JP2023007881A - Component mounting system and component mounting method - Google Patents

Abstract

To provide a component mounting system capable of suppressing the reduction of production efficiency by continuing the automatic operation of the mounting process of the component without stopping the operation even when an attachment error is generated during the attachment process of the component.SOLUTION: The component mounting system is a component mounting system having a mounting head that sucks and mounts a component to a mounting position of the board. The system includes: mounting error detection means for detecting the presence/absence of component mounting error by the mounting head; imaging means that picks up an image of a mounting position when a component mounting error is detected by the mounting error detection means; and component presence/absence determination means that determines whether or not the component exists at the mounting position based on the image picked up by the imaging means.SELECTED DRAWING: Figure 4

Description

The present disclosure relates to a component mounting apparatus and a component mounting method.

2. Description of the Related Art A component mounting apparatus is known that mounts chip-like electronic components (hereinafter abbreviated as "components") such as ICs (Integrated Circuits), resistors, capacitors, etc. on a substrate by means of a mounting head. Such a component mounting apparatus picks up a component from a component supply device (component supply mechanism) such as a tape feeder or a tray feeder with a suction nozzle (component holding nozzle) provided in a mounting head. In this type of component mounting apparatus, the component recognition camera recognizes the pickup state of the component, receives this recognition result, corrects the difference between the pickup posture of the component and the posture to be mounted, and mounts the component at a predetermined position. do.

For example, if there is a problem with the suction nozzle of the mounting head or the vacuum device due to changes over time, or if the component itself supplied from the component supply device is defective, the component is picked up, the image is recognized, and the component is placed on the board. Before mounting, there may occur a drop error in which the component sucked by the suction nozzle falls off, or a take-out error in which the component that should have been mounted on the board is brought back without being mounted.

For example, in Patent Document 1, when a drop error occurs, an error screen is displayed, and a selection of recovery or mounting position confirmation is received, and if the mounting position is to be confirmed, an image near the mounting position is displayed using a teaching screen. A component mounting apparatus is disclosed that prompts a worker to visually confirm the situation by doing so. After confirming the status, the component mounting apparatus displays a confirmation input screen and receives a selection of remounting processing or skipping the component and mounting the next component.

JP-A-2005-64366

In the configuration of Patent Document 1, when a drop error or take-out error (that is, a component mounting error) occurs, the component mounting apparatus displays a teaching screen including an image near the mounting position for the operator to confirm the situation. waits for the input of the status confirmation result by visual observation. As a result, there is a problem that the component mounting process by the component mounting apparatus is stopped, and the operating efficiency of production is lowered. In addition, if the worker is required to visually check the situation, the results of the check may vary depending on the worker's experience or skill, making it difficult to take appropriate measures in the event of an installation error. It can be said that the configuration of Patent Document 1 has room for improvement.

The present disclosure has been devised in view of the above-described conventional circumstances, and even if a mounting error occurs during the component mounting process, the automatic operation of the component mounting process can be continued without stopping to improve the operational efficiency of production. Provided are a component mounting apparatus and a component mounting method capable of suppressing deterioration.

The present disclosure provides a component mounting apparatus having a mounting head that picks up a component and mounts it at a mounting position on a board, a mounting error detecting means for detecting the presence or absence of a mounting error of the component by the mounting head, and the mounting error detecting means. an imaging means for imaging the mounting position when a mounting error of the component is detected by the above; and determining whether or not the component exists at the mounting position based on the image captured by the imaging means. and component presence/absence determination means.

Further, the present disclosure is a component mounting method executed by a component mounting apparatus having a mounting head that picks up a component and mounts it at a mounting position on a board, and detects the presence or absence of a mounting error of the component by the mounting head. imaging the mounting position when a mounting error of the component is detected; and determining whether or not the component exists at the mounting position based on the captured image. and a component mounting method.

According to the present disclosure, even if a mounting error occurs during the component mounting process, the automatic operation of the component mounting process can be continued without stopping the reduction in the operational efficiency of production.

1 is a top view illustrating the mechanical configuration of the component mounting apparatus according to Embodiment 1; FIG. FIG. 2 is a side view illustrating the mechanical configuration of the component mounting apparatus shown in FIG. 1; Schematic diagrams illustrating basic operations and functions of the mounting head shown in FIG. FIG. 2 is a block diagram illustrating a functional configuration of a body control section of the component mounting apparatus according to Embodiment 1; 5 is a flowchart illustrating an operation flow executed by the body control unit shown in FIG. 4; 6 is a flow chart illustrating an operation flow executed by a body control section of a component mounting apparatus according to Embodiment 2; Schematic diagram illustrating how a mounting error (falling error) occurs in the mounting head

Hereinafter, a plurality of embodiments specifically disclosing a component mounting apparatus and a component mounting method according to the present disclosure will be described in detail with reference to the drawings as appropriate. However, more detailed description than necessary may be omitted. For example, detailed descriptions of well-known matters and redundant descriptions of substantially the same configurations may be omitted. This is to avoid unnecessary verbosity in the following description and to facilitate understanding by those skilled in the art. Also, each of the attached drawings shall be referred to according to the orientation of the numerals. It should be noted that the accompanying drawings and the following description are provided for a thorough understanding of the present disclosure by those skilled in the art and are not intended to limit the claimed subject matter.

For example, the term "unit" or "apparatus" used in the embodiments is not limited to a physical configuration that is mechanically implemented by hardware, but also includes those that implement the functions of the configuration by software such as programs. . Also, the function of one configuration may be implemented by two or more physical configurations, or the functions of two or more configurations may be implemented by, for example, one physical configuration.

(Embodiment 1)
Embodiment 1 according to the present disclosure will be described based on FIGS. 1 to 5. FIG.

<Mechanical Configuration of Component Mounting Equipment>
A mechanical configuration of the component mounting apparatus 1 will be described with reference to FIGS. 1 and 2. FIG. FIG. 1 is a top view illustrating the mechanical configuration of a component mounting apparatus 1 according to Embodiment 1. FIG. 2 is a side view illustrating the mechanical configuration of the component mounting apparatus 1 shown in FIG. 1. FIG. 1 and 2, the front side of the component mounting apparatus 1 (lower side in the plane of FIG. 1, left side in the plane of FIG. 2) is the front side, and the back side of the component mounting apparatus 1 (the plane of FIG. 1 is 2) is also referred to as the rear side.

One or a plurality of component mounting apparatuses 1 are arranged in a mounting board manufacturing line for mounting various components S (for example, semiconductors) on a board W to manufacture the board W, and the board W transported from the upstream of the mounting board manufacturing line. A part S is mounted in a predetermined position and attitude.

As shown in FIGS. 1 and 2, the component mounting apparatus 1 mounts components S (for example, electronic components such as ICs, transistors, and capacitors, or BGA (Ball Grid Array) components) on a substrate W mainly by the operation of each mechanism. and a main body control section 40 (see FIG. 4) for controlling its operation. The body mechanism section 10 has a mounter body 11 configured by a base 12 and the like, and a head unit 23 configured to be movable with respect to the mounter body 11 . The body control unit 40 is housed inside the base 12 of the component mounting apparatus 1, and controls various mechanisms such as the mounting machine body 11 and the head unit 23 (see below).

A substrate transport mechanism 13 is arranged along the X direction (transport direction of the substrate W) in the central portion of the base 12 of the mounting machine main body 11 . The substrate transfer mechanism 13 has a pair of conveyor portions 14 extending along the X direction, and transfers the substrate W placed on the pair of conveyor portions 14 to a predetermined mounting position. The substrate W is positioned and held.

A pair of front and rear component supply mechanisms 15 are disposed facing each other on both front and rear sides of the board transfer mechanism 13 (both upper and lower sides in the plane of FIG. 1 and both left and right sides in the plane of FIG. 2). A pair of component supply mechanisms 15 are arranged to face each other with the substrate transfer mechanism 13 interposed therebetween. Each of the pair of component supply mechanisms 15 has a feeder base 16 in which a slot 17 is provided. A plurality of tape feeders 18 are mounted in parallel in the slots 17 as part feeders. The tape feeder 18 holds a carrier tape 22 (an example of a component holding portion).

In the component mounting apparatus 1 according to the present embodiment, the pair of component supply mechanisms 15 are arranged on both front and rear sides of the pair of substrate transfer mechanisms 13 that transfer the substrate W, but they are arranged only on one side. It may be a configuration. Furthermore, although the component mounting apparatus 1 according to this embodiment has a single-lane configuration capable of transporting one substrate W, it has a dual-lane configuration capable of simultaneously transporting two substrates W, respectively. good too.

Moreover, the component mounting apparatus 1 further has a feeder cart 19 . The feeder cart 19 includes a truck portion 20 on which a plurality of wheels 20A are arranged on the lower side, and a plurality of reel stock portions (not shown) arranged on the upper side of the truck portion 20. . A reel 21 is accommodated in each of the plurality of reel stock units. The components S are supplied from the tape feeder 18 of the component supply mechanism 15 to the component mounting apparatus 1 by pulling out the carrier tapes 22 containing the components S from the respective reels 21 . As a result, the tape feeder 18 of the component supply mechanism 15 conveys (pitch feeds) the carrier tape 22 in the tape feeding direction at a predetermined pitch, thereby supplying the carrier tape 22 to the pick-up position (see below) of the component by the component mounting apparatus 1 . do.

The pick-up position of the component is a place where the pick-up (in other words, pickup) of the component S is performed by the mounting head 26 of the head unit 23, which will be described later. Then, the component S is mounted on the substrate W at the mounting position and mounting posture (hereinafter, the mounting position and mounting posture are simply referred to as "mounting position").

The head unit 23 is disposed above the base 12, and is configured to be movable between the component supply mechanism 15, the mounting position where the substrate W is arranged, and the unloading position (see above). be. Specifically, the head unit 23 is moved along the X and Y directions by an X-axis table mechanism 25 and a Y-axis table mechanism 24 that are arranged orthogonally to each other on a plane substantially parallel to the surface of the substrate W. It is provided movably.

A Y-axis table mechanism 24 is arranged along the Y direction on the upper surface of the base 12 . A pair of front and rear X-axis table mechanisms 25 are arranged along the X direction, and are attached to the Y-axis table mechanism 24 so as to be slidable along the Y direction. A head unit 23 (more specifically, a mounting head 26) is attached to each of the pair of front and rear X-axis table mechanisms 25 so as to be slidable along the X direction.

A mounting head 26 is mounted on the head unit 23, and the mounting head 26 is configured to be independently movable in the X and Y directions by the X-axis table mechanism 25 and the Y-axis table mechanism 24, respectively. . Thereby, the mounting head 26 is arbitrarily positioned on a plane substantially parallel to the surface of the substrate W, that is, on a horizontal plane (XY plane). In this embodiment, both the X-axis table mechanism 25 and the Y-axis table mechanism 24 are composed of linear guide drive mechanisms.

A component recognition camera 29 is arranged between the component supply mechanism 15 and the substrate transport mechanism 13 which are a pair of front and rear components. A component holding nozzle 27 (see later) attached to the mounting head 26 is driven and controlled by the body control unit 40 so as to pass over the component recognition camera 29 while picking up the component S from the component supply mechanism 15 and holding it by suction. be. At this time, the component recognition camera 29 captures an image of the component S passing while being sucked and held by the component holding nozzle 27 . Based on this imaging, the type of the component S is recognized by the imaging processing section 46 of the main body control section 40 .

Further, a nozzle holder 32 and a waste box 31 are further arranged between the front and rear pair of the component supply mechanism 15 and the substrate transfer mechanism 13 . The nozzle holder 32 accommodates a plurality of types of component holding nozzles 27 of the mounting head 26 corresponding to the components S to be held. By causing the mounting head 26 to access the nozzle holder 32 and execute a predetermined nozzle replacement operation, the component holding nozzle 27 suitable for the object to be held (that is, the type of the component S) is mounted on the mounting head 26 . The disposal box 31 is formed in a box shape and has an internal space, in which parts S and the like are discarded based on the judgment of the main body control section 40 .

<About the basic operation and functions of the placement head>
The basic operation and function of the mounting head 26 will now be described with reference to FIG. FIG. 3 is a schematic diagram illustrating basic operations and functions of the mounting head 26 shown in FIG.

As shown in FIG. 3 , the mounting head 26 is a multiple head (not shown) having a plurality of mounting heads 26 , and a plurality of component holding nozzles 27 are arranged side by side at the lower end of each mounting head 26 . be.

Each of the component holding nozzles 27 has an air flow path (not shown) extending toward its tip, and an air pressure pump, for example, is connected to the base end of this air flow path. For this reason, each of the component holding nozzles 27 can hold the component S from the tape feeder 18 of the component supply mechanism 15 by vacuum suction at its leading end using air pressure.

The mounting head 26 also includes a Z-axis lifting mechanism (not shown) that individually lifts and lowers each of the component holding nozzles 27, and a θ-axis rotating mechanism (not shown) that individually rotates each of the component holding nozzles 27 around the nozzle axis. ) and further. Thereby, the component holding nozzle 27 can individually operate (more specifically, move up and down) the components S. Further, the mounting head 26 is arbitrarily positioned on the horizontal plane (XY plane) by driving the Y-axis table mechanism 24 and the X-axis table mechanism 25 . With such a three-dimensional movement, the mounting head 26 picks up the component S from the pickup position of the tape feeder 18 of the component supply mechanism 15 by vacuum suction with the component holding nozzle 27 and picks it up at an arbitrary mounting position P of the substrate W. It is possible to wear it.

Further, in this embodiment, a flow sensor 28 (an example of mounting error detection means) is attached to the air flow path of the component holding nozzle 27, and the flow sensor 28 detects whether or not air is flowing in the air flow path. or even its flow rate.

That is, when the component holding nozzle 27 vacuum-sucks and holds the component S at its tip, air does not flow. On the other hand, when the component holding nozzle 27 does not hold the component S by dropping it, the air flows. Therefore, the flow rate sensor 28 can detect whether there is an error in mounting the component S by the mounting head 26 by detecting the presence or absence of the flow rate. Based on the detection result of the flow rate sensor 28, the mounting error determination section 45 (an example of mounting error detection means, described later) of the main body control section 40 determines that each of the component holding nozzles 27 picks up the component S and the substrate W is removed. When mounting at the mounting position P, it is possible to finally determine the mounting error, such as whether the component S is properly vacuum-sucked and held and is operating normally, or whether it is operating abnormally due to a drop, etc. becomes.

In the concept of the mounting error described above, there is a drop error ( hereinafter simply referred to as "drop error"). Furthermore, the concept of the mounting error includes a take-out error indicating that the mounting head 26 has brought back the component S from the mounting position P in spite of the mounting operation on the board W (hereinafter simply referred to as "take-out error"). ) are also included. In other words, the concept of mounting error in the present embodiment includes at least two errors (mistakes), namely drop error and take-away error.

A substrate recognition camera 30 (an example of an imaging unit) is fixed to the mounting head 26 . That is, the board recognition camera 30 is fixed integrally with the mounting head 26, and as the mounting head 26 moves, the board recognition camera 30 passes over the board W positioned by the board transport mechanism 13, and the board W is positioned. can be imaged. The position and orientation of the substrate W are detected by recognition processing of the result of this imaging by the body control unit 40 .

As a result of detecting the position of the substrate W, the mounting head 26 mounts (in other words, mounts) the component S at each mounting position P by using each of the component holding nozzles 27 according to the instruction of the body control section 40 . This mounting of the component S each time is performed until all the components S sucked and held by the respective component holding nozzles 27 of the mounting head 26 are mounted on the substrate W. FIG. In this manner, the component S is moved from the picking position to the mounting position while being sucked and held by the component holding nozzle 27 of the mounting head 26, and finally mounted on the substrate W. FIG.

The component mounting apparatus 1 picks up and mounts a plurality of components S by the component holding nozzles 27 of the mounting head 26 until the mounting at each of the mounting positions P on the substrate W is completed. Repeat the work of By repeating this operation, a large number of components S are sequentially mounted on each of the substrates W that are sequentially transported, and after mounting, the substrate W on which all the components S are mounted is transported to the downstream process. In this manner, the mounter main body 11 and the head unit 23 operate in cooperation, and this cooperative operation is executed according to instructions from the main body control section 40 .

Furthermore, in this embodiment, the board recognition camera 30 of the mounting head 26 detects the mounting error of the component S by the flow rate sensor 28 of the mounting head 26 and the mounting error determination unit 45 of the main body control unit 40. It is provided so as to be able to image the mounting position P, which was . Based on the image captured by the board recognition camera 30, a component presence/absence determination unit 47 (an example of component presence/absence determination means, described later) of the main body control unit 40 determines whether or not the component S exists at the mounting position P. .

<Regarding the software configuration of the main control unit of the component mounter>
The operation of the software configuration (functional configuration) of the body control unit 40 of the component mounting apparatus 1 will be described with reference to FIG. FIG. 4 is a block diagram illustrating the functional configuration of the body control section 40 of the component mounting apparatus 1 according to Embodiment 1. As shown in FIG.

Note that the body control unit 40 of the component mounting apparatus 1 is composed of, for example, a general-purpose computer, and software stored in a storage device such as a ROM (Read Only Memory) or a RAM (Random Access Memory) of the computer. A program is executed by an arithmetic unit such as its CPU (Central Processing Unit) or FPGA (Field Programmable Gate Array).

Each block shown in the body control unit 40 of FIG. 4 represents a function realized by software such as a program stored in the storage unit 41 . That is, the body control unit 40 refers to the programs and data (information) stored and held in the storage unit 41 and executes the programs to implement the functions of the respective units. However, the functions expressed by each of the blocks are not limited to software, and each may be configured by hardware as a physical configuration of the "apparatus".

As shown in FIG. 4 , the body control section 40 includes a storage section 41 , a mechanism driving section 44 and an imaging processing section 46 .

The storage unit 41 includes, for example, a RAM as a work memory used when executing each process of the main body control unit 40, and a ROM for storing programs and data that define the operation of the main body control unit 40. be. The RAM temporarily stores data or information generated or acquired by the body control unit 40 . A program that defines the operation of the body control unit 40 is written in the ROM.

Further, the storage unit 41 stores at least mounting information 42 and component information 43 in, for example, a ROM. The mounting information 42 stores information such as the type of the component S to be mounted on each board W, and the mounting position P and mounting orientation of the component S on the board W. FIG. The component information 43 stores information such as the external shape of each type of component S, the presence or absence of electrodes, and the number of electrodes.

The mechanism drive unit 44 controls the main body mechanism unit 10, and controls the driving of, for example, the substrate transport mechanism 13, the head unit 23, and the component supply mechanism 15 so that they operate in cooperation with each other. Further, the mechanism drive section 44 is configured including a mounting error determination section 45 . The mounting error determination unit 45 detects whether there is a mounting error in the component S by the mounting head 26 based on the detection result of the flow rate sensor 28 provided in the mounting head 26 described above.

The imaging processing unit 46 controls the board recognition camera 30 and the component recognition camera 29, and performs image processing and recognition processing on images captured by the board recognition camera 30 and the component recognition camera 29. FIG. For example, regarding the substrate recognition camera 30, the imaging processing unit 46 causes the substrate recognition camera 30 to image the substrate W when the mounting head 26 passes over the substrate W positioned by the substrate transport mechanism 13. and pose recognition. As for the component recognition camera 29, the imaging processing unit 46 causes the component recognition camera 29 to image the component S when the component S sucked and held by the component holding nozzle 27 passes above the component recognition camera 29. Recognize types.

Further, in this embodiment, the imaging processing section 46 is configured including a component presence/absence determination section 47 . The imaging processing unit 46 causes the substrate recognition camera 30 to image the substrate W when a mounting error is detected. Then, based on the image captured by the board recognition camera 30, the component presence/absence determination section 47 of the imaging processing section 46 determines whether or not the component S exists at the mounting position P.

<About the operation flow of the main body control part>
An operation flow of the body control unit 40 according to the present embodiment will be described with reference to FIG. FIG. 5 is a flow chart illustrating an operation flow executed by main body control unit 40 shown in FIG.

As shown in FIG. 5, the mechanism driving section 44 instructs the head unit 23 of the main body mechanism section 10 to pick up the component S from the pickup position by vacuum suction with the mounting head 26 thereof. The component holding nozzle 27 of the mounting head 26 picks up the component S from the pick-up position by vacuum suction. Then, the mechanism drive unit 44 moves the component S above the component recognition camera 29 while the component holding nozzle 27 of the mounting head 26 is holding the component S by suction (S101).

At the moment when the component S sucked and held by the component holding nozzle 27 passes above the component recognition camera 29, the imaging processing unit 46 causes the component recognition camera 29 to image the component S and recognizes the type of the component S (S102). . Then, the mechanism driving section 44 mounts the components S on the mounting head 26 (head unit 23) by the respective component holding nozzles 27 at the mounting positions P corresponding to the respective components S (S103). At this time, the flow rate sensor 28 attached to the component holding nozzle 27 detects the flow rate of air in the air flow path (S104). Based on the result of this flow rate detection, the mounting error determination unit 45 determines whether or not there is a mounting error (take-out error in this embodiment) of the component S (S105).

Here, for example, when the flow rate of the air flow path of the component holding nozzle 27 detected by the flow sensor 28 is equal to or higher than a predetermined threshold value, the component S is not vacuum-sucked at the tip of the component holding nozzle 27 and is properly mounted on the substrate W. It is possible to judge that it has been attached (attached). Therefore, as a result of the determination of the mounting error, the mounting error determination unit 45 determines that the mounting error has not occurred when the flow rate detected by the flow rate sensor 28 is equal to or greater than the predetermined threshold value (NO in S105). Then, the body control unit 40 sets (records) the mounting position P as having been mounted in, for example, the storage unit 41 (S106).

Then, the main control unit 40 refers to the information recorded in the storage unit 41, for example, that the component S has been mounted or has not been mounted at each of the mounting positions P, and determines whether there is a component S that has not been mounted. It is determined whether or not (S107). As a result of the determination, if it is determined that there is an unmounted part S (YES in S107), the operation flow returns to step S101. If it is determined that all parts S have been mounted (S107), the operation flow ends (END). In other words, the component mounting apparatus 1 picks up the plurality of components S by the component holding nozzles 27 of the mounting head 26, mounts them, and moves them back to the picking positions until the mounting at each of the mounting positions P on the board W is completed. repeats a series of tasks.

On the other hand, for example, when the flow rate of the component holding nozzle 27 is less than a predetermined threshold, it can be determined that the component S is still vacuum-sucked by the component holding nozzle 27. identifies that there is a carry-out error as a part S mounting error. In this case (YES in S105), it is determined that there is an error in mounting the component S by the mounting head 26, and the imaging processing unit 46 causes the board recognition camera 30 to image the mounting position P of the board W (S108).

At this time, since the board recognition camera 30 is integrally fixed with the mounting head 26, the mechanism driving section 44 drives and controls the mounting head 26 (head unit 23) to move it, so that the board recognition camera 30 is mounted on the board. The mounting position P of W is positioned at a position where an image can be captured. When positioned, the image processing unit 46 instructs the board recognition camera 30 to image the mounting position P. FIG.

The imaging processing unit 46 analyzes the image captured by the board recognition camera 30 (S109). Based on the result of the image analysis, the component presence/absence determination unit 47 determines whether or not the component S exists at the mounting position P, in other words, whether or not the mounting at the mounting position P has been completed (S110). ). As a result of this determination, if it is determined that there is a component S at the mounting position P (YES in S110), the operation flow proceeds to step S106, and the main body control unit 40 sets the mounting position P as already mounted. .

When it is determined that there is no component S at the mounting position P (NO in S110), the mechanism drive unit 44 drives and controls the mounting head 26 to remove the component S vacuum-sucked to the tip of the component holding nozzle 27. It is disposed of in the disposal box 31 (S111). After the part S is discarded, the main body control unit 40 sets the mounting position P as being unmounted (S112). Then, the operation flow proceeds to step S107.

<Advantages of the Component Mounting Apparatus of Embodiment 1>
As described above, according to the component mounting apparatus 1 of the present embodiment, in the component mounting apparatus 1 having the mounting head 26 that picks up the component S and mounts it at the mounting position P of the substrate W, the component S is mounted by the mounting head 26. A flow rate sensor 28 and a mounting error determination section 45 (an example of mounting error detection means) for detecting the presence or absence of an error, and when a mounting error of the component S is detected by the flow rate sensor 28 and the mounting error determination section 45, the mounting position A board recognition camera 30 (an example of an imaging unit) that captures P, and a component presence/absence determination unit 47 that determines whether or not a component S exists at the mounting position P based on the image captured by the board recognition camera 30. (an example of component presence/absence determination means);

Further, according to the component mounting method of the present embodiment, the component mounting method is executed by the component mounting apparatus 1 having the mounting head 26 that picks up the component S and mounts it on the mounting position P of the board W. a step of detecting the presence or absence of a mounting error of the component S by the head 26; a step of imaging the mounting position P when the mounting error of the component S is detected; determining whether S exists.

Therefore, the presence or absence of a mounting error of the component S by the mounting head 26 is detected, and the mounting position P on the substrate W is imaged based on the detection result. Whether or not the component S is actually mounted on the substrate W at the mounting position P is determined based on the captured image. With such a determination, it becomes possible to automate the handling of the mounting error, which has conventionally been done by the worker, and the worker needs to stop the automatic operation of the mounting process to deal with it. However, the mounting of the component S can be continued without stopping the automatic operation. In other words, even if a mounting error occurs during the mounting process of the component S, the automatic operation of the mounting process of the component S can be continued without stopping, and the reduction in the operating efficiency of production can be suppressed.

Further, according to the component mounting apparatus 1 of the present embodiment, when the component presence/absence determination unit 47 (an example of component presence/absence determination means) determines that the component S does not exist at the mounting position P, the mounting head 26 The part S is discarded. Therefore, since it is determined that the component S is not mounted at the mounting position P, by discarding the component S, the next component S can be quickly taken out and mounted, and the component can be mounted on the board W. The mounting process of S can be continued quickly. As a result, it is possible to more reliably suppress a decrease in the operating rate of production.

Further, according to the component mounting apparatus 1 of the present embodiment, the board recognition camera 30 (an example of imaging means) is fixed integrally with the mounting head 26 . That is, it is assumed that the mounting head 26 is often positioned on or around the substrate W when the mounting error is detected. Therefore, by providing the board recognition camera 30 integrally with the mounting head 26, the board recognition camera 30 can pick up an image of the mounting position P by moving as short a distance as possible. As a result, it is possible to improve the time efficiency of determination of a mounting error.

Further, according to the component mounting apparatus 1 of the present embodiment, the mounting error determination section 45 (an example of the mounting error detection means) regards a take-out error indicating that the mounting head 26 has brought back the component S from the mounting position P as a mounting error. To detect. That is, the presence or absence of a mounting error is determined after the mounting head 26 sucks and holds the component S and performs the mounting operation to the mounting position P of the substrate W, thereby identifying that the specific content of the mounting error is the carry-out error. and respond appropriately.

(Embodiment 2)
Embodiment 2 according to the present disclosure will be described based on FIGS. 6 and 7. FIG. It should be noted that since the description of the same or equivalent parts as those of the above-described first embodiment is redundant, the same reference numerals may be assigned to the drawings and the description thereof may be omitted or simplified.

<About the operation flow of the main body control part>
An operation flow of the body control unit 40 of the present embodiment will be described with reference to FIGS. 6 and 7. FIG. FIG. 6 is a flow chart illustrating an operation flow executed by the body control section 40 of the component mounting apparatus 1 according to the second embodiment. FIG. 7 is a schematic diagram illustrating how a mounting error (falling error) occurs in the mounting head 26. As shown in FIG.

As shown in FIG. 6, the operation flow executes steps S201 to S204 (corresponding to steps S101 to S104 shown in FIG. 5), and then, based on the detection result of the flow sensor 28 of the component holding nozzle 27, the mounting error is determined. The unit 45 determines whether or not there is a mounting error in the component S. As a result of the determination, if it is determined that there is no mounting error (NO in S205), the body control unit 40 sets the mounting position P as already mounted (S206).

The body control unit 40 refers to the information on whether or not the component S has been mounted at each mounting position P, and determines whether or not there is a component S that has not been mounted (S207). As a result of this determination, if it is determined that there is an unmounted part S (YES in S207), the operation flow returns to step S201. If it is determined that all parts S have been mounted (S107), the operation flow ends (END).

On the other hand, if it is determined that there is a mounting error in the component S (YES in S205), the imaging processing unit 46 causes the board recognition camera 30 to image the mounting position P of the board W (S208), and displays the result of the imaging. Image analysis is performed (S209). Based on the result of the image analysis, the component presence/absence determination section 47 determines whether or not the component S exists at the mounting position P (S210). As a result of this determination, if it is determined that there is a part S at the mounting position P (YES in S210), the operation flow proceeds to step S206, and the main body control unit 40 sets the mounting position P as already mounted (S206). ).

When it is determined that there is no component S at the mounting position P (NO in S210), the flow rate sensor 28 of the component holding nozzle 27 again detects the flow rate of air in the air flow path (S211). Based on the result of this flow rate detection, the mounting error determination unit 45 determines whether or not the component S is being sucked and held at the tip of the component holding nozzle 27 (S212). As a result of this determination of suction holding, if it is determined that the suction holding state is established (YES in S212), the operation flow returns to step S202, and the steps after step S202 are executed again. In other words, when it is determined that the component S does not exist at the mounting position P and that the component S is held by suction at the tip of the component holding nozzle 27, the mounting head 26 returns the component S to the mounting position P. Installing.

Here, as described above, the mounting error includes the drop error as well as the carry-out error. As shown in FIG. 7, when the mounting head 26 attempts to mount the component S at the mounting position P, the vacuum suction of the component S becomes insufficient due to, for example, the timing of driving the pneumatic pump being out of order. 26 component holding nozzles 27 may drop onto the substrate W. FIG.

Therefore, as shown in FIG. 6, when it is determined that the component S is not suction-held by the tip of the component holding nozzle 27 (NO in S212), the mounting error determination unit 45 determines that the drop error is a mounting error. Detect as That is, by performing such a series of determinations, the mounting error determination unit 45 can identify that the mounting error is the drop error. Based on this identification, the body control unit 40 sets (records) that the mounting position P has not been mounted (S213). Then, the operation flow proceeds to step S207.

<Advantages of the Component Mounting Apparatus of the Present Embodiment>
As described above, according to the component mounting apparatus 1 of the present embodiment, when the component presence/absence determination unit 47 (an example of component presence/absence determination means) determines that the component S does not exist at the mounting position P, the mounting head 26 detects the component Remount S to mounting position P. Therefore, even if a mounting error is detected during the mounting process of the component S, the component S can be reused and mounted on the substrate W without wasting the component S, thereby suppressing an increase in production cost. can.

Further, according to the component mounting apparatus 1 of the present embodiment, the flow rate sensor 28 and the mounting error determination section 45 (an example of the mounting error detection means) allow the mounting head 26 to drop the component S to the mounting position P or its surroundings. A drop error indicating that the That is, when it is determined that the component S does not exist at the mounting position P and that the component S is not suction-held at the tip of the component holding nozzle 27, the mounting error determination unit 45 determines that the mounting head 26 is at the mounting position P or A drop error indicating that the component S has been dropped around it is detected as a mounting error. As a result, the body control unit 40 can identify that the specific content of the attachment error is the drop error, and can appropriately handle the error.

Other configurations and effects are the same as those of the first embodiment described above.

Although the embodiments have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is obvious that a person skilled in the art can conceive of various modifications, modifications, substitutions, additions, deletions, and equivalents within the scope of the claims. Naturally, it is understood that it belongs to the technical scope of the present disclosure. Moreover, each component in the above-described embodiments may be combined arbitrarily without departing from the gist of the invention.

Even if a mounting error occurs during the component mounting process, it is useful as a component mounting apparatus capable of continuously suppressing a decrease in the operating efficiency of production without stopping the automatic operation of the component mounting process.

Reference Signs List 1 : component mounting apparatus 10 : main body mechanism 11 : mounter main body 12 : base 13 : board transfer mechanism 14 : conveyor 15 : component supply mechanism 16 : feeder base 17 : slot 18 : tape feeder 19 : feeder cart 20 : Truck 20A : Wheel 21 : Reel 22 : Carrier tape 23 : Head unit 24 : Y-axis table mechanism 25 : X-axis table mechanism 26 : Mounting head 27 : Component holding nozzle 28 : Flow sensor 29 : Component recognition camera 30 : Board recognition Camera 31 : Disposal box 32 : Nozzle holder 40 : Main body control unit 41 : Storage unit 42 : Mounting information 43 : Parts information 44 : Mechanism driving unit 45 : Mounting error judgment unit 46 : Imaging processing unit 47 : Parts presence/absence judgment unit P : Mounting position S: Part W: Board

Claims (7)

In a component mounting apparatus having a mounting head that picks up a component and mounts it at a mounting position on a substrate,
a mounting error detecting means for detecting the presence or absence of a mounting error of the component by the mounting head;
imaging means for imaging the mounting position when a mounting error of the component is detected by the mounting error detection means;
component presence/absence determination means for determining whether or not the component exists at the mounting position based on the image captured by the imaging means;
Component mounting equipment. When the component presence/absence determination means determines that the component does not exist at the mounting position, the mounting head discards the component.
The component mounting apparatus according to claim 1. When the component presence/absence determination means determines that the component does not exist at the mounting position, the mounting head remounts the component at the mounting position.
The component mounting apparatus according to claim 1. The imaging means is fixed integrally with the mounting head,
The component mounting apparatus according to claim 1. The mounting error detection means detects, as the mounting error, a take-out error indicating that the mounting head has brought back the component from the mounting position.
The component mounting apparatus according to claim 1. The mounting error detecting means detects, as the mounting error, a drop error indicating that the mounting head has dropped the component at or around the mounting position.
The component mounting apparatus according to claim 1. A component mounting method executed by a component mounting apparatus having a mounting head that picks up a component and mounts it at a mounting position on a substrate,
a step of detecting whether or not there is an error in mounting the component by the mounting head;
imaging the mounting position when a mounting error of the component is detected;
determining whether or not the component exists at the mounting position based on the captured image;
Component mounting method.

Images