CN218691665U - Double-station full-automatic wafer surface defect visual detection equipment - Google Patents
Double-station full-automatic wafer surface defect visual detection equipment Download PDFInfo
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- CN218691665U CN218691665U CN202222955926.9U CN202222955926U CN218691665U CN 218691665 U CN218691665 U CN 218691665U CN 202222955926 U CN202222955926 U CN 202222955926U CN 218691665 U CN218691665 U CN 218691665U
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Abstract
The utility model discloses a full-automatic wafer surface defect visual inspection equipment in duplex position, include: the device comprises two conveying production lines which are arranged in parallel and used for conveying a material tray, and a feeding unit, a height measuring mechanism, a visual detection mechanism, a laser calibration mechanism, a manual intervention unit and a material receiving unit which are sequentially arranged along the conveying direction of the material tray; the feeding unit and the receiving unit are matched with the conveying assembly line to complete feeding and discharging of the wafers, the height measuring mechanism is used for detecting the positions of the wafers in the material tray and conveying the position information of the wafers to the visual detection mechanism, the visual detection mechanism is used for photographing and detecting whether defective products exist in the wafers in the material tray, and when the visual detection mechanism detects that the wafers are defective products, the laser calibration mechanism forms a cross cursor to mark the positions of the defective wafers. The utility model provides a full-automatic wafer surface defect visual inspection equipment in duplex position to wafer appearance imperfections visual inspection, replaces artifical microscope visual inspection, realizes the surface detection of high efficiency, high accuracy.
Description
Technical Field
The utility model relates to a technical field of semiconductor manufacturing especially relates to a full-automatic wafer surface defect visual inspection equipment in duplex position.
Background
In the semiconductor manufacturing industry, the appearance defect inspection of CMOS wafers and chip products with mirror surfaces in the production process is almost carried out manually by means of a microscope at present, the efficiency and the accuracy of the manual inspection cannot meet the production requirements along with the rapid increase of the yield in two years, the number of missed inspection, secondary pollution and manual turnover damage is correspondingly increased, in addition, as the inspection projects are more, the defect conditions are scattered and difficult to judge, the manual visual inspection can be performed by skilled quality inspection personnel, and the production process is also limited by the shortage of manpower.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the main technical problem who solves provides a full-automatic wafer surface defect visual inspection equipment in duplex position, carries out visual inspection to wafer appearance imperfections, replaces artifical microscope visual inspection, realizes the surface detection of high efficiency, high accuracy.
In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a full-automatic wafer surface defect visual inspection equipment in duplex position, includes: the device comprises two conveying production lines which are arranged in parallel and used for conveying a material tray, and a feeding unit, a height measuring mechanism, a visual detection mechanism, a laser calibration mechanism, a manual intervention unit and a material receiving unit which are sequentially arranged along the conveying direction of the material tray; the feeding unit and the receiving unit are matched with the conveying assembly line to complete feeding and discharging of the wafers, the height measuring mechanism is used for detecting the positions of the wafers in the material tray and conveying the position information of the wafers to the visual detection mechanism, the visual detection mechanism is used for photographing and detecting whether defective products exist in the wafers in the material tray, when the visual detection mechanism detects that the wafers are defective products, the laser calibration mechanism forms the position of a cross cursor used for marking the defective product wafers, and therefore the defective product wafers are removed through the manual intervention unit.
The utility model discloses a preferred embodiment, the material loading unit sets up the bearing that is used for on sending the assembly line support including setting up feed bin, the slip on conveying the assembly line support the tray support of charging tray, be used for promoting the propelling movement cylinder of tray support motion and set up in the first climbing mechanism that is used for jack-up charging tray in last feed bin below, be provided with the tray carrier plate on the conveying assembly line support, be provided with first guide rail on the tray carrier plate, the tray support with first guide rail sliding connection just is connected with the output of propelling movement cylinder.
In a preferred embodiment of the present invention, the tray support plate is a "U" shaped structure, the tray side is provided with a lifting notch matched with the tray support, and the two sets of tray support plates are driven by the pushing cylinder to move in opposite directions to lift the multiple layers of the tray.
In a preferred embodiment of the present invention, the feeding bin is formed by surrounding four "L" shaped vertical plates symmetrically disposed on the support of the conveying line.
