CN110581096A - Photoelectric property and appearance integrated detection equipment for LED chip - Google Patents
Photoelectric property and appearance integrated detection equipment for LED chip Download PDFInfo
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- CN110581096A CN110581096A CN201910924883.8A CN201910924883A CN110581096A CN 110581096 A CN110581096 A CN 110581096A CN 201910924883 A CN201910924883 A CN 201910924883A CN 110581096 A CN110581096 A CN 110581096A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention discloses a photoelectric property and appearance integrated detection device for an LED chip, which comprises a wafer robot arm, an AOI detection visual system, an AOI detection platform, a material box, a machine table, a probe platform and a probe moving platform, wherein the wafer robot arm is connected with the AOI detection visual system through a cable; wherein: the material box is fixed on a loading and unloading placing area of the machine table, and a wafer robot arm, an AOI detection visual system, an AOI detection platform, a probe platform and a probe moving platform are arranged on the machine table. The invention has the advantages that: the AOI appearance detection platform and the photoelectric test platform can be connected by using a wafer robot arm, so that the aim of automatic transmission between the two platforms is fulfilled; in addition, the point measurement platform is additionally provided with the CCD camera and the laser range finder to realize accurate alignment imaging, and then the automatic needle adjusting device is used for carrying out servo control compensation on XYZ axes, so that the purpose of automatically adjusting needles is achieved, intermediate links are reduced, the operation efficiency is improved, the labor cost is saved, and the abnormal conditions caused by personnel in the production process are reduced.
Description
Technical Field
The invention relates to the technical field of LED chip automatic detection equipment, in particular to LED chip photoelectric property and appearance integrated detection equipment.
background
In the LED chip production industry, the photoelectric detection and the appearance detection of the chip are carried out by 2 independent links, the middle link is carried by personnel to realize feeding and discharging, and the photoelectric detection equipment needs personnel to carry out manual pin adjustment before starting, consumes more manpower and has low efficiency, so that the production efficiency of enterprises is low, and the production cost of the enterprises is increased.
disclosure of Invention
The invention aims to provide LED chip photoelectric property and appearance integrated detection equipment, which can connect an AOI appearance detection platform with a photoelectric property test platform by using a wafer robot arm, and realizes the purpose of automatic transmission between the two platforms; in addition, the point measurement platform is additionally provided with the CCD camera and the laser range finder to realize accurate alignment imaging, and then the automatic needle adjusting device is used for carrying out servo control compensation on XYZ axes, so that the purpose of automatically adjusting needles is achieved, intermediate links are reduced, the operation efficiency is improved, the labor cost is saved, and the abnormal conditions caused by personnel in the production process are reduced.
in order to realize the purpose, the invention provides the following technical scheme: a photoelectric property and appearance integrated detection device for an LED chip comprises a wafer robot arm, an AOI detection visual system, an AOI detection platform, a material box, a machine table, a probe platform and a probe moving platform; wherein: the material box is fixed on a loading and unloading placing area of a machine table, and a wafer robot arm, an AOI detection visual system, an AOI detection platform, a probe platform and a probe moving platform are arranged on the machine table;
The wafer robot arm is composed of a first clamping jaw, a second clamping jaw, a first linkage shaft, a second linkage shaft, a third linkage shaft, a fourth linkage shaft, a sensing device and a cavity, wherein the fourth linkage shaft is connected with the second linkage shaft, the third linkage shaft is connected with the first linkage shaft, the fourth linkage shaft and the third linkage shaft are arranged in the cavity, the sensing device is connected with the first linkage shaft and the second linkage shaft, the second clamping jaw is installed at the front end of the first linkage shaft, and the first clamping jaw is installed at the front end of the second linkage shaft;
The material box comprises a material box handle, a material box and a sheet source placing device, wherein the material box handle is arranged above the material box, and the sheet source placing device is arranged in the material box.
