CN110581096B - LED chip photoelectric and appearance integrated detection equipment - Google Patents
LED chip photoelectric and appearance integrated detection equipment Download PDFInfo
- Publication number
- CN110581096B CN110581096B CN201910924883.8A CN201910924883A CN110581096B CN 110581096 B CN110581096 B CN 110581096B CN 201910924883 A CN201910924883 A CN 201910924883A CN 110581096 B CN110581096 B CN 110581096B
- Authority
- CN
- China
- Prior art keywords
- platform
- aoi
- motor
- linkage shaft
- needle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention discloses LED chip photoelectric and appearance integrated detection equipment, which comprises a wafer robot arm, an AOI detection visual system, an AOI detection platform, a magazine, a machine, a probe platform and a probe moving platform, wherein the wafer robot arm is connected with the AOI detection visual system; wherein: the magazine is fixed on the material loading and unloading place area of board, installs wafer robotic arm, AOI detection vision system, AOI testing platform, needle testing moving platform on the board. The invention has the advantages that: the AOI appearance detection platform and the photoelectric property test platform can be connected by using a wafer robot arm, so that the automatic transmission purpose between the two platforms is realized; in addition, the CCD camera and the laser range finder are added to the spot measurement platform to realize accurate alignment imaging, and the automatic needle adjustment device is used for carrying out servo control compensation on the XYZ axes, so that the aim of automatic needle adjustment is fulfilled, intermediate links are reduced, the operation efficiency is improved, the labor cost is saved, and meanwhile, the abnormal situation caused by personnel in the production process is reduced.
Description
Technical Field
The invention relates to the technical field of automatic detection equipment for LED chips, in particular to integrated detection equipment for the photoelectric property and the appearance of an LED chip.
Background
In the LED chip production industry, chip photoelectric detection and appearance detection are carried out in 2 independent links, the middle links are all carried by personnel to realize loading and unloading, and photoelectric detection equipment needs personnel to manually adjust needles before starting, so that more manpower is consumed, the efficiency is low, the production efficiency of enterprises is low, and the production cost of the enterprises is increased.
Disclosure of Invention
The invention aims to provide the photoelectric and appearance integrated detection equipment for the LED chip, which can connect an AOI appearance detection platform with a photoelectric test platform by using a wafer robot arm, so that the automatic transmission purpose between the two platforms is realized; in addition, the CCD camera and the laser range finder are added to the spot measurement platform to realize accurate alignment imaging, and the automatic needle adjustment device is used for carrying out servo control compensation on the XYZ axes, so that the aim of automatic needle adjustment is fulfilled, intermediate links are reduced, the operation efficiency is improved, the labor cost is saved, and meanwhile, the abnormal situation caused by personnel in the production process is reduced.
In order to achieve the purpose, the invention provides the following technical scheme: the integrated detection equipment for the photoelectricity and the appearance of the LED chip comprises a wafer robot arm, an AOI detection visual system, an AOI detection platform, a material box, a machine table, a probe platform and a probe moving platform; wherein: the material box is fixed on a loading and unloading placement area of a machine table, and a wafer robot arm, an AOI detection visual system, an AOI detection platform, a probe platform and a probe moving platform are arranged on the machine table;
the wafer robot arm consists of a clamping jaw I, a clamping jaw II, a linkage shaft III, a linkage shaft IV, an induction device and a cavity, wherein the linkage shaft IV is connected with the linkage shaft II, the linkage shaft III is connected with the linkage shaft I, the linkage shaft IV and the linkage shaft III are arranged in the cavity, the induction device is connected with the linkage shaft I and the linkage shaft II, the clamping jaw II is arranged at the front end of the linkage shaft I, and the clamping jaw I is arranged at the front end of the linkage shaft II;
the magazine comprises a magazine handle, a magazine and a sheet source placing device, wherein the magazine handle is arranged above the magazine, and the sheet source placing device is arranged in the magazine.
