201209952 六、發明說明： 【發明所屬之技術領域】 本發明係種半導體元制試機台，尤其是—種具有單一貫穿輸 送梭車之半導體元件測試機台。 【先前技術】 目前測試半導體元件的方法，轉可时為虛細試前境測試，其 中虛擬測試是指針對各IC的不同特性、根據預定的電路設計撰寫出特定的 測試軟體，藉以確認例如腳位間是否非預期地短路或斷路、以及是否符合 3定的邏輯實制試則是藉由已經具有完整功效的公板，僅將待測 ^置留自’將每個剌Ic輪流補人該空自位置，測試此時公板是否能正 n，從而相此制IC的舰正常，並依戦結果料分_依據。 田及Μ不同1C時，僅需替換不同公板及測試的軟體即可。 7昇效率’目和m機⑽送及制待辭導紅件雜均已採自 置有:Γ，如圖1所示’在人料區疊放有多組人舰4，每-人艱4中放 測半物元件。開_試時，先將最下方的人艱4向圖式下 導體元件31將此八料_-行内的待測半 ⑽22=r4 ㈣_移至測 於剛試座21進行測試。再組件221將待測半導體猶5移載 梭車34 jT成ψ後：W組件A將已測半導體元件6送至圖式上方的出料 32依t編Γ梭車34隨即右移至晴32可錄的位置，並由出料臂 右下方2 做為已測半導體元件6的分類依據，分別移載至圓式 側的另-戰纽件人2^辭導體件5 ®餘人料梭車33，並移動至右 、’ 2 ° ;及取位置。因此’在左側測試臂組件22,將完測 201209952 半導體元件移出測試座21時，右側測試臂組件222可儘速將下一顆待測半 導體元件5送進測試座21，繼續進行下一輪測試。 然而’當半導體元件移麟，左細組件22ι與右伽,!試臂組件 泣的移動需減此高細合，使賴台本身的製造成糊⑽冑不下；且 交接過程更f要與人料f及紐f機速度彼此舰：人料彳試_出料等三 個步驟中，速度最慢的步驟紐機财岐率，摊返交接過程中，對 於速度較快者會浪費些許的閒置等待時^尤其移載路徑如圖丨所示，入201209952 VI. Description of the Invention: [Technical Field] The present invention relates to a semiconductor element test machine, and more particularly to a semiconductor element test machine having a single through-feed shuttle. [Prior Art] At present, the method of testing a semiconductor component can be a test of a virtual test. The virtual test is to write a specific test software according to a predetermined circuit design for different characteristics of each IC, thereby confirming, for example, a foot. Whether the bit is unexpectedly short-circuited or broken, and whether it conforms to the 3 logic implementation test is to leave the test to be tested from 'the 剌Ic turn Empty from the position, test whether the public board can be positive n at this time, so that the ship of the IC system is normal, and rely on the results of the material _ basis. When the field is different from 1C, you only need to replace the different public boards and tested software. 7 liters of efficiency 'mesh and m machine (10) to send and to order resignation red pieces have been collected: Γ, as shown in Figure 1 'multiple groups of people in the crowd area 4, each difficult 4 in the middle of the test half element. In the open test, the lowermost person is first moved to the conductor element 31 to move the half to be tested (10) 22 = r4 (four) _ to the test block 21 for testing. After the component 221 transfers the shuttle 34 d to the semiconductor to be tested, the W component A sends the measured semiconductor component 6 to the discharge 32 above the drawing, and the shuttle 34 is then moved right to the sunny 32. Recordable position, and the lower right side of the discharge arm 2 as the classification basis of the tested semiconductor component 6, respectively transferred to the other side of the round side of the warfare member 2 ^ word conductor piece 5 ® surplus shuttle 33, and move to the right, '2 °; and take the position. Therefore, when the test component 22 is tested on the left side and the semiconductor component is removed from the test stand 21, the right test arm assembly 222 can feed the next semiconductor component 5 to be tested into the test stand 21 as soon as possible, and continue the next test. However, when the semiconductor component is moved, the left thin component 22ι and the right gamma, the movement of the test arm component must be reduced, so that the manufacturing of the laitai itself can be made into a paste (10); and the handover process is more important. Material f and New F machine speed each other: the three steps of the manpower test _ test _ discharge, the slowest step of the new machine financial rate, the return transfer process, for the faster speed will waste some idle Waiting time ^ especially the transfer path as shown in the figure, enter
