JP2002185198A - Method for detecting displacement of electrical component caused by absorption nozzle and method for mounting electrical component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a detection accuracy of displacement of an electronic component 82 to a rotational center of an absorption nozzle 184. SOLUTION: A dog 266 including a section 268 to be detected in a position where an image of the section and an electronic component 82 absorbed by the absorption nozzle 184 are simultaneously taken is prepared. An relative location between a tip 274 of the section 268 to be detected and the rotational center 322 of the absorption nozzle 184 is detected beforehand and stored in the storing means. The images of the electronic component 82 held by the absorption nozzle 184 and the section 268 to be detected are simultaneously taken, and the central position of the electronic component 82 and the tip 274 of the section 268 to be detected are detected. The position of rotational center is estimated based on the position of the tip 274 and the relative location between the detected tip 274 and the rotational center 322 of the absorption nozzle 184, and the displacement of the center of the electronic component 82 to the estimated central position is obtained. The shift of the central position of the absorption nozzle 184 caused by thermal expansion of every part of apparatus can be detected and eliminated as a positional shift of the section 268 to be detected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric component mounting system for mounting an electric component (including an electronic component) on a circuit board such as a printed wiring board, and a relative positional relationship between parts related to component mounting accuracy in the system. The present invention relates to acquisition, displacement of an electric component with respect to a suction nozzle, and the like.

[0002]

2. Description of the Related Art Many electric component mounting systems are provided with a suction nozzle for sucking and holding an electric component by a negative pressure, but the suction position of the electric component by the suction nozzle is usually slightly shifted. Therefore, conventionally, an electric device held by a suction nozzle is imaged by an image pickup device, a position shift of the electric component with respect to the suction nozzle is detected, and the electric component is mounted on a circuit board while correcting the position shift. I have. The displacement includes at least one of a displacement of a reference point such as a center point of the electric component in a direction orthogonal to a central axis of the suction nozzle and a displacement of the electric component around a central axis of the suction nozzle. Also, the circuit board on which the electric component is to be mounted is usually positioned and supported by the board support device. However, the position of the pad on which the electric component of the circuit pattern formed on the circuit board is to be mounted is still used. Often deviates slightly from the intended position. Therefore, the reference mark is formed simultaneously with the formation of the circuit pattern on the circuit board, the reference mark is imaged by the imaging device to obtain the positional deviation, the positional deviation of the pad is estimated from the positional deviation, and the positional deviation is also corrected. At the same time, electric parts are mounted.

As described above, in order to acquire the displacement of the electric component with respect to the suction nozzle and the displacement of the reference mark of the circuit board with respect to the substrate supporting device, it is necessary to obtain the position of the suction nozzle when picking up the electric component and the reference mark. It is necessary that the relative positions of the component imaging device, the reference mark imaging device, and the like be known. At the time of assembling and maintenance of the electrical component mounting system, their relative positions are detected using a dedicated detection device, and it is assumed that the relative positions have been maintained, and the positional deviation of the electrical components and reference marks has been detected. It is also possible to obtain. However, this requires a large-scale detection device. Further, even if the relative positions are detected once, the expansion / contraction based on the temperature change of the ball screw of the relative moving device that relatively moves the suction nozzle, the substrate support device, the imaging device, etc., the elastic deformation based on the load, and the electric component mounting system. The relative positions of the suction nozzle, the substrate support device, the imaging device, and the like change due to deformation or the like of the main body frame, the bracket holding the imaging device, and the like due to the temperature change. Note that expansion and contraction and deformation based on the above temperature change are collectively referred to as thermal deformation.

[0004] Furthermore, the suction nozzle, the substrate support device, and the like due to the aging of each component of the electric component mounting system and wear due to use, and movement due to loosening of the fixing device.
The relative position of the imaging device or the like may change. Therefore, in particular, in an electric component mounting system that requires high mounting position accuracy, a linear encoder is provided to detect an actual relative position, and a bracket or the like holding an imaging device has a high rigidity and a low coefficient of thermal expansion. 2. Description of the Related Art It has been practiced to use a material or a camera lens or the like having an earthquake-resistant structure. However, if these measures are taken, it is inevitable that the cost of the apparatus will increase, and it is still difficult to say that it is perfect.

[0005]

SUMMARY OF THE INVENTION In view of the above circumstances, the present invention accurately obtains a displacement of an electric component with respect to a suction nozzle while avoiding an increase in apparatus cost as much as possible. Or, to improve the electrical component mounting position accuracy of the electrical component mounting system, and to make it possible to obtain the relative positional relationship of the portion related to the electrical component mounting position accuracy has been made as a problem, According to the present invention, a method for detecting a displacement of an electric component, a recording medium and device for detection, a method for acquiring a relative positional relationship, a recording medium and device for acquisition, an electric component mounting method, a recording medium for mounting, a mounting system, etc. Is obtained. As in the case of the claims, each aspect is divided into sections, each section is numbered, and if necessary, is described in a form in which the numbers of other sections are cited. This is for the purpose of facilitating the understanding of the present invention and should not be construed as limiting the technical features and combinations thereof described in the present specification to those described in the following sections. . Further, when a plurality of items are described in one section, the plurality of items need not always be adopted together. It is also possible to select and adopt only some of the items.

