CN115808605A - Quality detection device for semiconductor material preparation - Google Patents
Quality detection device for semiconductor material preparation Download PDFInfo
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- CN115808605A CN115808605A CN202211577370.2A CN202211577370A CN115808605A CN 115808605 A CN115808605 A CN 115808605A CN 202211577370 A CN202211577370 A CN 202211577370A CN 115808605 A CN115808605 A CN 115808605A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 82
- 239000000463 material Substances 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 230000007246 mechanism Effects 0.000 claims abstract description 105
- 238000010438 heat treatment Methods 0.000 claims description 17
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Abstract
The invention relates to the field of semiconductor quality detection, and discloses a quality detection device for semiconductor material preparation, which comprises two symmetrically arranged mounting plates, wherein a conveyor is arranged between the two mounting plates, a plurality of carrying mechanisms which are arranged at equal intervals are fixedly arranged on the outer surface of the conveyor, and the carrying mechanisms are used for placing semiconductor workpieces; the first detection box body is fixedly arranged at the upper end of the mounting plate; the second detection box body is fixedly arranged at the upper end of the mounting plate; the third detection box body is fixedly arranged at the upper end of the mounting plate; the first adjusting mechanism is fixedly installed inside the first detection box body and used for adjusting the irradiation angle of the light source; the invention can detect the performance of the semiconductor with stricter quality requirements, is beneficial to accurately controlling the quality of the semiconductor, can effectively eliminate unqualified products and reduces the burden of a user.
Description
Technical Field
The invention relates to the field of semiconductor quality detection, in particular to a quality detection device for semiconductor material preparation.
Background
The patent document with publication number CN216052040U discloses a novel third generation semiconductor detection device, which comprises a frame with a U-shaped cross section, wherein one end of the frame is provided with a driving shaft and a first motor; a horizontal adjusting cylinder is fixedly arranged on the outer side of the other end of the rack, and the telescopic end of the clamping cylinder extends into the connecting disc and is respectively provided with a clamping block; the upper portion of the rack is rotatably provided with a screw rod, two sliding rods are symmetrically and fixedly arranged along the screw rod, a second motor used for driving the screw rod to rotate is arranged on the outer side of the rack, the screw rod and the two sliding rods are jointly provided with an installation seat with an L-shaped cross section, a threaded hole matched with the screw rod and two unthreaded holes matched with the two sliding rods respectively are formed in the vertical portion of the installation seat, a detector is fixedly arranged below the horizontal portion of the installation seat, detection of all parts of a semiconductor can be achieved, the semiconductor does not need to be manually moved, detection is more efficient and comprehensive, in the practical application process, only the appearance of the semiconductor is detected, performance detection strict in requirements on the quality of the semiconductor is lacked, accurate control on the quality of the semiconductor is not facilitated, effective elimination can not be achieved on unqualified products, manual sorting operation is also needed, and burden of users is increased.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a quality detection device for semiconductor material preparation.
In order to achieve the purpose, the invention provides the following technical scheme:
a quality detection device for semiconductor material preparation comprises two symmetrically arranged mounting plates, a conveyor is arranged between the two mounting plates, a plurality of carrying mechanisms which are arranged at equal intervals are fixedly arranged on the outer surface of the conveyor, and the carrying mechanisms are used for placing semiconductor workpieces;
the first detection box body is fixedly arranged at the upper end of the mounting plate;
the second detection box body is fixedly arranged at the upper end of the mounting plate;
the third detection box body is fixedly arranged at the upper end of the mounting plate;
the first adjusting mechanism is fixedly installed inside the first detection box body and used for adjusting the irradiation angle of the light source;
the two symmetrically arranged second adjusting mechanisms are fixedly arranged inside the first detection box body and are used for adjusting the height of the semiconductor workpiece passing through the upper end of the loading mechanism below the first detection box body and turning the semiconductor workpiece by ninety degrees; the second adjusting mechanism and the first adjusting mechanism are matched for use and are used for carrying out first detection on the semiconductor workpiece, and a detection piece for displaying a first detection result is arranged on the inner wall of one side, far away from the first adjusting mechanism, of the interior of the first detection box body;
the detector is positioned in the second detection box body, and the upper end of the second detection box body is provided with a second lifting cylinder for driving the detector to perform linear reciprocating motion in the vertical direction;
the two third adjusting mechanisms are symmetrically arranged inside the second detection box body and are used for adjusting the height of the semiconductor workpiece passing through the upper end of the carrying mechanism below the second detection box body;
and the fourth adjusting mechanism is positioned inside the second detection box body and used for adjusting the temperature of the semiconductor workpiece, and the fourth adjusting mechanism and the detector are matched for use and used for detecting the resistivity of the semiconductor workpiece at different temperatures.
As a further scheme of the invention: the sorting mechanism is located inside the third detection box body and used for removing unqualified semiconductor workpieces, a sorting groove is formed in the outer surface of the third detection box body, and an inclined plate is arranged on the inner wall of one side of the third detection box body.
As a further scheme of the invention: sorting mechanism contains the elevator of installing on the top inner wall of third detection box, the lower extreme of elevator rotates installs the absorption piece, sorting mechanism still contains the separation cylinder of installing at the upper surface of third detection box, one side of elevator is provided with and is used for driving the absorption piece and carries out pivoted rotation motor, the separation cylinder is used for driving the elevator, adsorbs the piece and together is straight reciprocating motion.
As a further scheme of the invention: the carrying mechanism comprises a fixed base fixedly mounted on the outer surface of the conveyor, the upper end of the fixed base is fixedly connected with a connecting seat, baffles are symmetrically arranged at the upper end of the connecting seat, an ejector rod is arranged on the upper surface of the connecting seat, a driving piece used for driving the ejector rod to eject a semiconductor workpiece is arranged in the connecting seat, and a mounting groove matched with the ejector rod is formed in the upper end of the connecting seat.
As a further scheme of the invention: the first adjusting mechanism comprises a first fixing column fixedly mounted on the inner wall of the top end of the first detection box body, a second fixing column is mounted at the lower end of the first fixing column in a rotating mode, a first rotating motor used for driving the second fixing column to rotate is arranged in the first fixing column, a fixed shell is mounted at the lower end of the second fixing column in a rotating mode, a light source piece is arranged inside the fixed shell, and an adjusting motor used for driving the fixed shell and the light source piece to rotate together is arranged on the outer surface of the second fixing column.
As a further scheme of the invention: adjusting mechanism two contains the fixed plate of fixed mounting in first detection box inside, the fixed plate is located one side of fixed column one, just the one end of fixed plate extends to the outside of first detection box, the upper end fixed mounting of fixed plate has lift cylinder one, the output of lift cylinder one runs through the fixed plate, the output of lift cylinder one is connected with fixed column three, one side sliding connection of fixed column three has fixed column four, fixed column three embeds there is the round trip cylinder that is used for driving fixed column four to carry out sharp back and forth movement, fixed column four keeps away from one side rotation that fixed column three installs the arc, fixed column four embeds there is to be used for driving the arc to carry out pivoted rotating electrical machines two.
As a further scheme of the invention: adjustment mechanism three contains the lifter plate of slidable mounting on second detection box one side inner wall, be provided with the lift cylinder three that is located the lifter plate below on the second detection box one side inner wall, lift cylinder three is used for driving the lifter plate and carries out the vertical lift, one side of lifter plate slides and is provided with the cardboard, the upper end of lifter plate is provided with and is used for driving the cardboard and carries out gliding extensible member.
As a further scheme of the invention: adjustment mechanism four contains the telescopic cylinder of fixed mounting on the second detects the box surface, telescopic cylinder's output runs through to the inside that the second detected the box, telescopic cylinder's output is connected with puts the thing dish, one side fixed mounting who puts the thing dish has the connecting plate, one side of connecting plate is provided with the heating plate that is located to put thing dish below, the opposite side of connecting plate is provided with lift cylinder four, one side of heating plate is connected with the slide of slidable mounting on the connecting plate, the output of lift cylinder four is connected with the lower extreme of slide.
Compared with the prior art, the invention has the following beneficial effects:
the invention can respectively carry out continuous refractive index detection and resistivity detection on the semiconductor workpiece, and is beneficial to controlling the product quality; the invention can remove unqualified products in time, avoids the subsequent investment of more manpower and material resources for processing, can realize the adjustment of the irradiation angle of the light source piece in a wider range, and has better applicability; in addition, the rapid separation of the semiconductor workpiece and the carrying mechanism is realized through the carrying mechanism, and the problem that the semiconductor workpiece cannot be discharged due to clamping is also avoided.
According to the invention, the fourth adjusting mechanism can be used for starting the heating plate when the semiconductor workpieces under different temperature conditions need to be detected, the semiconductor workpieces are heated and heated by the heat generated by the heating plate, and the distance between the heating plate and the object placing plate can be changed by adjusting the height of the heating plate through the fourth lifting cylinder, so that a faster heating rate is obtained, and the detection time is shortened.
Drawings
FIG. 1 is an overall configuration diagram of a quality inspection apparatus for semiconductor material fabrication in accordance with the present invention;
FIG. 2 is a schematic side sectional view of a first detection box, a first adjustment mechanism and a second adjustment mechanism according to the present invention;
FIG. 3 is a schematic bottom view of the connection of the third fixed column, the fourth fixed column and the arc plate of the present invention;
FIG. 4 is a schematic side sectional view of a second detection box, a second lifting cylinder, a detector and a third adjusting mechanism of the present invention;
FIG. 5 is a side view of an adjustment mechanism IV of the present invention;
FIG. 6 is a schematic sectional front view of a third inspection box and a sorting mechanism according to the present invention;
fig. 7 is a schematic structural view of the loading mechanism of the present invention.
In the figure: 1. a conveyor; 2. a controller; 3. a carrying mechanism; 4. supporting legs; 5. a first detection box body; 6. a second detection box body; 7. a third detection box body; 8. an observation window; 9. a sloping plate; 10. a first adjusting mechanism; 101. fixing a first column; 102. fixing a second column; 103. a stationary housing; 104. a light source element; 105. adjusting the motor; 11. a second adjusting mechanism; 111. a fixing plate; 112. a first lifting cylinder; 113. fixing a column III; 114. fixing a column IV; 115. an arc-shaped plate; 12. a detection member; 13. a second lifting cylinder; 14. a detector; 15. a third adjusting mechanism; 151. a lifting plate; 152. a third lifting cylinder; 153. clamping a plate; 154. a telescoping member; 16. a fourth adjusting mechanism; 161. a telescopic cylinder; 162. placing a tray; 163. a connecting plate; 164. heating the plate; 165. a lifting cylinder IV; 17. a sorting mechanism; 171. a sorting cylinder; 172. a lifting block; 173. rotating the motor; 174. an adsorbing member; 31. a fixed base; 32. a connecting seat; 33. a baffle plate; 34. and ejecting the rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The following examples were obtained with reference to fig. 1-7:
example 1
A quality detection device for semiconductor material preparation is used for detecting the quality of a semiconductor workpiece, rejecting the workpiece which does not meet production standards and ensuring the product quality.
The quality detection device for preparing the semiconductor material comprises the following components:
the automatic loading device comprises two symmetrically arranged mounting plates, a conveyor 1 is mounted between the two mounting plates, a plurality of loading mechanisms 3 which are arranged at equal intervals are fixedly arranged on the outer surface of the conveyor 1, the loading mechanisms 3 are used for placing semiconductor workpieces, and the semiconductor workpieces refer to wafer workpieces; the lower end of the mounting plate is symmetrically provided with supporting legs 4; the first detection box body 5 is fixedly arranged at the upper end of the mounting plate; the second detection box body 6 is fixedly arranged at the upper end of the mounting plate; the third detection box body 7 is fixedly arranged at the upper end of the mounting plate; the adjusting mechanism I10 is fixedly arranged inside the first detection box body 5, and the adjusting mechanism I10 is used for adjusting the irradiation angle of the light source; an observation window 8 is arranged on the outer surface of the first detection box body 5.
The two symmetrically arranged second adjusting mechanisms 11 are fixedly arranged inside the first detection box body 5, and the second adjusting mechanisms 11 are used for adjusting the height of the semiconductor workpiece passing through the upper end of the loading mechanism 3 below the first detection box body 5 and turning the semiconductor workpiece by ninety degrees; the adjusting mechanism II 11 and the adjusting mechanism I10 are matched for use and are used for carrying out first detection on the semiconductor workpiece, and a detection piece 12 used for displaying a first detection result is arranged on the inner wall of one side, away from the adjusting mechanism I10, of the interior of the first detection box body 5;
the detector 14 is positioned inside the second detection box body 6, and the upper end of the second detection box body 6 is provided with a second lifting cylinder 13 for driving the detector 14 to perform linear reciprocating motion in the vertical direction;
the two third adjusting mechanisms 15 are symmetrically arranged inside the second detection box body 6, and the third adjusting mechanisms 15 are used for adjusting the height of the semiconductor workpiece passing through the upper end of the carrying mechanism 3 below the second detection box body 6; the third adjusting mechanism 15 comprises a lifting plate 151 slidably mounted on the inner wall of one side of the second detection box 6, a third lifting cylinder 152 positioned below the lifting plate 151 is arranged on the inner wall of one side of the second detection box 6, the third lifting cylinder 152 is used for driving the lifting plate 151 to vertically lift, a clamping plate 153 is slidably arranged on one side of the lifting plate 151, and an extensible member 154 used for driving the clamping plate 153 to slide is arranged at the upper end of the lifting plate 151; when the third adjusting mechanism 15 is used, the telescopic part 154 is started to drive the clamping plates 153 to slide on the lifting plate 151 until the two clamping plates 153 are respectively in contact with the outer surface of the semiconductor workpiece at the upper end of the loading mechanism 3 below the second detection box 6, and then the third lifting cylinder 152 is started to drive the lifting plate 151 to vertically lift until the preset height is reached.
The adjusting mechanism four 16 is positioned inside the second detection box body 6, the adjusting mechanism four 16 is used for adjusting the temperature of the semiconductor workpiece, and the adjusting mechanism four 16 and the detector 14 are used in a matched mode and used for detecting the resistivity of the semiconductor workpiece at different temperatures, namely, for the second detection; the fourth adjusting mechanism 16 comprises a telescopic cylinder 161 fixedly mounted on the outer surface of the second detection box 6, the output end of the telescopic cylinder 161 penetrates into the second detection box 6, the output end of the telescopic cylinder 161 is connected with a material placing disc 162, one side of the material placing disc 162 is fixedly provided with a connecting plate 163, one side of the connecting plate 163 is provided with a heating disc 164 positioned below the material placing disc 162, the other side of the connecting plate 163 is provided with a fourth lifting cylinder 165, one side of the heating disc 164 is connected with a sliding plate slidably mounted on the connecting plate 163, and the output end of the fourth lifting cylinder 165 is connected with the lower end of the sliding plate; after the semiconductor workpiece is lifted to the preset height by the third adjusting mechanism 15, the telescopic cylinder 161 in the fourth adjusting mechanism 16 is started to move the object placing disc 162 to the lower part of the semiconductor workpiece, then the third adjusting mechanism 15 is started to separate from the semiconductor workpiece, so that the semiconductor workpiece falls to the upper end of the object placing disc 162, when the semiconductor workpiece under different temperature conditions needs to be detected, the heating disc 164 is started, the semiconductor workpiece is heated and heated by heat generated by the heating disc 164, the height of the heating disc 164 can be adjusted by the fourth adjusting mechanism 165 through the lifting cylinder, the distance between the heating disc 164 and the object placing disc 162 is changed, a faster heating rate is obtained, and the detection time is shortened.
The sorting mechanism 17 is positioned inside the third detection box body 7, the sorting mechanism 17 is used for removing unqualified semiconductor workpieces, a sorting groove is formed in the outer surface of the third detection box body 7, and an inclined plate 9 is arranged on the inner wall of one side of the third detection box body 7; the inclined plate 9 has a certain inclination angle, and one end of the inclined plate 9 close to the sorting tank is positioned at a lower horizontal plane, so as to ensure that the semiconductor workpieces rejected by the sorting mechanism 17 can smoothly enter the sorting tank; the sorting mechanism 17 comprises an elevating block 172 mounted on the inner wall of the top end of the third detection box 7, the lower end of the elevating block 172 is rotatably mounted with an adsorption piece 174, the sorting mechanism 17 further comprises a sorting cylinder 171 mounted on the upper surface of the third detection box 7, one side of the elevating block 172 is provided with a rotating motor 173 for driving the adsorption piece 174 to rotate, and the sorting cylinder 171 is used for driving the elevating block 172 and the adsorption piece 174 to do linear reciprocating motion together; the adsorption piece 174 can automatically adjust adsorption force, when the semiconductor workpiece needing to be rejected is contacted at the beginning, the adsorption force is at the maximum value, the sorting cylinder 171 drives the lifting block 172 and the adsorption piece 174 to descend together until the adsorption piece 174 is adsorbed on the upper surface of the semiconductor workpiece needing to be rejected, then the initial position is recovered, then the rotating motor 173 is started to turn the semiconductor workpiece to one side of the inclined plate 9, and finally the semiconductor workpiece falls into the sorting groove to finish the rejection operation.
Carry thing mechanism 3 and contain the unable adjustment base 31 of fixed mounting on 1 surface of conveyer, the upper end fixedly connected with connecting seat 32 of unable adjustment base 31, the upper end symmetry of connecting seat 32 is provided with baffle 33, the upper surface of connecting seat 32 is provided with ejector rod 34, connecting seat 32 embeds there is to be used for driving ejector rod 34 to carry out ejecting driving piece with semiconductor workpiece, the upper end of connecting seat 32 is provided with the mounting groove with ejector rod 34 looks adaptation, preferably can realize the installation, the connected mode of separation, and through baffle 33's fixed, make semiconductor workpiece be difficult for appearing the problem of skew in the position of testing process, and the driving piece that sets up, ejector rod 34 can be when semiconductor workpiece carries to conveyer 1 lower surface, realize semiconductor workpiece and the quick breaking away from of carrying thing mechanism 3, also avoided semiconductor workpiece to appear blocking the problem that leads to unable unloading.
The first adjusting mechanism 10 comprises a first fixing column 101 fixedly mounted on the inner wall of the top end of the first detection box body 5, a second fixing column 102 is rotatably mounted at the lower end of the first fixing column 101, a first rotating motor used for driving the second fixing column 102 to rotate is arranged in the first fixing column 101, a fixing shell 103 is rotatably mounted at the lower end of the second fixing column 102, a light source piece 104 is arranged in the fixing shell 103, and an adjusting motor 105 used for driving the fixing shell 103 and the light source piece 104 to rotate together is arranged on the outer surface of the second fixing column 102; the adjusting motor 105 drives the fixed shell 103 and the light source piece 104 to rotate together, and the first fixing column 101 is internally provided with a first rotating motor used for driving the second fixing column 102 to rotate, so that the irradiation angle of the light source piece 104 can be adjusted in a wider range, and the adjusting motor has better applicability.
The second adjusting mechanism 11 comprises a fixing plate 111 fixedly installed inside the first detection box 5, the fixing plate 111 is located on one side of the first fixing column 101, one end of the fixing plate 111 extends to the outside of the first detection box 5, a first lifting cylinder 112 is fixedly installed at the upper end of the fixing plate 111, the output end of the first lifting cylinder 112 penetrates through the fixing plate 111, a third fixing column 113 is connected to the output end of the first lifting cylinder 112, a fourth fixing column 114 is slidably connected to one side of the third fixing column 113, a reciprocating cylinder used for driving the fourth fixing column 114 to perform linear reciprocating motion is arranged in the third fixing column 113, an arc-shaped plate 115 is rotatably installed on one side, far away from the third fixing column 113, a second rotating motor used for driving the arc-shaped plate 115 to rotate is arranged in the fourth fixing column 114, the first lifting cylinder 112 is started to be lowered to the lowest height, then the reciprocating cylinder fourth fixing column 114 is started to perform linear motion until a semiconductor workpiece is clamped between the two arc-shaped plates 115, then the first lifting cylinder 112 is started to recover to the initial position, at this time, the second rotating motor is started to drive the arc-shaped plate 115 to rotate ninety degrees, the semiconductor workpiece to convert the horizontal posture into the vertical posture, which is convenient for light beam irradiation and is beneficial for detection.
Example 2
The difference from example 1 is that: the detection piece 12 is a photosensitive sensing piece, a deflection result is obtained after a light beam passes through a semiconductor workpiece, the deflection result is compared with a standard result corresponding to the light beam angle at the moment, when the detection piece 12 is made of a material divided by area, the area ratio of the overlapping area to the deflection result exceeding the range of the standard result is calculated, when the detection piece 12 is made of a material divided by quantity, the quantity ratio of the overlapping area to the deflection result exceeding the range of the standard result is calculated, and the detection piece 12 can perform corresponding selection according to the needs of a user, so that the detection piece has the same effect as the detection piece; the detector 14 is an existing device, and any detection device that detects resistivity by using a common detection method such as a four-probe method, a capacitance-voltage method, and the like may be used, and details thereof are not repeated herein.
Example 3
The difference from example 1 is that: the automatic sorting machine also comprises a controller 2, wherein the controller 2 is electrically connected with the conveyor 1, the adjusting mechanism II 11, the adjusting mechanism I10, the detector 14, the sorting mechanism 17, the adjusting mechanism III 15 and the adjusting mechanism IV 16, the controller 2 controls the conveyor 1 to move for a fixed distance each time when the conveyor 1 operates, and then the conveyor 2 operates again after the conveyor stops moving for a fixed time length, so that the purpose is to control the moving distance of the loading mechanism 3 and provide enough time for the first detection, the second detection and the rejection of unqualified workpieces; when the first detection is unqualified, an unqualified signal I is generated, when the second detection is unqualified, a qualified signal I and a qualified signal II are respectively generated, and the first detection and the second detection signal sets are sent to the sorting mechanism 17, wherein the qualification means that the deviation between the deflection rate result and the resistivity at the specified temperature and the standard product is controlled within the production requirement range, and when the sorting mechanism 17 receives the signal set containing the unqualified signal, the semiconductor workpiece entering the sorting mechanism 17 next time is rejected.
In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation and a specific orientation configuration and operation, and thus, should not be construed as limiting the present invention. Furthermore, "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above-mentioned embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the present invention may occur to those skilled in the art without departing from the principle of the present invention, and such modifications and embellishments should also be considered as within the scope of the present invention.
Claims (8)
1. A quality inspection apparatus for semiconductor material production, comprising:
the device comprises two symmetrically arranged mounting plates, a conveyor (1) is arranged between the two mounting plates, a plurality of carrying mechanisms (3) which are arranged at equal intervals are fixedly arranged on the outer surface of the conveyor (1), and the carrying mechanisms (3) are used for placing semiconductor workpieces;
the first detection box body (5) is fixedly arranged at the upper end of the mounting plate;
the second detection box body (6) is fixedly arranged at the upper end of the mounting plate;
the third detection box body (7) is fixedly arranged at the upper end of the mounting plate;
the first adjusting mechanism (10) is fixedly arranged inside the first detection box body (5), and the first adjusting mechanism (10) is used for adjusting the irradiation angle of the light source;
the two symmetrically arranged second adjusting mechanisms (11) are fixedly arranged inside the first detection box body (5), and the second adjusting mechanisms (11) are used for adjusting the height of the semiconductor workpiece passing through the upper end of the carrying mechanism (3) below the first detection box body (5) and overturning the semiconductor workpiece by ninety degrees; the second adjusting mechanism (11) and the first adjusting mechanism (10) are matched for use and used for carrying out first detection on the semiconductor workpiece, and a detection piece (12) used for displaying a first detection result is arranged on the inner wall of one side, away from the first adjusting mechanism (10), of the interior of the first detection box body (5);
the detector (14) is positioned in the second detection box body (6), and a second lifting cylinder (13) for driving the detector (14) to do linear reciprocating motion in the vertical direction is arranged at the upper end of the second detection box body (6);
the two adjusting mechanisms III (15) are symmetrically arranged inside the second detection box body (6), and the adjusting mechanisms III (15) are used for adjusting the height of the semiconductor workpiece passing through the upper end of the carrying mechanism (3) below the second detection box body (6);
and the fourth adjusting mechanism (16) is positioned inside the second detection box body (6), the fourth adjusting mechanism (16) is used for adjusting the temperature of the semiconductor workpiece, and the fourth adjusting mechanism (16) and the detector (14) are matched for use and are used for detecting the resistivity of the semiconductor workpiece at different temperatures.
2. The quality detection device for the preparation of the semiconductor material, according to claim 1, is characterized in that a sorting mechanism (17) is arranged inside a third detection box body (7), the sorting mechanism (17) is used for removing semiconductor workpieces which are detected to be unqualified, a sorting groove is formed in the outer surface of the third detection box body (7), and an inclined plate (9) is arranged on the inner wall of one side of the third detection box body (7).
