JP5569192B2 - Substrate overlay apparatus and device manufacturing method - Google Patents

Description

  The present invention relates to a substrate overlaying apparatus and a device manufacturing method.

There is a stage apparatus in which a substrate is held on each of a pair of opposing stages while being relatively moved and aligned, and further, the substrate is brought into contact with each other (see Patent Document 1).
[Prior art documents]
[Patent Literature]
[Patent Document 1] JP 2009-260039 A

  If the pair of stages are shifted in a direction crossing the facing direction, the front of the mounting surface of each stage becomes wide and the substrate can be easily mounted. However, since the moving distance of the stage required for the superposition of the substrates becomes long, the time required for the superposition of the substrates also becomes long.

  In order to solve the above problems, as a first aspect of the present invention, a first table for holding a first substrate, a second table for holding a second substrate in a direction facing the first substrate, a first table, A moving unit that moves at least one of the two tables; and a control unit that controls the moving unit. The control unit includes a first substrate and a second substrate in a facing direction that is a facing direction and a plane direction orthogonal to the facing direction. There is provided a substrate overlaying apparatus that generates a transport path including an intersecting path that intersects the facing direction between an initial position where the first substrate and the second substrate overlap each other, and a position where the first substrate and the second substrate overlap each other.

  According to a second aspect of the present invention, there is provided a device manufacturing method manufactured by superimposing a plurality of substrates, wherein the first substrate held on the first table and the second substrate facing in the direction facing the first substrate. The step of overlaying the second substrate held on the table includes an initial direction shifted from each other in a facing direction that is a facing direction and a surface direction orthogonal to the facing direction, and a position in which the first substrate and the second substrate overlap each other. A device manufacturing method is provided that includes a moving step of moving at least one of the first table and the second table along a conveyance path including a crossing path that intersects the opposing direction.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

1 is a schematic horizontal sectional view of an entire laminated substrate manufacturing apparatus 100. FIG. 5 is a perspective view of a substrate holder 104. FIG. It is a typical longitudinal cross-sectional view of the superimposition apparatus. It is a typical longitudinal cross-sectional view of the superimposition apparatus. 5 is a flowchart showing a control procedure of the superposition apparatus 130. FIG. 6 is a diagram schematically illustrating a conveyance path for a substrate. FIG. 6 is a diagram schematically illustrating a conveyance path for a substrate. It is a figure which shows the state of the board | substrate 102. FIG. It is a figure which shows the state transition of the board | substrate 102. FIG. It is a figure which shows the state transition of the board | substrate 102. FIG. It is a figure which shows the state transition of the board | substrate 102. FIG. It is a figure which shows typically the other conveyance path | route of the board | substrate 102. FIG. It is a figure which shows typically the other conveyance path | route of the board | substrate 102. FIG.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a schematic horizontal sectional view of the multilayer substrate manufacturing apparatus 100. The multilayer substrate manufacturing apparatus 100 is mainly formed inside a housing 110 having a room temperature part 98 and a high temperature part 99 partitioned by a heat insulating wall 112.

  In the room temperature section 98, an atmospheric loader 120, an overlay device 130, a substrate pre-aligner 142, a holder pre-aligner 144, and a holder stocker 146 are arranged. In the high temperature part 99, an environmental loader 160, a pressure device 170, and a cooling device 180 are arranged. The room temperature portion 98 and the high temperature portion 99 are coupled via a load lock 150.

  The inside of the room temperature portion 98 is in the same atmospheric environment as the outside of the housing 110 and is maintained at room temperature. In the room temperature portion 98, a plurality of front opening unified pods (FOUPs) 116 are attached to the outer surface of the casing 110 from the outside. The FOUP 116 can be individually removed from the housing 110. A plurality of substrates 102 are accommodated in each FOUP 116.

  Therefore, by mounting the FOUP 116 on the multilayer substrate manufacturing apparatus 100, a plurality of substrates 102 can be loaded into the multilayer substrate manufacturing apparatus 100 at once. In addition, the laminated substrate 108 formed by bonding the substrates 102 is collected by the FOUP 116 and carried out collectively.

  Further, a control panel 114 is disposed on the outer surface of the housing 110. The control panel 114 controls the operation of each part of the multilayer substrate manufacturing apparatus 100 in an integrated manner. Moreover, it becomes an operation part when operating the multilayer substrate manufacturing apparatus 100. Further, the control panel 114 also serves as a display unit that displays the operation state of the multilayer substrate manufacturing apparatus 100.

  An atmospheric loader 120 is disposed at a position facing the FOUP 116 inside the room temperature unit 98. The atmospheric loader 120 has a fork 122, a support arm 124 and a folding arm 126. The fork 122 is supported by the support arm 124 and advances and retreats according to the expansion and contraction of the support arm 124. The atmospheric loader 120 moves along a guide rail 121 arranged on the bottom surface of the multilayer substrate manufacturing apparatus 100.