的標的 料臂僅需在左_人料區與緊鄰的人料梭車間移動，㈣料伽需在出料 梭車與圖式右下方的分_關移動，使得出料臂移祕徑遠長於入料臂 移動路徑’迫使整體循環配合關步動作並不完美；—旦轉體元件在測 試座上受檢__再縮短，則上述同步化不完美_許時·費在整體 «中所佔_愈冑、隨之紐產纽率_題益形賴，尤 的料體元件職時，產出效率㈣確受到舰。再加上測試臂組件係以 -維移動方歧行轉體元件職，結馳_，祕±擔麻煩，使得 造價及維修成本姉偏高，在自動化戦流財，缺是可料一步改良 因此’若能提供-種各傳輸機械臂均以一維方式移動而移載半導體 牛^能加快移載速度、以及簡化結構、降低成本_試機台，使移載 至配合戦速度，不僅能夠降低測試時的時間，而簡化的 上及維修上也減的便宜，而且損_機雜低，使得自 迫情，達骑域柄啊亦能触有效率的: 【發明内容】 本發明之-目的在提供—種縣沿著貫穿人料位置、交換位置、及出 七立置的途錄返鶴，使得機綠賴化的具有單—貫諸送梭車之丰 201209952 導體元件測試機台。 本發明之另—目的在提供—種貫穿輪送梭車具有複數承誠，其中部 分因應入料需求、另部分則_料需求，使得人、_作可以被高度 同步化的具有[貫穿輸送梭車之半導體元件測試機台。 本發明之再-目的在提供—種讓貫穿輸送梭車時雜在人料、出料位 置間直線切換，使輯作業與測試作業效率提昇的具有單—貫穿輸送梭車 之半導體元件測試機台。The target material arm only needs to move in the left _ human material area and the adjacent human shuttle shop. (4) The material gamma needs to move in the lower part of the discharging shuttle and the lower right of the drawing, so that the discharging arm is far longer than the moving arm. The moving path of the feeding arm 'forces the overall cycle to match the closing action is not perfect; once the rotating element is inspected on the test stand __ and then shortened, the above synchronization is not perfect _ the time is the total _ 胄 胄 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 In addition, the test arm assembly is based on the -dimensional movement of the squadron, and the singularity is _, the secret is too troublesome, so that the cost of construction and maintenance is too high. In the automation of turbulence, the lack of one can be improved in one step. Can provide - all kinds of transmission robots move in one-dimensional mode to transfer semiconductor cattle ^ can speed up the transfer speed, and simplify the structure, reduce costs _ test machine, so that the transfer to the 戦 speed, not only can reduce the test time The time, while the simplification of the maintenance and repair is also reduced, and the damage is low, so that the self-forcing, the ride of the handle can also be efficient: [Summary of the Invention] - The county returns to the crane along the way through the position of the human material, the exchange location, and the exit of the seven-station, so that the green-green Laihua has a single-to-spin shuttle tire 201209952 conductor component testing machine. Another object of the present invention is to provide a plurality of through-wheel shuttles having a plurality of Chengcheng, some of which are required to be fed, and others to be required, so that the human and the _ can be highly synchronized [through the transport shuttle] The semiconductor component testing machine of the car. The re-purpose of the present invention is to provide a semiconductor component testing machine with a single-through conveying shuttle that allows a straight line to be switched between the material and the discharge position when the shuttle is transported, and the efficiency of the operation and the test operation is improved. .
依征、、树明揭露的—種具有單—貫穿輸送梭車之半導體元件測試機 三’係供顧複數放置在—個料_的待測半導體播，該測試機台包含. -個有供置放至少—個容納有前述料_人料區、及供置放複數 =:==料_料區之基座;-組設置於該基座上的測試 、…二至少—個具有至少-個顧位置_試座；及至 ^」應上制4座、供在—鑛應上述職座的錢位置與上述測試 :含移試完畢之半導體元件的測試臂組件;而該測試機 口還.讀运裝置，包括：—個設置於該機台上、供在一個對應該 及取位置與—個入料位置間搬移上述待測半導體元件的入料臂； 一 3又於该機台上、供在一個出料位置與一個對應上述出料區之釋放位 ===^輸#嶋卜嶋嫌承載座I 輸送梭車/… 讀位置、及出料位置的途徑中往返移動的貫穿 此"浙案斤揭路之具有單一貫穿輸送梭車之半導體元件測試機台，係 至ϊί輸物铜伟航㈣人繼，將制_元件移載 對應於職臂祕从械座’貫雜送梭料受_較得人料承載座 "' ' 時間出料承載座則對應至出料臂，而人料承載座 201209952 則由測試臂組件之用於取/放料的機械臂移載至測試座進行測試，同時貫穿 輸送梭車被驅動，使入料承載座承再次對應至入料臂，並再次由入料承載 座承載下一批待測半導體元件，而入料臂移載完的同時，測試座亦測試完 畢，貫穿輸送梭車則再次被驅動，出料承載座亦同樣的對應於測試臂組件， 再由機械臂將已測試完畢的半導體元件從測試座汲取並移載並放置於出料 承載座，當貫穿輸送梭車再次驅動使入料承載座對應於測試臂組件，而承 載有已測轉體元件的出料承載座綱樣對應至出料f，因此測試臂組件 同樣的再㈣T-批制半導體元㈣，出料制樣祕已财導體元件According to the levy and the disclosure of the tree--the semiconductor device testing machine with a single-through-transport shuttle, the three-series are placed in the semiconductor to be tested, and the test machine includes. Locating at least one susceptor containing the aforementioned material _ human material area, and for placing the plural number::==material _ material area; - group set on the pedestal test, ... at least one has at least - The location of the test _ test seat; and to ^ " should be made in 4 seats, for the position of the mine in the above-mentioned position and the above test: the test arm assembly containing the semiconductor component of the shift test; and the test machine mouth. The reading device comprises: a feeding arm disposed on the machine for moving the semiconductor component to be tested between a corresponding position and a feeding position; and 3 on the machine table, For a release position in a discharge position and a discharge point corresponding to the above discharge area ===^输#嶋 Bu suspected carrier I transport