3. The quality detection device for preparing the semiconductor material as claimed in claim 2, wherein the sorting mechanism (17) comprises an elevating block (172) mounted on an inner wall of a top end of the third detection box body (7), the lower end of the elevating block (172) is rotatably mounted with an adsorption piece (174), the sorting mechanism (17) further comprises a sorting cylinder (171) mounted on an upper surface of the third detection box body (7), one side of the elevating block (172) is provided with a rotating motor (173) for driving the adsorption piece (174) to rotate, and the sorting cylinder (171) is used for driving the elevating block (172) and the adsorption piece (174) to do linear reciprocating motion together.
4. The quality detection device for preparing the semiconductor material as claimed in claim 1, wherein the carrying mechanism (3) comprises a fixed base (31) fixedly mounted on the outer surface of the conveyor (1), a connecting base (32) is fixedly connected to the upper end of the fixed base (31), baffle plates (33) are symmetrically arranged at the upper end of the connecting base (32), an ejector rod (34) is arranged on the upper surface of the connecting base (32), a driving member for driving the ejector rod (34) to eject the semiconductor workpiece is arranged in the connecting base (32), and a mounting groove matched with the ejector rod (34) is arranged at the upper end of the connecting base (32).
5. The quality detection device for the preparation of the semiconductor material, according to claim 1, characterized in that the first adjusting mechanism (10) comprises a first fixing column (101) fixedly installed on the inner wall of the top end of the first detection box body (5), a second fixing column (102) is rotatably installed at the lower end of the first fixing column (101), a first rotating motor for driving the second fixing column (102) to rotate is arranged in the first fixing column (101), a fixed shell (103) is rotatably installed at the lower end of the second fixing column (102), a light source (104) is arranged in the fixed shell (103), and an adjusting motor (105) for driving the fixed shell (103) and the light source (104) to rotate together is arranged on the outer surface of the second fixing column (102).
6. The quality detection device for preparing the semiconductor material as claimed in claim 5, wherein the second adjusting mechanism (11) comprises a first fixing plate (111) fixedly installed inside the first detection box (5), the first fixing plate (111) is located on one side of the first fixing column (101), one end of the first fixing plate (111) extends to the outside of the first detection box (5), a first lifting cylinder (112) is fixedly installed at the upper end of the first fixing plate (111), an output end of the first lifting cylinder (112) penetrates through the first fixing plate (111), a third fixing column (113) is connected to an output end of the first lifting cylinder (112), a fourth fixing column (114) is slidably connected to one side of the third fixing column (113), a reciprocating cylinder for driving the fourth fixing column (114) to linearly reciprocate is installed in the third fixing column (113), an arc-shaped plate (115) is rotatably installed on one side of the fourth fixing column (114) far from the third fixing column (113), and a second rotating motor for driving the arc-shaped plate (115) to rotate is installed in the fourth fixing column (114).
7. The quality detection device for preparing the semiconductor material as claimed in claim 1, wherein the third adjustment mechanism (15) comprises a lifting plate (151) slidably mounted on an inner wall of one side of the second detection box body (6), a third lifting cylinder (152) located below the lifting plate (151) is disposed on the inner wall of one side of the second detection box body (6), the third lifting cylinder (152) is used for driving the lifting plate (151) to vertically lift, a clamping plate (153) is slidably disposed on one side of the lifting plate (151), and an expansion member (154) used for driving the clamping plate (153) to slide is disposed at an upper end of the lifting plate (151).
8. The quality detection device for preparing the semiconductor material as claimed in claim 1, wherein the adjusting mechanism four (16) comprises a telescopic cylinder (161) fixedly mounted on an outer surface of the second detection box (6), an output end of the telescopic cylinder (161) penetrates into the second detection box (6), an output end of the telescopic cylinder (161) is connected with a storage tray (162), a connecting plate (163) is fixedly mounted on one side of the storage tray (162), a heating plate (164) located below the storage tray (162) is arranged on one side of the connecting plate (163), a lifting cylinder four (165) is arranged on the other side of the connecting plate (163), a sliding plate slidably mounted on the connecting plate (163) is connected to one side of the heating plate (164), and an output end of the lifting cylinder four (165) is connected with a lower end of the sliding plate.
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| CN115808605B (en) | 2023-07-04 |
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