The utility model discloses a preferred embodiment, height measurement mechanism including stride locate the height measurement support on the conveying assembly line support, set up two second linear guide on the height measurement support, set up driving rack, step motor and the laser displacement sensor between two second linear guide, be provided with on step motor's the motor shaft with driving rack engaged with drive gear, step motor sets up on the motor mounting panel, the both ends of motor mounting panel are connected with the slider on the second linear guide respectively, the laser displacement sensor sets up the height that is used for detecting the wafer in the charging tray in the side of motor mounting panel.
The utility model discloses a preferred embodiment, visual inspection mechanism is including striding the portal frame of locating two conveying assembly line tops, setting up the sharp module on the portal frame and two sets of visual component mounting panels that are connected with the slider on the sharp module, be provided with camera height adjusting mechanism on the visual component mounting panel, install the CCD camera on the camera height adjusting mechanism, be provided with coaxial light source and the annular light source with CCD camera matched with on the visual component mounting panel.
In a preferred embodiment of the present invention, the laser calibration mechanism includes a mounting bracket disposed between two transmission lines, two arms of the mounting bracket are respectively provided with a laser marking assembly, the laser marking assembly includes a mounting bottom plate disposed on one arm of the mounting bracket, an X-direction motor mounting plate and a Y-direction motor mounting plate vertically disposed on the mounting bottom plate, and an X-direction deflection motor and a Y-direction deflection motor disposed on the mounting bottom plate and perpendicular to each other, an X-direction shaft coupler is locked on a motor shaft of the X-direction deflection motor, the X-direction shaft coupler penetrates through the X-direction motor mounting plate, and the front end of the X-direction shaft coupler extends out of the mounting bottom plate, the X-direction motor mounting plate is provided with an X-direction zero point sensor, and the front end of the X-direction shaft coupler is provided with an X-direction linear laser and an X-direction zero point sensor sheet matched with the X-direction zero point sensor; y has Y to the shaft coupling to locking on the motor shaft of deflection motor, Y runs through Y to motor mounting panel and front end to the shaft coupling and extends to outside the mounting plate, Y is provided with Y to the sensor at zero point on to the motor mounting panel, Y is installed Y to the front end of shaft coupling to a word line laser and with Y to sensor matched with Y to zero point and response piece to zero point
In a preferred embodiment of the present invention, the laser line that X jetted out to a word line laser device with X parallels to the shaft coupling, Y to a word line laser device jetted out laser line with Y parallels to the shaft coupling, X to a word line laser device jetted out laser line with Y forms the position of criss-cross line in order to instruct required processing product in the charging tray to the laser line that a word line laser device jetted out.
In a preferred embodiment of the present invention, a second jacking mechanism for jacking up the tray is disposed below the manual intervention unit.
In a preferred embodiment of the present invention, the material receiving unit includes a lower bin disposed on the conveying assembly line support, four sets of plate-turning support blocks disposed on both sides of the lower bin, and a third jacking mechanism disposed below the lower bin, a rotary seat is disposed on the conveying assembly line support, the rear end of the plate-turning support block is connected with the rotary seat through a rotary shaft, the front end of the plate-turning support block contacts with the assembly line support and extends out of the assembly line support to support the material tray jacked by the third jacking mechanism.
The utility model has the advantages that: the visual inspection can be simultaneously carried out on the appearance defects of the wafers on the two conveying assembly lines, the manual microscope visual inspection is replaced, and the efficient and high-accuracy surface inspection is realized.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:
FIG. 1 is a schematic view of the overall structure of a double-station fully automatic visual inspection apparatus for wafer surface defects of the present invention;
FIG. 2 is a schematic view of the double-station fully automatic visual inspection apparatus for wafer surface defects at another viewing angle;
fig. 3 is a schematic structural diagram of the feeding unit in the present invention;
fig. 4 is a schematic structural diagram of the height measuring mechanism of the present invention;
FIG. 5 is a schematic structural view of the middle vision inspection mechanism of the present invention
Fig. 6 is a schematic structural diagram of the laser calibration mechanism of the present invention;
fig. 7 is a schematic structural diagram of a laser marking assembly according to the present invention;
fig. 8 is a schematic structural diagram of the material receiving unit of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-2, an embodiment of the present invention includes: a double-station full-automatic wafer surface defect visual inspection equipment comprises: the device comprises two conveying pipelines 1 which are arranged in parallel and used for conveying a material tray, and a feeding unit 2, a height measuring mechanism 3, a visual detection mechanism 4, a laser calibration mechanism 5, a manual intervention unit 6 and a material receiving unit 7 which are sequentially arranged along the conveying direction of the material tray; the feeding unit and the receiving unit are matched with the conveying assembly line to complete feeding and discharging of wafers, the height measuring mechanism is used for detecting the positions of the wafers in the material tray and transmitting position information of the wafers to the visual detection mechanism, the visual detection mechanism is used for photographing to detect whether defective products exist in the wafers in the material tray, when the visual detection mechanism detects that the wafers are defective products, the laser calibration mechanism forms a cross-shaped cursor to mark the positions of the defective products, so that the defective products are removed by the manual intervention unit, during operation, the material tray with the wafers is put down from the feeding unit and sequentially passes through the height measuring mechanism, the detection mechanism and the manual intervention area unit, and finally the receiving unit, after the material tray is placed in the feeding unit, the material tray is driven by a linear module in the conveying assembly line to move to the position below the height measuring mechanism, the positions of the wafers in the material tray are detected by the laser displacement sensor, so that the next detection mechanism is convenient to adjust the focal length of a camera, after the camera detects the defective products, the camera forms a cross-shaped defective product marking position by the laser marking mechanism, the manual intervention is adjusted, the feeding unit or the manual intervention conveying assembly line or the manual taking of the chain type conveying assembly line is not only required to explain that the defective products are not required to be conveyed but the conveying assembly line, and the conveying efficiency of the conveying assembly line is not required to be improved.
Referring to fig. 3, the feeding unit 2 includes an upper bin 21 disposed on the conveying pipeline support, a tray support 22 slidably disposed on the conveying pipeline support and used for supporting the material tray, a pushing cylinder 23 for pushing the tray support to move, and a first jacking mechanism 24 disposed below the upper bin and used for jacking the material tray, wherein the upper bin is surrounded by four L-shaped vertical plates symmetrically disposed on the conveying pipeline support, a tray support plate 25 is disposed on the conveying pipeline support, a first guide rail 26 is disposed on the tray support plate, the tray support is slidably connected to the first guide rail and connected to an output end of the pushing cylinder, the tray support plate is of a U-shaped structure, a lifting gap 27 matched with the tray support is disposed on a side surface of the material tray, two sets of tray support plates move in opposite directions under the driving of the pushing cylinder to lift multiple layers of the material tray, when material needs to be placed, the first jacking mechanism jacks up the bottom surface of the material tray to hold the bottom surface of the material tray, the first jacking mechanism descends to a supporting position in the material tray support position, the pushing cylinder drives the tray support bracket to move to push the lifting gap to move to hold other upper material tray, and to clamp the material tray to the lower material tray, and to fix the material tray.
Referring to fig. 4, the height measuring mechanism 3 includes a height measuring support 31 straddling the conveying assembly line support, two second linear guide rails 32 disposed on the height measuring support, a transmission rack 33 disposed between the two second linear guide rails, a stepping motor 34, and a laser displacement sensor 35, a transmission gear engaged with the transmission rack is disposed on a motor shaft of the stepping motor, the stepping motor is disposed on a motor mounting plate 36, two ends of the motor mounting plate are respectively connected to sliders on the second linear guide rails, the laser displacement sensor is disposed on a side of the motor mounting plate and used for detecting a height of a wafer in the material tray, when the material tray moves through a detection range of the height measuring mechanism, the laser displacement sensor can measure a height position of the wafer, and the height position is quickly transmitted to a visual detection mechanism on the next step, so as to facilitate detection of focal length adjustment of the camera.
Referring to fig. 5, the vision inspection mechanism 4 includes a portal frame 41 spanning above the two conveying lines, a linear module 42 disposed on the portal frame, and two sets of vision component mounting plates 43 connected to sliders on the linear module, the vision component mounting plates are provided with a camera height adjusting mechanism 44, the camera height adjusting mechanism is provided with a CCD camera 45, the vision component mounting plates are provided with a coaxial light source 46 and an annular light source 47 matched with the CCD camera, the height adjusting mechanism can adopt a lead screw lifting mechanism or a lifting cylinder in the prior art, the CCD camera adjusts the focal length of the camera by the height adjusting mechanism through data transmitted by the height measuring mechanism, adjusts the camera position by the linear module on the portal frame, detects whether each wafer product has a defect, and transmits the position information of a defective product to the next person working area.
Referring to fig. 6-7, the laser calibration mechanism 5 includes an installation support 501 disposed between two conveying lines, laser marking assemblies are respectively disposed on two arms of the installation support, each laser marking assembly includes an installation bottom plate 503 disposed on one arm of the installation support, an X-direction motor installation plate 504 and a Y-direction motor installation plate 505 vertically disposed on the installation bottom plate, and an X-direction deflection motor 506 and a Y-direction deflection motor 507 vertically disposed on the installation bottom plate, an X-direction coupler 508 is locked on a motor shaft of the X-direction deflection motor, the X-direction coupler penetrates through the X-direction motor installation plate, and the front end of the X-direction coupler extends outside the installation bottom plate, the front end of the X-direction coupler penetrates through the X-direction motor installation plate and extends outside the range of the installation bottom plate, an X-direction in-line laser 509 is mounted at the front end of the X-direction coupler, an X-direction zero-point sensor 510 is disposed on the X-direction motor installation plate, and an X-direction zero point induction sheet 502 matched with the X-direction sensor is further mounted on the X-direction coupler.
The Y-direction shaft coupling 511 is locked on a motor shaft of the Y-direction deflection motor, the Y-direction shaft coupling penetrates through the Y-direction motor mounting plate, the front end of the Y-direction shaft coupling extends out of the range of the mounting base plate, the Y-direction motor mounting plate is provided with a Y-direction zero point sensor 512, the front end of the Y-direction shaft coupling is provided with a Y-direction linear laser 513 and a Y-direction zero point induction sheet 514 matched with the Y-direction zero point sensor, two groups of laser marking assemblies can indicate the position of a product in a material tray by irradiating a group of red cross laser lines on two rows of material trays, the X-direction deflection motor and the Y-direction deflection motor can control the two laser lines to respectively translate along the X direction and the Y direction, the position of the product is indicated by the intersection point of the cross lines, an operator can conveniently and accurately find the product to be processed in hundreds of products, a cross cursor is formed by the laser marking assemblies to mark defective product positions, manual intervention adjustment is carried out, and subsequently adjusted to be continuously transmitted to a material receiving area or manually and directly carried out, the two groups of laser marking assemblies work on the mounting support, and the left and right laser marking assemblies work simultaneously, thereby not affecting each other but improving the work efficiency.
As shown in fig. 8, a second jacking mechanism 61 for jacking up the tray is arranged below the manual intervention unit, when defective products exist in the tray, the tray is jacked up by the second jacking mechanism, a cross cursor is formed by the laser calibration mechanism at the upper part of the tray to indicate the positions of the defective products of the tray, the defective products can be quickly found by manual work for processing, after the defective products are processed by manual work, the second jacking mechanism can fall down, and the tray is continuously transported to the next working area and can be directly taken away by manual work for further processing; the material receiving unit 7 comprises a lower material bin 71 arranged on a conveying assembly line support, four groups of turning plate supporting blocks 72 positioned on two sides of the lower material bin and a third jacking mechanism 73 positioned below the lower material bin, a rotating seat 74 is arranged on the conveying assembly line support, the rear end of each turning plate supporting block is rotatably connected with the rotating seat through a rotating shaft, the front end of each turning plate supporting block is in contact with the assembly line support and extends out of the assembly line support to support a material tray jacked by the third jacking mechanism, when the material tray is conveyed to the material receiving unit, a clamping mechanism is opened, the third jacking mechanism jacks up the material tray, the turning plate supporting blocks can rotate around the rotating shafts in the jacking process, when the jacking height of the material tray exceeds the height of the turning plate supporting blocks, the third jacking mechanism descends, the turning plate supporting blocks fall under the action of gravity and are level with the assembly line support, and the material tray falls on the turning plate supporting blocks at the moment.
