JP5752401B2 - Component holding direction detection method - Google Patents

Description

The present invention relates to a component holding orientation detecting how, in particular, relates to the detection of the holding orientation of the electronic circuit component sucked to the upper surface by the suction nozzle.

  Patent Documents 1 and 2 below describe apparatuses that capture an image of an electronic circuit component whose upper surface is sucked by a suction nozzle from a direction orthogonal to the nozzle axis that is the axis of the suction nozzle. In the apparatus described in Patent Document 1, an electronic circuit component is continuously imaged while being rotated around an axis line by a line sensor provided horizontally, and the electronic circuit component is projected at two preset rotation positions. Based on the width, the holding position error and suction abnormality of the electronic circuit component by the suction nozzle are detected. In the apparatus described in Patent Document 2, a projection image is acquired by moving an electronic circuit component in the vertical direction with respect to a horizontal line sensor, and acquisition of projection images at two preset rotation positions is acquired. Thus, the type of the electronic circuit component is recognized, or chipping of the ball provided on the bottom surface is detected by imaging at a rotational position where the side surface of the electronic circuit component is inclined 45 degrees with respect to the parallel illumination light.

JP-A-9-36597 JP 2005-276990 A

The present invention has been completed with the above view in mind, it is an object to obtain a component holding orientation detecting how.

Then, according to the present invention, the recognition unit recognizes a portion that cannot be seen from the bottom surface of the electronic circuit component whose upper surface is sucked by the suction nozzle from the direction intersecting with the nozzle axis that is the axis of the suction nozzle. A component holding orientation detection method for determining a holding orientation of the electronic circuit component based on the electronic circuit component, wherein the electronic circuit component has at least an upper portion and a lower portion, and the upper portion can be seen from a direction perpendicular to the bottom surface of the lower portion. has no shape, part of the upper portion is polarity indicated by formation of notched cutout portion, and the lower in a direction parallel to the axis of the suction nozzle in a state of being attracted to the upper surface by the suction nozzle from the is an electronic circuit component identifying is impossible for the holding orientation, the recognition, at least, the performed from one direction whether discernible to the notch, of the electronic circuit component Component holding orientation detecting method characterized by determining the holding orientation of the electronic circuit components related to sexual obtain.
The “direction intersecting the nozzle axis” includes a direction orthogonal to the nozzle axis and a direction intersecting at an angle other than a right angle with the nozzle axis.
As the recognition device, in addition to a surface imaging device and a line sensor, which will be described later, for example, a device that detects an object by emitting ultrasonic waves can be employed.
“Electronic circuit component holding orientation” means the orientation of the electronic circuit component sucked by the suction nozzle in a plane perpendicular to the axis of the suction nozzle. For example, instead of the left-right direction and the front-rear direction, they are rightward, leftward, forward, backward, etc.

Further, in relation to the present invention, (A) a substrate holding device that holds a circuit substrate, (B) a component supply device that supplies an electronic circuit component, and (C) an electronic circuit component, the electronic circuit component A suction nozzle that sucks and holds the upper surface of the suction nozzle, (D) a moving device that moves the suction nozzle in a direction intersecting the axis of the suction nozzle, and (E) a bottom surface of the electronic circuit component held by the suction nozzle. A recognition device for recognizing a portion that cannot be seen from the direction intersecting the nozzle axis that is the axis of the suction nozzle, and (F) based on the recognition result of the recognition device, the holding direction of the electronic circuit component by the suction nozzle An electronic circuit component mounting system including a determination unit for determining
For example, (a) a printed wiring board on which an electronic circuit component is not yet mounted, (b) an electronic circuit component is mounted on one surface and electrically connected to the circuit substrate, and the other surface is Includes a printed circuit board with no electronic circuit components mounted, (c) a base material on which a bare chip is mounted to form a substrate with a chip, (d) a base material on which an electronic circuit component with a ball grid array is mounted It is. “Circuit board” is a general term for printed wiring boards and printed circuit boards.

If the holding direction specifying unit can recognize the electronic circuit component from the direction intersecting the nozzle axis even if the electronic circuit component is adsorbed on the upper surface by the adsorption nozzle and is not visible from the bottom surface of the electronic circuit component Based on the recognition, the holding orientation related to the polarity of the electronic circuit component can be determined.

In the electronic circuit component mounting system related to the present invention, the component holding orientation detection method according to the present invention is implemented, the holding orientation of the electronic circuit component by the suction nozzle is determined, and the electronic circuit component is set in a predetermined orientation. Attach to the circuit board.

Aspects of the Invention

  In the following, the invention which is recognized as being claimable in the present application (hereinafter, referred to as “claimable invention”. The claimable invention is a subordinate concept invention of the present invention which is the invention described in the claims) And may include inventions of a superordinate concept or another concept of the present invention). As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiment, the prior art, the common general technical knowledge, and the like. An aspect in which a constituent element is added and an aspect in which the constituent element is deleted from the aspect of each section can be an aspect of the claimable invention.

In addition, in each of the following items, the combination of items (2) and (9) generally corresponds to claim 1, and the limitation on the direction of recognition is added to claim 2, which relates to the determination method. A limitation is added to claim 3, claim (4) is added to claim 4 , claim 4 is added to the requirement described in (6), claim 5 is added, claim (8) is claimed. to 6, its corresponding respectively.

