 it Between error delta b it is big.

In the present embodiment, determination unit 415 is in the front end for the front end T and the 2nd lead Cl2 for being determined as the 1st lead Cl1 When the error delta b of detection relative position Lbs between portion T is greater than 1 feasible value stored in feasible value storage unit 424, sentence It is set to and does not install electronic component C to substrate P.That is, the case where electronic component C is the state that 5 and Figure 16 illustrates referring to Fig.1 Under, determination unit 415 is judged to not installing electronic component C to substrate P.

In addition, determination unit 415 is between the front end T of front end T and the 2nd lead Cl2 for being determined as the 1st lead Cl1 The error delta b of detection relative position Lbs is less than or equal to the 1st feasible value stored in feasible value storage unit 424 and ontology Cb When the error delta a of detection relative position Las between the front end T of lead Cl is greater than 2 feasible value, it is determined as electronics not Component C is installed to substrate P.That is, in the case where electronic component C is the state that 3 and Figure 14 illustrates referring to Fig.1, although the 1st lead Cl1 and the 2nd lead Cl2 are parallel, but at the 1st lead Cl1 and the 2nd lead Cl2 exceedingly inclined situation, determination unit 415 is sentenced It is set to and does not install electronic component C to substrate P.

In addition, determination unit 415 is between the front end T of front end T and the 2nd lead Cl2 for being determined as the 1st lead Cl1 The error delta b of relative position Lbs is detected less than or equal to the inspection between the 1st feasible value and ontology Cb and the front end T of lead Cl When surveying the error delta a of relative position Las less than or equal to 2 feasible value, it is judged to installing electronic component C to substrate P.That is, In the case where electronic component C is the state illustrated referring to Fig. 3 and Figure 12 or electronic component C is 3 and Figure 14 explanation referring to Fig.1 State in the case where, in the case where the inclination of the 1st lead Cl1 and the 2nd lead Cl2 is small, determination unit 415 is determined as the electricity Subassembly C is installed to substrate P.

Movement routine determination section 416 determines the movement routine of the suction nozzle 10 when being inserted into lead Cl to the opening of substrate P.

Movement routine determination section 416 is in the detection relative position Las being determined as between ontology Cb and the front end T of lead Cl Error delta a be less than or equal to 2 feasible value when, based on the detection relative position between ontology Cb and the front end T of lead Cl The length L of Las and the lead Cl stored in parts data storage unit 423, when determining for be inserted into the opening of substrate P lead Cl Suction nozzle 10 movement routine.That is, being 3 and Figure 14 explanation referring to Fig.1 in the 1st lead Cl1 of electronic component C and the 2nd lead Cl2 It is had occurred in inclined situation in this way, the inclination with the 1st lead Cl1 and the 2nd lead Cl2 matches and to the mobile road of suction nozzle 10 Diameter optimizes, so that the 1st lead Cl1 and the 2nd lead Cl2 are inserted into the opening of substrate P.

Movement routine determination section 416 is in the detection relative position Las being determined as between ontology Cb and the front end T of lead Cl Error delta a when being less than or equal to 2 feasible value, based on the length L of the detection relative position Las and lead Cl, to maintaining The movement routine of the suction nozzle 10 of ontology Cb is determined, so that being located at the 1st of the opening of substrate P from the front end T of lead Cl State rises, and is located at the 2nd state of the opening of substrate P by the middle part M of lead Cl and changes and be located at for the base end part B of lead Cl 3rd state of the opening of substrate P.

Figure 17 is the explanatory diagram being illustrated for the movement routine to suction nozzle 10 involved in present embodiment.Such as Figure 17 Shown, the position of the base end part B of the lead Cl in the lower surface of ontology Cb and the length L of lead Cl are stored in parts data The given data stored in portion 423.Therefore, movement routine determination section 416 based on the ontology Cl that is detected by detection device 300 and Detection relative position Las between the front end T of lead Cl, being capable of base end part B and front end T to the lead Cl in X/Y plane The distance between W calculated.In addition, being calculated by focus point position HF of the ranging processing unit 513 to front end T.Cause This, movement routine determination section 416 can in Z-direction base end part B and the distance between front end T H calculate.It is mobile Length L, distance W and distance H of the path determination section 416 based on lead Cl, can to indicate lead Cl gradient angle, θ into Row calculates.Movement routine determination section 416 is based on angle, θ, determines the suction nozzle 10 when being inserted into lead Cl to the opening PK of substrate P Movement routine, so that from the front end T of lead Cl is located at the 1st state of opening PK of substrate P, by the centre of lead Cl Portion M is located at the 2nd state of the opening PK of substrate P and changes the 3rd shape that the base end part B for lead Cl is located at the opening PK of substrate P State.

