JP5003610B2 - Board inspection method - Google Patents

Description

  The present invention relates to a substrate inspection method for inspecting whether or not an electronic component is mounted on an electronic component mounting portion on a mounting surface of a substrate.

  In the field of electronic component mounting, electronic components are picked up by being picked up by the nozzles from the state of being stored in the parts feeder, and picked up by the camera to check the picked-up position, etc., and corrected the position. It will be mounted on the mounting surface later. If the electronic component has not been removed due to a suction error, it can be confirmed from this imaging result. However, the electronic component may drop from the nozzle or be mounted after the position correction until mounting. However, electronic components may not be mounted on the mounting surface due to reasons such as being brought home while being attracted to the nozzle.

Conventionally, as a method for inspecting whether or not an electronic component is mounted on the mounting surface, whether or not there is a change in color by performing color recognition before and after mounting the electronic component on the mounting position of the electronic component on the mounting surface Is used to determine whether or not an electronic component is mounted (Patent Document 1).
JP 2001-345600 A

  In this inspection method, a step of performing color recognition at a stage before mounting an electronic component, storing the recognized color, performing color recognition again at the same position after mounting the electronic component, and comparing with the stored color. In order to confirm the mounting state of one electronic component, two color recognition operations are required. Therefore, there is a problem that the inspection takes time as the number of electronic components mounted increases.

  An object of the present invention is to provide a substrate inspection method capable of shortening the inspection time by reducing the number of times of color recognition required for inspection of the mounting state of an electronic component.

The substrate inspection method according to claim 1 is a substrate inspection method for inspecting whether or not an electronic component is mounted on an electronic component mounting portion of the mounting surface of the substrate , and the color of the mounting surface from an image captured by the camera Is recognized by the color recognizing unit, and stored as reference color data in the storage unit, and the mounted part is imaged by moving the camera based on the mounting part data of the electronic component stored in the storage unit. The process of recognizing the color of the mounting location with the color recognition unit, the reference color stored in the storage unit, and the color of each mounting location are compared, and whether or not an electronic component is mounted on the mounting location is determined. When the color of the mounting surface of the substrate is different from the reference color, the mounting state of the electronic component is inspected by changing the color range of the reference color.

The mounting location after mounting the electronic component by checking whether the electronic component is mounted on the mounting location of the electronic component by comparing the reference color with the color of the mounting surface of the board as the reference for inspection Therefore, it is not necessary to perform color recognition before mounting, so that the time required for substrate inspection can be shortened.

  Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a block diagram showing a part of an electronic component mounting line according to an embodiment of the present invention, FIG. 2 is a block diagram of an inspection apparatus according to the embodiment of the present invention, and FIG. 3 is a block diagram of the embodiment of the present invention. It is a flowchart which shows the flow of a test | inspection of the mounting state of the electronic component by an inspection apparatus.

  The electronic component mounting line 1 includes a mounting device 3 for mounting an electronic component on a substrate 2 printed with solder, an inspection device 4 for inspecting the mounting state of the electronic component, and a solder between the electronic component and the substrate. The soldering device 5 for soldering the electronic component to the substrate is arranged in order from the upstream to the downstream along the flow of the substrate 2.

  The mounting apparatus 3 carries in the board 2 and carries out the board 2 after mounting electronic components on the solder printed on the board 2. The place where the electronic component is mounted on the substrate 2 is determined for each type of the substrate, and the mounting apparatus 3 checks the type of the substrate by ID recognition and mounts the electronic component at each predetermined position. The mounting device 3 may be used by connecting a plurality of devices. Here, three mounting devices 3 are continuously arranged. Each mounting apparatus 3 carries in the board | substrate 2 in order, and each of the some mounting location defined on the board | substrate 2 shares, and mounts an electronic component.

  The inspection device 4 includes a first camera 6 that images a predetermined portion of the mounting surface of the substrate 2 and a second camera 7 that images a plurality of mounting locations defined on the mounting surface. The first camera 6 is disposed above the substrate conveyance path 8 that connects the mounting apparatus 3 and the inspection apparatus 4, and images the upper surface of the substrate 2, that is, the mounting surface, before being carried into the inspection apparatus 4. Since electronic components are already mounted on the mounting surface of the substrate 2 carried out from the mounting apparatus 3, generally, if the four corners of the substrate on which the electronic components are not mounted are imaged, the electronic components fall within the viewing angle. The mounting surface itself of the substrate 2 can be imaged. The second camera 7 is supported by a horizontal movement mechanism 9 so as to be horizontally movable above the substrate 2 carried into the inspection apparatus 4.

  The second camera 7 images all predetermined mounting locations on the mounting surface of the substrate 2 while moving horizontally above the substrate 2. If the electronic component is correctly mounted at the mounting location, the image captured by the second camera 7 is the electronic component. If the electronic component is not mounted due to a mounting error, the second camera 7 What is imaged is the mounting surface.

