JP2020129591A - Component mounting system and mounting board manufacturing method - Google Patents

Abstract

To provide a component mounting system and a mounting board manufacturing method that can improve the quality of a mounting board.SOLUTION: A mounting board manufacturing method includes a first mounting step (ST2 to ST4) of mounting a first component on a board by a first mounting device, a board transfer step (ST5) of transferring the board out of the first mounting device and transferring the board to a mounting device, and a mounting work step (ST7) of executing mounting work on the carried-in board by the mounting device. The mounting work is not performed on the board on which an abnormality has occurred in the first mounting device while being located inside the first mounting device (Yes in ST6).SELECTED DRAWING: Figure 8

Description

The present invention relates to a component mounting system for mounting components on a substrate and a method for manufacturing a mounted substrate.

A component mounting system that manufactures a mounting substrate in which components are mounted on a substrate mounts a plurality of components on the substrate while sequentially delivering the substrates by a plurality of mounting devices (for example, see Patent Document 1). The component mounting system described in Patent Document 1 includes an inspection device that inspects a mounting state of components mounted on a board between a plurality of connected mounting devices, and a board in which a mounting defect is detected by the inspection device. Skips the mounting of the component by the mounting device on the downstream side of the inspection device. As a result, it is possible to prevent waste of further mounting the components on the board having the mounting failure.

JP, 2012-227496, A

However, in the related art including Patent Document 1, it is not possible to prevent further components from being mounted on the board in which mounting failure has occurred in the mounting apparatus on the upstream side of the inspection apparatus. Further, even if an abnormality occurs in which the component is dropped onto the board in the mounting apparatus, if the dropped component is out of the inspection range, there is a problem that the defect is not detected in the inspection by the inspection device.

Therefore, an object of the present invention is to provide a component mounting system and a method of manufacturing a mounting board that can improve the quality of the mounting board.

A component mounting system according to the present invention includes a first mounting apparatus that mounts a first component on a board, and a mounting apparatus that executes a mounting operation on the board carried out from the first mounting apparatus. If an abnormality occurs in the first mounting device while the substrate is located inside the first mounting device, the mounting work is not performed on the substrate.

A mounting board manufacturing method according to the present invention comprises a first mounting step of mounting a first component on a board by a first mounting apparatus, and carrying out the board from the first mounting apparatus to a mounting apparatus. A substrate transfer step of transferring and a mounting operation step of executing a mounting operation on the board that has been carried in by the mounting apparatus, the first mounting apparatus being positioned inside the first mounting apparatus. The mounting work is not performed on the board for which an abnormality has occurred in the mounting apparatus.

According to the present invention, the quality of the mounting board can be improved.

Structure explanatory drawing of the component mounting system of one embodiment of this invention Structure explanatory drawing of the 1st mounting apparatus with which the component mounting system of one embodiment of this invention is equipped. Block diagram showing the configuration of a management computer according to an embodiment of the present invention The figure which shows an example of the abnormal process information memorize|stored in the memory|storage device with which the management computer of one embodiment of this invention is equipped. The figure which shows an example of the production board information memorize|stored in the memory|storage device with which the management computer of one embodiment of this invention is equipped. (A) (b) (c) Process explanatory drawing of the manufacturing of the mounting substrate in the component mounting system of one embodiment of this invention. (A) (b) (c) Process explanatory drawing of the manufacturing of the mounting substrate in the component mounting system of one embodiment of this invention. Flowchart of a method of manufacturing a mounting board in the component mounting system according to the embodiment of the present invention

An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, and the like described below are examples for description, and can be appropriately changed according to the specifications of the component mounting system and the mounting apparatus. In the following, corresponding elements are denoted by the same reference numerals in all the drawings, and overlapping description will be omitted. In FIG. 2 and a part to be described later, an X direction (horizontal direction in FIG. 2) of the substrate transport direction and a Y direction orthogonal to the substrate transport direction are shown as biaxial directions orthogonal to each other in the horizontal plane. In FIG. 2, the Z direction (vertical direction in FIG. 2) is shown as the height direction orthogonal to the horizontal plane. The Z direction is the vertical direction or the orthogonal direction when the component mounting apparatus is installed on a horizontal plane.