Furthermore, the AOI detection visual system and the AOI detection platform form an AOI detection platform, and the AOI detection platform comprises a marble, a main inspection camera, a main inspection lens, a rechecking camera, a rechecking lens, a fixed support, a focusing lens, a customized light source and a light source; wherein: the marble is fixed in on the AOI testing platform, on the camera was fixed in the marble was examined to the owner, the owner was examined the camera below and is installed main camera lens of examining, and main camera lens of examining is connected with the customization light source, and the rechecking camera is installed on fixed bolster upper portion, and the rechecking camera is connected with the rechecking camera lens, and the fixed bolster sub-unit connection has the focusing lens, and the focusing lens is connected with the light source.
Furthermore, the point measurement platform consists of a probe platform and a probe moving platform and comprises a signal computing device I, a signal computing device, a sensor I, a track, a nondestructive probe cleaning device, a microscope, an integrating sphere, a CCD camera vision component, a laser range finder, a sensor II, a motor I, a rotating shaft, a track II, a motor II, a sensor III, an automatic probe adjusting device, a sensor IV, an active edge finder, a sensor V and a sensor VI; wherein: the left side and the right side of the probe moving platform are respectively provided with a first motor, the right side of the first motor is connected with a second track, a rotating shaft is arranged above the second track, the right side of the second track is connected with a second motor, the rotating shaft is fixed on the second track, the left side and the right side of the probe platform are respectively provided with a first signal computing device and a second signal computing device, the first signal computing device and the second signal computing device are jointly connected with an integrating sphere to collect data, a microscope is connected with the integrating sphere, a laser range finder is connected below a CCD camera vision assembly and is fixed on the track, the left side of the probe platform is fixedly provided with a fifth sensor and a sixth sensor, the fifth sensor and the sixth sensor are connected with the second sensor, the first sensor and the fourth sensor are fixedly arranged on the right side of the probe platform, the first sensor and the fourth sensor are connected with the third sensor, the fourth sensor is connected with an automatic.
Wherein, the marble below is provided with AOI moving platform.
Further, AOI mobile platform includes belt, motor one, track one, motor two, microscope carrier, track two, its characterized in that: the first motor is installed at one end of the second rail, the first rail is installed on the second rail, the first motor drives the first rail to move on the second rail through a belt, the second motor is installed at one end of the first rail, the carrying platform is installed on the first rail, the second motor drives the carrying platform to move on the first rail through the belt, and horizontal movement of the carrying platform in the X, Y direction is achieved through driving of the first motor and the second motor.
Preferably, more than 5 material boxes are placed in the feeding and discharging placement area of the machine table.
Preferably, the material box is placed in a mode of surrounding a wafer robot arm, so that bilateral operation can be achieved without stopping.
Preferably, the magazine can accommodate 25 sheet sources.
Compared with the prior art, the invention provides the detection equipment for integrating the photoelectric property and the appearance of the LED chip, which has the following beneficial effects: the AOI appearance detection platform and the photoelectric test platform can be connected by using a wafer robot arm, so that the aim of automatic transmission between the two platforms is fulfilled; in addition, the point measurement platform is additionally provided with a CCD camera and a laser range finder to realize accurate alignment imaging, and then servo control compensation is carried out on XYZ axes through an XYZ automatic pin adjusting device, so that the purpose of automatically adjusting pins is achieved, intermediate links are reduced, the operation efficiency is improved, the labor cost is saved, and abnormal conditions caused by personnel in the production process are reduced.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a top view of the present invention.
FIG. 3 is a schematic view of a wafer robot according to the present invention.
Fig. 4 is a schematic structural diagram of the film expanding and feeding tool in the invention.
fig. 5 is a schematic structural view of the magazine of the present invention.
FIG. 6 is a schematic structural diagram of the spot measurement platform according to the present invention.
FIG. 7 is a schematic structural diagram of an AOI inspection platform according to the present invention.
FIG. 8 is a schematic structural diagram of an AOI mobile platform according to the present invention.
Reference numerals:
The system comprises a wafer robot arm 1, an AOI detection visual system 2, an AOI detection platform 3, a material box 4, a machine table 5, a probe platform 6, a probe moving platform 7, a first clamping jaw 8, a second clamping jaw 9, a first linkage shaft 10, a second linkage shaft 11, a third linkage shaft 12, a fourth linkage shaft 13, a sensing device 14, a cavity 15, a material box handle 16, a material box 17, a sheet source placing device 18, a signal computing device 19, a signal computing device 20, a first sensor 21, a rail 22, a nondestructive probe cleaning device 23, a microscope 24, an integrating sphere 25, a CCD camera visual component 26, a laser range finder 27, a second sensor 28, a first motor 29, a rotating shaft 30, a second rail 31, a second motor 32, a third sensor 33, an automatic probe adjusting device 34, a fourth sensor 35, an active edge finder 36, a fifth sensor 37, a sixth sensor 38, a marble 39, a main detection lens 40, a main detection camera 41, a re-detection camera 42, The device comprises a review lens 44, a fixed support 43, a focusing lens 45, an AOI moving platform 46, a belt 47, a first motor 48, a first rail 49, a second motor 50, a carrier 51, a second rail 52, a customized light source 53 and a light source 54.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Embodiment 1, as shown in fig. 1 to 3, an integrated testing apparatus for photoelectric property and appearance of an LED chip includes a wafer robot arm 1, an AOI testing vision system 2, an AOI testing platform 3, a magazine 4, a machine table 5, a probe platform 6, and a probe moving platform 7; wherein: the magazine 4 is fixed on the loading and unloading placing area of the machine table 5, and the machine table 5 is provided with a wafer robot arm 1, an AOI detection visual system 2, an AOI detection platform 3, a probe platform 6 and a probe moving platform 7.
As shown in fig. 4, the wafer robot arm 1 is composed of a first clamping jaw 8, a second clamping jaw 9, a first linkage shaft 10, a second linkage shaft 11, a third linkage shaft 12, a fourth linkage shaft 13, a sensing device 14 and a cavity 15, wherein the fourth linkage shaft 13 is connected with the second linkage shaft 11, the third linkage shaft 12 is connected with the first linkage shaft 10, the fourth linkage shaft 13 and the third linkage shaft 12 are arranged in the cavity 15, the sensing device 14 is connected with the first linkage shaft 10 and the second linkage shaft 11, the second clamping jaw 9 is installed at the front end of the first linkage shaft 10, and the first clamping jaw 8 is installed at the front end of the second linkage shaft 11. The clamping jaw I8 and the clamping jaw II 9 grab the film source through the linkage shafts, are not mutually influenced, and are alternately matched with each other to operate, so that the working efficiency is improved; meanwhile, the wafer robot arm 1 is provided with a sensing device 14 for detecting whether the material box 4 has the state of lamination and inclined sheet before the sheet is taken and placed.
As shown in fig. 5, the magazine 4 is composed of a magazine handle 16, a magazine 17, and a tablet source placement device 18, wherein the magazine handle 16 is disposed above the magazine 17, and the tablet source placement device 18 is installed in the magazine 17.
As shown in fig. 7, the AOI inspection vision system 2 and the AOI inspection platform 3 form an AOI inspection platform, which includes a marble 39, a main inspection camera 41, a main inspection lens 40, a review camera 42, a review lens 44, a fixing bracket 43, a focusing lens 45, a customized light source 53, and a light source 54; wherein: marble 39 is fixed in on AOI testing platform 3, and main camera 41 of examining is fixed in on marble 39, and main camera 41 below of examining is installed and is examined camera 40, and main camera 40 of examining is connected with customization light source 53, and fixed bolster 43 upper portion is installed and is examined camera 42 again, and it is connected with recheck camera 44 to examine camera 42 again, and fixed bolster 43 sub-unit connection has focusing lens 45, and focusing lens 45 is connected with light source 54. The AOI detection platform adopts an advanced customized light source 53, a high-speed high-resolution main inspection camera 41 and a rechecking camera 42, can clearly identify the appearance defects of the chip, is provided with a high-resolution main inspection lens 40 and a rechecking lens 44 with different multiplying powers, and can detect the defect size of about 1.5um at minimum; the AOI detection vision system 2 uses marble 39 as a framework, is stable and vibration-free, and is more beneficial to high-speed drawing acquisition.
As shown in fig. 5, the point measurement platform is composed of the probe platform 6 and the probe moving platform 7, and includes a first signal computing device 19, a first signal computing device 20, a first sensor 21, a track 22, a nondestructive probe cleaning device 23, a microscope 24, an integrating sphere 25, a CCD camera vision component 26, a laser range finder 27, a second sensor 28, a first motor 29, a rotating shaft 30, a second track 31, a second motor 32, a third sensor 33, an automatic probe adjusting device 34, a fourth sensor 35, an active edge finder 36, a fifth sensor 37 and a sixth sensor 38; wherein: a first motor 29 is arranged below the left side of the measuring needle moving platform 7, the right side of the first motor 29 is connected with a second track 31, a rotating shaft 30 is arranged above the second track 31, a second motor 32 is connected with the right side of the second track 31, the rotating shaft 30 is fixed on the second track 31, a first signal computing device 19 and a second signal computing device 20 are respectively arranged on the left side and the right side of the measuring needle platform 6, the first signal computing device 19 and the second signal computing device 20 are jointly connected with an integrating sphere 25 to collect data, a microscope 24 is connected with the integrating sphere 25, a laser range finder 27 is connected below a CCD camera vision component 26 and is fixed on a track 22, a fifth inductor 37 and a sixth inductor 38 are fixed on the left side of the measuring needle platform 6, the fifth inductor 37 and the sixth inductor 38 are connected with a second inductor 28, a first inductor 21 and a fourth inductor 35 are fixed on the right side of the measuring needle platform 6, the first inductor 21 and, the sensor four 35 is connected with the automatic needle adjusting device 34, and the automatic needle adjusting device 34 is connected with the active edge finder 36. The point measurement platform judges the Z-direction position through the laser range finder 27, the CCD camera vision component 26 automatically focuses to realize accurate contraposition imaging, and then the shaft is subjected to servo control compensation through the automatic pin adjusting device 34, and finally the automatic pin adjusting function is realized; an active edge finder 36 is configured to be connected with the automatic needle adjusting device 34, needle pressure is controlled stably, needle adjustment is convenient and rapid, the needle measuring platform 6 is loaded with the nondestructive needle cleaning device 23, needle cleaning is conducted in real time in the operation process, the dirty influence of the probe is avoided, and safety and high efficiency are achieved.
As shown in fig. 8, an AOI moving platform 46 is disposed below the marble 39, and the AOI moving platform 46 includes a belt 47, a first motor 48, a first rail 49, a second motor 50, a stage 51, and a second rail 52, where: one end of the second rail 52 is provided with a first motor 48, the first rail 52 is provided with a first rail 49, the first motor 48 drives the first rail 49 to move on the second rail 52 through a belt 47, one end of the first rail 49 is provided with a second motor 50, the first rail 49 is provided with a carrier 51, the second motor 50 drives the carrier 51 to move on the first rail 49 through the belt 47, and the first motor 48 and the second motor 50 drive the carrier 51 to horizontally move in the X, Y direction.
More than 5 material boxes 4 are placed in the feeding and discharging placement area of the machine table 5, so that the material changing frequency is reduced, and frequent feeding and discharging are avoided.
The material box 4 is arranged in a mode of surrounding the wafer robot arm 1, so that bilateral operation can be realized without stopping.
The magazine 4 can accommodate 25 film sources, reducing the frequency of manual feeding, and personnel can manage multiple machines simultaneously.
The specific working principle of the invention is as follows:
The invention puts the loaded material box 4 on the loading and unloading placing area of the machine table 5 by a robot, the clamping jaw I8 clamps the film source to the AOI detection platform 3, the motor I48 and the motor II 50 move the working table, simultaneously the AOI detection vision system 2 takes pictures and identifies the appearance defects of the chip by the customized light source 53, the high-speed and high-resolution main detection camera 41, the reinspection camera 42, the main detection lens 40 and the reinspection lens 44, after the detection is finished, the clamping jaw I8 clamps the film source and places the film source on the point detection platform, the clamping jaw II 9 clamps the other film source and places the other film source on the AOI detection platform 3 for taking pictures, the film source placed on the point detection platform moves under the action of the motor I29 and the motor II 32, the point detection platform is provided with a nondestructive needle cleaning device 23, an active edge finder 36, an automatic needle adjusting device 34, a laser range finder 27 and a CCD camera vision component 26, the Z-direction position is judged by the laser range, the CCD camera vision assembly 26 automatically focuses, automatic focusing, automatic needle adjustment and automatic thimble cleaning are achieved through the automatic devices, the clicked data are collected through the integrating sphere 25, the first conveying signal computing device 19 and the first signal computing device 20 to be analyzed, sorted and transmitted, after the point measurement is completed, the first clamping jaw 8 clamps a film source and puts the material box 4, the second clamping jaw 9 clamps an AOI detection film source and puts the electric measurement platform to be subjected to the point measurement, the first clamping jaw 8 continues to operate for the next film, and the process is repeated.
According to the invention, the AOI appearance detection platform is connected with the photoelectric test platform by using the wafer robot arm, so that the purpose of automatic transmission between the two platforms is realized; in addition, the point measurement platform is additionally provided with the CCD camera and the laser range finder to realize accurate alignment imaging, and then the automatic needle adjusting device is used for carrying out servo control compensation on XYZ axes, so that the purpose of automatically adjusting needles is achieved, intermediate links are reduced, the operation efficiency is improved, the labor cost is saved, and the abnormal conditions caused by personnel in the production process are reduced.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. a photoelectric property and appearance integrated detection device for an LED chip comprises a wafer robot arm (1), an AOI detection visual system (2), an AOI detection platform (3), a material box (4), a machine table (5), a probe platform (6) and a probe moving platform (7); the method is characterized in that: the material box (4) is fixed on a feeding and discharging placement area of the machine table (5), and a wafer robot arm (1), an AOI detection visual system (2), an AOI detection platform (3), a probe platform (6) and a probe moving platform (7) are arranged on the machine table (5);
The wafer robot arm (1) is composed of a first clamping jaw (8), a second clamping jaw (9), a first linkage shaft (10), a second linkage shaft (11), a third linkage shaft (12), a fourth linkage shaft (13), an induction device (14) and a cavity (15), wherein the fourth linkage shaft (13) is connected with the second linkage shaft (11), the third linkage shaft (12) is connected with the first linkage shaft (10), the fourth linkage shaft (13) and the third linkage shaft (12) are arranged in the cavity (15), the induction device (14) is connected with the first linkage shaft (10) and the second linkage shaft (11), the second clamping jaw (9) is installed at the front end of the first linkage shaft (10), and the first clamping jaw (8) is installed at the front end of the second linkage shaft (11);
The material box (4) is composed of a material box handle (16), a material box (17) and a sheet source placing device (18), wherein the material box handle (16) is arranged above the material box (17), and the sheet source placing device (18) is arranged in the material box (17).
2. The integrated detection equipment of the photoelectricity and appearance of the LED chip, according to claim 1, the AOI detection vision system (2) and the AOI detection platform (3) form an AOI detection platform, which comprises a marble (39), a main detection camera (41), a main detection lens (40), a rechecking camera (42), a rechecking lens (44), a fixing bracket (43), a focusing lens (45), a customized light source (53) and a light source (54); the method is characterized in that: marble (39) are fixed in on AOI testing platform (3), on main camera (41) of examining was fixed in marble (39), main camera (41) below of examining is installed main inspection camera (40), main inspection camera (40) are connected with customization light source (53), rechecking camera (42) are installed on fixed bolster (43) upper portion, rechecking camera (42) are connected with rechecking camera (44), fixed bolster (43) sub-unit connection has focusing lens (45), focusing lens (45) are connected with light source (54).
3. The integrated detection equipment for the photoelectricity and the appearance of the LED chip according to claim 1, wherein the probe platform (6) and the probe moving platform (7) form a point measurement platform, and the point measurement platform comprises a first signal calculation device (19), a first signal calculation device (20), a first sensor (21), a track (22), a nondestructive probe cleaning device (23), a microscope (24), an integrating sphere (25), a CCD camera vision component (26), a laser range finder (27), a second sensor (28), a first motor (29), a rotating shaft (30), a second track (31), a second motor (32), a third sensor (33), an automatic probe adjusting device (34), a fourth sensor (35), an active edge finder (36), a fifth sensor (37) and a sixth sensor (38); the method is characterized in that: a first motor (29) is installed below the left side of the measuring needle moving platform (7), the right side of the first motor (29) is connected with a second track (31), a rotating shaft (30) is arranged above the second track (31), a second motor (32) is connected to the right side of the second track (31), the rotating shaft (30) is fixed on the second track (31), a first signal computing device (19) and a second signal computing device (20) are respectively arranged on the left side and the right side of the measuring needle platform (6), the first signal computing device (19) and the second signal computing device (20) are jointly connected with an integrating sphere (25) to collect data, a microscope (24) is connected with the integrating sphere (25), a laser range finder (27) is connected below a CCD camera visual component (26) and is fixed on the track (22), a fifth inductor (37) and a sixth inductor (38) are fixed on the left side of the measuring needle platform (6), the fifth inductor (37) and the sixth inductor (38) are connected with, a first inductor (21) and a fourth inductor (35) are fixed on the right side of the needle measuring platform (6), the first inductor (21) and the fourth inductor (35) are connected with a third inductor (33), the fourth inductor (35) is connected with an automatic needle adjusting device (34), and the automatic needle adjusting device (34) is connected with an active edge finder (36).
4. The integrated photoelectric and appearance detection device of the LED chip as claimed in claim 2, wherein: an AOI moving platform (46) is arranged below the marble (39).
5. The integrated optical electrical property and appearance inspection apparatus for LED chips as claimed in claim 4, wherein said AOI moving platform (46) comprises a belt (47), a first motor (48), a first rail (49), a second motor (50), a carrier (51), and a second rail (52), and is characterized in that: a first motor (48) is installed at one end of a second rail (52), a first rail (49) is installed on the second rail (52), the first motor (48) drives the first rail (49) to move on the second rail (52) through a belt (47), a second motor (50) is installed at one end of the first rail (49), a carrying platform (51) is installed on the first rail (49), the second motor (50) drives the carrying platform (51) to move on the first rail (49) through the belt (47), and the first motor (48) and the second motor (50) drive the carrying platform to achieve horizontal movement of the carrying platform (51) in the X, Y direction.
6. The integrated photoelectric property and appearance detection device of the LED chip as claimed in claim 1, wherein: more than 5 material boxes (4) are placed in the feeding and discharging placing area of the machine table (5).
7. The integrated photoelectric property and appearance detection device of the LED chip as claimed in claim 1, wherein: the material box (4) is placed in a mode of surrounding the wafer robot arm (1), and therefore bilateral operation can be achieved without stopping.
8. The integrated photoelectric property and appearance detection device of the LED chip as claimed in claim 1, wherein: the magazine (4) can accommodate 25 sheet sources.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910924883.8A CN110581096B (en) | 2019-09-27 | 2019-09-27 | LED chip photoelectric and appearance integrated detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910924883.8A CN110581096B (en) | 2019-09-27 | 2019-09-27 | LED chip photoelectric and appearance integrated detection equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110581096A true CN110581096A (en) | 2019-12-17 |
| CN110581096B CN110581096B (en) | 2023-09-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910924883.8A Active CN110581096B (en) | 2019-09-27 | 2019-09-27 | LED chip photoelectric and appearance integrated detection equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110581096B (en) |
Cited By (4)
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| CN116203043A (en) * | 2023-05-05 | 2023-06-02 | 武汉精立电子技术有限公司 | LED chip integrated detection method and device |
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| CN110581096B (en) | 2023-09-05 |
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