CN101945568B - Electronic compound mounting device - Google Patents
Electronic compound mounting device Download PDFInfo
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- CN101945568B CN101945568B CN201010220217.5A CN201010220217A CN101945568B CN 101945568 B CN101945568 B CN 101945568B CN 201010220217 A CN201010220217 A CN 201010220217A CN 101945568 B CN101945568 B CN 101945568B
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Abstract
The invention relates to an electronic component mounting device for preventing absorption error and leading-back of electronic components. The electronic componet mounting device (100) is provided with: a pressure detection unit (125) detecting the inner pressure of an adsorption nozzle (105); and an acquisition control unit (30) of absorption required time, wherein the absorption action of the absorption nozzle is carried out through a negative pressure supply unit (122) in a component supply part (102) relative to each electronic component when mounting action control is not carried out, and the pressure detection unit measures and stores the absorption required time till the detection pressure becomes the target absorption pressure, and the absorption nozzle is raised after the absorption of each electronic component is continuous through the negative supply unit according to the absorption required time obtained by the acquisition control unit of absorption required time when the action control unit is installed on the electronic compound. The acquisition control unit of absorption required time makes the absorption nozzle to rise after the absorption required time is measured, and after a positive supply unit performs absorption and release to the electronic component.
Description
Technical field
The present invention relates to and a kind ofly utilize adsorption mouth attract electrons parts and carry out the electronic component mounting apparatus installed.
Background technology
Existing electronic component mounting apparatus, have and carry adsorption mouth and the boarded head that can move freely on an x-y plane, by making adsorption mouth from the feed appliance attract electrons parts of electronic unit, boarded head is moved to the parts mount position of substrate, in adsorption mouth, supply malleation in installation site and discharge electronic unit, carrying out the installation of electronic unit thus.
But along with the difference of electronic unit, the difference such as size, weight, surfacing of electronic unit, sometimes when adsorbing, from producing air leakage (gas leakage) between adsorption mouth front end and electronic component surface, thus cannot obtain sufficient confining force.
Therefore, in the electronic component mounting apparatus such as described in patent documentation 1, each electronic unit is preset to the air leakage parameter representing leakiness, with this air leakage parameter accordingly, the control carrying out making the translational speed of boarded head to reduce, prevents falling or offseting relative to the position of adsorption mouth of electronic unit.
In addition, there is following problems, namely, tack between some electronic units and the front end of adsorption mouth is too high, and when being released from this front end, electronic unit cannot be separated, directly under the state of attract electrons parts, boarded head is moved to next destination locations, i.e. the so-called problem taken back.
Therefore, in the electronic component mounting apparatus such as described in patent documentation 2, to easily producing the electronic unit taken back, carry out the slippage reducing adsorption mouth, or the adsorption mouth reduced when adsorbing is to the control of the pressing force (tack) of electronic unit, prevents from taking back.
Patent documentation 1: Japanese Unexamined Patent Publication 2007-242818 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2007-250795 publication
Summary of the invention
But, due in the prior art shown in above-mentioned patent documentation 1, adopt the method for the translational speed reducing boarded head according to air leakage parameter, so error when cannot prevent the supply unit attract electrons parts from electronic unit and mention.
In addition, in the prior art of above-mentioned patent documentation 1,2, carry out with leakage parameters and represent that the parameter producing the easiness taken back is for benchmark, Leakage prevention and the countermeasure taken back, but be difficult to each electronic unit, predicting leakage parameters in advance and represent the parameter producing the easiness taken back, in practice, is carrying out carrying and the laggard row relax of generation accident.
In addition, the parameter of easiness is taken back in leakage parameters and expression, must be conceived to each phenomenon, set for each electronic unit by user itself, pretty troublesome.
The object of the invention is to, before the installation performing electronic unit, suppress the generation reducing relative to the absorption affinity of adsorption mouth or take back, and, do not need the setting operation being carried out electronic component characteristic by operating personnel.
The invention that technical scheme 1 is recorded is a kind of electronic component mounting apparatus, and it has: board holder, and it keeps the substrate carrying out electronic unit installation, parts supply unit, described multiple electronic unit that its supply will be installed, boarded head, it has liftable adsorption mouth, and this adsorption mouth is for adsorbing the electronic unit carried to described substrate, negative pressure feeding unit, it applies negative pressure to described adsorption mouth, malleation feed unit, it applies malleation to described adsorption mouth, boarded head travel mechanism, it makes described boarded head comprising from the region of described parts supply unit to described board holder, at random running fix, and action control unit, it is based on installation data, and perform and control relative to the installation action of described substrate, it is characterized in that having: pressure sensing cell, it detects the internal pressure of described adsorption mouth, and absorption required time obtains control unit, it is before the described installation action of execution controls, for described each electronic unit, at the parts receiving position of described parts supply unit, the absorption action of described adsorption mouth is carried out by described negative pressure feeding unit, and, measure and store pressure that described pressure sensing cell detects and reach absorption required time till target affinity pressure, described action control unit, when the installation of electronic unit, according to the absorption required time being obtained control unit by described absorption required time and obtain, after absorption being continued to each electronic unit by described negative pressure feeding unit, described adsorption mouth is made to increase, obtain after control unit measures described absorption required time at described absorption required time, the absorption release of electronic unit is carried out by described malleation feed unit, then described adsorption mouth is made to increase.
The feature of the invention that technical scheme 2 is recorded is, there is the structure identical with the invention that technical scheme 1 is recorded, and, there is release required time and obtain control unit, its described do not perform installation action control time, for each electronic unit becoming mounting object in described installation data, at the parts receiving position of described parts supply unit, the absorption action making to become in described adsorption mouth target affinity pressure is carried out by described negative pressure feeding unit, and, measure and store and to be made in described adsorption mouth from described target affinity pressure until becoming the release required time till target release pressure by described malleation feed unit, described action control unit, when the installation of electronic unit, according to the release required time being obtained control unit by described release required time and obtain, continue to carry out the absorption release of each electronic unit by described malleation feed unit after, described adsorption mouth is made to increase.
The feature of the invention that technical scheme 3 is recorded is, there is the structure identical with the invention that technical scheme 2 is recorded, and, described release required time obtains control unit, from described absorption required time obtain control unit in order to carry out adsorb required time measurement and making to become in described adsorption mouth the state of target affinity pressure, perform and make by described malleation feed unit the action control becoming target release pressure in described adsorption mouth, thus measure described release required time.
