CN105977184A - Bonding apparatus and bonding method - Google Patents
Bonding apparatus and bonding method Download PDFInfo
- Publication number
- CN105977184A CN105977184A CN201610122439.0A CN201610122439A CN105977184A CN 105977184 A CN105977184 A CN 105977184A CN 201610122439 A CN201610122439 A CN 201610122439A CN 105977184 A CN105977184 A CN 105977184A
- Authority
- CN
- China
- Prior art keywords
- nude film
- reference mark
- mounting position
- camera
- microscope carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 30
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 238000012937 correction Methods 0.000 claims description 27
- 230000000007 visual effect Effects 0.000 claims description 24
- 238000012546 transfer Methods 0.000 claims description 23
- 238000012360 testing method Methods 0.000 claims description 16
- 238000001514 detection method Methods 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 10
- 238000009434 installation Methods 0.000 description 63
- 230000036544 posture Effects 0.000 description 58
- 239000000758 substrate Substances 0.000 description 17
- 230000008569 process Effects 0.000 description 10
- 238000002372 labelling Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000013139 quantization Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000006399 behavior Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a bonding device (bare chip bonder) and a bonding method, the device and the method can correct the posture offset between a camera for picking up and a camera for mounting, and the position precision is high in mounting position. In the device and the method, a bonding head comprising a standard mark on the offset center position of an adsorber for adsorbing and holding a bare chip is adopted to adsorb and hold the bare head and make the bare chip to bond to the mounting position, respective shooting mechanisms are adopted to shoot standard marks on the adsorbing and holding position and mounting position, the position offset and the rotation angle offset of the respective shooting mechanisms relative to the bonding head based on the respective shooting results, and the third rotatio angle offset is at least corrected in the third position offset and the third rotatio angle offset of the bonding head relative to the above mounting position based on the respective shooting results.
Description
Technical field
The present invention relates to engagement device and joint method, particularly relating to can be in the peace engaging nude film
Engagement device and the joint method of positioning precision is improved on holding position.
Background technology
By nude film (Die；Semiconductor chip) it is mounted in wiring board or lead frame etc.
Having following bonding process in a part for the operation carrying out assembled package body on substrate, it is from crystalline substance
Circle (wafer) absorption nude film, and nude film be directly placed on substrate or be placed on centre temporarily
On microscope carrier, and engaging head is utilized to install.
As such engagement device, there is patent document 1.Patent document 1 discloses
Following technology: in order to prevent the reduction of re-quantization the caused positioning precision because of engaging head, and
The rotary shaft causing re-quantization engaging head is not set on engaging head, and by accurate microscope carrier
(precision-stage；Middle microscope carrier) on the rotation of section (nude film) revise joint and carry
Position (angle) skew in the direction of rotation of the substrate on platform.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2000-252303 publication
On the other hand, according to the small-sized of current packaging body and slimming, the slimming band of nude film
The development of lamination techniques of chip on chip (stacked die) come, for nude film joint and
Need the location of tightened up μm level.
Accordingly, there exist only as patent document 1 by engaging the rotation of the substrate on microscope carrier
The correction of skew cannot obtain sufficient positioning precision, and following posture skew can be to nude film to peace
The positioning precision of holding position brings impact to become problem, this posture skew be pickup nude film time to by
The posture of the nude film that position and the anglec of rotation specify carries out pickup camera and the joint nude film shot
Time shooting installation site installation camera between relative to engaging head posture offset.
Summary of the invention
The present invention researches and develops in view of above-mentioned problem, it is provided that a kind of engagement device and joint side
Method, it revises the posture skew between pickup camera and installation camera, determining in installation site
Position precision is high.
The present invention is for achieving the above object, it is provided that a kind of engagement device, has: pickup camera
Structure, it has the first shooting visual field；Mounting position photographic unit, it has can shoot nude film
Mounting position second shooting the visual field；Nude film transfer instrument, it can pick up the first shooting and regard
Nude film is also positioned on the mounting position in the second shooting visual field by nude film in open country, and when pick up
Can photograph in the first shooting visual field and when nude film being positioned in mounting position when taking nude film
On the position that can photograph in the second shooting visual field time upper, there is reference mark；Can be
The first testing agency of reference mark is detected in the one shooting visual field；The visual field can be shot second
The second testing agency of reference mark inside detected；And correction mechanism, it can be based on the first inspection
Survey mechanism and the result of the second testing agency, revise the nude film that nude film transfer instrument kept
Mounting place.
Here, nude film transfer instrument except include engage nude film engaging head in addition to, also comprise from
The pick-up head of wafer nude film, between middle microscope carrier and other arbitrary site mobile nude film
Head mechanism.
It addition, pickup photographic unit comprise the photographic unit in the case of wafer nude film,
Photographic unit when pickup is positioned in the nude film on middle microscope carrier, to pick up other from holding instrument naked
Photographic unit etc. in the case of sheet, inventionbriefly comprises and can shoot when picking up nude film
Photographic unit.It addition, mounting position photographic unit includes being positioned in by nude film on middle microscope carrier
In the case of photographic unit, nude film is positioned on substrate in the case of photographic unit etc.