shuttle/... Read position and the position of the discharge position in the round-trip movement through this " The Zhejiang Component Jin Jie Road has a single semiconductor component testing machine that runs through the shuttle, and is connected to the 输ί Weihang (four) people follow, the system _ component transfer corresponds to the arm of the arm from the machine seat 'through the shuttle material receiving _ more than the material carrier'' time delivery bearing seat corresponds to the discharge arm, The human material carrier 201209952 is transferred from the robot arm for picking/discharging of the test arm assembly to the test seat for testing, and is driven through the transport shuttle to make the feeding carrier bearing again corresponding to the feeding arm. And the next batch of semiconductor components to be tested is carried by the loading carrier again. At the same time that the loading arm is transferred, the test socket is also tested, and the shuttle is driven again. The discharge carrier also corresponds to the same. Testing the arm assembly, and then the mechanical component of the tested semiconductor component is taken from the test socket and placed on the discharge carrier, and when the transport shuttle is driven again, the loading carrier corresponds to the test arm assembly, and the load is carried. The discharge carrier of the tested swivel element corresponds to the discharge f, so the test arm assembly is the same (four) T-batch semiconductor element (4), and the output sample has the secret conductor component.
移載出’透過時序性_換使得移載健與測試作業可關步無礙，從而 達成上述所有之目的。 【實施方式】 有關本發明之前述及其他猶内容、特賴功效，在町配合參考圖 式之較佳實施例的詳細說明中，將可清楚的呈現。 -作併參考圖2及圖3所示，為本案具有單一貫穿輸送梭車之半導體 凡件測摘。之第—較佳實補，主要包括基座丨，、測試裝置及輸送裝 置j，其中基座1，上形成有一個供擺放料£的入料區π，及出料區12,，入 料區1曰1,處的料_，贱承載放置有複數鱗游導體元件5，而出料區 則是分舰置放細_，每彳__載具有某蚊電氣性 、皮以刀類几畢的半導體元件，為便於說明，在此^義位於入料區 ，的料_人《4，，且在本财，人料“，是轉疊方式置放於入料區 而位於出料區12’的多個料!£為分類料昆7,。 的測Si座I’上的測試裝置2’在本例中包括-個測試座21，及 件M2,二、Μ ’測4臂組件22’則例釋為—個附有吸嘴220,及溫度調節 待測丰_ _ 221，藉由吸嘴220,施加負壓吸引/釋放負壓方式汲取/釋放 元件5，胤度調痛件222,則可依照需求進行溫度調節 ，尤其在進 201209952 行轉體元件測試時，鱗待測半導體元件5處於—個預定溫度，以測試 出半導體7G在模擬出的高溫環境或是低溫環境狀態下是否還能正常運作。 機械臂221，則將吸嘴22〇,所没取的待測半導體元件5移入測試座21，或反向 移出。雖然在本例中係使用吸嘴以負壓/釋放負壓方式沒取半導體元件，但 熟悉本技術者亦可使關㈣料方式皆細縣案之實施。 輸送裝置3,則包括設置在機台上的入料臂31，、出料臂32,及貫穿輸送 ，車’、中入料# 31及出料臂32,分別例釋為具有一個組吸引/釋放 半導體元件的吸嘴310,、32〇，。同樣地，此處將入料臂3ι，從入料匿4,沒取 鲁待測半導體元件5的位置稱為沒取位置，釋放待測半導體元件5至貫穿輸 送仏車33上的位置疋義為入料位置；而上機械臂如，從貫穿輸送梭車 33及取、或釋放半導體元件的位置為交換位置；丨料臂Μ，由貫穿輸送梭 車33,上取出完測半導體元件的位置則定義為出料位^，釋放至分類料匠7， 之位置則為釋放位置。因此，貫穿輸送梭車33，在機台上的移動途徑係貫穿 上述入料位置、父換位置、及出料位置並往返移動；並且藉由單一的貫穿 輸送梭車it行輸送錢’冑寵構、有贿低製造成本。 且在本例中，貫穿輪送梭車33，包括兩個彼此分隔一段預定距離的承載 •座’分別為入料承触331’及出料承_ 332’ ’供分別放置待測半導體元 件與完測半導體元件；入料承載座331，與出料承載座332,的間距，恰使得 當入料絲座如，位於人料位置時，⑽承載座说，位在錢位置；而當 入料承載座33Γ抵達交換位置時，出料承載座说，抵達出料位置。 為提供工作人員作業方便，本案之檢測機台入料區⑴及出料區12,在 機台上位置係位於圓2下方的側邊，並於相對的上方侧邊設置測試座π， 而貫穿輸送梭車33,則橫貫圖式的機台中央部份，使得測試座21，相對於入 料區11，及出料區12’，分別位在貫穿輸送梭車33，的兩相對侧邊；因此，工 作人員可於同一側邊位置完成上、下料。 在進仃移載測試作業時，一併參考圖4至圖6所示，首先如圖4所示 [S] 201209952 由入料臂31’至汲取位置，從入料昆4，中透過吸嘴31〇，汲取待測半導體元件 5 ’並移載至入料位置釋放，令待測半導體元件5被放置在貫穿輸送梭車％， 的入料承载座33〗’上，·同時，出料承载座幻2,正在交換位置接受機械臂奶， 所釋放的完測半導體元件。 隨後如圖5所示，當貫穿輪送梭車幻，受驅動右移，使入料承載座别， 對應移至交換位置’而龍於交換位置的機械臂221，則將人料承載座训 上所承載的待辭導體元件5由吸嘴蕭舰；相對地，出料臂把同時吸 41 取出料承載座332’上的完測半導體元件。 再如圖6所示’當待測半導體元件5被移載至測試位置後，機械臂221， 將下降’使得被吸嘴220,沒取的待測半導體元件5被壓制在測試座21，上進 仃測試，並同時摸擬特定環境’由溫度調節件222’調整施加預定溫度至待 測半導體元件5，並將測試結果傳輸至處理分類裝置23,。此過程中，出料 臂32,已經依照處理分類裝置23,的指令，將所汲取的完測半導體元件釋放 至對應的分類料H 7,中。而在進行測試的同時，貫穿輸送梭車33,亦會被驅 癱動左移回復至原來位置’使入料承載座331’對應至入料位置而出料承載 座332’則對應至交換位置’準備承接下一輪半導體元件，進行下一循環運 作。 由於’貫穿輸送梭車33,可以-肩承擔入料與出料的雙重責任並且入 料臂入料時間恰為測試臂組件出料時間，而測試臂組件入料又恰可供出料 臂出料’此種設計讓貫穿輸送梭車—舉統合人料與出料的同步協調運作， 使得入、㈣動作可以被高度同步化，賴作賴職作業鱗從而提昇， 機台之競爭力與市場接受度藉此提高，達成本發明所有上述目的。 201209952 當然’如熟於此技術領域者所能輕易理解，若測試過程耗時較長，則 相較之下移斜間較短，貫穿輸送梭車勢必需停頓等待。祕決此類問題， 提升整體產出效率，請參考圖7至u本案之第二較佳實施例所示，係以兩 組共四個測試座2Γ’、及兩組左、右測試臂組件22ι”、这”進行半導體元件 22i^22h„ ； 當然，本例的貫穿輸送梭車33,，也同樣包括_入料承載細，，及兩個出料 承載座332”，供同時承載兩個半導體元件；且入料臂31”、出料臂32”與機 械臂灿”、灿”皆分猶兩個吸嘴，供物取與觀兩個半導體元 件。由於謝細、亀左右恤置_試細，因此無論入料 位置、交換位置、與出料位置都必爾之有稍微錯開的左右因應位置。 如圖7所示，當貫穿輸送梭車33”位於圖式左側位置時，人料承載座 训，對應於偏左入料位置，此時入料臂31，，一次將兩個待測半導體元件$置 放於入科承載座331，，中，且出料承_说，，位於對應於左側測_件 從，的偏左交換位置，接收其完測半導體元件。隨後如圖8所示，貫穿輸送 梭車33’’受到驅動而右移，使入料承載座331，，對應於左側測試臂组件加 Ζ交換位置’《械㈣，，絲位⑽承触㈣的兩個待測半 轉5 ;同時，崎32”也由位於偏左出料位置處的出料承載趙” ’取出兩個已測半導體元件6加以分類，完成—次循環的上半程。 