The feature of the invention that technical scheme 4 is recorded is, there is the structure identical with the invention that technical scheme 2 is recorded, and, described release required time obtains control unit, from becoming the state of target affinity pressure in described adsorption mouth, malleation supply is carried out with the release required time of prediction by described malleation feed unit, when not becoming target release pressure in described adsorption mouth, the release required time of described prediction is made repeatedly to carry out above-mentioned action with the change of the unit interval of regulation, thus the described release required time obtained for becoming described target release pressure.
The feature of the invention that technical scheme 5 is recorded is to have the structure identical with the invention that technical scheme 2 is recorded, and have: parts absorption detecting unit, it to whether described adsorption mouth being adsorbed with electronic unit detects, and release required time confirms control unit, it makes to become target affinity pressure in described adsorption mouth and attract electrons parts, under the state making this adsorption mouth increase, based on the release required time being obtained control unit by described release required time and obtain, carry out malleation supply, and, stopping from the supply of this malleation after the stand-by time of regulation, judge whether described electronic unit is released by described parts absorption detecting unit, described release required time confirms control unit, above-mentioned action is repeatedly carried out with the change of the unit interval of regulation by making described stand-by time, till described electronic unit is released, obtain suitable stand-by time thus, and, described action control unit, when the installation of electronic unit, according to described release required time, the absorption release of each electronic unit is carried out by described malleation feed unit, then, after confirming by described release required time the stand-by time that control unit obtains, described adsorption mouth is made to increase.
The effect of invention
In the invention that technical scheme 1 is recorded, due to for each electronic unit becoming mounting object, obtain the absorption required time till the target affinity pressure becoming absorption, when installation action controls, absorption is continued according to the absorption required time obtained, so under the state reaching target affinity pressure, carry out rising and the movement of electronic unit, can restrain adsorption time error, mobile in the falling of electronic unit, generation relative to the position skew etc. of adsorption mouth front end, realize the reliability of action and the raising of installation site precision.
In addition, due to before execution installation action controls, obtain the absorption required time till the target affinity pressure becoming absorption, make a mistake when installation action so be different from and identify the electronic unit that this is the air leakage easily producing electronic unit for the first time, thus implement the situation of leaking countermeasure, even if when operating personnel does not carry out leakage characteristics identification to each electronic unit, also can automatically with leakage characteristics accordingly, carry out installation action, and more reduce the generation of mistake.
In addition, do not need operating personnel to carry out setting input operation to the leakage characteristics of each electronic unit, miscellaneous property of setting operation can be eliminated.
In addition, in technical scheme 1, such as, when setting " target affinity pressure " respectively for each electronic unit in installation data etc., measure the absorption required time reached till the target affinity pressure of each electronic unit, when " the target affinity pressure " with electronic unit independently setting general-purpose, for each electronic unit, measure the absorption required time till the target affinity pressure reaching identical.
And, because absorption required time obtains the measurement of the absorption required time in control, carry out at the parts receiving position of parts supply unit, and, after a measurement, carried out the absorption release of electronic unit by malleation feed unit after, adsorption mouth is made to increase, so electronic unit can not be removed from parts supply unit, its result, the measurement in order to adsorb required time can be avoided and waste electronic unit, the raising of economy can be realized.
In the invention that technical scheme 2 is recorded, due to relative to each electronic unit becoming mounting object, obtain the release required time that the supply beginning through malleation from adsorbed state makes to become in adsorption mouth till target release pressure, when installation action controls, according to the release required time obtained, carry out the release of adsorbing, so taking back of electronic unit can be suppressed, realize the raising of Reliability of Microprocessor.
In addition, due to when not performing installation action and controlling, obtain and become release required time till target release pressure by malleation feed unit, so be different from, to make a mistake when installation action and identify this be for the first time the electronic unit taken back easily producing electronic unit, thus the situation of implementation measure, even if when operating personnel not to each electronic unit identify easily produce the characteristic taken back, also automatically can carry out the installation action avoiding taking back, and more reduce the generation of mistake.
In addition, do not need operating personnel whether easily to produce for each electronic unit and take back and carry out setting input operation, the miscellaneous property setting operation can be eliminated.
And, because release required time obtains the measurement of the release required time in control, after the parts receiving position of parts supply unit carries out, adsorption mouth is made to increase, even if so when carrying out the measurement discharging required time, electronic unit can not be removed from parts supply unit, its result, the measurement in order to discharge required time can be avoided and waste electronic unit, the raising of economy can be realized.
In addition, so-called " target release pressure " is for making the pressure departed from from adsorption mouth by the electronic unit adsorbed, preferably from the pressure in the scope of atmospheric pressure to malleation critical value.In addition, so-called malleation critical value, refers to when electronic unit departs from, and the electronic unit not making this electronic unit or be arranged on surrounding is pressure that the is degree of occurrence positions skew because of jet.
In addition, in technical scheme 2, such as, when setting " target release pressure " respectively for each electronic unit in installation data etc., measure the absorption required time reached till the target release pressure of each electronic unit, when " the target release pressure " with electronic unit independently setting general-purpose, for each electronic unit, measure the release required time till the target release pressure reaching identical.
In the invention that technical scheme 3 is recorded, control unit is obtained owing to utilizing release required time, from in order to obtained by described absorption required time control unit carry out adsorb required time measurement and making to become in adsorption mouth the state of target affinity pressure, the action control becoming target release pressure is performed by the malleation supply of malleation feed unit, measure release required time, so absorption required time obtains the measurement of the absorption required time of control unit, the measurement of the release required time of control unit is obtained with release required time, carry out in a series of control, with carry out respectively adsorbing the negative pressure feeding action making to become in adsorption mouth till target affinity pressure that required time obtains control unit, the situation of the negative pressure feeding action become in adsorption mouth till target affinity pressure that makes obtaining control unit with release required time is compared, can shorten significantly absorption required time and release required time obtain the required time.
In the invention that technical scheme 4 is recorded, release required time obtains control unit, from becoming the state of target affinity pressure in adsorption mouth, make the malleation of malleation feed unit change for the unit interval of giving to specify and carry out retry, obtain the release required time becoming target release pressure.The measurement of release required time, also can monitor the detected pressures of pressure sensing cell, measure from the supply of malleation to the time reached target release pressure, but when being carried out actual malleation supply by action control and stopping, easy generation time is poor, even if control according to Measuring Time, the value that neither measure of the interior pressure of adsorption mouth sometimes.Therefore, if adopt by actual set release required time and implement, and repeatedly carry out the method whether adsorption mouth becomes the retry of target affinity pressure, time then required for the action control being supplied to stopping from malleation is reflected in release required time, so from the impact just comprising the time difference at first, therefore, required time can be discharged accurately.
Thus, release required time can be measured more accurately, more effectively prevent taking back of electronic unit, and, the position skew of other electronic units when can prevent installation action.