It should be noted that, the utility model discloses in first climbing mechanism, second climbing mechanism and third climbing mechanism can choose for use but not only limit to the jacking cylinder.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all of which utilize the equivalent structure or equivalent flow transformation made by the content of the specification of the present invention, or directly or indirectly applied to other related technical fields, all included in the same way in the patent protection scope of the present invention.
Claims (10)
1. The utility model provides a full-automatic wafer surface defect visual inspection equipment in duplex position which characterized in that includes:
the device comprises two conveying production lines which are arranged in parallel and used for conveying a material tray, and a feeding unit, a height measuring mechanism, a visual detection mechanism, a laser calibration mechanism, a manual intervention unit and a material receiving unit which are sequentially arranged along the conveying direction of the material tray; the feeding unit and the receiving unit are matched with the conveying assembly line to complete feeding and discharging of the wafers, the height measuring mechanism is used for detecting the positions of the wafers in the material tray and conveying the position information of the wafers to the visual detection mechanism, the visual detection mechanism is used for photographing and detecting whether defective products exist in the wafers in the material tray, when the visual detection mechanism detects that the wafers are defective products, the laser calibration mechanism forms the position of a cross cursor used for marking the defective product wafers, and therefore the defective product wafers are removed through the manual intervention unit.
2. The double-station full-automatic visual wafer surface defect inspection equipment according to claim 1, wherein the feeding unit comprises a feeding bin arranged on the conveying assembly line support, a tray support arranged on the conveying assembly line support in a sliding manner and used for supporting the material tray, a pushing cylinder used for pushing the tray support to move, and a first jacking mechanism arranged below the feeding bin and used for jacking the material tray, wherein a tray bearing plate is arranged on the conveying assembly line support, a first guide rail is arranged on the tray bearing plate, and the tray support is connected with the first guide rail in a sliding manner and connected with an output end of the pushing cylinder.
3. The double-station full-automatic wafer surface defect visual inspection equipment according to claim 2, wherein the tray bearing plates are in a U-shaped structure, a lifting notch matched with the tray support is formed in the side face of the tray, and the two sets of tray bearing plates move oppositely under the driving of the pushing cylinder to lift the plurality of layers of the trays.
4. The double-station full-automatic visual wafer surface defect inspection equipment according to claim 1, wherein the upper bin is surrounded by four L-shaped vertical plates symmetrically arranged on the conveying assembly line support.
5. The double-station full-automatic visual wafer surface defect detection equipment according to claim 1, wherein the height measuring mechanism comprises a height measuring support arranged on the conveying assembly line support in a spanning manner, two second linear guide rails arranged on the height measuring support, a transmission rack arranged between the two second linear guide rails, a stepping motor and a laser displacement sensor, a transmission gear meshed with the transmission rack is arranged on a motor shaft of the stepping motor, the stepping motor is arranged on a motor mounting plate, two ends of the motor mounting plate are respectively connected with a sliding block on the second linear guide rails, and the laser displacement sensor is arranged on the side edge of the motor mounting plate and used for detecting the height of the wafer in the material tray.
6. The double-station full-automatic wafer surface defect visual inspection equipment according to claim 1, wherein the visual inspection mechanism comprises a portal frame arranged over the two conveying flow lines, a linear module arranged on the portal frame, and two sets of visual component mounting plates connected with sliders on the linear module, a camera height adjusting mechanism is arranged on the visual component mounting plates, a CCD camera is arranged on the camera height adjusting mechanism, and a coaxial light source and an annular light source matched with the CCD camera are arranged on the visual component mounting plates.
7. The double-station full-automatic visual wafer surface defect detection equipment according to claim 1, wherein the laser calibration mechanism comprises a mounting bracket arranged between two conveying flow lines, laser marking assemblies are respectively arranged on two arms of the mounting bracket, each laser marking assembly comprises a mounting base plate arranged on one arm of the mounting bracket, an X-direction motor mounting plate and a Y-direction motor mounting plate which are vertically arranged on the mounting base plate, and an X-direction deflection motor and a Y-direction deflection motor which are vertically arranged on the mounting base plate, an X-direction coupler is locked on a motor shaft of the X-direction deflection motor, the X-direction coupler penetrates through the X-direction motor mounting plate, the front end of the X-direction coupler extends out of the mounting base plate, an X-direction zero point sensor is arranged on the X-direction motor mounting plate, and an X-direction linear laser and an X-direction zero point induction sheet matched with the X-direction zero point sensor are arranged at the front end of the X-direction coupler; y is to locking on the motor shaft of deflection motor to the shaft coupling, Y runs through Y to outside motor mounting panel and front end extend to mounting plate to the shaft coupling, Y is provided with Y to zero sensor on to the motor mounting panel, Y is installed to the front end of shaft coupling Y to a word line laser and with Y to zero sensor matched with Y to sensing piece to zero.
8. The double-station full-automatic visual wafer surface defect inspection device according to claim 7, wherein laser lines emitted from the X-direction linear laser are parallel to the X-direction coupler, laser lines emitted from the Y-direction linear laser are parallel to the Y-direction coupler, and the laser lines emitted from the X-direction linear laser and the laser lines emitted from the Y-direction linear laser form a cross line to indicate the position of a product to be processed in the tray.
9. The double-station full-automatic visual wafer surface defect detection equipment according to claim 1, wherein a second jacking mechanism for jacking up the tray is arranged below the manual intervention unit.
10. The double-station full-automatic visual wafer surface defect inspection equipment according to claim 1, wherein the material receiving unit comprises a lower bin arranged on a conveying assembly line support, four groups of turning plate support blocks positioned on two sides of the lower bin and a third jacking mechanism positioned below the lower bin, a rotating seat is arranged on the conveying assembly line support, the rear end of each turning plate support block is rotatably connected with the rotating seat through a rotating shaft, and the front end of each turning plate support block is in contact with the assembly line support and extends out of the assembly line support to support a material tray jacked up by the third jacking mechanism.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202222955926.9U CN218691665U (en) | 2022-11-07 | 2022-11-07 | Double-station full-automatic wafer surface defect visual detection equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202222955926.9U CN218691665U (en) | 2022-11-07 | 2022-11-07 | Double-station full-automatic wafer surface defect visual detection equipment |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116337876A (en) * | 2023-04-11 | 2023-06-27 | 互喜光电科技(浙江)有限公司 | Automatic-based laser chip detection equipment and detection method thereof |
| CN116753868A (en) * | 2023-05-26 | 2023-09-15 | 常州超音速智能装备有限公司 | Product flatness detection line and application method thereof |
| CN116952959A (en) * | 2023-06-06 | 2023-10-27 | 国网江苏省电力有限公司营销服务中心 | Residential cable terminal detection equipment for power grid construction engineering |
| CN117074427A (en) * | 2023-08-22 | 2023-11-17 | 梅州鼎泰电路板有限公司 | Quick detection device for printed circuit board circuit |
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2022
- 2022-11-07 CN CN202222955926.9U patent/CN218691665U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116337876A (en) * | 2023-04-11 | 2023-06-27 | 互喜光电科技(浙江)有限公司 | Automatic-based laser chip detection equipment and detection method thereof |
| CN116337876B (en) * | 2023-04-11 | 2024-02-09 | 互喜光电科技(浙江)有限公司 | Automatic-based laser chip detection equipment and detection method thereof |
| CN116753868A (en) * | 2023-05-26 | 2023-09-15 | 常州超音速智能装备有限公司 | Product flatness detection line and application method thereof |
| CN116952959A (en) * | 2023-06-06 | 2023-10-27 | 国网江苏省电力有限公司营销服务中心 | Residential cable terminal detection equipment for power grid construction engineering |
| CN116952959B (en) * | 2023-06-06 | 2024-03-15 | 国网江苏省电力有限公司营销服务中心 | Residential cable terminal detection equipment for power grid construction engineering |
| CN117074427A (en) * | 2023-08-22 | 2023-11-17 | 梅州鼎泰电路板有限公司 | Quick detection device for printed circuit board circuit |
| CN117074427B (en) * | 2023-08-22 | 2024-05-03 | 梅州鼎泰电路板有限公司 | Quick detection device for printed circuit board circuit |
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