  The atmospheric loader 120 can move the fork 122 by expanding and contracting the folding arm 126 while moving along the guide rail 121. As a result, the atmospheric loader 120 has at least the substrate 102 and the substrate holder 104 between the FOUP 116, the stacking device 130, the substrate pre-aligner 142, the holder pre-aligner 144, the holder stocker 146, and the load lock 150 that are arranged around the atmosphere loader 120. Transport one side.

  The substrate pre-aligner 142 carries the substrates 102 taken out from the FOUP 116 one by one by the atmospheric loader 120. The substrate pre-aligner 142 rotates or moves the loaded substrate 102 and then remounts it on the atmospheric loader 120 to adjust the mounting position of the substrate 102 with respect to the atmospheric loader 120 and the orientation of the notch with respect to the atmospheric loader 120.

  Thus, the substrate 102 is aligned with a certain accuracy with respect to the fork 122 of the atmospheric loader 120. Therefore, when the substrate 102 is mounted on the substrate holder 104 as will be described later, an extremely large positional shift is prevented.

  The holder pre-aligner 144 carries the substrate holders 104 taken out from the holder stocker 146 one by one by the atmospheric loader 120. The holder pre-aligner 144 places the carried-in substrate holder 104 at a predetermined position. Thereby, when the pre-aligned substrate 102 is carried in, the relative positions of the substrate 102 and the substrate holder 104 can be aligned with a certain accuracy.

  The holder stocker 146 accommodates a plurality of substrate holders 104 and makes them stand by. Each of the substrate holders 104 is made of a highly rigid material such as ceramics or metal, and has a flat holding surface wider than the area of the substrate 102. The substrate holder 104 has a substrate holding mechanism such as an electrostatic chuck or a vacuum chuck that attracts the substrate 102 to the holding surface.

  Thus, the substrate holder 104 holds the substrates 102 one by one to protect the fragile substrate 102 and facilitates handling of the substrate 102 in the multilayer substrate manufacturing apparatus 100. Note that the substrate holder 104 is not taken out of the multilayer substrate manufacturing apparatus 100 at least during the period when the multilayer substrate manufacturing apparatus 100 is operating.

  The overlapping device 130 has a lower stage 134 and an upper stage 136 supported by a rigid frame 132. The upper stage 136 is fixed downward on the top surface of the frame 132. The lower stage 134 is supported from the bottom surface of the frame 132 via the drive unit 131. The drive unit 131 translates the lower stage 134 in each direction indicated by arrows X, Y, and Z in the drawing. Further, the lower stage 134 is swung with respect to a horizontal plane by another driving unit, and also rotates around a vertical rotation axis.

  Note that the frame 132 is supported from the bottom surface of the housing 110 via the anti-vibration legs 138. Thereby, the influence which the vibration produced by operation | movement of the atmospheric | air loader 120, the load lock 150, the environmental loader 160, the pressurization apparatus 170, etc. has on the alignment accuracy of the superimposition apparatus 130 is suppressed. In addition, the room temperature portion 98 is temperature-controlled in the housing 110, and is kept at room temperature, for example. Thereby, the alignment accuracy of the overlay device 130 is maintained.

  The substrate holder 104 holding the substrate 102 mounted on the holder pre-aligner 144 is carried into the overlaying device 130 by the atmospheric loader 120. In the superimposing apparatus 130, the substrate holders 104 each holding the substrate 102 are mounted on the lower stage 134 and the upper stage 136. Thereby, in the superimposing apparatus 130, the pair of substrates 102 and the substrate holder 104 face each other.

  The overlaying device 130 aligns the pair of substrates 102 with each other by translating, rotating, or swinging the lower stage 134. The aligned pair of substrates 102 is sandwiched and temporarily joined between the pair of substrate holders 104 between the lower stage 134 and the upper stage 136. The pair of substrates 102 that have been aligned and temporarily joined together with the pair of substrate holders 104 sandwiching the substrate 102 are conveyed again to the atmospheric loader 120 and carried into the load lock 150.

  The load lock 150 includes shutters 152 and 154 that open and close individually on the room temperature portion 98 side in the atmospheric pressure environment and the high temperature portion 99 side in the vacuum environment. The shutters 152 and 154 hermetically shield between the room temperature portion 98 and the load lock 150 and between the high temperature portion 99 and the load lock 150, respectively. The interior of the load lock 150 can be evacuated to a vacuum environment, or the atmosphere can be returned to an atmospheric pressure environment. Thus, the substrate 102 and the substrate holder 104 can be transferred between the room temperature portion 98 and the high temperature portion 99 while maintaining the atmospheric pressure environment of the room temperature portion 98 and the vacuum environment of the high temperature portion 99, respectively.

  An environmental loader 160 is disposed substantially at the center of the high temperature part 99. The environment loader 160 includes forks 162 and 262, arms 164 and 264, a common support portion 168 and a folding arm 166.

  The pair of forks 162 and 262 are supported in common on one end of the folding arm 166 via a common support portion 168. The other end of the folding arm 166 is supported to be rotatable with respect to the housing 110. With such a structure, the environmental loader 160 can transport the stacked body 106 between the load lock 150, the pressurizing device 170, and the cooling device 180 arranged around the environment loader 150.

  The environmental loader 160 conveys the stacked body 106 including the pair of temporarily bonded substrates 102 and the pair of substrate holders 104 that sandwich the substrate 102. For this reason, the environmental loader 160 has a greater load resistance as compared with the atmospheric loader 120 in which the laminate 106 is transported within a short distance from the stacking device 130 to the load lock 150.

  In the high temperature part 99, a load lock 150, a plurality of pressure devices 170, and a cooling device 180 are arranged around the environment loader 160. Further, the load lock 150, the pressure device 170, and the cooling device 180 are airtightly connected to each other by an airtight wall 156. Further, the interior of the hermetic wall 156 is coupled to a vacuum pump 118.

  The pressure device 170 has a pair of heating plates. Moreover, it has a drive part which advances and retracts one of a pair of heating plates toward the other. Therefore, the laminated body 106 can be pressurized by operating the drive unit with the laminated body 106 sandwiched between the heating plates.

  Note that the pressure device 170 can heat-bond the pair of substrates 102 by operating the heating plate. In this case, a cooling device is attached to the pressurizing device 170 for the purpose of returning the temperature of the pressurizing device 170 itself to the initial state after the pair of substrates 102 are bonded and before the next stacked body 106 is inserted. It may be provided.

  The cooling device 180 includes a cooling plate through which a refrigerant flows, and rapidly cools the accommodated stacked body 106. Thereby, the laminated body 106 carried out from the high temperature part 99 to the room temperature part 98 is rapidly returned to room temperature, and temperature management of the room temperature part 98 is made easy.

  FIG. 2 is a perspective view showing the pair of substrate holders 104. A lower substrate holder 104 holds the substrate 102. The substrate 102 has a disk shape with a part cut off by the notch 202, and has a plurality of alignment marks 204 and element regions 206 on the surface.

  The notch 202 is formed corresponding to the crystal orientation of the substrate 102 or the like. Therefore, when the substrate 102 is handled, the direction of the substrate 102 can be known using the notch 202 as an index.

  A plurality of element regions 206 are arranged on the surface of the substrate 102. In each of the element regions 206, an element formed by processing the substrate 102 and some connection terminal for the element are arranged. When a plurality of substrates 102 are stacked, these terminals are electrically coupled to each other, so that a large-scale element that conducts between the plurality of stacked substrates 102 is formed. In other words, when the substrates 102 are overlapped, fine terminals included in the element region 206 are aligned with each other.

  The alignment mark 204 is formed together with the element region 206 when the element region 206 is formed on the substrate 102. For this reason, alignment with the element region 206 can be performed by aligning the alignment mark 204.

  In the drawing, the element regions 206 and the alignment marks 204 are drawn large. For example, the number of the element regions 206 formed on the substrate 102 of 300 mmφ may reach several hundreds or more. Accordingly, the number of alignment marks 204 arranged on one substrate 102 increases.

  The cross-shaped alignment mark 204 shown in the figure is merely an example, and the alignment mark 204 is formed in various shapes. Further, a wiring pattern or the like formed in the element region 206 may be used as the alignment mark 204.

  By the way, the element region 206 is finally cut and used individually. For this reason, scribe lines that are cut off when the substrate 102 is divided are arranged in the gaps between the element regions 206 as shown by dotted lines in the drawing.

  Many of the alignment marks 204 are arranged between the element regions 206. For this reason, the alignment mark 204 may overlap the scribe line. In this case, the alignment mark 204 disappears simultaneously with the division of the element region 206.

  The substrate holder 104 is formed in a disk shape as a whole and has a flat holding surface for holding the substrate 102 in the center. The substrate holder 104 has a flange portion 109 adjacent to the outer periphery of the holding surface. A plurality of permanent magnets 101 or magnetic members 103 are arranged on the flange portion 109.

  The substrate holder 104 can connect the pair of substrate holders 104 by attracting the permanent magnet 101 and the magnetic member 103 to each other. That is, the substrate holder 104 is used as a set of two, combining the one having the permanent magnet 101 and the one having the magnetic member 103.

  A plurality of contacts 105 are arranged on the back surface of the substrate holder 104. The contact 105 forms a common surface with the lower surface of the substrate holder 104 and is connected to an internal electrode embedded in the substrate holder 104. Thus, the substrate 102 can be electrostatically attracted and held by applying a voltage to the internal electrode via the contact 105.

  In some cases, a plurality of internal electrodes are provided on one substrate holder 104. In that case, a plurality of contacts 105 are also provided corresponding to the internal electrodes. The substrate holder 104 is integrally formed of a highly rigid material such as ceramics or metal, but is insulated from at least the contact 105.

  3 and 4 are schematic longitudinal sectional views of the superimposing apparatus 130. FIG. 3 shows a state immediately after the pair of substrates 102 is loaded, and FIG. 4 shows a state after the pair of substrates are overlaid.

  The superimposing device 130 includes a frame 132, a drive unit 131, a lower stage 134, and an upper stage 136 disposed inside the frame 132. The frame 132 is formed of a highly rigid material, and does not deform even when a reaction force due to the operation of the overlapping device 130 is applied.