After determining movement routine, as shown in figure 17, mount control part 411 puts down the suction nozzle 10 for maintaining ontology Cb in XY It is moved in face, so that the front end T of lead Cl is located at the center of opening PK.

In the state that ontology Cb is held in suction nozzle 10, lead Cl is shot by filming apparatus 30, determines that XY is flat The position of the front end T of lead Cl in face.In addition, by substrate position detection apparatus (not shown) to the substrate in X/Y plane It is detected the position of P.Substrate position detection apparatus detects the reference mark being arranged on the surface of such as substrate P.Base Positional relationship between fiducial mark note and opening PK is the given data that can for example obtain from the design data of substrate P.As a result, Determine the position of the opening PK in X/Y plane.As a result, the front end T to the lead Cl in the X/Y plane and opening PK of substrate P it Between positional relationship calculated.Therefore, the front end T of lead Cl can be positioned at the opening of substrate P by mount control part 411 The center of PK.

Next, mount control part 411 keeps suction nozzle 10 mobile to -Z direction while the movement in X/Y plane, so that Obtain the 2nd state for being located at the PK that is open from the middle part M that the 1st state that the front end T of lead Cl is located at opening PK becomes lead C.

Figure 18 is to show schematically that the lead Cl of electronic component C involved in present embodiment is inserted into the opening of substrate P The figure of state when PK.The suction nozzle 10 of ontology Cb is maintained to move to -Z direction on one side on one side mobile in X/Y plane, thus from Such as shown in figure 17, lead Cl front end T is located at the 1st state of the opening PK of substrate P, change for it is as shown in figure 18 this Sample, lead Cl middle part M is located at the 2nd state of the opening PK of substrate P.

Mount control part 411 is located at the opening PK of substrate P in the movement routine of suction nozzle 10, in the middle part M of lead Cl When, the holding of the electronic component C realized by suction nozzle 10 is decontroled.In the present embodiment, it is located at base in the middle part M of lead Cl When the opening PK of plate P, the attraction realized by the vacuum source connecting with the suction port of suction nozzle 10 is released.As a result, electronic component C from Suction nozzle 10 is released.

Figure 19 is to show schematically that the lead Cl of electronic component C involved in present embodiment is inserted into the opening of substrate P The figure of state when PK.When the middle part M of lead Cl is located at opening PK by the holding solution of the electronic component C realized by suction nozzle 10 It removes, is thus located at the 2nd state of the opening PK of substrate P from such, lead Cl middle part M as shown in figure 18, changes as such as Such, lead Cl base end part B shown in Figure 19 is located at the 3rd state of the opening PK of substrate P.In the present embodiment, drawing The middle part M of line Cl releases the holding of the electronic component C realized by suction nozzle 10 when being located at opening PK, and thus electronic component C is logical Gravity (self weight) is crossed, it is mobile to -Z direction.While lead Cl is guided by the PK that is open, electronic component C exists on one side It is mobile mobile to -Z direction on one side in X/Y plane.

[electronic component mounting method]

Figure 20 is the flow chart for indicating an example of electronic component mounting method involved in present embodiment.Installation control Suction nozzle 10 is moved to component supply position PJa by portion 411 processed, and the electronic component C supplied from feeder 200 is protected by suction nozzle 10 It holds.The suction nozzle 10 for maintaining electronic component C is moved to filming apparatus 30 by mount control part 411.

Shooting control part 413 changes between the electronic component C kept of suction nozzle 10 and the focus FP of optical system 31 on one side Distance H, filming apparatus 30 is controlled on one side, the multiple images data of electronic component C are shot.Multiple images number According to output to image processing part 5.Multiple images data of the image processing part 5 based on electronic component C generate the complete of electronic component C Focus image detects the relative position between the ontology Cb in X/Y plane and the front end T of lead Cl.In addition, image Pan focus image of the processing unit 5 based on electronic component C, to the front end T and the 2nd lead Cl2 of the 1st lead Cl1 in X/Y plane Front end T between relative position detected (step S10).

Determination unit 415 is to the detection relative position between the front end T of the front end T and the 2nd lead Cl2 of the 1st lead Cl1 Whether the error delta b between Lbs and target relative position Lbr, which is less than or equal to the 1st feasible value, is determined (step S20).

In step S20, when being determined as that error delta b is less than or equal to 1 feasible value (step S20:Yes), determination unit The error between detection relative position Las and target relative position Lar between 415 couples of ontology Cb and the front end T of lead Cl Whether Δ a, which is less than or equal to the 2nd feasible value, is determined (step S30).