接著如圏9所示，入料承载座331，，再受到驅 一 為謝側測_件為，，的完測時段，_ :^_置，使得人_座331”_復右側人料位置it 4 31所釋放的下—批(兩個)待測半導體元件5，同時測試臂組 201209952 件222’’則將兩個已測半導體元件6由機械臂22h，，釋放至兩個出料承載座 332，此時，機械臂221ι”則將前一步驟中所汲取的待測半導體元件5分別 壓制在所屬的兩個測試座21，，上，並將測試結果傳至處理分類裝置23”。 故如圖10所示，當機械臂221ι，，與測試座21，，持續進行測試過程中，入 料承載座331”將再度右移至偏右交換位置，供機械臂22h”的吸嘴汲取，且 出料承載座332”也右移至偏右出料位置，供出料臂32”沒取完測半導體元 件，再度賴處理分織置23”指示分駐適當的分類料匿中。 最後如圖11所示’貫穿輸送梭車回復到左側，使入料承載座331”對應 籲於偏左入料位置，再度接納由入料臂h”送來的下一批待测半導體元件$， 機械臂221ι”則將已測試完畢的完測半導體元件6移載至偏左交換位置的出 屬的測試位置並壓制在測試座21，，上，並將測試結果傳導至體; 23”，從而完成整個循環。 同樣地，由於僅需使用單-組貫穿輸送梭車，機台本身的結構因而簡 化、成本隨之降低，且梭車與人料臂、出射各自承翻責任與移動路徑 相當單純，彼此間具有高度的協雛，機台整體產出效率從而大幅提昇， 齡尤其無論測試_長短’都可以有朗應，提昇機台顧雜，達成所有 貫施例以兩組左右平行配置_試臂組件進行移載測試 p ’亦可侧丨2 _ 17所示本案之第三較佳實施例輪測試臂組 #22,- 22,^^221,^ 221,- 出料區、人料臂、出料料結構，均與前述實施例相同，本财，每一機 械臂22H’，，、22h”，都具有四個吸嘴，貫穿輸送後車π,亦 四個入料承載座别，”及四個出料承载座332，”。請—並 、有 所示，貫穿輸送梭車33”，先移至入料位置，同時入料臂Μ，，，及= 5 33,^ ^ 201209952 了移’，四個已測半導體元件釋放至出料承載座332，”後上移；此時，機械 /2扎正由準備位置下移，將其所触的四個制半導體元件$下壓至測 試位置，於螂試座上進行測試。 ί著如圖15獅，貫賴送梭車33，，，右移，使人料承餘训”移至 對應父換位置，請一併參照圖10，機械臂灿”，再度下降、沒取位於入料 承載座331，’，的待測半導體元件5後上升，機械臂训”，則保持在測試位置。 時出料承載座移至出料位置，供出料臂沒取四個完測半導體元件，並 依照處理分雜置23”，料，分類槪至各鑛應分雜訂”。 • 隨後併參考如圖17所不，機械臂221,’’，將攜帶測試完畢的半導體元 牛由、、J試位置上移，準備向圓式左方移動，前往交換位置；機械臂2212”， °圖式右方移動至準備位置。隨即’貫穿輸送梭車33’，’將回移至啟始狀 料承载座331重新回到入料位置，接納入料臂所釋放的制半導體 疋件5 ’而機师灿”，下移至錢錄將綱半導體元件職至出料承載 機械#22h鱗_帶轉體元件下移，並迫緊至測試座進行 測試，從而回復如圖12的流程，進入下一循環，如此不斷重複，直到全部 測試完畢。 鲁 J<述、。構°又°十’不僅使得單一的貫穿輸送梭車完整肩負入料與出 广使命丄簡化測試機台結構、有效降低製造成本，也使得各工作岗位的部 =有冋度細性’可有效率麵步進行半導體元件賴、測試、與分類， β ^檢測效率與產出，達到降低成本、同時提昇效率的目的。惟以上所述 者僅本發明之較佳實施例而已，當不能以此限定本發明實施之範圍即 大凡依本發明申請專利範圍及發明說明内容所作簡單的等效變化與修飾， 皆仍屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是習知半導體元件檢測機台的俯視圖； 201209952 圖2是本發明第—較佳實施例具有單一貫穿輸送梭車之半導體元件測 試機台的俯視圖； 圖3是圖2具有單—貫穿輸送梭車之半導體元伽m機台的前視圖； 圖4是圖2入料臂没取待測半導體元件並放置在之入料承載座之機台 的俯視圖； 13 圖5是圖2赋臂鱗跡錄賴位置的人料承触所承載之半導 體元件之機台的俯視圖； 修 圖6是圖2貫穿輸送梭車被驅動左移回復至原來位置，準備承接下一 輪半導體元件進行下—補運狀機台的俯視圖； 圖7疋本發明第二較佳實施例以兩測試臂組件進行半導體元件的測試 作業之機台的俯視圖； 圖8是圖7貫穿輸送梭車受麟後向右移動之機台崎視圖； 圖9是圖7入料承載座受到驅動向左移動，進行本循環的下半程之機 台的俯視圖； 鲁 圖10是圖7入料承載座將再度右移至偏右交換位置，且出料承載座也 右移至偏右出料位置之機台的俯視圖； 圖11是圖7使入料承載座再度接納由入料臂送來的下一批待測半導體 辑，測試臂組件麟已職完畢的完游導體元件移載至偏左交換位置 的出料承載座之機台的俯視圖； 圖12是本發明第三較佳實施例由兩組測試臂組件上下交替輪轉測試之 機台的俯視圖； 圖13疋圖12具有兩組測試臂組件上下交替輪轉測試機台的前視圖； [S] 12 201209952 圖14是圖12具有兩組測試臂組件上下交替輪轉測試機台的側視圖； 圖I5是圖I2貫穿輸送梭車右移使入料承載座移至對應交換位置之機 台的俯視圖； 圖I6是圖I2’組測試臂組件各別同步進行沒取及下壓測試待測半導 體元件之機台的側視圖；及 圖Π是圖12兩組測試臂組件位置交替互換之機台的侧視圖。 【主要元件符號說明】Transferring the 'transfer timing _ change makes the transfer and test operations unobtrusive, thus achieving all of the above objectives. [Embodiment] The foregoing and other aspects of the present invention will be apparent from the detailed description of the preferred embodiments of the accompanying drawings. - As shown in Fig. 2 and Fig. 3, the semiconductor article with a single shuttle car is transported. The first, preferably the actual compensation, mainly comprises a base cymbal, a testing device and a conveying device j, wherein the base 1 is formed with a feeding zone π for placing the material, and a discharging zone 12, In the material area 1曰1, the material _, the raft carries a plurality of scaly conductor elements 5, and the discharge area is divided into small _, each __ contains a mosquito electric, skin knife A few completed semiconductor components, for the convenience of explanation, here in the feeding area, the material _ people "4, and in this wealth, the material", is the stacking method placed in the feeding area and located in the discharge A plurality of materials of zone 12'! £ is a sorting material of Kun. 7, the test device 2' on the Si seat I' includes, in this example, a test stand 21, and a piece M2, two, Μ '4 arms The component 22' is exemplified as a nozzle 220, and a temperature adjustment to be measured _ _ 221, by the suction nozzle 220, applying a vacuum suction/release negative pressure method to extract/release the component 5, the sputum is painful For the piece 222, the temperature adjustment can be performed according to requirements, especially when the test component of the rotating body is tested in 201209952, the semiconductor component 5 to be tested is at a predetermined temperature to test the semiconductor 7G in the simulation. Whether the high-temperature environment or the low-temperature environment can still operate normally. The robot arm 221, the nozzle 22 is smashed, and the semiconductor component 5 to be tested is moved into the test seat 21 or removed in the reverse direction. The use of the nozzle to take the semiconductor component in the negative pressure/release negative pressure mode, but those skilled in the art can also make the implementation of the (four) material method in the fine county case. The conveying device 3 includes the input arm disposed on the machine table. 