The photographic unit shot is carried out when being positioned in by nude film on the object part of transfer nude film.
It addition, mounting nude film is in addition to including being placed in nude film the situation in object place, also wrap
Include any situation engaging behavior of interim crimping or formal crimping etc..
It addition, correction mechanism is not limited to be based only upon the correction of nude film transfer instrument, as long as can
The correction mechanism that the mounting place of the nude film that nude film transfer instrument is kept is modified,
As described below, as modification method, it is also possible to by revise nude film transfer instrument position and/
Or angle revises the mounting place of nude film, it is also possible to by the middle of revising microscope carrier position and/
Or angle revises the mounting place of nude film, in addition, as long as inventionbriefly can revise
The correction mechanism in the mounting place of nude film.
It addition, can be in the present invention, the first testing agency or the second testing agency can
Detection is when transfer instrument is in the movement moved to the mounting position of nude film from the take-off location of nude film
The reference mark obtained during planar movement on direction or on direction orthogonal to the moving direction
Track.
And, can be that reference mark is to be located on transfer instrument via having in the present invention
2 prisms optical system and can be by pickup photographic unit or mounting position photographic unit
The reference mark photographed.
It addition, can be in the present invention, correction mechanism can make middle microscope carrier rotation carry out
Revising, this middle microscope carrier can rotate in the face that the mounting surface relevant to mounting position is parallel.
And, can be in the present invention, there is mechanism for picking, it can overturn nude film, and
And can rotate in the face parallel with the mounting surface with mounting position, correction mechanism makes pickup
Mechanism rotates and is modified.
It addition, the present invention provides a kind of joint method, have:
The reference mark that detection is photographed by pickup photographic unit, nude film transfer instrument is had
The first detecting step；
Detect the second detecting step of the reference mark photographed by mounting position photographic unit；With
Testing result based on the first detecting step and the second detecting step revises nude film transfer
The correction step in the mounting place of the nude film that instrument is kept.
And, can be that the first detecting step or the second detecting step are bases in the present invention
In when nude film transfer instrument is in the shifting moved to the mounting position of nude film from the take-off location of nude film
The described base obtained during planar movement on dynamic direction or on direction orthogonal to the moving direction
The track of fiducial mark note carries out the step detected.
It addition, can be in the present invention, the first detecting step or the second detecting step be through
By there is the optical system of 2 prisms being located on transfer instrument to shoot the step of reference mark
Suddenly.
And, can be that revising step is based on the first detecting step and second in the present invention
The result that obtains in detecting step and make middle microscope carrier rotate the step being modified, in the middle of this
Microscope carrier can rotate in the face parallel with mounting surface.
It addition, can be in the present invention, revising step be to make mechanism for picking rotate to repair
Positive step, this mechanism for picking can overturn nude film, and can with the load with mounting position
Rotate in the face that face of putting is parallel.
The effect of invention
In accordance with the invention it is possible to provide a kind of engagement device and joint method, it is revised pickup and uses
Posture skew between camera and installation camera, the positioning precision in installation site is high.
Accompanying drawing explanation
Fig. 1 is suitable for the general of the major part of the first embodiment of the nude film jointing machine of the present invention
Slightly side view.
Fig. 2 is the skeleton diagram of the embodiment representing the pick-up head from wafer nude film.
Fig. 3 (a)～Fig. 3 (c) is the figure of the structure of the engaging head schematically illustrating first embodiment.
Fig. 4 represents the detection procedure of the posture skew of camera.
Fig. 5 (a) is the figure of the testing result of the posture skew representing installation camera, Fig. 5 (b)
It it is the figure representing middle microscope carrier camera relative to the testing result of the posture skew of engaging head.
Fig. 6 (a) be represent utilize installation camera shoot be transported on sticking carrying platform by void
Substrate P shown in line or be figure during new nude film D installation site for installing nude film,
Fig. 6 (b) is to represent to utilize middle microscope carrier camera to shoot the nude film D being positioned on middle microscope carrier
Time figure.
Fig. 7 is suitable for the outline in the main portion of the second embodiment of the nude film jointing machine of the present invention
Side view.
Fig. 8 (a) and Fig. 8 (b) is the different figure for the present invention and prior art are described.
