CN109550704A - Automatic silicon wafer sorting equipment - Google Patents
Automatic silicon wafer sorting equipment Download PDFInfo
- Publication number
- CN109550704A CN109550704A CN201710879427.7A CN201710879427A CN109550704A CN 109550704 A CN109550704 A CN 109550704A CN 201710879427 A CN201710879427 A CN 201710879427A CN 109550704 A CN109550704 A CN 109550704A
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- magazine
- detection
- feed mechanism
- separation equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 105
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 105
- 239000010703 silicon Substances 0.000 title claims abstract description 105
- 230000007246 mechanism Effects 0.000 claims abstract description 64
- 238000001514 detection method Methods 0.000 claims abstract description 60
- 230000005540 biological transmission Effects 0.000 claims abstract description 32
- 238000010330 laser marking Methods 0.000 claims abstract description 12
- 238000012360 testing method Methods 0.000 claims description 45
- 238000000926 separation method Methods 0.000 claims description 18
- 238000005520 cutting process Methods 0.000 claims description 13
- 230000007723 transport mechanism Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 230000007547 defect Effects 0.000 abstract description 4
- 238000007599 discharging Methods 0.000 abstract 3
- 230000010354 integration Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- GVVPGTZRZFNKDS-JXMROGBWSA-N geranyl diphosphate Chemical compound CC(C)=CCC\C(C)=C\CO[P@](O)(=O)OP(O)(O)=O GVVPGTZRZFNKDS-JXMROGBWSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/04—Sorting according to size
- B07C5/10—Sorting according to size measured by light-responsive means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2301/00—Sorting according to destination
- B07C2301/0008—Electronic Devices, e.g. keyboard, displays
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention provides automatic silicon wafer sorting equipment which comprises a feeding part, a detection part and a discharging part which are arranged in sequence, wherein the detection part comprises a transmission mechanism: the detection part is arranged in the silicon chip and is used for transmitting the silicon chip; a positioning mechanism: the silicon wafer discharging mechanism is arranged at the starting end of the transmission mechanism and used for positioning the silicon wafer of the wafer discharging basket; a surface detection module: the transmission mechanism is arranged on the side surface and the upper surface of the silicon wafer and used for detecting appearance defects of the surface of the silicon wafer; a geometric parameter detection module: the silicon wafer thickness measuring device is arranged in the detection part and is used for measuring the thickness of the silicon wafer; a resistivity detection module: and the detector is arranged in the detection part and used for measuring the electric loss of the silicon chip. The invention has the advantages that the functions of belt transmission line integration, appearance detection, geometric parameter detection, resistivity detection, laser marking and the like are realized, the silicon wafer is automatically, efficiently and accurately sorted, the productivity of silicon wafer detection and sorting is effectively improved, the silicon wafer is free to be sorted according to parameters such as resistivity, thickness and appearance, the false detection rate is reduced, and the like.
Description
Technical field
The invention belongs to semi-conductor silicon chip manufacturing machine technical fields, more particularly, to a kind of silicon wafer automatic separation equipment.
Background technique
Semi-conductor silicon chip is the basic material of semiconductor devices production.Semiconductor devices production line product produced is many
More, specifications and models are had nothing in common with each other.The silicon wafer of specific electric resistance, thickness need to be selected to be thrown for the specifications parameter of different components
It produces.If the silicon chip resistivity of selection, thickness and appearance are undesirable, the inclined of electrical parameter can occur for the product produced
From formation product is bad.The parameter that supplied materials silicon wafer need to detect at present is as follows:
1. silicon wafer apparent parameter: chipping, notch, contamination, scuffing；
2. silicon wafer geometric parameter；Thickness, TTV, warpage, deformation；
3. silicon chip resistivity parameter: resistance value, the judgement of P/N type；
Designer is just needed to take into account above 3 sides of consideration to meet semiconductor devices product to the testing requirements of supplied materials silicon wafer
The detection parameters in face.
The semiconductor silicon slice test sorting equipment overwhelming majority on the market is using the side such as artificial sampling observation and probe in detecting at present
Formula has the disadvantage in that
1. it is low that probe station detects the efficiency of separation, it is difficult to meet the requirement of large-scale production；
2. artificial detection false detection rate is high；
3. equipment on the market can only detect single parameter or 2~3 parameters at present, it is difficult to according to the appearance of silicon wafer, several
What and resistance parameter are reasonably sorted, and product yield is influenced；
Summary of the invention
The object of the present invention is to provide a kind of silicon wafer automatic separation equipments, are to solve capacity efficiency in the prior art
Problem low, false detection rate is high, detection parameters are single.
In order to solve the above technical problems, the technical solution adopted by the present invention is that: a kind of silicon wafer automatic separation equipment, including according to
Feeding portion, test section and the blanking portion of secondary setting, the test section includes transmission mechanism, positioning mechanism, surface detection module, several
What parameter detection module and Resistivity testing module, wherein
The transmission mechanism is arranged in the test section, for transmitting to silicon wafer；
The starting point of the transmission mechanism is arranged in the positioning mechanism, positions to the silicon wafer of slice basket；
The sides and top of the transmission mechanism is arranged in the surface detection module, and the appearance for detecting silicon chip surface lacks
It falls into；
The geometric parameter detection module is arranged in test section, measures the thickness of silicon wafer；
The Resistivity testing module is arranged in test section, measures the electrical loss of silicon wafer.
Further, the test section further includes laser marking module, and the laser marking module includes setting gradually
Camera and printing station, wherein
The camera is for positioning silicon wafer；
The printing station is used to print the content of position location.
Further, the geometric parameter detection module scans silicon wafer, measurement using multiple high-precision 3D laser sensors
The thickness of silicon wafer calculates warpage and deformation.
Further, the feeding portion includes the full magazine feed mechanism and stacking feed mechanism set gradually,
The full magazine feed mechanism, for for the silicon wafer in extracting sheet basket；
The stacking feed mechanism, for transporting the silicon wafer of laminar to transmission mechanism.
Further, the feeding portion further includes sky magazine cutting agency, the sky magazine cutting agency and the full material
Box feed mechanism is arranged in parallel, and the sky magazine cutting agency is set to the full magazine feed mechanism bottom.
Further, the feeding portion further includes magazine lifting platform, and the magazine lifting platform setting is on the full magazine
Expect between mechanism and the stacking feed mechanism, the magazine lifting platform is under the full magazine feed mechanism and the empty magazine
It is slided up and down between material mechanism, to drive magazine to go up and down.
Further, the blanking portion includes,
Transport mechanism: the silicon wafer after being used for transmission detection；
Multiple Riving Box stations: being set to the side of transport mechanism, and different according to test item classify to silicon wafer；
Further, the blanking portion further includes multiple basket stations: being set to the other side of the transport mechanism, uses
In the full blue qualified products of storage.The tool of rewinding station can be arranged according to the difference of silicon chip resistivity and thickness, software in each station
Body rewinding parameter.
Further, the blanking portion further includes multiple basket stations: being set to the transport mechanism and described
Between basket station, for storing detection qualified products.
The advantages and positive effects of the present invention are:
1. using high-speed belt transmission line by appearance detection module, geometric parameter detection module, Resistivity testing module and
Laser marking block coupled in series to together, by integrated belt transmission line, appearance detection, geometric parameter detection, Resistivity testing and
The functions such as laser marking, realize silicon wafer it is automatic, efficiently and accurately sort, will test the silicon wafer that finishes and sort to setting
Discharge station.
2. silicon wafer automatic separation equipment has the effective production capacity for improving silicon wafer detection sorting, guarantees silicon wafer according to resistance
The advantages that parameters such as rate, thickness, appearance carry out free sorting and reduce false detection rate.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is the structural schematic diagram in feeding portion of the present invention；
Fig. 3 is the configuration schematic diagram inside test section of the present invention；
Fig. 4 is the structural schematic diagram in blanking portion of the present invention.
In figure:
1, feeding portion, 2, test section, 3, blanking portion, 11, full magazine feed mechanism, 12, empty magazine cutting agency, 13, material
Box lifting platform, 14, stacking feed mechanism, 21, positioning mechanism, 22, upper surface detection module, 23, lower surface detection module, 24,
Geometric parameter detection module, 25, Resistivity testing module, 26, laser marking module, 31, Riving Box station, 32, piece basket caching
Station, 33, piece basket station.
Specific embodiment
As shown in Figs 1-4, a kind of silicon wafer automatic separation equipment of this example, including set gradually feeding portion 1, test section 2
With blanking portion 3, test section 2 includes transmission mechanism, positioning mechanism 21, surface detection module, geometric parameter detection module 24 and electricity
Resistance rate detection module 25, wherein transmission mechanism is arranged in test section 2, and transmission mechanism uses belt transmission line, belt transmission line
Through test section, for being transmitted to silicon wafer；The starting point of transmission mechanism is arranged in positioning mechanism 21, to the silicon of slice basket
Piece is positioned；Surface detection module includes upper surface detection module 22 and lower surface detection module 23, is arranged in transmission mechanism
Sides and top, detect the open defect of silicon chip surface；Geometric parameter detection module 24 is arranged in test section 2, measures silicon
The thickness of piece；Resistivity testing module 25 is arranged in test section 2, measures the electrical loss of silicon wafer.Test section 2 further includes that laser is beaten
Module 26 is marked, laser marking module 26 includes the camera and printing station set gradually, wherein camera is for determining silicon wafer
Position；Printing station is used to print the content of position location.
Silicon wafer automatic separation equipment transmits silicon wafer using belt line, utilizes after reaching vision station positioned at belt line
The camera of two sides and camera positioned at belt line upper end carry out photographic analysis, measurement to the thickness of silicon wafer and silicon wafer upper surface respectively
Silicon wafer thickness and surface appearance defects.Geometric parameter module 24 scans silicon wafer using multiple high-precision 3D laser sensors, according to
Needs of production chooses an appropriate number of high-precision 3D laser sensor, the high-precision 3D laser sensor that this example is chosen
It is 6, measures the thickness of silicon wafer, calculates warpage and deformation.3D laser sensor use internal loopback principle, detection issue with
The time difference for receiving laser calculates the specific of silicon chip surface and laser head, later according to consolidating between delivery platform and laser
It is fixed highly to extrapolate silicon wafer thickness.Resistivity testing module 25 is flowed in the coil close to conductive material by alternating current.
The magnetic field of coil causes circulation (vortex) electric current in silicon wafer.Resistivity is calculated by electrical loss in measurement eddy current measurement silicon wafer,
By functions such as integrated belt transmission line, appearance detection, geometric parameter detection, Resistivity testing, laser markings, silicon wafer is realized
Automatically, efficiently and accurately sort.
Feeding portion 1 includes the full magazine feed mechanism 11 set gradually and stacking feed mechanism 14, wherein full magazine feeding
Mechanism 11, for the full magazine feed mechanism, for the silicon wafer in extracting sheet basket, when supplied materials is the piece basket form for sticking with silicon wafer
When, controlling setting feeding manner by PLC control system is piece basket feeding, and equipment identifies that full magazine feed mechanism has piece Lan Houke
By the silicon wafer extraction in piece basket.Feed mechanism 14 is stacked, for for inhaling the silicon wafer of laminar piecewise by vacuum cups
After taking on transport to transmission belt, stacks feed mechanism and also PLC control system is used to control.
It further include sky magazine cutting agency 12, empty magazine cutting agency 12 and full magazine feed mechanism 11 are arranged in parallel, empty
Magazine cutting agency 12 is set to full 11 bottom of magazine feed mechanism, further includes magazine lifting platform 13, and magazine lifting platform 13 is arranged
It in full magazine feed mechanism 11 and stacks between feed mechanism 14, magazine lifting platform 13 is in full magazine feed mechanism 11 and empty magazine
It is slided up and down between cutting agency 12, to drive magazine to go up and down.
Blanking portion 3 includes transport mechanism: the silicon wafer after being used for transmission detection；Multiple Riving Box stations 31: it is set to transmission
The side of mechanism, different according to test item classify to silicon wafer；Multiple basket stations 33: it is set to the another of the transport mechanism
Side, for storing full blue qualified products.Multiple basket stations 32: the transport mechanism and described basket station are set to
Between 33, for storing detection qualified products.Riving Box station 31, piece basket station 32 and the piece basket station 33 in blanking portion 3
Quantity can increase and decrease according to actual needs, this example according to needs of production select 5 Riving Box stations, 31,6 pieces
Basket station 32 and 6 piece basket stations 33.It can test item various criterion by setting three kinds or more.Riving Box work
31 points of position is several classes, and substandard product box category is divided into: bad order uses 2 Riving Boxes, and thickness is bad to use 1 sub-material
Box, resistivity is bad to use 1 Riving Box, does not know product and uses 1 Riving Box；Qualified products box uses 6 piece baskets, according to
Setting classifies to product.
The course of work of this example: feeding portion passes through PLC controller control from piece basket feeding or lamination feeding, material-uploading style
System, silicon wafer is sent on belt piecewise, and silicon wafer is entered test section, and positioning mechanism: positioning the silicon wafer of slice basket, when fixed
When position mechanism detects silicon wafer, belt stops operating, and the fixed position of silicon wafer of the clamp system of positioning mechanism two sides, left-right position is missed
Difference < ± 2mm, rotation error < 2 °；Upper and lower surface testing agency: using the image of line-scan digital camera acquisition upper and lower surface, appearance is carried out
The inspection of defect；3D detection module: using 6 high-precision 3D laser sensors, measures the thickness of GPP, calculates warpage and deformation；
Resistivity testing module: data acquisition is carried out using SEMILAB WMT-3 module and is analyzed；Laser marking module: product enters
Printing station first positions product using camera, is then printed, be will test according to the position of setting and printing content
The silicon wafer finished passes through in cutting agency transmission sorting to the corresponding piece basket or Riving Box set.
The beneficial effects of the present invention are:
1. using high-speed belt transmission line by appearance detection module, geometric parameter detection module, Resistivity testing module and
Laser marking block coupled in series to together, by integrated belt transmission line, appearance detection, geometric parameter detection, Resistivity testing and
The functions such as laser marking, realize silicon wafer it is automatic, efficiently and accurately sort, will test the silicon wafer that finishes and sort to setting
Discharge station.
2. silicon wafer automatic separation equipment has the effective production capacity for improving silicon wafer detection sorting, guarantees silicon wafer according to resistance
The advantages that parameters such as rate, thickness, appearance carry out free sorting and reduce false detection rate.
One embodiment of the present invention has been described in detail above, but the content is only preferable implementation of the invention
Example, should not be considered as limiting the scope of the invention.It is all according to all the changes and improvements made by the present patent application range
Deng should still be within the scope of the patent of the present invention.
Claims (9)
1. a kind of silicon wafer automatic separation equipment, it is characterised in that: including feeding portion, test section and the blanking portion set gradually, institute
Stating test section includes transmission mechanism, positioning mechanism, surface detection module, geometric parameter detection module and Resistivity testing module,
Wherein,
The transmission mechanism is arranged in the test section, for transmitting to silicon wafer；
The starting point of the transmission mechanism is arranged in the positioning mechanism, positions for the silicon wafer to slice basket；
The sides and top of the transmission mechanism is arranged in the surface detection module, and the appearance for detecting silicon chip surface lacks
It falls into；
The geometric parameter detection module is arranged in test section, for measuring the thickness of silicon wafer；
The Resistivity testing module is arranged in test section, for measuring the electrical loss of silicon wafer.
2. a kind of silicon wafer automatic separation equipment according to claim 1, it is characterised in that: the test section further includes laser
Mark module, the laser marking module include the camera and printing station set gradually, wherein
The camera is for positioning silicon wafer；
The printing station is used to print the content of position location.
3. a kind of silicon wafer automatic separation equipment according to claim 1 or 2, it is characterised in that: the geometric parameter detection
Module scans silicon wafer using multiple high-precision 3D laser sensors, measures the thickness of silicon wafer, calculates warpage and deformation.
4. a kind of silicon wafer automatic separation equipment according to claim 1, it is characterised in that: the feeding portion includes successively setting
The full magazine feed mechanism and stacking feed mechanism set,
The full magazine feed mechanism, for the silicon wafer in extracting sheet basket；
The stacking feed mechanism, for transporting the silicon wafer of laminar to transmission mechanism.
5. a kind of silicon wafer automatic separation equipment according to claim 3, it is characterised in that: the feeding portion further includes empty material
Box cutting agency, the sky magazine cutting agency and the full magazine feed mechanism are arranged in parallel, the sky magazine cutting agency
It is set to the full magazine feed mechanism bottom.
6. a kind of silicon wafer automatic separation equipment according to claim 4, it is characterised in that: the feeding portion further includes magazine
Lifting platform, the magazine lifting platform setting is between the full magazine feed mechanism and the stacking feed mechanism, the magazine
Lifting platform slides up and down between the full magazine feed mechanism and the empty magazine cutting agency, to drive magazine to go up and down.
7. a kind of silicon wafer automatic separation equipment according to claim 1, it is characterised in that: the blanking portion includes,
Transport mechanism: the silicon wafer after being used for transmission detection；
Multiple Riving Box stations: being set to the side of transport mechanism, and different according to test item classify to silicon wafer.
8. a kind of silicon wafer automatic separation equipment according to claim 7, it is characterised in that: the blanking portion further includes,
Multiple basket stations: being set to the other side of the transport mechanism, for storing full blue qualified products.Each station can root
According to the difference of silicon chip resistivity and thickness, the specific rewinding parameter of rewinding station is arranged in software.
9. a kind of silicon wafer automatic separation equipment according to claim 8, it is characterised in that: the blanking portion further includes,
Multiple basket stations: being set between the transport mechanism and described basket station, and for storing, detection is qualified to be produced
Product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710879427.7A CN109550704A (en) | 2017-09-26 | 2017-09-26 | Automatic silicon wafer sorting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710879427.7A CN109550704A (en) | 2017-09-26 | 2017-09-26 | Automatic silicon wafer sorting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109550704A true CN109550704A (en) | 2019-04-02 |
Family
ID=65862770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710879427.7A Pending CN109550704A (en) | 2017-09-26 | 2017-09-26 | Automatic silicon wafer sorting equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109550704A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110026351A (en) * | 2019-05-22 | 2019-07-19 | 许昌学院 | A kind of plate detected automatically sticks up trigger squeeze |
| CN110153040A (en) * | 2019-06-23 | 2019-08-23 | 东莞广达智能科技有限公司 | Efficient chip visual detection equipment |
| CN110379736A (en) * | 2019-07-09 | 2019-10-25 | 无锡奥特维科技股份有限公司 | Silicon wafer sorting machine |
| CN110538806A (en) * | 2019-09-05 | 2019-12-06 | 蓝思智能机器人(长沙)有限公司 | detection system and feeding and discharging equipment thereof |
| CN110921234A (en) * | 2019-12-30 | 2020-03-27 | 太仓市晨启电子精密机械有限公司 | Silicon controlled rectifier consistent machine with foldable loading attachment |
| CN111185408A (en) * | 2020-03-09 | 2020-05-22 | 常州新隆威智能技术有限公司 | Automatic sorting system for solar cell silicon wafers |
| CN111957586A (en) * | 2020-08-31 | 2020-11-20 | 常州科瑞尔科技有限公司 | Full-automatic PL detection device |
| CN113351514A (en) * | 2021-05-06 | 2021-09-07 | 上海大族富创得科技有限公司 | Wafer thickness sorting method |
| CN114002226A (en) * | 2021-10-29 | 2022-02-01 | 西安奕斯伟材料科技有限公司 | Silicon wafer detection method |
| CN114101434A (en) * | 2021-11-01 | 2022-03-01 | 嘉善悦诚汽车配件有限公司 | Automatic production stamping assembly line for automobile seat beam fittings |
| WO2022116514A1 (en) * | 2020-12-04 | 2022-06-09 | 苏州天准科技股份有限公司 | Intelligent silicon wafer sorting machine |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202245328U (en) * | 2011-09-17 | 2012-05-30 | 无锡先导自动化设备股份有限公司 | Device for circularly taking out box-packed silicon wafers |
| CN102807092A (en) * | 2011-06-01 | 2012-12-05 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Solar cell conveying mechanism and solar cell conveying system |
| CN104259109A (en) * | 2014-07-28 | 2015-01-07 | 中国电子科技集团公司第四十八研究所 | Stepping silicon wafer quality sorting system |
| CN204122375U (en) * | 2014-09-01 | 2015-01-28 | 中国电子科技集团公司第四十八研究所 | A kind of crystal silicon battery acetes chinensis screening installation |
| CN104307759A (en) * | 2014-09-25 | 2015-01-28 | 中国电子科技集团公司第四十八研究所 | Feeding system and feeding method for silicon chip quality sorting equipment |
| CN104613879A (en) * | 2015-01-19 | 2015-05-13 | 无锡名谷科技有限公司 | Silicon wafer thickness measuring device and measuring method |
| CN206194697U (en) * | 2016-06-28 | 2017-05-24 | 南京卓胜自动化设备有限公司 | Type silicon chip or battery piece detect sorter in succession |
| CN207401780U (en) * | 2017-09-26 | 2018-05-25 | 天津环鑫科技发展有限公司 | Automatic silicon wafer sorting equipment |
-
2017
- 2017-09-26 CN CN201710879427.7A patent/CN109550704A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102807092A (en) * | 2011-06-01 | 2012-12-05 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Solar cell conveying mechanism and solar cell conveying system |
| CN202245328U (en) * | 2011-09-17 | 2012-05-30 | 无锡先导自动化设备股份有限公司 | Device for circularly taking out box-packed silicon wafers |
| CN104259109A (en) * | 2014-07-28 | 2015-01-07 | 中国电子科技集团公司第四十八研究所 | Stepping silicon wafer quality sorting system |
| CN204122375U (en) * | 2014-09-01 | 2015-01-28 | 中国电子科技集团公司第四十八研究所 | A kind of crystal silicon battery acetes chinensis screening installation |
| CN104307759A (en) * | 2014-09-25 | 2015-01-28 | 中国电子科技集团公司第四十八研究所 | Feeding system and feeding method for silicon chip quality sorting equipment |
| CN104613879A (en) * | 2015-01-19 | 2015-05-13 | 无锡名谷科技有限公司 | Silicon wafer thickness measuring device and measuring method |
| CN206194697U (en) * | 2016-06-28 | 2017-05-24 | 南京卓胜自动化设备有限公司 | Type silicon chip or battery piece detect sorter in succession |
| CN207401780U (en) * | 2017-09-26 | 2018-05-25 | 天津环鑫科技发展有限公司 | Automatic silicon wafer sorting equipment |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110026351A (en) * | 2019-05-22 | 2019-07-19 | 许昌学院 | A kind of plate detected automatically sticks up trigger squeeze |