In step s 30, when being determined as that error delta a is less than or equal to 2 feasible value (step S30:Yes), determination unit 415 are judged to installing electronic component C to substrate P.

Length L of the movement routine determination section 416 based on detection relative position Las and lead Cl, to maintaining ontology Cl's The movement routine of suction nozzle 10 is determined (step S40).

The suction nozzle 10 for maintaining electronic component C is moved to installation site PJb by mount control part 411.Mount control part 411 Make suction nozzle 10 mobile based on the movement routine determined by movement routine determination section 416, the lead Cl of electronic component C is inserted into The opening PK of substrate P.As a result, such as 7 to Figure 19 explanations referring to Fig.1, it is located at opening for substrate P from the front end T of lead Cl The 1st state of mouth PK rises, and is located at the 2nd state of the opening of substrate P by the middle part M of lead Cl and changes as the base of lead Cl End B is located at the 3rd state of the opening PK of substrate P.The base end part B of lead Cl is located at the opening PK of substrate P, thus by the ministry of electronics industry Part C installs (step S50) to substrate P.

In step S20, when being determined as that error delta b is greater than 1 feasible value (step S20:No), determination unit 415 determines Electronic component C not to be installed (step S60) to substrate P.The electronic component C that suction nozzle 10 is kept for example is discarded.

In step s 30, when being determined as that error delta a is greater than 2 feasible value (step S30:No), determination unit 415 determines Electronic component C not to be installed (step S60) to substrate P.The electronic component C that suction nozzle 10 is kept for example is discarded.

[effect]

As described above, according to the present embodiment, in insert type electronic component, before ontology Cb and lead Cl It is detected by detection device 300 relative position between the T of end.By between ontology Cb and the front end T of lead Cl Relative position is detected, thus as referring for example to Figure 13 explanation, it is curved in the base end part B of the lead Cl of electronic component C In the case where folding, can to lead Cl base end part B bending the case where detect.For example, in the front end T only to lead Cl In the case where being detected, such as 3 explanations referring to Fig.1, if the 1st lead Cl1 and the 2nd lead Cl2 are parallel, although base End B bending, the front end T based on the 1st lead Cl1 and the relative position between the front end T of the 2nd lead Cl2, it is also possible to It is normal for being mistakenly identified as electronic component C.Even if lead Cl base end part B bend, but the front end T of the 1st lead Cl1 and In the normal situation in relative position between the front end T of 2nd lead Cl2, the front end T and the 2nd lead Cl2 of the 1st lead Cl1 Front end T be inserted into the opening PK of substrate P, therefore implement the installation of the electronic component C of the base end part B bending of lead Cl Movement.In the case where the base end part B of lead Cl bending, after the front end T of lead Cl is inserted into the opening PK of substrate P, If the suction nozzle 10 for maintaining electronic component C is mobile to -Z direction as the crow flies, lead Cl is forcibly inserted into substrate P Opening PK, lead Cl be possible to bear load.As a result, generation installation is bad it is possible that lead Cl is deformed.

According to the present embodiment, the relative position between ontology Cb and the front end T of lead Cl is carried out by detection device 300 Detection is based on its testing result, determines whether the base end part B of lead Cl bends.In the base end part B for being determined as lead Cl In the case where substantially bending, electronic component C is not installed to substrate P, thus inhibits that undesirable generation is installed.Inhibit as a result, not The manufacture of good equipment inhibits the reduction of productivity.

In addition, according to the present embodiment, detection device 300 includes filming apparatus 30, with optical system 31, on one side Change the distance between the focus FP of electronic component C and optical system 31 H, on one side to the multiple images data of electronic component C into Row shooting；And image processing part 5, the multiple images data based on electronic component C and the pan focus figure for generating electronic component C Picture calculates detection relative position.It, can be accurately to ontology Cb as a result, based on the pan focus image of electronic component C It is detected relative position between the front end T of lead Cl.

In addition, according to the present embodiment, before ontology Cb, the 1st lead Cl1 that detection device 300 keeps suction nozzle 10 It is detected relative position in the X/Y plane of the front end T of end T and the 2nd lead Cl2.Control unit 4 is being determined as the 1st lead The error delta b of detection relative position Lbs between the front end T of the front end T and the 2nd lead Cl2 of Cl1 is greater than the 1st feasible value When, it is judged to not installing electronic component C to substrate P.In the case where error delta b is big, the 1st lead Cl1 and the 2nd can not be drawn Line Cl2 is inserted into 2 opening PK of substrate P respectively.According to the present embodiment, ontology Cb, the 1st lead suction nozzle 10 kept It is detected relative position in the X/Y plane of the front end T of the front end T and the 2nd lead Cl2 of Cl1.Therefore, suitably determine Electronic component C can be installed to substrate P.