Description of reference numerals
11: supply microscope carrier camera
12: supply microscope carrier
13: pick-up head
21: middle microscope carrier camera
The center in the shooting visual field of 21c: middle microscope carrier camera
22: middle microscope carrier
23: engaging head
23C: adsorber
The center of 23cp: adsorber
23j: adsorber central shaft
23m: labeling section
23o；Optical system
23p1,23p2: prism
23s: optical system support
23K: camera posture offset detection portion
The main body of 23H: engaging head
25: rotating driving device
31: installation camera
The center in the shooting visual field of 31c: installation camera
32: sticking carrying platform
34: heater
41: lower section what comes into a driver's camera
100,200: nude film jointing machine
D: nude film (semiconductor chip)
P: substrate
M, M1, M2, M α, M β: reference mark
W: wafer
Δ θ ba: installation camera offsets relative to the anglec of rotation of engaging head
Δ θ bc: middle microscope carrier camera offsets relative to the anglec of rotation of engaging head
Detailed description of the invention
Accompanying drawings used below etc. illustrate an embodiment of the invention.Additionally, following says
Bright for an embodiment of the invention is described, do not limit the scope of the invention.Therefore, right
For those skilled in the art, it is possible to use and these each key elements or whole key element are replaced as
The embodiment of the key element being equal to it, these embodiments are also contained in the model of the present application
Enclose.
Additionally, in this manual, in the explanation of each figure, for having the structure of general utility functions
Become the reference that key element mark is identical, avoid the explanation repeated as far as possible.
Fig. 1 is suitable for the of the engagement device i.e. nude film jointing machine (die bonder) of the present invention
The summary side elevation of the major part of one embodiment.Nude film jointing machine 100 is following device, its
The nude film D picked up by pick-up head 13 is positioned in temporarily on middle microscope carrier (holding position) 22,
And utilize engaging head 23 again to pick up placed nude film D, it is engaged in installation site
And be arranged on substrate P.
Nude film jointing machine 100 has: the supply microscope carrier phase of the posture of the nude film D on identification wafer
Machine 11；Identify the middle microscope carrier camera 21 of the posture of the nude film D being positioned on middle microscope carrier 22；
Installation camera 31 with the installation site identified on sticking carrying platform 32.
In the present invention, it is necessary to the camera revising the skew of the posture between camera is: with engaging head 23
The relevant middle microscope carrier camera 21 of pickup；And with engaging head 23 to the joint phase of installation site
The installation camera closed.In the present embodiment, middle microscope carrier camera 21 becomes in the present invention
Pickup camera.
It addition, nude film jointing machine 100 has: the rotation being located on middle microscope carrier 22 drives dress
Put 25；The lower section being located between middle microscope carrier 22 and sticking carrying platform (attach stage) 32 regards
Scape camera (under vision camera) 41；The heater 34 being located on sticking carrying platform 32；
With control device 50.
Rotating driving device 25 makes middle microscope carrier 22 parallel with the installed surface with installation site
Face on rotate, and it is inclined to revise the anglec of rotation between middle microscope carrier camera 21 and installation camera
Move.
Lower section what comes into a driver's camera 41 observes what engaging head 23 was adsorbed moving process from underface
The state of nude film D, microscope carrier 32 is heated by heater 34 in order to install nude film D.
Control device 50 and there is not shown CPU (Central processor unit；Centre
Reason device), storage control program ROM (Read only memory；Read only memory),
RAM (the Random access memory of storage data；Random access memory), control bus
Deng, control constitute each key element of nude film jointing machine 100 and carry out the installation control of the following stated.
The present invention arranges reference mark on engaging head 23, and revises pickup camera 21 and peace
Dress posture between camera 31 offsets.
And, in the present embodiment, make middle microscope carrier 22 rotate the rotation revising two cameras
Angular variation.Hereinafter, in the present embodiment, two cameras refer to the middle microscope carrier phase of pickup camera
Machine 21 and installation camera 31.
(a) of Fig. 2 is the figure of the structure showing schematically the engaging head 23 in the present embodiment.
Engaging head 23 has: absorption keeps adsorber (collet) 23C of nude film D；Make adsorber
23C lifting and on the two-dimensional surface parallel with installed surface main body 23H of movement；With there is benchmark
The camera posture offset detection portion 23K of labelling M.Engaging head 23 do not have make adsorber with
The rotary shaft rotated on the face that installed surface is parallel.
Camera posture offset detection portion 23K has: labeling section 23m, it prolongs from main body 23H
Stretch and be provided with reference mark M；With optical system 23o, it makes the picture of reference mark M from absorption
The center 23cp of device 23C passes through, and directs it to the central shaft orthogonal with installed surface
On 23j.Additionally, the center 23cp shown in (a) of Fig. 2 for the ease of display table
Show on the limit parallel with paper.
In the present embodiment, optical system 23o has: be located at 2 of top of main body 23H
Prism 23p1,23p2；With the optical system supporting that these prisms are bearing in main body 23H
Portion 23s.Prism 23p2 is arranged in the way of making its optical axis consistent with central shaft 23j.As light
System can also use such as in addition so that end face makes another to reference mark M
The optical fiber holding the mode that camera shoots on the position of above-mentioned prism 23p2 face to arrange regards
Mirror (fiberscope).
Reference mark M enters in the two cameras respective shooting visual field, and is located at from adsorber
On the position of the center 23cp biasing of 23C.It addition, from the shooting face of two cameras to base
Distance L of fiducial mark note M becomes the position of the focal length WD of the camera shown in (b) of Fig. 2
Put, become L1+L2+L3.