31, the discharge arm 32, and the through conveyor, the vehicle ', the medium feed # 31 and the discharge arm 32 are respectively illustrated as a suction nozzle 310 having a group of attracting/releasing semiconductor elements, 32 〇. Here, the feeding arm 3i is taken from the inlet 4, and the position where the semiconductor element 5 to be tested is not taken is referred to as the no-take position, and the position at which the semiconductor element 5 to be tested is released to the through-feeding carriage 33 is defined as The position of the material is, for example, the position from the shuttle shuttle 33 and the position at which the semiconductor component is taken or released is the exchange position; the arm is defined by the position of the semiconductor carrier through which the shuttle 33 is taken. Released to the sorter 7 for the discharge level ^, the position is released Therefore, through the transport shuttle 33, the moving path on the machine runs through the above-mentioned feeding position, the parent changing position, and the discharging position, and moves back and forth; and the money is transported by a single through-feed shuttle.胄 胄 、 、 有 有 有 有 有 有 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄 胄'The spacing between the semiconductor component to be tested and the semiconductor component to be tested; the loading carrier 331 and the discharge carrier 332 are such that when the inlet wire holder is located at the position of the material, (10) the carrier says , in the position of the money; and when the loading carrier 33Γ arrives at the exchange position, the discharge carrier says that it arrives at the discharge position. In order to provide convenient operation for the staff, the test machine feeding area (1) and the discharge area 12 of the present case are located on the side of the machine 2 under the circle 2, and the test seat π is disposed on the opposite upper side. The shuttle 33 is transported across the central portion of the machine platform such that the test seat 21, relative to the feed zone 11, and the discharge zone 12', are respectively located on opposite sides of the transport shuttle 33; Therefore, the staff can complete the loading and unloading at the same side position. When entering the load transfer test operation, refer to FIG. 4 to FIG. 6 together, first as shown in FIG. 4[S] 201209952 from the feed arm 31' to the picking position, from the feed block 4, through the suction nozzle 31〇, the semiconductor component 5' to be tested is taken and transferred to the feeding position to release, so that the semiconductor component 5 to be tested is placed on the feeding carrier 33' of the conveying shuttle%, and at the same time, the discharging load Block 2, in the exchange position to accept the robot arm milk, the finished semiconductor component is released. Then, as shown in FIG. 5, when the shuttle is shuttled through the wheel, the drive is moved to the right, so that the loading carrier is moved to the exchange position, and the robot arm 221 in the exchange position is loaded. The conductor element 5 to be carried thereon is suspended by the nozzle; oppositely, the discharge arm simultaneously sucks 41 the finished semiconductor component on the material carrier 332'. Further, as shown in FIG. 6, 'When the semiconductor component 5 to be tested is transferred to the test position, the robot arm 221 will be lowered' so that the nozzle to be tested 220 is not pressed, and the semiconductor component 5 to be tested is pressed on the test stand 21, The test is performed, and