CN108847403B - On-line chip supplementing method and device in burning equipment - Google Patents
On-line chip supplementing method and device in burning equipment Download PDFInfo
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- CN108847403B CN108847403B CN201810800369.9A CN201810800369A CN108847403B CN 108847403 B CN108847403 B CN 108847403B CN 201810800369 A CN201810800369 A CN 201810800369A CN 108847403 B CN108847403 B CN 108847403B
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000001502 supplementing effect Effects 0.000 title claims abstract description 8
- 230000007246 mechanism Effects 0.000 claims abstract description 152
- 230000033001 locomotion Effects 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 21
- 238000012545 processing Methods 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 8
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 9
- 239000002131 composite material Substances 0.000 description 8
- 238000013329 compounding Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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Abstract
The invention discloses an on-line chip supplementing method and device in burning equipment, comprising the following steps: after detecting the unqualified chip, rejecting the chip; the carrying mechanism carries the replacement chip into the burning seat, and then writes information which is the same as the removed chip on the replacement chip through the burner; the chip grooves on the chip belt corresponding to the removed chips are empty; when the replacement chip is burnt, the driving mechanism drives the chip belt to do backward translational motion, so that the chip placing groove corresponding to the removed chip translates back to the collecting station; and the carrying mechanism carries the burnt replacement chips to the chip placing grooves corresponding to the removed chips, and then the driving mechanism drives the chip belt to reset. The on-line chip repairing method and the device can be used for repairing the chip on line after detecting the unqualified chip so as to replace the unqualified chip, and can also be used for collecting according to a given sequence.
Description
Technical Field
The invention relates to chip processing equipment, in particular to an on-line chip supplementing method and device in burning equipment.
Background
Along with development of information technology, chips are provided in many products, wherein the chips are required to burn corresponding data into the chips by a chip burner before specific application. Generally, in the process of burning, a chip is required to be placed in a chip groove of a burning seat, and then the burning is performed, wherein a read-write needle of a burner extends upwards from the bottom end of the burning seat to the chip groove, so that a read-write task can be performed on the chip, and related information is written; after the chip is burnt, unified collection is needed for subsequent storage and transportation.
In ordered chip burning work, chips are firstly conveyed to a burning seat according to a given sequence, then corresponding information is written in the chips, and after burning is finished, the chips are sequentially collected. In a reel type burner, after the burning is finished, chips are orderly collected on a chip belt, and different chips are stored in chip placing grooves at different positions. During operation, if the presence of a failed chip is detected, the failed chip is rejected so as not to be collected on the chip strap together with the failed chip. However, after the unqualified chips are removed, the corresponding chip placement grooves on the chip tape are empty, and meanwhile, due to the lack of the chips, the subsequent process is required to be added for chip replenishment, and the online chip replenishment cannot be realized.
Disclosure of Invention
The present invention aims to overcome the above-mentioned problems, and provides an on-line chip repairing method in a burning device, which can perform on-line chip repairing after detecting an unqualified chip to replace the unqualified chip, and can also perform collection according to a predetermined sequence.
Another object of the present invention is to provide an on-line chip repairing device in a burning apparatus.
The aim of the invention is achieved by the following technical scheme:
an on-line chip supplementing method in a burning device comprises the following steps:
s1: after detecting the unqualified chip, rejecting the chip;
s2: the carrying mechanism carries the replacement chip into the burning seat, and then writes information which is the same as the removed chip on the replacement chip through the burner;
s3: the chip grooves on the chip belt corresponding to the removed chips are empty;
s4: when the replacement chip is burnt, the driving mechanism drives the chip belt to do backward translational motion, so that the chip placing groove corresponding to the removed chip translates back to the collecting station;
s5: and the carrying mechanism carries the burnt replacement chips to the chip placing grooves corresponding to the removed chips, and then the driving mechanism drives the chip belt to reset.
