JPH10145096A - Method and device for mounting electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely mount electronic parts on a wiring board even when the wiring board has a warp or the shape of the electronic parts varies. SOLUTION: Electronic parts are picked up by means of a suction nozzle (102) and the positional deviation (X, Y, and θ) of the parts from the ideal mounting position of the parts on a wiring board is found and corrected by driving an XYZ driving device and the suction nozzle (108). After the suction nozzle is moved to a position above the mounting position of the wiring board (110), the nozzle is lowered (112). The position of the front end (q) of the lead of the parts is detected (114) and, when a positional deviation exists ('Y' in 116), the deviation is calculated (118). When the calculated deviation exceeds a preset value S ('Y' in 120), the lowering operation of the nozzle is stopped (122) and the picking up of the parts by means of the nozzle by suction is released (124).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for mounting an electronic component at a predetermined position on a wiring board using a bonding material.

[0002]

2. Description of the Related Art Conventionally, there is an electronic component mounting apparatus for mounting an electronic component at a predetermined position on a wiring board. In this electronic component mounting apparatus, a suction nozzle is movably disposed,
The suction nozzle sucks an electronic component provided in the electronic component supply unit and moves the electronic component to a position above a predetermined position (mounting position) of the wiring board. At this time, for example, by using an image recognition device or the like, by confirming the mounting position of the wiring board and the suction position of the electronic component and correcting the position of the wiring board and the electronic component, the accuracy of the mounting position of the electronic component can be improved. it can.
Next, the suction nozzle on which the electronic component is sucked is lowered by a predetermined amount stored in the storage unit in advance. This predetermined amount is set in advance based on the shape data of the electronic component. After the suction nozzle is lowered in this manner, the electronic component is mounted at a predetermined position on the wiring board by releasing the suction state by the suction nozzle.

[0003]

However, for example, when the wiring board is warped or when the shape of the electronic component varies, the relative height between the wiring board and the electronic component in the height direction is reduced. The positional relationship may be shifted. Therefore, in the conventional electronic component mounting apparatus, the suction nozzle on which the electronic component is sucked is moved above the mounting position of the wiring board, and then lowered by a predetermined amount previously stored in the storage unit. If the relative position in the height direction between the electronic component and the electronic component is shifted, it is difficult to securely mount the electronic component at a predetermined position on the wiring board.

That is, since the predetermined amount for lowering the suction nozzle is a fixed amount without considering the warpage of the wiring substrate and the variation in the shape of the electronic component, the length between the wiring substrate and the electronic component, That is, when the relative distance is long, the electronic component is mounted while being floated from the wiring board, so that the mounting position of the electronic component is likely to be shifted. On the other hand, when the relative distance is short, the electronic component is pushed too far into the wiring board, so that when a viscous bonding material is used as the bonding material, the shape of the viscous bonding material is broken or the leads of the electronic component are deformed. Or As a result, the distance between adjacent land patterns or adjacent leads is shortened, and soldering defects such as bridges may increase at the time of soldering.

[0005] In particular, when a narrow-pitch multi-pin component such as a TCP (Tape Carrier Package) or a QFP (Quad Flat Package) is mounted on a wiring board, the above-mentioned problem is remarkable. For example, in TCP, leads are often formed of thin copper foil having a thickness of about several tens of micrometers, and have low rigidity. Therefore, when mounted using a solder precoat having an arc-shaped surface, a slight stress is applied. Deforms easily. On the other hand, Q
In the case of FP, soldering using cream solder is common. The solder is usually supplied by a screen printing method, and cream solder is printed on a substrate land in a manner similar to a land shape. As the pitch becomes smaller, the space between lands with respect to the cream solder printing thickness becomes smaller. Therefore, the shape of the cream solder may be distorted due to the pressing force at the time of mounting the QFP or the weight of the electronic component, and the solder may come into contact with the cream solder on an adjacent land to form a solder bridge.

