CN108847403B - An online chip patching method and device in burning equipment - Google Patents
An online chip patching method and device in burning equipment Download PDFInfo
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Abstract
Description
技术领域Technical field
本发明涉及芯片加工设备，具体涉及一种烧录设备中的在线补芯片方法及装置。The invention relates to chip processing equipment, and in particular to an online chip patching method and device in burning equipment.
背景技术Background technique
随着信息科技的发展，很多产品中均设有芯片，其中，芯片在具体应用之前，需要通过芯片烧录器将相应的数据烧录于芯片中。一般地，在烧录的过程中，需要将芯片放在烧录座的芯片槽中，然后再进行烧录，其中，烧录器的读写针从烧录座的底端向上延伸至芯片槽中，从而可以在芯片上进行读写任务，写入相关的信息；当芯片完成烧录后，需要进行统一收集，以便后续的存放和搬运。With the development of information technology, many products are equipped with chips. Before the chip is actually used, the corresponding data needs to be burned into the chip through a chip writer. Generally, during the burning process, the chip needs to be placed in the chip slot of the burning socket before burning. The read and write pins of the burner extend upward from the bottom of the burning socket to the chip slot. , so that reading and writing tasks can be performed on the chip and relevant information can be written; when the chip is burned, it needs to be collected uniformly for subsequent storage and transportation.
在有序的芯片烧录工作中，按照既定的顺序，先分别将芯片搬运至烧录座中，然后在芯片上写入对应的信息，烧录完毕后，再按顺序地将芯片收集起来。在卷盘式烧录机中，烧录结束后，芯片有序地收集在芯片带上，不同芯片存放在不同位置的芯片放置槽中。在工作的过程中，如果检测到存在不合格的芯片，将该不合格的芯片剔除，以免其与合格的芯片一起收集在芯片带上。但是，剔除不合格的芯片后，芯片带上对应的芯片放置槽将会空置，同时由于缺少了该芯片，后续需要增加工序补上，无法实现在线补芯片。In the orderly chip burning work, the chips are first moved to the burning socket in a predetermined order, and then the corresponding information is written on the chip. After the burning is completed, the chips are collected in order. In a reel-to-reel burner, after the burning is completed, the chips are collected in an orderly manner on the chip tape, and different chips are stored in chip placement slots at different locations. During the work process, if an unqualified chip is detected, the unqualified chip will be removed to prevent it from being collected on the chip tape together with the qualified chips. However, after the unqualified chips are eliminated, the corresponding chip placement slot on the chip belt will be vacant. At the same time, due to the lack of the chip, additional processes will be required to make up for it later, and online chip replacement cannot be achieved.
发明内容Contents of the invention
本发明的目的在于克服上述存在的问题，提供一种烧录设备中的在线补芯片方法，该在线补芯片方法能够在检测到不合格的芯片后进行在线补芯片，以替补该不合格的芯片，且还可以按照既定的顺序进行收集。The object of the present invention is to overcome the above-mentioned existing problems and provide an online chip compensation method in a burning device. This online chip compensation method can perform online chip compensation after detecting an unqualified chip to replace the unqualified chip. , and can also be collected in a predetermined order.
本发明的另一个目的在于提供一种烧录设备中的在线补芯片装置。Another object of the present invention is to provide an online chip patching device in a burning device.
本发明的目的通过以下技术方案实现：The object of the present invention is achieved through the following technical solutions:
一种烧录设备中的在线补芯片方法，包括以下步骤：An online chip compensation method in a burning device, including the following steps:
S1：检测到不合格的芯片后，剔除该芯片；S1: After detecting an unqualified chip, remove the chip;
S2：搬运机构将替补的芯片搬运至烧录座中，然后通过烧录器在替补的芯片上写入与被剔除的芯片相同的信息；S2: The transport mechanism transports the replacement chip to the burning socket, and then writes the same information as the rejected chip on the replacement chip through the writer;
S3：将芯片带上与被剔除的芯片对应的芯片槽空置；S3: Bring the chip to the empty chip slot corresponding to the rejected chip;
S4：当替补的芯片完成烧录后，驱动机构驱动芯片带作后退平移运动，使得被剔除的芯片对应的芯片放置槽平移回到收集工位处；S4: After the replacement chip is programmed, the driving mechanism drives the chip belt to perform a backward translational movement, causing the chip placement slot corresponding to the rejected chip to translate back to the collection station;
S5：搬运机构将已完成烧录的替补的芯片搬运至被剔除的芯片对应的芯片放置槽中，接着驱动机构驱动芯片带复位。S5: The transport mechanism transports the substitute chip that has been burned to the chip placement slot corresponding to the rejected chip, and then the driving mechanism drives the chip belt to reset.