In the invention that technical scheme 5 is recorded, owing to being confirmed that by release required time control unit obtains the rear stand-by time of release, and, action control unit, from by making adsorption mouth become the state of target release pressure absorption release, waiting for after stand-by time, making in adsorption mouth
Rise, so taking back of electronic unit can be prevented more reliably.
Accompanying drawing explanation
Fig. 1 is the vertical view of the entirety of the electronic component mounting apparatus represented involved by present embodiment.
Fig. 2 is the block diagram of the control system representing electronic component mounting apparatus.
Fig. 3 is the front view of the boarded head of electronic component mounting apparatus.
Fig. 4 is the flow chart that absorption required time obtains control.
Fig. 5 represents from the switching of switching electromagnetically operated valve, the line chart of the state of the pressure change in adsorption mouth.
Fig. 6 is the flow chart that release required time obtains control.
Fig. 7 represents when the internal pressure of adsorption mouth is in the target affinity pressure of three phases, the line chart of the state of the pressure change in adsorption mouth when making switching electromagnetically operated valve carry out switching controls and carry out malleation supply with the predetermined stand-by period.
Fig. 8 is the flow chart that release required time confirms to control.
Fig. 9 is that electronic unit installs the flow chart controlled.
Embodiment
(working of an invention mode)
Based on Fig. 1 to Fig. 9, embodiments of the present invention are described.Below, as shown in the drawing, both direction orthogonal is in a horizontal plane set to X-direction and Y direction respectively.In addition, the vertical orthogonal with them is set to Z-direction.
Electronic component mounting apparatus 100 as shown in Figure 1, has: first component supply unit 102, and supply arranges as multiple electronic unit feed appliances 101 of the electronic unit of mounting object along X-direction and keeps by it; Second component supply unit 104, it is configured for the pallet 103 loading various electronic unit; Substrate supply unit 108, it is along X-direction conveying substrate; Board holder (not shown), it is arranged in the substrate transport path of this substrate supply unit 108, for carrying out the electro part carrying operation relative to substrate K; Boarded head 106, it liftably keeps multiple, such as 6 adsorption mouth 105, carries out the maintenance of electronic unit T; As the X-Y portal frame 107 of boarded head travel mechanism, boarded head 106 is driven conveying to the optional position in the operating area comprising 2 parts supply units 102,104 and board holder by it; Pedestal 114, it carries and supports above-mentioned each structure; Pneumatics loop 120, it makes each adsorption mouth 105 become to be less than atmospheric atmospheric pressure state (negative pressure) and to be more than or equal to atmospheric atmospheric pressure state (malleation); And action control unit 10, it carries out the action control of above-mentioned each structure.
The action control unit 10 of above-mentioned electronic component mounting apparatus 100, preserve the installation data of the record various setting contents relevant to the installation of electronic unit, from above-mentioned installation data, read and represent the electronic unit that should install and the data etc. based on the installation site on the parts receiving position of electronic unit feed appliance 101 setting position of electronic unit and substrate.In addition, above-mentioned action control unit 10 pairs of X-Y portal frames 107 control, by boarded head 106 to the receiving position of electronic unit and installation site conveying, in position, boarded head 106 is controlled, carry out lifting action and the absorption-release movement of adsorption mouth 105.In addition, above-mentioned action control unit 10, in the conveying of boarded head 106, uses component recognition apparatus 113 described later, the angle that the position of electronic unit when adsorbing and adsorption mouth rotate detects, and the action control such as executing location correction and angular adjustment.
(substrate supply unit and board holder)
Substrate supply unit 108 has not shown conveyer belt, utilizes this conveyer belt to be carried along X-direction by substrate K.
In addition, as noted above, in the substrate transport path of substrate supply unit 108, the shown position of substrate K in FIG and job position place, be provided with the board holder for being fixed maintenance to substrate K when being carried to substrate K by electronic unit.Substrate K is delivered to board holder and stops by substrate supply unit 108, utilizes not shown maintaining body to carry out the maintenance of substrate K.That is, substrate K be kept mechanism keep state under, carry out stable electro part carrying operation.
(first and second parts supply unit)
First component supply unit 102 is arranged on Y direction one end of pedestal 114, is arranged by multiple electronic unit feed appliance 101 and can carry out the region along X-direction of carrying.At the upper surface of the par of first component supply unit 102, multiple electronic unit feed appliance 101 arranges along X-direction and loads installation.In addition, each electronic unit feed appliance 101 arranges latching mechanism, by the operation of latching mechanism, can to attaching/detaching on first component supply unit.
Above-mentioned electronic unit feed appliance 101 maintains tep reel (omitting diagram) in rearward end side, it reels by electronic unit with the collecting band of a large amount of inclosure all at equal intervals, and, near leading section, as noted above, there is the transport unit 101a transmitting electronic unit to boarded head 106.
When the installation action of electronic unit, adsorption mouth 105 is positioned at as on the transport unit 101a of the electronic unit feed appliance 101 carrying object by boarded head 106, carries out the transmission of electronic unit.
Second component supply unit 104, on pedestal 114, to be arranged on along Y direction across substrate supply unit 108 with on the end of first component supply unit 102 opposite side.
The pallet be configured on this second component supply unit 104 has multiple recess, and be arranged electronic unit in each recess.
In addition, when the installation action of electronic unit, adsorption mouth 105 is positioned at the recess place stored as the electronic unit carrying object by boarded head 106, carries out the transmission of electronic unit.
(X-Y portal frame)
X-Y portal frame 107 has: X-axis guide rail 107a, and it guides the movement of boarded head 106 along X-direction; Two Y-axis guide rail 107b, boarded head 106 guides along Y direction by it together with this X-axis guide rail 107a; As the X-axis motor 109 of drive source, it makes boarded head 106 move along X-direction; And as the Y-axis motor 110 of drive source, it makes boarded head 106 move along Y direction via X-axis guide rail 107a.
In addition, by the driving of each motor 109,110, the roughly whole region of boarded head 106 between two Y-axis guide rail 107b can be carried.
In addition, each motor 109,110, by making respective rotation amount be identified by action control unit 10, being controlled to the rotation amount into expecting, carrying out the location of adsorption mouth 105 thus via boarded head 106.
In addition, according to the needs of electronic unit installation exercise, above-mentioned first and second parts supply unit 102,104, board holder is all configured in the region of the boarded head carried 106 of X-Y portal frame 107.
In addition, in the region that this can be carried, be provided with the discarded case 116 discarded by the electronic unit producing bad grade.
(boarded head)
Fig. 3 is the front view of the boarded head 106 from the point of view along Y direction.Boarded head 106 is provided with: six adsorption mouth 105, utilizes air attracting holding electronic unit T at its leading section; Six Z axis motor 111 (only illustrating in fig. 2), it makes each adsorption mouth 105 be elevated along Z-direction respectively; Six turning motors 112, it rotates respectively for making each adsorption mouth 105, carries out angular adjustment around Z-direction to kept electronic unit; Marker recognition camera 115, it is for taking the mark of substrate K, thus identifies substrate position; And component recognition apparatus 113, it detects relative to the position of adsorption mouth leading section and the angle of Z axis rotation being adsorbed on the electronic unit in each adsorption mouth 105.In addition, in fig. 2, only each motor 111,112 is illustrated to an adsorption mouth 105, but in fact, each motor 111,112 is set for each adsorption mouth 105 be mounted on boarded head 106.
Above-mentioned each adsorption mouth 105 is with the state along Z-direction, and liftable and be rotatably supported on boarded head 106, can carry out reception or the installation of electronic unit by lifting, and by rotating the angular adjustment carrying out electronic unit.
In addition, component recognition apparatus 113, from the multiple light sources along X-direction spread configuration, laser irradiation is carried out along Y direction to the electronic unit of the front end of adsorption mouth 105, by receiving its reverberation, obtain reverberation according within the scope of in the X-axis direction which, position and the angle of the electronic unit of adsorption mouth front end can be identified.
In addition, this component recognition apparatus 113 can according to or without this reverberation, and to the leading section in adsorption mouth 105, whether attract electrons parts detect, and work as " parts absorption detecting unit ".
(pneumatics loop)
Pneumatics loop 120 has: positive pressure source 121, and it produces the pneumatics of malleation; Negative pressure generating device 122, it utilizes the raw negative pressure of air miscarriage of positive pressure source; Decompressor 123, it is by reduce pressure to the malleation produced from positive pressure source 121 and the electric air conditioner being adjusted to authorized pressure is formed; Switch with electromagnetically operated valve 124, it switches the negative pressure produced from negative pressure generating device 122 and the malleation exported from decompressor 123, supplies to each adsorption mouth 105; And pressure sensing cell 125, it detects the internal pressure of each adsorption mouth 105.
Above-mentioned positive pressure source 121 and decompressor 123 work as the malleation feed unit applying malleation to adsorption mouth 105, and above-mentioned negative pressure generating device 122 works as the negative pressure feeding unit applying negative pressure to adsorption mouth 105.
Above-mentioned switching electromagnetically operated valve 124 can switch to negative pressure feeding state, malleation supply condition, by these three positions of state of loop closedown, this switching action is controlled by action control unit 10.By said structure, pneumatics loop 120, when adsorption mouth 105 carries out the absorption of electronic unit, makes switching electromagnetically operated valve 124 carry out switching controls, to make negative pressure generating device 122 be connected with adsorption mouth 105, carries out the supply of negative pressure and become adsorbable state.
In addition, when the adsorbed state of the electronic unit from adsorption mouth 105 discharges, switching electromagnetically operated valve 124 carries out switching controls, to make decompressor 123 be connected with adsorption mouth 105, carries out the supply of malleation and is discharged by electronic unit.
In addition, omit the diagram in pneumatics loop 120, but in fact, respectively pneumatics loop 120 is prepared to multiple adsorption mouth 105.
(action control unit)
As shown in Figure 2, action control unit 10 mainly has: CPU30, it is according to the control program of regulation, performs various process and control to the switching electromagnetically operated valve 124 in the X-axis motor 109 of X-Y portal frame 107, Y-axis motor 110, the Z axis motor 111 that boarded head 106 carries out the lifting of adsorption mouth 105, the turning motor 112 carrying out the rotation of adsorption mouth 105, pneumatics loop 120, pressure sensing cell 125, component recognition apparatus 113 and marker recognition camera 115; System ROM12, it stores the program for performing various process and control; RAM13, it, by storing various data, becomes the operating area of various process; I/F (interface) 14, it realizes the connection of CPU30 and various equipment; Nonvolatile memory devices 17, the installation data needed for its installation action such as list, the installation site of each electronic unit, the receiving position of electronic unit storing the electronic unit installed to substrate controls and other set informations etc.; Guidance panel 15, it is for carrying out the input of the data needed for various setting or operation; And display 18, it carries out the prompting etc. of various setting content and necessary information.In addition, above-mentioned each motor 109 ~ 112 is all the servomotors with encoder, is connected with I/F14 via not shown servo-driver.
Above-mentioned CPU30, when the installation exercise of electronic unit, read in installation data from storage device 17, from this installation data, obtain the list of the various electronic units of the mounting object become relative to substrate, the receiving position of each electronic unit and the information of installation site.
Then, CPU30 controls X-axis and Y-axis motor 109,110, is carried by the receiving position of boarded head 106 to this electronic unit, Z axis motor is controlled, adsorption mouth 105 is declined, attract electrons parts, make adsorption mouth 105 increase, then boarded head 106 is delivered to installation site.
In addition, CPU30, in the conveying of installation site, uses component pose recognition unit, carries out the position of adsorbed electronic unit relative to adsorption mouth and the detection of the adsorption mouth anglec of rotation, control turning motor 112, performs angle correct.In addition, when being located to installation site by boarded head 106, consider that electronic unit corrects relative to the position of adsorption mouth.
Then, utilize Z axis motor that adsorption mouth 105 is declined, complete the installation of electronic unit.
All electronic units that CPU30 subtend substrate carries perform above-mentioned action repeatedly.
In addition, CPU30 is according to the various programs be stored in system ROM12, carry out absorption required time obtain control, release required time obtain control, release required time confirm control, to obtain the important set information relevant to the absorption action in the installation of electronic unit.Below, describe these in detail to control.
(absorption required time obtains control)
Absorption required time obtains control, it is the process that CPU30 performs according to the program in system ROM12, such as carry out following process: do not perform installation action after the main power source of device is just connected or after just having obtained new installation data etc. when controlling, for each electronic unit becoming mounting object in installation data, adsorption mouth 105 is positioned at transport unit 101a (or recess of the pallet 103) place of electronic unit feed appliance 101, in this position, adsorption mouth 105 is made to drop to absorption height, negative pressure feeding is carried out by switching solenoid valve 124, under the state of attract electrons parts, CPU30 monitors pressure sensing cell 125, measure the absorption required time till the target affinity pressure arriving absorption.
In addition, this process is carried out all electronic units becoming each parts supply unit 102,104 of mounting object in installation data, is stored in storage device 17 by the absorption required time of each electronic unit.
In addition, the target affinity pressure of above-mentioned absorption, is the pressure that the adsorption mouth 105 that can make to be adsorbed with electronic unit rises, can carries out setting value by guidance panel 15.
In this example embodiment, being illustrated for electronic unit, is the situation of general fiducial value by target affinity pressure setting, but such as, also for each electronic unit, can consider the stability etc. when depending on the absorption of its weight, shape, and set respectively.
Fig. 4 is the flow chart that absorption required time obtains control.According to this figure, illustrate that absorption required time obtains control.
First, CPU30 controls X-axis motor 109 and Y-axis motor 110, with by certain adsorption mouth 105 on boarded head 106, be positioned at transport unit 101a (or recess of the pallet 103) place (step S1) of the electronic unit feed appliance 101 of the electronic unit as object.
Then, by the driving of Z axis motor 111, make adsorption mouth 105 drop to absorption height (step S2) of electronic unit, by the switching of switching solenoid valve 124, in adsorption mouth 105, carry out negative pressure feeding (step S3).Thus, the electronic unit in the transport unit 101a (or recess of pallet 103) of electronic unit feed appliance 101, is adsorbed by adsorption mouth 105.
Then, with negative pressure feeding side by side, CPU30 monitors the output of pressure sensing cell 125, measures the time reached till target affinity pressure, obtains absorption required time (step S4).
Fig. 5 is the line chart of the state of the pressure change represented in the adsorption mouth 105 from the switching of switching electromagnetically operated valve 124.Curve A represents that the common electronic unit that air leakage is less, curve B represent and leaks more electronic unit.In addition, in this line chart, represent above the longitudinal axis that air pressure reduces, below the longitudinal axis, represent that air pressure rises.
As shown in the drawing, if start negative pressure feeding under the state that the leading section of adsorption mouth 105 abuts with the upper surface of each electronic unit, then when arbitrary electronic unit, all after produce some delays from the switching timing of switching electromagnetically operated valve 124, produce the reduction of adsorption mouth internal pressure, when there being the electronic unit of air leakage, as curveb, the slope that this pressure known reduces slows down, and the time (absorption required time) reached till target affinity pressure is elongated.
Further, after reaching target affinity pressure, stop negative pressure feeding (step S5) by the action of switching electromagnetically operated valve 124, then, switch to malleation supply (step S6) by the action of switching electromagnetically operated valve 124.Then, if carry out malleation supply with the time preset, then switching electromagnetically operated valve 124 cut out and stop malleation supplying (step S7).Thus, the inside of adsorption mouth 105 returns to atmospheric pressure, and electronic unit is released from adsorbed state.In the above-described state, control Z axis motor 111, to make adsorption mouth 105 rise to standby height (step S8), the absorption required time for an electronic unit obtains and controls to terminate.
In addition, above-mentioned absorption required time obtains control and repeatedly performs, till all electronic units prepared in electronic component mounting apparatus 100 all complete.
CPU30, by performing above-mentioned control, works as " absorption required time obtains control unit ".
(release required time obtains control)
Release required time obtains control, is the process that CPU30 performs according to the program in system ROM12.Such as carry out following process: do not perform installation action after the main power source of device is just connected or after just having obtained new installation data etc. when controlling, for each electronic unit becoming mounting object in installation data, adsorption mouth 105 is positioned at transport unit 101a (or recess of the pallet 103) place of electronic unit feed appliance 101, in this position, utilize adsorption mouth 105 attract electrons parts, target affinity pressure will be set in adsorption mouth, the supply of malleation from above-mentioned state, measures until returning to the release required time till target release pressure.
In addition, this process is carried out all electronic units becoming each parts supply unit 102,104 of mounting object in installation data, is stored in storage device 17 by the release required time of each electronic unit.
In figure 6, illustrate that release required time obtains control.
First, CPU30 controls X-axis motor 109 and Y-axis motor 110, using the recess place (step S31) of the transport unit 101a or pallet 103 that a certain adsorption mouth 105 on boarded head 106 are positioned at the electronic unit feed appliance 101 of the electronic unit as object.
Then, by the driving of Z axis motor 111, make adsorption mouth 105 drop to absorption height (step S32) of electronic unit, then, by the switching of switching solenoid valve 124, in adsorption mouth 105, carry out negative pressure feeding (step S33).Thus, the electronic unit in the transport unit 101a of electronic unit feed appliance 101 or the recess of pallet 103, is adsorbed by adsorption mouth 105.
Then, with negative pressure feeding side by side, CPU30 monitors the output (step S34) of pressure sensing cell 125, reaches the timing of target affinity pressure, utilize switching electromagnetically operated valve 124 to stop negative pressure feeding (step S35) in adsorption mouth 105.
In addition, when obtaining absorption required time, in step S34, can not monitor pressure sensing cell 125 yet, and in wait after absorption required time, stop negative pressure feeding in step s 35.
Then, CPU30 is measured being supplied the time (release required time) making the inside of adsorption mouth 105 reach till target release pressure by malleation.
Also can be supplied to pressure sensing cell 125 to beginning from malleation in above-mentioned measurement and represent that the elapsed time reached till target release pressure carries out timing, if but after wait detects target release pressure by pressure sensing cell 125, carry out the switching of switching electromagnetically operated valve 124, then sometimes postpone due to its response.
Therefore, obtain in control at this release required time, switching electromagnetically operated valve 124 is controlled, to make at first, after predetermined time n [ms], malleation supply is carried out from reaching the state of target affinity pressure in adsorption mouth 105, its result, according to the detected pressures in the adsorption mouth 105 obtained, judge that initial malleation service time n is long or too short, with this judgement accordingly, malleation service time n adds or deducts the unit interval of regulation, retry repeatedly, by in adsorption mouth 105 from the best malleation service time of boosting in the scope (using this scope as " target release pressure ") of atmospheric pressure till malleation critical value, obtain as release required time.
In addition, the initial value of malleation service time n can utilize guidance panel 15 at random to set.In addition, malleation critical value also can utilize guidance panel 15 at random to set, but must be set greater than or equal atmospheric pressure, and not producing in the scope of position skew because air stream makes the electronic unit of installation and be arranged on electronic unit around it.
Fig. 7 represents when the internal pressure of adsorption mouth 105 is in the target affinity pressure of three phases, the line chart of the state of adsorption mouth 105 internal pressure change when switching electromagnetically operated valve 124 carries out switching controls and carries out malleation supply with predetermined stand-by period n.
Curve C represents pressure change when to apply malleation from the target affinity pressure of most negative pressure, and in the case, even if carry out malleation supply with malleation service time n, also can not reach atmospheric pressure, electronic unit can not be released from adsorption mouth 105.
In addition, curve D represents pressure change when to apply malleation from slightly become the target affinity pressure of malleation compared with C, in the case, if carry out malleation supply with malleation service time n, then atmospheric pressure can be reached, and be no more than the critical value of malleation, good absorption release can be carried out.
In addition, curve E represents pressure change when to apply malleation from become the target affinity pressure of malleation further compared with D, in the case, if carry out malleation supply with malleation service time n, then can exceed atmospheric pressure, and exceed the critical value of malleation, electronic unit is discharged, but jet due to what may produce surrounding, so electronic unit and neighbouring electronic unit thereof may be blown away.
As noted above, determine best malleation service time n accordingly with target affinity pressure, obtain in control at release required time, make malleation service time n change successively and explore optimum value.
Specifically, the supply of malleation starts (step S36), after malleation service time n (step S37), by the control of switching with electromagnetically operated valve 124, stops the supply (step S38) of malleation.Then, judge detected pressures in the adsorption mouth 105 of pressure sensing cell 125 now whether as negative pressure (step S39), when negative pressure, think that malleation service time is not enough, 1 [ms] will be added on n and the value obtained as the new stand-by period (step S40), make to the processing returns to step S33.
Then, again supply negative pressure, after till becoming target affinity pressure, supply malleation with new malleation service time n [ms], judge that the internal pressure of adsorption mouth 105 is whether as negative pressure (step S33 ~ S39).The circulation of this step S33 ~ S40 is carried out repeatedly, till the internal pressure of adsorption mouth 105 is more than or equal to atmospheric pressure.
In addition, in step S39, when detecting the pressure of adsorption mouth 105 inside not for negative pressure, whether above-mentioned malleation critical value is less than to this internal pressure and judges (step S41).
Its result, when being more than or equal to malleation critical value, think that malleation service time is long, the value obtained deducting 1 [ms] from n sets (step S42) as new malleation service time, makes to the processing returns to step S33.
Then, again supply negative pressure, after till becoming target affinity pressure, supply malleation with new malleation service time n [ms], judge that the internal pressure of adsorption mouth 105 is whether as negative pressure, or whether be not greater than or equal to malleation critical value (step S33 ~ S41).The circulation of this step S33 ~ S42 is carried out repeatedly, until be less than the malleation critical value of adsorption mouth 105.
By repeatedly carrying out above-mentioned retry, can obtain making to be more than or equal to atmospheric pressure in adsorption mouth 105 and the malleation service time being less than malleation critical value by malleation supply, it can be used as release required time and obtain.
Thus, the inside of adsorption mouth 105 becomes target release pressure, and electronic unit is released from adsorbed state.In the above-described state, Z axis motor 111 is controlled, to make adsorption mouth 105 rise to standby height (step S43), the release required time of an electronic unit is obtained and controls to terminate.In addition, above-mentioned release required time obtains control and repeatedly performs, till all electronic units prepared in electronic component mounting apparatus 100 all complete.
CPU30, by performing above-mentioned control, works as " release required time obtains control unit ".
(release required time confirms to control)
Process that to be CPU30 perform according to the program in system ROM12 that release required time confirms to control, when not performing installation action and controlling and above-mentioned release required time obtain control to perform after carry out.
Confirm in control at this release required time, for each electronic unit becoming mounting object in installation data, adsorb at transport unit 101a (or recess of the pallet 103) place of electronic unit feed appliance 101, and make adsorption mouth 105 increase, to be moved by boarded head and standby above discarded case 116, malleation supply is carried out to obtain the release required time obtained in control release time, and, after the stand-by time through regulation, utilize component recognition apparatus 113, whether electronic unit is existed to the leading section in adsorption mouth 105 and judges.
Then, when detecting that the leading section of adsorption mouth 105 adsorbs electronic unit, with the unit interval of regulation, add operation is carried out to stand-by time, target affinity pressure is again utilized to adsorb, carry out absorption release to discharge required time, and carry out the detection of electronic unit, stand-by time was extended with the unit interval, retry repeatedly, till confirmation electronic unit does not exist.
Thus, the stand-by time till electronic unit is separated from adsorption mouth 105 after the malleation supply that can obtain for adsorbing release stops.
In addition, this process is carried out all electronic units becoming each parts supply unit 102,104 of mounting object in installation data, the stand-by time of each electronic unit is stored in storage device 17.
In addition, confirm in control at this release required time, because each electronic unit is consumed one, so be not set as along with release required time obtains the execution of control and necessarily perform this release required time confirmation control, such as can only at random perform in the following cases, that is, based on obtained by release required time control the release required time that obtains carry out the installation action of electronic unit time, when also producing the taking back of electronic unit.
In fig. 8, illustrate that release required time confirms to control.
First, CPU30 controls X-axis motor 109 and Y-axis motor 110, certain adsorption mouth 105 on boarded head 106 to be positioned at transport unit 101a (or recess of the pallet 103) place (step S61) of the electronic unit feed appliance 101 of the electronic unit as object.
Then, by the driving of Z axis motor 111, make adsorption mouth 105 drop to absorption height (step S62) of electronic unit, by the switching of switching solenoid valve 124, in adsorption mouth 105, carry out negative pressure feeding (step S63).Thus, the electronic unit in the transport unit 101a of electronic unit feed appliance 101 or the recess of pallet 103, is adsorbed by adsorption mouth 105.
Then, with negative pressure feeding side by side, CPU30 monitors the output (step S64) of pressure sensing cell 125, by the driving of Z axis motor 11, make adsorption mouth 105 increase (step S65), by the driving of X, Y-axis motor 109,110, boarded head 106 is moved to discarded case 116 place (step S66), again by the driving of Z axis motor 111, adsorption mouth 105 is made to drop to discarded height (step S67).
Then, during these action controls, if adsorption mouth 105 inside reaches target affinity pressure, then stop negative pressure feeding (step S68).In addition, when obtaining absorption required time, can not monitor pressure sensing cell 125 in step S64 yet, but starting the timing of adsorbing required time, in step S68, wait for after absorption required time, the supply of negative pressure is stopped.
Then, above discarded case 116, starting the supply (step S69) of malleation, waiting for after obtained the release required time controlling to obtain by release required time (step S70), stopping the supply (step S71) of malleation.
Then, wait is being supplied to after initial stand-by time m (step S72) from stopping malleation, carry out negative pressure feeding (step S73), adsorption mouth 105 is risen to and is mounted in the identification of the component recognition apparatus 113 on boarded head 105 highly (step S74).
