JP4682867B2 - Electronic component mounting method - Google Patents

Description

The present invention relates to an electronic component mounting method for performing mounting of electronic components on one of the plurality of mounting portions to suck the electronic component to a plurality of nozzles Noso respectively branched from the intake passage.

  In the field of electronic component mounting, a mounting apparatus is used in which an electronic component is sucked from an electronic component supply unit by a nozzle and mounted at a plurality of mounting locations such as a substrate. Moreover, in order to improve the mounting efficiency of electronic components, one using a plurality of nozzles (multiple nozzles) is known. And, it is an important issue to ensure the mounting quality to accurately mount a plurality of electronic components attracted by the multiple nozzles at a plurality of mounting locations on the substrate and prevent the occurrence of a missing substrate. . For this reason, the electronic component picked up by picking up the multiple nozzles from the electronic component supply unit is recognized by a recognition means such as a camera, and it is confirmed whether or not the electronic components are picked up by each nozzle of the multiple nozzles. .

  However, even when it is confirmed that the electronic component is adsorbed, the electronic component may fall before the multiple nozzles move to the mounting location on the substrate. In this case, since the mounting is performed based on the recognition result by the camera, the mounting may be actually performed by the nozzle that does not suck the electronic component, and there is a possibility that a missing substrate may be generated.

As a means for solving such a problem, a change in pressure in the intake passage of the multiple nozzles is detected by a vacuum pressure sensor, and the vacuum pressure at the time when the electronic component is adsorbed and the vacuum pressure at the time before mounting are calculated. When the difference exceeds a threshold value, a method has been proposed for detecting that an electronic component has fallen at any nozzle during movement (see Patent Document 1).
JP 2004-71830 A

  However, when an electronic component falls from any nozzle during the movement, it takes a certain time for the change in the vacuum pressure around the nozzle to appear as the change in the vacuum pressure in the entire intake passage. Therefore, if the movement time from the time when the electronic component is attracted to the multiple nozzles until the mounting is short, the change in the vacuum pressure in the intake passage is compared with the threshold value when it is not stable, the electronic component has dropped. In some cases, the change in the vacuum pressure in the intake passage does not exceed the threshold value. In this case, since the drop of the electronic component is not detected, the mounting is performed by the nozzle in which the drop of the electronic component has occurred, and there is a possibility that a missing substrate may be generated.

The present invention aims to provide an electronic part Shinami instrumentation method capable of preventing the occurrence of a shortage substrate by accurately detecting the dropping of the electronic component from the array type nozzle.

The electronic component mounting method according to claim 1 is a recognition step of recognizing an electronic component adsorbed by a plurality of nozzles branched from one intake passage, and a first method of detecting a vacuum pressure in the intake passage after the recognition step. Detection step, a first movement step of moving the plurality of nozzles above the first mounting position of the electronic component after the first detection step, and an elapsed time from the start of the first movement step When the elapsed time measured in the first measurement process exceeds the first predetermined time at the time when the first measurement process and the first movement process are completed, The vacuum pressure in the intake passage is detected at the time when one moving step is completed, and the elapsed time measured in the first measuring step is detected at the first predetermined time when the first moving step is completed. When the time is not exceeded The second detection step of detecting the vacuum pressure in the intake passage when the first predetermined time has elapsed, the vacuum pressure in the intake passage detected in the second detection step, and the A first mounting step of mounting an electronic component at the first mounting location when the difference from the vacuum pressure in the intake passage detected in the first detection step is equal to or less than a first threshold; A third detection step of detecting the vacuum pressure in the intake passage after the first mounting step; and a second movement for moving the plurality of nozzles above the next mounting location of the electronic component after the third detection step. A process, a second measuring process for measuring an elapsed time from the start of the second moving process, and a process measured in the second measuring process at a time when the second moving process is completed. If the time exceeds the second predetermined time The vacuum pressure in the intake passage is detected at the time when the second moving step is completed, and the elapsed time measured in the second measuring step is detected at the time when the second moving step is completed. If the predetermined time is not exceeded, the fourth detection step of detecting the vacuum pressure in the intake passage when the second predetermined time has passed, and the detection detected in the fourth detection step When the difference between the vacuum pressure in the intake passage and the vacuum pressure in the intake passage detected in the third detection step is equal to or less than a second threshold value, the electronic component is mounted at the next mounting location. Multiple mounting locations by repeatedly performing the second mounting step, the second moving step, the second measuring step, the third detecting step, the fourth detecting step, and the second mounting step. Sequentially mounting electronic components on including.