本发明的一个优选方案，其中，在步骤S2，当替补的芯片搬运至烧录座中后，停止将位于烧录座中已完成烧录的芯片搬往收集工位。一般地，在现有的卷盘式烧录设备的收料装置中，空载的芯片带从放料盘上传送出来，绕至传送轮上，然后穿过收集工位，搬运机构将已烧录的芯片搬至收集工位处的芯片放置槽中，接着芯片带继续往前移动至复合工位中，与膜带复合，最后收卷到收料盘上。其中，收集工位到复合工位之间的距离有限，即芯片放到芯片放置槽后，接着芯片带往前移动，进行覆膜，所以当不合格的芯片被剔除后，需要尽快加入替补的芯片，避免被剔除的芯片对应的芯片放置槽越过复合工位，而没有放入替补的芯片；所以当替补的芯片在进行烧录时，停止将其他位于烧录座中的已完成烧录的芯片搬往收集工位处，这样可以间接地减短被剔除的芯片对应的芯片放置槽往前移动的距离，从而防止被剔除的芯片对应的芯片放置槽越过复合工位。In a preferred embodiment of the present invention, in step S2, after the replacement chip is transported to the burning seat, the chip that has been programmed in the burning seat stops being moved to the collection station. Generally, in the rewinding device of existing reel-type recording equipment, the unloaded chip tape is conveyed from the unloading tray, wound onto the conveying wheel, and then passes through the collection station. The conveying mechanism will transfer the burned chip tape. The recorded chips are moved to the chip placement slot at the collection station, and then the chip tape continues to move forward to the compounding station, compounded with the film tape, and finally wound up on the rewinding tray. Among them, the distance between the collection station and the compounding station is limited. That is, after the chips are placed in the chip placement slot, the chip belt then moves forward for coating. Therefore, after the unqualified chips are rejected, replacements need to be added as soon as possible. chip to prevent the chip placement slot corresponding to the eliminated chip from crossing the composite station without placing the replacement chip; therefore, when the replacement chip is being burned, stop placing other completed chips in the burning seat The chips are moved to the collection station, which can indirectly shorten the forward movement distance of the chip placement slot corresponding to the rejected chip, thereby preventing the chip placement slot corresponding to the rejected chip from crossing the composite station.
进一步地，搬运机构将位于烧录座和收集工位之间的芯片搬运至芯片带上。Further, the transport mechanism transports the chips located between the burning seat and the collection station to the chip tape.
本发明的一个优选方案，其中，在步骤S2中，当替补的芯片搬运至烧录座中后，搬运机构停止搬运工作。In a preferred embodiment of the present invention, in step S2, after the replacement chip is transported to the programming seat, the transport mechanism stops the transport work.
本发明的一个优选方案，其中，在步骤S4中，当替补的芯片完成烧录后，搬运机构将位于烧录座和收集工位之间的芯片以及替补的芯片依次搬运至芯片带上。具体地，收集工位与烧录取放工位之间设有若干个工位，包括以下一个或多个工位：用于在芯片上打上标识的激光打码工位、用于检测芯片是否合格的检测工位、用于端正芯片的姿态的定位工位等。当芯片烧录完毕后，需要经过上述若干个工位，才能到达收集工位，所以当替补的芯片烧录完毕后，搬运机构依次将位于烧录座和收集工位之间的芯片以及位于烧录座中的替补的芯片搬运至芯片带上，这样可以简化搬运机构的结构，使其仅用一个动力元件，即可完成在烧录座到收集工位之间的横向的驱动工作，从而同步往收集工位的方向搬运芯片。In a preferred embodiment of the present invention, in step S4, after the replacement chip is programmed, the transport mechanism sequentially transports the chip located between the burning seat and the collection station and the replacement chip to the chip tape. Specifically, there are several stations between the collection station and the burning and loading station, including one or more of the following stations: a laser coding station for marking the chip, and a laser coding station for testing whether the chip is qualified. Detection station, positioning station for correcting the attitude of the chip, etc. After the chip is burned, it needs to pass through several of the above-mentioned work stations before reaching the collection station. Therefore, after the replacement chip is burned, the transport mechanism will sequentially move the chip between the burning seat and the collection station and the chip between the burning station and the collection station. The substitute chip in the recording base is transported to the chip tape, which can simplify the structure of the transport mechanism and enable it to use only one power component to complete the lateral driving work between the recording base and the collection station, thereby synchronizing Transport the chips towards the collection station.
进一步地，当位于替补的芯片前方的芯片全部搬运至芯片带上后，驱动机构驱动芯片带作后退平移运动，使得被剔除的芯片对应的芯片放置槽后退回到收集工位上。在驱动机构的驱动下，整个收料装置包括芯片带往后平移，使得被剔除的芯片对应的芯片放置槽回到收集工位处，进而将替补的芯片搬运至该芯片放置槽中。Further, when all the chips located in front of the replacement chips are transported to the chip belt, the driving mechanism drives the chip belt to perform a backward translational movement, so that the chip placement slot corresponding to the rejected chip retreats back to the collection station. Driven by the driving mechanism, the entire collecting device including the chip belt moves backward, so that the chip placement slot corresponding to the rejected chip returns to the collection station, and then the replacement chip is transported to the chip placement slot.