  The upper stage 136 is suspended from the ceiling surface of the frame 132 together with the microscope 247. The upper stage 136 and the microscope 247 are fixed with respect to the frame 132 and do not move. Therefore, the relative positions of the upper stage 136 and the microscope 247 do not change.

  The upper stage 136 has a suction mechanism by vacuum suction, electrostatic suction or the like on the downward mounting surface. Thereby, the substrate holder 104 in contact with the upper stage 136 can be held.

  The upper stage 136 is equipped with a reflecting mirror 249. The reflecting mirror 249 is fixed with respect to the upper stage 136 and reflects light emitted from an interferometer (not shown). Thereby, the position of another measuring object can be detected using the interferometer with reference to the position of the upper stage 136.

  Further, a plurality of load cells 241 are sandwiched between the upper stage 136 and the frame 132. Thereby, when the substrate 102 held on the upper stage 136 is pushed up, the load applied to the substrate 102 can be detected. In addition, when the detection values of the plurality of load cells 241 are different from each other, it can be seen that a biased load is applied to the substrate 102.

  A lower stage 134 mounted on the driving unit 131 is disposed on the bottom surface of the frame 132. The drive unit 131 includes an X-direction actuator 236, a Y-direction actuator 234, and a Z-direction actuator 232 that are sequentially stacked from the bottom surface of the frame 132.

  The X-direction actuator 236 moves in a direction indicated by an arrow X in the drawing while being guided by a guide rail 238 fixed on the bottom surface of the frame 132. The Y-direction actuator 234 moves in the Y direction orthogonal to the X direction indicated by the arrow Y in the figure while being conveyed in the X direction by the X direction actuator 236. The Z-direction actuator 232 moves in the vertical direction as indicated by an arrow Z in the figure while being conveyed in the Y-direction by the Y-direction actuator 234.

By such a drive unit 131, the lower stage 134 is movable in the horizontal direction including the X direction and the Y direction, and in the vertical direction that is the Z direction. Moreover, by operating the other actuator not shown, the lower stage 134 is swung in the theta _X direction and theta _Y direction center of the spherical seat 231 as a swing axis.

  The Z-direction actuator 232 supports the lower stage 134 via the spherical seat 231. The lower stage 134 swings on the spherical seat 231 by an actuator (not shown). Therefore, the lower stage 134 moves in the X direction, the Y direction, and the Z direction while maintaining the inclination determined by the swing. Further, as the lower stage 134 moves, the substrate 102 is transported in each direction.

The lower stage 134, by the rotational driving unit, not shown, rotates in the theta _Z direction around a vertical rotary axis. Accordingly, the lower stage 134 can acquire six degrees of freedom and move the mounted substrate 102 to an arbitrary target position and target posture.

  The mounting surface of the lower stage 134 has a suction mechanism such as vacuum suction or electrostatic suction, and sucks and holds the substrate holder 104. This prevents the mounted substrate holder 104 from being displaced on the lower stage 134.

  The lower stage 134 is equipped with a microscope 237 and a reflecting mirror 239. Since the microscope 237 and the reflecting mirror 239 move together with the lower stage 134, the relative positions of the lower stage 134, the microscope 237, and the reflecting mirror 239 do not change.

  The reflecting mirror 239 is used when measuring the position of the lower stage 134 by reflecting the irradiation light of an interferometer (not shown). The reflecting mirror 239 is used when detecting the amount of movement when the lower stage 134 moves.

  As shown in FIG. 3, the overlapping device 130 as described above is located above the lower stage 134 or below the upper stage 136 in a state where the lower stage 134 and the upper stage 136 are shifted in the horizontal direction orthogonal to the opposing direction. A large space is open. Therefore, the substrate holder 104 holding the substrate 102 can be easily mounted on each of the lower stage 134 and the upper stage 136.

  Further, by moving the lower stage 134 by the driving unit 131 and raising the lower stage 134 at a position facing the upper stage 136, the substrates 102 can be brought into contact with each other and overlapped. The movement of the lower stage 134 is executed under the control of the control unit 220.

  That is, the control unit 220 measures the positional deviation between the pair of substrates 102 mounted on the lower stage 134 and the upper stage 136, as will be described later. Further, the control unit 220 includes a calculation unit 222 that calculates a conveyance path of the lower stage 134 that eliminates the positional deviation.

  Therefore, the control unit 220 controls the drive unit 131 along the conveyance path calculated by the calculation unit 222 to move the lower stage 134. Note that the control unit 220 may be individually mounted on the superimposing apparatus 130 itself. Further, it may be mounted as a part of the control panel 114 of the entire multilayer substrate manufacturing apparatus 100.

FIG. 5 is a flowchart illustrating a control procedure of the control unit 220 in the superimposing apparatus 130.
The superimposing device 130 is loaded with a pair of substrates 102 each held by the substrate holder 104. The loaded substrate 102 is mounted on the lower stage 134 and the upper stage 136, respectively, and control by the control unit 220 is started.

  First, the control unit 220 swings the lower stage 134 around the spherical seat 231 to level the surface of the substrate 102 mounted on the lower stage 134 (step S101). As a result, the microscope 247 described later can observe the surface of the substrate 102 mounted on the lower stage 134 within the depth of field.

  Next, the control unit 220 operates the X direction actuator 236 and the Y direction actuator 234 to move the substrate 102 horizontally, and moves the substrate 102 to the lower stage 134 by the upper microscope 247 fixed to the frame 132 together with the upper stage 136. The alignment mark 204 of the mounted substrate 102 is observed (step S102). Thereby, the control unit 220 can measure the position of the alignment mark 204 of the substrate 102 mounted on the lower stage 134.

  Subsequently, the control unit 220 operates the X-direction actuator 236 and the Y-direction actuator 234 to move the lower stage 134 horizontally, while using the lower microscope 237 mounted on the Z-direction actuator 232 together with the lower stage 134. The alignment mark 204 of the substrate 102 held on the upper stage 136 is observed (step S103). Thereby, the control unit 220 can measure the position of the alignment mark 204 of the substrate 102 mounted on the upper stage 136.

  The control unit 220 can know the position of the alignment mark 204 arranged on each substrate 102 by observation with the microscopes 237 and 247. Since the relative position with respect to the lower stage 134 of the microscope 237 and the relative position with respect to the upper stage 136 of the microscope 247 are known and do not change, the control unit 220 aligns the upper and lower substrates 102 based on the measurement result. The opposite position is calculated by the calculation unit 222 (step S104). Here, the facing position means the position of the alignment mark 204 of the pair of upper and lower substrates 102 and the position of the lower stage 134 when aligned in the horizontal direction.

  However, when the pair of substrates 102 is aligned, it is rare that all the positions of the plurality of alignment marks 204 formed on each of the substrates 102 are accurately matched. Therefore, the calculation unit 222 calculates a position where the positional deviation of the plurality of alignment marks 204 is statistically minimized over the entire substrate 102 as the opposing position. Thereby, even if the alignment mark 204 remains displaced, the conduction of the elements of the pair of substrates 102 is ensured.

  Next, the control unit 220 causes the calculation unit 222 to calculate a transport path for moving the lower stage 134 to the facing position (step S105). That is, the conveyance path means a path that is followed while the lower stage 134 that is shifted in the horizontal direction with respect to the upper stage 136 moves to a position facing the upper stage 136.

  FIG. 6 is a diagram schematically illustrating the conveyance path of the lower stage 134 in step 106. That is, the control unit 220 moves the substrate 102 and the substrate holder 104 at the initial position I to the facing position D by moving the lower stage 134 along the conveyance path calculated by the calculation unit 222 (step S106). .

  The control unit 220 moves the lower stage 134 at the initial position I in the X direction by the X direction actuator 236, in the Y direction by the Y direction actuator 234, and in the Z direction by the Z direction actuator 232. However, as indicated by the dotted line A in the figure, when the movement is sequentially performed in the X direction, the Y direction, and the Z direction, the moving distance of the lower stage 134 becomes long and the moving time becomes long.

Therefore, the calculation unit 222 calculates, for example, a conveyance path for operating the X direction actuator 236, the Y direction actuator 234, and the Z direction actuator 232 at the same time. Thus, as indicated by a dotted line B ₁ in the figure, the initial lower stage 134 starts to move is, X direction, moving Y and Z directions simultaneously. Therefore, the transport path of the lower stage 134 is shortened obliquely with respect to the Z direction, which is the facing direction of the substrate 102, and the time required for movement is also shortened.

  Note that the movement amounts of the lower stage 134 in the X direction, the Y direction, and the Z direction are not necessarily equal to each other. In the illustrated example, the movement of the lower stage 134 in the Y direction and the Z direction ends first, and immediately before the facing position D, it moves in the X direction. Therefore, although the conveyance path has changed direction at least once, the lower stage 134 can move at the maximum movement speed in each of the X direction, the Y direction, and the Z direction.

Further, as shown by the dotted line B ₂ in the figure, as the change in acceleration in accordance with movement of the lower stage 134 in the continuously conveying path under the stage 134 from the initial position I to the opposite position D is a curve It may be moved. Thereby, the change of the inertia force which acts on the board | substrate 102 and the board | substrate holder 104 decreases, and the position shift with respect to the board | substrate holder 104 of the board | substrate 102 is prevented.

Furthermore, the calculation unit 222, as indicated by a dotted line C ₁ in the figure, may be calculated transport path to follow the shortest distance from the initial position I to the opposite position D is the target. In this case, the control unit 220 also controls the movement speed of the lower stage 134 so that the movement amounts obtained individually in the X direction, the Y direction, and the Z direction move in the same time. As a result, the dotted line C ₁ indicating the transport path moves on the single plane P up to the facing position D. In this way, the lower stage 134 can move from the initial position I to the facing position D with the shortest distance to shorten the movement time.

  As described above, the control unit 220 moves the lower stage 134 along the transport path calculated by the calculation unit 222. As a result, the substrate 102 mounted on the lower stage 134 is quickly transported to the facing position D. When the lower stage 134 moves to the facing position D, the corresponding alignment marks 204 are aligned with each other on the pair of substrates 102 facing each other.

  Referring to FIG. 5 again, next, the control unit 220 operates the Z-direction actuator 232 to raise the lower stage 134 toward the contact position F (step S107). That is, the facing position D is a position where the pair of substrates 102 are opposed to each other with a predetermined distance apart, and is not a position where the pair of substrates 102 is in contact with each other. When the lower stage 134 rises without being displaced horizontally in step S107, the substrate 102 transported to the lower stage 134 eventually comes into contact with the substrate 102 held by the upper stage 136.

  Here, when the pair of substrates 102 that are in contact with each other is not parallel to the moment of contact, contact of the edge of one of the substrates 102 with the surface of the other substrate occurs. When the one-side contact occurs, the substrate 102 having an impact on the edge may be chipped. Further, the surface of the substrate 102 with which the edge abuts may be damaged.

  Therefore, immediately before the pair of substrates 102 abut, it is preferable to reduce the rising speed of the lower stage 134 to prevent a large impact from occurring. Therefore, the control unit 220 executes transport control different from step S106 in step S107.

  FIG. 7 is a diagram schematically showing a transport path on the plane P of the substrate 102 in step S107. In step S106, since the pair of substrates 102 has already been aligned in the X direction and the Y direction, in step S107, the lower stage 134 moves exclusively in the Z direction as shown in the figure.

  As already described, the substrate 102 transferred to the lower stage 134 is horizontally adjusted by the swinging of the lower stage 134. Therefore, the pair of substrates 102 are overlapped without causing a single contact. However, there is a case where the minute inclinations of each of the pair of substrates 102 are overlapped to cause the pair of substrates 102 to hit each other.

  Therefore, referring to FIG. 5 again, the control unit 220 monitors the individual detection values of the load cell 241 and determines whether or not a collision has occurred (step S108). That is, when an equal pressure is detected from the plurality of load cells 241, the control unit 220 determines that the pair of substrates 102 are in contact with each other in a parallel state, and no contact occurs (step S108: NO). .

  Therefore, the control unit 220 continues to raise the lower stage 134. Therefore, the control unit 220 further raises the lower stage 134 to bring the pair of substrates 102 into close contact with each other. Further, the driving force of the Z-direction actuator 232 is increased to temporarily bond the pair of substrates 102 (step S109).

  On the other hand, when the detection values of the plurality of load cells 241 are different from each other, the control unit 220 determines that the pair of substrates 102 are not completely parallel and that one-side contact has occurred (step S108: YES). In this case, the controller 220 first lowers the lower stage 134 to separate the pair of substrates 102 (step S110). Next, the control unit 220 swings the lower stage 134 to make the pair of substrates 102 parallel to each other (step S111).

  Thereafter, the control unit 220 raises the lower stage 134 again (step S107). Thereafter, the control unit 220 repeats the steps S107, S108, S110, and S111 until the pair of substrates 102 come into contact with each other without contacting each other. Thus, the conveyance control different from the facing position D to the facing position D is executed.

  In the multilayer substrate manufacturing apparatus 100, the temporarily bonded substrate 102 is separately pressurized by the pressurizing device 170 to become the permanently bonded multilayer substrate 108. Therefore, in the above steps S104 and S105, the throughput when the laminated substrate 108 is manufactured can be improved by rapidly transporting the substrate 102 to the facing position D.

  8, 9, 10, and 11 are diagrams showing the transition of the state of the substrate 102 in the multilayer substrate manufacturing apparatus 100. Hereinafter, the operation of the multilayer substrate manufacturing apparatus 100 will be described with reference to FIGS. 8, 9, 10, and 11.

  First, the substrate 102 to be joined is accommodated in the FOUP 116 and loaded into the multilayer substrate manufacturing apparatus 100. The substrates 102 used for bonding may have the same specifications or different specifications. In some cases, the substrate 102 itself used for bonding has a laminated structure already formed by bonding.

  In the multilayer substrate manufacturing apparatus 100, first, the atmospheric loader 120 unloads the substrate holder 104 from the holder stocker 146 and loads it into the holder pre-aligner 144. In the holder pre-aligner 144, the substrate holder 104 is guided by, for example, a guide member or the like and placed at a predetermined position.

  Next, the atmospheric loader 120 carries the substrate 102 out of the FOUP 116 and carries it to the substrate pre-aligner 142. The substrate pre-aligner 142 corrects the mounting direction and mounting position of the substrate 102 with respect to the atmospheric loader 120 using the notch or the like formed in the substrate 102 as an index. Further, the atmospheric loader 120 conveys the substrate 102 to the holder pre-aligner 144.

  The atmospheric loader 120 holds the substrate 102 against the substrate holder 104 placed at a predetermined position in the holder pre-aligner 144. The substrate holder 104 holds the substrate 102 by a holding mechanism such as an electrostatic chuck. Thus, as shown in FIG. 8, the substrate holder 104 holding the substrate 102 is prepared. At least two sets of substrate holders 104 holding the substrate 102 are prepared.

  Subsequently, the atmospheric loader 120 sequentially transports the substrate holders 104 each holding the substrate 102 to the stacking apparatus 130. For example, the substrate holder 104 transported first is reversed by the atmospheric loader 120 and held on the upper stage 136.

