JPH11326451A - Measuring device for electronic part, measuring method using it and conveying method of electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance processing efficiency of measuring system by providing in parallel measuring portions, providing a dedicated transferring robot on every measuring portions and independently controlling the action of the transferring robot. SOLUTION: A first measuring portion 14 and a second measuring portion 15 are connected in parallel to a test head 13 of a measuring device. The measuring portions 14, 15 are disposed on a line tightening a supplying sorter 4 and an accommodating sorter 18 and tightening a supplying sorter 19 and an accommodating sorter 10. Thereby, an operation (attachment/detachment) for transferring and measuring IC to be measured by a head 3 and a head 8 on both measuring portions 14, 15 is carried out in a narrow range at a short distance to accomplish a throughput of the measurement. Then, a first transferring robot and a second transferring robot are provided in dedicated for the first measuring portion 14 and the second measuring portion 15 connected in parallel, respectively. Since a measurement of the other IC can be started immediately after a measurement of one IC is completed by independently controlling the respective actions, a processing efficiency of a measuring system is enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a measuring device for measuring and inspecting electronic components such as ICs and LSIs, a measuring method using the same, and a method of transporting electronic components for realizing an efficient measuring method. It is about.

[0002]

2. Description of the Related Art A conventional IC measuring apparatus and inspection apparatus will be described below.

FIG. 8 shows a conventional IC measurement system. In FIG. 8, reference numeral 1 denotes an IC supply sorter moved to a receiving position, 2 denotes operation lines of the first and second transfer robots, 3 denotes a head of the first transfer robot, and 4 denotes supply to the first transfer robot. The IC supply sorter to be moved to the position, 5 is the rail of the first transfer robot horizontal movement linear movement system, 6 is the measuring unit, 7 is the rail of the measurement IC supply sorter movement linear movement system, and 8 is the second. 9 is the rail of the linear motion system for horizontal movement of the second transfer robot, 9 is the IC storage sorter after measurement moved to the receiving position from the second transfer robot, and 11 is the IC storage sorter after measurement Reference numeral 12 denotes a rail of the linear motion system for use, a reference numeral 12 denotes a sorter for storing ICs after being moved to a delivery position, and a reference numeral 13 denotes a test head of a measuring device.

The test unit 13 of the measuring device has a measuring unit 6
Is connected. The measuring unit 6 is arranged on the operation line 2 of the first and second transfer robots.

The IC supply sorters 1 and 4 move along the rail 7 of the linear movement system for moving the IC supply sorter, and the storage sorters 10 and 12 after measurement use the linear movement system for moving the IC storage sorter. It moves along the rail 11.

The operation of the IC measuring system configured as described above will be described below. First, the first IC to be measured is supplied to the IC to be measured supply sorter 4 which has moved to the receiving position, and moves on the operation line 2 of the first and second transfer robots. The head 3 of the first transfer robot holds the first IC to be measured stored in the IC supply sorter 4 moved to the supply position to the first transfer robot in a vacuum, and holds the first transfer robot horizontally. It moves along the rail 5 of the moving linear motion system and comes into contact with the measuring unit 6. The measurement is started while maintaining the state where the head 3 of the first transfer robot presses the first IC to be measured against the measuring section 6.

[0007] The first transfer robot head 3 to the first
The IC supply sorter 4 which has moved to the supply position to the first transfer robot which has finished supplying the IC to be measured immediately receives the IC to be measured along the rail 7 of the linear movement system for moving the IC supply sorter. Move to position.

The measured IC supply sorter 1 that has moved to the receiving position receives the second measured IC from the preceding unit and returns to the position for supplying to the first transfer robot. After the measurement is completed, the head 3 of the first transfer robot moves to the first measured I
The holding of C is stopped, the first IC to be measured is left on the measuring section 6, and the IC is immediately moved onto the IC sorter 4 at the supply position to the first transfer robot, and the second IC to be measured is transferred to the first transfer robot. Hold in vacuum.

As soon as the head 3 of the first transfer robot moves from above the measurement unit 6, the head 8 of the second transfer robot moves along the rail 9 of the linear movement system for horizontal movement of the second transfer robot 6. The first IC to be measured, which has been moved upward and has been measured, is held in vacuum, transferred, and moved to a receiving position from the second transfer robot, and then stored in the IC storage sorter 10 after measurement.

The post-measurement IC storage sorter in which the post-measurement IC is stored moves to the IC delivery position after the measurement along the rail 11 of the post-measurement IC storage sorter moving linear motion system. After the measurement, the IC storage sorter 12 that has moved to the transfer position transfers the IC after the measurement to the rear unit, and returns to the receiving position from the second transfer robot. As soon as the head 8 of the second transfer robot moves from above the measuring unit 6, the head 3 of the first transfer robot moves along the rail 5 of the first transfer robot horizontal movement linear motion system, and The IC to be measured is transferred to the measuring section 6 and measurement is started. Thereafter, the same operation is repeated.

[0011]

However, in the above-mentioned conventional configuration, the head 3 of the first transfer robot moves from the measuring section 6 after the measurement of the first IC to be measured is completed, and the second The head 8 of the transfer robot removes the first IC to be measured from the measuring unit 6, and the head 3 of the first transfer robot transfers the second IC to be measured to the measuring unit 6 until the measurement is started. There was waiting time.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an IC measurement system for starting measurement of a second IC to be measured immediately after completion of measurement of a first IC to be solved in order to solve the above-mentioned conventional problems. And

[0013]

SUMMARY OF THE INVENTION The present invention provides first and second embodiments.
A first transfer unit that conveys the electronic component to be measured to a standby position before measurement, and moves the first electronic component to be measured from the standby position to the first measurement unit before measurement, and ends the measurement. After that, a second transfer means for moving from the first measuring section to a storage position for storing the first electronic component to be measured, and moving the second electronic component to be measured from the measurement standby position before measurement. A third transfer unit that moves the second electronic component to be measured from the second measurement unit to the storage position after the electronic component is moved to the second measurement unit and the measurement is completed; And a fourth transfer means for moving the second electronic component to be measured from the storage position after the measurement is completed.

Further, according to the present invention, while one of the first and second electronic components to be measured is being measured by the first measuring unit and the second measuring unit, the other electronic component to be measured is The measurement is awaited while being held by the transfer means.
Alternatively, after the second electronic component to be measured has cut off the contact with the measuring section, the other electronic component to be measured is brought into contact with any one of the measuring sections, and then the other electronic component to be measured is measured. This is a method for measuring electronic components.

Further, the present invention relates to a method for transporting electronic components for measuring a plurality of electronic components, wherein the first electronic component to be measured is transferred to a first measuring section and the first electronic component to be measured is transferred. A component is mounted on the first measuring unit, and while the first electronic component to be measured is mounted, a second electronic component to be measured is transferred to a position near the second measuring unit, and the first electronic component is measured. After the mounting of the electronic component to be measured is released from the first measuring section, the second electronic component to be measured is mounted on the second measuring section, and the second electronic component to be measured is mounted on the second measuring section. The third electronic component to be measured is caused to stand by near the first measuring unit while being mounted on the measuring unit, and after the mounting of the second electronic component to be measured is released, the third electronic component to be measured is released. This is a method for transporting an electronic component in which the electronic component to be measured is mounted on the first measuring unit.

With the above arrangement, the electronic component measuring apparatus, the measuring method, and the transporting method according to the present invention are arranged such that one of the transfer means is connected to the second measuring unit during measurement of the electronic component by the first measuring unit. Immediately above, the second electronic component to be measured, which has been aligned, is held and waiting, the measurement of the first electronic component to be measured is completed, and the first electronic component to be measured is held. Immediately after one transfer unit is separated from the first measurement unit, one of the transfer units is lowered so that the second electronic component to be measured comes into contact with the second measurement unit and the second measurement unit is moved. By starting the measurement of the electronic component, the time from the end of the measurement of the first electronic component to be measured to the start of the measurement of the second electronic component to be measured is minimized. , Measurement equipment) can be improved.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a first transfer means for transferring first and second electronic devices to be measured to a standby position before measuring them, The first electronic component to be measured is moved from the measurement standby position to the first measuring section, and after the measurement is completed, the first electronic component is moved from the first measuring section to a storage position for storing the first electronic component to be measured. 2) moving the second electronic component to be measured from the measurement standby position to the second measuring section before the measurement, and moving the second electronic component to be measured to the second electronic component after the measurement. A third transfer means for moving from the measuring section to the storage position, and a fourth transfer means for moving the first and second electronic components to be measured from the storage position after the measurement is completed. It is a measuring device for electronic components provided.

According to this, when measuring a large number of electronic components, the time until the next measurement can be shortened, so that the operating rate of the measuring device can be improved.

The second aspect of the present invention is the first aspect.
, The first transfer means transfers the first measured electronic component and the second measured electronic component respectively to the first standby position and the second standby position, and the fourth transfer means terminates the measurement. Thereafter, the electronic component measuring apparatus stores the first electronic component to be measured and the second electronic component to be measured at the first storage position and the second storage position, respectively.

According to this, the electronic component to be measured is transferred to the vicinity of each of the first measuring unit and the second measuring unit before the measurement, and the first measuring unit and the second Can be received near the measuring unit, so that the operating range of the second transfer unit and the third transfer unit can be narrowed and shortened, so that the throughput of the measurement device can be improved.

According to a third aspect of the present invention, the first measuring section is disposed on a line connecting the first standby position and the first storage position, and the second standby position and the second storage position are arranged. 2. The electronic component measuring device according to claim 1, wherein the second measuring unit is arranged on a line connecting the positions.

According to this, it is possible to reduce the time for transporting and measuring the electronic component to be measured. According to a fourth aspect of the present invention, the second transfer means and the third transfer means are provided with attachment / detachment means for attaching / detaching the electronic component to be measured to / from the first measurement unit and the second measurement unit, respectively. The electronic component measuring device according to claim 1.

Thus, the time required for attaching and detaching a plurality of electronic components to be measured in the measuring section can be reduced.

According to a fifth aspect of the present invention, there is provided the electronic component measuring apparatus according to the first aspect, wherein the first and second measuring units are electrically connected in parallel.

Thus, the same measurement / inspection can be continuously performed, so that the measurement / inspection throughput can be improved.

According to a sixth aspect of the present invention, while the first measuring section and the second measuring section are measuring either one of the first and second electronic components to be measured, the second measuring section performs the second measuring operation. Alternatively, the first or second electronic component to be measured is held by the third transfer means to wait for the measurement, and the first or second electronic component to be measured during the measurement cuts off the contact with the measuring unit. After that, the other electronic component to be measured is brought into contact with one of the measurement units, and thereafter, the other electronic component to be measured is measured.

According to this, the electronic component to be measured, which is waiting for measurement, is in a position very close to the measuring unit, so that the mounting time to the measuring unit before shifting to the next measurement can be shortened. .

According to a seventh aspect of the present invention, there is provided a method for transporting an electronic component for measuring a plurality of electronic components, wherein the first electronic component to be measured is moved to a first measuring section. The first electronic component to be measured is mounted on the first measuring section, and the second electronic component to be measured is placed near the second measuring section while the first electronic component to be measured is mounted. And after the mounting of the first electronic component to be measured from the first measuring unit is released, the second electronic component to be measured is mounted on the second measuring unit, and the second While the electronic component to be measured is mounted on the second measuring unit, a third electronic component to be measured is made to stand by near the first measuring unit;
A method of transporting an electronic component in which the third electronic component to be measured is mounted on the first measuring unit after the mounting of the second electronic component to be measured is released.

According to this method, when sequentially measuring a plurality of electronic components to be measured, the electronic components to be measured are supplied to the measuring unit, the measuring unit performs the measurement, and the measured electronic components are received from the measuring unit after the measurement. The time required for a series of flows can be shortened.

Hereinafter, specific examples of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a configuration of an IC measuring device according to the present invention. In FIG. 1, reference numeral 1 denotes an IC supply sorter moved to a receiving position, 3 denotes a head of the first transfer robot, 4 denotes an IC supply sorter moved to a supply position to the first transfer robot, and 5 denotes a sorter. 1 is a rail of a linear motion system for horizontal movement of a transfer robot, 7 is a rail of a linear motion system for moving a sorter for supplying an IC to be measured, 8 is a head of a second transfer robot, and 9 is a linear motion of a second transfer robot. Rail of the system, 10 is a sorter for storing IC after measurement moved to the receiving position from the second transfer robot, 11 is a rail of a linear motion system for moving the sorter for IC storage after measurement, 12 is IC storing after moving to the delivery position. A sorter, 13 is a test head of a measuring device, 14 is a first measuring unit, 15 is a second measuring unit, 16 is an operation line of the first transfer robot, and 17 is an operation line of the second transfer robot. 18
Is an IC storage sorter after measurement moved to the receiving position from the first transfer robot, and 19 is a measured IC supply sorter moved to the supply position to the second transfer robot.

The main parts of the measuring apparatus of the present invention are a first transfer means including the IC supply sorters 1, 4, 19 and the rail 7, a second transfer means including the head 3 and the rail 5, and a head 8; The third transfer means including the rail 9, and the fourth transfer means including the storage sorters 18, 10 and 12 and the rail 11.

The IC supply sorter 1 of the first transfer means mounts the IC to be measured, slides the rail 7 and
It is set to stop near 4,15.

The I to be measured waiting in the IC supply sorter 4
C is transferred to the measuring section 14 by the head 3 of the second transfer means. The transferred IC to be measured is measured by the measuring unit 14 (IC
Socket) to perform a predetermined measurement. When the measurement is completed, the head 3 removes the IC to be measured from the measuring section 14 and transfers the IC to the storage sorter 18 of the fourth transfer means. The IC under test transferred to the storage sorter 18 moves to the next processing step along the rail 11.

The IC to be measured waiting in the IC supply sorter 19 is transferred to the measuring section 15 by the head 8 of the third transfer means. The transferred IC to be measured is measured by the measuring unit 15.
(IC socket) to perform a predetermined measurement.
When the measurement is completed, the head 8 removes the IC to be measured from the measuring section 15 and transfers the IC to the storage sorter 10 of the fourth transfer means. The measured IC transferred to the storage sorter 10 is the rail 1
Move to the next processing step along 1.

The operation of making the IC to be measured stand by in the IC supply sorter 4 and the operation of making it stand by in the IC supply sorter 19 are performed alternately, and the measurements in the measuring units 14 and 15 are also performed alternately.

A first measuring unit 14 and a second measuring unit 15 are connected in parallel to a test head 13 of the measuring device. The first measurement unit 14 is on the operation line 16 of the first transfer robot, and the second measurement unit 15 is on the operation line 1 of the second transfer robot.
7 respectively.

The measured IC supply sorter 1 that has moved to the receiving position receives the measured IC from the preceding unit. The head 3 of the first transfer robot holds the IC stored in the IC supply sorter 4 to be moved to the supply position to the first transfer robot in a vacuum, and holds the IC for horizontal movement of the first transfer robot. Slide along the rails 5 of the motion system,
After being transferred to the measuring section 14 and brought into contact with the measuring section 14, the operation of moving to the receiving position from the first transfer robot while maintaining the vacuum and then transferring to the IC storage sorter 18 after measurement is repeated.

The measuring section 14 is arranged on a line connecting the supply sorter 4 and the storage sorter 18. Thereby, the operation for transferring and measuring the IC to be measured by the head 3 (removal)
Is performed in a narrow range and at a short distance, and the measurement throughput is achieved.

The measuring section 15 is arranged on a line connecting the supply sorter 19 and the storage sorter 10. Thus, the operation for transferring and measuring the IC to be measured by the head 8 (removal)
Is performed in a narrow range and at a short distance, and the measurement throughput is achieved.

The head 8 of the second transfer robot holds the IC housed in the measured IC supply sorter 19 which has been moved to the supply position to the second transfer robot in a vacuum, and holds the horizontal position of the second transfer robot. It slides along the rail 9 of the moving linear motion system and is transferred to the second measuring section 15 where the measuring section 1 is moved.
After the contact with the IC transfer sorter 10, the transfer is repeated in the order of the IC storage sorter 10 after the measurement.

The measured IC supply sorters 4 and 19 receive the measured IC from the preceding unit at the measured IC receiving position, and operate on the operation line 16 of the first transfer robot or the operation line 17 of the second transfer robot. Transfer up, first
The operation of supplying the IC to be measured to the head 3 of the transfer robot or the head 8 of the second transfer robot is repeated.

After the measurement, the IC storage sorters 18 and 10
On the operation line 16 of the first transfer robot or on the operation line 17 of the second transfer robot.
Alternatively, the operation of receiving the IC after the measurement from the head 8 of the second transfer robot, transferring the IC to the IC transfer position after the measurement, and transferring the IC after the measurement to the subsequent unit is repeated.

The operation of the measuring system configured as described above will be described with reference to the drawings.

FIGS. 2 to 7 are perspective views of main parts of FIG.
The same parts as those in FIG. 1 are denoted by the same reference numerals. Reference numeral 20 denotes a wiring, 21 denotes a first IC, 22 denotes a rail of a first transfer robot elevating linear motion system, 23 denotes a second IC, 24 denotes a second transfer robot elevating linear motion system rail, 25 is a third IC.

One of the wiring 20 and the wiring 27 is connected to the first measuring section 14 and the second measuring section 15. Wiring 20
Is divided into two parts, and a wiring 20 is provided on the first measuring unit side.
A is connected to the wiring 20B on the second measurement unit side.

One side of the wiring 27 is also branched into two,
The wiring 27A is connected to the measuring unit 14 side, and the wiring 27B is connected to the second measuring unit 15 side.

That is, in the embodiment of the present invention, the first
The wiring 20A and the wiring 27A are connected to the measuring unit 14 side so that two ICs can be measured simultaneously.

The wiring 20B and the wiring 27B are connected to the second measuring section 15 side, and the configuration is the same as that of the first measuring section 14 side.

The other side of the wirings 20 and 27 is not shown in the figure, but is used to measure the IC under test.
The measurement units 14 and 15 are provided with a voltage source and a current source for supplying a voltage and a current, and are connected to a tester side for determining whether or not the measurement result is acceptable. Therefore, the embodiment of the present invention shows a case where two testers are prepared.

The head 3 of the first transfer robot has the first I
C21 is held in a vacuum, and is transferred to a position directly above the first measuring unit 14 along the rail 5 of the first transfer robot horizontal movement linear motion system, and the first transfer robot lift linear movement system rail is moved. It descends along 22 and the measurement has now begun. On the other hand, the head 8 of the second transfer robot holds the second IC 23 housed in the measured IC supply sorter 19 moved to the supply position to the second transfer robot in a vacuum, and the second transfer robot It moves right above the second measuring unit 15 along the rail 9 of the horizontal movement linear motion system, and waits (FIG. 2).

When the measurement of the first IC 21 is completed, the head 3 of the first transfer robot rises along the rail 22 of the first transfer robot elevating linear motion system while holding the first IC 21 in vacuum. At the moment when the first IC 21 cuts off the contact with the first measuring unit 14, the head 8 of the second transfer robot moves at the timing when the second IC 23 comes into contact with the second measuring unit 15. The transfer robot descends along the rail 24 of the linear motion system for elevating and lowering, bringing the second IC 23 into contact with the second measurement unit 15 to start measurement (FIG. 3).

The measured IC supply sorter 19 which has moved to the supply position to the second transfer robot after the supply of the second IC 23 to the head 8 of the second transfer robot is completed. Before returning to the rail 7 of the linear moving system for moving the IC supply sorter to be measured again, it moves to the receiving position, receives the third IC 25 from the previous unit, and returns to the supply position to the first transfer robot.

The head 3 of the first transfer robot rises along the rail 22 of the first transfer robot elevating linear movement system while holding the first IC 21 for which measurement has been completed in a vacuum, and then moves the first IC 21 to the first position. After moving to the receiving position from the first transfer robot along the rail 5 of the linear movement system for horizontal movement of the transfer robot, the transfer robot moves right above the IC storage sorter 18 and then moves up and down the first transfer robot. It descends along the rail 22 of the moving system, breaks the vacuum holding the first IC 21, moves the first IC 21 to the receiving position from the first transfer robot, and moves to the IC storage sorter 18 after measurement. Store (Fig. 4).

Next, the head 3 of the first transfer robot is
The measured object ascended along the rail 22 of the first transfer robot elevating linear movement system and moved to the supply position to the first transfer robot along the rail 5 of the first transfer robot horizontal movement linear movement system After moving directly above the IC supply sorter 19, it descends along the rail 22 of the first transfer robot elevating linear motion system, and moves to the IC supply sorter 19 to be moved to the supply position to the first transfer robot. 3rd supplied
IC25 is held in a vacuum. Thereafter, the first transfer robot rises along the rail 22 of the linear motion system for lifting and lowering, and the rail 5 of the linear motion system for horizontal movement of the first transport robot.
Along the first measuring unit 14 and waits (FIG. 5). When the measurement of the second IC 23 is completed, the head 8 of the second transfer robot holds the second IC 23 in a vacuum, and the rail 2 of the second linear movement system for lifting and lowering the transfer robot.
4, and the second IC 23 is connected to the second measuring unit 1
5, the head 3 of the first transfer robot moves along the rail 22 of the first transfer robot elevating linear movement system at the timing when the third IC 25 contacts the first measurement unit 14. Then, the third IC 25 is brought into contact with the first measurement unit 14 to start measurement (FIG. 6).

The measured IC supply sorter 4 that has moved to the supply position to the first transfer robot after the supply of the third IC 25 to the head 3 of the first transfer robot is completed. Before returning to the rail 7 of the linear movement system for moving the IC supply sorter to be measured again, it moves to the receiving position and receives the fourth IC 26 from the previous unit, and the second
To the supply position to the transfer robot. The head 8 of the second transfer robot rises along the rail 24 of the second transfer robot elevating linear movement system while holding the second IC 23 that has completed the measurement in a vacuum, and After being moved to the receiving position from the second transfer robot along the rail 9 of the horizontal transfer linear movement system, after being moved to a position directly above the IC storage sorter 10 after the measurement, the rail of the second transfer robot vertical movement system is moved. 24, breaking the vacuum holding the second IC 23,
Is moved to the receiving position from the second transfer robot and stored in the IC storage sorter 10 after measurement (FIG. 7).

Thereafter, these operations are repeated. Although the present embodiment has been described using an IC, the present invention can be applied to measurement and inspection of electronic components in general.

As described above, the measuring apparatus according to the present invention is provided with the first transfer robot and the second transfer robot dedicated to the first measurement unit 14 and the second measurement unit 15 connected in parallel, respectively. By controlling each operation independently,
Since the measurement of the other IC can be started immediately after the measurement of one IC is completed, the processing efficiency of the measurement system is improved.

[0058]

As described above, according to the present invention, the measuring units are provided in parallel, a dedicated transfer robot for supplying the IC to be measured is provided for each of the measuring units, and the operation of the transfer robot is independently controlled. Thereby, the time from the end of measurement in one measurement unit to the start of measurement in the other measurement unit can be shortened, and the processing efficiency of the measurement system can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view of a measuring apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a measuring device according to an embodiment of the present invention.

FIG. 3 is a perspective view of a measuring device according to an embodiment of the present invention.

FIG. 4 is a perspective view of a measuring device according to an embodiment of the present invention.

FIG. 5 is a perspective view of a measuring device according to an embodiment of the present invention.

FIG. 6 is a perspective view of a measuring device according to an embodiment of the present invention.

FIG. 7 is a perspective view of a measuring device according to an embodiment of the present invention.

FIG. 8 is a diagram showing the operation of a conventional IC measurement system.

[Explanation of symbols]

Reference Signs List 1 IC supply sorter moved to receiving position 2 Operation line of first and second transfer robots 3 Head of first transfer robot 4 IC supply sorter moved to supply position to first transfer robot 5 Rail of linear motion system for first transfer robot horizontal movement 6 Measurement section 7 Rail of linear motion system for moving IC sorter to be measured 8 Head of second transfer robot 9 Linear motion system for second transfer robot horizontal movement Rail 10 Post-measurement IC storage sorter moved to the receiving position from the second transfer robot 11 Rail of linear motion system for moving the IC storage sorter after measurement 12 Post-measurement IC storage sorter moved to the delivery position 13 Test head of measuring device 14 First measuring unit 15 Second measuring unit 16 Operation line of first transfer robot 17 Operation line of second transfer robot 18 IC storage sorter moved to the receiving position from the transfer robot of the above 19 IC sorter to be measured moved to the supply position to the second transfer robot 20 Wiring 21 First IC 22 Linear movement for the first transfer robot elevating Rail of system 23 Second IC 24 Rail of linear motion system for lifting and lowering of second transfer robot 25 Third IC 26 Fourth IC

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Sueo Asahina 1-1, Sachimachi, Takatsuki-shi, Osaka Matsushita Electronics Co., Ltd. (72) Inventor Toshihiko Sato 1-1, Sachimachi, Takatsuki-shi, Osaka Matsushita Electronics Inside the corporation

Claims (7)

[Claims] 1. A first transfer means for transferring first and second electronic components to be measured to a standby position before measurement, and moving the first electronic component from the measurement standby position before measurement. A second transfer unit that moves to the first measuring unit and after the measurement is completed, moves from the first measuring unit to a storage position for storing the first electronic component to be measured, and the second transfer unit that performs the second measurement before the measurement. A third transfer unit configured to move the electronic component to be measured from the measurement standby position to the second measurement unit and, after the measurement, to move the second electronic component to be measured from the second measurement unit to the storage position; And a fourth transfer means for moving the first electronic component to be measured and the second electronic component to be measured from the storage position after the measurement is completed. 2. The first transfer means transfers the first electronic component to be measured and the second electronic component to be measured to a first standby position and a second standby position, respectively. The electronic component according to claim 1, wherein after the measurement is completed, the first electronic component to be measured and the second electronic component to be measured are stored in the first storage position and the second storage position, respectively. Measuring device. 3. A first measurement unit is disposed on a line connecting the first standby position and the first storage position, and a second measurement unit is disposed on a line connecting the second standby position and the second storage position. The measuring device for an electronic component according to claim 1, wherein the unit is disposed. 4. The second transfer means and the third transfer means are provided with attachment / detachment means for attaching / detaching the electronic component to be measured to / from the first measurement unit and the second measurement unit, respectively. The electronic component measuring device according to claim 1. 5. The electronic component measuring device according to claim 1, wherein the first and second measuring units are electrically connected in parallel. 6. While one of the first and second electronic components to be measured is being measured by the first measuring unit and the second measuring unit, the other electronic component to be measured is transferred by the transfer means. The measurement is held and waiting, and after the first or second electronic component to be measured has cut off the contact with the measurement unit, the other electronic component to be measured is brought into contact with any one of the measurement units, Thereafter, the other electronic component to be measured is measured. 7. A method for transferring an electronic component for measuring a plurality of electronic components, the method comprising: moving a first electronic component to be measured to a first measuring unit, and transferring the first electronic component to be measured to the first electronic component. The second electronic component to be measured is moved to a position near the second measuring unit while the first electronic component to be measured is mounted, and the first electronic component to be measured is mounted on the first measuring unit. After the mounting of the electronic component from the first measuring unit is released, the second
The third electronic component to be measured is mounted on the second measuring unit while the second electronic component to be measured is mounted on the second measuring unit. Wherein the third electronic component to be measured is mounted on the first measuring unit after the mounting of the second electronic component to be measured is released. Transportation method.