In view of the above-mentioned facts, the present invention provides a method of mounting an electronic component that can reliably mount an electronic component at a predetermined position on a wiring substrate even when the wiring substrate is warped or the shape of the electronic component varies. And an apparatus.

[0007]

According to a first aspect of the present invention, there is provided a component mounting method for mounting an electronic component on a substrate provided with a bonding material. A shape change of the electronic component is detected while moving toward the bonding material provided on the substrate, and based on the detected value, whether or not the electronic component is at least in contact with the bonding material provided on the substrate The movement of the electronic component is stopped when the electronic component is in the contact state.

According to a second aspect of the present invention, there is provided the electronic component mounting method according to the first aspect, wherein the joining material is a viscous joining material, and a change in the shape of the viscous joining material is detected. And determining whether the electronic component is in a contact state at least in contact with the bonding material provided on the substrate.

According to a third aspect of the present invention, there is provided a component mounting apparatus for mounting an electronic component on a substrate provided with a bonding material, wherein the electronic component is mounted on a substrate provided with a bonding material. Transport means for transporting to a predetermined position on the substrate, and detecting means for detecting a change in at least one of the shape of the electronic component and the shape of the bonding material,
Based on the detection result of the detection unit, it is determined whether the electronic component is in a contact state at least in contact with a bonding material provided on the substrate, and when the electronic component is in the contact state, the electronic component is transported. And control means for controlling the transport means so that the vehicle is stopped.

According to a fourth aspect of the present invention, in the electronic component mounting apparatus according to the third aspect, the detecting means detects a change in shape of the joining material of the viscous joining material.

According to the present invention, a change in shape of the electronic component is detected while moving the electronic component toward the bonding material provided on the substrate, and the electronic component is provided on the substrate based on the detected value. It is determined whether or not the contact state is at least contacted. For example, electronic components such as ICs are provided with leads, and the leads have low rigidity. Therefore, when a stress is applied, the shape of the lead itself and the shape such as the lead interval change. Also, as described in claim 2, when a viscous bonding material is used as the bonding material, the viscous bonding material itself is easily deformed. Therefore, it is possible to determine whether or not the electronic component has come into contact with the bonding material by detecting a change in shape. By stopping the movement of the electronic component when the contact state is reached, the electronic component can be mounted on the substrate provided with the bonding material without deforming the electronic component or the bonding material.

This method of mounting an electronic component can be realized by the component mounting device according to the third aspect. Electronic components
The transport is started by the transport means toward a predetermined position on the substrate on which the electronic component is to be mounted. During the transportation, the detecting means detects a change in at least one of the shape of the electronic component and the shape of the bonding material. As the detection means, there is an image processing apparatus which calculates a change amount after calculating a position, a shape, and an interval of an element (for example, a lead) of an electronic component or a bonding material from a captured image. There is also a measuring device for measuring a three-dimensional shape such as a light cutting device. As described in claim 4, when a viscous bonding material is used as the bonding material, the viscous bonding material itself is easily deformed, so that the detecting means detects a change in shape of the bonding material of the viscous bonding material. You may. The control means determines whether or not the electronic component is at least in contact with the bonding material provided on the substrate, based on the detection result of the detection means. Then, the transport unit is controlled so that the transport of the electronic component is stopped when the electronic component is in the contact state. For example, when the calculated value of the image processing device or the measured value of the measuring device exceeds a predetermined value,
That is, when the electronic component or the joining material is deformed and reaches a predetermined allowable limit value, it is determined that the electronic component has contacted the joining material. By stopping the movement of the electronic component when the contact state is reached, the electronic component can be mounted on the substrate provided with the bonding material without deforming the electronic component or the bonding material.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION

[First Embodiment] Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

FIGS. 1A and 1B show a wiring board 12.
And the electronic component 14 are shown. As shown in FIG. 1A, the electronic component 14 has a plurality of leads 32 arranged at a narrow pitch. Lead 32 of this electronic component 14
Is made of thin copper foil etc., it has low rigidity,
Deforms easily with slight stress. As shown in FIG. 1B, the electronic component 1 is provided on a part of the surface of the wiring board 12.
The same number of lands 34 as the leads 32 of the electronic component 14 are formed at the mounting position 38 of No. 4. An arc-shaped solder precoat 36 is applied on the land 34 as a bonding material (see FIGS. 5 and 6).