First, the configuration of the component mounting system 1 will be described with reference to FIG. The component mounting system 1 includes a first mounting device M1, a second mounting device M2, an inspection device M3, and a substrate transfer/collection device M4 from the upstream side (left side of the paper surface) in the substrate transfer direction toward the downstream side (right side of the paper surface). , The reflow device M5 and the like are configured by serially connecting a mounting device that executes the mounting work to the substrate. Each mounting device is connected to the management computer 3 via the communication network 2. The component mounting system 1 carries out a mounting work in each mounting device while sequentially transporting a substrate having solder printed on the lands carried into the first mounting device M1, and manufactures a mounting substrate on which components are mounted on the substrate. To do.

The first mounting apparatus M1 and the second mounting apparatus M2 each include a plurality of feeders 4 for supplying components to be mounted on the board, and a mounting head on which nozzles for holding the components are mounted. The component mounting operation is performed in which the component supplied by the feeder 4 is taken out by the suction nozzle and mounted on the mounting position of the board. On the front surfaces of the first mounting apparatus M1 and the second mounting apparatus M2, a plurality of operation buttons 5 including a production start button, a production stop button, a power cutoff button, and the like are arranged. When the work start button is operated, production of the mounting board is started. Also, when the production stop button is operated, the movement of the mounted head, etc. will be stopped. When the power cutoff button is operated, the power supply to the device is forcibly cut off.

In FIG. 1, the inspection device M3 includes an inspection camera, and executes an inspection work for inspecting the state of the components mounted on the board. The inspection result is transmitted to the management computer 3. The board transfer/recovery apparatus M4 receives the board from the inspection apparatus M3 and, according to a command from the management computer 3, collects the board to be discarded due to mounting failure or the like into the stocker 6 (see FIG. 6). When not discarding, the substrate is carried out to the reflow device M5 (the mounting work is executed). The reflow device M5 executes a reflow operation of heating a substrate carried into the device by a substrate heating unit to melt and solder the solder on the substrate and to bond a land of the substrate and an electrode of a component.

The state of the mounting apparatus in which the mounting work is being performed, information about an abnormality that occurred during the mounting work, and the like are sequentially transmitted to the management computer 3. As described above, the component mounting system 1 includes the first mounting apparatus M1 and the mounting apparatuses (the second mounting apparatus M2 and the inspection apparatus M3) that execute the mounting work on the board carried out from the first mounting apparatus M1. , A substrate transfer/collection device M4, and a reflow device M5).

Next, the configurations of the first mounting apparatus M1 and the second mounting apparatus M2 will be described with reference to FIG. The first mounting apparatus M1 and the second mounting apparatus M2 have the same configuration, and the first mounting apparatus M1 will be described here. The first mounting apparatus M1 includes a board transfer mechanism 11. The substrate transfer mechanism 11 includes a substrate loading unit 12, an intermediate transfer unit 13, and a substrate unloading unit 14 in order from the upstream side in the X direction. The substrate loading unit 12 receives the substrate B from the upstream device and transports it downstream. The intermediate transfer section 13 receives the board B from the board loading section 12 and transfers it to the downstream side to position the board B in the mounting work area W. The substrate unloading unit 14 receives the substrate B from the intermediate transfer unit 13 and unloads it to the downstream device.

A mounting head 15 is arranged above the substrate transfer mechanism 11. The mounting head 15 includes a suction nozzle 16 that holds the component P at the lower end by vacuum suction, and a nozzle elevating mechanism 17 that moves the suction nozzle 16 up and down. The mounting head 15 reciprocates between the feeder 4 and the upper portion of the substrate B positioned in the mounting work area W by the mounting head moving mechanism 18, and holds the component P supplied by the feeder 4 by the suction nozzle 16. It is mounted on the mounting position of the board B.

In FIG. 2, the mounting head 15 includes a flow rate sensor 19 that measures the flow rate of the air flowing in from the suction nozzle 16. The flow rate sensor 19 can determine whether the suction nozzle 16 holds the component P or not by measuring the inflow amount of air. While the suction nozzle 16 takes out the component P from the feeder 4 and transfers the component P to the mounting position of the board B, the suction state of the component P may be bad and the component P may be dropped. Even in such a case, by measuring the inflow amount of air by the flow rate sensor 19 before mounting the component P on the board B, the component P held by the suction nozzle 16 due to the abnormality of the component drop occurs first. It is possible to detect the drop in the first mounting device M1.