一种用于实现上述在线补芯片方法的装置，包括用于搬送芯片的搬运机构以及用于驱动收料机构在收料方向上平移的后退驱动机构；A device for implementing the above-mentioned online chip patching method, including a transport mechanism for transporting chips and a retreat driving mechanism for driving a collecting mechanism to translate in the collecting direction;
其中，所述搬运机构包括移动板、驱动移动板作横向移动的横向驱动机构以及多组竖向搬运机构，所述多组竖向搬运机构沿直线等间距地设置在移动板上，且相邻两组竖向搬运机构之间的间距与相邻两个工位之间的间距相等；每组竖向搬运机构包括用于吸取芯片的吸取杆以及驱动吸取杆进行竖向运动的竖向驱动机构，所述吸取杆与负压装置连通；Wherein, the transportation mechanism includes a moving plate, a transverse driving mechanism that drives the moving plate to move laterally, and multiple groups of vertical transportation mechanisms. The multiple groups of vertical transportation mechanisms are arranged on the moving plate at equal intervals along a straight line, and are adjacent to each other. The distance between two sets of vertical conveying mechanisms is equal to the distance between two adjacent workstations; each set of vertical conveying mechanisms includes a suction rod for sucking chips and a vertical driving mechanism that drives the suction rod to move vertically. , the suction rod is connected with the negative pressure device;
所述收料机构的收集工位与烧录机构的烧录取放工位之间设有中间处理工位，该中间处理工位包括检测工位；所述收集工位、中间处理工位以及烧录取放工位于同一竖直面上，且位于竖向搬运机构的正下方；An intermediate processing station is provided between the collecting station of the collecting mechanism and the burning and releasing station of the burning mechanism. The intermediate processing station includes a detection station; the collecting station, the intermediate processing station and the burning and releasing station. The work release is located on the same vertical plane and directly below the vertical transport mechanism;
所述后退驱动机构设置在收料机构的下方，其驱动的方向垂直于横向搬运的方向。The retracting driving mechanism is arranged below the material collection mechanism, and its driving direction is perpendicular to the direction of transverse transportation.
上述在线补芯片装置的工作原理为：The working principle of the above-mentioned online chip compensation device is:
一般地，搬运机构从上料工位中将芯片搬运至烧录取放工位中的烧录座上进行烧录，芯片烧录完毕后，搬运机构再将芯片搬运至检测工位处，由检测工位处的检测机构检测芯片上写入的信息是否合格，最后搬运机构将合格的芯片搬运至收集工位中的芯片带上。Generally, the transport mechanism transports the chip from the loading station to the programming seat in the programming and placement station for programming. After the chip is burned, the transport mechanism transports the chip to the testing station, where the testing worker The detection mechanism at the location detects whether the information written on the chip is qualified, and finally the transport mechanism transports the qualified chips to the chip belt in the collection station.
具体地，在搬运机构的工作过程中，在竖向驱动机构的驱动下，吸取杆可作升降移动来吸取芯片，由于所有的竖向搬运机构均设置在移动板上，所以在横向驱动机构的驱动下，多个竖向搬运机构可作横向同步移动，将芯片搬运至下一个工位中，然后返回上一个工位，待吸取杆吸取芯片后，再移动至下一个中，以此逐步交替地将芯片往靠近收集工位的方向搬运。Specifically, during the working process of the transport mechanism, driven by the vertical drive mechanism, the suction rod can move up and down to pick up the chips. Since all vertical transport mechanisms are arranged on the moving plate, the horizontal drive mechanism can Under the drive, multiple vertical transport mechanisms can move horizontally synchronously to transport the chip to the next station, and then return to the previous station. After the suction rod absorbs the chip, it then moves to the next station, thus gradually alternating. Move the chips closer to the collection station.
进一步，当检测到不合格的芯片后，搬运机构将其剔除，然后再从上料工位中将替换的芯片搬运至烧录取放工位中，进而在替换的芯片上写入与被剔除的芯片相同的信息。其中，由于烧录机构中的烧录座均装载着芯片，在横向驱动机构的同步驱动下，将位于烧录座中已完成烧录的芯片搬运至相邻的中间处理工位中，同时将替换的芯片搬运至该烧录座中。Furthermore, when an unqualified chip is detected, the transport mechanism will reject it, and then transport the replacement chip from the loading station to the programming and placement station, and then write the same code as the rejected chip on the replacement chip. Same information. Among them, since the burning seats in the burning mechanism are loaded with chips, under the synchronous driving of the horizontal driving mechanism, the burned chips located in the burning seats are transported to the adjacent intermediate processing station, and at the same time, The replacement chip is moved to the programming socket.
当替换的芯片完成烧录后，在横向驱动机构和竖向驱动机构的驱动下，吸取杆将替换的芯片搬运至相邻的中间处理工位中(原先位于该工位中的芯片已同步搬离该工位)，接着再往收集工位的方向搬运替换的芯片。在此过程中，在搬运的方向上，位于替换的芯片前方的芯片依次按顺序地收集到对应的芯片放置槽上，其中，与被剔除的芯片对应的芯片放置槽会被空置，以便替换的芯片补上。When the replacement chip is programmed, driven by the horizontal driving mechanism and the vertical driving mechanism, the suction rod will transport the replacement chip to the adjacent intermediate processing station (the chip originally located in this station has been moved simultaneously. away from the station), and then transport the replacement chip in the direction of the collection station. During this process, in the direction of transportation, the chips located in front of the replaced chips are sequentially collected into the corresponding chip placement slots. Among them, the chip placement slots corresponding to the rejected chips will be vacant for replacement. Chip added.
在搬运机构的搬运下，当位于替补的芯片前方最近的芯片收集到芯片带上后，替补的芯片也随着移动至与收集工位相邻的中间处理工位上；其中，在收料机构的驱动下，空载的芯片带从放料盘上传送出来，绕至收集工位上，当搬运机构将已烧录的芯片搬至收集工位处的芯片放置槽中后，芯片带继续往前移动至复合工位中，与膜带复合，最后收卷到收料盘上。明显地，在位于替补的芯片前方的芯片收集到芯片带的过程中，与被剔除的芯片对应的芯片放置槽随着芯片带逐步往靠近复合工位的方向移动，当位于替补的芯片前方所有芯片均收集到芯片带上后，后退驱动机构驱动整个收料机构作后退平移运动，使得与被剔除的芯片对应的芯片放置槽平移回到收集工位处，接着搬运机构将替换的芯片搬运至其对应的芯片放置槽中，然后后退驱动机构再驱动收料机构复位，使得芯片带上下一个空载的芯片放置槽位于收集工位处，进行下一个芯片的收集工作。Under the transportation of the transport mechanism, when the chips closest to the substitute chips are collected on the chip belt, the substitute chips also move to the intermediate processing station adjacent to the collection station; among them, in the collecting mechanism Under the drive of It moves forward to the compounding station, is compounded with the film tape, and is finally wound up on the rewinding tray. Obviously, during the process of collecting the chips in front of the substitute chips into the chip belt, the chip placement slot corresponding to the rejected chip gradually moves toward the composite station along with the chip belt. When all the chips in front of the substitute chips are collected, After all the chips are collected on the chip belt, the retreat driving mechanism drives the entire collecting mechanism to perform a retreat translation movement, so that the chip placement slot corresponding to the rejected chip moves back to the collection station, and then the transport mechanism transports the replacement chip to The corresponding chip is placed in the slot, and then the retracting driving mechanism drives the collecting mechanism to reset, so that the next unloaded chip placing slot on the chip belt is located at the collection station, and the next chip is collected.
本发明的一个优选方案，其中，所述后退驱动机构包括后退驱动电机以及传动组件，所述传动组件包括丝杆和丝杆螺母，所述丝杆螺母通过固定板连接在收料机构的底板上。通过上述结构，在后退驱动电机的驱动下，收料机构可作垂直于横向搬运方向的直线移动，从而能够使得预先空置的芯片放置槽返回至收集工位处，进而将替换的芯片搬运至该芯片放置槽中。In a preferred solution of the present invention, the retraction drive mechanism includes a retraction drive motor and a transmission assembly, the transmission assembly includes a screw rod and a screw nut, and the screw nut is connected to the base plate of the retracting mechanism through a fixed plate. . Through the above structure, driven by the backward driving motor, the collecting mechanism can move in a straight line perpendicular to the lateral conveying direction, so that the previously vacant chip placement slot can be returned to the collection station, and then the replaced chips can be transported to the collection station. The chip is placed in the slot.
本发明与现有技术相比具有以下有益效果：Compared with the prior art, the present invention has the following beneficial effects:
本发明的在线补芯片方法和装置能够在检测到不合格的芯片后进行在线补芯片，以替补该不合格的芯片，且还可以按照既定的顺序进行收集。The online chip replenishment method and device of the present invention can perform online chip replenishment after detecting unqualified chips to replace the unqualified chips, and can also collect them in a predetermined order.
附图说明Description of the drawings
图1-为本发明的在线补芯片装置的工作流程俯视简图，其中，X表示芯片的横向搬运的方向，Y表示芯片收集的方向。Figure 1 - is a schematic top view of the work flow of the online chip patching device of the present invention, where X represents the direction of transverse transportation of chips, and Y represents the direction of chip collection.
