JP5600952B2 - Position detection apparatus, substrate bonding apparatus, position detection method, substrate bonding method, and device manufacturing method - Google Patents

Description

  The present invention relates to a position detection apparatus and a device manufacturing method.

One technique for improving the effective mounting density of semiconductor devices is a three-dimensional structure in which a plurality of semiconductor chips are stacked. In particular, a semiconductor chip manufactured by a procedure of laminating a plurality of wafers in the state of a wafer as a semiconductor substrate and joining them into individual pieces has recently attracted attention because of its high productivity. When two wafers are overlapped, alignment is performed while measuring the alignment marks of each other with a microscope (see, for example, Patent Document 1).
[Prior art documents]
[Patent Literature]
[Patent Document 1] Japanese Patent Laid-Open No. 2005-251972

  In recent years when the diameter of the wafer tends to increase, it has become difficult to perform high-speed alignment with submicron accuracy over the entire surface of the wafers that are superimposed. In particular, there is a problem of how to accurately and rapidly align the other wafer with respect to one wafer.

  In order to solve the above-described problem, in the position detection device according to the first aspect of the present invention, a first stage on which the first substrate is placed, and the first stage are disposed so as to face each other. A first acquisition unit that is a plurality of observation devices that acquire the first observation unit, an adjustment mechanism that adjusts the distance between the observation devices constituting the first acquisition unit, and a first substrate that is disposed to face the first stage. A second stage to be placed, a second acquisition unit that is arranged opposite to the second stage and acquires an image of the second substrate, and a second unit in which the interval between the observers is adjusted by the adjustment mechanism. And a control calculation unit that calculates the position of the first index of the first substrate by the first acquisition unit, and calculates the position of the second index of the second substrate by the second acquisition unit.

  In order to solve the above-described problem, the device manufacturing method according to the second aspect of the present invention is a device manufacturing method manufactured by stacking a plurality of substrates, and the step of stacking the plurality of substrates includes The first placement step of placing the first substrate on the first stage and the interval between the observation devices of the first acquisition unit that is arranged to face the first stage and is constituted by a plurality of observation devices is adjusted. Adjusting step, a first calculating step of calculating the position of the first index of the first substrate by the first acquisition unit, and placing the second substrate on the second stage disposed to face the first stage. A second placement step; a second calculation step of calculating a position of a second index of the second substrate by a second acquisition unit that is arranged opposite to the second stage and configured by at least one observer; Calculated by the first calculation step Including the position of the first index, based on the position of the second index calculated by the second calculation step, a laminating step of overlaying the first substrate and the second substrate.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a top view which shows roughly the whole structure of a superimposition apparatus. It is a top view which shows the structure of a board | substrate schematically. It is a top view which shows the structure of an upper board | substrate holder roughly. It is a top view which shows the structure of a lower substrate holder roughly. It is sectional drawing which shows the structure of an aligner roughly. It is sectional drawing which shows roughly operation | movement of the aligner when adjusting the optical axis of an upper observer and a lower observer. It is sectional drawing which shows roughly the state of the aligner with which the lower workpiece | work was mounted in the lower stage. It is sectional drawing which shows schematically the aligner of the state by which the lower stage is arrange | positioned in the position facing a 1st acquisition part. It is sectional drawing which shows roughly the state of the aligner when the robot arm is reversing the upper workpiece. It is sectional drawing which shows roughly the state of the aligner when the inverted upper workpiece | work is mounted in the lower stage. It is sectional drawing which shows roughly the aligner of the state by which the upper workpiece | work is arrange | positioned in the position facing a 2nd acquisition part. It is sectional drawing which shows schematically the aligner of the state by which the lower workpiece | work is arrange | positioned in the position facing a 1st acquisition part. It is sectional drawing which shows roughly the state of the aligner when a workpiece | work pair is formed by temporarily joining a lower board | substrate and an upper board | substrate. It is a top view which shows the structure of an adjustment mechanism roughly. It is sectional drawing which shows roughly the structure of a lower reference observer and an upper reference observer.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a plan view schematically showing the overall structure of an overlay apparatus 100 including a position detection apparatus according to the present embodiment. The plane direction is the XY axis direction, and the gravity direction is the Z axis direction. The superimposing apparatus 100 is an apparatus for joining two substrates on which circuit patterns are formed by superimposing and heating and pressing so that electrodes to be joined are in contact with each other. The superimposing apparatus 100 includes an atmospheric environment unit 102 and a vacuum environment unit 202 formed in a common housing 101.

  The atmospheric environment unit 102 has a control unit 110 and an EFEM (Equipment Front End Module) 112 facing the outside of the housing 101. Each element of each device included in the superimposing apparatus 100 is controlled by the control unit 110 that controls and controls the entire superimposing apparatus 100, or the control arithmetic unit provided for each element performs integrated control and cooperative control. Operate. The control unit 110 includes a storage unit 111 that stores information for controlling the superposition apparatus 100 and an operation unit that is operated by the user from the outside when the superposition apparatus 100 is turned on and various settings are made. Furthermore, the control unit 110 may include a connection unit that connects to other deployed devices.

  The EFEM 112 includes three load ports 113, 114, 115 and a robot arm 116. Each load port is fitted with a FOUP (Front Opening Unified Pod) which is a sealed pod for storing a substrate. A plurality of substrates 120 are stored in the FOUP attached to the load ports 113 and 114, and are carried into the atmospheric environment unit 102 by the robot arm 116. The substrate 120 bonded in the atmospheric environment unit 102 and the vacuum environment unit 202 is stored in a FOUP attached to the load port 115.

  The substrate 120 here is a single silicon wafer, a compound semiconductor wafer or the like on which a plurality of circuit patterns are already formed periodically. Further, the loaded substrate 120 may be a laminated substrate that is already formed by laminating a plurality of wafers.

  The atmospheric environment unit 102 includes a pre-aligner 130, an aligner 140 including a position detection device, a holder rack 150, a separation mechanism 160, and a transport mechanism 170, which are disposed inside the housing 101. The pre-aligner 130 includes a turntable 131, a holder table 132, and a detector 133. The substrate 120 is placed on the turntable 131 by the robot arm 116 of the EFEM 112. Then, the position of the substrate 120 in the rotation direction is adjusted by the turntable 131. A substrate holder 190 transported from the holder rack 150 is placed on the holder table 132.

  The detector 133 includes an imaging unit having an optical system that looks down at the substrate holder 190 placed on the holder table 132 and the substrate 120 located above the substrate holder 190 and forms a partial image on the imaging element. The imaging unit is fixed to a place that is not easily affected by vibration, such as a ceiling frame of the pre-aligner 130. A cutout is provided in the outer periphery of the substrate holder 190, and the pre-aligner 130 identifies the posture of the substrate holder 190 by detecting the cutout with the detector 133.

  A plurality of insertion holes are provided in the substrate holding surface of the substrate holder 190 and penetrate the front and back of the substrate holder 190. The holder table 132 is provided with a plurality of through holes, and the plurality of lift pins can pass through the through holes and the insertion holes of the substrate holder 190 so that the substrate 120 can be placed on the lift pins. .

  The substrate 120 transported from the turntable 131 to the holder table 132 by the substrate slider is placed on a plurality of lift pins. Then, the image is picked up by the image pickup unit together with the substrate holder 190, and is accurately positioned with reference to the notch. After being aligned, the substrate 120 is placed on the substrate holder 190.