  FIG. 2 is a block diagram of the inspection apparatus 4. The color recognition unit 10 recognizes the color of the mounting surface from the image of the mounting surface captured by the first camera 6. The color of the mounting surface recognized by the color recognition unit 10 is stored in the storage unit 11 as reference color data. The storage unit 11 stores electronic component mounting location data, and the horizontal movement mechanism 9 sequentially moves the second camera 7 to the mounting location based on this data. Each time the second camera 7 moves, the mounting location is imaged. The color recognition unit 10 recognizes the imaged color of each mounting location.

  The mounting state determination unit 12 compares the reference color stored in the storage unit 11 with the color of each mounting location, and determines whether the electronic component is mounted, that is, whether the electronic component is mounted at the mounting location. To do. In this mounting state determination, a color range indicating a color range regarded as the same color as the reference color is stored in advance in the storage unit 11, and the color of the mounting location is included in the color range defined by the color range. The electronic component mounting state is determined based on whether or not the electronic component is mounted. As the color range, a plurality of different color ranges corresponding to colors assumed as the colors of the mounting surface are prepared in advance and stored in the storage unit 11.

The display unit 13 displays the determination result of the electronic component mounting state made by the mounting state determination unit 12, the images actually captured by the first camera 6 and the second camera 7, and the like. The input unit 14 is used to input mounting location data and a color range to the storage unit 11 and to update various programs and parameters used for control in the control unit 15.

  FIG. 3 is a flowchart showing a flow of inspection of the mounting state of the electronic component by the inspection device 4. First, a master substrate is carried into the electronic component mounting line 1 (ST1). Next, the mounting surface of the master substrate is imaged by the first camera 6 (ST2). Next, the color of the mounting surface of the master substrate is recognized from the captured image (ST3). Next, the recognized color is registered as a reference color (ST4). Thereafter, the master board that has finished its role is carried out (ST5), and the board on which the electronic component is actually mounted is carried in (ST6). If the substrate is in a good management state (no fading or uneven color), it can be used for registration of the reference color instead of the master substrate.

  The mounting surface of the board that has been loaded is imaged by the first camera 6 (ST7). Next, the color of the mounting surface of the substrate is recognized from the captured image (ST8). Next, the actually recognized color of the mounting surface is compared with the registered reference color (ST9). As a result of comparison, if the colors are the same, the mounting state determination unit 12 determines the mounting state of the electronic component without changing the color range of the registered reference color (ST10). On the other hand, when the color of the mounting surface is different from the registered reference color, the color range corresponding to the actual color of the mounting surface is changed (ST11), and the mounting state of the electronic component is determined using the changed color range ( ST12). Next, the board after the determination of the mounting state of the electronic component is carried out (ST13), and a new board is carried in (ST14).

  By inspecting the mounting status of electronic components in this way, it is possible to determine whether electronic components are mounted by comparing them with the first registered reference color, so the conventional color recognition work that has been done before and after mounting is installed. Only one time later is required, and the time and labor required for the inspection can be greatly reduced. The change of the color range (ST11) can be performed only by changing the parameters of the electric signal processing in the mounting state determination unit 12, so that a substantial burden is not increased. Also, the color range change process is a process that is required when fading, stains, or changes in hue due to different lots occur in the middle of a continuous inspection process, as long as normal substrate management is performed. Is an irregular process that is not frequently performed.

  In the present embodiment, the first camera 6 is used to recognize the color of the mounting surface of the board. However, when the imaging field of view of the second camera 7 is sufficiently wide with respect to the size of the component to be inspected. May be used for recognizing the color of the mounting surface of the board in an area where no part is present in the imaging field of view.

  In addition, after carrying the board into the inspection apparatus 4 and before inspecting the component mounting state, the second camera 7 captures a predetermined portion of the board mounting surface and recognizes the color of the board mounting surface. Also good.

  The present invention is useful in the field of mounting electronic components.

The block diagram which showed a part of electronic component mounting line of embodiment of this invention The block block diagram of the inspection apparatus of embodiment of this invention The flowchart which shows the flow of a test | inspection of the mounting state of the electronic component by the test | inspection apparatus of embodiment of this invention.

Explanation of symbols

1 Electronic component mounting line 2 Substrate 4 Inspection device

Claims (1)

A substrate inspection method for inspecting whether or not an electronic component is mounted on an electronic component mounting position on a mounting surface of a substrate,
A step of recognizing the color of the mounting surface from the image captured by the camera by the color recognition unit and storing it as reference color data in the storage unit;
The step of moving the camera based on the mounting location data of the electronic component stored in the storage unit to capture the mounting location, and recognizing the color of each captured mounting location by the color recognition unit;
A step of comparing the reference color stored in the storage unit with the color of each mounting location and determining whether or not an electronic component is mounted on the mounting location by a mounting state determination unit , When the color is different from the reference color, the substrate inspection method is characterized by inspecting the mounting state of the electronic component by changing the color range of the reference color.

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