图2-8为本发明的在线补芯片装置进行在线补芯片的俯视简图，其中，X表示芯片的横向搬运的方向，Y表示芯片收集的方向，检测工位中带有阴影的为不合格的芯片，烧录座中粗实线的为替换的芯片；图2为检测到不合格的芯片的简图，；图3为替换的芯片搬运至烧录座中的简图；图4为替换的芯片完成烧录并搬运至激光打码工位中的简图；图5为替换的芯片搬运至定位工位中的简图；图6为与被剔除的芯片对应的芯片放置槽后退平移回到收集工位中的简图；图7为替换的芯片搬运至对应的芯片放置槽中的简图；图8为后退驱动机构驱动收料机构复位后的简图。Figure 2-8 is a schematic top view of the online chip patching device of the present invention performing online chip patching, where The chip, the thick solid line in the programming socket is the replacement chip; Figure 2 is a simplified diagram of the unqualified chip detected; Figure 3 is a simplified diagram of the replacement chip being transported to the programming socket; Figure 4 is the replacement The simplified diagram of the chip being burned and transported to the laser coding station; Figure 5 is the simplified diagram of the replacement chip being transported to the positioning station; Figure 6 is the chip placement slot corresponding to the rejected chip being moved back Figure 7 is a schematic diagram of the replacement chip being transported to the corresponding chip placement slot; Figure 8 is a schematic diagram of the retracting drive mechanism driving the collecting mechanism to reset.
图9-10为本发明的搬运机构的工作原理简图，其中，图9为横向驱动机构驱动竖向搬运机构远离收集工位的简图，图10为横向驱动机构驱动竖向搬运机构靠近收集工位的简图。Figures 9-10 are schematic diagrams of the working principle of the transport mechanism of the present invention. Figure 9 is a schematic diagram of the transverse drive mechanism driving the vertical transport mechanism away from the collection station. Figure 10 is a schematic diagram of the transverse drive mechanism driving the vertical transport mechanism close to the collection station. Simplified drawing of work station.
图11-12为本发明的后退驱动机构和收料机构的正视图，其中，图11为正常工作状态下的正视图，图12为后退驱动机构驱动收料机构往后平移的正视图。Figures 11-12 are front views of the retracting drive mechanism and the collecting mechanism of the present invention, wherein Figure 11 is a front view in normal working condition, and Figure 12 is a front view of the retracting driving mechanism driving the retracting mechanism to translate backward.
具体实施方式Detailed ways
为了使本领域的技术人员很好地理解本发明的技术方案，下面结合实施例和附图对本发明作进一步描述，但本发明的实施方式不仅限于此。In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described below in conjunction with the embodiments and drawings, but the embodiments of the present invention are not limited thereto.
参见图9-12，本实施例中的在线补芯片装置，包括用于搬送芯片的搬运机构以及用于驱动收料机构7在收料方向上平移的后退驱动机构3；其中，所述搬运机构包括移动板、驱动移动板作横向移动的横向驱动机构4以及多组竖向搬运机构，所述多组竖向搬运机构沿直线等间距地设置在移动板上，且相邻两组竖向搬运机构之间的间距与相邻两个工位之间的间距相等；每组竖向搬运机构包括用于吸取芯片的吸取杆6以及驱动吸取杆6进行竖向运动的竖向驱动机构5，所述吸取杆6与负压装置连通；所述收料机构7的收集工位F与烧录机构的烧录取放工位B之间设有中间处理工位，该中间处理工位包括检测工位D；所述收集工位F、中间处理工位以及烧录取放工位B于同一竖直面上，且位于竖向搬运机构的正下方。Referring to Figures 9-12, the online chip patching device in this embodiment includes a transport mechanism for transporting chips and a retreat driving mechanism 3 for driving the collecting mechanism 7 to translate in the collecting direction; wherein, the transport mechanism It includes a moving plate, a transverse driving mechanism 4 that drives the moving plate to move laterally, and multiple sets of vertical conveying mechanisms. The multiple sets of vertical conveying mechanisms are arranged on the moving plate at equal intervals along a straight line, and two adjacent groups of vertical conveying mechanisms are The distance between the mechanisms is equal to the distance between two adjacent workstations; each set of vertical transport mechanisms includes a suction rod 6 for sucking chips and a vertical drive mechanism 5 that drives the suction rod 6 to move vertically, so The suction rod 6 is connected to the negative pressure device; an intermediate processing station is provided between the collecting station F of the collecting mechanism 7 and the burning and releasing station B of the burning mechanism, and the intermediate processing station includes a detection station D. ; The collection station F, the intermediate processing station and the burning and placing station B are on the same vertical plane, and are located directly below the vertical transport mechanism.
所述后退驱动机构3设置在收料机构7的下方，其驱动的方向垂直于横向搬运的方向。The backward driving mechanism 3 is arranged below the material collecting mechanism 7, and its driving direction is perpendicular to the direction of transverse transportation.