The electronic component mounting method according to claim 2 is the electronic component mounting method according to claim 1 , wherein the vacuum pressure detected in the second detection step and the vacuum pressure detected in the second detection step are detected in the first detection step. When the difference from the vacuum pressure in the intake passage exceeds the first threshold, the electronic component is not mounted in the first mounting step.

Electronic component mounting method according to claim 3, wherein, in the electronic component mounting method according to claim 1 or 2, wherein the detection at said fourth of said vacuum pressure of the intake passage which is detected in the detection step the third detection step In the case where the difference from the vacuum pressure in the intake passage that has been exceeded exceeds the second threshold value, the electronic component is not mounted in the second mounting step.

An electronic component mounting method according to a fourth aspect is the electronic component mounting method according to any one of the first to third aspects, wherein the second predetermined time is set to be smaller than the first predetermined time. The threshold value 2 is set smaller than the first threshold value.

  According to the present invention, since the vacuum pressure after the movement of the multiple nozzles is detected after a predetermined time has elapsed from the start of movement, the electronic component can be accurately dropped without being affected by the movement distance of the multiple nozzles. It becomes possible to detect, and generation | occurrence | production of a missing-part board | substrate can be prevented.

  An embodiment of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a configuration diagram of an intake system in the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. 4 is a configuration diagram of a control system in the electronic component mounting apparatus according to the embodiment, FIG. 4 is an explanatory diagram showing a change in vacuum pressure in the intake passage in the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. FIG. 6 is an explanatory diagram showing a change in vacuum pressure in the air intake passage in the electronic component mounting apparatus of one embodiment, and FIG. 6 is a flowchart showing the steps of the electronic component mounting method in one embodiment of the present invention.

  First, the overall configuration of the electronic component mounting apparatus will be described. In FIG. 1, a conveyance path 2 extending in the X direction is disposed at a substantially center on a base 1. The transport path 2 has a function of transporting the substrate 3 and positioning it at a predetermined position. In the present invention, the transport direction of the substrate 3 is the X direction, and the direction orthogonal to the horizontal direction in the horizontal plane is the Y direction. Both sides of the transport path 2 in the Y direction are electronic component supply units 4, and a plurality of parts feeders 5 are detachably arranged in parallel to the base 1. The parts feeder 5 stores a large number of electronic components.

  At the edge of the base 1, a Y table 6 extending in the Y direction and an X table 7 extending in the X direction are disposed. A mounting head 8 is disposed on the X table 7. As shown in FIG. 2, the mounting head 8 includes multiple nozzles 20 (a nozzle group in which ten nozzles are arranged in a line in the X direction) as a plurality of nozzle groups for attracting electronic components. Is installed). Each nozzle of the multiple nozzle 20 is configured to be movable up and down and rotatable so that the posture of the sucked electronic component can be changed independently. The mounting head 8 is configured to be horizontally movable on the base 1 by the Y table 6 and the X table 7, and has a function of picking up electronic components supplied from the parts feeder 5 and mounting them on the substrate 3. Yes.

  In FIG. 1, a camera 9 serving as a side image means is disposed on the side of the mounting head 8, and is configured to be able to move horizontally on the base 1 together with the mounting head 8. The camera 9 has a function of imaging a mark for alignment provided on a lower electronic component, the substrate 3 or the like. Further, a line camera 10 which is an electronic component recognition means is disposed between the conveyance path 2 and the electronic component supply unit 4 and has a function of scanning the electronic component sucked by the multiple nozzles 20 from below. ing.

  Next, the configuration of the intake system of the multiple nozzles in the electronic component mounting apparatus will be described. In FIG. 2, an air passage 21 is formed in each nozzle of the multiple nozzle 20, and each air passage 21 is configured to communicate with one intake passage 22. The suction passage 22 is maintained at a negative pressure by a vacuum generation source 23 so that electronic components can be adsorbed to each nozzle. Each air passage 21 is provided with a valve 24 for opening and closing the air passage. By opening and closing the valve 24, it is possible to select whether the electronic component is attracted or not attracted by any nozzle. The intake passage 22 is provided with a vacuum pressure sensor 25 so that the vacuum pressure in the intake passage 22 can be detected.

Next, the configuration of the control system of the electronic component mounting apparatus will be described. In FIG. 3, the control unit 30
Are a drive mechanism 2a of the conveyance path 2, a parts feeder 5, a drive mechanism 6a of the Y table 6, a drive mechanism 7a of the X table 7, a camera 9, a line camera 10, a multiple nozzle 20, a vacuum source 23, a valve 24, It is connected to each part of the vacuum pressure sensor 25. The control unit 30 includes a calculation unit 31 and a storage unit 32. The calculation unit 31 performs various types of calculation processing based on data and control programs related to electronic components, substrates, nozzles, and the like stored in the storage unit 31. And controlling the mounting operation in the electronic component mounting apparatus. In addition, the calculation unit 31 has a function of performing position recognition by processing an image of the alignment mark imaged by the camera 9 and the line camera 10 and an image of the electronic component sucked by the nozzle, and positioning in the mounting operation. Take control. The operation input unit 33 includes a keyboard, a driver, and the like, and can input data, a control program, and the like to the storage unit 31 and can directly access the calculation unit 31 to operate the electronic component mounting apparatus. The output unit 34 is composed of a visible display means such as a CRT or a liquid crystal panel, a warning means, etc., and visually displays the operation status in the electronic component mounting apparatus, and also gives an error warning when a malfunction occurs during the mounting operation. It is like that.

  Next, an electronic component fall detection method in the electronic component mounting apparatus will be described. In FIG. 2, when any one of the electronic components sucked by the multiple nozzles 20 falls, outside air is sucked from the nozzles where the drops have occurred, and the vacuum pressure in the intake passage 22 decreases. FIG. 4 shows a change in the vacuum pressure in the intake passage when the electronic component falls. The vacuum pressure in a state where the electronic component is adsorbed to the multiple nozzle 20 is p0. The multiple nozzle 20 that sucks the electronic component moves to above the mounting location on the substrate 3, and the nozzle that sucks the electronic component to be mounted and the mounting location are aligned. In general, when the multiple nozzles 20 are moved, each drive mechanism provided in the electronic component mounting apparatus starts driving at a time, so that an accident in which the electronic components fall from the nozzles easily occurs. When an electronic component falls from any one of the multiple nozzles 20 at time t1 immediately after the start of movement, the vacuum pressure rapidly decreases immediately after the electronic component drops, and then the rate of decrease gradually decreases and finally becomes steady. To do.

  The vacuum pressure at the time t2 when the movement of the multiple nozzles 20 is finished is p1. The vacuum pressures p0 and p1 before and after the movement of the multiple nozzle 20 are detected by the vacuum pressure sensor 25 based on a control command from the calculation unit 31, and a difference Δp1 between these vacuum pressures p0 and p1 is calculated. The calculated vacuum pressure difference Δp1 is compared with a threshold value th stored in advance in the storage unit 32, and when the vacuum pressure difference Δp1 exceeds the threshold value th, at least any one of the multiple nozzles 20 is being moved. It is determined that an electronic component has fallen from one nozzle, and error processing is performed. By this error processing, the mounting operation in the electronic component mounting apparatus is stopped, and a problem that a missing substrate is generated by performing mounting (empty mounting) with a nozzle in which the electronic component has dropped is prevented. Further, the operator is notified by warning means such as a warning light and a warning sound.

  The threshold th is set to a value smaller than the difference in vacuum pressure that changes before and after the fall of at least one electronic component. When the difference in vacuum pressure exceeds the threshold th, the electronic component is removed from at least one nozzle. It is possible to detect that it has fallen.

  By the way, when an electronic component falls from a certain nozzle, first, a local change in vacuum pressure is generated around the nozzle, and finally the entire vacuum pressure in the intake passage 22 is stabilized while gradually propagating to the surroundings. As shown in FIG. 4, the change in the vacuum pressure from the time point t1 when the electronic component is dropped is detected as a stable value by the vacuum pressure sensor 25 at the time point t3 when the decrease in the vacuum pressure becomes almost steady. It takes time Δt (= t3−t1) after the electronic component falls. Therefore, as shown in FIG. 5, when the moving time of the multiple nozzles 20 is short, the vacuum pressure p2 is detected at time t4 when the change in the vacuum pressure in the intake passage 22 is not stable (cannot be lowered), and the vacuum There may be a case where the pressure difference Δp2 (= p2−p0) does not exceed the threshold th. In such a case, if the falling of the electronic component cannot be accurately detected, the mounting operation is performed by the nozzle in which the dropping of the electronic component has occurred, and there is a possibility that a shortage substrate may be generated.

  Therefore, by detecting the vacuum pressure after completion of the movement of the multiple nozzles 20 after the steady state time Δt from when the movement of the multiple nozzles 20 starts until the decrease in the vacuum pressure becomes almost steady, the intake air is detected. The vacuum pressure is detected when the change in the vacuum pressure in the passage 22 is stable. The calculation unit 31 measures the time until the steady time Δt elapses from the movement start time t0 of the multi-nozzle 20, and is the case where the multi-nozzle 20 has finished moving at time t4 before the steady time Δt elapses. However, the vacuum pressure is not detected, and the vacuum pressure p3 is detected at the time t3 when the stabilization time Δt has elapsed.

  That is, in FIG. 4, since the moving distance of the multiple nozzle 20 is relatively large and the time t0 to t2 required for the movement is longer than the steady time Δt, the steady time Δt at the movement end time t2 of the multiple nozzle 20. Has passed. For this reason, the vacuum pressure p1 is detected at the time t2 when the movement of the multiple nozzles 20 is finished, and the difference Δp1 between the vacuum pressures p0 and p1 is compared with the threshold value th. On the other hand, in FIG. 5, since the moving distance of the multiple nozzles 20 is relatively small and the time t0 to t4 required for the movement is shorter than the steady time Δt, the steady time Δt at the movement end time t4 of the multiple nozzles 20. Has not passed. Therefore, after the movement of the multiple nozzles 20 is completed, the vacuum pressure p3 is detected at the time t3 when the stabilization time Δt has elapsed, and the difference Δp3 between the vacuum pressures p0 and p3 is compared with the threshold value th.

  4 and 5, the time from the movement start time t0 of the multiple nozzle 20 to the time t1 when the electronic component is dropped is extremely short. Further, the difference in vacuum pressure around time t3 when the decrease in vacuum pressure becomes steady is extremely small. Therefore, in FIG. 5, the time when the steady time Δt elapses from the movement start time t0 of the multiple nozzles 20 is substantially the same time as t3. Therefore, the difference in vacuum pressure before and after the movement of the multiple nozzles 20 calculated by the calculation unit 31 is substantially the same as Δp3. On the other hand, although rarely, the electronic component may fall immediately before the end of the movement of the multiple nozzles 20. In this case, if the steady time Δt elapses after the movement start time t0 of the multiple nozzles 20 is immediately after the electronic component drop occurrence time, the vacuum pressure is stable even when the steady time Δ has elapsed. There are things that are not. Assuming this case, it is also possible to detect the vacuum pressure when the stationary time Δt has elapsed since the end of the movement of the multiple nozzles 20.

  In addition, since the flow rate of air flowing from the nozzle depends on the opening diameter of the nozzle and the electronic component to be adsorbed is not completely sealed, the steady time Δt is the type of the nozzle or electronic component. Therefore, nozzles and electronic components used in the electronic component mounting apparatus are set in advance and stored in the storage unit 32. At the time of mounting, if a type such as a nozzle or an electronic component is input in advance by the operation input unit 33, the calculation unit 31 performs a detection process of the drop of the electronic component using the steady time Δt corresponding to the input type. .

  In the present embodiment, the stabilization time Δt is used as the timing for detecting the vacuum pressure after completion of the movement of the multiple nozzles 20 when the change in the vacuum pressure after the occurrence of the electronic component drop is stabilized. This is because it is desirable to detect a high vacuum pressure, but the present invention can also achieve its purpose by setting a predetermined time other than the stabilization time Δt and a threshold value corresponding thereto.

  Further, by resetting the vacuum pressure sensor 25 that detects the vacuum pressure p0 before the movement of the multiple nozzles 20 to zero, the differences Δp1 and Δp3 in the vacuum pressure before and after the movement of the multiple nozzles 20 are set as the relative vacuum pressures p1 and p3. Can be detected directly. In this case, the calculation unit 31 compares the relative vacuum pressure detected by the vacuum pressure sensor 25 after the multiple nozzles 20 are moved with the threshold th1 stored in advance in the storage unit 32 to determine whether the electronic component has dropped. .

Next, an electronic component mounting method will be described. FIG. 6 is a flowchart showing the mounting operation in the electronic component mounting apparatus described above in the order of steps. In FIG. 6, first, an electronic component is adsorbed to each nozzle of the multiple nozzle 20 (ST1). The electronic component sucked by each nozzle is scanned by the line camera 10 to recognize the position and orientation of the electronic component (recognition process: ST2). At this time, for the non-adsorption nozzles for which no electronic component has been recognized, no subsequent mounting operation is performed in order to prevent the occurrence of a missing substrate.

  Next, the vacuum pressure in the intake passage 22 of the multiple nozzle 20 is detected (first detection step: ST3). After detecting the vacuum pressure, the multiple nozzles 20 are moved above the substrate 3 to align the first mounting portion set on the substrate 3 with the nozzle that sucks the electronic component first mounted on the substrate 3. (First moving step: ST4). Moreover, the elapsed time from the movement start time of the multiple nozzles 20 is measured (first measurement step: ST5). After the movement of the multi-nozzle 20 is finished, it is determined whether or not a first predetermined time set in advance has passed (ST6), and when the first movement step (ST4) is finished, the first measurement step When the elapsed time measured in (ST5) exceeds the first predetermined time, the vacuum pressure is detected when the first moving step (ST4) is completed. On the other hand, when the elapsed time measured in the first measurement step (ST5) does not exceed the first predetermined time at the time when the first movement step (ST4) is completed, the first predetermined time is reached. When the time has elapsed, the vacuum pressure is detected (second detection step: ST7).

  Next, the difference in vacuum pressure detected in the first detection step (ST3) and the second detection step (ST7) is calculated, and the calculation result is compared with a preset first threshold (ST8). ). If the calculation result is equal to or less than the first threshold value, it is determined that the electronic component has not dropped in the first movement step (ST4), and the electronic component is mounted at the first mounting location (ST9: No. 1). 1 mounting process). On the other hand, if the calculation result exceeds the first threshold value, it is determined that the electronic component has dropped in the first movement step (ST4), and the mounting operation is interrupted to perform error processing (ST10). .

  In the first mounting step (ST9), after mounting the electronic component on the first mounting location set on the substrate 3, the electronic component is mounted on the next mounting location also set on the substrate 3. . First, after the first mounting step (ST9), the vacuum pressure in the intake passage 22 of the multiple nozzle 20 is detected (third detection step: ST11). After detecting the vacuum pressure, the multiple nozzles 20 are moved above the substrate 3 to align the nozzle that sucks the electronic component to be next mounted on the substrate 3 with the next mounting location set on the substrate 3. (Second moving step: ST12). Moreover, the elapsed time from the movement start time of the multiple nozzles 20 is measured (second measurement step: ST13). After the movement of the multi-nozzle 20 is finished, it is determined whether or not a second predetermined time set in advance has elapsed (ST14), and when the second movement step (ST12) is finished, the second measurement step When the elapsed time measured in (ST13) exceeds the second predetermined time, the vacuum pressure is detected when the second moving step (ST12) is completed. On the other hand, when the elapsed time measured in the second measurement step (ST13) does not exceed the second predetermined time at the time when the second movement step (ST12) is completed, the second predetermined time is reached. When the time has elapsed, the vacuum pressure is detected (fourth detection step: ST15).

Next, the difference in vacuum pressure detected in the third detection step (ST11) and the fourth detection step (ST15) is calculated, and the calculation result is compared with a preset second threshold value (ST16). ). If the calculation result is less than or equal to the second threshold, it is determined that the electronic component has not dropped in the second movement step (ST12), and the electronic component is mounted at the mounting location (ST17: second). Mounting process). On the other hand, if the calculation result exceeds the second threshold value, it is determined that the electronic component has dropped in the second movement step (ST12), and the mounting operation is interrupted to perform error processing (ST18). . Thereafter, by repeating the steps from the third detection step (ST11) to the second mounting step (ST17) a predetermined number of times, electronic components are sequentially mounted on the mounting locations set on the substrate 3, When the mounting of the electronic component is completed at the mounting position, the mounting operation ends.

  According to the mounting operation performed through the above steps, it is possible to accurately detect the drop of the electronic component from the multiple nozzles 20, and thus it is possible to prevent the occurrence of a missing substrate. Note that the first predetermined time and the first threshold corresponding thereto, and the second predetermined time and the second threshold corresponding thereto can be set independently. Since the second moving step (ST12) in the present embodiment is a moving step from the first mounting location to the next mounting location on the substrate 3, it is smaller than the moving distance in the first moving step (ST4). Therefore, if the second predetermined time is set to be the same as the first predetermined time, the time until the first predetermined time elapses in the fourth detection step (ST15) may be a loss time. In this case, the loss time can be reduced by setting the second predetermined time smaller than the first predetermined time and correspondingly setting the second threshold smaller than the first threshold.

According to the electronic unit Shinami instrumentation process of the present invention, it is possible to it is possible to accurately detect the dropping of the electronic component without being affected by the moving distance of the array type nozzle, to prevent the occurrence of shortage substrate Therefore, it is useful in the field where an electronic component is attracted to each of a plurality of nozzles branched from one intake passage and the electronic component is mounted at a plurality of mounting locations.

The top view of the electronic component mounting apparatus of one embodiment of this invention The block diagram of the intake system in the electronic component mounting apparatus of one embodiment of this invention 1 is a configuration diagram of a control system in an electronic component mounting apparatus according to an embodiment of the present invention. These are explanatory drawings which show the mode of the change of the vacuum pressure in an intake passage in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing which shows the mode of the change of the vacuum pressure in an intake passage in the electronic component mounting apparatus of one embodiment of this invention The flowchart which shows the process of the electronic component mounting method in one embodiment of this invention

Explanation of symbols

20 Multiple nozzles 22 Air intake passage

Claims (4)

A recognition process for recognizing electronic components adsorbed by a plurality of nozzles branched from one intake passage;
A first detection step of detecting a vacuum pressure in the intake passage after the recognition step;
A first movement step of moving the plurality of nozzles above the first mounting location of the electronic component after the first detection step;
A first measuring step for measuring an elapsed time from the time when the first moving step is started;
When the elapsed time measured in the first measurement process exceeds the first predetermined time at the time when the first movement process is completed, the time at which the first movement process is completed is When the elapsed time measured in the first measurement step does not exceed the first predetermined time when the vacuum pressure in the intake passage is detected and the first movement step is completed, A second detection step of detecting a vacuum pressure in the intake passage when the first predetermined time has elapsed;
When the difference between the vacuum pressure in the intake passage detected in the second detection step and the vacuum pressure in the intake passage detected in the first detection step is equal to or less than a first threshold, A first mounting step of mounting an electronic component at the first mounting location;
A third detection step of detecting a vacuum pressure in the intake passage after the first mounting step;
A second moving step of moving the plurality of nozzles above the next mounting location of the electronic component after the third detecting step;
A second measuring step for measuring an elapsed time from the time when the second moving step is started;
When the elapsed time measured in the second measurement process exceeds the second predetermined time at the time when the second movement process is completed, the time at which the second movement process is completed is When the elapsed time measured in the second measurement step does not exceed the second predetermined time at the time when the vacuum pressure in the intake passage is detected and the second movement step is finished, A fourth detection step of detecting a vacuum pressure in the intake passage when a second predetermined time has elapsed;
When the difference between the vacuum pressure in the intake passage detected in the fourth detection step and the vacuum pressure in the intake passage detected in the third detection step is equal to or less than a second threshold, A second mounting step of mounting an electronic component on the next mounting location;
By sequentially performing the second moving step, the second measuring step, the third detecting step, the fourth detecting step, and the second mounting step, electronic components are sequentially mounted at a plurality of mounting locations. And a process of
An electronic component mounting method including: When the difference between the vacuum pressure in the intake passage detected in the second detection step and the vacuum pressure in the intake passage detected in the first detection step exceeds a first threshold, electronic component mounting method according to claim 1, wherein no mounting electronic components in the first mounting step. When the difference between the vacuum pressure in the intake passage detected in the fourth detection step and the vacuum pressure in the intake passage detected in the third detection step exceeds a second threshold, electronic component mounting method according to claim 1 or 2, wherein no mounting the electronic component in the second mounting step. Electronic component according to any one of claims 1 to 3 wherein the second predetermined time and the second threshold value is set smaller than the first threshold value with is set to be smaller than the first predetermined time Implementation method.

Images