JP2012033811A - Substrate transfer apparatus, substrate laminating device, laminated semiconductor device manufacturing method, and laminated semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate transfer apparatus capable of correcting a displacement of a substrate generated while substrates are transferred.SOLUTION: The substrate transfer apparatus comprises: an outer shape observation part to grasp a substrate position by observing an outer shape of a substrate; an indicator observation part to grasp the substrate position more in details than the outer shape observation part by observing an indicator provided on the substrate; a transportation part to transport the substrate from the outer shape observation part to the indicator observation part; and a position correction part, disposed on the transportation path from the outer shape observation part to the indicator observation part, to correct the substrate displacement during the transportation.

Description

  The present invention relates to a substrate transfer device, a substrate bonding device, a stacked semiconductor device manufacturing method, and a stacked semiconductor device.

Patent Document 1 describes an alignment apparatus that aligns the position of a substrate. Since such an alignment apparatus is highly accurate, if the initial position of the substrate placed on the alignment apparatus deviates so far as to extend beyond the observation range of the microscope in the alignment apparatus, the alignment of the substrate cannot be performed. Therefore, it is necessary to preliminarily align the substrate before installing the substrate in the alignment apparatus.
Patent Document 1 Japanese Patent Laid-Open No. 2009-231671

  However, when the substrate position is preliminarily aligned and then transferred to the alignment apparatus via a plurality of apparatuses, the position of the substrate may be shifted again during the transfer process.

  In order to solve the above-described problem, in the first aspect of the present invention, the outer shape observation unit that grasps the position of the substrate by observing the outer shape of the substrate, and the index provided on the substrate are observed. An index observation unit that grasps the position in more detail than the outline observation unit, a conveyance unit that conveys the substrate from the outline observation unit to the index observation unit, and a conveyance path from the outline observation unit to the index observation unit that is being conveyed There is provided a substrate transport apparatus including a position correction unit that corrects the positional deviation of the substrate.

  In a second aspect of the present invention, there is provided a substrate bonding apparatus that includes the substrate transfer apparatus and bonds a plurality of substrates.

  In a third aspect of the present invention, there is provided a method for manufacturing a laminated semiconductor device, comprising bonding a substrate by the substrate bonding apparatus.

  In a fourth aspect of the present invention, a stacked semiconductor device manufactured by the above-described stacked semiconductor device manufacturing method is provided.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

1 is a plan view schematically showing an overall structure of a substrate bonding apparatus 100. FIG. FIG. 6 is a front view schematically showing the structure of a first delivery port 183. 5 is a plan view schematically showing a structure of a first delivery port 183. FIG. It is a front view which shows the structure of this aligner 140 roughly. In the present aligner 140, a process of observing a substrate index is schematically shown. A process of aligning the position of the substrate in the aligner 140 will be schematically shown. In the present aligner 140, a process of superimposing substrates is schematically shown. A manufacturing method of a laminated semiconductor device is shown roughly.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a plan view schematically showing the overall structure of a substrate bonding apparatus 100 according to the present embodiment. The substrate bonding apparatus 100 is an apparatus for bonding two substrates on which circuit patterns are formed by superimposing them so that the electrodes to be bonded are in contact with each other and heating and pressing them. The substrate bonding apparatus 100 includes an atmospheric environment unit 102 and a vacuum environment unit 202 that are formed inside a common housing 101.

  The atmospheric environment unit 102 functions as an alignment device that aligns the two substrates on which the circuit pattern is formed so that the electrodes to be joined are in contact with each other. Facing the outside of the housing 101, a control unit 110 and an EFEM (Equipment Front End Module) 112 are provided. As for each element of each device included in the substrate bonding apparatus 100, the control unit 110 that controls and calculates the entire substrate bonding apparatus 100, or a control calculation unit provided for each element performs integrated control and cooperative control. It works by The control unit 110 includes a storage unit 111 that stores information for controlling the substrate bonding apparatus 100 and an operation unit that is operated by a user from the outside when the substrate bonding apparatus 100 is turned on and various settings are made. Furthermore, the control unit 110 may include a connection unit that connects to other deployed devices.

  The EFEM 112 includes three load ports 113, 114, 115 and a robot arm 116. Each load port is equipped with a FOUP (Front Opening Unified Pod). The FOUP is a sealed substrate storing pod and can accommodate a plurality of substrates 120.

  A plurality of substrates 120 are accommodated in the FOUP attached to the load ports 113 and 114, and are carried into the atmospheric environment unit 102 by the robot arm 116. With this configuration, the substrate 120 can be transported from the FOUP to the atmospheric environment unit 102 without being exposed to the outside air, and dust can be prevented from adhering to the substrate 120. The substrate 120 bonded by the atmospheric environment unit 102 and the vacuum environment unit 202 is stored in a FOUP attached to the load port 115.

