TWI227324B - Machine allocation and processing processes of IC handler - Google Patents

Abstract

The invention relates to machine allocation and processing processes of an IC handler, and more particularly to one that sufficiently arranges and utilizes limited machine room to implement a material stacking and buffering part for massively stacking IC to be tested and reducing the machine down time due to the material supply, an empty IC tray allocating mechanism for sucking the empty material supply tray having ICs thereon unloaded by the material stacking and buffering area, dual IC delivery arms with each arm having two sucking heads for sucking a pair of ICs at one time and enhancing performance, an reciprocal delivery temporary storage tray for moving in/out the IC testing area so as to continue the tests conducted in the testing area, and a placing area for tested IC allowing the system to automatically determine the IC testing result and place the IC with good quality and IC with other class of quality so as to sufficiently utilize the characteristics and orientation of the workspace between this mechanism and other mechanism in formation of a machine allocation with high efficiency and minimum room occupation and a work machine with the simplified processing processes.

Description

1227324 丨 i__ -f-one-w-this invention is a machine configuration and processing of a 1C test processor, especially a machine used for IC_ test operation program processing and will reach the 1C test The u-style arrangement of each mechanism required by the test head to execute the test and complete the classification and placement of the test results is the configuration that is most in line with the work efficiency, so as to increase the performance of the operation. In the entire machine tooling process of the 1C test handler (IC Handler), the most important point is: how to maintain the test fluency of 1 (: IC TEST HEAD) as much as possible without making it test 1 (: The interruption of the operation affects the overall performance. The general 1C test processor does not focus on its 1 (: the smoothness of the flow on the machine, often only by a vacuum suction conveyor to suck 1C from the feed i to the test head Test, after the test, it will be transferred from the other-conveying arm to the final test area. #This simple and direct Ic wafer transfer process is the key to the overall production efficiency of the machine, because the IC test processor ’s machine is on the line 'Xiao often has a situation in which the supply of the test area is interrupted for the replacement of 1 (: receiving plate (TRAY)), or after the test is completed, "the test placement area is unavailable and the IC placement plate that is unavailable leads to The test area operation was performed by the male 1C test processor. The invention patent in this case can subtly study the entire operation procedure, and can make full use of the characteristics of the movement space between the mechanism and the mechanism. Direction to match Rate / space ratio maximum working machine. For the technical means used to achieve the above-mentioned purposes and advantages achieved by this creation, we will cooperate with the drawings and list the preferred embodiments as described below. Please refer to Figure 1 The main structure is a small machine, and on the machine 1 is provided with a stacking feeding buffer section 2, an empty disk scheduling mechanism 5, and an empty Ic tray U27324 i you.

^ Date of 1109519, description of the invention (2) = Zhiyuan: Department double 1C conveying arm 31, complete measurement department double 1c conveying arm 32, characteristics: plate '㈣ test area 7' IC complete test placement area 8 and other institutions, which Rush? : Set on the most side of the machine 'is the most stable tray full of 1C layer to be tested. Each feed tray can be lifted and conveyed in the ζ axis direction; and the feed tray of the layer can be made by the γ-axis transmission mechanism. Movement in the γ-axis direction; the 4 pallet dispatching mechanism: a base body with an X-axis transmission mechanism and its cantilever, and a 'vacuum suction cup is provided on the cantilever, and a central axis above the base body can be The rotation of the shaft center can suck the 'empty inclined cup' from the IC of the feeding buffer section and rotate '180. To the top of the empty 10 pallet stacking area, focus on the empty 1 (: to deposit the existing stacking area for backup, and the X-axis transmission mechanism moves the X axis, suck up the empty 1C pallet in the empty IC pallet stacking area, and place it in the 1C final measurement placement area ; Double IC conveying arm of the testing unit: · Equipped with double suction heads, which can suck a pair of c at a time, and an X-axis transmission mechanism can be used for X-axis conveying of 1C, which is mainly responsible for feeding the material from the slow-weighing department. The to-be-tested on the tray is sent to the IC slot of the human measurement IC that transports the temporary storage disk; the double 1C conveying arm of the yuan measurement department: equipped with double suction heads, which can suck a pair of ic at a time, with X-axis transmission mechanism and Y-axis transmission mechanism It can be used to transport 1C in the X and Y directions, and complete the test 1 (: Ic in the slot) to the test placement area. The temporary transport disk: set in the test area A pair of staggered temporary storage disks on both sides of the test head. The temporary storage disk is moved by the Y-axis transmission mechanism in the Y-axis direction to send the IC under test / completed IC into / out of the IC test area; IC Finished placement area: can be divided into good quality area and several other grade placement areas for

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f is being replaced by '贝 I # 9110951Q V. Description of the invention (3) IC classification and placement after the test. According to the above structures, the main process of the second figure Λ to the second figure c of the material supply slow balance process is as follows, please refer to the figure, the second figure D, the schematic diagram of the plane of the feeding buffer # \\ and the conveying arm B1 -> The third picture C- > The third picture D1 [The first picture A ~ > The third one HIA > 篦-HR ?, Sheng IC transportation 'and the test transmission area or the second image A- > The second circle- > The third diagram, the third diagram, the second plane D2, the plane movement diagram of the conveying area is shown as follows: ^ Inverse 'and Yuantest A) Place the IC (a) to be tested in the stacking buffer section 2 The material tray 2m is on the groove 211, and the supply tray 21 is stacked; the 1C block B) can be separated and placed on the Y-axis transmission mechanism 22 through the Z-axis lifting and separating mechanism. When the ¥ axis is moved, the first row of 1C sockets 212 is located at the coordinate position of the ic take-out position 23, and the feeding arm 1C conveying arm 31 takes out the ICs of the first row of IC sockets 212 ^ (a) After taking the ic (a) to be measured in the first row of 1C sockets 212, step-by-divide to the γ axis, so that the second row of 1C sockets 2 1 3 are located on the IC take-out position f 23 and continue to be fed into the testing unit 1C Conveying arm 31 takes out the IC under test (a); After the test tray 21 to take complete IC, continued feeding of stacked buffer section 2 and then the next feed tray 21 is removed. ', C) IC transfer arm 3 into the test section IC transfer arm 3 1 Fill out the test I c (a) into the temporary storage disk 41 into the test 1C socket 411 or the temporary storage disk 42 into the test 1C socket 421 . D) Please refer to the fourth diagrams A to E. The temporary storage disk 41 of the test area 2 after entering / completed the test is placed in the IC under test (a) by the process (C), and then sent to the test by the Y-axis transmission mechanism 41 3 The left side of the test head 71 in zone 7; At the same time, the temporary storage disk 4 2 is sent by the Y-axis transmission mechanism 4 2 3 from the right side of the test head 71 to the test zone 7 and accepted by the conveyor arm 31 of the test unit 1C.

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Enter the IC to be tested (a) to the temporary storage disk 42 into the test 1C socket 421 and wait for the next schedule. Send it to the test area 7 for testing. E) The test head 71 of the test area 7 first goes to the test IC socket 411 of the temporary storage disk 41 on the left side of the test head 71, and then returns to the test for the test IC (a). The test should be completed after the test. The test IC (b) is returned to the end of the temporary storage disk 41 in the test IC socket 412 and at the next time, the temporary storage disk 41 is sent out of the test area 7; at the same time, the temporary storage disk 42 is sent to the right side of the test head 71, and the test head 71 to The test 1 of the temporary storage disk 42 (: Take out the IC (b) to be tested in the seat 421 and return to the test for the test. After the test, the completed test ic (b) is returned to the completed test ic seat 422 of the temporary storage 42 and At the next time, the storage disk 42 is sent out of the test area 7, and the temporary storage disk 41 is sent to the right side of the test 71 again. "The end of the measurement section of the arm 1 1 The wheel transfer arm 32 will complete the temporary storage disk 41 and test the Ic slot 2 Take out the finished test in the 1C seat slot 422 in the internal or temporary storage disk 42 and remove it, and

The test results obtained at the time ‘$ are placed at the end of the test placement area 8 according to 1 bow net class. Λ sucks f 52 with its seat ㈣ is completely taken out and ^ α / Λ is sent to the feed tray 21 at the bottom of its Y axis. With its seat = C tray stacking area 6, it becomes an empty IC tray 61; ic (V and move ： 时 ”When the position of the good test product placing tray 81 is removed due to the completion of the test 1C 完, the empty Ic can also be sucked up by the tray 81 (such as the fifth picture of the wide = the sending arm every two rounds: The feeding tray is lost in the testing section 1C.

The seat slot is in place, so that the step-grid 'let the lower-row 1C juice can enter the measuring section and the 1C conveying arm can be maintained at a pure X-axis shift No. 1227324 91095519' X ~ α Correction of the moving route to carry the 1C to be tested 'No In addition, the empty disk scheduling mechanism uses a single body and kicking and cutting routes to reduce efficiency; the moving mechanism 53 can be used at the same time; ί;: ν plus rotating cantilever / X-axis transfer disk and empty IC tray stacking area, and ^ Use the feeding tray of the axial direction to convey to the good test product placement panel; = move, product. In addition, the test area Mm of the present invention has a characteristic of 1C, and the measured area is reduced to 1C. After the first 71 sets of ICs are measured, they can be picked up immediately on the other side of the temporary storage disk to be tested = this is endless. Recycling to ensure the highest operating efficiency of the 1 (: test processing machine). The application of the invention and the production of intellectual property has been ^ 要 备 # invention patent application is new, please. Utilization requirements, 爰The application of the invention patent filed according to the law is too popular. It is disclosed in the preferred embodiment of the above. However, it is not used for FF. Within two = He is familiar with this art, without departing from the essence of the invention. The same changes and retouching 'Therefore, when the J of the present invention, please refer to the definition of the scope of patent application attached.

A227324

Brief description of the drawing The drawing is a configuration diagram of each department of the machine of the ic test processor of the present invention. The second figure A to the second figure C are schematic diagrams of the feeding buffer portion and the IC conveying operation of the present invention. Fig. D is a schematic diagram of the operation of the feeding buffer portion of the present invention. : Figure A 'Bl, C, D1 or A, B2, c, D2 are schematic diagrams of the plane movement of the 1C conveying arm of the present invention when it enters or completes the measurement. $ 四 图 A ~ E are schematic diagrams of the plane operation of the test / test transport area and test area of the present invention. The fifth diagrams A and B are operation schematic diagrams of the supply-and-disc scheduling mechanism of the present invention. Symbols used in each figure are briefly explained: a. Ic to be tested b. Ic to be tested 1. machine 2 · stacking buffer unit 21 · feeding tray ^ 1 · IC socket 212 · first row 1C socket Z 1 3. The second row of IC sockets 22 · Y-axis transmission mechanism 2 3 · IC take-out position 3 · IC transfer arm 31 · Double 1C transfer arm

Page 10 1227324 1 is being replaced 519 91109519 Means a simple explanation of the correction pattern 311. X-axis transmission mechanism 3 1 2. Holding head assembly 32. Complete measurement unit double 1C conveying arm 321. X-axis transmission mechanism 3 2 2. Holding Head assembly 323. Stern shaft drive mechanism 4. Entry test / complete test conveyor area 41. Temporary storage disc 411. Entry test IC socket 412. End test 1C seat slot 41 3. Stern drive mechanism 42. Temporary drive disc 421. Entry test 1C Block Slot Complete Test 1C Block Slot 423 · Glaze Transmission Mechanism 5 2. Suction Arm 5. Empty Disk Scheduling Mechanism 51. Seat 53. Rotary Cantilever / X-Axis Transmission 6. Empty IC Tray Stacking Area 61. Empty 1C Tray 7. IC test area 72. Holding head assembly 71. IC test head 8. IC finished test placement area 81. Good test product placement plate 82. Other grade product placement plate

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Claims (1)

1227324 f is replacing page% 1 ^ 91109519 Amendment 1. A 1C test processor, the main structure is a small machine, and the machine is equipped with a stacking supply buffer section, an empty tray scheduling mechanism, and an empty 1C tray scheduling mechanism. 'Double 1C conveying arm in the testing section and double 1C conveying arm in the testing section, and the temporary storage disk is transported over and over.' 1C test area, IC completed test placement area and other organizations, which are characterized by: On the side, there is a stacked feed tray filled with I c to be tested, and each feed tray can be moved up and down in the Z-axis direction; and the top-level feed tray can be moved in the Y-axis direction by the Y-axis transmission mechanism; Empty 1C pallet dispatching mechanism: It consists of a base body with an X-axis transmission mechanism and its cantilever. 'The cantilever is equipped with a vacuum suction cup and can be rotated around the Z axis of the base body'. The feeding buffer can be taken out. The empty supply tray after the IC is sucked up and concentrated in the empty 1C tray stacking area for backup, or the X-axis transmission mechanism is used for X-axis movement. 'Place the empty 1C tray on the good product tray; Arm: with double suction head, can suck a pair of I c at a time, equipped with X-axis drive Structure for X-axis conveying IC; Meta-testing unit, double i C conveying arm: there are double suction heads, which can pick up a pair of I c at one time, which has X-axis transmission mechanism and γ-axis transmission mechanism, and can be used for χ-axis And I-axis conveyance I c 'is mainly responsible for conveying the I c to be tested on the supply tray of the supply buffer section to the test 1 (: seat slot; The complete test IC in the complete test 1C slot is transported to the final test placement area; the transit temporary storage disk: a pair of temporary temporary storage disks located on the two sides of the test head located in the test area, the temporary storage disk is driven by the gamma axis Those who use the mechanism to make repeated movements in the ¥ axis direction to send the IC under test / completed IC into / out of the IC test area; 1C complete test placement area: It can be divided into good product placement plates and other grades of mouth plates for complete test 1C Classified placements. Page 12 1227324 2. —The processing method of 1C test processor, the main part of which includes the 1C test processor described in item 1 of the scope of patent application, the processing flow is as follows: A) The 1C to be tested is placed in the stacking buffer buffer section. On the [0 seat groove of the material tray, and stack the supply trays; B) Via the Z-axis lifting and separating mechanism, the bottom plate of the supply tray can be separated separately and placed on the Y-axis transmission mechanism to make The γ axis moves, and the first row of 1C sockets is located exactly at the coordinate position of the ic take-out position, and the feeding arm 1C conveying arm takes out each of the test 1 () in the first row of IC sockets and puts them in the first row. ^ After taking the test slot 1C, step one step towards the γ axis to make the second row 1 (: the slot is located at the IC take-out position and continue to be fed into the test section [c conveying arm take-out test] c; when it is normal After the feeding tray has taken 1C to be tested, the second feeding tray of the stacking buffer section is continued; C) The IC of the 1C conveying arm is filled with the IC to be tested into the temporary storage tray into the test IC socket. Or the temporary storage disk is inserted into the test 丨 c block; D) The temporary storage disk into the testing / completed testing conveyor area is put into the process by (c). Test 1 (: After that, move to the Y-axis drive The left side of the test head sent into the test area; at the same time, the temporary storage disk is sent out from the right side of the test head by the γ-axis transmission mechanism. A time course is sent to the test area for testing; E) The test head of the test area takes out the Ic to be tested from the first test IC socket, and the test IC is returned to the temporary storage disk. The c block is sent out of the test area. At the same time, the duration of the temporary disk operation is first returned to the temporary storage disk on the left side for testing. After the test is completed, the temporary storage is sent to the right side of the test head in the next time slot. The test head Page 13 1227324 Go to the test IC socket of the temporary storage disk and take out the test 1 c. Then return to the test for the test. After the test, the completed test IC is returned to the temporary storage 1 c test slot and sent to the temporary storage disk at the next schedule. At the same time, the temporary storage disk is sent to the right side of the test head again at the same time; F) The end of the 1C conveyor arm 1C conveyor arm takes out the completed IC in the temporary storage disk 1C socket or the temporary storage IC in the IC socket According to the test results obtained during the test of the test head, they are sent to the IC complete test placement area and classified according to different levels; G) The empty disk scheduling mechanism is sucked up by its suction arm and completely taken out of the IC to be tested and transported The supply tray to the bottom of its Y axis is rotated into its empty 1C tray stacking area with its seat as the axis, and becomes an empty 1C tray; and its empty tray scheduling mechanism completes the test at the position where the good test product is placed. When 1C is removed, the empty IC tray in the stacking area of the empty IC tray can also be sucked up, instead of placing a good test product on the tray. 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