JP2013026555A - Management device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem in which there is a risk that a suction unit is degraded to cause a reduction in alignment accuracy of a substrate and a shift of the substrate during a substrate transfer when a leaf spring of the substrate holder is degraded.SOLUTION: The management device, which manages a first suction unit, provided on a first substrate holder which holds a first substrate, and a second suction unit, provided on a second substrate holder which holds a second substrate, which exerts an attraction force of sandwiching the first substrate and the second substrate between the first substrate holder and the second substrate holder by pairing with the first suction unit, comprises: a detector which detects a state of the attraction force between the first suction unit and the second suction unit; a determination part which determines whether or not the attraction force between the first suction unit and the second suction unit is good on the basis of the state of the attraction force; and a warning part which warns to prompt a maintenance of at least one of the first suction unit and the second suction unit on the basis of the determination result of the determination part.

Description

  The present invention relates to a management apparatus.

A bonding apparatus is known in which a pair of substrate holders holding a substrate are accurately aligned, overlapped, and heated and pressed to bond a pair of substrates (for example, see Patent Document 1). The substrate holder includes a magnet and a magnetic unit that attract and fix the substrate holders to each other, thereby preventing the pair of substrate holders from being displaced.
[Prior art documents]
[Patent Literature]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2007-208031

  In the bonding apparatus, when the substrate holder is repeatedly used, the suction force of the suction unit is weakened, and the substrate may be shifted during the transport of the substrate.

  In order to solve the above problems, a management device according to the present invention is provided in a first suction unit provided in a first substrate holder that holds a first substrate, and a second substrate holder that holds a second substrate, A management device for a second suction unit that exhibits a suction force that sandwiches the first substrate and the second substrate between the first substrate holder and the second substrate holder in pairs with the first suction unit, A detection unit that detects the state of the suction force between the first suction unit and the second suction unit, and a determination that determines whether the suction force between the first suction unit and the second suction unit is good based on the state of the suction force And a warning unit that issues a warning prompting maintenance of at least one of the first suction unit and the second suction unit based on the determination result of the determination unit.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a top view which shows roughly the whole structure of the bonding apparatus which concerns on 1st Embodiment. It is a sectional side view which shows the structure of this aligner roughly. It is a top view which shows roughly the 1st board | substrate holder holding the 1st board | substrate. It is a top view showing roughly the 2nd substrate holder holding the 2nd substrate. It is a top view which shows the state just before workpiece | work pair formation schematically. It is a top view which shows the state immediately after workpiece | work pair formation schematically. It is a perspective view which shows a magnet unit roughly. It is a top view which shows roughly the leaf | plate spring of an adsorption | suction unit. It is a perspective view which shows roughly the state which the leaf | plate spring elastically deformed. FIG. 10 is a perspective view including an adsorber in the deformed state of the leaf spring shown in FIG. 9. It is a block block diagram which shows the structure of a control part roughly. It is a flowchart of the management process which manages the adsorption | suction unit performed in parallel with the joining process which joins 2 sets of board | substrates by the bonding apparatus. It is a conceptual diagram which shows a mode that this aligner detects the elastic reaction force of a leaf | plate spring by driving a biasing member below. It is a top view which shows roughly the whole structure of the bonding apparatus which concerns on 2nd Embodiment. It is a perspective view which shows a mode that the lower substrate holder was looked down from upper direction. It is a perspective view which shows a mode that the lower substrate holder was looked up from the downward direction. It is a perspective view which shows a mode that the upper substrate holder was looked up from the downward direction. It is a perspective view which shows a mode that the upper substrate holder was looked down from upper direction. In this aligner, it is sectional drawing which shows the state immediately before formation of a workpiece | work pair schematically. In this aligner, it is sectional drawing which shows the state immediately after formation of a workpiece | work pair. It is a sectional side view which shows the structure of a holder observation unit roughly. It is a block block diagram which shows the structure of a control part roughly. It is a flowchart of the management process which manages the adsorption | suction unit performed in parallel with the joining process which joins 2 sets of board | substrates by the bonding apparatus. It is a conceptual diagram which shows the example of the image data containing the mark for a deviation | shift detection observed through the observation hole by this aligner and holder observation unit.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a plan view schematically showing the overall structure of a bonding apparatus 100 according to the present embodiment. The laminating apparatus 100 bonds a plurality of substrates on which circuit patterns are formed by overlapping and heating and pressing so that electrodes to be bonded come into contact with each other.

  The bonding apparatus 100 includes an atmospheric environment unit 102 and a vacuum environment unit 202 that are formed inside a common housing 101. The atmospheric environment unit 102 has an overall control unit 110 and an EFEM (Equipment Front End Module) 112 facing the outside of the housing 101. The overall control unit 110 includes a storage unit 111 that stores a recipe that is a control program for controlling an apparatus included in the bonding apparatus 100. The overall control unit 110 controls each device included in the bonding apparatus 100 according to the recipe stored in the storage unit 111.

  The EFEM 112 includes three load ports 113 and a robot arm 116. Each load port is mounted with a FOUP (Front Opening Unified Pod) 114 which is a sealed pod for storing a substrate. The substrate 120 stored in the FOUP 114 is taken in and out by the robot arm 116. The substrate 120 here is a single silicon wafer, a compound semiconductor wafer or the like on which a plurality of circuit patterns are already formed periodically. In some cases, the substrate 120 stored in the FOUP 114 is a laminated substrate formed by already laminating a plurality of wafers.

  The atmospheric environment unit 102 includes a spare aligner 130, a main aligner 140, a holder rack 150, and a separation mechanism 160, which are arranged inside the housing 101, respectively. The holder rack 150 stores a plurality of substrate holders 300 that hold the substrate 120.

  The substrate holder 300 is divided into two types: a lower substrate holder 330 as an example of a first substrate holder and an upper substrate holder 310 as an example of a second substrate holder. The lower substrate holder 330 and the upper substrate holder 310 are paired. used. When the substrate 120 held by the upper substrate holder 310 is distinguished from the substrate 120 held by the lower substrate holder 330, the substrate 120 held by the upper substrate holder 310 is the substrate 120 held by the first substrate 121 and the lower substrate holder 330. Is called a second substrate 122.

  The holder rack 150 includes a barcode reader 152 on the surface side where the substrate holder 300 is inserted and removed. The substrate holder 300 is provided with a barcode 302 in which a management ID that is different for each substrate holder 300 is encoded. The barcode reader 152 reads the barcode 302 when the substrate holder 300 is carried in / out by the robot arm 175. Then, the barcode reader 152 transmits a management ID obtained by decoding the read barcode 302 to the overall control unit 110. The overall control unit 110 receives the management ID from the holder rack 150 and thereby identifies the substrate holder 300 that has been carried into and out of the holder rack 150.

  The preliminary aligner 130 preliminarily aligns the substrate 120 so that when the substrate 120 is carried into the main aligner 140, the alignment mark of the substrate 120 is within the field of view of the microscope included in the aligner 140. The spare aligner 130 includes a substrate aligner 131 and a holder aligner 134.

  The substrate aligner 131 includes a substrate table 132 and a detector 133. The substrate 120 is placed on the substrate table 132 by the robot arm 116. The detector 133 overlooks the substrate 120 and detects the position and orientation of the substrate 120. The substrate aligner 131 adjusts the position and orientation of the substrate 120 so as to fall within a predetermined range.