  Here, the substrate 120 is a single silicon wafer, a compound semiconductor wafer, or the like on which a plurality of circuit patterns are already formed periodically. In addition, the loaded substrate 120 may be a laminated substrate that is already formed by laminating a plurality of wafers.

  The atmospheric environment unit 102 includes a spare aligner 130, a main aligner 140, a holder rack 150, a reversing mechanism 160, a separation mechanism 170, and a transport unit 180, which are disposed inside the casing 101. The temperature of the atmosphere environment unit 102 is controlled so that the temperature is substantially the same as the room temperature of the environment where the substrate bonding apparatus 100 is installed. Thereby, since the accuracy of the aligner 140 is stabilized, positioning can be accurately performed.

  Since the preliminary aligner 130 is highly accurate, the positions of the individual substrates 120 are temporarily aligned so that the positions of the substrates 120 are within the narrow adjustment range of the aligner 140. The spare aligner 130 includes a substrate position adjustment unit 131, a holder position adjustment unit 132, a detector 133, and a detector 134. The spare aligner 130 is an example of an outer shape observation unit.

  The substrate 120 is placed on the substrate position adjustment unit 131 by the robot arm 116 of the EFEM 112. The detector 133 overlooks the substrate 120 placed on the substrate position adjustment unit 131 and detects the position of the substrate 120 by observing the external contour, notches, and the like of the substrate 120. The substrate position adjustment unit 131 adjusts the position and orientation of the substrate 120 based on the position of the substrate 120 detected by the detector 133 so that the substrate 120 falls within a predetermined range. The detector 133 is fixed to a place that is not easily affected by vibration, such as the ceiling frame of the spare aligner 130, for example.

  A substrate holder 122 transported from the holder rack 150 is placed on the holder position adjustment unit 132. The detector 134 looks down on the substrate holder 122 placed on the holder position adjustment unit 132 and detects its position by the outline of the substrate holder 122 and the cutouts provided on the outer periphery. The detector 134 is fixed to a place that is not easily affected by vibration, such as the ceiling frame of the spare aligner 130. The holder position adjustment unit 132 adjusts the position and orientation of the substrate holder 122 so that the substrate holder 122 falls within a predetermined range based on the position of the substrate holder 122 detected by the detector 134. The substrate holder 122 is divided into two types, an upper substrate holder 124 and a lower substrate holder 125.

  The position-adjusted substrate 120 is transferred from the substrate position adjustment unit 131 to the holder position adjustment unit 132 by the robot arm 116 and placed on the position-adjusted substrate holder 122. The holder position adjustment unit 132 is provided with a power supply pin, and is connected to a power receiving terminal provided on the back surface of the substrate holder 122 to supply power to the substrate holder 122. The substrate holder 122 supplied with power from the power receiving terminal causes a potential difference on the surface holding the substrate by an electrostatic chuck provided therein, and electrostatically attracts the substrate 120. The substrate 120 and the substrate holder 122 thus integrated may be referred to as “workpieces”. In addition, the workpiece composed of the upper substrate holder 124 and the substrate 120 may be referred to as “upper workpiece”, and the workpiece composed of the lower substrate holder 125 and the substrate 120 may be referred to as “lower workpiece”. The substrate 120 placed on the upper substrate holder 124 and the substrate 120 placed on the lower substrate holder 125 may be substrates that have undergone the same processing process, substrates that have undergone different processing processes, The substrates may be of different materials, shapes, and number of layers.

  The aligner 140 observes a plurality of indices provided on the two substrates 120 held and transported by the upper substrate holder 124 and the lower substrate holder 125, respectively, so that the positions of the two substrates 120 are changed to the spare aligner 130. By grasping in more detail, the two substrates 120 face each other, align, and overlap. For the alignment, an enhanced global alignment (EGA) method in which the observation result is statistically processed to calculate the coordinates of each substrate 120 may be used. The aligner 140 is an example of an index observation unit. The aligner 140 includes an upper stage 141, a lower stage 142, and a control unit 144. A specific description of the aligner 140 will be described later with reference to other drawings.

  The two substrates 120 overlapped by the aligner 140 are sandwiched between the upper substrate holder 124 and the lower substrate holder 125, and the magnet provided on the upper substrate holder 124 and the magnetic material provided on the lower substrate holder 125 are used. Temporarily fixed by the including positioning mechanism. Thus, the combination of the upper substrate holder 124, the lower substrate holder 125, and the two substrates sandwiched between them may be referred to as a “work pair”. The work pair is transferred to the vacuum environment unit 202 by the transfer unit 180 and heated and pressurized by the heating and pressing device 240 to join the two substrates 120.

  The holder rack 150 includes a plurality of shelves that store the substrate holders 122. Each shelf is provided with at least three support convex portions for placing the substrate holder 122 thereon. Since each support convex part is provided in the position corresponding to the outer peripheral area | region of the substrate holding surface of the substrate holder 122, the substrate holder 122 can be accommodated upward or downward. Here, the upper substrate holder 124 is stored with the holding surface holding the substrate 120 facing downward, and the lower substrate holder 125 is stored with the holding surface facing upward.

  The reversing mechanism 160 has a function of reversing the work or the substrate holder 122 conveyed by the conveying unit 180.

  The separation mechanism 170 separates the workpiece pair after being heated and pressurized by a heating and pressing apparatus 240 described later into an upper substrate holder 124, a lower substrate holder 125, and two bonded substrates 120. The two bonded substrates may be referred to as “laminated substrates”. The separated upper substrate holder 124 is collected in the holder rack 150 and stands by. The separated laminated substrate is transferred to the preliminary aligner 130 by the transfer unit 180 together with the lower substrate holder 125, and is collected to the load port 115 by the robot arm 116.

  The transfer unit 180 includes a first transfer unit 181, a second transfer unit 182, a first transfer port 183, a second transfer port 184, and a robot arm 186. The first transport unit 181 transports the substrate 120, the substrate holder 122, the workpiece and the workpiece pair among the spare aligner 130, the reversing mechanism 160, the first delivery port 183 and the second delivery port 184. The first transport unit 181 is an example of an upstream transport arm.

  The first delivery port 183 is arranged on the transport path from the spare aligner 130 to the main aligner 140. The first delivery port 183 plays a role of mediating delivery of the substrate holder 122, the workpiece, and the workpiece pair between the first conveyance unit 181 and the second conveyance unit 182. The second delivery port 184 is provided on the upper part of the separation mechanism 170 and includes a push pin for placing the substrate holder 122 and the work pair.

  The second transport unit 182 transports workpieces and workpiece pairs between the first delivery port 183 and the lower stage 142 of the main aligner 140. The second transport unit 182 is an example of a downstream transport arm. As shown in FIG. 1, the transport path of the substrate and the like by the first transport unit 181 is different from the transport path of the substrate and the like by the second transport unit 182. That is, the first transport unit 181 transports a substrate or the like in the Y-axis direction, while the second transport unit 182 transports the substrate or the like in the X-axis direction.

  The robot arm 186 conveys a work pair between the second delivery port 184, the separation mechanism 170, and a load lock chamber 220 described later. The robot arm 186 transports the substrate holder 122 between the holder rack 150, the second delivery port 184, and the separation mechanism 170.

  The vacuum environment unit 202 includes a heat insulating wall 210, a load lock chamber 220, a robot arm 230, and a plurality of heating and pressurizing devices 240. The heat insulating wall 210 surrounds the vacuum environment unit 202 to maintain the internal temperature of the vacuum environment unit 202 and blocks heat radiation to the outside of the vacuum environment unit 202. Thereby, the influence which the heat of the vacuum environment part 202 has on the atmospheric environment part 102 can be suppressed.

  The robot arm 230 is a transfer device that transfers a workpiece pair. Then, the held work pair is transported between the load lock chamber 220 and the heating and pressurizing device 240.

  The load lock chamber 220 includes shutters 222 and 224 that open and close alternately on the atmosphere environment unit 102 side and the vacuum environment unit 202 side. When the workpiece pair is carried into the vacuum environment unit 202 from the atmospheric environment unit 102, first, the shutter 222 on the atmospheric environment unit 102 side is opened, and the robot arm 186 carries the workpiece pair into the load lock chamber 220. Next, the shutter 222 on the atmosphere environment unit 102 side is closed, and the air in the load lock chamber 220 is exhausted to make a vacuum state.

  After the inside of the load lock chamber 220 is in a vacuum state, the shutter 224 on the vacuum environment unit 202 side is opened, and the robot arm 230 carries out the workpiece pair. By such a loading operation to the vacuum environment unit 202, the workpiece pair can be loaded into the vacuum environment unit 202 without leaking the internal atmosphere of the air environment unit 102 to the vacuum environment unit 202 side.

  Next, the robot arm 230 carries the unloaded workpiece pair into one of the plurality of heating and pressing devices 240. The heating / pressurizing device 240 heats and presses the workpiece pair. Thereby, the board | substrate 120 carried in in the state pinched | interposed into the board | substrate holder 122 is joined.

  The heating / pressurizing device 240 includes a main body for heating the work pair and a heating / pressurizing chamber in which the main body is disposed. The robot arm 230 is installed in the robot arm chamber. That is, the plurality of heating and pressurizing chambers, robot arm chambers, and load lock chambers 220 constituting the vacuum environment unit 202 are individually partitioned and the atmosphere can be adjusted separately. As shown in the drawing, the vacuum environment unit 202 includes a plurality of heating and pressurizing chambers and a load lock chamber 220 arranged in the circumferential direction with the robot arm chamber as the center.

  When the workpiece pair is carried out from the vacuum environment unit 202 to the atmospheric environment unit 102, the shutter 224 on the vacuum environment unit 202 side is first opened, and the robot arm 230 carries the workpiece pair into the load lock chamber 220. Next, the shutter 224 on the vacuum environment section 202 side is closed, the load lock chamber 220 is leaked, and the shutter 222 on the atmosphere environment section 102 side is opened.

  In addition, you may provide the cooling part which cools a workpiece | work pair after heat-pressing in the heat-pressing apparatus 240. FIG. Thereby, the radiant heat from the workpiece | work pair returned to the atmospheric environment part 102 after a heating can be suppressed, and the temperature management of the atmospheric environment part 102 can be made easy. In addition, one of the plurality of heating and pressing devices 240 can be replaced with a cooling device. At this time, the cooling chamber in which the cooling device is installed is also arranged around the robot arm chamber. The cooling device is loaded with a pair of workpieces heated by the heating / pressurizing device 240 and cools them down to a certain temperature.

  FIG. 2 is a front view schematically showing the structure of the first delivery port 183. FIG. 3 is a plan view schematically showing the structure of the first delivery port 183. The first delivery port 183 includes a temporary table 185, an upper observer 187, and a lower observer 189. The first delivery port 183 is an example of a position correction unit.

  The temporary placement table 185 has push pins 188 that can be expanded and contracted vertically, and temporarily places a work. The temporary table 185 can rotate in a plane perpendicular to the Z axis. The temporary table 185 may further include a mechanism that translates in the XY direction.

  The upper observer 187 is placed on the upper surface of the substrate holder 122 held by the push pin 188, which is above the position where the push pin 188 delivers the workpiece between the first transfer unit 181 and the second transfer unit 182. The substrate 120 is placed at a position where it can be observed. The upper observer 187 detects the position of the substrate 120 by observing the outer contour of the substrate 120 and the outer shape of the notch 121 and the like. The upper observer 187 is fixed to a place that is not easily affected by vibration, such as the frame of the first delivery port 183, for example.

  The lower observer 189 is positioned below the position where the push pin 188 delivers the workpiece between the first transfer unit 181 or the second transfer unit 182 and is placed on the lower surface of the substrate holder 122 held by the push pin 188. The substrate 120 is placed at a position where it can be observed. The lower observer 189 detects the position of the substrate 120 by observing the outer contour of the substrate 120 and the outer shape such as a notch. The lower observer 189 is fixed to a place that is not easily affected by vibration, such as the frame of the first delivery port 183, for example.

  2 and 3 show a state in which the first transport unit 181 transports the upper substrate holder 124 holding the substrate 120 from the reversing mechanism 160 to the first delivery port 183 and delivers it to the first delivery port 183. In the reversing mechanism 160, the upper substrate holder 124 holding the substrate 120, that is, the upper work is reversed, so that the upper substrate holder 124 holds the substrate 120 downward. The first transport unit 181 moves the upper work to the upper part of the temporary placing table 185, the push pin 188 is raised, and the upper work is lifted from the first transport unit 181 and received. As shown in FIG. 3, the three push pins 188 are arranged on the temporary placement table 185 so as to receive the upper work while supporting the position that does not touch the substrate 120 near the outer periphery of the upper substrate holder 124. . The first transport unit 181 retreats in the Y direction after delivering the upper work to the first delivery port 183.

  The lower observer 189 detects the position of the substrate 120 held by the upper substrate holder 124. The temporary placement table 185 adjusts the position and orientation of the substrate 120 by rotation or parallel movement so that the substrate 120 falls within a predetermined range based on the position of the substrate 120 detected by the lower observer 189. Thereby, even if a positional deviation occurs while the substrate 120 aligned in the preliminary aligner 130 is transported to the first delivery port 183, the first delivery port 183 corrects the positional deviation of the substrate 120. Can do.

  Next, the second transport unit 182 advances in the −X direction, that is, the left direction in FIGS. 2 and 3 to a position for receiving the upper work. The push pin 188 descends, transfers the upper work to the second transport unit 182, and retreats inside the temporary placement table 185. The second transport unit 182 transports the received upper work to the main aligner 140 and places it on the lower stage 142.

  The first transport unit 181 and the second transport unit 182 have a power supply terminal 281 and a power supply terminal 282 that supply electrostatic adsorption power to the substrate holder 122, respectively. When the first transport unit 181 or 182 holds a workpiece, the power supply terminal 281 or the power supply terminal 282 is in contact with the power reception terminal provided in the substrate holder 122 and is provided inside the substrate holder 122. Can be powered. Therefore, the substrate holder 122 can stably hold the substrate 120 by electrostatic attraction while the first transfer unit 181 or the second transfer unit 182 transfers the workpiece.

  The first delivery port 183 also has a mechanism for supplying electrostatic adsorption power to the substrate holder 122. The push pin 188 in the first delivery port 183 is provided with a power supply wiring therein, and a power supply terminal is provided at the tip thereof. When the push pin 188 holds a workpiece, the power supply terminal at the tip of the push pin 188 may contact the power receiving terminal of the substrate holder 122 to supply power to the electrostatic electrode provided inside the substrate holder 122. . With such a mechanism, the substrate holder 122 can stably hold the substrate 120 by electrostatic adsorption even while the workpiece is held by the push pin 188. However, the time for the first delivery port 183 to hold the workpiece is short, and even if the substrate holder 122 moves away from the first transport unit 181 or the second transport unit 182 within that time, the substrate 120 is sufficiently stabilized by residual static electricity. If it can be held, the first delivery port 183 may not be provided with a power feeding mechanism.

  4 to 7 schematically illustrate the structure of the aligner 140, and schematically illustrate the stages in which the aligner 140 aligns and superimposes the two substrates 120. FIG. The aligner 140 includes an upper stage 141, a lower stage 142, and an elevating unit 360 disposed inside the frame 310.

  The frame 310 includes a top plate 312 and a bottom plate 316 that are parallel to each other and a plurality of support columns 314 that couple the top plate 312 and the bottom plate 316. The top plate 312, the support column 314, and the bottom plate 316 are each formed of a highly rigid material and do not deform even when a reaction force relating to the operation of the internal mechanism is applied.

  The upper stage 141 is fixed to the lower surface of the top plate 312. As shown in FIG. 6, the upper stage 141 sucks the upper substrate holder 124 that holds the substrate 120 on the lower surface. The adsorption method may be vacuum adsorption or electrostatic adsorption. The substrate 120 is held on the lower surface of the upper substrate holder 124 by electrostatic adsorption.

  The lower stage 142 includes an X stage 354, a Y stage 356, an elevating unit 360, and a lower suction plate 372. The X stage 354 is placed on the bottom plate 316 and moved in the X direction while being guided by a guide rail 352 fixed to the bottom plate under the control of the control unit 144 (see FIG. 1). The Y stage 356 moves in the Y direction on the X stage 354 under the control of the control unit 144.

  The elevating unit 360 is mounted on the Y stage 356 and has a cylinder 362 and a piston 364. The piston 364 moves up and down in the Z direction in the cylinder 362 under the control of the control unit 144. A lower suction plate 372 is provided on the piston 364. As shown in FIG. 6, the lower substrate holder 125 is held on the lower suction plate 372. Further, the substrate 120 is held on the lower substrate holder 125. Therefore, the substrate 120 held on the lower suction plate 372 via the lower substrate holder 125 can move in the X, Y, and Z directions under the control of the control unit 144.

  The lower suction plate 372 has a function of rotating around the X, Y, and Z axes, respectively, under the control of the control unit 144. Therefore, the orientation of the substrate 120 held on the lower suction plate 372 via the lower substrate holder 125 can be changed on the XY plane under the control of the control unit 144, and the inclination angle can be changed. The lower stage 142 is an example of a position adjustment unit.

  The lower stage 142 further includes a push pin 320. When the upper substrate holder 124 holding the substrate 120 is fixed to the upper stage 141, the second transfer unit 182 transfers the upper substrate holder 124 holding the substrate 120 from the first delivery port 183, and from the lower suction plate 372, It is put on the push pin 320 which is raised to the height. FIG. 4 shows a state after the upper substrate holder 124 holding the substrate 120 is transferred to the push pin 320.

  Thereafter, the lower stage 142 moves below the upper stage 141. The push pin 320 is further raised to bring the upper substrate holder 124 closer to the upper stage 141. The upper stage 141 receives and holds the upper substrate holder 124 by vacuum suction or the like. For convenience of explanation, two push pins 320 are shown in FIG. 4, but three or more push pins 320 may be arranged in the surface of the lower suction plate 372.

  FIG. 5 further shows a state in which the lower substrate holder 125 holding the substrate 120 is transported from the second transport unit 182 and placed on the lower suction plate 372. Each of the substrates 120 has a plurality of indices M serving as alignment references on the surface thereof. However, the index M is not necessarily a graphic or the like provided for that purpose, but may be a wiring, a bump, a scribe line, or the like formed on each substrate 120.

  The aligner 140 includes a pair of microscopes 342 and 344. One microscope 342 is fixed to the lower surface of the top plate 312 with a predetermined distance from the upper stage 141. The other microscope 344 is mounted on the lower stage 142 together with the lifting unit 360. Thereby, the microscope 344 moves on the XY plane together with the elevating unit 360. As shown in FIG. 5, the aligner 140 uses the microscopes 342 and 344 to observe the index M provided on the opposing substrates 120, thereby positioning the two substrates 120 in more detail than the spare aligner 130. Detect and grasp. The detected position data is transmitted to and stored in the control unit 144 (see FIG. 1).

  FIG. 6 schematically illustrates a process in which the aligner 140 aligns the two substrates 120. The control unit 144 controls the lower stage 142 based on the acquired position data of the two substrates 120 so that both the substrates 120 are arranged at the statistically calculated positions. 120 positions are aligned with high accuracy.

  FIG. 7 schematically illustrates a process in which the aligner 140 superimposes two substrates 120. The controller 144 raises the piston 364 to lift the substrate 120 placed on the lower suction plate 372 and superimpose it on the substrate 120 held on the upper stage 141. The position fixing mechanism provided on the upper substrate holder 124 and the lower substrate holder 125 temporarily fixes the two substrates 120 to form a work pair. The upper stage 141 releases the suction to the upper substrate holder 124, and the piston 364 descends to lower the workpiece pair. The second transport unit 182 carries out the work pair from the main aligner 140.

  Next, the flow until the two substrates 120 are joined will be briefly described. When the substrate bonding apparatus 100 starts operating, the robot arm 186 unloads the upper substrate holder 124 with the mounting surface stored downward from the holder rack 150 and mounts it on the push pin of the second delivery port 184. Put.

  Subsequently, the first transport unit 181 holds the upper substrate holder 124 placed on the push pin of the second delivery port 184, moves to the reversing mechanism 160, and delivers it to the reversing mechanism 160. The reversing mechanism 160 reverses the upper substrate holder 124. The first transport unit 181 receives the inverted upper substrate holder 124, moves to the holder position adjustment unit 132 of the preliminary aligner 130, and places the upper substrate holder 124 on the holder position adjustment unit 132. The holder position adjusting unit 132 adjusts the position and orientation of the upper substrate holder 124 based on the position of the upper substrate holder 124 detected by the detector 134 so that the upper substrate holder 124 falls within a predetermined range.

  On the other hand, the substrate 120 held by the upper substrate holder 124 is unloaded from the FOUP by the robot arm 116 of the EFEM 112 and placed on the substrate position adjustment unit 131 of the spare aligner 130. The substrate position adjustment unit 131 adjusts the position and orientation of the substrate 120 based on the position of the substrate 120 detected by the detector 133 so that the substrate 120 falls within a predetermined range. The robot arm 116 holds the substrate 120 and moves to the holder position adjustment unit 132 to place the substrate 120 on the upper substrate holder 124.

  Electric power is supplied to the upper substrate holder 124 by the holder position adjusting unit 132, and the substrate 120 is fixed to the upper substrate holder 124 by electrostatic attraction. The upper workpiece formed in this way is transported directly above the reversing mechanism 160 by the first transport unit 181. The reversing mechanism 160 reverses the upper work and lowers the substrate holding surface. Then, the first transport unit 181 moves the upper work to the first delivery port 183.

  As shown in FIG. 2, the first delivery port 183 holds the upper workpiece by pushing out the push pin 188, and the first transfer unit 181 is retracted. Based on the position of the substrate 120 detected by the lower observer 189, the first delivery port 183 corrects the positional deviation of the substrate 120 by rotation or parallel movement so that the substrate 120 falls within a predetermined range. Thereafter, the second transport unit 182 receives the upper work from the first delivery port 183 and carries it into the aligner 140.

  As shown in FIG. 4, the upper work carried into the aligner 140 is temporarily placed on a push pin 320 protruding from the lower stage 142. The lower stage 142 moves below the upper stage 141 and the push pin 320 rises to lift and hold the upper work up to the upper stage 141.

  Similar to the above-described upper workpiece, the robot arm 186 unloads the lower substrate holder 125 with the substrate holding surface stored upward from the holder rack 150 and places it on the push pin of the second delivery port 184. Then, the lower substrate holder 125 is transported to the holder position adjusting unit 132 by the first transport unit 181 and the position and orientation thereof are adjusted.

  On the other hand, the substrate 120 placed on the lower substrate holder 125 is transported from the FOUP to the substrate position adjustment unit 131 by the robot arm 116 of the EFEM 112 and aligned. The robot arm 116 places the substrate 120 on the lower substrate holder 125 in the holder position adjustment unit 132. The lower substrate holder 125 electrostatically attracts the substrate 120 to form a lower workpiece.

  The first transport unit 181 transports the lower work to the first delivery port 183 without passing through the reversing mechanism 160 with the surface of the lower work holding the substrate 120 facing upward. Based on the position of the substrate 120 detected by the upper observer 187, the first delivery port 183 corrects the positional deviation of the substrate 120 by rotation or translation so that the substrate 120 falls within a predetermined range. The second transport unit 182 carries the lower work into the main aligner 140 and places it on the lower stage 142.

  As shown in FIGS. 5 to 7, the aligner 140 detects the positions of the two substrates 120 held by the upper stage 141 and the lower stage 142 with the microscope 342 and the microscope 344. The aligner 140 aligns and superimposes the two substrates 120 based on the detection data. The two superposed substrates 120 are temporarily fixed by a positioning mechanism provided on the upper substrate holder 124 and the lower substrate holder 125 to form a work pair.

  The workpiece pair is transported from the main aligner 140 to the first delivery port 183 by the second transport unit 182 and transported to the second delivery port 184 by the first transport unit 181. Thereafter, the robot arm 186 holds the work pair on the second delivery port 184 and carries it into the load lock chamber 220. The workpiece pair is carried from the load lock chamber 220 to the heating / pressurizing device 240 by the robot arm 230 and heated and pressurized, whereby the two substrates 120 are joined to each other and integrated.

  While the workpiece pair is joined, a new upper substrate holder 124 is unloaded from the holder rack 150, a new substrate 120 is unloaded from the FOUP, and a new upper workpiece is formed by the holder position adjusting unit 132. The new upper work is transported to the aligner 140 and held on the upper stage 141 to stand by.

  The bonded workpiece pair is unloaded from the heating / pressurizing device 240 by the robot arm 230 and loaded into the load lock chamber 220. Then, the robot arm 186 unloads the workpiece pair from the load lock chamber 220 and loads it into the separation mechanism 170. The separation mechanism 170 separates the laminated substrate joined from the upper substrate holder 124 and the lower substrate holder 125.

  The separated upper substrate holder 124 is returned to the holder rack 150 by the robot arm 186 and stands by. The laminated substrate is transported to the holder position adjusting unit 132 by the transport unit 180 while being placed on the lower substrate holder 125, and is collected by the robot arm 116 in the FOUP attached to the load port 115. The lower substrate holder 125 left in the holder position adjusting unit 132 waits to form a new lower workpiece together with the substrate 120 newly loaded by the robot arm 116. Through the above flow, a laminated substrate in which two substrates 120 on which circuit patterns are formed is overlaid is manufactured.

  In FIG. 2, the first delivery port 183 corrects the positional deviation of the substrate 120 by observing the outer shape of the substrate 120 by the upper observer 187 or the lower observer 189 so that the substrate 120 falls within a predetermined range. To do.

  An example of the predetermined range is an adjustment range that can be adjusted by the lower stage 142. As described above, the aligner 140 aligns the substrate 120 by moving the lower stage 142. Since the lower stage 142 is highly accurate, the range in which the movement can be adjusted is narrow. If the position of the substrate 120 transferred from the first delivery port 183 to the lower stage 142 is outside the adjustment range that can be adjusted by the lower stage 142, the deviation may not be completely corrected. Correct alignment by the aligner 140 can be ensured by correcting the positional deviation of the substrate 120 so that the first delivery port 183 falls within the adjustment range in which the substrate 120 can be adjusted by the lower stage 142.

  Another example of the predetermined range is an observation range in which the index M can be observed with the microscope 342 and the microscope 344. As described above, the aligner 140 accurately detects the positions of the two substrates 120 by observing the index M provided on the opposing substrate 120 with the microscope 342 and the microscope 344, and based on the detection data. The substrate 120 is aligned. If the position of the substrate 120 transferred from the first delivery port 183 to the aligner 140 does not fall within the observation range where the index M can be observed with the microscope 342 and the microscope 344, it takes time to find the index M. Correct alignment by the aligner 140 is ensured by correcting the positional deviation of the substrate 120 so that the first transfer port 183 is within the observation range in which the index M of the substrate 120 can be observed with the microscope 342 or the microscope 344. it can.

  According to the above correction, both the substrate 120 held by the upper substrate holder 124 and the substrate 120 held by the lower substrate holder 125 are provided on the surfaces thereof at the positions placed on the upper stage 141 and the lower stage 142, respectively. The obtained index M is surely stored in the field of view of the microscope 342 and the microscope 344 facing each other. The aligner 140 can accurately detect the positions of the two substrates 120 using the microscopes 342 and 344.

  In the embodiment shown in FIGS. 1 to 7, the upper observer 187 and the lower observer 189 observe the outer shape of the substrate 120 at the first delivery port 183, but the observation target is not limited to this. As other observation targets, the outer shapes of the upper substrate holder 124 and the lower substrate holder 125, for example, the notches 128 may be observed at the first delivery port 183. In this case, the upper observation device 187 and the lower observation device 189 shown in FIG. 2 may be used. Instead, the light source, the light receiving unit, and the upper and lower substrate holders 124 are sandwiched between the light source and the light receiving unit. The outer shape of the upper substrate holder 124 and the outer shape of the lower substrate holder 125 may be observed using a set of transmission optical systems arranged with the above. Even in this case, the preliminary aligner 130 grasps the relative position between the substrate 120 and the upper substrate holder 124 and the like, and based on the outer shape of the upper substrate holder 124 and the like observed at the first delivery port 183, The stage 185 corrects the position of the upper substrate holder 124 and the like, whereby the position of the substrate 120 placed on the upper substrate holder 124 can be corrected.

  FIG. 8 shows an outline of a manufacturing method for manufacturing a stacked semiconductor device. As shown in FIG. 8, the laminated semiconductor device is a base material for the laminated semiconductor device, step S110 for designing the function / performance of the laminated semiconductor device, step S120 for producing a mask (reticle) based on this design step, and step S120. Step S130 for manufacturing a substrate, substrate processing step S140 for forming a semiconductor device on the substrate 120, including lithography using a mask pattern, and bonding a plurality of processed substrates 120 using the above-described substrate bonding apparatus The device is manufactured through a device assembly step S150 including a substrate bonding step to be performed, an inspection step S160, and the like. The device assembly step S150 includes processing processes such as a dicing process, a bonding process, and a package process following the substrate bonding process.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The execution order of each process such as operation, procedure, step, and stage in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the specification, and the drawings, even if it is described using “first”, “next”, etc. for the sake of convenience, it means that it is essential to carry out in this order. It is not a thing.

  DESCRIPTION OF SYMBOLS 100 Board | substrate bonding apparatus, 101 Case, 102 Atmosphere environment part, 110 Control part, 111 Memory | storage part, 112 EFEM, 113 Load port, 114 Load port, 115 Load port, 116 Robot arm, 120 board | substrate, 121 notch, 122 board | substrate Holder, 124 Upper substrate holder, 125 Lower substrate holder, 128 Notch, 130 Spare aligner, 131 Substrate position adjustment unit, 132 Holder position adjustment unit, 133 detector, 134 detector, 140 aligners, 141 Upper stage, 142 Lower Stage, 144 Control unit, 150 Holder rack, 160 Inversion mechanism, 170 Separation mechanism, 180 Transport unit, 181 First transport unit, 182 Second transport unit, 183 First delivery port, 184 Second delivery port, 185 Temporary placement 186 Robot arm, 187 Upper observer, 188 Push pin, 189 Lower observer, 202 Vacuum environment part, 210 Heat insulation wall, 220 Load lock chamber, 222 Shutter, 224 Shutter, 230 Robot arm, 240 Heating and pressing device, 281 Feed terminal, 282 Feed terminal, 310 frame, 312 top plate, 314 support, 316 bottom plate, 320 push pin, 342 microscope, 344 microscope, 352 guide rail, 354 X stage, 356 Y stage, 360 lift section, 362 cylinder, 364 piston, 372 lower suction plate

Claims (12)

An outer shape observation unit for grasping the position of the substrate by observing the outer shape of the substrate;
By observing an index provided on the substrate, an index observation unit that grasps the position of the substrate in more detail than the outer shape observation unit;
A transport unit that transports the substrate from the outer shape observation unit to the index observation unit;
A substrate transport apparatus comprising: a position correction unit that is arranged on a transport path from the outer shape observation unit to the index observation unit and corrects a positional deviation of the substrate being transported. The position correction unit has a temporary placement table for temporarily placing the substrate,
The said conveyance part has the upstream conveyance arm which conveys the said board | substrate from the said external appearance observation part to the said temporary placement stand, and the downstream conveyance arm which conveys the said board | substrate from the said temporary placement stand to the said index observation part. The board | substrate conveyance apparatus of description.   The substrate transfer apparatus according to claim 2, wherein the substrate transfer path by the upstream transfer arm and the substrate transfer path by the downstream transfer arm have different directions.   The substrate transport apparatus according to claim 2, wherein a rotation mechanism that rotates the front and back of the substrate is provided in a transport path for transporting the substrate from the outer shape observation unit to the temporary placement table.   5. The substrate transfer apparatus according to claim 2, wherein the temporary placement table rotates at least within the plane of the substrate to correct the positional deviation of the substrate. 6.   The substrate transfer apparatus according to claim 1, wherein the position correction unit corrects a positional shift of the substrate by observing an outer shape of the substrate. The transport unit transports the substrate while being held by a substrate holder,
The substrate transport apparatus according to claim 1, wherein the position correction unit corrects a positional deviation of the substrate by observing an outer shape of the substrate holder. The index observation unit has a position adjustment unit that adjusts the position of the received substrate,
The substrate transfer apparatus according to claim 1, wherein the position correction unit corrects a positional deviation of the substrate within an adjustment range that can be adjusted by the position adjustment unit.   The substrate transport apparatus according to claim 8, wherein the position correction unit corrects a positional deviation of the substrate within an observation range in which the index can be observed by the index observation unit.   A substrate bonding apparatus that includes the substrate transfer device according to claim 1 and bonds a plurality of the substrates.   A method for manufacturing a laminated semiconductor device, comprising: bonding the substrate by the substrate bonding apparatus according to claim 10.   A stacked semiconductor device manufactured by the method for manufacturing a stacked semiconductor device according to claim 11.

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