JP2010258115A - Electronic component mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To find a contamination in the early stages to avoid an unnecessary follow-on mounting of electronic components. <P>SOLUTION: When an abnormal drop of an electronic component is determined by a CPU (central processing unit) in a step of sequentially mounting the electronic components on a printed circuit board (S5), an inspection for the existence of the contamination is conducted at the mounting point before and after the occurrence of the abnormal conditions (S6). When the CPU determines the abnormal conditions (S8) to control to stop the mounting operation of the electronic component of an electronic component mounting device, visually and aurally notifying the existence of the contamination on the printed circuit board by a notifying means (S9). <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component mounting method in which an electronic component supplied from a component supply device is taken out by a suction nozzle and mounted on a printed circuit board.

  This type of electronic component mounting method is disclosed in, for example, Patent Document 1. In general, after mounting an electronic component on a printed circuit board, the printed circuit board is inspected by an inspection apparatus, that is, whether or not a foreign substance other than the original electronic component is present on the printed circuit board.

Japanese Unexamined Patent Publication No. 7-94896

  However, when a dropped electronic component or other foreign matter is on the printed circuit board, for example, on solder, the produced printed circuit board cannot be used as a non-defective product. In addition, if the foreign object is not found at an earlier stage, unnecessary electronic components will be mounted on a printed circuit board that cannot be used. There is a risk of mounting electronic components, and the problem is particularly great when expensive electronic components are mounted.

  Therefore, an object of the present invention is to detect foreign matters at an earlier stage and prevent unnecessary subsequent electronic components from being mounted.

  Therefore, according to the first aspect of the present invention, in the electronic component mounting method in which the electronic component supplied from the component supply device is taken out by the suction nozzle and mounted on the printed circuit board, mounting of the first electronic component on the printed circuit board is started. Before, it is characterized in that it is inspected whether or not there is a foreign substance on the printed circuit board.

A second invention is an electronic component mounting method in which an electronic component supplied from a component supply device is taken out by a suction nozzle and mounted on a printed circuit board.
It is determined whether or not an abnormal drop of the electronic component has occurred in the process of sequentially mounting the electronic component on the printed circuit board P,
When it is determined that an abnormality in dropping of the electronic component has occurred, an inspection is performed as to whether or not there is a foreign object at the mounting points before and after the occurrence of the dropping abnormality.

A third invention is an electronic component mounting method in which an electronic component supplied from a component supply device is taken out by a suction nozzle and mounted on a printed circuit board.
It is determined whether or not there is an inspection designation for an electronic component to be mounted in the process of sequentially mounting the electronic component on the printed circuit board P,
If it is determined that there is an inspection designation, an inspection is performed as to whether or not there is a foreign object at the mounting point of the electronic component with the inspection designation.

  According to a fourth aspect of the present invention, in the first to third aspects of the invention, when the inspection for whether there is a foreign object is performed and it is determined that there is a foreign object, the electronic component mounting operation is controlled to stop. It is characterized by.

  5th invention WHEREIN: In the 1st thru | or 3rd invention, when the said printed circuit board P is a split board | substrate with a plurality of split board | substrate parts and an electronic component is mounted | worn with a repeating pattern, whether there is a foreign material In the case where it is determined that there is a foreign object after the above inspection is performed, a bad mark is attached to the split board portion that is determined to have a foreign substance, and mounting of electronic components on the split board portion is stopped, and another split board portion is stopped. Control is performed so that the electronic component is mounted on the board portion.

  A sixth invention is characterized in that, in the first to third inventions, the inspection for whether there is a foreign object is performed, and when it is determined that there is a foreign object, the notification means notifies that there is a foreign object. And

According to a seventh invention, in the first to third inventions, the inspection first images the printed board with a board recognition camera,
Calculate the difference between the input image obtained for this imaging and the corresponding reference image,
Pixels that are determined to be different are calculated and connected by expansion / contraction processing,
It is characterized by the fact that one shape is raised and specified.

  The present invention can detect foreign matters at an earlier stage and prevent unnecessary subsequent mounting of electronic components.

The top view of an electronic component mounting apparatus is shown. It is a control block diagram. It is a figure which shows mounting data. It is a figure which shows the information of the kind of electronic component corresponding to the arrangement | positioning number of a component supply unit. It is a figure which shows parts library data. It is a figure which shows the flowchart which concerns on mounting | wearing and a test | inspection of an electronic component. It is a figure which shows a test | inspection flowchart. It is a figure for demonstrating the positioning method of the reference | standard image and input image at the time of using an individual recognition mark. It is a figure for demonstrating the difference of an image. It is a figure for demonstrating the expansion / contraction process performed with respect to the pixel judged to have a difference. It is a figure for demonstrating the extraction of a feature. It is a figure for demonstrating the positioning method of the reference | standard image and input image when not using an individual recognition mark. It is a figure which shows Formula 1 for calculating | requiring a correlation coefficient (matching degree). It is a figure which shows Formula 2 for calculating | requiring a mismatch degree. It is a figure which shows Formula 3 for calculating | requiring a mismatch degree.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1, and component supply devices 3A, 3B, 3C, and 3D are divided into four blocks at the front and rear of the apparatus main body 2 of the electronic component mounting apparatus 1. It is installed. The component supply device 3A has a lane number (component supply unit arrangement number) in the 100s, the component supply device 3B has a lane number in the 200s, and the component supply device 3C has a lane number in the 300s. 3D has lane numbers in the 400s.

  Each of the component supply devices 3A, 3B, 3C, and 3D has a large number of component supply units 5 arranged in parallel on a feeder base of a cart base that is a mounting base. The device body 2 is detachably disposed on the apparatus main body 2 via a connector (not shown) so as to face the road, and can be moved by a caster provided on the lower surface when the connector is released and the handle is pulled. .

  Each of the component supply devices 3A, 3B, 3C, and 3D is disposed so that the tip of the component supply side faces the pickup area of the mounting head 6, and each component supply unit 5 is freely rotatable on the cart table. Rotate a feed sprocket whose teeth are fitted into feed holes opened at predetermined intervals on a storage tape that has been wound around a supply reel placed on the feed reel and rotate it by a predetermined angle. A tape feed mechanism that intermittently feeds to a position by a feed motor, and a cover tape peeling mechanism for peeling the cover tape from the carrier tape before the suction removal position by driving the peeling motor. The electronic parts that have been peeled off and loaded in the carrier tape storage part are sequentially supplied to the part suction / extraction position, and the suction part to be described later is supplied from the tip part. It can be taken out by Le.

  Between the front-side component supply devices 3B and 3D and the rear-side component supply devices 3A and 3C, there are two supply conveyors, positioning units 8 and 8 (having a conveyor) that constitute the substrate transport mechanism, and discharge. A conveyor is provided. Each supply conveyor transports each printed circuit board P received from upstream to each positioning unit 8, and after each electronic component is mounted on each substrate P positioned by a positioning mechanism (not shown) in each positioning unit 8, It is transported to each discharge conveyor and then transported to the downstream device.

  Each beam 10 that moves along the guide rail 9 by the Y-axis drive motor 11 in the Y direction is provided with a mounting head 6 that is moved by the X-axis drive motor 13 in the longitudinal direction, that is, in the X direction. Are provided with a plurality of suction nozzles. The mounting head 6 is equipped with a vertical axis drive motor 14 for moving the suction nozzle up and down, and a θ-axis drive motor 15 for rotating around the vertical axis. Therefore, the suction nozzle of the mounting head 6 can move in the X direction and the Y direction, can rotate about the vertical axis, and can move up and down.

  Reference numeral 12 denotes a component recognition camera having a wide imaging area. The electronic component is imaged for recognizing the position of the electronic component with respect to the suction nozzle in terms of the XY direction and the rotation angle. Reference numeral 19 denotes a board recognition camera provided in the mounting head 6 for picking up an image of a recognition mark attached to the printed board P. The images captured by the cameras 12 and 19 are subjected to recognition processing by the recognition processing device 23.