Fig. 3 (a) represents the figure of reference mark M shown in (a) of Fig. 2 viewed from above.
Shape as other reference mark M can also use the triangle shown in Fig. 3 (b)
Kerf, labelling 23m can also use strip.Inventionbriefly, if reference mark M
Take the contrast distinguished with labeling section 23m, and in order to improve the positioning accurate in installation site
Spend and there is the shape that the resolution with camera can distinguish.
It addition, the wire shape shown in Fig. 3 (c) can also be used as reference mark.If adopting
By wire, then have and be no need to detect the advantage that posture skew makes reference mark M move.
When the size of nude film D is little, in order to improve resolution further, the visual field of camera diminishes, and deposits
Situation in the length that can not increase wire.
Before the detection method of the posture skew of explanation two cameras, use Fig. 8 that the present invention is described
The prior art recorded with patent documentation 1.Fig. 8 (a) is the process stream schematically illustrating the present invention
The figure of journey, Fig. 8 (b) is the figure of the handling process schematically illustrating prior art.
Prior art, merely with each camera shooting substrate and the posture of nude film, is revised by substrate
The posture skew specified with position (X, Y) and the rotation angle θ of nude film.On the other hand, originally
Invent in addition to the correction that the posture of substrate and nude film offsets, and also that as described in problem
The pickup camera shooting the posture of nude film is revised and to installation site (substrate in sample ground
Deng) carry out the posture skew relative to engaging head between the installation camera shot, especially
Anglec of rotation shifted by delta θ.
Hereinafter, about the detection method of the posture skew of the camera realized based on reference mark M,
Use Fig. 2, Fig. 4 and Fig. 5 that the example of installation camera 31 is described.Fig. 4 is to represent camera
The figure of detection procedure of posture skew.Fig. 5 (a) is to represent the peace obtained by process
The dress figure of the testing result of the posture skew of camera 31.Additionally, in explanation, such as Fig. 1
Shown in, engaging head 23 direction of movement between middle microscope carrier 22 and sticking carrying platform 32 is made
For Y-direction, using direction orthogonal with Y-direction on the face parallel with installed surface 32m as
X-direction.
First, engaging head 23 is made to move and to the shooting visual field of installation camera 31 along Y-direction
Near center location move, obtain the shooting M1 (S1) of reference mark M.Then, make
Engaging head 23 and X-direction are moved parallel to predetermined distance, obtain reference mark M now
Shooting M2 (S2).As shown in Fig. 5 (a), even if making reference mark M put down with X-direction
Capablely mobile, the straight line linking M1, M2 also can tilt, and thus obtains installation camera 31
Tilt relative to engaging head 23, i.e. anglec of rotation shifted by delta θ ba (S3).Owing to M1 is in suction
On the center 23cp of adnexa 23C, so M1 and the installation shooting visual field of camera 31
Center 31c between skew become inclined relative to engaging head 23 of installation camera 31
Move, obtain position skew (Δ Xba, Δ Yba) (S4).
Implement the S1 to S4 shown in Fig. 4 even for middle microscope carrier camera 21, also can obtain figure
Middle microscope carrier camera 21 shown in 5 (b) relative to engaging head 23 anglec of rotation shifted by delta θ bc,
Position skew (Δ Xbc, Δ Ybc).Such as, Δ θ ba, Δ θ ba with clockwise for just,
Other anglec of rotation skew is also same.Additionally, reference 21c represents middle microscope carrier phase
The center in the shooting visual field of machine 21.
These results are, offset based on middle microscope carrier camera 21 and the installation posture of camera 31
The engaging head 23 on sticking carrying platform 32 that (two camera postures skew) are caused relative to peace
The posture skew of holding position becomes numerical expression (1), numerical expression (2).
Anglec of rotation shifted by delta θ b: Δ θ ba-Δ θ bc (1)
Position skew (Δ Xb, Δ Yb): (Δ Xba-Δ Xbc, Δ Yba-Δ Ybc) (2)
In the case of two camera posture skews change momently, come according to its change
Detect, in the case of can maintaining posture skew with the stipulated time, at intervals of set time
Detect.In either case, anglec of rotation offset correction all makes middle microscope carrier 22 rotate
Carry out.Rotate result be to again identify that nude film D, when nude film D enter to prescribed limit it
After, after utilizing adsorber 23C to adsorb and pick up so that it is move to installation site and engage.
On the other hand, position offset correction is that the XY direction utilizing engaging head is moved and implemented.
About the position revised, position offset correction based on middle microscope carrier camera 21 can be therefrom
Between microscope carrier pickup before and after carry out, offset correction based on installation camera 31 can install
Time implement, or integral position based on two cameras described later can also be implemented in installation site
Skew.