FIG. 2 is a schematic configuration diagram of an electronic component mounting apparatus according to an embodiment of the present invention. In the figure, two directions orthogonal to each other in the horizontal direction are represented by arrows X and Y, and a height direction perpendicular to the directions of the arrows X and Y is represented by arrow Z.

As shown in FIG. 2, the wiring board 12 on which the electronic component 14 is mounted is fixed by board fixing portions 16A and 16B. An electronic component supply unit 18 on which a plurality of electronic components 14 are mounted is provided near the wiring board 12. Above the electronic component supply unit 18, a suction nozzle 20 is provided. The suction nozzle 20 includes the rotating unit 2
0A and a cylindrical suction portion 20B to which a suction plate (not shown) for suctioning the electronic component 14 is attached at the tip end.
It is constituted by. Rotating part 20 of suction nozzle 20
A is the suction unit 2 with the center of the cylinder of the suction unit 20B as the central axis.
0B in the direction of the arrow θ. The suction nozzle 20 is connected to an XYZ drive device 21 via an arm 22. The XYZ drive device 21 is for moving the suction nozzle 20 to a designated position in a three-dimensional space. The position range of the suction nozzle 20 that can be moved by the XYZ drive device 21, that is, the distance, covers at least the space between the electronic component supply unit 18 and the wiring board 12.

The suction nozzle 20 and the XYZ driving device 2
1 is connected to the control device 28. Therefore, conveyance of the electronic component 14 is controlled by an instruction from the control device 28. The control device 28 is configured by a microcomputer (not shown) having a CPU, a ROM, and a RAM, and stores a flowchart described later in advance.

In the vicinity of the electronic component supply section 18, a preliminary detection device 26 is provided. This preliminary detection device 26
This is for detecting the shape of the electronic component 14 sucked by the suction nozzle 20. For example, at least one of the interval g between the leads 32 and the pitch p between the leads 32 (see FIG. 3) is detected, and if the detected values are significantly different from the electronic component 14 having a normal shape, the component is selected as a defective component. be able to. Further, a detection device 24 is provided above the wiring board 12. The detection device 24 is configured to detect the position of the electronic component 14 that has been detected by the preliminary detection device 26,
This is for detecting at least one of the shape and the shape of the bonding material (solder precoat in the first embodiment) 36 applied on the land 34 (see FIG. 1) of the wiring board 12. Examples of the detection device 24 include an image processing device equipped with a TV camera and a light cutting device that detects a shape by irradiating slit light. The detecting device 24 may be used in combination with a detecting device for confirming a mounting position of an electronic component on a wiring board or a detecting device for a lead shape defect of an electronic component. Book first
In the embodiment, the electronic device 14 is
Of the lead q (see FIG. 3) of the lead 32 of FIG.
A case where the shape of the electronic component 14 is detected will be described. In addition,
Generally, the cross-sectional shape of the solder precoat is an arc shape, and the lead forming shape is a so-called gull-wing shape that is bent. Therefore, there is a possibility that the deformation of the lead occurs in the lead pitch direction and the tip direction. Therefore, the detecting device 24 detects at least one of them, preferably in both directions.

The control device 28 stores data relating to a mounting position 38 on the wiring board 12 on which the electronic component 14 is mounted, suction position data when the electronic component 14 is sucked from the electronic component supply unit 18, and the like. The device 30 is connected.

In the above description, the configuration of the electronic component 14 is detected in advance by the preliminary detection device 26. However, when all are detected by the detection device 24, the preliminary detection device 26 is unnecessary.