  The holder aligner 134 includes a holder table 135 and a detector 136. The substrate holder 300 transferred from the holder rack 150 is placed on the holder table 135. The detector 136 overlooks the substrate holder 300 and detects the position and orientation of the substrate holder 300. The holder aligner 134 adjusts the position and orientation of the substrate holder 300 so as to fall within a predetermined range.

  The substrate slider 138 conveys the substrate 120 whose position has been adjusted by the substrate aligner 131 from the substrate aligner 131 to the holder aligner 134. The substrate slider 138 places the substrate 120 on the substrate holder 300 whose position is adjusted by the holder aligner 134.

  The holder table 135 is provided with a power supply terminal 139 and is connected to a power supply terminal provided on the back surface of the substrate holder 300 to supply power to the substrate holder 300. The substrate holder 300 has an electrostatic chuck inside, and the electrostatic chuck electrostatically attracts the substrate 120 with electric power supplied from the holder aligner 134. As a result, the substrate holder 300 holds the substrate 120. The substrate 120 and the substrate holder 300 integrated by suction may be referred to as a “work”. The second substrate 122 and the upper substrate holder 310 integrated by suction may be referred to as “upper workpiece”, and the first substrate 121 and the lower substrate holder 330 integrated by suction may be referred to as “lower workpiece”. . The workpiece formed by the preliminary aligner 130 is placed on the transfer port 178 by the robot arm 171 and is carried into the main aligner 140 by the robot arm 176.

  The aligner 140 positions and superimposes a plurality of alignment marks formed on the substrate 120 of each work, with the upper work and the lower work facing each other. The alignment accuracy required for the aligner 140 is higher than that of the preliminary aligner 130. When the alignment is performed so that the electrodes to be bonded of the substrate 120 on which the circuit pattern is formed are in contact with each other, the accuracy on the submicron level is high. Desired.

  The two substrates 120 overlapped by the aligner 140 are sandwiched between the upper substrate holder 310 and the lower substrate holder 330. The two substrates 120 are temporarily fixed by the attractive force generated between the permanent magnet provided on the upper substrate holder 310 and the magnetic material adsorber provided on the lower substrate holder 330. The combination of the upper substrate holder 310, the lower substrate holder 330, and the two substrates 120 sandwiched between them may be referred to as a “work pair”. The workpiece pair is placed on the transfer port 178 by the robot arm 176. Then, the robot arm 171 transfers the workpiece pair from the transfer port 178 to the separation mechanism 160 in accordance with the control of the transfer control unit 172. Then, the workpiece pair is carried into the load lock chamber 220 by the robot arm 175.

  The vacuum environment unit 202 includes a load lock chamber 220, a robot arm 230, and a plurality of heating and pressing units 240. The robot arm 230 conveys the held work pair between the load lock chamber 220 and the heating / pressurizing unit 240. The load lock chamber 220 has shutters 222 and 224 that open and close alternately on the atmosphere environment section 102 side and the vacuum environment section 202 side, and leaks the internal atmosphere of the atmosphere environment section 102 to the vacuum environment section 202 side. Instead, the work pair is carried into the vacuum environment unit 202.

  The robot arm 230 carries the work pair carried out from the load lock chamber 220 into one of the plurality of heating and pressing units 240. The heating / pressurizing unit 240 heats and presses the loaded workpiece pair. When the work pair is heated and pressurized, the two sets of substrates 120 are permanently bonded. The two sets of substrates 120 bonded by the heating and pressing unit 240 may be collectively referred to as “bonded substrates”.

  The workpiece pair after substrate bonding is carried into the load lock chamber 220 by the robot arm 230 and carried into the separation mechanism 160 by the robot arm 175. The separation mechanism 160 separates the bonded substrate attached to the substrate holder 300 from the substrate holder 300 by being heated and pressurized. The separated bonded substrate is placed on the lower substrate holder 330 without being adsorbed.

  After separating the bonded substrates, the separation mechanism 160 reads the barcode 302 of the upper substrate holder 310 with the barcode reader 162. Then, the separation mechanism 160 notifies the overall control unit 110 of the management ID obtained by decoding the barcode 302. The upper substrate holder 310 is inverted by the robot arm 176 and then returned to the holder rack 150 or transferred to the spare aligner 130 for mounting the next substrate 120. The lower substrate holder 330 is transported to the spare aligner 130 by the robot arm 171 with the bonded substrate placed thereon. Then, the bonded substrate is accommodated in the FOUP 114 by the robot arm 116. Then, the lower substrate holder 330 is returned to the holder rack 150 or the position thereof is adjusted by the holder aligner 134 to mount the next substrate 120. As described above, the process in which the bonding apparatus 100 mounts the two sets of substrates 120 on the substrate holder 300, overlaps them, and bonds them by heating and pressing may be referred to as “substrate bonding process”.

  FIG. 2 is a cross-sectional view schematically showing the structure of the aligner 140. The upper stage 141 of the aligner 140 is fixed to the ceiling 147. An upper microscope 143 and a barcode reader 146 are fixed to the ceiling 147. On the other hand, the lower stage 142 includes a lower mounting table 421, an elevating unit 422, a base unit 423, a driving unit 424, and a base 425.

  A substrate holder 300 on which the substrate 120 is mounted is placed on the lower mounting table 421. The lower mounting table 421 holds the substrate holder 300 by vacuum suction. The elevating unit 422 moves the lower mounting table 421 up and down. A lower microscope 144 is installed on the lower mounting table 421. When the lower mounting table 421 moves up and down by the lifting unit 422, the lower microscope 144 moves up and down together. The lower microscope 144 observes the workpiece placed on the upper stage 141.

  On the other hand, the upper microscope 143 observes the workpiece placed on the lower placement table 421. The pedestal portion 423 is installed on the driving portion 424. The drive unit 424 is installed on the base 425 and moves the pedestal unit 423 in the XY plane direction. Here, a processing flow for forming a work pair by superposing the upper work and the lower work will be described.

  The upper work is first carried into the aligner 140 by the robot arm 176. The aligner 140 reads the barcode 302 of the upper substrate holder 310 with the barcode reader 146 and transmits the management ID to the overall control unit 110. Then, the upper work is reversed by the robot arm 176 and is pressed against the upper stage 141 with the surface holding the substrate facing downward. The upper stage 141 sucks and holds the upper work.

  Next, the robot arm 176 places the lower work on the lower mounting table 421. The aligner 140 images the surface of the substrate 120 of the lower workpiece with the upper microscope 143 while moving the lower mounting table 421 by the driving unit 424. The aligner 140 detects the coordinates of a plurality of alignment marks. Next, the aligner 140 images the surface of the substrate 120 of the upper workpiece with the lower microscope 144 while moving the lower mounting table 421 by the driving unit 424. The aligner 140 detects the coordinates of a plurality of alignment marks formed on the substrate 120 of the upper workpiece.

  The aligner 140 aligns the positions of the substrates 120 so that the detected misalignment of the corresponding alignment marks on both the substrates 120 is minimized. After the alignment is completed, the lower mounting table 421 is raised to bring the lower work substrate 120 and the upper work substrate 120 into contact with each other to form a work pair. The workpiece pair thus formed is carried out from the aligner 140 by the robot arm 176.

  FIG. 3 is a plan view schematically showing the upper substrate holder 310 holding the first substrate 121. The upper substrate holder 310 includes a holder main body 312 and a magnet unit 320 as an example of a first attracting unit. The holder body 312 is integrally formed of a highly rigid material such as ceramics or metal, and has a disk shape whose diameter is slightly larger than that of the first substrate 121.

  The holder main body 312 includes a holding region 314 for holding the first substrate 121 on the surface thereof. The holding region 314 is polished and has high flatness. The first substrate 121 is held by suction using an electrostatic force. Specifically, a voltage is applied to the electrode 316 embedded in the holder main body 312 via a power supply terminal 318 provided on the back surface of the holder main body 312, so that the upper substrate holder 310 and the first substrate 121 are interposed. A potential difference is generated to attract the first substrate 121 to the holding region 314.

  A plurality of magnet units 320 are arranged in an outer peripheral region on the surface holding the first substrate 121 and outside the held first substrate 121. In the case of the figure, a total of six magnet units 320 are arranged every 120 degrees with two as one set.

  FIG. 4 is a plan view schematically showing the lower substrate holder 330 holding the second substrate 122. The lower substrate holder 330 includes a holder main body 332 and a suction unit 340. The holder main body 332 is integrally formed of a highly rigid material such as ceramic or metal, and has a disk shape whose diameter is slightly larger than that of the second substrate 122.

  The holder main body 332 includes a holding region 334 that holds the second substrate 122 on the surface thereof. The holding region 334 is polished and has high flatness. The second substrate 122 is held by suction using an electrostatic force. Specifically, a voltage is applied to the electrode 336 embedded in the holder main body 332 via a power supply terminal 338 provided on the back surface of the holder main body 332, so that the lower substrate holder 330 and the second substrate 122 are interposed. A potential difference is generated to attract the second substrate 122 to the lower substrate holder 330.

  A plurality of suction units 340 are arranged on the outer surface of the surface that holds the second substrate 122 and outside the held second substrate 122. In the case of the figure, a total of six suction units 340 are arranged every 120 degrees with two as one set. The adsorption unit 340 includes an adsorber 341 as an example of a second adsorption unit and a leaf spring 342 as an example of an elastic member. The adsorber 341 is made of a magnetic material. The adsorber 341 is fixed on the leaf spring 342 and receives the elastic force of the leaf spring 342 in a direction perpendicular to the holding region 334.

  The adsorption unit 340 is disposed so as to correspond to the magnet unit 320 of the upper substrate holder 310, respectively. When the upper substrate holder 310 that holds the first substrate 121 and the lower substrate holder 330 that holds the second substrate 122 face each other, an attractive force is generated between the adsorption unit 340 and the magnet unit 320. The upper substrate holder 310 and the lower substrate holder 330 sandwich and fix the first substrate 121 and the second substrate 122 by this suction force.

  FIG. 5 is a cross-sectional view schematically showing a state immediately before the work pair is formed in the aligner 140. Specifically, the first substrate 121 held by the upper substrate holder 310 held by vacuum suction on the upper stage 141 and the second substrate 122 held by the lower substrate holder 330 held by vacuum suction on the lower stage 142 are aligned. It is sectional drawing of the state which completed.

  When performing alignment between the first substrate 121 and the second substrate 122, that is, when the lower stage 142 is moved in the XY plane, the first substrate 121 and the second substrate 122 are not in contact with each other so as not to contact each other. A slight gap is formed. In this state, the upper stage 141 includes a plurality of urging members 430 so that the attractor 341 is not coupled to the magnet unit 320.

  The biasing member 430 mainly includes a push pin 432 that is a columnar member, and a cylinder portion 434 that drives the push pin 432 in the vertical direction. The push pin 432 passes through the inside of the through hole 321 provided in the magnet unit 320 at the extended position, and the tip thereof protrudes from the through hole 321. Further, in the storage position, a part of the push pin 432 is stored inside the cylinder portion 434 and retracts from the through hole 321. That is, the push pin 432 moves forward and backward in the Z-axis direction by driving the cylinder portion 434 inside the through hole 321.

  When the first substrate 121 and the second substrate 122 can be moved relative to each other in the XY direction, the push pin 432 is controlled to the extended position so as to contact the upper surface of the attractor 341, and to the magnet unit 320 of the attractor 341. Block the binding. That is, the attracting element 341 is installed on the leaf spring 342, but the push pin 432 presses the attracting element 341 from above so that the leaf spring 342 is elastically deformed and the attracting element 341 is not coupled to the magnet unit 320. The elastic deformation of the leaf spring 342 is suppressed. The push pin 432 is provided with a load cell 436. The aligner 140 detects the pressure applied to the push pin 432 by the load cell 436.

  It should be noted that the alignment of the first substrate 121 and the second substrate 122 by the aligner 140 is performed with a moving amount such that the tip of the push pin 432 slides on the upper surface of the adsorber 341 in the final fine adjustment stage. Is done. In the other stage, for example, the stage of observing the alignment mark by a microscope, the first substrate 121 and the second substrate 122 are relatively far apart in the XYZ axis directions, so that the attractor 341 is disposed in the magnet unit. There is no unexpected binding to 320. Therefore, in principle, the push pin 432 is controlled to the extended position when the magnetic force of the magnet unit 320 is applied to the attracting element 341 and it is desired to restrict the coupling between them, and is controlled to the retracted position otherwise.

  FIG. 6 is a cross-sectional view schematically showing a state immediately after the work pair is formed in the aligner 140. Specifically, FIG. 5 shows a state in which the lower stage 142 is driven in the Z-axis direction so that the surface of the first substrate 121 and the surface of the second substrate 122 are in contact with each other, and the push pin 432 is stored. The state where the attractor 341 is coupled to the magnet unit 320 under the control of the position is shown.

  In the process of shifting from the state of FIG. 5 to the state of FIG. 6, the leaf spring 342 is elastically deformed with the operation of moving the push pin 432 to the storage position, and the attractor 341 is coupled to the magnet unit 320. At this time, the elastic force of the leaf spring 342 acts in a direction that pulls the lower substrate holder 330 and the upper substrate holder 310 together to increase the clamping force of the first substrate 121 and the second substrate 122 by the lower substrate holder 330 and the upper substrate holder 310. . In the separation mechanism 160, when the bonded substrate is separated from the substrate holder 300, the reverse process is performed. That is, the separation mechanism 160 releases the coupling between the magnet unit 320 and the attractor 341 by pushing down the attractor 341 with a push pin.

  FIG. 7 is a perspective view schematically showing the magnet unit 320. The magnet unit 320 includes a magnet 322 and a support portion 325 that accommodates and supports the magnet 322. The support portion 325 has a cylindrical accommodating portion that accommodates the magnet 322. Further, the support portion 325 has a screw hole 328 through which a screw fixed to the upper substrate holder 310 is passed. The support portion 325 is made of, for example, carbon steel S25C. The support portion 325 has a facing surface 329 that faces the adsorbent 341.

  The magnet 322 is a columnar permanent magnet that is inserted into the accommodating portion of the support portion 325, and has a magnetic force of about 8N, for example. An insertion hole 323 through which the push pin 432 is inserted is provided on the central axis of the magnet 322, and an insertion hole 326 is also provided in the support portion 325 so as to connect to the insertion hole 323. A through hole 321 is formed by the insertion hole 323 and the insertion hole 326.

  FIG. 8 is a plan view schematically showing the leaf spring 342. The leaf spring 342 is an elastic member having elasticity in a direction orthogonal to the holding region 334 of the lower substrate holder 330, and is formed of, for example, high-strength precipitation hardening stainless steel such as SUS631. The leaf spring 342 includes a circular portion 343 near the center and a mounting portion 344 protruding in an ear shape, and the center portion has a diameter of 22 mm and a thickness of 0.1 mm.

  The circular portion 343 is formed with a pair of slits 346 extending along the same direction and spaced from each other in a direction perpendicular to the extending direction. Each slit 346 has the same distance from the center of the circular portion 343. A band-shaped portion 348 is formed near the center of the circular portion 343 by the two slits 346.

  The belt-like portion 348 is provided with a through hole 347 for fixing the adsorber 341 at a position that becomes the center of the circular portion 343. Similarly, the attachment portion 344 has a screw hole 345 through which a screw for fixing the leaf spring 342 to the upper substrate holder 310 is passed. The plate spring 342 has a holder main body so that two screw holes are along the circumferential direction of the upper substrate holder 310 and the extension direction of the slit 346 is along the substantially radial direction of the upper substrate holder 310 with respect to the upper substrate holder 310. It is arranged at the peripheral edge of 332.

  FIG. 9 is a perspective view schematically showing a state in which the leaf spring 342 is elastically deformed upward. Specifically, it represents a deformed state when the attracting element 341 fixed to the leaf spring 342 is attracted to and coupled to the magnet unit 320. However, the adsorber 341 is not shown in the drawing.

  The leaf spring 342 is lifted so that the belt-like portion 348 has the through hole 347 as a vertex when the attractor 341 is attracted to the magnet unit 320. As the plate spring 342 is lifted, the leaf spring 342 is elastically deformed so that the two portions connected to the belt-like portion 348 in the peripheral portion of the circular portion 343 approach each other. At this time, each slit 346 deforms the opening shape so as to allow the respective deformation.

  10 is a perspective view including the adsorber 341 in a deformed state of the leaf spring 342 shown in FIG. The adsorber 341 is fixed to the leaf spring 342 through a through hole 347 with a fastening member such as a screw. 9 and 10 illustrate the state in which the leaf spring 342 is elastically deformed in the upward direction, the leaf spring 342 is also elastically deformed in the downward direction. For example, when the attracting member 430 is pushed down by the biasing member 430, the leaf spring 342 is elastically deformed downward. At this time, the biasing member 430 receives an upward elastic reaction force from the leaf spring 342.

  FIG. 11 is a block diagram schematically showing the system configuration of the overall control unit 110. The bonding apparatus 100 according to the present embodiment executes a management process for managing the leaf spring 342 of the substrate holder 300 in parallel with the substrate bonding process. The overall control unit 110 includes a storage unit 111, a drive control unit 502, a detection unit 504, a determination unit 506, a warning unit 510, a display unit 512, an audio output unit 514, and a communication unit 516.

  The storage unit 111 stores the management ID of each substrate holder 300 in association with the number of times each substrate holder 300 has been used for the substrate bonding process. The number of times each substrate holder 300 is used for the substrate bonding process is counted by the overall control unit 110 that controls the overall operation of the bonding apparatus 100. Then, the data in the storage unit 111 is sequentially updated by the overall control unit 110.

  The drive control unit 502 controls each device in the bonding apparatus 100 to execute substrate bonding processing and leaf spring 342 management processing. The detection unit 504 detects the elastic reaction force of the leaf spring 342. The determination unit 506 compares the elastic reaction force detected by the detection unit 504 with a predetermined reference reaction force to determine whether the leaf spring 342 is good or bad.

  The warning unit 510 issues a warning that prompts maintenance of the leaf spring 342 based on the result determined by the determination unit 506. The display unit 512 displays a warning prompting maintenance of the leaf spring 342 according to the control of the warning unit 510. The voice output unit 514 outputs a warning for prompting maintenance of the leaf spring 342 according to the control of the warning unit 510. The communication unit 516 transmits data including a warning for prompting maintenance of the leaf spring 342 to another device via the network according to the control of the warning unit 510.

  FIG. 12 is a flowchart of a management process for managing the leaf spring 342 executed by the bonding apparatus 100 in parallel with the substrate bonding process. FIG. 13 is a conceptual diagram showing how the aligner 140 detects the elastic reaction force of the leaf spring 342 by driving the biasing member 430 downward. The flow shown in FIG. 12 starts when the upper work and the lower work are carried into the aligner 140 in the substrate bonding process.

  In step S <b> 1202, the aligner 140 notifies the overall control unit 110 of the management ID obtained by reading the barcode 302 of the upper substrate holder 310 and the lower substrate holder 330 constituting the upper workpiece. The overall control unit 110 refers to the management ID and usage count correspondence data stored in the storage unit 111 and acquires the usage counts of the upper substrate holder 310 and the lower substrate holder 330 corresponding to the notified management ID.

  In step S1204, the aligner 140 aligns the upper work and the lower work. The aligner 140 performs alignment by driving the lower stage 142 in the XY plane direction with reference to the alignment marks of the first substrate 121 and the second substrate 122. At this time, the lower stage 142 and the upper stage 141 are relatively far apart in the Z-axis direction, and the magnetic force of the magnet unit 320 does not affect the attractor 341.

  In step S1206, overall control unit 110 determines whether the number of times of use of upper substrate holder 310 and lower substrate holder 330 acquired in step S1202 is a multiple of a predetermined number. The predetermined number of times is set by the user according to the frequency of checking the quality of the leaf spring 342, for example, 100 times. If the determination is affirmative in step S1206, the process proceeds to step S1208.

  In step S1208, the aligner 140 drives the push pin 432 downward by the cylinder portion 434, and biases the attractor 341 in a direction away from the magnet unit 320 against the elastic force of the leaf spring 342. The aligner 140 moves the adsorber 341 downward from a reference position, that is, a state without elastic deformation, by a predetermined distance.

  In step S1210, the aligner 140 detects, by the load cell 436, the elastic reaction force received by the push pin 432 when the adsorber 341 is pushed down from the reference position by a predetermined distance. The aligner 140 stores the detected elastic reaction force in the storage unit 111.

In step S <b> 1212, the determination unit 506 determines whether the leaf spring 342 is good or not based on whether or not the elastic reaction force detected in step S <b> 1210 is less than the reference reaction force. The reference reaction force is set by conducting an experiment in advance. For example, let X [N] be an elastic reaction force when the leaf spring 342 in a state without deterioration is pushed down by a predetermined distance, and the elastic reaction force decreases by (0.5) ⁿ X [N] due to the deterioration. Nine leaf springs 342 are prepared (that is, n = 1 to 9). Then, a workpiece pair is formed by the lower substrate holder 330 and the upper substrate holder 310 on which each leaf spring 342 is installed, and a conveyance test is performed. The elastic reaction force of the leaf spring 342 in which the frequency of occurrence of deviation exceeds 5% Set as the standard reaction force.

