CN207198293U - Chip testing carrier and chip testing devices - Google Patents

Abstract

A kind of chip testing carrier and chip testing devices, chip testing devices include：Chip testing carrier, tester table, multigroup test probe and mobile platform, chip testing carrier include：Can the overlapped purpose-made pallet and core pallet that clamps and can be separated from each other；Transferring pallet includes：Supporting plate, to hold the unit that holds of chip, each holds the center of unit with cross-shaped through hole and to accommodate the accommodating chamber of chip, core pallet includes with located at the positive multiple rows of parallel distribution of supporting plate：The clamping unit to clamping chip of substrate and multiple rows of parallel distribution located at substrate front side, each clamping unit have the card chamber of clamping chip, and card chamber size, which is less than, accommodates chamber size.The chip testing carrier can realize batch feeding in chip testing process, remove precise positioning in material and test process in batches so that be greatly promoted using the testing efficiency of the chip testing devices of the chip testing carrier.

Description

Chip testing carrier and chip testing devices

Technical field

It the utility model is related to a kind of chip testing field, more particularly to a kind of test loaded tool for chip batch test And test equipment.

Background technology

Recently as the progress of electronics technology technology, personal computer, multimedia, work station, network, communication correlation are set The standby demand for waiting electronic product is increased sharply, and drives All Around The World semiconductor industry to flourish.

The IC chip of various functions turns into the core of electronic product hardware circuit, and each manufacturer is to IC chip Procurement criteria is also more harsh, it is existing IC chip demand is increased on the premise of, supplier is in addition to ensuring that final survey Try qualified outer, it is necessary to being capable of a large amount of shipment rapidly.

But some IC chips, such as closely inductor chip, because its appearance and size is smaller, chip is being surveyed Riding position slightly deviation on test-run a machine, will cause to test probe can not accurate contact chip test point, cause chip testing to lose Lose, so this kind of small chip is difficult to large batch of scale test.

The test mode of current this kind of small chip has two kinds, and one kind is to test one by one, you can to test one by one by hand, Chip can be put into measurement jig one by one and be tested.Another test mode is by the multiple one group of progress of test equipment Test.The test equipment of current this kind of small chip includes：Tester table, be arranged on above tester table can be relative to board The test probe and suction manipulator risen or fallen, one or several chip necks are provided with tester table, and test is visited The quantity of head is equal with chip pocket numbers, and the corresponding chip neck of each test probe, chip is placed on material disc, often Probably lay dozens or even hundreds of chip on individual material disc, suction manipulator absorption chip and is put into each chip neck one by one In, the shape size of each chip neck is adapted to chip form size, and when chip is put into neck, chip is positioned in and tested The position of alignment probe, after each chip neck piles chip, each test probe is set to decline and contact the survey of each chip respectively Pilot is tested, and after the completion of to be tested, chip is sucked back into material disc one by one further through suction manipulator, and from material disc one by one Draw the chip neck that new chip is put into tester table.As can be seen here, needed back and forth for each group of test chip, manipulator Motion carries out each chip blowing, feeding one by one many times, and testing efficiency is extremely low, shorter especially for the product test time Situation, take, put chip occupancy time be much larger than the actual product testing time.

Utility model content

Main technical problem to be solved in the utility model is to provide a kind of chip testing carrier, to solve chip batch Test problem is measured, improves chip testing efficiency.

Another technical problem to be solved in the utility model is to provide a kind of chip testing devices, to solve chip batch Test problem, improve chip testing efficiency.

In order to solve the above technical problems, the utility model provides a kind of chip testing carrier, it includes：Overlapped it can block The purpose-made pallet and core pallet that fills and can be separated from each other；Transferring pallet includes：Supporting plate is positive multiple rows of parallel with located at supporting plate Distribution holding the unit that holds of chip, it be in cross-shaped through hole each to hold the center of unit to have, described to lead to Hole by the dividing elements that hold into multiple support blocks, each support block in close to the position of the through hole set respectively relative to The recessed support groove of the top surface of the supporting plate, each support groove collectively form the accommodating chamber for accommodating chip, and each support groove is respectively provided with The horizontal support face to support chip, the support face of each support groove are concordant；Core pallet includes：Substrate and located at substrate just The clamping unit to clamping chip of multiple rows of parallel distribution in face, each clamping unit include at least one pair of Relative distribution Claw, a card chamber of clamping chip is formed between each claw, horizontal and flush with each other is wherein at least provided with a pair of claws Supporting surface；Each clamping unit of the unit respectively with the core pallet that respectively hold of the transferring pallet corresponds, and works as institute When stating transferring pallet and being stacked on the core pallet, the claw of each clamping unit correspondingly stretches to the through hole for respectively holding unit In, and the supporting surface of the core pallet is higher than the support face of the transferring pallet, the card chamber of the core pallet is less than described The accommodating chamber of transferring pallet.

Preferably, each support groove inwall for holding unit includes the stopping surface perpendicular to the support face；It is described Each claw of clamping unit includes：Towards the card chamber and perpendicular to the card access surface of the supporting surface, when the transferring pallet When being stacked in the core pallet, the clamping unit being mutually matched is with holding in unit, an at least card access surface and an at least block Face homonymy, and the card access surface of homonymy is prominent more to the through hole center position relative to stopping surface.

Preferably, each support groove includes two stopping surfaces, and two stopping surfaces of same support groove are mutually perpendicular to.

Preferably, there is guiding surface between the stopping surface and the supporting plate top surface, the guiding surface respectively with institute The top surface for stating stopping surface and the supporting plate forms reflex angle angle.

Preferably, profile of the support face close to the through hole is curved.

Preferably, it is outstanding at each support block of correspondence for holding the unit back side and form multiple boss；It is described Clamping unit front is provided with multiple stopper slots for accommodating each boss respectively.

Preferably, the boss is provided with arc angling close to through hole, makes the bottom opening of through hole in flaring bore It is horn-like.

Preferably, each claw is respectively provided with spigot surface towards the close top end of the card chamber side, two paired claws Spigot surface is located remotely from each other from the bottom to top.

Preferably, the clamping unit includes two pairs of claws, two first respectively symmetrical claws and symmetrical Two second claws, perpendicular to the line of two second claws, the width of first claw is more than institute for the lines of two first claws The width of the second claw is stated, the supporting surface is on first claw；When the transferring pallet is stacked in the core support When on disk, each claw is correspondingly distributed between two support blocks.

Preferably, the clamping unit is provided centrally with via, and each claw is distributed in the via surrounding.

Preferably, the clamping unit back side opens up the reaming groove towards front side recess, and the via penetrates the reaming groove Bottom land, and the bore of the reaming groove be more than the via aperture.

Preferably, the substrate width of the core pallet is more than the supporting plate width of the transferring pallet, the transferring pallet The width both sides at the supporting plate back side be symmetrically arranged with multiple material grasping necks, the width side of the substrate front side of the core pallet Multiple material grasping escape groove are symmetrical arranged to both sides, when the transferring pallet is stacked in above the core pallet, each material grasping card Groove and each material grasping escape groove are relative one by one, and each material grasping escape groove outwards exceeds the lateral edges of the transferring pallet.

In order to solve the above technical problems, the utility model also provides a kind of chip testing devices, it includes：Said chip is surveyed Carrier is tried, in addition to：Tester table, multigroup test probe and mobile platform, testing host is set on tester table, and tested Board can be controlled and moved up and down；Each group test probe be distributed in the bottom surface of the tester table and arrange it is in a row, often Group test probe is made up of an at least test probe, and the probe of each group test probe is electrically connected with the test master on tester table Plate can simultaneously move up and down with the tester table, and often row holds element number and core in the quantity and transferring pallet of test probe The quantity all same of clamping unit is often arranged in heart pallet；Mobile platform is located at below the test probe, and the chip testing carries The core pallet of tool is fixed on the mobile platform, and the transferring pallet of the chip testing carrier is used for bulk transport chip, And can coordinate with core pallet and chip is clamped on test station, the mobile platform can be controlled and according to setting step pitch horizontal position Move, and drive the core pallet and multiple rows of chip to be measured that the transferring pallet is moved on the core pallet together by row Each test probe being aligned one by one on the tester table.

Preferably, the chip testing devices also include material grasping manipulator, and material grasping manipulator is capturing fully loaded core to be measured The transferring pallet of piece is simultaneously pressed on the core pallet, or takes transferring pallet away from the core pallet.

Preferably, the material grasping machinery is fixed with chip to be pressed on to each clamping unit of the core pallet on hand In pressing plate, the bottom surface of the pressing plate is provided with multiple rows of raised briquetting, and each briquetting respectively holds list according to the transferring pallet The spacing arrangement of member.

Preferably, the bottom surface of each briquetting is respectively provided with a groove, and the briquetting forms two presser feets, institute in the groove both sides Stating respectively has a guiding surface on the relative two side of two presser feets, the guiding surface of two presser feet is in downwards by the bottom land of groove Mutually it is distributed away from situation and forms horn-like slot opening.

Preferably, the material grasping manipulator also include it is multipair can the material graspings of mutually opening and closing refer to, two material graspings in pairs refer to difference It is symmetrically positioned in the both sides of the pressing plate and the material grasping refers to end and extends downwardly from the pressing plate, the end that paired material grasping refers to is opposite It is extended with material grasping convex edge.

Compared with prior art, the utility model has the advantages that：The utility model is by using specific structure Transferring pallet and specific structure core pallet coordinate realize the batch feeding in chip testing process, in batches remove material and Precise positioning in test process, substantially increase the efficiency of chip testing.

Brief description of the drawings

Fig. 1 is the rough schematic view of the utility model chip testing devices.

Fig. 2 is the positive stereoscopic diagram of transferring pallet.

Fig. 3 is the back three-dimensional diagram of transferring pallet.

Fig. 4 is the enlarged drawing in A portions in Fig. 3.

Fig. 5 is the single front plan view for holding unit.

Fig. 6 is the enlarged drawing in B portions in Fig. 4.

Fig. 7 is the positive stereoscopic diagram of core pallet.

Fig. 8 is the back three-dimensional diagram of core pallet.

Fig. 9 is the schematic perspective view of each clamping unit of core pallet.

Figure 10 is the enlarged drawing in Fig. 8 C portions.

When Figure 11 is that transferring pallet is overlapping with core pallet, the single mated condition for holding unit and single clamping unit Stereogram.

Schematic diagram when Figure 12 is platen presses chip.

Figure 13 is the structure chart of pressing plate.

Figure 14 is the pressing plate top view in Figure 13.

Figure 15 is the dimensional structure diagram of the single briquetting on pressing plate.

Description of reference numerals is as follows：1st, tester table；11st, testing host；12nd, power supply；13rd, test main frame；2nd, test is visited Head；3rd, mobile platform；4th, transferring pallet；41st, supporting plate；42nd, unit is held；421st, through hole 421；4211st, passage；422nd, support Block；423rd, support groove；4231st, support face；4232nd, stopping surface；424th, accommodating chamber；425th, guiding surface；426th, boss；4261、 Arc angling；427th, interval trough；43rd, material grasping neck；5th, core pallet；51st, substrate；52nd, clamping unit；53rd, the first claw； 531st, supporting surface；532nd, card access surface；533rd, spigot surface；54th, the second claw；55th, card chamber；56th, stopper slot；57th, via；58th, expand Hole slot；6th, pressing plate；61st, briquetting；611st, presser feet；6112nd, guiding surface；612nd, groove.

Embodiment

In order to further illustrate principle and structure of the present utility model, it is preferable to carry out in conjunction with accompanying drawing to of the present utility model Example is described in detail.

Chip testing carrier embodiment.

The utility model introduces a kind of batch feeding for being used to realize in chip testing process, removes material in batches and survey first The chip testing carrier of precise positioning during examination.

For the structure of chip testing carrier is discussed in detail, will introduce first below a kind of suitable for the test of closely inductor Chip testing carrier.

Refering to Fig. 2, Fig. 3, Fig. 7 and Fig. 8, the chip testing carrier includes：Overlapped it can clamp and can be separated from each other Transferring pallet 4 and core pallet 5.Setting element when core pallet 5 is as chip testing, it is ensured that chip and the essence of test probe 2 Quasi- contraposition.Transferring pallet 4 is used to realize that chip batch feeding and batch remove material, by core pallet 5 and transferring pallet 4 coordinate and Chip batch is clamped on test station.

Refering to Fig. 2 to Fig. 6, transferring pallet 4 includes：Supporting plate 41 with located at the positive multiple rows of parallel distribution of supporting plate 41 to Hold chip holds unit 42.Only show that two rows hold unit 42 in figure, remaining holds unit 42 and omitted.Each row holds unit 42 quantity is consistent and arrangement spacing is consistent.

It is in cross-shaped through hole 421 that each center for holding unit 42, which has, and through hole 421 will hold unit 42 and divide Into multiple support blocks 422, through hole 421 forms the passage 4211 of up/down perforation between adjacent two support block 422.

Each support block 422 is set relative to the recessed support of the top surface of supporting plate 41 respectively in the position close to through hole 421 Groove 423, each support groove 423 collectively form the accommodating chamber 424 for accommodating chip.

The size of the accommodating chamber 424 is slightly larger than chip appearance and size, and when chip mount is in accommodating chamber 424, chip is holding Receiving in chamber 424 has appropriate activity space, even if so as to which transferring pallet 4 is slightly unstable in moving process, will not also cause core Piece touches the side wall of accommodating chamber 424 and occurs laterally to stand, therefore chip is in the moving process of transferring pallet 4, substantially with flat Lie or posture of slightly obliquely reclining is placed in respectively the holding in unit 42 of transferring pallet 4, be easy in test job and core pallet 5 Coordinate and realize chip and precisely align.

Each support groove 423 includes：It is horizontal to the support face 4231 of support chip and perpendicular to support face 4231 Stopping surface 4232.The support face 4231 of each support groove 423 is concordant, and when chip is positioned over accommodating chamber 424, each support groove 423 is held The corner location of the support chip of support 4231, the stopping surface 4232 of each support groove 423 are construed as limiting the limit in chip activity space Wall.

The shape of stopping surface 4232 is adapted with the profile of chip, and usual chip is square, then the phase of stopping surface 4232 should be The plane of matching chip appearance profile.

Each support groove 423 includes two orthogonal stopping surfaces 4232, adjacent to limit chip corner respectively Both sides.In the present embodiment, there is the interval trough of a connection support groove 423 between two stopping surfaces 4232 of each support groove 423 427, the one side of interval trough 427 can expand the activity space in chip corner, avoid interfering with chip corner and cause Chip corner tilts, another conveniently to also allow for milling out support groove 423 on supporting plate 41.

There is guiding surface 525 between stopping surface 4232 and the top surface of supporting plate 41, guiding surface 525 respectively with stopping surface 4232 Reflex angle angle is formed with the top surface of supporting plate 41, so that the upper shed of accommodating chamber 424 is in the horn-like of flaring bore from the inside to the outside, with It is put into accommodating chamber 424 to chip to be oriented to, the chip for enabling to be put into the edge of accommodating chamber 424 falls automatically with guiding surface 525 Enter in accommodating chamber 424.

Profile of the support face 4231 at through hole 421 is curved, to expand between the relative corner positions of two support block 422 The bore of passage 4211, avoid and interfered during core 5 overlapping clamping of pallet, guarantee smoothly docked with core pallet 5.

Hold outstanding at each support block 422 of correspondence at the back side of unit 42 and form multiple boss 426, the boss 426 are used to coordinate core pallet 5, and clamp overlapping to transferring pallet 4 and core pallet 5 forms positioning.

Boss 426 is provided with arc angling 4261 at through hole 421, and the bottom opening for making through hole 421 is in flaring bore It is horn-like, for transferring pallet 4 clamp to core pallet 5 provide clamp be oriented to, be easy to the two smoothly to dock.

Refering to Fig. 7-Figure 10, core pallet 5, including：Substrate 51 and the use located at the positive multiple rows of parallel distribution of substrate 51 With the clamping unit 52 of clamping chip.Two row's clamping units 52 are only shown, remaining clamping unit 52 omits in figure.Each row's clamping list The quantity of member 52 is consistent and arrangement spacing is consistent.

The quantity that clamping unit 52 is often arranged in core pallet 5 holds the quantity of unit 42 and survey with often being arranged in transferring pallet 4 The quantity of probe header 2 is consistent.The regularity of distribution of clamping unit 52 is consistent with the regularity of distribution for holding unit 42, if core support Disk 5 has 20 rows, and often row has ten clamping units 52, then accordingly also has 20 rows in transferring pallet 4, and often row has ten Clamping unit 52.

Each clamping unit 52 includes the claw of at least one pair of Relative distribution, and the one of clamping chip is formed between each claw Card chamber 55.The size of card chamber 55 and chip appearance and size are basically identical, so as to which when chip is located at card chamber 55, chip can be by card Pawl firmly clamping and realize positioning.

Each unit 42 that holds of transferring pallet 4 provides an accommodating chamber 424 for holding chip, core pallet 5 it is each Clamping unit 52 provides the card chamber 55 of a clamping chip, and the size of card chamber 55 is less than the size of accommodating chamber 424.Work as transferring pallet 4 is overlapping when being installed in core pallet 5, and the position of each clamping unit 52 of core pallet 5 respectively holds unit 42 with transferring pallet 4 Position correspond, and each claw of clamping unit 52 can extend into and hold in the through hole 421 of unit 42, and by accommodating chamber Chip in 424 is transferred in card chamber 55, and clamping positioning is carried out to chip.

With reference to horizontal and mutually flat refering to Fig. 9 and Figure 11, being wherein at least provided with a pair of claws for clamping unit 52 Neat supporting surface 531.In the present embodiment, clamping unit 52 includes two pairs of claws, two first respectively symmetrical claws 53 and two second symmetrical claws 54.Two first claws 53 and the cross-cutting distribution of two second claw 54, i.e., two first cards Line of the line of pawl 53 perpendicular to two second claws 54.The width of first claw 53 is more than the width of the second claw 54, support Face 531 is arranged on two first claws 53.

When transferring pallet 4, which stacks, to be installed on core pallet 5, each claw of core pallet 5 is each logical through transferring pallet 4 Road 4211 is stretched into the accommodating chamber 424 of transferring pallet 4, and now, the supporting surface 531 of core pallet 5 is higher than the support of transferring pallet 4 Face 4231, chip are jacked up naturally, and the supporting surface 531 of core pallet 5 is transferred to from the support face 4231 of transferring pallet 4, i.e., real Show and be automatically transferred to chip in the card chamber 55 of core pallet 5 by the accommodating chamber 424 of transferring pallet 4.

Each claw on core pallet 5 also includes：Towards card chamber 55 and perpendicular to the card access surface 532 of supporting surface 531, each card The card access surface 532 of pawl collectively forms the periphery of card chamber 55.

When transferring pallet 4, which stacks, is installed in core pallet 5, the clamping unit 52 that is mutually matched and hold in unit 42, An at least stopping surface 4232 homonymy of at least card access surface 532 with holding unit 42 of clamping unit 52, and the card access surface of homonymy 532 is prominent more to the center position of through hole 421 relative to stopping surface 4232, so that the size of card chamber 55 of core pallet 5 is less than The size of accommodating chamber 424 of transferring pallet 4.

Specifically in the present embodiment, core pallet 5 has four claws, and each claw is distributed in the side of quadrangle, often Respectively there is a card access surface 532 on individual claw.Transferring pallet 4 has four support grooves 423, has two in each support groove 423 The stopping surface 4232 of individual not homonymy.When transferring pallet 4, which stacks, is installed in core pallet 5, each claw is correspondingly distributed in two Between support groove 423 so that the stopping surface 4232 of each corresponding two homonymies of distribution in the both sides of card access surface 532 and relative indent.

Each claw of clamping unit 52 is respectively provided with spigot surface 533 towards the close top end of the side of card chamber 55, and paired two The spigot surface 533 of claw is located remotely from each other from the bottom to top, so that the upper shed of card chamber 55 is in horn-like, enters the structure of card chamber 55 to chip Into guiding.

The front of clamping unit 52 is additionally provided with multiple stopper slots 56, when transferring pallet 4 is overlapping is installed in core pallet 5, Each boss 426 of the bottom of transferring pallet 4 is respectively received in each stopper slot 56, so that the two fast positioning clamps.

The center of clamping unit 52 is additionally provided with via 57, and each claw is distributed in the surrounding of via 57.The via 57 is used to supply Closely inductor sends downwards laser signal in test.

The back side of clamping unit 52 opens up the reaming groove 58 towards front side recess, and via 57 penetrates the bottom land of reaming groove 58, and expands The bore of hole slot 58 is more than the aperture of via 57, consequently facilitating closely inductor connects, sends out laser signal.

It is the structure suitable for the chip testing carrier of closely inductor above, suitable for the test loaded tool of other chips Structure it is similar therewith, if chip to be measured need not send signal downwards, each clamping unit 52 of core pallet 5 can need not Open up via 57, other structures and above-mentioned the test closely structure of the chip testing devices of inductor and principle all same, this Place repeats no more.

It is noted that in other embodiments, may also set up in each clamping unit 52 of core pallet 5 a pair it is relative The claw of distribution, or be set as desired more to claw.For example, for the chip in a direction longer dimension, Multipair claw can be laid in the direction or lay long claw in the direction, in the shorter chip of a direction size Speech, it can only lay a pair of claws or lay stub pawl.

Chip testing devices embodiment.

Chip testing devices of the present utility model are applied to the batch testing of various small chips, below will be to test low coverage From the structure and operation principle for describing chip testing devices of the present utility model exemplified by this chip of inductor in detail.

Refering to Fig. 1, the chip testing devices include：Tester table 1, test probe 2, mobile platform 3, chip testing carrier And material grasping manipulator.

The structure of chip testing carrier is discussed in detail in above-described embodiment, and the present embodiment repeats no more.

Tester table 1 can be controlled and moved up and down, and its actuating unit moved up and down can be common in mechanical field Various straight line driving mechanisms, e.g., tester table 1 is driven to move up and down by cylinder piston rod is flexible；Or by motor driven ball Leading screw, which rotates, makes the sliding block on ball-screw be moved linearly along leading screw, and then drives tester table 1 to move up and down by sliding block； Or rotated by motor driven gear, engaged by wheel and rack and drive rack linear to walk, and then driven on tester table 1 Lower movement；It can also be by motor driven pulley rotation, coordinate belt to move linearly by roller and belt pulley, enter And tester table 1 is driven to move up and down.Tester table 1 when moves and mobile stroke, using external control mechanisms Realized by universal controller.

Testing host 11 is set on tester table 1.In the present embodiment, testing host 11 has multiple, each phase of testing host 11 It is mutually independent, each testing host 11 one chip of corresponding test.In other embodiments, each testing host 11 can be also incorporated into On one test board, make independently to test each core with the test circuit that multichannel works independently from each other on the test board Piece.

Test probe 2 have it is multigroup, each group test probe 2 be distributed in the bottom surface of tester table 1 and arrange it is in a row, Every group of test probe 2 is made up of an at least test probe, and the probe of each group test probe 2 is electrically connected with tester table 1 Each testing host 11 can simultaneously move up and down with the tester table 1.When each testing host 11 is incorporated on a test board, respectively The probe of group test probe 2 is then respectively and electrically connected to each test circuit of the test board.

The number of probes of every group of test probe 2 determines according to the quantity of the test point of chip under test, if each tested Chip has a test point contacted with probe, then correspondingly, every group of test probe 2 has a test probe；It is if every There are two test points, then correspondingly, every group of test probe 2 has two test probes, by that analogy, often on individual chip under test The number of probes of group test probe 2 is consistent with the quantity of the test point of chip under test.

Each testing host 11 by power line connect power supply 12, each testing host 11 also by wired or wireless way with Test main frame 13 communicates.Test program is installed in test main frame 13, test is controlled by the test program in test main frame 13 Mainboard 11 works, and testing host 11 is again by testing the test point on probe contact chip surface.During test, sent out by testing host 11 Going out test signal to chip, chip receives the test signal and generates response signal, and by testing probe by the response signal Transmit to testing host 11, testing host 11 again by the corresponding signal change or non-conversion send to test main frame 13, by surveying Try main frame 13 and judge whether chip is qualified.

Mobile platform 3 is located at the lower section of test probe 2, and core pallet 5 is fixed on mobile platform 3.Mobile platform 3 can be by Control and stepping movement in the horizontal direction.To realize the engine of actuating unit and tester table 1 that mobile platform 3 moves horizontally Structure is similar, and here is omitted.When control mobile platform 3 moves the distance with 3 each stepping of mobile platform, also using outer Portion's controlling organization is realized by universal controller.Card access surface 532

Material grasping manipulator capturing the transferring pallet 4 of fully loaded chip to be measured and be pressed on core pallet 5, or from Take transferring pallet 4 on core pallet 5 away.

Material grasping machinery be fixed with hand it is multipair can the material graspings of mutually opening and closing refer to.Material grasping refers to for capturing transferring pallet 4 and inciting somebody to action It is placed on core pallet 5.The end that paired material grasping refers to has extended towards material grasping convex edge.

Refering to Fig. 2, Fig. 3 and Fig. 7, the width both sides at the back side of supporting plate 41 of transferring pallet 4 are symmetrically arranged with multiple grab Expect neck 43, when material grasping manipulator captures transferring pallet 4, each material grasping refers to the both sides for being clamped in transferring pallet 4, material grasping convex edge pair It should stretch at material grasping neck 43, prevent transferring pallet 4 from falling.

The quantity of material grasping neck 43 is consistent with the quantity that material grasping refers to, and in the present embodiment, material grasping neck 43 has four, and material grasping refers to There are two pairs.In practical application, in order to improve the smoothness of the transhipment of transferring pallet 4, can corresponding pairs increase material grasping refer to and material grasping Neck 43.

The width of substrate 51 of core pallet 5 is more than the width of supporting plate 41 of transferring pallet 4, the front of substrate 51 of core pallet 5 Width both sides be symmetrical arranged multiple material grasping escape groove, quantity and the quantity of material grasping neck 43, the material grasping of material grasping escape groove refer to Quantity is identical.When transferring pallet 4 is stacked in above core pallet 5, each material grasping neck 43 and each material grasping escape groove are relative one by one, And each material grasping escape groove outwards exceeds the lateral edges of transferring pallet 4, is interfered so as to avoid referring to material grasping.

Refering to Figure 13, Figure 14 and Figure 15, material grasping machinery is further fixed on chip is pressed on into each of core pallet 5 on hand Pressing plate 6 in clamping unit 52, two paired material graspings refer to respectively symmetrically to be referred to end and slightly stretches downwards positioned at the both sides of pressing plate 6 and material grasping Go out pressing plate 6.

The bottom surface of pressing plate 6 is provided with multiple rows of raised briquetting 61, and each briquetting 61 respectively holds unit 42 according to transferring pallet 4 Spacing arrangement.The bottom surface of each briquetting 61 is respectively provided with a groove 612, and briquetting 61 forms two presser feets 611 in the both sides of groove 612, Respectively there is a guiding surface 6112, the guiding surface 6112 of two presser feets 611 is by groove 612 on the relative two side of two presser feets 611 Bottom land downwards in mutually away from situation be distributed and form horn-like groove 612 and be open.

With reference to refering to Fig. 2, Figure 13, Figure 14 and Figure 15, when material grasping manipulator captures transferring pallet 4, pressing plate 6 is located at should The top of transferring pallet 4, and each briquetting 61 of pressing plate 6 corresponds each hold unit 42 respectively so that briquetting 61 is just as one Lid is covered above each accommodating chamber 424 for holding unit 42, departs from transferring pallet 4 to avoid chip activity amplitude excessive Each hold unit 42.

Refering to Figure 12, in the feeding process of transferring pallet 4, the segment chip in transferring pallet 4 will likely be because of transhipment Pallet 4 is moved unstable and is slightly slanted, and after transferring pallet 4 is positioned over core pallet 5, inclined chip will be unable to certainly The dynamic claw clamping by core pallet 5, now the pressing plate 6 of material grasping manipulator push, the groove of each briquetting 61 on pressing plate 6 The 612 clamping units 52 of face one and a chip, because the both sides of groove 612 have two guiding surfaces 6112, therefore chip will It is directed to the automatic guiding of inclined-plane 6112 and guides into the card chamber 55 between claw and by claw clamping.That is, pressing plate 6 Effect is, by inclined chip automatic guiding and is pressed between the claw of core pallet 5.

Further, since the unit 42 that respectively holds of transferring pallet 4 has well-to-do accommodating chamber 424, chip is in accommodating chamber 424 In there is certain activity surplus, so even transferring pallet 4 is slightly unstable in moving process, chip will not also touch receiving The side wall of chamber 424 causes laterally to stand, so that when transferring pallet 4 is crawled and is pressed against on core pallet 5, transferring pallet 4 In each chip can be by 6 rapid correcting of pressing plate into horizontality.

The above-mentioned course of work for testing the closely chip testing devices of inductor is as follows：Chip（Closely sense Device）The each of transferring pallet 4 is placed in first to hold in the accommodating chamber 424 of unit 42, after pallet 4 to be transported is fully loaded with chip, It is arranged on by outer conveyor belt or manually by transferring pallet 4 at upper material position；Start material grasping manipulator, it is captured by upper material position Transferring pallet 4, by its it is overlapping be placed on core pallet 5, the claw of each clamping unit 52 of core pallet 5 is automatically extended into turning Fortune pallet 4 is respectively held in the through hole 421 of unit 42, at the same time pushes pressing plate 6, by each chip correcting into horizontality and quilt The claw clamping of core pallet 5, now core pallet 5 be located at initial position, the first row chip in pallet is respectively aligned to test Each test probe 2 on board 1；Then start tester table 1 to decline, make the test point of the contact chip of test probe 2, chip root Laser signal is sent downwards according to the test program of main frame, and is received the laser signal of return and exported and believe to apart from related response Number, the response signal is transmitted to testing host 11 by testing probe, testing host 11 again changes the corresponding signal or non- Conversion ground is sent to test main frame 13, judges whether chip is qualified by test main frame 13；After completing first row chip testing, test Board 1 rises, and drives transferring pallet 4 and the row's spacing of 5 stepping of core pallet one by mobile platform 3, makes the next row core in pallet Each test probe 2 on piece alignment tester table 1, tester table 1 declines again completes second row chip testing, by that analogy, Concurrent testing by row is carried out to chip, until after the completion of last row's chip testing, support will be transported by being again started up material grasping manipulator Disk 4 is taken away, and captures a transferring pallet 4 again from upper material position and put core pallet 5, carries out the batch of next pallet chip Test.

In other embodiments, said chip test equipment can also omit material grasping manipulator, and use artificial transfer transhipment instead Pallet 4, and transferring pallet 4 is placed on core pallet 5, tilt and the state of malcompression if there is some chips, also may be used Manually flattening chip makes it be compressed by the claw of core pallet 5.

It should also be noted that the quantity of material grasping manipulator is not unique, two material grasping manipulators, a materials-taking machine may also set up Tool hand captures transferring pallet 4 from upper material position and is placed on core pallet 5, another material grasping manipulator is used for feeding Material is removed, i.e., takes transferring pallet 4 away from core pallet 5.

It is noted that chip testing devices of the present utility model are applicable not only to core as closely inductor Piece, the batch testing of various small chips is applied also for, when applied to other chip testings, as fruit chip need not be to issuing The number of delivering letters, then each clamping unit 52 of core pallet 5 can need not open up via 57, the test program in test main frame 13 accordingly replaces Change the test program of chip to be measured into, the structure and original of other structures and above-mentioned test closely chip testing devices of inductor All same is managed, here is omitted.

To sum up, because the unit 42 that respectively holds of transferring pallet 4 of the present utility model has well-to-do accommodating chamber 424, because And chip has certain activity surplus when being placed on each accommodating chamber 424 of transferring pallet 4, chip shifts in transferring pallet 4 During will not laterally be stood because transfer process is unstable, transferring pallet is placed in the appearance that lies low or slightly obliquely recline substantially 4 respectively hold in unit 42, so as to which when transferring pallet 4 is crawled and is pressed against on core pallet 5, chip can shift automatically Into each clamping unit 52 of core pallet 5, and because the size of card chamber 55 of clamping unit 52 is smaller, chip is clamped unit 52 Claw firmly clamping and position, during test, only drive chip to be directed at tester table by row by the horizontal displacement of mobile platform 3 Each test probe 2 on 1, motion ratio now is more steady, and chip can be stably clamped in each card chamber 55, so as to test The precisely contraposition by row of each test probe 2 on board 1, it is ensured that the test point of the reliable contacts chip of test probe 2, realize chip by Row concurrent testing.It can be seen that the utility model is matched somebody with somebody by using the transferring pallet 4 of specific structure and the core pallet 5 of specific structure Close realize the batch feeding in chip testing process, in batches remove material and test process in positioning, substantially increase chip The efficiency of test.

Preferable possible embodiments of the present utility model are these are only, not limit the scope of protection of the utility model, all fortune Changed with the equivalent structure made by the utility model specification and accompanying drawing content, be all contained in the scope of protection of the utility model It is interior.

Claims (17)

1. A kind of 1. chip testing carrier, it is characterised in that including：Overlapped can clamp and the purpose-made pallet that can be separated from each other with Core pallet,

   Transferring pallet, including：Supporting plate with located at the positive multiple rows of parallel distribution of supporting plate to hold the unit that holds of chip, often It is in cross-shaped through hole that the individual center for holding unit, which has, and the through hole is by the dividing elements that hold into multiple supports Block, each support block are set relative to the recessed support groove of the top surface of the supporting plate respectively in close to the position of the through hole, respectively Support groove collectively forms the accommodating chamber for accommodating chip, and each support groove is respectively provided with the horizontal support face to support chip, respectively The support face of support groove is concordant；

   Core pallet, including：The clamping unit to clamping chip of substrate and multiple rows of parallel distribution located at substrate front side, often Individual clamping unit includes the claw of at least one pair of Relative distribution, a card chamber of clamping chip is formed between each claw, wherein extremely Horizontal and flush with each other supporting surface is provided with few a pair of claws；

   Each clamping unit of the unit respectively with the core pallet that respectively hold of the transferring pallet corresponds, when the transhipment When pallet is stacked on the core pallet, the claw of each clamping unit, which correspondingly stretches to, respectively to be held in the through hole of unit, and institute The supporting surface for stating core pallet is higher than the support face of the transferring pallet, and the card chamber of the core pallet is less than the transferring pallet Accommodating chamber.
2. 2. chip testing carrier as claimed in claim 1, it is characterised in that each support groove inwall for holding unit wraps Include the stopping surface perpendicular to the support face；Each claw of the clamping unit includes：Towards the card chamber and perpendicular to institute The card access surface of supporting surface is stated, when the transferring pallet is stacked in the core pallet, the clamping unit being mutually matched is with holding In unit, an at least card access surface and an at least stopping surface homonymy, and the card access surface of homonymy relative to stopping surface more to the through hole Center position protrudes.
3. 3. chip testing carrier as claimed in claim 2, it is characterised in that each support groove includes two blocks Face, two stopping surfaces of same support groove are mutually perpendicular to.
4. 4. chip testing carrier as claimed in claim 2, it is characterised in that have between the stopping surface and the supporting plate top surface There is guiding surface, the guiding surface forms reflex angle angle with the top surface of the stopping surface and the supporting plate respectively.
5. 5. chip testing carrier as claimed in claim 1, it is characterised in that profile of the support face close to the through hole It is curved.
6. 6. chip testing carrier as claimed in claim 1, it is characterised in that each support block of correspondence for holding the unit back side Place is outstanding and forms multiple boss；The clamping unit front is provided with multiple stopper slots for accommodating each boss respectively.
7. 7. chip testing carrier as claimed in claim 6, it is characterised in that the boss is provided with arc close to through hole and fallen Angle, make the bottom opening of through hole in the horn-like of flaring bore.
8. 8. chip testing carrier as claimed in claim 1, it is characterised in that close top of each claw towards the card chamber side Spigot surface is respectively provided with end, the spigot surface of two paired claws is located remotely from each other from the bottom to top.
9. 9. chip testing carrier as claimed in claim 1, it is characterised in that the clamping unit includes two pairs of claws, respectively For two first symmetrical claws and two second symmetrical claws, the line of two first claws is perpendicular to two second claws Line, the width of first claw is more than the width of second claw, and the supporting surface is on first claw； When the transferring pallet is stacked on the core pallet, each claw is correspondingly distributed between two support blocks.
10. 10. chip testing carrier as claimed in claim 1, it is characterised in that the clamping unit is provided centrally with via, Each claw is distributed in the via surrounding.
11. 11. chip testing carrier as claimed in claim 10, it is characterised in that the clamping unit back side opens up recessed towards front Sunken reaming groove, the via penetrates the bottom land of the reaming groove, and the bore of the reaming groove is more than the aperture of the via.
12. 12. chip testing carrier as claimed in claim 1, it is characterised in that the substrate width of the core pallet is more than institute The supporting plate width of transferring pallet is stated, the width both sides at the supporting plate back side of the transferring pallet are symmetrically arranged with multiple material grasping cards Groove, the width both sides of the substrate front side of the core pallet are symmetrical arranged multiple material grasping escape groove, when the transferring pallet When being stacked in above the core pallet, each material grasping neck and each material grasping escape groove are relative one by one, and each material grasping escape groove is outside Beyond the lateral edges of the transferring pallet.
13. A kind of 13. chip testing devices, it is characterised in that including：Chip testing described in claim 1-12 any one carries Tool, in addition to：

    Tester table, sets testing host thereon, and tester table can be controlled and move up and down；

    Multigroup test probe, each group test probe is distributed in the bottom surface of the tester table and in a row, every group of survey of arranging Probe header is made up of an at least test probe, and the testing host on the probe electric connection tester table of each group test probe is simultaneously It can be moved up and down with the tester table, often row holds element number and core support in the quantity and transferring pallet of test probe The quantity all same of clamping unit is often arranged in disk；

    Mobile platform, below the test probe, the core pallet of the chip testing carrier is fixed on the movement and put down On platform, the transferring pallet of the chip testing carrier is used for bulk transport chip, and can coordinate with core pallet by chip clamping In test station, the mobile platform can be controlled and according to setting step pitch horizontal displacement, and drive the core pallet and described Multiple rows of chip to be measured that transferring pallet is moved on the core pallet together is aligned each on the tester table one by one by row Test probe.
14. 14. chip testing devices as claimed in claim 13, it is characterised in that the chip testing devices also include materials-taking machine Tool hand, material grasping manipulator capturing the transferring pallet of fully loaded chip to be measured and be pressed on the core pallet, or from Transferring pallet is taken away on the core pallet.
15. 15. chip testing devices as claimed in claim 14, it is characterised in that the material grasping machinery is fixed with to incite somebody to action on hand Chip is pressed on the pressing plate in each clamping unit of the core pallet, and the bottom surface of the pressing plate is provided with multiple rows of raised pressure Block, each briquetting arrange according to the spacing for respectively holding unit of the transferring pallet.
16. 16. chip testing devices as claimed in claim 15, it is characterised in that the bottom surface of each briquetting is respectively provided with a groove, The briquetting forms two presser feets in the groove both sides, respectively has a guiding surface, institute on the relative two side of two presser feet The guiding surface for stating two presser feets forms horn-like slot opening in being mutually distributed away from situation downwards by the bottom land of groove.
17. 17. chip testing devices as claimed in claim 15, it is characterised in that the material grasping manipulator also include it is multipair can phase The material grasping of mutual opening and closing refers to, and two paired material graspings refer to respectively symmetrically to be referred to end and stretch downwards positioned at the both sides of the pressing plate and the material grasping Go out the pressing plate, the end that paired material grasping refers to has extended towards material grasping convex edge.