JP7259476B2 - Alignment apparatus, substrate processing apparatus, alignment method, and substrate processing method - Google Patents

Alignment apparatus, substrate processing apparatus, alignment method, and substrate processing method Download PDF

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JP7259476B2
JP7259476B2 JP2019061317A JP2019061317A JP7259476B2 JP 7259476 B2 JP7259476 B2 JP 7259476B2 JP 2019061317 A JP2019061317 A JP 2019061317A JP 2019061317 A JP2019061317 A JP 2019061317A JP 7259476 B2 JP7259476 B2 JP 7259476B2
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秀樹 駒田
孝徳 若林
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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Description

本開示は、基板のアライメントを行う技術に関する。 The present disclosure relates to techniques for aligning substrates.

フラットパネルディスプレイ（Flat Panel Display：ＦＰＤ）の製造工程においては、基板処理を行う基板処理室にガラス基板を搬入するときに、正しい位置に搬入できるように、予めガラス基板のアライメントを行い、位置合わせが行われる。
特許文献１は、ガラス基板を搬送する搬送室に複数の基板の処理室が接続された基板処理装置にて、各処理室に搬送するガラス基板のアライメントを行うにあたって、個々の処理室を接続する際に生じる位置ずれに着目している。そしてガラス基板の搬送先となる処理室ごとにガラス基板の配置位置を調節し、正しい位置にガラス基板を載置する技術が記載されている。 In the manufacturing process of flat panel displays (FPDs), when a glass substrate is carried into a substrate processing chamber where substrate processing is performed, the glass substrate is aligned in advance so that it can be carried into the correct position. is done.
Japanese Patent Laid-Open No. 2004-100000 describes a substrate processing apparatus in which processing chambers for a plurality of substrates are connected to a transfer chamber for transferring glass substrates. We focus on the positional deviation that occurs in the process. Then, a technique is described in which the placement position of the glass substrate is adjusted for each processing chamber to which the glass substrate is to be transferred, and the glass substrate is placed in the correct position.

特開２００６－３２４３６６号公報JP 2006-324366 A

本開示はこのような事情の下になされたものであり、並べて配置された２枚の矩形基板の配置位置を調節する技術を提供することにある。 The present disclosure has been made under such circumstances, and it is an object of the present disclosure to provide a technique for adjusting the arrangement position of two rectangular substrates arranged side by side.

本開示のアライメント装置は、矩形基板の配置位置を調節するアライメント装置であって、
２枚の矩形基板を隣り合って並べて配置するための第１基板配置領域及び第２基板配置領域が設定された載置台と、
前記第１基板配置領域に配置される矩形基板を構成する４つの角部から選択された１つの角部を第１角部としたとき、前記第１角部を形成する２つの辺部の配置位置を各々規制する第１規制部及び第２規制部と、
前記第１角部を形成する２つの辺部と対向する方向から、前記第１規制部及び前記第２規制部へ向けて矩形基板を押し当てる第１押し当て部と、
前記第２基板配置領域に配置される矩形基板を構成する４つの角部から選択された１つの角部を第２角部としたとき、前記第２角部を形成する２つの辺部の配置位置を各々規制する第３規制部及び第４規制部と、
前記第２角部を形成する２つの辺部と対向する方向から、前記第３規制部及び前記第４規制部へ向けて矩形基板を押し当てる第２押し当て部と、
前記第１角部及び前記第２角部から、前記２枚の矩形基板の並び方向と交差する方向へ伸びる２つの辺部の離間間隔及びこれらの辺の成す角度を変化させるために、前記第１規制部～前記第４規制部を各々移動させる移動機構とを備え、
前記移動機構は、前記離間間隔及び前記角度の設定値を変更することが可能である。
An alignment apparatus of the present disclosure is an alignment apparatus that adjusts the placement position of a rectangular substrate,
a mounting table having a first substrate placement area and a second substrate placement area for arranging two rectangular substrates side by side;
When one corner selected from four corners forming a rectangular substrate arranged in the first substrate placement area is defined as a first corner, arrangement of two side portions forming the first corner. a first restricting portion and a second restricting portion that respectively restrict the position;
a first pressing portion that presses the rectangular substrate toward the first restricting portion and the second restricting portion from a direction facing the two side portions forming the first corner;
When one corner selected from four corners forming a rectangular substrate arranged in the second substrate placement area is defined as a second corner, arrangement of two side portions forming the second corner. a third restricting portion and a fourth restricting portion that respectively restrict the position;
a second pressing portion that presses the rectangular substrate toward the third restricting portion and the fourth restricting portion from a direction facing the two side portions forming the second corner;
In order to change the distance between two side portions extending from the first corner portion and the second corner portion in a direction intersecting the direction in which the two rectangular substrates are arranged and the angle formed by these sides, a moving mechanism for moving each of the first restricting portion to the fourth restricting portion ;
The moving mechanism can change the set values of the separation interval and the angle .

本開示によれば、並べて配置された２枚の矩形基板の配置位置を調節することができる。 According to the present disclosure, it is possible to adjust the arrangement position of two rectangular substrates arranged side by side.

一実施の形態に係る真空処理装置の平面図である。1 is a plan view of a vacuum processing apparatus according to one embodiment; FIG. 一実施の形態に係るロードロック室の平面図である。1 is a plan view of a load lock chamber according to one embodiment; FIG. 一実施の形態に係る中央規制部の平面図である。It is a top view of the central control part which concerns on one embodiment. 一実施の形態に係る中央規制部の作用を示す説明図である。FIG. 5 is an explanatory diagram showing the action of the central restricting portion according to one embodiment; 一実施の形態に係る中央規制部の作用を示す説明図である。FIG. 5 is an explanatory diagram showing the action of the central restricting portion according to one embodiment; 一実施の形態に係る中央規制部の作用を示す説明図である。FIG. 5 is an explanatory diagram showing the action of the central restricting portion according to one embodiment; 一実施の形態に係るロードロック室の作用を示す説明図である。FIG. 4 is an explanatory diagram showing the operation of the load lock chamber according to one embodiment; 一実施の形態に係るロードロック室の作用を示す説明図である。FIG. 4 is an explanatory diagram showing the operation of the load lock chamber according to one embodiment; 一実施の形態に係るロードロック室の作用を示す説明図である。FIG. 4 is an explanatory diagram showing the operation of the load lock chamber according to one embodiment; ガラス基板の配置位置の調節の一例を説明する説明図である。It is explanatory drawing explaining an example of adjustment of the arrangement position of a glass substrate. ガラス基板の配置位置の調節の一例を説明する説明図である。It is explanatory drawing explaining an example of adjustment of the arrangement position of a glass substrate. ガラス基板の配置位置の調節の一例を説明する説明図である。It is explanatory drawing explaining an example of adjustment of the arrangement position of a glass substrate. ガラス基板の配置位置の調節の一例を説明する説明図である。It is explanatory drawing explaining an example of adjustment of the arrangement position of a glass substrate. 真空処理装置の他の例を示す平面図である。FIG. 5 is a plan view showing another example of the vacuum processing apparatus; アライメント方式の他の例を示す模式図である。It is a schematic diagram which shows the other example of an alignment system. アライメント方式の他の例を示す模式図である。It is a schematic diagram which shows the other example of an alignment system. アライメント方式の他の例を示す模式図である。It is a schematic diagram which shows the other example of an alignment system. アライメント方式の他の例を示す模式図である。It is a schematic diagram which shows the other example of an alignment system. アライメント方式の他の例を示す模式図である。It is a schematic diagram which shows the other example of an alignment system.

本開示に係るアライメント装置の一実施形態を適用した基板処理装置である真空処理装置について説明する。図１に示すように真空処理装置は、大気搬送モジュールである大気搬送室１１、ロードロックモジュールであるロードロック室１２及び真空搬送モジュールである真空搬送室１３がこの順番に接続されて構成されている。以下明細書中では、ロードロック室１２に対して、真空搬送室１３が接続されている方向を前方側、大気搬送室１１が接続されている方向を後方側とし、後方側から前方側を見て、夫々左右を左手側、右手側として説明する。 A vacuum processing apparatus, which is a substrate processing apparatus to which an alignment apparatus according to an embodiment of the present disclosure is applied, will be described. As shown in FIG. 1, the vacuum processing apparatus is configured by connecting an atmospheric transfer chamber 11 as an atmospheric transfer module, a load lock chamber 12 as a load lock module, and a vacuum transfer chamber 13 as a vacuum transfer module in this order. there is In the following specification, the direction in which the vacuum transfer chamber 13 is connected to the load lock chamber 12 is defined as the front side, and the direction in which the atmospheric transfer chamber 11 is connected is defined as the rear side, and the front side is viewed from the rear side. The left and right sides will be described as the left and right sides, respectively.

大気搬送室１１の左右には、各々矩形基板であるガラス基板Ｇの搬送容器Ｃが載置されるロードポート１４が設けられている。搬送容器Ｃ内には、複数枚のガラス基板Ｇが上下に間隔を空けて多段に配置可能にされている。また真空搬送室１３は、例えば平面視矩形に構成され、側面のうち後方側の面を除いた３面に夫々基板処理モジュールとして真空処理モジュール９が接続されている。大気搬送室１１及び真空搬送室１３には、夫々、ガラス基板Ｇを搬送する基板搬送機構である搬送アーム１５、１６が設けられている。 On the left and right sides of the atmospheric transfer chamber 11, there are provided load ports 14 in which transfer containers C for glass substrates G, which are rectangular substrates, are placed. In the transport container C, a plurality of glass substrates G can be arranged in multiple stages with a space therebetween in the vertical direction. The vacuum transfer chamber 13 is, for example, rectangular in plan view, and vacuum processing modules 9 as substrate processing modules are connected to three side surfaces of the side surfaces excluding the rear side surface. The atmospheric transfer chamber 11 and the vacuum transfer chamber 13 are provided with transfer arms 15 and 16, which are substrate transfer mechanisms for transferring the glass substrate G, respectively.

大気搬送室１１に設けられた搬送アーム１５は、基台１５ｂと、２枚のガラス基板Ｇを先端側及び基端側に保持する基板保持部１５ａと、を備えている。基台１５ｂは例えば鉛直軸周りに回転自在に構成され、基板保持部１５ａは、基台１５ｂに対して進退自在に構成されている。
真空搬送室１３に設けられる搬送アーム１６は、例えば鉛直軸周りに回転及び伸縮可能な関節アームで構成されたアーム部１６ｂの先端に２枚のガラス基板Ｇを先端側と基端側とに保持する基板保持部１６ａが角度調整可能に設けられている。搬送アーム１６は、基板保持部１６ａ及びアーム部１６ｂを駆動することによりガラス基板Ｇを受け渡す位置へ移動できるように構成されている。 The transfer arm 15 provided in the atmosphere transfer chamber 11 includes a base 15b and a substrate holder 15a that holds two glass substrates G on the front end side and the base end side. The base 15b is configured to be rotatable around, for example, a vertical axis, and the substrate holder 15a is configured to move forward and backward with respect to the base 15b.
The transfer arm 16 provided in the vacuum transfer chamber 13 holds the two glass substrates G at the distal end side and the proximal end side at the distal end of the arm portion 16b which is composed of, for example, a joint arm that can rotate and extend around a vertical axis. A substrate holding portion 16a is provided so that the angle can be adjusted. The transport arm 16 is configured to move to a position for transferring the glass substrate G by driving the substrate holding portion 16a and the arm portion 16b.