Next, the operation of the first embodiment of the present invention will be described with reference to the flowchart of FIG. In the first embodiment, a case will be described in which the electronic component 14 of the narrow pitch multi-pin component is mounted on the mounting position 38 of the wiring board 12 using the solder precoat 36 as a bonding material.

First, in step 100, the suction position data and the mounting position data of the electronic component 14 stored in the storage device 30 are read. By reading the suction position data, one of the plurality of electronic components 14 placed on the electronic component supply unit 18 can be specified. Further, by reading the mounting position data, the mounting position 38 of the electronic component 14 on the wiring board 12 can be specified. In the next step 102, the suction nozzle 20 is moved based on the suction position data read in step 100, and one of the electronic components 14 mounted on the electronic component supply unit 18 is moved by the suction unit 20B of the suction nozzle 20. Adsorb.
The suction nozzle 20 on which the electronic component 14 is sucked is moved to the preliminary detection position.

In step 104, the shape of the lead 32 of the electronic component 14 is detected by the preliminary detection device 26. For example, the interval g of the lead 32 is detected, and the detected interval g
Is significantly different from the spacing g between the leads 32 of the electronic component 14 having a normal shape, the sucked electronic component 14 is selected as a defective product, and other processing such as defective product processing is performed.

In step 106, an ideal position when the electronic component 14 is sucked by the suction nozzle 20 is read. The ideal position is the electronic component 1 at the preliminary detection position when the center of the electronic component 14 is sucked by the suction nozzle 20.
4 position. This ideal position may be calculated. In the next step 108, the position of the electronic component 14 sucked in step 102 and the position of step 106
The position correction amount in the directions of arrows X, Y, and θ in FIG. 2 is calculated based on the ideal position read in and the correction is performed. That is, the shift amount (X, Y, θ) of the electronic component 14 with respect to the ideal position is obtained, and this is set as the position correction amount. The XYZ drive unit 21 and the suction nozzle 20 (θ) are driven by an amount corresponding to the position correction amount to correct the shift amount. In the next step 110, based on the mounting position data read in step 100, the suction nozzle 2
0 is moved to the mounting position 3 of the wiring board 12 in the XYZ directions.
8 above. At this time, as shown in FIG. 5A, since the electronic component 14 is not in contact with the solder pre-coat 36, no stress is applied, and no change is observed in the shape of the lead 32.

In step 112, the lowering operation of the suction nozzle 20 is started.
The shape of the lead 32 is detected by detecting the position of the tip q of the lead 32 of the electronic component 14. In the next step 116, it is determined whether or not there is a displacement in the position of the tip q of the lead 32.

Here, a case where a shape change occurs due to a lead position shift will be described. As shown in FIG. 5A, the lead 32 of the electronic component 14 moved above the mounting position 38
Is set as a reference line e along the locus of the tip q of the suction nozzle 20 due to the downward movement of the suction nozzle 20. This reference line e is shown in FIG.
5B can be obtained from a slight movement of the electronic component 14. Therefore, the tip q
Deviates from the reference line e when some stress is applied or the electronic component 14 falls off. That is, in step 116, it is determined whether or not the tip q has deviated from the reference line e to determine the presence or absence of a positional shift.

Therefore, if there is no displacement, a negative determination is made in step 116 and the process returns to step 112. on the other hand,
If there is a displacement and an affirmative determination is made in step 116, the process proceeds to step 118.

When the lowering operation of the suction nozzle 20 is continued,
As shown in FIG. 5B, the electronic component 14 contacts the solder precoat 36. If you continue descending further,
As shown in FIG. 5C, the tip q of the lead 32 is displaced. In this case, since an affirmative determination is made in step 116, the process proceeds to step 118 to calculate the displacement amount of the lead 32, that is, the distance from the reference line e to the tip q of the lead 32 (for example, the distance of the perpendicular). .
In the next step 120, it is determined whether or not the amount of displacement of the lead 32 calculated in step 118 has exceeded a predetermined set value S. The set value S is a limit of the amount of displacement of the lead 32 determined in consideration of the influence of the variation of the shape of the lead 32 of the electronic component 14, the variation of the height of the solder precoat 36, the local warpage of the wiring board 12, and the like. Value. In the first embodiment, FIG.
The dotted line portion shown in FIG. That is, if the displacement of the lead 32 is within the range of the set value S, it is determined that the electronic component 14 is securely mounted. In FIG. 5, the displacement amount is shown as a region, but may be a distance in a direction orthogonal to the reference line e. As a result, when a small amount of stress is applied to the lead 32 (see FIG. 5C), a negative determination is made in step 120 as being within the allowable shape change. On the other hand, when the suction nozzle 20 is continuously lowered when the allowable value (set value S) is exceeded, the lead 32 is deformed by a large stress (FIG. 5).
(See (D)), an affirmative determination is made in step 120. Therefore, if the determination in step 120 is affirmative, the process proceeds to step 122 to stop the lowering operation of the suction nozzle 20 and to execute step 124
Then, the suction of the electronic component 14 by the suction nozzle 20 is released. Thus, the mounting process of the electronic component 14 ends.

On the other hand, if a negative determination is made in step 120, the flow shifts to step 112 to repeatedly execute the above-described processing.

As described above, the change in the shape of the electronic component 14 is detected based on the amount of displacement of the tip q of the lead 32 of the electronic component 14 and the driving of the suction nozzle 20 is controlled. The electronic component 14 can be mounted at the mounting position of the wiring board 12 in response to the variation and the warpage of the wiring board 12. In addition, in the initial stage of the mounting process (step 104 in FIG. 4), the shape of the lead 32 of the electronic component 14 is detected, and a defective component that is predicted to cause a mounting failure is removed, thereby facilitating the mounting process. Let it proceed. That is, the electronic component 14
The time required for the mounting process can be reduced.

In the first embodiment, the tip q of the lead 32 of the electronic component 14 is detected, and the driving of the suction nozzle 20 is controlled based on the amount of displacement calculated from the detected tip q of the lead 32. However, the present invention is not limited to this. For example, as shown in FIG. 6, an interval g between the leads 32 of the electronic component 14 and a pitch p between the leads 32 are provided.
And the like, and the amounts of these changes are calculated to obtain the suction nozzle 2
0 may be controlled. The driving of the suction nozzle 20 may be controlled based on a plurality of change amounts instead of one change amount.

In the first embodiment, the processing of steps 112 to 120 shown in the flowchart of FIG.
Is controlled to be gradually lowered, but is not limited to this. For example, a height (position) at which the electronic component 14 does not come into contact with the wiring board 12 is calculated from the relationship between the shape data of the electronic component 14 and the maximum value of its variation and the maximum allowable value of the warpage of the wiring board 12, and a storage device in advance 30 may be stored, and after the suction nozzle 20 on which the electronic component 14 has been sucked is moved down to that position, the above-described processing after step 112 may be executed. As a result, the time required for the mounting process of the electronic component 14 can be reduced.

In this embodiment, the shape is detected by detecting a part of the electronic component. However, it is preferable that the measurement range is performed for all leads. Further, the above-described operation may be limited to a specific part according to the performance of the detection device, the reduction of the measurement time, and the degree of quality evaluation.

[Second Embodiment] Next, a second embodiment of the present invention will be described. Since the second embodiment has substantially the same configuration as the first embodiment, the same portions are denoted by the same reference numerals and detailed description thereof will be omitted.

In the first embodiment, a solder precoat 36 is applied on the lands 34 of the wiring board 12, and the driving of the suction nozzle 20 is controlled by controlling the displacement of the tip q of the lead 32 of the electronic component 14. Parts 14 are connected to the wiring board 12
In the second embodiment, the method of mounting the electronic component 14 by using the cream solder 38 as the bonding material and changing the shape of the cream solder 38 has been described. I do.

The operation of the second embodiment will be described with reference to the flowchart of FIG. However, description of the same processing as in the first embodiment will be omitted.

The suction nozzle 20 to which the electronic component 14 has been sucked
Is moved above the mounting position 38 of the wiring board 12 (Steps 100 to 112), and then Step 130
Then, the shape of the cream solder 38 is detected by the detection device 26. In this shape detection, the shape can be recognized by detecting the area when the cream solder 38 is viewed from above and the contour extracted by the light cutting method. There is a screen printing method for supplying the cream solder, and as the printing shape detection, detection of a printing area, detection of at least one of gaps between adjacent patterns, and the like can be applied. In the present embodiment, a case will be described in which a shape is recognized by detecting a contour line. Next Step 13
In 2, it is determined whether or not the shape of the cream solder 38 detected in step 130 has changed. If a negative determination is made in step 132, the process proceeds to step 112 and the lowering operation of the suction nozzle 20 is continued. That is, when the electronic component 14 is not in contact with the cream solder 38 as shown in FIG.
Since no stress is applied, the shape of the cream solder 38 is not changed, and the outline 37A is detected.

On the other hand, when the lowering operation of the suction nozzle 20 is continued, the electronic component 14 shown in FIG. 8B comes into contact with the cream solder 38, and when the suction nozzle 20 is further lowered, the operation shown in FIG. Cream solder 3
8, the shape changes from the contour 37A to the contour 37B. In this case, since an affirmative determination is made in step 132, the process proceeds to step 134, where the shape change amount of the cream solder 38 is calculated. For example, an angle difference between contour lines, an increased area, and the like are obtained. Generally, when the suction nozzle descending amount is large, the shape of the cream solder 38 spreads in the pitch direction. For this reason, if the descending amount is too large, the cream solder 38 comes into contact with the adjacent land or the adjacent lead, and a bridge failure occurs. On the other hand, if the suction nozzle descending amount is small, variation in lead shape, variation in solder printing height, or local warpage of the wiring board, etc.
Lead floating failure occurs. Therefore, in the next step 136, it is determined whether or not the shape change amount calculated in step 134 has exceeded a predetermined set value S '. The set value S ′ is a limit value of a shape change amount determined in consideration of the influence of the variation of the shape of the lead 32 of the electronic component 14, the variation of the height of the cream solder 38, the local warpage of the wiring board 12, and the like. is there. In other words, as shown in FIG.
If 8 continues to be crushed, it will bridge to the adjacent land. Therefore, the limit value before reaching the bridge as described above is determined as the set value S ′. Therefore, when the shape change amount does not exceed the set value S ′, the electronic component 14
Is securely mounted on the wiring board 12 without causing a bridge. Therefore, if the shape change amount of the cream solder 38 calculated in step 134 has reached the set value S ′ (see FIG. 8C), step 1
The flow proceeds to 22 to stop the lowering operation of the suction nozzle 20.
On the other hand, if the calculated shape change amount has not reached the set value S ′, the process proceeds to step 112 and the lowering operation of the suction nozzle 20 is continued.

As described above, the shape of the cream solder 38 is detected by the detecting device 26, and the driving of the suction nozzle 20 is controlled based on the shape change amount.
The electronic component 14 can be securely mounted at a predetermined position on the wiring board 12 in accordance with the warpage of the electronic component 14 and the variation in the shape of the electronic component 14.

In the second embodiment, the example in which the cream solder 38 is used as the bonding material and the electronic component 14 is mounted using the cream solder 38 has been described. However, the present invention is not limited to this. It may be mounted depending on the material.

Further, in the present embodiment, the drive of the suction nozzle 20 is controlled every time the electronic component 14 is mounted on the wiring board 12.
When the electronic component 14 is mounted, the relative position in the height direction between the wiring board 12 and the electronic component 14 is considered to be relatively stable. And the driving of the suction nozzle 20 may be controlled based on the stored lowering amount. In this case, first, a predetermined number of electronic components 14 are controlled to lower the suction nozzle 20 in the same manner as in the above-described embodiment, and the lowering amounts are stored. When the electronic component 14 is mounted, the lowering of the suction nozzle 20 is controlled by the stored lowering amount of the subsequent mounting of the electronic component 14. By doing so, the mounting processing time of the electronic component 14 can be shortened, and the production efficiency can be improved.

In the above embodiment, QFP and TCP are used.
Has been described, but the present invention is not limited to this, and is effective, for example, when various components having lead terminals in the horizontal direction from the component main body are mounted on a substrate.

[0043]

As described above, the method and apparatus for mounting an electronic component according to the present invention controls the movement of the electronic component according to the amount of change in the electronic component and the bonding material. Regardless of this, there is an excellent effect that it can be securely mounted on the wiring board.

[Brief description of the drawings]

FIG. 1A is a schematic perspective view of an electronic component mounted on a wiring board, and FIG. 1B is a schematic view showing a part of the wiring board.

FIG. 2 is a schematic configuration diagram showing an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 3 is an enlarged view showing a lead portion of an electronic component and a part of a wiring board.

FIG. 4 is a flowchart illustrating a control routine relating to a method of mounting an electronic component according to the first embodiment.

FIG. 5 is a part of a cross-sectional view taken along line VV of FIG. 3 showing a positional relationship between leads of an electronic component and a wiring board. (A) shows a non-contact state between the electronic component and the joining material, and (B) shows a contact state between the electronic component and the joining material. (C) shows a state where the electronic component is securely mounted, and (D) shows a state where the mounting failure of the electronic component has occurred.

FIG. 6 is a cross-sectional view taken along line VV of FIG. 3 showing changes in the intervals and pitches of leads of the electronic component. (A) shows a non-contact state between the electronic component and the joining material, and (B) shows a contact state between the electronic component and the joining material. (C) shows a state in which the lead shape of the electronic component has changed and a mounting failure has occurred.

FIG. 7 is a flowchart illustrating a method for mounting an electronic component by the electronic component mounting apparatus according to the second embodiment.

FIG. 8 is a cross-sectional view illustrating a positional relationship between leads of an electronic component and a wiring board. (A) shows a non-contact state between the electronic component and the joining material, and (B) shows a contact state between the electronic component and the joining material. (C) shows a state in which the shape of the joining material has changed due to the weight of the electronic component or the like, and (D) shows a state in which the shape of the joining material has collapsed to form a solder bridge.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 12 Wiring board 14 Electronic component 20 Suction nozzle (transportation means) 24 Detector (detector) 26 Preliminary detector 28 Controller (controller)

Claims (4)

[Claims] 1. A component mounting method for mounting an electronic component on a substrate provided with a bonding material, wherein the electronic component is moved toward a bonding material provided on the substrate, and a change in shape of the electronic component is detected. Detecting whether the electronic component is in a contact state at least in contact with the bonding material provided on the substrate based on the detected value, and moving the electronic component when the electronic component is in the contact state. Stop, how to mount electronic components. 2. The method according to claim 1, wherein the joining material is a viscous joining material, a change in shape of the viscous joining material is detected, and based on the detected value, the electronic component is in at least contact with a joining material provided on the substrate. The method of claim 1, wherein it is determined whether or not the electronic component is mounted. 3. A component mounting apparatus for mounting an electronic component on a substrate provided with a bonding material, wherein the transporting means transports the electronic component toward a predetermined position on the substrate on which the electronic component is to be mounted. Detecting means for detecting a shape change of at least one of the shape of the electronic component and the shape of the bonding material; based on a detection result of the detecting means, the electronic component is at least provided on a bonding material provided on the substrate. A control unit that determines whether or not the electronic component is in a contact state and controls the transport unit so that transport of the electronic component is stopped when the electronic component is in the contact state. 4. The electronic component mounting apparatus according to claim 3, wherein the detection unit detects a change in shape of the joining material of the viscous joining material.