参见图9-12，所述中间处理工位还包括激光打码工位C和定位工位E，所述检测工位D位于激光打码工位C和定位工位E之间。在搬运机构的作用下，芯片从上料机构中的芯片带2上出来，依次被搬运至烧录取放工位B、激光打码工位C、检测工位D、定位工位E，最后收集在收集工位F中的芯片带2上。Referring to Figures 9-12, the intermediate processing station also includes a laser coding station C and a positioning station E, and the detection station D is located between the laser coding station C and the positioning station E. Under the action of the transport mechanism, the chips come out of the chip belt 2 in the loading mechanism, and are transported sequentially to the burning and placement station B, the laser coding station C, the detection station D, and the positioning station E, and are finally collected at Collect the chips in station F on strip 2.
所述后退驱动机构3包括后退驱动电机以及传动组件，所述传动组件包括丝杆和丝杆螺母，所述丝杆螺母通过固定板连接在收料机构7的底板上。通过上述结构，在后退驱动电机的驱动下，收料机构7可作垂直于横向搬运方向的直线移动，从而能够使得预先空置的芯片放置槽2-1返回至收集工位F处，进而将替换的芯片搬运至该芯片放置槽2-1中。The retraction drive mechanism 3 includes a retraction drive motor and a transmission assembly. The transmission assembly includes a screw rod and a screw nut. The screw nut is connected to the bottom plate of the retracting mechanism 7 through a fixed plate. Through the above structure, driven by the backward driving motor, the collecting mechanism 7 can move in a straight line perpendicular to the transverse conveying direction, so that the previously vacant chip placement slot 2-1 can be returned to the collection station F, and the replacement can be The chip is transferred to the chip placement slot 2-1.
所述横向驱动机构由横向驱动电机以及横向丝杆传动机构构成，其中，所述横向丝杠传动机构的丝杆与横向驱动电机的动力输出轴连接，所述横向丝杠传动机构的横向丝杆螺母与移动板固定连接。The transverse drive mechanism is composed of a transverse drive motor and a transverse screw transmission mechanism, wherein the screw of the transverse screw transmission mechanism is connected to the power output shaft of the transverse drive motor, and the transverse screw of the transverse screw transmission mechanism The nut is fixedly connected to the moving plate.
上述在线补芯片装置的工作原理为：The working principle of the above-mentioned online chip compensation device is:
一般地，搬运机构从上料工位A中将芯片搬运至烧录取放工位B中的烧录座1上进行烧录，芯片烧录完毕后，搬运机构再将芯片搬运至检测工位D处，由检测工位D处的检测机构检测芯片上写入的信息是否合格，最后搬运机构将合格的芯片搬运至收集工位F中的芯片带2上。Generally, the transport mechanism transports the chip from the loading station A to the programming seat 1 in the programming and placement station B for burning. After the chip is burned, the transport mechanism transports the chip to the testing station D. , the detection mechanism at the detection station D detects whether the information written on the chip is qualified, and finally the transportation mechanism transports the qualified chips to the chip tape 2 in the collection station F.
具体地，在搬运机构的工作过程中，在竖向驱动机构5的驱动下，吸取杆6可作升降移动来吸取芯片，由于所有的竖向搬运机构均设置在移动板上，所以在横向驱动机构4的驱动下，多个竖向搬运机构可作横向同步移动，将芯片搬运至下一个工位中，然后返回上一个工位，待吸取杆6吸取芯片后，再移动至下一个中，以此逐步交替地将芯片往靠近收集工位F的方向搬运。Specifically, during the working process of the transportation mechanism, driven by the vertical driving mechanism 5, the suction rod 6 can move up and down to suck the chips. Since all vertical transportation mechanisms are arranged on the moving plate, they can be driven horizontally Driven by mechanism 4, multiple vertical transport mechanisms can move horizontally synchronously to transport the chip to the next station, and then return to the previous station. After the suction rod 6 absorbs the chip, it then moves to the next station. In this way, the chips are gradually and alternately transported in the direction close to the collection station F.
进一步，当检测到不合格的芯片后，搬运机构将其剔除，然后再从上料工位A中将替换的芯片搬运至烧录取放工位B中，进而在替换的芯片上写入与被剔除的芯片相同的信息。其中，由于烧录机构中的烧录座1均装载着芯片，在横向驱动机构4的同步驱动下，将位于烧录座1中已完成烧录的芯片搬运至激光打码工位C中，同时将替换的芯片搬运至该烧录座1中。Furthermore, when an unqualified chip is detected, the transport mechanism will reject it, and then transport the replacement chip from the loading station A to the programming and placement station B, and then write and reject the replaced chip. chip with the same information. Among them, since the burning seats 1 in the burning mechanism are loaded with chips, the chips that have been burned in the burning seats 1 are transported to the laser coding station C under the synchronous driving of the horizontal driving mechanism 4. At the same time, transport the replacement chip to the programming base 1.