真空処理モジュール９としては、例えばプラズマ処理装置が設けられている。この真空処理モジュール９は、真空容器９０内に例えば２枚のガラス基板Ｇが並べて載置される載置台９１を備えている。載置台９１には、例えば真空容器９０内に設けられたシャワーヘッドとの間にプラズマを発生させるための電極が埋設されている（シャワーヘッド及び電極はいずれも不図示）。 A plasma processing apparatus, for example, is provided as the vacuum processing module 9 . The vacuum processing module 9 includes a mounting table 91 on which, for example, two glass substrates G are placed side by side in a vacuum chamber 90 . An electrode for generating plasma is embedded in the mounting table 91, for example, between it and a shower head provided in the vacuum vessel 90 (both the shower head and the electrode are not shown).

上述の概略構成を備える基板処理装置において、ロードポート１４に搬送容器Ｃが載置されたとき、当該搬送容器Ｃの各段には、ガラス基板Ｇが２枚ずつ並べて収納されている。このとき各段のガラス基板Ｇは、その長辺を、搬送容器Ｃ内への基板保持部１５ａの進入方向と交差する方向に向けて配置されている。大気搬送室１１に設けられた搬送アーム１５は、隣り合って並ぶ２枚のガラス基板Ｇを、その先端側と基端側とに受け取る。そして２枚のガラス基板Ｇをロードロック室１２内の後述する載置台２０に前後方向に並べて受け渡す。 In the substrate processing apparatus having the above-described schematic configuration, when the transfer container C is placed on the load port 14, each stage of the transfer container C accommodates two glass substrates G side by side. At this time, the glass substrates G in each stage are arranged so that their long sides are oriented in a direction intersecting with the direction in which the substrate holders 15a enter the transport container C. As shown in FIG. A transfer arm 15 provided in the atmosphere transfer chamber 11 receives two glass substrates G arranged side by side on the front end side and the base end side thereof. Then, the two glass substrates G are arranged in the front-rear direction and transferred to a mounting table 20 described later in the load lock chamber 12 .

一方、真空搬送室１３側の搬送アーム１６は、２枚のガラス基板Ｇを、その先端側と基端側とに並ぶように受け取り、各真空処理モジュール９に受け渡す。
具体的には、搬送アーム１６を搬送対象の真空処理モジュール９に対向するように回転した後、アーム部１６ｂを載置台９１に向かって延伸させる処理を行う。従って各真空処理モジュール９においては、２枚のガラス基板Ｇが、真空搬送室１３側から見て手前側と奥手側とに並べて受け渡される。 On the other hand, the transfer arm 16 on the side of the vacuum transfer chamber 13 receives the two glass substrates G so as to line up on the front end side and the base end side, and transfers them to each vacuum processing module 9 .
Specifically, after rotating the transfer arm 16 so as to face the vacuum processing module 9 to be transferred, the arm portion 16 b is extended toward the mounting table 91 . Therefore, in each vacuum processing module 9, two glass substrates G are handed over side by side as viewed from the vacuum transfer chamber 13 side.

このような真空処理モジュール９においては、搬送アーム１６に対して各ガラス基板Ｇの搬送先を記憶させるティーチングを行うことで、各載置台９１上のより正確な位置へ搬送を行う取り組みがなされていた。そしてティーチングの結果を正確に実行させる前提として、真空処理装置では、例えばロードロック室１２における各ガラス基板Ｇの配置位置の位置合わせをするアライメントを行っていた。 In such a vacuum processing module 9, an attempt is made to transfer the glass substrates G to more accurate positions on the respective mounting tables 91 by teaching the transfer arm 16 to store the transfer destination of each glass substrate G. rice field. As a premise for accurately executing teaching results, in the vacuum processing apparatus, for example, alignment for aligning the arrangement positions of the glass substrates G in the load lock chamber 12 is performed.

しかしながら搬送アーム１６により各真空処理モジュール９にガラス基板Ｇを搬送するにあたって、各真空処理モジュール９の相対位置を同一に揃えることは困難であり、わずかに位置ずれが生じる。さらには近年ガラス基板Ｇの大型化に伴い、装置が大型化している。そのため装置を構成する部品の設置公差の積み上げによる誤差、熱膨張による誤差、装置を組み上げる際の誤差などの累積値が大きくなり、搬送精度に対して無視できない大きさとなる場合がある。またティーチングでは、搬送アーム１６の鉛直軸周りの角度θ、アーム部１６ｂの伸縮距離ｒを調節することによりガラス基板Ｇの載置位置を調節するため、２枚のガラス基板Ｇの個別の配置位置の調節に限界がある。この結果、載置台９１に対して各ガラス基板Ｇを十分に正確な位置に載置できないおそれも懸念される。 However, when transferring the glass substrate G to each vacuum processing module 9 by the transfer arm 16, it is difficult to align the relative positions of the respective vacuum processing modules 9, and a slight positional deviation occurs. Furthermore, in recent years, as the size of the glass substrate G has increased, the size of the apparatus has increased. As a result, accumulated values such as errors due to accumulation of installation tolerances of parts constituting the apparatus, errors due to thermal expansion, errors when assembling the apparatus, and the like increase, and may become unignorable relative to the transfer accuracy. In the teaching, since the placement position of the glass substrate G is adjusted by adjusting the angle θ of the transfer arm 16 about the vertical axis and the expansion/contraction distance r of the arm portion 16b, the two glass substrates G can be placed in separate positions. There are limits to the adjustment of As a result, there is a concern that each glass substrate G may not be mounted on the mounting table 91 at a sufficiently accurate position.

そこで本開示に係る真空処理装置においては、ロードロック室１２にて、アライメントを行うときに、２枚のガラス基板Ｇの配置位置を個別に調節できるように構成している。図２は、ロードロック室１２の構成例を示している。ロードロック室１２は、搬入出口２２、２３を介して大気搬送室１１、真空搬送室１３と接続された真空容器２００を備え、図示しないゲートバルブにより搬入出口２２、２３を閉じた状態で内部雰囲気を大気雰囲気と真空雰囲気との間で切り替えることができるように構成されている。 Therefore, in the vacuum processing apparatus according to the present disclosure, the arrangement positions of the two glass substrates G can be individually adjusted in the load lock chamber 12 when alignment is performed. FIG. 2 shows a configuration example of the load lock chamber 12. As shown in FIG. The load-lock chamber 12 includes a vacuum vessel 200 connected to the atmospheric transfer chamber 11 and the vacuum transfer chamber 13 via loading/unloading ports 22 and 23, and the internal atmosphere is maintained while the loading/unloading ports 22 and 23 are closed by gate valves (not shown). can be switched between an air atmosphere and a vacuum atmosphere.

真空容器２００内には、載置台２０が設けられている。載置台２０には、２枚のガラス基板Ｇを、前後方向に隣り合って並べて配置するための基板配置領域２１ａ、２１ｂが設定されている。これらの基板配置領域２１ａ、２１ｂには、基板処理装置の前後方向と交差する方向に長辺を向けて、これらのガラス基板Ｇが配置される。以下明細書中では、前方側の基板配置領域を第１基板配置領域２１ａ、後方側の基板配置領域を第２基板配置領域２１ｂというものとする。 A mounting table 20 is provided in the vacuum vessel 200 . The mounting table 20 is provided with substrate placement regions 21a and 21b for arranging two glass substrates G side by side in the front-rear direction. These glass substrates G are arranged in these substrate arrangement areas 21a and 21b with their long sides facing in a direction crossing the front-rear direction of the substrate processing apparatus. In the following specification, the front side board placement area is referred to as the first board placement area 21a, and the rear side board placement area is referred to as the second board placement area 21b.

また載置台２０には、ガラス基板Ｇの配置位置を規制するための規制部３、７と、規制部３、７に向けてガラス基板Ｇを押し当てる押し当て部８と、が設けられている。
図２に示す例では、第１基板配置領域２１ａに載置されるガラス基板Ｇを構成する４つの角部のうち、右手側後方（図２に向かって第１基板配置領域２１ａの右下）の角部は規制部３、７により規制される第１角部ｃ１に選択されている。そして第１角部ｃ１を形成する２つの辺部（第１辺部ｓ１、第２辺部ｓ２）を規制するように規制部３、７が設けられている。また第２基板配置領域２１ｂに載置されるガラス基板Ｇを構成する４つの角部のうち、右手側前方（図２に向かって第２基板配置領域２１ｂの右上）の角部が第２角部ｃ２に選択される。第２角部ｃ２を形成する２つの辺部（第３辺部ｓ３、第４辺部ｓ４）の配置位置を規制するように規制部３、７が設けられている。
ここで上述の規制部３は、図２に示すように第１辺部ｓ１と第３辺部ｓ３とを同時に規制するための、２枚のガラス基板Ｇの隙間に配置された中央規制部３として構成されている。この例では中央規制部３は、前記隙間の左右の端部付近に夫々１つ設けられている。一方、第２辺部ｓ２と第４辺部ｓ４を夫々規制する側方規制部７（７ａ、７ｂ）は、互いに独立して設けられている。 Further, the mounting table 20 is provided with regulating portions 3 and 7 for regulating the arrangement position of the glass substrate G, and a pressing portion 8 for pressing the glass substrate G against the regulating portions 3 and 7. .
In the example shown in FIG. 2, of the four corners forming the glass substrate G to be placed in the first substrate placement area 21a, the rear right side (lower right of the first substrate placement area 21a as viewed in FIG. 2). is selected as the first corner c1 that is regulated by the regulating portions 3 and 7. As shown in FIG. Regulating portions 3 and 7 are provided to regulate two side portions (first side portion s1 and second side portion s2) forming the first corner c1. Further, of the four corners forming the glass substrate G placed in the second substrate placement area 21b, the right-hand front corner (upper right of the second substrate placement area 21b as viewed in FIG. 2) is the second corner. selected for part c2. Regulating portions 3 and 7 are provided to regulate the arrangement positions of the two side portions (the third side portion s3 and the fourth side portion s4) forming the second corner c2.
Here, as shown in FIG. 2, the regulation portion 3 described above is the central regulation portion 3 arranged in the gap between the two glass substrates G for simultaneously regulating the first side portion s1 and the third side portion s3. is configured as In this example, one center restricting portion 3 is provided near each of the left and right ends of the gap. On the other hand, the lateral regulation portions 7 (7a, 7b) that respectively regulate the second side portion s2 and the fourth side portion s4 are provided independently of each other.

さらに第１基板配置領域２１ａに着目したとき、載置台２０には、第１角部ｃ１を形成する２つの辺部ｓ１、ｓ２と対向する方向から中央規制部３、側方規制部７ａへ向けて前方側のガラス基板Ｇを押し当てるように押し当て部８として長辺側押し当て部８ａ、短辺側押し当て部８ｂが設けられている。一方、第２基板配置領域２１ｂに着目したとき、載置台２０には、第２角部ｃ２を形成する２つの辺部ｓ３、ｓ４と対向する方向から中央規制部３、側方規制部７ｂへ向けて前方側のガラス基板Ｇを押し当てるように押し当て部８として長辺側押し当て部８ｃ、短辺側押し当て部８ｄが設けられている。 Further, when focusing on the first substrate placement region 21a, the mounting table 20 has two side portions s1 and s2 forming the first corner portion c1, which are directed toward the central regulation portion 3 and the side regulation portions 7a. A long-side pressing portion 8a and a short-side pressing portion 8b are provided as the pressing portion 8 so as to press the glass substrate G on the front side. On the other hand, when focusing on the second substrate placement region 21b, the mounting table 20 has two side portions s3 and s4 forming the second corner c2, and from the direction facing the two side portions s3 and s4 to the central regulating portion 3 and the side regulating portion 7b. A long-side pressing portion 8c and a short-side pressing portion 8d are provided as the pressing portion 8 so as to press the glass substrate G on the front side.

中央規制部３について、図３を参照して説明する。なお図３は、後方から前方を見て右手側に配置された中央規制部３を示し、図３中のＸ軸は、真空搬送装置の左から右に向かう方向（左右方向）、Ｙ軸は、真空搬送装置の後方側から前方側に向かう方向（前後方向）を示している。なお、左手側に配置された中央規制部３は、例えば載置台２０を平面視したときの中心位置周りに、右手側の中央規制部３とは１８０°回転対称に配置される。 The central restricting portion 3 will be described with reference to FIG. Note that FIG. 3 shows the central restricting portion 3 arranged on the right hand side when viewed from the rear to the front, the X axis in FIG. , the direction from the rear side to the front side of the vacuum transfer device (front-rear direction). Note that the left-hand central regulation portion 3 is arranged 180° rotationally symmetrical with the right-hand central regulation portion 3 around the center position when the mounting table 20 is viewed in plan, for example.

中央規制部３は、前後方向に細長い、台形板状の基体３０を備えている。基体３０は、例えば前後方向に伸びる図示しないガイドレールに沿って移動自在に構成されている。基体３０の左右の両辺は、右手側よりも左手側の方が長くなっていて、基体３０の後方側にくさび状の鋭角が形成されている。また基体３０の上面における後方端の位置には、前記鋭角によって形成される斜め方向に延びる辺に沿って溝部３３が形成されている。 The central restricting portion 3 includes a trapezoidal plate-like base 30 elongated in the front-rear direction. The base 30 is configured to be movable along, for example, a guide rail (not shown) extending in the front-rear direction. Both the left and right sides of the base 30 are longer on the left hand side than on the right hand side, and a wedge-shaped acute angle is formed on the rear side of the base 30 . A groove portion 33 is formed along the obliquely extending side formed by the acute angle at the position of the rear end of the upper surface of the base body 30 .

溝部３３には、上下方向に伸びる突起部３５が挿入されている。突起部３５は、右から左に向かって伸び、先端が前方に向かって屈曲した梁状部材３４ａの先端の下面に接続されている。梁状部材３４ａの基端側は、例えば載置台２０に固定された第１伸縮機構３４に接続され、第１伸縮機構３４により梁状部材３４ａを伸縮させることにより、突起部３５は、溝部３３内を移動自在に構成されている。 A projection 35 extending vertically is inserted into the groove 33 . The projecting portion 35 extends from right to left and is connected to the lower surface of the tip of a beam member 34a whose tip is bent forward. The base end side of the beam-like member 34a is connected to, for example, a first expansion/contraction mechanism 34 fixed to the mounting table 20, and the first expansion/contraction mechanism 34 expands and contracts the beam-like member 34a. It is configured to be movable inside.

さらに基体３０の上方には、既述の梁状部材３４ａの基端側と同じ、左右方向に伸びる梁状部材３１ａが設けられ、梁状部材３１ａの左手側の端部には上方に向かって突出する突起部３２が設けられている。梁状部材３１ａの基端側は、例えば載置台２０に固定された第２伸縮機構３１に接続され、第２伸縮機構３１が伸縮することにより突起部３２が左右方向（Ｘ軸方向）に移動するように構成されている。 Furthermore, above the base 30, a beam-like member 31a extending in the left-right direction is provided, which is the same as the base end side of the beam-like member 34a described above. A projecting portion 32 is provided. The base end side of the beam-shaped member 31a is connected to, for example, a second elastic mechanism 31 fixed to the mounting table 20. As the second elastic mechanism 31 expands and contracts, the protrusion 32 moves in the left-right direction (X-axis direction). is configured to

この梁状部材３１ａのさらに上方には、前後方向に伸びる概略矩形板状の板状部材４０が設けられている。板状部材４０は、基体３０の上面に設けられた左右方向（Ｘ軸方向）に伸びる図示しないガイドレールに沿って、移動自在に構成されている。板状部材４０の右辺寄りの位置には、板状部材４０を貫通し、前後方向（Ｙ軸方向）に伸びる長穴４２が形成され、長穴４２には、板状部材４０の下面側から既述の突起部３２が挿入されている。また板状部材４０の左辺寄りの位置には、上方に向かって突出するように円柱状の移動体４１が設けられている。 Further above the beam-like member 31a, a substantially rectangular plate-like plate-like member 40 extending in the front-rear direction is provided. The plate member 40 is configured to be movable along a guide rail (not shown) provided on the upper surface of the base 30 and extending in the left-right direction (X-axis direction). At a position near the right side of the plate-like member 40, an elongated hole 42 is formed that penetrates the plate-like member 40 and extends in the front-rear direction (Y-axis direction). The previously mentioned projection 32 is inserted. At a position near the left side of the plate-like member 40, a cylindrical moving body 41 is provided so as to protrude upward.

板状部材４０の更に上方には、２つのブロック体５１、５２が前後方向に並ぶように配置される。各ブロック体５１、５２は、基体３０の上面に設けられた前後方向に伸びる図示しないガイドレールに沿って、移動自在に支持されている。各ブロック体５１、５２は、各々概略矩形に構成され、各ブロック体５１、５２の長辺方向が左右方向に向かう姿勢に配置されている。前方側のブロック体５１の後方側左端の部位は、後方側に向かって突出した突出部５３となっており、当該突出部５３の上面に円柱状のピン５５が上方に向かって伸びるように設けられている。そして後方側のブロック体５２の前方側左端の部位は、前方側のブロック体５１の突出部５３の形状に対応して窪んだ形状の切り欠きが形成されている。 Further above the plate-like member 40, two block bodies 51 and 52 are arranged side by side in the front-rear direction. Each of the block bodies 51 and 52 is movably supported along a guide rail (not shown) provided on the upper surface of the base 30 and extending in the front-rear direction. Each of the block bodies 51 and 52 is configured in a substantially rectangular shape, and arranged so that the long side direction of each of the block bodies 51 and 52 faces the horizontal direction. The rear left end portion of the block body 51 on the front side is a protruding portion 53 protruding rearward, and a cylindrical pin 55 is provided on the upper surface of the protruding portion 53 so as to extend upward. It is A recessed notch corresponding to the shape of the projecting portion 53 of the front block body 51 is formed at the front left end portion of the rear block body 52 .

また後方側のブロック体５２における窪んだ形状の部位の右手側は、前方側に向かって突出した突出部５４となっており、当該突出部５４の上面に円柱状のピン５６が上方に向かって伸びるように設けられている。そして前方側のブロック体５１には、後方側のブロック体５２の突出部５４の形状に対応して窪んだ形状の切り欠きが形成されている。 The right-hand side of the concave portion of the block body 52 on the rear side is a protruding portion 54 that protrudes forward, and a columnar pin 56 extends upward on the upper surface of the protruding portion 54 . It is designed to extend. The block body 51 on the front side is formed with a recessed notch corresponding to the shape of the projecting portion 54 of the block body 52 on the rear side.

さらに前方側のブロック体５１の後方側における右寄りの部位と、後方側のブロック体５２の前方側における右寄りの部位との隙間には、上面側から見たとき、左手側から右手側に向かって徐々に隙間がテーパー状に広がるテーパー部５７が形成されている。さらにテーパー部５７の右手側は前方側のブロック体５１の面と、後方側のブロック体５２の面との隙間の幅が一定の並行部５８になっている。 Furthermore, in the gap between the rearward right portion of the block body 51 on the front side and the rightward portion on the front side of the rearward block body 52, when viewed from the top side, there is a A tapered portion 57 is formed in which the gap gradually widens in a tapered shape. Further, the right-hand side of the tapered portion 57 forms a parallel portion 58 in which the width of the gap between the surface of the block body 51 on the front side and the surface of the block body 52 on the rear side is constant.

前方側のブロック体５１の左方側寄りの側面に対向する、前方側の位置には、基体３０の上面に起立するように設けられた支持部６１が形成されている。支持部６１の側面には、ブロック体５１に向けて突出するガイドシャフト５９が設けられている。 A support portion 61 is formed so as to stand on the upper surface of the base 30 at a position on the front side facing the left side surface of the block body 51 on the front side. A guide shaft 59 projecting toward the block body 51 is provided on a side surface of the support portion 61 .

また後方側のブロック体５２の左方側寄りの側面に対向する、後方側の位置には、基体３０の上面に起立するように設けられた支持部６２が形成されている。支持部６２の側面には、ブロック体５２に向けて突出するガイドシャフト６０が設けられている。 A support portion 62 is formed so as to stand on the upper surface of the base body 30 at a position on the rear side facing the left side surface of the block body 52 on the rear side. A guide shaft 60 protruding toward the block body 52 is provided on the side surface of the support portion 62 .

また前方側の支持部６１と前方側のブロック体５１との間には、ばね部材６３が設けられ、後方側の支持部６２と後方側のブロック体５２との間には、ばね部材６４が設けられている。これらばね部材６３、６４により、前方側のブロック体５１は、後方側に付勢され、後方側のブロック体５２は、前方側に付勢される。既述のガイドシャフト５９、６０は、各々これらばね部材６３、６４に挿入され、下記に述べるブロック体５１、５２の移動動作をガイドする。 A spring member 63 is provided between the front support portion 61 and the front block body 51, and a spring member 64 is provided between the rear support portion 62 and the rear block body 52. is provided. By these spring members 63 and 64, the block body 51 on the front side is urged rearward, and the block body 52 on the rear side is urged forward. The guide shafts 59 and 60 already described are inserted into these spring members 63 and 64, respectively, and guide the movement of the blocks 51 and 52, which will be described below.

上述の構成を備えたブロック体５１、５２の間には、既述の並行部５８を構成する隙間内に前記移動体４１が位置するように配置されている。各ばね部材６３、６４によって付勢されたブロック体５１、５２は、この移動体４１に接触することにより規制されて静止する。このとき、移動体４１の直径や並行部５８の隙間の幅、各突出部５３、５４の突出長さなどは、移動体４１によって規制された各ブロック体５１、５２上のピン５５、５６が、左右方向（Ｘ軸方向）に沿って並んだ状態となるように設定されている。 Between the block bodies 51 and 52 having the above-described structure, the moving body 41 is arranged so as to be positioned within the gap forming the parallel portion 58 described above. The block bodies 51 and 52 urged by the respective spring members 63 and 64 are regulated by coming into contact with the moving body 41 and stand still. At this time, the diameter of the moving body 41, the width of the gap of the parallel portion 58, the projecting length of each projecting portion 53, 54, etc. are determined by the pins 55, 56 on the block bodies 51, 52 regulated by the moving body 41. , are arranged in the horizontal direction (X-axis direction).

以上の構成を備えた中央規制部３の動作について説明しておく。図４～図６には、図４に記載の中央規制部３を簡略化して記載してある。
例えば図４に示すように、中央規制部３は、ガラス基板Ｇを受け取るときには、梁状部材３４ａの突起部３５が溝部３３の長さ方向中央に位置した状態で待機している。 The operation of the central regulation section 3 having the above configuration will be described. 4 to 6 show the central restricting portion 3 shown in FIG. 4 in a simplified manner.
For example, as shown in FIG. 4, when receiving the glass substrate G, the center regulating portion 3 is on standby with the projecting portion 35 of the beam member 34a positioned at the center of the groove portion 33 in the longitudinal direction.

また移動体４１は、ブロック体５１、５２の隙間の並行部５８に位置している。よって既述のようにブロック体５１、５２上のピン５５、５６は、Ｘ軸方向に並んだ状態となっている。中央規制部３は、この状態にて待機しており、同図中に破線で示す２枚のガラス基板Ｇは、これらのピン５５、５６を挟んで載置される。 Further, the moving body 41 is positioned in a parallel portion 58 between the block bodies 51 and 52 . Therefore, as described above, the pins 55 and 56 on the blocks 51 and 52 are aligned in the X-axis direction. The central regulating portion 3 is on standby in this state, and two glass substrates G indicated by broken lines in the figure are placed with these pins 55 and 56 interposed therebetween.

ガラス基板Ｇが載置されたら、図５に示すように第２伸縮機構３１により移動体４１を左手側に移動させテーパー部５７に進入させる。既述のようにテーパー部５７は、並行部５８よりも隙間の幅が狭く、且つ、左手側に向かうほど次第に隙間が狭くなっている。従って移動体４１が左手側に移動するに従い、ブロック体５１、５２を押し広げる力がかかる。その作用により、両ブロック体５１、５２は、ばね部材６３、６４の付勢力に抗して前後方向に移動する。これらブロック体５１、５２の動きに応じて各ピン５５、５６も前後方向に移動し、両ピン５５、５６間の離間間隔が広がる。 After the glass substrate G is placed, the moving body 41 is moved leftward by the second extension mechanism 31 to enter the taper portion 57 as shown in FIG. As described above, the tapered portion 57 has a gap narrower than that of the parallel portion 58, and the gap gradually narrows toward the left hand side. Therefore, as the moving body 41 moves to the left hand side, a force is applied to spread the block bodies 51 and 52 . By this action, both block bodies 51 and 52 move in the front-rear direction against the biasing force of the spring members 63 and 64 . The pins 55 and 56 also move in the front-rear direction in accordance with the movement of the blocks 51 and 52, and the distance between the pins 55 and 56 increases.

この結果、両ピン５５、５６を挟むように配置されるガラス基板Ｇから見ると、これらのピン５５、５６による各ガラス基板Ｇの規制位置（各ガラス基板Ｇの間隔）が変化する。
このときテーパー部５７内に位置する移動体４１を左手側に移動させるに従い、ブロック体５１、５２の隙間が広げられるため、ピン５５、５６の離間間隔が広くなる。またテーパー部５７に位置する移動体４１を右手側に移動させるに従い、ブロック体５１、５２の間の隙間が狭くなるため、ピン５５、５６の離間間隔が狭くなる。このように移動体４１の位置によりピン５５、５６の離間間隔を調節することができ、各ガラス基板Ｇの規制位置（各ガラス基板Ｇの間隔）を調節することができる。 As a result, when viewed from the glass substrates G arranged so as to sandwich both the pins 55 and 56, the regulating positions of the glass substrates G (interval between the glass substrates G) by the pins 55 and 56 change.
At this time, as the movable body 41 located in the taper portion 57 is moved to the left hand side, the gap between the block bodies 51 and 52 is widened, so that the distance between the pins 55 and 56 is widened. Further, as the moving body 41 located at the tapered portion 57 is moved to the right hand side, the gap between the block bodies 51 and 52 becomes narrower, so that the distance between the pins 55 and 56 becomes narrower. In this manner, the distance between the pins 55 and 56 can be adjusted by the position of the moving body 41, and the regulating positions of the glass substrates G (intervals between the glass substrates G) can be adjusted.

また図６に示すように、中央規制部３は、第１伸縮機構３４を伸縮させることで突起部３５が溝部３３内を左右方向に移動する。一方、溝部３３は、突起部３５の移動方向を斜めに横切るように形成されているので、左右方向に移動する突起部３５が溝部３３の内壁を押し返し、基体３０を前後方向に移動させる力が働く。この結果、第１伸縮機構３４を伸縮させることで両ブロック体５１、５２が基体３０と共に前後方向に移動し、ピン５５、５６によって２枚のガラス基板Ｇを規制する位置を前後方向に移動させることができる。なお、第２の伸縮機構３１、梁状部材３１ａ及び突起部３２は、前後方向（Ｙ軸方向）へ移動できないが、板状部材４０に形成された長穴４２に沿って突起部３２を移動させることで基体３０の前後方向の移動と干渉しないようになっている。 Further, as shown in FIG. 6 , in the central restricting portion 3 , the projecting portion 35 moves in the horizontal direction within the groove portion 33 by extending and contracting the first telescopic mechanism 34 . On the other hand, since the groove portion 33 is formed so as to obliquely cross the moving direction of the protrusion portion 35, the protrusion portion 35 moving in the left-right direction pushes back the inner wall of the groove portion 33, and the force to move the base body 30 in the front-rear direction is generated. work. As a result, by expanding and contracting the first telescopic mechanism 34, both the block bodies 51 and 52 move in the front-rear direction together with the base 30, and the position where the two glass substrates G are regulated by the pins 55 and 56 is moved in the front-rear direction. be able to. The second elastic mechanism 31, the beam-like member 31a, and the protrusion 32 cannot move in the front-rear direction (Y-axis direction), but the protrusion 32 can be moved along the elongated hole 42 formed in the plate-like member 40. By doing so, it does not interfere with the movement of the base body 30 in the front-rear direction.

図２に戻って、上述の構成を備える中央規制部３は、各ピン５５、５６が第１基板配置領域２１ａと、第２基板配置領域２１ｂと、の隙間に配置されるように、載置台２０の左右の位置に設けられている。以下右手側の中央規制部に符号３ａ、左手側の中央規制部に符号３ｂを付して説明する。この例では、左手側の中央規制部３ｂは、右手側の中央規制部３ａを載置台２０の中心部を中心として鉛直軸周りに概ね１８０°回転対称に配置されている。即ち左手側の中央規制部３ｂにおいては、２本のピン５５、５６のうちピン５５が第２基板配置領域２１ｂに載置された後方側のガラス基板Ｇを規制し、ピン５６が第１基板配置領域２１ａに載置された前方側のガラス基板Ｇを規制する。 Returning to FIG. 2, the central regulation portion 3 having the above-described configuration is arranged on the mounting table such that the pins 55 and 56 are arranged in the gap between the first substrate placement area 21a and the second substrate placement area 21b. 20 are provided at left and right positions. In the following description, the central restricting portion on the right hand side is denoted by reference numeral 3a, and the central restricting portion on the left hand side is denoted by reference numeral 3b. In this example, the central restricting portion 3b on the left hand side and the central restricting portion 3a on the right hand side are arranged approximately 180.degree. That is, in the center regulating portion 3b on the left hand side, the pin 55 out of the two pins 55, 56 regulates the rear side glass substrate G placed in the second substrate placement area 21b, and the pin 56 regulates the first substrate. The front side glass substrate G placed in the arrangement area 21a is regulated.

次いで側方規制部７について説明する。側方規制部７は、例えば棒状に構成され、その先端で、ガラス基板Ｇの右手側の辺（第２辺部ｓ２、第４辺部ｓ４）の配置位置を規制するように構成されている。この例では、側方規制部７ａ、７ｂは、第２辺部ｓ２における前方寄りの位置、第４辺部ｓ４における後方寄りの位置を夫々規制できるように配置されている。各側方規制部７ａ、７ｂは、左右方向に移動自在に構成され、ガラス基板Ｇを搬入出する際には、第１基板配置領域２１ａ、第２基板配置領域２１ｂから外れた位置に待機するように構成されている。 Next, the side regulating portion 7 will be described. The side regulating portion 7 is configured, for example, in a rod shape, and is configured to regulate the arrangement position of the right-hand side (the second side s2 and the fourth side s4) of the glass substrate G at its tip. . In this example, the side regulating portions 7a and 7b are arranged so as to regulate the front position of the second side portion s2 and the rearward position of the fourth side portion s4. Each side regulation part 7a, 7b is configured to be movable in the left-right direction, and when the glass substrate G is carried in and out, it stands by at a position outside the first substrate placement area 21a and the second substrate placement area 21b. is configured as

本実施の形態では、第１角部ｃ１、第２角部ｃ２からガラス基板Ｇの並び方向（前後方向）と交差する方向に沿って見た２つの辺部である第１辺部ｓ１、第３辺部ｓ３は、共通の中央規制部３ａ、３ｂ（詳しくはピン５５、５６）を用いて規制される。また第１角部ｃ１、第２角部ｃ２から前後に伸びる２つ辺部である第２辺部ｓ２、第４辺部ｓ４は、夫々側方規制部７（７ａ、７ｂ）により規制される。 In the present embodiment, the first side portion s1 and the second side portion s1, which are two side portions viewed from the first corner portion c1 and the second corner portion c2 along the direction intersecting the direction in which the glass substrates G are arranged (the front-rear direction). The three side portions s3 are regulated using common central regulating portions 3a and 3b (specifically, pins 55 and 56). Further, the second side portion s2 and the fourth side portion s4, which are two side portions extending forward and backward from the first corner portion c1 and the second corner portion c2, are restricted by the side restriction portions 7 (7a and 7b), respectively. .

この場合において、ピン５５、５６を用いて第１基板配置領域２１ａに配置されたガラス基板Ｇの規制を行う２つの中央規制部３ａ、３ｂが第1規制部に相当し、側方規制部７ａが第２規制部に相当する。またピン５６、５５を用いて第２基板配置領域２１ｂに配置されたガラス基板Ｇの規制を行う２つの中央規制部３ａ、３ｂは、第３規制部にも相当し、側方規制部７ｂが第４規制部に相当する。 In this case, the two central regulating portions 3a and 3b for regulating the glass substrate G placed in the first substrate placement region 21a using the pins 55 and 56 correspond to the first regulating portion, and the side regulating portions 7a corresponds to the second regulation part. The two central regulating portions 3a and 3b that regulate the glass substrate G arranged in the second substrate arranging region 21b using the pins 56 and 55 also correspond to the third regulating portion, and the lateral regulating portion 7b It corresponds to the fourth regulation section.

次いで押し当て部８は、先端によりガラス基板Ｇの一辺を側面側から押すことができるように構成され、押す位置に遊びを持たせるために例えばばね部材が設けられている。
この実施の形態では、第１基板配置領域２１ａの前方には、左右に２つの長辺側押し当て部８ａが設けられ、長辺側押し当て部８ａにより第１基板配置領域２１ａに載置されたガラス基板Ｇを押すことにより当該ガラス基板Ｇを中央規制部３ａ、３ｂの各ピン５６、５５に押し当てることができる。また第１基板配置領域２１ａの左手側には、側方規制部７ａに向けて当該ガラス基板Ｇを押し当てることができるように短辺側押し当て部８ｂが設けられている。長辺側押し当て部８ａ、短辺側押し当て部８ｂは、夫々第１辺部対向押し当て部、第２辺部対向押し当て部に相当する。また長辺側押し当て部８ａ及び短辺側押し当て部８ｂは、第１押し当て部に相当する。 Next, the pressing portion 8 is configured so that one side of the glass substrate G can be pressed from the side by the tip thereof, and a spring member, for example, is provided in order to give play to the pressing position.
In this embodiment, two long-side pressing portions 8a are provided on the left and right in front of the first substrate placement area 21a, and the substrate is placed on the first substrate placement area 21a by the long-side pressing portions 8a. By pressing the glass substrate G, the glass substrate G can be pressed against the pins 56 and 55 of the central regulating portions 3a and 3b. A short-side pressing portion 8b is provided on the left hand side of the first substrate placement region 21a so that the glass substrate G can be pressed toward the lateral regulation portion 7a. The long-side pressing portion 8a and the short-side pressing portion 8b correspond to a first side-opposing pressing portion and a second side-opposing pressing portion, respectively. The long-side pressing portion 8a and the short-side pressing portion 8b correspond to the first pressing portion.