at the same time, the specific environment 'the temperature adjustment member 222' is adjusted to apply the predetermined temperature to the semiconductor element 5 to be tested, and the test result is transmitted to the process classification device 23. During this process, the discharge arm 32, in accordance with the instructions of the processing sorting device 23, releases the captured semiconductor component to the corresponding sorting material H7. While the test is being carried out, the shuttle shuttle 33 is also driven to the left to return to the original position 'the feed carrier 331' corresponds to the feeding position and the discharge carrier 332' corresponds to the exchange position. 'Prepare to take over the next round of semiconductor components for the next cycle. Because of the 'through the transport shuttle 33, the shoulder can bear the dual responsibility of feeding and discharging, and the feeding arm feeding time is just the test arm assembly discharging time, and the test arm assembly feeding is just ready for the discharging arm discharging. 'This design allows the coordinating and coordinating operation of the shuttle and the unloading through the transport shuttle, so that the incoming and (4) actions can be highly synchronized, which can be improved by the scale of the work, and the competitiveness and market acceptance of the machine. To this end, all of the above objects of the present invention are achieved. 201209952 Of course, as can be easily understood by those skilled in the art, if the test process takes a long time, the shifting slant is shorter, and the shuttle must be stopped. To solve such problems and improve the overall output efficiency, please refer to FIG. 7 to the second preferred embodiment of the present invention. The two test sets are two sets of two test stands, and two sets of left and right test arm assemblies. 22ι", this" carries on the semiconductor component 22i^22h„; of course, the through-feeding shuttle 33 of this example also includes the _feed bearing fine, and two discharge carriers 332" for carrying two at the same time. The semiconductor component; and the feeding arm 31", the discharging arm 32" and the mechanical arm "can", and the "can" are divided into two nozzles for feeding and viewing the two semiconductor components. Since the thank-you and the left and right sides of the shirt are set to be thin, the position of the material, the position of the exchange, and the position of the discharge are all slightly different from each other. As shown in FIG. 7 , when the through shuttle shuttle 33 ′′ is located at the left side of the drawing, the human load bearing training corresponds to the left-side feeding position, at this time, the feeding arm 31 , and the two semiconductor components to be tested at a time Placed in the entrance carrier 331, in, and the output carrier _ said, located at the left-hand exchange position corresponding to the left side of the test piece, receiving its completed semiconductor component. Then, as shown in FIG. The transport shuttle 33'' is driven and moved to the right to make the loading carrier 331 corresponding to the left-hand test arm assembly twisting exchange position '"(me), the wire position (10) to touch (four) two half-turns to be tested 5; At the same time, the Saki 32" is also sorted by the discharge bearing at the left-left discharge position to extract two measured semiconductor components 6 to complete the first half of the cycle. Then, as shown in 圏9, The feeding carrier 331 is again subjected to the driving test, and the completion period of the test is _: ^_, so that the person _ seat 331" _ the right side of the man position is released under the 4 31 - Batch (two) semiconductor components 5 to be tested, while test arm group 201209952 222'' then two tested semiconductor components 6 The mechanical arm 22h is released to the two discharge carriers 332. At this time, the mechanical arm 221i" presses the semiconductor component 5 to be tested taken in the previous step to the two test seats 21, respectively. The test results are passed to the