JP2012064781A - Method for checking component recognition camera state, and electronic component mounting apparatus having function to check component recognition camera state - Google Patents

Abstract

PROBLEM TO BE SOLVED: To automatically detect a foreign substance on a component recognition camera by checking the state of the component recognition camera mounted on an electronic component mounting apparatus.SOLUTION: A cylindrical-shaped rotor having a suction nozzle at the tip thereof is attached to a mount head of the electric component mounting apparatus. The suction nozzle is positioned by the movement of the mount head to the component recognition camera and the rotation of the mount head corresponding to an imaging area section of the component recognition camera. Next, an image recognition processing apparatus image-recognizes the suction nozzle, and according to the image recognition result of the suction nozzle by the image recognition processing apparatus, the number of image recognition abnormality times of the suction nozzle is stored into a memory, on the basis of each imaging area section of the component recognition camera. Then, the number of image recognition abnormality times of the suction nozzle stored in the memory for each imaging area section of the component recognition camera is decided. When the number of times for each section reaches a specified count or greater, an abnormal state alarm of the component recognition camera is displayed on a monitor.

Description

  The present invention relates to a method for checking the state of a component recognition camera mounted on an electronic component mounting apparatus, and more particularly to a method suitable for detecting a foreign object on a component recognition camera.

  In an electronic component mounting device that mounts electronic components on a printed circuit board, the mounted components are sucked out from the component supply unit by the suction nozzle mounted on the mounting head, moved to the printed circuit board, and then the mounting head is printed. There is known a method of mounting electronic components by lowering the substrate.

  At this time, the mounting head passes over the component recognition camera and is imaged, thereby performing recognition processing for recognizing the position of the component in the suction nozzle, the state and size of the sucked-out component, and the like. A substrate recognition camera is also installed in the mounting head, and images a positioning mark on the printed circuit board, and recognizes the position of the positioning mark thereafter. In this way, the correctness of the position of the printed circuit board on which the component is mounted can be obtained without mistakes in the type of the component mounted on the printed circuit board, depending on the result of the recognition process of the imaging result by the component recognition camera and the recognition process by the substrate recognition camera Secured.

  Japanese Patent Application Laid-Open No. 2004-133620 discloses a technique for displaying a component suction state on a monitor using an image captured from the component recognition camera in an electronic component mounting apparatus using such a component recognition camera. Patent Document 2 discloses a technique for automatically discarding an abnormal part by recognition processing based on an imaging result of a part recognition camera.

JP 2009-239010 A JP 2006-210722 A

  As described above, the electronic component mounting apparatus is equipped with a plurality of cameras such as a component recognition camera and a board recognition camera, and by using image recognition technology, the accuracy of the component mounting position and the type of component can be controlled. Legitimacy is ensured.

  However, when there is a foreign object on the component recognition camera mounted on the electronic component mounting apparatus, there is a problem that recognition processing cannot be performed normally. Patent Document 1 and Patent Document 2 presuppose that there is no abnormality in the state of the component recognition camera. For this reason, after the operation of the electronic component mounting apparatus, component recognition cannot be performed, and the operator has to check the state of the component recognition camera visually.

  The present invention has been made to solve the above problems, and its purpose is to check the status of a component recognition camera mounted on an electronic component mounting apparatus and automatically detect foreign matter on the component recognition camera. It is to provide a method.

  In the component recognition camera state check method according to the present invention, the electronic component mounting apparatus is an electronic component mounting apparatus that sucks a component into a suction nozzle of a mounting head and supplies the component to a substrate, and includes a CPU, a memory, an image It has a recognition processing device and a monitor.

  A cylindrical rotating body having a suction nozzle at the tip is attached to the mounting head of the electronic component mounting apparatus.

  First, the mounting head is moved onto the component recognition camera.

  Then, the mounting head is rotated to position the suction nozzle in accordance with the classification of the imaging area of the component recognition camera.

  Next, the image recognition processing device recognizes an image of the suction nozzle, and according to the result of the image recognition of the suction nozzle of the image recognition processing device, there is an image recognition abnormality of the suction nozzle for each of the imaging region classifications of the component recognition camera. Is stored in the memory.

