JP2012253273A - Substrate bonding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate bonding device which solves a problem that an engaging part cannot be engaged with a substrate holding member.SOLUTION: A substrate bonding device comprises: a plurality of pressurizing chambers for pressurizing and bonding a plurality of substrates; a substrate holding member for holding the substrate; a conveyance part for conveying the substrate and the substrate holding member to the plurality of pressurizing chambers; and engaging members respectively provided in the plurality of pressurizing chambers, and being engaged with an engaging part of the substrate holding member. The engaging member engages with the engaging part even when the substrate holding member with any of a plurality of different orientations is conveyed into the pressurizing chamber.

Description

  The present invention relates to a substrate bonding apparatus.

A substrate bonding apparatus is known in which a plurality of substrates are held by a substrate holding member and bonded together by pressurization in a pressure chamber.
[Patent Document 1] JP 2009-49066 A

  When a plurality of pressurizing chambers are connected, there is a problem in that the substrate holding member is rotated during the conveyance by the conveying unit, and the engaging portion provided in each pressure chamber cannot be engaged with the substrate holding member.

  In the first aspect of the present invention, a plurality of pressure chambers for pressing and bonding a plurality of substrates, a substrate holding member for holding the substrates, the substrate and the substrate holding members for the plurality of pressure chambers. Each of the plurality of pressurizing chambers, and an engagement member that is engaged with an engagement portion of the substrate holding member, wherein the substrate holding member has a plurality of different directions. There is provided a substrate bonding apparatus including an engagement member that engages with the engagement portion even when the pressure chamber is carried in the orientation.

  In the second aspect of the present invention, a plurality of pressurizing chambers that pressurize and bond a plurality of substrates, a transport unit that transports the substrates to the pressurizing chamber, and the pressurizing chambers are provided, respectively. An engagement member engaged with the engagement portion of the substrate, the engagement member engaging with the engagement portion even when the substrate is carried into the pressurizing chamber in any of a plurality of different directions. Provided is a substrate laminating apparatus including a combination member.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a top view of the whole structure of a board | substrate bonding apparatus. FIG. 5 is a perspective view of an upper substrate holder 210 of a pair of substrate holders 204 as viewed from above. It is the perspective view which looked at the upper board | substrate holder 210 from the downward direction. FIG. 6 is a perspective view of a lower substrate holder 230 of a pair of substrate holders 204 as viewed from above. It is the perspective view which looked at the lower board | substrate holder 230 from the downward direction. 3 is a schematic configuration diagram of pressurizing chambers 68 and 76. FIG. It is the expansion schematic of the connection part 94 (104). It is a top view which shows the relationship between the connection part 94 (104) and a substrate holder. FIG. 4 is a schematic plan view for explaining a bonding unit 14. FIG. 5 is a schematic plan view for explaining conveyance of a substrate 200 in a bonding unit 14. FIG. 5 is a schematic plan view for explaining conveyance of a substrate 200 in a bonding unit 14. FIG. 5 is a schematic plan view for explaining conveyance of a substrate 200 in a bonding unit 14. FIG. 5 is a schematic plan view for explaining conveyance of a substrate 200 in a bonding unit 14. FIG. 5 is a schematic plan view for explaining conveyance of a substrate 200 in a bonding unit 14. FIG. 5 is a schematic plan view for explaining conveyance of a substrate 200 in a bonding unit 14. It is a top view of the lower stage of embodiment which changed the connection part. FIG. 17 is an enlarged cross-sectional view of a part of the lower stage shown in FIG. 16.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a plan view of the overall configuration of the substrate bonding apparatus. XY indicated by arrows in FIG. 1 is defined as the XY direction of the substrate bonding apparatus 10. In the present embodiment, the substrate bonding apparatus 10 includes a plurality of apparatuses having the same configuration, for example, the pressurizing chambers 68 and 76, and in each of the pressurizing chambers 68 and 76, the connection terminals are connected to the pair of substrate holders 204. Connect. As shown in FIG. 1, the substrate bonding apparatus 10 includes a preprocessing unit 12, a bonding unit 14, and a control unit 16.

  The preprocessing unit 12 includes a front frame 20, a substrate cassette 22, a robot arm 24, a pre-aligner 26, a robot arm 28, a carry-in unit 30, a carry-out unit 32, and an aligner 34.

  The front frame 20 is a hollow housing. The front frame 20 accommodates main parts of the pretreatment unit 12 excluding the substrate cassette 22 and the robot arm 24.

  The substrate cassette 22 is detachably attached to the front frame body 20 outside the front frame body 20. The substrate cassette 22 accommodates the substrate 200 to be bonded in the substrate bonding apparatus 10. Thereby, the several board | substrate 200 can be mounted in the board | substrate bonding apparatus 10 collectively. The substrate cassette 22 accommodates the superimposed substrate 202 that has been bonded and carried out by the substrate bonding apparatus 10.

  The robot arm 24 vacuum-sucks the substrate 200 and the superimposed substrate 202. The robot arm 24 moves in the X direction. The robot arm 24 transports the substrate 200 accommodated in the substrate cassette 22 to the pre-aligner 26. After being bonded, the robot arm 24 carries the superimposed substrate 202 conveyed to the pre-aligner 26 to the substrate cassette 22.

  The pre-aligner 26 includes a turntable 40 and a holder table 42. The turntable 40 holds the substrate 200 carried in by the robot arm 24. The turntable 40 rotates the substrate 200 around the vertical axis to temporarily align the circumferential position of the substrate 200. The holder table 42 holds the overlapping substrate 202 and the substrate holder 204 which are transported by the robot arm 28 after being bonded. The holder table 42 separates the overlapping substrate 202 and the substrate holder 204. The superposed substrate 202 separated from the substrate holder 204 is carried out to the substrate cassette 22 by the robot arm 24. On the other hand, the substrate 200 of the turntable 40 is transported to and placed on the substrate holder 204 that remains after being separated.

  Since the pre-aligner 26 is highly accurate, the positions and orientations of the individual substrates 200 and the substrate holder 204 are temporarily aligned so that the positions of the substrates 200 are within the narrow adjustment range of the aligner 34. As a result, the aligner 34 can accurately align the substrate 200 and the substrate holder 204.

  The robot arm 28 moves in the Y direction between the pre-aligner 26 and the bonding unit 14. The robot arm 28 rotates around the vertical axis. The robot arm 28 is expanded and contracted in the XY plane with the rotation axis as a starting point. The robot arm 28 vacuum-sucks the substrate holder 204 of the holder table 42 that sucks the substrate 200 and transports the substrate holder 204 to the loading unit 30. The robot arm 28 is aligned by the aligner 34, vacuum-sucks the pair of substrates 200 held by the pair of substrate holders 204, transports them from the unloading unit 32, and transports them to the bonding unit 14. The robot arm 28 conveys the laminated substrate 202 after bonding together with the pair of substrate holders 204 from the bonding unit 14 to the holder table 42.

  The loading unit 30 temporarily sucks and holds the substrate holder 204 that holds the substrate 200 loaded by the robot arm 28. The carry-out unit 32 temporarily sucks and holds the pair of substrates 200 and the pair of substrate holders 204 aligned by the aligner 34. The carry-in unit 30 and the carry-out unit 32 shut off the aligner 34 and the inside of the front frame body 20 other than the aligner 34. Thereby, the aligner 34 suppresses contamination while facilitating the adjustment of the internal temperature and humidity.

  The aligner 34 is blocked from the outside by the carry-in unit 30 and the carry-out unit 32. The temperature and humidity of the aligner 34 are controlled by an air conditioner or the like. Thereby, the aligner 34 improves the alignment accuracy. The aligner 34 includes a robot arm 50, a fixed stage 52, and a moving stage 54. The robot arm 50 conveys the substrate holder 204 that holds the substrate 200 carried into the carry-in unit 30 to the moving stage 54 or the fixed stage 52. When the robot arm 50 transports the substrate 200 and the substrate holder 204 to the fixed stage 52, the robot arm 50 transports the substrate upside down. Accordingly, the moving stage 54 holds the substrate 200 and the substrate holder 204 with the substrate holder 204 facing down, and the fixed stage 52 holds the substrate 200 and the substrate holder 204 with the substrate holder 204 facing up. The moving stage 54 moves in the X direction, the Y direction, and the vertical direction. As a result, the moving stage 54 moves in the XY directions to align the substrate 200 held by itself with the substrate 200 held by the fixed stage 52. As a result, the pair of substrates 200 is held between the pair of substrate holders 204 in a state of being aligned by the moving stage 54. The robot arm 50 transports the pair of aligned substrates 200 together with the substrate holder 204 to the carry-out unit 32.

  The bonding unit 14 bonds the pair of substrates 200 held by the pair of substrate holders 204 to form an overlapping substrate 202. The bonding unit 14 includes a rear frame 60, an air lock chamber 62, a front robot chamber 64, a robot arm 66, four pressurization chambers 68, a relay port 70, a rear robot chamber 72, and a robot. An arm 74 and four pressurizing chambers 76 are provided.

  The rear frame body 60 is provided on one surface of the front frame body 20. The rear frame 60 is a hollow casing. The rear frame 60 accommodates the main part of the bonding part 14.

  The air lock chamber 62 includes a shutter 80 on the preprocessing unit 12 side, a shutter 82 on the bonding unit 14 side, and a mounting table 84. Only one of the shutters 80 and 82 is open. As a result, the air lock chamber 62 allows the substrate 200 and the substrate holder 204 to be transferred between the pretreatment unit 12 and the bonding unit 14 while blocking the preprocessing unit 12 and the bonding unit 14.

  The front robot chamber 64 is formed in a hollow hexagonal column shape. The front robot chamber 64 accommodates the robot arm 66. Of the six sides of the front robot chamber 64, the side on the −Y side is connected to the air lock chamber 62. Of the six sides of the front robot chamber 64, the + Y side is connected to the relay port 70. Of the six sides of the front robot chamber 64, the remaining four sides are connected to the pressurizing chamber 68.

  The robot arm 66 is an example of a transport unit. The robot arm 66 rotates around the center of the front robot chamber 64. The robot arm 66 has a link mechanism that enables expansion and contraction between the center of the front robot chamber 64 and the pressurizing chamber 68. The robot arm 66 vacuum-sucks the substrate holder 204 carried into the air lock chamber 62. The robot arm 66 conveys the pair of substrate holders 204 that have been vacuum-sucked to one of the pressurizing chambers 68 or the relay port 70 together with the pair of stacked substrates 200. The robot arm 66 vacuum-sucks the substrate holder 204 and transports it from the pressurizing chamber 68 to the air lock chamber 62 together with the superposed substrate 202 bonded by the pressurizing chamber 68. In addition, the robot arm 66 vacuum-sucks the superposed substrate 202 bonded together by the pressurizing chamber 76 together with the substrate holder 204, and conveys it from the relay port 70 to the air lock chamber 62.

  The four pressurizing chambers 68 form a first pressurizing portion 69 that is an odd-numbered surface. The pressure chamber 68 includes a lower pressure stage 90 and an upper pressure stage 92. The lower pressure stage 90 and the upper pressure stage 92 press and bond the pair of substrates 200 held by the pair of substrate holders 204 from above and below. As a result, the substrate 200 and the substrate 200 are joined to form the superimposed substrate 202. The pressurizing chamber 68 may pressurize while heating the pair of substrates 200.

  The relay port 70 is an example of a connection unit. The relay port 70 is disposed between the robot arm 66 and the robot arm 74 on the transfer path of the substrate holder 204 and the substrate 200. The relay port 70 connects the pressure units 69 and 77 via the front robot chamber 64 and the rear robot chamber 72. The relay port 70 includes a shutter 96 on the front robot chamber 64 side, a shutter 97 on the rear robot chamber 72 side, and a relay stand 98. Only one of the shutters 96 and 97 is open. As a result, the relay port 70 enables the substrate 200 and the substrate holder 204 to be transferred between the front robot chamber 64 and the rear robot chamber 72 while blocking the front robot chamber 64 and the rear robot chamber 72. The relay stand 98 temporarily holds the substrate 200 and the substrate holder 204 transferred from the robot arm 66 to the robot arm 74.

  The rear robot chamber 72, the robot arm 74, and the pressurizing chamber 76 have substantially the same configuration as the front robot chamber 64, the robot arm 66, and the pressurizing chamber 68, respectively. The rear robot chamber 72 is disposed on the opposite side of the front robot chamber 64 with the relay port 70 interposed therebetween. The robot arm 74 is an example of a transport unit. The robot arm 74 is disposed inside the rear robot chamber 72. The four pressurizing chambers 76 form a second pressurizing portion 77 that is an even-numbered surface. The pressurizing chamber 76 is provided in the rear robot chamber 72. The pressure chamber 76 includes a lower pressure stage 100 and an upper pressure stage 102.

  The control unit 16 governs overall control of the substrate bonding apparatus 10. For example, the control unit 16 controls the movement and suction of the robot arms 24, 28, 66, and 74.

  Next, the bonding process of the substrate 200 by the substrate bonding apparatus 10 described above will be described.

  First, the robot arm 24 transports the substrate 200 from the substrate cassette 22 to the turntable 40 of the pre-aligner 26. After aligning the direction of the substrate 200 by the turntable 40, the pre-aligner 26 transports the substrate 200 to the substrate holder 204 placed on the holder table 42. Thereby, the substrate holder 204 electrostatically attracts the substrate 200.

  The robot arm 28 transports the substrate holder 204 that electrostatically attracts the substrate 200 from the pre-aligner 26 to the carry-in unit 30. In the aligner 34, the robot arm 50 inverts and transports the substrate holder 204 and the substrate 200 to the fixed stage 52. The fixed stage 52 sucks and holds the substrate holder 204 and the substrate 200 with the substrate holder 204 facing upward.

  By the same operation, the robot arm 50 transports the next substrate holder 204 and substrate 200 transported to the carry-in unit 30 to the moving stage 54. The moving stage 54 sucks and holds the substrate holder 204 and the substrate 200. The moving stage 54 aligns the substrate 200 held by itself and the substrate 200 held by the fixed stage 52. Thereafter, the moving stage 54 moves up to bring the substrate 200 and the substrate 200 into contact with each other. Thereby, one substrate holder 204 attracts the other substrate holder 204, and the pair of substrate holders 204 holds the pair of substrates 200.

  Next, the robot arm 50 transports the pair of substrate holders 204 and the pair of substrates 200 from the moving stage 54 to the carry-out unit 32. The robot arm 28 unloads the substrate holder 204 and the substrate 200 from the unloading unit 32 and conveys them to the air lock chamber 62 of the bonding unit 14.

  The robot arm 66 transports the substrate holder 204 and the substrate 200 in the air lock chamber 62 to one of the pressurizing chambers 68 or the relay table 98 of the relay port 70. The pressurizing chamber 68 pressurizes the transported substrate holder 204 and the substrate 200. As a result, the pair of substrates 200 are attached to each other to form the superimposed substrate 202. Thereafter, the robot arm 66 conveys the substrate holder 204 and the superimposed substrate 202 to the air lock chamber 62.

  On the other hand, the pair of substrate holders 204 and the pair of substrates 200 conveyed to the relay table 98 are rotated 180 degrees. Thereafter, the pair of substrate holders 204 and the pair of substrates 200 are transferred to one of the pressurizing chambers 76 by the robot arm 74. The pressurizing chamber 76 pressurizes the pair of substrates 200. As a result, the pair of substrates 200 are bonded to form an overlapping substrate 202. Thereafter, the robot arms 74 and 66 convey the pair of substrate holders 204 and the superimposed substrate 202 to the air lock chamber 62.

  Thereafter, the robot arm 28 conveys the substrate holder 204 and the superimposed substrate 202 to the pre-aligner 26. After the pre-aligner 26 disassembles the substrate holder 204 and the overlapping substrate 202, the robot arm 24 carries the overlapping substrate 202 to the substrate cassette 22.

  FIG. 2 is a perspective view of the upper substrate holder 210 of the pair of substrate holders 204 as viewed from above. FIG. 3 is a perspective view of the upper substrate holder 210 as viewed from below. The upper substrate holder 210 is an example of a substrate holding member.

  As shown in FIGS. 2 and 3, the upper substrate holder 210 includes an upper holder main body 212, four attracted portions 214, a pair of upper electrostatic pads 216 and 216, and two upper surface receiving terminals 218. Two lower surface receiving terminals 220 are provided.

  The upper holder body 212 is formed in a disk shape that is slightly larger than the substrate 200. An upper placement surface 222 on which the substrate 200 is placed is formed at the center of the lower surface of the upper holder body 212. The upper placement surface 222 is formed so as to protrude below the outer periphery. The upper placement surface 222 is formed in the same circular shape as the substrate 200.

  The attracted portion 214 is disposed on the lower surface of the upper holder main body 212. The attracted portion 214 is disposed outside the upper placement surface 222. The four to-be-adsorbed portions 214 are arranged at four positions at 90 ° intervals around the center of the upper holder main body 212. The attracted portion 214 includes a material that is attracted to the magnet, for example, a ferromagnetic material.

  The pair of upper electrostatic pads 216 are embedded in an area corresponding to the upper placement surface 222 inside the upper holder main body 212. Each upper electrostatic pad 216 is formed in a substantially semicircular shape. One upper electrostatic pad 216 is disposed on the opposite side of the other upper electrostatic pad 216 across the center of the upper mounting surface 222.

  The two upper surface receiving terminals 218 are provided on the upper surface of the upper holder body 212. The two upper surface receiving terminals 218 are disposed outside the upper placement surface 222. One upper surface receiving terminal 218 is electrically connected to one upper electrostatic pad 216. The other upper surface receiving terminal 218 is connected to the other upper electrostatic pad 216. The upper surface receiving terminal 218 receives the supply of electrostatic force to the upper electrostatic pad 216 from the outside and transmits it to the upper electrostatic pad 216. Here, the outside refers to the air lock chamber 62, the relay port 70, the robot arms 66 and 74, and the like. For example, a higher voltage is applied to the upper surface receiving terminal 218 connected to one upper electrostatic pad 216 than to the upper surface receiving terminal 218 connected to the other upper electrostatic pad 216. As a result, the voltage of one upper electrostatic pad 216 becomes higher than the voltage of the other upper electrostatic pad 216, and the substrate 200 placed on the upper placement surface 222 so as to face the upper electrostatic pad 216 is formed. It is electrostatically attracted.

  The two lower surface receiving terminals 220 are an example of an engaging portion. The two lower surface receiving terminals 220 are provided on the lower surface of the upper holder body 212. The two lower surface receiving terminals 220 are arranged at the same place as one of the two upper surface receiving terminals 218 in plan view. One lower surface receiving terminal 220 is electrically connected to one upper electrostatic pad 216. The other lower surface receiving terminal 220 is electrically connected to the other upper electrostatic pad 216. The lower surface receiving terminal 220 receives the supply of electrostatic force to the upper electrostatic pad 216 from the outside and transmits it to the upper electrostatic pad 216. Here, the outside refers to the air lock chamber 62, the relay port 70, the robot arms 66 and 74, and the like. For example, a higher voltage is applied to the lower surface receiving terminal 220 connected to one upper electrostatic pad 216 than to the lower surface receiving terminal 220 connected to the other upper electrostatic pad 216. As a result, an electrostatic force acts between the substrate 200 and the upper electrostatic pad 216, and the substrate 200 is electrostatically attracted by the upper electrostatic pad 216.

  FIG. 4 is a perspective view of the lower substrate holder 230 of the pair of substrate holders 204 as viewed from above. FIG. 5 is a perspective view of the lower substrate holder 230 as viewed from below. The lower substrate holder 230 is an example of a substrate holding member.

  As shown in FIGS. 4 and 5, the lower substrate holder 230 includes a lower holder body 232, four attracting portions 234, a pair of lower electrostatic pads 236 and 236, and two external receiving terminals 238. Have.

  The lower holder main body 232 has a disk shape that is slightly larger than the substrate 200 and is formed in substantially the same shape as the upper holder main body 212. A lower placement surface 242 on which the substrate 200 is placed is formed at the center of the upper surface of the lower holder body 232. The lower mounting surface 242 is formed to protrude above the outer periphery. The lower mounting surface 242 is formed in the same circular shape as the substrate 200. Two recesses 233 are formed on the outer periphery of the lower holder body 232. The two recesses 233 are disposed at a point-symmetrical position of 180 degrees with respect to the center of the lower holder body 232. The outer peripheral side of the recess 233 is opened. The recess 233 penetrates the lower holder main body 232 in the vertical direction. In a state where the upper substrate holder 210 and the lower substrate holder 230 sandwich the substrate 200, the recess 233 is disposed below the lower surface receiving terminal 220. Therefore, the lower surface receiving terminal 220 of the upper substrate holder 210 is exposed by the recess 233 without being covered by the lower substrate holder 230.

  The suction part 234 is provided on the upper surface of the lower holder body 232. The suction portion 234 is disposed outside the lower placement surface 242. The four suction portions 234 are arranged at four positions at 90 ° intervals around the center of the lower holder main body 232. Accordingly, the four suction portions 234 are arranged at positions facing any one of the suction target portions 214. The attracting part 234 includes a permanent magnet capable of attracting the attracted part 214. The suction part 234 sucks the suctioned part 214, so that the upper substrate holder 210 and the lower substrate holder 230 hold the pair of substrates 200 between them.

  The pair of lower electrostatic pads 236 are embedded in an area corresponding to the lower placement surface 242 inside the lower holder body 232. Each lower electrostatic pad 236 is formed in a substantially semicircular shape. One lower electrostatic pad 236 is disposed on the opposite side of the other lower electrostatic pad 236 across the center of the lower placement surface 242.

  The two outer receiving terminals 238 are an example of an engaging portion. The two outer receiving terminals 238 are provided on the lower surface of the lower holder body 232. The two external receiving terminals 238 are arranged outside the lower placement surface 242. The two outer receiving terminals 238 are arranged at different positions from the upper surface receiving terminal 218 and the lower surface receiving terminal 220 in a state where the substrate 200 is sandwiched between the lower substrate holder 230 and the upper substrate holder 210. Each outer receiving terminal 238 is arranged at the same distance from the center of the lower holder body 232. That is, the two external receiving terminals 238 are arranged at a plurality of rotational positions around the vertical axis of the lower mounting surface 242. The two external receiving terminals 238 are electrically connected to one lower electrostatic pad 236. The remaining two external receiving terminals 238 are connected to the other lower electrostatic pad 236.

  The external receiving terminal 238 receives the supply of electrostatic force to the lower electrostatic pad 236 from the outside and transmits it to the lower electrostatic pad 236. Here, the outside refers to the air lock chamber 62, the relay port 70, the robot arms 66 and 74, and the like. For example, a voltage higher than that of the external receiving terminal 238 connected to the other lower electrostatic pad 236 is supplied to the external receiving terminal 238 connected to the lower electrostatic pad 236. As a result, the lower electrostatic pad 236 holds the substrate 200 on the lower placement surface 242 by electrostatic adsorption.

  FIG. 6 is a schematic configuration diagram of the pressurizing chambers 68 and 76. The pressurizing chamber 76 has the same configuration as the pressurizing chamber 68. Therefore, in the description of FIG. 6, the reference numerals of the components of the pressurizing chamber 76 are written in parentheses, and the description is omitted. As shown in FIG. 6, the pressurizing chamber 68 (76) includes a lower pressurizing stage 90 (100) provided at the bottom, an upper pressurizing stage 92 (102) fixed to the ceiling, and a pressing unit 95 ( 105) and eight connecting portions 94 (104). The pressing portion 95 (105) is provided at the center of the lower pressure stage 90 (100). The pressing portion 95 (105) moves in the vertical direction. As a result, the pressing portion 95 (105) and the top plate 91 or the top plate 101 fixed to the upper pressure stage 92 (102) press the lower substrate holder 230 and the upper substrate holder 210 from above and below. The connecting portion 94 (104) is fixed to the upper surface of the lower pressure stage 90 (100) and outside the pressing portion 95 (105). Thereby, the connection part 94 (104) is being fixed with respect to the lower pressurization stage 90 (100), even if the press part 95 (105) moves up and down. Of the eight connecting portions 94 (104), four connecting portions 94 (104) are arranged at positions corresponding to the external receiving terminals 238 of the lower substrate holder 230. Accordingly, the connecting portion 94 (104) is engaged with the external receiving terminal 238 of the lower substrate holder 230 disposed above the lower pressure stage 90 (100) and applies a voltage. The remaining four connection portions 94 (104) are arranged at positions corresponding to the lower surface receiving terminals 220 of the upper substrate holder 210. Thereby, the connection part 94 (104) applies a voltage to the lower surface receiving terminal 220 of the upper substrate holder 210 disposed above the lower pressure stage 90 (100).

  FIG. 7 is an enlarged schematic view of the connecting portion 94 (104). The connection part 94 includes a support member 112, an elastic member 116, and a power supply terminal 118.

  The support member 112 has, for example, a columnar column portion 113 that extends in the vertical direction. The lower end of the support member 112 is fixed to the lower pressure stage 90. The upper end of the support member 112 supports either the lower substrate holder 230 or the upper substrate holder 210. The height of the support member 112 is set so as to correspond to the substrate holder to be supported. The support member 112 includes a branch portion 114. The branch part 114 is fixed to the upper side surface of the cylindrical part 113. The branch part 114 is formed in an L shape. Therefore, the branch part 114 extends laterally from the side surface of the cylindrical part 113, and the end of the branch part 114 extends upward. The branch part 114 is formed in a hollow shape.

  The elastic member 116 is disposed in the hollow part of the branch part 114. The elastic member 116 is, for example, a spring that can be elastically deformed in the vertical direction.

  The power supply terminal 118 is an example of an engaging member. The power supply terminal 118 is detachably provided in the hollow part of the branch part 114 of the support member 112. Accordingly, the user places the power supply terminal 118 at a position where it engages with the outer receiving terminal 238 or the lower receiving terminal 220 in accordance with the direction in which the lower substrate holder 230 and the upper substrate holder 210 are carried into the pressurizing chambers 68 and 76. Can be moved. The upper end portion of the power supply terminal 118 is inserted into the recess 233 of the lower substrate holder 230 and protrudes from the upper end of the branch portion 114. The lower part of the power supply terminal 118 is supported by the elastic member 116. Accordingly, the power supply terminal 118 slides and moves in the vertical direction while being supported by the elastic member 116. The power feeding terminal 118 is supported to be engaged with the outer receiving terminal 238 or the lower receiving terminal 220 according to the orientation of the lower substrate holder 230 and the upper substrate holder 210 conveyed to the pressurizing chambers 68 and 76. Is changed. Thus, when the lower substrate holder 230 and the upper substrate holder 210 are arranged above the lower pressure stage 90, the power supply terminal 118 is connected to the outer receiving terminal 238 or the lower receiving terminal 220. The power supply terminal 118 is connected to an external power source. Therefore, the power supply terminal 118 applies a voltage to the external receiving terminal 238 or the bottom receiving terminal 220 when supplied with power from the outside. Accordingly, the power supply terminal 118 is a supply unit that supplies an electrostatic force as a holding force of the substrate 200 to the lower substrate holder 230 and the upper substrate holder 210, and supplies electric power to the lower substrate holder 230 and the upper substrate holder 210. Functions as a power supply terminal. As a result, the outer receiving terminal 238 and the lower surface receiving terminal 220 are receiving units that receive the holding force supplied from the supplying unit, and function as connection terminals connected to the power feeding terminal 118. The connecting portion 104 of the pressurizing chamber 76 has a power supply terminal 128 and has the same configuration as the connecting portion 94.

  FIG. 8 is a plan view showing the relationship between the connecting portion 94 (104) and the substrate holder. As shown in FIG. 8, the connecting portions 94 (104) are arranged in two places as two sets. One set of connection portions 94 (104) and the other set of connection portions 94 (104) are arranged around the center of the lower pressure stage 90 so as to be 180 degree point symmetric. The power supply terminal 118 (128) is attached to the connecting portion 94 (104) on the side corresponding to the outer receiving terminal 238 and the lower surface receiving terminal 220. On the other hand, the power supply terminal 118 (128) is not attached to the set of connecting portions 94 (104) arranged on the opposite side of the outer receiving terminal 238 and the lower receiving terminal 220.

  FIG. 9 is a schematic plan view illustrating the bonding unit 14. In FIG. 9, the power supply terminals 118 and 128 are indicated by black circles. As shown in FIG. 9, the lower pressurization stage 90 of each pressurization chamber 68 has four pairs of connection parts 94 which are examples of supply parts. The four pairs of connecting portions 94 including the support member 112 are disposed 180 degrees rotationally symmetrical around the center of each pressurizing chamber 68. Note that the four pairs of connection portions 94 including the support member 112 may be arranged point-symmetrically between 45 degrees and 180 degrees. A straight line connecting each pair of connecting portions 94 on the outer and inner sides of each lower pressurizing stage 90 is the center C1 of the front robot chamber 64 and intersects with the rotation axis of the robot arm 66. The term “outside” and “inside” as used herein refers to the case of viewing from the straight line connecting the center C1 and the center of each pressurizing chamber 68. The angle between the perpendiculars of the corresponding connecting portions 94 of each pressurizing chamber 68 is 60 degrees or 120 degrees. The lower pressurizing stage 100 of each pressurizing chamber 76 has the same configuration as the connecting portion 94 and has a pair of connecting portions 104. The positional relationship between the connecting portion 104 and the center C2 is the same as the positional relationship between the connecting portion 94 and the center C1.

  Of the four pressurization chambers 68 of the pressurization unit 69, the power supply terminals 118 of the odd-numbered pressurization chambers 68 are carried in the first direction along the transfer path of the lower substrate holder 230 and the upper substrate holder 210. The power supply terminals 118 of the even-numbered pressurization chambers 68 are arranged in the second direction and are arranged at the first positions corresponding to the outer receiving terminals 238 and the lower receiving terminals 220 of the lower substrate holder 230 and the upper substrate holder 210. For example, two pressurization chambers on the −Y side from the center C1 are disposed at the second positions corresponding to the outer receiving terminal 238 and the lower receiving terminal 220 of the lower substrate holder 230 and the upper substrate holder 210 to be carried in. In 68, the power supply terminal 118 is arranged on the + Y side. On the other hand, in the two pressurizing chambers 68 on the + Y side from the center C1, the power supply terminal 118 is disposed on the −Y side.

  The power supply terminal 118 of the pressurizing chamber 68 of the first pressurizing unit 69 which is an odd number along the transport path of the lower substrate holder 230 and the upper substrate holder 210 among the two pressurizing units 69 and 77 is the first. Are disposed at a first position corresponding to the outer receiving terminal 238 and the lower receiving terminal 220 of the lower substrate holder 230 and the upper substrate holder 210. On the other hand, the power supply terminal 128 of the pressurizing chamber 76 of the second pressurizing unit 77 which is an even number is the lower substrate holder 230 and the outer receiving terminal 238 and the lower receiving terminal of the upper substrate holder 210 that are carried in the second direction. The second position corresponding to 220 is arranged. In other words, the power supply terminal 128 in each of the four pressurizing chambers 76 is disposed at a position corresponding to the orientation of the lower substrate holder 230 and the upper substrate holder 210 temporarily placed in the relay port 70. For example, the power supply terminal 118 is not attached to the branch portion 114 indicated by a white circle in the two pairs of connection portions 94 outside the pressurizing chambers 68 as viewed from the center C1. On the other hand, as viewed from the center C <b> 1, power supply terminals 118 are attached to the branch portions 114 in the two pairs of connection portions 94 inside each pressurizing chamber 68. On the other hand, in each pressurizing chamber 76, as viewed from the center C <b> 2, the power supply terminal 128 is not attached to the branch portion 114 in the two pairs of connecting portions 104 inside each pressurizing chamber 76. On the other hand, as viewed from the center C <b> 2, power supply terminals 128 are attached to the branch portions 114 in the two pairs of connection portions 104 outside the pressurizing chambers 76.

  Therefore, in the odd-numbered pressurizing chamber 68 and the even-numbered pressurizing chamber 76, the positions of the power supply terminals 118 and 128 to which a voltage can be applied are rotationally symmetrical by 180 degrees with respect to the centers of the lower pressurizing stages 90 and 100. is there. Note that the rotationally symmetric angle at the positions of the power supply terminals 118 and 128 may be other than 180 degrees, for example, 45 degrees or more and 180 degrees or less. Thereby, in the pressurizing chamber 68 and the pressurizing chamber 76, even when the lower substrate holder 230 and the upper substrate holder 210 are loaded into the pressurizing chambers 68 and 76 in any of a plurality of different directions, the connecting portion 94. The connecting portion 104 can be engaged with and connected to the outer receiving terminal 238 and the lower receiving terminal 220. As a result, the two pairs of connecting portions 94 indicated by black circles are in a state where a voltage can be applied to the outer receiving terminal 238 and the lower receiving terminal 220. In addition, the two pairs of connecting portions 104 indicated by black circles are in a state in which a voltage can be applied to the outer receiving terminal 238 and the lower receiving terminal 220.

  The mounting table 84 of the air lock chamber 62 has two pairs of connection portions 88. The distance between the pair of connection portions 88 is equal to the distance between the pair of external receiving terminals 238 of the lower substrate holder 230. The pair of connection portions 88 are connected to the pair of external receiving terminals 238 of the lower substrate holder 230 and apply a voltage. The distance between the other pair of connection portions 88 is equal to the distance between the pair of lower surface receiving terminals 220 of the upper substrate holder 210. The pair of connection portions 88 are connected to the pair of lower surface receiving terminals 220 of the upper substrate holder 210 and apply a voltage. The connecting portion 88 is disposed on the + Y side of the center of the mounting table 84.

  The relay stand 98 of the relay port 70 has two pairs of connection portions 99. The distance between one pair of connection portions 99 is equal to the distance between the pair of external receiving terminals 238 of the lower substrate holder 230. The pair of connection portions 99 are connected to the pair of external receiving terminals 238 of the lower substrate holder 230 and apply a voltage. The distance between the other pair of connection portions 99 is equal to the distance between the pair of lower surface receiving terminals 220 of the upper substrate holder 210. The pair of connection portions 99 are connected to the pair of lower surface receiving terminals 220 of the upper substrate holder 210 and apply a voltage. The connecting portion 99 is disposed on the −Y side at the center of the relay stand 98.

  The robot arm 66 includes a suction claw 65 having two pairs of connection portions 67. The distance between one pair of connection portions 67 is equal to the distance between the pair of external receiving terminals 238. The distance between the other pair of connection portions 67 is equal to the distance between the pair of lower surface receiving terminals 220. The robot arm 74 includes a suction claw 73 having a pair of connection portions 75. The distance between the pair of connection portions 75 is equal to the distance between the pair of external receiving terminals 238.

  10 to 15 are schematic plan views for explaining the conveyance of the substrate 200 in the bonding unit 14. 10 to 15, the pair of external receiving terminals 238 of the lower substrate holder 230 are indicated by triangles, and the pair of lower surface receiving terminals 220 of the upper substrate holder 210 are indicated by squares. The pair of substrates 200 and the upper pressure stages 92 and 102 placed on the lower substrate holder 230 are omitted in FIGS.

  As shown in FIG. 10, the lower substrate holder 230 is transferred to the air lock chamber 62. In this state, the pair of external receiving terminals 238 of the lower substrate holder 230 and the pair of lower surface receiving terminals 220 of the upper substrate holder 210 are in contact with the connection portion 88 of the mounting table 84. Thereby, a voltage is applied to the outer receiving terminal 238 and the lower surface receiving terminal 220 through the connection portion 88. As a result, the lower electrostatic pad 236 and the upper electrostatic pad 216 electrostatically attract the substrate 200.

  Next, as shown in FIG. 11, the robot arm 66 inserts the suction claw 65 below the lower substrate holder 230 and vacuum-sucks the lower substrate holder 230. In this state, the connecting portion 67 of the robot arm 66 is in contact with the outer receiving terminal 238 and the lower receiving terminal 220 to apply a voltage. Thereby, even if the voltage application from the connection part 88 of the mounting base 84 stops, the lower electrostatic pad 236 and the upper electrostatic pad 216 continue the electrostatic adsorption state of the substrate 200.

  Next, the robot arm 66 conveys the lower substrate holder 230 to one of the pressurizing chambers 68 connected to the front robot chamber 64 or the relay port 70. For example, as shown in FIG. 12, the robot arm 66 rotates 60 degrees counterclockwise about the center C1, and conveys the lower substrate holder 230 to the pressurizing chamber 68 on the lower right side of the drawing. The outer receiving terminal 238 and the lower receiving terminal 220 are placed on the lower pressure stage 90 so as to come into contact with the connection portion 94 of the pressure chamber 68. In this state, a voltage is applied to the outer receiving terminal 238 and the lower surface receiving terminal 220 via the connection portion 94. Thereby, even if the voltage application from the connection part 67 of the robot arm 66 is stopped, the lower electrostatic pad 236 and the upper electrostatic pad 216 electrostatically attract the substrate 200.

  On the other hand, as shown in FIG. 13, when the robot arm 66 transports the lower substrate holder 230 to the relay port 70, the robot arm 66 rotates 180 degrees around the center C1. Accordingly, the lower substrate holder 230 rotates 180 degrees around the vertical axis from the state where it is placed in the air lock chamber 62. Here, the connection portion 99 of the relay stand 98 is disposed on the + Y side of the center of the relay stand 98. Thereby, the outer receiving terminal 238 and the lower receiving terminal 220 rotated by 180 degrees can be arranged on the connection part 99 of the relay stand 98. As a result, the voltage is applied to the outer receiving terminal 238 and the lower surface receiving terminal 220 via the connecting portion 99. Therefore, even if the voltage application from the connecting portion 67 of the robot arm 66 is stopped, the lower electrostatic pad 236 and The upper electrostatic pad 216 electrostatically attracts the substrate 200.

  Next, as shown in FIG. 14, the robot arm 74 inserts the suction claw 73 below the lower substrate holder 230 and vacuum-sucks the lower substrate holder 230. In this state, the connecting portion 75 of the robot arm 74 is in contact with the outer receiving terminal 238 and the lower receiving terminal 220 and applies a voltage. Thereby, the lower electrostatic pad 236 and the upper electrostatic pad 216 electrostatically attract the substrate 200.

  Thereafter, the robot arm 74 transports the substrate 200 to any one of the pressurizing chambers 76 connected to the rear robot chamber 72. For example, as shown in FIG. 15, the robot arm 74 rotates 60 degrees clockwise around the center C <b> 2 and transports the substrate 200 to the pressurizing chamber 76 on the lower right side of the drawing. Here, in the pressurizing chamber 68 and the pressurizing chamber 76, the positional relationship between the connection portions 94 and 104 to which a voltage can be applied is opposite to the center of the lower pressurizing stages 90 and 100 by 180 degrees. Therefore, the connecting portion 104 of the pressurizing chamber 76 is connected to the outer receiving terminal 238 and the lower receiving terminal 220 rotated 180 degrees by the robot arm 66. As a result, a voltage is applied to the outer receiving terminal 238 and the lower receiving terminal 220 via the connection unit 104, and the lower electrostatic pad 236 and the upper electrostatic pad 216 electrostatically attract the substrate 200.

  Thereafter, the robot arm 74 conveys the lower substrate holder 230 and the upper substrate holder 210 to the relay stand 98. After the relay table 98 rotates the lower substrate holder 230 and the upper substrate holder 210 by 180 degrees around the vertical axis, the robot arm 66 conveys the lower substrate holder 230 and the upper substrate holder 210 to the mounting table 84.

  In the above-described embodiment, when the lower substrate holder 230 and the upper substrate holder 210 are loaded into the pressurizing chambers 68 and 76 in any of a plurality of different directions, the connecting portion 94 and the connecting portion 104 are external receiving terminals. 238 and the lower surface receiving terminal 220 can be engaged and connected. Thereby, even if the lower substrate holder 230 and the upper substrate holder 210 are rotated by the robot arm 66, the connecting portion 94 and the connecting portion 104 can apply a voltage to the outer receiving terminal 238 and the lower surface receiving terminal 220.

  FIG. 16 is a plan view of the lower pressure stage in the embodiment in which the connection portion is changed. 17 is an enlarged cross-sectional view of a part of the lower stage shown in FIG. In FIG. 16, the connection terminals 318 are hatched for convenience of explanation. As shown in FIGS. 16 and 17, the connection portion 394 includes eight support members 312 and a pair of connection terminals 318. The four support members 312 have a cylindrical portion 313 and a branch portion 314. The four support members 312 support one connection terminal 318 at a height that can be connected to the external receiving terminal 238 of the lower substrate holder 230 indicated by thick line hatching. The remaining four support members 312 support the other connection terminal 318 at a height that can be connected to the lower surface receiving terminal 220 of the upper substrate holder 210 indicated by thin line hatching. The pair of connection terminals 318 includes a slide part 338 and a ring-shaped ring part 340. The slide part 338 is formed in a columnar shape. The slide part 338 is supported by the branch part 314 so as to be slidable in the vertical direction. The ring part 340 is provided at the upper end of the slide part 338. The pair of ring portions 340 are arranged concentrically. The outer diameter of one ring part 340 is smaller than the inner diameter of the other ring part 340. Therefore, one ring part 340 is disposed so as to be surrounded by the other ring part 340. With this configuration, the connection terminal 318, the outer receiving terminal 238, and the lower surface receiving terminal 220 are connected to each other regardless of the direction in which the lower substrate holder 230 and the upper substrate holder 210 are conveyed to the lower pressure stage 90. Connected.

  In the above-described embodiment, the example in which the two pressure units 69 and 77 are connected in series has been described. However, three or more pressure units may be connected in series or in parallel. In each pressurization part 69 and 77, the number of pressurization chambers 68 and 76 may be changed suitably, and arrangement of pressurization chambers 68 and 76 may be a combination of series, parallel, and other arrangements.

  Further, although the example in which the substrate holder 204 holds the substrate 200 by electrostatic force is shown, the substrate holder 204 may be configured to hold the substrate 200 by vacuum suction or the like.

  In the above-described embodiment, an example in which the power supply terminals 118 and 128 are not attached to some of the branch parts 114 is shown, but the power supply terminals 118 and 128 may be attached to all of the branch parts 114. Thus, the power supply terminals 118 and 128 engage with the outer receiving terminal 238 and the lower receiving terminal 220 when the lower substrate holder 230 and the upper substrate holder 210 are carried into the pressurizing chambers 68 and 76 in the first direction. It is arranged at each of the position and the position where it engages with the outer receiving terminal 238 and the lower receiving terminal 220 when it is carried in the second direction.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

  DESCRIPTION OF SYMBOLS 10 Board | substrate bonding apparatus, 12 Pre-processing part, 14 Bonding part, 16 Control part, 20 Front frame, 22 Substrate cassette, 24 Robot arm, 26 Pre-aligner, 28 Robot arm, 30 Carry-in part, 32 Carry-out part, 34 Aligner , 40 Turntable, 42 Holder table, 50 Robot arm, 52 Fixed stage, 54 Moving stage, 60 Rear frame, 62 Air lock chamber, 64 Front robot chamber, 65 Adsorption claw, 66 Robot arm, 67 Connection, 68 Addition Pressure chamber, 69 Pressurization section, 70 Relay port, 72 Rear robot chamber, 73 Adsorption claw, 74 Robot arm, 75 Connection section, 76 Pressure chamber, 77 Pressure unit, 80 shutter, 82 shutter, 84 mounting table, 88 connection unit, 90 lower pressure stage, 91 top plate, 92 upper pressure stage, 94 connection unit, 95 pressing unit, 96 shutter, 97 shutter, 98 relay Base, 99 connection part, 100 lower pressure stage, 101 top plate, 102 upper pressure stage, 104 connection part, 112 support member, 113 column part, 114 branch part, 116 elastic member, 118 power supply terminal, 128 power supply terminal , 200 substrate, 202 superposed substrate, 204 substrate holder, 210 upper substrate holder, 212 upper holder body, 214 attracted portion, 216 electrostatic pad, 218 Upper surface receiving terminal, 220 Lower surface receiving terminal, 222 Upper mounting surface, 230 Lower substrate holder, 232 Lower holder main body, 233 Recess, 234 Adsorption portion, 236 Lower electrostatic pad, 238 Outer receiving terminal, 242 Lower mounting surface, 312 Support member , 313 cylindrical part, 314 branch part, 318 connection terminal, 338 slide part, 340 ring part, 394 connection part

Claims (19)

A plurality of pressure chambers for pressing and bonding a plurality of substrates;
A substrate holding member for holding the substrate;
A transport unit for transporting the substrate and the substrate holding member to the plurality of pressure chambers;
An engaging member provided in each of the plurality of pressurizing chambers and engaged with an engaging portion of the substrate holding member, wherein the substrate holding member is carried into the pressurizing chamber in any of a plurality of different directions. A substrate bonding apparatus comprising an engaging member that engages with the engaging portion even when the engaging portion is engaged.   The engaging member is movably provided in the pressurizing chamber, and moves to a position where the engaging member is engaged with the engaging portion according to a direction in which the substrate holding member is carried into the pressurizing chamber. Item 2. A substrate bonding apparatus according to Item 1.   The pressurizing chamber is provided with a plurality of support members that detachably support the engaging member, and the engaging member is in accordance with the direction in which the substrate holding member is carried into the pressurizing chamber. The board | substrate bonding apparatus of Claim 2 by which the supporting member supported is changed so that it may engage with the said engaging part.   The substrate bonding apparatus according to claim 3, wherein the plurality of support members are arranged in a rotational symmetry of 45 degrees or more and 180 degrees or less.   The substrate bonding apparatus according to claim 2, wherein the engagement member is slidably provided.   Among the plurality of pressurizing chambers, the engaging members of the odd-numbered pressurizing chambers along the transport path of the substrate holding member are in the engaging portion of the substrate holding member carried in the first direction. The engagement member of the even-numbered pressurizing chamber is arranged at a corresponding first position, and the second position corresponding to the engagement portion of the substrate holding member loaded in the second direction. The board | substrate bonding apparatus as described in any one of Claim 1 to 5 arrange | positioned.   The engagement member of the odd-numbered pressurizing chamber and the engagement member of the even-numbered pressurizing chamber are arranged at rotationally symmetric positions of 45 degrees or more and 180 degrees or less. The board | substrate bonding apparatus of description. A plurality of pressurizing units having the plurality of pressurizing chambers;
The engagement member of each pressurizing chamber of the odd-numbered pressurizing unit along the transport path of the substrate holding member corresponds to the first engaging unit of the substrate holding member carried in the first direction. The engaging members of the pressurizing chambers of the even-numbered pressurizing units are arranged at the positions of the second pressurizing units corresponding to the engaging units of the substrate holding member carried in the second orientation. The board | substrate bonding apparatus as described in any one of Claim 1 to 5 arrange | positioned in the position.   The engagement members of the pressurization chambers of the odd-numbered pressurization units and the engagement members of the pressurization chambers of the even-numbered pressurization units rotate 45 degrees or more and 180 degrees or less. The board | substrate bonding apparatus of Claim 8 arrange | positioned in the symmetrical position. A plurality of pressurizing sections each having the plurality of pressurizing chambers and connected to each other; and a connecting section connecting the plurality of pressurizing sections;
The engagement member in each of the plurality of pressurizing chambers is disposed at a position corresponding to the direction of the substrate holding member temporarily placed on the connecting portion. Substrate bonding device.   The said engaging member adjusts the direction of the said board | substrate according to the angle of the carrying-out direction of the said board | substrate holding member from the said connection part with respect to the direction of the said board | substrate holding member temporarily placed in the said connection part. Substrate bonding equipment.   The board | substrate bonding apparatus of any one of Claim 1 to 11 in which the said conveyance part conveys in the state which accumulated these several board | substrates. The engagement member is a supply unit that supplies a holding force of the substrate to the substrate holding member,
The substrate bonding apparatus according to claim 1, wherein the engaging portion is a receiving portion that receives supply of holding force from the supplying portion.   The substrate bonding according to claim 13, wherein the holding force is an electrostatic force, the supply unit is a power supply terminal that supplies power to the substrate holding member, and the receiving unit is a connection terminal connected to the power supply terminal. apparatus.   The engagement member includes a position where the substrate holding member is engaged with the engagement portion when the substrate holding member is loaded in the first direction, and the engagement portion when the substrate holding member is loaded in the second direction. The board | substrate bonding apparatus of Claim 1 arrange | positioned at each position with which it engages. A plurality of pressure chambers for pressing and bonding a plurality of substrates;
A transport unit for transporting the substrate to the pressurizing chamber;
An engaging member provided in each pressurizing chamber and engaged with the engaging portion of the substrate, and the substrate may be carried into the pressurizing chamber in any of a plurality of different directions. A substrate bonding apparatus comprising: an engaging member that engages with the engaging portion.   The engaging member is movably provided in the pressurizing chamber, and moves to a position to engage with the engaging portion in accordance with a direction in which the substrate is carried into the pressurizing chamber. The board | substrate bonding apparatus of description.   The substrate bonding apparatus according to claim 16, wherein the engagement member is slidably provided.   The engaging member is located at a position where the substrate is engaged with the engaging portion when the substrate is carried into the pressurizing chamber in the first direction and to the engaging portion when the substrate is carried in the second direction. The board | substrate bonding apparatus of Claim 16 arrange | positioned at each with the position to engage.

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