  Further, the substrate holder 104 loaded next is held on the lower stage 134 in the same direction. As shown in FIG. 9, the substrates 102 held by these substrate holders 104 are temporarily aligned and aligned with each other by an overlapping device 130 to form a laminated body 106.

  Since the pair of substrates 102 temporarily bonded in the superimposing apparatus 130 is not yet bonded, the permanent magnet 101 and the magnetic member 103 of the substrate holder 104 are attracted to each other as shown in FIG. The holders 104 are coupled to each other. As a result, the pair of substrates 102 is sandwiched between the pair of coupled substrate holders 104, aligned, and the state is preserved.

  Next, the atmospheric loader 120 unloads the stacked body 106 from the stacking device 130 and loads it into the load lock 150. At this time, the shutter 154 is closed, and the inside of the load lock 150 is cut off from the vacuum environment of the high temperature part 99.

  Next, in a state where the laminated body 106 is placed in the load lock 150, the shutter 152 is also closed to seal the load lock 150 in an airtight manner. In this state, the interior of the load lock 150 is evacuated to create a vacuum environment. Subsequently, the shutter 154 is opened, and the load lock 150 is communicated with the vacuum environment in the high temperature part 99. Thereby, the environment loader 160 can carry out the laminated body 106 from a load lock.

  Next, the environmental loader 160 carries the laminated body 106 into one of the pressure devices 170. The pressurizer 170 heats and pressurizes the laminate 106 to permanently bond the substrate 102. Thus, the pair of substrates 102 becomes a laminated substrate 108 as shown in FIG.

  Next, the environment loader 160 unloads the stacked body 106 from the pressurizing device 170 and loads it into the cooling device 180. In the cooling device 180, the stacked body 106 is cooled to room temperature. The cooled laminated body 106 is again carried into the load lock 150 by the environmental loader 160.

  The load lock 150 loaded with the laminated body 106 closes the shutter 154 on the high temperature part 99 side, returns the inside of the load lock 150 to atmospheric pressure, and then opens the shutter on the room temperature part 98 side. Thereby, the atmospheric loader 120 can carry out the laminated body 106 to the room temperature part 98 side.

  The transported laminated body 106 is separated into the laminated substrate 108 and the substrate holder 104 in, for example, a holder pre-aligner 144. The separated substrate holder 104 is returned to the holder stocker 146. Further, the separated laminated substrate 108 is collected in the FOUP 116 for carrying out.

  FIG. 12 is a diagram schematically illustrating another form of the transport path generated in step S105. That is, as illustrated, the calculation unit 222 may calculate a conveyance path that follows the shortest distance from the initial position I to the contact position F.

In this case, the control unit 220 sets the facing position D obliquely below the contact position F, and moves the movement amounts separately obtained in the X direction, the Y direction, and the Z direction at the same time. The movement speed of the lower stage 134 is controlled. Thus, as shown by the dotted line C ₂ in the figure, forming an initial position and the transport path from I to the opposite position D, the conveying path from opposite positions D to the contact position F, continuous linear path To do.

  Thus, since the moving distance from the initial position I to the contact position F is the shortest, the moving time of the lower stage 134 is shortened, and the throughput of the multilayer substrate manufacturing apparatus 100 is improved. Further, since the operation amount of the lower stage 134 is reduced, wear of the sliding portion in the driving portion 131 is also reduced. Therefore, this contributes to a longer life of the multilayer substrate manufacturing apparatus 100.

  Even when the conveyance path of the lower stage 134 draws a continuous straight line from the initial position to the contact position F, the distance between the facing position D and the contact position F set in the vicinity of the contact position F is not limited. The moving speed of the lower stage 134 may be reduced. Thereby, even when the substrate 102 abuts at an unexpected timing due to thickness variation or the like, the damage can be reduced.

Further, if the opposing position D is set obliquely below the contact position F, as indicated by the dotted line C ₃ in the figure, the control unit 220, reaches the abutting position F through the opposing position D from the initial position I You may control so that the change of the acceleration of the lower stage 134 becomes constant in the whole conveyance path | pass. Thereby, the inertia force which acts on the board | substrate 102 and the board | substrate holder 104 reduces, and the position shift of the board | substrate 102 is prevented.

  FIG. 13 is a diagram schematically showing still another form of the transport path generated in step S105. That is, as illustrated, the calculation unit 222 may calculate a conveyance path that is continuous in a curved line from the initial position I to the facing position D or from the contact position F.

Path indicated by the dotted line C ₄ in the drawing, from the initial position I, until facing position D located below the contact position F, a curve, the slope of which varies continuously. The path indicated by the dotted line C ₅ in the drawing, from the initial position I, until the contact position F, a curve, the slope of which varies continuously.

  Thus, by moving the substrate 102 and the substrate holder 104 along a path that draws a continuous curve, when there is an obstacle as indicated by the dotted line Q in the figure, it interferes with the obstacle. The substrate 102 and the substrate holder 104 can be smoothly moved over a short distance.