Then, result after utilizing component recognition apparatus 113 to detect is, even if carried out malleation supply, when also detecting that electronic unit is adsorbed on the leading section of adsorption mouth 105 (step S75), think that stand-by time is not enough, 1 [ms] will be added on m and the value obtained as new stand-by time (step S76), make to the processing returns to step S67.Then, again supply negative pressure, until after becoming target affinity pressure, stop negative pressure feeding, and, to discharge required time supply malleation, after stopping, after standby with new stand-by time m, judge whether electronic unit exists (step S67 ~ S75).The circulation of this step S67 ~ S76 is carried out repeatedly, until confirm that electronic unit does not exist.
Then, in step S75, when detecting that the front end of adsorption mouth 105 does not exist electronic unit and falls, the stand-by time m finally obtained is stored in storage device 17, ends process.
In addition, above-mentioned release required time confirms to control repeatedly to perform, till all electronic units prepared in electronic component mounting apparatus 100 all complete.
CPU30, by performing above-mentioned control, works as " release required time confirms control unit ".
(control of electronic unit installation action)
Below, based on the flow chart of Fig. 9, illustrate that the installation action of the electronic unit that CPU30 carries out according to the program be stored in system ROM12 controls.
First, CPU30 controls X-axis motor 109 and Y-axis motor 110, certain adsorption mouth 105 on boarded head 106 to be positioned at transport unit 101a (or recess of the pallet 103) place (step S101) of the electronic unit feed appliance 101 of the electronic unit as object.
Then, by the driving of Z axis motor 111, make adsorption mouth 105 drop to absorption height (step S102) of electronic unit, by the switching of switching solenoid valve 124, in adsorption mouth 105, carry out negative pressure feeding (step S103).Thus, the electronic unit in the transport unit 101a (or recess of pallet 103) of electronic unit feed appliance 101, is adsorbed by adsorption mouth 105.
Then, with negative pressure feeding side by side, CPU30 carries out timing (step S104) to absorption required time, through obtaining by absorption required time the timing controlling the absorption required time obtained, utilizes switching electromagnetically operated valve 124 to stop negative pressure feeding (step S105).
Then, by the driving of Z axis motor 111, make adsorption mouth 105 rise to delivery head (step S106), X-axis motor 109 and Y-axis motor 110 are controlled, the adsorption mouth 105 of boarded head 106 to be positioned at the installation site (step S107) of substrate K.
Then, by the driving of Z axis motor 111, make adsorption mouth 105 drop to setting height(from bottom) (step S108).
Then, starting malleation supply (step S109), waiting for after obtained the release required time controlling to obtain by release required time (step S110), stopping the supply (step S111) of malleation.
In addition, after malleation supply stops, wait for the stand-by time (step S112) through being confirmed to control to obtain by release required time, then, by the driving of Z axis motor 111, make adsorption mouth 105 rise to delivery head (step S106), control to terminate to the installation action of an electronic unit.
In addition, to all electronic units becoming mounting object, the process from above-mentioned S101 to S113 is repeatedly performed.
(effect of execution mode)
In above-mentioned electronic component mounting apparatus 100, owing to obtaining control by absorption required time, for each electronic unit, obtain the absorption required time becoming target affinity pressure in adsorption mouth 105, when installation action controls, according to the absorption required time obtained, continue absorption, so under the state reaching suitable target affinity pressure, carry out rising and the movement of adsorption mouth 105, can restrain adsorption time error, falling of electronic unit in movement, relative to the generation of the position skew etc. of adsorption mouth front end, realize the reliability of action and the raising of installation site precision.
In addition, control is obtained owing to implementing absorption required time outside installation action individually, so obtain control by such as implementing absorption required time before carrying out installation action, therefore following situation is different from, namely, make a mistake when installation action and identify the electronic unit that this is the air leakage easily producing electronic unit for the first time, thus implement the situation of leaking countermeasure, thus, even if when operating personnel does not carry out leakage characteristics identification to each electronic unit, also can automatically with leakage characteristics accordingly, carry out installation action, and more reduce the generation of mistake.
In addition, owing to being obtained the execution of control by absorption required time, for each electronic unit, absorption required time is automatically stored in storage device 17, so do not need operating personnel to carry out setting input operation to the leakage characteristics of each electronic unit, miscellaneous property of setting operation can be eliminated.
In addition, because absorption required time obtains the measurement of the absorption required time in control, be carry out in the transport unit 101a of electronic unit feed appliance 101 or the recess of pallet 103, and, supply malleation after a measurement, after carrying out the absorption release of electronic unit, make adsorption mouth 105 increase, so electronic unit can not be raised, therefore, at least obtain in control at absorption required time, discarding of electronic unit can not be produced, the waste of electronic unit can be prevented, realize the raising of economy.
In addition, owing to being obtained the execution of control by release required time, can for each electronic unit becoming mounting object, obtain make the inside of adsorption mouth 105 to become from atmospheric pressure to malleation critical value between scope in the release required time of (target release pressure), so when installation action controls, according to the release required time obtained, carry out the release of adsorbing, thus, electronic unit can be discharged more reliably, suppress taking back of electronic unit, the raising of Reliability of Microprocessor can be realized.
In addition, due to when not performing installation action and controlling, perform release required time and obtain control, so such as performed release required time in advance to obtain control before installation action, therefore following situation is different from, namely, making a mistake when installation action and identify this is for the first time the electronic unit taken back easily producing electronic unit, thus the situation of implementation measure, thus, even if when operating personnel not to each electronic unit identify easily produce the characteristic taken back, also the installation action avoiding taking back can automatically be carried out, and more reduce the generation of mistake.
In addition, due to for release required time, also be automatically stored in storage device 17 when it obtains control, take back so do not need operating personnel whether easily to produce for each electronic unit and carry out setting input operation, the miscellaneous property setting operation can be eliminated.
In addition, owing to obtaining in control at above-mentioned release required time, make the little by little change of release required time, retry repeatedly, obtain the release required time making adsorption mouth internal pressure become suitable, so under the state of impact comprising the time difference caused by switching electromagnetically operated valve 124, release required time can be obtained, when implementing in the action control installed, also can reproduce identical result.
Therefore, release required time can be measured more accurately, more effectively prevent taking back of electronic unit, and, the position skew of other electronic units when can prevent installation action.
In addition, owing to confirming that control obtains stand-by time by release required time, and, when installation action, carry out in the supply by malleation adsorbing on the basis of release, do not make adsorption mouth 105 increase during stand-by time, but make it standby, so taking back of electronic unit can be prevented more reliably.
(other)
In addition, in above-mentioned action control unit 10, enforcement absorption required time obtains control and discharges required time and obtains control respectively, but also can pass through a series of action control, and obtains absorption required time and release both required times.