In addition, according to the present embodiment, control unit 4 is less than or equal in the error delta b for being judged to detecting relative position Lbs The error delta a of detection relative position Las between the front end T of 1st feasible value and ontology Cb and lead Cl is greater than the 2nd and allows When value, it is judged to not installing electronic component C to substrate P.Even if being less than or equal to the 1st feasible value in error delta b, lead Cl is still It substantially tilts, in the case that error delta a is greater than the 2nd feasible value, if attempting to install electronic component C to substrate P, occurs A possibility that bad height is installed.According to the present embodiment, it is less than or equal to the 1st feasible value in error delta b, error delta a is greater than the 2nd In the case where feasible value, the movement for installing electronic component C to substrate P is not implemented yet.Therefore, inhibit that undesirable generation is installed, Inhibit the manufacture of bad equipment.

In addition, according to the present embodiment, control unit 4 is the front end T's and the 2nd lead Cl2 for being determined as the 1st lead Cl1 Error delta b between detection relative position Lbs between the T of front end and target relative position Lbr is less than or equal to the 1st and allows Value and the error detected between relative position Las and target relative position Lar between ontology Cb and the front end T of lead Cl When Δ a is less than or equal to 2 feasible value, it is judged to installing electronic component C to substrate P.In both error delta b and error delta a In the case where all small, it can be determined that the lead Cl of electronic component C is normal.

In addition, according to the present embodiment, in the detection relative position being determined as between ontology Cb and the front end T of lead Cl When error delta a between Las and target relative position Lar is less than or equal to 2 feasible value, based on detection relative position Las and The length L of lead Cl determines the movement routine of suction nozzle 10, so that 10 adipping of suction nozzle is mobile.As a result, lead Cl's In the case that base end part B is without substantially bending, the movement routine of suction nozzle 10 is matched and determined with the angle, θ of lead Cl, it can Electronic component C is installed to substrate P.Therefore, it is able to suppress the quantity of the electronic component C discarded.

In addition, according to the present embodiment, control unit 4 is in the movement routine for keeping 10 adipping of suction nozzle mobile, lead When the middle part M of Cl is located at the opening PK of substrate P, the holding of the electronic component C realized by suction nozzle 10 is decontroled.Drawing as a result, While line Cl is guided by the PK that is open, by the gravity (self weight) of electronic component C, it is smoothly inserted into opening PK.

In addition, in the above-described embodiment, substantially bending in the base end part B of lead Cl, error delta b is greater than the 1st and allows In the case where value or in the case that error delta a is greater than the 2nd feasible value, electronic component C can not be discarded, and be based on error Δ b or error delta a corrects the bending of lead Cl using lead rectifier.

In addition, in the above-described embodiment, being set as that ontology Cb is provided with 2 lead Cl.Lead Cl also can be set Any amount more than or equal to 3 can also only be arranged 1.In the case where being set to the lead Cl of ontology Cb is 1, Error of the control unit 4 in the detection relative position being determined as between ontology Cb and the front end T of lead Cl is greater than the 2nd feasible value When, it can be determined that electronic component C is not installed to substrate P, in the inspection being determined as between ontology Cb and the front end T of lead Cl When surveying the error of relative position less than or equal to 2 feasible value, it can be determined that electronic component C is installed to substrate P.

In addition, in the above-described embodiment, being set as generating the pan focus image of electronic component C, being based on electronic component C Pan focus image, the relative position between ontology Cb and the front end T of lead Cl is detected.As long as can be to ontology Cb Relative position between the front end of lead Cl is detected, then is not limited to the method using pan focus image, can be with Use arbitrary method.For example, can be based on laser when respectively irradiating ontology Cb from laser to electronic component C and lead Cl Light is as a result, detect the relative position between ontology Cb and the front end T of lead Cl.Alternatively, it is also possible to based on complete burnt Point image detects the position of the front end T of lead Cl, based on irradiation laser when laser light result and to ontology It is detected the position of Cb.

In addition, in the above-described embodiment, the protrusion protruded from ontology Cb can not be lead Cl.For example, being used for It, can be to this in the case that the protrusion i.e. boss positioned to electronic component C and substrate P is set to the ontology of electronic component C Relative position between body and the front end of boss is detected, and the relative position is based on, and is determined whether electronic component C to base Plate P installation.