  The holder table 132 is provided with power supply pins, and is connected to a power supply terminal provided on the back surface of the substrate holder 190 to supply power to the substrate holder 190. The substrate holder 190 supplied with power from the power supply terminal causes a potential difference on the substrate holding surface by the electrostatic chuck provided therein, and electrostatically attracts the substrate 120. The substrate 120 and the substrate holder 190 integrated in this way are called a workpiece.

  The aligner 140 includes a lower stage 141, an upper stage 142, and an interferometer 143. Further, a heat insulating wall 144 and a shutter 145 are provided so as to surround the aligner 140. The space surrounded by the heat insulating wall 144 and the shutter 145 communicates with an air conditioner or the like and is temperature-controlled to maintain the alignment accuracy in the aligner 140.

  The lower stage 141 is configured to be movable in the direction of the placement surface on which the workpiece is placed, and holds the substrate 120 held by the substrate holder 190 upward. The upper stage 142 is installed on the ceiling portion of the aligner 140 and holds the substrate 120 held by the substrate holder 190 downward.

  When the two substrates 120 are overlapped, a workpiece placed on the lower stage 141 is called a lower workpiece, and a workpiece placed on the upper stage 142 is called an upper workpiece. The substrate holder 190 constituting the lower workpiece is referred to as a lower substrate holder 191, the substrate 120 is referred to as a lower substrate 121, the substrate holder 190 constituting the upper workpiece is referred to as an upper substrate holder 192, and the substrate 120 is referred to as an upper substrate 122. Specific configurations of the substrate 120, the upper substrate holder 192, and the lower substrate holder 191 will be described later.

  The aligner 140 moves the lower stage 141 precisely while monitoring the position by the interferometer 143, so that the upper substrate 122 held by the upper stage 142 and the lower substrate 121 held by the lower stage 141 are moved. Align. Then, by raising the lower stage 141 in the aligned state, the bonding surfaces of the upper substrate 122 and the lower substrate 121 are brought into contact with each other and temporarily bonded. The two temporarily joined workpieces are collectively called a workpiece pair. A specific configuration of the aligner 140 will be described later.

  The holder rack 150 includes a plurality of shelves that store the substrate holders 190. Each shelf is provided with at least three support convex portions for placing the substrate holder 190 thereon, and is put in and out by the robot arm 175. The separation mechanism 160 receives a workpiece pair heated and pressurized by a heating and pressurizing apparatus 240 described later, and a lower substrate 121 and an upper substrate, which are two bonded substrates, from the lower substrate holder 191 and the upper substrate holder 192. 122 is separated.

  The transfer mechanism 170 includes a first transfer unit 171, a second transfer unit 172, a first transfer port 173, a second transfer port 174, and robot arms 175 and 176. The first transfer unit 171 and the second transfer unit 172 transfer the substrate 120, the substrate holder 190, the workpiece, and the workpiece pair between the pre-aligner 130, the first transfer port 173, and the second transfer port 174.

  The first transport unit 171 and the second transport unit 172 travel independently on rails provided in parallel in the vertical direction. The first transport unit 171 is positioned above the second transport unit 172, and has a structure that can pass even while holding the substrate 120, the substrate holder 190, the workpiece, and the workpiece pair.

  The first delivery port 173 is provided on the upper part of the separation mechanism 160 and includes a push-up pin for placing the substrate holder 190 and a work pair. The second delivery port 174 also includes a push-up pin, and plays a role of mediating delivery of the robot arm 175, the substrate holder 190, the workpiece, and the workpiece pair between the first conveyance unit 171 and the second conveyance unit 172.

  The robot arm 175 conveys a work pair between the first delivery port 173, the separation mechanism 160, and a load lock chamber 220 described later. The robot arm 175 transports the substrate holder 190 among the holder rack 150, the first delivery port 173, and the separation mechanism 160. The robot arm 176 conveys the workpiece and the workpiece pair between the second delivery port 174 and the aligner 140.

  The vacuum environment unit 202 includes a heat insulating wall 210, a load lock chamber 220, a robot arm 230, and a plurality of heating and pressurizing devices 240. The heat insulating wall 210 surrounds the vacuum environment unit 202 to maintain the internal temperature of the vacuum environment unit 202 and blocks heat radiation to the outside of the vacuum environment unit 202. Thereby, the influence which the heat of the vacuum environment part 202 has on the atmospheric environment part 102 can be suppressed. The robot arm 230 is a transfer device that transfers a work pair, and transfers the held work pair between the load lock chamber 220 and the heating and pressurizing device 240.

  The load lock chamber 220 includes shutters 222 and 224 that open and close alternately on the atmosphere environment unit 102 side and the vacuum environment unit 202 side. When the workpiece pair is carried into the vacuum environment unit 202 from the atmospheric environment unit 102, first, the shutter 222 on the atmospheric environment unit 102 side is opened, and the robot arm 175 carries the workpiece pair into the load lock chamber 220. Next, the shutter 222 on the atmosphere environment unit 102 side is closed, and the air in the load lock chamber 220 is exhausted to make a vacuum state.

  After the inside of the load lock chamber 220 is in a vacuum state, the shutter 224 on the vacuum environment unit 202 side is opened, and the robot arm 230 carries out the workpiece pair. By such a loading operation to the vacuum environment unit 202, the workpiece pair can be loaded into the vacuum environment unit 202 without leaking the internal atmosphere of the air environment unit 102 to the vacuum environment unit 202 side.

  Next, the robot arm 230 carries the unloaded workpiece pair into one of the plurality of heating and pressing devices 240. The heating / pressurizing device 240 heats and presses the workpiece pair. Thereby, the lower substrate 121 and the upper substrate 122 which are the two substrates carried in between the two substrate holders 190 are permanently joined.

  When the workpiece pair is carried out from the vacuum environment unit 202 to the atmospheric environment unit 102, the shutter 224 on the vacuum environment unit 202 side is first opened, and the robot arm 230 carries the workpiece pair into the load lock chamber 220. Next, the shutter 224 on the vacuum environment section 202 side is closed, and the shutter 222 on the atmosphere environment section 102 side is opened. Then, the robot arm 175 carries the workpiece pair into the separation mechanism 160. The lower substrate 121 and the upper substrate 122 separated from the substrate holder 190 by the separation mechanism 160 are stored in the FOUP attached to the load port 115 by the transport mechanism 170.

  FIG. 2 is a plan view schematically showing the structure of the substrate 120. The plane direction is the XY axis direction, and the gravity direction is the Z axis direction. The coordinate system in the figure matches the coordinate system in FIG. 1 when the substrate 120 is placed on the lower stage 141 of the aligner 140.

  The substrate 120 is provided with a notch 123 indicating the crystal orientation of the substrate 120 in a part of the periphery of the substrate 120. Further, the semiconductor chip region 124 is formed on the substrate 120 in about several tens to several hundred shots. A plurality of alignment marks 125 are formed around the semiconductor chip region 124 by a photolithography process. Here, the alignment mark 125 is formed in a cross shape. The orientation of the substrate 120 is adjusted by the pre-aligner 130 so that the notch 123 is positioned at the end in the −Y direction when the substrate 120 is placed on the lower stage 141 of the aligner 140.

  FIG. 3 is a plan view schematically showing the lower substrate holder 191. The lower substrate holder 191 includes a holder main body 911 and a suction unit 912, and has a disk shape whose diameter is slightly larger than that of the substrate 120 as a whole. The holder main body 921 is integrally formed of a highly rigid material such as ceramic or metal.

  The holder main body 911 includes a region for holding the substrate 120 on the surface thereof. This holding region is polished and has high flatness. The substrate 120 is held by suction using an electrostatic force. Specifically, a voltage difference is applied between the lower substrate holder 191 and the substrate 120 by applying a voltage to the electrostatic chuck embedded in the holder body 921 via a voltage application terminal provided on the back surface of the holder body 921. And the substrate 120 is attracted to the lower substrate holder 191. Note that the suction surface of the substrate 120 is a surface opposite to the surface on which the circuit region is provided.

  The holder body 911 includes the insertion hole 913 and the notch 914 described above. The notch 914 is used as a reference when the substrate 120 is preliminarily aligned with the substrate holder 190 in the pre-aligner 130. A plurality of suction units 912 are arranged in an outer peripheral area outside the held substrate 120 on the surface holding the substrate 120. In the case of the figure, a total of six suction units 912 are arranged every 120 degrees with two as one set. The adsorption unit 912 is made of a magnetic material such as iron.

  FIG. 4 is a plan view schematically showing the upper substrate holder 192. The upper substrate holder 192 includes a holder main body 921 and a magnet unit 922, and has a disk shape whose diameter is slightly larger than that of the substrate 120 as a whole. The holder body 911 is integrally formed of a highly rigid material such as ceramic or metal.

  The holder main body 921 includes a region for holding the substrate 120 on the surface thereof. This holding region is polished and has high flatness. The substrate 120 is held by suction using an electrostatic force. Specifically, a voltage difference is applied between the upper substrate holder 192 and the substrate 120 by applying a voltage to the electrostatic chuck embedded in the holder body 921 via a voltage application terminal provided on the back surface of the holder body 921. The substrate 120 is attracted to the upper substrate holder 192. Note that the suction surface of the substrate 120 is a surface opposite to the surface on which the circuit region is provided.

  A plurality of magnet units 922 are arranged in an outer peripheral region that is outside the held substrate 120 on the surface that holds the substrate 120. In the case of the figure, a total of six magnet units 922 are arranged every 120 degrees with two as one set. The magnet unit 922 is arranged so as to correspond to the suction unit 912, and when the suction unit 912 and the magnet unit 922 are operated with the upper work and the lower work facing each other, the two substrates 120 are overlapped. Can be pinched and fixed.

  The upper substrate holder 192 includes a collar portion 925 that is a portion of the outer peripheral shape of the upper substrate holder 192 that does not match the outer peripheral shape of the lower substrate holder 191. When the separation mechanism 160 separates the lower substrate holder 191 from the bonded substrate 120, the upper substrate holder 192 receives a pressing force from the lower substrate holder 191 side in a region including the collar portion 925. At this time, the electrostatic adsorption of the upper substrate holder 192 is made effective and the electrostatic adsorption of the lower substrate holder 191 is made invalid, whereby the substrate 120 is lifted together with the upper substrate holder 192 and separated from the lower substrate holder 191. .

  FIG. 5 is a sectional view schematically showing the structure of the aligner 140. In the figure, the vertical direction is the Z-axis direction, the horizontal direction is the Y-axis direction, and the depth X-axis direction. The aligner 140 includes a lower stage 141, an upper stage 142, an interferometer 143, a first acquisition unit 401, a second acquisition unit 402, an adjustment mechanism 403, a control calculation unit 404, and a movement mechanism 406.

  The lower substrate 121 is placed on the lower stage 141 while being held by the lower substrate holder 191 by the robot arm 176. Further, the lower stage 141 is moved by the moving mechanism 406 in the XY direction which is the mounting surface direction on which the lower substrate 121 is placed. The moving mechanism 406 precisely moves the lower stage 141 while monitoring its position with the interferometer 143. The upper stage 142 is disposed to face the lower stage 141, and the upper substrate 122 is placed on the upper stage 142 while being held by the upper substrate holder 192.

  The first acquisition unit 401 is installed adjacent to the upper stage 142 and includes a plurality of upper observers 411 that acquire images of the lower substrate 121 placed on the lower stage 141. When the lower stage 141 is moved to a position facing the first acquisition unit 401 by the moving mechanism 406, the upper observer 411 acquires an image of the lower substrate 121. In this embodiment, an example in which the first acquisition unit 401 includes five upper observers 411 will be described. However, the number is not limited to this number, and a different number may be used as long as it is plural.

  The second acquisition unit 402 is disposed adjacent to the lower stage 141, and moves with the lower stage 141 when the lower stage 141 is moved by the moving mechanism 406. The second acquisition unit 402 includes a plurality of lower observers 412 that acquire an image of the upper substrate 122 placed on the upper stage 142. The lower observation device 412 acquires an image of the upper substrate 122 by moving the lower stage 141 by the moving mechanism 406 so that the second acquisition unit 402 is disposed at a position facing the upper substrate 122. In the present embodiment, an example in which the second acquisition unit 402 includes five lower observers 412 is described. However, the number is not limited to this number, and may be one or a different number.

  The adjustment mechanism 403 is provided for each of the five upper observers 411, and moves the upper observer 411 precisely to adjust the interval between the plurality of upper observers 411. Here, at least one of the five upper observers 411 is set as the reference upper reference observer 413. The upper reference observer 413 is controlled not to be adjusted by the adjustment mechanism 403 when adjusting the optical axes of the upper observer 411 and the lower observer 412.

  Which of the five upper observers 411 is used as the upper reference observer 413 is preset by the user. Here, the upper observer 411 located in the middle of the five upper observers 411 is set as the upper reference observer 413. Further, the lower observer 412 located in the middle of the five lower observers 412 is set as the lower reference observer 414 corresponding to the upper reference observer 413.

  Here, in the present embodiment, the upper observer 411 set as the upper reference observer 413 is controlled so as not to be adjusted. However, the upper observer 411 that is not adjusted is not provided with the adjusting mechanism 403. You may comprise as follows. For example, when one of the five upper observers 411 is a dedicated upper reference observer 413, the upper reference observer 413 can be configured not to include the adjustment mechanism 403.

  Based on the image information acquired by the first acquisition unit 401, the control calculation unit 404 calculates the positions of a plurality of alignment marks 125 that are indices formed on the lower substrate 121. The control calculation unit 404 calculates the positions of the plurality of alignment marks 125 formed on the upper substrate 122 based on the image information acquired by the second acquisition unit 402.

  Then, the control calculation unit 404 precisely moves the lower stage 141 by controlling the moving mechanism 406 based on the position information of the alignment mark 125 on the lower substrate 121 and the position information on the alignment mark 125 on the upper substrate 122. The substrate 121 and the upper substrate 122 are aligned. At this time, for example, when the plurality of alignment marks 125 on the lower substrate 121 and the corresponding plurality of alignment marks 125 on the upper substrate 122 are overlapped with each other, the control calculation unit 404 minimizes the amount of mutual displacement. Thus, the calculation is performed using a global alignment method or the like that is statistically determined.

  Here, the control procedure of the aligner 140 will be described with reference to the drawings. Each procedure is mainly performed by the control calculation unit 404 of the aligner 140, and is executed by cooperative control and integrated control with the control units of other components included in the aligner 140. First, the aligner 140 makes the first acquisition unit 401 and the second acquisition unit 402 face each other, and performs optical axis adjustment between the upper observation device 411 and the lower observation device 412 facing each other.

