CN101567327B - Buffer sorting device for bare wafer testing machine platform and machine platform - Google Patents
Buffer sorting device for bare wafer testing machine platform and machine platform Download PDFInfo
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- CN101567327B CN101567327B CN 200810043281 CN200810043281A CN101567327B CN 101567327 B CN101567327 B CN 101567327B CN 200810043281 CN200810043281 CN 200810043281 CN 200810043281 A CN200810043281 A CN 200810043281A CN 101567327 B CN101567327 B CN 101567327B
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Abstract
The invention discloses a buffer sorting device for a bare wafer testing machine platform. A plurality of bare wafers to be tested by the machine platform are placed in a plurality of test loading plates, and a plurality of loading grooves for loading the bare wafers are formed in each test loading plate. The buffer sorting device driven by a processing device of the machine platform comprises a buffer zone, a plurality of discharging loading plates and a moving device, wherein the buffer zone is used for placing the test loading plates; the discharging loading plates are used for placing thebare wafers to be tested in a sorting mode, and a plurality of containing grooves for containing the bare wafers are formed on the discharging loading plates; and the moving device is used for movingthe bare wafers to be tested in the test loading plates arranged in the buffer zones to the corresponding discharging loading plates according to the driving signals of the processing device. The invention also discloses the bare wafer testing machine platform adopting the buffer sorting device.
Description
Technical field
The present invention relates to a kind of buffer sorting device for bare wafer testing machine platform; The invention still further relates to bare wafer testing machine platform with this buffer sorting device.
Background technology
Behind semiconductor subassembly experience wafer stage (Wafer) processing procedure, cut apart one by one, before not entering encapsulated phase (Package) processing procedure, be naked crystalline substance (Bare die or Bare Chip) state, because assemblies such as present partial memory, should increase capacity, reduce shared volume again, stacking-type encapsulates and for example take one after another, to detect again after naked crystalline substance of storehouse multilayer and the encapsulation, difficulty will significantly improve, for ensureing the semiconductor subassembly workmanship and prevent in the future the defective products loss of deriving that promptly carrying out electrical detection in the naked crystalline substance stage is the QC process that necessitates.
The outward appearance of naked crystalline substance as shown in Figure 1, naked brilliant 10 is roughly rectangular laminar, compared to several millimeters easily (mm) square length and the width of millimeter surplus ten, the often only over one hundred micron of its thickness (μ m) is hundred times of gaps each other, so be highly susceptible to impaired at its thickness direction.Naked brilliant 10 then are formed with a plurality of contacts 102 for electrically connect in the future at the ora terminalis place, with manufacture of semiconductor technology fast lifting, the size of naked crystalline substance is constantly reduced, and the quantity of contact is on the contrary because of functional requirement increases, and compact naked crystalline substance has been a trend of the times with laying intensive contact.
Because number of connections is many and the position is intensive, when testing at present, how with probe (Probe Card) as being electrically connected the interface that detects, common probe external form differs, but construct roughly the samely, be and utilize the corresponding naked chip contact of spacing on probe probe group at interval, once direct a plurality of contacts of covering naked crystalline substance to be measured, supply with and transmit electric signal and carry out testing electrical property, and then judge the naked brilliant good and the bad.
As shown in Figure 2, for the probe stuck point touches the schematic perspective view of naked chip contact, a plurality of contacts 102 are disposed at naked brilliant 10 1 sides, after probe 2 is determined the position vertical depression, make corresponding one by one naked brilliant 10 a plurality of contacts 102 of a plurality of probes 22 of probe 2 one ends, finish the guiding path of electrical connection.
The manufacture of semiconductor tachytelic evolution, when so carrying out naked brilliant test, still detecting the detecting pattern of single naked crystalline substance based on manual operation machines, single, both had been manual detection, wrong unavoidably survey, test leakage or because of the fragile characteristic of naked crystalline substance betide to inhale and put naked brilliant mistiming and decrease the naked brilliant facts to be measured.And therefore, machines is inserted naked crystalline substance to be measured and is detected, taken out the flow process speed of surveying naked crystalline substance and almost can't promote, and output efficiency is well imagined.And because of naked crystalline substance is not the state of final use, must face subsequently contact is drawn the dust free room operation that forms pin and encapsulate, in the testing process, operating personnel's manual operation brings a little uncertain factor undoubtedly again, thereby improves the possibility of pollutant sources.
Therefore, if a kind of full-automation can be provided, can carry out a plurality of naked brilliant automations detections simultaneously, and fragile naked brilliant clean, safe detection moving-wire and environment is provided, not only promote naked brilliant detection efficiency immediately, also promote simultaneously and detect quality and naked brilliant yield assurance, should be best solution.
Summary of the invention
Technical problem to be solved by this invention provides a kind of manual detection that replaces fully, and a plurality of naked crystalline substances of testing simultaneously, effectively promotes the buffer sorting device for bare wafer testing machine platform that detects quality and efficient.Bare wafer testing machine platform input and output material process with buffer sorting device is properly transmitted naked crystalline substance, avoids causing meaningless damage.Another technical problem to be solved by this invention is to propose a kind of bare wafer testing machine platform with above-mentioned buffer sorting device.
In order to solve the problems of the technologies described above, the buffer sorting device for bare wafer testing machine platform that the present invention proposes, a plurality of naked crystalline substance for this board test is placed in a plurality of test carriers, and each test all is formed with in carrier a plurality of respectively in order to carry the bearing groove of these naked crystalline substances, and its innovative point is: the buffer sorting device that driven by this board processing unit comprises: the buffering area that is used to put above-mentioned test carrier; A plurality ofly be used for these tested naked crystalline substances of classified placing and be formed with a plurality of discharging carriers of taking in the storage tank of these naked crystalline substances respectively; These tested naked crystalline substances that are arranged in the test carrier of buffering area are driven the Conveyer that signal moves into corresponding discharging carrier respectively according to this processing unit.
Among the present invention, buffering area preferably is positioned on the pedestal of board; Conveyer is preferably the mechanical arm that is provided with suction nozzle; This suction nozzle preferably has the adsorption section greater than a predetermined cross-sectional, by this suction is dispersed to a predetermined area of this naked crystalline substance of being drawn.
The bare wafer testing machine platform that the present invention proposes, a plurality of naked crystalline substance for this board test is placed in a plurality of test carriers, and all be formed with a plurality of in each test carrier respectively in order to carry the bearing groove of these naked crystalline substances, it is characterized in that this board comprises: pedestal, carry these carriers conveying device, to checkout gear that should conveying device, accept this checkout gear signal and judge these tested naked crystallinity can processing unit and the above-mentioned buffer sorting device that driven by this processing unit.
In the above-mentioned bare wafer testing machine platform of the present invention, preferably also comprise should conveying device and/or this checkout gear, and these the naked brilliant position datas in these test carriers are exported to the image capture unit of this processing unit.
With respect to prior art, buffer sorting device of the present invention only carries out the single suction to naked crystalline substance in minute time-like puts action, and naked crystalline substance is effectively drawn in well-designed suction nozzle adsorption section does not but have naked brilliant misgivings of damage; Integrate buffer sorting device in tester table, by test carrier many naked crystalline substances of portable simultaneously, can be in a plurality of detection port position, need not painstakingly pick and place naked crystalline substance and can detect synchronously.
Description of drawings
Fig. 1 is the stereoscopic schematic diagram of common naked crystalline substance;
Fig. 2 is the stereogram that common probe stuck point is surveyed naked crystalline substance;
Fig. 3 is the bare wafer testing machine platform first embodiment vertical view of the present invention;
Fig. 4 is the vertical view of checkout gear among Fig. 3;
Fig. 5 is the stereogram of Conveyer suction nozzle among Fig. 3;
Fig. 6 is the vertical view of bare wafer testing machine platform second embodiment of the present invention.
Wherein: 10 is naked crystalline substance; 102 is contact; 12,12 ' is the test carrier; 122,122 ' is bearing groove; 2 is probe; 22 is probe; 3,3 is tester table; 32,32 ' is feeding device; 4,4 ' is pedestal; 5,5 ' is conveying device; 52,52 ' is the pan feeding conveyer; 54,54 ' is the discharging conveyer; 6,6 ' is checkout gear; 62 is detection port; 64 is probe; 66 is lift arm; 7,7 ' is processing unit; 8,8 ' is buffer sorting device; 82,82 ' is buffering area; 84,84 ' is the discharging carrier; 842,842 ' is storage tank; 86,86 ' is mechanical arm; 862 is suction nozzle; 864 is the adsorption section; 9,9 ' is image capture unit.
Embodiment
Below in conjunction with the drawings and specific embodiments, further set forth the present invention.These embodiment are interpreted as only being used to the present invention is described and are not used in restriction protection scope of the present invention.After the content of having read the present invention's record, those skilled in the art can make various changes or modifications the present invention, and these equivalences change and modify and fall into appended claims of the present invention institute restricted portion equally.
Because the contact of naked crystalline substance is clouded in both side ends, precisely contraposition during probe in detecting, in case the bearing groove accuracy of manufacture deficiency of carrier, to make storing naked crystalline substance wherein be difficult for being detected by correct contraposition, but high-precision carrier cost is high, therefore, among the following embodiment of the present invention employed high accuracy carrier in the testing process is called the detection carrier, is called the discharging carrier and carry the low precision carrier that detects the naked crystalline substance that finishes.Certainly, can understand easily in this operator as ripe, if do not consider price factor, and assist a ruler in governing a country with other contraposition mechanism and solve the required aligning accuracy problem that detects, then both are used alternatingly that also do not have can not.
As shown in Figures 3 and 4, the bare wafer testing machine platform 3 that proposes of the present invention's first preferred embodiment comprise pedestal 4, feeding device 32, transport conveying device 5, the corresponding conveying device 5 of test carrier 12 checkout gear 6, image capture unit 9, when checkout gear 6 outputs detect signals, judge naked crystallinity can processing unit 7 and buffer sorting device 8.In the testing process, naked brilliant 10 among Fig. 1 will be held in a plurality of bearing grooves 122 that are placed in test carrier 12, reduce damaged risk with the protection of accepting bearing groove 122 and location and contraposition when guaranteeing to detect; And in the present embodiment, a plurality of test carriers to be measured 12 are divided two repeatedly to be stacked over feeding device 32 places, and each 12 of carrier of test has 4 bearing grooves 122.
In the present embodiment, conveying device 5 comprises one group of pan feeding conveyer 52 and discharging conveyer 54; 52 of pan feeding conveyers comprise that one group can be moved and the extractor that is provided with and two groups of longitudinal load-bearing shifters that can move and be set parallel to each other along graphic above-below direction along graphic left and right directions.Extractor is obtained test carrier 12 by feeding device 32 places, and respectively to left and right conveying, make the precalculated position of test carrier 12 with regard to the carrying shifter starting point of conveying device 5, and by image capture unit 9 obtain test in the carrier 12 each naked brilliant position data and export processing unit 7 to, if test carrier 12 location have deviation slightly, will be by micromatic setting (among the figure indicate) fine setting calibration, the location of detection port 62 is required after a while for correspondence.
When the carrying shifter will test carrier 12 and move to corresponding checkout gear 6 places, in the present embodiment checkout gear 6 for example comprise two groups of detection port 62, corresponding to a plurality of probe 64 of detection port 62 numbers, reach the lift arm 66 of corresponding detection port 62 positions.At this moment, by lift arm 66 jackings test carrier 12, make ccontaining naked crystalline substance wherein according to the aforementioned location data, accurately contact the corresponding probe on the probe 64 that is arranged at detection port 62 places, four naked crystalline substances in the synchronous detecting test carrier 12, and will test the gained data and be sent to processing unit 7, as classification foundation.Via above-mentioned arrangement, before finishing the front-end detection action, all naked crystalline substances all never by taking out in the bearing groove, are subjected to the protection of bearing groove fully, thereby avoid unnecessary damage.
After test finishes, to test carrier 12 by discharging conveyer 54 and be transported to the buffering area 82 of the buffer sorting device 8 that is positioned at pedestal 4 opposite sides to carry out the packing action, buffer sorting device 8 further comprises a plurality of discharging carriers 84 and the Conveyer with a plurality of storage tanks 842, and the Conveyer of present embodiment is a mechanical arm 86.In the present embodiment, be divided into for example four kinds of grades, comprise non-defective unit, sub-quality products, defective products and the product of need resurveying, be loaded into respectively in the different discharging carriers 84 surveying the naked crystalline substance of finishing.
The absorption of general semiconductor test machine station, move, for pursuing higher output efficiency, except that the testing process that can't quicken, between each station of board is target to move fast all, but consider the structure that naked crystalline substance is extremely fragile,, significantly increase the risk of damaging undoubtedly in case move fast; Board is taked as above-mentioned flow process in the present embodiment, and the test section then is subjected to the protection of carrier because of naked crystalline substance, even translational speed is very fast, can guarantee that still it is appropriate.
After detection finished, because the setting of buffering area 82, mechanical arm 86 can be fully despite the detection rates of board, and moving with safety fully is supreme principle, and slowly that all are tested naked crystalline substance moves into the discharging carrier with the shortest distance of moving.Owing in all flow processs, only undertaken single time and inhale-put action, reduce and reduce to minimum to the naked brilliant risk of damaging that produces by mechanical arm 86.
Certainly, image capture unit is not limited to the pan feeding conveyer start position of corresponding conveying device, also can corresponding pan feeding conveyer will test carrier and deliver to the checkout gear position, as shown in Figure 6, in the bare wafer testing machine platform that the present invention's second preferred embodiment provides, image capture unit 9 ' is disposed at the position of checkout gear 6 ', and also mat image capture unit 9 ' obtains the positional information of naked crystalline substance.
In the tester table 3 ', the pedestal 4 ' similar to first preferred embodiment, conveying device 5 ', checkout gear 6 ', the test carrier 12 ' with a plurality of bearing grooves 122 ', feeding device 32 ', pan feeding conveyer 52 ', discharging conveyer 54 ', processing unit 7 ' and buffer sorting device 8 ' etc. are not all given unnecessary details in this.Buffer sorting device 8 ' also comprises buffering area 82 ' equally, have a plurality of discharging carriers 84 ' of taking in storage tank 842 ', and Conveyer 86 '.But in the present embodiment, by position image capture unit 9 ' is set at corresponding checkout gear 6 ', and for example adopt equally the described probe of TaiWan, China I291563 patent of invention by the applicant had, can adopt the lower test carrier 12 ' of precision, and, remedy the contraposition deviation of each bearing groove in the test carrier 12 ' by the micro-adjusting mechanism on the probe, and can guarantee that still each naked crystalline substance is all correctly detected, by this, reduce the accuracy requirement restriction of test carrier.
According to the various embodiments described above explanation, buffer sorting device of the present invention provides safest classification environment, and naked crystalline substance is only carried out slow suction of short-range single put, the testing agency of the front end of properly arranging in pairs or groups, the efficient that manual detection can not be obtained is carried out in perfection; Also, reduce bringing in of naked brilliant pollutant sources, overcome contingent disappearance in the prior art fully, solved the technical problem that the present invention proposes because of replacing manual operation.
Claims (10)
1. buffer sorting device for bare wafer testing machine platform, a plurality of naked crystalline substance for this board test is placed in a plurality of test carriers, and all be formed with a plurality of in each test carrier respectively in order to carry the bearing groove of these naked crystalline substances, it is characterized in that the buffer sorting device that driven by this board processing unit comprises:
Be used to put the buffering area of above-mentioned test carrier;
A plurality ofly be used for these tested naked crystalline substances of classified placing and be formed with a plurality of discharging carriers of taking in the storage tank of these naked crystalline substances respectively;
These tested naked crystalline substances that are arranged in the test carrier of buffering area are driven the Conveyer that signal moves into corresponding discharging carrier respectively according to this processing unit.
2. buffer sorting device for bare wafer testing machine platform according to claim 1 is characterized in that buffering area is positioned on the pedestal of board.
3. buffer sorting device for bare wafer testing machine platform according to claim 1 is characterized in that, Conveyer is the mechanical arm that is provided with suction nozzle.
4. buffer sorting device for bare wafer testing machine platform according to claim 3 is characterized in that this suction nozzle has the adsorption section greater than a predetermined cross-sectional, by this suction is dispersed to a predetermined area of this naked crystalline substance of being drawn.
5. bare wafer testing machine platform, a plurality of naked crystalline substance for this board test is placed in a plurality of test carriers, and all be formed with a plurality of in each test carrier respectively in order to carry the bearing groove of these naked crystalline substances, it is characterized in that this board comprises: pedestal, carry these carriers conveying device, to checkout gear that should conveying device, accept this checkout gear signal and judge these tested naked crystallinity can processing unit and be subjected to that this processing unit drives as any one described buffer sorting device among the claim 1-4.
6. bare wafer testing machine platform according to claim 5 is characterized in that, also comprises to be used to put the feeding device that multicomponent does not accommodate the test carrier of a plurality of these tested naked crystalline substances.
7. bare wafer testing machine platform according to claim 6, it is characterized in that, this conveying device comprise with these test carriers by this feeding device move to pan feeding conveyer that should checkout gear and with these test carriers by to should checkout gear moving to the discharging conveyer of this buffering area.
8. bare wafer testing machine platform according to claim 5 is characterized in that, this checkout gear comprises that a plurality of output signals respectively are to the detection port of this processing unit.
9. bare wafer testing machine platform according to claim 8 is characterized in that, this checkout gear also comprises a plurality of respectively corresponding these detection port, is somebody's turn to do the probe of testing all these tested naked crystalline substances in the carrier for synchronous detecting, and
A plurality of respectively corresponding these probe positions are for the lift arm of these test carriers of lifting.
10. according to any one described bare wafer testing machine platform among the claim 5-9, it is characterized in that, also comprise should conveying device and/or this checkout gear, and these the naked brilliant position datas in these test carriers are exported to the image capture unit of this processing unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810043281 CN101567327B (en) | 2008-04-23 | 2008-04-23 | Buffer sorting device for bare wafer testing machine platform and machine platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810043281 CN101567327B (en) | 2008-04-23 | 2008-04-23 | Buffer sorting device for bare wafer testing machine platform and machine platform |
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| Publication Number | Publication Date |
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| CN101567327A CN101567327A (en) | 2009-10-28 |
| CN101567327B true CN101567327B (en) | 2010-09-08 |
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| CN 200810043281 Expired - Fee Related CN101567327B (en) | 2008-04-23 | 2008-04-23 | Buffer sorting device for bare wafer testing machine platform and machine platform |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| EP3346280B8 (en) * | 2015-08-31 | 2021-12-29 | HappyJapan, Inc. | Ic test system |
| CN106249134B (en) * | 2016-09-22 | 2019-10-25 | 英华达（上海）科技有限公司 | Electronic product tests production line and its test method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6327676B1 (en) * | 1998-03-31 | 2001-12-04 | Emc Corporation | Test equipment |
| CN1371122A (en) * | 2001-02-23 | 2002-09-25 | 达司克科技股份有限公司 | IC conveying program and unit of IC testing processor |
| CN201017021Y (en) * | 2007-02-12 | 2008-02-06 | 寰邦科技股份有限公司 | Test mechanism |
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2008
- 2008-04-23 CN CN 200810043281 patent/CN101567327B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6327676B1 (en) * | 1998-03-31 | 2001-12-04 | Emc Corporation | Test equipment |
| CN1371122A (en) * | 2001-02-23 | 2002-09-25 | 达司克科技股份有限公司 | IC conveying program and unit of IC testing processor |
| CN201017021Y (en) * | 2007-02-12 | 2008-02-06 | 寰邦科技股份有限公司 | Test mechanism |
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| CN101567327A (en) | 2009-10-28 |
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Granted publication date: 20100908 Termination date: 20200423 |