In embodiments illustrated above, although make engaging head 23 move to installation camera 31
And the near center location in the shooting visual field of centre microscope carrier camera, but by making engaging head 23
From installation site move in parallel to installation camera 31 shooting the visual field center and
Between the Y location of center of microscope carrier camera 21, eliminate the position skew in Y-direction, X
Position shifted by delta Xb on direction also becomes Δ Xbc.Become numerical expression (2 ').
Position skew (Δ Xb, Δ Yb): (-Δ Xbc, 0) (2 ')
Its result is, comprises position below offset correction and becomes to hold in interior and position offset correction
Easily.
In embodiments illustrated above, pickup (middle microscope carrier) camera and the peace to nude film
Holding position carries out the rotation by middle microscope carrier of the anglec of rotation skew between the installation camera shot
Transfer correction but it also may rotary shaft is set on engaging head and revises.
The present embodiment from the description above, utilizes the engaging head with reference mark, and detection is picked up
Take (middle microscope carrier) camera and installation camera that the installation site to nude film shoots it
Between relative to engaging head posture offset and revised, it is possible to pacify accurately
The location of holding position.
It addition, the present embodiment from the description above, by making middle microscope carrier rotate, it is possible to no
It is used on engaging head and rotary shaft ground is set, revise the anglec of rotation skew of two camera posture skews.
In the case of more precisely positioning, then the process posture adding following description is inclined
In-migration is modified.
Process posture skew to refer to, the substrate P or mounted being transported on sticking carrying platform 32
Nude film D is installed and has offset and be positioned in middle microscope carrier relative to the posture of installation camera 31
Nude film D on 22 is relative to the general name of the posture skew of middle microscope carrier camera 21.Hereinafter, make
Illustrate to process posture skew with Fig. 6.
Fig. 6 (a) represents that utilizing installation camera 31 to shoot is transported on sticking carrying platform 32
By the substrate P shown in dotted line or for install nude film D be new nude film D installation site time
Figure.Knowable to Fig. 6 (a), about installation site relative to the installation posture of camera 31
Skew, anglec of rotation skew becomes Δ θ ad, and position skew becomes (Δ Xad, Δ Yad).With
Sample ground, Fig. 6 (b) is the nude film D that shooting is positioned on middle microscope carrier 22, and represents relatively
In the figure of the posture skew of middle microscope carrier camera 21, anglec of rotation skew becomes Δ θ cd, and position is inclined
Move into as (Δ Xcd, Δ Ycd).
As can be seen from Figure 6, based in the installation site on sticking carrying platform 32 and middle microscope carrier 22
The process posture relative to installation site that posture skew between nude film D is caused shifts into
For numerical expression (3), numerical expression (4).
Anglec of rotation shifted by delta θ d: Δ θ ad-Δ θ cd (3)
Position skew (Δ Xd, Δ Yd): (Δ Xad-Δ Xcd, Δ Yad-Δ Ycd) (4)
Engaging head 23 in the case of two camera posture skews occurring simultaneously and processing posture skew
Offset to become relative to the overall posture of installation site and make numerical expression (1), numerical expression (2) institute respectively
The two camera posture skews shown and the skew knot of the process posture shown in numerical expression (3), numerical expression (4)
The numerical expression (5) of conjunction, numerical expression (6).
Integral-rotation angular variation Δ θ: Δ θ b+ Δ θ d (5)
Integral position skew (Δ X, Δ Y): (Δ Xb+ Δ Xd, Δ Ya+ Δ Yd) (6)
Therefore, in FIG, in the case of substrate P only engages 1 nude film D, based on number
Formula (3) or numerical expression (5) and make middle microscope carrier 22 rotate and revise anglec of rotation skew, go back base
Carry out correction position in numerical expression (6) by engaging head to offset, then pick up from middle microscope carrier 22
Nude film D, and it is engaged in installation site.Repairing of position based on numerical expression (6) skew
Just can not also implement on middle microscope carrier 22, and implement in installation site.
It addition, in FIG, in the case of multiple nude film D are layered on substrate P, stacking
The posture skew of nude film D can be converted as making the posture of substrate P initially obtained
Posture offsets and obtains.
It addition, the present embodiment from the description above, it is positioned on middle microscope carrier by detection
Nude film relative to the posture skew of middle microscope carrier camera and the installation site of sticking carrying platform relative to
The posture skew of installation camera, and can be with the two camera posture skew phases relative to engaging head
Associatedly revise and offset relative to the posture of installation site such that it is able to be accurately that nude film is fixed
Position is in installation site.
Hereinafter, Fig. 7 is used to illustrate to be suitable for the second embodiment of the nude film jointing machine of the present invention.
The nude film jointing machine 200 of the second embodiment is different from first embodiment, does not has middle microscope carrier 22,
Engaging head 23 is directly to pick up nude film D and by it directly in patch from wafer (holding position) W
The device engaged in the installation site of appendix platform 32.
In a second embodiment, the posture to the nude film D on the wafer W on supply microscope carrier 12
The supply microscope carrier camera 11 carrying out confirming becomes pickup camera.Such as, by (a) of Fig. 2
The shown engaging head 23 with reference mark M, and according to the method described in first embodiment,
Detect the posture skew between supply microscope carrier camera 11 and installation camera 31, by revising
This posture offsets, and can improve the positioning precision in installation site.In the present embodiment, if
Put the rotary shaft of engaging head 23, also together with the offset correction of position, carried out by rotary shaft
The correction of anglec of rotation skew.
In a second embodiment, also in the same manner as first embodiment, by engaging head 23
Reference mark M is set, and it is inclined to revise the posture between pickup camera and installation camera
Move, and the positioning precision in installation site can be improved.
As long as the engaging head described in first, second embodiment picks up nude film and by it in installation position
Put the nude film jointing machine on joint, it becomes possible to be suitable for the present invention.Such as, additionally it is possible to be applicable to make
Nude film handing-over for the flip-chip bond machine (flip chip bonder) of engagement device.Upside-down mounting
Chip engagement machine has pick-up head 13, and this pick-up head 13 picks up nude film D from wafer W, in order to
Handing-over and make this nude film D overturn, and this pick-up head 13 can with there is installation site
Rotate in the face that installed surface is parallel.Engaging head 23 utilizes pick-up head 13 making nude film D overturn
The upper absorption in position (holding position) keep nude film D, and it is engaged in installation site.
In the position overturn and installation site photographs reference mark M, and according to these shooting results
Detect engaging head 23 to offset relative to the position of installation site and anglec of rotation skew, such as,
Pick-up head 13 can be utilized to revise anglec of rotation skew, utilize engaging head 23 to carry out correction position inclined
Move.In the case of this example, the pick-up head that nude film D overturns is equivalent to the centre of first embodiment
Microscope carrier.
Claims (12)
1. an engagement device, it is characterised in that have:
Pickup photographic unit, it has the first shooting visual field；
Mounting position photographic unit, it has the second shooting of the mounting position that can shoot nude film
The visual field；
Nude film transfer instrument, it can pick up the nude film in the described first shooting visual field and by described
Nude film is positioned on the mounting position in the described second shooting visual field, and at the energy when picking up nude film
Enough photograph in described first shoots the visual field and when described nude film being positioned on mounting position
Time can shoot in the visual field described second, on the position that photograph, there is reference mark；
The first testing machine of described reference mark can be detected in described first shoots the visual field
Structure；
The second testing machine of described reference mark can be detected in described second shoots the visual field
Structure；With
Correction mechanism, it can be based on described first testing agency and described second testing agency
As a result, the mounting place of the nude film that described nude film transfer instrument is kept is revised.
2. engagement device as claimed in claim 1, it is characterised in that
Described first testing agency or described second testing agency can detect when described transfer
Instrument from the take-off location of nude film on the moving direction that moves of mounting position of nude film or
The described reference mark obtained during planar movement on the direction orthogonal with described moving direction
Track.
3. engagement device as claimed in claim 1, it is characterised in that
Described reference mark is via the optics with 2 prisms being located on described transfer instrument
System and described pickup photographic unit or mounting position photographic unit can be utilized to photograph
Reference mark.
4. engagement device as claimed in claim 2, it is characterised in that
Described reference mark is via the optics with 2 prisms being located on described transfer instrument
System and described pickup photographic unit or mounting position photographic unit can be utilized to photograph
Reference mark.
5. the engagement device as according to any one of Claims 1 to 4, it is characterised in that
Described correction mechanism can make middle microscope carrier rotation be modified, and this middle microscope carrier can
Rotate in the face that the mounting surface relevant to described mounting position is parallel.
6. the engagement device as according to any one of Claims 1 to 4, it is characterised in that
Having mechanism for picking, it can overturn nude film, and can with there is described mounting position
Rotate in the face that the mounting surface put is parallel,
Described correction mechanism makes the rotation of described mechanism for picking be modified.
7. a joint method, it is characterised in that have:
The reference mark that detection is photographed by pickup photographic unit, nude film transfer instrument is had
The first detecting step；
Detect the second detection step of the described reference mark photographed by mounting position photographic unit
Suddenly；With
Testing result based on described first detecting step and described second detecting step is revised
The correction step in the mounting place of the nude film that described nude film transfer instrument is kept.
8. joint method as claimed in claim 7, it is characterised in that
Described first detecting step or described second detecting step are to move based on when described nude film
Send instrument from the take-off location of nude film on the moving direction that moves of mounting position of nude film or
The described reference mark that person obtains during planar movement on the direction orthogonal with described moving direction
Track carry out the step that detects.
9. joint method as claimed in claim 7, it is characterised in that
Described first detecting step or the second detecting step are to be located at described transfer via having
The optical system of 2 prisms on instrument shoots the step of described reference mark.
10. joint method as claimed in claim 8, it is characterised in that
Described first detecting step or the second detecting step are to be located at described transfer via having
The optical system of 2 prisms on instrument shoots the step of described reference mark.
11. joint methods as according to any one of claim 7～10, it is characterised in that
Described correction step is based in described first detecting step and described second detecting step
The result that obtains and make middle microscope carrier rotate the step being modified, this middle microscope carrier can be
Rotate in the face parallel with mounting surface.
12. joint methods as according to any one of claim 7～10, it is characterised in that
Described correction step is to make mechanism for picking rotate the step being modified, this mechanism for picking
Nude film can be overturn, and can be in the face inward turning parallel with the mounting surface with described mounting position
Turn.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-048178 | 2015-03-11 | ||
| JP2015048178A JP6510838B2 (en) | 2015-03-11 | 2015-03-11 | Bonding apparatus and bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105977184A true CN105977184A (en) | 2016-09-28 |
| CN105977184B CN105977184B (en) | 2019-02-15 |
Family
ID=56984120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610122439.0A Active CN105977184B (en) | 2015-03-11 | 2016-03-03 | Engagement device and joint method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6510838B2 (en) |
| KR (1) | KR101793366B1 (en) |
| CN (1) | CN105977184B (en) |
| TW (1) | TWI647767B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106373914A (en) * | 2016-11-10 | 2017-02-01 | 北京中电科电子装备有限公司 | Chip bonding device |
| CN107978543A (en) * | 2016-10-25 | 2018-05-01 | 库利克和索夫工业公司 | Engagement head assembly, associated splice machine and correlation technique including reflective optical devices |
| CN108352335A (en) * | 2016-06-02 | 2018-07-31 | 株式会社华祥 | Engagement device, joint method and Engagement Control program |
| CN109521583A (en) * | 2017-09-19 | 2019-03-26 | 三星显示有限公司 | For manufacturing the device and method of display device |
| CN112530839A (en) * | 2019-09-19 | 2021-03-19 | 捷进科技有限公司 | Chip mounting device and method for manufacturing semiconductor device |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6705727B2 (en) * | 2016-09-26 | 2020-06-03 | ファスフォードテクノロジ株式会社 | Flip chip bonder and method for manufacturing semiconductor device |
| TWI662638B (en) * | 2017-04-21 | 2019-06-11 | 台灣愛司帝科技股份有限公司 | Method and device for repairing a semiconductor chip |
| JP7164314B2 (en) | 2017-04-28 | 2022-11-01 | ベシ スウィッツァーランド エージー | APPARATUS AND METHOD FOR MOUNTING COMPONENTS ON SUBSTRATE |
| JP7033878B2 (en) * | 2017-10-16 | 2022-03-11 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing equipment and methods for manufacturing semiconductor equipment |
| JP7018341B2 (en) | 2018-03-26 | 2022-02-10 | ファスフォードテクノロジ株式会社 | Manufacturing method of die bonding equipment and semiconductor equipment |
| US11031368B2 (en) * | 2018-05-14 | 2021-06-08 | Panasonic Intellectual Property Management Co., Ltd. | Bonding apparatus |
| US10861819B1 (en) * | 2019-07-05 | 2020-12-08 | Asm Technology Singapore Pte Ltd | High-precision bond head positioning method and apparatus |
| KR102350557B1 (en) * | 2020-03-06 | 2022-01-14 | 세메스 주식회사 | Die bonding method and die bonding apparatus |
| TWI792785B (en) * | 2020-12-31 | 2023-02-11 | 南韓商Ｔｅｓ股份有限公司 | Substrate bonding apparatus and substrate bonding method |
| WO2023181346A1 (en) * | 2022-03-25 | 2023-09-28 | 株式会社Fuji | Inspection assistance device, production management system, and inspection assistance method |
| JP7292463B1 (en) * | 2022-03-29 | 2023-06-16 | キヤノンマシナリー株式会社 | Alignment Apparatus, Alignment Method, Bonding Apparatus, Bonding Method, and Semiconductor Device Manufacturing Method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1194456A (en) * | 1997-03-26 | 1998-09-30 | 财团法人工业技术研究院 | Chip connection method and device |
| JP2000252303A (en) * | 1999-02-26 | 2000-09-14 | Shibaura Mechatronics Corp | Pellet bonding method |
| TW200929425A (en) * | 2007-10-09 | 2009-07-01 | Oerlikon Assembly Equipment Ag Steinhausen | Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate |
| CN103000558A (en) * | 2011-09-15 | 2013-03-27 | 株式会社日立高新技术仪器 | Die bonder and bonding method |
| KR101303024B1 (en) * | 2012-02-23 | 2013-09-03 | 한미반도체 주식회사 | Flip Chip Bonding Apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003092313A (en) * | 2001-09-19 | 2003-03-28 | Nec Machinery Corp | Chip inverting device and die-bonder |
| JP2003249797A (en) * | 2002-02-25 | 2003-09-05 | Toray Eng Co Ltd | Mounting apparatus and alignment method therefor |