In a preferred embodiment of the present invention, in step S2, after the replacement chip is transported to the recording seat, the transportation of the chip in the recording seat after the recording is completed to the collecting station is stopped. Generally, in a receiving device of an existing reel type recording device, an empty chip tape is conveyed from a discharging tray, wound on a conveying wheel, then passes through a collecting station, a conveying mechanism conveys a recorded chip to a chip placing groove at the collecting station, then the chip tape continues to move forward to a compounding station to be compounded with a film tape, and finally is wound on the receiving tray. The distance from the collecting station to the composite station is limited, namely after the chips are placed in the chip placing groove, the chips are moved forwards to be coated, so that after unqualified chips are removed, replacement chips are required to be added as soon as possible, and the chips corresponding to the removed chips are prevented from crossing the composite station without placing the replacement chips; therefore, when the replacement chip is burnt, the other burnt chips in the burning seat are stopped from being moved to the collecting station, so that the distance of the chip placing groove corresponding to the removed chip moving forward can be indirectly shortened, and the chip placing groove corresponding to the removed chip is prevented from crossing the composite station.
Further, the handling mechanism carries the chips between the burning seat and the collecting station to the chip belt.
In a preferred embodiment of the present invention, in step S2, after the replacement chip is transported to the burning seat, the transporting mechanism stops the transporting operation.
In a preferred embodiment of the present invention, in step S4, after the replacement chip finishes the burning, the carrying mechanism carries the chip located between the burning seat and the collecting station and the replacement chip onto the chip strap in sequence. Specifically, a plurality of stations are arranged between the collecting station and the burning taking and placing station, and the collecting station comprises one or more of the following stations: a laser coding station for marking on a chip, a detection station for detecting whether the chip is qualified, a positioning station for correcting the posture of the chip, and the like. After the chip is burnt, the chip can reach the collecting station through the plurality of stations, so after the replacement chip is burnt, the carrying mechanism carries the chip between the burning seat and the collecting station and the replacement chip in the burning seat onto the chip belt in sequence, the structure of the carrying mechanism can be simplified, and the chip can be carried in the direction of the collecting station by using only one power element.
Further, after all chips in front of the replacement chips are carried onto the chip belt, the driving mechanism drives the chip belt to do backward translational motion, so that the chips which are removed and correspond to the chip placing grooves are returned to the collecting station. Under the drive of the driving mechanism, the whole material collecting device comprises a chip belt which moves backwards, so that a chip placing groove corresponding to the removed chip returns to the collecting station, and the replaced chip is carried to the chip placing groove.
The device for realizing the online chip repairing method comprises a carrying mechanism for carrying chips and a backward driving mechanism for driving the receiving mechanism to translate in the receiving direction;
the conveying mechanisms comprise a moving plate, a transverse driving mechanism for driving the moving plate to transversely move and a plurality of groups of vertical conveying mechanisms, wherein the groups of vertical conveying mechanisms are arranged on the moving plate at equal intervals along a straight line, and the interval between two adjacent groups of vertical conveying mechanisms is equal to the interval between two adjacent stations; each group of vertical carrying mechanisms comprises a suction rod for sucking the chip and a vertical driving mechanism for driving the suction rod to vertically move, and the suction rods are communicated with the negative pressure device;
an intermediate processing station is arranged between the collecting station of the material receiving mechanism and the burning taking and placing station of the burning mechanism, and comprises a detection station; the collecting station, the intermediate processing station and the burning taking and placing workers are positioned on the same vertical surface and are positioned right below the vertical conveying mechanism;
the backward driving mechanism is arranged below the material receiving mechanism, and the driving direction of the backward driving mechanism is perpendicular to the transverse carrying direction.
The working principle of the on-line chip supplementing device is as follows:
generally, the handling mechanism carries the chip from the feeding station to the burning seat in the burning, taking and placing station for burning, after the chip is burnt, the handling mechanism carries the chip to the detecting station, the detecting mechanism at the detecting station detects whether the information written on the chip is qualified or not, and finally the handling mechanism carries the qualified chip to the chip belt in the collecting station.
Specifically, in the working process of the carrying mechanism, under the drive of the vertical driving mechanism, the sucking rod can be lifted to suck the chips, and as all the vertical carrying mechanisms are arranged on the moving plate, under the drive of the horizontal driving mechanism, the plurality of vertical carrying mechanisms can be transversely and synchronously moved to carry the chips to the next station and then return to the last station, and after the sucking rod sucks the chips, the chips are moved to the next station, so that the chips are carried towards the direction close to the collecting station in a gradual and alternative mode.
Further, after the unqualified chips are detected, the carrying mechanism rejects the unqualified chips, then carries the replaced chips from the feeding station to the burning, taking and placing station, and further writes the same information as the rejected chips on the replaced chips. The writing bases in the writing mechanism are loaded with chips, and the chips which are positioned in the writing bases and are subjected to writing are conveyed to adjacent intermediate processing stations under the synchronous driving of the transverse driving mechanism, and meanwhile, the replaced chips are conveyed to the writing bases.