  Then, the number of times that there has been an abnormality in the image recognition of the suction nozzle for each section of the imaging area of the component recognition camera stored in the memory is determined. To do.

  ADVANTAGE OF THE INVENTION According to this invention, the check method of performing the state check of the component recognition camera mounted in an electronic component mounting apparatus and detecting automatically the foreign material on a component recognition camera can be provided.

It is a top view of the electronic component mounting apparatus which concerns on 1st embodiment of this invention. 1 is a block diagram of an electronic component mounting apparatus according to a first embodiment of the present invention. It is the figure which looked at the mounting head part and component recognition camera of an electronic component mounting apparatus from the side. It is the figure which looked at the mounting head from the lower surface. It is a side view which shows the structure of a components recognition camera. It is a figure which shows a mode when the foreign material on a components recognition camera and the (theta) axis | shaft rotary body 41 are imaged from the bottom. It is a figure which shows each state of the foreign material on a components recognition camera and the suction nozzle 40 to image when a (theta) axis | shaft rotary body is rotated. It is a figure which shows each state of the foreign material on a components recognition camera, and the suction nozzle 40 to image when a (theta) axis | shaft rotary body is rotated. It is a figure which shows each state of the foreign material on a components recognition camera and the adsorption nozzle 40 to image when a (theta) axis | shaft rotary body is rotated (the 3). It is a figure which shows each state of the foreign material on a components recognition camera and the adsorption nozzle 40 to image when a (theta) axis | shaft rotary body is rotated (the 4). It is a flowchart which shows the process which collects the status information on a components recognition camera. It is a flowchart which shows the process which determines abnormality by the arrangement | sequence of the frequency | count of abnormality for every area | region. It is a figure which shows a mode when the foreign material on a components recognition camera and the mounting head of the electronic component mounting apparatus which concerns on 2nd embodiment of this invention are imaged from the bottom. It is a figure which shows the relationship between the imaging area and suction nozzle of an electronic component mounting apparatus when the mounting head of the electronic component mounting apparatus which concerns on 2nd embodiment of this invention is moved.

  Hereinafter, a method for checking a mounted camera of an electronic component mounting apparatus according to each embodiment of the present invention will be described with reference to FIGS.

Embodiment 1
Hereinafter, a method for checking the mounted camera of the electronic component mounting apparatus according to the first embodiment of the present invention will be described with reference to FIGS.
First, the structure of the electronic component mounting apparatus according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2.
FIG. 1 is a top view of the electronic component mounting apparatus according to the first embodiment of the present invention.
FIG. 2 is a block diagram of the electronic component mounting apparatus according to the first embodiment of the present invention.
As shown in FIG. 1, the electronic component mounting apparatus according to this embodiment includes a component supply unit 3 that supplies various electronic components one by one to a component take-out portion (component suction position) on a base 2. Are arranged side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing component supply unit 3 groups. The supply conveyor 4 transports the printed circuit board P received from the upstream device to the positioning unit 5, and after the electronic component is mounted on the printed circuit board P positioned and fixed by the positioning mechanism (not shown) in the positioning unit 5. , And conveyed to the discharge conveyor 6.

  The pair of beams 8 </ b> A and 8 </ b> B are elongated in the X direction, rotate the screw shaft 10 by driving the Y-axis motor 9, respectively, and perform components of the printed circuit board P and the component supply unit 3 along the pair of left and right guides 11. The position above the take-out position (part suction position) is individually moved in the Y direction.

  Each of the beams 8A and 8B has a mounting head 51 attached to a mounting body 50 that moves along a guide (not shown) by the X-axis motor 12 in the longitudinal direction, that is, the X direction, respectively by a θ-axis motor 14 (not shown). It is provided so that rotation is possible. Each mounting head 51 is equipped with a vertical axis motor 13 for vertically moving any one of n (n is an integer of 1 or more) suction nozzles, and a θ-axis motor 14 is mounted. . Therefore, each suction nozzle of the mounting head 51 can move in the X direction and the Y direction (plane direction), can rotate about a vertical line, and can move up and down.

  The component recognition camera 16 is a camera that captures an image of the electronic component sucked and held by the suction nozzle from below.

The board recognition camera 18 is a camera that is attached to the mounting head 51 and images a positioning mark attached to the printed circuit board P. Also, a functional block of the electronic component mounting apparatus of the present embodiment is shown in FIG. Come to show. Each part of the electronic component mounting apparatus 1 is controlled in response to an instruction from a CPU (Central Processing Unit) 30. A ROM (Read Only Memory) 31 storing a program related to this control and a RAM (Random Access Memory) 32 storing various data are connected via a bus line 33. Further, a monitor 34 for displaying an operation screen and the like, and a touch panel switch 35 as input means formed on the display screen of the monitor 34 are connected to the CPU 30 via an interface 36. A Y-axis motor 9, an X-axis motor 12, a vertical axis motor 13, and a θ-axis motor 14 are connected to the CPU 30 via a drive circuit 38 and an interface 36.

  The RAM 32 stores mounting data for each type of printed circuit board P related to component mounting. For each mounting order (step number), the X direction of the mounting coordinates of each electronic component in the printed circuit board P, Y direction and angle information, arrangement number information of each component supply unit 3, and the like are stored. The RAM 32 stores information on the types of electronic components corresponding to the component supply unit arrangement numbers of the component supply units 3 and component arrangement data. Furthermore, shape data, recognition data, control data, and components are stored. Parts library data consisting of supply data is stored. That is, as the component library data, data such as the X direction and Y direction length and thickness information of the electronic component representing the characteristics of the electronic component and data related to the nozzle ID of the suction nozzle used are stored for each component ID. ing. The RAM 32 also stores management data for the electronic component mounting apparatus.

  The image recognition processing device 37 is connected to the CPU 30 via the interface 36, and the image recognition processing device 37 performs recognition processing of an image captured and captured by the component recognition camera 16. The processing result is sent out. That is, the CPU 30 outputs an instruction to the image recognition processing device 37 so as to perform recognition processing (calculation of misalignment amount, etc.) on the image captured by the component recognition camera 16, and the recognition processing result is output from the image recognition processing device 37. It is what you receive.

  Next, an outline of the component mounting operation of the electronic component mounting apparatus according to the present embodiment will be described.

  First, the production operation of the printed circuit board P is started. When the printed circuit board P is inherited from the upstream device (not shown) and exists on the supply conveyor 4, the printed circuit board P on the supply conveyor 4 is transferred to the positioning unit 5. Move and fix the positioning. Then, the mounting data stored in the RAM 32, that is, the XY coordinate position to be mounted on the printed circuit board P, the rotation angle position around the vertical axis, the FDR number (arrangement number of each component supply unit 3), etc. are designated. According to the data, in the Y direction, the Y axis motor 9 is driven to move the beam 8A or 8B along the pair of guides 11, and in the X direction, the X axis motor 12 is driven to attract the corresponding mounting head 51. One of the nozzles is moved above a predetermined component supply unit 3 for supplying an electronic component to be mounted, the vertical axis motor 13 is driven, the suction nozzle is lowered, and the electronic component is sucked and taken out.

  Further, the electronic component held by suction is moved while moving the suction nozzle above the component recognition camera 16 (fly imaging), and recognition processing is performed by the image recognition processing device 37, and the beam 8A or 8B is moved above the printed circuit board P. The positioning mark attached to the printed circuit board P is picked up by the board recognition camera 18 and the amount of displacement is recognized by the image recognition processing unit 37. Based on these results, the board P is again moved upward to the mounting position of the board P. Then, the suction nozzle corrects the positional deviation by adding both recognition results to the mounting coordinates of the mounting data, and mounts all electronic components sucked and held by the suction nozzle of the mounting head 51 on the printed circuit board P, respectively.

  In this manner, the extraction, recognition, and mounting of the electronic components are repeated until all the electronic components to be mounted on one printed circuit board P are completed. When all the electronic components are completed, the printed circuit board is transferred from the positioning unit 5 to the discharge conveyor 6. P is transported, the production related to the mounting of electronic components on the first printed board P is completed, and the production for the second printed board P is performed.

Next, the structure of the mounting head portion and the component recognition camera of the electronic component mounting apparatus according to the first embodiment of the present invention will be described in detail with reference to FIGS.
FIG. 3 is a side view of the mounting head portion and the component recognition camera of the electronic component mounting apparatus.
FIG. 4 is a view of the mounting head as viewed from below.
FIG. 5 is a side view showing the structure of the component recognition camera.

  The mounting head 51 is attached to the attachment body 50, and can move freely in the XY directions as shown in FIG.

  As shown in FIG. 3, the mounting head 51 has a structure in which n suction nozzles 40 are attached to the θ-axis rotating body 41, and the electronic component 60 is sucked to the suction nozzle 40 so that the θ-axis rotating body 41. The θ-axis motor 14 installed on the board can be rotated by a desired angle and taken to the component mounting position on the board. However, in the check of the component recognition camera according to the present embodiment, there is no phase in which the electronic component 60 is attracted to the suction nozzle. The number of suction nozzles attached to the head varies depending on the model of the apparatus, but for example, n = 15.

  As shown in FIG. 4, the mounting head 51 is arranged so that the center of the suction nozzle 40 connects the circumference of a concentric circle when viewed from below. FIG. 4 shows a case where n = 12.

  The component recognition camera 16 is a camera for capturing an image of the electronic component 60 sucked and held by the suction nozzle 40 from below and sending the captured image to the image recognition processing device 37. The image recognition processing device 37 recognizes the captured image and performs component defect detection and positional deviation correction.

  As shown in FIG. 5, the component recognition camera 16 has an LED 161, which is a light emitter, disposed on the opening 160 on the circumference. Below that, a lens 162 is arranged, and an image captured by the CCD camera body 163 from the lens 162 is sent as digital data to the image recognition processing device 37 via a signal line. The foreign object 80 adheres to the opening of the component recognition camera 16 as shown in FIG.

Next, a method for checking the state of the component recognition camera mounted on the electronic component mounting apparatus according to the first embodiment of the present invention will be described with reference to FIGS. 6 to 9 in addition to FIGS.
FIG. 6 is a diagram illustrating a situation when the foreign matter on the component recognition camera and the θ-axis rotating body 41 are imaged from below.
7A to 10D are diagrams illustrating states of the foreign matter on the component recognition camera and the suction nozzle 40 for imaging when the θ-axis rotating body is rotated.
FIG. 8 is a flowchart showing processing for collecting state information on the component recognition camera.
FIG. 9 is a flowchart showing a process for determining an abnormality based on an array of the number of abnormalities for each region.

  The processing of FIGS. 8 and 9 is performed by the CPU 30 executing the component recognition camera state check program stored in the ROM 31 of FIG.

  In addition, the following time can be considered as a timing which checks the component recognition camera 16 by executing a component recognition camera state check program.

1) Every time the number of printed circuit boards produced reaches a preset number. 2) Every set operating time, etc. 3) When a part picked up by a suction nozzle during normal device production operation is imaged and recognized. When the position etc. is not obtained, it is determined as recognition abnormality and the number of occurrences of recognition abnormality is counted. When this count reaches the set number of times. 4) When the monitor is a touch panel switch For example, when the operator presses a switch provided on the monitor screen, in the method for checking the state of the component recognition camera mounted on the electronic component mounting apparatus in the present embodiment, first, the imaging region of the component recognition camera 16 is The component recognition camera 16 is divided into m (m is an integer of 1 or more), the state of each suction nozzle 40 is imaged for each divided area, and the captured image is recognized. Check for foreign objects falling on the top.

As shown in FIG. 6, foreign objects 80a and 80b are placed on the component recognition camera 16, and when the θ-axis rotating body 41 is imaged from below, the state shown in FIG. 6 is assumed. The sector divided into _m is assumed to be F _{1 to} F _{m in} the clockwise direction. Further, the suction nozzle 40 is shown as (1) to (n) in the clockwise direction.

  Hereinafter, the process of collecting the state information on the component recognition camera will be sequentially described with reference to FIG.

  First, the mounting body 50 is moved, and the mounting head 50 is moved onto the component recognition camera 16 (S01).

  Then, a loop between S02 and S10 is performed by using j (j = 1 to m) as an index for the divided area m of the imaging area.

  Next, the θ-axis rotating body 41 is rotated to match the suction nozzle 41 with the divided area (S03). In the j-th loop of S02 and S10, the rotation angle of the θ-axis rotating body 41 is set to (360 ° / m) × (j−1).

  Next, the component recognition camera 16 images the mounting head 51 from below (S04).

  Then, the number n of the suction nozzles 40 is looped between S05 and S09 with i (i = 1 to n) as an index.

  Next, the picked-up nozzle 40 is detected by performing image processing on the captured image by the image recognition processing device 37 shown in FIG. 2 (S06).

  The recognition result on the component recognition camera 16 is determined (S07). If there is no foreign object on the component recognition camera 16, the suction nozzle 40 is normally recognized and the position is also obtained. The algorithm of the image recognition processing in the image recognition processing device 37 is performed by obtaining the center and arc of the suction nozzle 40. When it is normal, it goes to the next loop.

When the suction nozzle 40 is not normally obtained, the array ERR [j] of the number of abnormal times of the region F _j corresponding to the suction nozzle 40 is counted up (S08). Wherein the sequence of the abnormality frequency ERR [j] (j = 1~m ) is a sequence of recording the detection abnormality frequency of the suction nozzle 40 in the region _{F j.} This array ERR [j] is stored in the RAM 32.

  Next, a process of determining an abnormality based on the array of the number of abnormalities for each area will be described with reference to FIG.

  The loop between S20 and S22 is performed using j as an index for the number of abnormal times of each region (that is, the divided region m of the imaging region).

  Then, it is determined whether or not ERR [j] ≧ the specified number of times (S21), and when it is satisfied, the operator is notified that there is a possibility that a foreign object has fallen on the component recognition camera 16. Notification is made (S23).

  Here, a specific example in which m = 4 and the number n of the suction nozzles 40 of the θ-axis rotating body 41 is n = 5 will be described.

7A is between loop S02～S10, when the j = 1, the rotation angle is 0 °, in this case, at _{F 1,} it is an abnormal detected suction nozzle 40 (1).

In FIG. 7B, when j = 2 between the loops of S02 to S10, the rotation angle is 90 °. In this case, F ₁ is (2) with the suction nozzle 40 and F ₃ (2 ) Is detected abnormally.

7C is between loop S02～S10, when the j = 3, the rotation angle is 180 °, in this case, at _{F 1,} with the suction nozzle 40, _{F 3} of (4), (1 ) Is detected abnormally.

Figure 7D is between loop S02～S10, when the j = 4, the rotation angle is 270 °, in this case, at _{F 1,} is an abnormal detected suction nozzle 40 (2).

  Therefore, ERR [1] = 4, ERR [2] = 0, ERR [3] = 2, and ERR [4] = 0.

In this case, if the specified number of times regarded as an error is 2, ERR [1] for the region F1 and ERR [3] for the region F3 satisfy the condition greater than or equal to this, and the loops of S20 to S22 j = go to 1 in S23 steps time, the possibility that there is an abnormality on the component recognition camera 16 in the area F ₁ and the area F ₃ to notify the operator.

  The number m of the area division of the imaging area on the component recognition camera 16 and the number n of the suction nozzles 40 may be arbitrary regardless of this combination. In general, the larger the number n of suction nozzles 40, the larger the number of suction nozzles 40 that are abnormally detected, so the number of prescribed times that are regarded as errors must be increased.

  Further, as the imaging target of the component recognition camera 16, not only the suction nozzle but also the sucked jig or the component itself may be captured to check the state of the component recognition camera 16.

  Thus, in the present embodiment, there is a possibility that there is a foreign object in the imaging region on the component recognition camera 16 when the number of suction nozzles 40 that cannot be recognized exceeds the specified number for each imaging region on the component recognition camera 16. Notify that there is. Thereby, when the suction nozzle 40 itself is defective or recognition error is excluded, the operator is notified only when there is a high possibility that there is a foreign object in the imaging area on the component recognition camera 16.

[Embodiment 2]
Next, a method for checking the state of the component recognition camera of the electronic component mounting apparatus according to the second embodiment of the present invention will be described with reference to FIGS.
FIG. 10 is a diagram illustrating a situation when the foreign matter on the component recognition camera and the mounting head of the electronic component mounting apparatus according to the second embodiment of the present invention are imaged from below.
FIG. 11 is a diagram illustrating the relationship between the imaging region of the electronic component mounting apparatus and the suction nozzle when the mounting head of the electronic component mounting apparatus according to the second embodiment of the present invention is moved.

  In the first embodiment, as illustrated in FIG. 6, the case where the component recognition camera 16 looks circular when the mounting head 51 is imaged has been described.

  As shown in FIG. 10, the present embodiment has a line shape when the mounting head 51 is imaged from the component recognition camera 16.

  Here, the foreign material 80c is placed on the component recognition camera 16, the number of suction nozzles 40 is five, and the imaging area of the component recognition camera 16 is an area corresponding to three suction nozzles 40. These rectangles are designated as R1 to R3, respectively.

  At this time, as shown in FIGS. 11A to 11B, by sequentially moving the head, in FIG. 11A, the suction nozzle 40 in FIG. 11 (b), the suction nozzle 40 of (2) becomes abnormal in recognition in R1, and the suction nozzle 40 of (3) becomes abnormal in recognition in R1 in FIG. 11 (c). . Therefore, when the specified number of times is 2, the operator is notified of the possibility that there is a foreign object in the area R1.

  DESCRIPTION OF SYMBOLS 1 ... Electronic component mounting apparatus, 16 ... Component recognition camera, 37 ... Image recognition processing apparatus, 40 ... Adsorption nozzle, 41 ... (theta) axis | shaft rotary body, 50 ... Attachment body, 51 ... Mounting head.

Claims (4)

In the checking method of the component recognition camera mounted on the electronic component mounting device that sucks the component to the mounting head suction nozzle and supplies the component to the substrate,
The electronic component mounting apparatus includes a CPU, a memory, an image recognition processing apparatus, and a monitor.
The CPU moving the mounting head onto the component recognition camera;
The CPU positioning the suction nozzle in correspondence with an image area classification of the component recognition camera;
The image recognition processing device performing image recognition of the suction nozzle;
The CPU stores, in the memory, the number of times the suction nozzle image recognition abnormality has occurred for each imaging region of the component recognition camera in accordance with the result of image recognition of the suction nozzle of the image recognition processing device. Steps,
The CPU determines the number of times that the suction nozzle image recognition abnormality has occurred for each section of the imaging region of the component recognition camera stored in the memory, and when the number exceeds the specified number of times, the component recognition is performed on the monitor. A method for checking the status of a component recognition camera, comprising: displaying a warning of an abnormal status of the camera.   The captured image of the mounting head of the component recognition camera has a circular shape, the imaging area of the component recognition camera is divided into m (m is an integer of 1 or more), and the positioning of the mounting head is The method of checking a component recognition camera according to claim 1, wherein the check is performed by rotating the movable part of the mounting head by 360 ° / m.   2. The method for checking a component recognition camera according to claim 1, wherein a captured image of the mounting head of the component recognition camera has a line shape. In an electronic component mounting apparatus that sucks a component to a suction nozzle of a mounting head and supplies the component to a substrate,
A CPU, a memory, an image recognition processing device, and a monitor;
A cylindrical rotating body having the suction nozzle at the tip is attached to the mounting head,
The CPU moves the mounting head onto the component recognition camera,
The CPU positions the suction nozzle by rotating the mounting head corresponding to the imaging area of the component recognition camera,
The image recognition processing device recognizes an image of the suction nozzle,
The CPU stores, in the memory, the number of times that the suction nozzle image recognition abnormality has occurred for each of the imaging region of the component recognition camera according to the result of image recognition of the suction nozzle of the image recognition processing device. ,
The CPU determines the number of times that the suction nozzle image recognition abnormality has occurred for each section of the imaging region of the component recognition camera stored in the memory, and when the number exceeds the specified number of times, the component recognition is performed on the monitor. An electronic component mounting device that displays warnings about abnormal camera conditions.

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