  FIG. 6 is a cross-sectional view schematically showing the operation of the aligner 140 when the optical axes of the upper observer 411 and the lower observer 412 are adjusted. As shown in FIG. 6, the aligner 140 uses the robot arm 408 to place the optical axis between the first acquisition unit 401 and the second acquisition unit 402 on the focal plane of the upper observer 411 or the focal plane of the lower observer 412. A transparent plate 407, which is an adjustment index, is inserted. The transparent plate 407 moves forward and backward with respect to the observation field of the upper observation device 411 or the observation field of the lower observation device 412 by the robot arm 408.

  The transparent plate 407 is provided with five marks that can be observed from both sides of the first acquisition unit 401 side and the second acquisition unit 402 side. Here, the mark located in the middle of the five marks is used as the reference mark. First, the control calculation unit 404 adjusts the position of the transparent plate 407 by the robot arm 408 so that the reference mark of the transparent plate 407 is positioned at the center position of the image acquired by the upper reference observer 413. Thereafter, the lower stage 141 is moved by the moving mechanism 406 so that the reference mark is positioned at the center position of the image acquired by the lower reference observer 414.

  By controlling in this way, the optical axes of the upper reference observer 413 and the lower reference observer 414 can be matched. Further, here, the adjustment mechanism 403 moves the upper observer 411 so that four marks other than the reference mark are positioned at the center positions of images acquired by the four upper observers 411 other than the upper reference observer 413. Move.

  The four marks other than the reference mark are transparent so that when the reference mark is positioned at the center position of the image acquired by the lower reference observer 414, the four marks are positioned at the center position of the image acquired by the other lower observer 412. By controlling in this way, the optical axes of the other four upper observers 411 and 412 can be matched.

  Here, although the transparent plate 407 has been described as an example including five marks that match the number of the upper observer 411 and the lower observer 412, the present invention is not limited thereto. The number of upper and lower observers 411 and 412 for adjusting the optical axis may be reduced by fewer than five, or the number used for optical axis adjustment may be selected by increasing the number of the upper observers 411 and lower observers 412. You may comprise so that it may be used.

  Alternatively, only one upper reference observer 413 and lower reference observer 414 may be configured to adjust the optical axis, with one reference mark. In this case, arrangement information indicating the arrangement relationship between the lower reference observer 414 and the other lower observer 412 is stored in the storage unit 405, and the adjustment mechanism 403 moves the upper observer 411 based on the arrangement information. Thus, the optical axes of the other four upper observers 411 and the other four lower observers 412 are made to coincide.

  FIG. 7 is a cross-sectional view schematically showing a state of the aligner 140 in which the lower work is placed on the lower stage 141. The robot arm 176 carries the upper work placed on the second delivery port 174 into the aligner 140 and places it on the push-up pin 146 provided on the placement surface of the lower stage 141. Thereafter, the lower stage 141 lowers the push-up pin 146, so that the upper work is placed on the placement surface of the lower stage 141.

  FIG. 8 is a cross-sectional view schematically showing the aligner 140 in a state where the lower stage 141 is disposed at a position facing the first acquisition unit 401. The lower stage 141 is moved by the moving mechanism 406. The moving mechanism 406 moves the lower stage so that the alignment mark 125 provided at the center of the end in the −X direction among the plurality of alignment marks 125 provided on the upper substrate 122 is positioned directly below the upper reference observer 413. 141 is moved. The position of the upper substrate 122 is adjusted by the pre-aligner 130 so that the notch 123 is positioned at the end in the −Y direction, and the alignment marks 125 are provided so as to form five rows in the X direction. .

  Thereafter, based on the image information of the upper substrate 122 acquired by the upper reference observer 413, the control calculation unit 404 allows the upper reference observer 413 to accurately acquire the alignment mark 125 positioned immediately below at the center of the optical axis. In addition, the lower stage 141 is moved by the moving mechanism 406. Thereafter, based on the image information acquired by the other upper observer 411, the upper observer 411 uses the adjustment mechanism 403 so that the other upper observer 411 can acquire the alignment mark 125 included in the image at the center of the optical axis. The position of 411 is adjusted. According to FIG. 2, since the upper substrate 122 is provided with three alignment marks 125 at the end in the −X direction, the upper observers 411 on both sides of the upper reference observer 413 here set the alignment marks 125 respectively. It is adjusted so that it can be acquired at the center of the optical axis.

  Then, while observing the upper substrate 122 with the upper observer 411, the lower stage 141 is moved in the + X direction. Since the alignment marks 125 constituting the five rows of the upper substrate 122 correspond to the five upper observers 411, the alignment marks 125 can be sequentially imaged by moving in this way. Here, since each alignment mark 125 of the upper substrate 122 is designed so that the center thereof is positioned at the center of the image captured by the upper observer 411, the alignment mark 125 is designed by the upper observer 411 in design. Can be acquired at the center of the optical axis.

  However, the actual position of the alignment mark 125 deviates from the design position due to an error between apparatuses performing the process, expansion and distortion of the upper substrate 122, and the like. The direction and size of this shift differ for each upper substrate 122, and further vary for each alignment mark 125 within the same upper substrate 122. Therefore, the upper observer 411 may acquire the alignment mark 125 at a position shifted from the optical axis center.

  Therefore, in this embodiment, the upper observation device 411 adjusts the position of the upper observation device 411 by the adjustment mechanism 403 based on the image information of the upper substrate 122 acquired by the upper observation device 411, so that each upper observation device 411 transmits the alignment mark 125 to the light. Control so that it can be acquired at the axis center. This adjustment is executed in cooperation with the movement of the lower stage 141 in the + X direction. By controlling in this way, each upper observer 411 can acquire the alignment mark 125 at the center of the optical axis, so that it is possible to reduce the influence of the aberration of the lens constituting the upper observer 411, and the position of the alignment mark 125 Can be detected with high accuracy.

  When calculating the position of the alignment mark 125, if the captured alignment mark 125 is shifted from the center of the optical axis, the shift amount is calculated by image processing. Thus, the position can be calculated from the measurement result by the interferometer 143 and the movement amount by the adjustment mechanism 403, and the calculation amount can be reduced. The positional information of the plurality of alignment marks 125 acquired in this way is stored in the storage unit 405.

  FIG. 9 is a cross-sectional view schematically showing the state of the aligner 140 when the robot arm 176 reverses the upper workpiece. First, the lower stage 141 is moved to a position facing the upper stage 142 by the moving mechanism 406. Then, the lower stage 141 raises the push-up pin 146, and the robot arm 176 extends the arm to lift the upper work, and sucks and holds it. Thereafter, the robot arm 176 carries the upper work from the lower stage 141 and reverses it.

  FIG. 10 is a cross-sectional view schematically showing a state of the aligner 140 when the inverted upper work is placed on the lower stage 141. The inverted upper work is first placed on the push-up pin 146 of the lower stage 141 by the robot arm 176. Since the push-up pins 146 are arranged so as to support the outside of the substrate mounting surface of the substrate holder 190, the work can be held downward. Then, after the robot arm 176 is retracted, the push-up pin 146 is raised to press the upper work against the upper stage 142. The upper stage 142 sucks and holds the upper work. In this way, the upper work is transferred from the lower stage 141 to the upper stage 142, but the robot arm 176 handles the upper work precisely so that the upper work is not displaced by the transfer.

  FIG. 11 is a cross-sectional view schematically showing the aligner 140 in a state where the upper work is disposed at a position facing the second acquisition unit 402. The control calculation unit 404 refers to the position information stored in the storage unit 405 and moves the lower stage 141 to the moving mechanism 406 so that the upper work and the second acquisition unit 402 face each other. Here, the control calculation unit 404 observes at least three of the plurality of alignment marks 125 on the upper substrate 122 with the lower observer 412 and calculates their positions.