Next, with reference to FIG. 3, the configuration regarding the function of the management computer 3 will be described. The management computer 3 includes a processing unit 20, a storage device 23, an input unit 24, and a display unit 25. The processing unit 20 is a data processing device such as a CPU, and includes a production monitoring unit 21 and an abnormality occurrence processing unit 22 as internal processing units. Note that the management computer 3 does not have to be configured by one computer, and may be configured by a plurality of devices. For example, the storage device may be a file server connected to the communication network 2.

The input unit 24 is an input device such as a keyboard, a touch panel, and a mouse, and is used when inputting operation commands and data. The display unit 25 is a display device such as a liquid crystal panel, and displays various data stored in the storage device 23, and also displays various information such as an operation screen for operation by the input unit 24.

In FIG. 3, the production monitoring unit 21 monitors the work status, work result, occurrence of abnormality, etc. of the mounting board (board B on which the mounting work is performed) manufactured by the component mounting system 1. Specifically, data such as work status, work result, abnormality occurrence information, and inspection result are sequentially acquired from the mounting apparatus that constitutes the component mounting system 1. The storage device 23 stores abnormality processing information 23a, production board information 23b, and the like. The abnormality processing information 23a includes information about the subsequent processing of the board B in the mounting apparatus at the time when an abnormality occurs in each mounting apparatus.

Here, an example of the abnormality processing information 23a of the first mounting apparatus M1 will be described with reference to FIG. In the abnormality processing information 23a, post-processing 31 after the occurrence of the abnormality is designated for each type 30 of the abnormality that has occurred in the first mounting apparatus M1. In this example, "power off", "part drop", and "emergency stop" are shown as the type 30 of the abnormality. The post-processing 31 is designated for each position of the board B when an abnormality occurs. In this example, when the substrate B is in the substrate loading unit 12 (post-processing 31a), in the intermediate transfer unit 13 (post-processing 31b), and in the substrate unloading unit 14 (post-processing 31c), Each is specified. The post-processing 31 of “discard” indicates that the board B is a waste board that skips the mounting work and is discarded. When the post-processing 31 is "continue", the board B continues the mounting work.

In FIG. 4, when "power cutoff" occurs in which the power supply to the first mounting apparatus M1 is cut off due to a power failure or operation of the power cutoff button (operation button 5), mounting is performed on all the boards B in the apparatus. Since there is a possibility that a defect has occurred, the post-processing 31a, 31b, 31c is designated as "discard" at all positions. When a “component drop” occurs in which the component P held from the suction nozzle 16 falls, the post-processing 31 of the board B at the position where the component P may drop is designated as “discard”. In this example, since the component P may drop on all the boards B in the apparatus, the post-processing 31a, 31b, 31c is designated as "discard" at all positions.

An "emergency stop" occurs in which the component mounting work of the first mounting apparatus M1 is stopped due to detection of an abnormality by a sensor installed in the device, operation of a production stop button (operation button 5) during component mounting work, and the like. In this case, since there is a possibility that a mounting failure has occurred in the board B during the component mounting work in the mounting work area W of the intermediate transfer section 13, the post-processing 31b of the board B in the intermediate transfer section 13 is designated as “discard”. ing. On the other hand, since the substrates B in the substrate loading unit 12 and the substrate unloading unit 14 are not affected, the post processing 31a and 31c is designated as "continuation". As described above, the abnormality includes power-off of the first mounting apparatus M1, drop of the component P inside the first mounting apparatus M1, and emergency stop of the first mounting apparatus M1. The abnormality processing information 23a is appropriately changed according to the configuration of the first mounting apparatus M1.