当替换的芯片完成烧录后，在横向驱动机构4和竖向驱动机构5的驱动下，吸取杆6将替换的芯片搬运至激光打码工位C中(原先位于该工位中的芯片已同步搬离该工位)，打码完毕后，接着再往收集工位F的方向搬运替换的芯片。在此过程中，在搬运的方向上，位于替换的芯片前方的芯片依次按顺序地收集到对应的芯片放置槽2-1上，其中，与被剔除的芯片对应的芯片放置槽2-1会被空置，以便替换的芯片补上。When the replacement chip is programmed, driven by the horizontal driving mechanism 4 and the vertical driving mechanism 5, the suction rod 6 will transport the replacement chip to the laser coding station C (the chip originally located in this station has been Move out of the station synchronously), after the coding is completed, then move the replacement chip in the direction of the collection station F. During this process, in the direction of transportation, the chips located in front of the replaced chips are sequentially collected into the corresponding chip placement slots 2-1, wherein the chip placement slots 2-1 corresponding to the rejected chips will Vacant to be filled by replacement chips.
在搬运机构的搬运下，当位于替补的芯片前方最近的芯片收集到芯片带2上后，替补的芯片也随着移动至定位工位E上；其中，在收料机构7的驱动下，空载的芯片带2从放料盘上传送出来，绕至收集工位F上，当搬运机构将已烧录的芯片搬至收集工位F处的芯片放置槽2-1中后，芯片带2继续往前移动至复合工位G中，与膜带复合，最后收卷到收料盘上。明显地，在位于替补的芯片前方的芯片收集到芯片带2的过程中，与被剔除的芯片对应的芯片放置槽2-1随着芯片带2逐步往靠近复合工位G的方向移动，当位于替补的芯片前方所有芯片均收集到芯片带2上后，后退驱动机构3驱动整个收料机构7作后退平移运动，使得与被剔除的芯片对应的芯片放置槽2-1平移回到收集工位F处，接着搬运机构将替换的芯片搬运至其对应的芯片放置槽2-1中，然后后退驱动机构3再驱动收料机构7复位，使得芯片带2上下一个空载的芯片放置槽2-1位于收集工位F处，进行下一个芯片的收集工作。Under the transportation of the transport mechanism, when the chips closest to the substitute chip are collected on the chip belt 2, the substitute chip also moves to the positioning station E; among them, driven by the collecting mechanism 7, the empty chip The loaded chip tape 2 is transported out of the discharge tray and wound to the collection station F. When the transport mechanism moves the burned chips to the chip placement slot 2-1 at the collection station F, the chip tape 2 Continue to move forward to the compounding station G, compound it with the film tape, and finally wind it up on the rewinding tray. Obviously, in the process of collecting the chips in front of the substitute chips into the chip belt 2, the chip placement slot 2-1 corresponding to the rejected chip gradually moves toward the composite station G along with the chip belt 2. When After all the chips located in front of the substitute chips are collected on the chip belt 2, the retreat driving mechanism 3 drives the entire collecting mechanism 7 to perform a retreat translation movement, so that the chip placement slot 2-1 corresponding to the rejected chip moves back to the collection process. At position F, the transport mechanism then transports the replaced chip to its corresponding chip placement slot 2-1, and then the backward driving mechanism 3 drives the collecting mechanism 7 to reset, so that there is an unloaded chip placement slot 2 above the chip belt 2. -1 is located at the collection station F and collects the next chip.
参见图1-8，上述在线补芯片装置的补芯片方法，包括以下步骤：Referring to Figure 1-8, the chip compensation method of the above-mentioned online chip compensation device includes the following steps:
S1：当检测机构检测到不合格的芯片后，搬运机构剔除该芯片，如图2。S1: When the detection mechanism detects an unqualified chip, the transport mechanism removes the chip, as shown in Figure 2.
S2：搬运机构将烧录座中已完成烧录的芯片搬运至下一个工位(激光打码工位C)中，同时将替补的芯片搬运至该烧录座1的芯片槽中，其他工位上的芯片也移动至下一工位中；然后通过烧录器在替补的芯片上写入与被剔除的芯片相同的信息，如图3；此时，搬运机构停止搬运工作。S2: The transport mechanism transports the programmed chip in the programming socket to the next station (laser coding station C), and at the same time transports the replacement chip to the chip slot of the programming socket 1. Other work The chip on the station is also moved to the next station; then the same information as the rejected chip is written on the replacement chip through the writer, as shown in Figure 3; at this time, the transportation mechanism stops the transportation work.