  Then, by comparing the calculated position information with the position information stored in the storage unit 405, it is confirmed whether or not a position shift has occurred by inverting the upper substrate 122. The upper substrate 122 may be displaced due to a mechanical error caused by the robot arm 176, the tilt of the lower stage 141 or the upper stage 142, etc., but the positions of at least three alignment marks 125 on the upper substrate 122 are calculated. By comparing with the position information stored in the storage unit, this positional deviation can be detected.

  As a result of the confirmation, if it is determined that a positional deviation has occurred, the positional deviation amount is calculated, and the lower stage 141 is moved by the moving mechanism 406 by the amount of the positional deviation. As described above, after the upper work is once placed on the lower stage 141 and the position of the alignment mark 125 on the upper substrate 122 is calculated by the first acquisition unit 401 including the adjustment mechanism 403, the upper work is placed on the upper stage 142. The position detection accuracy can be improved by adopting the transfer configuration.

  FIG. 12 is a cross-sectional view schematically showing the aligner 140 in a state where the lower workpiece placed on the lower stage 141 is disposed at a position facing the first acquisition unit 401. The moving mechanism 406 moves on the lower stage 141 on which the lower workpiece is placed by the robot arm 176, so that the moving mechanism 406 is provided at the center of the −X direction end among the plurality of alignment marks 125 provided on the lower substrate 121. The lower stage 141 is arranged so that the alignment mark 125 is located immediately below the upper reference observer 413.

  Thereafter, based on the image information of the lower substrate 121 acquired by the upper reference observer 413, the control calculation unit 404 allows the upper reference observer 413 to accurately acquire the alignment mark 125 positioned immediately below at the center of the optical axis. In addition, the lower stage 141 is moved by the moving mechanism 406. Thereafter, based on the image information acquired by the other lower observer 412, the adjustment mechanism 403 allows the lower observer 412 to acquire the alignment mark 125 included in the image at the center of the optical axis. Adjust the position.

  And while observing the lower board | substrate 121 with the upper observer 411, the lower stage 141 is moved to + X direction, and the alignment mark 125 is imaged in order. At this time, based on the image information of the lower substrate 121 acquired by the upper observer 411, the adjustment mechanism 403 allows the upper observer 411 to acquire the alignment mark 125 accurately at the center of the optical axis. Adjust the position. Then, the control calculation unit 404 calculates the position of the alignment mark 125 and stores the calculated position information in the storage unit 405.

  FIG. 13 is a cross-sectional view schematically showing a state of the aligner 140 when a work pair is formed by temporarily bonding the lower substrate 121 and the upper substrate 122. The control arithmetic unit 404 precisely aligns the lower substrate 121 and the upper substrate 122 and then raises the lower stage 141 to bring the lower substrate 121 and the upper substrate 122 into contact with each other to form a workpiece pair. Specifically, first, the control calculation unit 404 precisely moves the lower stage 141 based on the position information of the alignment mark 125 of the lower substrate 121 and the position information of the alignment mark 125 of the upper substrate 122 stored in the storage unit 405. The lower substrate 121 and the upper substrate 122 are aligned by moving.

  At this time, the control calculation unit 404 performs the alignment by calculating using the global alignment method so that the positional error between the alignment mark 125 of the lower substrate 121 and the alignment mark 125 of the upper substrate 122 is minimized. By controlling in this way, the lower substrate 121 and the upper substrate 122 are aligned with the line width accuracy of the circuit pattern provided in the semiconductor chip region 124.

  After the alignment is completed, the lower stage 141 is raised to form a work pair. The workpiece pair formed by the above procedure is unloaded from the aligner 140 by the robot arm 176 and placed on the second delivery port.

  In the present embodiment, the case where the number of the upper observers 411 and the number of columns formed by the alignment marks 125 of the substrate 120 are described as an example. However, the present invention is not limited thereto, and the alignment marks 125 are configured. You may comprise so that the number of rows may be smaller than the number of the upper observers 411. FIG. In this case, the upper observer 411 for observing the alignment mark 125 is selected from the plurality of upper observers 411, and the position detection process is executed. Further, the alignment mark 125 may be configured so that the number of columns is larger than the number of the upper observers 411. In this case, by adjusting the position of the upper observation device 411 with the adjustment mechanism 403, control is performed so that one upper observation device 411 observes a plurality of rows.

  In addition, when a plurality of columns are arranged close to each other and an alignment mark 125 belonging to a plurality of other columns enters the imaging field of one upper observer 411, one of the alignment marks 125 is adjusted by the adjustment mechanism 403. Adjustment may be made so that the image is captured at the center of the image, and the position of the other alignment mark 125 may be calculated by image processing. It is also possible to control so as not to observe the rows of alignment marks 125 that exceed the number of upper observers 411.

  Further, the alignment mark 125 may be provided so as not to form a column in the X direction. In this case, the substrate 120 is observed with a plurality of upper observers 411, and when any alignment mark 125 appears in the imaging field of the upper observer 411, an adjustment mechanism is provided so that the alignment mark 125 can be acquired at the center of the image. 403 adjusts the position of the upper observer 411. With the configuration described above, position detection can be performed with high accuracy regardless of the arrangement of the alignment marks 125.

  FIG. 14 is a schematic diagram schematically showing the structure of the adjustment mechanism 403. The figure shows a state in which one of the five upper observers 411 is looked up from directly below. The upper observer 411 is fixed to the X movable frame 560, and X rod sliding portions 501, 502, 503, and 504 are provided at the four corners of the X movable frame 560. The X rod sliding portions 501 and 502 are slidably fitted to the X rod 511 fixed to the Y movable frame 520, and the X rod sliding portions 503 and 504 are similarly fitted to the Y movable frame 520. A sliding fit is performed on the fixed X rod 512.

  Y rod sliding portions 531, 532, 533, and 534 are provided at four corners of the Y movable frame 520. The Y rod sliding portions 531 and 532 are slidably fitted to the Y rod 541 fixed to the fixed frame 550, and the Y rod sliding portions 533 and 534 are similarly fixed to the fixed frame 550. The Y rod 542 is slidably fitted.

  With this configuration, the upper observer 411 can move smoothly in the xy plane, which is a plane orthogonal to the optical axis. Further, a Y magnet 581 and an X magnet 591 are fixed to the back surface of the X movable frame 560. A Y coil 582 is disposed away from the Y magnet 581 at a position facing the Y magnet 581, and an X coil 592 is disposed away from the X magnet 591 at a position facing the X magnet 591. That is, the Y magnet 581 and the Y coil 582 form a Y-VCM, and the X magnet 591 and the X coil 592 form an X-VCM. The control calculation unit 404 can move the upper observer 411 by the target movement amount in the x direction and the y direction by controlling the direction and current value of the current flowing through the Y coil 582 and the X coil 592.

  Hall elements 571 and 572 are provided near the centers of the Y coil 582 and the X coil 592, respectively. Then, the position of the upper observation device 411 is detected by detecting the change in the magnetic field of the Y magnet 581 and the X magnet 591 that are opposed and relatively moved by the Hall elements 571 and 572.