After the replacement chip is burnt, the suction rod is driven by the transverse driving mechanism and the vertical driving mechanism to convey the replacement chip to an adjacent intermediate processing station (the chip originally positioned in the station is synchronously conveyed away from the station), and then the replacement chip is conveyed towards the direction of the collecting station. In the process, chips positioned in front of the replaced chips are sequentially collected onto the corresponding chip placement grooves in the conveying direction, wherein the chip placement grooves corresponding to the removed chips are empty so as to be filled with the replaced chips.
Under the carrying of the carrying mechanism, after the nearest chip positioned in front of the replacement chip is collected on the chip belt, the replacement chip also moves to an intermediate processing station adjacent to the collecting station along with the replacement chip; under the drive of the receiving mechanism, the empty chip belt is conveyed out from the discharging disc and wound on the collecting station, after the burnt chip is carried into a chip placing groove at the collecting station by the carrying mechanism, the chip belt continuously moves forward to the compounding station to be compounded with the film belt, and finally the chip belt is wound on the collecting disc. Obviously, in the process that chips in front of the replacement chips are collected to the chip belt, the chip placing groove corresponding to the removed chips moves along with the chip belt gradually towards the direction close to the composite station, when all chips in front of the replacement chips are collected to the chip belt, the whole material collecting mechanism is driven by the back driving mechanism to do back translational movement, so that the chip placing groove corresponding to the removed chips is translated to the collecting station, then the carrying mechanism carries the replaced chips to the corresponding chip placing groove, then the back driving mechanism drives the material collecting mechanism to reset, so that the chip placing groove with the next empty load is located at the collecting station, and the collecting work of the next chip is carried out.
According to a preferred scheme of the invention, the backward driving mechanism comprises a backward driving motor and a transmission assembly, wherein the transmission assembly comprises a screw rod and a screw rod nut, and the screw rod nut is connected to a bottom plate of the material receiving mechanism through a fixing plate. Through the structure, under the drive of the backward driving motor, the material receiving mechanism can linearly move perpendicular to the transverse conveying direction, so that the chip placing groove which is empty in advance can be returned to the collecting station, and the replaced chip is conveyed into the chip placing groove.
Compared with the prior art, the invention has the following beneficial effects:
the on-line chip repairing method and the on-line chip repairing device can be used for repairing the unqualified chips on line after the unqualified chips are detected so as to replace the unqualified chips, and can be used for collecting according to a given sequence.
Drawings
FIG. 1-is a schematic top view of the workflow of the on-line chip replenishment device of the present invention, wherein X represents the direction of lateral transport of the chips and Y represents the direction of chip collection.
FIGS. 2-8 are schematic top views of an on-line chip repairing apparatus for performing on-line chip repairing according to the present invention, wherein X represents the direction of the lateral transportation of chips, Y represents the direction of chip collection, a failed chip with shadows in the inspection station, and a replaced chip with thick solid lines in the burning seat; FIG. 2 is a schematic diagram of a chip that detects failure; FIG. 3 is a simplified diagram of an alternate chip being transported into a burn seat; FIG. 4 is a schematic diagram of an alternate chip completed burn-in and carried into a laser coding station; FIG. 5 is a schematic diagram of an alternate chip handling into a positioning station; FIG. 6 is a schematic view of a chip placement slot corresponding to a rejected chip back translated back into a collection station; FIG. 7 is a schematic diagram of an alternate chip being carried into a corresponding chip placement tank; fig. 8 is a schematic diagram of the return drive mechanism after the receiving mechanism is reset.
Fig. 9-10 are diagrams of the working principle of the handling mechanism according to the invention, wherein fig. 9 is a diagram of the lateral drive mechanism driving the vertical handling mechanism away from the collecting station, and fig. 10 is a diagram of the lateral drive mechanism driving the vertical handling mechanism towards the collecting station.
Fig. 11-12 are front views of the retraction drive mechanism and the retraction mechanism of the present invention, wherein fig. 11 is a front view in a normal operating state and fig. 12 is a front view of the retraction drive mechanism driving the retraction mechanism to translate rearward.