  If the determination unit 506 determines in step S1212 that the detected elastic reaction force is lower than the reference reaction force, the process proceeds to step S1214. In step S <b> 1214, the warning unit 510 displays a warning for prompting maintenance of the management ID of the lower substrate holder 330 and the leaf spring 342 on the display unit 512.

  If the determination is negative in step S1206 and if the determination is negative in step S1212, the process proceeds to step S1216. In step S1216, the aligner 140 overlaps the upper work and the lower work to form a work pair. The formed workpiece pair is unloaded from the main aligner 140 by the robot arm 176 and transferred to the vacuum environment unit 202.

  In step S1218, the overall control unit 110 determines whether an instruction to end the substrate bonding process has been received. If the determination is negative, the process returns to step S1202, and the management IDs of the next upper substrate holder 310 and lower substrate holder 330 are acquired. If the determination is affirmative, the process ends.

  That is, in the present embodiment, when the substrate holder 300 is used a predetermined number of times, the quality of the leaf spring 342 is determined by detecting the elastic reaction force of the leaf spring 342, and is lower than the reference reaction force. In this case, a warning prompting the maintenance of the leaf spring is displayed. The warning allows the user to know that the leaf spring 342 is in a state requiring maintenance. Therefore, for example, during the substrate bonding process, the first substrate 121 sandwiched between the upper substrate holder 310 and the lower substrate holder 330 due to the deterioration of the leaf spring 342 while being transferred from the aligner 140 to the vacuum environment unit 202. It is possible to prevent the second substrate 122 from shifting. As a result, a contact failure between electrodes to be bonded due to a shift between the first substrate 121 and the second substrate 122 can be prevented, which can contribute to an improvement in the yield of the substrate bonding process.

  In the above-described embodiment, an example in which a warning prompting maintenance of the leaf spring 342 is displayed when the detected elastic reaction force is lower than the reference reaction force in step S1212 has been described. A warning may be displayed after being accommodated in 150. For example, the overall control unit 110 stores the substrate holder 300 in the holder rack 150 after the substrate bonding process for the substrate 120 held by the target substrate holder 300 is completed. Then, the warning unit 510 displays the management ID of the substrate holder 300 after the storage, a warning for prompting maintenance of the leaf spring 342, and the shelf number of the holder rack 150 that stores the substrate holder 300. By displaying the shelf numbers together, the user who sees the warning can quickly carry out the maintenance of the target substrate holder 300 from the corresponding shelf number.

  Then, the warning unit 510 erases the warning displayed on the display unit 512 when the corresponding substrate holder 300 is unloaded from the holder rack 150. Specifically, the holder rack 150 notifies the overall control unit 110 that the substrate holder 300 has been carried out, and the received overall control unit 110 displays a warning corresponding to the notified shelf number. Control to end.

  In the above embodiment, in step S1212, when the determination unit 506 determines that the elastic reaction force of the leaf spring 342 detected by the detection unit 504 is lower than the reference reaction force, an example of performing a warning for prompting maintenance is performed. And explained. Further, the warning unit 510 may display the remaining number of uses until the leaf spring 342 requires maintenance according to the difference between the detected elastic reaction force and the reference reaction force.

  For example, when the determination unit 506 sets the elastic reaction force of the undegraded leaf spring 342 to X [N] and the reference reaction force to 0.6 X [N], the detected elastic reaction force is 0.7 X [N ], It is determined that the remaining number of uses is 200, and in the case of 0.65X [N], the remaining number of uses is 100. The remaining number of uses for the difference between the elastic reaction force and the reference reaction force is stored in advance in the storage unit 111 associating the difference with the number of use, and the decision unit 506 refers to the correspondence table. to decide. The correspondence table may be set by the user based on experience or may be set by conducting an experiment in advance.

  Then, the warning unit 510 displays the management ID and the remaining usage count of the target substrate holder 300 on the display unit 512. As described above, by exemplifying the remaining number of times of use, the user is ready to perform maintenance of the leaf spring 342. Note that the warning unit 510 may determine and display the remaining usage time instead of the remaining usage count.

  Further, in the above-described embodiment, the warning unit 510 has been described by taking an example in which a warning is displayed on the display unit 512. However, the warning unit 510 may be configured to output a warning through a voice output unit 514. Still further, data including a warning may be transmitted to a computer installed in a management company of the substrate holder 300. By informing the management company that the substrate holder 300 requires maintenance, the replacement substrate holder 300 can be provided quickly.

  FIG. 14 is a plan view schematically showing the overall structure of the bonding apparatus according to the second embodiment. Elements common to those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted. A bonding apparatus 100 according to the second embodiment includes a holder observation unit 180.

  FIG. 15 is a perspective view schematically showing a state in which the lower substrate holder 370 is looked down from above. FIG. 16 is a perspective view showing the same lower substrate holder 370 as viewed from below. The lower substrate holder 370 includes a holder main body 910, an adsorber 920 and a leaf spring 925 as an example of a first adsorption unit.

  The holder body 910 is integrally formed of a highly rigid material such as sintered ceramics or metal, and has a disk shape whose diameter is slightly larger than that of the second substrate 122. The holder main body 910 includes a substrate holding surface 911 that holds the second substrate 122. The substrate holding surface 911 has high flatness and is in close contact with the second substrate 122. The substrate holding surface 911 is formed with a through hole 916 that passes through the front and back of the holder body 910. Further, a deviation detection mark 915 is provided in a region outside the substrate holding surface 911. A barcode 302 is provided on the front and back surfaces of the holder body 910.

  The adsorbers 920 are formed of a magnetic material, and a plurality of the adsorbers 920 are arranged on the outer peripheral side of the substrate holding surface 911 in the holder main body 910. The plate springs 925 are made of titanium, and a plurality of leaf springs 925 are arranged on the outer peripheral side of the substrate holding surface 911 in the holder main body 910. The adsorber 920 is fixed on the plate spring 925 and receives the elastic force of the plate spring 925 in a direction perpendicular to the substrate holding surface 911. The power supply terminal 930 is embedded in the holder main body 910 on the back surface of the lower substrate holder 370. The lower substrate holder 370 electrostatically attracts the substrate 120 by receiving power supply through the power supply terminal 930.

  FIG. 17 is a perspective view showing the upper substrate holder 360 as viewed from below. FIG. 18 is a perspective view schematically showing the same upper substrate holder 360 as viewed from above. Elements common to the lower substrate holder 370 are denoted by the same reference numerals and description thereof is omitted.

  The upper substrate holder 360 includes a permanent magnet 940 as an example of a second adsorption unit. A plurality of permanent magnets 940 are arranged on the outer peripheral side of the substrate holding surface 910 in the holder main body 910. The permanent magnet 940 and the attractor 920 of the lower substrate holder 370 are arranged at corresponding positions. Then, when the lower substrate holder 370 holding the second substrate 122 and the upper substrate holder 360 holding the first substrate 121 face each other, an attractive force is generated between the attractor 920 and the permanent magnet 940. The lower substrate holder 370 and the upper substrate holder 360 are clamped and fixed in a state where the first substrate 121 and the second substrate 122 are overlapped by this suction force.

  An observation hole 914 penetrating the front and back is provided in a region outside the substrate holding surface 911 of the upper substrate holder 360. The observation hole 914 faces the displacement detection mark 915 of the lower substrate holder 370 when the upper substrate holder 360 and the lower substrate holder 370 are overlapped. Accordingly, the deviation detection mark 915 can be observed from the back surface side of the upper substrate holder 360 through the observation hole 914. In the present embodiment, the bonding apparatus 100 includes a deviation detection mark 915 observed with the main aligner 140, and a deviation detection mark 915 observed with the holder observation unit 180 after being transferred from the aligner 140 to the holder observation unit 180. Are detected, a shift between the lower substrate holder 370 and the upper substrate holder 360 that occurs during conveyance is detected.

  FIG. 19 is a cross-sectional view schematically showing a state immediately before the work pair is formed in the aligner 140. Specifically, the second substrate 122 held by the lower substrate holder 370 held by vacuum suction on the lower stage 142 and the first substrate 121 held by the upper substrate holder 360 held by vacuum suction on the upper stage 141 are aligned. It is sectional drawing of the state which completed.

  When performing alignment between the first substrate 121 and the second substrate 122, that is, when the lower stage 142 is moved in the XY plane, the first substrate 121 and the second substrate 122 are not in contact with each other so as not to contact each other. A gap of several millimeters is formed. The upper stage 141 includes a plurality of urging members 450 so that the attractor 920 is not coupled to the permanent magnet 940.

  The biasing member 450 mainly includes a push pin 452 that is a columnar member, and a cylinder portion 454 that drives the push pin 452 in the vertical direction. In the extended position, the push pin 452 has a holder insertion hole 938 provided in the upper substrate holder 360 and a permanent magnet provided in a permanent magnet 940 that is aligned and aligned with the holder insertion hole 938. The tip protrudes from the permanent magnet insertion hole 942 through the inside of the insertion hole 942. Further, in the storage position, a part of the push pin 452 is stored inside the cylinder portion 454 and retracts from each insertion hole. That is, the push pin 452 moves back and forth in the vertical direction by driving the cylinder portion 454 inside each insertion hole.

  When the first substrate 121 and the second substrate 122 can be moved relative to each other in the XY direction, the push pin 452 is controlled to the extended position so as to come into contact with the upper surface of the attractor 920, and to the permanent magnet 940 of the attractor 920. Block the binding. That is, the attractor 920 is installed on the leaf spring 925, but the push pin 452 presses the attractor 920 from above so that the leaf spring 925 is elastically deformed and the attractor 920 is not coupled to the permanent magnet 940. The elastic deformation of the leaf spring 925 is suppressed.

  FIG. 20 is a cross-sectional view schematically showing a state immediately after the work pair is formed in the aligner 140. Specifically, FIG. 19 shows a state in which the lower stage 142 is driven in the Z-axis direction so that the surface of the first substrate 121 and the surface of the second substrate 122 are in contact with each other, and the push pin 452 is housed. The state is shown in which the attractor 920 is coupled to the permanent magnet 940 under the control of the position.

  In the process of shifting from the state of FIG. 19 to the state of FIG. 20, the leaf spring 925 is elastically deformed with the operation of moving the push pin 452 to the storage position, and the attractor 920 is coupled to the permanent magnet 940. At this time, the elastic force of the leaf spring 925 acts to pull the lower substrate holder 370 and the upper substrate holder 360 closer together and increase the clamping force of the first substrate 121 and the second substrate 122 by the lower substrate holder 370 and the upper substrate holder 360. .

  FIG. 21 is a side sectional view schematically showing the structure of the holder observation unit 180. The holder observation unit 180 includes a mounting table 182 and an observation unit 184. A work pair formed by the aligner 140 is carried into the mounting table 182 by the robot arm 171. The workpiece pair is arranged at a position where the observation hole 914 of the upper substrate holder 360 falls within the imaging field of view of the observation unit 184.

  The observation unit 184 images the shift detection mark 915 of the lower substrate holder 370 that enters the imaging field of view through the observation hole 914 and the observation hole 914. Then, the holder observation unit 180 transmits image data including the observation hole 914 and the deviation detection mark 915 acquired by imaging to the overall control unit 118.

  FIG. 22 is a block diagram schematically showing the system configuration of the overall control unit 118. The bonding apparatus 100 according to the present embodiment executes a management process for managing the suction unit of the substrate holder 300 in parallel with the substrate bonding process. The overall control unit 118 includes a storage unit 111, a drive control unit 602, a detection unit 604, a determination unit 606, a warning unit 610, a display unit 612, an audio output unit 614, and a communication unit 616.

  The storage unit 111 stores a recipe that is a control program for controlling each device in the bonding apparatus 100. In addition, the storage unit 111 stores the management ID of each substrate holder 300 and the number of times each substrate holder 300 has been used for the substrate bonding process in association with each other. The total number of times used for the substrate bonding process is counted by the overall control unit 118, and the data in the storage unit 111 is sequentially updated. For example, when the management controller 118 receives a management ID from the barcode reader 162 of the separation mechanism 160, the overall control unit 118 counts up the number of times the substrate holder 300 corresponding to the management ID has been used for the substrate bonding process.

  The drive control unit 602 controls each device in the bonding apparatus 100 to execute a substrate bonding process and a management process for the first suction unit and the second suction unit. The detection unit 604 detects a shift amount between the substrate holders 300 when the two substrate holders 300 are moved in a state where the first suction unit and the second suction unit exert suction power and sandwich the substrate 120 therebetween. To do. The determination unit 606 determines the quality of the first suction unit and the second suction unit based on the deviation amount detected by the detection unit 604.

  The warning unit 610 issues a warning that prompts maintenance of at least one of the first suction unit and the second suction unit based on the result determined by the determination unit 606. The display unit 612 displays a warning that prompts maintenance of at least one of the first suction unit and the second suction unit according to the control of the warning unit 610. The voice output unit 614 outputs a warning prompting maintenance of at least one of the first suction unit and the second suction unit in accordance with the control of the warning unit 610. The communication unit 616 transmits data including a warning that prompts maintenance of at least one of the first suction unit and the second suction unit to another device via the network according to the control of the warning unit 610.

  FIG. 23 is a flowchart of a management process for managing the first suction unit and the second suction unit, which is executed by the bonding apparatus 100 in parallel with the substrate bonding process. FIG. 24 is a conceptual diagram illustrating an example of image data including an observation hole 914 and a deviation detection mark 915 captured by the aligner 140 and the holder observation unit 180. The flow of the flowchart shown in FIG. 23 starts when the upper work and the lower work formed by the preliminary aligner 130 are carried into the main aligner 140 and a work pair is formed by the main aligner 140 in the substrate bonding process.

  In step S2302, the aligner 140 observes the deviation detection mark 915 of the lower substrate holder 370 through the observation hole 914 of the upper substrate holder 360. The aligner 140 moves the lower mounting table 421 on which the work pair is mounted by the driving unit 424 to place the observation hole 914 of the upper substrate holder 360 in the field of view of the upper microscope 143. The aligner 140 captures an image including the observation hole 914 and the shift detection mark 915 with the upper microscope 143. The aligner 140 transmits the captured image data to the overall control unit 118. The overall control unit 118 stores the received image data as first image data 801 in the storage unit 111.

  In step S 2304, first, the robot arm 176 unloads the work pair from the aligner 140 and places it on the delivery port 178. Then, the robot arm 171 transfers the workpiece pair from the transfer port 178 to the holder observation unit 180 in accordance with control by the transfer control unit 172. The workpiece pair transported to the holder observation unit 180 is placed on the placement table 182.

  In step S2306, the holder observation unit 180 observes the deviation detection mark 915 of the lower substrate holder 370 through the observation hole 914 of the upper substrate holder 360 constituting the workpiece pair. Then, the holder observation unit 180 transmits image data including the observation hole 914 and the deviation detection mark 915 taken by the observation unit 184 to the overall control unit 118. The overall control unit 118 stores the received image data as second image data 802 in the storage unit 111.

  In step S <b> 2308, the detection unit 604 detects a shift amount between the lower substrate holder 370 and the upper substrate holder 360 that is generated while the work pair moves from the aligner 140 to the holder observation unit 180. The detection unit 604 first refers to the first image data 801 and the second image data 802 stored in the storage unit 111.

  Then, the detection unit 604 detects the displacement detection mark 915 included in the first image data and the displacement detection included in the second image data with reference to the portion of the observation hole 914 in the first image data 801 and the second image data 802. The shift amount of the mark for use 915 is detected. Specifically, the detection unit 604 calculates the positional deviation amount X and the angular deviation amount θ between the center points of the two deviation detection marks 915 shown in the comparison image 803 in FIG. The detection unit 604 stores the calculated positional deviation amount X and angular deviation amount θ in the storage unit 111 as deviation amounts before and after the conveyance of the lower substrate holder 370 and the upper substrate holder 360.

  In step S2310, the determining unit 606 refers to the correspondence table that associates the deviation amount with the degree of deterioration of the first adsorption unit and the second adsorption unit, and stores the deviation amount calculated in step S2308. Determine the degree of deterioration. In the correspondence table, data having a positive correlation between the amount of deviation and the degree of deterioration is registered. That is, the determination unit 606 determines that the degree of deterioration is larger as the deviation amount is larger. The correspondence table is set in advance by the user and stored in the storage unit 111.

  In step S2312, the determination unit 606 determines whether or not the degree of deterioration determined in step S2310 exceeds the reference degree of deterioration. The reference deterioration degree is determined by the amount of deviation between the lower substrate holder 370 and the upper substrate holder 360 that are caused by the deterioration of the first adsorption unit and the second adsorption unit before and after the conveyance of the first substrate 121 and the second substrate 122. Is set at a sub-micron level with reference to whether or not the amount of deviation exceeds the amount of electrical conduction.

  In step S2314, the robot arm 175 stores the lower substrate holder 370 and the upper substrate holder 360 in the evacuation shelf after the workpiece pair joining process for which the determined deterioration degree exceeds the reference deterioration degree is completed. To do. The holder rack 150 notifies the overall control unit 118 of the shelf number of the retreat shelf in which the lower substrate holder 370 and the upper substrate holder 360 are stored.

  In step S2316, the warning unit 610 controls the management ID of the lower substrate holder 370 and the upper substrate holder 360 stored in the evacuation shelf, the shelf number of the evacuation shelf notified in step S2314, and the first adsorption unit and the second adsorption unit. A warning prompting at least one maintenance is displayed on the display unit 612. And the process of this flowchart is complete | finished.

  That is, in this embodiment, the amount of deviation generated in the lower substrate holder 370 and the upper substrate holder 360 is detected before and after the workpiece pair is conveyed, and the quality of the first suction unit and the second suction unit is determined from the detected amount of deviation. When the allowable deterioration is exceeded, a warning that prompts maintenance of the suction unit is displayed. When the user sees the warning, for example, the attractive force of the leaf spring 925 as an example of the first adsorption unit is weakened, or the permanent magnet 940 as an example of the second adsorption unit is heated to high heat by the heating and pressurizing unit. It can be noticed that it has deteriorated due to thermal demagnetization.

  When the suction unit is maintained by the user, the pair of substrates 120 may be poorly bonded due to a positional shift while the workpiece pair is being transported in the bonding apparatus 100 due to the deterioration of the suction unit. Can be prevented in advance. Furthermore, in the present embodiment, the lower substrate holder 370 and the upper substrate holder 360 that have deteriorated beyond the allowable deterioration of the first suction unit and the second suction unit are stored in the retreat shelf of the holder rack 150 and the Since the use is stopped, the displacement of the substrate holder 300 that occurs before the user notices the warning can be prevented. In this embodiment, the example in which the substrate holder 300 is stored in the retreat shelf in step S2314 has been described. However, control is performed so as to continue using the target substrate holder 300 until the user gives an instruction. Also good.

  The warning unit 610 erases the warning displayed on the display unit 612 when the corresponding substrate holder 300 is unloaded from the retraction shelf of the holder rack 150. Specifically, the holder rack 150 detects that the substrate holder 300 has been unloaded from the evacuation shelf, notifies the overall control unit 118 of the shelf number, and the received overall control unit 118 receives the notified shelf. Control to end display of warning corresponding to number.

  In the above embodiment, an example in which the amount of displacement between the lower substrate holder 370 and the upper substrate holder 360 is detected by observing the displacement detection mark 915 of the lower substrate holder 370 through the observation hole 914 of the upper substrate holder 360 will be described. explained. However, the present invention is not limited thereto, and the amount of shift between the lower substrate holder 370 and the upper substrate holder 360 may be detected by observing the edge portions of the lower substrate holder 370 and the upper substrate holder 360 before and after the conveyance.

  When the edge portions of the lower substrate holder 370 and the upper substrate holder 360 are observed, the aligner 140 executes the observation of the edge portions of the lower substrate holder 370 and the upper substrate holder 360 before the conveyance. In addition, the holder observation unit 180 executes observation of the edge portions of the lower substrate holder 370 and the upper substrate holder 360 after the conveyance. Instead of the observation hole 914 and the displacement detection mark 915, the amount of displacement is detected by observing the edge portion, so that the observation hole 914 and the displacement detection mark 915 need not be provided. It can be simplified.

  Further, by forming convex portions and concave portions that fit in a non-contact manner in the lower substrate holder 370 and the upper substrate holder 360, and detecting the gap between the convex portions and the concave portions before and after conveyance of the workpiece pair, the lower substrate holder 370 A deviation of the upper substrate holder 360 may be detected. In that case, a well-known gap sensor is installed in a convex part and a recessed part, and a gap is detected by supplying electric power to a gap sensor.

  The power supply is performed from the power supply terminals provided on the lower mounting table 421 of the aligner 140 and the mounting table 182 of the holder observation unit 180 by providing a power supply terminal connected to the gap sensor on the back surface of the substrate holder 300, for example. Similarly, the detection value detected by the gap sensor is obtained by connecting the wiring provided on the back surface of the substrate holder 300 and the wiring provided on the lower mounting table 421 of the aligner 140 and the mounting table 182 of the holder observation unit 180. To execute. By adopting the detection of deviation by a gap sensor, it is possible to expect a higher processing speed than detecting deviation by observation.

  In the above-described embodiment, an example in which deviation is detected every time a work pair is formed by the aligner 140 has been described. However, each time the substrate holder 300 is used for a predetermined number of times in the substrate bonding process, the deviation is detected. It may be configured to detect the above. In that case, the overall control unit 118 monitors the number of uses of each substrate holder 300 stored in the storage unit 111, and executes the flowchart shown in FIG. 23 every time the number of uses becomes equal to a multiple of 100, for example. To control.

  Still further, when the workpiece pair is transferred from the delivery port 178 to the holder observation unit 180, a predetermined acceleration may be applied by the transport control unit 172. For example, when the flow shown in FIG. 11 is executed every time the number of uses of each substrate holder 300 becomes equal to a multiple of 100, the overall control unit 118 controls the conveyance so as to give a larger acceleration than when the flow is not executed. The unit 172 is controlled.

  When the determination unit 606 determines whether the first suction unit and the second suction unit are good or bad, the deterioration depends on whether or not the reference deviation amount set in association with the acceleration stored in the storage unit 111 is exceeded. It is configured to determine. The reference deviation amount set in association with the acceleration is set by performing in advance a test for measuring the positional deviation amount when transported at different accelerations.

  When executing the management process of the substrate holder 300, it is possible to detect deterioration without changing the acceleration by giving a higher acceleration than when not executing it and judging whether the first suction unit and the second suction unit are good or bad. Deterioration can be detected at an earlier stage than In other words, since the deterioration state can be detected, a warning for urging maintenance can be issued before the reference deterioration degree is exceeded while the substrate holder 300 is being used in the substrate bonding process.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

DESCRIPTION OF SYMBOLS 100 Bonding apparatus, 101 Housing | casing, 102 Atmosphere environment part, 110 Whole control part, 111 Memory | storage part, 112 EFEM, 113 Load port, 114 FOUP, 116 Robot arm, 118 Whole control part, 120 board | substrate, 121 1st board | substrate, 122 Second substrate, 130 Preliminary aligner, 131 Substrate aligner, 132 Substrate table, 133 detector, 134 Holder aligner, 135 Holder table, 136 detector, 138 Substrate slider, 139 Feed terminal, 140 aligner, 141 Upper stage, 142 Lower stage, 143 Upper microscope, 144 Lower microscope, 146 Bar code reader, 147 Ceiling, 150 Holder rack, 152 Bar code reader, 160 Separation mechanism, 162 Bar code reader, 171 Robot arm, 17 Transfer control unit, 175, 176 Robot arm, 178 Delivery port, 180 Holder observation unit, 182 Mounting table, 184 Observation unit, 202 Vacuum environment unit, 220 Load lock chamber, 222, 224 Shutter, 230 Robot arm, 240 Heating and pressurization Unit, 300 Substrate holder, 302 Bar code, 310 Upper substrate holder, 312 Holder body, 314 Holding area, 316 Electrode, 318 Feed terminal, 320 Magnet unit, 321 Through hole, 322 Magnet, 323 Insertion hole, 325 Support part, 326 Insertion hole, 328 Screw hole, 329 Opposing surface, 330 Lower substrate holder, 332 Holder body, 334 Holding area, 336 Electrode, 338 Power supply terminal, 340 Adsorption unit, 341 Adsorber, 342 Leaf spring, 343 Circular part, 44 Mounting portion, 345 Screw hole, 346 Slit, 347 Through hole, 348 Band-shaped portion, 360 Upper substrate holder, 370 Lower substrate holder, 421 Lower mounting base, 422 Lifting portion, 423 Base portion, 424 Drive portion, 425 Base, 430 attached Urging member, 432 push pin, 434 cylinder part, 436 load cell, 450 urging member, 452 push pin, 454 cylinder part, 502 drive control part, 504 detection part, 506 judgment part, 510 warning part, 512 display part, 514 sound Output unit, 516 communication unit, 602 drive control unit, 604 detection unit, 606 determination unit, 610 warning unit, 612 display unit, 614 audio output unit, 616 communication unit, 801 first image data, 802 second image data, 803 Comparative image, 910 Holder body, 911 Substrate holding , 914 observation hole 915 deviation detecting mark, 916 through hole, 920 Kyuchakuko, 925 leaf springs, 930 power supply terminals, 938 holder insertion hole 940 permanent magnet, 942 a permanent magnet insertion hole

Claims (13)

A first suction unit provided in a first substrate holder for holding a first substrate; and a second substrate holder for holding a second substrate; and the first substrate holder as a pair with the first suction unit; A management device for a second suction unit that exerts a suction force that sandwiches the first substrate and the second substrate between the second substrate holder;
A detection unit for detecting a state of an adsorption force between the first adsorption unit and the second adsorption unit;
A determination unit that determines whether or not the suction force between the first suction unit and the second suction unit is good based on the state of the suction force;
A management apparatus comprising: a warning unit that issues a warning that prompts maintenance of at least one of the first suction unit and the second suction unit based on a determination result of the determination unit. The first adsorption unit has a first adsorbent,
The second adsorption unit has a second adsorbent that exhibits the adsorbing force in a pair with the first adsorbent included in the first adsorbing unit, and an elastic member that supports the second adsorbing unit. ,
The detection unit detects an elastic reaction force of the elastic member as a state of the adsorption force,
The determination unit determines deterioration of the elastic member depending on whether the elastic reaction force is less than a predetermined reference reaction force,
The warning unit performs a warning for urging maintenance of the elastic member based on a determination result of the determination unit.
The management apparatus according to claim 1.   An urging member that urges the second adsorbent in a direction away from the first adsorbent against the elastic force of the elastic member; and the detection unit is a reaction that the urging member receives from the elastic member. The management device according to claim 2 which detects force.   The management device according to claim 3, wherein the first adsorption body has a through hole, and the urging member urges the second adsorption body through the through hole.   The management device according to claim 2, wherein the elastic member is a leaf spring. The detection unit includes the first substrate holder and the second substrate holder in a state where the first suction unit and the second suction unit exert the suction force and sandwich the first substrate and the second substrate. Detecting the state of the attraction force based on the amount of deviation after moving
The management apparatus according to claim 1. An accelerating unit that applies a predetermined acceleration to the first substrate holder and the second substrate holder when moving the first substrate holder and the second substrate holder;
The management device according to claim 6, wherein the determination unit determines the quality based on whether or not a deviation amount exceeds a reference deviation amount set based on the predetermined acceleration. The first adsorption unit and the second adsorption unit each include a magnet, a magnetic body, and an elastic member that supports at least one of the magnet and the magnetic body.
The management device according to claim 6 or 7, wherein the determination unit determines deterioration of the elastic member.   The management device according to claim 1, wherein the warning unit displays a warning for prompting the maintenance on a display device.   The management device according to claim 9, wherein the warning unit displays at least one of a remaining time until a maintenance time is required and a remaining number of times of use until a maintenance is required as the warning for prompting the maintenance.   The management device according to claim 1, wherein the warning unit accommodates the substrate holder in a holder rack that accommodates the substrate holder based on a determination result of the determination unit.   The management device according to claim 1, wherein the warning unit outputs a warning that prompts the maintenance.   The management device according to claim 1, wherein the warning unit transmits data including a warning that prompts the maintenance.

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