一般地，在现有的卷盘式烧录设备的收料机构7中，空载的芯片带2从放料盘上传送出来，绕至传送轮上，然后穿过收集工位F，搬运机构将已烧录的芯片搬至收集工位F处的芯片放置槽2-1中，接着芯片带2继续往前移动至复合工位G中，与膜带复合，最后收卷到收料盘上。其中，收集工位F到复合工位G之间的距离有限，即芯片放到芯片放置槽2-1后，接着芯片带2往前移动，进行覆膜，所以当不合格的芯片被剔除后，需要尽快加入替补的芯片，避免被剔除的芯片对应的芯片放置槽2-1越过复合工位G，而没有放入替补的芯片；所以当替补的芯片在进行烧录时，停止将其他位于烧录座1中的已完成烧录的芯片搬往收集工位F处，这样可以间接地减短被剔除的芯片对应的芯片放置槽2-1往前移动的距离，从而防止被剔除的芯片对应的芯片放置槽2-1越过复合工位G。Generally, in the rewinding mechanism 7 of the existing reel-type recording equipment, the unloaded chip tape 2 is transported out of the rewinding tray, wound onto the transmission wheel, and then passes through the collection station F. The transport mechanism Move the burned chip to the chip placement slot 2-1 at the collection station F, then the chip tape 2 continues to move forward to the compounding station G, compounded with the film tape, and finally rolled up on the rewinding tray . Among them, the distance between the collection station F and the composite station G is limited, that is, after the chip is placed in the chip placement slot 2-1, the chip belt 2 then moves forward for coating, so when the unqualified chips are removed , it is necessary to add the substitute chip as soon as possible to prevent the chip placement slot 2-1 corresponding to the eliminated chip from crossing the composite station G without placing the substitute chip; therefore, when the substitute chip is being burned, stop placing other chips in The burned chips in the burning seat 1 are moved to the collection station F, which can indirectly shorten the forward movement distance of the chip placement slot 2-1 corresponding to the rejected chip, thereby preventing the rejected chip from moving forward. The corresponding chip placement slot 2-1 crosses the composite station G.
S3：当替补的芯片完成烧录后，搬运机构依次将定位工位E、检测工位D、激光打码工位C以及烧录座1中替换的芯片搬运至收集工位F中；其中，按照预定的顺序，在搬运的过程中，将与被剔除的芯片对应的芯片放置槽2-1空置，如图4-5。S3: After the replacement chip is programmed, the transport mechanism will sequentially transport the replaced chip in the positioning station E, the detection station D, the laser coding station C and the burning seat 1 to the collection station F; among them, According to the predetermined order, during the transportation process, the chip placement slot 2-1 corresponding to the rejected chip is left vacant, as shown in Figure 4-5.
S4：当替换的芯片搬运至定位工位E后，后退驱动机构3驱动整个收料机构7作后退平移运动，使得被剔除的芯片对应的芯片放置槽2-1后退回到收集工位F上，如图6。S4: When the replaced chip is transported to the positioning station E, the retreat driving mechanism 3 drives the entire collecting mechanism 7 to perform a retreat translation movement, so that the chip placement slot 2-1 corresponding to the rejected chip retreats back to the collection station F. , Figure 6.
S5：搬运机构将已烧录的替补的芯片搬运至被剔除的芯片对应的芯片放置槽2-1中，接着驱动机构驱动芯片带2复位，如图7-8。S5: The transport mechanism transports the burned replacement chip to the chip placement slot 2-1 corresponding to the rejected chip, and then the driving mechanism drives the chip belt 2 to reset, as shown in Figure 7-8.
上述为本发明较佳的实施方式，但本发明的实施方式并不受上述内容的限制，其他的任何未背离本发明的精神实质与原理下所做的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本发明的保护范围之内。The above is the preferred embodiment of the present invention, but the embodiment of the present invention is not limited by the above content. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention can be made. All should be equivalent substitutions, and all are included in the protection scope of the present invention.
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|---|---|---|---|---|
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| CN206184793U (en) * | 2016-09-20 | 2017-05-24 | 东莞市台工电子机械科技有限公司 | An LED product automatic backspace replenishment mechanism |
| CN107293512A (en) * | 2017-08-05 | 2017-10-24 | 广州明森科技股份有限公司 | A kind of chip packaging device of multicore smart card |
| CN207451064U (en) * | 2017-07-28 | 2018-06-05 | 广东天机工业智能系统有限公司 | Cycle haulage equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106269545A (en) * | 2016-08-29 | 2017-01-04 | 福州派利德电子科技有限公司 | IC chip braid defective products automatic removing device |
| CN206184793U (en) * | 2016-09-20 | 2017-05-24 | 东莞市台工电子机械科技有限公司 | An LED product automatic backspace replenishment mechanism |
| CN207451064U (en) * | 2017-07-28 | 2018-06-05 | 广东天机工业智能系统有限公司 | Cycle haulage equipment |
| CN107293512A (en) * | 2017-08-05 | 2017-10-24 | 广州明森科技股份有限公司 | A kind of chip packaging device of multicore smart card |
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