processing sorting device 23". Therefore, as shown in FIG. 10, during the continuous test of the robot arm 221, and the test seat 21, the feeding carrier 331" will be moved right again to the right exchange position for the suction of the robot arm 22h". And the discharge carrier 332" is also moved to the right to the right discharge position, and the discharge arm 32" has not taken the semiconductor component, and then the processing is divided into 23" indications to be assigned to the appropriate classification. Figure 11 shows the 'transfer shuttle to the left side, so that the loading carrier 331' corresponds to the left-hand feeding position, and re-accepts the next batch of semiconductor components to be tested sent by the feeding arm h", mechanical The arm 221 ι" transfers the tested semiconductor component 6 that has been tested to the test position of the left-hand exchange position and presses it on the test socket 21, and transmits the test result to the body; 23", thereby completing In the same way, since only the single-group through-feed shuttle is used, the structure of the machine itself is simplified, the cost is reduced, and the responsibility and movement path of the shuttle car and the human arm and the exit are relatively simple. Have a high degree of synergy between each other, The overall output efficiency of the machine has been greatly improved. In particular, regardless of the test _ length, there can be a positive response, the machine is noisy, and all the implementations are implemented in two sets of parallel configurations _ test arm components for transfer test p ' The third preferred embodiment of the present invention, the side of the test wheel set #22, - 22, ^^221, ^ 221, - the discharge area, the human arm, and the material structure of the discharge material are all The foregoing embodiment is the same, the main body, each of the robot arms 22H',, 22h" has four nozzles, through the transport vehicle π, also four load carrying seats," and four discharge carriers 332,". Please - and, as shown, through the transport shuttle 33", first move to the feeding position, while the loading arm Μ,,, and = 5 33, ^ ^ 201209952 moved ', four tested semiconductor components released to The discharge carrier 332," is moved up; at this time, the mechanical/2 is being moved down from the preparation position, and the four semiconductor components that it touches are pressed down to the test position, and the test is performed on the test stand.如图 Figure 15 lion, relying on the shuttle 33,,, right shift, so that the manbearing training" moved to the corresponding parent position, please refer to Figure 10, the mechanical arm can be, again declined, did not take The semiconductor component 5 to be tested, which is located at the loading carrier 331, ', rises, and the mechanical arm training" is maintained at the test position. When the discharge carrier moves to the discharge position, the output arm does not take four semiconductors. Components, and according to the processing of the miscellaneous 23", material, classification 各 to each mine should be divided into sets. · Subsequently and refer to Figure 17, no, the mechanical arm 221, '', will carry the test of the semiconductor element , J test position moves up, ready to move to the left of the circle, to the exchange position; the robot arm 2212", ° right to move to the ready position. Then, 'through the shuttle shuttle 33', 'will move back to the starting material carrier 331 and return to the feeding position, and then the semiconductor element 5' released by the arm is removed, and the machine is moved down to Qian Lu will be the semiconductor component to the discharge bearing machinery #22h scale_ with the swivel component down, and forced to the test seat for testing, in order to reply to the flow of Figure 12, into the next cycle, so repeat, until All the tests are completed. Lu J<Russian. The structure of °°°°T' not only makes the single through-feeding shuttle complete the loading and unloading mission, simplifying the test machine structure, effectively reducing the manufacturing cost, and also making the various jobs Department = has the fineness of 'the efficiency of the surface of semiconductor components, testing, and classification, β ^ detection efficiency and output, to achieve the purpose of reducing costs, while improving efficiency. Only the above is only the present invention The preferred embodiments are not to be construed as limiting the scope of the invention, and the equivalent equivalents and modifications of the scope of the invention and the description of the invention are still covered by the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of a conventional semiconductor component testing machine; 201209952 FIG. 2 is a plan view of a semiconductor component testing machine having a single through-feed shuttle according to a first preferred embodiment of the present invention; 3 is a front view of the semiconductor element gamma machine having a single-through conveying shuttle; FIG. 4 is a plan view of the machine of FIG. 2 in which the feeding arm does not take the semiconductor component to be tested and is placed on the feeding carrier; 13 is a top view of the machine of the semiconductor component carried by the human arm in the position of the arm of the arm of FIG. 2; FIG. 6 is the driving shuttle of FIG. 2 is driven to the left to return to the original position, ready to undertake FIG. 7 is a plan view of a machine for performing a test operation of a semiconductor component with two test arm assemblies according to a second preferred embodiment of the present invention; FIG. 8 is a through-transfer of FIG. Figure 9 is a top view of the machine in Figure 7, which is driven to the left by the drive carrier, and the lower half of the cycle is performed. Figure 5 is the feed of Figure 7. The carrier will be again a plan view of the machine that moves right to the right exchange position, and the discharge carrier is also moved right to the right discharge position; FIG. 11 is the next batch of FIG. 7 that allows the feed carrier to be re-accepted by the feed arm. The semiconductor chip to be tested, the test arm assembly has completed the completed conductor element transfer to the top of the discharge position of the discharge carrier of the left-hand exchange position; Figure 12 is a third preferred embodiment of the present invention by two sets of tests Top view of the machine with the upper and lower alternate rotation test of the arm assembly; Figure 13 and Figure 12 are front views of the two sets of test arm assemblies up and down alternately rotating the test machine; [S] 12 201209952 Figure 14 shows Figure 12 with two sets of test arm assemblies Figure I5 is a top view of the machine of Figure I2 moving through the shuttle shuttle to the right to move the loading carrier to the corresponding exchange position; Figure I6 is the same as the group of test arms of Figure I2 A side view of the machine that does not take down and test the semiconductor component to be tested; and FIG. 12 is a side view of the machine in which the positions of the two sets of test arm assemblies are alternately interchanged. [Main component symbol description]
基座 11， 入料區 12, 出料區 2， 測試裝置 2 卜 21’、21” 測試座 22ι、222'22’、22ι”、222”、22ι”’、222”， 測試臂組件 220’ 吸嘴 222’ 溫度調節件 221，、221丨”、22h”、221丨”，、22h，，， 機械臂 23,、23”、23”， 處理分類裝置 3， 輸送裝置 31、31，、31”、31”， 入料臂 32、32,、32”、32，，’ 出料臂 33 入料梭車 34 出料梭車 13 [S] 201209952 33’、33”、33”’ 貫穿輸送梭車 331，、33Γ、331，” 入料承載座 332,、332”、332，” 出料承載座 310,、320， 吸嘴 4、4， 入料匣 5 待測半導體元件 6 已測半導體元件 7， 、 7”， 分類料匣 [s] 14Base 11, feed zone 12, discharge zone 2, test set 2, 21', 21" test stand 22ι, 222'22', 22ι", 222", 22ι"', 222", test arm assembly 220' Suction nozzle 222' temperature regulating member 221, 221丨", 22h", 221丨", 22h,,, robot arm 23, 23", 23", processing sorting device 3, conveying device 31, 31, 31 ", 31", Feeding arms 32, 32, 32", 32,, 'Outlet arm 33 Feed shuttle 34 Outlet shuttle 13 [S] 201209952 33', 33", 33"' Through the transport shuttle Cars 331, 33, 331," loading carrier 332, 332", 332," discharge carrier 310, 320, nozzles 4, 4, feed 匣 5 semiconductor component to be tested 6 semiconductor component tested 7, 7", Category 匣[s] 14