KR101367852B1 - apparatus and method for making etching area on substrate - Google Patents

Abstract

An apparatus for forming an etching region on a substrate capable of easily distinguishing an etching region on a substrate for a flat panel display device is disclosed.

An apparatus for making an etched region in such a substrate includes a frame, a base plate fixedly installed in a bufferable state inside the frame, and a transparent sealing space at an upper side thereof, and in contact with the base plate apart from the base plate. A chamber mold fixed to the frame side, a pattern surface for distinguishing between etched and non-etched regions, and a soft mold positioned in an airtight space of the chamber case while being fixedly supported with the base plate, and loading a substrate. And a stage positioned at a lower side away from the soft mold at regular intervals in a sealed space of the chamber case, and fixed to the base plate side to bond the substrate toward the soft mold while up / down the stage. Generating and transmitting power to Includes alignment means for correcting the position of the substrate attached to each other in accordance with the driving means and the position of the soft mold.

Flatbed printing, imprint method, frame, substrate, soft mold, alignment means, alignment deviation correction, chamber case, seismic protection, static elimination means, negative ion, ionizer

Description

Apparatus and method for making etching area on substrate

The present invention relates to an apparatus and method for making an etched region in a substrate capable of preventing abnormally formed etched and non-etched regions due to vibration or positional deviation generated when the substrate for a flat panel display device and the soft mold are bonded together. will be.

The operation of dividing the etched and non-etched regions into a flat panel display substrate (hereinafter referred to as a "substrate") uses an apparatus that can proceed in an imprint manner using a soft mold.

The configuration of an apparatus for distinguishing the etched and non-etched regions will be briefly described as follows: a chamber case, a stage for loading a substrate inside the chamber case, and an up / down operation above the stage, in an imprint manner. And a vision unit (eg, a micro camera) for sensing an alignment position when the soft mold and the substrate are bonded to each other.

That is, the soft mold may be moved downward in a state where a substrate coated with a resin layer (photosensitive resin) is placed on the stage to be bonded to the substrate by a single imprint operation, thereby distinguishing between etched and non-etched regions.

However, since the apparatus for distinguishing the conventional etching and non-etching regions does not include a means for removing static electricity generated in the chamber case, the etching and non-etching regions may be abnormally formed by static electricity. .

For example, the soft mold used several times may cause a phenomenon that static electricity is easily generated and the bonding with the resin layer is not performed smoothly.

In addition, since the stage is not provided with a means for stably holding the substrate, the substrate may deviate from the stage when the substrate is loaded or bonded.

In addition, the micro cameras of the vision unit are mostly installed on the upper surface of the chamber case so as to sense alignment marks of the soft mold and the substrate, respectively.

However, such a fixed structure is such that when the inside of the chamber case is switched to a vacuum atmosphere or a vacuum release atmosphere, surface deformations (bending) of the outer surfaces of the chamber case are caused by vacuum pressure, so that the fixing posture of the micro cameras is easily changed. Can be.

That is, when the fixing posture of the micro cameras is changed, it is difficult to sense the exact bonding position when the substrate and the soft mold are bonded, so that an alignment error may occur during the bonding.

In addition, since the soft mold is bonded by an imprint operation by one pitch movement toward the substrate, the method of bonding by one imprint operation may cause a positional deviation during the movement of the soft mold, resulting in greater alignment error. have.

In addition, the structure in which the soft mold soft material is bonded to the substrate while the soft mold is moved among the soft mold and the substrate may be bonded to the substrate in a non-uniform contact state while the mold surface is easily bent during the movement of the soft mold.

Therefore, in the apparatus for distinguishing the conventional etching and non-etching regions, the etching and non-etching regions may be abnormally formed when the substrate and the soft mold are bonded.

The present invention has been made to solve the conventional problems as described above, the object of the present invention is to prevent the abnormal formation of the etched and non-etched region by the alignment error when the substrate and the soft mold is bonded. An apparatus and method for making an etched region in a substrate are provided.

In order to realize the object of the present invention as described above,

frame;

A base plate fixedly installed in a state capable of buffering the inside of the frame;

A chamber case having a transparent sealing space at an upper surface thereof and spaced apart from the base plate to be fixed to the frame side in a non-contact state with the base plate;

A soft mold having a pattern surface for distinguishing between etched and non-etched regions and positioned in an airtight space of the chamber case while being fixedly supported with the base plate;

A stage having a loading surface for loading a substrate and positioned below the soft mold at regular intervals in a sealed space of the chamber case;

Driving means fixed to the base plate side to generate and transmit power for bonding the substrate toward the soft mold while up / down the stage;

Alignment means for correcting the bonding position of the substrate according to the position of the soft mold;

It provides an apparatus for making an etching region on a substrate comprising a.

In order to achieve another object of the present invention,

A primary alignment step of aligning the bonding position before bonding the substrate and the soft mold;

A first bonding step of bonding the first aligned substrate and the soft mold in contact with each other;

A second alignment step of aligning the bonding position of the substrate and the soft mold in the contact state;

A second bonding step of bonding the substrate and the soft mold which are secondly aligned in a surface contact state;

It provides a method for making an etching region on a substrate comprising a.

In the method for forming an etched region on the substrate according to the present invention, when the substrate and the soft mold are bonded by imprinting, the etching and non-etching regions can be easily distinguished by imprinting through two alignment and bonding steps, respectively. .

As such, the structure of bonding the substrate and the soft mold by dividing the alignment step and the bonding step into two processes (or two or more processes), for example, is compared with the method of the soft mold in comparison with the method of bonding in one pitch shifting operation. The alignment error that can occur when the substrate is bonded can be minimized.

In addition, the apparatus for making an etched region in the substrate according to the present invention, having a frame having a seismic structure capable of absorbing vibration or shock, and etched and unetched while undergoing an alignment step and a bonding step in the frame. You can easily separate the areas.

In particular, the frame of the seismic structure is formed so as not to interfere with the surface deformation of the chamber case when aligning the position of the substrate by the alignment means to reduce the sensing error that can occur when the position of the substrate and the soft mold alignment.

In addition, the apparatus for making an etched region in the substrate according to the present invention is provided with a means (ionizer) for removing the static electricity by using negative ions, so that problems caused by static electricity when bonding the soft mold and the substrate I can solve it.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Embodiments of the present invention are described to the extent that those of ordinary skill in the art can practice the present invention.

Therefore, since the embodiments of the present invention may be modified in various other forms, the claims of the present invention are not limited to the embodiments described below.

1 is a view showing the entire internal structure of the apparatus for making an etched region in the substrate according to an embodiment of the present invention, 2 denotes a frame.

The frame 2 discloses a rectangular frame body in which a plurality of metal pipes are welded or bolted and fixed in a conventional manner.

The frame 2 may be attached to a conventional grounding hole 2b such as a rubber plate so as to be supported in a stable ground state capable of absorbing vibration generated from the ground. (See FIG. 1).

The base plate 4 is located inside the frame 2.

The base plate 4 has a support surface F of a predetermined size and can be installed on the horizontal frame portion 2a formed inside the frame 2 such that the support surface F is positioned in a horizontal position. have.

The base plate 4 is positioned in a state capable of absorbing various shocks and vibrations in the horizontal frame portion 2a. That is, the base plate 4 may be installed in a state in which a plurality of buffering grounding holes A are provided on the horizontal frame portion 2a and placed on the buffering grounding hole A. FIG.

The shock absorbing ground (A) is, for example, in the form of a cylinder or a polygon filled with a fluid (air) therein, a conventional structure for supporting the frame or work table of the various devices that require a buffer to be able to absorb the shock from the ground Is made of.

The base plate 4 is used in a metal (for example, stainless steel) having rigidity that can suppress deformation of the support surface S due to pressure, vibration, shock, friction, or the like.

That is, the base plate 4 serves as a main workbench capable of absorbing vibration or shock on the frame 2 side. In such a structure, the operation of separating the etched and non-etched regions may be performed on the side of the substrate G in a state where the vibration resistance is secured in the frame 2.

The chamber case 6 is positioned above the base plate 4. The chamber case 6 provides a space for distinguishing between etched and non-etched regions of the resin layer G1 (photosensitive resin) of the substrate G in a vacuum atmosphere.

The chamber case 6 discloses a box type having a rectangular sealed space H therein.

The closed space (H) is connected to the normal vacuum pump (P) and the tube (P1) it is possible to switch to a vacuum atmosphere or atmospheric pressure atmosphere by the drive of the pump (P). That is, when the etching and non-etching regions are divided into the resin layer G1 of the substrate G in a vacuum pressure atmosphere, bubbles may be prevented from occurring in the resin layer G1.

As described above, the structure for converting the closed space H into a vacuum or atmospheric pressure using the vacuum pump P is easily implemented by those skilled in the art, and thus, further description thereof will be omitted. .

Although not shown in the drawings, a door for opening and closing the sealed space H may be installed at one side of the chamber case 6 to supply or withdraw the substrate G from the outside.

The chamber case 6 is fixedly installed in a non-contact state apart from the base plate 4.

That is, the chamber case 6 may be fixed in a state of being separated from the base plate 4 at a predetermined interval by connecting to the side of the frame 2 with a separate connector Q as shown in FIG. 1. .

The connector (Q) is made possible to connect and fix one or more points of the chamber case (6) with the side of the frame (2) in a conventional hinge fixing manner.

When the chamber case 6 is fixed in the non-contact state with the base plate 4 as described above, the vibration or shock generated from the chamber case 6 or the base plate 4 side is transmitted to the other side and interferes with the phenomenon. Can be prevented.

The soft mold 8 is positioned inside the chamber case 6. The soft mold 8 is used to distinguish between etched and non-etched regions while joining the substrate G in an imprint manner.

The soft mold 8 discloses a rectangular pad type having a constant thickness and sized to cover the entire area of the resin layer G1 of the substrate G.

The soft mold 8 has a conventional pattern surface 8a for pouring transparent synthetic resin raw materials (e.g., POLY DIMETHYLSILOXANE) onto a mastering plate (not shown) to distinguish between etched and non-etched regions on one side. Made of structure.

Although the substrate G and the soft mold 8 are not shown in the figure, a plurality of alignment marks, which are used as a reference when aligning the alignment positions, are formed on the edge portion side.

The soft mold 8 has a horizontal attitude as shown in FIG. 1 in the sealed space H of the chamber case 6 and is fixedly installed on the plurality of fixing bars 10 installed on the base plate 4. Can be.

The soft mold 8 is fixed in a closed space H of the chamber case 6 so that the pattern surface 8a has a downward attitude.

The plurality of fixing bars 10 are positioned on the support surface F of the base plate 4 so as to penetrate the bottom surface of the chamber case 6, and one end thereof is connected to the support surface F. The opposite end is fixed with the soft mold 8.

In addition, the points through which the plurality of fixing bars 10 penetrate the chamber case 6 may be sealed by inserting a conventional sealing member such as a rubber ring although not shown in the drawing.

Meanwhile, the stage 12 corresponding to the soft mold 8 is positioned inside the chamber case 6.

The stage 12 is for loading the substrate G in a state in which the stage 12 can be bonded to the soft mold 8.

That is, the stage 12 has a loading surface 12a for loading the substrate G and is positioned in parallel with the soft mold 8 apart from the enclosed space H of the chamber case 6. (See Fig. 1)

In addition, the apparatus for making an etched region in the substrate according to an embodiment of the present invention, as shown in Figure 2 may further comprise a holder for the substrate (14).

The substrate holder 14 is for pressing and detachably pressing the edge of the substrate G loaded on the loading surface 12a of the stage 12 in a contact state.

The substrate holder 14 has a pressing surface 14a and is slidably fixed at two or more edge portions of the stage 12. (See FIG. 2).

That is, as shown in FIG. 3, the substrate holder 14 slides back and forth by the rotation of the adjusting bolt 14b in the stage 12, and the edge side of the substrate G to the pressing surface 12a. Press to detach it.

The substrate holder 14 is installed so as not to protrude upward from the upper surface of the substrate G when installed on the stage 12 side. For example, when protruding above the substrate G, the pattern surface 8a may be unevenly contacted when the pattern surface 8a comes into contact with the protruding portion of the holder 14 for the substrate when the soft mold 8 is bonded.

The apparatus for making an etched region in a substrate according to an embodiment of the present invention comprises a drive means (16).

The driving means 16 is to up / down the stage 12 so that the substrate G and the soft mold 8 can be bonded in an imprint manner.

As shown in FIG. 1, the drive means 16 may use a motor C or a cylinder having a drive shaft C1 capable of up / down movement.

The motor (C) body may be fixedly installed in a state where it is mounted on the fixing plate (C2) side attached to the base plate (4) side.

In addition, a moving plate C3 is installed on the drive shaft C1, and the moving plate 3 and the stage 12 are connected and fixed by supporting bars C4. The support bars C4 are fixed to the stage 12 in a state of penetrating the base plate 4 and the bottom surface of the chamber case 6.

That is, the motor C can support the stage 12 horizontally while being fixed to the base plate 4 side and push up or down while pushing or pulling.

By the up / down driving, the stage 12 may move in a parallel posture toward the soft mold 8, and thus the substrate G and the soft mold 8 may be bonded in an imprint manner.

In addition to the above-described structure, the driving means 16 connects the motor shaft and the screw (for example, ball screw) to the stage 12 while transmitting power by forward and reverse rotation of the screw. You can also set it up or down.

In particular, the structure that is bonded while moving the substrate G by the driving means 16 as described above is, for example, compared to the structure that is bonded while moving the soft soft mold 8 by vibration or shock during the movement. The deformation of the surface of the soft mold 8 can be prevented.

In addition, between the movable plate C3 and the chamber case 6, a bellows tube C5 is connected in a state in which the support bars C4 are enclosed as shown in FIG.

That is, one end of the bellows pipe (C5) is fixed to the moving plate (C3), the other end is fixed to the bottom surface of the chamber case (6).

The bellows pipe C5 may block the through point of the bottom surface of the bottom of the chamber case 6 through which the support bars C4 penetrate in the airtight state, so that the bellows pipe C5 penetrates when the sealed space H is converted into a vacuum pressure atmosphere. The pressure can be prevented from being released through the gap.

The apparatus for making an etched region in a substrate according to an embodiment of the present invention comprises an alignment means 18.

The alignment means 18 is for pre-aligning their bonding position before bonding the substrate G and the soft mold 8 together.

The alignment unit 18 includes a vision unit V1 for detecting a position and an adjusting unit V2 for changing the position of the substrate G or the soft mold 8 according to a detection signal of the vision unit V1. ).

The vision unit V1 is constituted by a micro camera V1-1 and is provided on the frame 2 side so as not to be subjected to interference due to vibration or surface deformation of the chamber case 6.

To this end, in the present embodiment, as shown in FIG. 1, a cradle V3 is provided on the side of the base plate 4 so that the micro camera V1-1 is fixed to the cradle V3.

The holder V3 is fixed to the support surface F of the base plate 4 and has a mounting structure capable of fixing the micro cameras V1-1 to the upper side of the chamber case 6.

The vision unit V1 comprises two micro cameras V1-1 as a set so as to sense alignment marks at two points among the alignment marks formed on the soft mold 8 and the substrate G side. do.

In addition, a transparent plate 6a is installed on the upper surface of the chamber case 6 so that the soft mold 8 and the substrate G located in the sealed space H can be sensed from the outside (upper chamber case). do. A normal quartz plate can be used for this transparent plate 6a.

The vision unit V1 senses an alignment mark of the soft mold 8 through the transparent plate 6a with the micro carrera V1-1 and at the same time through the transparent soft mold 8. The alignment mark of the substrate G may be sensed.

The adjusting unit V2 is for adjusting the position of the stage 12 so that the substrate G is located at a bonding point corresponding to the soft mold 8, and a plurality of position adjusting members V2-1. It can be configured as.

That is, as shown in FIG. 1, the auxiliary stage 12b is disposed below the stage 12 in the chamber case 6.

As shown in FIG. 5, three position adjusting members V2-1 are provided between the stage 12 and the auxiliary stage 12b to operate the stage (V2-1). 12) is to be adjusted.

The position adjusting member V2-1 may be used in a conventional UVW stage or a manual stage having a structure capable of linear movement and rotation angle adjustment in two directions. These stages, although not shown in the figures, can be set to operate using fluid pressure (eg pneumatics) or by separate drives (cylinders, motors).

That is, as shown in Figure 6 by the respective position adjusting members (V2-1) so as to correspond to the position of the soft mold 8 while rotating and moving the stage 12 in the left and right directions before and after The bonding position of the board | substrate G can be adjusted.

As shown in FIG. 1, the control unit U is connected between the vision unit V1 and the control unit V2 to operate the control unit V2 according to the sensing signal of the vision unit V1. Set to control.

That is, the control unit U may correct the position of the substrate G while controlling the operation of the adjusting unit V2 such that the two alignment marks sensed by the micro cameras V1-1 coincide with each other. Can be.

The control unit U may use a conventional numerical controlled computer.

The apparatus for making an etched region in the substrate according to an embodiment of the present invention may further comprise a static electricity removing means 20.

The static electricity removing means 20 is for removing static electricity generated in the chamber case 6.

To this end, in this embodiment, as shown in FIG. 1, an ionizer W is mounted on one side of the chamber case 6 to remove static electricity generated in the sealed space H.

The ionizer (W) is made of a conventional structure for generating negative ions to easily remove the static electricity that may occur on the substrate (G) or the soft mold (8) side located in the closed space (H) by using an anion. Can be.

The ionizer W may be installed on the chamber case 6 side so that negative ions can be generated between the bonding surfaces of the soft mold 8 and the substrate G in the sealed space H. Such a structure can easily remove the static electricity generated between these bonding surfaces when separating the bonded state of the soft mold 8 and the substrate (G).

The ionizer W may, for example, be external to the chamber case 6 so as to generate negative ions toward the surface of the substrate G before loading the substrate G on the stage 12 side. It may be located.

Next, a preferred working embodiment for dividing the etched and non-etched regions on the substrate G by using the apparatus having the above-described structure will be described.

FIG. 7 is a flowchart illustrating an entire operation process of a method for forming an etching region on a substrate according to an exemplary embodiment of the present invention, and reference numeral S1 denotes a primary alignment step.

The first alignment step S1 may be performed before the soft mold 8 and the substrate G are bonded to each other in a state in which the substrate G is loaded on the stage 12 located inside the chamber case 6. It is for correcting the bonding position.

That is, as shown in FIG. 8, the alignment mark between the soft mold 8 and the substrate G is sensed outside the chamber case 6 by the vision unit V1.

Then, the bonding position of the substrate G to correspond to the soft mold 8 while controlling the driving of the adjusting unit V2 with the control unit U according to the data sensed by the vision unit V1. Align firstly (see Figure 6).

And, when the micro cameras V1-1 of the vision unit V1 switch the closed space H of the chamber case 6 into a vacuum pressure atmosphere, for example, the chamber case 6 is caused by vacuum pressure. Even if the surface of the surface is deformed, it is always placed in a constant posture without interference.

When the first alignment step (S1) is completed as described above, the first bonding step (S2) is performed.

The first bonding step S2 is to move the substrate G toward the soft mold 8 so that the first bonding step S2 is in close proximity at a minute interval L. FIG.

That is, as shown in FIG. 9, the stage 12 is moved upward by the driving means 16 so that the gap between the resin layer G1 of the substrate G and the pattern surface 8a of the soft mold 8 is increased. Maintain a fine spacing L of approximately 10 micrometers to 100 micrometers.

By such an operation, the resin layer G1 of the substrate G and the pattern portion 8a of the soft mold 8 are spaced apart from each other by the minute gap L and do not come into contact with each other or the soft mold ( The drooping phenomenon of 8) results in a so-called temporary contact state where some surfaces are in contact.

Then, the secondary alignment step (S3) is performed in the contact state.

In the second alignment step S3, the alignment means 18 is performed in the same manner as in the first alignment step S1 in a state in which the substrate G and the soft mold 8 are first bonded as shown in FIG. 9. Proceed by correcting the cementation position once more within the allowable deviation using).

That is, the second alignment step S3 is for precise alignment in a state where the substrate G and the soft mold 8 are close to each other at a minute interval L. FIG.

As described above, after the bonding positions of the substrate G and the soft mold 8 are secondarily aligned, the secondary bonding step S4 is performed.

In the second bonding step S4, the entire surface is uniformly uniform in a state where the resin layer G1 of the substrate G and the pattern surface 8a of the soft mold 8 are adjacent at a minute interval L. FIG. It is for precise bonding so as to contact.

That is, when the stage 12 is moved upward by the driving means 16 in the state where the substrate G and the soft mold 8 are in contact with each other, the resin of the substrate G is moved. The layer G1 and the entire pattern surface 8a of the soft mold 8 are in surface contact with each other in a parallel posture.

As described above, the second bonding step S4 may be performed to separate the etched and non-etched regions by an imprint operation in which the substrate G and the soft mold 8 are in surface contact with each other in a parallel posture. (G1) can be patterned.

In particular, the structure in which the imprint operation is divided into two parts as described above can reduce the alignment error that may occur during the movement of the substrate G as compared to the method of patterning by one imprint operation, for example. have.

In addition, the method for making an etching region on the substrate according to the embodiment of the present invention, in addition to the method of performing the alignment operation and the bonding operation twice, for example, the separation distance between the substrate (G) and the soft mold (8) In accordance with the above-described manner may proceed through two or more alignment and bonding operations.

1 is a view showing the internal structure of an apparatus for making an etched region on a substrate according to an embodiment of the present invention.

FIG. 2 is a view for explaining a substrate holder structure of an apparatus for forming an etching region in a substrate according to an embodiment of the present invention.

3 is a view for explaining the detailed structure and operation of the holder for a substrate of FIG.

4 is a view for explaining the detailed structure of the chamber case of the apparatus for making an etching region on the substrate according to an embodiment of the present invention.

5 is a view for explaining the structure of the control unit of the alignment means of the apparatus for making an etching region on the substrate according to an embodiment of the present invention.

6 is a view for explaining the operation of the control unit of FIG.

FIG. 7 is a process diagram schematically illustrating an entire working process of a method for forming an etching region in a substrate according to an embodiment of the present invention. FIG.

FIG. 8 is a diagram for describing a primary alignment step of FIG. 7.

9 is a view for explaining the first bonding step and the second alignment step of FIG.

FIG. 10 is a diagram for describing a second bonding step of FIG. 7.

Claims (11)

frame; A base plate fixedly installed in a state capable of buffering the inside of the frame; A chamber case having a transparent sealing space at an upper surface thereof, the chamber case being connected to and fixed to the frame side and spaced apart from the base plate so that interference due to contact with the base plate does not occur; A soft mold having a pattern surface for distinguishing between etched and non-etched regions and positioned in a closed space of the chamber case while being fixedly supported on the base plate side; A stage having a loading surface for loading a substrate and positioned below the soft mold at regular intervals in a sealed space of the chamber case; Driving means fixed to the base plate side to generate and transmit power for bonding the substrate toward the soft mold while up / down the stage; Alignment means for correcting the bonding position of the substrate according to the position of the soft mold; Apparatus for making an etched region in the substrate comprising a. The method according to claim 1, The base plate, An apparatus for making an etched region in a substrate which is mounted on a buffer support in the frame and is fixedly supported in a buffer state capable of absorbing vibration or shock. The method according to claim 1, The chamber case is, Connecting the confined space with a vacuum pump to create an etched region in the substrate which is converted into a vacuum atmosphere or released state by driving the pump. The method according to claim 1, The apparatus for making an etching region on the substrate, Further comprising a holder for the substrate, The substrate holder has a pressing surface, the apparatus for making an etched region in the substrate which is slidably mounted on the stage so that two or more edge portions of the substrate can be pressed in contact with the pressing surface. The method according to claim 1, The driving means includes: Using a motor or cylinder as a drive source, And up / down while pushing or pulling said stage. The method according to claim 1, The alignment means, A vision unit configured of a micro camera by sensing an alignment mark of the substrate and the soft mold; Adjusting unit consisting of a position adjusting member for changing the position of the stage; A control unit which receives the sensing signal from the vision unit to control driving of the adjusting unit; Apparatus for making an etched region in the substrate comprising a. The method of claim 6, The micro camera, It is fixed to the cradle side installed on the base plate side is installed so as to sense one or more alignment marks of the soft mold and the substrate through the transparent upper surface of the sealed space for making an etching area on the substrate Device. The method of claim 6, The position adjusting member, Use UVW stage or manual stage, And an inside of the chamber case supporting the stage so as to be rotatable and move forward / backward in a left / right direction. The method according to claim 1, The apparatus for making an etching region on the substrate, It further comprises a static elimination means, The static elimination means, using an ionizer for generating anions, Apparatus for making an etched region in the substrate that is installed inside or outside the chamber case. delete delete

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