  Next, the control block diagram of FIG. 2 will be described. The electronic component mounting apparatus 1 includes a CPU (Central Processing Unit) 20 as a control apparatus that performs overall control of the mounting apparatus 1, and a bus line connected to the CPU 20. RAM (Random Access Memory) 21 and ROM (Read Only Memory) 22 are provided. The CPU 20 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 22 based on the data stored in the RAM 21. That is, the CPU 20 controls driving of the Y-axis drive motor 11, the X-axis drive motor 13, the vertical axis drive motor 14, the θ-axis drive motor 15, and the like via the interface 24 and the drive circuit 27.

  As shown in FIG. 3, the RAM 21 has an X direction (represented by “X”) and a Y direction (represented by “X”) of the mounting coordinates of each electronic component in the printed circuit board P for each mounting order (step number). Mounting data composed of “Y” and angle information (represented by “Z”), arrangement number information of each component supply unit 5 (represented by “feeder”), and the like are stored.

  The RAM 21 stores information (see FIG. 4) of the type (component ID) of each electronic component corresponding to the arrangement number of each component supply unit 5, and further features of the electronic component for each component ID. And the like library library data (see FIG. 5) is stored. The component library data includes inspection designation data that designates that an expensive electronic component is to be inspected for the presence of foreign matter before being mounted on the printed circuit board P. In addition, although it specified that it test | inspects with component library data, you may specify in mounting data, for example.

  The RAM 21 stores in advance a plurality of reference images in a predetermined size region in the mounting region of the printed circuit board P, for example, for each region in which one electronic component is mounted. That is, a plurality of reference images in the entire mounting area of the printed board P are stored.

  A recognition processing device 23 is connected to the CPU 20 via an interface 24. The recognition processing device 23 performs recognition processing of an image captured by the component recognition camera 12 or the board recognition camera 19. The processing result is sent to the CPU 20. That is, the CPU 20 outputs an instruction to the recognition processing device 23 to perform recognition processing on the images captured by the component recognition camera 12 and the board recognition camera 19 and receives a recognition processing result from the recognition processing device 23.

  Reference numeral 25 denotes a monitor for displaying a part image and a screen for setting various data. The monitor 25 is provided with various touch panel switches 26 as input means. Can be set.

  With the above configuration, the production operation of the printed circuit board P will be described along the flowchart of FIG. First, when the electronic component mounting apparatus 1 is automatically operated, the printed circuit board P is carried from the upstream apparatus (step S1), conveyed to the positioning unit 8 via the supply conveyor, and positioned and fixed by the positioning mechanism.

  Then, when the printed circuit board P is carried in, whether or not electronic components and other foreign matters are dropped on the printed circuit board P before starting to mount the first electronic component on the printed circuit board P. Inspection, i.e., inspection is performed on the entire mounting area of the printed circuit board P to see if electronic components and other foreign matters are dropped on the printed circuit board P (step S2). This inspection for the presence of foreign matter will be described based on the inspection flowchart of FIG.

  First, the CPU 20 drives the Y-axis drive motor 11 to move the beam 10 in the Y direction, drives the X-axis drive motor 13 to move the substrate recognition camera 19 in the X direction, and is positioned and fixed by the positioning unit 8. The mounted area of the printed circuit board P is imaged for each area of a predetermined size. In this case, it is not always necessary to image the entire mounting area of the printed circuit board P, but it is only necessary to image the entire mounting area, and the area to be imaged may be reduced as necessary.

  Then, after imaging the mounting area of the printed circuit board P for each area of a predetermined size, a plurality of reference images corresponding to the captured image, for example, for each area where one electronic component is mounted, are stored in the RAM 21. Since it is stored, the CPU 20 obtains and positions the first input image thus picked up and the corresponding reference image (steps S101 and S102).

  Here, as shown in FIG. 8, a method of positioning using individual recognition marks will be described. The left part of FIG. 8 is a reference image, and the right part is an input image. The recognition processing device 23 recognizes and recognizes the individual recognition marks MK1 and MK2 of the reference image and the individual recognition marks MN1 and MN2 of the input image. As described above, the CPU 20 performs alignment.

  Note that positioning may be performed without using individual recognition marks. That is, as shown in FIG. 12, while the reference image corresponding to the left input image displayed on the monitor 25 is sequentially moved, the CPU 20 changes g to the reference image, h as shown in FIG. Is used as an input image to obtain a correlation coefficient, which is the degree of coincidence between the two images, and is positioned at the highest value and aligned.

  That is, first, with respect to the 4 × 4 16 pixels of the reference image and the 16 pixels at the upper left of the input image, Equation 1 is calculated for each pixel, and the correlation coefficient of these 16 pixels as a whole is obtained ( 1st) Next, the reference image is moved to the right by shifting one pixel, and 4 × 4 16 pixels in the reference image and 16 pixels in the input image in which the reference image is shifted by one pixel to the right are those pixels. Equation 1 is calculated every time to obtain the correlation coefficient of these 16 pixels as a whole (second time). Next, the reference image is further shifted to the right by one pixel, and the 4 × 4 16 pixels of the reference image and the input image shifted by one pixel to the right (two pixels from the beginning) For the 16 pixels, Equation 1 is calculated for each of these pixels, and the correlation coefficient of these 16 pixels as a whole is obtained (third time). Next, the reference image is moved downward by one pixel, and the 4 × 4 16 pixels of the reference image and the 16 pixels of the input image in which the reference image is shifted downward by one pixel are set for each pixel. The above equation 1 is calculated to obtain the correlation coefficient of these 16 pixels as a whole (fourth time). Next, the reference image is shifted leftward by one pixel to similarly obtain the correlation coefficient of the entire 16 pixels (fifth time), and further shifted leftward by one pixel to similarly obtain the correlation coefficient of the entire 16 pixels (6 Second time). Then, the reference image is shifted downward by one pixel to similarly obtain the correlation coefficient for the entire 16 pixels (seventh time), and further shifted rightward by one pixel to similarly obtain the correlation coefficient for the entire 16 pixels (eighth time). Further, the correlation coefficient of the entire 16 pixels is obtained in the same manner by shifting one pixel to the right (the ninth time). In this way, a total of nine correlation coefficients are obtained, and since the degree of coincidence is high at the correlation coefficient having the highest value, alignment is performed at this position.

  Note that the degree of inconsistency may be obtained by Expression 2 shown in FIG. 14 or the degree of inconsistency may be obtained by Expression 3 shown in FIG. 15. The smaller the value, the higher the degree of coincidence. In these cases, the smallest value is obtained. Align with.

  After this alignment, the CPU 20 calculates the difference between the input image on the right side and the corresponding reference image on the left side (step S103), and there is a foreign object DT in addition to the land LN as shown in FIG. In this case, there is a difference between the input image and the reference image, and the portion of the foreign matter DT has a gradation value different from that of other regions. Therefore, the foreign matter DT is detected by taking the difference for each pixel. Can do.

  Next, the CPU 20 expands and contracts the pixels determined to have a difference and connects them (step S104). This pixel expansion / contraction process will be described with reference to FIG. 10. The black portion is a pixel determined to have a difference, and the white portion is a pixel determined to have no difference, which will be described in detail below. . First, paying attention to a pixel determined to have a difference, that is, a black pixel, expansion processing is performed, and white pixels existing around the black pixel are replaced with black pixels (from the upper left portion of FIG. 10 to the upper middle portion). Section). Subsequently, when the shrinking process is performed, the black pixels having a small area disappear (see the upper right part of FIG. 10 from the upper right part of the lower stage), and when the expansion process is further performed, one shape emerges and can be identified as the foreign object DT. (See the lower center of FIG. 10).

  Therefore, if the pixels determined to have a difference are connected by expansion / contraction processing, the features can be extracted, and for example, the foreign matter DT can be determined from the position, size, area, perimeter, circularity, etc. ( Step S105).

  This feature extraction will be described below with reference to FIG. 11. When extracting a feature that seems to be a foreign object DT from an image obtained by connecting pixels determined to have the above-described difference by expansion / contraction processing, first, With the upper left corner as the origin of the coordinate system, the center position in the X direction is 4, and the center position in the Y direction is 7. The size is 5 in the X direction and 3 in the Y direction, and the area is 5 (X direction) × 3 (Y direction) = 15. The perimeter is (5 + 3) × 2 = 16, and the circularity is (4π × area) / (perimeter length × perimeter length) = 0.73.

  Therefore, features can be extracted from the position, size, area, perimeter, circularity, etc., and these values can be compared with the reference threshold stored in the RAM 21 and the CPU 20 to determine whether or not it is a foreign object DT. .

  Therefore, in step S3 of FIG. 6, it is determined whether or not there is the foreign matter DT as described above. As a result of the inspection as described above, if the CPU 20 determines that there is the foreign matter DT, the CPU 20 determines that the electronic component mounting apparatus 1 is present. The electronic component is controlled to stop the mounting operation, and the notification means visually (for example, displays on the monitor 25) or audibly notifies that there is a foreign object DT on the printed circuit board P (step S9). .

  At this time, the operator understands that the foreign matter DT is on the printed circuit board P, and removes the printed circuit board P released from positioning by the positioning mechanism from the positioning unit 8 and discards it (step S10). To do.

  On the other hand, if it is determined in step S3 that the foreign matter DT is not present by the CPU 20, control is performed so as to start the operation of mounting the electronic component on the printed circuit board P (step S4).

  That is, the mounting head 6 moves according to the mounting data stored in the RAM 21, and the electronic component to be mounted by the suction nozzle corresponding to the component type of the electronic component is sucked out from the predetermined component supply unit 5. More specifically, the suction nozzle of the mounting head 6 moves so as to be positioned above the component supply unit 5 that stores electronic components to be mounted in accordance with the mounting order. However, in the Y direction, the Y-axis drive motor 11 is driven and the beam 10 is moved. In the X direction, the X-axis drive motor 13 is driven and the mounting head 6 is moved, and the component supply unit 5 has already been driven by the feed motor and the peeling motor so that the component can be taken out at the component suction and take-out position. Therefore, the vertical axis drive motor 14 lowers the suction nozzle to pick up and take out the electronic components, and then the mounting head 6 moves up.

  The suction nozzle moves so as to mount the electronic component at a predetermined position on the printed circuit board P positioned by the positioning unit 8. While the mounting head 6 moves, the component recognition is performed while the mounting head 6 moves. The electronic component sucked and held by the suction nozzle when passing the upper position of the camera 12 is imaged by the component recognition camera 12 (fly recognition).

  Based on this imaging result, the recognition processing device 23 recognizes how much the electronic component is displaced and held with respect to the suction nozzle by the recognition processing device 23, but the Y-axis drive motor 11 The suction nozzle that holds the electronic component by driving the X-axis drive motor 13 moves to the printed board P. Before the electronic component is mounted on the printed board P, the board recognition camera 19 captures an image of the recognition mark attached to the printed board P, and the recognition processing device 23 performs recognition processing to grasp the position of the printed board P. Therefore, the Y axis drive motor 11, the X axis drive motor 13, and the θ axis drive motor 15 are added by the CPU 20 by adding the position recognition result of the printed circuit board P and the position recognition processing result of each component to the mounting coordinates of the suction and mounting order data. Is corrected, and the electronic nozzles are mounted at predetermined positions on the printed circuit board P while the suction nozzles of the mounting heads 6 correct the positional deviation.

  As described above, electronic components are sequentially mounted on the printed circuit board P. In these mounting processes, an electronic component has fallen abnormally, or an electronic component to be mounted in the future is the component. It is determined by the CPU 20 whether or not the inspection is specified by the library data (step S5).

  When it is determined that an electronic component drop abnormality has occurred, for example, when the CPU 20 determines that the air pressure at the suction nozzle that should suck and hold the electronic component is based on the detection value by the flow meter, as described above, An inspection is performed as to whether or not there is a foreign object at the mounting points before and after the occurrence of the abnormality (step S6). In addition, when an abnormality or the like of the vertical axis drive motor 14 or the θ axis drive motor 15 occurs and the electronic component mounting apparatus 1 stops the mounting operation, the mounting point inspection before and after the stop is started before the mounting operation is started. It may also be possible to perform control so that the operation is not started when there is a foreign object.

  In this way, the inspection of whether there is a foreign object at the mounting points before and after the occurrence of the abnormality is because the electronic component drop abnormality occurs because the electronic component in front of the electronic component to be mounted is This is because it is after mounting and before moving and mounting for mounting the next electronic component.

  In this inspection, if the CPU 20 determines that an electronic component drop abnormality has occurred, the mounting point immediately before the abnormality occurrence on the printed circuit board P is inspected.

  That is, for example, when an electronic component having a step number 0004 in the mounting data is taken out from the component supply unit 5 and it is determined that the electronic component has dropped, the periphery including the mounting coordinates of the step number 0003 is moved XY. The board recognition camera 19 takes an image. Then, as shown in FIG. 7, the CPU 20 acquires and positions the captured input image and the corresponding reference image, and the CPU 20 calculates the difference between the input image and the corresponding reference image. Next, the CPU 20 expands and contracts the pixels that are determined to have a difference, and as a foreign object DT, one shape emerges and can be identified, and its features can be extracted. For example, the foreign substance DT can be determined from the position, size, area, perimeter, circularity, and the like.

  Next, as a result of the inspection of the mounting point immediately before the occurrence of the abnormality as described above, the CPU 20 determines whether or not there is a foreign object DT (step S8). The electronic component is controlled to stop the mounting operation, and the notification means visually (for example, displays on the monitor 25) or audibly notifies that there is a foreign object DT on the printed circuit board P (step S9). .

  At this time, the operator understands that the foreign matter DT is on the printed circuit board P, and removes the printed circuit board P released from positioning by the positioning mechanism from the positioning unit 8 and discards it (step S10). To do.

  On the other hand, as described above, the mounting point immediately before the occurrence of the abnormality on the printed circuit board P is inspected, and if the CPU 20 determines that there is no foreign matter DT, then the step number that is the mounting point immediately after the occurrence of the abnormality on the printed circuit board P The board recognition camera 19 that has moved XY around the periphery including the mounting coordinates 0004 takes an image, inspects the mounting point immediately after the occurrence of the abnormality (step S6), and the CPU 20 determines the presence or absence of the foreign matter DT (step S8). .

  As a result of the inspection of the mounting point immediately after the occurrence of the abnormality as described above, if the CPU 20 determines that there is a foreign object DT, the CPU 20 controls the electronic component mounting apparatus 1 to stop the mounting operation of the electronic component and prints the printed circuit board. The notification means visually (for example, displays on the monitor 25) or audibly notifies that there is a foreign substance DT on P (step S9). At this time, the operator understands that the foreign matter DT is on the printed circuit board P, and removes the printed circuit board P released from the positioning by the positioning mechanism from the positioning unit 8 and discards it (step S10). ).

  Then, in step S6, whether or not there is a foreign object DT is checked for the mounting points before and after the occurrence of an abnormality. If the CPU 20 determines that there is no foreign object DT, the last mounting point of the mounting data. It is determined whether or not (the last step number to be mounted) (step S11). If it is determined that there is still an electronic component to be mounted and it is not the last mounting point, the process returns to step S4 to mount the electronic component. Will be continued, and will be complete | finished if it determines with it being the last attachment point.

  In the process of sequentially mounting electronic components on the printed circuit board P, in step S5 described above, an electronic component drop abnormality has occurred, or an electronic component to be mounted is inspected with the component library data. When it is determined by the CPU 20 whether or not it is designated, it is designated to inspect like the electronic component (part supply unit arrangement number 102) of the step number 0007 of the mounting data. Even in this case, the above-described inspection is performed on the mounting point of the electronic component (step S7).

  In this case, the inspection when an electronic component drop abnormality occurs is performed on the mounting points before and after the drop abnormality occurs. The difference is that the inspection is performed only on the component mounting points, and the processing after the inspection is the same as the processing in the case where an electronic component drop abnormality occurs, and is omitted here.

  When it is determined that there is a foreign matter DT as a result of the inspection, the operator takes out the printed board P from the positioning unit 8 and discards it. However, the operation is stopped in step S8, and the printed board P is removed. Is attached with data indicating that the inspection is defective, and when the printed circuit board P is sent to the downstream electronic component mounting apparatus 1, this data is also transmitted so that the electronic component mounting apparatus 1 on the downstream side does not mount the electronic component. The same control is performed when sending to the electronic component mounting apparatus 1 further downstream. For example, the operator may take out the printed circuit board P from the electronic component mounting apparatus at the most downstream side.

  Next, the case where the printed board P is a split board (having a plurality of split board portions) on which electronic components are mounted in a repetitive pattern will be described below. First, in step S3 of FIG. 6, when the CPU 20 determines that there is a foreign matter DT based on the inspection, a bad mark is printed on the split substrate portion with the foreign matter DT by a printing device, or a sticker representing the bad mark is attached. A control different from that of a normal printed board P that is not a split board is performed in that mounting of an electronic component to a split board portion that is not marked with a bad mark is started. In addition, instead of printing a bad mark on the split substrate portion with the foreign matter DT or sticking a sticker indicating the bad mark, an area for storing the presence / absence data of the bad mark for each split substrate portion is provided in the RAM 21 in advance. “Yes” data may be stored in this area.

  In addition, as described above, it is specified that an electronic component has started to be mounted, and that during the mounting process, an electronic component has fallen abnormally, or that an electronic component to be mounted will be inspected using the component library data. If the inspection is performed and the CPU 20 determines that the foreign matter DT is present in step S8, a bad mark is printed on the split substrate portion where the foreign matter DT is present, and the bad mark is not attached. The control different from the normal printed circuit board P that is not the split board is also performed in that the electronic component is continuously mounted on the split board section. The above control is performed until there is an electronic component to be mounted.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 5 Component supply unit 19 Substrate recognition camera 20 CPU
21 RAM
25 Monitor

Claims (7)

  In an electronic component mounting method in which an electronic component supplied from a component supply device is taken out by a suction nozzle and mounted on a printed circuit board, before the first electronic component is mounted on the printed circuit board, the electronic component is mounted on the printed circuit board. An electronic component mounting method characterized by performing an inspection to determine whether there is a foreign object. In an electronic component mounting method in which an electronic component supplied from a component supply device is taken out by a suction nozzle and mounted on a printed circuit board.
It is determined whether or not an abnormal drop of the electronic component has occurred in the process of sequentially mounting the electronic component on the printed circuit board P,
An electronic component mounting method comprising: inspecting whether or not a foreign object is present at mounting points before and after the occurrence of a drop abnormality when it is determined that a drop abnormality of the electronic component has occurred. In an electronic component mounting method in which an electronic component supplied from a component supply device is taken out by a suction nozzle and mounted on a printed circuit board.
It is determined whether or not there is an inspection designation for an electronic component to be mounted in the process of sequentially mounting the electronic component on the printed circuit board P,
An electronic component mounting method, wherein when it is determined that there is an inspection designation, an inspection is performed as to whether or not there is a foreign object at a mounting point of the electronic component with the inspection designation.   4. The apparatus according to claim 1, wherein the inspection is performed to determine whether or not there is a foreign object, and when it is determined that there is a foreign object, the electronic component mounting operation is controlled to stop. The electronic component mounting method described.   In the case where the printed circuit board P is a divided board having a plurality of divided board portions and electronic components are mounted in a repeated pattern, the inspection for whether there is a foreign object is performed and it is determined that there is a foreign object Attaches a bad mark to the board part that has been determined to have foreign matter, and stops mounting electronic components on this board part, and controls to place electronic parts on other board parts. The electronic component mounting method according to any one of claims 1 to 3, wherein:   4. The inspection according to any one of claims 1 to 3, wherein when the inspection for foreign matter is performed and it is determined that there is a foreign matter, a notification means notifies the presence of the foreign matter. Electronic component mounting method. The inspection first images the printed circuit board with a substrate recognition camera,
Calculate the difference between the input image obtained for this imaging and the corresponding reference image,
Pixels that are determined to be different are calculated and connected by expansion / contraction processing,
4. The electronic component mounting method according to claim 1, wherein one of the shapes is raised and specified.

Images