In FIG. 3, the abnormality generation processing unit 22 determines whether the abnormality has occurred in the mounting device and the downstream mounting device based on the abnormality processing information 23a and the abnormality generation information acquired by the production monitoring unit 21 from the mounting device. The abnormality occurrence processing including the transmission of the instruction of is executed. The abnormality occurrence information transmitted from the mounting apparatus includes identification information such as a board number that identifies the board B that was in the mounting apparatus when the abnormality occurred, and the type of the abnormality that occurred. In the abnormality occurrence processing, the abnormality occurrence processing section 22 updates the information of the corresponding board B in the production board information 23b based on the abnormality occurrence information. That is, when an abnormality occurs in the mounting apparatus, the production board information 23b is updated based on the abnormality occurrence information.

Here, an example of the production board information 23b will be described with reference to FIG. FIG. 5 is production board information 23b in the manufacturing state of the component mounting system 1 shown in FIG. In the production board information 23b, a board state 33, an abnormality type 34, and a board position 35 when an abnormality occurs are stored for each board number 32 which is identification information of the board B.

The substrate state 33 indicates the processing state of the substrate B at that time, and “manufacturing” indicates that it is being manufactured or has been manufactured, “disposal” is a discarding substrate, or is designated as a discarding substrate. It indicates that The abnormality type 34 is the same as the abnormality type 30 of the abnormality processing information 23a. The position 35 of the board when the abnormality occurs is information for identifying the positions of the mounting apparatus and the board B in which the abnormality has occurred in the apparatus. In this way, the storage device 23 stores the identification information (board number 32) of the discarded board determined to be discarded. Hereinafter, the substrate having the substrate number 32 of "1" is described as a substrate B1, and the substrate of "2" is described as a substrate B2.

In FIG. 5, the substrates B1 to B3 are the manufacturing conditions shown in FIG. 6A, that is, the substrate B1 is at the position of the substrate unloading unit 14 and the substrate B2 is at the position of the intermediate transfer unit 13 in the first mounting apparatus M1. When the board B3 is at the position of the board carry-in section 12, an abnormality of "emergency stop" has occurred. At this time, the abnormality generation processing unit 22 determines that the board B2 is "discard" and the boards B1 and B3 are "continue" based on the failure processing information 23a, and the board state 33 of the board B2 is "manufacturing". Has been updated from "to disposal". Further, "emergency stop" is stored in the abnormality type 34, and the positions of the boards B1 to B3 are stored in the board position 35 when the failure occurs.

In FIG. 5, the board B4 is determined to be a mounting failure by the manufacturing status shown in FIG. 7B, that is, the inspection by the inspection device M3. At that time, the abnormality generation processing unit 22 updates the state 33 of the board from “manufacturing” to “discard”, sets “abnormal mounting” to the type of abnormality 34, and “inspection device” to the position 35 of the board when the abnormality occurs. I remember each one.

In FIG. 5, the boards B5 to B7 are the manufacturing conditions shown in FIG. 7B, that is, the board B5 is located at the board unloading section 14 and the board B6 is located at the intermediate transfer section 13 in the second mounting apparatus M2. When the board B7 is at the position of the board carry-in section 12, an abnormality of "component drop" occurs. At that time, the abnormality generation processing unit 22 determines that the substrates B5 to B7 are “discard” based on the abnormality processing information 23a, and updates the state 33 of the substrate from “manufacturing” to “discard”. In addition, “part drop” is stored in the abnormality type 34, and the positions of the boards B5 to B7 are stored in the board position 35 when the failure occurs.

In FIG. 3, in the abnormality occurrence processing, the abnormality occurrence processing unit 22 determines that the discarding board in which the state 33 of the board is stored as “discard” is loaded into the mounting apparatus based on the production board information 23b. Send instructions not to perform implementation work.

Next, with reference to FIG. 6 and FIG. 7, description will be made on the manufacture of a mounting board for carrying out the mounting work on the boards B1 to B10 while conveying the boards B1 to B10 by the mounting apparatus of the component mounting system 1. In FIG. 6A, the board B<b>1 has a predetermined component P mounted in the intermediate transfer section 13 of the first mounting apparatus M<b>1 and is transferred to the board unloading section 14. Hereinafter, the predetermined component P mounted on the boards B1 to B10 in the first mounting apparatus M1 will be referred to as “first component P1”. That is, the first mounting apparatus M1 mounts the first component P1 on the boards B1 to B10. The board B2 is undergoing component mounting work in the intermediate transfer unit 13. The board B3 is on standby in the board carry-in section 12.

In this state, assume that an abnormality of "emergency stop" occurs in the first mounting apparatus M1. When an abnormality occurs, the first mounting apparatus M1 transmits to the management computer 3 the abnormality occurrence information including the identification information (board number 32) of the boards B1 to B3 inside and the abnormality type. In the management computer 3, the abnormality occurrence processing section 22 updates the production board information 23b stored in the storage device 23 based on the abnormality occurrence information. That is, when an abnormality occurs while the boards B1 to B3 are located inside the first mounting apparatus M1, the first mounting apparatus M1 stores the identification information of the boards B1 to B3 and the abnormality type information in the storage device 23. Send to. When the abnormality is “power off”, the first mounting apparatus M1 transmits the abnormality occurrence information to the storage device 23 after restarting.

Due to the "emergency stop" abnormality that has occurred in the first mounting apparatus M1, the board B2 becomes a waste board, and the mounting of the first component P1 on the board B2 after the occurrence of the abnormality is skipped. That is, when an abnormality occurs before the first mounting apparatus M1 mounts the first component P1 on the board B2, the first mounting apparatus M1 does not mount the first component P1 on the board B2 after that. Since the abnormality that occurred is "emergency stop", the manufacturing of the substrates B1 and B3 is continued. Next, the board B1 is transferred to the intermediate transfer unit 13 of the second mounting apparatus M2 (arrow a1).

In FIG. 6B, a predetermined component P is mounted on the board B1 in the intermediate transfer unit 13 of the second mounting apparatus M2. Hereinafter, the predetermined component P mounted on the boards B1 to B10 in the second mounting apparatus M2 will be referred to as “second component P2”. That is, the second mounting apparatus M2 is a mounting apparatus that mounts the second component P2 on the boards B1 to B10 carried out from the first mounting apparatus M1. The board B3 is mounted with the first component P1 in the intermediate transfer unit 13 of the first mounting apparatus M1 and then transferred to the intermediate transfer unit 13 of the second mounting apparatus M2 (arrow a2).

In FIG. 6C, the board B1 on which the first component P1 and the second component P2 are mounted is transported to the inspection device M3 and the inspection work is executed. There is no mounting defect on the board B1, and after the inspection work, the board B1 is transferred to the reflow apparatus M5 via the board transfer/collection apparatus M4 (arrow a3). When the board B2, which is a waste board, is carried into the second mounting apparatus M2, the abnormality generation processing unit 22 sends an instruction from the management computer 3 to the board B2 not to execute the mounting work. Upon receiving the instruction, the second mounting apparatus M2 carries out the component mounting operation on the board B2 and directly carries it out to the inspection apparatus M3. According to the instruction from the management computer 3, the inspection device M3 carries out the substrate B2 to the substrate transfer/recovery device M4 without performing the inspection work.

In this way, the second mounting apparatus M2 (mounting apparatus) does not perform the mounting work on the board B2 when the carried-in board B2 is stored in the storage device 23 as a discarded board. That is, if the second mounting apparatus M2, which is a mounting apparatus, has an abnormality in the first mounting apparatus M1 while the board B2 is located inside the first mounting apparatus M1, the board B2 The second component P2 is not mounted (the mounting work is not performed on the board B2). In addition, the inspection apparatus M3, which is a mounting apparatus, inspects the board B2 when an abnormality occurs in the first mounting apparatus M1 while the board B2 is located inside the first mounting apparatus M1. Do not run.

In FIG. 6C, the second component P2 is mounted on the board B3 that is not the discard board in the intermediate transfer unit 13 of the second mounting apparatus M2. The board B4 has the first component P1 mounted by the first mounting apparatus M1 and is transported to the board loading unit 12 of the second mounting apparatus M2. The first component P1 is mounted on the board B5, and the board B5 is conveyed to the board unloading unit 14 of the first mounting apparatus M1. The board B6 is mounted with the first component P1 in the first mounting apparatus M1.

In FIG. 7A, in accordance with an instruction from the management computer 3, the substrate transfer/collection device M4 recovers the transferred discarded substrate B2 in the stocker 6 (arrow a4). That is, the substrate B2 is collected (discarded) before the reflow work is performed. In this way, the component mounting system 1 is a reflow device that is a mounting device when an abnormality occurs in the first mounting device M1 while the board B2 is located inside the first mounting device M1. The reflow work (mounting work) of the board B2 by M5 is not executed.

The board B3 on which the first component P1 and the second component P2 are mounted is conveyed to the inspection device M3 and the inspection work is executed. There is no mounting defect on the board B3, and the board B3 is transported to the reflow device M5 after the inspection work. The board B4 is mounted with the second component P2 in the intermediate transfer unit 13 of the second mounting apparatus M2, and then transferred to the inspection apparatus M3 (arrow a5).

In FIG. 7B, it is assumed that the board B4 is determined to be defective in mounting by the inspection work of the inspection apparatus M3. The inspection device M3 transmits the inspection result to the management computer 3, and the management computer 3 updates the production board information 23b stored in the storage device 23 based on the inspection result. As a result, the substrate B4 becomes a discarded substrate, and is collected (discarded) by the stocker 6 of the substrate transfer/collection device M4 without being transferred to the reflow device M5 (FIG. 7C).

In FIG. 7B, the board B<b>5 has the second component P<b>2 mounted in the intermediate transfer section 13 of the second mounting apparatus M<b>2 and is transferred to the board unloading section 14. The board B6 is undergoing component mounting work in the intermediate transfer unit 13. The board B7 is on standby in the board carry-in section 12. In this state, it is assumed that an abnormality of “component drop” has occurred in the second mounting apparatus M2. The second mounting apparatus M2 transmits the abnormality occurrence information to the management computer 3, and the abnormality occurrence processing unit 22 updates the production board information 23b using the boards B5 to B7 as the waste boards. As a result, the substrates B5 to B7 that have become discarded substrates are sequentially collected in the stocker 6 of the substrate transfer/collection device M4 (FIG. 7C).

Next, a method of manufacturing a mounting board in the component mounting system 1 will be described along the flow of FIG. 8 with reference to FIGS. 6 and 7. First, the manufacture of a mounting board for mounting the component P (first component P1, second component P2) on the substrate B1 in the component mounting system 1 will be described. In FIG. 8, the board B1 is carried into the first mounting apparatus M1 and is positioned in the mounting work area W by the board carry-in section 12 and the intermediate carrying section 13 (ST1: board carry-in step). Next, when no abnormality has occurred in the first mounting apparatus M1 (No in ST2), the first component P1 is mounted on the board B1 (ST3: first component mounting step).

If the mounting of all the planned first components P1 has not been completed (No in ST4), ST2, the first component mounting process (ST3), and ST4 are repeatedly executed. That is, ST2 to ST4 are a first mounting step of mounting the first component P1 on the board B1 by the first mounting apparatus M1. When all the planned first components P1 are mounted on the board B1 (Yes in ST4), the board B1 is unloaded from the first mounting apparatus M1 and transferred to the second mounting apparatus M2 (mounting apparatus). (ST5: substrate transfer step) (arrow a1 in FIG. 6A).

In FIG. 8, when the board B1 is transferred to the second mounting apparatus M2, the abnormality generation processing unit 22 of the management computer 3 determines whether the board B1 is a discarded board (ST6: determination step). Specifically, in the determination step (ST6), in the production board information 23b stored in the storage device 23, the board B1 carried into the second mounting apparatus M2 (mounting apparatus) is discarded board (board state). It is determined whether 33 is stored as "discard").

Since the board B1 is not stored as a discarded board (No in ST6), the second mounting apparatus M2 mounts the second component P2 on the board B1 (FIG. 6B). That is, the mounting apparatus (second mounting apparatus M2) executes the mounting operation step (ST7) for executing the mounting operation (component mounting operation) on the carried-in board B1. When all the planned second components P2 are mounted, the board B1 is unloaded from the second mounting apparatus M2 (ST8: board unloading step). After that, the board B1 is inspected for the state of the components P (first component P1, second component P2) mounted in the inspection device M3, and then conveyed to the reflow device M5 (arrow a3 in FIG. 6C). ) Reflow work is executed.

Next, manufacturing of a mounting board for mounting the component P (first component P1, second component P2) on the substrate B2 in the component mounting system 1 will be described. In FIG. 8, the board B2 is carried into the first mounting apparatus M1 in the board carrying-in step (ST1). In the first mounting apparatus M1, an abnormality of “emergency stop” occurs in the process of mounting the first component P1 on the board B2 while repeating ST2 to ST4 (first mounting process) (Yes in ST2).

When an abnormality occurs while the board B2 is located inside the first mounting apparatus M1 (Yes in ST2), the first mounting apparatus M1 includes the abnormality occurrence information including the identification information of the board B2 and the abnormality type information. Is transmitted to the management computer 3 (storage device 23) (ST9: identification information transmitting step). In the management computer 3, the abnormality occurrence processing section 22 updates the production board information 23b based on the received abnormality occurrence information. As a result, the storage device 23 stores that the board B2 is a waste board.

In FIG. 8, when an abnormality occurs in the first mounting apparatus M1, the subsequent component mounting work is skipped, and the board B2 is transferred to the second mounting apparatus M2 by the board transfer step (ST5) (FIG. 6(b )). That is, in the first mounting step (ST2 to ST4), when an abnormality occurs before the first mounting apparatus M1 mounts the first component P1 on the board B2, the first mounting apparatus M1 then The planned first component P1 is not mounted on the board B2.

Next, in the determination step (ST6) executed, the board B2 is determined to be a discarded board (Yes), the mounting work step (ST7) is skipped, and the board B2 is removed from the second mounting apparatus M2 by the board unloading step (ST8). Be shipped. That is, when the board B2 is judged to be a discarded board in the judgment step (ST6) (Yes), the mounting work step (ST7) is omitted. Specifically, the second mounting apparatus M2 mounts the second component P2 on the board B2 in which the abnormality has occurred in the first mounting apparatus M1 while being located inside the first mounting apparatus M1. No (do not perform implementation work).

The inspection work (mounting work) in the inspection device M3 is omitted, and the substrate B2 carried out from the second mounting device M2 is transferred to the substrate transfer/recovery device M4. The substrate transfer/recovery device M4 recovers (discards) the substrate B2 to the stocker 6 without carrying out the substrate B2 to the reflow device M5 (without performing the mounting work) (arrow a4 in FIG. 7A). That is, in the component mounting system 1, the board B2 is not subjected to the reflow work (mounting work) in the reflow device M5.

As described above, the component mounting system 1 executes the mounting work on the first mounting apparatus M1 for mounting the first component P1 on the board B and the board B carried out from the first mounting apparatus M1. And a mounting device (a second mounting device M2, an inspection device M3, a reflow device M5). If an abnormality occurs in the first mounting apparatus M1 while the board B is located inside the first mounting apparatus M1, the mounting work is not performed on the board B. As a result, when it is required to discard the board B, which may have a mounting failure for quality assurance, without repairing it, it is possible to omit the mounting work after the occurrence of an abnormality and improve the manufacturing efficiency of the mounting board. The quality of the mounting substrate can be improved while suppressing the deterioration.

In the above description, the first mounting apparatus M1 transmits the abnormality occurrence information to the management computer 3 (storage device) when an abnormality occurs, but the present invention is not limited to this mode. For example, the first mounting apparatus M1 transmits the abnormality occurrence information to the second mounting apparatus M2 on the downstream side, and the second mounting apparatus M2, based on the received abnormality occurrence information, mounts the component in the case of a discarded board. The work (mounting work) may be omitted, and the abnormality occurrence information may be transmitted to the inspection device M3 on the downstream side when the discarded substrate is carried out. That is, when an abnormality occurs, the abnormality occurrence information may be transmitted to the mounting apparatus on the downstream side at the same time when the discarded substrate is carried out. In this case, each mounting apparatus is provided with a storage device that stores abnormality occurrence information including identification information (board number 32) of the discarded board determined to be discarded.

In addition, the first mounting apparatus M1 includes a laser mark device that marks a discard mark on the upper surface of the board B to indicate that the board is a waste board, and the second mounting apparatus M2 includes a camera that images the upper surface of the board B. In the above, the first mounting apparatus M1 stamps and carries out the disposal mark on the board B inside when the abnormality occurs, and the second mounting apparatus M2 images the upper surface of the board B with the camera and has the disposal mark. In this case, the component mounting work (mounting work) may be omitted.

INDUSTRIAL APPLICABILITY The component mounting system and the mounting substrate manufacturing method of the present invention have the effect of improving the quality of the mounting substrate, and are useful in the field of mounting components on a substrate.

1 Component Mounting System B, B1 to B10 Substrate M1 First Mounting Device M2 Second Mounting Device (Mounting Device)
M3 inspection device (mounting device)
M4 board transfer/collection device (mounting device)
M5 reflow equipment (mounting equipment)
P1 First part P2 Second part

Claims (14)

A first mounting device for mounting the first component on the board;
A mounting device that performs a mounting operation on the substrate carried out from the first mounting device;
A component mounting system that does not execute the mounting work on the substrate when an abnormality occurs in the first mounting device while the substrate is located inside the first mounting device. Further comprising a storage device for storing identification information of the discarded board determined to be discarded,
The first mounting apparatus transmits identification information of the board to the storage device when the abnormality occurs while the board is located inside the first mounting apparatus,
The component mounting system according to claim 1, wherein the mounting apparatus does not perform mounting work on the board when the carried-in board is stored in the storage device as a waste board. The component mounting system according to claim 2, wherein the first mounting apparatus transmits the information of the abnormality type together with the identification information of the substrate to the storage device when the abnormality occurs. The component mounting system according to any one of claims 1 to 3, wherein the abnormality includes power-off of the first mounting apparatus. The component mounting system according to claim 1, wherein the abnormality includes a drop of the first component inside the first mounting apparatus. The component mounting system according to claim 1, wherein the abnormality includes an emergency stop of the first mounting apparatus. The first mounting device does not mount the first component on the substrate when the abnormality occurs before the first mounting device mounts the first component on the substrate. 6. The component mounting system according to any one of 6. The mounting apparatus is a second mounting apparatus that mounts a second component on the board carried out from the first mounting apparatus,
In the case where the abnormality has occurred in the first mounting device while the substrate is located inside the first mounting device, the second mounting device may include the second component on the substrate. The component mounting system according to claim 1, wherein the component mounting system is not mounted. The mounting apparatus is an inspection apparatus that inspects the state of the first component mounted on the board carried out from the first mounting apparatus,
8. The inspection device does not inspect the substrate when an abnormality occurs in the first mounting device while the substrate is located inside the first mounting device, wherein the inspection device does not inspect the substrate. The component mounting system according to any one. A first mounting step of mounting the first component on the board by the first mounting device;
A substrate transfer step of unloading the substrate from the first mounting apparatus and transferring it to the mounting apparatus;
A mounting work step of performing a mounting work on the board carried in by the mounting device;
A method for manufacturing a mounting board, wherein mounting work is not performed on the board in which an abnormality has occurred in the first mounting apparatus while being positioned inside the first mounting apparatus. An identification information transmitting step of transmitting identification information of the board to the storage device when the abnormality occurs while the board is located inside the first mounting apparatus;
Further comprising a determination step of determining whether or not the substrate carried into the mounting apparatus is stored in the storage device as a discarded substrate,
The method of manufacturing a mounting board according to claim 10, wherein the mounting operation step is omitted when the board is determined to be a discarded board in the determination step. The mounting board manufacturing method according to claim 11, wherein, in the identification information transmitting step, the abnormality type information is transmitted to the storage device together with the substrate identification information. In the first mounting step, if the abnormality occurs before the first mounting apparatus mounts the first component on the substrate, the first mounting apparatus causes the first component to be mounted on the substrate. 13. The method for manufacturing a mounting board according to claim 10, wherein the mounting board is not mounted. The mounting apparatus is a second mounting apparatus that mounts a second component on the board carried out from the first mounting apparatus,
The second mounting apparatus does not mount the second component on the board on which the abnormality has occurred in the first mounting apparatus while being located inside the first mounting apparatus. 14. The method for manufacturing a mounting board according to any one of 10 to 13.

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