(1) An electronic circuit component whose upper surface is sucked by the suction nozzle is recognized by a recognition device from a direction intersecting the nozzle axis which is the axis of the suction nozzle, and the holding direction of the electronic circuit component is determined based on the recognition result. A method for detecting a component holding direction, comprising: determining a component holding direction.
Recognition is performed for (I) all electronic circuit components that are sequentially held by the suction nozzle, (II) only for the first electronic circuit component, or (III) every time a predetermined condition is met. be able to. (I) is effective when the holding orientation by the suction nozzle is not constant, for example, when the electronic circuit component is supplied from a bulk feeder, and (II) is, for example, the electronic circuit component from the tape feeder. This is effective when the orientation of the electronic circuit components held on one tape is constant, as in the case of being supplied. (III) is effective when, for example, sampling is performed for every predetermined number, or each time a connecting portion where two tapes are connected is detected by splicing.
(I) is also effective when determining whether or not an electronic circuit component is a non-defective product in addition to determining the holding orientation. The quality determination is performed, for example, based on whether or not the electronic circuit component has a defect or a dimensional error exceeding the set range.
The recognition may be performed in a state where the outline of the holding direction specifying unit forms the outline of the electronic circuit component, or may be performed in a state where the holding direction specifying unit is set against the side surface of the electronic circuit component. The former recognition is particularly effective when the latter recognition is not easy.
Even if the holding direction specifying unit cannot recognize the electronic circuit component from the direction parallel to the nozzle axis while the electronic circuit component is absorbed by the suction nozzle, it can be recognized from the direction intersecting the nozzle axis. If possible, the holding orientation can be determined based on the recognition. The holding azimuth may be determined by recognizing the holding azimuth specifying unit, or may be determined by not recognizing the holding azimuth specifying unit.
(2) The component holding direction detection method according to (1), wherein the recognition is performed on a portion that is not visible from the bottom surface of the electronic circuit component.
An example of the “part that cannot be seen from the bottom side” is the following item (3). As another example, for example, a notch may be formed in an intermediate part in a direction parallel to the nozzle axis. In this case, the upper surface and the bottom surface have the same shape, and it is necessary to recognize them from the side.
(3) The component holding orientation detection method according to item (1) or (2), wherein the portion not visible from the bottom surface is the upper end portion of the electronic circuit component.
The upper end portion of the electronic circuit component can be recognized from above in a state where it is not sucked by the suction nozzle. Therefore, for example, it is possible to recognize the electronic circuit component from above and determine the orientation and acquire the holding orientation before the suction nozzle sucks the electronic circuit component. Cost. Further, once the suction nozzle sucks the electronic circuit component, once it is placed on the temporary placement table and recognized from above, it is possible to determine the holding orientation, but this requires extra time. On the other hand, the upper end of the electronic circuit component can be recognized from the direction intersecting the nozzle axis in a state where the electronic circuit component is sucked by the suction nozzle, which increases the time required for suction and extra time for processing after suction. It is possible to determine the holding orientation without the need for.
(4) The component holding orientation detection method according to any one of (1) to (3), wherein the recognition is performed from a plurality of directions intersecting with the nozzle axis.
There are cases where the holding direction of the electronic circuit component can be determined by recognition from only one direction and cases where the holding direction cannot be determined unless recognition is performed from two or more directions. Even in the former case, the possibility of erroneous determination may be reduced by performing recognition from two or more directions.
(5) The component holding orientation detection method according to item (4), wherein the plurality of directions are two directions.
(6) The component according to item (4) or (5), wherein the recognition in at least one direction among the recognitions in the plurality of directions is recognition in at least one other direction and recognition of a different part of the electronic circuit component. Holding orientation detection method.
Different parts of the electronic circuit component are recognized around the axis, and different information is obtained in each direction. Thereby, the effect described in the item (4) can be obtained, and determination different from the determination of the holding orientation, for example, determination of the type of electronic circuit component, a defect, and the like can be performed. Although it is possible to make a plurality of types of determination including the determination of the holding direction based on recognition in one direction, by recognizing from a plurality of directions, the recognition direction is set to a direction suitable for each of the plurality of types of determination. Each determination can be performed accurately.
(7) The recognition in at least one direction among the recognitions in the plurality of directions is recognition in at least one other direction and recognition of a portion whose position in a direction parallel to the nozzle axis is different. The component holding orientation detection method according to any one of (6).
The method in this section may be effective depending on the three-dimensional shape of the electronic circuit component. Further, it may be possible to make a determination different from the determination of the holding direction.
Recognition in each of the plurality of directions results in recognition of more parts of the electronic circuit component. One of the plurality of portions having different positions in the direction parallel to the nozzle axis may be recognized as a whole in the direction parallel to the nozzle axis.
(8) The recognition from the plurality of directions is performed by the same recognition device by rotating the electronic circuit component around the rotation axis of the suction nozzle by rotating the suction nozzle. The component holding orientation detection method according to any one of the items.
Recognition from a plurality of directions can be performed at low cost by a single recognition device. In particular, when the suction nozzle is provided so as to be rotatable around the rotation axis in order to correct the rotational position error of the electronic circuit component by the suction nozzle, recognition from a plurality of directions is performed at a lower cost by using the rotation of the suction nozzle. be able to.
However, a recognition device may be provided in each of a plurality of directions without rotating the suction nozzle to recognize the electronic circuit component.
(9) The electronic circuit component has at least an upper part and a lower part, has a shape in which the upper part cannot be seen from a direction perpendicular to the bottom surface of the lower part, and a cutout part in which a part of the upper part is cut out. The component holding orientation detection method according to any one of (1) to (8), wherein the LED has a polarity indicated by formation, and the recognition is performed from at least one direction in which the presence or absence of the notch can be identified. .
Since the LED has a polarity, it is necessary to obtain a holding orientation in order to use it in a set orientation, but according to the method of this section, the notch portion that is the holding orientation specifying portion is at the top. The holding orientation can be determined for the LED.
In addition, the determination method of the holding direction in the above and following items is not limited to the LED, and it is necessary to determine the holding direction. However, it is generally used for electronic circuit components that cannot be determined by recognition from the bottom side. Can be adopted.
(10) The recognition according to the items (1) to (9), wherein the electronic circuit component is received from the component supply device by the suction nozzle and is transported to be mounted on the circuit substrate. The component holding orientation detection method according to any one of the above.
The recognition device may be provided stationary in the middle of the path, or may be moved together with the suction nozzle so as to recognize the electronic circuit component during the movement. In the former case, the electronic circuit component reaches the recognition device during the conveyance, and in the latter case, the electronic circuit component is recognized while being moved together with the recognition device and recognized in the middle of the conveyance path. In any case, according to the method described in this section, it is not necessary to move the electronic circuit component excessively for recognition, and the efficiency reduction of the mounting work is favorably avoided. If the recognition and the conveyance of the electronic circuit component are performed in parallel, it is possible to avoid a delay in the conveyance due to the recognition.
(11) The component holding orientation detection method according to any one of (1) to (10), wherein a surface imaging device is used as the recognition device.
As the imaging device, for example, a CCD camera or a CMOS camera can be employed.
(12) The component holding orientation detection method according to any one of (1) to (10), wherein a line sensor is used as the recognition device.
The line sensor is preferably used in a posture in which the photoelectric conversion elements are arranged along a straight line that intersects the nozzle axis at right angles. This is because it is not necessary to use a light guide device that changes the direction of light that forms an image, and the configuration of the recognition device can be simplified.
(13) a substrate holding device for holding a circuit substrate;
A component supply device for supplying electronic circuit components;
A suction nozzle that holds the electronic circuit component by sucking and holding the upper surface of the electronic circuit component;
A moving device that moves the suction nozzle in a direction intersecting the axis of the suction nozzle;
A recognition device for recognizing an electronic circuit component held by the suction nozzle from a direction intersecting a nozzle axis which is an axis of the suction nozzle;
An electronic circuit component mounting system comprising: a determination unit that determines a holding direction of the electronic circuit component by the suction nozzle based on a result of recognition by the recognition device.
The moving device includes: (i) a suction nozzle that receives an electronic circuit component from the component supply device and is mounted between the substrate holding device and the component supply device so as to be mounted on the circuit substrate held by the substrate holding device. (Ii) holding a plurality of suction nozzles and turning the plurality of suction nozzles around one axis, or (iii) moving them along a straight line. (iv) A mounting head that holds a plurality of suction nozzles, turns around one axis, or moves along a straight line is further moved between the component supply device and the substrate holding device. Is provided with a recognition device on a movable member that moves while holding the mounting head, and electronic circuit components held by a plurality of suction nozzles that are swung around a single axis or moved along a straight line. You may be made to recognize. Even when the mounting head holds one suction nozzle, a recognition device may be provided on the movable member. Further, the recognition device may be provided with its position fixed with respect to the suction nozzle moved by the moving device.
The “direction intersecting the axis of the suction nozzle” includes a direction orthogonal to the axis of the suction nozzle and a direction intersecting at an angle other than a right angle with the axis of the suction nozzle.
The component supply device is, for example, a device that supplies electronic circuit components by a feeder or a tray. Examples of the feeder include a tape feeder, a stick feeder, and a bulk feeder.
Each feature described in the above items (2) to (12) is also applicable to the electronic circuit component mounting system of this item.
(14) The electronic device according to (13), wherein the recognition device is provided in the vicinity of a movement path of the suction nozzle by the movement device in a state where the electronic circuit component moving along the movement path can be recognized. Circuit component mounting system.
If the recognition device is provided in the vicinity of the movement path of the suction nozzle, in any of the cases (i) to (iv) described in section (13), the suction nozzle is moved using the movement of the suction nozzle by the movement device. It can be located at the recognition position and recognized by the recognition device. This eliminates the need for a dedicated device for positioning the recognition device and the suction nozzle for recognition, thereby suppressing an increase in device cost. In the cases (ii) to (iv), the recognition can be performed in parallel with the extraction of the electronic circuit component from the component supply device. In the case of (ii), the electronic circuit component can be recognized in parallel with the removal of the electronic circuit component from the component supply device and the mounting on the circuit substrate, and there is a delay in mounting the electronic circuit component due to the recognition. Avoided.
(15) Furthermore,
A nozzle rotating device for rotating the suction nozzle around the nozzle axis;
An orientation correction unit that corrects the orientation of the electronic circuit component by rotating the suction nozzle by the nozzle rotating device when the holding orientation determined by the determination unit is different from the planned holding orientation (13). Item (14) or the electronic circuit component mounting system according to item (14).
By correcting the orientation, the electronic circuit component can be mounted on the circuit board in a predetermined orientation. For this reason, it is avoided that electronic circuit components having a determined orientation different from the plan are discarded and are wasted, and that removal from the component supply device is performed again and mounting efficiency is reduced.
However, azimuth correction is not indispensable, the notification device informs that the holding azimuth is different from the schedule, removal of electronic circuit components from the component supply tool that supplied the electronic circuit components is prohibited, and component supply tools It may be exchanged.

It is a top view which shows the electronic circuit component mounting system which is one Embodiment of claimable invention. It is a side view (partial cross section) which shows the mounting apparatus of the said electronic circuit component mounting system. It is a side view which shows the mounting head of the said mounting apparatus. It is a figure which shows LED with which the said mounting apparatus mounts | wears a circuit board, Fig.4 (a) is a top view, FIG.4 (b) is a front view, FIG.4 (c) is a bottom view. It is a top view which shows roughly the state by which the component holding tape in which the said LED was accommodated was hold | maintained at the feeder. It is a bottom view (partial cross section) which shows the side components imaging system provided in the Y-axis slide of the said mounting apparatus. It is a block diagram which shows notionally the control apparatus which controls the said electronic circuit component mounting system. It is a figure explaining the imaging of LED by the said side parts imaging system. It is a figure explaining the determination of the holding | maintenance direction of LED by the suction nozzle of the said mounting apparatus, and confirmation of a kind. It is a figure which shows the electronic circuit component by which the confirmation of a kind and determination of a holding direction are performed in the electronic circuit component mounting system which is another embodiment, FIG.10 (a) is a top view, FIG.10 (b) is a front view, FIG. 10C is a bottom view. It is a figure explaining the confirmation of the kind performed about the electronic circuit component shown in FIG. 10, and the determination of a holding | maintenance direction. It is a top view which shows roughly the side component imaging system of the electronic circuit component mounting system which is another embodiment.

  Hereinafter, several embodiments of the claimable invention will be described with reference to the drawings. In addition to the following embodiment, the claimable invention can be implemented in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section.

  FIG. 1 shows an electronic circuit component mounting system as an embodiment of the claimable invention. In this electronic circuit component mounting system, a component holding orientation detection method as one embodiment of the claimable invention is implemented.

  As shown in FIG. 1, the electronic circuit component mounting system includes a substrate transport device 10, a substrate holding device 12, a component supply device 14, a mounting device 16, a mark imaging system 18, and a lower component imaging system which is a bottom side component imaging system. 20, side part imaging system 22 (see FIG. 2) and control device 24 (see FIG. 7). The board conveyance device 10 is provided on a bed 26 as a system main body, and conveys a circuit board 28 as a circuit base material in one horizontal direction. In the present embodiment, the conveyance direction of the circuit board 28 is the X-axis direction, and the direction orthogonal to the X-axis direction is a horizontal plane that is the surface of the circuit board 28 and parallel to the component mounting surface as the work surface. The Y-axis direction is assumed.

  The substrate holding device 12 is provided at a position corresponding to an intermediate portion in the conveyance direction of the substrate conveyance device 10 and in a direction parallel to the substrate conveyance direction of the component supply device 14. The substrate holding device 12 includes a substrate supporting device and a clamp member, and holds the circuit board 28 in a horizontal posture.

  As schematically illustrated in FIG. 1, the component supply device 14 includes, for example, a component supply table 34 in which a large number of feeders 30 as component supply tools are arranged on a feeder holding table 32. In the feeder holding table 32, a plurality of feeder holding portions are provided at equal intervals in the direction parallel to the X-axis direction. In this embodiment, the feeder 30 is provided at equal intervals, and the feeder 30 is in the X-axis and Y-axis directions. And is detachably held in a state in which lifting from the feeder holding table 32 is prevented. The feeder 30 is, for example, a tape feeder that is supplied in a state where electronic circuit components are held on a component holding tape, and is provided with a tape feeder, and sequentially feeds the electronic circuit components one by one to the component supply unit. Position it. A large number of feeders 30 each accommodate a large number of electronic circuit components of one type, and each component supply unit is arranged on a feeder holding table 32 in a state of being aligned along a straight line parallel to the X-axis direction.

  As shown in FIGS. 1 and 2, the mounting device 16 includes a mounting head 40 as a holding head, a head moving device 42, a nozzle lifting / lowering device 44, a head rotating device 46, and a nozzle rotating device 48. As shown in FIG. 1, the head moving device 42 includes an X-axis direction moving device 50 and a Y-axis direction moving device 52, and moves the mounting head 40 to an arbitrary position in the horizontal plane. The X-axis direction moving device 50 includes an X-axis slide 54 and an X-axis slide moving device 56 as movable members. The X-axis slide moving device 56 includes an electric motor 58 as a drive source, and a feed screw mechanism 62 including a feed screw 60 and a nut (not shown). In this embodiment, the Y-axis direction moving device 52 is provided on the X-axis slide 54, and includes a Y-axis slide 66 and a Y-axis slide moving device 68 as movable members. Similar to the X-axis slide moving device 56, the Y-axis slide moving device 68 includes an electric motor 70 as a drive source, and a feed screw mechanism 76 (see FIG. 2) having a feed screw 72 and a nut 74. As the feed screws 60 and 72, ball screws are suitable, and as the electric motors 58 and 70, an electric motor capable of controlling the rotation angle such as a servo motor is suitable. The same applies to the feed screw and the electric motor described below. The head moving device may be one in which an X-axis direction moving device is provided on the Y-axis slide.

