CN211756921U

CN211756921U - Wafer sorting machine

Info

Publication number: CN211756921U
Application number: CN201922237968.7U
Authority: CN
Inventors: 常德; 李进阳
Original assignee: SHENZHEN KERUIER AUTOMATION EQUIPMENT CO Ltd
Current assignee: SHENZHEN KERUIER AUTOMATION EQUIPMENT CO Ltd
Priority date: 2019-12-13
Filing date: 2019-12-13
Publication date: 2020-10-27
Anticipated expiration: 2029-12-13

Abstract

The utility model relates to a wafer sorter, include: the rotary table is rotationally arranged on the workbench and used for driving the wafer to rotate; the feeding mechanism is arranged on the workbench and used for pouring the wafer onto the turntable; the material sucking mechanism is arranged on the workbench and used for sucking the wafer on the turntable; the detection mechanism is arranged on the workbench and used for detecting whether the wafer sucked by the material sucking mechanism is qualified or not; and the material suction mechanism is used for separately placing the qualified wafer and the unqualified wafer according to the detection result of the detection mechanism. The wafer is poured onto the turntable through the feeding mechanism, and then the turntable drives the wafer to rotate, so that the wafer is scattered and is convenient to absorb by the absorbing mechanism; the material suction mechanism sucks the wafer on the turntable, and the qualified wafer and the unqualified wafer are separately placed according to the detection result of the detection mechanism, so that automatic separation of the wafers is realized, manual separation is avoided, and the separation efficiency of the wafers is greatly improved.

Description

Wafer sorting machine

Technical Field

The utility model relates to a wafer processing technology field, especially a wafer sorter.

Background

With the rapid development of the quartz crystal industry, the product types also tend to be miniaturized more and more. At present, the appearance detection of the quartz wafer is manually and directly observed by naked eyes or observed by a magnifying glass. Due to subjective factors, inspection standards vary from person to person, and sorting wafers can be subject to errors. And with the miniaturization of products, the difficulty of manual visual observation is more and more high, so that the requirements of the market and the process processing cannot be met by manual detection and separation.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in providing a wafer sorter that can automated inspection and select separately.

The utility model provides a technical scheme that its technical problem adopted is: there is provided a wafer sorter comprising: a working table is arranged on the upper portion of the machine body,

the rotary table is rotationally arranged on the workbench and used for driving the wafer to rotate;

the feeding mechanism is arranged on the workbench and used for pouring the wafer onto the turntable;

the material sucking mechanism is arranged on the workbench and used for sucking the wafer on the turntable;

the detection mechanism is arranged on the workbench and used for detecting whether the wafer sucked by the material sucking mechanism is qualified or not; and the material suction mechanism is used for separately placing the qualified wafer and the unqualified wafer according to the detection result of the detection mechanism.

Further, feed mechanism includes first support, is used for placing the storage section of thick bamboo and the first power portion of wafer, first support is installed on the workstation, the storage section of thick bamboo activity sets up on the first support, first power portion drive the rotation of storage section of thick bamboo.

Furthermore, an elevation angle is formed between the central shaft of the storage cylinder and the rotating plane of the rotary disc; the inner wall of the storage cylinder is provided with threads which are convenient for pouring out crystals.

Further, the elevation angle is 15 ° to 25 °.

Further, the feeding mechanism further comprises a funnel, and the funnel is arranged on the first support and is positioned below the storage barrel; the wafers poured out of the storage cylinder drop onto the rotary table one by one through the hopper.

Further, the detection mechanism comprises a first CCD camera and a first light source, and the first CCD camera and the first light source are both arranged on the workbench.

Further, the wafer sorting machine further comprises a positioning mechanism for positioning the wafer, the positioning mechanism comprises a second support, and a second CCD camera and a second light source which are arranged on the second support, the second support is arranged on the workbench, and the second light source is positioned below the second CCD camera and above the turntable; the first light source and the second light source are both annular light sources.

Further, the material sucking mechanism comprises a vacuum suction nozzle and a second power part, wherein the second power part drives the vacuum suction nozzle to do reciprocating motion along a straight line and respectively pass through the upper part of the first CCD camera and the lower part of the second CCD camera.

Furthermore, the second power part comprises a servo motor, a screw rod, a guide rail and a slide block arranged on the guide rail, a fine adjustment assembly is arranged on the slide block, the vacuum suction nozzle is arranged on the fine adjustment assembly, and the vacuum suction nozzle can be lifted by adjusting the fine adjustment assembly; the sliding block is in threaded connection with the screw rod, the servo motor drives the screw rod to rotate, the sliding block is driven to move along the guide rail, and the vacuum suction nozzle is driven to move in a reciprocating mode along the guide rail.

Further, the wafer sorting machine also comprises a good product box for storing qualified wafers and a waste product box for storing unqualified wafers, wherein the good product box and the waste product box are both arranged on the workbench; and after the vacuum suction nozzle sucks the wafer from the turntable, placing the sucked wafer in the good product box or the waste product box according to the detection result of the detection mechanism.

Compared with the prior art, the wafer sorting machine provided by the utility model has the advantages that the wafers are poured onto the turntable through the feeding mechanism, and then the turntable drives the wafers to rotate, so that the wafers are scattered and are convenient to be absorbed by the absorbing mechanism; the material suction mechanism sucks the wafer on the turntable, and the qualified wafer and the unqualified wafer are separately placed according to the detection result of the detection mechanism, so that automatic separation of the wafers is realized, manual separation is avoided, and the separation efficiency of the wafers is greatly improved.

Drawings

The invention will be further explained with reference to the drawings and examples, wherein:

fig. 1 is a schematic perspective view of a wafer sorter according to the present invention;

FIG. 2 is an enlarged partial schematic view of the wafer sorter of FIG. 1;

FIG. 3 is a side schematic view of the wafer sorter of FIG. 1;

fig. 4 is an enlarged partial schematic view of the wafer sorter of fig. 1.

Detailed Description

The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

As shown in fig. 1, the utility model provides a wafer sorter, include: a table 10, wherein the table is horizontally disposed. The turntable 20 is rotationally arranged on the worktable 10 and is used for driving the wafer to rotate; the turntable 20 is driven to rotate by a motor.

And a loading mechanism 30, wherein the loading mechanism 30 is arranged on the workbench 10 and is used for pouring the wafer onto the turntable 20. And the material sucking mechanism 40, wherein the material sucking mechanism 40 is arranged on the workbench 10 and is used for sucking the wafer on the turntable 20.

The detection mechanism 50, the detection mechanism 50 is arranged on the worktable 10 and is used for detecting whether the wafer sucked by the material suction mechanism 40 is qualified; the suction mechanism 40 separates the acceptable wafers from the unacceptable wafers according to the result of the inspection by the inspection mechanism 50.

During operation, the wafer is poured onto the turntable 20 through the feeding mechanism 30, and then the turntable 20 drives the wafer to rotate, so that the wafer is scattered to avoid stacking, and the wafer is convenient to be sucked by the sucking mechanism 40. The material suction mechanism 40 sucks the wafers on the turntable 20, and places the qualified wafers and the unqualified wafers separately according to the detection result of the detection mechanism 50, so that automatic separation of the wafers is realized, manual separation is avoided, and the separation efficiency of the wafers is greatly improved.

As shown in fig. 2, the loading mechanism 30 includes a first support 31, a storage cylinder 32 for placing a wafer, and a first power unit 33. The first support 31 is mounted on the worktable 10, the storage barrel 32 is movably disposed on the first support 31, and the first power unit 33 drives the storage barrel 32 to rotate, so that the wafers in the storage barrel 32 are dumped onto the turntable 20. The first power part 33 is preferably a servo motor, and the servo motor is also mounted on the first bracket 31.

In this embodiment, an angle of elevation Q is formed between the central axis of the storage cylinder 32 and the rotation plane of the turntable 20, and the inner wall of the storage cylinder 32 is provided with a thread 37 for pouring out the crystal. During the rotation of the storage cylinder 32, the wafer moves along the screw 37 and is slowly guided out of the storage cylinder 32. The discharging mode with the elevation angle can control the discharging speed, and the design is very ingenious. Specifically, the elevation angle is 15 ° to 25 °, preferably 20 ° (see fig. 3). If the elevation angle is too large, the lead-out of the wafer is not facilitated.

The feeding mechanism 30 further comprises a hopper 34, and the hopper 34 is disposed on the first support 31 and located below the storage cylinder 32. The wafers poured out of the storage cylinder 32 drop onto the turntable 20 one by one through the hopper 34, so that the wafers can be scattered uniformly, and the material taking by the material suction mechanism 40 is facilitated.

In order to adjust the position of the funnel 34 conveniently, the funnel 34 is mounted on the first bracket 31 through a connecting rod 35, a first strip-shaped hole 36 is formed in the funnel 34, and the funnel is fixed on the connecting rod 35 through a locking member passing through the first strip-shaped hole 36. Wherein, the locking piece can be a screw or a bolt.

Referring to fig. 4, the detection mechanism 50 includes a first CCD camera 51 and a first light source 52, and the first CCD camera 51 and the first light source 52 are both provided on the table 10. When the material suction mechanism 40 sucks the wafer to pass through the first CCD camera 51, the first CCD camera 51 performs flight shooting on the wafer from bottom to top, that is, the material suction mechanism 40 does not need to stop midway, and shooting is realized in the moving process. Thus, the detection efficiency can be greatly improved.

In this embodiment, the first light source 52 is a ring light source, and the ring light source is uniformly illuminated. The first light source 52 is installed on the first CCD camera 51, and the first CCD camera 51 photographs the wafer through the annular light source, which is good in photographing effect.

Since the wafer is rotated with the turntable 20, the suction mechanism 40 can precisely suck the wafer. The wafer sorter further includes a positioning mechanism 60 for positioning the wafer, the positioning mechanism 60 including a second support 61, and a second CCD camera 62 and a second light source 63 mounted on the second support 61, the second support 61 being mounted on the table 10, the second light source 63 being located below the second CCD camera 62 and above the turntable 20.

Specifically, the material suction position of the material suction mechanism 40 is a material suction area, the second CCD camera 62 is just located above the material suction area, and can shoot the wafer which is to be rotated to the material suction area in advance, the system can calculate the time from the wafer to the material suction area according to the rotation angular velocity of the turntable 20, and after the time, the material suction mechanism 40 is controlled to generate suction action, so that the wafer which is rotated to the material suction area can be just sucked. That is, the positioning mechanism 60 is mainly used to determine the position of the wafer and then guide the suction mechanism 40 to precisely suck.

In the present embodiment, the second light source 63 is also a ring light source, and the illumination is uniform. The second CCD camera 62 shoots the wafer through the annular light source, and the shooting effect is good. The second CCD camera 62 and the second light source 63 are mounted on the second bracket 61 to be vertically adjustable through the second bar-shaped hole 64.

Referring to fig. 4, the suction mechanism 40 includes a vacuum suction nozzle 41 and a second power unit 42, and the second power unit 42 drives the vacuum suction nozzle 41 to reciprocate along a straight line, passing above the first CCD camera 51 and below the second CCD camera, respectively. The first CCD camera 51 is convenient to fly and shoot, and the second CCD camera is convenient to position.

In this embodiment, the second power portion 42 is a servo module, the servo module mainly includes a servo motor, a screw rod, a guide rail and a slider disposed on the guide rail, the vacuum suction nozzle 41 is disposed on the slider, the slider is in threaded connection with the screw rod, the servo motor drives the screw rod to rotate, the slider is driven to move along the guide rail, and the vacuum suction nozzle 41 is driven to reciprocate along the guide rail. Wherein, there are two vacuum suction nozzles 41, which can suck two wafers at the same time, thereby improving the efficiency. Of course, the second power unit 42 may be a linear cylinder or the like.

Since the vacuum suction nozzle 41 performs a linear movement in the lateral direction along the guide rail, it is necessary to suck the wafer in a spaced manner. Thus, it is necessary to control the distance between the vacuum suction nozzle 41 and the wafer, and the distance is too large to be sucked and too small to easily collide with the wafer. Therefore, the fine adjustment assembly 43 is arranged on the slide block, the vacuum suction nozzle 41 is arranged on the fine adjustment assembly 43, and the vacuum suction nozzle 41 can be lifted and lowered by adjusting the fine adjustment assembly 43, so that the distance between the vacuum suction nozzle and the wafer can be adjusted, and a better distance can be obtained.

In this embodiment, the fine adjustment assembly 43 includes a vertical slide and a vertical adjustment bolt. The vertical slide block is arranged on the slide block in a sliding way, and the vacuum suction nozzle 41 is arranged on the vertical slide block. The vertical adjusting bolt is screwed to drive the vertical sliding block to move up and down, so that the vacuum suction nozzle 41 is lifted up and down.

Referring to fig. 4, the wafer sorter further includes a good cassette 70 for storing good wafers and a waste cassette 80 for storing defective wafers, the good cassette 70 and the waste cassette 80 being disposed on the table 10. The vacuum suction nozzle 41 sucks the wafer from the turntable 20, passes over the first CCD camera 51, and is subjected to flying photography. The sucked wafer is then placed in the good cassette 70 or the reject cassette 80 according to the detection result of the detection mechanism 50. That is, if the wafer is acceptable, the sucked wafer is placed in the good package 70. If not, the picked wafer is placed in a reject box 80 to effect sorting of the wafers.

Referring to fig. 1, the wafer handler further includes a cabinet 91 and a display screen 92, the table 10 is disposed on the cabinet 91, and the display screen 92 is disposed on the table 10. The cabinet 91 is internally provided with a control circuit system which is respectively electrically connected with the display screen 92 and the mechanisms, and displays working states and working parameters through the display screen 92, so that an operator can visually know the working condition of the wafer sorting machine conveniently.

It should be understood that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; and all such modifications and alterations should fall within the scope of the appended claims.

Claims

1. A wafer sorter, comprising: a working table is arranged on the upper portion of the machine body,

2. The wafer sorting machine of claim 1, wherein the feeding mechanism comprises a first bracket, a storage barrel for placing the wafer, and a first power unit, the first bracket is mounted on the worktable, the storage barrel is movably arranged on the first bracket, and the first power unit drives the storage barrel to rotate.

3. The wafer sorter of claim 2 wherein the central axis of the storage bin is at an angle of elevation relative to the plane of rotation of the turntable; the inner wall of the storage cylinder is provided with threads which are convenient for pouring out crystals.

4. The wafer sorter of claim 3 wherein the elevation angle is 15 ° to 25 °.

5. The wafer sorter of claim 3 wherein the feed mechanism further comprises a hopper disposed on the first support and positioned below the storage bin; the wafers poured out of the storage cylinder drop onto the rotary table one by one through the hopper.

6. The wafer sorter according to any of claims 1 to 5 wherein the detection mechanism comprises a first CCD camera and a first light source, both of which are disposed on the table.

7. The wafer sorter of claim 6 further comprising a positioning mechanism for positioning a wafer, the positioning mechanism comprising a second support mounted on the table and a second CCD camera and a second light source mounted on the second support, the second light source being located below the second CCD camera and above the turntable; the first light source and the second light source are both annular light sources.

8. The wafer sorter of claim 7 wherein the suction mechanism includes a vacuum nozzle and a second power section, the second power section driving the vacuum nozzle to reciprocate in a straight line past above the first CCD camera and below the second CCD camera, respectively.

9. The wafer handler of claim 8, wherein the second power unit includes a servo motor, a lead screw, a guide rail, and a slider disposed on the guide rail, a fine adjustment assembly is disposed on the slider, and the vacuum nozzle is disposed on the fine adjustment assembly, and the vacuum nozzle can be raised and lowered by adjusting the fine adjustment assembly; the sliding block is in threaded connection with the screw rod, the servo motor drives the screw rod to rotate, the sliding block is driven to move along the guide rail, and the vacuum suction nozzle is driven to move in a reciprocating mode along the guide rail.

10. The wafer sorter of claim 8 further comprising a good cassette for storing qualified wafers and a waste cassette for storing rejected wafers, the good cassette and the waste cassette both being disposed on the table; and after the vacuum suction nozzle sucks the wafer from the turntable, placing the sucked wafer in the good product box or the waste product box according to the detection result of the detection mechanism.