Detailed Description
In order that those skilled in the art will well understand the technical solutions of the present invention, the following describes the present invention further with reference to examples and drawings, but the embodiments of the present invention are not limited thereto.
Referring to fig. 9 to 12, the on-line chip repairing apparatus in this embodiment includes a carrying mechanism for carrying chips and a retreat driving mechanism 3 for driving the receiving mechanism 7 to translate in a receiving direction; the conveying mechanisms comprise a moving plate, a transverse driving mechanism 4 for driving the moving plate to transversely move and a plurality of groups of vertical conveying mechanisms, wherein the plurality of groups of vertical conveying mechanisms are arranged on the moving plate at equal intervals along a straight line, and the interval between two adjacent groups of vertical conveying mechanisms is equal to the interval between two adjacent stations; each group of vertical conveying mechanisms comprises a suction rod 6 for sucking chips and a vertical driving mechanism 5 for driving the suction rod 6 to vertically move, and the suction rod 6 is communicated with a negative pressure device; an intermediate processing station is arranged between the collecting station F of the material receiving mechanism 7 and the burning taking and placing station B of the burning mechanism, and comprises a detection station D; the collecting station F, the intermediate processing station and the burning, taking and placing station B are arranged on the same vertical surface and are positioned right below the vertical conveying mechanism.
The backward driving mechanism 3 is arranged below the material receiving mechanism 7, and the driving direction of the backward driving mechanism is perpendicular to the transverse conveying direction.
Referring to fig. 9-12, the intermediate processing station further includes a laser coding station C and a positioning station E, and the detection station D is located between the laser coding station C and the positioning station E. Under the action of the conveying mechanism, chips come out from the chip belt 2 in the feeding mechanism and are sequentially conveyed to the burning, taking and placing station B, the laser coding station C, the detection station D and the positioning station E, and finally are collected on the chip belt 2 in the collecting station F.
The backward driving mechanism 3 comprises a backward driving motor and a transmission assembly, the transmission assembly comprises a screw rod and a screw rod nut, and the screw rod nut is connected to a bottom plate of the material receiving mechanism 7 through a fixing plate. Through the structure, the material receiving mechanism 7 can linearly move perpendicular to the transverse conveying direction under the drive of the backward driving motor, so that the chip placing groove 2-1 which is empty in advance can be returned to the collecting station F, and the replaced chip can be conveyed into the chip placing groove 2-1.
The transverse driving mechanism consists of a transverse driving motor and a transverse screw rod transmission mechanism, wherein a screw rod of the transverse screw rod transmission mechanism is connected with a power output shaft of the transverse driving motor, and a transverse screw rod nut of the transverse screw rod transmission mechanism is fixedly connected with the moving plate.
The working principle of the on-line chip supplementing device is as follows:
generally, the handling mechanism carries the chip from the feeding station a to the burning seat 1 in the burning, taking and placing station B for burning, after the chip is burnt, the handling mechanism carries the chip to the detecting station D, the detecting mechanism at the detecting station D detects whether the information written on the chip is qualified, and finally the handling mechanism carries the qualified chip to the chip belt 2 in the collecting station F.
Specifically, in the working process of the carrying mechanism, under the driving of the vertical driving mechanism 5, the sucking rod 6 can be lifted to suck the chips, and as all the vertical carrying mechanisms are arranged on the moving plate, under the driving of the horizontal driving mechanism 4, the plurality of vertical carrying mechanisms can be transversely and synchronously moved to carry the chips to the next station, then return to the last station, after the sucking rod 6 sucks the chips, the chips are moved to the next station, so that the chips are gradually and alternately carried towards the direction close to the collecting station F.
Further, after the unqualified chips are detected, the carrying mechanism rejects the unqualified chips, then carries the replaced chips from the feeding station A to the burning, taking and placing station B, and further writes information identical to the rejected chips on the replaced chips. The writing seat 1 in the writing mechanism is loaded with chips, and the chips which are positioned in the writing seat 1 and are subjected to writing are conveyed to the laser coding station C under the synchronous driving of the transverse driving mechanism 4, and meanwhile, the replaced chips are conveyed to the writing seat 1.
After the replaced chip is burnt, the sucking rod 6 carries the replaced chip into the laser coding station C (the chip originally positioned in the station is synchronously moved away from the station) under the drive of the transverse driving mechanism 4 and the vertical driving mechanism 5, and after coding, the replaced chip is carried towards the direction of the collecting station F. In this process, chips located in front of the replaced chips are sequentially collected onto the corresponding chip placement grooves 2-1 in the direction of conveyance, wherein the chip placement grooves 2-1 corresponding to the removed chips are left empty for replacement chips to be replenished.
Under the carrying of the carrying mechanism, after the nearest chip positioned in front of the replacement chip is collected on the chip belt 2, the replacement chip also moves to the positioning station E along with the replacement chip; under the drive of the material receiving mechanism 7, the empty chip belt 2 is conveyed out from the material discharging disc, wound on the collecting station F, and when the conveying mechanism conveys the burnt chip to the chip placing groove 2-1 at the collecting station F, the chip belt 2 continuously moves forward to the compounding station G to be compounded with the film belt, and finally wound on the material receiving disc. Obviously, in the process that chips in front of the replacement chips are collected to the chip belt 2, the chip placing groove 2-1 corresponding to the removed chips moves along with the chip belt 2 gradually towards the direction close to the composite station G, after all chips in front of the replacement chips are collected to the chip belt 2, the whole material collecting mechanism 7 is driven by the back driving mechanism 3 to do back translational motion, so that the chip placing groove 2-1 corresponding to the removed chips translates back to the collecting station F, then the replacement chips are conveyed to the corresponding chip placing grooves 2-1 by the conveying mechanism, then the material collecting mechanism 7 is driven by the back driving mechanism 3 to reset, and the chip placing groove 2-1 with the upper and lower empty chips of the chip belt 2 is located at the collecting station F, so that the collecting work of the next chip is carried out.
Referring to fig. 1-8, the chip repairing method of the on-line chip repairing device comprises the following steps:
s1: when the detecting mechanism detects an unqualified chip, the carrying mechanism rejects the chip, as shown in fig. 2.
S2: the carrying mechanism carries the chip which is burnt in the burning seat to the next station (laser coding station C), and simultaneously carries the replacement chip to the chip groove of the burning seat 1, and the chips on other stations are also moved to the next station; then writing the same information as the rejected chip on the replaced chip through a writer, as shown in fig. 3; at this time, the conveying mechanism stops the conveying work.
Generally, in the receiving mechanism 7 of the existing reel type recording apparatus, the empty chip tape 2 is transferred from the discharge tray, wound onto the transfer wheel, then passes through the collecting station F, the carrier mechanism moves the recorded chip to the chip placement groove 2-1 at the collecting station F, then the chip tape 2 continues to move forward to the compounding station G to be compounded with the film tape, and finally wound up on the receiving tray. The distance from the collecting station F to the composite station G is limited, namely after the chips are placed in the chip placing groove 2-1, the chip belt 2 moves forwards to perform film coating, so that after unqualified chips are removed, replacement chips are required to be added as soon as possible, and the chip placing groove 2-1 corresponding to the removed chips is prevented from crossing the composite station G, and the replacement chips are not placed in the chip placing groove; therefore, when the replacement chip is burned, the other burned chips in the burning seat 1 are stopped from being moved to the collecting station F, so that the distance of the chip placing groove 2-1 corresponding to the removed chip moving forward can be indirectly shortened, and the chip placing groove 2-1 corresponding to the removed chip is prevented from crossing the composite station G.
S3: after the replacement chips are burnt, the carrying mechanism carries the positioning station E, the detection station D, the laser coding station C and the chips replaced in the burning seat 1 into the collecting station F in sequence; wherein, in a predetermined order, the chip placement grooves 2-1 corresponding to the removed chips are left empty during the handling, as shown in fig. 4-5.
S4: after the replaced chips are carried to the positioning station E, the whole material receiving mechanism 7 is driven by the backward driving mechanism 3 to do backward translational motion, so that the chips corresponding to the removed chips are placed in the chip placing grooves 2-1 and then returned to the material receiving station F, as shown in fig. 6.
S5: the carrying mechanism carries the burnt replacement chips to the chip placing grooves 2-1 corresponding to the removed chips, and then the driving mechanism drives the chip belt 2 to reset, as shown in fig. 7-8.
The foregoing is illustrative of the present invention, and is not to be construed as limiting thereof, but rather as various changes, modifications, substitutions, combinations, and simplifications which may be made without departing from the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (5)
1. An on-line chip supplementing method in a burning device is characterized by comprising the following steps:
s1: after detecting the unqualified chip, rejecting the chip;
s2: the carrying mechanism carries the replacement chip into the burning seat, and then writes information which is the same as the removed chip on the replacement chip through the burner;
s3: the chip grooves on the chip belt corresponding to the removed chips are empty;
s4: when the replacement chip is burnt, the driving mechanism drives the chip belt to do backward translational motion, so that the chip placing groove corresponding to the removed chip translates back to the collecting station; the method comprises the following steps:
a plurality of stations are arranged between the collecting station and the burning taking and placing station, and the device comprises: the device comprises a laser coding station for coding marks on a chip and a detection station for detecting whether the chip is qualified or not;
after the chip is burnt, the chip can reach the collecting station only through the stations; after all chips in front of the replacement chips are carried onto the chip belt, the driving mechanism drives the chip belt to do backward translational movement, so that the chips which are removed and correspond to the chip placing grooves are returned to the collecting station;
s5: and the carrying mechanism carries the burnt replacement chips to the chip placing grooves corresponding to the removed chips, and then the driving mechanism drives the chip belt to reset.
2. The method for on-line chip replenishment in a burning apparatus according to claim 1, wherein in step S2, after the replacement chip is transported to the burning seat, the transportation of the burned chip located in the burning seat to the collecting station is stopped.
3. The method for on-line chip replenishment in a burning apparatus according to claim 1, wherein in step S2, the transporting mechanism stops the transporting operation after the replacement chip is transported to the burning seat.
4. An on-line chip repairing device applying the on-line chip repairing method in a burning apparatus according to any one of claims 1 to 3, characterized by comprising a carrying mechanism for carrying chips and a back driving mechanism for driving a receiving mechanism to translate in a receiving direction;
the conveying mechanisms comprise a moving plate, a transverse driving mechanism for driving the moving plate to transversely move and a plurality of groups of vertical conveying mechanisms, wherein the groups of vertical conveying mechanisms are arranged on the moving plate at equal intervals along a straight line, and the interval between two adjacent groups of vertical conveying mechanisms is equal to the interval between two adjacent stations; each group of vertical carrying mechanisms comprises a suction rod for sucking the chip and a vertical driving mechanism for driving the suction rod to vertically move, and the suction rods are communicated with the negative pressure device;
an intermediate processing station is arranged between the collecting station of the material receiving mechanism and the burning taking and placing station of the burning mechanism, and comprises a detection station; the collecting station, the intermediate processing station and the burning taking and placing workers are positioned on the same vertical surface and are positioned right below the vertical conveying mechanism;
the backward driving mechanism is arranged below the material receiving mechanism, and the driving direction of the backward driving mechanism is perpendicular to the transverse carrying direction;
when unqualified chips are detected, the carrying mechanism rejects the unqualified chips, carries the replaced chips from the feeding station to the burning, taking and placing station, and writes information identical to the rejected chips on the replaced chips; and under the synchronous driving of the transverse driving mechanism, the chip which is positioned in the burning seat and is burnt is conveyed to the adjacent intermediate processing station, and meanwhile, the replaced chip is conveyed to the burning seat.
5. The on-line chip repairing device according to claim 4, wherein the back driving mechanism comprises a back driving motor and a transmission assembly, the transmission assembly comprises a screw rod and a screw rod nut, and the screw rod nut is connected to a bottom plate of the material receiving mechanism through a fixing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810800369.9A CN108847403B (en) | 2018-07-19 | 2018-07-19 | On-line chip supplementing method and device in burning equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810800369.9A CN108847403B (en) | 2018-07-19 | 2018-07-19 | On-line chip supplementing method and device in burning equipment |
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| CN108847403A CN108847403A (en) | 2018-11-20 |
| CN108847403B true CN108847403B (en) | 2023-10-31 |
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| CN112233994B (en) * | 2020-10-13 | 2021-08-24 | 珠海市科迪电子科技有限公司 | Chip gold wire detection method |
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| CN106269545A (en) * | 2016-08-29 | 2017-01-04 | 福州派利德电子科技有限公司 | IC chip braid defective products automatic removing device |
| CN206184793U (en) * | 2016-09-20 | 2017-05-24 | 东莞市台工电子机械科技有限公司 | Automatic backspace feed supplement mechanism of LED product |
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