一方、第２基板配置領域２１ｂの後方には、左右に２つの長辺側押し当て部８ｃが設けられ、長辺側押し当て部８ｃにより第２基板配置領域２１ｂに載置されたガラス基板Ｇを押すことにより当該ガラス基板Ｇを中央規制部３ａ、３ｂの各ピン５５、５６に押し当てることができる。また第２基板配置領域２１ｂの左手側には、側方規制部７ｂに向けてガラス基板Ｇを押し当てることができるように短辺側押し当て部８ｄが設けられている。長辺側押し当て部８ｃ、短辺側押し当て部８ｄは、夫々第３辺部対向押し当て部、第４辺部対向押し当て部に相当する。また長辺側押し当て部８ｃ及び短辺側押し当て部８ｄは、第２押し当て部に相当する。 On the other hand, two long-side pressing portions 8c are provided on the left and right behind the second substrate placement region 21b, and the glass substrate G placed on the second substrate placement region 21b by the long-side pressing portions 8c. By pressing , the glass substrate G can be pressed against the pins 55 and 56 of the central regulating portions 3a and 3b. A short side pressing portion 8d is provided on the left hand side of the second substrate placement region 21b so that the glass substrate G can be pressed toward the lateral regulation portion 7b. The long-side pressing portion 8c and the short-side pressing portion 8d correspond to the third side-opposing pressing portion and the fourth side-opposing pressing portion, respectively. The long-side pressing portion 8c and the short-side pressing portion 8d correspond to second pressing portions.

ガラス基板Ｇの搬送経路上に設けられている長辺側押し当て部８ａ、８ｃは、例えばガラス基板Ｇをロードロック室１２に搬入出するときには、載置台２０の内部（上面よりも下の位置）にて待機し、ガラス基板Ｇが搬入された後、載置台２０の上方に上昇するように構成されている。また短辺側押し当て部８ｂ、８ｄは、左右方向に移動自在に構成され、ガラス基板Ｇを搬入出する際には、第１基板配置領域２１ａ、第２基板配置領域２１ｂから外れた位置に待機するように構成されている。 For example, when the glass substrate G is carried in and out of the load-lock chamber 12, the long-side pressing portions 8a and 8c provided on the transport path of the glass substrate G are positioned inside the mounting table 20 (at a position below the upper surface). ), and after the glass substrate G is carried in, it is configured to rise above the mounting table 20 . Further, the short-side pressing portions 8b and 8d are configured to be movable in the horizontal direction, and when the glass substrate G is carried in and out, they are positioned outside the first substrate placement region 21a and the second substrate placement region 21b. configured to wait.

真空処理装置は、図１に示すように真空処理装置内におけるガラス基板Ｇの搬送、アライメントを制御する制御部１００を備えている。制御部１００は例えば図示しないＣＰＵと記憶部とを備えたコンピュータからなる。この記憶部には、真空処理装置におけるガラス基板Ｇの搬送スケジュールや、ロードロック室１２におけるアライメントに係るステップ（命令）群が組まれたプログラムが記録されている。またガラス基板Ｇを搬送する真空処理モジュール９毎にガラス基板Ｇを正確な位置に載置するためのアライメントにおけるガラス基板Ｇの配置位置の情報が記憶されている。さらに予め各真空処理モジュール９に合わせたティーチングにより取得された搬送アーム１６の搬送位置に関する情報が記憶されている。このプログラムは、例えばハードディスク、コンパクトディスク、マグネットオプティカルディスク、メモリカードなどの記憶媒体に格納され、そこからコンピュータにインストールされる。 As shown in FIG. 1, the vacuum processing apparatus includes a control section 100 that controls transportation and alignment of the glass substrate G within the vacuum processing apparatus. The control unit 100 is composed of, for example, a computer having a CPU and a storage unit (not shown). In this storage unit, a transfer schedule of the glass substrate G in the vacuum processing apparatus and a program in which a group of steps (instructions) related to alignment in the load lock chamber 12 are assembled are recorded. Further, the information of the arrangement position of the glass substrate G in alignment for placing the glass substrate G at an accurate position is stored for each vacuum processing module 9 that conveys the glass substrate G. FIG. Furthermore, information on the transfer position of the transfer arm 16 acquired by teaching matched to each vacuum processing module 9 is stored in advance. This program is stored in a storage medium such as a hard disk, compact disc, magnetic optical disc, memory card, etc., and is installed in the computer from there.

続いて真空搬送装置の作用について説明する。ガラス基板Ｇを収納した搬送容器Ｃがロードポート１４に載置されると、大気搬送室１１の搬送アーム１５は、２枚のガラス基板Ｇを取り出す。さらにロードロック室１２の搬入出口２２の図示しないゲートバルブを開き、搬送アーム１５をロードロック室１２に進入させて保持した２枚のガラス基板Ｇを第１基板配置領域２１ａ、第２基板配置領域２１ｂに夫々受け渡す。 Next, the action of the vacuum transfer device will be described. When the transfer container C containing the glass substrates G is placed on the load port 14, the transfer arm 15 of the atmospheric transfer chamber 11 takes out the two glass substrates G. As shown in FIG. Further, the gate valve (not shown) of the loading/unloading port 22 of the load-lock chamber 12 is opened, and the transfer arm 15 is moved into the load-lock chamber 12 so that the two glass substrates G held are transferred to the first substrate placement area 21a and the second substrate placement area. 21b respectively.

そして載置台２０にガラス基板Ｇが受け渡されると、ロードロック室１２においては、搬入出口２２を図示しないゲートバルブで閉じ、内部の雰囲気を真空雰囲気に切り替える。この時、制御部１００はロードロック室１２に受け渡したガラス基板Ｇを搬送する真空処理モジュール９に対応したガラス基板Ｇの配置位置の情報を記憶部から読み出す。ロードロック室１２においては、制御部１００から、受け渡されたガラス基板Ｇを搬送する真空処理モジュール９におけるガラス基板Ｇの配置位置の情報を受信する。以下の例では、真空搬送室１３の左手側に接続された真空処理モジュール９内にガラス基板Ｇを配置するための配置位置の情報を取得した場合について説明する。そしてロードロック室１２では、取得した配置位置の情報に応じてガラス基板Ｇのアライメントが行われる。 When the glass substrate G is transferred to the mounting table 20, in the load lock chamber 12, the loading/unloading port 22 is closed by a gate valve (not shown) to switch the internal atmosphere to a vacuum atmosphere. At this time, the control unit 100 reads from the storage unit information on the arrangement position of the glass substrate G corresponding to the vacuum processing module 9 that transports the glass substrate G delivered to the load lock chamber 12 . In the load lock chamber 12 , information on the arrangement position of the glass substrate G in the vacuum processing module 9 that transports the transferred glass substrate G is received from the control unit 100 . In the following example, a case will be described in which information on the arrangement position for arranging the glass substrate G in the vacuum processing module 9 connected to the left hand side of the vacuum transfer chamber 13 is obtained. Then, in the load-lock chamber 12, alignment of the glass substrate G is performed according to the acquired information on the arrangement position.

ロードロック室１２におけるアライメントについて図７～図９を参照して説明する。なお図７～図９では、規制部３、７及び押し当て部８に併記した実線の矢印は、各ステップにてガラス基板Ｇを規制し、または押すために移動するものを示し、破線の矢印は、ガラス基板Ｇを規制する位置または押す位置にて停止しているものを示している。 Alignment in the load lock chamber 12 will be described with reference to FIGS. 7 to 9. FIG. In FIGS. 7 to 9, the solid-line arrows written together with the regulating portions 3 and 7 and the pressing portion 8 indicate the movement for regulating or pushing the glass substrate G at each step, and the broken-line arrows indicates that the glass substrate G is stopped at a position for regulating it or a position for pushing it.

まず図７に示すように、２枚のガラス基板Ｇが第１基板配置領域２１ａ、第２基板配置領域２１ｂに載置されると、左右の中央規制部３ａ、３ｂ及び側方規制部７ａ、７ｂの位置合わせを行い、各ガラス基板Ｇの規制位置を設定する。次いで図８に示すようにガラス基板Ｇの前方側及び後方側に位置する長辺側押し当て部８ａ、８ｃを載置台２０の上面へ上昇させる。しかる後、前方側のガラス基板Ｇを後方側の中央規制部３ａ、３ｂに向かって押し当てると共に、後方側のガラス基板Ｇを前方側の中央規制部３ａ、３ｂに向かって押し当てる(第１押し当て工程及び第３押し当て工程に相当)。これにより２枚のガラス基板Ｇの前後方向の位置が定まる。次いで図９に示すように短辺側押し当て部８ｂ、８ｄをガラス基板Ｇ側に移動させて、各ガラス基板Ｇを側方規制部７ａ、７ｂに押し当てる(第２押し当て工程及び第４押し当て工程に相当)。これにより各ガラス基板Ｇの左右方向の位置が規制される。 First, as shown in FIG. 7, when the two glass substrates G are placed in the first substrate placement area 21a and the second substrate placement area 21b, the left and right central regulation portions 3a and 3b and the side regulation portions 7a, 7b are aligned, and the regulation position of each glass substrate G is set. Next, as shown in FIG. 8, the long side pressing portions 8a and 8c located on the front side and the rear side of the glass substrate G are raised to the upper surface of the mounting table 20. Then, as shown in FIG. Thereafter, the glass substrate G on the front side is pressed against the central regulation portions 3a and 3b on the rear side, and the glass substrate G on the rear side is pressed against the central regulation portions 3a and 3b on the front side (first corresponding to the pressing process and the third pressing process). Thereby, the positions of the two glass substrates G in the front-rear direction are determined. Next, as shown in FIG. 9, the short side pressing portions 8b and 8d are moved toward the glass substrate G, and the respective glass substrates G are pressed against the side regulating portions 7a and 7b (second pressing step and fourth pressing step). equivalent to the pressing process). Thereby, the position of each glass substrate G in the left-right direction is regulated.

さらに本例のロードロック室１２においては、中央規制部３におけるピン５５、５６の離間間隔と、各中央規制部３の前後方向の配置位置と、を調節することができる。この結果、各ガラス基板Ｇの配置位置を個別に調節することができる。言い替えると、第１角部ｃ１及び第２角部ｃ２から２枚のガラス基板Ｇの並び方向と交差する方向に伸びる２つの辺部（第１辺部ｓ１、第３辺部ｓ３）の離間間隔及びこれらの辺の成す角度を変化させることにより各ガラス基板Ｇの配置位置を個別に調節することができる。これにより搬送容器Ｃの各段に２枚ずつ並べて収納されているガラス基板Ｇの相対的な配置関係を搬送先の各真空処理モジュール９に合わせたものに変更することができる。 Furthermore, in the load-lock chamber 12 of this example, the spacing between the pins 55 and 56 in the central regulation portion 3 and the arrangement position of each central regulation portion 3 in the front-rear direction can be adjusted. As a result, the arrangement position of each glass substrate G can be individually adjusted. In other words, the distance between the two side portions (the first side portion s1 and the third side portion s3) extending from the first corner portion c1 and the second corner portion c2 in the direction intersecting the arrangement direction of the two glass substrates G And by changing the angle formed by these sides, the arrangement position of each glass substrate G can be individually adjusted. As a result, the relative positional relationship of the glass substrates G, which are stored two by two in each stage of the transport container C, can be changed to match the vacuum processing module 9 to which the glass substrates are transported.

各ガラス基板Ｇの配置位置を個別に調節する手法について図１０～図１３を参照して説明する。以下図１０～図１３の説明において、中央規制部３の２本のピン５５、５６の離間間隔とは、Ｙ軸方向における前方側のピン５５の前端の位置から後方側のピン５６の後端の位置までの幅を示すものとする。また図中の破線は、後述の基準位置における前方側のガラス基板Ｇの後方側の辺部（第１辺部ｓ１）の位置ｓ１０、及び後方側のガラス基板Ｇの前方側の辺部（第３辺部ｓ３）の位置ｓ３０を示している。 A technique for individually adjusting the arrangement position of each glass substrate G will be described with reference to FIGS. 10 to 13. FIG. 10 to 13, the separation distance between the two pins 55 and 56 of the central restricting portion 3 means the distance between the front end of the pin 55 on the front side and the rear end of the pin 56 on the rear side in the Y-axis direction. shall indicate the width to the position of The dashed lines in the drawing indicate the position s10 of the rear side (first side s1) of the front glass substrate G at a reference position to be described later, and the position s10 of the front side of the rear glass substrate G (first side s1). The position s30 of the three sides s3) is shown.

例えば図１０に示すように、左右の中央規制部３は、夫々のピン５５、５６の離間間隔を同じ距離、例えば離間間隔を２０ｍｍに調節すると共に、２本のピンのＹ軸方向の位置を揃えることで２枚のガラス基板Ｇを互いに平行に配置することができる。ここでは、図１０の状態を基準位置ｓ１０、ｓ３０として説明する。
そして図１１に示すように各中央規制部３のピン５５、５６の離間間隔を２０ｍｍに設定し、例えば左手側の中央規制部３ｂを前方側に移動させると共に、右手側の中央規制部３ａを後方側に移動させる。これにより基準位置にある各ガラス基板Ｇを各々のガラス基板Ｇの中心を中心として、上方から見て時計回り方向に回転した位置に配置することができる。 For example, as shown in FIG. 10, the left and right central regulating portions 3 adjust the spacing between the pins 55 and 56 to the same distance, for example, 20 mm, and adjust the positions of the two pins in the Y-axis direction. By aligning them, the two glass substrates G can be arranged parallel to each other. Here, the state of FIG. 10 will be described as reference positions s10 and s30.
Then, as shown in FIG. 11, the distance between the pins 55 and 56 of each central regulating portion 3 is set to 20 mm, for example, the left central regulating portion 3b is moved forward, and the right central regulating portion 3a is moved forward. Move it backwards. As a result, each glass substrate G at the reference position can be arranged at a position rotated clockwise about the center of each glass substrate G as viewed from above.

さらに図１２に示すように各中央規制部３ａ、３ｂのピン５５、５６の離間間隔を２０ｍｍに設定し、両方の中央規制部３を例えば前方に同じ距離移動させることで各ガラス基板Ｇを平行に配置した状態で、基準位置ｓ１０、ｓ３０から前後方向に移動させることができる（図１２は、前方向に移動させた状態を示している）。
また図１３に示すように左手側の中央規制部３ｂのピン５５、５６の離間間隔を例えば３０ｍｍ、右手側の中央規制部３ａのピン５５、５６の離間間隔を２０ｍｍとすると共に、左手側の中央規制部３ｂの後方側のピン５５と、右手側の中央規制部３ａの後方側のピン５６との前後方向の位置を揃える。これにより前方側のガラス基板Ｇのみを上方から見て時計回り方向に回転した位置に配置し、後方側のガラス基板Ｇを基準位置と平行な状態とすることができる。 Further, as shown in FIG. 12, the distance between the pins 55 and 56 of the central regulating portions 3a and 3b is set to 20 mm, and both the central regulating portions 3 are moved forward by the same distance, for example, so that the glass substrates G are parallel. can be moved in the front-rear direction from the reference positions s10 and s30 (FIG. 12 shows a state in which it is moved in the front direction).
Further, as shown in FIG. 13, the spacing between the pins 55 and 56 of the central restricting portion 3b on the left hand side is, for example, 30 mm, and the spacing between the pins 55 and 56 of the central restricting portion 3a on the right hand side is set to 20 mm. The pin 55 on the rear side of the central restricting portion 3b and the pin 56 on the rear side of the central restricting portion 3a on the right hand side are aligned in the longitudinal direction. As a result, only the glass substrate G on the front side can be arranged at a position rotated clockwise when viewed from above, and the glass substrate G on the rear side can be placed in a state parallel to the reference position.

このように中央規制部３におけるピン５５、５６の離間間隔と、位置とを調節することにより、各ガラス基板Ｇの配置位置を個別に調節することができる。また合わせて第２辺部ｓ２、第４辺部ｓ４を規制している側方規制部７ａ、７ｂの左右方向の位置を調節してガラス基板Ｇの角度を調節してもよい。 By adjusting the spacing and position of the pins 55 and 56 in the central regulation portion 3 in this way, the arrangement position of each glass substrate G can be individually adjusted. In addition, the angle of the glass substrate G may be adjusted by adjusting the lateral positions of the lateral regulation portions 7a and 7b that regulate the second side portion s2 and the fourth side portion s4.

上述の手法により、各ガラス基板Ｇのアライメントを実施すると共に、ロードロック室１２内の雰囲気を真空雰囲気として、真空搬送室１３側の搬入出口２３を開放する。さらに搬送アーム１６により２枚のガラス基板Ｇを一度に受けとり、所定の真空処理モジュール９、例えば真空搬送室１３の左に接続された真空処理モジュール９に搬送する。 Alignment of each glass substrate G is performed by the above-described method, and the atmosphere in the load lock chamber 12 is made into a vacuum atmosphere, and the loading/unloading port 23 on the side of the vacuum transfer chamber 13 is opened. Further, two glass substrates G are received at once by the transfer arm 16 and transferred to a predetermined vacuum processing module 9 , for example, the vacuum processing module 9 connected to the left of the vacuum transfer chamber 13 .

２枚のガラス基板Ｇは、ロードロック室１２にて搬送先の真空処理モジュール９に合わせて個別にアライメントが実施されているため、真空処理モジュール９の設置ずれなどに伴う載置ずれを補償して、正確な位置に各ガラス基板Ｇを配置することができる。このように各ガラス基板Ｇを各真空処理モジュール９内の正確な位置に配置することにより、ガラス基板Ｇを正常に処理することができる。 Since the two glass substrates G are individually aligned in the load-lock chamber 12 in accordance with the vacuum processing module 9 to which they are to be transferred, misalignment caused by misalignment of the vacuum processing module 9 can be compensated for. Therefore, each glass substrate G can be placed at an accurate position. By arranging each glass substrate G at an accurate position in each vacuum processing module 9 in this manner, the glass substrates G can be processed normally.

各真空処理モジュール９にてガラス基板Ｇの処理を行った後、２つのガラス基板Ｇは、同時に搬送アーム１６により取り出され、ロードロック室１２に受け渡される。そしてロードロック室１２においては、これらのガラス基板Ｇの位置を、例えば基準位置になるようにアライメントを行う。即ち、２枚のガラス基板Ｇの並び方向と交差する方向へ伸びる２つの辺部（第１辺部ｓ１、第３辺部ｓ３）を、搬送容器Ｃ内へ収納するのに合わせた位置に、各規制部３ａ、３ｂ、７ａ、７ｂを各々移動させて再度アライメントを行う。その後ロードロック室１２の雰囲気を大気雰囲気に切り替え、ロードロック室１２に載置された２枚のガラス基板Ｇが搬送アーム１５により取り出され、搬送容器Ｃに戻される。 After processing the glass substrates G in each vacuum processing module 9 , the two glass substrates G are simultaneously taken out by the transfer arm 16 and transferred to the load lock chamber 12 . Then, in the load-lock chamber 12, alignment is performed so that the positions of these glass substrates G are, for example, the reference positions. That is, two side portions (the first side portion s1 and the third side portion s3) extending in a direction intersecting with the direction in which the two glass substrates G are arranged are positioned so as to be accommodated in the transport container C. Alignment is performed again by moving each of the restricting portions 3a, 3b, 7a, and 7b. After that, the atmosphere of the load lock chamber 12 is switched to the air atmosphere, and the two glass substrates G placed in the load lock chamber 12 are taken out by the transfer arm 15 and returned to the transfer container C.

上述の実施の形態は、２枚の隣り合って並べて配置されたガラス基板Ｇに対して夫々設定された第１角部ｃ１、第２角部ｃ２を形成する辺部の位置を規制部３、７により規制する。そして、規制された各辺部と対向する方向から夫々押し当て部８を押し当ててガラス基板Ｇのアライメントを行っている。このとき２枚のガラス基板Ｇの間に配置される中央規制部３を前後方向に移動自在に構成すると共に、ガラス基板Ｇの離間間隔を調節するピン５５、５６の離間間隔を調節できるように構成している。そのため各ガラス基板Ｇの配置位置を個別に調節することができる。 In the above-described embodiment, the positions of the side portions forming the first corner portion c1 and the second corner portion c2 respectively set with respect to the two glass substrates G arranged side by side are controlled by the regulating portion 3, 7. Then, the glass substrate G is aligned by pressing the pressing portion 8 from the direction facing each of the regulated sides. At this time, the central regulating portion 3 arranged between the two glass substrates G is configured to be movable in the front-rear direction, and the spacing between the pins 55 and 56 for adjusting the spacing between the glass substrates G can be adjusted. Configure. Therefore, the arrangement position of each glass substrate G can be individually adjusted.

また中央規制部３のピン５５、５６の離間間隔及び前後方向の位置を夫々調節できるようにすることで、２枚のガラス基板Ｇの離間間隔及び配置角度を自在に調節することができる。
また本開示は、前方側のガラス基板Ｇの後方側の第１辺部ｓ１、及び当該第１辺部ｓ１と隣り合う後方側のガラス基板Ｇの前方側の第３辺部ｓ３の離間間隔及び角度を変化できるように第１角部ｃ１、第２角部ｃ２を設定している。そのため第１辺部ｓ１と、第３辺部ｓ３と、を規制する中央規制部３を共通化することができ、部材を少なくすることができる。
さらに押し当て部８は、第１角部ｃ１、第２角部ｃ２に対向する方向から力を掛けることができればよい。そのため、例えば各ガラス基板Ｇの第１角部ｃ１、第２角部ｃ２から延びる対角線の方向から各ガラス基板Ｇを押す押し当て部８は一つづつ設けてもよい。 Further, by making it possible to adjust the spacing and the longitudinal position of the pins 55 and 56 of the central regulating portion 3, the spacing and arrangement angle of the two glass substrates G can be freely adjusted.
In addition, the present disclosure provides the distance between the first side portion s1 on the rear side of the glass substrate G on the front side and the third side portion s3 on the front side of the glass substrate G on the rear side adjacent to the first side portion s1, and The first corner c1 and the second corner c2 are set so that the angle can be changed. Therefore, the central restricting portion 3 that restricts the first side portion s1 and the third side portion s3 can be shared, and the number of members can be reduced.
Further, it is sufficient that the pressing portion 8 can apply force from the direction facing the first corner c1 and the second corner c2. Therefore, for example, one pressing portion 8 for pressing each glass substrate G from the direction of the diagonal line extending from the first corner c1 and the second corner c2 of each glass substrate G may be provided.

また各ガラス基板Ｇの位置合わせを行うにあたって、前後に配置された長辺側押し当て部８ａ、８ｃと、側方に配置された短辺側押し当て部８ｂ、８ｄと、をガラス基板Ｇにガラス基板Ｇに同時に押し当て、各ガラス基板Ｇの前後方向の位置と左右方向の位置を同時に規制することも可能である。しかしながらガラス基板Ｇの前後方向から長辺側押し当て部８ａ、８ｃを押し当てるタイミングと、側方から短辺側押し当て部８ｂ、８ｄを押し当てるタイミングとを、個別に行うことで一度にガラス基板Ｇにかかる力を分散できる。そのためガラス基板Ｇのアライメントの精度が向上する効果がある。長辺側押し当て部８ａ、８ｃを押し当てるタイミングと、短辺側押し当て部８ｂ、８ｄを押し当てるタイミングと、は、長辺側押し当て部８ａ、８ｃを先に押し当て、その後短辺側押し当て部８ｂ、８ｄを押し当ててもよい。あるいは、短辺側押し当て部８ｂ、８ｄを先に押し当て、その後長辺側押し当て部８ａ、８ｃを押し当ててもよい。 Further, when aligning the glass substrates G, the long side pressing portions 8a and 8c arranged in the front and back and the short side pressing portions 8b and 8d arranged in the lateral direction are attached to the glass substrate G. It is also possible to press against the glass substrates G at the same time and regulate the position in the front-rear direction and the position in the left-right direction of each glass substrate G at the same time. However, the timing of pressing the long-side pressing portions 8a and 8c from the front and back of the glass substrate G and the timing of pressing the short-side pressing portions 8b and 8d from the side are performed separately. The force applied to the substrate G can be dispersed. Therefore, there is an effect that the alignment accuracy of the glass substrate G is improved. The timing of pressing the long side pressing portions 8a and 8c and the timing of pressing the short side pressing portions 8b and 8d are such that the long side pressing portions 8a and 8c are first pressed and then the short side pressing portions 8a and 8c are pressed. The side pressing portions 8b and 8d may be pressed. Alternatively, the short-side pressing portions 8b and 8d may be pressed first, and then the long-side pressing portions 8a and 8c may be pressed.

さらに第１基板配置領域２１ａに載置されたガラス基板Ｇの長辺側押し当て部８ａ、短辺側押し当て部８ｂ、第２基板配置領域２１ｂに載置されたガラス基板Ｇの長辺側押し当て部８ｃ及び短辺側押し当て部８ｄを夫々互いに異なるタイミングでガラス基板Ｇに押し当ててもよい。この場合にも各ガラス基板Ｇにおいてガラス基板Ｇに一度にかかる力を分散できるためガラス基板Ｇのアライメントの精度が向上する効果がある Further, the long side pressing portion 8a, the short side pressing portion 8b, and the long side of the glass substrate G placed in the second substrate placement region 21b are formed on the glass substrate G placed in the first substrate placement region 21a. The pressing portion 8c and the short-side pressing portion 8d may be pressed against the glass substrate G at different timings. In this case also, the force applied to the glass substrates G at once can be dispersed among the glass substrates G, so that the accuracy of the alignment of the glass substrates G can be improved.

さらに本開示においては、中央規制部３にてピン５５，５６の離間間隔を変更するにあたって、テーパー部５７における移動体４１の進入位置を調節することにより、ピン５５、５６の離間間隔を調節することができる。従って第１辺部ｓ１と、第３辺部ｓ３と、の間の離間間隔及びこれらの辺部の成す角度の設定値を変化させることができる。従って真空処理モジュール９のずれに応じて設定値を調節することができる。 Further, in the present disclosure, when changing the spacing between the pins 55 and 56 in the central restricting portion 3, the spacing between the pins 55 and 56 is adjusted by adjusting the entry position of the moving body 41 in the tapered portion 57. be able to. Therefore, it is possible to change the set values of the distance between the first side portion s1 and the third side portion s3 and the angle formed by these side portions. Therefore, the set value can be adjusted according to the displacement of the vacuum processing module 9 .

また中央規制部３を２つ設けていることから中央規制部３が一つの場合に比べて、第１辺部ｓ１、及び第３辺部ｓ３の離間間隔及び角度をより広い範囲で変化させることができる。
さらに処理を終えたガラス基板Ｇをロードロック室１２から搬送容器Ｃに戻すにあたってガラス基板Ｇを格納する搬送容器Ｃに対応したガラス基板Ｇの配置位置の情報を記憶部から読み出して位置合わせを行ってもよい。 In addition, since two central regulating portions 3 are provided, the spacing and angle between the first side portion s1 and the third side portion s3 can be changed in a wider range than when there is only one central regulating portion 3. can be done.
Further, when the processed glass substrate G is returned from the load lock chamber 12 to the transport container C, information on the arrangement position of the glass substrate G corresponding to the transport container C storing the glass substrate G is read out from the storage unit and aligned. may

また本開示は、図１４に示すように平面視六角形の真空搬送室１３０を備え、真空搬送室１３０の各側面にロードロック室１２と、５つの真空処理モジュール９が接続された真空処理装置に適用しても良い。このような真空処理装置においては、真空処理モジュール９がロードロック室１２と真空搬送室１３との並び方向に対して、斜めの位置に接続されている。そのためロードロック室１２と真空搬送室１３とが並ぶ方向、あるいは並ぶ方向に対して直交する方向に設けられた真空処理モジュール９と比べて、搬送アーム１６のティーチングのみによる配置位置の調整が実施しにくい。 In addition, the present disclosure is a vacuum processing apparatus that includes a vacuum transfer chamber 130 that is hexagonal in plan view as shown in FIG. may be applied to In such a vacuum processing apparatus, the vacuum processing module 9 is connected at an oblique position with respect to the alignment direction of the load lock chamber 12 and the vacuum transfer chamber 13 . Therefore, compared to the vacuum processing module 9 provided in the direction in which the load lock chamber 12 and the vacuum transfer chamber 13 are aligned or in a direction orthogonal to the direction in which the load lock chamber 12 and the vacuum transfer chamber 13 are aligned, the arrangement position can be adjusted only by teaching the transfer arm 16. Hateful.

この点、本開示に係る真空処理装置においては、ロードロック室１２にてアライメントを行うときに真空処理モジュール９毎に、２枚のガラス基板Ｇの配置位置を個別に調節することができるため、このような真空処理装置においても各真空処理モジュール９に正確にガラス基板Ｇを搬送することができる。
また、図１、図１４に記載の例に替えて、ロードロック室１２とは別に、２枚のガラス基板Ｇのアライメントを行うアライメントモジュールを、ロードロック室１２や真空搬送室１３、１３０に別途接続した構成であってもよい。
また真空搬送室は平面視六角形に限らず、平面視が任意の多角形の構成であってもよい。 In this respect, in the vacuum processing apparatus according to the present disclosure, the arrangement positions of the two glass substrates G can be individually adjusted for each vacuum processing module 9 when alignment is performed in the load lock chamber 12. Even in such a vacuum processing apparatus, the glass substrate G can be accurately transported to each vacuum processing module 9 .
1 and 14, an alignment module for aligning two glass substrates G may be installed in the load lock chamber 12 and the vacuum transfer chambers 13 and 130 separately from the load lock chamber 12. A connected configuration may also be used.
Further, the vacuum transfer chamber is not limited to a hexagonal shape when viewed from above, and may have an arbitrary polygonal configuration when viewed from above.

本開示は規制された第１角部ｃ１を形成する２つの辺部と対向する方向から押し当て部８が夫々押し当てられ、規制された第２角部ｃ２を形成する２つの辺部と対向する方向から押し当て部が夫々押し当てられていればよい。このようなバリエーションを図１５Ａ～図１５Ｅに示す。これらの図において、各規制部３、７によって規制されるガラス基板Ｇの辺に対応する位置を太線で示してある。例えば図１５Ｂ～図１５Ｅのように、２枚のガラス基板Ｇの第1辺部ｓ１と第３辺部ｓ３とが離れて配置される場合がある。この場合には、共通の中央規制部３ａ、３ｂを設ける場合に替えて、側方規制部７ａ、７ｂと同様にこれらの規制部３ａ、３ｂを個別に設けてもよい。 In the present disclosure, the pressing portion 8 is pressed from a direction facing the two sides forming the regulated first corner c1, and faces the two sides forming the regulated second corner c2. It suffices that the pressing portions are pressed from the direction to be pressed. Such variations are shown in FIGS. 15A-15E. In these figures, the positions corresponding to the sides of the glass substrate G that are regulated by the regulating portions 3 and 7 are indicated by thick lines. For example, as shown in FIGS. 15B to 15E, the first side portion s1 and the third side portion s3 of the two glass substrates G may be arranged apart from each other. In this case, instead of providing the common central restricting portions 3a and 3b, these restricting portions 3a and 3b may be provided individually like the side restricting portions 7a and 7b.

以上に検討したように、今回開示された実施形態はすべての点で例示であって制限的なものではないと考えられるべきである。上記の実施形態は、添付の請求の範囲及びその主旨を逸脱することなく、様々な形態で省略、置換、変更されてもよい。 As discussed above, the embodiments disclosed this time should be considered illustrative and not restrictive in all respects. The embodiments described above may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

３（３ａ、３ｂ） 中央規制部
７（７ａ、７ｂ） 側方規制部
８（８ａ～８ｄ） 押し当て部
２０ 載置台
５５、５６ ピン
ｃ１ 第１角部
ｃ２ 第２角部
Ｇ ガラス基板 3 (3a, 3b) Central regulating portion 7 (7a, 7b) Side regulating portion 8 (8a to 8d) Pressing portion 20 Mounting table 55, 56 Pin c1 First corner c2 Second corner G Glass substrate

Claims (12)

矩形基板の配置位置を調節するアライメント装置であって、
２枚の矩形基板を隣り合って並べて配置するための第１基板配置領域及び第２基板配置領域が設定された載置台と、
前記第１基板配置領域に配置される矩形基板を構成する４つの角部から選択された１つの角部を第１角部としたとき、前記第１角部を形成する２つの辺部の配置位置を各々規制する第１規制部及び第２規制部と、
前記第１角部を形成する２つの辺部と対向する方向から、前記第１規制部及び前記第２規制部へ向けて矩形基板を押し当てる第１押し当て部と、
前記第２基板配置領域に配置される矩形基板を構成する４つの角部から選択された１つの角部を第２角部としたとき、前記第２角部を形成する２つの辺部の配置位置を各々規制する第３規制部及び第４規制部と、
前記第２角部を形成する２つの辺部と対向する方向から、前記第３規制部及び前記第４規制部へ向けて矩形基板を押し当てる第２押し当て部と、
前記第１角部及び前記第２角部から、前記２枚の矩形基板の並び方向と交差する方向へ伸びる２つの辺部の離間間隔及びこれらの辺の成す角度を変化させるために、前記第１規制部～前記第４規制部を各々移動させる移動機構とを備え、
前記移動機構は、前記離間間隔及び前記角度の設定値を変更することが可能である、アライメント装置。 An alignment device for adjusting the placement position of a rectangular substrate,
a mounting table having a first substrate placement area and a second substrate placement area for arranging two rectangular substrates side by side;
When one corner selected from four corners forming a rectangular substrate arranged in the first substrate placement area is defined as a first corner, arrangement of two side portions forming the first corner. a first restricting portion and a second restricting portion that respectively restrict the position;
a first pressing portion that presses the rectangular substrate toward the first restricting portion and the second restricting portion from a direction facing the two side portions forming the first corner;
When one corner selected from four corners forming a rectangular substrate arranged in the second substrate placement area is defined as a second corner, arrangement of two side portions forming the second corner. a third restricting portion and a fourth restricting portion that respectively restrict the position;
a second pressing portion that presses the rectangular substrate toward the third restricting portion and the fourth restricting portion from a direction facing the two side portions forming the second corner;
In order to change the distance between two side portions extending from the first corner portion and the second corner portion in a direction intersecting the direction in which the two rectangular substrates are arranged and the angle formed by these sides, a moving mechanism for moving each of the first restricting portion to the fourth restricting portion ;
The alignment apparatus , wherein the moving mechanism is capable of changing set values of the spacing and the angle . 前記離間間隔及び前記角度を変化させる２つの辺部を第１辺部及び第３辺部と呼ぶとき、これら第１辺部及び第３辺部が隣り合って配置される位置となるように、前記第１角部及び前記第２角部が選択された、請求項１に記載のアライメント装置。 When the two sides that change the separation distance and the angle are called the first side and the third side, the first side and the third side are positioned to be adjacent to each other, 2. The alignment device of claim 1, wherein said first corner and said second corner are selected. 前記第１辺部及び前記第３辺部の配置位置を各々前記第１規制部及び前記第３規制部にて規制するとき、
前記第１規制部及び前記第３規制部は、前記２枚の矩形基板の並び方向と交差する方向に沿って見た、前記第１規制部及び前記第３規制部の離間間隔を変化させることが可能な共通の前記移動機構である、共通移動機構に設けられている、請求項２に記載のアライメント装置。 When the arrangement positions of the first side portion and the third side portion are restricted by the first restriction portion and the third restriction portion, respectively,
Said first restricting part and said third restricting part are configured to change a separation distance between said first restricting part and said third restricting part when viewed along a direction intersecting with a direction in which said two rectangular substrates are arranged. 3. The alignment device according to claim 2 , wherein the alignment device is provided in a common movement mechanism which is the common movement mechanism capable of. 前記第１規制部及び前記第３規制部と前記共通移動機構との組が、前記第１辺部と前記第３辺部との隙間に沿って複数組設けられた、請求項３に記載のアライメント装置。 4. The set according to claim 3, wherein a plurality of sets of said first restricting portion and said third restricting portion and said common moving mechanism are provided along a gap between said first side portion and said third side portion. Alignment device. 前記第１角部を形成する２つの辺部の一方の辺部を第１辺部、他方の辺部を第２辺部と呼び、前記第２角部を形成する２つの辺部の一方の辺部を第３辺部、他方の辺部を第４辺部と呼ぶとき、
前記第１押し当て部は、前記第１辺部と対向する方向から矩形基板を押し当てる第１辺部対向押し当て部と、前記第２辺部と対向する方向から矩形基板を押し当てる第２辺部対向押し当て部と、とを備え、
前記第２押し当て部は、前記第３辺部と対向する方向から矩形基板を押し当てる第３辺部対向押し当て部と、前記第４辺部と対向する方向から矩形基板を押し当てる第４辺部対向押し当て部と、とを備え、
前記第１辺部対向押し当て部が第１辺部に向けて矩形基板を押し当てるタイミングと、前記第２辺部対向押し当て部が第２辺部に向けて矩形基板を押し当てるタイミングと、が互いに異なり、前記第３辺部対向押し当て部が第３辺部に向けて矩形基板を押し当てるタイミングと、前記第４辺部対向押し当て部が第４辺部に向けて矩形基板を押し当てるタイミングと、が互いに異なる請求項１ないし４のいずれか一項に記載のアライメント装置。 One of the two sides forming the first corner is called a first side, and the other side is called a second side. When one side is called the third side and the other side is called the fourth side,
The first pressing section includes a first side opposing pressing section that presses the rectangular substrate in a direction facing the first side, and a second side pressing section that presses the rectangular substrate in a direction facing the second side. A side portion facing pressing portion, and
The second pressing portion includes a third side pressing portion that presses the rectangular substrate in a direction facing the third side, and a fourth side pressing portion that presses the rectangular substrate in a direction facing the fourth side. A side portion facing pressing portion, and
a timing at which the first side pressing portion presses the rectangular substrate toward the first side; and a timing at which the second side pressing portion presses the rectangular substrate toward the second side; are different from each other, the timing of the third side pressing portion pressing the rectangular substrate toward the third side portion, and the timing of the fourth side pressing portion pressing the rectangular substrate toward the fourth side portion. 5. The alignment apparatus according to any one of claims 1 to 4 , wherein the application timing and the timing are different from each other. 請求項１ないし５のいずれか一つに記載のアライメント装置を備え、常圧雰囲気と真空雰囲気とを切り替え自在に構成されたロードロックモジュールと、
前記ロードロックモジュールに接続され、真空雰囲気下にて、前記アライメント装置にて配置位置が調節された２枚の矩形基板を同時に搬送する基板搬送機構を備えた真空搬送モジュールと、
前記真空搬送モジュールに接続され、前記基板搬送機構によって搬送された２枚の矩形基板を収容し、真空雰囲気下にて基板処理を行う基板処理モジュールと、を備えた、基板処理装置。 a load lock module comprising the alignment device according to any one of claims 1 to 5 and configured to be capable of switching between a normal pressure atmosphere and a vacuum atmosphere;
a vacuum transfer module connected to the load lock module and provided with a substrate transfer mechanism for simultaneously transferring two rectangular substrates whose arrangement positions are adjusted by the alignment device in a vacuum atmosphere;
a substrate processing module that is connected to the vacuum transfer module, accommodates two rectangular substrates transferred by the substrate transfer mechanism, and performs substrate processing in a vacuum atmosphere. 前記真空搬送モジュールに対し、複数の前記基板処理モジュールが接続された、請求項６に記載の基板処理装置。 7. The substrate processing apparatus according to claim 6 , wherein a plurality of said substrate processing modules are connected to said vacuum transfer module. 前記基板処理装置を平面視したとき、前記真空搬送モジュールに対し、前記ロードロックモジュールと前記真空搬送モジュールとの並び方向、及びこれらのモジュールの並び方向と直交する方向からずれた方向に沿って接続された前記基板処理モジュールを含む、請求項７に記載の基板処理装置。 When the substrate processing apparatus is viewed from above, the vacuum transfer module is connected along the direction in which the load lock module and the vacuum transfer module are arranged and in a direction deviated from the direction orthogonal to the direction in which these modules are arranged. 8. The substrate processing apparatus of claim 7 , comprising the substrate processing module configured as a substrate. 矩形基板の配置位置を調節するアライメント方法であって、
２枚の矩形基板を隣り合って並べて配置するための第１基板配置領域及び第２基板配置領域が設定された載置台に、これらの矩形基板を配置する工程と、
前記第１基板配置領域に配置される矩形基板を構成する４つの角部から選択された１つの角部を第１角部としたとき、前記第１角部を形成する２つの辺部の配置位置を各々規制する第１規制部及び第２規制部に向けて、前記第１角部を形成する２つの辺部と対向する方向から当該矩形基板を押し当てる工程と、
前記第２基板配置領域に配置される矩形基板を構成する４つの角部から選択された１つの角部を第２角部としたとき、前記第２角部を形成する２つの辺部の配置位置を各々規制する第３規制部及び第４規制部に向けて、前記第２角部を形成する２つの辺部と対向する方向から当該矩形基板を押し当てる工程とを含み、
前記第１基板配置領域及び前記第２基板配置領域への各矩形基板の最初の配置状態に対し、前記第１角部及び前記第２角部から、これらの矩形基板の並び方向と交差する方向へ伸びる２つの辺部の離間間隔及びこれらの辺の成す角度を変化させるために、前記第１規制部～前記第４規制部が各々移動可能に構成されると共に、前記離間間隔及び前記角度の設定値は変更することが可能である、アライメント方法。 An alignment method for adjusting the placement position of a rectangular substrate,
placing two rectangular substrates on a mounting table having a first substrate placement area and a second substrate placement area for arranging two rectangular substrates side by side;
When one corner selected from four corners forming a rectangular substrate arranged in the first substrate placement area is defined as a first corner, arrangement of two side portions forming the first corner. a step of pressing the rectangular substrate from a direction facing two side portions forming the first corner portion toward a first restricting portion and a second restricting portion that respectively restrict positions;
When one corner selected from four corners forming a rectangular substrate arranged in the second substrate placement area is defined as a second corner, arrangement of two side portions forming the second corner. pressing the rectangular substrate from a direction facing the two side portions forming the second corner portion toward a third restricting portion and a fourth restricting portion that respectively restrict positions;
With respect to the initial arrangement state of each rectangular substrate in the first substrate placement area and the second substrate placement area, the alignment direction of these rectangular substrates is intersected from the first corner and the second corner. In order to change the spacing between two side portions extending in the direction and the angle formed by these sides, the first to fourth restricting portions are each configured to be movable , and the spacing and the angle It is possible to change the setting value of the alignment method. 前記離間間隔及び前記角度を変化させる２つの辺部を第１辺部及び第３辺部と呼ぶとき、これら第１辺部及び第３辺部が隣り合って配置される位置となるように、前記第１角部及び前記第２角部が選択された、請求項９に記載のアライメント方法。 When the two sides that change the separation distance and the angle are called the first side and the third side, the first side and the third side are positioned to be adjacent to each other, 10. The alignment method of claim 9 , wherein said first corner and said second corner are selected. 前記第１角部を形成する２つの辺部の一方の辺部を第１辺部、他方の辺部を第２辺部と呼び、前記第２角部を形成する２つの辺部の一方の辺部を第３辺部、他方の辺部を第４辺部と呼ぶとき、
前記第１角部を形成する２つの辺部と対向する方向から当該矩形基板を押し当てる工程は、前記第１辺部と対向する方向から矩形基板を押し当てる第１押し当て工程と、前記第１押し当て工程と異なるタイミングにて前記第２辺部と対向する方向から矩形基板を押し当てる第２押し当て工程と、を含み、
前記第２角部を形成する２つの辺部と対向する方向から当該矩形基板を押し当てる工程は、前記第３辺部と対向する方向から矩形基板を押し当てる第３押し当て工程と、前記第３押し当て工程と異なるタイミングにて前記第４辺部と対向する方向から矩形基板を押し当てる第４押し当て工程と、を含む請求項９または１０に記載のアライメント方法。 One of the two sides forming the first corner is called a first side, and the other side is called a second side. When one side is called the third side and the other side is called the fourth side,
The step of pressing the rectangular substrate from the direction facing the two sides forming the first corner includes a first pressing step of pressing the rectangular substrate from the direction facing the first side; a second pressing step of pressing the rectangular substrate from a direction facing the second side at a timing different from that of the first pressing step;
The step of pressing the rectangular substrate from the direction facing the two sides forming the second corner includes a third pressing step of pressing the rectangular substrate from the direction facing the third side; 11. The alignment method according to claim 9 , further comprising a fourth pressing step of pressing the rectangular substrate from a direction facing the fourth side at a timing different from that of the third pressing step. 請求項９ないし１１のいずれか一つに記載のアライメント方法にて配置位置が調節される２枚の矩形基板を、共通の基板搬送機構により、真空雰囲気下にて同時に搬送する工程と、
前記基板搬送機構によって搬送された２枚の矩形基板を基板処理モジュールに収容し、真空雰囲気下にて基板処理を行う工程と、を含む、基板処理方法。 A step of simultaneously transporting two rectangular substrates whose arrangement positions are adjusted by the alignment method according to any one of claims 9 to 11 under a vacuum atmosphere by a common substrate transport mechanism;
and a step of accommodating two rectangular substrates transported by the substrate transport mechanism in a substrate processing module and performing substrate processing in a vacuum atmosphere.
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