Namely, due to when discharging the obtaining of required time, negative pressure feeding must be carried out in adsorption mouth 105, after becoming target affinity pressure, start malleation supply, and become suitable pressure, so also when making to become target affinity pressure in adsorption mouth 105, the service time of negative pressure can be measured, obtain absorption required time, then, carry out malleation supply with predetermined time, carry out the process judging whether to become in adsorption mouth in the scope of target release pressure.
Further illustrate, timing is started time from the negative pressure feeding of the step S33 in Fig. 6, in step S34, monitoring adsorption mouth pressure, by measuring target affinity pressure and the time till stopping negative pressure feeding of becoming in step s 35, absorption required time can be obtained.After step S36 afterwards, as noted abovely to control, obtain release required time thus.In addition, be the judgement of "Yes" due to step S39 and S41, and when carrying out retry, for the process of the later step S33 ~ S35 that circulates for the second time, preferably do not carry out timing, but by the supervision to pressure sensing cell 125, carry out controlling negative pressure feeding is stopped.
As noted above, obtain control by execution absorption required time in a process and discharge required time and obtain control, the absorption required time of the Fig. 4 carried out separately can not be needed to obtain control, shortening can obtain absorption required time and the time of release required for required time significantly.
Claims (5)
1. an electronic component mounting apparatus, it has:
Board holder, it keeps the substrate of mounting electronic parts;
Parts supply unit, the multiple described electronic unit that its supply will be installed;
Boarded head, it has liftable adsorption mouth, and this adsorption mouth is for adsorbing the electronic unit carried to described substrate;
Negative pressure feeding unit, it applies negative pressure to described adsorption mouth;
Malleation feed unit, it applies malleation to described adsorption mouth;
Boarded head travel mechanism, it makes described boarded head comprising from the region of described parts supply unit to described board holder, at random running fix; And
Action control unit, it is based on installation data, performs and controls relative to the installation action of described substrate,
It is characterized in that having:
Pressure sensing cell, it detects the internal pressure of described adsorption mouth; And
Absorption required time obtains control unit, it is before the described installation action of execution controls, for described electronic unit, respectively at the parts receiving position of described parts supply unit, the absorption action of described adsorption mouth is carried out by described negative pressure feeding unit, further, measure and store pressure that described pressure sensing cell detects and reach absorption required time till target affinity pressure
Described action control unit, when the installation of electronic unit, according to the absorption required time being obtained control unit by described absorption required time and obtain, after continuing absorption, makes described adsorption mouth rise by described negative pressure feeding unit to each electronic unit,
Described absorption required time obtains control unit, after the described absorption required time of measurement, after being carried out the absorption release of electronic unit, makes described adsorption mouth increase by described malleation feed unit.
2. electronic component mounting apparatus according to claim 1, is characterized in that,
There is release required time and obtain control unit, it is not when performing described installation action and controlling, for each electronic unit becoming mounting object in described installation data, at the parts receiving position of described parts supply unit, the absorption action making to become in described adsorption mouth target affinity pressure is carried out by described negative pressure feeding unit, and, measure and store and to be made in described adsorption mouth from described target affinity pressure until becoming the release required time till target release pressure by described malleation feed unit
Described action control unit, when the installation of electronic unit, according to the release required time being obtained control unit by described release required time and obtain, continued to carry out the absorption release of each electronic unit by described malleation feed unit after, described adsorption mouth is made to increase.
3. electronic component mounting apparatus according to claim 2, is characterized in that,
Described release required time obtains control unit, from described absorption required time obtain control unit in order to carry out adsorb required time measurement and making to become in described adsorption mouth the state of target affinity pressure, perform and make by described malleation feed unit the action control becoming target release pressure in described adsorption mouth, thus measure described release required time.
4. electronic component mounting apparatus according to claim 2, is characterized in that,
Described release required time obtains control unit, from becoming the state of target affinity pressure in described adsorption mouth, malleation supply is carried out with the release required time of prediction by described malleation feed unit, when not becoming target release pressure in described adsorption mouth, make the release required time of described prediction repeatedly carry out above-mentioned action with the change of the unit interval of regulation, thus obtain the described release required time for becoming described target release pressure.
5. electronic component mounting apparatus according to claim 2, is characterized in that, has:
Parts absorption detecting unit, it to whether described adsorption mouth being adsorbed with electronic unit detects; And
Release required time confirms control unit, it makes to become target affinity pressure in described adsorption mouth and attract electrons parts, under the state making this adsorption mouth increase, based on the release required time being obtained control unit by described release required time and obtain, carry out malleation supply, and, stopping from the supply of this malleation after the stand-by time of regulation, judge whether described electronic unit is released by described parts absorption detecting unit
Described release required time confirms control unit, by making described stand-by time repeatedly carry out above-mentioned action with the change of the unit interval of regulation, till described electronic unit is released, obtains suitable stand-by time thus, and,
Described action control unit, when the installation of electronic unit, according to described release required time, the absorption release of each electronic unit is carried out by described malleation feed unit, then, after confirming by described release required time the stand-by time that control unit obtains, described adsorption mouth is made to increase.
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| WO2015059839A1 (en) * | 2013-10-21 | 2015-04-30 | Fuji Machine Mfg. Co., Ltd. | Method for mounting an electronic-component onto a substrate and electronic-component mounting machine |
| US10757851B2 (en) * | 2016-06-14 | 2020-08-25 | Fuji Corporation | Electronic component mounter and electronic component release method |
| CN106488696B (en) * | 2016-10-27 | 2019-05-03 | 深圳市路远自动化设备有限公司 | A kind of suction nozzle self-adapting regulation method of chip mounter |
| JP6906158B2 (en) * | 2017-02-15 | 2021-07-21 | パナソニックＩｐマネジメント株式会社 | Parts mounting device and parts mounting method |
| US11317549B2 (en) * | 2017-09-22 | 2022-04-26 | Fuji Corporation | Component mounting machine and retry method for picking up components |
| CN110099558A (en) * | 2019-05-07 | 2019-08-06 | 深圳市路远智能装备有限公司 | A kind of chip mounter picks up and attachment action plate grade implementation method |
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| JP2003078290A (en) * | 2001-09-05 | 2003-03-14 | Sony Corp | Apparatus and method for component mounting |
| JP3760404B2 (en) * | 2001-12-10 | 2006-03-29 | 山形カシオ株式会社 | Component mounting device |
| JP2006202994A (en) * | 2005-01-20 | 2006-08-03 | Juki Corp | Part loader |
| JP2007158052A (en) * | 2005-12-06 | 2007-06-21 | Matsushita Electric Ind Co Ltd | Electronic component mounting device and mounting error repairing method |
| JP2009016498A (en) * | 2007-07-03 | 2009-01-22 | Yamaha Motor Co Ltd | Component suction method, and surface mounting machine |
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