JP2009259984A - Electronic component mounting apparatus and method of mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To decide whether a measured value is abnormal, due to the breakdown of a height level measuring device and prevent the generation of defects of a printed circuit board. <P>SOLUTION: A height level measuring device 18 measures the height level of the measurement position of a printed circuit board P. If a CPU 30 can read a measurement result, it is decided as being normal. Then, a threshold decision for deciding whether the measurement result is within the range, -0.3 mm<(a reference value-a measured value)<+0.3 mm is performed. When it is decided that the reference value less the measured value lies outside of the range, the measurement positions of four points around the original measurement position are measured, one after another. The average value of the measured values of five points is calculated, and it is decided whether the measured values are separated from the average value by 0.1 mm or larger. When it is decided that there is no such separated measured value, it is decided whether a difference between the maximum value and the minimum value of the measured values of three points, except for the maximum value and the minimum value of the measured values of five points lies within the range of 0.1 mm. If the difference lies out the range, an electronic component mounting apparatus 1 is abnormally stopped, and the fault is notified by notification means. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention measures the height level of a printed circuit board with a height level measuring device, and when the suction nozzle takes out an electronic component from a component supply device and mounts it on the printed circuit board based on the measurement result, The present invention relates to an electronic component mounting apparatus and an electronic component mounting method that perform lowering control of a suction nozzle.

An electronic component mounting apparatus in which a suction nozzle takes out an electronic component from a component supply apparatus and mounts the electronic component on a printed circuit board is disclosed in, for example, Patent Document 1. In general, in a very small electronic component, the printed circuit board may be warped during the mounting operation and may be taken home without being mounted, or the electronic component may be cracked or the solder may be scattered. For this reason, using a measurement device for the height level of the printed circuit board such as a laser displacement meter, the lowering control of the suction nozzle is performed at the time of mounting based on this measurement result.
JP 2006-286707 A

  However, when measuring the height level of a printed circuit board, even if there is a disturbance factor such as a failure of the height level measurement device or measurement of foreign matter such as dust on the printed circuit board, the height level measurement It was not possible to determine whether the measured value by the device was abnormal.

  Accordingly, an object of the present invention is to determine whether or not a measurement value is abnormal due to a failure of a height level measurement device, thereby preventing a printed circuit board from being defective.

  Therefore, in the first invention, the height level of the printed board is measured by the height level measuring device, and based on the measurement result, the suction nozzle takes out the electronic component from the component supply device and mounts it on the printed board. In the electronic component mounting apparatus that controls the lowering of the suction nozzle, a determination unit that determines a measurement result obtained by measuring the height level at the measurement position by the height level measurement device, and the determination unit includes the measurement result. And a control means for controlling the lowering of the suction nozzle based on the measurement results obtained by measuring the height levels of a plurality of positions around the measurement position. Electronic component mounting device.

  According to a second aspect of the present invention, when the height level of the printed circuit board is measured by the height level measuring device, and the suction nozzle takes out the electronic component from the component supply device and mounts it on the printed circuit board based on the measurement result. Determining means for determining whether or not the measurement result obtained by measuring the height level at the measurement position by the height level measurement device is within a predetermined range in the electronic component mounting apparatus that performs the lowering control of the suction nozzle; When the determination unit determines that the position is outside the predetermined range, the suction nozzle descending control is performed based on the measurement result of the measurement position and the measurement result of measuring the height level at a plurality of positions around the measurement position. And a control means.

  According to a third aspect of the present invention, in the first or second aspect of the electronic component mounting device, whether the measured values excluding the maximum value and the minimum value of the plurality of measurement results measured by the height level measuring device are within a certain range. Determining means for determining whether or not, and a control means for controlling the lowering of the suction nozzle based on a measurement result excluding the maximum value and the minimum value within the certain range within the certain range. And

  According to a fourth aspect of the present invention, in the first or second aspect of the electronic component mounting device, whether the measured values excluding the maximum value and the minimum value of the plurality of measurement results measured by the height level measuring device are within a certain range. A judgment means for judging whether or not, and when this judgment means judges that the electronic component mounting apparatus is out of a certain range, the electronic component mounting apparatus is controlled to be stopped abnormally and the average of the measured values excluding the maximum value and the minimum value is calculated. And a control device for controlling the lowering of the suction nozzle based on the calculated average value.