Further, the AOI detection visual system and the AOI detection platform form an AOI detection platform, and the AOI detection platform comprises marble, a main detection camera, a main detection lens, a re-detection camera, a re-detection lens, a fixed bracket, a focusing lens, a customized light source and a light source; wherein: the marble is fixed on the AOI testing platform, the main inspection camera is fixed on the marble, the main inspection lens is installed below the main inspection camera, the main inspection lens is connected with the customized light source, the recheck camera is installed on the upper portion of the fixed support, the recheck camera is connected with the recheck lens, the lower portion of the fixed support is connected with the focusing lens, and the focusing lens is connected with the light source.
Further, the measuring needle platform and the measuring needle moving platform form a spot measuring platform, and the spot measuring platform comprises a first signal computing device, a first sensor, a track, a nondestructive needle cleaning device, a microscope, an integrating sphere, a CCD camera vision component, a laser range finder, a second sensor, a first motor, a rotating shaft, a second track, a second motor, a third sensor, an automatic needle adjusting device, a fourth sensor, an active edge finder, a fifth sensor and a sixth sensor; wherein: the left side of the needle measurement moving platform is provided with a motor I, the right side of the motor I is connected with a rail II, a rotating shaft is arranged above the rail II, the right side of the rail II is connected with a motor II, the rotating shaft is fixed on the rail II, the left side and the right side of the needle measurement platform are respectively provided with a signal computing device I and a signal computing device, the signal computing devices I and the signal computing devices are connected with an integrating sphere together to collect data, a microscope is connected with the integrating sphere, a laser range finder is connected below a CCD camera vision component and fixed on the rail, the left side of the needle measurement platform is fixed with an inductor five and an inductor six, the inductor five and the inductor six are connected with the inductor II, the right side of the needle measurement platform is fixed with an inductor I and an inductor four, the inductor four is connected with the inductor three, and the inductor four is connected with an automatic needle adjustment device which is connected with an active edge finder.
Wherein, the marble below is provided with AOI moving platform.
Further, AOI moving platform includes belt, motor one, track one, motor two, carrier, track two, its characterized in that: the motor I is installed to track II one end, installs track I on the track II, and motor I passes through belt drive track I and moves on track II, and track one end installs motor II, installs the microscope carrier on the track I, and motor II passes through belt drive microscope carrier and moves on track I, through motor I, motor II drive, realizes the horizontal migration of microscope carrier in X, Y orientation.
Preferably, more than 5 material boxes are arranged in the loading and unloading placement area of the machine table.
Preferably, the material box is placed in a mode of encircling the wafer robot arm, so that bilateral operation can be achieved without stopping.
Preferably, the magazine can hold 25 sheet sources.
Compared with the prior art, the invention provides the integrated detection equipment for the photoelectricity and the appearance of the LED chip, which has the following beneficial effects: the AOI appearance detection platform and the photoelectric property test platform can be connected by using a wafer robot arm, so that the automatic transmission purpose between the two platforms is realized; in addition, a CCD camera and a laser range finder are added to the spot measurement platform to realize accurate alignment imaging, and then the XYZ axes are subjected to servo control compensation through an XYZ automatic needle adjustment device, so that the aim of automatic needle adjustment is fulfilled, intermediate links are reduced, the working efficiency is improved, the labor cost is saved, and meanwhile, the abnormal situation caused by personnel in the production process is reduced.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the present invention.
Fig. 2 is a top view of the present invention.
FIG. 3 is a schematic view of a wafer robot in accordance with the present invention.
Fig. 4 is a schematic structural diagram of a film-expanding feeding tool in the invention.
FIG. 5 is a schematic view of a magazine according to the present invention.
FIG. 6 is a schematic diagram of the structure of the spot measurement platform according to the present invention.
FIG. 7 is a schematic structural diagram of an AOI detection platform according to the present invention.
Fig. 8 is a schematic structural diagram of an AOI mobile platform according to the present invention.
Reference numerals:
wafer robot arm 1, AOI inspection vision system 2, AOI inspection stage 3, magazine 4, stage 5, needle stage 6, needle movement stage 7, jaw one 8, jaw two 9, joint shaft one 10, joint shaft two 11, joint shaft three 12, joint shaft four 13, sensing device 14, cavity 15, magazine handle 16, magazine 17, placement sheet source device 18, signal computation device one 19, signal computation device 20, sensor one 21, track 22, non-destructive needle cleaning device 23, microscope 24, integrating sphere 25, CCD camera vision assembly 26, laser rangefinder 27, sensor two 28, motor one 29, rotation shaft 30, track two 31, motor two 32, sensor three 33, automatic needle adjustment device 34, sensor four 35, active edge finder 36, sensor five 37, sensor six 38, marble 39, primary inspection lens 40, primary inspection camera 41, secondary inspection camera 42, secondary inspection lens 44, fixed bracket 43, lens 45, AOI movement stage 46, track 47, motor one 48, motor two 48, carrier two 52, custom made light source 52, and custom made track two light sources 52.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
1, as shown in fig. 1-3, an integrated detection device for photoelectricity and appearance of an LED chip includes a wafer robot arm 1, an AOI detection vision system 2, an AOI detection platform 3, a magazine 4, a machine 5, a probe platform 6, and a probe moving platform 7; wherein: the magazine 4 is fixed on a loading and unloading placement area of the machine 5, and the machine 5 is provided with a wafer robot arm 1, an AOI detection vision system 2, an AOI detection platform 3, a probe platform 6 and a probe moving platform 7.
As shown in fig. 4, the wafer robot arm 1 is composed of a first clamping jaw 8, a second clamping jaw 9, a first linkage shaft 10, a second linkage shaft 11, a third linkage shaft 12, a fourth linkage shaft 13, a sensing device 14 and a cavity 15, wherein the fourth linkage shaft 13 is connected with the second linkage shaft 11, the third linkage shaft 12 is connected with the first linkage shaft 10, the fourth linkage shaft 13 and the third linkage shaft 12 are arranged in the cavity 15, the sensing device 14 is connected with the first linkage shaft 10 and the second linkage shaft 11, the second clamping jaw 9 is arranged at the front end of the first linkage shaft 10, and the first clamping jaw 8 is arranged at the front end of the second linkage shaft 11. The clamping jaw I8 and the clamping jaw II 9 grab a film source through each linkage shaft, are not mutually influenced, and are mutually matched and operated alternately, so that the working efficiency is improved; meanwhile, an induction device 14 is arranged on the wafer robot arm 1 and is used for detecting whether lamination and inclined sheets exist in the material box 4 before picking and placing the sheets.
As shown in fig. 5, the magazine 4 is composed of a magazine handle 16, a magazine 17, and a set sheet source device 18, wherein the magazine handle 16 is disposed above the magazine 17, and the set sheet source device 18 is installed in the magazine 17.
As shown in fig. 7, the AOI inspection vision system 2 and the AOI inspection platform 3 form an AOI inspection platform, which includes a marble 39, a main inspection camera 41, a main inspection lens 40, a review inspection camera 42, a review inspection lens 44, a fixing bracket 43, a focusing lens 45, a customized light source 53, and a light source 54; wherein: marble 39 is fixed on AOI testing platform 3, and main camera 41 is fixed on marble 39, and main camera 41 installs main camera lens 40 below, and main camera lens 40 is connected with customization light source 53, and the reinspection camera 42 is installed to fixed bolster 43 upper portion, and reinspection camera 42 is connected with reinspection camera lens 44, and fixed bolster 43 lower part is connected with focusing lens 45, and focusing lens 45 is connected with light source 54. The AOI detection platform adopts an advanced customized light source 53, a high-speed high-resolution main detection camera 41 and a double detection camera 42, so that appearance flaws of a chip can be clearly identified, and the high-resolution main detection lens 40 and the double detection lens 44 with different multiplying powers are configured, so that flaw sizes of about 1.5um can be detected at minimum; the AOI detection visual system 2 takes marble 39 as a framework, is stable and vibration-free, and is more beneficial to high-speed image acquisition.
As shown in fig. 5, the stylus platform 6 and the stylus moving platform 7 form a pointing platform, and the pointing platform comprises a first signal computing device 19, a second signal computing device 20, a first sensor 21, a track 22, a nondestructive needle cleaning device 23, a microscope 24, an integrating sphere 25, a CCD camera vision component 26, a laser range finder 27, a second sensor 28, a first motor 29, a rotating shaft 30, a second track 31, a second motor 32, a third sensor 33, an automatic needle adjusting device 34, a fourth sensor 35, an active edge finder 36, a fifth sensor 37 and a sixth sensor 38; wherein: the motor I29 is arranged below the left side of the stylus moving platform 7, the right side of the motor I29 is connected with the track II 31, the rotating shaft 30 is arranged above the track II 31, the right side of the track II 31 is connected with the motor II 32, the rotating shaft 30 is fixed on the track II 31, the left side and the right side of the stylus platform 6 are respectively provided with the signal computing device I19 and the signal computing device 20, the signal computing device I19 and the signal computing device 20 are jointly connected with the integrating sphere 25 to collect data, the microscope 24 is connected with the integrating sphere 25, the laser range finder 27 is connected below the CCD camera vision component 26 and is fixed on the track 22, the sensor V37 and the sensor V37 are fixed on the left side of the stylus platform 6, the sensor V38 is connected with the sensor II 28, the sensor I21 and the sensor V35 are fixed on the right side of the stylus platform 6, the sensor I21 and the sensor V35 are connected with the sensor V33, the sensor V35 is connected with the automatic stylus adjusting device 34, and the automatic stylus adjusting device 34 is connected with the active type edge finder 36. The spot measurement platform determines the Z-direction position through the laser range finder 27, the CCD camera vision component 26 automatically focuses to realize accurate alignment imaging, and then the automatic needle adjusting device 34 performs servo control compensation on the shaft to finally realize the automatic needle adjusting function; an active edge finder 36 is configured to be connected with the automatic needle adjusting device 34 and used for controlling needle pressure to be stable, facilitating rapid needle adjustment, and the needle measuring platform 6 is loaded with the nondestructive needle cleaning device 23 and used for cleaning needles in real time in the operation process, so that the influence of dirt on the probes is avoided, and the safety and the efficiency are high.
As shown in fig. 8, an AOI moving platform 46 is disposed below the marble 39, and the AOI moving platform 46 includes a belt 47, a first motor 48, a first rail 49, a second motor 50, a stage 51, and a second rail 52, wherein: one end of the second rail 52 is provided with a first motor 48, the second rail 52 is provided with a first rail 49, the first motor 48 drives the first rail 49 to move on the second rail 52 through a belt 47, one end of the first rail 49 is provided with a second motor 50, the first rail 49 is provided with a carrying platform 51, the second motor 50 drives the carrying platform 51 to move on the first rail 49 through the belt 47, and the first motor 48 and the second motor 50 drive the carrying platform 51 to horizontally move in the X, Y direction.
More than 5 material boxes 4 are placed in the loading and unloading placement area of the machine table 5, so that the material changing frequency is reduced, and frequent loading and unloading is avoided.
The material box 4 is placed in a mode of surrounding the wafer robot arm 1, so that bilateral operation can be achieved without stopping.
The magazine 4 can accommodate 25 sheet sources, reduces the frequency of manual feeding, and can manage a plurality of machines simultaneously.
The specific working principle of the invention is as follows:
the invention puts the loaded material box 4 on the loading and unloading placing area of the machine 5 by a robot, the first clamping jaw 8 clamps the film source to the AOI detecting platform 3, the first motor 48 and the second motor 50 enable the workbench to move, meanwhile, the AOI detecting vision system 2 photographs and identifies the appearance flaws of the chip by customizing the light source 53, the high-speed high-resolution main detecting camera 41, the rechecking camera 42, the main detecting lens 40 and the rechecking lens 44, after the detection is finished, the first clamping jaw 8 clamps the film source to be placed on the point detecting platform, the second clamping jaw 9 clamps the other film to be placed on the AOI detecting platform 3 to photograph, the film source placed on the point detecting platform moves under the actions of the first motor 29 and the second motor 32, the point measurement platform is provided with a nondestructive needle cleaning device 23, an active edge finder 36, an automatic needle adjusting device 34, a laser distance meter 27 and a CCD camera vision component 26, the Z-direction position is determined through the laser distance meter 27, the CCD camera vision component 26 automatically focuses, automatic needle adjusting and automatic thimble cleaning are realized through the automatic devices, the pointed data are collected through an integrating sphere 25, a conveying signal computing device I19 and a signal computing device 20, analyzed and tidied and transmitted, after the point measurement is finished, a clamping jaw I8 clamps a sheet source to be placed in a magazine 4, a clamping jaw II 9 clamps an AOI detection sheet source to be placed in the electric measurement platform to be point measured, and a clamping jaw I8 continues the next operation, so that the operation is circulated.
According to the invention, the AOI appearance detection platform is connected with the photoelectric testing platform by using the wafer robot arm, so that the automatic transmission purpose between the two platforms is realized; in addition, the CCD camera and the laser range finder are added to the spot measurement platform to realize accurate alignment imaging, and the automatic needle adjustment device is used for carrying out servo control compensation on the XYZ axes, so that the aim of automatic needle adjustment is fulfilled, intermediate links are reduced, the operation efficiency is improved, the labor cost is saved, and meanwhile, the abnormal situation caused by personnel in the production process is reduced.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The integrated detection equipment for the photoelectricity and the appearance of the LED chip comprises a wafer robot arm (1), an AOI detection visual system (2), an AOI detection platform (3), a material box (4), a machine table (5), a measuring needle platform (6) and a measuring needle moving platform (7); the method is characterized in that: the material box (4) is fixed on a loading and unloading placement area of the machine table (5), and the machine table (5) is provided with a wafer robot arm (1), an AOI detection visual system (2), an AOI detection platform (3), a probe platform (6) and a probe moving platform (7);
the wafer robot arm (1) is composed of a clamping jaw I (8), a clamping jaw II (9), a linkage shaft I (10), a linkage shaft II (11), a linkage shaft III (12), a linkage shaft IV (13), an induction device (14) and a cavity (15), wherein the linkage shaft IV (13) is connected with the linkage shaft II (11), the linkage shaft III (12) is connected with the linkage shaft I (10), the linkage shaft IV (13) and the linkage shaft III (12) are arranged in the cavity (15), the induction device (14) is connected with the linkage shaft I (10) and the linkage shaft II (11), the clamping jaw II (9) is arranged at the front end of the linkage shaft I (10), and the clamping jaw I (8) is arranged at the front end of the linkage shaft II (11);
the magazine (4) is composed of a magazine handle (16), a magazine (17) and a sheet source placing device (18), wherein the magazine handle (16) is arranged above the magazine (17), and the sheet source placing device (18) is arranged in the magazine (17);
the point measurement platform is composed of a first measurement needle platform (6) and a second measurement needle moving platform (7), and comprises a first signal calculation device (19), a first signal calculation device (20), a first sensor (21), a track (22), a nondestructive needle cleaning device (23), a microscope (24), an integrating sphere (25), a CCD camera vision component (26), a laser range finder (27), a second sensor (28), a first motor (29), a rotating shaft (30), a second track (31), a second motor (32), a third sensor (33), an automatic needle adjusting device (34), a fourth sensor (35), an active edge finder (36), a fifth sensor (37) and a sixth sensor (38); the method is characterized in that: a motor I (29) is arranged below the left side of the needle measurement moving platform (7), the right side of the motor I (29) is connected with a track II (31), a rotating shaft (30) is arranged above the track II (31), the right side of the track II (31) is connected with a motor II (32), the rotating shaft (30) is fixed on the track II (31), the left side and the right side of the needle measurement platform (6) are respectively provided with a signal computing device (19) and a signal computing device (20), the signal computing devices (19) and the signal computing devices (20) are jointly connected with an integrating sphere (25) to collect data, a microscope (24) is connected with the integrating sphere (25), a laser range finder (27) is connected below a CCD camera vision component (26), and fixed on track (22), needle testing platform (6) left side is fixed with inductor five (37), inductor six (38), and inductor five (37), inductor six (38) are connected with inductor two (28), and needle testing platform (6) right side is fixed with inductor one (21), inductor four (35), and inductor one (21), inductor four (35) are connected with inductor three (33), and inductor four (35) are connected with automatic needle regulating device (34), and automatic needle regulating device (34) are connected with initiative type finder (36).
2. The integrated detection device for photoelectricity and appearance of an LED chip according to claim 1, wherein the AOI detection vision system (2) and the AOI detection platform (3) form an AOI detection platform, and the AOI detection platform comprises marble (39), a main camera (41), a main camera lens (40), a recheck camera (42), a recheck lens (44), a fixing bracket (43), a focusing lens (45), a customized light source (53) and a light source (54): the method is characterized in that: marble (39) is fixed in on AOI testing platform (3), and main camera (41) are fixed in on marble (39), and main camera (40) are installed to main camera (41) below, and main camera (40) are connected with customization light source (53), and reinspection camera (42) are installed on fixed bolster (43) upper portion, and reinspection camera (42) are connected with reinspection camera (44), and fixed bolster (43) lower part is connected with focusing lens (45), and focusing lens (45) are connected with light source (54).
3. The integrated detection device for photoelectricity and appearance of an LED chip according to claim 2, wherein: an AOI moving platform (46) is arranged below the marble (39).
4. The integrated LED chip photoelectric and appearance detection apparatus according to claim 3, wherein said AOI mobile platform (46) comprises a belt (47), a first motor (48), a first rail (49), a second motor (50), a carrier (51), and a second rail (52), and the integrated LED chip photoelectric and appearance detection apparatus is characterized in that: a first motor (48) is arranged at one end of a second rail (52), a first rail (49) is arranged on the second rail (52), the first motor (48) drives the first rail (49) to move on the second rail (52) through a belt (47), a second motor (50) is arranged at one end of the first rail (49), a carrier (51) is arranged on the first rail (49), the second motor (50) drives the carrier (51) to move on the first rail (49) through the belt (47), and horizontal movement of the carrier (51) in the X, Y direction is achieved through the first motor (48) and the second motor (50).
5. The integrated detection device for photoelectricity and appearance of an LED chip according to claim 1, wherein: more than 5 material boxes (4) are arranged in the loading and unloading placement area of the machine table (5).
6. The integrated detection device for photoelectricity and appearance of an LED chip according to claim 1, wherein: the material boxes (4) are placed in a mode of encircling the wafer robot arm (1), so that bilateral operation can be achieved without stopping.
7. The integrated detection device for photoelectricity and appearance of an LED chip according to claim 1, wherein: the magazine (4) can accommodate 25 sheet sources.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910924883.8A CN110581096B (en) | 2019-09-27 | 2019-09-27 | LED chip photoelectric and appearance integrated detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910924883.8A CN110581096B (en) | 2019-09-27 | 2019-09-27 | LED chip photoelectric and appearance integrated detection equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110581096A CN110581096A (en) | 2019-12-17 |
| CN110581096B true CN110581096B (en) | 2023-09-05 |
Family
ID=68813989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910924883.8A Active CN110581096B (en) | 2019-09-27 | 2019-09-27 | LED chip photoelectric and appearance integrated detection equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110581096B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113639859A (en) * | 2021-08-25 | 2021-11-12 | 扬州和铵半导体有限公司 | Photoelectric testing device for LED packaging |
| CN115346901B (en) * | 2022-10-17 | 2023-02-03 | 江西兆驰半导体有限公司 | LED wafer sorting method |
| CN116203043B (en) * | 2023-05-05 | 2023-07-25 | 武汉精立电子技术有限公司 | LED chip integrated detection method and device |
| CN116482521B (en) * | 2023-06-25 | 2023-10-20 | 江西兆驰半导体有限公司 | Chip testing method and system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005049131A (en) * | 2003-07-30 | 2005-02-24 | Seiwa Electric Mfg Co Ltd | Led chip optical characteristic measuring instrument and led chip optical characteristic measuring method |
| CN101515016A (en) * | 2008-02-22 | 2009-08-26 | 东京毅力科创株式会社 | Probe apparatus, probing method, and storage medium |
| CN102980742A (en) * | 2011-08-25 | 2013-03-20 | 日本麦可罗尼克斯股份有限公司 | An inspection apparatus and inspection method for light emitting devices |
| CN104600009A (en) * | 2015-01-16 | 2015-05-06 | 圆融光电科技有限公司 | Chip measuring sorting system and method |
| CN206563647U (en) * | 2016-12-06 | 2017-10-17 | 大西电子仪器（昆山）有限公司 | A kind of LED ATEs based on integrating sphere |
| CN207464519U (en) * | 2017-11-01 | 2018-06-08 | 珠海市梅木自动化科技有限公司 | A kind of RFID automatic weldings detection machine |
-
2019
- 2019-09-27 CN CN201910924883.8A patent/CN110581096B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005049131A (en) * | 2003-07-30 | 2005-02-24 | Seiwa Electric Mfg Co Ltd | Led chip optical characteristic measuring instrument and led chip optical characteristic measuring method |
| CN101515016A (en) * | 2008-02-22 | 2009-08-26 | 东京毅力科创株式会社 | Probe apparatus, probing method, and storage medium |
| CN102980742A (en) * | 2011-08-25 | 2013-03-20 | 日本麦可罗尼克斯股份有限公司 | An inspection apparatus and inspection method for light emitting devices |
| CN104600009A (en) * | 2015-01-16 | 2015-05-06 | 圆融光电科技有限公司 | Chip measuring sorting system and method |
| CN206563647U (en) * | 2016-12-06 | 2017-10-17 | 大西电子仪器（昆山）有限公司 | A kind of LED ATEs based on integrating sphere |
| CN207464519U (en) * | 2017-11-01 | 2018-06-08 | 珠海市梅木自动化科技有限公司 | A kind of RFID automatic weldings detection machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110581096A (en) | 2019-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110581096B (en) | LED chip photoelectric and appearance integrated detection equipment | |
| CN201787926U (en) | On-line solder paste printing detection device | |
| CN209205824U (en) | MTF applied to camera lens production detects production line | |
| CN107228861A (en) | The defect detecting device of liquid crystal panel | |
| CN105293070A (en) | Equipment and method for detecting weld joints of turbine components | |
| CN111069078B (en) | Multifunctional visual detection platform | |
| CN209589873U (en) | A kind of LED chip module defect detecting device | |
| CN103175847A (en) | Grating surface blemish detection device | |
| CN109254014A (en) | Camera sensing device chip tester structure and method | |
| CN109813718A (en) | A kind of LED chip module defect detecting device and method | |
| CN205222060U (en) | Turbine part welding seam check out test set | |
| WO2017002369A1 (en) | Electronic component transfer device and electronic component inspection device | |
| CN203758470U (en) | Flatness detection apparatus for cell phone shielding cover | |
| CN217237794U (en) | Diversified outward appearance detection device | |
| TW201715221A (en) | An optical inspecting apparatus with multi-axial robotic arm | |
| CN206990465U (en) | The defects of liquid crystal panel detection means | |
| CN106018415A (en) | System for detecting quality of small parts based on micro-vision | |
| CN111007150B (en) | Online ultrasonic imaging detection device | |
| CN210720188U (en) | Rapid automatic optical detection system | |
| CN109319477B (en) | Lifting type high-speed material taking and discharging platform and working method | |
| CN214201149U (en) | Gantry dual-drive AOI detection equipment | |
| CN211825732U (en) | Non-contact film pressing backlight panel detection device and backlight panel automatic detection line | |
| CN209182254U (en) | Optical detection device | |
| JPH11160036A (en) | Method and apparatus for automatic inspection of article with complicated shape | |
| JPS63102294A (en) | Electronic component tester |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |