WO2022116514A1 - Intelligent silicon wafer sorting machine - Google Patents

Abstract

An intelligent silicon wafer sorting machine, comprising: a feeding device (100), a testing device (200), and a discharging and sorting device (300); the feeding device (100) comprises at least two feeding modules (110, 120) and a translation module (130), and the at least two feeding modules (110, 120) are driven by the translation module (130) so as to perform alternate feeding; the testing device (200) is located at the downstream of the feeding device (100), and comprises a testing streamline (210) and multiple testing modules provided in the testing streamline (210); the sorting device (300) is located at the downstream of the testing device (200), and comprises several discharging and sorting modules (310), and the discharging and sorting modules (310) are combined and butt-jointed in accordance with a discharging and conveying direction. The sorting machine can, by means of the feeding device (100), achieve continuous and efficient feeding of silicon wafers, and fully utilize the operation time of loading of silicon wafer charging baskets; the sorting machine can, by means of the testing device (200) at the downstream, complete the testing of multiple items of the silicon wafers, and fully meet the actual requirements for testing silicon wafers; and after completing the testing, the sorting machine can, by means of the discharging and sorting device (300), also achieve the sorting of good and bad silicon wafers and the sorting of silicon wafers having different defect types.

Description

Silicon wafer intelligent sorting machine technical field

The invention relates to the technical field of silicon wafer sorting, in particular to an intelligent silicon wafer sorting machine.

Background technique

As an important industrial raw material, silicon wafers are widely used in the production of solar cells, circuit boards and other products. Therefore, it is necessary to strictly control the quality of silicon wafers before they leave the factory to ensure the quality of solar cells, circuit boards and other products made from silicon wafers. In the actual quality inspection of silicon wafers, it is necessary to integrate multiple inspection items to complete the quality inspection of silicon wafers. Therefore, it is necessary to propose further solutions for the above problems.

SUMMARY OF THE INVENTION

The present invention aims to provide a silicon wafer intelligent sorting machine to overcome the deficiencies in the prior art.

For solving the above-mentioned technical problems, the technical scheme of the present invention is:

An intelligent sorting machine for silicon wafers, comprising: a feeding device, a detection device, and a feeding sorting device;

The feeding device includes: a translation module and at least two feeding modules, and the at least two feeding modules are driven by the translation modules to perform alternate feeding;

The detection device is located downstream of the feeding device, and includes: a detection streamline and a plurality of detection modules arranged along the detection streamline;

The sorting device is located downstream of the detection device, and includes a plurality of blanking and sorting modules, and each blanking and sorting module is combined and connected according to the direction of blanking and conveying.

As an improvement of the silicon wafer intelligent sorting machine of the present invention, the feeding device includes: a first feeding module and a second feeding module;

Any feeding module includes: a feeding frame, a rotating motor, a clamping unit, a base and a first lifting mechanism. The bottom of the feeding frame is pivotally connected to the base, and the rotating motor drives the feeding frame to connect to the base. The pivot between the bases rotates, the clamping units are installed on both sides of the loading rack, and the first lifting mechanism drives the loading rack, the rotating motor, the clamping unit and the base to lift and lower as a whole.

As an improvement of the intelligent silicon wafer sorting machine of the present invention, the clamping unit includes at least two groups of clamping structures arranged from top to bottom;

Any set of clamping structures includes: fixed jaws, movable jaws and clamping cylinders, the fixed jaws are installed on one side of the feeding rack at the end, and the movable jaws are located on the other side of the feeding frame at the end. and the movable jaw can be driven by the clamping cylinder to reciprocate relative to the fixed jaw.

As an improvement of the silicon wafer intelligent sorting machine of the present invention, the first lifting mechanism includes: a first lifting motor, a first lifting screw and a first lifting slider;

The first lifting screw is arranged vertically, one end of the first lifting screw is connected to the first lifting motor, and is driven by the first lifting motor to pivot, and the first lifting slider is connected to the first lifting motor. The first lifting screw rod is threadedly connected and moves in a vertical direction with the pivoting of the first lifting screw rod, and the first lifting sliding block is connected with the base.

As an improvement of the silicon wafer intelligent sorting machine of the present invention, the translation module includes: a translation motor, a translation screw, a translation slider and at least two guide rails arranged horizontally;

The translation motor is drive-connected with one end of the translation screw, the translation slider is threadedly matched with the translation screw, and the translation slider is connected to the fixed plate where the at least two feeding modules are located, so the The translation motor drives the at least two feeding modules to move horizontally along the guide rail through the translation screw and the translation slider.

As an improvement of the silicon wafer intelligent sorting machine of the present invention, the detection streamline is composed of a plurality of streamline units arranged in sequence;

Any streamline unit includes: a streamline bracket, a pulley, a transmission belt and a drive motor, the streamline bracket includes: a bracket body and a strut supporting the bracket body, there are several pulleys, and the several pulleys are symmetrical They are distributed on both sides of the streamline support, the transmission belts are respectively sleeved on a plurality of pulleys on both sides, the oppositely arranged pulleys on both sides are connected by a transmission shaft, and the drive motor is connected with a pulley for transmission. .

As an improvement of the silicon wafer intelligent sorting machine of the present invention, on one side of the streamline support, two pulleys are located at both ends of the support body, and the other four pulleys are located below between the pulleys at both ends , and two of the four pulleys are arranged adjacently, and the other pulley is located just below between the two adjacently arranged pulleys, and the drive motor is drive-connected with the pulley directly below.

As the improvement of the silicon wafer intelligent sorting machine of the present invention, the upstream end of the detection streamline is further provided with a guiding mechanism, and the guiding mechanism includes: a left-right symmetrically arranged guiding unit and two guiding units that are driven to face each other Or adjustment units that move in opposite directions;

The guiding unit on either side includes: a first base, a guiding belt and a guiding motor, the guiding belt and the guiding motor are installed at the top position of the first base, and the guiding belt is along the silicon The conveying direction of the wafer is set obliquely, so that the distance between the guiding belts of the two guiding units gradually decreases along the conveying direction of the silicon wafer;

The adjusting unit includes: an adjusting handwheel and an adjusting screw, two ends of the adjusting screw are respectively provided with threads arranged in opposite directions, and two ends of the adjusting screw are threadedly connected with sliders, and the sliders at both ends are respectively connected with the screws. The corresponding guiding units are connected, and the adjusting handwheel is fixedly connected with one end of the adjusting screw rod.

As an improvement of the silicon wafer intelligent sorting machine of the present invention, the plurality of detection modules include: left and right edge collapse modules, thickness detection modules, resistivity test modules, front and rear collapse modules, size detection modules, dirty Part or all of the contamination detection module, the chamfering and edge module, and the crack detection module.

As an improvement of the silicon wafer intelligent sorting machine of the present invention, any blanking and sorting module includes: a workbench, a blanking conveying line, several blanking and sorting stations, the blanking conveying line is installed on the worktable, and several The material sorting stations are distributed on both sides of the unloading conveyor line;

The unloading conveying line includes: a conveying line body, a jacking mechanism and a sorting conveying mechanism;

The conveying line body comprises: two conveying belts arranged in parallel, and a plurality of supporting platforms located between the two conveying belts and spaced along the conveying direction;

The jacking mechanisms are respectively arranged between the adjacent support tables, and include: a jacking motor, a cam and a steering belt perpendicular to the conveying direction, the steering belt is initially located between the adjacent support tables. Below, the cam is located below the steering belt, and is directly or indirectly connected to the bottom of the steering belt, and the cam is driven by the jacking motor to pivot;

The sorting and conveying mechanism includes an inclined sorting and conveying belt, one end of the sorting and conveying belt can be connected with the steering belt after being lifted by the cam, and the other end extends to the corresponding blanking and sorting station. where

The blanking and sorting stations are respectively arranged at the downstream ends of the sorting and conveying belts, and include: a second lifting mechanism and a plurality of material boxes driven up and down by the second lifting mechanism, and the plurality of material boxes are arranged at intervals from top to bottom;

The second lifting mechanism includes: a second lifting motor, a second lifting screw and a second lifting slider;

The second lifting screw is arranged vertically, the two ends of the second lifting screw are connected with the second lifting motor, and are driven by the second lifting motor to pivot, and the second lifting slider It is threadedly connected with the second lifting screw and moves in the vertical direction with the pivoting of the second lifting screw, and the second lifting slider is connected with the fixing plate where the plurality of material boxes are located.

Compared with the prior art, the beneficial effects of the present invention are: the intelligent silicon wafer sorting machine of the present invention can realize continuous and efficient feeding of silicon wafers through its feeding device, and make full use of the operation time for loading the wafer baskets. At the same time, the detection of multiple items of silicon wafers is completed through the downstream detection device, which fully meets the actual inspection requirements of silicon wafers and significantly improves the quality inspection efficiency of silicon wafers. At the same time, after the inspection is completed, the sorting device is also passed through the blanking and sorting device, which also realizes the sorting of good and bad silicon wafers, as well as the sorting of silicon wafers of different defect types, which is convenient for the management of silicon wafers and the existence of problems in the production process of silicon wafers. Analysis statistics of the problem.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments described in the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

FIG. 1 is a three-dimensional schematic diagram of an embodiment of an intelligent silicon wafer sorting machine according to the present invention;

Fig. 2 is the three-dimensional enlarged schematic diagram of the feeding device in Fig. 1;

Fig. 3 is the three-dimensional enlarged schematic diagram of the first feeding module, the second feeding module and the translation module in Fig. 2;

Fig. 4 is a perspective enlarged schematic view of another angle of the first feeding module, the second feeding module and the translation module in Fig. 2;

Fig. 5 is the three-dimensional enlarged schematic diagram of the first lifting mechanism in Fig. 2;

Fig. 6 is the plane enlarged schematic diagram of the translation module in Fig. 1;

Fig. 7 is the three-dimensional enlarged schematic diagram of the detection device in Fig. 1;

Fig. 8 is the three-dimensional enlarged schematic diagram of the detection streamline in Fig. 7;

Fig. 9 is the three-dimensional enlarged schematic diagram of the streamline unit in Fig. 8;

Fig. 10 is the three-dimensional enlarged schematic diagram of the guiding mechanism in Fig. 7;

Fig. 11 is the three-dimensional enlarged schematic diagram of the left and right edge collapse module in Fig. 7;

Fig. 12 is the three-dimensional enlarged schematic diagram of the thickness detection module in Fig. 7;

Fig. 13 is the three-dimensional enlarged schematic diagram of the resistivity test module in Fig. 7;

Fig. 14 is the three-dimensional enlarged schematic diagram of the front and rear collapse modules in Fig. 7;

Fig. 15 is the three-dimensional enlarged schematic diagram of the size detection module in Fig. 7;

FIG. 16 is an enlarged schematic perspective view of the upper contamination detection unit in FIG. 7;

FIG. 17 is an enlarged schematic three-dimensional view of the lower contamination detection unit in FIG. 7;

Fig. 18 is the three-dimensional enlarged schematic diagram of the chamfering and edge-breaking module in Fig. 7;

Fig. 19 is the three-dimensional enlarged schematic diagram of the crack detection module in Fig. 7;

Fig. 20 is the three-dimensional enlarged schematic diagram of the blanking sorting device in Fig. 1;

Fig. 21 is a three-dimensional enlarged schematic view of the blanking and sorting module in Fig. 20;

FIG. 22 is an enlarged schematic plan view of the jacking mechanism and the sorting and conveying mechanism in FIG. 20 .

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

As shown in FIG. 1 , an embodiment of the present invention provides an intelligent silicon wafer sorting machine. The intelligent silicon wafer sorting machine in this embodiment includes: a feeding device 100 , a detection device 200 , and a cutting and sorting device 300 .

【 Feeding device 】

As shown in FIGS. 2-6 , the loading device 100 is used to realize the loading of silicon wafers, wherein the silicon wafers are placed in a basket in a stacked manner, and the basket for loading a plurality of stacked silicon wafers can be placed on the upper In the feeding device 100, the feeding device 100 further recycles the feeding basket and sends it to the feeding position.

The feeding device 100 includes: a first feeding module 110 , a second feeding module 120 and a translation module 130 . Both of the two feeding modules 110 and 120 can load the stacking baskets of several silicon wafers, and are driven by the translation module 130 to alternate feeding. Therefore, during the process of placing the material basket on the material feeding module, the other material feeding module can be kept able to continue to work, thereby achieving higher material feeding efficiency.

Any of the feeding modules 110 and 120 includes: a feeding frame 111 , a rotating motor 112 , a clamping unit 113 , a base 114 and a first lifting mechanism 115 .

The bottom of the feeding rack 111 is pivotally connected to the base 114, and the rotating motor 112 is installed on one side of the base 114, and can drive the pivot between the feeding frame 111 and the base 114 to rotate, so that the feeding frame 111 at least The pivoting is performed within a range of 90°. The purpose of this setting is to consider that the material basket is first placed horizontally in the process of loading the material loading module, and the silicon wafers are sent out from the bottom when the material basket is vertical. Therefore, the loading rack 111 for loading the basket needs to be turned from a horizontal state to a vertical state.

The clamping units 113 are installed on both sides of the feeding rack 111 so as to clamp and fix the material baskets loaded in the feeding rack 111 to maintain the stability of feeding. The clamping unit 113 includes at least two groups of clamping structures 1131 arranged from top to bottom. In one embodiment, there are two groups of clamping structures 1131 , one of which is mounted on one end of the feeding rack 111 , and the other group is mounted on the other end of the feeding rack 111 .

Any set of clamping structures 1131 includes: fixed clamping jaws 11311 , movable clamping jaws 11312 and clamping cylinders 11313 . Among them, the fixed jaw 11311 is installed on one side of the feeding rack 111 at the end, the movable jaw 11312 is located on the other side of the feeding frame 111 at the end, and the movable jaw 11312 can be driven by the clamping cylinder 11313, opposite to the fixed clamp The claw 11311 reciprocates to realize the clamping of the material basket.

At the same time, the upper edge of the fixed jaw 11311 and/or the movable jaw 11312 at the upper end is also provided with a limiting protrusion, and the clamping action surface of the limiting protrusion facing the material basket is an inclined surface. Correspondingly, the upper end edge of the fixed jaw 11311 and/or the movable jaw 11312 at the lower end is also provided with a limiting protrusion, and the clamping action surface of the limiting protrusion facing the material basket is an inclined surface. In this way, when the material basket is clamped, the material basket can be firmly held by the limiting protrusions, thereby further preventing it from loosening.

The first lifting mechanism 115 is used to drive the feeding rack 111 , the rotating motor 112 , the clamping unit 113 and the base 114 to lift and lower as a whole. The purpose of this setting is to consider that when the vertical basket is feeding, the stacked silicon wafers are sent out one by one from the bottom of the basket, so that the height of the stacked silicon wafers gradually decreases. Correspondingly, the loading rack 111 , the rotating motor 112 , the clamping unit 113 and the base 114 are also required to be lowered as a whole to keep the lowermost silicon wafer aligned with the entrance of the downstream detection device 200 .

The first lifting mechanism 115 specifically includes: a first lifting motor 1151 , a first lifting screw 1152 , a first lifting slider 1153 and a first housing 1154 . The first lift screw 1152 is arranged vertically, one end of the first lift screw 1152 is connected to the first lift motor 1151 and is driven by the first lift motor 1151 to pivot. The first lifting slider 1153 is threadedly connected with the first lifting screw 1152 , and moves in a vertical direction with the pivoting of the first lifting screw 1152 . And by controlling the forward and reverse rotation of the first lift motor 1151 , the movement direction of the first lift slider 1153 can be controlled. The first lifting motor 1151 , the first lifting screw 1152 , and the first lifting slider 1153 are accommodated in the first casing 1154 , and the two edges of the first lifting slider 1153 protrude from the gaps on both sides of the first casing 1154 , the protruding part of the first lifting slider 1153 is connected with the base 114 of the feeding module. In this way, when the first lifting motor 1151 works, it can drive the feeding rack 111 , the rotating motor 112 , the clamping unit 113 and the base 114 to lift and lower as a whole.

The first lifting mechanisms 115 of the two feeding modules are arranged side by side, and are driven by the translation module 130 to move left and right in the horizontal direction, so that the two feeding modules are alternately rotated to the feeding position.

The translation module 130 includes: a translation motor 131 , a translation screw 132 , a translation slider and at least two guide rails 134 arranged horizontally. Wherein, the translation motor 131 is drivingly connected with one end of the translation screw rod 132 to drive the translation screw rod 132 to pivot. At the same time, the translation slider is threadedly matched with the translation screw rod 132, so that when the translation screw rod 132 pivots, the translation slider can be driven to move left and right in the horizontal direction. The translation sliding block is further connected to the fixing plate where the two feeding modules are located. Meanwhile, when there are two guide rails 134 , the translation motor 131 , the translation screw rod 132 and the translation slider are located between the two guide rails 134 . In this way, when the translation motor 131 works, the first feeding module 110 and the second feeding module 120 can be moved horizontally along the two guide rails 134 by the translation screw 132 and the translation slider.

In addition, between the feeding device 100 and the detection device 200 , there is also a conveying line for transferring the silicon wafers sent out from the feeding basket to the entrance of the detection device 200 . The conveying line includes a belt driven by a motor for conveying. One end of the belt extends to the entrance of the detection device 200 and the other end extends to one side of the two feeding modules, and can receive the feeding modules from the two alternate feeding modules. Set of silicon wafers.

【 Detection device 】

As shown in FIGS. 7 to 19 , the detection device 200 is used to detect the quality of the silicon wafers loaded by the loading device 100 . The detection device 200 realizes the centralized and continuous detection of various items of silicon wafers by integrating a plurality of detection stations, fully meeting the detection requirements in the industrial production of silicon wafers, and ensuring the quality of the silicon wafers leaving the factory.

The detection device 200 includes: a detection flow line 210 and along the detection flow line 210: a left and right edge collapse module 220, a thickness detection module 230, a resistivity test module 240, a front and rear collapse module 250, a size detection module 260, The contamination detection module 270 , the chamfering and chipping module 280 , and the crack detection module 290 . The order of the above-mentioned detection modules is not limited to the order shown in the drawings. In addition, according to the actual application situation, each of the above-mentioned detection modules may be omitted, or replaced with detection modules capable of realizing other detection items.

Wherein, the detection flow line 210 is used to receive the silicon wafers loaded by the loading device 100, and transmit them to each detection module in sequence for quality detection. The detection flow line 210 is composed of a plurality of flow line units arranged in sequence, and any flow line unit includes: a flow line support 211 , a pulley 212 , a transmission belt 213 and a drive motor 214 .

The streamline support 211 includes a support body and a strut supporting the support body. There are several pulleys 212 , the plurality of pulleys 212 are symmetrically distributed on both sides of the streamline support 211 , and the transmission belts 213 are respectively fitted on the plurality of pulleys 212 on both sides, and drive the silicon wafer to move. The oppositely arranged pulleys 212 on both sides may be connected by a transmission shaft. In this embodiment, in order to make the transmission belt 213 have better tension and avoid loosening during the transmission process, the arrangement of the plurality of pulleys 212 on both sides is optimally designed.

Specifically, taking the arrangement of several pulleys 212 on one side as an example, two pulleys 212 are located at both ends of the bracket body, and the other four pulleys 212 are located below between the pulleys 212 at both ends, and four pulleys 212 are located at the two ends of the bracket body. Two of the pulleys 212 are disposed adjacent to each other, and the other pulley 212 is located just below between the two adjacent pulleys 212 . The drive motor 214 is drivingly connected to the pulley 212 directly below. In this way, when the driving motor 214 works, it can drive the pulley 212 directly connected to it to rotate synchronously, and the pulley 212 further drives the transmission belt and the other pulleys 212 for transmission.

In addition, the upstream end of the detection flow line 210 is also provided with a guiding mechanism 2100 , and the guiding mechanism 2100 guides the silicon wafers that are about to enter the detection flow line 210 to facilitate subsequent transfer and detection of the wafers.

The above-mentioned guiding mechanism 2100 includes: a guiding unit 2101 arranged symmetrically on the left and right, and an adjusting unit 2102 that drives the two guiding units 2101 to move toward or away from each other.

The guide unit 2101 on either side includes: a first base 2111, a guide belt 2121, and a guide motor 2131. The guide belt 2121 and the guide motor 2131 are installed on the top of the first base 2111, and the guide The belts 2121 are inclined along the conveying direction of the silicon wafers, so that the distance between the guiding belts 2121 of the two guiding units 2101 gradually decreases along the conveying direction of the silicon wafers.

The adjustment unit 2102 includes an adjustment hand wheel 2112 and an adjustment screw 2122 . The two ends of the adjusting screw 2122 are respectively provided with oppositely arranged threads, the two ends of the adjusting screw 2122 are screwed with sliders, and the sliders at both ends are respectively connected with the corresponding guiding units 2101 . The adjusting handwheel 2112 is fixedly connected to one end of the adjusting screw 2122 . In this way, when the adjustment hand wheel 2112 is controlled to pivot, due to the reversely arranged thread structure on the adjustment screw 2122, the two alignment units 2101 can be moved toward or away from each other to adjust the distance between the alignment belts 2121. Adapt to the alignment of silicon wafers of different scales. In addition, the first base 2111 is also provided with a slide rail 2132 that facilitates the sliding of the two alignment motors 2131 .

The left and right edge chipping modules 220 are used for quality inspection of the left and right edges of the silicon wafer to determine whether the silicon wafer meets the corresponding quality standard. The left and right edge chipping modules 220 include: two edge chipping detection units 221. In terms of the arrangement, the two edge chipping detection units 221 are dislocated along the conveying direction of the detection streamline 210 to avoid mutual interference between the two edge chipping detection units 221. , which affects the accuracy of the detection results.

The edge chipping detection unit 221 on either side includes: a second base 2211 , a first detection camera 2212 , and a first light source 2213 . The first detection camera 2212 is horizontally mounted on the second base 2211 and disposed toward the detection streamline 210 . In one embodiment, the above-mentioned first detection camera 2212 can be a line scan camera, which can detect chipping on the left and right sides of the silicon wafer, and chipping on the upper, lower, left, and right surfaces, respectively, during the movement of the silicon wafer.

The first light source 2213 is used to provide illumination required by the detection camera for detection, and an opening suitable for the detection light to pass through is opened in the middle. In this way, the oppositely disposed edge chipping detection unit can perform on-line detection on the silicon wafers conveyed by the detection flow line 210 .

In addition, the left and right edge chipping modules 220 further include fans for cooling the two edge chipping detection units. The fan and the two edge collapse detection units are arranged separately, so as to avoid the vibration generated when the fan is working and affect the detection accuracy of the edge collapse detection unit.

The thickness detection module 230 is used to detect the thickness of the silicon wafer to determine whether the silicon wafer meets the corresponding thickness standard. The thickness detection module 230 includes: a substrate 231 and a plurality of sets of thickness detection units 232 mounted on the substrate 231 . Any set of thickness detection units 232 includes two line laser emitters arranged up and down opposite to each other, so that the height information of the upper and lower surfaces of the silicon wafer can be measured through the two line laser emitters, and then the thickness and line marks of the silicon wafer can be calculated. and roughness.

In one embodiment, there are three groups of thickness detection units 232, and the three groups of thickness detection units 232 are arranged in the left, middle, and right sides. The other side of the above-mentioned substrate 231 is set opposite to the position between the two thickness detection units 232 on the other side, so as to detect the two sides of the silicon wafer between the two line lasers passing through the three sets of thickness detection units 232 and the thickness in between.

In addition, in any set of thickness detection units 232 , the line laser emitters are connected and fixed through preset holes on the substrate 231 where they are located. The pre-opened holes on the above-mentioned base plate 231 are opened according to the orientations that meet the detection requirements, so as to avoid repeated debugging after the installation of the line laser transmitter.

The resistivity test module 240 is used to detect the resistivity of the silicon wafer, so as to determine whether the silicon wafer meets the corresponding electrical standard. The resistivity test module 240 includes: a resistivity test bracket 241 , an upper test probe 242 and a lower test probe 243 . Wherein, the resistivity test bracket 241 has two connecting arms arranged up and down opposite to each other, and the upper test probe 242 and the lower test probe 243 are correspondingly installed on the corresponding connecting arms. The upper test probe 242 or the lower test probe 243 is also provided with a PN sensor, so that when the silicon wafer passes between the upper test probe 242 and the lower test probe 243, the polarity of the silicon wafer can be measured.

The front and rear collapse module 250 is used to realize the quality inspection of the front and rear edges of the silicon wafer, so as to judge whether the silicon wafer meets the corresponding quality standard. The front and rear collapse module 250 includes: a fixing bracket 251 , a second detection camera 252 and a second light source 253 . In one embodiment, the second inspection camera 252 is a high-speed line scan camera, which inspects the front side and the back side of the silicon wafer under illumination provided by the second light source 253 .

The second detection camera 252 and the second light source 253 are mounted on the fixing bracket 251 and located above the detection flow line 210 . The second light source 253 is located between the second detection camera 252 and the detection streamline 210 , and an opening suitable for detecting light passing through is opened in the middle of the second light source 253 . In this way, the second detection camera 252 and the second light source 253 can sequentially detect the front and rear edges of the silicon wafer conveyed by the detection streamline 210 .

The size detection module 260 is used to detect the size of the silicon wafer, so as to judge whether the silicon wafer meets the corresponding size standard. The size detection module 260 includes: a mounting bracket 261 and a third detection camera 262 . The third inspection camera 262 is located below the inspection flow line 210 , and inspects the silicon wafers transferred on the inspection flow line 210 by looking down. Since the third inspection camera 262 only detects the shape of the silicon wafer, the influence of the inspection flow line 210 can be ignored.

The contamination detection module 270 is used to detect the contamination on the surface of the silicon wafer, so as to judge whether the silicon wafer meets the corresponding cleanliness standard. The contamination detection module 270 includes an upper contamination detection unit 271 and a lower contamination detection unit 272 , which are located above and below the detection flow line 210 respectively.

The contamination detection units 271 and 272 on either side include: a fourth detection camera 2711 and a third light source 2712 . The above-mentioned fourth detection camera 2711 is a line scan camera, so that the upper and lower contamination detection units 271 and 272 can cooperate with the light source to detect contamination during the movement of the silicon wafer, so as to realize the detection of the front and back of the silicon wafer. In order to facilitate the detection of the lower contamination detection unit 272 , the lower contamination detection unit 272 is located at a gap position where the two streamline units are transitionally connected.

The third light source 2712 includes a light emitting diode and a lampshade. The light-emitting diodes are located under the lampshade. In this way, inside the lampshade, the light emitted by the light-emitting diode is in a state of diffuse reflection at a large angle, and the diffusely reflected radiation further reaches the fourth detection camera 2711 through the gap of the lampshade. This arrangement can reduce the contrast of the crystal structure of the silicon wafer and make it uniform in width. Illuminated silicon wafers.

The chamfering and chipping module 280 is used to realize the quality inspection of the four chamfers of the silicon wafer, so as to judge whether the silicon wafer meets the corresponding quality standard. The chamfering and chipping module 280 includes: two sets of chamfering detection units 281 . In terms of arrangement, the two groups of chamfering detection units 281 are symmetrically distributed on both sides of the detection streamline 210, and realize online detection of two chamfers of the corresponding side silicon wafers.

The chamfer detection unit 281 on either side includes: a third base 2811 , a fifth detection camera 2812 and a fourth light source 2813 . Among them, there are two fifth detection cameras 2812 , and the two fifth detection cameras 2812 have an included angle of 45°, so as to detect two chamfers of the corresponding side silicon wafer. The fourth light source 2813 is disposed obliquely, and illuminates the detection areas of the two fifth detection cameras 2812 . In either side of the chamfering detection unit 281 , the fourth light source 2813 and the two fifth detection cameras 2812 are mounted on the L-shaped vertical plate on the third base 2811 .

The crack detection module 290 is used to detect the surface cracks of the silicon wafer, so as to judge whether the silicon wafer meets the corresponding appearance standard. The crack detection module 290 includes: two groups of crack detection units 291 . In terms of arrangement, the two groups of crack detection units 291 are symmetrically distributed on both sides of the detection streamline 210 .

The crack detection unit 291 on either side includes: a fourth base 2911 , a sixth detection camera 2912 and a fifth light source 2913 . The sixth detection camera 2912 is installed on the fourth base 2911 obliquely downward. In one embodiment, the sixth detection camera 2912 adopts a line scan camera. The detection area of the sixth detection camera 2912 of the two groups of crack detection units 291 covers the position where the two streamline units are transitionally connected, which can reduce the adverse effects caused by the reflection of the belt. The fifth light source 2913 is disposed below the transitional connection position of the two streamline units. In one embodiment, the fifth light source 2913 is an infrared light source. In this way, the line scan camera combined with the infrared light source can realize the detection of crack defects on the surface of the silicon wafer.

In addition, in order to adjust the detection angle of the sixth detection camera 2912, the fourth base 2911 where it is located is also provided with a scale line that can measure the installation angle of the sixth detection camera 2912, and the corresponding sixth detection camera 2912 is installed with a pointing scale line pointer. In this way, after adjusting the position of the scale line pointed by the pointer, the inclination angle of the sixth detection camera 2912 can be adjusted to meet the actual detection requirements, so that the detection areas of the sixth detection camera 2912 of the two groups of crack detection units 291 cover two The location of the transitional connection of the streamline elements.

【 Breaking and sorting device 】

As shown in FIGS. 20 to 22 , the blanking and sorting device 300 is used to classify the silicon wafers that have been inspected by the inspection device 200 according to good products and defective products. And for defective silicon wafers, it can be further classified according to the type of defects, so that the sorting of good and defective silicon wafers is realized, and the sorting of silicon wafers according to different defect types is also convenient for the management of silicon wafers and silicon wafers. Analysis and statistics of problems in the production process.

The blanking and sorting device 300 includes: a plurality of blanking and sorting modules 310, and each blanking and sorting module 310 is combined and connected according to the direction of blanking and conveying. In this embodiment, there are two groups of blanking and sorting modules 310 .

Any blanking and sorting module 310 includes: a workbench 311 , a blanking conveying line 312 , and several blanking and sorting stations 313 . The blanking conveying line 312 is installed on the worktable 311, and several blanking and sorting stations 313 are distributed on both sides of the blanking conveying line 312. The silicon wafers are conveyed by the blanking conveying line 312 and are sorted to the corresponding stations. place.

The unloading conveying line 312 includes a conveying line body 3121 , a jacking mechanism 3122 and a sorting conveying mechanism 3123 .

The conveying line body 3121 includes: two conveying belts 31211 arranged in parallel, and a plurality of supporting platforms 31212 located between the two conveying belts 31211 and spaced along the conveying direction. The driving pulleys of the two conveyor belts 31211 are linked by a drive shaft, and the drive shaft is driven by a drive motor, so that the two conveyor belts 31211 can move synchronously under the drive of the drive motor.

The jacking mechanisms 3122 are respectively disposed between the adjacent support platforms 31212, and include: jacking motors, cams and steering belts arranged perpendicular to the conveying direction. The steering belt is initially located under the adjacent support platforms 31212, and the cam is located under the steering belt, and is directly or indirectly connected to the bottom of the steering belt. The cam is driven by the jacking motor to pivot. Therefore, when the cam pivots, the cam can drive the steering belt to rise, so that it moves to a position equal to the height of the adjacent support platform 31212 . In this way, the silicon wafers conveyed between the adjacent support tables 31212 can be sorted to one side of the conveying line body 3121 along with the turning belt. At the same time, by controlling the forward or reverse rotation of the motor of the steering belt, the silicon wafers can be controlled to be sorted to one side or the other side of the conveyor line body 3121 .

The sorting and conveying mechanisms 3123 are arranged on both sides of each jacking mechanism 3122 , and are used for continuing to transport the silicon wafers steered by the steering belt for sorting to the corresponding blanking and sorting stations 313 . The sorting and conveying mechanism 3123 includes an inclined sorting and conveying belt 31211. One end of the sorting and conveying belt 31211 can be connected with the steering belt after being lifted by the cam, and the other end extends to the corresponding blanking and sorting station 313. place. In this way, the silicon wafers leaving the conveying line body 3121 are further sorted into the blanking and sorting station 313 on the downstream side.

The blanking and sorting stations 313 are respectively arranged at the downstream ends of the sorting and conveying belts 31211 to receive good or non-good silicon wafers conveyed by the sorting and conveying belts 31211 . The blanking and sorting station 313 includes: a second lifting mechanism 3131 and a plurality of material boxes 3132 driven and lifted by the second lifting mechanism 3131 .

Among them, several material boxes 3132 are arranged at intervals from top to bottom, so that the same station can receive more silicon wafers. The second lifting mechanism 3131 is used to drive the upper or lower material box 3132 to move to a position aligned with the downstream end of the sorting conveyor belt 31211 after one material box 3132 is full, and continue to receive the sorted silicon wafers.

The mechanical mechanism of the second lifting mechanism 3131 is similar to that of the first lifting mechanism 115 described above. It includes: a second lifting motor, a second lifting screw, a second lifting slider and a second casing.

Wherein, the second lifting screw rod is arranged vertically, one end of the second lifting screw rod is connected with the second lifting motor, and is driven by the second lifting motor to pivot. The second lifting slider is threadedly connected with the second lifting screw, and moves in the vertical direction with the pivoting of the second lifting screw. And by controlling the forward and reverse rotation of the second lift motor, the movement direction of the second lift slider can be controlled. The second lifting motor, the second lifting screw, and the second lifting slider are accommodated in the second casing, and the two edges of the second lifting slider protrude from the gaps on both sides of the second casing. The second lifting slider The protruding part is connected to the fixing plate where the plurality of cartridges 3132 are located. In this way, when the second lift motor works, it can drive a plurality of material boxes 3132 to lift and lower as a whole.

In addition, between the most upstream blanking and sorting module 310 and the detection device 200 , a feeding conveying line 320 for transporting the silicon wafers to the blanking and sorting module 310 is also provided. At the same time, a transfer box 330 is also provided at the downstream end of the blanking conveying line 312 of the most downstream blanking and sorting module 310 . The function of the transfer box 330 is that when a certain silicon wafer is not sorted in time, it can flow into the transfer box 330 for temporary storage, and wait for the staff to re-feed it into the blanking and sorting device 300 .

During the sorting process of silicon wafers, the detection results can be stored by the system of the silicon wafer intelligent sorting machine, and the detection results are in one-to-one correspondence with the IDs of the silicon wafers. Therefore, when the blanking and sorting device 300 is in operation, the silicon wafers corresponding to the IDs can be sorted into the bins 3132 of the corresponding blanking and sorting station 313 according to the detection result.

To sum up, the intelligent silicon wafer sorting machine of the present invention can realize continuous and efficient feeding of silicon wafers through its feeding device, and make full use of the working time of loading the wafer baskets. At the same time, the detection of multiple items of silicon wafers is completed through the downstream detection device, which fully meets the actual inspection requirements of silicon wafers and significantly improves the quality inspection efficiency of silicon wafers. At the same time, after the inspection is completed, the sorting device is also passed through the blanking and sorting device, which also realizes the sorting of good and bad silicon wafers, as well as the sorting of silicon wafers of different defect types, which is convenient for the management of silicon wafers and the existence of problems in the production process of silicon wafers. Analysis statistics of the problem.

It will be apparent to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, but that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments are to be regarded in all respects as illustrative and not restrictive, and the scope of the invention is to be defined by the appended claims rather than the foregoing description, which are therefore intended to fall within the scope of the claims. All changes within the meaning and scope of the equivalents of , are included in the present invention. Any reference signs in the claims shall not be construed as limiting the involved claim.

In addition, it should be understood that although this specification is described in terms of embodiments, not each embodiment only includes an independent technical solution, and this description in the specification is only for the sake of clarity, and those skilled in the art should take the specification as a whole , the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims (10)

1. An intelligent sorting machine for silicon wafers, characterized in that the intelligent sorting machine for silicon wafers comprises: a feeding device, a detection device, and a feeding and sorting device;

   The feeding device includes: a translation module and at least two feeding modules, and the at least two feeding modules are driven by the translation modules to perform alternate feeding;

   The detection device is located downstream of the feeding device, and includes: a detection streamline and a plurality of detection modules arranged along the detection streamline;

   The sorting device is located downstream of the detection device, and includes a plurality of blanking and sorting modules, and each blanking and sorting module is combined and connected according to the direction of blanking and conveying.
2. The silicon wafer intelligent sorting machine according to claim 1, wherein the feeding device comprises: a first feeding module and a second feeding module;

   Any feeding module includes: a feeding frame, a rotating motor, a clamping unit, a base and a first lifting mechanism. The bottom of the feeding frame is pivotally connected to the base, and the rotating motor drives the feeding frame to connect to the base. The pivot between the bases rotates, the clamping units are installed on both sides of the loading rack, and the first lifting mechanism drives the loading rack, the rotating motor, the clamping unit and the base to lift and lower as a whole.
3. The silicon wafer intelligent sorting machine according to claim 2, wherein the clamping unit comprises at least two groups of clamping structures arranged from top to bottom;

   Any set of clamping structures includes: fixed jaws, movable jaws and clamping cylinders, the fixed jaws are installed on one side of the feeding rack at the end, and the movable jaws are located on the other side of the feeding frame at the end. and the movable jaw can be driven by the clamping cylinder to reciprocate relative to the fixed jaw.
4. The silicon wafer intelligent sorting machine according to claim 2, wherein the first lifting mechanism comprises: a first lifting motor, a first lifting screw and a first lifting slider;

   The first lifting screw is arranged vertically, one end of the first lifting screw is connected to the first lifting motor, and is driven by the first lifting motor to pivot, and the first lifting slider is connected to the first lifting motor. The first lifting screw rod is threadedly connected and moves in a vertical direction with the pivoting of the first lifting screw rod, and the first lifting sliding block is connected with the base.
5. The silicon wafer intelligent sorting machine according to claim 1, wherein the translation module comprises: a translation motor, a translation screw, a translation slider and at least two guide rails arranged horizontally;

   The translation motor is drive-connected with one end of the translation screw, the translation slider is threadedly matched with the translation screw, and the translation slider is connected to the fixed plate where the at least two feeding modules are located, so the The translation motor drives the at least two feeding modules to move horizontally along the guide rail through the translation screw and the translation slider.
6. The silicon wafer intelligent sorting machine according to claim 1, wherein the detection flow line is composed of a plurality of flow line units arranged in sequence;

   Any streamline unit includes: a streamline bracket, a pulley, a transmission belt and a drive motor, the streamline bracket includes: a bracket body and a strut supporting the bracket body, there are several pulleys, and the several pulleys are symmetrical They are distributed on both sides of the streamline support, the transmission belts are respectively sleeved on a plurality of pulleys on both sides, the oppositely arranged pulleys on both sides are connected by a transmission shaft, and the drive motor is connected with a pulley for transmission. .
7. The silicon wafer intelligent sorting machine according to claim 6, wherein, on one side of the streamline support, two pulleys are located at both ends of the support body, and the other four pulleys are located at both ends of the belt. Below between the pulleys, two of the four pulleys are arranged adjacently, and the other pulley is located just below between the two adjacently arranged pulleys, and the drive motor is drivingly connected to the pulley directly below.
8. The silicon wafer intelligent sorting machine according to claim 1, wherein a guiding mechanism is further provided at the upstream end of the detection streamline, and the guiding mechanism comprises: a left-right symmetrical guiding unit and a driving two Adjustment units that move toward or away from the guiding units;

   The guiding unit on either side includes: a first base, a guiding belt and a guiding motor, the guiding belt and the guiding motor are installed at the top position of the first base, and the guiding belt is along the silicon The conveying direction of the wafer is set obliquely, so that the distance between the guiding belts of the two guiding units gradually decreases along the conveying direction of the silicon wafer;

   The adjusting unit includes: an adjusting handwheel and an adjusting screw, two ends of the adjusting screw are respectively provided with threads arranged in opposite directions, and two ends of the adjusting screw are threadedly connected with sliders, and the sliders at both ends are respectively connected with the screws. The corresponding guiding units are connected, and the adjusting handwheel is fixedly connected with one end of the adjusting screw rod.
9. The silicon wafer intelligent sorting machine according to claim 1, wherein the plurality of detection modules include: left and right edge collapse modules, thickness detection modules, resistivity test modules, front and rear collapse modules, size Some or all of the detection module, the contamination detection module, the chamfering and chipping module and the crack detection module.
10. The intelligent silicon wafer sorting machine according to claim 1, wherein any one of the blanking and sorting modules comprises: a workbench, a blanking conveying line, and several blanking and sorting stations, and the blanking conveying line is installed in the work station. On the table, several blanking and sorting stations are distributed on both sides of the blanking conveying line;

    The unloading conveying line includes: a conveying line body, a jacking mechanism and a sorting conveying mechanism;

    The conveying line body comprises: two conveying belts arranged in parallel, a plurality of supporting platforms arranged between the two conveying belts and spaced along the conveying direction;

    The jacking mechanisms are respectively arranged between the adjacent support tables, and include: a jacking motor, a cam and a steering belt perpendicular to the conveying direction, the steering belt is initially located between the adjacent support tables. Below, the cam is located below the steering belt, and is directly or indirectly connected to the bottom of the steering belt, and the cam is driven by the jacking motor to pivot;

    The sorting and conveying mechanism includes an inclined sorting and conveying belt, one end of the sorting and conveying belt can be connected with the steering belt after being lifted by the cam, and the other end extends to the corresponding blanking and sorting station. where

    The blanking and sorting stations are respectively arranged at the downstream ends of the sorting and conveying belts, and include: a second lifting mechanism and a plurality of material boxes driven up and down by the second lifting mechanism, and the plurality of material boxes are arranged at intervals from top to bottom;

    The second lifting mechanism includes: a second lifting motor, a second lifting screw and a second lifting slider;

    The second lifting screw is arranged vertically, the two ends of the second lifting screw are connected with the second lifting motor, and are driven by the second lifting motor to pivot, and the second lifting slider It is threadedly connected with the second lifting screw and moves in the vertical direction with the pivoting of the second lifting screw, and the second lifting slider is connected with the fixing plate where the plurality of material boxes are located.

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