CN112642731A

CN112642731A - Combined detection device and intelligent silicon wafer sorting machine

Info

Publication number: CN112642731A
Application number: CN202011402228.5A
Authority: CN
Inventors: 刘长清; 刘满朝; 曹葵康; 胡辉来; 孙靖; 顾烨; 孙俊; 程璧; 苏傲; 蔡耀锋; 温延培
Original assignee: Tztek Technology Co Ltd
Current assignee: Tztek Technology Co Ltd
Priority date: 2020-12-04
Filing date: 2020-12-04
Publication date: 2021-04-13

Abstract

The invention provides a joint detection device and an intelligent silicon wafer sorting machine, wherein the joint detection device comprises: the system comprises a detection flow line and a plurality of detection modules arranged along the detection flow line; the detection streamline is arranged in proper order by a plurality of streamline units and constitutes, a plurality of detection modules include: about collapse limit module, thickness and detect module, resistivity test module, around collapse module, size detection module, dirty detection module, chamfer and collapse some or all in the limit module and the latent detection module that splits. The joint detection device can integrate and continuously complete the detection of a plurality of items of the silicon chip, fully meet the actual detection requirement of the silicon chip and obviously improve the quality detection efficiency of the silicon chip.

Description

Combined detection device and intelligent silicon wafer sorting machine

Technical Field

The invention relates to the technical field of silicon wafer sorting, in particular to a combined detection device and an intelligent silicon wafer sorting machine.

Background

Silicon wafers are widely used as important industrial raw materials for the production and manufacture of products such as solar cells and circuit boards. Therefore, before the silicon wafer is produced and shipped, the quality of the silicon wafer needs to be strictly controlled so as to ensure the quality of products such as solar cells, circuit boards and the like manufactured by the silicon wafer. In the actual quality detection of the silicon wafer, a plurality of detection items are integrated to complete the quality detection of the silicon wafer. Therefore, it is necessary to provide a further solution to the above problems.

Disclosure of Invention

The invention aims to provide a joint detection device and an intelligent silicon wafer sorting machine to overcome the defects in the prior art.

In order to solve the technical problems, the technical scheme of the invention is as follows:

a joint detection apparatus, comprising: the system comprises a detection flow line and a plurality of detection modules arranged along the detection flow line;

the detection streamline is arranged in proper order by a plurality of streamline units and constitutes, a plurality of detection modules include: about collapse limit module, thickness and detect module, resistivity test module, around collapse module, size detection module, dirty detection module, chamfer and collapse some or all in the limit module and the latent detection module that splits.

As an improvement of the combined detection device, any streamline unit comprises: the streamline support, the belt wheel, the transmission belt and the driving motor;

the streamline support comprises: the support comprises a support body and a support pillar for supporting the support body, wherein the belt wheels are a plurality of belt wheels, the belt wheels are symmetrically distributed on two sides of the streamline support, the transmission belts are respectively sleeved on the belt wheels on the two sides, the belt wheels on the two sides are oppositely arranged and are connected through transmission shafts, and the driving motor is in transmission connection with one belt wheel.

As an improvement of the combined detection device, two belt wheels are arranged at two ends of the support body on one side of the streamline support, the other four belt wheels are arranged below the belt wheels at the two ends, two of the four belt wheels are arranged adjacently, the other belt wheel is arranged right below the belt wheels arranged adjacently, and the driving motor is in transmission connection with the belt wheel right below.

As an improvement of the combined detection device of the present invention, the upstream end of the detection flow line is further provided with a guiding mechanism, and the guiding mechanism comprises: the left and right guide units are symmetrically arranged and the adjusting units drive the two guide units to move towards or away from each other;

the pilot unit on either side includes: the silicon wafer correcting device comprises a first base, a correcting belt and a correcting motor, wherein the correcting belt and the correcting motor are arranged at the top of the first base, and the correcting belt is obliquely arranged along the conveying direction of a silicon wafer, so that the distance between the correcting belts of two correcting units is gradually reduced along the conveying direction of the silicon wafer;

the adjusting unit includes: adjusting handle and accommodate the lead screw, accommodate the lead screw both ends are provided with the screw thread of reverse setting respectively, accommodate the lead screw's both ends threaded connection has the slider, and the slider at both ends is connected with the leading positive unit that corresponds respectively, adjusting handle and accommodate the lead screw's one end fixed connection.

As an improvement of the joint detection device of the present invention, the left and right edge breakage module includes: the two edge breakage detection units are arranged along the conveying direction of the detection streamline in a staggered manner;

the edge collapse detecting unit on either side includes: second base, first detection camera, first light source, first detection camera horizontal installation is on the second base, and the orientation detect the streamline setting, first light source is located first detection camera and detects the light path between the streamline, it is right still that the limit module of collapsing about includes two detecting element that collapse carries out refrigerated fan, fan and two detecting element components of a whole that can function independently settings that collapse the limit.

As an improvement of the joint inspection apparatus of the present invention, the thickness inspection module includes: the thickness detection device comprises a substrate and three groups of thickness detection units arranged on the substrate;

any group of thickness detection units comprises two line laser transmitters which are arranged up and down oppositely, and three groups of thickness detection units are arranged on the left, the middle and the right, wherein two groups of thickness detection units are arranged on one side of the substrate, and the other group of thickness detection units are arranged on the other side of the substrate and are arranged opposite to the position between the two thickness detection units on the other side.

As an improvement of the combined detection device, the line laser transmitters are connected and fixed through holes preset on the base plate, and the holes preset on the base plate are arranged according to directions meeting detection requirements.

As an improvement of the joint detection apparatus of the present invention, the resistivity test module comprises: the resistivity testing device comprises a resistivity testing bracket, an upper testing probe and a lower testing probe;

the resistivity test support is provided with two connecting arms which are oppositely arranged up and down, the upper test probe and the lower test probe are correspondingly arranged on the corresponding connecting arms, and a PN sensor is further arranged on the upper test probe or the lower test probe.

As an improvement of the joint detection apparatus of the present invention, the front and rear collapse module includes: the device comprises a fixed bracket, a second detection camera and a second light source;

the second detection camera and the second light source are arranged on the fixed support and are located above the detection flow line, the second light source is located between the second detection camera and the detection flow line, and an opening suitable for the detection light to pass through is formed in the middle of the second light source.

As an improvement of the joint detection apparatus of the present invention, the subfissure detection module includes: the two groups of hidden crack detection units are symmetrically distributed on two sides of the detection flow line;

the subfissure detection unit on either side comprises: fourth base, sixth detection camera and fifth light source, the sixth detection camera installs on the fourth base slant downwards, and two sets of latent detection unit's sixth detection camera's detection zone covers two streamline unit transitional coupling's position, the fifth light source sets up in the below of two streamline unit transitional coupling positions, the fourth base still is provided with and can measures the scale mark of sixth detection camera installation angle, it is directional to install on the sixth detection camera the pointer of scale mark.

the utility model provides a silicon chip intelligence sorter which is including setting gradually: the device comprises a feeding device, a detection device and a discharging device, wherein the detection device is the combined detection device.

Compared with the prior art, the invention has the beneficial effects that: the joint detection device can integrate and continuously complete the detection of a plurality of items of the silicon chip, fully meet the actual detection requirement of the silicon chip and obviously improve the quality detection efficiency of the silicon chip.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic perspective view of an embodiment of an intelligent silicon wafer sorter according to the present invention;

FIG. 2 is an enlarged perspective view of the loading device shown in FIG. 1;

FIG. 3 is an enlarged perspective view of the first loading module, the second loading module and the translation module shown in FIG. 2;

FIG. 4 is an enlarged perspective view of the first feeding module, the second feeding module and the translation module of FIG. 2 at another angle;

fig. 5 is an enlarged perspective view of the first lifting mechanism in fig. 2;

FIG. 6 is an enlarged schematic plan view of the translation module of FIG. 1;

FIG. 7 is an enlarged perspective view of the joint detection apparatus of FIG. 1;

FIG. 8 is an enlarged perspective view of the flow lines being sensed in FIG. 7;

FIG. 9 is an enlarged perspective view of the flow line unit of FIG. 8;

FIG. 10 is an enlarged perspective view of the pilot mechanism of FIG. 7;

FIG. 11 is an enlarged perspective view of the left and right edge breaking modules shown in FIG. 7;

FIG. 12 is an enlarged perspective view of the thickness detection module shown in FIG. 7;

FIG. 13 is an enlarged schematic perspective view of the resistivity testing module of FIG. 7;

FIG. 14 is an enlarged perspective view of the front and rear collapsing modules shown in FIG. 7;

FIG. 15 is an enlarged perspective view of the size detection module shown in FIG. 7;

FIG. 16 is an enlarged perspective view of the soil detection unit of FIG. 7;

FIG. 17 is an enlarged perspective view of the lower contamination detection unit of FIG. 7;

FIG. 18 is an enlarged perspective view of the bevel edge breaking module shown in FIG. 7;

FIG. 19 is an enlarged perspective view of the subfissure detection module shown in FIG. 7;

FIG. 20 is an enlarged perspective view of the blanking and sorting apparatus of FIG. 1;

fig. 21 is an enlarged perspective view of the blanking sorting module shown in fig. 20;

fig. 22 is an enlarged plan view of the jacking mechanism and the sorting conveying mechanism in fig. 20.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1, an embodiment of the present invention provides an intelligent silicon wafer sorting machine, which includes: a feeding device 100, a combined detection device 200 and a blanking sorting device 300.