  In the above-described embodiment, an example in which the optical axis adjustment of the upper observation device 411 and the lower observation device 412 is performed by inserting the transparent plate 407 between the first acquisition unit 401 and the second acquisition unit 402 has been described. Not limited to this. FIG. 15 is a view showing another embodiment of the optical axis adjustment, and is a cross-sectional view schematically showing the structures of the lower reference observer 610 and the upper reference observer 620. The lower reference observer 610 and the upper reference observer 620 have the same configuration as the upper reference observer 413 and the lower reference observer 414 in the above embodiment, except that the projection unit 640 is provided. Hereinafter, in order to explain the operation of the projection unit 640, the same parts as the upper reference observer 413 and the lower reference observer 414 will be described.

  The lower reference observer 610 includes a first objective optical unit 611, a first epi-illumination unit 650, and a first imaging unit 612. The upper reference observer 620 includes a second objective optical unit 621, a projection unit 640, a second epi-illumination unit 655, and a second imaging unit 622. A control calculation unit 404 is connected to the first imaging unit 612 and the second imaging unit 622.

  The first objective optical unit 611 of the lower reference observer 610 includes a first objective lens 613 on the upper reference observer 620 side and a first imaging lens 614 on the first imaging unit 612 side. A first half mirror 615 that reflects light from the first epi-illumination unit 650 is disposed between the first objective lens 613 and the first imaging lens 614.

  The first epi-illumination unit 650 of the lower reference observer 610 includes an illumination light source 651, a lens 652, and a lens 653. The illumination light source 651 is visible light, passes through the lens 652 and the lens 653, becomes parallel light, is reflected by the first half mirror 615 in the first objective optical unit 611, and proceeds in the Z direction.

  The second objective optical unit 621 of the upper reference observer 620 includes a second objective lens 623 and a second imaging lens 624. Between the second objective lens 623 and the second imaging lens 624, a second half mirror 625 that reflects light from the projection unit 640 and a third half mirror that reflects light from the second epi-illumination unit 655. 626 is arranged.

  The second epi-illumination unit 655 of the upper reference observer 620 includes an illumination light source 656, a lens 657, and a lens 658. The illumination light source 656 is visible light, passes through the lens 657 and the lens 658, becomes parallel light, is reflected by the third half mirror 626 in the second objective optical unit 621, and proceeds in the Z direction.

  The projection unit 640 includes a light source 641, a lens 642, a fiber 643, a lens 644, a collimator lens 645, a field stop 647 such as a pinhole, and an aperture stop 648. The light from the light source 641 is visible light or light having a single wavelength within the visible light wavelength.

  When optical axis adjustment is performed, a diffusion plate 409 is installed between the lower reference observer 610 and the upper reference observer 620 and on the focal plane of the lower reference observer 610 or the upper reference observer 620. First, the light source 641 of the projection unit 640 is turned on, and the adjustment index formed by passing through the field stop 647 is reflected by the second half mirror 625, and the third half mirror 626 and the second objective lens 623. It passes through in order and is projected on the inserted diffusion plate 409. The adjustment index projected on the diffusion plate 409 is imaged by the second imaging unit 622 side.

  The control calculation unit 404 confirms whether or not the adjustment index can be acquired at the center of the optical axis based on the image information captured by the second imaging unit 622. When the acquisition is not possible at the optical axis center, the control calculation unit 404 adjusts the angle of the second half mirror 625 of the second objective optical unit 621. Instead of adjusting the angle of the second half mirror 625, the field stop 647 can be adjusted by moving it in the direction intersecting the optical path from the light source 641.

  On the other hand, the lower reference observer 610 images the adjustment index projected on the diffusion plate 409 by the first imaging unit 612. Then, the control calculation unit 404 confirms whether the adjustment index can be acquired at the center of the optical axis based on the image information captured by the first imaging unit 612. In the case where acquisition is not possible at the optical axis center, the control calculation unit 404 adjusts the position by moving the lower stage 141 by the moving mechanism 406. By controlling as described above, by using the diffusion plate 409, the optical axes of the lower reference observer 610 and the upper reference observer 620 can be matched.

  In the above-described embodiment, the example in which all of the plurality of alignment marks 125 are the position detection targets has been described. However, the present invention is not limited to this, and the alignment mark 125 that is the position detection target is selected from the plurality of alignment marks 125. It may be configured. In this case, for example, the alignment mark 125 arranged at a position suitable for using the global alignment method such as a distance between the alignment marks 125 being separated from the plurality of alignment marks 125 can be selected with priority. .

  In addition, those formed more clearly on the substrate 120, those having a high degree of coincidence between the optical axis of the upper observation device 411 and the center of the alignment mark 125, and the like may be added to the conditions, and the combination is determined. You may comprise as follows. As described above, by selecting the alignment mark 125 based on a predetermined reference and making it a position detection target, a higher quality alignment mark 125 can be used as the position detection target.

  Further, the processing load can be reduced by controlling as follows. First, the upper observer 411 observes the upper substrate 122 and selects an alignment mark 125 from a plurality of alignment marks 125 based on a predetermined reference. Then, when there is a column that does not include the alignment mark 125 that is the selected index among a plurality of columns of the alignment mark 125 configured on the upper substrate 122, the upper observer 411 corresponding to the column is recognized. Then, the information is stored in the storage unit 405.

  Thereafter, when the lower substrate 121 is observed by the upper observer 411, the alignment mark 125 observed by the lower observer 412 is the position of the lower observer 412 corresponding to the upper observer 411 stored in the storage unit 405. Since it is not a detection target, control is performed so that observation of the lower substrate 121 is not executed. As described above, the processing load can be reduced by specifying the lower observation device 412 that performs observation in order to perform position detection.

  In the above embodiment, the example in which the first acquisition unit 401 includes the adjustment mechanism 403 has been described. However, both the first acquisition unit 401 and the second acquisition unit 402 may be configured to be included. With such a configuration, after the upper workpiece is transferred from the lower stage 141 to the upper stage 142, when the lower observer 412 images the upper workpiece, the target alignment mark 125 can be acquired at the center of the optical axis. Therefore, the position detection accuracy can be improved.

  In the above embodiment, the upper substrate 122 is once mounted on the lower stage 141 and then transferred to the upper stage 142. However, the present invention is not limited thereto, and the upper substrate 122 is faced downward. It may be configured to be carried in and placed on the upper stage 142. In this case, control is performed as follows. The description will focus on the parts different from the above embodiment, and the description of the common parts will be omitted.

  First, the robot arm 176 places the lower work on the lower stage 141. Next, the movement mechanism 406 is arranged such that the alignment mark 125 provided at the center of the end in the −X direction among the plurality of alignment marks 125 provided on the lower substrate 121 is positioned directly below the upper reference observer 413. The lower stage 141 is moved. Thereafter, based on the image information of the lower substrate 121 acquired by the upper reference observer 413, the control calculation unit 404 allows the upper reference observer 413 to accurately acquire the alignment mark 125 positioned immediately below at the center of the optical axis. In addition, the lower stage 141 is moved by the moving mechanism 406.

  Thereafter, the movement mechanism 406 scans the lower substrate 121 while moving the lower stage 141 in the + X direction. At this time, the adjustment mechanism 403 adjusts the position of each upper observer 411 so that the alignment mark 125 is positioned at the center position of the image acquired by each upper observer 411, and the image information of the lower substrate 121 is adjusted after adjustment. get. The control calculation unit 404 calculates the position of the alignment mark 125 based on the image information, and the calculated position information is stored in the storage unit 405 of the control calculation unit 404.

  Next, the robot arm 176 carries in the upper work held downward and places it on the upper stage. After that, the moving mechanism 406 is positioned so that the alignment mark 125 provided at the center of the end in the −X direction among the plurality of alignment marks 125 provided on the upper substrate 122 is located directly below the upper reference observer 413. The lower stage 141 is moved. Then, the control calculation unit 404 refers to the alignment mark position information of the lower substrate 121 stored in the storage unit 405, and the moving mechanism 406 moves the lower stage 141 in the + X direction, and the image information of the alignment mark 125. To get.

  At this time, the moving mechanism 406 moves the lower stage 141 in the ± Y direction so that the alignment mark 125 is positioned at the center position of the image acquired by each upper observer 411. The control calculation unit 404 calculates the position of the alignment mark 125 based on the acquired image information, and stores the calculated position information in the storage unit 405.

  Thereafter, the control calculation unit 404 controls the moving mechanism 406 based on the position information of the alignment mark 125 of the lower substrate 121 and the position information of the alignment mark 125 of the upper substrate 122 stored in the storage unit 405, thereby lower stage. 141 is moved precisely to align the lower substrate 121 and the upper substrate 122. Then, after the alignment is completed, the lower substrate 141 is raised to stack the lower substrate 121 and the upper substrate 122.

  As described above, the upper observer 411 is adjusted by the adjusting mechanism 403 and the lower observer 412 is adjusted by the moving mechanism 406, so that the upper observer 411 and the lower observer 412 can be adjusted. Each of the alignment marks 125 can be grasped at the center of the optical axis, and the position detection accuracy can be improved. It should be noted that the single lower observer 412 may be used, and the plurality of alignment marks 125 on the upper substrate 122 may be observed by the one lower observer 412. In that case, the lower observation device 412 is moved by the moving mechanism 406 to a position where each of the plurality of alignment marks 125 can be observed. With this configuration, the apparatus can be simplified.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

100 overlay apparatus, 101 housing, 102 atmospheric environment section, 110 control section, 111 storage section, 112 EFEM, 113, 114, 115 load port, 116 robot arm, 120 substrate, 121 lower substrate, 122 upper substrate, 123 notch , 124 Semiconductor chip area, 125 Alignment mark, 130 Pre-aligner, 131 Turntable, 132 Holder table, 133 Detector, 140 Aligner, 141 Lower stage, 142 Upper stage, 143 Interferometer, 144 Heat insulation wall, 145 Shutter, 146 Push-up Pin, 150 holder rack, 160 separation mechanism, 170 transport mechanism, 171 first transport unit, 172 second transport unit, 173 first delivery port, 174 second delivery port, 175, 176 Robot arm, 190 Substrate holder, 191 Lower substrate holder, 192 Upper substrate holder, 202 Vacuum environment section, 210 Heat insulation wall, 220 Load lock chamber, 222, 224 Shutter, 230 Robot arm, 240 Heating and pressing device, 401 First acquisition , 402 second acquisition unit, 403 adjustment mechanism, 404 control calculation unit, 405 storage unit, 406 movement mechanism, 407 transparent plate, 408 robot arm, 409 diffuser plate, 411 upper observation device, 412 lower observation device, 413 upper reference Observer, 414 Lower reference observer, 501, 502, 503, 504 X rod sliding part, 511, 512 X rod, 520 Y movable frame, 531, 532, 533, 534 Y rod sliding part, 541, 542 Y Rod, 550 Fixed frame, 560 X movable frame, 571, 572 E Element, 581 Y magnet, 582 Y coil, 591 X magnet, 592 X coil, 610 lower reference observer, 611 first objective optical section, 612 first imaging section, 613 first objective lens, 614 first imaging lens , 615 First half mirror, 620 Upper reference observer, 621 Second objective optical unit, 622 Second imaging unit, 623 Second objective lens, 624 Second imaging lens, 625 Second half mirror, 626 Third half mirror , 640 projection unit, 641 light source, 642 lens, 643 fiber, 644 lens, 645 collimator lens, 647 field stop, 648 aperture stop, 650 first epi-illumination unit, 651 illumination light source, 652, 653 lens, 655 second epi-illumination Part, 656 Illumination light source, 657, 658 Lens, 911 Holder body 912 adsorption unit, 913 through hole, 914 notch, 921 holder body, 922 magnet unit, 925 the flange portion

Claims (38)