According to a fifth aspect of the present invention, when the height level of the printed board is measured by the height level measuring device, and the suction nozzle takes out the electronic component from the component supply device and mounts it on the printed board based on the measurement result. In addition, in the electronic component mounting method for performing the lowering control of the suction nozzle,
The height level measuring device measures the height level at the measurement position;
Determine whether this measurement result can be read,
If it is determined by this determination that it cannot be read, the height level of the peripheral position of the measurement point is measured,
The lowering of the suction nozzle is controlled on the basis of the surrounding measurement results.

According to a sixth aspect of the present invention, when the height level of the printed circuit board is measured by the height level measuring device, and the suction nozzle takes out the electronic component from the component supply device and mounts it on the printed circuit board based on the measurement result. In the electronic component mounting method for performing the lowering control of the suction nozzle,
The height level measuring device measures the height level at the measurement position;
Determine whether this measurement result is within a predetermined range,
When it is determined that it is outside the predetermined range, the height level around the measurement position is measured,
The lowering of the suction nozzle is controlled based on the measurement result of the measurement position and the measurement result obtained by measuring the height levels at a plurality of positions around the measurement position.

According to a seventh invention, in the fifth or sixth invention relating to the electronic component mounting method, is the measured value excluding the maximum value and the minimum value of the plurality of measurement results measured by the height level measuring device within a certain range? It is characterized by determining whether or not.

According to an eighth aspect of the present invention, in the fifth or sixth aspect of the electronic component mounting method, whether the measured values excluding the maximum value and the minimum value of the plurality of measurement results measured by the height level measuring device are within a certain range. Determine whether or not
When it is determined that it is out of a certain range, the electronic component mounting device is controlled to abnormally stop and the average of the measured values excluding the maximum value and the minimum value is calculated,
The lowering of the suction nozzle is controlled based on the calculated average value.

  In the present invention, when measuring the height level of a printed circuit board, if the height level measuring device breaks down or there is a disturbance factor such as measuring dust on the printed circuit board, the height level is measured. It is possible to determine whether or not the measurement value by the measuring apparatus is abnormal, and thus it is possible to prevent the occurrence of a defective printed circuit board.

  Hereinafter, an embodiment of an electronic component mounting apparatus for mounting an electronic component on a printed circuit board will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1. A plurality of component supply units 3 for supplying various electronic components one by one to a component take-out portion (component adsorption position) are provided on a base 2 of the apparatus 1. It is installed side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing component supply unit 3 groups. The supply conveyor 4 transports the printed circuit board P received from the upstream device to the positioning unit 5, and after the electronic components are mounted on the substrate P positioned and fixed by a positioning mechanism (not shown) in the positioning unit 5, the discharge is discharged. It is conveyed to the conveyor 6.

  8A and 8B are a pair of beams that are long in the X direction. The screw shaft 10 is rotated by driving the Y-axis motor 9, and the component suction and extraction positions of the printed circuit board P and the component supply unit 3 along the left and right guides 11 are respectively Move upward in the Y direction individually.

  Each of the beams 8A and 8B is provided with mounting heads 7A and 7B that move along the guide (not shown) by the X-axis motor 12 in the longitudinal direction, that is, the X direction. Each mounting head 7A or 7B is equipped with two vertical axis motors 13 for vertically moving the two suction nozzles 17A, 17B or 17C, 17D, and a θ-axis motor 14 for rotating around the vertical axis. Are installed two each. Accordingly, the suction nozzles of the two mounting heads 7A and 7B can move in the X direction and the Y direction, can rotate around a vertical line, and can move up and down.

  Reference numeral 16 denotes a component recognition camera that captures an image of electronic components sucked and held by the suction nozzles 17A, 17B, 17C, and 17D. Reference numeral 18 denotes a height level measuring device such as a laser displacement meter provided in the mounting heads 7A and 7B, which measures the height level of the printed circuit board P positioned by the positioning unit 5.

  Next, in the control block diagram of FIG. 2, each element of the electronic component mounting apparatus 1 is centrally controlled by the CPU 30, and a ROM 31 storing a program related to this control and a RAM 32 storing various data are connected via a bus line 33. Connected. Further, a monitor 34 for displaying an operation screen and the like, and a touch panel switch 35 as input means formed on the display screen of the monitor 34 are connected to the CPU 30 via an interface 36. The Y-axis motor 9 and the like are connected to the CPU 30 via a drive circuit 38 and an interface 36.

  The RAM 32 stores mounting data for each type of printed circuit board P related to component mounting, and the X direction of the mounting coordinates of each electronic component in the printed circuit board P for each mounting order (step number). , Y direction and angle information, arrangement number information of each component supply unit 3, and the like are stored. The RAM 32 stores information on the type of each electronic component corresponding to the component supply unit arrangement number of each component supply unit 3, that is, component arrangement data. Further, for each component ID, the X of the electronic component is stored. The component library data relating to the direction, the length in the Y direction, thickness information, the nozzle ID of the used suction nozzle, and the like are stored.

Further, although the height level may vary depending on the position of the printed circuit board P due to the warp of the printed circuit board P or the like, as described later, the RAM 32 has a plurality of height level measurement positions (for each type of the printed circuit board P) ( 3 that shows the measurement position of the board ID “001”) and the reference value of the height level of the printed board P for each type of the printed board P are also stored. 37 is connected to the CPU 30 via the interface 36. In the recognition processing device, the recognition processing device 37 recognizes an image captured by the component recognition camera 16 and sends the processing result to the CPU 30. In other words, the CPU 30 outputs an instruction to the recognition processing device 37 so as to perform recognition processing (calculation of misalignment amount, etc.) on the image captured by the component recognition camera 16 and receives the recognition processing result from the recognition processing device 37. is there.

  When the measurement result of the height level of the printed circuit board P exceeds, for example, plus or minus 0.3 mm from the reference value stored in the RAM 32, the height level stored in the RAM 32 will be described later. The monitor 34 displays the setting of whether to use the multipoint measurement function for whether or not to perform multipoint measurement around the measurement position, whether to use the multipoint measurement function, or whether to recover when the height level measurement device 18 is abnormal. The touch panel switch 35 can be operated, and these setting contents are stored in the RAM 32.

  The following description is based on the flowchart shown in FIG. First, when the printed circuit board P is inherited from an upstream device (not shown) and exists on the supply conveyor 4, the printed circuit board P on the supply conveyor 4 is moved to the positioning unit 5.

  At this time, the printed circuit board P is locked and stopped by a positioning pin (not shown) of the position regulating device as a reference in the substrate transport direction. Then, a Z clamp mechanism (not shown) is operated, and the level in the height direction of the printed board P can be kept constant, the printed board P can be positioned in the vertical direction, and the three-dimensional direction can be positioned. Can be fixed.

  Further, backup pins necessary for the printed circuit board P to be produced are inserted into a plurality of concave grooves of the backup base (not shown), and when the backup base rises, the backup pins hit the back surface of the printed circuit board P. The substrate P is pushed up and supported so as to hold the substrate P horizontally.

  In this way, the positioning operation of the printed circuit board P is completed. When the CPU 30 determines that the positioning has been performed, the CPU 30 determines the first height level corresponding to the printed circuit board P stored in the RAM 32. The measurement position is read, and the X-axis motor 12 and the Y-axis motor 9 are controlled to move the height level measuring device 18 above the first measurement position.

  Then, the height level measuring device 18 measures the height level at the first measurement position of the printed circuit board P positioned by the positioning unit 5, and the CPU 30 determines this measurement result (“measurement result determination”). To do. That is, if the measurement result can be read, it is determined to be normal, and next, for example, “threshold determination” is performed to determine whether it is within a range of minus 0.3 mm <(reference value−measured value) <plus 0.3 mm However, if the CPU 30 determines that the reference value minus the measured value is within the range, the measured value is stored in the RAM 32, and the measurement at all measurement positions is not completed. The CPU 30 reads the measurement position of the second height level stored in the RAM 32, controls the X-axis motor 12 and the Y-axis motor 9, and moves the height level measuring device 18 above the measurement position.

However, if the height level measuring device 18 measures the height level at the first measurement position and the measurement result cannot be read, it is determined that there is an abnormality, and if it is not set to recover in the case of this abnormality, the CPU 30 Causes the electronic component mounting apparatus 1 to stop abnormally and causes the notification means to notify the abnormality. That is, for example, when the measurement position of the height level measurement device 18 is above the opening of the printed circuit board P or where it cannot be diffusely reflected, the height level is not measured, and the height level measurement device 18 For example, if a signal indicating that measurement could not be performed is output to the CPU 30 and the measurement result cannot be read by the CPU 30, the electronic component mounting apparatus 1 is stopped abnormally unless the setting is made to recover in the event of an abnormality. At the same time, the notification means notifies the abnormality. This “abnormal stop” means, for example, that when the electronic component is not sucked, the suction operation is not started, and when the electronic component is already picked up, the mounting to the printed circuit board is not started (hereinafter, referred to as “abnormal stop”). the same.)
However, as described above, when recovery is set, or when the measurement result as described above is read and determined to be normal, minus 0.3 mm <(reference value−measurement value) <plus 0.3 mm. When it is determined that it is out of the range, multipoint measurement is performed as follows.

  That is, as shown in FIG. 5, in addition to the coordinates of a plurality of measurement positions, the RAM 32 also stores, for example, the coordinates of four points around each measurement coordinate. That is, assuming that the coordinates of the original measurement position are (X, Y), the coordinates (X−0.2 mm, Y−0.2 mm), (X−0. 2 measurement positions of 2 mm, Y + 0.2 mm), (X + 0.2 mm, Y−0.2 mm), and (X + 0.2 mm, Y + 0.2 mm) are also stored, and the height of these 4 measurement positions In order to measure, the height level measuring device 18 is first moved above the position of the first of the four points, and is measured one after another.

  When the above-described measurement of the four points is completed, the CPU 30 calculates the average value of the four measured values when it cannot be read or the five measured values when it is read, and then each measured value is, for example, 0 based on the calculated average value. If it is determined that the distance is less than 1 mm, and it is determined that there is even one point away, and it is not set as a recovery, it will be stopped abnormally and notified as described above. Therefore, information indicating that “the measured value is abnormal and will be restored” is stored in the RAM 32 as one piece of device information.

  Then, after this storage, or when it is determined that there is no measured value at this distance when determining whether each measured value is more than 0.1 mm away from the above-mentioned average value, there are next four points. Alternatively, the CPU 30 determines whether the difference between the maximum value and the minimum value of the two or three measurement values excluding the maximum value and the minimum value of the five measurement values is within a range of, for example, 0.1 mm. If the CPU 30 is out of the range, the electronic component mounting apparatus 1 is abnormally stopped and notified by the notifying means, and if it is within the range, the average value of the two or three measured values is calculated.

  Then, the CPU 30 calculates this average value, and then determines whether or not the result is within -1.0 mm <average value <+3.0, for example. That is, if the CPU 30 is out of the range, the electronic component mounting apparatus 1 is abnormally stopped and notified by the notification means, and if within the range, the average value of the two or three points as the measurement result is stored in the RAM 32.

  As described above, all of the plurality of printed circuit boards P shown in FIG. 3 except for the case where the electronic component mounting apparatus 1 is abnormally stopped and the abnormality is notified by the notification unit during the measurement and determination of the measurement. When the height level of the measurement point is measured and the determination of the measurement is completed, all the operations related to the measurement determination are completed.

  As described above, all of the plurality of printed circuit boards P shown in FIG. 3 except for the case where the electronic component mounting apparatus 1 is abnormally stopped and the abnormality is notified by the notification unit during the measurement and determination of the measurement. Since the measurement result corresponding to the measurement point is stored in the RAM 32, the CPU 30 controls the lowering of the suction nozzles 17A, 17B, 17C, and 17D based on the measurement result when the electronic component is mounted.

  Therefore, according to the mounting data stored in the RAM 32 on the printed circuit board P transported to the positioning unit 5, the electronic components to be mounted by any of the suction nozzles 17A, 17B, 17C, 17 are sucked from the predetermined component supply unit 3. Then, the electronic component passes through the component recognition camera 16 and images each electronic component sucked and held by the suction nozzle. The recognition processing device 37 recognizes the component, and based on the result, the component is placed in the mounting coordinates of the mounting data. The electronic component is mounted on the printed circuit board P while correcting the misalignment in consideration of the recognition result, and based on each measurement result of the height level of the printed circuit board P corresponding to the mounting position of the electronic component. The CPU 30 controls the lowering of the suction nozzle. That is, the amount of lowering is decreased when warped upward, and the amount of lowering is increased when warped downward.

  Therefore, whether or not the measurement value by the height level measuring device is abnormal when the height level measuring device has failed or there has been a disturbance factor such as measuring dust on the printed circuit board. However, according to the present embodiment, the determination can be made, and the occurrence of a printed circuit board defect can be prevented.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description. It encompasses alternatives, modifications or variations.

It is a top view of an electronic component automatic placement device. It is a control block diagram. It is a figure which shows the measurement coordinate data of board | substrate ID "001". It is a figure which shows a flowchart. It is a figure which shows the relationship between the original measurement position and the measurement position of the circumference | surroundings.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 5 Positioning part 7A, 7B Mounting head 17A, B, C, D Suction nozzle 18 Height level measuring apparatus 30 CPU
32 RAM
34 Monitor 35 Touch Panel Switch P Printed Circuit Board

Claims (8)

  The height level of the printed circuit board is measured by the height level measuring device, and when the suction nozzle takes out the electronic component from the component supply device and mounts it on the printed circuit board based on the measurement result, the suction nozzle is lowered. In the electronic component mounting apparatus that performs control, when the height level measurement device determines a measurement result obtained by measuring the height level at the measurement position, and when the determination device determines that the measurement result cannot be read. An electronic component mounting apparatus comprising: control means for controlling the lowering of the suction nozzle based on measurement results obtained by measuring height levels at a plurality of positions around the measurement position.   The height level of the printed circuit board is measured by the height level measuring device, and when the suction nozzle takes out the electronic component from the component supply device and mounts it on the printed circuit board based on the measurement result, the suction nozzle is lowered. In the electronic component mounting apparatus that performs control, a determination unit that determines whether a measurement result obtained by measuring the height level at the measurement position by the height level measurement device is within a predetermined range, and the determination unit is outside the predetermined range. And a control means for controlling the lowering of the suction nozzle based on the measurement result of the measurement position and the measurement result of measuring the height level of a plurality of positions around the measurement position. An electronic component mounting apparatus characterized by that.   A determination means is provided for determining whether or not a measurement value excluding the maximum value and the minimum value of a plurality of measurement results measured by the height level measurement device is within a certain range, and if within the certain range, the maximum value and the minimum value 3. The electronic component mounting apparatus according to claim 1, further comprising: a control unit configured to control the lowering of the suction nozzle based on a measurement result excluding.   A determination means for determining whether or not a measurement value excluding a maximum value and a minimum value of a plurality of measurement results measured by the height level measurement device is within a certain range; and when the determination means determines that the measurement value is outside the certain range Controls the electronic component mounting apparatus to abnormally stop, calculates the average of measured values excluding the maximum value and minimum value, and controls the lowering of the suction nozzle based on the calculated average value The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is provided. The height level of the printed circuit board is measured by the height level measuring device, and when the suction nozzle takes out the electronic component from the component supply device and mounts it on the printed circuit board based on the measurement result, the suction nozzle is lowered. In the electronic component mounting method for controlling,
The height level measuring device measures the height level at the measurement position;
Determine whether this measurement result can be read,
If it is determined by this determination that it cannot be read, the height level of the peripheral position of the measurement point is measured,
An electronic component mounting method, wherein the lowering of the suction nozzle is controlled based on a measurement result of the surroundings. The height level of the printed circuit board is measured by the height level measuring device, and when the suction nozzle takes out the electronic component from the component supply device and mounts it on the printed circuit board based on the measurement result, the suction nozzle is lowered. In the electronic component mounting method for controlling,
The height level measuring device measures the height level at the measurement position;
Determine whether this measurement result is within a predetermined range,
When it is determined that it is outside the predetermined range, the height level around the measurement position is measured,
An electronic component mounting method, wherein the lowering of the suction nozzle is controlled based on a measurement result of the measurement position and a measurement result obtained by measuring height levels at a plurality of positions around the measurement position. Determining whether the measurement value excluding the maximum value and the minimum value of the plurality of measurement results measured by the height level measurement device is within a certain range;
7. The electronic component mounting method according to claim 5, wherein the lowering of the suction nozzle is controlled based on a measurement result excluding the maximum value and the minimum value within the certain range. Determining whether the measurement value excluding the maximum value and the minimum value of the plurality of measurement results measured by the height level measurement device is within a certain range;
When it is determined that it is out of a certain range, the electronic component mounting device is controlled to abnormally stop and the average of the measured values excluding the maximum value and the minimum value is calculated,
7. The electronic component mounting method according to claim 5, wherein the lowering of the suction nozzle is controlled based on the calculated average value.