In addition, in the above-described embodiment, by the work of Z driving device 113, the suction of electronic component C will be maintained Mouth 10 is mobile in Z-direction, is thus set as being adjusted the distance between electronic component C and filming apparatus 30.It can also set Filming apparatus mobile device that can be mobile in Z-direction by filming apparatus 30 is set, by the work of filming apparatus mobile device, The distance between electronic component C and filming apparatus 30 are adjusted.Alternatively, it is also possible to by electronic component C and filming apparatus 30 The two is mobile in Z-direction, is thus adjusted to the distance between electronic component C and filming apparatus 30.

Claims (9)

1. a kind of electronic component mounting apparatus, by the electronic component with ontology and the protrusion protruded from the ontology in table Face is provided with the substrate installation of opening,

In the electronic component mounting apparatus, comprising:

Suction nozzle keeps the ontology；

Detection device, to the front end of the ontology and the protrusion in the predetermined surface parallel with the surface of the substrate it Between relative position detected；And

Control unit, the detection phase based on the relative position that target relative position and expression are detected by the detection device To the error between position, determine whether to install the electronic component to the substrate.

2. electronic component mounting apparatus according to claim 1, wherein

The detection device includes filming apparatus, with optical system, changes the electronic component and the optical system on one side The distance between focus of system on one side shoots the multiple images data of the electronic component；And image processing part, Multiple images data based on the electronic component and the pan focus image for generating the electronic component detect opposite position to described It sets and is calculated.

3. electronic component mounting apparatus according to claim 1 or 2, wherein

The protrusion includes the 1st protrusion and the 2nd protrusion,

The ontology, the described 1st raised front end and the 2nd protrusion that the detection device keeps the suction nozzle Relative position in the predetermined surface of front end is detected,

The detection of the control unit between the front end of the front end and the 2nd protrusion that are determined as the 1st protrusion When the error of relative position is greater than 1 feasible value, it is judged to not installing the electronic component to the substrate.

4. electronic component mounting apparatus according to claim 3, wherein

The detection of the control unit between the front end of the front end and the 2nd protrusion that are determined as the 1st protrusion The error of relative position is less than or equal to the detection between the 1st feasible value and the ontology and the front end of the protrusion When the error of relative position is greater than 2 feasible value, it is judged to not installing the electronic component to the substrate.

5. electronic component mounting apparatus according to claim 3 or 4, wherein

The detection of the control unit between the front end of the front end and the 2nd protrusion that are determined as the 1st protrusion The error of relative position is less than or equal to the detection between the 1st feasible value and the ontology and the front end of the protrusion When the error of relative position is less than or equal to 2 feasible value, it is judged to installing the electronic component to the substrate.

6. electronic component mounting apparatus according to claim 1 or 2, wherein

Error of the control unit in the detection relative position being determined as between the ontology and the front end of the protrusion When greater than 2 feasible value, it is judged to not installing the electronic component to the substrate, is being determined as the ontology and described convex When the error for the detection relative position between front end risen is less than or equal to 2 feasible value, it is determined as the electronics Component is installed to the substrate.

7. electronic component mounting apparatus according to claim 5 or 6, wherein

Error of the control unit in the detection relative position being determined as between the ontology and the front end of the protrusion When less than or equal to 2 feasible value, based on the size of the detection relative position and the protrusion, to maintaining the ontology The movement routine of the suction nozzle is determined, so that passing through from the front end of the protrusion is located at the 1st state of the opening The middle part for crossing the protrusion is located at the 2nd state of the opening and changes and be located at the opening for the base end part of the protrusion 3rd state, the control signal that the control unit output makes the suction nozzle mobile based on the movement routine,

The movement routine include the suction nozzle on one side orthogonal with the surface of substrate direction movement, while exist with it is described The mobile path in the parallel direction in the surface of substrate.

8. electronic component mounting apparatus according to claim 7, wherein

It, will be real by the suction nozzle when control unit middle part raised described in the movement routine is located at the opening The holding of the existing electronic component is decontroled.

9. a kind of electronic component mounting method, by the electronic component with ontology and the protrusion protruded from the ontology in table Face is provided with the substrate installation of opening,

Include following step in the electronic component mounting method:

To the opposite position between the front end of the ontology and the protrusion in the predetermined surface parallel with the surface of the substrate It sets and is detected；

Based on the error between target relative position and the detection relative position for indicating the relative position detected, judgement is It is no to install the electronic component to the substrate；And

When being judged to installing the electronic component to the substrate, the ruler based on the detection relative position and the protrusion It is very little, the movement routine for the suction nozzle for maintaining the ontology is determined, the suction nozzle is made based on the movement routine It is mobile, the protrusion is inserted into the opening.