  Even when the conveyance path of the lower stage 134 draws a continuous curve from the initial position to the contact position F, from the facing position D set obliquely below the contact position F to the contact position F. The moving speed of the lower stage 134 may be reduced. Thereby, even when the substrate 102 abuts at an unexpected timing due to thickness variation or the like, the damage can be reduced.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output of the previous process may be realized in any order unless used in a subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

98 Room temperature part, 99 High temperature part, 100 Laminated substrate manufacturing apparatus, 101 Permanent magnet, 102 Substrate, 103 Magnetic body member, 104 Substrate holder, 105 Contact, 106 Laminated body, 108 Laminated substrate, 109 Flange part, 110 Housing, 112 Thermal insulation wall, 114 control panel, 116 FOUP, 118 vacuum pump, 120 atmospheric loader, 121, 238 guide rail, 122, 162, 262 fork, 124, 164, 264 arm, 126, 166 folding arm, 130 superposition device, 131 Drive unit, 132 frame, 134 lower stage, 136 upper stage, 138 anti-vibration legs, 142 substrate pre-aligner, 144 holder pre-aligner, 146 holder stocker, 150 load lock, 152, 154 shutter, 156 airtight wall 160 Environmental loader, 168 Common support, 170 Pressurization device, 180 Cooling device, 202 Notch, 204 Alignment mark, 206 Element area, 220 Control unit, 222 Calculation unit, 232 Z direction actuator, 231 Spherical seat, 234 Y direction actuator 236 X direction actuator, 237, 247 microscope, 239, 249 Reflector, 241 Load cell

Claims (9)

A substrate superimposing apparatus that superimposes a first substrate and a second substrate each having an element region formed thereon,
A first table for holding the first substrate;
A second table for holding the second substrate so as to face the first substrate;
A drive unit that moves at least one of the first table and the second table;
The drive unit is
An initial position where the first substrate and the second substrate are displaced from each other in a facing direction which is the facing direction and a surface direction orthogonal to the facing direction, and a predetermined distance between the first substrate and the second substrate Moving at least one of the first table and the second table in a transport path including an intersecting path that obliquely intersects the facing direction between facing positions that are spaced apart from each other,
At least one of the first table and the second table is moved between the facing position and the overlapping position where the first substrate and the second substrate overlap with each other by a transport path not including the component in the surface direction. A substrate superimposing apparatus characterized by that.   The substrate overlapping apparatus according to claim 1, wherein the predetermined distance is determined based on thicknesses of the first substrate and the second substrate.   3. The substrate overlaying apparatus according to claim 1, wherein a transport speed in a transport path from the initial position to the facing position is higher than a transport speed in a transport path from the facing position to the overlapping position. A generating unit that generates a transport path from the initial position to the facing position;
The generating unit superimposes a substrate according to any one of claims 1 3 for generating a shortest distance of the conveying path as the conveying path device. A generating unit that generates a transport path from the initial position to the overlapping position;
The generating unit superimposes a substrate according to any one of claims 1 3 for generating a shortest distance of the conveying path as the conveying path device. A detection unit for detecting the position of the first mark provided on the first substrate and the position of the second mark provided on the second substrate, respectively;
The generation unit calculates the facing position in at least one of the first table and the second table based on the position of the first mark and the position of the second mark detected by the detection unit, and the conveyance The substrate overlaying apparatus according to claim 4 or 5 , wherein a path is generated. A control unit for controlling the drive unit;
The drive unit includes a first drive unit that moves at least one of the first table and the second table along the surface direction, and at least one of the first table and the second table along the facing direction. A second drive unit that is moved
Wherein, when moving at least one of said first table and said second table in the crossing path, any one of claims 1 to 6 for simultaneously driving the first drive and the second drive unit The substrate overlaying apparatus according to one item. A substrate superimposing apparatus that superimposes a first substrate and a second substrate each having an element region formed thereon,
A first table for holding the first substrate;
A second table for holding the second substrate so as to face the first substrate;
A drive unit for moving at least one of the first table and the second table;
With
The drive unit includes an initial position in which the first substrate and the second substrate are displaced from each other in a facing direction that is the facing direction and a surface direction orthogonal to the facing direction, and the first substrate and the second substrate are Substrate stacking characterized in that at least one of the first table and the second table is moved in a transport path including an intersecting path that obliquely intersects the facing direction between overlapping positions overlapping each other. Alignment device. A device manufacturing method manufactured by superposing a plurality of substrates each having an element region formed thereon,
Superposing the first substrate held on the first table and the second substrate held on the second table so as to face the first substrate;
The superimposing step includes
An initial position where the first substrate and the second substrate are displaced from each other in a facing direction which is the facing direction and a surface direction orthogonal to the facing direction, and a predetermined distance between the first substrate and the second substrate A first path that moves at least one of the first table and the second table in a transport path including a cross path that obliquely intersects the facing direction between the facing positions that are spaced apart from each other and facing each other. A moving step;
At least one of the first table and the second table is moved between the facing position and the overlapping position where the first substrate and the second substrate overlap with each other by a transport path not including the component in the surface direction. A second moving step;
A device manufacturing method including:

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