【Feeding device】

As shown in fig. 2 to 6, the loading device 100 is used for loading silicon wafers, wherein the silicon wafers are stacked in a basket, the basket for loading a plurality of stacked silicon wafers can be placed in the loading device 100, and the loading device 100 further transfers the basket to the loading position.

The feeding device 100 includes: a first loading module 110, a second loading module 120 and a translation module 130. The two

feeding modules

110 and 120 can load baskets of stacked silicon wafers and perform alternate feeding under the driving of the translation module 130. Therefore, in the process that the charging basket is placed on the charging module, the other charging module can continue to work, and the charging efficiency is higher.

Either of the feeding

modules

110, 120 includes: a loading frame 111, a rotating motor 112, a clamping unit 113, a base 114, and a first lifting mechanism 115.

The bottom of the loading frame 111 is pivotally connected to the base 114, and the rotating motor 112 is installed at one side of the base 114 and can drive the pivot between the loading frame 111 and the base 114 to rotate, so that the loading frame 111 pivots at least within a range of 90 °. The purpose of this arrangement is to take into account that the basket is first placed horizontally during loading on the loading module, whereas the silicon wafers are delivered from the bottom with the basket upright. Therefore, it is necessary to turn the loading frame 111, which loads the basket, from the horizontal state to the vertical state.

The clamping units 113 are installed at both sides of the loading frame 111, so as to clamp and fix the baskets loaded in the loading frame 111, and maintain the stability of loading. The clamping unit 113 includes at least two sets of clamping structures 1131 arranged from top to bottom. In one embodiment, the clamping structures 1131 are provided in two sets, one set being mounted at one end of the upper rack 111 and the other set being mounted at the other end of the upper rack 111.

Any set of clamping structures 1131 includes: a fixed jaw 11311, a movable jaw 11312, and a clamp cylinder 11313. Wherein, fixed clamping jaw 11311 is installed in the end of the place and goes up one side of work or material rest 111, and activity clamping jaw 11312 is located the end of the place and goes up the opposite side of work or material rest 111, and activity clamping jaw 11312 can be driven by die clamping cylinder 11313, and relative fixed clamping jaw 11311 carries out reciprocating motion to the centre gripping to the basket is realized.

Meanwhile, the edge of the upper end of the fixed clamping jaw 11311 and/or the movable clamping jaw 11312 is also provided with a limiting protrusion, and the limiting protrusion is an inclined surface facing the clamping action surface of the charging basket. Correspondingly, the upper end edge of the lower fixed jaw 11311 and/or the upper end edge of the movable jaw 11312 are/is further provided with a limiting protrusion, and the limiting protrusion is an inclined surface facing the clamping action surface of the charging basket. So, when the centre gripping of charging basket, can firmly hold the charging basket through spacing arch, further avoid it to take place the pine to take off.

The first lifting mechanism 115 is used to drive the feeding frame 111, the rotating motor 112, the clamping unit 113, and the base 114 to integrally lift. The purpose of the arrangement is to consider that when the charging basket in a vertical state is used for feeding, the silicon wafers stacked inside are sent out one by one from the bottom of the charging basket, so that the height of the stacked silicon wafers is gradually reduced. Accordingly, the loading frame 111, the rotation motor 112, the clamping unit 113, and the base 114 are also required to be integrally lowered to maintain the lowermost wafer in alignment with the entrance of the downstream joint inspection apparatus 200.

The first elevating mechanism 115 specifically includes: a first elevation motor 1151, a first elevation screw 1152, a first elevation slider 1153, and a first housing 1154. The first lifting screw 1152 is vertically arranged, and one end of the first lifting screw 1152 is connected to the first lifting motor 1151 and is driven by the first lifting motor 1151 to pivot. The first elevation slider 1153 is screw-coupled to the first elevation screw 1152, and performs a vertical movement along with the pivoting of the first elevation screw 1152. And the movement direction of the first elevation slider 1153 can be controlled by controlling the forward and reverse rotation of the first elevation motor 1151. The first lifting motor 1151, the first lifting screw 1152 and the first lifting slider 1153 are accommodated in the first housing 1154, two side edges of the first lifting slider 1153 extend out of a gap between two sides of the first housing 1154, and the extending portion of the first lifting slider 1153 is connected with the base 114 of the feeding module. Thus, when the first elevating motor 1151 operates, the loading frame 111, the rotating motor 112, the clamping unit 113 and the base 114 are driven to integrally elevate.

The first lifting mechanisms 115 of the two feeding modules are arranged side by side and are driven by the translation module 130 to move horizontally left and right, so that the two feeding modules are alternately turned to the feeding position.

The translation module 130 includes: a translation motor 131, a translation screw 132, a translation slider and at least two guide rails 134 arranged horizontally. The translation motor 131 is in transmission connection with one end of the translation screw 132 to drive the translation screw 132 to pivot. Meanwhile, the translation sliding block is in threaded fit with the translation screw rod 132, so that when the translation screw rod 132 pivots, the translation sliding block can be driven to move left and right in the horizontal direction. The translation slider is further connected to the fixed plate on which the two feeding modules are arranged. Meanwhile, when there are two guide rails 134, the translation motor 131, the translation screw 132, and the translation slider are located between the two guide rails 134. Thus, when the translation motor 131 works, the first feeding module 110 and the second feeding module 120 can be driven by the translation screw rod 132 and the translation slider to move horizontally along the two guide rails 134.

In addition, a transfer line for transferring the silicon wafers discharged from the charging basket to the inlet of the joint inspection apparatus 200 is provided between the charging apparatus 100 and the joint inspection apparatus 200. The conveying line comprises a belt driven by a motor to convey, one end of the belt extends to an inlet of the joint detection device 200, the other end of the belt extends to one side of the two feeding modules, and the belt can receive silicon wafers from the two feeding modules which are alternately fed.

【Joint detection device】

As shown in fig. 7 to 19, the joint inspection apparatus 200 is used for inspecting the quality of the silicon wafers loaded by the loading apparatus 100. The combined detection device 200 is integrated with a plurality of detection stations, so that centralized continuous detection of various items of the silicon wafer is realized, the detection requirements in industrial production of the silicon wafer are fully met, and the delivery quality of the silicon wafer is guaranteed.

The joint detection apparatus 200 includes: a detection flow line 210 and, disposed along the detection flow line 210: a left-right edge-breaking module 220, a thickness detection module 230, a resistivity test module 240, a front-back edge-breaking module 250, a size detection module 260, a dirt detection module 270, a chamfer edge-breaking module 280 and an subfissure detection module 290. The sequence of the detection modules is not limited to the sequence shown in the drawings. In addition, according to the practical application, the detection modules can be omitted or replaced by detection modules capable of realizing other detection items.

The detection flow line 210 is configured to receive silicon wafers loaded by the loading device 100, and sequentially transmit the silicon wafers to each detection module for quality detection. This detection streamline 210 is arranged in proper order by a plurality of streamline units and constitutes, and arbitrary streamline unit includes: a streamline support 211, a belt wheel 212, a transmission belt 213 and a driving motor 214.

The streamline support 211 includes: the support body and the pillar that supports is carried out to the support body. The number of the belt wheels 212 is several, the several belt wheels 212 are symmetrically distributed on two sides of the streamline support 211, and the transmission belts 213 are respectively sleeved on the several belt wheels 212 on two sides and drive the silicon wafer to move. The pulleys 212 arranged oppositely on the two sides can be connected with each other through a transmission shaft. In this embodiment, in order to make the transmission belt 213 have a better tension and avoid looseness in the transmission process, the arrangement of the pulleys 212 on both sides is optimally designed.

Specifically, taking the arrangement of the pulleys 212 on one side as an example, two of the pulleys 212 are located at two ends of the bracket body, the other four pulleys 212 are located below the pulleys 212 at two ends, two of the four pulleys 212 are arranged adjacently, and the other pulley 212 is located right below the two pulleys 212 arranged adjacently. The driving motor 214 is in transmission connection with the pulley 212 directly below. Thus, when the driving motor 214 works, the driving motor can drive the belt pulley 212 directly connected with the driving motor to synchronously rotate, and the belt pulley 212 further drives the transmission belt and the other belt pulleys 212 to perform transmission.

In addition, a guiding mechanism 2100 is further disposed at the upstream end of the detection flow line 210, and the guiding mechanism 2100 guides the silicon wafer entering the detection flow line 210 to facilitate the transfer and detection of the subsequent silicon wafer.

The guide mechanism 2100 includes: a left-right symmetrically arranged pilot unit 2101 and an adjusting unit 2102 driving the two pilot units 2101 to move towards or away from each other.

Wherein the pilot unit 2101 on either side includes: the first base 2111, the correcting belt 2121 and the correcting motor 2131 are arranged at the top of the first base 2111, the correcting belt 2121 and the correcting motor 2131 are arranged at an inclined position along the conveying direction of the silicon wafer, so that the distance between the correcting belts 2121 of the two correcting units 2101 is gradually reduced along the conveying direction of the silicon wafer.

The adjusting unit 2102 includes: an adjusting handwheel 2112 and an adjusting screw 2122. The two ends of the adjusting screw rod 2122 are respectively provided with threads arranged in opposite directions, the two ends of the adjusting screw rod 2122 are in threaded connection with sliders, and the sliders at the two ends are respectively connected with the corresponding pilot units 2101. The adjusting handwheel 2112 is fixedly connected with one end of the adjusting screw rod 2122. Thus, when the adjusting handwheel 2112 is controlled to pivot, due to the threaded structure reversely arranged on the adjusting screw rod 2122, the two guiding units 2101 can move towards or away from each other to adjust the distance between the guiding belts 2121, so as to adapt to guiding of silicon wafers of different dimensions. In addition, the first base 2111 is further provided with a sliding rail 2132 for facilitating the sliding of the two guiding motors 2131.

The left and right edge breaking modules 220 are used for realizing quality detection of the left and right edges of the silicon wafer so as to judge whether the silicon wafer meets the corresponding quality standard. The left and right edge-collapsing module 220 includes: two edge breakage detecting units 221 are arranged in a staggered manner along the conveying direction of the detection streamline 210, so that the two edge breakage detecting units 221 are prevented from interfering with each other and affecting the accuracy of the detection result.

The edge collapse detecting unit 221 on either side includes: a second base 2211, a first detection camera 2212, a first light source 2213. The first detection camera 2212 is horizontally mounted on the second base 2211 and disposed toward the detection flow line 210. In one embodiment, the first detecting camera 2212 may be a line camera, which can detect the left side edge collapse and the right side edge collapse and the upper, lower, left and right surface collapse of the silicon wafer during the movement of the silicon wafer.

The first light source 2213 is used for providing illumination required by the detection camera for detection, an opening suitable for passing the detection light is arranged in the middle of the first light source 2213, and the first light source 2213 is located on a light path between the first detection camera 2212 and the detection flow line 210. Thus, the edge collapse detection units arranged oppositely can perform online detection on the silicon wafers conveyed by the detection streamline 210.

In addition, the left and right edge breakage module 220 further includes a fan for cooling the two edge breakage detection units. This fan sets up with two detection unit components of a whole that can function independently that collapse limit, so avoided the vibration that the fan during operation produced, influence the detection precision that collapses detection unit.

The thickness detection module 230 is used for detecting the thickness of the silicon wafer to determine whether the silicon wafer meets the corresponding thickness standard. The thickness detection module 230 includes: a substrate 231 and a plurality of sets of thickness detection units 232 mounted on the substrate 231. Any group of thickness detection unit 232 comprises two line laser transmitters which are oppositely arranged up and down, so that the height information of the upper surface and the lower surface of the silicon wafer through the two line laser transmitters can be measured, and the thickness, the line marks and the roughness of the silicon wafer can be calculated.

In one embodiment, the thickness detection units 232 are three groups, and the three groups of thickness detection units 232 are arranged in the left, middle and right directions, wherein two groups of thickness detection units 232 are installed on one side of the substrate 231, and another group of thickness detection units 232 are installed on the other side of the substrate 231 and are opposite to the position between the two thickness detection units 232 on the other side, so as to detect the thickness of the two sides and the middle of the silicon wafer between the two line lasers passing through the three groups of thickness detection units 232.

In addition, in any group of thickness detecting units 232, the line laser emitters are connected and fixed through holes preset on the substrate 231. The holes pre-formed in the substrate 231 are formed in directions meeting detection requirements, so that repeated debugging of the line laser transmitter after installation is avoided.

The resistivity testing module 240 is used for detecting the resistivity of the silicon wafer to determine whether the silicon wafer meets the corresponding electrical standard. The resistivity testing module 240 includes: a resistivity test support 241, an upper test probe 242, and a lower test probe 243. The resistivity testing bracket 241 has two connecting arms oppositely arranged up and down, and the upper testing probe 242 and the lower testing probe 243 are correspondingly mounted on the corresponding connecting arms. The upper test probe 242 or the lower test probe 243 is also provided with a PN sensor so that the polarity of the silicon wafer can be measured when the silicon wafer passes between the upper test probe 242 and the lower test probe 243.

The front and rear collapse modules 250 are used for realizing quality detection of the front and rear edges of the silicon wafer so as to judge whether the silicon wafer meets the corresponding quality standard. The front and rear collapse module 250 includes: a fixed bracket 251, a second detection camera 252, and a second light source 253. In one embodiment, the second inspection camera 252 is a high speed line scan camera that inspects the front and back sides of the silicon wafer under illumination provided by the second light source 253.

The second inspection camera 252 and the second light source 253 are mounted on the fixing bracket 251 and are located above the inspection flow line 210. The second light source 253 is located between the second detection camera 252 and the detection streamline 210, and an opening suitable for passing the detection light is formed in the middle of the second light source 253. In this way, the second inspection camera 252 and the second light source 253 can sequentially inspect the front and rear edges of the silicon wafer conveyed by the inspection flow line 210.

The size detection module 260 is used for detecting the size of the silicon wafer to determine whether the silicon wafer meets the corresponding size standard. The size detection module 260 includes: a mounting bracket 261, and a third detection camera 262. The third inspection camera 262 is located below the inspection flow line 210, and inspects the silicon wafer transmitted on the inspection flow line 210 by looking down. Since the third inspection camera 262 only inspects the profile of the silicon wafer, the influence of the inspection flow line 210 is negligible.

The contamination detection module 270 is used to detect the contamination of the surface of the silicon wafer to determine whether the silicon wafer meets the corresponding cleanliness standard. This dirty detection module 270 includes: an upper contamination detection unit 271 and a lower contamination detection unit 272, which are disposed above and below the detection flow line 210.

Wherein the

contamination detection units

271, 272 of either side include: a fourth detection camera 2711 and a third light source 2712. The fourth detection camera 2711 is a line camera, so that the upper and lower

contamination detection units

271 and 272 can detect contamination during movement of the silicon wafer in cooperation with the light source, thereby realizing detection of the front and back of the silicon wafer. To facilitate the detection of the lower contamination detecting unit 272, the lower contamination detecting unit 272 is located at a gap position where two streamline units are transitionally connected.

The third light source 2712 includes: light emitting diode and lamp shade. The light emitting diode is positioned below the lampshade. So inside the lamp shade, the light that emitting diode sent is big angle diffuse reflection state, and the radiation of diffuse reflection further reaches fourth detection camera 2711 through the gap of lamp shade, so set up the contrast that can alleviate silicon chip crystal structure to make the silicon chip of illumination evenly in the aspect of the width.

The chamfer edge-breaking module 280 is used for realizing quality detection of four chamfers of the silicon wafer so as to judge whether the silicon wafer meets the corresponding quality standard. The chamfer edge-breaking module 280 includes: two sets of chamfer detecting units 281. In the setting mode, the two sets of chamfer detection units 281 are symmetrically distributed on two sides of the detection streamline 210 in opposite directions, and two chamfers of the silicon wafer on the corresponding side are detected on line.

The chamfer detecting unit 281 on either side includes: a third base 2811, a fifth inspection camera 2812, and a fourth light source 2813. The number of the fifth inspection cameras 2812 is two, and the two fifth inspection cameras 2812 have an included angle of 45 degrees, so that the two chamfers of the silicon wafer on the corresponding side are inspected. The fourth light source 2813 is obliquely disposed and illuminates the inspection areas of the two fifth inspection cameras 2812. In the chamfer detecting unit 281 on either side, a fourth light source 2813 and two fifth detecting cameras 2812 are mounted on an L-shaped vertical plate on a third base 2811.

The subfissure detection module 290 is used to detect the surface cracks of the silicon wafer to determine whether the silicon wafer meets the corresponding appearance standard. The subfissure detection module 290 includes: two sets of subfissure detection units 291. In the setting mode, the two groups of hidden crack detection units 291 are symmetrically distributed on two sides of the detection streamline 210.

The subfissure detection unit 291 on either side includes: a fourth base 2911, a sixth detection camera 2912, and a fifth light source 2913. Here, the sixth detection camera 2912 is obliquely installed downward on the fourth base 2911. In one embodiment, the sixth detection camera 2912 employs a line camera. The detection area of the sixth detection camera 2912 of the two groups of subfissure detection units 291 covers the transitional connection position of the two streamline units, so that the adverse effect caused by belt reflection can be reduced. A fifth light source 2913 is disposed below the transition connection location of the two flow line cells. In one embodiment, the fifth light source 2913 is an infrared light source. Therefore, the linear array camera is matched with an infrared light source, and the detection of the silicon wafer surface subfissure defect can be realized.

In addition, in order to adjust the detection angle of the sixth detection camera 2912, the fourth base 2911 on which the sixth detection camera 2912 is mounted is further provided with scale marks capable of measuring the installation angle of the sixth detection camera 2912, and a pointer pointing to the scale marks is mounted on the corresponding sixth detection camera 2912. In this way, after the position of the scale mark pointed by the pointer is adjusted, the inclination angle of the sixth detection camera 2912 can be adjusted to meet the actual detection requirement, so that the detection area of the sixth detection camera 2912 of the two sets of hidden crack detection units 291 covers the transitional connection position of the two streamline units.

【Unloading sorting unit】

As shown in fig. 20 to 22, the blanking sorting device 300 is used for sorting the silicon wafers detected by the joint detection device 200 according to good products and defective products. And the defective silicon wafers can be further classified according to the defect types, so that the sorting of the good silicon wafers and the defective silicon wafers is realized, the sorting of the silicon wafers according to different defect types is convenient, and the management of the silicon wafers and the analysis and statistics of problems in the production process of the silicon wafers are facilitated.

The blanking sorting device 300 includes: and the blanking sorting modules 310 are combined and butted according to the blanking conveying direction. In this embodiment, there are two sets of the blanking sorting modules 310.

Any of the blanking sorting modules 310 includes: a workbench 311, a blanking conveying line 312 and a plurality of blanking sorting stations 313. The blanking conveying line 312 is arranged on the workbench 311, a plurality of blanking sorting stations 313 are distributed on two sides of the blanking conveying line 312, and the silicon wafers are conveyed by the blanking conveying line 312 and sorted to the corresponding stations.

Wherein, unloading transfer chain 312 includes: transfer chain body 3121, climbing mechanism 3122 and select separately conveying mechanism 3123.

The conveyor line body 3121 includes: two parallel conveyor belts 31211, and a plurality of support tables 31212 arranged at intervals in the conveying direction between the two conveyor belts 31211. The driving belt wheels of the two conveying belts 31211 are linked by a transmission shaft, and the transmission shaft is driven by a driving motor, so that the two conveying belts 31211 can synchronously move under the driving of the driving motor.

Jacking mechanism 3122 sets up respectively between each adjacent supporting bench 31212, and it includes: jacking motor, cam and with the perpendicular steering belt who sets up of direction of delivery. The steering belt is initially positioned below and between the adjacent support tables 31212, and the cam is positioned below the steering belt and is in driving connection, directly or indirectly, with the bottom of the steering belt. The cam is driven by a jacking motor to pivot. Thus, when the cam pivots, the cam can lift the steering belt to move it to a position at the same height as the adjacent support table 31212. With the arrangement, the silicon wafers conveyed to the positions between the adjacent support tables 31212 can be sorted to one side of the conveyor line body 3121 along with the steering belt. Meanwhile, the silicon wafers can be controlled to be sorted to one side or the other side of the conveying line body 3121 by controlling the forward rotation or the reverse rotation of the motor of the steering belt.

The sorting and conveying mechanisms 3123 are disposed on two sides of each jacking mechanism 3122, and are used for continuously conveying the silicon wafers steered by the steering belts to the corresponding blanking sorting stations 313. The sorting conveying mechanism 3123 includes a sorting conveying belt 31211 disposed obliquely, one end of the sorting conveying belt 31211 can be butted with the steering belt lifted by the cam, and the other end extends to the corresponding blanking sorting station 313. With this arrangement, the silicon wafers leaving the line body 3121 are further sorted into the downstream side blanking sorting station 313.

The blanking sorting stations 313 are respectively arranged at the downstream ends of the sorting conveyor belts 31211 to receive good or defective silicon wafers conveyed by the sorting conveyor belts 31211. This unloading sorting station 313 includes: a second lifting mechanism 3131 and a plurality of material boxes 3132 driven by the second lifting mechanism 3131 to lift.

In which a plurality of magazines 3132 are spaced apart from one another from top to bottom, so that the same station can receive more wafers. The second elevating mechanism 3131 is configured to move the upper or lower magazine 3132 to a position aligned with the downstream end of the sorting conveyor belt 31211 after one magazine 3132 is filled, and to continue to receive sorted silicon wafers.

The mechanism of the second lifting mechanism 3131 is similar to that of the first lifting mechanism 115 described above. It includes: the second lifting motor, the second lifting screw rod, the second lifting slide block and the second shell.

The second lifting screw rod is vertically arranged, and one end of the second lifting screw rod is connected with the second lifting motor and is driven by the second lifting motor to pivot. The second lifting slide block is in threaded connection with the second lifting screw rod and moves in the vertical direction along with the pivoting of the second lifting screw rod. And the movement direction of the second lifting slide block can be controlled by controlling the forward and reverse rotation of the second lifting motor. The second lifting motor, the second lifting screw rod and the second lifting slider are accommodated in the second shell, two side edges of the second lifting slider extend out of gaps on two sides of the second shell, and the extending part of the second lifting slider is connected with a fixing plate where the plurality of material boxes 3132 are located. Thus, when the second lifting motor works, the second lifting motor can drive the plurality of material boxes 3132 to integrally lift.

In addition, a feeding line 320 for conveying the silicon wafers to the discharge sorting module 310 is disposed between the discharge sorting module 310 at the most upstream and the joint inspection apparatus 200. Meanwhile, a transfer box 330 is disposed at the downstream end of the blanking conveying line 312 of the most downstream blanking sorting module 310. The transfer box 330 is used for allowing a silicon wafer to flow into the transfer box 330 for temporary storage when the silicon wafer is not sorted in time, and waiting for the worker to send the silicon wafer into the discharging and sorting device 300 again.

In the process of sorting the silicon wafers, the detection results of the silicon wafers can be stored by a system of the intelligent silicon wafer sorting machine, and the detection results correspond to the IDs of the silicon wafers one to one. Therefore, when the blanking sorting device 300 is in operation, silicon wafers corresponding to the IDs can be sorted into the magazine 3132 of the corresponding blanking sorting station 313 according to the detection result.

In conclusion, the intelligent silicon wafer sorting machine can realize continuous and efficient loading of silicon wafers through the loading device, and fully utilizes the operation time of loading the silicon wafer charging basket. Meanwhile, the detection of a plurality of items of the silicon wafer is finished through the downstream joint detection device, the actual detection requirement of the silicon wafer is fully met, and the quality detection efficiency of the silicon wafer is remarkably improved. Meanwhile, the good products and the defective products of the silicon wafers are sorted and the silicon wafers with different defect types are sorted by the blanking sorting device after the detection is finished, so that the management of the silicon wafers and the analysis and statistics of problems in the production process of the silicon wafers are facilitated.

Claims

1. A joint detection apparatus, comprising: the system comprises a detection flow line and a plurality of detection modules arranged along the detection flow line;

2. The joint detection device of claim 1, wherein any streamline unit comprises: the streamline support, the belt wheel, the transmission belt and the driving motor;

3. The joint detection device according to claim 2, wherein two pulleys are arranged at two ends of the support body on one side of the streamline support, the other four pulleys are arranged below the pulleys at the two ends, two of the four pulleys are arranged adjacently, the other pulley is arranged right below the pulley arranged adjacently, and the driving motor is in transmission connection with the pulley arranged right below.

4. The combined detection apparatus according to any one of claims 1 to 3, wherein the upstream end of the detection flow line is further provided with a pilot mechanism, and the pilot mechanism comprises: the left and right guide units are symmetrically arranged and the adjusting units drive the two guide units to move towards or away from each other;

5. The joint detection device according to claim 1, wherein the left and right edge collapse modules comprise: the two edge breakage detection units are arranged along the conveying direction of the detection streamline in a staggered manner;

6. The joint detection device according to claim 1, wherein the thickness detection module comprises: the thickness detection device comprises a substrate and three groups of thickness detection units arranged on the substrate;

any group of thickness detection units comprises two line laser transmitters which are arranged up and down oppositely, and three groups of thickness detection units are arranged in the left, middle and right directions, wherein two groups of thickness detection units are arranged on one side of the substrate, and the other group of thickness detection units are arranged on the other side of the substrate and are arranged oppositely to the position between the two thickness detection units on the other side;

the line laser transmitter is fixedly connected through a preset hole in the substrate, and the hole which is formed in advance in the substrate is formed according to the direction meeting the detection requirement.

7. The joint detection apparatus of claim 1, wherein the resistivity testing module comprises: the resistivity testing device comprises a resistivity testing bracket, an upper testing probe and a lower testing probe;

8. The joint detection device according to claim 1, wherein the front and rear collapse modules comprise: the device comprises a fixed bracket, a second detection camera and a second light source;

9. The joint detection device of claim 1, wherein the subfissure detection module comprises: the two groups of hidden crack detection units are symmetrically distributed on two sides of the detection flow line;

10. The utility model provides a silicon chip intelligence sorter which is including setting gradually: a feeding device, a detection device and a discharging device, wherein the detection device is a combined detection device according to any one of claims 1-9.