| JP2007115851A (en) * | 2005-10-19 | 2007-05-10 | Toshiba Corp | Method and device for inspecting position of semiconductor component, and manufacturing method of semiconductor device |
-
2015
- 2015-03-11 JP JP2015048178A patent/JP6510838B2/en active Active
-
2016
- 2016-02-19 TW TW105104932A patent/TWI647767B/en active
- 2016-02-29 KR KR1020160024620A patent/KR101793366B1/en active IP Right Grant
- 2016-03-03 CN CN201610122439.0A patent/CN105977184B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1194456A (en) * | 1997-03-26 | 1998-09-30 | 财团法人工业技术研究院 | Chip connection method and device |
| JP2000252303A (en) * | 1999-02-26 | 2000-09-14 | Shibaura Mechatronics Corp | Pellet bonding method |
| TW200929425A (en) * | 2007-10-09 | 2009-07-01 | Oerlikon Assembly Equipment Ag Steinhausen | Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate |
| CN103000558A (en) * | 2011-09-15 | 2013-03-27 | 株式会社日立高新技术仪器 | Die bonder and bonding method |
| KR101303024B1 (en) * | 2012-02-23 | 2013-09-03 | 한미반도체 주식회사 | Flip Chip Bonding Apparatus |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108352335A (en) * | 2016-06-02 | 2018-07-31 | 株式会社华祥 | Engagement device, joint method and Engagement Control program |
| CN107978543A (en) * | 2016-10-25 | 2018-05-01 | 库利克和索夫工业公司 | Engagement head assembly, associated splice machine and correlation technique including reflective optical devices |
| CN107978543B (en) * | 2016-10-25 | 2023-08-04 | 库利克和索夫工业公司 | Bond head assembly including reflective optical element, associated bonding machine, and associated method |
| CN106373914A (en) * | 2016-11-10 | 2017-02-01 | 北京中电科电子装备有限公司 | Chip bonding device |
| CN106373914B (en) * | 2016-11-10 | 2020-03-24 | 北京中电科电子装备有限公司 | Chip bonding device |
| CN109521583A (en) * | 2017-09-19 | 2019-03-26 | 三星显示有限公司 | For manufacturing the device and method of display device |
| US11637034B2 (en) | 2017-09-19 | 2023-04-25 | Samsung Display Co., Ltd. | Apparatus and method for manufacturing display device |
| CN109521583B (en) * | 2017-09-19 | 2023-10-03 | 三星显示有限公司 | Apparatus and method for manufacturing display device |
| CN112530839A (en) * | 2019-09-19 | 2021-03-19 | 捷进科技有限公司 | Chip mounting device and method for manufacturing semiconductor device |
| CN112530839B (en) * | 2019-09-19 | 2024-03-08 | 捷进科技有限公司 | Chip mounting apparatus and method for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201701379A (en) | 2017-01-01 |
| CN105977184B (en) | 2019-02-15 |
| JP2016171107A (en) | 2016-09-23 |
| KR20160110110A (en) | 2016-09-21 |
| TWI647767B (en) | 2019-01-11 |
| JP6510838B2 (en) | 2019-05-08 |
| KR101793366B1 (en) | 2017-11-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105977184A (en) | Bonding apparatus and bonding method | |
| CN106057704B (en) | Engagement device and joint method | |
| CN101794721B (en) | Alignment apparatus for semiconductor wafer | |
| CN105977183B (en) | Mounting device and attaching method | |
| CN110364455A (en) | The manufacturing method of chip attachment device and semiconductor device | |
| CN106959410B (en) | For handling the component and method of component | |
| CN104105391B (en) | Element fixing apparatus | |
| CN108807224A (en) | For by the device and method of component be installed on substrate | |
| TWI666437B (en) | Vision inspection module and device handler having the same | |
| CN110249199A (en) | The height detection method of engagement device and subject | |
| CN109524320A (en) | The manufacturing method of semiconductor manufacturing apparatus and semiconductor devices | |
| JP2011066041A (en) | Electronic component mounting device | |
| TWI673502B (en) | Electronic component transport apparatus and electronic component inspection apparatus | |
| JP6438826B2 (en) | Bonding apparatus and bonding method | |
| KR101237056B1 (en) | Method for Aligning Semiconductor Package Aggregate | |
| JP4122170B2 (en) | Component mounting method and component mounting apparatus | |
| US11031367B2 (en) | Bond head assemblies including reflective optical elements, related bonding machines, and related methods | |
| TWI557832B (en) | Apparatus and method for manufacturing semiconductor | |
| KR102155346B1 (en) | Device handler | |
| CN110783224A (en) | Assembling component carriers using offset information between structural features formed on opposite sides of a reference component | |
| JP4334917B2 (en) | Alignment device | |
| TWI784051B (en) | Semiconductor device attaching method | |
| KR20230040288A (en) | End-portion state checking device | |
| TW200822245A (en) | Method for mounting semiconductor chips and automatic mounting apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |