KR101303024B1 - Flip Chip Bonding Apparatus - Google Patents

Abstract

The present invention relates to a flip chip bonding apparatus in which the accuracy of the bonding process and the efficiency of the bonding process are maximized in the flip chip bonding process. According to the flip chip bonding apparatus according to the present invention, it is possible to minimize the unnecessary transfer process of the flip chip, and the shareable equipment can be shared in each transfer path.

Description

Flip Chip Bonding Apparatus

The present invention relates to a flip chip bonding apparatus. More specifically, the present invention relates to a flip chip bonding apparatus in which the accuracy of the bonding process and the efficiency of the bonding process in the flip chip bonding process are maximized.

The flip chip bonding apparatus forms a separate solder bump on a pad, which is an input / output terminal of a semiconductor chip, and then flips the semiconductor chip to turn over a circuit pattern such as a carrier substrate or a circuit tape. Refers to a device that is directly bonded to a pattern).

In the flip chip package, since the semiconductor chip is bonded to the substrate by the bumps formed on the bonding pads of the chip, electrical connection between the semiconductor chip and the substrate is to be made, the flip chip bonding process requires considerable precision.

Here, the substrate also includes a substrate on which the chip is already mounted, and also includes a case in which an electrode pattern is provided on the lower surface of the chip rather than solder bumps and thus the electrode pattern is bonded to the substrate.

In the process of bonding the flip chip, the process of picking up, rotating, dipping, and bonding the flip chip may include lifting or rotating the chip physically, so that the bump electrode provided on the bottom surface of the chip may be a substrate. High precision is required to ensure accurate contact with

In addition, each semiconductor chip may be moved to the substrate side via a vision unit and a flux supply unit including at least one camera for alignment, and bonding may be performed.

Therefore, in order to accurately bond each flip chip to the bonding target substrate bs in the flip chip bonding process, the chip is picked up, rotated, immersed and bonded, and the bonding target substrate bs is placed at a bonding position. The bonding position of the flip chip or the chip on the substrate should be accurately corrected or corrected during the bonding process.

In addition, since a plurality of chips may be sequentially bonded to the substrate to which the chips are bonded, the flip chip bonding efficiency may be greatly affected by the transfer path of the chip for bonding the flip chips.

In addition to the accuracy of the bonding operation, the efficiency of the operation is important in the flip chip bonding process. However, since the accuracy and efficiency of the flip chip bonding operation may be inconsistent with each other, there is an urgent need for a method for maximizing the bonding efficiency of the flip chip while ensuring the accuracy of the flip chip bonding.

An object of the present invention is to provide a flip chip bonding apparatus in which the accuracy of the bonding process and the efficiency of the bonding process are maximized in the flip chip bonding process.

In order to solve the above problems, the present invention provides a flip chip supply unit for separating and supplying each flip chip from a wafer, a flux immersion unit for immersing the bottom surface of the flip chip supplied from the flip chip supply unit, immersed in the flux immersion unit A flip chip bonding unit in which a flip chip is bonded to a bonding target substrate, a bonding head unit picking up a flip chip supplied from the flip chip supply unit and immersing the flip chip in the flux immersion unit, and then bonding the flip chip bonding unit, and the bonding head unit In order to photograph the transfer part to which the bonding head part is mounted and the bottom surface of the flip chip immersed in the flux immersion part to transfer to the predetermined transfer path via the flip chip supply part, the flux immersion part and the flux bonding part, A transfer path including the chip vision unit disposed and transferring the bonding head part The wire path, the flip chip supply unit, the flux needle portion, the chip unit and the non-flip-chip bonding portion provides a flip chip bonding device are sequentially arranged on the transport path below.
In addition, in order to solve the above problems, the present invention provides a flip chip supply unit for separating and supplying each flip chip from the wafer, a flux immersion unit for immersing the bottom surface of the flip chip supplied from the flip chip supply unit, the flux immersion unit A flip chip bonding unit in which the immersed flip chip is bonded to the bonding target substrate, a bonding head unit picking up the flip chip supplied from the flip chip supply unit and immersing in the flux immersion unit, and bonding the flip chip bonding unit to the flip chip bonding unit, the bonding An image is taken for photographing a lower surface of the transfer unit to which the bonding head unit is mounted and the flip chip immersed in the flux immersion unit for transferring the head unit to a predetermined transfer path via the flip chip supply unit, the flux immersion unit and the flux bonding unit. A conveying diameter of the conveying part including a chip vision unit disposed in a direction and conveying the bonding head part; The furnace is a straight path, and the flip chip supply unit, the chip vision unit, the flux immersion unit and the flip chip bonding unit provide a flip chip bonding apparatus sequentially disposed below the transfer path.

In this case, the bonding head unit may be returned to the flip chip supply unit by the transfer unit after the pick-up process, immersion process and bonding process of a specific flip chip is performed along the transfer path of the transfer unit.

The bonding head unit may be lifted in a direction perpendicular to the transfer path at at least one of the flip chip supply unit, the flux immersion unit, the chip vision unit, and the flip chip bonding unit.

The chip vision unit may photograph an area of at least two points of the lower surface of the flip chip to be photographed.

Here, the chip vision unit may be displaceable in a direction perpendicular to the conveying direction of the conveying path by the conveying unit.

In this case, the flip chip immersed in the flux immersion unit may include a substrate vision unit disposed downward to photograph the substrate bonded.

In addition, the substrate vision unit may photograph an area of at least two or more points of a bonding area to which a specific flip chip of the substrate is to be bonded.

The substrate vision unit may be mounted to the transfer part so as to be displaceable in a direction parallel to the transfer direction of the transfer path of the bonding head part.

Here, the bonding head unit and the substrate vision unit may be independent driving and independent transfer.

In this case, the transfer path of the substrate vision unit may include a section that does not interfere with the transfer path of the bonding head unit.

In addition, the substrate vision unit may be mounted to the vision transfer unit provided in parallel with the transfer unit.

In addition, when interference occurs during the transfer of the bonding head portion, the substrate vision unit may be lifted and driven to avoid interference with the bonding head portion.

Here, the transfer path of the substrate vision unit by the vision transfer unit may be disposed parallel to or parallel to the transfer path of the bonding head unit by the transfer unit.

In this case, the length of the vision transfer unit may be shorter than the length of the transfer unit and the arrangement position on the transfer path may be different.

In addition, the flip chip supply unit may include an ejector that separates each flip chip from a wafer, and a flip unit that picks up the flip chip ejected by the ejector and rotates the bonding head unit to pick up the flip chip.

The pair of transfer parts may be provided in parallel with each other, and at least one bonding head part may be mounted on each of the transfer parts, and the pair of bonding head parts mounted at a corresponding position may alternate flip chips separated from one ejector. Can be picked up.

Here, a substrate vision unit for photographing a substrate mounted on a flip chip bonding unit is mounted to each transfer unit to bond the flip chip, and a transfer path of each substrate vision unit is mounted on each transfer unit. It may be parallel to the transfer path of the bonding head portion.

In this case, the bonding head portion is provided with a pair of one transfer portion, a pair of the bonding head portion is mounted to the independent transfer or independent transfer to the transfer portion, a pair of the bonding head portion is provided in the center portion of the transfer portion Flip chips may be bonded to the flip chip bonding units.

The substrate vision unit may further include a substrate vision unit for photographing the bottom surface of the flip chip, and the substrate vision unit may be mounted to the transfer unit between a pair of bonding heads.

The apparatus further includes a substrate vision unit for photographing the bottom surface of the flip chip, and the substrate vision unit may be mounted on a vision transfer unit provided in parallel with a transfer unit on which a pair of bonding heads are mounted.

Here, the transfer unit may be provided in pairs in parallel, at least one bonding head unit may be mounted on each transfer unit, and the bonding head unit mounted at a corresponding position may be immersed in one flux immersion unit.

In this case, the flip chip bonding unit may include a bonding table on which a substrate on which the flip chip is to be bonded is fixed to an upper surface, and the bonding table may be displaced in a direction perpendicular to the transfer direction of the bonding head unit.

In addition, the bonding head unit, the transfer unit, the flip chip bonding unit and the chip vision unit and the substrate vision unit to control, the bonding position of the flip chip through the image taken by the chip vision unit and the substrate vision unit It may provide a flip chip bonding apparatus including a control unit for modifying the.

 The control unit calculates an error of a position of the flip chip or the substrate from an image of the flip chip photographed by the chip vision unit and the substrate vision unit or the image of the substrate, and thus the bonding head unit or the flip chip bonding unit. It is possible to correct the flip chip bonding position by.

According to the flip chip bonding apparatus according to the present invention, the flip chip supplying part, the flux immersion part and the flip chip bonding part constituting the flip chip bonding device are disposed on the linear transfer path of the bonding head part by the transfer part, and the transfer path of the flip chip picked up. Since it can be minimized, flip chip bonding efficiency can be maximized.

In addition, according to the flip chip bonding apparatus according to the present invention, by simplifying the transfer path of the bonding head portion in the state of picking up the flip chip, it is possible to minimize the occurrence of the position error of the flip chip that may occur when the direction of the bonding head portion changes have.

Further, according to the flip chip bonding apparatus according to the present invention, the flip chip supply unit, the flux immersion unit and the flip chip bonding unit constituting the flip chip bonding apparatus are sequentially disposed on the transfer path to minimize unnecessary transfer process, and bonding The size of the device can be minimized.

In addition, according to the flip chip bonding apparatus according to the present invention, a substrate vision unit for photographing the bonding target substrate to determine the bonding position of the chip on the substrate mounted on the transfer unit for transferring the bonding head unit so that the drive means Can be simplified.

Further, according to the flip chip bonding apparatus according to the present invention, the bonding head portion and the substrate vision unit of the flip chip bonding apparatus according to the present invention are separately configured to be independently driven in the transfer portion, thereby reducing the weight of the bonding head portion, thereby improving bonding efficiency. At the same time, each process of the bonding head unit and the photographing operation of the substrate vision unit (a substrate to be bonded or a chip bonded) are separated, so that the bonding operation and the photographing of the bonding head unit can be performed in parallel so that the bonding process is more efficient. The effect can be improved.

In addition, according to the flip chip bonding apparatus according to the present invention, by providing a parallel transfer unit and sharing the sharable equipment, as necessary, it is possible to minimize unnecessary waste of the equipment can ensure the price competitiveness of the flip chip.

Figure 1 shows a plan view of one embodiment of a flip chip bonding apparatus according to the present invention.
Figure 2 shows a plan view of another embodiment of a flip chip bonding apparatus according to the present invention.
Figure 3 shows a plan view of another embodiment of a flip chip bonding apparatus according to the present invention.
Figure 4 shows a plan view of another embodiment of a flip chip bonding apparatus according to the present invention.
5 is a plan view of another embodiment of a flip chip bonding apparatus according to the present invention.
5 is a plan view of another embodiment of a flip chip bonding apparatus according to the present invention.
6 illustrates a transfer unit of the flip chip bonding apparatus according to the present invention.
Figure 7 shows a plan view of another embodiment of a flip chip bonding apparatus according to the present invention.
8 is a block diagram of a flip chip bonding apparatus according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.

1 shows a plan view of one embodiment of a flip chip bonding apparatus 1000 according to the present invention.

The present invention provides a flip chip supply unit 200 for separating and supplying each flip chip fc from a wafer w, and a flip chip supplied from the flip chip supply unit 200 to a flux. The flux immersion unit 400 to be immersed, the flip chip bonding unit 500 to which the flip chip is bonded on a substrate, and the flip chip supplied from the flip chip supply unit 200 to the flux immersion unit 400. After immersing in the bonding head portion 300 and the bonding head portion 300 to bond to the flip chip bonding portion 500, the flip chip supply portion 200, the flux immersion portion 400 and the flip chip bonding Provided is a flip chip bonding apparatus 1000 including a transfer unit 600 for transferring to the unit 500.

The flip chip bonding apparatus 1000 according to the present invention separates and picks up individual flip chips fc from each wafer w supplied from the wafer supply unit 100 so that a bonding surface on which a bump electrode (solder bump) is formed is downward. The operation of flipping the individual chips so as to be turned on may be performed.

The wafer supply unit 100 may wait for a work in a state in which a plurality of wafers w are stacked on the wafer onloader 110, and the wafers of the wafer supply unit 100 sequentially receive a flip chip supply unit ( 200).

The wafer supply unit 100 may include guide means 130 for guiding the wafer onloader 110 to the flip chip supply unit 200. The guide means 130 serves to guide the transfer of the wafer onloader 110 transferred by a separate driving means (not shown).

The flip chip supply unit 200 separates each flip chip fc from the wafer w supplied from the wafer supply unit 100 and provides it to the bonding head unit 300 to be described later.

The flip chip supply unit 200 may include an ejector 230 for ejecting each flip chip from a wafer w and an ejected flip chip fc that is priced and separated by the ejector 230. It may include a flip unit 210 to rotate to pick up (300).

The flip unit 210 may have a picker structure capable of a pick-up operation by adsorption and a rotation operation of inverting the upper and lower surfaces of the chip. The rotation direction of the flip unit 210 or the like may be variously modified.

The wafer onloader 110 has a structure for supporting each wafer with one surface of the wafer exposed.

The wafer w composed of a plurality of flip chips fc is in a state of being adhered with an adhesive tape on the bottom thereof. Each flip chip fc may be in a state in which a bottom surface of a bump electrode (solder bump) or a chip provided with a contact point upward.

Accordingly, the ejector 230 is disposed under the wafer, and each flip chip fc constituting the wafer w may be separated from the wafer w by the hit of the ejector 230. The separated flip chip fc may be rotated such that the bottom surface of the chip provided with the bump electrode (solder bump) or the contact point is downward by the flip unit 210 positioned on the wafer.

The flip chip fc rotated by the flip unit 210 may be picked up by the bonding head unit 300 waiting thereon.

Since the flip unit 210 picks up and rotates the chip, the bonding surface rotates downward so that the bonding surface faces downward, and the upper surface of the chip faces upward, so that the bonding head part 300 adsorbs the upper surface of the chip facing upward to bump electrodes. The pick-up state can be maintained so that the bottom surface of the chip exposed (solder bump) or the like faces downward.

The bonding head unit 300 may be transferred in a predetermined transfer section A by the transfer unit 600. The transfer unit 600 may transfer the bonding head unit 300 to the flux immersion unit 400 to be described later and the flip chip bonding unit 500 to be described later from the flip chip supply unit 200. The bonding head unit 300 may be driven to be returned to the flip chip supply unit by the transfer unit after a pickup process, an immersion process, and a bonding process of a specific flip chip are performed along the transfer path of the transfer unit 600.

In addition, the transfer unit 600 may transfer any one of the vision units constituting the vision unit described later in a direction parallel to the bonding head unit 300. Description thereof will be described later.

The transfer unit 600 transfers the bonding head unit 300, which picks up the flip chip from the flip chip supply unit 200, to the flux immersion unit 400.

The flux immersion unit 400 may provide a flux for bonding by the bottom surface of the flip chip is immersed.

The flux immersion unit 400 may include a flux receiver 410 in which flux is accommodated, and a flux blade 420 for planarizing the surface of the flux after flux immersion of the flip chip.

The bonding head 300 may be transferred to the flux receiver 410 by the transfer unit 600 while picking up the flip chip, and then the bonding head 300 may be lowered to perform an immersion process.

The bonding head unit 300 is perpendicular to the transfer path in at least one of the flip chip supply unit, the flux immersion unit 400, the chip vision unit 910, and the flip chip bonding unit 500. It can be configured to be elevated.

In the embodiment shown in Figure 1, the bonding head 300 may have a structure that can be elevated to enable the immersion of the lower surface of the flip chip when transferred to the flux immersion unit 400 by the transfer unit 600. .

The bonding head unit 300 has a structure capable of lifting in a direction perpendicular to the flip chip supply unit, the flux immersion unit, and the flip chip bonding unit, so that the transfer may be interrupted during each operation to perform each operation. have.

Of course, the transfer unit 600 on which the bonding head unit 300 is mounted may have a structure that can be elevated.

The bonding head 300 to which the flip chip on which the flux immersion is completed is adsorbed may be transferred in the direction of the flip chip bonding part 500 to be described later by the transfer part 600.

The flip chip is picked up, rotated, and picked up by the flip chip supply unit 200, and the bottom chip is immersed in the flux immersing unit 400. That is, even though each process is precisely controlled, since the physical position is continuously changed, the flip chip may be in a distorted or pushed-out state.

Since these physical errors cannot be completely prevented, it is necessary to correct or eliminate these errors in the bonding process. This is because bump electrodes (solder bumps) or contacts on the bottom surface of the flip chip are minute in size, and thus, even if the flip chip is slightly changed, accurate bonding cannot be guaranteed.

Accordingly, the flip chip bonding apparatus 1000 according to the present invention may include at least one vision unit for photographing the flip chip or the substrate to which the flip chip is bonded. The vision unit may include a vision unit for taking at least one image.

In the embodiment illustrated in FIG. 1, the vision unit may include a chip vision unit 910 disposed upward in order to photograph a lower surface of the flip chip immersed in the flux immersion unit 400.

In the flip chip bonding apparatus according to the present invention, an ejector 230 for separating each flip chip from a wafer, a bonding head 300 for picking up a flip chip separated from the ejector 230, and the bonding head 300 Chip vision unit 910 for photographing the bottom surface of the flip chip picked up and transported in the flux, a flux immersion unit 400 for immersing the flip chip photographed on the bottom surface in the chip vision unit 910, and the flux The flip chip immersed in the immersion unit 400 includes a flip chip bonding unit 500 bonded to the substrate, the transfer path of the bonding head 300 is a linear path, the chip vision unit 910, the The flux immersion unit 400 and the flip chip bonding unit may include a flip chip bonding apparatus sequentially disposed below the transfer path of the bonding head unit 300.

In the embodiment illustrated in FIG. 1, the chip vision unit 910 is a position where the flip chip passes through the flux immersion unit 400 by the bonding head unit 300 to photograph the bottom surface of the immersed flip chip. It is shown to be placed in.

However, the chip vision unit 910 may be disposed at a position for photographing the bottom surface of the flip chip before being immersed in the flux immersion unit 400. This is because the flip chip may cause a major error in its bonding position in the pickup process before the flux immersion process.

Therefore, in the embodiments described below with reference to FIG. 1, the chip vision unit 910 is illustrated and described as having the flux immersion unit 400 disposed rearward, but the chip vision unit 910 and the flux immersion unit 400 are described. If the position of the) is on the linear feed path of the bonding head 300, the position may be changed as necessary.

As illustrated in FIG. 1, the chip vision unit 910 may be disposed in an up-looking direction to photograph a lower surface of the flip chip immersed in the flux immersion unit 400.

In addition, the chip vision unit 910 may photograph at least two areas of the lower surface of the flip chip. It is also possible to determine the position of each flip chip from the image by taking one point (one shot), but it is possible to capture a more accurate image by capturing two or more areas.

In order to determine the degree of twisting (or rotation) together with the amount of displacement of the flip chip in a specific direction, it is necessary to photograph two or more areas.

In addition, the chip vision unit 910 may be configured to be displaceable in a direction perpendicular to the transfer direction (y-axis direction) of the bonding head unit 300 (x-axis direction). This is for photographing multiple points to minimize fine error according to the angle of view.

In the chip vision unit 910, the flip chip immersed in the flux is transferred to the flip chip bonding unit 500.

The flip chip bonding unit 500 may include a bonding table 510 for fixing and mounting the bonding target substrate bs transferred by the substrate onloader 1130.

The bonding table 510 may also be configured to be displaced in a direction perpendicular to the transfer direction of the bonding head 300 by the transfer unit 600.

As illustrated in FIG. 1, the bonding table 510 may be perpendicular to the conveying direction of the conveying part 600 precisely through the motor 550, the ball screw 570, the guide 530, and the like as an example of the driving means. Its position can be controlled in the direction.

Like the wafer onloader 110, the substrate onloader 1130 may be propelled and guided by a driving means (not shown) and a guide means 1110.

The bonding area sp on which the bonding target substrate bs is mounted is determined on the bonding table 510 in advance.

Each of the substrates bs should be accurately seated in each bonding region sp, but the substrate may be detached from the bonding region sp in the transfer process, or the substrate may be seated in the bonding region sp in a twisted state. The bonding region sp may be separated.

When each substrate leaves the respective bonding region sp, the accuracy of the bonding process of the flip chip immersed in the flux cannot be guaranteed, and a poor electrical connection may occur.

As described above, in order to reflect the positional deviation of the flip chip, which may be caused in the pick-up or immersion process of the flip chip, in the bonding process, the chip vision unit 910 is provided to photograph the bottom surface of the flip chip to flip the chip. Like collecting the position information of the, the flip chip bonding apparatus 1000 according to the present invention may be provided with a substrate vision unit 960 to accurately determine the mounting position of the substrate to be bonded (bs).

The substrate vision unit 960 is down-looking to photograph the substrate seated in the bonding area sp of the bonding table 510 to bond the flip chip immersed in the flux immersion unit 400. ) May be arranged.

The bonding table 510 bonds the flip head 300 by the transfer part 600 to bond each flip chip to a bonding position of each predetermined chip on a substrate seated in the bonding area sp. It may be configured to be displaced in a direction perpendicular to the conveying direction of the).

As illustrated in FIG. 1, the substrate vision unit 960 may be mounted on the transfer unit 600 to be transferred in a predetermined direction (y-axis direction) in a predetermined transfer section B, and the bonding table may be used. 510 may also be configured to be displaceable in a predetermined direction (x-axis direction).

Accordingly, the substrate vision unit 960 may move above all of the bonding target substrates bs mounted on the bonding table 510, and photograph the predetermined region of each substrate to bond the bonding region sp of each substrate. ) Relative position relative to the

Accordingly, the chip vision unit 910 captures an image for determining a position error of the flip chip to be bonded by capturing the bottom surface of the flip chip, and the substrate vision unit 960 is a bonding area (i) of the bonding table 510. An image for determining the position of the substrate, that is, the bonding position of the chip, in the mounted state of the substrate mounted on each sp) can be taken.

The flip chip bonding apparatus 1000 according to the present invention includes a vision unit 910 and / or 960 and an image of the chip or substrate photographed by the chip vision unit 910 and the substrate vision unit 960 constituting the vision unit The bonding head 300 or the flip chip bonding unit 500 may be compared or processed by the processing apparatus according to the comparison information or algorithm stored in the memory of the controller to generate a control signal for accurate bonding of each chip. To control.

Like the chip vision unit 910, the substrate vision unit 960 also accurately determines the bonding position of the chip on the substrate in the mounting state of the substrate mounted on the bonding area sp of the bonding table 510, respectively. At least two areas of each bonding area sp of the substrate may be photographed.

In addition, the substrate vision unit 960 may be used for photographing an image for determining that a defect has occurred in the bonding process by photographing a substrate on which bonding is completed, in addition to photographing a substrate to be bonded. In this case, it is possible to determine whether a defect occurs by determining the position of the chip with respect to the substrate. This is possible because the bonding head unit and the substrate vision unit are configured to enable independent driving and independent transfer.

As described above, when the bonding head unit and the substrate vision unit are configured to be driven independently, the photographing operation for alignment before flip chip bonding and the imaging operation for determining bonding defect after bonding are separated from the flip chip bonding operation. And in parallel, as a result, the bonding efficiency of the flip chip can be improved.

Based on the images captured by the chip vision unit 910 and the substrate vision unit 960, the controller of the flip chip bonding apparatus 1000 according to the present invention may be the bonding head unit 300 or the bonding table 510. The position of can be precisely controlled.

In this case, the horizontal position (x-axis direction) position deviation among the bonding positions of the flip chip may be corrected by displacing the bonding table 510, and the vertical position (y-axis direction) position deviation among the bonding positions may be modified by the bonding head unit 300. Can be modified by displacing. In addition, an error such as twisting (rotation) of the chip or the substrate can be eliminated by rotating the bonding head part so that the bonding head part can be rotated and the bonding direction (θ direction) of the chip is corrected.

In addition, the substrate vision unit 960 may be mounted on the transfer unit 600 on which the bonding head unit 300 is mounted so as to be displaced in a transfer direction parallel to the transfer direction of the bonding head unit 300.

In addition, when the substrate vision unit and the bonding head portion are mounted at different heights in the same transfer portion in the sense that the transfer paths are parallel in the present specification, the trajectories on the plane (xy plane) of the substrate vision unit and the bonding head portion may be substantially the same linear shape. The trajectory can be observed. In other words, it can be seen that the movement trajectory on the plane coincides with one transfer unit.

The bonding head unit 300 and the substrate vision unit 960 may be configured to enable independent driving and independent transfer. The bonding head unit 300 and the substrate vision unit 960 are mounted to the transfer unit 600, respectively, but the transfer unit 600 independently drives the bonding head unit 300 and the substrate vision unit 960. The driving direction may be a parallel direction (y axis direction).

Conventionally, a bonding apparatus having a structure in which a substrate vision unit is mounted on the bonding head portion is introduced to share a transfer means for transferring the bonding head and the substrate vision unit. There was a problem that the result of increasing, the bonding efficiency is lowered.

Therefore, the bonding head unit 300 and the substrate vision unit 960 of the flip chip bonding apparatus according to the present invention are separately configured to be independently driven in the transfer unit to reduce the weight of the bonding head unit 300 to increase the bonding efficiency. At the same time (reducing the cycle time for bonding each chip) and separating each process of the bonding head portion and the photographing operation of the substrate vision unit, the bonding head portion can be taken in parallel with the photographing operation to improve the efficiency of the bonding process. The effect can be obtained.

When the bonding head unit 300 and the substrate vision unit 960 are driven independently, each transfer path is preferably configured not to interfere or configured to avoid any one of them. This will be described later with reference to FIG. 6.

As shown in FIG. 1, according to the flip chip bonding apparatus 1000 according to the present invention, the flip chip supply unit 200, the flux immersion unit 400, and the flip chip bonding unit constituting the flip chip bonding apparatus 1000 may be used. Since the 500 is sequentially disposed below the linear transfer path of the bonding head part 300 by the transfer part 600, the transfer path of the picked up flip chip can be minimized, thereby maximizing flip chip bonding efficiency and flipping. By simplifying the transfer path of the bonding head unit 300 in the state of picking up the chip, it is possible to minimize the occurrence of the position error of the flip chip that may be caused by physical inertia when changing the direction of the bonding head unit 300, The unnecessary transfer process can be minimized, and the configuration of the bonding apparatus can be simplified and the size can be minimized.

This is because the flip chip supply unit 200, the flux immersion unit 400 and the flip chip bonding unit 500 are sequentially arranged on a straight line below the transfer path of the bonding head unit 300 by the transfer unit 600, thereby bonding the bonding head. Addition means that each operation is performed while sequentially moving on the flip chip supply unit 200, the flux immersion unit 400, and the flip chip bonding unit 500 without unnecessary retraction operation.

In addition, the substrate vision unit 960 for photographing the bonding target substrate and determining the bonding position of the chip on the substrate is mounted to the transfer unit 600 for transferring the bonding head unit 300 so as to be independently transported. It is possible to simplify the driving means for, and in the presence of the physical error of the transfer itself can be to be shared together.

2 is a plan view of another embodiment of a flip chip bonding apparatus 1000 according to the present invention. The description with reference to FIG. 1 will not be repeated.

Unlike the flip chip bonding apparatus 1000 illustrated in FIG. 1, the flip chip bonding apparatus 1000 according to the present invention illustrated in FIG. 2 is a bonding head unit 300 (1, 300 (2)) and a substrate vision unit ( 960 (1), 960 (2)) and transfer units 600 (1), 600 (2) are provided to face each other in pairs.

The flip chip bonding apparatus 1000 shown in FIG. 2 is provided with a pair of first and second transfer parts 600 (1) and 600 (2) in parallel, and each bonding head part 300 is provided at each transfer part. (1) and 300 (2), each of the flux immersion parts 400 and the chip vision units 910 (1) and 910 (2) may be provided.

Unlike the embodiment shown in FIG. 1, the embodiment shown in FIG. 2 is provided with a pair of first and second transfer parts 600 (1) and 600 (2), each of which has a bonding head portion ( 300 (1), 300 (2)) are provided.

As shown in FIG. 2, each of the bonding heads 300 (1) and 300 (2) shares an ejector 230 constituting the flip chip supply unit 200.

As described above, in the flip chip bonding process, the bonding head unit picks up the flip chip, immerses the flux immersion unit, and bonds the flip chip in the flip chip bonding unit. As a repetition, the ejector and the flip unit of the embodiment shown in FIG. 1 perform the operation of separating and flipping the flip chip from the wafer only when the bonding head part returns to the flip chip supply part 200.

That is, although the ejector 230 may perform the process of separating the flip chip from the wafer w more quickly, the ejector 230 maintains the standby state until the work of the bonding head parts 300 (1) and 300 (2) is completed and returned. It must be maintained.

Therefore, a pair of flip units 210 (1, 210 (2)) and a bonding head unit (a flip chip separated from one ejector 230 may be provided with bonding heads respectively provided in the transfer unit and each transfer unit). The working efficiency can be increased in such a way that 300 (1) and 300 (2) are picked up alternately.

When the pair of flip units 210 (1) and 210 (2) pick up the flip chip separated from one ejector 230 alternately, the transfer unit is provided in parallel with each other in pairs, and the pair of transfer units It can be applied in the embodiment shown in Fig. 2 and the like each having a bonding head portion provided.

In this case, the control unit of the flip chip bonding apparatus 1000 according to the present invention is that each bonding head portion 300 (1, 300 (2)) to each flip unit 210 (1, 210 (2)). By alternately performing the operation of receiving the flip chip, it is necessary to control the bonding head parts 300 (1) and 300 (2) to minimize the waiting time of the flip chip supply part 200.

In addition, the flip chip bonding apparatus 1000 shown in FIG. 2 shares the flip chip bonding unit 500. The bonding table 510 corresponds to the bonding process of each bonding head 300 (1, 300 (2)) according to the working state of each bonding head 300 (1), 300 (2) may be displaced in the x-axis direction.

In addition, the flip chip bonding apparatus 1000 according to the present invention shown in FIG. 2 has a structure in which the flux immersion unit 400 is also shared. This is because the size of the flux receiver 410 can be appropriately selected.

Flip chip bonding apparatus 1000 according to the present invention shown in Figure 2 is each chip vision unit (910 (1), 910 (2)) and each substrate vision unit (960 (1), 960 (2)) The bonding process may be performed by modifying the bonding positions of the flip chip and the chip on the bonding target substrate, which are respectively provided with reference to FIG. 1.

In addition, in the embodiment shown in Fig. 2, each bonding head portion 300 (1), 300 (2) is shown as sharing one flux immersion portion 400, but with each flux immersion portion. Thus, the immersion process of each of the bonding heads 300 (1) and 300 (2) may be performed.

According to the flip chip bonding apparatus 1000 according to the present invention shown in FIG. 2, the transfer unit may be provided in parallel as necessary and share the facilities that can be shared, thereby minimizing unnecessary waste of the equipment and at the same time waiting for a process such as an ejector. By minimizing time, the flip chip bonding efficiency can be maximized.

 3 is a plan view of another embodiment of a flip chip bonding apparatus 1000 according to the present invention. Descriptions duplicated with those described with reference to FIGS. 1 and 2 will be omitted.

1 and 2 relates to a flip chip bonding apparatus in which the number of bonding head portions provided in one transfer unit is one.

However, when a plurality of bonding heads 300 are provided in one transfer unit 600, the transfer facility constituting the transfer unit 600 may be shared.

Accordingly, the flip chip bonding apparatus 1000 illustrated in FIG. 3 (a) has flip chip supply units 200 (1) and 200 (2), respectively, and has first and second bondings to one transfer unit 600. The head parts 300 (1) and 300 (2) are provided to be capable of independent driving or independent transport, and are transferred in opposite directions and perform a flip chip bonding process.

Accordingly, as illustrated in FIG. 2A, the first and second chip vision units 910 are bonded to each of the first and second bonding heads 300 (1) and 300 (2). (1) and 920 (2).

3A, the flip chip bonding unit 500 and the substrate vision unit 960 may be shared. The substrate vision unit 960 is provided to photograph the substrate mounted on the flip chip bonding unit as described above.

Therefore, since the number of bonding heads for performing the flip chip bonding operation in one flip chip bonding unit 500 may be increased, the flip chip bonding efficiency may be increased.

In addition, since the substrate vision unit 960 can be shared, the overlap of manufacturing facilities can be minimized and the size of the facilities can be reduced.

The flip chip bonding apparatus 1000 according to the present invention shown in FIG. 3 (a) has two bonding head parts 300 (1) and 300 (1) in one transfer part 600 around the flip chip bonding part 500. 2)) approaches the flip chip bonding unit 500 and performs the steps necessary for the flip chip bonding process, thereby minimizing unnecessary copper wires, thereby maximizing work efficiency and sharing sharable configurations, thus the size of equipment. And the cost can be minimized.

The embodiment shown in FIG. 3 (b) is arranged in parallel with a pair of transfer parts 600 (1, 600 (2)), as in the embodiment shown in FIG. 2, and two bonding to each transfer part 600. A head part is provided.

A chip vision unit 910 (1) for photographing the bottom surface of the flip chip immersed on the movement paths of the respective bonding head portions 300 (1), 300 (2), 300 (3), and 300 (4), 910 (2), 910 (3), and 910 (4) are disposed under the transfer path of the flip chip, as in the above-described embodiments.

Since precise photographing is required, the chip vision units 910 (1), 910 (2), and 910 (corresponding to the respective bonding head parts 300 (1), 300 (2), 300 (3), and 300 (4)) may be used. 3), 910 (4).

As described above, the transfer unit 600 is provided with a pair in parallel. As described above, the flip chip bonding operation is performed by increasing the efficiency in the flip chip separation process and the pick up process by the ejectors 230 (1) and 230 (2). It is possible to increase the efficiency of, and having two bonding head portion in one transfer portion as described with reference to Figure 3 (a), can minimize the unnecessary copper wire during the transfer process and share the process equipment, The bonding efficiency may be maximized by increasing the number of bonding head parts 300.

In this case, the flux dipping operation of the two bonding head portions mounted at the opposite corresponding positions approaching in parallel directions can be performed in one flux dipping portion 400 (1), 400 (2), and the same conveying portion The substrate vision units 960 (1) and 960 (2) for photographing the bonding target substrate for bonding the flip chip conveyed by (600 (1) and 600 (2)) may be shared.

Of course, the system may be configured such that the flux immersion portion is separately provided at a position corresponding to each bonding head portion.

Process efficiency obtained by sharing the ejector of the flip chip supply unit by providing the transfer unit in parallel is common to the embodiment described with reference to FIG. 2.

In summary, the effects of the increase in process efficiency and the parallel arrangement of the transfer unit are obtained by providing two bonding heads in the same transfer unit, which is an advantage of the embodiment described with reference to FIGS. 2 and 3 (a). Synergy may be generated through the flip chip bonding apparatus shown in FIG.

As shown in FIG. 3, as necessary, a pair of transfer units 600 (1) and 600 (2) may be provided in parallel, and at least one of each transfer unit 600 (1) and 600 (2). The above (for example, two) bonding head portions may be mounted to improve the efficiency of the bonding operation. In addition, the opposite bonding heads mounted at the corresponding positions of each transfer unit may be immersed in one flux immersion unit, and the substrate vision for photographing the substrate to which the bonding head unit 300 mounted on each transfer unit is to be bonded. Unit 960 can be shared, thus reducing the size of the installation and preventing waste.

4 is a plan view of another embodiment of a flip chip bonding apparatus 1000 according to the present invention. The description with reference to Figs. 1 to 3 will be omitted.

Unlike the embodiment illustrated in FIG. 3, the embodiment illustrated in FIG. 4 includes a pair of flip chip bonding units 500 (1) and 500 (2). That is, the flip chips picked up and bonded by a pair of bonding head units provided in one transfer unit may be bonded to flip chip bonding units provided at short distances.

If the transfer efficiency of the flip chip is increased, there is an effect that can prevent the process delay caused by the frequent supply of the substrate.

In addition, each of the flip chip bonding units 500 (1) and 500 (2) may have respective bonding tables, and each bonding table may be driven independently.

Substrate onloaders 1130 (1) and 1130 (2) for supplying substrates to the respective bonding tables are driven (not shown) and guide means 1110 (1) and 1110 (2) as in the above-described embodiments. Can be propelled and guided.

In the embodiment shown in FIG. 4A, two wafer supply parts 100 (1) and 100 (2) are provided with two bonding head parts 300 (1) and 300 (2) in one transfer part 600. From each wafer supplied from)), the flip chip provided from each flip chip supply unit 200 (1, 200 (2)) is picked up, and at each flux immersion unit 400 (1, 400 (2)). After immersion, it may be bonded to a substrate mounted on any one of the flip chip bonding units 500 (1) and 500 (2).

In the flip chip bonding apparatus 1000 illustrated in FIG. 4A, one substrate vision unit 960 is provided in one transfer unit 600. Therefore, when the bonding target substrate bs is mounted on the bonding table 510 of the specific flip chip bonding unit 500, the substrate vision unit 960 is transferred by the transfer unit 600 and bonded to the bonding target substrate bs. Photographing may determine the bonding position of the chip on the bonding target substrate (bs). Even if two flip chip bonding units are provided, they are provided in adjacent positions so that accurate photographing is possible with one substrate vision unit.

In addition, as described above, the interference between the substrate vision unit 960 and the bonding head 300 may be avoided by a method of arranging the height of the transfer path differently.

4 (b) shows a case in which a pair of transfer units 600 is provided, unlike the embodiment shown in FIG. 4 (a). Accordingly, the ejectors 230 (1) and 230 (2) of the first and second flip chip supply units 200 (1) and 200 (2) minimize the work delay and are provided in the respective transfer units 600. More flip chips may be supplied to the first to fourth bonding head portions 300 (1), 300 (2), 300 (3), and 300 (4).

5 illustrates another embodiment of a flip chip bonding apparatus 1000 according to the present invention. Descriptions duplicated with those described with reference to FIGS. 1 through 4 will be omitted.

The flip chip bonding apparatus 1000 shown in FIG. 5 (a) is flipped from wafers supplied from the first to fourth wafer supply units 100 (1), 100 (2), 100 (3), and 100 (4). First to fourth bonding head portions 300 (1), 300 (2), 300 (3), and 300 (4) are provided for picking up and bonding the chips, and each of the bonding head portions is first of two. And second transfer units 600 (1) and 600 (2).

In addition, the ejectors 230 (1), 230 (2), and 230 (which constitute the first to fourth flip chip supply units 200 (1), 200 (2), 200 (3), and 200 (4)). 3) and 230 (4)) are provided independently of each other.

First to fourth flux immersion portions ((1) for immersing the flip chips picked up by the respective first to fourth bonding head portions 300 (1), 300 (2), 300 (3), and 300 (4). 400 (1), 400 (2), 400 (3) and 400 (4), the first to fourth chip vision unit (9100 (1), for photographing the lower surface of the flip chip immersed in the flux, 910 (2), 910 (3), and 910 (4).

The first transfer unit 600 (1) and the second transfer unit 600 (2) respectively include first and second substrate vision units 960 (1) and 960 (2) in the center thereof. The first and second substrate vision units 960 (1) and 960 (2) photograph the bonding target substrates mounted on the first and second flip chip bonding units 500 (1) and 500 (2).

The first and second flip chip bonding units 500 (1) and 500 (2) are provided with bonding tables 510 (1) and 510 (2), respectively. Guide rails for conveying can be shared.

5 (b) is different from the embodiment shown in FIG. 5 (a), the first to fourth bonding heads 300 (1), 300 (2), 300 (3), and 300 ( The first to fourth flip chip bonding units 500 (1), 500 (2), 500 (3), and 500 (4) are provided to correspond to 4)).

The first and fourth flip chip bonding portions 500 (1) and 500 (4) share a first guide rail, and the second and third flip chip bonding portions 500 (2) and 500 (3) The wafer is fed through the second guide rail.

The flip chip bonding apparatus 1000 shown in FIG. 5B also includes a substrate vision unit 960 for photographing a substrate to be bonded, and the substrate vision unit is centered on the first and second transfer units 600. A first substrate vision unit 960 (1) and a second substrate vision unit 960 (2) are provided to respectively include the first substrate vision unit 960 (1), and the first substrate vision unit 960 (1) has a first flip and a second flip. The substrate mounted on the chip bonding units 500 (1) and 500 (2) is photographed, and the second substrate vision unit 960 (2) includes the third and fourth flip chip bonding units 500 (3) and 500. The substrate mounted on (4)) can be photographed in the same manner as in the embodiment shown in FIG.

6 is a side view of the transfer unit 600 of the flip chip bonding apparatus 1000 according to the present invention. Specifically, FIG. 6A illustrates an example of a transfer unit 600 having one bonding head unit 300 and one substrate vision unit 960 in one transfer unit 600, and FIG. 6B. And FIG. 6 (c) shows an example of a transfer part 600 having a pair of bonding head parts 300 (1, 300 (2)) and a substrate vision unit 960 in one transfer part 600. Illustrated.

The flip chip bonding apparatus 1000 according to the present invention picks up the flip chip supplied from the flip chip supply unit 200 to pass through the flux immersion unit 400, the chip vision unit 910, and the flip chip bonding unit 500. The bonding head unit 300 transfers and bonds the flip chip to the substrate mounted on the flip chip bonding unit 500.

The transfer unit 600 is a means for transferring the bonding head unit 300 and the substrate vision unit 960 in a transfer direction. As described above, the bonding head 300 and the substrate vision unit 960 should be able to be driven independently, so that the transfer unit 600 is the bonding head 300 and the substrate vision unit 960. It may be provided with a drive means for driving independently.

In the embodiment illustrated in FIG. 6, the driving motor 305, the ball screw 303, the guide rail 301, and the like are respectively driven to independently drive the bonding head unit 300 and the substrate vision unit 960. It can be provided. Of course, the drive unit is not limited to this and can be replaced in various ways.

Therefore, the bonding head 300 may be conveyed along a predetermined conveying direction.

The substrate vision unit 960 may also be transported along a transport direction of the transfer unit 600 to photograph an area of at least two points or more of the substrate mounted on the flip chip bonding unit 500.

Accordingly, the transfer unit 600 includes driving means for displacing the substrate vision unit 960 along the transfer direction, and the driving means includes a driving motor 965 and a ball screw 963 as shown in FIG. 6. ), A guide rail 961 and the like can be provided.

Transfer paths of the bonding head unit 300 and the substrate vision unit 960 may be provided at different heights to avoid interference between the transfer paths of the bonding head unit 300 and the chip vision unit 910. have. In this case, the transfer path of the bonding head 300 may be disposed at a lower position in consideration of the pickup process or the bonding process of the bonding head 300. However, increasing the height of the installation has real difficulties.

In this case, a method of avoiding the bonding head 300 and the substrate vision unit 960 may be possible to avoid interference. It will be described later with reference to Fig. 6 (a) and 6 (b).

In addition, even when the bonding head 300 and the substrate vision unit 960 are independently driven by the transfer unit 600, the bonding head 300 and the substrate vision unit 960 are transferred. The path may include interfering sections. For example, when interference between the bonding head unit 300 and the substrate vision unit 960 occurs, such as when the transfer path is disposed at a similar height, the bonding head unit 300 and the substrate vision unit are generated. Any one of 960 may avoid the operation in the direction perpendicular to the conveying direction by the conveying unit 600. It will be described later with reference to Figure 6 (c).

In addition, the bonding head 300 and the substrate vision unit 960, respectively, the transfer range is distinguished. Since the substrate vision unit 960 is provided to photograph a bonding target substrate mounted on the flip chip bonding unit 500, the substrate vision unit 960 does not require a wide range of transfer range, such as a flip chip bonding unit.

However, even if there is a large or small transfer range, the above-described interference problem may occur when the transfer range overlaps.

In the embodiment shown in Figure 6 (a), the transfer section of the bonding head unit 300 and the substrate vision unit 960 by the transfer unit 600 is a section A and B section, respectively, the substrate vision unit The section B, which is the transfer section of 960, may be divided into the section B1, which is a transfer section that does not overlap with the section B2, which is an overlapping transfer section, which is a section overlapping with the section A, which is the transfer section of the bonding head unit 300.

Therefore, the substrate vision unit 960 may control the substrate vision unit 960 to avoid the overlapping transfer section B1 when interference is expected in the transfer process of the bonding head unit 300.

The flip chip bonding process is repeatedly performed for each flip chip, but since the substrate photographing process for acquiring an image for determining a substrate position error may have a frequency lower than that of the bonding process, the substrate vision unit 960 performs the bonding. In order to avoid interference with the head unit 300 may be transferred to a non-overlapping transfer section B1.

The embodiment shown in FIG. 6 (b) is similar to the embodiment shown in FIG. 6 (a), wherein the first and second bonding head portions 300 (1) and 300 (2) by the transfer part 600 are provided. ) And the transfer section of the substrate vision unit 960 are section A, section C and section B, respectively, section B, which is a section of transfer of the substrate vision unit 960, is a section of transfer of the first bonding head unit 300. It may be partitioned into a B3 section, which is a transport section that does not overlap with a B1 + B2 section, which is an overlapping transport section, which is a section overlapping with a section A. In addition, the section B, which is the transfer section of the substrate vision unit 960 in the relationship with the second bonding head unit 300, is an overlapping transfer section that is a section overlapping the section C, which is the transfer section of the second bonding head unit 300. It may be partitioned into a section B1 which is a transport section that does not overlap with the section B2 + B3.

Therefore, in the embodiment shown in FIG. 6 (b), if the substrate vision unit 960 interferes with the first bonding head 300, it avoids the section B3 and the substrate vision unit 960. If interference occurs with the second bonding head 300, it can be avoided in the B1 section.

6 (c) shows a case in which one substrate vision unit 960 and two bonding head parts 300 (1, 300 (2)) are provided in the transfer part 600.

6 (c) is different from the embodiment of FIG. 6 (a) or 6 (b), the transfer section B of the substrate vision unit 960 is the first bonding head portion 300 (1). It is included in section A, which is a transfer section of)), and the transfer section B of the substrate vision unit 960 may also be included in section C, which is a transfer section of the second bonding head unit 300 (2). That is, when the substrate vision unit 960 does not secure a non-overlapping transfer section for avoiding interference when transferring the specific bonding head unit 300.

Therefore, when it is not possible to secure a non-overlapping transfer section as shown in FIG. 6C, the substrate vision unit 960 may be configured to be liftable so that the substrate vision unit 960 may be interfered with the bonding head 300. The method of elevating can be used.

If the length of the transfer unit 600 and the respective driving means can be sufficiently secured, as shown in Figs. 6 (a) and 6 (b), the substrate vision unit 960 is avoided in a non-overlapping section. If the length of the transfer unit 600 and each driving means cannot be secured, the substrate vision unit 960 is lifted and lowered (z-axis direction) as shown in FIG. 6 (c). ), Physical interference between the substrate vision unit 960 and the bonding head 300 may be avoided.

Figure 7 shows a plan view of another embodiment of a flip chip bonding apparatus according to the present invention. Descriptions duplicated with those described with reference to FIGS. 1 through 6 will be omitted and will be described based on differences.

In the embodiment illustrated in FIG. 7, the substrate vision unit 960 for photographing a substrate mounted on the flip chip bonding unit 500 and to which the flip chip is bonded is different from the above-described embodiments. ) Is mounted to the vision transfer unit 600b provided separately from the transfer unit 600a.

The substrate vision unit 960 may be provided in the vision transfer unit 600b provided in parallel with the transfer unit 600a provided for the transfer of the bonding head unit 300.

The transfer path of the substrate vision unit 960 by the vision transfer unit 600b may be parallel to or parallel to the transfer path of the bonding head unit by the transfer unit. An example in which the transfer path of the substrate vision unit 960 by the vision transfer part 600b is parallel to the transfer path of the bonding head part by the transfer part means that the transfer path is arranged to have a height difference. By the height difference, interference avoidance between the substrate vision unit 960 and the bonding head 300 may be easy.

The length of the vision transfer unit 600b may be shorter than the length of the transfer unit 600a and the arrangement positions on the transfer path may be different from each other.

Therefore, since the respective transfer paths may include sections which do not overlap along the transfer direction, the transfer path of the substrate vision unit 960 by the vision transfer unit 600b is the bonding head by the transfer unit 600a. Even if the transfer path of the unit 300 is disposed on the same straight line, interference between the substrate vision unit 960 and the bonding head unit 300 may be avoided.

In detail, in the embodiment shown in FIG. 7, the vision transfer part 600b may be disposed at a position parallel to and spaced apart from the transfer part 600a on which the bonding head part 300 is mounted, and the transfer path is in a transfer direction. It can be seen that it can include each section that does not overlap in the vertical direction with.

As described above, the length of the vision transfer unit 600b may be shorter than the length of the transfer unit 600a, and the vision transfer unit 600b may be in a predetermined direction (y-axis direction) near the flip chip bonding unit. Transfer may be possible in the predetermined transfer range (B).

In addition, in the embodiment illustrated in FIG. 7, only one bonding head unit 300 is provided in the transfer unit 600a, but in the embodiment illustrated in FIG. 7, FIG. 3 (a) or 4 ( Like the embodiment illustrated in a), the transfer part 600a may include a plurality of bonding heads.

Therefore, the substrate vision unit 960 may be mounted on the vision transfer unit provided in parallel with the transfer unit on which the pair of bonding heads are mounted.

In this case, the substrate vision unit 960 included in the vision transfer unit 600b may be shared to photograph the position of the substrate to be bonded by each bonding head unit. In this case, one or a pair of flip chip bonding units 500 may be provided such that bonding operations by the respective bonding units are performed.

8 is a block diagram of a flip chip bonding apparatus 1000 according to the present invention. In the flip chip bonding apparatus 1000 according to the present invention, a bonding head 300 and a bonding head 300 are mounted to pick up, transport and bond flip chips, and the bonding head 300 is predetermined. A vision unit 900 having a transfer unit 600 for transferring the transfer path, at least one vision unit for photographing a flip chip picked up by the transfer unit 600 or a substrate to be bonded to the flip chip, The flip chip bonding unit 500, the bonding head unit 300, the transfer unit 600, and the vision unit 900, on which the substrate to be bonded is mounted, are controlled, and the flip chip is controlled by an image photographed by the vision unit. Provides a flip chip bonding device including a control unit 800 for correcting the error of the bonding position of the.

The vision unit 900 may be understood as a concept including at least one of the chip vision unit 910 and the substrate vision unit 960.

Here, the chip vision unit 910 constituting the vision unit and the image of the chip or substrate photographed by the substrate vision unit 960 is the processing unit 810 of the controller by comparison information or algorithm stored in the memory 860 of the controller. By comparing or processing in the above to generate a control signal for the accurate bonding of each chip can control the bonding head 300, flip chip bonding 500, and the like precisely.

Examples of the control signal may be a distance, angle, or direction to be corrected in the bonding process according to the positional error and the direction error of the picked up flip chip or the mounted substrate.

In addition, the flip chip bonding apparatus 1000 according to the present invention carries out the wafer supply unit 100, the flip chip supply unit 200, the flux immersion unit 400, the flip chip bonding unit 500, and the bonded substrate. The substrate carrying unit 700 may be further provided, and each component may receive a control signal transmitted from the controller 800 of the flip chip bonding apparatus and at the same time feed back the state information of each component. The bonding process can be continued without predetermined interference or interruption.

Therefore, each component should be understood as a concept including a sensor and a driving unit, each of which is required. The sensing information or state information provided from each component is stored or updated in the memory 860 of the controller to process the controller. The device 810 generates a new control signal.

While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. . It is therefore to be understood that the modified embodiments are included in the technical scope of the present invention if they basically include elements of the claims of the present invention.

1000: flip chip bonding apparatus 100: wafer supply unit
200: flip chip supply unit 300: bonding head portion
400: flux immersion unit 500: flip chip bonding unit
600: transfer unit 800: control unit
900: Vision Division

Claims (25)

A flip chip supply unit for separating and supplying each flip chip from the wafer;
A flux immersion unit in which a lower surface of the flip chip supplied from the flip chip supply unit is immersed;
A flip chip bonding unit in which the flip chip immersed in the flux immersion unit is bonded to a bonding target substrate;
A bonding head unit which picks up a flip chip supplied from the flip chip supply unit and immerses the flip chip in the flux immersion unit and bonds the flip chip bonding unit to the flip chip bonding unit;
A transfer unit to which the bonding head unit is mounted to transfer the bonding head unit to a predetermined transfer path via the flip chip supply unit, the flux immersion unit, and the flux bonding unit; And
And a chip vision unit disposed upward to photograph the lower surface of the flip chip immersed in the flux immersion unit.
The transfer path of the transfer unit for transferring the bonding head portion is a straight path, the flip chip supply unit, the flux immersion unit, the chip vision unit and the flip chip bonding unit is disposed sequentially below the transfer path. A flip chip supply unit for separating and supplying each flip chip from the wafer;
A flux immersion unit in which a lower surface of the flip chip supplied from the flip chip supply unit is immersed;
A flip chip bonding unit in which the flip chip immersed in the flux immersion unit is bonded to a bonding target substrate;
A bonding head unit which picks up a flip chip supplied from the flip chip supply unit and immerses the flip chip in the flux immersion unit and bonds the flip chip bonding unit to the flip chip bonding unit;
A transfer unit to which the bonding head unit is mounted to transfer the bonding head unit to a predetermined transfer path via the flip chip supply unit, the flux immersion unit, and the flux bonding unit; And
And a chip vision unit disposed upward to photograph the lower surface of the flip chip immersed in the flux immersion unit.
The transfer path of the transfer unit for transferring the bonding head portion is a straight path, the flip chip supply unit, the chip vision unit, the flux immersion unit and the flip chip bonding unit is disposed sequentially below the transfer path. 3. The method according to claim 1 or 2,
And the bonding head unit is returned to the flip chip supply unit by the transfer unit after a pickup process, an immersion process and a bonding process of a specific flip chip are performed along the transfer path of the transfer unit. 3. The method according to claim 1 or 2,
And the chip vision unit captures at least two or more areas of the lower surface of the flip chip to be photographed. 5. The method of claim 4,
And the chip vision unit is displaceable in a direction perpendicular to the conveying direction of the conveying path by the conveying unit. 3. The method according to claim 1 or 2,
And a substrate vision unit disposed downward to photograph the substrate on which the flip chip immersed in the flux immersion unit is bonded. The method according to claim 6,
And the substrate vision unit photographs at least two or more points of a bonding region to which a specific flip chip of the substrate is to be bonded. The method according to claim 6,
And the substrate vision unit is mounted to the transfer unit to be displaceable in a direction parallel to a transfer direction of the transfer path of the bonding head unit. 9. The method of claim 8,
And the bonding head unit and the substrate vision unit are capable of independent driving and independent transfer. 10. The method of claim 9,
And a transfer path of the substrate vision unit includes a section that does not interfere with the transfer path of the bonding head unit. 10. The method of claim 9,
And when the interference occurs during the transfer of the bonding head portion, the substrate vision unit is driven up and down so as to avoid interference with the bonding head portion. The method according to claim 6,
And the substrate vision unit is mounted to a vision transfer unit provided in parallel with the transfer unit. The method of claim 12,
And the transfer path of the substrate vision unit by the vision transfer unit is parallel to or parallel to the transfer path of the bonding head unit by the transfer unit. The method of claim 13,
The length of the vision transfer portion is shorter than the length of the transfer portion flip chip bonding apparatus, characterized in that the arrangement position on the transfer path is different. 3. The method according to claim 1 or 2,
And the flip chip supplying unit comprises an ejector for separating each flip chip from a wafer, and a flip unit for picking up the flip chip ejected by the ejector and rotating the picking head unit to pick up the flip chip. 16. The method of claim 15,
The transfer unit is provided in pairs in parallel, and each of the transfer units is equipped with at least one bonding head unit, and the pair of bonding head units mounted at corresponding positions alternately pick up flip chips separated from one ejector. Flip chip bonding apparatus, characterized in that. 17. The method of claim 16,
In order to bond the flip chip, a substrate vision unit for photographing a substrate mounted on a flip chip bonding unit is mounted to each transfer unit, and a transfer path of each of the substrate vision units is bonded to each of the bonds mounted on each transfer unit. Flip chip bonding device characterized in that parallel to the feed path of the head portion. 3. The method according to claim 1 or 2,
The bonding head portion is provided with a pair of one transfer portion, a pair of the bonding head portion is mounted to enable the independent drive or independent transfer to the transfer portion, a pair of the bonding head portion is a flip chip provided in the center region of the transfer portion Flip chip bonding apparatus for bonding each of the flip chip in the bonding portion. 19. The method of claim 18,
And a substrate vision unit for photographing the bottom surface of the flip chip, wherein the substrate vision unit is mounted to the transfer unit between a pair of bonding heads. 19. The method of claim 18,
And a substrate vision unit for photographing the substrate to which the flip chip is bonded, wherein the substrate vision unit is mounted to a vision transfer unit provided in parallel with a transfer unit to which a pair of bonding heads are mounted. Device. 3. The method according to claim 1 or 2,
A pair of the transfer part is provided in parallel, each of the at least one bonding head portion is mounted to each of the transfer portion, the bonding head portion mounted to the corresponding position is flip chip bonding, characterized in that immersed in one flux immersion portion Device. 3. The method according to claim 1 or 2,
And the flip chip bonding unit includes a bonding table on which a substrate on which the flip chip is to be bonded is fixed to an upper surface, and the bonding table may be displaced in a direction perpendicular to a transfer direction of the bonding head unit. The method according to claim 6,
Controls the bonding head unit, the transfer unit, the flip chip bonding unit, the chip vision unit, and the substrate vision unit, and corrects the bonding position of the flip chip through an image photographed by the chip vision unit and the substrate vision unit. Flip chip bonding apparatus further comprises a control unit. 24. The method of claim 23,
The control unit calculates an error of a position of the flip chip or the substrate from an image of the flip chip photographed by the chip vision unit and the substrate vision unit or the image of the substrate, and thus the bonding head unit or the flip chip bonding unit. Flip chip bonding device characterized in that for correcting the error of the flip chip bonding position. 3. The method according to claim 1 or 2,
And the bonding head unit is capable of lifting in a direction perpendicular to the transfer path at at least one of the flip chip supply unit, the flux immersion unit, the chip vision unit, and the flip chip bonding unit.

Images