(1) Suction for sucking electric parts by negative pressure
This is a method for detecting the displacement of the electrical component with respect to the nozzle.
Thus, the suction nozzle and a dog disposed in the vicinity thereof
And a first imaging step of simultaneously imaging
Process the image data of the suction nozzle and the dog
The relative positional relationship between the suction nozzle and the dog.
A first data processing step of obtaining and storing, and the suction nozzle
While holding the electrical component in the
And a second imaging step of imaging the
Image data of the electrical part and the dog obtained by
Between the suction nozzle and the dog acquired in the first data processing step
Based on the relative positional relationship, the electrical component suction nozzle
And a second data processing step of acquiring a positional deviation to be performed.
And a method for detecting a displacement of an electric component.
1). The displacement of the electric component with respect to the suction nozzle is as follows.
Directly to the center axis of the suction nozzle at the reference point such as the center point of the electrical component
Misalignment in the intersecting direction and the suction noise
At least one of the rotational position shifts around the center axis of the
including. In the second data processing step, first, the dog
Position of the dog, and the position of the dog and the first data processing
The relative position between the dog and the suction nozzle
The position of the suction nozzle is obtained from the
Acquires the relative position (position shift) of the electrical component with respect to the position
First, determine the relative positional relationship between the dog and the electrical components.
In the first data processing step.
Based on the relative positional relationship between the dog and the suction nozzle
The position of the electrical component with respect to the suction nozzle
You may. The imaging device is, for example, a camera such as a CCD camera.
Or only one or more reflective surfaces,
A light guide device with many optical fibers to change the direction of light
It is also possible to provide with. In the former
With the camera facing the tip of the suction nozzle,
Makes the light guide devices face each other. According to the present invention,
The suction nozzle is hidden behind electrical components when imaging
Of a detectable dog
Position and phase of the previously detected dog and suction nozzle
Accurately estimate the position of the suction nozzle based on the
Can be specified. Then, the power for the estimated position
The misalignment of the electrical component is
Is considered to be a misalignment when the suction nozzle and the
This is appropriate as long as the relative position with respect to the tag does not change. So
Then, for example, the member itself holding the suction nozzle or
Can rotate the member relatively or move axially
If the dog is held by the members held in the
Adsorption noise due to thermal deformation, elastic deformation, aging, wear, etc.
To prevent the relative position of the dog and the dog from changing.
It is relatively easy to do. So, for example,
For the estimated position of the suction nozzle based on the position of the
Product misalignment is caused by the actual
By performing the mounting work assuming that it is a displacement,
Relative relationship between the suction nozzle and the imaging device based on the various causes
Corrects misalignment and enables electrical components to be mounted on circuit boards with high positional accuracy
Can be attached to (2) The first imaging step includes reducing the number of the suction nozzles.
Is also rotated once so that suction at at least two rotational positions is possible.
Imaging the tip of the arrival nozzle, the first imaging step
Are based on images of the tips of at least two of the suction nozzles.
Obtaining the rotation center position of the suction nozzle
(1) The method for detecting the displacement of the electrical component described in (1) (Claim
2). For example, the suction nozzle is rotated 180 degrees,
Of the suction nozzle at two rotation positions before and after the rotation
Using the average value of the center coordinates of the two images at the tip as the rotation center position
Or rotate the suction nozzle 90 degrees three times
And the center of the four images at the tip in four rotational positions
The coordinates of the rotation center position can be obtained from the mark. 3
When using images of the tip in more than one rotational position
Means that the rotation angle of the suction nozzle does not necessarily have to be the same
Absent. Assuming that the center of the image at the tip is located on one circumference,
What is necessary is just to acquire the position of the center of the circumference of. Adsorption
If the nozzle does not rotate, the tip position is
It is OK to do mounting work etc. as it is the position,
The suction nozzle rotates, and the electric parts are placed in a circuit with an arbitrary rotation posture.
If it can be mounted on the substrate, turn the suction nozzle
Control of mounting work with the position of the center of rotation as the position of the suction nozzle
Otherwise, the accuracy of the mounting position will be reduced. (3) A plurality of the docks are provided, and at least the first
In the imaging step, the plurality of dogs are imaged, and the
Relative positional relationship of multiple dogs in one data processing process
Obtain the tilt of the imaging screen based on (1) or (2)
3. A method for detecting a displacement of an electric component according to claim 1.
Assembly error of the imaging device itself or the device holding the imaging device
And the imaging screen (imaging area)
May lean relatively. If you use multiple dogs,
This inclination can be detected. For example, two docks
The X-axis and Y-axis at two corners of the imaging screen of the first imaging device.
So that images can be captured exactly in the direction parallel to each other
If you arrange them, the two dogs have a predetermined
The straight line connecting the reference points, such as vertices, is
(The tilt of the image screen)
Can be. The X-axis or straight line connecting the reference points
Is to measure the tilt angle with respect to the Y-axis with another device in advance.
For example, a straight line connecting the reference points can be used to detect the inclination of the first imaging device.
It can be used as a reference for issuing. Further
As will be described later in the embodiment section,
If the top, the first imaging device and the second imaging device are used,
The inclination of the straight line connecting the above-mentioned reference points is determined by the electrical component mounting system.
It can be detected using its own function. Dog
The dog may be damaged due to an assembly error or thermal deformation of the holding device.
This method can cause the dog to tilt itself.
It can be detected. And so detected
A straight line connecting the reference points is used to detect the inclination of the imaging screen of the first imaging device.
Can be used as a basis for issuing
By using the reference chip, the first imaging device
It can also detect the tilt relative to the imaging device.
You. Dogs are relatively large and suitable for detecting tilt
If it is shaped, the tilt of the imaging screen can be controlled by one dog.
Can be detected. However, dogs
It hides behind electrical components that are absorbed by the slime
Is meaningless, so the outer periphery of the imaging screen, especially the imaging screen
In the case of a rectangle, a plurality of relatively small
It is desirable to provide a tag. (4) Electric components are adsorbed by the suction nozzle to the circuit board
Mounting and assembly of electrical circuits
How to get the relative positional relationship of parts related to mounting accuracy
Wherein the first imaging device and the vicinity of the suction nozzle
First imaging step of simultaneously imaging a dog placed beside
And the suction nozzle and nozzle acquired in the first imaging step.
Process the image data with the suction nozzle and the
Data processing that acquires and stores the relative positional relationship with the
Process and a state in which a reference chip is held by the suction nozzle
A second image of the reference chip and the dog simultaneously
The imaging step and the reference channel acquired in the second imaging step
Image data of a top and a dog and the first data processing step
Based on the relative positional relationship between the suction nozzle and the dog
The position of the reference tip with respect to the suction nozzle.
Obtaining a second data processing step;
Relative to the substrate support device that supports the circuit board
The mounting surface is set to be immovable relative to the support device.
The mounting process for mounting the reference chip and the mounting process
Image of the mounted reference chip by the second imaging device
The third imaging step and the base acquired in the third imaging step
Based on the image data of the quasi chip, the suction nozzle,
Relative positional relationship between the first imaging device and the second imaging device
And a third data processing step of obtaining
Suction of the reference chip obtained in the second data processing step
Correct the misalignment with respect to the nozzle and execute the placement process described above
And obtained in the second data processing step
Displacement of the reference chip with respect to the suction nozzle
The third data based on the reference chip image data
To carry out one of the processing steps.
Characteristic relative positional relationship acquisition method (claim 4). First shot
Component mounting system including an imaging device and a second imaging device
In general, the position of electrical components with respect to the suction nozzle
The misalignment occurs in the image data acquired by the first imaging device.
On the other hand, and
The position shift that occurs is the image data acquired by the second imaging device.
Data is detected based on the
Suction nozzle and substrate support specified by the loading control program
The mounting is performed after the relative positioning with respect to the holding device is corrected.
Therefore, the suction nozzle, the first imaging device, and the second imaging device
If there is a relative displacement between the devices, the displacement is
Naturally, this causes a decrease in the mounting position accuracy of the electric component. Scold
According to the present invention, a suction nozzle, a first imaging device and
Relative positional relationship of the second imaging device, for example,
Detecting the relative positional deviation of the other two with respect to one of the deviations,
Considering the relative displacement, the suction nozzle and substrate support
If the relative positioning with the holding device is corrected,
The landing position accuracy can be improved. The reference tip is
Prepare a dedicated chip to obtain the relative positional relationship
Electrical components that may be used and should be actually mounted on the circuit board
May be used as a reference chip. Smell the former
The reference tip with a shape and dimension
Or with optical characteristics that are convenient for detection
And thereby obtain the relative positional relationship
It is easy to improve the degree. The mounting surface is
May be permanently set on the components of the
It may be set temporarily on the circuit board on which the product is to be mounted.
The mounting surface is used to support the substrate when the mounting step and the third imaging step are performed.
It only needs to be set to be immovable relative to the holding device
It is. The method for acquiring the relative positional relationship in this section
Electric components can be used during system assembly and maintenance.
It is also possible to carry out at appropriate time during the mounting work.
You. In the former, based on the acquired relative positional relationship,
By modifying the mounting control program, etc., the suction nozzle
By correcting the relative positioning between the
To improve the electrical component placement accuracy of the electrical component placement system
Can be done. In the latter case, the electrical component mounting system
Changes in relative positional relationship caused by thermal deformation of each part of the stem
Acquired, and based on it, the suction nozzle
By correcting the relative positioning, the electrical component mounting system
The accuracy of mounting electric components on the stem can be further improved
You. In addition, the temperature of each part of the electrical
Sufficient mounting position accuracy even if mounting work is performed before
Obtainable. (5) The relative position relationship acquisition method described in (4),
The reference mark provided on the circuit board supported by the board support device
A fourth imaging step of imaging the workpiece with the second imaging device;
The image data of the fiducial mark acquired in the fourth imaging step
Data to obtain the circuit board displacement based on the data
In the processing step, the electric component is held by the suction nozzle, and
Fifth imaging in which the first electrical device is imaged by the first imaging device
Process and the image of the electrical component obtained in the fifth imaging process
Image data and the relative position
Of the obtained suction nozzle, the first imaging device and the second imaging device.
Relative positional relationship and acquired in the fourth data processing step
The substrate support device based on the misalignment of the circuit board.
Correct the predetermined relative position between the placement and the suction nozzle
And a component mounting process for mounting the electrical components on the circuit board.
An electric component mounting method including the method (claim 5). The above fourth data processing
Misalignment of the circuit board obtained in the
Position of the second imaging device)
(Position shift of the circuit board with respect to the second imaging device)
Alternatively, it may be a deviation from the normal position. In the former case,
If the position of the first imaging device is
Assuming that it is the reference position, the regular position on the circuit board
Deviation from the position of the circuit board with respect to the second imaging device.
And the displacement of the second imaging device with respect to the first imaging device.
Is obtained as the sum of (6) An electrical component according to any one of paragraphs (1) to (3)
A control program for implementing the position shift detection method is not
A record recorded in a state readable by a computer
Medium. (7) Implement the relative positional relationship acquisition method described in (4).
Computer-readable control program for
Recording medium recorded in a functional state. (8) To implement the electrical component mounting method described in (5).
Control program can be read by computer
Recording medium recorded in the state. (9) For suction nozzles that suck electric components by negative pressure
A device for detecting a displacement of an electric component,
From the direction parallel to the central axis of the suction nozzle
Imaging device capable of imaging and suction nozzle using the imaging device
At the same time, the dog placed at
When the image pickup device picks up the suction nozzle and the dog at the same time,
In addition, the electrical components sucked by the suction nozzle and the dog are
An imaging control device for causing an image to be taken at the same time;
Suction nozzle and dog based on image of arrival nozzle and dog
To obtain the relative positional relationship with
Image of electrical parts and dog, and suction nozzle and dog
Of the suction nozzle based on the relative position of the
And a data processing device for acquiring the positional deviation of the product.
A feature of the present invention is a device for detecting a displacement of an electric component.
The position shift detecting device according to this section is the position shift detecting apparatus according to the above (1).
This is suitable for implementing the displacement detection method. (10) The imaging control device reduces the number of the suction nozzles.
Are rotated once and in at least two rotational positions.
Multiple shots to make the imaging device image the tip of the suction nozzle
An image control unit, wherein the data processing device includes the at least
Also based on the images of the tips of the two suction nozzles
Includes rotation center position acquisition unit that acquires rotation center position (9)
Item 5. A device for detecting a displacement of an electric component according to the above. (11) Including a plurality of the dogs,
The imaging nozzle simultaneously with the suction nozzle
Placed at the position where the image is taken on the outer periphery of the image screen
The device for detecting misalignment of electrical components described in paragraph (9) or (10)
Place. (12) The data processing device includes a plurality of dogs.
Obtain the tilt of the imaging screen of the imaging device based on the image
Including the inclination acquisition unit, the position deviation detection of the electrical parts described in section (11)
Output device. (13) The dog generally has a rectangular shape, and the rectangular shape
A detected object having a vertex defined by two mutually orthogonal sides
(9) to (12)
Component displacement detector. Vertex defined by two sides
Is easy to accurately detect by imaging,
It is ideal as a reference point for defining the position of the dog.
You. (14) The detected portion has a chamfer extending along the two sides.
And the two sides intersect each other at an acute angle
The electrical component according to item (13), formed as an intersection of two planes.
Misalignment detection device. Thickness on the part that forms the two sides
For example, when two sides are imaged by an imaging device,
Since it is difficult to obtain an image, from the original purpose, the above two sides are sentence
Literally "formed as a line of intersection of two planes that intersect at an acute angle
It is ideal that the thickness of the portion forming the two sides is 0
However, for the sake of manufacturing, or in view of durability and safety,
From the point, the part forming the two sides has a very small thickness
It may be assumed. This section also includes that form
I do. (15) Component supply device for supplying electrical components, and electrical components
Suction nozzle that sucks and holds the air, and supports the circuit board
Substrate support device, component supply device, suction nozzle and base
A relative movement device for relatively moving the plate support device, and the relative movement device;
Controlling the anti-movement device to supply the component to the suction nozzle.
Supports the electrical components supplied by the device on the substrate support device
Mounting at a predetermined position on the circuit board
A control device, and a central axis of the suction nozzle
A first imaging device capable of imaging from a direction parallel to the line;
The reference mark provided on the circuit board supported by the board support device
Imaging device capable of capturing images, and their first and second imaging devices
Data processing for processing image data acquired by the device
Device in an electric component mounting system including
Chisel, relative to the first imaging device and the second imaging device
A relative positional relationship acquisition device for acquiring a positional relationship, wherein
The first imaging device can take an image simultaneously with the suction nozzle
And a dog disposed at an appropriate position,
The suction nozzle and the dog are imaged simultaneously.
The reference chip and the dog sucked by the suction nozzle are
Imaging control means for causing an image to be captured at the time, and control of the imaging control means.
The image of the suction nozzle and the dog taken simultaneously by the control
The relative positional relationship between the suction nozzle and the dog based on the
Of the reference chip and the dog
Based on the image and the relative positional relationship between the suction nozzle and the dog.
The position of the reference tip with respect to the suction nozzle
The relative displacement device and the suction device
The nozzle and the substrate support device are relatively moved to support the substrate.
Place the base on a mounting surface that is set to be immovable relative to the device.
Reference chip placement control means for placing the reference chip,
Making the second imaging device image the mounted reference chip
Reference chip imaging control means and the obtained reference chip
The suction nozzle and the first imaging
Acquiring a relative positional relationship between an imaging device and the second imaging device.
And relative position relationship acquisition means, and
The means is a reference key acquired by the displacement acquisition means.
Correct the position of the tip with respect to the suction nozzle
The reference chip is mounted on the mounting surface described above in a nozzle.
Or the relative positional relationship acquisition means is
Suction of the reference chip acquired by the position shift acquisition means
The position shift with respect to the nozzle and the reference chip imaging control
With the image data of the reference chip acquired by the control of the stage
That the relative positional relationship is obtained based on the
Characteristic relative positional relationship acquisition device. Relative position according to this section
The relationship acquisition device is configured to acquire the relative positional relationship according to the above (4).
It is suitable for carrying out the method. (16) Component supply device for supplying electrical components, and electrical components
Suction nozzle that sucks and holds the air, and supports the circuit board
Substrate support devices, their component supply devices, suction nozzles and
Relative movement device for relatively moving the substrate and the substrate support device;
Controlling the relative moving device to supply the parts to the suction nozzle
Supports electrical components supplied from the device on the substrate support device
Mounting at a predetermined position on the circuit board
A control device, and a central axis of the suction nozzle
A first imaging device capable of imaging from a direction parallel to the line;
The reference mark provided on the circuit board supported by the board support device
Imaging device capable of capturing images, and their first and second imaging devices
Data processing for processing image data acquired by the device
An electrical component mounting system comprising:
A position where an image can be taken simultaneously with the suction nozzle by an imaging device
And the suction device is attached to the first imaging device.
Simultaneous imaging of the chisel and the dog
Simultaneous imaging of reference chip and dog adsorbed by nozzle
Imaging control means for controlling the imaging control means
Based on the image of the suction nozzle and the dog taken at the same time
Acquire the relative positional relationship between the suction nozzle and the dog
At the same time, the image of the reference chip and the dog
Suction based on the relative positional relationship between the suction nozzle and the dog.
Position where the positional deviation of the reference chip from the landing nozzle is obtained
A shift acquiring unit, the suction nozzle provided to the relative moving device,
The substrate support device is relatively moved, and the substrate support device is moved.
The reference chip is placed on the mounting surface
Reference chip placement control means for placing
The reference chip for causing the second imaging device to image the reference chip
Imaging control means and the acquired image data of the reference chip.
The suction nozzle, the first imaging device and the
And a relative position for obtaining a relative positional relationship of the second imaging device.
The placement relationship acquisition means and the placement control means are provided with
With respect to the suction nozzle of the reference chip acquired by the acquisition means.
The suction nozzle and the reference chip
That the pump is to be placed on the placement surface
The positional relationship acquiring means acquires the position by the positional deviation acquiring means.
Displacement of the obtained reference chip with respect to the suction nozzle,
The base obtained by the control of the reference chip imaging control means.
The relative positional relationship is determined based on the image data of the quasi-chip.
The substrate to be obtained
Fiducial mark provided on a circuit board supported by a support device
Reference mark imaging control means for causing the second imaging device to image
Based on the column and the image data of the acquired fiducial mark
Board displacement acquisition to acquire the circuit board displacement
Means for holding an electric component on the suction nozzle,
Electrical component imaging for imaging the electrical component by the first imaging device
Image control means and the acquired image data of the electric component
And the suction obtained by the relative positional relationship obtaining means.
Relative position of arrival nozzle, first imaging device and second imaging device
Relationship and the number of times obtained by the substrate displacement obtaining means.
The substrate supporting device and the front
Correct the predetermined relative position with the suction nozzle and
The electronic component is mounted at a predetermined position on the circuit board.
Electrical component mounting comprising:
system. The electrical component mounting system according to this section,
(5) It is suitable for implementing the electrical component mounting method according to the paragraph.
You. (17) The relative moving device is supported by the substrate supporting device.
X-axis in a plane parallel to the surface of the circuit board
X-axis slide that can move in the direction
Therefore, the Y axis perpendicular to the X axis direction in the plane
Held movably in the direction, holding the suction nozzle
A Y-axis slide, and the first imaging
An imaging device was fixedly attached to the X-axis slide (1
The electric component mounting system according to the item 6). (18) The relative moving device is supported by the substrate supporting device.
X-axis in a plane parallel to the surface of the circuit board
X-axis slide that can move in the direction
Therefore, the Y axis perpendicular to the X axis direction in the plane
Held movably in the direction, holding the suction nozzle
And a Y-axis slide, wherein the first imaging device
Is attached to a stationary member that holds the X-axis slide.
The electrical component mounting system according to item (16). (19) The relative moving device is supported by the substrate supporting device.
X-axis in a plane parallel to the surface of the circuit board
X-axis slide that can move in the direction
Therefore, the Y axis perpendicular to the X axis direction in the plane
Held movably in the direction, holding the suction nozzle
A Y-axis slide, and a second imaging device.
Item (16) wherein the device is fixedly attached to the Y-axis slide.
Or the electrical component mounting system according to any one of (18) to (18).
M (20) The mounting surface is the origin of the movement of the X-axis slide.
And near the origin close to the origin of the Y-axis slide movement
Position, the origin of the X axis slide movement and the Y axis
Is set to a remote position that is far from the origin of the movement of the id.
The reference chip placement control means is located near the origin.
The reference chip is placed on both the placement surface at the position and the remote position.
Described in any of paragraphs (17) to (19)
Electrical component mounting system. (21) The relative moving device pivots the suction nozzle.
Turn around the line and advance on the trajectory of the turn.
Nozzle moving device that stops at a plurality of set stop positions
And the substrate supporting device was supported by the substrate supporting device.
Orthogonal to each other in a plane parallel to the surface of the circuit board
Substrate that moves in two directions parallel to the X axis and the Y axis
A moving device, wherein the first imaging device stops the plurality of stops.
A position facing the tip surface of the suction nozzle stopped at one of the positions
And the second imaging device is mounted stationary on the substrate support.
At a position facing the circuit board supported by the holding device
The provided electrical component mounting system according to (16). (22) The substrate moving device moves in a direction parallel to the X axis.
Moveable X-axis slide and move in a direction parallel to the Y-axis
A movable Y-axis slide;
Origin of axis slide movement and movement of the Y axis slide
And the position near the origin close to the origin of the X-axis slide movement.
Both the origin and the origin of the Y-axis slide movement are far
Remote position and the reference chip placement control
Means are placed on both the mounting position near the origin and the remote position.
According to the item (21), wherein the reference chip is placed.
Electrical component mounting system.

[0007]

Embodiments of the present invention will be described below in detail with reference to the drawings. An electronic component mounting system according to one embodiment of the present invention is shown in FIGS. In FIG. 1, reference numeral 10 denotes a base of the electronic component mounting system. On the base 10, a printed wiring board 12, which is a kind of a circuit board, is placed in the X-axis direction (the horizontal direction in FIG. 1).
And a component mounting device 18 for mounting an electronic component, which is a kind of electrical component, on the printed wiring board 12, and component supply devices 20 and 22 for supplying the electronic component to the component mounting device 18. I have.

In this embodiment, the printed wiring board 12
Is transported in a horizontal position by the wiring board conveyor 14,
It is stopped at a predetermined component mounting position by a stop device not shown, and is also provided by a wiring board supporting device 26 (see FIG. 5) as a circuit board supporting device provided at a portion of the base 10 corresponding to the component mounting position. Supported. In the present embodiment, the printed wiring board 12 is supported such that the mounting surface 28 on which the electronic component is mounted is horizontal. The X-axis direction is a direction that is parallel to the mounting surface 28 and parallel to one coordinate axis on a horizontal XY coordinate plane.

The circuit board conveyor 14 includes a pair of guide rails 30 and 32, as schematically shown in FIGS. In the present embodiment, the guide rails 30,
One of the fixed guide rails 32 is a fixed guide rail provided at a fixed position on the base 10, and the other is a movable guide rail provided so as to be able to approach and separate from the fixed guide rail. The movable guide rail is moved according to the dimension perpendicular to the transport direction), and the transport width is changed.

A pair of guide rails 30 and 32 are respectively wound around a conveyor belt 34 as an endless wrapping body. The printed wiring board 12 is placed on the conveyor belt 34, and the pair of conveyor belts 34. Are synchronously circulated by a belt driving device having a wiring board transport motor 36 (see FIG. 9) as a driving source.
The printed wiring board 12 is transported.

The wiring board support device 26 may include a pair of clamp members 40 and a plurality of support members 42 as schematically shown in FIG. The pair of clamp members 40 are formed in a plate shape, and are respectively erected on both sides of the elevating platform 44 parallel to the wiring board transport direction in parallel with the wiring board transport direction. A portion between the pair of clamp members 40 of the elevating platform 44 and a supported portion on the back surface of the printed wiring board 12 (the surface opposite to the side where the electronic components are mounted in the electronic component mounting system). It is erected at the corresponding position.

The lift 44 is raised and lowered by a lift drive 50. In the example shown in the drawing, the lifting platform drive device 50 includes a lifting cylinder 52 as a drive source. The lifting / lowering cylinder 52 is a type of a hydraulic cylinder serving as a hydraulic actuator, and is an air cylinder in the present embodiment. The elevating cylinder 52 is provided vertically, and a piston rod 54 is engaged with the elevating table 44. Therefore, if the piston rod 54 is expanded and contracted, the lifting platform 44 can move the plurality of sets of the guide rods 5.
6 and a guide device 60 including a guide cylinder 58, the guide member 60 is moved up and down while being guided by the guide device 60. They can be approached and separated. The pair of clamp members 40 lift the printed wiring board 12 from the conveyor belt 34 and clamp the printed wiring board 12 with its edges sandwiched between holding portions 62 provided on the guide rails 30 and 32, respectively. ,
The support member 42 contacts the back surface of the printed wiring board 12 and supports it from below.

As shown in FIGS. 1 and 2, the component supply devices 20 and 22 are provided on both sides of the wiring board conveyor 14 so as to be separated from each other in a Y-axis direction orthogonal to the X-axis direction.
In the illustrated example, the component supply device 20 is a feeder type component supply device, and the component supply device 22 is a tray type component supply device. Feeder type electronic component supply device 20
In, a number of feeders 70 are arranged side by side in the X-axis direction. Taping electronic components are set in each feeder 70. The electronic component is accommodated in each of the component accommodating recesses formed at equal intervals in the carrier tape, and the openings of the component accommodating recesses are closed by a cover film affixed to the carrier tape, so that the carrier tape is closed. This prevents the electronic component from jumping out of the component housing recess when the tape is fed. This carrier tape is fed at a predetermined pitch in the Y-axis direction, and the cover film is peeled off and sent to the component supply position. The electronic components supplied by the feeder 70 include:
Some electronic components have leads and some have no leads. In any case, since the electronic component is substantially positioned and accommodated in the component accommodating recess, the component mounting device 18 can hold the approximate center of the electronic component and take it out with a substantially correct rotation posture.

The tray-type electronic component supply device 22 stores and supplies electronic components in a component tray 76 (see FIG. 3).
The component trays 76 are supported one by one in a large number of component tray housing boxes 78 arranged vertically.
Each of these component tray storage boxes 78 is supported by a support member (not shown), and is sequentially raised to a component supply position by an elevating device provided in a column 79. Above the component supply position, a holding device described later is provided. It is necessary to secure space for taking out electronic components. Therefore, the component tray storage box 78 to which the electronic components have been supplied is raised by the space at the same time as the next component tray storage box 78 is raised to the component supply position, and is retracted to the upper evacuation area. . The tray-type electronic component supply device 22 is the same as the electronic component supply device described in Japanese Patent Publication No. 2-57719, and a description thereof will be omitted.

As described above, the component mounting device 18 takes out the electronic components one by one from the component tray 76 in the tray housing box 78 having a space formed above. Each component tray 7
6 is a large number of receiving recesses 80 formed in a matrix.
(See FIG. 6), each of which accommodates an electronic component 82,
Each accommodating recess 80 accommodates the electronic component 82 in a substantially positioned state. Therefore, the component mounting device 18 can hold the substantially center of the electronic component 82 and can take it out with a substantially correct rotation posture. The illustrated electronic component 82 has a large number of leads 92 extending from four sides of a rectangular main body 90. When the leads 92 are connected to the printed wiring board 12, Is referred to as a bottom surface 96, and the opposite surface is referred to as an upper surface 94. However, the electronic components having the ball grid array and the electronic components having no leads are all represented by reference numeral 82.

The component mounting device 18 transports the electronic component 82 by linearly moving the holding device 100 shown in FIG. 3 in the directions having the X-axis direction and the Y-axis direction orthogonal to each other. Or it is to be mounted on the mounting surface 18 which is the upper surface. Therefore, as shown in FIG. 1, ball screws 104 are provided on both sides of the wiring board conveyor 22 of the base 10 in the Y-axis direction in parallel with the X-axis direction, and nuts 108 (provided on the X-axis slide 106). Each of the ball screws 104 is rotated by an X-axis slide drive motor 110 so that the X-axis slide 106 is parallel to the X-axis. To any position in any direction. X axis slide 10
As shown in FIG. 1, reference numeral 6 has a length extending from the feeder type electronic component supply device 20 to the tray type electronic component supply device 22 beyond the wiring board conveyor 14. The base 10
A guide rail 112 (see FIG. 4) serving as a guide member is provided below each of the two ball screws 104 on the upper side. The fitting is possible and the movement is guided. As described above, the nut 108, the ball screw 104, the X-axis slide driving motor 110 and the like constitute the X-axis slide moving device 116.

The ball screw 1 is placed on the X-axis slide 106.
20 (see FIG. 4) is provided in parallel with the Y-axis direction, and a Y-axis slide 122 is screwed on a nut 124. When the ball screw 120 is rotated by gears 128 and 130 by a Y-axis slide driving motor 126 (see FIG. 1), the Y-axis slide 122 is rotated.
Is guided by a pair of guide rails 132 as guide members, and is moved to an arbitrary position parallel to the Y-axis direction. that's all,
The nut 124, the ball screw 120, and the Y-axis slide driving motor 126 constitute a Y-axis slide moving device 134, and the X-axis slide 106 and the X-axis slide moving device 1
The holding device 100 is moved to an arbitrary position in a horizontal plane by the moving device 136 together with the moving device 136 together with the 16 and the Y-axis slide 122.

The vertical side surface 140 of the Y-axis slide 122
2 and 3, the holding device 100, an elevating device 144 for lifting and lowering the holding device 100, and the holding device 1
A rotation device 146 for rotating the motor 00 around its axis is provided, and the holding device 100 and the like constitute a component mounting unit. In this embodiment, one set of component mounting units is provided, but a plurality of sets may be provided. For example, a plurality of component mounting units can be provided on the Y-axis slide 122 in a row in parallel with the Y-axis direction.

The component mounting unit of the present embodiment has the same configuration as the component mounting unit described in Japanese Patent Application Laid-Open No. 4-372199, and will be briefly described. Y-axis slide 1
7 is provided on the supporting portion 150 provided on the side surface 140 of FIG.
As shown in FIG.
The nuts 4 are supported concentrically and at a distance in the vertical direction about their own axis, and in this embodiment, rotatably about a vertical axis.
A male thread 158 of the hollow rod 156 is screwed into the 52, and a spline 160 formed below the male thread 158 of the hollow rod 156 is fitted to the spline member 154. The nut 152 and the spline member 154 are a ball nut and a ball spline member holding a large number of balls.

The nut 152 is connected to the motor 16 for raising and lowering the nozzle.
4, rotated about an axis by a rotary drive including gears 166, 168, whereby the hollow rod 156 is moved axially and raised and lowered. Nut 15
2, gears 166, 168 and nozzle lifting motor 16
4 constitutes the lifting device 144. The lifting / lowering device 144 includes the hollow rod 156 and thus the holding device 100.
Is moved in a direction parallel to the axis of the printed wiring board 12, and is also an approaching / separating device that moves the holding device 100 in a direction perpendicular to the surface of the printed wiring board 12 to approach and separate from the printed wiring board 12. The rotation angle of the motor 164 is detected by an encoder 170.

The support portion 15 of the spline member 154
A gear 172 is fixed to the lower end protruding from the nozzle 0, and is engaged with a gear fixed to the output shaft of the nozzle rotation motor 174 (see FIG. 9).
Rotation of spline member 154 by 74 causes hollow rod 156 to rotate about its vertical axis. Thereby, the holding device 100 is rotated around its axis, and the electronic component 82 held by the holding device 100 is a rotation axis perpendicular to the upper surface 94 and passing through substantially the center of the upper surface 94. Is rotated about a vertical axis. The rotation angle of the nozzle rotation motor 174 is detected by an encoder 176 (see FIG. 9).

At the lower end of the hollow rod 156, FIG.
As shown in, the chuck adapter 180 is detachable,
It is attached so that it cannot come out, and the chuck adapter 1
A chuck 182 is detachably attached to 80 and cannot be pulled out. These three members are the suction nozzle 1
The suction nozzle 184 and the holder 186 constitute the holding device 100.

The suction nozzle 184 includes a sleeve 190,
And a suction tube 192 fitted to the sleeve 190. The sleeve 190 is fitted to the chuck adapter 180 and a compression coil spring 198 (hereinafter referred to as a spring 1) disposed between the sleeve 190 and the chuck adapter 180.
Abbreviated as 98. ), A pair of inclined surfaces 202 provided on the pair of ears 200 and located on the same plane with each other are provided on the chuck 182. Pin 2 of
By engaging the suction nozzle 04, the suction nozzle 184 is held by the chuck 182 so as to be relatively immovable in the axial direction and relatively unrotatable. The compression coil spring 198 is
It is a spring member as an elastic member which is a kind of the urging means.

The light emitting plate 206 is fitted and fixed to the outer surface of the sleeve 190 at the end protruding from the chuck 182, and the suction tube 192 is fitted to the inner peripheral surface thereof. It is made to protrude. The light emitting plate 206
When the suction posture of the electronic component 82 is detected by the suction nozzle 184, the suction nozzle 184 receives ultraviolet light and emits visible light.

The suction nozzle 184 sucks the electronic component 82 by negative pressure, and the printed wiring board 12 as a member to be mounted.
Attach to Therefore, the suction nozzle 184 includes the pipe 210 fitted in the hollow rod 156 so as to be relatively movable in the axial direction, the housing 212 fixed to the upper end protruding from the hollow rod 156 of the pipe 210, and the housing 2.
12 are connected to a negative pressure source (not shown), a positive pressure source (not shown), and the atmosphere via a nipple 214 and the like attached to the suction pipe 12. It is alternatively connected to a positive pressure source and the atmosphere. The suction tube 192 supplies the electronic component 8 by supplying a negative pressure.
2 is sucked on the upper surface 94 of the main body 90, and the electronic component 82 is opened by supplying a positive pressure. In the present embodiment, the suction nozzle 184 sucks and holds the electronic component 82 in a horizontal posture.

As shown in FIG. 8, the suction nozzle 1 held by the holder 186 is moved by its own weight.
84 is in contact with the upper surface of the sleeve 190 and is moved up and down together with the suction nozzle 184. In the present embodiment, the start of the relative movement between the holder 186 and the suction nozzle 184 is detected based on the movement of the pipe 210. Therefore, at the upper end of the pipe 210, FIG.
As shown in FIG. 7, a dog 222 is fixed, and a photoelectric switch 226 is fixed on an upper portion of the housing 212.

The photoelectric switch 226 is provided at a position above the dog 222 when the electronic component 82 is not mounted. The photoelectric switch 226 is a reflection type in this embodiment, has a light emitter and a light receiver, and emits an ON signal when light emitted from the light emitter is reflected and received, and the light is not reflected and is not received. In this case, an OFF signal is issued. Therefore, in a state where the suction nozzle 184 protrudes the longest from the holder 186, there is nothing that reflects the light emitted from the photoelectric switch 226, and the OFF signal is issued because the light is not received.
When retracted, the light is reflected by the dog 222 and
N signal, whereby the suction nozzle 184 and the holder 1
The start of the relative movement with respect to 86 is detected. In this embodiment, the pipe 210, the dog 222, and the photoelectric switch 226 constitute a detection device that detects the start of the relative movement between the holder 186 and the suction nozzle 184.

A plurality of types of electronic components 82 are mounted on the printed wiring board 12, but different types often have different sizes (at least one of the cross-sectional area and the height).
A suction nozzle 184 having a larger diameter of the suction tube 192 as the electronic component 82 is larger is used. Therefore, the adsorption tube 19
A plurality of types of suction nozzles 184 having different diameters 2 are prepared, housed in a nozzle housing device (not shown), and exchanged according to the type of electronic component 82 to be mounted. Note that the length of the adsorption tubes 192 may be different if the diameters of the adsorption tubes 192 are different, but here, the lengths of the adsorption tubes 192 are all the same for easy understanding.

The Y-axis slide 122 is also provided with a reference mark camera 240 (see FIG. 1) as an image pickup device for picking up a reference mark provided on the printed wiring board 12 so as to be immovable. In the present embodiment, the reference mark camera 240 includes a CCD (Charge Coupled Device) and a lens system, and is a CCD camera that acquires a two-dimensional image of a subject at once. An illumination device 242 is provided corresponding to the fiducial mark camera 240, and illuminates the fiducial mark and its surroundings.

The X-axis slide 106 is located at a position corresponding to each of the two ball screws 104 for moving the X-axis slide 106, between the feeder-type electronic component supply device 20 and the printed wiring board 12 and the tray-type. An imaging device 248 is immovably attached to a position between the electronic component supply device 22 and the printed wiring board 12, respectively. The configurations of these imaging devices 248 are the same, and one of the imaging devices 248 will be described as a representative.

As shown in FIG. 4, the image pickup device 248 includes a component camera 250 for picking up an image of the electronic component 82 and a light guide device 251. The light guide device 251 has reflection mirrors 252 and 254 as reflection devices. ing. Reflecting mirrors 252, 25
4 is fixed to the lower part of the X-axis slide by a bracket (not shown).
00, the reflection surface is inclined at about 45 degrees with respect to the vertical plane including the center line of the suction nozzle 184, and the end near the X-axis slide is located below. 256.

On the other hand, the other reflecting mirror 254 has a reflecting surface 256 of the reflecting mirror 252 on the opposite side of the X-axis slide.
And a reflecting surface 258 that is inclined symmetrically with respect to the vertical plane, and whose end near the X-axis slide is located below. A component camera that picks up an image of the electronic component 82 held by the suction nozzle 184 at a position opposite to the side on which the holding device 100 of the X-axis slide 106 is provided and facing the reflecting surface 258 of the reflecting mirror 254. 250 is fixed downward. Therefore, the holding device 100 is moved to the moving device 136.
And the ball screw 1 is moved in the Y-axis direction.
When the component camera 250 reaches a position corresponding to the position 04 and located on the reflecting mirror 252, the component camera 250 can image the electronic component 82. The imaging device 248 displays the electronic component 8 on the movement locus of the electronic component 82 when the Y-axis slide 122 moves with respect to the X-axis slide 106.
That is, they are arranged at positions where two images can be taken. In the present embodiment, the component camera 250 is a surface imaging device, like the fiducial mark camera 240, and has a CC
D camera. Note that the reflecting mirror 254 is omitted,
It is also possible to dispose the component camera 250 at a position facing the reflecting mirror 252 in a horizontal posture.

In the vicinity of the reflecting mirror 252, a strobe 260 as an ultraviolet irradiation device is provided.
The light emitting plate 206 is irradiated with ultraviolet rays. The light-emitting plate 206 absorbs ultraviolet light and emits visible light, illuminates the electronic component 82 sucked by the suction nozzle 184 from behind, and the component camera 250 uses the light-emitting plate 206 as a bright background and a silhouette image of the electronic component 82. So,
An image of the electronic component 82 viewed from a direction parallel to the rotation axis is captured. In the present embodiment, the light emitting plate 206 and the ultraviolet irradiation device constitute an illumination device. Further, another strobe 262 for irradiating a visible ray to a position closer to the suction nozzle 184 than the strobe 260 is provided to illuminate the ball grid array with a small inclination angle with respect to the bottom surface of the electronic component 82. Of the lighting device. It should be noted that the strobe light 260 is used to emit visible light to the electronic component 8.
It is also possible to use a lighting device for acquiring a front image that irradiates toward the bottom surface of 2, and to provide both a lighting device for acquiring a silhouette image and a lighting device for acquiring a front image, and selectively use them. It can be possible.

A dog 266 is provided near the holding device 100 as shown in FIGS. The dog 266 is connected to the Y-axis slide 12 via the bracket 267.
2 and has a detected part 268 having a shape shown in FIGS. 10 and 11 at the lower end. Detected part 268
Has a rectangular shape, and portions corresponding to two sides of the rectangle are chamfered to form sharp edges 270 and 272. Vertex 274 where these edges 270 and 272 intersect
Is detected as the position of the dog 266. As shown in FIG. 12, an image of the electronic component 82 (in the illustrated example, an electronic component having a ball grid array) is represented by the same reference numeral for convenience, and the same applies to other images. When acquired, dog 2 at the same time
The image of the 66 to-be-detected portion 268 is also provided at a position acquired at the corner of the imaging screen 276.

The holding device 100 is moved to the moving device 136.
In the present embodiment, as shown in FIG. 1, a portion close to two corners on a diagonal line of a rectangular area moved by the X-axis slide driving motor 110 of the ball screw 104 on the component supply device 20 side And the component supply device 2
X-axis slide drive motor 1 for ball screw 104 on 2 side
A mounting surface 28 is provided at each of one position near the end on the side remote from 10.
2,284 are set. The mounting surface 282 is set at a position close to the origin of the movement of the X-axis slide 106 and the Y-axis slide 122, and the mounting surface 284 is as far as possible from the origin of the movement of the X-axis slide 106 and the Y-axis slide 122. It is set at just the position. The reference chip 286 is selectively mounted on one of the mounting surfaces 282 and 284. The ball screws 104 and 120
The end on the side driven by the X-axis slide drive motor 110 and the Y-axis slide drive motor 126 is held by the base 10 and the X-axis slide 106 so as to be rotatable and immovable in the axial direction. Is held in a state where both rotation and axial movement are allowed. Therefore, the amount of thermal deformation and elastic deformation of the ball screws 104 and 120 is small on the mounting surface 282 side, and
It increases on the 4 side. It is desirable that the mounting surface 282 be set at a position where the amount of thermal deformation or elastic deformation is negligible. However, the mounting surfaces 282 and 284 may be provided near two diagonally opposite corners of the printed wiring board 12 that is to be supported by the wiring board support device 26. The reference chip 286 may be a flat plate member having a rectangular planar shape and each side may function as a detected portion. May be formed. In the following, the former is assumed for the sake of simplicity.

The present electronic component mounting system includes a control device 300 shown in FIG. 9 as control means. The control device 300 includes a CPU 302, a ROM 304, and a RAM 306.
And a computer having a bus 308 connecting them. An image input interface 312 is connected to the bus 308, and the fiducial mark camera 240 and the component camera 250 are connected to the bus 308. A servo interface 314 is connected to the bus 308, and various actuators such as the X-axis slide drive motor 110 are connected to the bus 308. X-axis slide drive motor 1
Reference numeral 10 denotes a kind of an electric motor as a drive source, which is a servo motor in the present embodiment. However, any motor that can control the rotation angle can be used, and a step motor or the like can be used.

A digital input interface 318 is also connected to the bus 308, and the encoders 170, 1
Although not shown, an encoder for detecting the rotation angle of the X-axis slide drive motor 110 and the like is connected. A digital output interface 320 is further connected to the bus 308, and the motor 3
6, a lifting cylinder 52 and the like are connected. RA above
Various control programs such as a main routine (not shown), a relative positional relationship acquisition routine, an electronic component mounting routine, and the like are stored in M306. Although illustration of the connection is omitted, the control device 300 also controls imaging by various cameras.

The electronic component mounting system configured as described above acquires the relative positional relationship of the parts related to the mounting accuracy by itself, and determines the mounting accuracy based on the deviation of the relative positional relationship from the normal relative positional relationship. Electronic components 8 while avoiding decline
2 can be mounted on the printed wiring board 12. That is, the deviation of the relative position of the imaging device 248 including the component camera 250 and the light guide device 251, the reference mark camera 240, and the suction nozzle 184 from the original relative position, that is, the magnitude and direction of the deviation are determined by the electronic component. The mounting system itself can automatically detect and correct the displacement of the relative position, and mount the electronic component 82 on the printed wiring board 12. In the present embodiment, the positions of the imaging device 248 and the reference mark camera 240 are represented by the positions of their optical axes, that is, the positions of the center points of the imaging screen. In the present embodiment, the positions of the reference mark camera 240 and the suction nozzle 184 are determined based on the position of the center point of the imaging screen of the imaging device 248, and
It is represented by a position on an XY coordinate plane defined by an axis. Also, the origin of the XY coordinate plane is defined by the moving area of the X-axis slide 106 and the Y-axis slide 122.
It is set at a portion closest to the X-axis slide drive motor 110 and the Y-axis slide drive motor 126.

By executing the relative positional relationship acquisition routine,
First, the suction nozzle 184 is moved to the position of the coordinates (X ₁ , Y ₁ ) set as the position of the optical axis of the imaging device 248 and stopped. The coordinate position at this time is acquired by the control device 300 based on an output signal of an encoder provided to the X-axis slide drive motor 110 and the Y-axis slide drive motor 126. If this electronic component mounting system is manufactured as designed,
The center of the tip end surface of the suction nozzle 184 should be located at the position of the optical axis of the imaging device 248, that is, at the center of the imaging screen. The tip end surface of the suction nozzle 184 and the detected portion 268 of the dog 266 are imaged by the imaging device 248 as shown by a solid line in FIG.

Thereafter, the suction nozzle 184 is rotated by 180 degrees, and the tip end surface of the suction nozzle 184 is imaged as shown by a two-dot chain line in FIG. Alternatively, the suction nozzle 184 may be rotated three times by 90 degrees, and the tip surface of the suction nozzle 184 may be imaged at each of the rotation positions. By processing image data representing a plurality of images of the tip surface of the suction nozzle 184 thus obtained, the coordinates of the center of the tip surface are obtained, and an average value of the coordinates is calculated, and the like. The coordinates (X ₂ , Y ₂ ) of the position of the rotation center 322 are obtained. The coordinates (X ₃ , Y ₃ ) of the vertex 274 are also obtained by processing the image data representing the image of the detected portion 268 of the dog 266. Then, the difference DX = X between these coordinates (X ₂ , Y ₂ ) and (X ₃ , Y ₃ )
_3- X ₂ , DY = Y ₃ -Y ₂ is represented by the dog 266 represented by the vertex 274 and the rotation center 322 of the suction nozzle 184.
Is stored in the RAM 306 as data representing a relative position with respect to. The rotation center 322 of the suction nozzle 184
The data ΔX ₁ = X ₂ −X ₁ and ΔY ₁ = Y ₂ −Y ₁ representing the displacement of the imaging device 248 from the optical axis are also stored in the RAM 30.
6 is stored. The relative position between the dog 266 and the rotation center 322 of the suction nozzle 184, the suction nozzle 1
The operation of acquiring the relative position between the rotation center 84 and the optical axis of the imaging device 248 may be performed only once, but is performed a plurality of times, and the relative position is acquired based on a plurality of detection data. It is desirable. The same applies to the acquisition of the following various data.

Next, the suction nozzle 184 is moved to a predetermined position above the mounting surface 282 and lowered to suck the reference chip 286. The suction nozzle 1
84 is again moved to a position facing the imaging device 248, but in this case, the suction nozzle 1 whose position has been detected earlier
The rotation center 322 of 84 is moved to a position corrected by ΔX ₁ = X ₂ −X ₁ and ΔY ₁ = Y ₂ −Y ₁ so as to coincide with the optical axis of the imaging device 248. Then, an image of the reference chip 286 sucked by the suction nozzle 184 is taken. The coordinates (X ₄ , Y ₄ ) of the center of the reference chip 286 are obtained by processing the image data representing the image of the reference chip 286 shown in FIG. Misalignment, that is, misalignment Δ of the imaging device 248 with respect to the optical axis
X ₂ = X ₄ −X ₁ and ΔY ₂ = Y ₄ −Y ₁ are calculated, and R
It is stored in the AM 306. Note that, in practice, the center of the reference chip 286 not only shifts with respect to the optical axis of the imaging device 248, but also tilts in the imaging screen of the imaging device 248. Usually, the reference tip 286 also has a rotational position error. However, here, for the sake of simplicity, it is assumed that there is no rotational displacement between the imaging device 248, the reference mark camera 240, and the reference chip 286.

Next, the above-mentioned positional deviation is corrected so that the center of the reference chip 286 matches the coordinates (X ₅ , Y ₅ ) of the mounting position preset on the mounting surface 282. The suction nozzle 184 is moved to the position, and the reference chip 286 is mounted on the mounting surface 282 at that position. Therefore, the coordinates of the center of the reference chip should be (X ₅ , Y ₅ ). Therefore, the reference mark camera 240
Is moved to a position where its optical axis should match the mounting position, and the reference chip 286 is imaged as shown in FIG. By processing the image data representing the image of the reference chip 286 obtained as a result, the coordinates (X ₆ , Y ₆ ) of the center of the reference chip 286 are obtained. Actually, depending on the reference mark camera 240, the center of the reference chip 286 supposed to be at the mounting position represented by the coordinates (X ₅ , Y ₅ ) is ΔX ₃ = X ₆ −X ₅ and ΔY ₃ = Y ₅ −Y _The image is picked up so that there is only a displacement of _six , which means that the position of the optical axis of the reference mark camera 240 is
−ΔX ₃ = − (X ₆
−X ₅ ) and −ΔY ₃ = − (Y ₅ −Y ₆ ).

As is clear from the above description, in the system based on the position of (the optical axis of) the imaging device 248,
The rotation center 322 of the suction nozzle 184 is ΔX ₁ = X ₂ −X
₁ , ΔY ₁ = Y ₂ −Y _{1, and} the position of (the optical axis of) the reference mark camera 240 is −ΔX ₃ = − (X ₆ −
X ₅ ) and −ΔY ₃ = − (Y ₅ −Y ₆ ). Therefore, data representing these positional deviations is stored in the RAM 306 as data representing the relative positional relationship between the imaging device 248, the suction nozzle 184, and the reference mark camera 240.

Next, the reference chip 286 is sucked again by the suction nozzle 184. At this time, the suction nozzle 184 is moved to a position where its rotation center 322 coincides with the mounting position and is lowered. Therefore, the center of the reference chip 286 held by the suction nozzle 184 should coincide with the rotation center 322 of the suction nozzle 184. Therefore, although not necessary, in the present embodiment, it is confirmed by imaging the reference chip 284 by the imaging device 248 and processing the image data obtained as a result. If the two centers do not coincide with each other, it is determined that some trouble has occurred during the detection, and the operation of acquiring the relative positional relationship between the imaging device 248, the suction nozzle 184, and the reference mark camera 240 is repeated. However, the coincidence of both centers is usually confirmed.

Therefore, the suction nozzle 184 is mounted on the mounting surface 28.
4 (Y coordinate)₇, Y₇)of
The reference tip 284 is moved to the position and lowered.
Is placed on the placement surface 284. The coordinates at this time are also
Motor 110 and the Y-axis slide drive motor.
Output signal of an encoder attached to the
It is acquired by the control device 300 based on the number. Soshi
And the reference mark camera 240 has its optical axis
Is moved to a position corresponding to
Image. Movement of suction nozzle 184 and reference mark
The movement of the camera 240 depends on the imaging device 248 acquired earlier.
Nozzle 184 and fiducial mark based on the position of
While correcting the displacement of the camera 240 from its normal position
Done. Therefore, there is no operation error in the moving device 136.
If so, the reference chip 284 obtained by the above imaging
Is processed, and the center of the reference chip 284 is processed.
Are obtained, the coordinates are set to the placement surface 284 described above.
The coordinates of the placement position set above (Y₇, Y₇) And one
Should have done it. However, in reality, the reference chip 2
The coordinates of the center of 84 are (Y₈, Y₈) Is usually
ΔX_Four= X₈-Y ₇, ΔY_Four= X₈-Y₇Is the difference
I will.

The above difference can be considered as an operation error of the moving device 136.
120, etc., due to manufacturing errors, elastic deformation, thermal deformation, and the like. And although the manufacturing error and the elastic deformation do not change with the elapsed time after the start, the thermal deformation changes with the elapsed time, so at every predetermined operation time or at a time when the mounting work of the electronic component 82 is not hindered. , It is desirable to detect the displacement of the moving device 136 in the same manner as described above. From the same viewpoint, the acquisition of the relative positional relationship between the imaging device 248, the suction nozzle 184, and the reference mark camera 240 by mounting the reference chip 284 on the mounting surface 282 is also performed at every predetermined operation time or when the electronic component 82 is mounted. It is desirable to carry out the repetition at a time when it does not interfere with the mounting work. Imaging device 248, suction nozzle 1
84, the member holding the fiducial mark camera 240 and the like are also thermally deformed with the temperature change.

As described above, the dog 266 and the suction
The vector V of FIG. 17 with the center of rotation 322 of the chirp 184₀
DX = X of relative position data represented by_Three-X_Two, DY =
Y_Three-Y_Two, Based on the position of (the optical axis of) the imaging device 248
Of rotation 322 of the suction nozzle 184 in the system
And the vector V of the reference mark camera 240₁, V_Twoso
Expressed displacement ΔX₁= X_Two-X₁, ΔY₁= Y_Two−
Y₁And -ΔX_Three=-(X₆-X_Five), -ΔY_Three= −
(Y_Five-Y₆), And the data of the mobile device 136.
Kuturu V_ThreeOperating error ΔX expressed by_Four= X₈-Y₇, Δ
Y_Four= X₈-Y ₇After the data of
Print wiring of the electronic component 82 by executing the mounting routine
The mounting work on the plate 12 is started.

In this mounting operation, first, the positional deviation of the printed wiring board 12 carried in by the wiring board conveyor 14 and supported by the substrate supporting device from the normal position is determined by the reference mark camera 240 and the imaging of the reference mark. Detected by image processing. Thereafter, the electronic component 82 is taken out from the component supply device 20 or 22 by the suction nozzle 184, and the suction nozzle rotation center 3 of the electronic component 82 is captured by the imaging device 248 and image processing.
The displacement with respect to 22 is detected. Then, the positional deviation of the printed wiring board 12 and the positional deviation of the electronic component 82 are removed by correcting the predetermined mounting control data, and the electronic component 82 is mounted at a predetermined position on the printed wiring 12.

Although this point is the same as the conventional one, in the present embodiment, when the positional deviation of the printed wiring board 12 and the positional deviation of the electronic component 82 are detected, a system based on the position of the imaging device 248 is used. Displacement ΔX between the rotation center 322 of the suction nozzle 184 and the reference mark camera 240 in the middle
₁ = X ₂ −X ₁ , ΔY ₁ = Y ₂ −Y ₁ and −ΔX ₃ =
The difference is that the suction nozzle 184 and the reference mark camera 240 are moved to a position where-(X ₆ -X ₅ ) and -ΔY ₃ =-(Y ₅ -Y ₆ ) are removed.

The rotation center 322 of the suction nozzle 184
When detecting the displacement of the electronic component 82 with respect to the electronic component 82, the detected portion 268 of the dog 266 is also imaged at the same time as the electronic component 82, and the coordinates (X ₉ , Y ₉ ) of the vertex of the detected portion 268 and , The detected part 268 acquired earlier
DX = X ₃ −X ₂ , DY = Y ₃ −Y ₂
, The position (X ₁₀ , Y ₁₀ ) of the rotation center 322 of the suction nozzle 184 is estimated, and the center (X ₁₁ , Y ₁₁₎ of the electronic component 82 from the estimated position of the rotation center 322 of the suction nozzle 184. Another characteristic is that the misalignment of ₁₁ ) is detected.

The suction nozzle 184 is hidden behind the electronic component 82 and cannot be seen.
Since the object 68 can be seen, the detected part 268 is imaged by the imaging device 248, and suction is performed based on the obtained image and data of the relative position between the detected part 268 and the rotation center of the suction nozzle 184 which has been detected in advance. Rotation center 322 of nozzle 184
Can be estimated. However, as described above, the suction nozzle 184 is positioned such that the position of the rotation center 322 thereof is positioned on the optical axis of the imaging device 248 based on the data of the relative positional relationship. Immediately after the acquisition of, the rotation center 322 of the suction nozzle 184 should be located on the optical axis of the imaging device 248. However, as the operation time of the electronic component mounting system increases, the temperature of each part rises, and the position of the rotation center 322 of the suction nozzle 184 becomes
In the present embodiment, the position of the rotation center 322 is estimated at regular intervals during the operation of the electronic mounting system because the position of the optical axis 8 is shifted from the position of the optical axis 8. Since the position of the rotation center 322 can be estimated in a relatively short time, the position of the rotation center 322 can be detected every time when the suction position shift of each electronic component 82 is detected.

In the present electronic component mounting system, the suction nozzle 1 is positioned when the electronic component 82 is mounted on the printed wiring board 12.
Along with the displacement of the center of the electronic component 82 with respect to the rotation center 322 of 84 and the displacement of the printed wiring board 12, the operation error ΔX ₄ = X ₈ − of the moving device 136 acquired earlier.
The mounting control data is modified so that Y ₇ , ΔY ₄ = X ₈ −Y ₇ is removed. The correction of the mounting control data for removing the operation error includes, for example, the operation error of the moving device 136, the X-axis direction, the Y direction from the mounting position on the mounting surface 282 to the mounting position on the mounting surface 284. This can be done on the assumption that it increases in proportion to the axial distance.

Specifically, the suction nozzle 184 is placed on the mounting surface 2
An operation error when moving from the position 82 to the mounting surface 284 is represented by ΔX ₄ = X ₈ − represented by a vector V ₃ in FIG.
Since Y ₇ , ΔY ₄ = X ₈ −Y ₇ , the distance in the direction parallel to the X axis and the Y axis from the mounting position on the mounting surface 282 to the electronic component mounting position on the printed wiring board 12 is: The ratio K _X divided by the distance from the mounting position on the mounting surface 282 to the mounting position on the mounting surface 284 in the direction parallel to the X axis and the Y axis,
The product of K _Y and the operation errors ΔX ₄ , ΔY ₄ , K _X · ΔX ₄ , K
The _Y · [Delta] Y ₄ is regarded as a working error of the mobile device 136 at the mounting position, is to add a correction for removing the operational error in mounting the control data. However, since the operation errors ΔX ₄ and ΔY ₄ of the moving device 136 change as the operation time of the electronic component mounting system increases, the operation errors ΔX ₄ and ΔY ₄ are updated for each operation error detection operation that is sometimes performed during operation as described above. Use

If the attitude (rotational position) of the electronic component 82 received from the component supply devices 20 and 22 by the suction nozzle 184 is different from the attitude of mounting the electronic component 82 on the printed wiring board 12, Although the electronic component 82 is mounted by being rotated by a predetermined angle due to the rotation, high mounting position accuracy can be obtained even in this case. In the present electronic component mounting system, the suction nozzle 18 of the electronic component 82 is used.
4 is obtained as a positional shift of the suction nozzle 184 with respect to the rotation center 322, a change in the center position of the electronic component 82 due to the rotation of the suction nozzle 184 can be accurately calculated, and the calculated center can be calculated. The suction nozzle 184 and the printed wiring board 12 are
This is because it is possible to correct the relative positioning with respect to.

In the description so far, the reference chip 2
Although it is assumed that the rotation position error is not included in the holding position error of the suction nozzle 184 of the electronic component 86 or the electronic component 82,
In practice, the rotational position is also included. Therefore, the imaging device 2
The inclination of the reference chip 286 or the electronic component 82 with respect to the 48 imaging screens 276 is detected by image processing, and the suction nozzle 184 is rotated so as to remove the rotational position error, thereby performing mounting and mounting. However, for that purpose, the rotational position error of the imaging device 248 and the fiducial mark camera 240 is
It is necessary to adjust it so small that it can be ignored.
The case where the existence of these rotational position errors is allowed will be described later in detail.

As is apparent from the above description, in this embodiment, the moving device 136 for moving the suction nozzle 184 and the reference mark camera 240 relative to the wiring board supporting device 26 constitutes a relative moving device. , The control device 300 controls the moving device 136 to control the suction nozzle 18.
4 shows a printed wiring board 1 supported by a wiring board supporting device 26
The part to be mounted on 2 forms a mounting control device. The imaging device 284 constitutes a first imaging device, the fiducial mark camera 240 constitutes a second imaging device, and the control device 30
The part of the image processing apparatus 284 and the reference mark camera 240 that perform imaging performs the imaging control device or the imaging control unit, and the part that processes the obtained image data forms the data processing apparatus. Further, a portion of the data processing device that acquires the rotation center position of the suction nozzle 184 constitutes a rotation center position acquisition unit, and the suction control unit 184 of the imaging control device rotates the suction nozzle 184 at least one time to obtain at least two rotation center positions. Suction nozzle 18 at rotating position
The portion that causes the imaging device 248 to image the tip of the image No. 4 constitutes an imaging control unit a plurality of times. Further, the following parts of the control device 300 constitute the following units. Suction nozzle 184, dog 266 and reference chip 2
Based on the relative positional relationship with the suction nozzle 86, the portion for obtaining the displacement of the reference chip with respect to the suction nozzle constitutes a position shift acquisition unit, and the portion for placing the reference chip 286 on the placement surface 282 with the suction nozzle 184 is the reference. A part of the chip placement control unit that causes the imaging device 284 to image the reference chip 286 constitutes a reference chip imaging control unit. Suction nozzle 184, imaging device 284 and fiducial mark camera 24
The part for acquiring the relative positional relationship of 0 constitutes a relative positional relationship acquiring means. The part that causes the reference mark camera 240 to image the reference mark of the printed wiring board 12 constitutes a reference mark imaging control unit, and the part that acquires the displacement of the printed wiring board 12 constitutes the board displacement acquisition means. The part where the suction nozzle 184 holds the electric component and the electric device is imaged by the image pickup device 284 constitutes an electric component imaging control unit, and the acquired image data of the electric component and the relative position relationship obtained by the relative position acquisition unit are acquired. The wiring board support device 26 and the suction nozzle 184 are determined based on the relative positional relationship between the suction nozzle 184, the imaging device 284, and the reference mark camera 240, and the positional deviation of the printed wiring board 12 acquired by the substrate positional deviation acquiring means. The part for correcting the predetermined relative position with respect to the above and mounting the electric component at the predetermined position of the printed wiring board 12 constitutes a mounting control means.

Then, a control program for acquiring the relative positional relationship between the suction nozzle 184, the image pickup device 284, and the reference mark camera 240, the portion of the RAM 306 storing the control program for detecting the displacement of the electric component. The moving device 136 is controlled while utilizing the relative position relationship, the operation error of the moving device 136 and the data of the displacement of the electric component and the printed wiring board, and the electric component is transferred to the printed wiring board 12. The part storing the control program for accurately mounting the electronic component at a predetermined position constitutes a recording medium storing the control programs for detecting the displacement of the electric component, obtaining the relative positional relationship, and mounting the electric component, respectively. are doing. These control programs are stored in a storage device of a host computer to which the present electronic component mounting system is connected.
Although it is downloaded to the AM 306 and executed, it is recorded on a removable recording medium such as a floppy disk and read and executed by the electronic component mounting system itself or the reading device provided in the host computer. Good.

Although only one dog 266 is provided in the above embodiment, a plurality of dogs 266 may be provided. For example, as shown in FIG.
And two corners of the image of the detected parts 334 and 336 separated in a direction parallel to the X axis or Y axis of the imaging screen 276 of the imaging device 248 (in the illustrated example, separated in a direction parallel to the Y axis). (At two corners). Then, the rotation angle Δθ ₁ of the imaging screen 276 with respect to the straight line 342 connecting the vertexes 338 and 340 of the two detected parts 334 and 336 is obtained. The vertex 338 of the two detected parts 334, 336,
If the two dogs 332 are adjusted so that a straight line 342 connecting 340 is exactly parallel to the guide rail 132 for the Y-axis slide 122 provided on the X-axis slide 106, the rotation angle Δθ _{1 is obtained.} Represents the rotation position error of the imaging screen 276, that is, the rotation position error of the imaging device 248.

Further, as shown in FIG.
In a state where the reference chip 286 is attracted to the imaging device 84, the imaging device 248 takes an image of the reference chip 286, and the imaging screen 2
When the rotation angle Δθ ₂ of the reference chip 286 with respect to the reference chip 286 is obtained, the rotation position error of the reference chip 286 is calculated as Δθ ₁ + Δ
It can be obtained as theta _2.

The suction nozzle 184 is rotated by an angle that eliminates the rotational position error of the reference chip 286, the reference chip 286 is mounted on the mounting surface 282, and the reference mark camera 240 captures an image. Then, the fiducial mark camera 24
If the relative rotation angle of the image of the reference chip 286 with respect to the imaging screen of 0 is acquired, the relative rotation angle becomes
8, the sum of the rotational position error and the rotational position error of the image pickup device 248 is the X position of the reference mark camera 240.
Guide rails 30, 32 and Y for shaft slide 106
This is an absolute rotational position error with respect to the XY coordinate plane defined by the guide rail 132 for the shaft slide 122. In the present embodiment, among the data processing devices constituted by a part of the control device 300, the imaging screen 2 of the imaging device 248 is based on the images of the plurality of dogs 332.
The part for acquiring the inclination of 76 constitutes the inclination acquisition unit.

In the above embodiment, two dogs 3
A straight line 342 connecting the positions vertices 338 and 340 of the detected parts 334 and 336 is a Y-axis slide 122.
Is adjusted in advance so as to be exactly parallel to the guide rail 132 for the
Can also be detected using the function of the electronic component mounting system. For example, as described above, the rotational position error of the reference chip 286 is obtained as Δθ ₁ + Δθ _{2 based} on the straight line 342 connecting the vertices 338 and 340 of the detected parts 334 and 336, and then the rotational position error is removed. Then, the suction nozzle 184 is rotated, and the reference chip 286 is mounted on the mounting surface 282. And
The mounted reference chip 286 is used as a reference mark camera 2.
Then, the reference mark camera 240 is moved by a fixed small distance only in a direction parallel to the X axis or the Y axis, and the reference chip 286 is imaged again. If the images of the two reference chips 286 obtained in this manner are described in an overlapping manner, the state shown in FIG. 21 is obtained. Then, the straight line 350 connecting the same vertices of the images of the two reference chips 286 should be a straight line that is exactly parallel to the Y-axis, and the vertices 338 and 340 of the detected parts 334 and 336 are set as described above. Since the rotational position error of the reference chip 286 with respect to the connecting straight line 342 should have been removed, the rotation angle Δθ ₃ of the reference chip 286 with respect to the straight line 350 is determined by the detected part 33.
Y of a straight line 342 connecting vertices 338 and 340 of 4,336
This is a rotational position error with respect to the shaft.

In this way, the detected parts 334, 336
If the rotational position error of the straight line 342 connecting the vertices 338 and 340 with respect to the Y-axis can be obtained,
By correcting the rotational position error of the imaging device 248 and the reference mark camera 240 obtained based on the reference by the rotational position error of the straight line 342, the absolute rotational position error of the imaging device 248 and the reference mark camera 240 can be obtained. it can.

The present invention can be applied to an electronic component mounting system of the type shown in FIG. This electronic component mounting system is different from the electronic component mounting system of the above-described embodiment in that a component camera 356, which is an imaging device for acquiring a displacement of the electronic component with respect to the rotation center of the suction nozzle, is fixed to the base 10. It is different from the component mounting system. The component camera 356 is disposed between the component supply device 20 and the wiring board conveyor 14 in the longitudinal direction of the printed wiring board 12 supported by the wiring board support device (wiring board conveyor 1).
In the position corresponding to the approximate center of the (transport direction 4), the base 10 is fixedly provided. The suction nozzle 184 and the fiducial mark camera 240 are fixed to the Y-axis slide 122 similarly to the electronic component mounting system of FIGS. Also in the present electronic component mounting system, the above-described dog 266 and the reference chip 286 are used.
The suction nozzle 186, the reference mark camera 240 and the component camera 3
56 relative positional relationships (including the center position shift and the rotational position shift) can be obtained.

The present invention can be applied to an electronic component mounting system of the type shown in FIG. In the present electronic component mounting system, the component holders 360 each having a suction nozzle are held by one intermittent rotary disk 362, and the intermittent rotary disk 362 is intermittently rotated by a fixed angle, so that the intermittent rotary disk 362 is rotated. A nozzle moving device 364 is provided for rotating the component holder 360 about a rotation axis, which is a rotation center line, and stopping at a plurality of preset stop positions on the path of the rotation. Further, a wiring board for moving the wiring board supporting device 366 in two directions parallel to the X axis and the Y axis orthogonal to each other in a plane parallel to the surface of the printed wiring board 12 supported by the wiring board supporting device 366. A moving device 370 is also provided. The wiring board moving device 370 includes an X-axis slide drive motor 372 and an X-axis slide 376 that is moved by a ball screw 374 as a feed screw, and a Y-axis slide drive motor 378 and a feed screw on the X-axis slide 376. And a Y-axis slide moved by the ball screw 380. The Y-axis slide supports the wiring board support device 366 from below. Then, at a position facing the tip end surface of the suction nozzle stopped at one of the plurality of stop positions, an imaging device 384 including a component camera and a light guide device and imaging the electronic component is provided stationary,
A holder rotating device (not shown) for rotating the component holder 360 is also provided stationary above the imaging device 384 and the component holder 360. The holder rotating device corrects the rotational position error of the electronic component 82 also at a stop position between the stop position where the imaging device 384 is provided and the stop position for mounting the electronic component 82 on the printed wiring board 12. It is provided in order to. Although not shown, a device for raising and lowering a suction nozzle for sucking and mounting an electronic component is also provided. Further, the wiring board support device 3
A fiducial mark camera 386 that captures a fiducial mark on the printed wiring board 12 supported by 66 is also provided stationary. In FIG. 23, a holding device for holding the intermittent rotating disk 362, the imaging device 384, the reference mark camera 386, the dog 390, and the like is not shown in order to avoid complexity. Further, instead of the intermittent rotating disk 362, each is provided rotatably around a common rotation axis, and is rotated by a cam device in accordance with a predetermined speed pattern, and a predetermined stop position is provided at different times. It is also possible to employ a plurality of rotating members that are sequentially stopped at (plural). For example, each of the plurality of rotating members holds one component holder 360 so as to be rotatable and movable in the axial direction.

Also in the electronic component mounting system, the dog 390 is positioned near the stop position where the image pickup device 384 is provided, and the dog 390 is also captured simultaneously when the electronic component held by the suction nozzle is imaged. The present invention can be practiced by providing the mounting surfaces 392 and 394 and the reference chip 396 in a stationary state at the position. In substantially the same manner as in the above embodiment, the rotation center of the component holder 360, that is, the position of the rotation center of the suction nozzle is estimated with reference to the dog 390, and the displacement of the electronic component 82 with respect to the rotation center position is detected. It is also possible to acquire the rotation center of the suction nozzle and the relative positional relationship between the reference mark camera 386 and the imaging device 384, and acquire the operation error of the wiring board moving device 370.

The first and second image pickup devices are not limited to the surface image pickup device but may be constituted by line sensors. The line sensor has a large number of imaging elements arranged in a straight line, and a two-dimensional image can be obtained by repeatedly performing imaging while relatively moving the object. When the first imaging device is configured by a line sensor, for example, a number of line sensors are provided in a straight line in a direction parallel to the upper surface of the electronic component, and the line sensor and the electronic component are disposed on the upper surface of the electronic component. What is necessary is just to relatively move in a direction which is parallel and orthogonal to the straight line.

Although some embodiments of the present invention have been described in detail above, these are merely examples, and the present invention is not limited to the above-mentioned [Problems to be Solved by the Invention, Means for Solving Problems and Effects]. The present invention can be implemented in various modified and improved forms based on the knowledge of those skilled in the art, including the described embodiment.

[Brief description of the drawings]

FIG. 1 is a plan view showing an electronic component mounting system according to an embodiment of the present invention.

FIG. 2 is a side view of the electronic component mounting system.

FIG. 3 is a front view showing a component mounting device of the electronic component mounting system.

FIG. 4 is a side view (partial cross section) showing the component mounting apparatus.

FIG. 5 is a side view schematically showing a wiring board support device of the electronic component mounting system.

FIG. 6 is a side view showing electronic components housed in a component tray of the electronic component mounting system.

FIG. 7 is a side view (partial cross section) showing a component mounting unit of the component mounting apparatus.

FIG. 8 is a side sectional view showing a holding device of the component mounting unit.

FIG. 9 is a block diagram schematically showing a control device of the electronic component mounting system.

FIG. 10 is a plan view showing a part of a dog of the electronic component mounting system.

FIG. 11 is a front view of a main part of the dog.

FIG. 12 is an explanatory diagram showing a situation where the dog is imaged together with an electronic component.

FIG. 13 is a diagram for describing acquisition of a rotation center of a suction nozzle in the electronic component mounting system.

FIG. 14 is a diagram for explaining imaging of a reference chip held by a suction nozzle in the electronic component mounting system.

FIG. 15 is a diagram for describing acquisition of a positional shift of a reference mark camera in the electronic component mounting system.

FIG. 16 is a diagram for explaining acquisition of an operation error of the moving device in the electronic component mounting system.

FIG. 17 is a diagram showing a relative position between a dog and a rotation center of a suction nozzle, a relative position shift between a suction nozzle, an imaging device, and a reference mark camera, and an operation error of a moving device in the electronic component mounting system.

FIG. 18 is a diagram for describing acquisition of a displacement of the electronic component from the rotation center of the suction nozzle in the electronic component mounting system.

FIG. 19 is a diagram for explaining acquisition of a rotational position shift of an imaging device in an electronic component mounting system according to another embodiment of the present invention.

FIG. 20 is a view for explaining acquisition of a rotational position shift of a reference mark camera in the electronic component mounting system.

FIG. 21 is a diagram illustrating detection of inclinations of a plurality of dogs in an electronic component mounting system according to yet another embodiment of the present invention.

FIG. 22 is a plan view showing an electronic component mounting system according to still another embodiment of the present invention.

FIG. 23 is a plan view showing an electronic component mounting system according to still another embodiment of the present invention.

[Explanation of symbols]

12: Printed wiring board 14: Wiring board conveyor 1
8: Component mounting device 20, 22: Component supply device 2
6: Wiring board supporting device 82: Electronic component 100: Holding device 106: X-axis slide 116: X-axis slide moving device 122: Y-axis slide 134: Y-axis slide moving device 136: moving device 144: elevating device 146: rotating device 184: suction nozzle 248: imaging device 250: component camera 251: light guide device 266: dog 268: detected part 276: imaging screen 282, 2
84: mounting surface 286: reference chip 300: control device 332: dog 356: component camera 3
84: Imaging device 386: Reference mark camera 39
0: dog 392, 394: mounting surface 396: reference chip

Claims (6)

[Claims] 1. A method for detecting a displacement of an electric component with respect to a suction nozzle that suctions an electric component by negative pressure, wherein a first imaging step of simultaneously imaging the suction nozzle and a dog disposed in the vicinity thereof A first data processing step of processing image data of the suction nozzle and the dog obtained in the first imaging step to obtain and store a relative positional relationship between the suction nozzle and the dog; A second imaging step of imaging the electrical component and the dog while holding the component, image data of the electrical component and the dog acquired in the second imaging process, and the image data acquired in the first data processing step A second data processing step of acquiring a displacement of the electric component with respect to the suction nozzle based on a relative positional relationship between the suction nozzle and the dog. Positional deviation detection method of goods. 2. The first imaging step includes a step of rotating the suction nozzle at least once to image a tip of the suction nozzle at at least two rotation positions, and the first imaging step includes the at least two suction nozzles. The method according to claim 1, further comprising a step of acquiring a rotation center position of the suction nozzle based on an image of the tip of the nozzle. 3. A plurality of docks are provided, and the plurality of dogs are imaged in at least the first imaging step. The method for detecting a displacement of an electric component according to claim 1, wherein the acquisition is performed. 4. A method for acquiring a relative positional relationship of a part related to mounting accuracy of an electric part mounting system for assembling an electric circuit by mounting an electric part on a circuit board by suctioning the electric part by a suction nozzle, comprising: A first imaging step of simultaneously imaging the suction nozzle and a dog arranged in the vicinity thereof by an apparatus, and processing the image data of the suction nozzle and the dog acquired in the first imaging step to process the suction nozzle and the dog. A first data processing step of acquiring and storing a relative positional relationship with the second imaging step of simultaneously imaging the reference chip and the dog while holding the reference chip in the suction nozzle; Based on the image data of the reference chip and the dog obtained in the imaging step and the relative positional relationship between the suction nozzle and the dog obtained in the first data processing step A second data processing step of acquiring a positional shift of the reference chip with respect to the suction nozzle; and a mounting in which the suction nozzle and the substrate supporting device supporting the circuit board are relatively moved, and are set to be relatively immovable with respect to the substrate supporting device. A mounting step of mounting the reference chip on a mounting surface, a third imaging step of imaging the reference chip mounted in the mounting step with a second imaging device, and a reference chip acquired in the third imaging step. A third data processing step of acquiring a relative positional relationship between the suction nozzle, the first imaging device, and the second imaging device based on the image data, and a reference obtained in the second data processing step. Correcting the displacement of the chip with respect to the suction nozzle and performing the placement step, and the suction nozzle of the reference chip obtained in the second data processing step Performing the third data processing step on the basis of the positional deviation with respect to and the image data of the reference chip placed as described above. 5. A method for acquiring a relative positional relationship according to claim 4, further comprising: a fourth image pickup step of picking up an image of a reference mark provided on a circuit board supported by the substrate support apparatus, using the second image pickup apparatus. A fourth data processing step of acquiring a positional displacement of the circuit board based on the image data of the reference mark acquired in the fourth imaging step; A fifth imaging step of capturing an image, image data of the electrical component acquired in the fifth imaging step, and a relative positional relationship between the suction nozzle, the first imaging device, and the second imaging device acquired by performing the relative positional relationship acquisition method. And, based on the displacement of the circuit board obtained in the fourth data processing step, based on the predetermined relative position of the substrate support device and the suction nozzle is corrected, EC mounting method including a component mounting step of mounting the gas components on the circuit board. 6. A device for detecting a displacement of an electric component with respect to a suction nozzle for suctioning an electric component by a negative pressure, the imaging device being capable of imaging the suction nozzle from a direction parallel to a central axis of the suction nozzle. A dog arranged at a position that can be imaged simultaneously with the suction nozzle by the imaging device; and simultaneously causing the imaging device to image the suction nozzle and the dog, and simultaneously imaging the electric component and the dog sucked by the suction nozzle. An imaging control device that causes a relative positional relationship between the suction nozzle and the dog to be obtained based on the image of the suction nozzle and the dog that are simultaneously captured, and an image of the electrical component and the dog that are simultaneously obtained,
A data processing device for acquiring a displacement of the electric component with respect to the suction nozzle based on a relative positional relationship between the suction nozzle and the dog.