| CN110153040A (en) * | 2019-06-23 | 2019-08-23 | 东莞广达智能科技有限公司 | Efficient chip visual detection equipment |
| CN110379736A (en) * | 2019-07-09 | 2019-10-25 | 无锡奥特维科技股份有限公司 | Silicon wafer sorting machine |
| CN110538806B (en) * | 2019-09-05 | 2021-08-27 | 蓝思智能机器人(长沙)有限公司 | Detection system and feeding and discharging equipment thereof |
| CN110538806A (en) * | 2019-09-05 | 2019-12-06 | 蓝思智能机器人(长沙)有限公司 | detection system and feeding and discharging equipment thereof |
| CN110921234A (en) * | 2019-12-30 | 2020-03-27 | 太仓市晨启电子精密机械有限公司 | Silicon controlled rectifier consistent machine with foldable loading attachment |
| CN111185408A (en) * | 2020-03-09 | 2020-05-22 | 常州新隆威智能技术有限公司 | Automatic sorting system for solar cell silicon wafers |
| CN111957586A (en) * | 2020-08-31 | 2020-11-20 | 常州科瑞尔科技有限公司 | Full-automatic PL detection device |
| WO2022116514A1 (en) * | 2020-12-04 | 2022-06-09 | 苏州天准科技股份有限公司 | Intelligent silicon wafer sorting machine |
| CN113351514A (en) * | 2021-05-06 | 2021-09-07 | 上海大族富创得科技有限公司 | Wafer thickness sorting method |
| CN114002226A (en) * | 2021-10-29 | 2022-02-01 | 西安奕斯伟材料科技有限公司 | Silicon wafer detection method |
| CN114002226B (en) * | 2021-10-29 | 2024-01-26 | 西安奕斯伟材料科技股份有限公司 | Silicon wafer detection method |
| CN114101434A (en) * | 2021-11-01 | 2022-03-01 | 嘉善悦诚汽车配件有限公司 | Automatic production stamping assembly line for automobile seat beam fittings |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109550704A (en) | Automatic silicon wafer sorting equipment | |
| CN207401780U (en) | Automatic silicon wafer sorting equipment | |
| CN107381043B (en) | Testing and packaging machine for pulse transformer products and testing and packaging process thereof | |
| CN103776841B (en) | Synthetic leather automatic defect detecting device and detection method | |
| CN205905562U (en) | Laser marking machine | |
| CN105396801B (en) | A kind of metal strain meter detects, cuts, sorting automatically, packaging system | |
| CN107051918B (en) | Full-automatic heating plate current sorting voltage-withstanding detection line and detection method | |
| CN202049116U (en) | Device for detecting and classifying packaging chips | |
| CN102680102A (en) | Automatic detection method of solar silicon chip colors based on machine vision | |
| CN112150439B (en) | Automatic sorting equipment and sorting method for injection molding parts | |
| CN207946113U (en) | A kind of Visual intelligent detection robot | |
| CN102773219A (en) | Device for detecting and sorting light-emitting components | |
| CN105731066A (en) | Lithium battery after-process test machine | |
| CN103929893A (en) | Automatic transformer PCB assembling line | |
| CN107187636A (en) | Fully-automatic intelligent clothes packaging system | |
| TWI536011B (en) | Electronic parts inspection device | |
| CN210847220U (en) | Station turntable improvement device of circuit board detector | |
| CN103344900B (en) | Photovoltaic battery panel electric performance test, data process and place method for separating and equipment | |
| CN207736544U (en) | Automatic test cutting all-in-one | |
| CN205522025U (en) | Automatic unloading sorting machine | |
| CN209379452U (en) | A kind of comprehensive chip appearance automatic optics inspection platform | |
| CN205470126U (en) | Timely flush trimmer of beverage assembly line packing defect | |
| CN202075380U (en) | Light-emitting element detecting and classifying device | |
| CN209815112U (en) | Regulation and control system and detection production line | |
| CN206154530U (en) | A equip that is used for online automatic identification of elastomeric compound defective work and letter sorting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |