JP5970909B2 - Clamp mechanism and substrate bonding apparatus - Google Patents

Description

  The present invention relates to a clamp mechanism and a substrate bonding apparatus.

A substrate bonding method for bonding a plurality of substrates held in a state of being stacked on a pair of substrate holders having a pair of substrate holders is known (for example, see Patent Document 1). The pair of substrate holders of the pair of substrate holders has a coupling member that couples to each other by magnetic force or the like. At least one of the coupling members is provided on the substrate holder by an elastic member. When the coupling member is coupled, the plurality of substrates are sandwiched between the pair of substrate holders.
[Patent Document 1] Japanese Patent Application Laid-Open No. 2010-10628

  However, when the pair of substrate holders are coupled to each other, there is a problem that the elastic member is deformed and the relative positions of the plurality of sandwiched substrates are shifted.

  In the first aspect of the present invention, a plurality of substrates are provided between the first holder body having a first holder body and a first coupling member provided on the first holder body, and the first holder body. A second holder main body that sandwiches the first coupling member, a second coupling member that is provided in the second holder main body and that couples to the first coupling member, and connects the second holder main body and the second coupling member and is elastically deformable. A second substrate holder having a flexible elastic member, the first coupling member, and a stress reducing unit that reduces the stress in the surface direction of the substrate generated in the elastic member by coupling the second coupling member; A clamp mechanism is provided.

  In the 2nd aspect of this invention, a board | substrate bonding apparatus provided with the above-mentioned clamp mechanism is provided.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

1 is an overall configuration diagram of a substrate bonding apparatus 10. FIG. It is a figure explaining the bonding process of the bonding board | substrate 95 by the board | substrate bonding apparatus 10. FIG. It is a figure explaining the bonding process of the bonding board | substrate 95 by the board | substrate bonding apparatus 10. FIG. It is a figure explaining the bonding process of the bonding board | substrate 95 by the board | substrate bonding apparatus 10. FIG. It is a figure explaining the bonding process of the bonding board | substrate 95 by the board | substrate bonding apparatus 10. FIG. It is a bottom view of the upper substrate holder 100 which is one substrate holder 94 of a clamp mechanism. It is a perspective view of the upper substrate holder 100 seen from below. It is a top view of the lower board | substrate holder 200 which is the other board | substrate holder 94 of a clamp mechanism. It is a perspective view of the lower board | substrate holder 200 seen from upper direction. It is an expansion perspective view of the vicinity of the to-be-joined part 208 in the clamping state. It is a figure explaining clamping of the board | substrate 90 when there is no stress reduction part 230. FIG. It is a figure explaining clamping of the board | substrate 90 when there is no stress reduction part 230. FIG. It is a figure explaining clamping of the board | substrate 90 when there is no stress reduction part 230. FIG. It is a figure explaining clamping of the board | substrate 90 in this embodiment which has the stress reduction part 230. FIG. It is a figure explaining clamping of the board | substrate 90 in this embodiment which has the stress reduction part 230. FIG. It is a figure explaining clamping of the board | substrate 90 in this embodiment which has the stress reduction part 230. FIG. It is a fragmentary perspective view of the to-be-joined part 1208 which has the stress reduction part 1230 which changed the support mechanism. It is a fragmentary perspective view of the to-be-joined part 308 vicinity explaining another embodiment of the stress reduction part 330. FIG. It is the schematic seen from the side of the coupling | bond part 108 and the to-be-joined part 308. FIG. It is a figure explaining operation | movement of the to-be-joined part 308. FIG. It is a figure explaining operation | movement of the to-be-joined part 308. FIG. FIG. 19 is a partial perspective view of the vicinity of a coupled portion 1308 obtained by modifying a part of the coupled portion 308 illustrated in FIG. 18. It is the schematic seen from the side of the coupling | bond part 108 and the to-be-joined part 1308. FIG. It is a fragmentary perspective view of the to-be-joined part 2308 vicinity of another embodiment. FIG. 11 is a plan view of a stress reduction portion 2330 of a coupled portion 2308. It is a fragmentary perspective view of the to-be-joined part 3308 vicinity of another embodiment. It is a fragmentary perspective view of the coupling | bond part 408 vicinity of the upper substrate holder 100 of another embodiment. 4 is an exploded perspective view of a coupling portion 408. FIG. It is a figure explaining operation | movement of the coupling | bond part 408. FIG. It is a figure explaining operation | movement of the coupling | bond part 408. FIG. It is a figure explaining operation | movement of the coupling | bond part 408. FIG. It is a figure explaining operation | movement of the coupling | bond part 408. FIG. It is a figure explaining operation | movement of the coupling | bond part 408. FIG. It is the schematic of the coupling | bond part 2408 of another embodiment. It is a figure explaining operation | movement of the coupling | bond part 2408. FIG. It is a figure explaining operation | movement of the coupling | bond part 2408. FIG. It is a figure explaining operation | movement of the coupling | bond part 2408. FIG. It is the schematic explaining another stress reduction part 530. FIG. It is a figure explaining another lower elastic member 616 and to-be-joined member 618. FIG. 5 is a plan view of a lower elastic member 616. FIG. It is an exploded view of the member to be coupled 618. It is a side view of the to-be-coupled member 618 in a non-coupled state. It is a side view of the to-be-coupled member 618 in a coupled state.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is an overall configuration diagram of the substrate bonding apparatus 10. The substrate bonding apparatus 10 manufactures a bonded substrate 95 by bonding two substrates 90 and 90 together. The substrate bonding apparatus 10 may manufacture the bonded substrate 95 by bonding three or more substrates 90 at a time.

  As shown in FIG. 1, the substrate bonding apparatus 10 includes an air environment unit 14, a vacuum environment unit 16, and a control unit 18.

  The atmospheric environment unit 14 includes an environment chamber 12, a plurality of substrate cassettes 20, a substrate holder rack 22, a robot arm 24, a pre-aligner 26, an aligner 28, and a robot arm 30. The environmental chamber 12 is formed so as to surround the atmospheric environment unit 14.

  The substrate cassette 20 accommodates the substrate 90 and the bonded substrate 95 bonded together in the substrate bonding apparatus 10. The substrate 90 to be bonded by the substrate bonding apparatus 10 may be formed with elements, circuits, terminals, and the like in addition to a single silicon wafer, a compound semiconductor wafer, a glass substrate, and the like.

  The substrate holder rack 22 accommodates a plurality of pairs of substrate holders 94 that hold the stacked substrate 92 and the bonded substrate 95 on which the pair of substrates 90 are stacked from above and below. The substrate holder 94 holds the substrate 90 by electrostatic adsorption.

  The robot arm 24 transports the substrate 90 loaded in the substrate cassette 20 to the pre-aligner 26. The robot arm 24 conveys the substrate 90 of the pre-aligner 26 to the substrate holder 94 placed on the moving stage 38 of the aligner 28 described later. After being bonded, the robot arm 24 transfers the bonded substrate 95 transferred to the moving stage 38 to one of the substrate cassettes 20.

  The pre-aligner 26 temporarily aligns the positions of the individual substrates 90 so that each substrate 90 is loaded in the narrow adjustment range of the aligner 28 because of the high accuracy when the substrates 90 are loaded on the aligner 28. . Thereby, the positioning of the substrate 90 in the aligner 28 can be performed quickly and accurately.

  The aligner 28 is disposed between the robot arm 24 and the robot arm 30. The aligner 28 includes a frame body 34, a fixed stage 36, a moving stage 38, and a pair of shutters 40 and a shutter 42.

  The frame 34 is formed so as to surround the fixed stage 36 and the moving stage 38. Openings are formed in the surface of the frame 34 on the substrate cassette 20 side and the surface on the vacuum environment unit 16 side so that the substrate 90, the superimposed substrate 92, and the bonded substrate 95 can be carried in and out.

  The lower surface of the fixed stage 36 vacuum-sucks the substrate holder 94 conveyed from the moving stage 38 by the robot arm 30 while holding the substrate 90.

  The upper surface of the moving stage 38 vacuum-sucks the substrate 90 and the substrate holder 94. The moving stage 38 moves in the horizontal direction and the vertical direction inside the frame body 34. Accordingly, the substrate 90 and the substrate holder 94 held on the fixed stage 36 and the substrate 90 and the substrate holder 94 held on the moving stage 38 are aligned and overlapped by the movement of the moving stage 38. Is temporarily joined. The substrate 90 and the substrate 90 may be temporarily bonded with an adhesive or may be temporarily bonded with plasma.

  The shutter 40 opens and closes the opening of the frame 34 on the substrate cassette 20 side. The shutter 42 opens and closes the opening of the frame 34 on the vacuum environment unit 16 side. The area surrounded by the frame body 34 and the shutters 40 and 42 is communicated with an air conditioner or the like, and the temperature is controlled. Thereby, the accuracy of alignment between the substrate 90 and the substrate 90 is improved.

  The robot arm 30 conveys the substrate holder 94 accommodated in the substrate holder rack 22 to the moving stage 38. The robot arm 30 is placed on the moving stage 38, and the substrate holder 94 holding the substrate 90 is turned over and transferred to the fixed stage 36. The robot arm 30 vacuum-sucks the substrate holder 94 including the pair of substrates 90 aligned by the moving stage 38 and conveys the substrate holder 94 to the vacuum environment unit 16. The robot arm 30 conveys the bonded substrate 95 from the vacuum environment unit 16 to the moving stage 38.

  The vacuum environment unit 16 is set to a high temperature and a vacuum state in the bonding process of the substrate bonding apparatus 10. The vacuum environment unit 16 includes a load lock chamber 48, a pair of access doors 50 and a gate valve 52, a robot arm 54, three storage chambers 55, three heating and pressurizing devices 56, a robot arm 58, The cooling chamber 60 is provided. Note that the number of the heating and pressing devices 56 is not limited to three, and may be changed as appropriate.

  The load lock chamber 48 connects the atmospheric environment unit 14 and the vacuum environment unit 16. The load lock chamber 48 can be set to a vacuum state and an atmospheric pressure. Openings are formed in the load lock chamber 48 on the atmosphere environment unit 14 side and the vacuum environment unit 16 side so that the superimposed substrate 92 and the bonded substrate 95 including the pair of substrates 90 held by the pair of substrate holders 94 can be conveyed. Has been.

  The access door 50 opens and closes the opening of the load lock chamber 48 on the atmosphere environment unit 14 side. The gate valve 52 opens and closes the opening of the load lock chamber 48 on the vacuum environment unit 16 side. The robot arm 54 carries the superposed substrate 92 carried into the load lock chamber 48 by the robot arm 30 into one of the heating and pressing devices 56.

  The storage chamber 55 is connected to the robot chamber 53 via a gate valve 57. The accommodation chamber 55 opens and closes the gate valve 57 in order to carry in and carry out the overlapping substrate 92 and the bonded substrate 95.

  The three heating / pressurizing devices 56 are arranged radially around the robot arm 54. The heating and pressing device 56 is configured to be able to heat and press the overlapping substrate 92. The heating and pressurizing device 56 can bond the overlapping substrate 92 carried in from the load lock chamber 48.

  The robot arm 58 is rotatably arranged at the center of the robot chamber 53. Thereby, the robot arm 58 can convey the bonded substrate 95 from the heating and pressurizing device 56 to the cooling chamber 60. Further, the robot arm 58 can transfer the bonded substrate 95 from the cooling chamber 60 to the load lock chamber 48.

  The cooling chamber 60 has a cooling function. Thereby, the cooling chamber 60 can cool the high-temperature bonded substrate board 95 coupled by the robot arm 58. The cooling chamber 60 is connected to the robot chamber 53 through a gate valve 57. The control unit 18 controls the overall operation of the substrate bonding apparatus 10.

  2 to 5 are diagrams for explaining a bonding process of the bonded substrate 95 by the substrate bonding apparatus 10. In the bonding step, first, as shown in FIG. 2, the robot arm 30 conveys the substrate holder 94 from the substrate holder rack 22 to the moving stage 38. The robot arm 24 places the substrate 90 on the substrate holder 94 placed on the moving stage 38 via the pre-aligner 26 from any of the substrate cassettes 20.

  The robot arm 30 carries the substrate holder 94 holding the substrate 90 upside down from the moving stage 38 to the fixed stage 36. As shown in FIG. 3, the fixed stage 36 holds the substrate holder 94 by vacuum suction after receiving the substrate holder 94 together with the substrate 90 from the robot arm 30.

  Next, after the robot arm 30 transports the substrate holder 94 to the moving stage 38 by the same operation, the robot arm 24 transports the substrate 90 to the substrate holder 94 on the moving stage 38. The moving stage 38 moves below the fixed stage 36 that holds the substrate 90 and the substrate holder 94 while holding the substrate 90 and the substrate holder 94. As a result, the substrate 90 of the movable stage 38 and the substrate 90 of the fixed stage 36 are positioned relative to each other.

  Next, as shown in FIG. 4, the moving stage 38 moves upward, and the upper surface of the substrate 90 of the moving stage 38 and the lower surface of the substrate 90 of the fixed stage 36 are brought together. Thereafter, the robot arm 30 conveys the superimposed substrate 92 on the moving stage 38 to the load lock chamber 48. Thereafter, the robot arm 54 carries the superimposed substrate 92 from the load lock chamber 48 to the heating and pressurizing device 56.

  Next, in the bonding step, the heating and pressurizing device 56 heats the overlapping substrate 92 to the bonding temperature, and then pressurizes the overlapping substrate 92 from above and below while maintaining the bonding temperature. Thereby, the substrates 90 and 90 of the overlapping substrate 92 are bonded to become a bonded substrate 95. Thereafter, the robot arm 58 carries the bonded substrate board 95 into the cooling chamber 60. The cooling chamber 60 cools the bonded substrate board 95. The robot arm 58 transports the cooled bonded substrate 95 together with the substrate holder 94 from the cooling chamber 60 to the load lock chamber 48.

  Next, the robot arm 30 conveys the bonded substrate 95 from the load lock chamber 48 to the moving stage 38. As shown in FIG. 5, the bonded substrate 95 is separated from the substrate holder 94 by the robot arm 30 on the moving stage 38. Thereafter, the robot arm 24 carries the bonded substrate board 95 to one of the substrate cassettes 20. Thereby, the bonding process by the board | substrate bonding apparatus 10 is complete | finished, and the bonded substrate board 95 is completed. After that, along the dotted line shown in FIG. 5, the laminated substrate 95 is separated into individual pieces, thereby completing the laminated semiconductor device 96.

  FIG. 6 is a bottom view of the upper substrate holder 100 which is one substrate holder 94 of the clamp mechanism. FIG. 7 is a perspective view of the upper substrate holder 100 as viewed from below. The up and down directions indicated by arrows in FIG. As shown in FIGS. 6 and 7, the upper substrate holder 100 includes an upper placement portion 102, an upper ear portion 104, a pair of upper electrostatic pads 106 and 107, three coupling portions 108, and an upper power supply terminal. 120 and 122 and a plurality of upper couplers 112. The upper placement part 102 and the upper ear part 104 are examples of the first holder body.

The upper mounting portion 102 is made of a ceramic such as AlN having an allowable stress of 120 MPa and a thermal expansion coefficient of 4.5 × 10 ⁻⁶ / ° C. The upper placement portion 102 is formed in a substantially disk shape that is slightly larger than the substrate 90. The lower surface of the upper mounting part 102 is formed in a planar shape. The lower surface of the upper placement part 102 protrudes below the upper ear part 104. The lower surface of the central portion of the upper placement unit 102 functions as a placement surface on which the substrate 90 is placed.

  The upper ear 104 is supported by the robot arms 24, 30, 54, 58, etc. during transport. The upper ear portion 104 is formed in a ring shape. The upper ear portion 104 has three upper ear piece members 124 divided in the circumferential direction. The upper ear piece members 124 are arranged apart from each other along the circumferential direction. That is, a space is formed between adjacent upper ear piece members 124. The inner periphery of the upper ear portion 104 is formed in substantially the same shape as the outer periphery of the upper placement portion 102. The inner periphery of the upper ear portion 104 is connected to the outer periphery of the upper placement portion 102. Further, the upper ear 104 may be used to be supported by another member such as a pin of a temporary placing table instead of or in addition to the robot arm 24.

  A plurality of notches 126 are formed on the outer periphery of the upper ear portion 104. The notch 126 has a plurality of functions. For example, the notch 126 is passed with a push-up pin that separates the upper substrate holder 100 and a lower substrate holder described later. The periphery of the notch 126 is processed with a high temperature laser. Thereby, in the state which returned to normal temperature after pressurization, a compressive stress acts on the periphery of the notch 126. FIG. As a result, the distortion due to the deformation of the compressive stress is absorbed by the notch 126, and damage to the upper ear portion 104 can be suppressed.

  The upper electrostatic pad 106 is formed in a semicircular shape. The upper electrostatic pads 106 and 107 are embedded in the upper placement unit 102. One upper electrostatic pad 106 is disposed so as to be symmetrical with the other upper electrostatic pad 107 with the center of the upper mounting portion 102 interposed therebetween. The upper power supply terminals 120 and 122 are provided on the outer peripheral portion of the upper ear portion 104. The upper power supply terminals 120 and 122 are disposed on both the upper surface and the lower surface of the upper ear portion 104. The upper power supply terminals 120 and 122 are electrically connected to the robot arms 24, 30, 54, 58, and the like during transportation to be supplied with electric power. The upper power supply terminal 120 supplies electric power to one upper electrostatic pad 106 to charge positive charges. The upper power supply terminal 122 supplies power to the other upper electrostatic pad 107 to charge negative charges. Thus, the upper electrostatic pad 106 generates an electrostatic force and electrostatically attracts the substrate 90.

  The three coupling portions 108 are arranged on the outer peripheral side of the upper placement portion 102 and where the upper ear portion 104 is interrupted. The three coupling portions 108 are arranged at approximately 120 ° intervals in the circumferential direction. Each coupling portion 108 includes an upper coupling member 114 and a pair of coupling members 116 that are an example of a first coupling member. The upper connecting member 114 is formed in a substantially rectangular shape that is long in the circumferential direction of the upper placement portion 102 in plan view. The upper connecting member 114 is connected to the outer peripheral portion of the upper placement portion 102. The pair of coupling members 116 are provided on the upper placement portion 102 via the upper coupling member 114. The pair of coupling members 116 includes a permanent magnet for coupling.

  The upper connector 112 elastically connects the upper placement part 102 and the upper ear part 104 while urging the upper placement part 102 to be movable in the radial direction with respect to the upper ear part 104.

  FIG. 8 is a top view of the lower substrate holder 200 which is the other substrate holder 94 of the clamp mechanism. FIG. 9 is a perspective view of the lower substrate holder 200 as viewed from above. FIG. 10 is an enlarged perspective view of the vicinity of the coupled portion 208 in the clamped state. The up and down directions indicated by arrows in FIG. As shown in FIGS. 8, 9 and 10, the lower substrate holder 200 includes a lower mounting portion 202, a lower ear portion 204, a pair of lower electrostatic pads 206 and a lower electrostatic pad 207, and three covered substrates. Coupling portions 208, 208, 208, lower power supply terminals 222, 224, and a lower connector 228 are included. The lower placement part 202 and the lower ear part 204 are examples of the second holder body.

  The lower mounting portion 202 is formed in a substantially disk shape that is slightly larger than the substrate 90. The upper surface of the lower mounting part 202 is formed in a planar shape. The upper surface of the lower placement part 202 protrudes above the lower ear part 204. The upper surface of the center part of the lower mounting part 202 functions as a mounting surface on which the substrate 90 is mounted. The lower mounting unit 202 holds the pair of substrates 90 between the upper mounting unit 102.

  The lower ear portion 204 is supported by the robot arms 24, 30, 54, 58, etc. during transportation. The lower ear portion 204 is formed in a ring shape. The lower ear portion 204 includes a lower ear piece member 220 divided into three pieces in the circumferential direction. Each lower ear piece member 220 is spaced apart along the circumferential direction. The inner periphery of the lower ear portion 204 is formed in substantially the same shape as the outer periphery of the lower placement portion 202. The inner periphery of the lower ear portion 204 is fixed to the outer periphery of the lower placement portion 202. A notch 210 having the same function as the notch 126 is formed on the outer periphery of the lower ear portion 204.

  The lower electrostatic pad 206 is formed in a semicircular shape. The lower electrostatic pads 206 and 207 are embedded in the lower placement unit 202. One lower electrostatic pad 206 is arranged so as to be symmetrical with the other lower electrostatic pad 207 with the center of the lower mounting portion 202 interposed therebetween. The lower power supply terminals 222 and 224 are formed on the lower surface of the lower ear portion 204. One lower electrostatic pad 206 is negatively charged by the power supplied from the lower power supply terminal 222. The other lower electrostatic pad 207 is positively charged by the power supplied from the lower power supply terminal 224. As a result, the lower electrostatic pad 206 generates an electrostatic force and electrostatically attracts the substrate 90.

  The three coupled portions 208 are arranged on the outer peripheral side of the lower placement portion 202 and at a location where the lower ear portion 204 is interrupted. The three coupled portions 208 are arranged at approximately 120 ° intervals in the circumferential direction. Each coupled portion 208 includes a lower connecting member 214, a pair of lower elastic members 216 that is an example of an elastic member, a pair of coupled members 218 that is an example of a second coupling member, and a stress reduction unit 230. .

  The lower connecting member 214 is formed in a substantially square shape in plan view. The lower connecting member 214 is connected to the outer peripheral portion of the lower mounting portion 202. The lower elastic member 216 is configured by an elastically deformable leaf spring. The lower elastic member 216 is formed in a rectangular shape that is long in the circumferential direction. One end of the lower elastic member 216 is connected to the lower connecting member 214. The other end of the lower elastic member 216 is coupled to the coupled member 218 so that it cannot move in the vertical direction with respect to the coupled member 218. Thereby, the lower elastic member 216 connects the member to be coupled 218 to the lower mounting portion 202 via the lower connecting member 214.

  Here, the lower elastic member 216 couples the coupling member 116 and the coupled member 218 to each other even when the thickness of the substrate 90 sandwiched between the upper substrate holder 100 and the lower substrate holder 200 changes. That is, the lower elastic member 216 enables relative movement along the coupling direction of the coupling member 116 and the coupled member 218. The coupling direction here is the normal direction of the substrate 90. Further, the lower elastic member 216 includes the coupling member 116 and the lower substrate holder 200 so that the upper substrate holder 100 and the lower substrate holder 200 restrain relative movement in the surface direction of the substrate 90 in a state where the coupling member 116 and the coupled member 218 are coupled to each other. The relative movement along the surface direction of the coupled member 218 is restrained. The surface direction here is a direction parallel to the surface of the substrate 90 and orthogonal to the normal line of the surface of the substrate 90. Further, the lower elastic member 216 causes the reaction force due to elastic deformation to act as a force for sandwiching the pair of substrates 90 between the upper substrate holder 100 and the lower substrate holder 200.

  The coupled member 218 includes a material that is attracted to the magnet, for example, a ferromagnetic material. The coupled member 218 is provided on the lower mounting portion 202 via the lower connecting member 214 and the lower elastic member 216. The pair of members to be coupled 218 are disposed at positions facing the coupling member 116. As a result, when the lower surface of the upper substrate holder 100 and the upper surface of the lower substrate holder 200 are close to each other, the coupled members 218 are attracted to the coupling member 116 by a magnetic force and coupled to each other. As a result, the substrates 90 and 90 are held by the upper substrate holder 100 and the lower substrate holder 200. In this substrate holding state, the lower elastic member 216 is elastically deformed and appropriately adjusts the pressing force acting on the substrates 90 and 90 from the upper substrate holder 100 and the lower substrate holder 200.

  The stress reduction unit 230 is configured by the same leaf spring as the lower elastic member 216. An example of the thickness of the stress reduction part 230 is 0.1 mm. One end of the stress reduction unit 230 is coupled to the lower coupling member 214. Accordingly, the three pairs of stress reduction units 230 are arranged around the center of the lower placement unit 202 at 120 ° intervals. As a result, the three pairs of stress reduction portions 230 are point-symmetrical around the center of the lower substrate holder main body constituted by the lower placement portion 202 and the lower ear portion 204 in plan view. The other end portion of the stress reduction unit 230 is connected to the member to be coupled 218 so that it cannot move in the vertical direction with respect to the member to be coupled 218. The stress reduction unit 230 connects the coupled member 218 and the lower placement unit 202 via the lower connection member 214. Moreover, since the stress reduction part 230 is connected with the to-be-coupled member 218 which is not fixed, it is cantilever. The stress reduction unit 230 is disposed above the lower elastic member 216. The stress reduction unit 230 may be disposed below the lower elastic member 216. The stress reduction unit 230 is disposed in parallel with the lower elastic member 216. An example of the interval between the stress reduction unit 230 and the lower elastic member 216 is 0.7 mm. The distance between the stress reducing portion 230 and the lower elastic member 216 is preferably large in order to maintain the parallelism of the coupled member 218. The stress reduction unit 230 regulates the inclination of the coupled member 218 with respect to the horizontal direction. Thereby, the stress reduction unit 230 moves the coupled member 218 in parallel along the vertical direction. As a result, the stress reduction unit 230 reduces the stress in the surface direction of the substrate 90 generated in the lower elastic member 216 by coupling the coupling member 116 and the coupled member 218 in order to sandwich the substrate 90.

  Next, sandwiching of the pair of substrates 90 by the upper substrate holder 100 and the lower substrate holder 200 will be described.

  First, the clamping of the substrate 90 when there is no stress reduction unit 230 will be described. 11, 12, and 13 are diagrams for explaining the holding of the substrate 90 when the stress reduction unit 230 is not provided. As shown in FIG. 11, the substrate 90 held by the upper substrate holder 100 and the substrate 90 held by the lower substrate holder 200 are aligned, and then contact each other. As a result, as shown in FIG. 12, the coupling member 116 draws the coupled member 218 by an attracting force due to a magnetic force. Here, the coupled member 218 is coupled to the lower coupling member 214 only by the lower elastic member 216. Accordingly, the coupled member 218 rotates counterclockwise around the end of the lower elastic member 216 on the lower coupling member 214 side. As a result, the coupled member 218 comes into contact with the coupling member 116 in an inclined state. Thereafter, the member to be coupled 218 rotates clockwise with respect to the contact point with the coupling member 116. As a result, as shown in FIG. 13, the coupled member 218 is in a horizontal state and coupled to the coupling member 116. Here, since the coupled member 218 moves in a complicated manner such as tilting and rotation, the lower elastic member 216 is distorted in the coupled state shown in FIG. Power is generated. Due to this restoration, the elastic force of the lower elastic member 216 acts on the coupled member 218 as stress, so that the relative positions of the substrate 90 and the substrate 90 shift.

  Next, clamping of the substrate 90 of this embodiment will be described. FIGS. 14, 15, and 16 are diagrams for explaining the holding of the substrate 90 in the present embodiment having the stress reduction unit 230. As shown in FIG. 14, after the substrate 90 held by the upper substrate holder 100 and the substrate 90 held by the lower substrate holder 200 are aligned, they come into contact with each other. As a result, as shown in FIG. 15, the coupling member 116 draws the coupled member 218 by an attracting force due to a magnetic force. Here, the coupled member 218 is supported by the lower elastic member 216 and the stress reduction unit 230. Thereby, since the movement of the coupled member 218 in the horizontal direction is restricted, the coupled member 218 approaches the coupling member 116 while maintaining the horizontal state. Thereafter, as shown in FIG. 16, the upper surface of the coupled member 218 and the lower surface of the coupling member 116 are in surface contact with each other substantially in parallel. In this coupled state, the lower elastic member 216 and the stress reducing unit 230 are not distorted, so that no stress acts on the coupled member 218. As a result, the displacement of the relative position between the substrate 90 and the substrate 90 can be suppressed.

  Next, an embodiment in which the support mechanism of the stress reduction unit 230 in the above-described embodiment is changed will be described. FIG. 17 is a partial perspective view of a coupled portion 1208 having a stress reduction portion 1230 with a changed support mechanism. The stress reduction unit 1230 is made of the same leaf spring as the lower elastic member 216. As shown in FIG. 17, one end of the lower elastic member 216 and the stress reduction unit 1230 is connected to the end of the lower ear piece member 220. The other ends of the lower elastic member 216 and the stress reduction unit 1230 extend toward the lower connecting member 214 and are connected to the coupled member 218. The stress reduction unit 1230 is provided in parallel with the lower elastic member 216. Thereby, also in this embodiment, the stress reduction part 1230 can suppress the distortion of the lower elastic member 216, and can reduce the stress which acts on the to-be-joined member 218.

  FIG. 18 is a partial perspective view of the vicinity of the coupled portion 308 for explaining another embodiment of the stress reducing unit 330. FIG. 19 is a schematic view of the coupling portion 108 and the coupled portion 308 viewed from the side. As shown in FIGS. 18 and 19, the coupled portion 308 of the lower substrate holder 200 includes a lower elastic member 216, a coupled member 218, and a stress reducing unit 330. The lower elastic member 216, the coupled member 218, and the stress reduction unit 330 are provided on the lower substrate holder 200 in three pairs.

  The lower elastic member 216 includes a leaf spring. One end of the lower elastic member 216 is connected to the end of the lower ear piece member 220. The other end of the lower elastic member 216 extends toward the lower connecting member 214 and is connected to the coupled member 218.

  The stress reduction unit 330 is made of a nonmagnetic material. The rigidity of the stress reducing unit 330 in the surface direction of the substrate 90 is larger than the rigidity of the lower elastic member 216 in the surface direction of the substrate 90. The rigidity of the stress reduction unit 330 in the direction intersecting the surface direction of the substrate 90 is smaller than the rigidity of the lower elastic member 216 in the direction intersecting the surface direction of the substrate 90. The stress reduction unit 330 is formed in a plate shape. One end of the stress reducing unit 330 is connected to the end of the lower ear piece member 220. The pair of stress reduction portions 330 are arranged on both sides of the lower connecting member 214. The three pairs of stress reduction units 330 are 120 degrees around the center so as to be point-symmetrical around the center of the lower substrate holder main body constituted by the lower mounting unit 202 and the lower ear unit 204 in plan view. Has been placed. The other end of the stress reducing unit 330 extends toward the lower connecting member 214. The other end of the stress reduction unit 330 is not connected to any configuration. That is, the stress reduction unit 330 is cantilevered. A part of the stress reduction unit 330 covers an upper surface of the coupled member 218 that is an example of a surface on which the coupling member 116 and the coupled member 218 come into contact. Note that the stress reduction unit 330 may be disposed above the upper surface of the coupled member 218. In this case, the stroke of the stress reducing unit 330 may be smaller than the stroke of the lower elastic member 216 in the direction perpendicular to the surface of the substrate 90. The stress reduction unit 330 is not fixed to the upper surface of the coupled member 218. That is, the other end of the stress reduction unit 330 can move in the vertical direction around one end connected to the lower ear piece member 220. The frictional force generated between the lower surface of the stress reduction unit 330 and the upper surface of the coupled member 218 is smaller than the frictional force generated between the upper surface of the stress reduction unit 330 and the lower surface of the coupling member 116.

  Next, the operation of the coupled portion 308 shown in FIG. 18 will be described. 20 and 21 are diagrams illustrating the operation of the coupled portion 308. FIG.

  First, as shown in FIG. 19, the substrate 90 held by the upper substrate holder 100 and the substrate 90 held by the lower substrate holder 200 are aligned, and then contact each other. Here, since the stress reduction unit 330 is made of a non-magnetic material, it is not attracted to and contacted with the coupling member 116 until the substrates 90 are aligned.

  Next, as shown in FIG. 20, the coupling member 116 draws the coupled member 218 by magnetic force. As a result, the coupled member 218 is coupled to the coupling member 116 via the stress reduction unit 330. In this state, the lower elastic member 216 is elastically deformed and distortion occurs in the lower elastic member 216. Here, the frictional force generated between the lower surface of the stress reduction unit 330 and the upper surface of the coupled member 218 is smaller than the frictional force generated between the upper surface of the stress reduction unit 330 and the lower surface of the coupling member 116. Further, the rigidity of the stress reducing unit 330 in the surface direction of the substrate 90 is larger than the rigidity of the lower elastic member 216 in the surface direction of the substrate 90.

  Therefore, due to the stress generated by the distortion of the lower elastic member 216, the upper surface of the coupled member 218 having a small frictional force and small rigidity slides on the lower surface of the stress reducing unit 330. On the other hand, the lower surface of the coupling member 116 does not slide on the upper surface of the stress reduction unit 330 because the frictional force is large. As a result, as shown in FIG. 21, even if the lower elastic member 216 is restored and the stress is reduced, the relative position between the coupled member 218 and the lower mounting portion 202 is changed, so The relative position with respect to the substrate holder 200, that is, the relative position between the pair of substrates 90 does not change.

  Further, the frictional force generated between the lower surface of the stress reducing unit 330 and the upper surface of the coupled member 218 may be larger than the restoring force of the lower elastic member 216. Thereby, even if the lower elastic member 216 is elastically deformed, the stress reduction unit 330 can prevent the lower elastic member 216 from being restored while reducing the stress acting on the lower placement unit 202 from the lower elastic member 216.

  Next, an example in which a part of the coupled portion 308 shown in FIG. 18 is modified will be described. FIG. 22 is a partial perspective view of the vicinity of the coupled part 1308 obtained by modifying a part of the coupled part 308 shown in FIG. FIG. 23 is a schematic view seen from the side of the coupling portion 108 and the coupled portion 1308. The configuration of the coupled portion 1308 is the same as that of the coupled portion 308 shown in FIG.

  As illustrated in FIGS. 22 and 23, the stress reduction portion 1330 of the coupled portion 1308 includes a stress reduction member 1332 and a reinforcement portion 1334. The stress reduction member 1332 has the same configuration as the above-described stress reduction unit 330. The reinforcing portions 1334 are integrally provided on both sides of the region in contact with the coupling member 116 among both sides of the stress reducing member 1332. The reinforcing portion 1334 extends from the side edge to the coupled member 218 side. The reinforcing portion 1334 is made of a non-magnetic material, and is formed in a plate shape parallel to a surface intersecting with the surface of the stress reducing member 1332.

  The reinforcing portion 1334 is provided substantially parallel to the vertical plane. The reinforcing portion 1334 reinforces the plate-like stress reducing member 1332. Thereby, the reinforcement part 1334 can suppress the deformation | transformation of the stress reduction member 1332, especially the deformation | transformation of the stress reduction member 1332 of the area | region which contacts the coupling member 116. FIG. Further, the stress reducing member 1332 can exhibit the same operations and effects as the above-described stress reducing unit 330.

  In the above-described embodiment, the reinforcing portion 1334 is bent so as to extend toward the coupled member 218 side. However, the reinforcing portion 1334 is folded toward the side opposite to the coupled member 218, that is, the upper substrate holder 100 side. It may be done. In this case, even if the upper surface of the lower mounting portion 202 of the lower substrate holder 200 slides before the substrate 90 is sandwiched between the upper substrate holder 100 and the lower substrate holder 200, the reinforcing portion 1334 prevents the substrate 90 from falling off. Can do.

  FIG. 24 is a partial perspective view of the vicinity of the coupled portion 2308 of another embodiment. FIG. 25 is a plan view of the stress reducing portion 2330 of the coupled portion 2308. The configuration of the coupled portion 2308 other than the stress reduction portion 2330 is the same as that of the coupled portion 2308 shown in FIG. As shown in FIG. 24, one end of the stress reducing portion 2330 of the coupled portion 2308 is connected to the lower ear piece member 220. The other end of the stress reducing portion 2330 is connected to the lower connecting member 214. In other words, the stress reduction part 2330 is supported by both ends. The stress reduction unit 2330 is made of a nonmagnetic material and is formed in a plate shape. The frictional force generated between the lower surface of the stress reduction unit 2330 and the upper surface of the coupled member 218 is smaller than the frictional force generated between the upper surface of the stress reduction unit 2330 and the lower surface of the coupling member 116.

  Here, as shown in FIGS. 24 and 25, the stress reducing portion 2330 is formed with a plurality of deformation grooves 2336. The deformation groove 2336 increases the amount of elastic deformation of the stress reduction unit 2330. As a result, both end portions of the two-sided stress reduction portion 2330 are elastically deformed, and the central portion of the stress reduction portion 2330 can move in the vertical direction. Therefore, when the member to be coupled 218 is coupled to the coupling member 116, the stress reduction unit 2330 moves in the direction of the coupling member 116 while covering the upper surface of the member to be coupled 218. In the coupled state, the stress reducing unit 2330 is sandwiched between the coupled member 218 and the coupling member 116. Thereby, the stress reduction part 2330 can have the same effect | action and effect as the above-mentioned stress reduction part 330. FIG.

  FIG. 26 is a partial perspective view of the vicinity of the coupled portion 3308 of another embodiment. The configuration of the coupled portion 3308 other than the stress reducing portion 3330 is the same as that of the coupled portion 308 shown in FIG.

  As shown in FIG. 26, the stress reducing portion 3330 of the coupled portion 3308 includes a stress reducing member 3332 and a reinforcing portion 3334. The stress reducing member 3332 has the same configuration as the above-described stress reducing unit 2330. The reinforcing portions 3334 are integrally provided on both sides of the region in contact with the coupling member 116 among both sides of the stress reducing member 3332. The reinforcing portion 3334 is made of a nonmagnetic material and is formed in a plate shape. The reinforcing portion 3334 is provided substantially parallel to the vertical surface. The reinforcing portion 3334 reinforces the plate-like stress reducing member 3332. Thereby, the reinforcement part 3334 can suppress the deformation | transformation of the stress reduction member 3332, especially the deformation | transformation of the stress reduction member 3332 of the area | region which contacts the coupling member 116. FIG. Thereby, the stress reduction part 3330 can have the same effect | action and effect as the above-mentioned stress reduction part 2330.

  FIG. 27 is a partial perspective view of the vicinity of the coupling portion 408 of the upper substrate holder 100 according to another embodiment. FIG. 28 is an exploded perspective view of the coupling portion 408. FIG. 27 is a perspective view of the upper substrate holder 100 as viewed from below. In addition, the to-be-joined part in this embodiment should just have the to-be-joined member 218 supported by the lower elastic member 216, as shown in FIG. As illustrated in FIGS. 27 and 28, the coupling portion 408 includes a coupling member 416 and a stress reduction portion 430.

  The coupling member 416 is an example of a coupling permanent magnet. The coupling member 416 is made of a permanent magnet such as a columnar alnico magnet.

  The stress reduction unit 430 changes the strength of the magnetic force for coupling of the coupling member 416. The stress reduction unit 430 includes a holding member 446, a magnetic force blocking member 448, a rotating unit 452, a magnetic force blocking member 454 that is an example of a permanent magnet unit for reduction, a shaft member 438, a pair of actuators 440 and an actuator 442. And have. The holding member 446 is made of a magnetic material. The holding member 446 is fixed to the upper ear piece member 124. A shaft hole 450 through which the shaft member 438 is inserted is formed in the holding member 446.

  The magnetic shielding member 448 has a ring shape and is made of a nonmagnetic material such as stainless steel SUS304. The magnetic shielding member 448 is embedded in the holding member 446. Thereby, the magnetic force blocking member 448 is surrounded by the magnetic body. The rotating part 452 is made of a magnetic body formed in a hollow shape. A shaft hole 456 through which the shaft member 438 is inserted is formed in the rotating portion 452. The rotating part 452 is connected to the holding member 446 by a shaft member 438. The rotating part 452 rotates around the shaft member 438. Accordingly, the rotating part 452 rotates relatively with respect to the holding member 446.

  The magnetic force blocking member 454 is embedded in the rotation unit 452. The magnetic shielding member 454 has a ring shape that is the same shape as the magnetic shielding member 448. The magnetic shielding member 454 is made of a nonmagnetic material such as stainless steel SUS304. The magnetic shielding member 454 rotates around the shaft member 438 between a coupling position where the center coincides with the magnetic shielding member 448 and a release position where the center deviates from the magnetic shielding member 448 in plan view. That is, at the coupling position, the magnetic force blocking member 448 and the magnetic force blocking member 454 are at the same position in a plan view, and at the release position, the magnetic force blocking member 448 and the magnetic force blocking member 454 are at different positions. At the coupling position, a magnetic flux is formed on the outer peripheral portions of the magnetic shielding member 454 and the magnetic shielding member 448, and the coupling magnetic force of the coupling member 416 acts. On the other hand, in the release position, the magnetic flux of the coupling member 416 is blocked by the magnetic force blocking member 454 and the magnetic force blocking member 448. Thereby, the magnetic force of the coupling member 416 is reduced, and the coupling between the coupling member 416 and the coupled member 218 is released.

  The pair of actuators 440 and 442 is an example of a moving unit. The pair of actuators 440 and 442 rotate the rotation unit 452 around the shaft member 438. As a result, the pair of actuators 440 and 442 change the relative positions of the magnetic force blocking member 454 and the magnetic force blocking member 448. A solenoid actuator or the like can be applied to the actuators 440 and 442.

  29, 30, 31, 32, and 33 are diagrams for explaining the operation of the coupling unit 408. FIG. 29, 31 and 33 are partial cross-sectional views of the coupling portion 408 as viewed from the side. 30 and 32 are plan views of the coupling portion 408. FIG. 30 and 32, the magnetic force blocking member 454 is shown to be thicker than the magnetic force blocking member 448 for the sake of explanation.

  First, as shown in FIG. 29, the upper substrate holder 100 and the lower substrate holder 200 are arranged vertically so that the pair of substrates 90 are arranged facing each other. Next, as shown in FIGS. 30 and 31, the pair of substrates 90 are brought into contact with each other. In this state, the center of the magnetic force blocking member 448 is shifted from the center of the magnetic force blocking member 454. Accordingly, the magnetic flux blocking member 448 and the magnetic flux blocking member 454 block the magnetic flux of the coupling member 416 so that the magnetic flux hardly leaks to the outside.

  Next, in this state, the pair of substrates 90 are aligned with each other. Here, since the magnetic flux of the coupling member 416 is hardly generated, the magnetic force hardly acts between the coupling member 416 and the coupled member 218. Therefore, when the upper substrate holder 100 and the lower substrate holder 200 are aligned, even if the upper substrate holder 100 and the lower substrate holder 200 move along the horizontal direction, the frictional force hardly acts between the coupling member 416 and the coupled member 218. Therefore, the lower elastic member 216 connected to the coupled member 218 is not distorted.

  Next, as shown in FIGS. 32 and 33, the actuator 440 is driven to rotate the rotating portion 452 around the shaft member 438 together with the magnetic force blocking member 454. Thereby, the center of the magnetic force blocking member 454 and the center of the magnetic force blocking member 448 coincide with each other, and the magnetic flux of the coupling member 416 is formed outside the magnetic force blocking member 454 and the magnetic force blocking member 448. Therefore, an attractive force acts between the coupling member 416 and the coupled member 218. As a result, the coupling member 416 attracts the coupled member 218, and the pair of substrates 90 is sandwiched between the upper substrate holder 100 and the lower substrate holder 200.

  As described above, in this embodiment, the magnetic flux of the coupling member 416 is blocked by the magnetic force blocking members 448 and 454. Thereby, the stress reduction part 430 can reduce the stress resulting from the distortion produced in the lower elastic member 216. As a result, the stress reduction unit 430 can suppress the positional deviation between the pair of aligned substrates 90. Although the example in which the magnetic force blocking member 454 rotates is shown, the magnetic force blocking member 454 may be moved linearly.

  FIG. 34 is a schematic view of a coupling portion 2408 according to another embodiment. As shown in FIG. 34, the coupling portion 2408 has a coupling member 2416 and a stress reduction portion 2430.

  The coupling member 2416 is made of a permanent magnet such as a columnar alnico magnet. The coupling member 2416 adsorbs the coupled member 218.

  The stress reduction unit 2430 includes a fixing unit 2460, a housing 2462, a fixing permanent magnet 2472, a driving electromagnet 2474, a pair of magnetic force blocking members 2464 and a magnetic force blocking member 2466.

  The fixing portion 2460 is fixed to the upper connecting member 114. The fixing portion 2460 is made of a magnetic material such as carbon steel S25C.

  The housing 2462 is made of a magnetic material such as carbon steel S25C. The housing 2462 is formed in a hollow shape. The housing 2462 accommodates the coupling member 2416 and the fixing permanent magnet 2472. The housing 2462 is detachably installed on the fixing portion 2460.

  The fixing permanent magnet 2472 fixes the coupling member 2416 to the fixing portion 2460 by magnetic force. The driving electromagnet 2474 is provided on the fixed stage 36. The driving electromagnet 2474 causes a magnetic force stronger than the magnetic force of the fixing permanent magnet 2472 to act on the coupling member 2416. Accordingly, the driving electromagnet 2474 causes the coupling member 2416 to be detached from the fixing portion 2460 together with the fixing permanent magnet 2472.

  The magnetic force shielding members 2464 and 2466 are formed in a ring shape having substantially the same diameter as the coupling member 2416. The magnetic shielding members 2464 and 2466 are made of a nonmagnetic material such as stainless steel SUS304. The magnetic shielding member 2464 is embedded in the fixed portion 2460. The magnetic shielding member 2466 is embedded in the bottom surface of the housing 2462. Therefore, the magnetic force shielding member 2466 moves in the vertical direction together with the housing 2462. In plan view, the magnetic force blocking member 2466 is disposed at the same position as the magnetic force blocking member 2464. Thus, the magnetic flux of the coupling member 2416 is formed outside the magnetic force blocking members 2464 and 2466, and the magnetic force of the coupling member 2416 acts on the coupled member 218 as an adsorption force.

  Next, the operation of the combining unit 2408 will be described. 35 to 37 are diagrams for explaining the operation of the coupling unit 2408. FIG. First, as shown in FIG. 34, the upper substrate holder 100 is transported to and held by the fixed stage 36 together with the substrate 90. In this state, the housing 2462 is held by the fixing portion 2460 together with the coupling member 2416 and the fixing permanent magnet 2472.

  Next, as shown in FIG. 35, the driving electromagnet 2474 is driven. As a result, a magnetic force for attracting the coupling member 2416 to the driving electromagnet 2474 is generated, so that the coupling member 2416 is detached from the fixing portion 2460 together with the fixing permanent magnet 2472. In this state, the lower substrate holder 200 is transferred to the moving stage 38 and held together with the substrate 90.

  Next, as shown in FIG. 36, the moving stage 38 moves upward to bring the pair of substrates 90 into contact with each other. In this state, the moving stage 38 is moved in the horizontal plane to align the pair of substrates 90 with each other. Here, even if the moving stage 38 moves, the coupling member 2416 is detached upward, so that no attracting force acts between the coupling member 2416 and the coupled member 218. Accordingly, the lower elastic member 216 that supports the coupled member 218 is not distorted. In other words, the stress reduction unit 2430 reduces the stress that acts on the coupled member 218 from the lower elastic member 216 due to distortion.

  Next, as shown in FIG. 37, when the alignment between the pair of substrates 90 is completed, the driving electromagnet 2474 is stopped. As a result, the coupling member 2416 is attracted to the fixing portion 2460, and thus is detached from the driving electromagnet 2474. The coupling member 2416 is coupled to the fixing portion 2460, and the coupling member 2416 and the member to be coupled 218 are adsorbed by the magnetic force through the fixing portion 2460. As a result, the pair of substrates 90 is sandwiched between the upper substrate holder 100 and the lower substrate holder 200.

  FIG. 38 is a schematic diagram illustrating another stress reduction unit 530. As illustrated in FIG. 38, the stress reduction unit 530 includes a coil unit 580 that is an example of a magnetic force control electromagnet, a stress control unit 582, a cooling unit 584, and a load cell 586.

  The coil portion 580 is wound around the outer peripheral portion of the coupled member 218. When power is supplied, the coil unit 580 generates a magnetic force that reduces the magnetic force for coupling generated from the coupling member 116. Thereby, the coil part 580 reduces the attractive force between the coupling member 116 and the coupled member 218. In addition, the coil unit 580 generates a magnetic force that increases the magnetic force for coupling. Thereby, the coil part 580 increases the attractive force between the coupling member 116 and the coupled member 218.

  The load cell 586 supports the coupled member 218. When the coupled member 218 is placed on the load cell 586, the load cell 586 detects a load applied by the coupled member 218. In this state, when the coupling member 116 approaches the coupled member 218, the coupled member 218 is attracted to the coupling member 116, so that the load acting on the load cell 586 is reduced. As a result, the load cell 586 detects the magnetic force of the coupling member 116. The cooling unit 584 cools the coil unit 580 to which power for generating magnetic force is supplied.

  The stress control unit 582 is configured to be connected to and disconnected from the coil unit 580. The stress control unit 582 is connected to the cooling unit 584 and the load cell 586. Thus, the stress control unit 582 controls the coil unit 580, the cooling unit 584, and the load cell 586. For example, the stress control unit 582 controls the magnetic force of the coil unit 580.

  In the stress reduction unit 530, the stress control unit 582 supplies power to the coil unit 580 and drives the cooling unit 584 to cool the coil unit 580 until alignment between the substrates 90 is completed. Thereby, the magnetic force between the coupling member 116 and the member to be coupled 218 is canceled by the magnetic force generated from the coil portion 580. As a result, since no attracting force is generated between the coupling member 116 and the coupled member 218, the coupling member 116 does not attract the coupled member 218. Therefore, since the coupled member 218 can freely move with respect to the coupling member 116, even if the lower substrate holder 200 is moved during alignment, the lower elastic member 216 is not distorted. Thereafter, when the alignment between the substrates 90 is completed, the stress control unit 582 gradually weakens the power of the coil unit 580. Thereby, the magnetic force of the coupling member 116 canceled by the magnetic force of the coil portion 580 gradually decreases, and the attractive force of the coupling member 116 coupled to the coupled member 218 gradually increases. As a result, the coupling member 116 is coupled to the coupled member 218. Here, since the attracting force gradually increases, even if the coupling member 116 and the coupled member 218 are separated from each other, the lower elastic member 216 is hardly distorted by the coupling. Therefore, the stress of the lower elastic member 216 due to strain can be reduced. In other words, the stress reduction unit 530 reduces the stress of the lower elastic member 216 by controlling the coil unit 580.

  FIG. 39 is a diagram illustrating another lower elastic member 616 and a member 618 to be coupled. FIG. 40 is a plan view of the lower elastic member 616. FIG. 41 is an exploded view of the coupled member 618.

  As shown in FIGS. 39 and 40, the lower elastic member 616 has a sliding groove 617 extending in the longitudinal direction.

  As shown in FIGS. 39 and 41, the member to be coupled 618 includes an upper coupled part 620, a lower coupled part 622, and a connecting shaft 624.

  The upper part of the upper coupled portion 620 is formed in a disc shape. A cylindrical upper cylindrical portion 626 is formed in addition to the upper portion of the upper coupled portion 620. The outer diameter of the upper cylindrical portion 626 is larger than the width of the sliding groove 617. A fitting portion 628 is formed in the lower portion of the upper coupled portion 620. The fitting portion 628 is fitted into the lower joint portion 622. Further, the fitting portion 628 is inserted through the sliding groove 617. The diameter of the fitting portion 628 is substantially the same as the width of the sliding groove 617. An upper connection groove 630 is formed on a side surface of the upper coupled portion 620.

  The lower part of the lower joint part 622 is formed in a disk shape. A cylindrical lower cylindrical portion 632 is formed in addition to the lower portion of the lower portion to be coupled 622. The outer diameter of the lower cylindrical portion 632 is the same as the outer diameter of the upper cylindrical portion 626 and is larger than the width of the sliding groove 617. A lower coupling groove 634 that is continuous with the upper coupling groove 630 is formed in the lower coupling portion 622.

  The connection shaft 624 is inserted through the upper connection groove 630 and the lower connection groove 634. Thus, the connecting shaft 624 connects the upper coupled site 620 and the lower coupled site 622 so as to be movable relative to each other in a vertical direction while suppressing the upper coupled site 620 and the lower coupled site 622 from separating. To do.

  FIG. 42 is a side view of the member 618 to be coupled in the uncoupled state. FIG. 43 is a side view of the coupled member 618 in the coupled state.

  As shown in FIG. 42, in the unbound state, the lower bound site 622 is disposed at the lower limit position with respect to the upper bound site 620 by its own weight. Thereafter, when the coupling member 116 approaches the coupled member 618, the coupled member 618 is attracted to the coupling member 116 by magnetic force while sliding on the sliding groove 617 of the lower elastic member 616. That is, until the coupled member 618 is attracted to the coupling member 116, the coupled member 618 and the lower elastic member 616 can move relative to each other. When the coupled member 618 contacts the coupling member 116, the upper coupled site 620 stops, but the lower coupled site 622 is further adsorbed by the coupling member 116. Accordingly, as shown in FIG. 43, the fitting portion 628 is further fitted into the lower coupled portion 622, so that the lower elastic member 616 is sandwiched between the lower surface of the upper cylindrical portion 626 and the upper surface of the lower cylindrical portion 632. The As a result, the coupled member 618 is fixed to the lower elastic member 616. That is, after the coupled member 618 is attracted to and coupled to the coupling member 116, the relative movement between the coupled member 618 and the lower elastic member 616 becomes impossible. Here, since the coupled member 618 is coupled while sliding on the lower elastic member 616, the lower elastic member 616 is not distorted. Thereby, the stress of the lower elastic member 616 can be reduced. In this embodiment, it can be said that the lower elastic member 616 and the coupled member 618 also serve as a stress reduction unit.

  The shape, arrangement, number, material, numerical value and the like of the configuration of each embodiment described above may be changed as appropriate. Moreover, you may combine each embodiment suitably. For example, the number of lower elastic members may be changed as appropriate.

  The stress reduction unit in FIGS. 18 to 26 may be provided in the upper substrate holder 100. Although the flat substrate holder is taken as an example, one or both of the embodiments may be applied to a ring-shaped substrate holder. Further, the coupling member and the member to be coupled may be coupled by vacuum adsorption, intermolecular force, an adhesive, or the like, or may be coupled by a combination thereof.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

  DESCRIPTION OF SYMBOLS 10 Board | substrate bonding apparatus, 12 Environmental chamber, 14 Atmospheric environment part, 16 Vacuum environment part, 18 Control part, 20 Substrate cassette, 22 Substrate holder rack, 24 Robot arm, 26 Pre-aligner, 28 aligner, 30 Robot arm, 34 Frame , 36 fixed stage, 38 moving stage, 40 shutter, 42 shutter, 48 load lock chamber, 50 access door, 52 gate valve, 53 robot chamber, 54 robot arm, 55 receiving chamber, 56 heating and pressurizing device, 57 gate valve, 58 robot arm, 60 cooling chamber, 90 substrate, 92 superimposed substrate, 94 substrate holder, 95 bonded substrate, 96 laminated semiconductor device, 100 Upper substrate holder, 102 Upper placement part, 104 Upper ear part, 106 Upper electrostatic pad, 107 Upper electrostatic pad, 108 Coupling part, 112 Upper coupling tool, 114 Upper coupling member, 116 Coupling member, 120 Upper power supply terminal, 122 Upper feeding terminal, 124 Upper ear piece member, 126 Notch, 200 Lower substrate holder, 202 Lower mounting portion, 204 Lower ear portion, 206 Lower electrostatic pad, 207 Lower electrostatic pad, 208 Coupled portion, 210 Notch, 214 lower connecting member, 216 lower elastic member, 218 coupled member, 220 lower ear piece member, 222 lower feeding terminal, 224 lower feeding terminal, 228 lower coupling tool, 230 stress reducing portion, 308 coupled portion, 330 stress reducing portion , 408 joint, 416 joint Material, 430 Stress reducing part, 438 Shaft member, 440 Actuator, 442 Actuator, 446 Holding member, 448 Magnetic shielding member, 450 Shaft hole, 452 Rotating part, 454 Magnetic shielding member, 456 Shaft hole, 530 Stress reducing part, 580 Coil part, 582 Stress control part, 584 Cooling part, 586 Load cell, 616 Lower elastic member, 617 Sliding groove, 618 Member to be joined, 620 Upper part to be joined, 622 Lower part to be joined, 624 Connecting shaft, 626 Upper cylindrical part , 628 fitting part, 630 upper connecting groove, 632 lower cylindrical part, 634 lower connecting groove, 1208 coupled part, 1230 stress reducing part, 1308 coupled part, 1330 stress reducing part, 1332 stress reducing member, 1 334 Reinforcement part, 2308 To-be-joined part, 2330 Stress reduction part, 2336 Deformation groove, 2408 Coupling part, 2416 Coupling member, 2430 Stress reduction part, 2460 Fixing part, 2462 Housing, 2464 Magnetic shielding member, 2466 Magnetic shielding member Permanent magnet for fixing, 2474 electromagnet for driving, 3308 coupled portion, 3330 stress reducing portion, 3332 stress reducing member, 3334 reinforcing portion

Claims (14)

A holder body for placing a substrate;
A coupling member coupled to the holder body via an elastic member and coupled to another substrate holder that holds the substrate between the holder body ;
A stress reduction unit that reduces stress generated in the elastic member when the coupling member is coupled in the coupled state of the coupling member;
A substrate holder comprising:   The substrate holder according to claim 1, wherein the stress reduction unit reduces the stress by moving the elastic member relative to the other substrate holder. The stress reduction portion, prior SL is connected at one end to the holder body has a plate-shaped stress reducing member covering the coupling surface of part of the coupling member,
The coupling member is coupled to the other substrate holder by sandwiching the stress reducing member between the coupling surface and the other substrate holder,
The substrate holder according to claim 2, wherein a frictional force between the stress reducing member and the coupling surface is smaller than a frictional force between the stress reducing member and the coupling member of the other substrate holder. Before SL stress reduction portion includes a plurality of said stress reducing member,
The substrate holder according to claim 3, wherein the plurality of stress reducing members are arranged so as to be point symmetric around the center of the holder body in a plan view. 5. The substrate holder according to claim 3 , wherein the stress reduction portion includes a plate-like reinforcing portion that is provided on a side of the stress reduction member and intersects the stress reduction member. Each of the plurality of the stress reducing member, the substrate holder according to any one of claims 3 to 5 which is cantilevered. The substrate holder according to claim 1 , wherein the coupling member includes a coupling magnet that generates a magnetic force. The substrate holder according to claim 7 , wherein the stress reduction unit changes the strength of the magnetic force acting on the coupling member of the other substrate holder. The stress reduction unit includes: a first magnetic force blocking member that blocks the magnetic flux of the coupling magnet that causes the magnetic force to act on the coupling member of the other substrate holder; and coupling positions of the coupling member of another substrate holder, according to claim 8 and a moving unit for moving the first magnetic shielding member between a release position for releasing the coupling by blocking the flux Substrate holder. The stress reduction part which has further the stress control part which controls the magnetic force of the magnetic force control electromagnet which produces the magnetic force which reduces the magnetic force for the said coupling | bonding magnetic force, and the said magnetic force control electromagnet. A substrate holder according to claim 1. The substrate holder according to claim 10 , wherein the magnetic force control electromagnet generates a magnetic force that increases the coupling magnetic force. The substrate holder according to claim 1 , wherein the coupling member is coupled to the coupling member of the other substrate holder by vacuum suction. A substrate bonding apparatus comprising the substrate holder according to claim 1 . A first substrate holder having a holder body for placing a substrate and a first coupling member connected to the holder body via an elastic member;
A second substrate holder having a second coupling member coupled to the first coupling member, and holding the plurality of substrates with the first substrate holder;
A stress reduction unit that reduces stress generated in the elastic member when the first coupling member and the second coupling member are coupled in the coupled state of the first coupling member and the second coupling member;
A pair of substrate holders.

Images