A first stage on which a first substrate provided with a plurality of first indices is placed;
A plurality of first detectors arranged to face the first stage and detecting the plurality of first indicators of the first substrate;
The interval between at least two first detection units among the plurality of first detection units is adjusted , and each of the first indexes to be detected among the plurality of first indexes is detected at the optical axis center. An adjustment mechanism for adjusting the at least two first detection units ;
A second stage for placing a second substrate disposed opposite to the first stage and provided with a second index;
At least one second detection unit disposed opposite to the second stage for detecting the second index;
Control for calculating the positions of the plurality of first indexes detected by the first detection unit, the intervals of which are adjusted by the adjustment mechanism, and calculating the positions of the second indexes detected by the second detection unit. A position detection apparatus comprising a calculation unit.   2. The position detection device according to claim 1, wherein the control calculation unit performs optical axis adjustment between the opposing detection units by causing at least one of the plurality of first detection units to face the second detection unit.   The position detection device according to claim 2, wherein an adjustment index used for the optical axis adjustment is provided on at least one focal plane of the plurality of first detection units or the focal plane of the second detection unit.   The position detection device according to claim 3, wherein the adjustment index advances and retreats with respect to an observation visual field of the plurality of first detection units or an observation visual field of the second detection unit. A diffusion plate installed on at least one focal plane of the plurality of first detection units or the focal plane of the second detection unit;
The position detection apparatus according to claim 2, further comprising: a projection unit that projects an adjustment index used for the optical axis adjustment on the diffusion plate.   The position detection device according to claim 5, wherein the diffusion plate advances and retreats with respect to at least one observation field of view of the plurality of first detection units or the observation field of view of the second detection unit.   The position detection device according to claim 1, wherein at least one of the plurality of first detection units is not adjusted by the adjustment mechanism.   The position detection device according to claim 1, further comprising a moving mechanism that moves the first stage at least in a direction of a placement surface of the first substrate.   The position detection device according to claim 8, wherein the plurality of first detection units are arranged in a direction orthogonal to a moving direction of the first substrate by the moving mechanism.   The control calculation unit acquires image information of the first substrate placed on the first stage moved by the moving mechanism by the at least two first detection units, and the plurality of the plurality of the control calculation units based on the image information After the adjustment by the adjustment mechanism so that at least one of the first detection units can acquire at least one first index of the plurality of first indices at the optical axis center, the first detection unit is moved again by the movement mechanism. The position detection device according to claim 9, wherein image information of the first substrate placed on one stage is acquired and a position of the first index is calculated.   The control calculation unit calculates the positions of the plurality of first indices by the at least two first detection units for the substrate placed on the first stage as the first substrate, and then moves the substrate to the second stage. 11. The apparatus according to claim 1, wherein the second substrate is transferred as a second substrate, and the second detector detects positions using the indicators used as the plurality of first indicators as the second indicators. Position detection device. A plurality of the second detectors;
The control calculation unit is configured to select a selection index selected based on a predetermined criterion from among the plurality of first indices acquired by the first detection unit, the specific second of the plurality of second detection units. The position detection device according to claim 11, wherein the position is confirmed by a detection unit.   Each of the plurality of first detection units is sequentially arranged in the detection region of each first detection unit in conjunction with the movement of the first stage in a direction parallel to the first axis. The position detection device according to any one of claims 1 to 12, wherein the plurality of first indexes arranged along a direction parallel to an axis is detected.   The board | substrate bonding apparatus provided with the position detection apparatus of any one of Claim 1 to 13. A first placing step of placing the first substrate on the first stage;
A first detection step that is arranged opposite to the first stage and detects a plurality of first indicators provided on the first substrate by a plurality of first detection units;
A first adjustment step of adjusting an interval between at least two first detection units of the plurality of first detection units by an adjustment mechanism;
A second placing step of placing a second substrate provided with a second index on a second stage disposed opposite to the first stage;
A second detection step that is arranged to face the second stage and detects the second index by at least one second detection unit;
A second adjustment step of adjusting the at least two first detection units so as to detect each of the first indices to be detected among the plurality of first indices at the optical axis center;
The positions of the plurality of first indexes detected by the first detection unit whose positions relative to the interval and the first index are adjusted by the adjustment mechanism are calculated, and the second detected by the second detection unit is calculated. A position detection method including an arithmetic control step of calculating a position of the index.   The position detection method according to claim 15, wherein in the calculation control step, at least one of the plurality of first detection units and the second detection unit are opposed to each other, and optical axis adjustment between the opposed detection units is performed.   17. The optical control is performed according to claim 16, wherein the calculation control step performs the optical axis adjustment based on an adjustment index provided on at least one focal plane of the plurality of first detection units or a focal plane of the second detection unit. Position detection method.   The position detection method according to claim 17, wherein the adjustment index advances and retreats with respect to the observation visual field of the plurality of first detection units or the observation visual field of the second detection unit.   The calculation control step projects an adjustment index used for the optical axis adjustment onto a diffusion plate installed on at least one focal plane of the plurality of first detection units or a focal plane of the second detection unit. 16. The position detection method according to 16.   The position detection method according to claim 19, wherein the diffusion plate advances and retreats with respect to at least one observation field of view of the plurality of first detection units or an observation field of view of the second detection unit.   21. The position detection method according to claim 15, wherein in the adjustment step, at least one of the plurality of first detection units is not adjusted by the adjustment mechanism.   The position detecting method according to any one of claims 15 to 21, further comprising a moving step of moving the first stage at least in the direction of the mounting surface of the first substrate by a moving mechanism.   The position detection method according to claim 22, wherein the plurality of first detection units are arranged in a direction orthogonal to a moving direction of the first substrate by the moving mechanism.   In the calculation control step, the at least two first detection units acquire image information of the first substrate placed on the first stage moved by the moving mechanism, and the plurality of the plurality of the plurality of pieces of image information are obtained based on the image information. After the adjustment by the adjustment mechanism so that at least one of the first detection units can acquire at least one first index of the plurality of first indices at the optical axis center, the first detection unit is moved again by the movement mechanism. 24. The position detection method according to claim 23, wherein the image information of the first substrate placed on one stage is acquired and the position of the first index is calculated.   The calculation control step calculates the positions of the plurality of first indices by the at least two first detection units for the substrate placed on the first stage as the first substrate, and then moves the substrate to the second stage. The transfer according to any one of claims 15 to 24, wherein the second substrate is transferred as a second substrate, and the second detection unit confirms the position using the plurality of first indicators as the second indicators. Position detection method. A plurality of the second detectors;
In the calculation control step, a selection index selected based on a predetermined criterion among the plurality of first indexes acquired by the at least two first detection units is specified among the plurality of second detection units. The position detection method according to claim 25, wherein the position is confirmed by the second detection unit.   When the first stage is moved in the first direction to detect an index having a different position in the first direction on the first substrate, a detection region having a different position in a second direction different from the first direction The position detection method according to claim 15, further comprising a detection step of detecting a different number of indices according to the position of the first substrate in the first direction using the at least two first detection units having the following.   28. The detection step according to claim 27, wherein a plurality of indices having substantially the same position in the second direction on the first substrate moved in the first direction are detected by one of the plurality of detection regions. Position detection method.   In the detection step, the relative positions of the plurality of detection regions in the second direction according to the positions of the plurality of first indicators on the first substrate moved in the first direction in the second direction. 29. The position detection method according to claim 27 or 28, wherein: Placing a substrate on which indicators are respectively formed at a plurality of different positions on a stage that moves in a predetermined plane including a first axis and a second axis that intersects the first axis; and
A step of simultaneously detecting indices at different positions on the substrate using a plurality of detection units arranged at different positions in a detection region in a direction parallel to the second axis;
Adjusting the plurality of detection units so as to detect each of the plurality of different indexes at the center of the optical axis ,
A substrate bonding method in which the number of indicators on the substrate that are simultaneously detected by the plurality of detection units differs depending on the position of the stage in the plane. A first step of placing the substrate on a stage movable in first and second directions within a predetermined plane;
When the stage is moved in the first direction to detect an index having a different position in the first direction on the substrate, a detection unit having a detection region having a position different in the second direction is used. A second step of detecting a different number of indices depending on the position of the substrate in the first direction ;
A substrate bonding method comprising: a third step of adjusting the detection unit so as to detect each of the indexes having different positions in the first direction at the optical axis center .   32. The substrate according to claim 31, wherein the detection unit detects a plurality of indexes whose positions in the second direction are substantially the same on the substrate moved in the first direction, in one of the plurality of detection regions. Pasting method.   The said detection part adjusts the relative position of the said 2nd direction of several said detection area according to the position of the said 2nd direction of the said parameter | index on the said board | substrate moved to the said 1st direction. The substrate bonding method according to 31 or 32. A device manufacturing method manufactured by stacking a plurality of substrates,
The step of superimposing the plurality of substrates includes:
A first placement step of placing a first substrate provided with a plurality of first indicators on a first stage;
A first adjustment step that is arranged to face the first stage and adjusts the interval between the observers of at least two first detection units among the plurality of first detection units;
A second adjustment step of adjusting the at least two first detection units so as to detect each of the first indices to be detected among the plurality of first indices at the optical axis center;
A first calculation step of calculating positions of the plurality of first indices on the first substrate by the plurality of first detection units;
A second placing step of placing a second substrate on a second stage disposed opposite the first stage;
A second calculation step that is arranged opposite to the second stage and calculates a position of a second index of the second substrate by at least one second detection unit; and the plurality of the calculation points calculated by the first calculation step A device manufacturing method including a position of a first index and a stacking step of superimposing the first substrate and the second substrate based on the position of the second index calculated in the second calculation step. The first stage moves in a predetermined plane including a first axis and a second axis intersecting the first axis;
Using the at least two first detection units arranged in different positions with respect to the direction parallel to the second axis, and simultaneously detecting indices at different positions on the first substrate,
35. The device manufacturing method according to claim 34, wherein the number of indices on the first substrate that are simultaneously detected by the first detection unit varies depending on a position of the first stage in the plane. The first stage moves in first and second directions within a predetermined plane;
When the first stage is moved in the first direction to detect an index having a different position in the first direction on the first substrate, the first stage has a detection region having a position different in the second direction. 35. The device manufacturing method according to claim 34, further comprising a detection step of detecting a different number of indices depending on the position of the first substrate in the first direction using a detection unit.   37. The detection step according to claim 36, wherein a plurality of indices having substantially the same position in the second direction on the first substrate moved in the first direction are detected by one of the plurality of detection regions. Device manufacturing method.   In the detection step, the relative positions of the plurality of detection regions in the second direction according to the positions of the plurality of first indicators on the first substrate moved in the first direction in the second direction. 38. The device manufacturing method according to claim 36 or 37, wherein:

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