  As shown in FIG. 2, the mounting head 40, the nozzle elevating device 44, the head rotating device 46, and the nozzle rotating device 48 are provided on the Y-axis slide 66, and are moved in the horizontal plane by the movement of the X-axis and Y-axis slides 54, 66. Can be moved to any position. The mounting head 40 is configured to hold a plurality of, for example, three or more suction nozzles 80, which are a kind of component holder (FIG. 2 representatively shows two suction nozzles 80). ). The head main body 82 of the mounting head 40 is uniaxially driven by a Y-axis slide 66 and is rotated around its own vertical axis and is held so as not to move in the axial direction, and a lower part of the rotary shaft 84. And a nozzle holder 86 as a part holder holding body provided concentrically and rotated around a vertical axis.

  As shown in FIG. 2, the head rotating device 46 uses an electric motor 88 as a drive source, the rotating shaft 84 is rotated by the electric motor 88, and the mounting head 40 is rotated at an arbitrary angle in both forward and reverse directions.

  The nozzle holding body 86 has a circular cross-sectional shape and is larger in diameter than the rotation shaft 84, and three or more, for example, eight nozzle holding portions 98 are one circle centered on the rotation axis of the mounting head 40. It is provided on the circumference at an appropriate interval, for example, at an equiangular interval. Each of the nozzle holding portions 98 is held by the nozzle holding body 86 so as to be movable in the vertical direction parallel to the rotation axis of the mounting head 40 and to be rotatable around its own vertical axis. A holding shaft 100 as a member is provided, and suction nozzles 80 are detachably held one by one by a nozzle holder 102 provided at a lower end protruding downward from the nozzle holder 86. Each of the plurality of suction nozzles 80 is held at a position eccentric from the rotation axis of the mounting head 40 so as to be rotatable about its own vertical axis. It is swung around the rotation axis and moved in a direction perpendicular to the nozzle axis which is the axis. Therefore, the electronic circuit component held in any of the plurality of suction nozzles 80 has an axis line in the vertical direction and a height direction in the vertical direction.

  The suction nozzle 80 sucks and holds electronic circuit components by negative pressure, and includes a nozzle body 104 and a suction pipe 106, and passes through a passage (not shown) provided in the head body 82 so as to have a negative pressure source (not shown). Negative pressure is supplied from (omitted). Supply and interruption of the negative pressure of the suction nozzle 80 are individually performed for each of the plurality of suction nozzles 80 by a switching device (not shown). There are a plurality of types of suction nozzles 80 in which the shape and size of the suction pipe 106 are different, and the suction nozzle 80 corresponding to the shape and size of the electronic circuit component is used for mounting the electronic circuit component on the circuit board 28. Is done. For example, in the suction nozzle 80a shown in FIG. 2, the suction tube 106a is straight and the diameter of the suction surface is small, and a small electronic circuit component such as a square chip 108 which is a kind of electronic circuit component can be mounted on the circuit board 28. used.

  Further, the suction nozzle 80b shown in FIG. 3 has a shape in which the diameter of the suction pipe 106b increases toward the tip, the suction surface has a larger diameter, and an LED (Light Emitting Diode) 110 shown in FIG. It is used for mounting large electronic circuit components on the circuit board 28 such as a ball grid array (CSP) and a chip size package (CSP). The LED 110 has an upper part 112 and a lower part 114 as shown in FIGS. 4 (a) and 4 (b). The lower part 114 has a rectangular parallelepiped shape, and the upper part 112 has a shape in which one of four corners of the rectangular parallelepiped is notched at a notch surface 116 having a flat surface to form a notch 118. The polarity of the LED 110 is indicated by the formation of the notch 118, and the side where the notch 118 is formed in the longitudinal direction is the cathode, and the side where the notch 118 is not formed is the anode. The upper part 112 is smaller in size in plan view than the lower part 114 and is provided concentrically with the lower part 114. Therefore, the upper portion 112 cannot be seen from a direction perpendicular to the bottom surface of the lower portion 114, and only the bottom surface of the lower portion 114 can be seen as shown in FIG.

  In this embodiment, as shown schematically in FIG. 5, the LED 110 is in a state in which the longitudinal direction is parallel to the width direction of the component holding tape 122 and the feeder 30 is held by the feeder holding portion of the feeder holding table 32. Then, the notch 118, that is, the side on which the cathode is provided is scheduled to be accommodated in the component accommodating recess 126 formed on the carrier tape 124 in an orientation located downstream in the conveying direction of the circuit board 28. . This orientation is referred to as a planned accommodation orientation. The housing orientation means the orientation of the electronic circuit component housed in the component housing portion in a plane perpendicular to the axis thereof. For the LED 110 housed in the component housing recess 126, the cathode and the anode are connected to the LED 110. Which direction the axis is oriented. In a state where the feeder 30 is held on the feeder holding table 32, the longitudinal direction of the LED 110 is parallel to the X-axis direction.

  The plurality of holding shafts 100 are rotated around their own axes by the nozzle rotating device 48. As illustrated in FIG. 2, the nozzle rotating device 48 uses an electric motor 130 that is provided on the Y-axis slide 66 so as to be rotatable about an axis parallel to the rotation axis of the mounting head 40 as a drive source. The nozzle rotating device 48 includes a cylindrical rotating body 132 that is fitted to the rotating shaft 84 of the head main body 82 so as to be relatively rotatable and immovable in the axial direction, and is provided on an upper end portion of the rotating body 132. The drive gear 134 and the drive gear 136 fixed to the output shaft of the electric motor 130 are engaged with each other, and the drive gear 138 provided at the lower portion of the rotating body 132 is moved upward from the head main body 82 of each of the plurality of holding shafts 100. It is meshed with a driven gear 139 provided on the extended upper part. Therefore, when the rotating body 132 is rotated by the electric motor 130, the plurality of holding shafts 100 are simultaneously rotated around their own axes, and the plurality of suction nozzles 80 are simultaneously rotated in the same angle and in the same direction. The electronic circuit components held by the suction nozzle 80 are rotated around the nozzle axis. When the head main body 82 is rotated by the head rotating device 46, the rotary body 132 is rotated in the same direction as the head main body 82 at the same angular speed, so that the holding shaft 100 does not rotate around its own axis. The

  The drive gear 138 has a longer dimension in the direction parallel to the rotation axis than the driven gear 139, and the holding shaft 100 moves up and down while keeping the driven gear 139 engaged with the drive gear 138. Is possible. Each of the plurality of holding shafts 100 is biased upward by a compression coil spring 140 as a spring as an elastic member which is a kind of biasing device disposed between the nozzle holder 86 and the driven gear 139. . The upper limit of the holding shaft 100 due to the bias of the spring 140 is defined by the nozzle holder 102 coming into contact with the nozzle holder 86, and the holding shaft 100 and the suction nozzle 80 are positioned at the rising end position.

  As shown in FIG. 2, the nozzle lifting device 44 includes a lifting drive member 142 and a lifting drive member driving device 144. The elevating drive member drive device 144 includes an electric motor 146 provided in the vertical direction on the Y-axis slide 66, and a feed screw mechanism 152 including a feed screw 148 and a nut 150. The feed screw 148 is provided on the Y-axis slide 66 so as to be rotatable about a vertical axis and not movable in the axial direction. A nut 150 screwed to the feed screw 148 is provided on the Y-axis slide 66 so as to be movable up and down. The elevating drive member 142 is held. The elevating drive member 142 has an engaging portion 154 that extends from the nut 142 toward the mounting head 40 and is positioned above the turning path of the plurality of holding shafts 100.

  Each of the plurality of holding shafts 100 includes an engaged portion 156 above the portion where the driven gear 139 is provided. When the raising / lowering drive member 142 does not raise or lower the holding shaft 100, the engaging portion 154 is at a rising end position or a non-operating position that is a position slightly above the engaged portion 156 of the holding shaft 100 located at the rising end position. Located and allows the holding shaft 100 to pivot. The plurality of holding shafts 100 are sequentially swung to the lift position where the engaged portion 156 is opposed to the engagement portion 154 by the rotation of the mounting head 40, and the engagement portion 154 is lowered by the lowering of the lift drive member 142. Engages the engaged portion 156, lowers the holding shaft 100 against the urging force of the spring 140, and lowers the suction nozzle 80. Further, the raising of the holding shaft 100 is allowed by the raising of the elevating drive member 142, the holding shaft 100 is raised by the urging of the spring 140, and the suction nozzle 80 is raised. The electronic circuit components are taken out from the feeder 30 by the suction nozzle 80 and mounted on the circuit board 28 at the lift position. The raising / lowering positions are a component receiving position, a component mounting position, and a component suction mounting position. In this embodiment, the position closest to the component supply device 14 in the Y-axis direction is set as the lifting position in the turning path of the suction nozzle 80. Yes.

  The mark imaging system 18 is a system that images a plurality of reference marks 160 (see FIG. 1) provided on the circuit board 28, and is mounted on a Y-axis slide 66 as shown in FIG. 40 is moved together with the head moving device 42. The head moving device 42 is also an imaging system moving device. The mark imaging system 18 includes a mark imaging device 162 and an illumination device 164. The mark imaging device 162 is, for example, a surface imaging device, and is configured by, for example, a CCD camera and provided downward.

  As shown in FIG. 1, the lower component imaging system 20 is located between the substrate transport device 10 of the bed 26 and the component supply device 14, and the range of movement of the mounting head 40 is determined by the substrate transport device 10. The circuit board 28 is provided in a fixed position at the center position in the conveyance direction. The lower component imaging system 20 is provided at a position corresponding to the center position in the direction in which the component supply units of the large number of feeders 30 are arranged. The lower component imaging system 20 includes a lower component imaging device 170 and an illumination device 172 as bottom surface component imaging devices, and is located below the moving plane of the mounting head 40, with the imaging center line being provided vertically and upward. The front image of the electronic circuit component is imaged from a direction perpendicular to the lower surface, which is the bottom surface of the main body of the electronic circuit component.

  Therefore, as shown in FIGS. 2 and 3, the suction nozzles 80a and 80b include plate-like background forming members 174a and 174b, respectively, and the background which is the surface of the background forming members 174a and 174b on the suction pipes 106a and 106b side. The color of the forming surface is black. The lower part imaging device 170 is, for example, a surface imaging device, and includes, for example, a CCD camera and a lens system. The image pickup possible area of the lower component imaging device 170 is that all the electronic circuit components held by the suction nozzles 80 are held at a time in a state where the suction nozzles 80 are held by all the nozzle holding parts 98 of the mounting head 40. The lower part imaging device 170 has an imageable area where the entire lower surface of the electronic circuit part can be imaged. The lower part imaging system may be provided on the X-axis slide 54 so that an electronic circuit component is imaged during the movement of the mounting head 40 in the X-axis direction.

  As shown in FIG. 2, the side component imaging system 22 is located at the same position as the nozzle lifting / lowering device 44 around the rotation axis of the mounting head 40 by the bracket 178 on the Y-axis slide 66 and the turning path of the holding shaft 100. It is provided at a position corresponding to the lift position inside, and is moved together with the mounting head 40 etc. to an arbitrary position in the horizontal plane. The head moving device 42 is also a side component imaging system moving device.

  The side component imaging system 22 includes a side component imaging device 180 and a lighting device 182. The side component imaging device 180 is a surface imaging device, for example, and includes a CCD camera and a light guide device 184, for example. In this embodiment, the side component imaging device 180 is provided in a state in which the imaging center line is horizontal, is orthogonal to the head rotation axis, and is parallel to the Y-axis direction. It is orthogonal to the nozzle axis which is the axis of the suction nozzle 80 located at the position. Therefore, the electronic circuit component held in the posture in which the axis is vertical by the suction nozzle 80 is imaged from the direction orthogonal to the nozzle axis by the side component imaging device 180 and is imaged from the side. The raising / lowering position is also a side part imaging position.

  In the height direction of the electronic circuit component, the imageable area of the side component imaging device 180 has a size that allows the entire electronic circuit component to be imaged, and is a horizontal direction or width that is a direction orthogonal to the height direction. In the direction, even if there is a deviation in the holding of the electronic circuit component by the suction nozzle 80 and the rotation position (position around the axis) of the electronic circuit component is any, the entire electronic circuit component can be imaged. It has the size that can be.

  The illumination device 182 includes a plurality of light emitters 186 as shown in FIGS. 2 and 6. Each of these light emitters 186 is composed of an LED, and is arranged in a row in the horizontal direction on the casing 188, and irradiates light in the horizontal direction. The illumination device 182 is provided on the same side as the side component imaging device 180 with respect to the suction nozzle 80b in the direction orthogonal to the nozzle axis, and irradiates the electronic circuit component with light. The light guide device 184 includes a plurality of prisms 190, changes the direction of image forming light reflected from the electronic circuit component, and horizontally enters the CCD camera, thereby capturing a front image of the electronic circuit component.

  As shown in FIG. 7, the control device 24 is mainly composed of a control computer 210 including a CPU 200, a ROM 202, a RAM 204, and a bus 206 for connecting them, and an input / output unit 212 includes a mark. An image processing computer 214 that processes image data obtained by imaging of the imaging device 162, the lower component imaging device 170, and the side component imaging device 180 is connected. In addition, encoders 218 and other servo motor encoders constituting a drive source are connected to the input unit, and various actuators such as a drive source of the substrate transport apparatus 10 are connected to the output unit via the drive circuit 220. Etc. are connected.

Regarding the electronic circuit component mounting system configured as described above, mounting of the LED 110 to the circuit board 28 will be described.
The suction nozzle 80b is used for mounting the LED 110. Therefore, each of the plurality of holding shafts 100 holds the suction nozzle 80b. Then, the mounting head 40 is moved to the component supply device 14, and each of the plurality of suction nozzles 80 b receives the LEDs 110 from the feeder 30. The plurality of suction nozzles 80b are sequentially swung to the lift position by the rotation of the mounting head 40, and are lowered by the nozzle lift device 44 to suck the upper surface of the LED 110. After suction, the holding shaft 100 biases the spring 140. And the suction nozzle 80b is raised, and the LED 110 is taken out from the feeder 30. The LED 110 is imaged from the side by the side component imaging device 180 at the rising end position.

  In parallel with the adsorption and imaging of the LEDs 110, the image data obtained by the imaging is processed by the image processing computer 214, and the height direction position of the lower end of the LEDs 110 is obtained. In the electronic circuit component mounting system, the height direction of the electronic circuit component is the vertical direction, the bottom side end is the lower end, and the height direction position is the position in the vertical direction or the vertical direction. The position including the position in the height direction of the side component imaging device 180 is known by design, and the height direction position of the lower end is calculated based on the image data of the LED 110 and sent to the control computer 210.

  In the control computer 210, based on the height direction position of the lower end of the LED 110, for example, it is determined whether or not the suction nozzle 80b is sucking the LED 110, whether or not the LED 110 is held in a predetermined posture, and the like. The For example, if the suction nozzle 80b does not suck the LED 110, for example, after the reception operation of the LEDs 110 by all the suction nozzles 80b is completed, the reception operation of the LED 110 is performed again. If the LED 110 is not held in a predetermined posture, the electronic circuit component is dropped into the storage box, and the LED 110 is received again. If the position of the LED 110 in the height direction is not possible if the LED 110 to be sucked is sucked by the suction nozzle 80b in a normal posture, the LED 110 is sucked in a posture inappropriate for mounting. You can see that

  If all the suction nozzles 80 b held by the mounting head 40 have received the LEDs 110, the mounting head 40 is moved to the substrate holding device 12 and the LEDs 110 are mounted on the circuit board 28. In the middle of this movement, the mounting head 40 is moved onto the lower part imaging device 170, and all the LEDs 110 held by the plurality of suction nozzles 80b are imaged at a time. The image data obtained by this imaging is processed by the image processing computer 214, and the holding position error of the LED 110 by the suction nozzle 80 b is calculated for each of the plurality of LEDs 110 and sent to the control computer 210. The holding position error includes a position error in the X axis and Y axis directions, which is a position error in a direction orthogonal to the axis of the suction nozzle 80b, and a rotational position error, which is a position error around the axis.

  After the imaging of the LED 110 by the lower component imaging device 170, the mounting head 40 is moved to the substrate holding device 12. During the movement, the LED 110 is imaged by the side component imaging device 180, the type of the LED 110 is confirmed, and the suction nozzle The holding orientation of the LED 110 is determined by 80b. This holding orientation is in which direction the anode and the cathode of the LED 110 are oriented around the nozzle axis. The suction nozzle 80b holds the LED 110 until it is mounted on the circuit board 28 after the LED 110 is taken out from the feeder 30, and the holding direction is the same as that of the component holding tape 122 in the feeder 30 mounted on the feeder holding table 32. It depends on the housing orientation of the LED 110 housed in the component housing recess 126. Therefore, the accommodation direction is determined by determining the holding direction.

  The direction when the LED 110 is mounted on the circuit board 28 is set for each component mounting position. In the mounting program, generally, the coordinates of the component mounting position on the circuit board 28, the type of electronic circuit component to be mounted, the mounting posture of the electronic circuit component, and the holding on the feeder holding table 32 of the feeder 30 that supplies the electronic circuit component. The position and the like are associated with each other, and the mounting order is set. For example, the mounting orientation is a rotational orientation in which the longitudinal direction of the electronic circuit component is the front-rear direction and the left-right direction, regardless of the orientation, but the mounting orientation is set for the LED 110. The direction is also set such that it faces right and 45 degrees right front. The mounting direction of the LED 110 is set by the rotation angle from the original position with the direction of the LED 110 in the state of being housed in the component holding tape 122 as the original position.

  However, for some reason, the LED 110 may be housed in the component housing recess 126 in a direction opposite to the planned housing direction, and the notch 118 may be located upstream in the transport direction. In addition, the housing posture of the LED 110 (the rotational posture regardless of the orientation in the state of being housed in the component housing recess 126) is known, but if the housing orientation is unknown, the LED 110 is in a different orientation from the setting. May be attached. Therefore, the holding direction is determined, and the LED 110 is mounted on the circuit board 28 in the set direction.

  The housing orientation of the LEDs 110 may be different for each component holding tape 122, but is the same for many LEDs 110 held by one component holding tape 122. For this reason, the feeder 30 that supplies the LED 110 is determined to be held by the suction nozzle 80b for the LED 110 that is first taken out after being mounted on the feeder holding table 32, and the accommodation orientation of the LED 110 is acquired.

  The plurality of suction nozzles 80 held by the mounting head 40 receive electronic circuit components from the feeder 30 in accordance with the mounting program. In the control computer 210, the electronic circuit from the feeder 30 in which any suction nozzle 80 is held at any holding position. It is known whether the parts have been received. Further, if the holding direction is determined, the storage direction of the LED 110 corresponding to the holding position of the feeder 30 is provided in the RAM 204 for the feeder 30 supplied with the LED 110 for which the determination has been performed, and the storage unit is configured. Is stored in the storage orientation memory. The accommodation direction memory is cleared prior to the start of the mounting operation of the electronic circuit components on the series of circuit boards 28, and the accommodation direction is stored in the accommodation direction memory when the LED 110 is taken out from the feeder 30 for the first time. Instead, imaging by the side component imaging device 180 and determination of the holding direction are performed. The holding azimuth and the accommodating azimuth uniquely correspond, and the accommodating azimuth memory is also a holding azimuth memory.

  When the mounting head 40 has a plurality of suction nozzles 80b from which the LEDs 110 are taken out from the same feeder 30, a predetermined one of the plurality of suction nozzles 80b, for example, the suction nozzle 80b having the earliest receiving order is held. Direction determination is performed. With respect to the second and subsequent LEDs 110 taken out from the same feeder 30, since the accommodation orientation is acquired, imaging by the side component imaging device 180 is not performed, and mounting is performed using the acquired accommodation orientation. When there are a plurality of suction nozzles 80b from which the first LED 110 is taken out from the feeder 30 among the plurality of suction nozzles 80b, the suction nozzles 80b are moved to the side component imaging position in the order of reception, for example. The LED 110 is imaged and the holding direction is determined.

  The suction nozzle 80b for which the holding orientation is determined is moved to the side component imaging position. The LED 110 is imaged at two rotational positions by the side component imaging device 180, and is imaged from two different directions orthogonal to the nozzle axis. One is an orthogonal position in which the side surface parallel to the longitudinal direction of the LED 110 is orthogonal to the imaging center line indicated by the alternate long and short dash line, as shown by a solid line in FIG. 8 (a). As shown in (b), the notch surface 116 is a parallel position parallel to the imaging center line, and the LED 110 images two different portions around the axis.

  In the present embodiment, as described above, the imaging center line of the side component imaging device 180 is parallel to the Y axis, and the LED 110 is accommodated in the feeder 30 in a posture in which the longitudinal direction thereof is parallel to the X axis direction. Has been. Therefore, the LED 110 sucked by the suction nozzle 80b is positioned at an orthogonal position as indicated by a solid line in FIG. 8A when the suction nozzle 80b is positioned at the side component imaging position, and is preset from this position. By being rotated by a preset angle in the direction, it is positioned at a parallel position as shown in FIG. These angles and directions are set based on the inclination angle and formation location of the notch surface 116 on the assumption that the LED 110 is housed in the component holding tape 122 in a predetermined housing orientation, and are associated with the type of the LED 110, It is stored in an imaging position memory provided in the RAM 204 and constituting a storage means.

  However, the LED 110 held by the suction nozzle 80b often has a rotational position error as indicated by a two-dot chain line in FIG. This rotational position error is acquired by imaging the LED 110 by the lower part imaging device 170, and the suction nozzle 80b is moved to the side part imaging position and rotated by the rotation of the mounting head 40, and the rotational position error is detected. Is corrected, and the LED 110 is positioned at the orthogonal position. The LED 110 is imaged at the orthogonal position by the side component imaging device 180, and then rotated to the parallel position by the rotation of the suction nozzle 80b to be imaged. After imaging, the LED 110 is returned to the orthogonal position, and further returned to the rotational position before the rotational position error is corrected. If the LED 110 is housed in the component holding tape 122 in the opposite direction to the schedule, the image is captured in the state shown in FIG. 8C at the orthogonal position, and the state shown in FIG. 8D at the parallel position. The image is taken with.

  In order to simplify the explanation, the LED 110 is imaged by the lower component imaging device 170 and then moved to the side component imaging position without being rotated about its own axis, and the side component imaging is performed. In the electronic circuit component mounting system, the plurality of suction nozzles 80 are simultaneously rotated by the nozzle rotation device 48 at the same time, so that at the side component imaging position. The LEDs 110 other than the LED 110 imaged by the side component imaging device 180 are also rotated. Therefore, if there are two or more suction nozzles 80b for which the holding orientation of the LED 110 is determined, the required rotation angle of the suction nozzle 80b is calculated so that the angle rotated by the rotation of the other suction nozzles 80b is removed. Is done. This is the same when correcting the rotational position error of the LED 110 when the electronic circuit component is mounted on the circuit board 28.

  Regardless of whether the accommodation orientation of the LED 110 is as planned, the image shown in FIG. 9A is obtained by imaging at the orthogonal position. The same reference numerals as those of the entities are given to the images, and the correspondence with each part of the LED 110 is shown. Then, by the processing of the image processing computer 214, the longitudinal dimensions L1 and L2 of the upper part 112 and the lower part 114 are calculated, and the control computer 210 calculates the difference between the dimensions L1 and L2 from the set dimensions. If the absolute value of the difference is equal to or less than the set value for both the upper part 112 and the lower part 114, it is determined that the type of LED 110 set by the mounting program is held. If the absolute value of the difference exceeds the set value for at least one of the upper part 112 and the lower part 114, it is determined that the type is wrong, the fact is notified, and the LED 110 is not mounted on the circuit board 28.

  The holding direction is determined based on the image of the LED 110 obtained by imaging at the parallel position. In the parallel position, the LED 110 is imaged in a state where the cut-out surface 116 is parallel to the imaging center line and the end of the upper portion 112 is missing, so that the image is shortened accordingly, and the image is displayed on either side of both ends in the longitudinal direction. The holding orientation can be determined by detecting whether the cutout portion 118 is shortened.

  If the accommodation orientation of the LED 110 is as planned, the image shown in FIG. 9B is obtained by imaging at the parallel position, and if it is opposite to the plan, the image shown in FIG. 9C is obtained. Regardless of the obtained image, the distance L3 between one end and the distance between the other end set in advance in the imaging plane in the longitudinal direction of each image of the upper part 112 and the lower part 114 by image processing. L4 is calculated and sent to the control computer 210.

In the control computer 210, the distance L4 is subtracted from the distance L3, and the azimuth is determined based on the difference between the positive and negative values and the magnitude of the absolute value. If the difference is negative and the absolute value is greater than or equal to the set value, it is determined that there is a notch 118 at the end on the side where the distance L4 of the LED 110 is calculated. The end of the LED 110 on the side where the distance L4 is calculated is located downstream in the board conveyance direction when the suction nozzle 80b is located at the component receiving position. Therefore, it is determined that the holding orientation of the LED 110 by the suction nozzle 80b is the same as the planned accommodation orientation, and it is determined that the actual accommodation orientation of the LED 110 is as planned. If the difference is positive and the absolute value is equal to or greater than the set value, it is determined that the holding orientation and the actual accommodation orientation are 180 degrees opposite to the planned accommodation orientation. The accommodation direction obtained by the determination of the holding direction is stored in the accommodation direction memory in association with the holding position in the feeder holding table 32 of the feeder 30. If the absolute value of the difference is smaller than the set value, it is impossible to determine the holding direction, and reception of the LED 110 from the feeder 30 in which the LED 110 is accommodated is prohibited.
At least one of the distance L3 and the distance L4 is detected, the detected distance is compared with a set value, the notch 118 is detected based on the magnitude of the absolute value of the difference, and the holding orientation is determined. You may do it.

  In the present embodiment, the side component imaging system 22 is mounted on the Y-axis slide 66 together with the mounting head 40, and the LED 110 is imaged while the mounting head 40 is moved by the head moving device 42, and the transport path of the LED 110. Imaging is performed in the middle of. Therefore, by performing imaging for holding orientation determination, the time required for the suction nozzle 80 to move to the substrate holding device 12 is lengthened, and a reduction in mounting efficiency is avoided. In this embodiment, the side part imaging system 22 is mounted on a movable member on which the mounting head 40 is mounted, and the suction nozzle 80 is moved to the imaging position by turning, so that the turning path is recognized. The apparatus is a moving path provided in the vicinity, and the head rotating device 46 constitutes a moving apparatus that moves the suction nozzle 80 along the moving path.

  When the LED 110 is mounted on the circuit board 28, the accommodation direction is read, and if the accommodation direction is opposite to the plan, the suction nozzle 80b is rotated 180 degrees. Normally, the suction nozzle 80b is configured such that the angle of difference between the housing posture of the electronic circuit component in the component holding tape 122 and the mounting posture set in the mounting program, the rotational position error in the holding position error, and the component mounting position of the circuit board 28. In addition to the LED 110 having an accommodation direction opposite to the expected angle, the LED 110 is further rotated 180 degrees, and the LED 110 is rotated by the sum of the angle necessary for correcting the rotational position error of the LED 110. It is mounted in the same state as was stored in the holding tape 122 in the planned storage orientation. The holding position of the feeder 30 from which the LED 110 held by the suction nozzle 80b is taken out is grasped by the control computer 210, and the housing orientation of the LED 110 held by the suction nozzle 80b is read from the housing orientation memory. Further, the position error of the component mounting position is caused by the fact that the reference mark 160 is imaged by the mark imaging device 162 after the circuit board 28 is carried into the electronic circuit component mounting system and held by the substrate holding device 12. Each of the component mounting positions is acquired.

  As is apparent from the above description, in this embodiment, the side component imaging device 180 constitutes a recognition device, and the holding orientation of the LED 110 by the suction nozzle 80b is determined based on the imaging of the LED 110 at the parallel position of the control computer 210. The part that performs the determination constitutes a determination part, and the part that rotates the suction nozzle 80b by 180 degrees when the actual accommodation direction of the LED 110 is opposite to the schedule constitutes the direction correction part.

  In the above embodiment, the LED 110 is large and the suction nozzle 80b having a large suction surface diameter is used for mounting on the circuit board 28. However, when the LED 110 is small, the circuit board 28 is used. A suction nozzle 80a having a small suction surface diameter is used for mounting. As for the small LED 110, the cutout portion 118 is identified based on imaging from the side as in the large LED 110, and the holding direction by the suction nozzle 80a is determined.

  Note that the side component imaging system is provided so that the holding orientation can be determined by imaging the LED at the time of taking out from the feeder, and the holding orientation is determined together with the presence / absence of the electronic circuit component and the detection of the holding posture. Good.

The recognition of at least one direction among the plurality of directions of recognition of the electronic circuit component held by the suction nozzle is performed on a portion whose position in the direction parallel to the nozzle axis is different from the recognition of at least one direction. Also good. The embodiment will be described with reference to FIGS.
The electronic circuit component 250 recognized in the present embodiment has an upper part 252, a middle part 254, and a lower part 256 as shown in FIG. The middle part 254 and the lower part 256 are configured in the same manner as the upper part 112 and the lower part 114 of the LED 110, and as shown in FIG. 10 (c), the middle part 254 is not visible from the direction perpendicular to the bottom surface of the lower part 256, A corner of one end of each of the two is notched at the notch surface 258 to have a notch 260. As shown in FIGS. 10A and 10B, the upper portion 252 has a longitudinal dimension shorter than the middle portion 254.

  The electronic circuit component 250 is imaged at an orthogonal position where the side surface in the longitudinal direction is orthogonal to the imaging center line of the imaging device, and at a parallel position where the notch surface 256 is parallel to the imaging center line. The image shown in FIG. 11A is obtained by imaging at the orthogonal position, the distances L1 and L2 in the longitudinal direction of the upper part 252 and the lower part 256 are calculated, and the type of the electronic circuit component 250 is determined by comparison with these set distances. It is confirmed. The images shown in FIG. 11 (b) or FIG. 11 (c) are obtained by imaging at the parallel position, and distances L3 and L4 between the longitudinal ends of the images of the middle part 254 and the lower part 256 are calculated, and the difference between them is calculated. Based on this, the holding orientation is determined.

When recognition of an electronic circuit component is performed by imaging with an imaging device, a silhouette image of the electronic circuit component may be captured. The embodiment will be described with reference to FIG.
In the present embodiment, as schematically shown in FIG. 12, in the direction orthogonal to the axis of the suction nozzle 300, the imaging device 304 of the imaging system 302 is provided on one side of the nozzle axis, and the illumination device 306 is provided on the other side. Is provided.

  In the imaging system 302, the imaging center line is orthogonal to the axis of the suction nozzle 300 at an imaging position that is one of a plurality of stop positions of the suction nozzle 300 due to the rotation of the mounting head 308, and other than the suction nozzle 300. The illumination device 306 is provided so as not to intersect the member, and is opposed to the imaging device 304 with the suction nozzle 300 interposed therebetween, and forms a bright background of the electronic circuit component 310 held by the suction nozzle 300. The suction nozzle 300 is positioned at a predetermined rotational position around its own axis at the imaging position, a silhouette image is captured by the imaging device 304, and the holding orientation is determined based on the imaging result.

  The main mounting head 308 is moved between the substrate holding device and the component supply device by the head moving device. The imaging system 302 may be mounted on the Y-axis slide together with the mounting head 308 as in the case of the side component imaging system 22 or may be mounted on the X-axis slide. When the mounting head 308 is mounted on the Y-axis slide and the imaging system 302 is mounted on the X-axis slide, the imaging system 302 is provided stationary in the middle of the transport path in the Y-axis direction of the electronic circuit component 310, and the suction nozzle 300 is moved to the imaging position by movement in the Y-axis direction and turning. Therefore, the movement path and the turning path in the Y-axis direction of the suction nozzle 300 constitute a movement path in which the recognition device is provided in the vicinity, and the Y-axis direction movement apparatus and the head rotation device are arranged along the movement path. Constitutes a moving device for moving.

  22: Side component imaging system 80: Suction nozzle 110: LED 118: Notch 180: Side component imaging device

Claims (6)

A portion that cannot be seen from the bottom surface of the electronic circuit component whose upper surface is sucked by the suction nozzle is recognized by a recognition device from a direction intersecting the nozzle axis that is the axis of the suction nozzle, and the electronic circuit component is based on the recognition result. A component holding direction detection method for determining the holding direction of
Said electronic circuit components, and at least upper and lower, has a shape that the top is not visible from a direction perpendicular to the bottom of the bottom surface, the polarity by the formation of the notch part of the upper portion is cut away at its And an electronic circuit component in which the holding orientation cannot be specified from below in a direction parallel to the axis of the suction nozzle in a state where the upper surface is sucked by the suction nozzle ,
A component holding orientation detection method, wherein the recognition is performed from at least one direction in which the presence or absence of the notch can be identified, and the holding orientation of the electronic circuit component relating to the polarity of the electronic circuit component is determined.   The component holding orientation detection method according to claim 1, wherein the recognition is performed from a direction orthogonal to the nozzle axis.   3. The component holding according to claim 1, wherein, based on the recognition, it is determined on which side of the upper portion the cutout portion is located, and the holding direction of the electronic circuit component is determined based on the determination. Direction detection method.   The component holding orientation detection method according to claim 1, wherein the recognition is performed from a plurality of directions each intersecting the nozzle axis.   The component holding orientation detection method according to claim 4, wherein the recognition in at least one direction among the recognitions in the plurality of directions is recognition in at least one other direction and recognition of a different part of the electronic circuit component.   The component holding orientation according to claim 4 or 5, wherein the recognition from the plurality of directions is performed by the same recognition device by rotating the electronic circuit component around a rotation axis of the suction nozzle by rotation of the suction nozzle. Detection method.

Images