JPS63102294A - Electronic component tester - Google Patents
Electronic component testerInfo
- Publication number
- JPS63102294A JPS63102294A JP61247207A JP24720786A JPS63102294A JP S63102294 A JPS63102294 A JP S63102294A JP 61247207 A JP61247207 A JP 61247207A JP 24720786 A JP24720786 A JP 24720786A JP S63102294 A JPS63102294 A JP S63102294A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead
- suction head
- suction
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 210000000078 claw Anatomy 0.000 claims description 17
- 238000007689 inspection Methods 0.000 claims description 17
- 230000003287 optical effect Effects 0.000 claims description 11
- 230000007723 transport mechanism Effects 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims 1
- 238000003384 imaging method Methods 0.000 description 8
- 238000007667 floating Methods 0.000 description 7
- 239000013307 optical fiber Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 241000277269 Oncorhynchus masou Species 0.000 description 1
- 235000006732 Torreya nucifera Nutrition 0.000 description 1
- 244000111306 Torreya nucifera Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、電子部品をプリント基板に実装する前工程
などで、電子部品のリードを検査するために用いる電子
部品の検査装置に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an electronic component inspection device used for inspecting leads of electronic components in a pre-process of mounting electronic components on a printed circuit board. .
第６図は例えば実開昭６０−１８９８０８号公報に示さ
れた従来の電子部品の検査装置の斜視図である。第６図
において、１は検査される電子部品であす、電子部品１
は４つの側辺の外周から複数のリード１ａがそれぞれ突
出している平面矩形の薄板状のものである。２は電子部
品１を着脱可能に保持するｔこめの吸着ヘッドてあり、
吸着ヘッド２ζよ図示しない排気装置に接続されている
。３は吸着・＼ラド２の下方に配設され、吸着ヘッド２
を縦軸回りに旋回させるためのモータ、４は吸着・＼、
−Ｉド２事ｊよびモータ３が装着され、これらを水平に
直線移動させるための移動テーブル、５は移動テーブル
４の移動量を検出するための直線エンコーダ、６および
７は吸着ｌ＼ラッドに保持された電子部品１のリード１
ａの曲がりを検査するための光ファイバおよびフオＩ・
センサである。FIG. 6 is a perspective view of a conventional electronic component inspection apparatus disclosed in, for example, Japanese Utility Model Application Publication No. 60-189808. In Fig. 6, 1 is an electronic component to be inspected.Electronic component 1
is a thin plate with a rectangular plane and a plurality of leads 1a protruding from the outer periphery of each of its four sides. 2 has a T-shaped suction head that removably holds the electronic component 1;
The suction head 2ζ is connected to an exhaust device (not shown). 3 is arranged below the suction/rad 2, and the suction head 2
Motor for rotating around the vertical axis, 4 is suction ＼,
- A moving table is installed to move the moving table 2 and the motor 3 horizontally, 5 is a linear encoder for detecting the amount of movement of the moving table 4, and 6 and 7 are attached to the suction l\rad. Lead 1 of held electronic component 1
Optical fiber and optical fiber for inspecting bending of a.
It is a sensor.
次に、以上のように構成された従来の電子部品の動作に
ついて説明する。電子部品１を吸着ヘッド２上に載置し
、吸着ヘッド２から排気して吸着ヘッド２に電子部品ｌ
を吸着把持する。次に、移動テーブル４を適宜の手段で
直線移動させることで電子部品１を移動させ、これの−
側辺から突出した１番目のり−ド１ａの先端部と光ファ
イバ６の先端面とが対向するように位置合せを行う。光
ファイバ６からリード１ａの先端部に向って光を照射し
、その反射光の有無をフォトセンサ７で検出することで
、リード１ａの上下方向の浮きを検出し、移動テーブル
４によって電子部品１を移動させながら、この移＃量を
直線エンコーダ５で検出し、リード１ａ先端部からの反
射光の有無をフォトセンサ７で検出することにより、リ
ード１ａのピ・ソチを検査する。また、モータ３によっ
て吸着ヘッド２に保持された電子部品１を９０°回転さ
せ、他の側辺から突出したり−ド１ａの曲がり。Next, the operation of the conventional electronic component configured as described above will be explained. The electronic component 1 is placed on the suction head 2, the suction head 2 is evacuated, and the electronic component 1 is placed on the suction head 2.
Hold it by suction. Next, the electronic component 1 is moved by linearly moving the moving table 4 by an appropriate means, and the -
Alignment is performed so that the tip end of the first beam 1a protruding from the side and the tip end surface of the optical fiber 6 are opposed to each other. By emitting light from the optical fiber 6 toward the tip of the lead 1a and detecting the presence or absence of the reflected light with the photosensor 7, lifting of the lead 1a in the vertical direction is detected, and the electronic component 1 is moved by the moving table 4. While moving the lead 1a, the linear encoder 5 detects the amount of movement, and the photosensor 7 detects the presence or absence of reflected light from the tip of the lead 1a, thereby inspecting the lead 1a. Moreover, the electronic component 1 held by the suction head 2 is rotated by 90 degrees by the motor 3, and the electronic component 1 is protruded from the other side or the electronic component 1 is bent.
ピッチの検査を上述した一側辺と同様にして行う。The pitch is inspected in the same manner as for one side as described above.
従来の電子部品の検査装置は、上述のように構成され、
光ファイバの先端面と電子部品のリード先端部との距離
が特定されており、特定寸法の電子部品しか検査できず
、また吸着ヘッド上に電子部品を置く際に吸着ヘッドの
中心に対する電子部品の位置ずれや、電子部品の回転に
よるずれによって、光ファイバの先端面と電子部品のリ
ード先端部との距離が変化し、このため高精度のリード
の検査ができず、これ（まフラジ）−パッケージ形の電
子部品をプリン）・基板に実装する工程においてリード
間隔ピッチが小さくなり、信頼性を確保しにくくなるこ
とにつながるという間；頂点がある。A conventional electronic component inspection device is configured as described above,
The distance between the tip of the optical fiber and the lead tip of the electronic component is specified, so only electronic components of specific dimensions can be inspected, and when placing the electronic component on the suction head, the electronic component must be placed relative to the center of the suction head. Due to misalignment or misalignment due to the rotation of electronic components, the distance between the tip of the optical fiber and the tip of the lead of the electronic component changes, making it impossible to inspect the lead with high precision. In the process of mounting electronic components (printed) and printed circuit boards, the lead spacing pitch becomes smaller, making it difficult to ensure reliability.
さらに、リード先端部からの光の反射があるか否かによ
ってリードの検査をしているため、リードの接合面から
の上下方向の浮き址は計測できないという問題点があっ
た。Furthermore, since the lead is inspected based on whether or not there is light reflection from the tip of the lead, there is a problem in that it is not possible to measure the vertical lifting of the lead from the bonding surface.
この発明は、上記のような問題点を解決するためになさ
れたもので、寸法、形状が異なる多品種のヤニ子部品の
リードを、これらのピッチと接合面からの浮き量とを高
精度に計測できる電子部品の検査装置を得ろことを目的
としている。This invention was made in order to solve the above-mentioned problems, and it is possible to accurately adjust the pitch and the amount of floating from the joint surface of the leads of various types of resin parts with different sizes and shapes. The purpose is to obtain an inspection device for electronic components that can be measured.
この発明に係る電子部品の検査装置は、吸着へ、ソドの
両側方に電子部品を押付ける少な（とも１組の相対向す
る開閉可能な爪を配設した位置決め装置と、上記電子部
品の吸着ヘッドによる吸着面と傾斜した光軸上の電子部
品−側方および他側方に光源およびテレビカメラのよう
なリード撮像機を対向設置した画像計測装置とを備え、
上記撮像機を電子部品に対する距離調節可能に構成し、
さらに画像計測装置で得た画像と予めブムグラムされた
リードの形状精度の値とから制御装置によって電子部品
の良否判定を行うようにしたものである。The electronic component inspection device according to the present invention includes a positioning device that presses the electronic component on both sides of a suction member (a positioning device having a pair of opposing claws that can be opened and closed); Equipped with a suction surface by a head, an electronic component on an inclined optical axis, and an image measuring device with a light source and a lead imager such as a television camera installed facing each other on one side and the other side,
The image pickup device is configured to be able to adjust the distance to the electronic component,
Furthermore, the quality of the electronic component is determined by the control device based on the image obtained by the image measuring device and the value of the shape accuracy of the lead which has been programmed in advance.
この発明における電子部品の検査装置は、吸着ヘッドに
載置された電子部品を相対向する爪で対向側辺外側から
押付けて位置決めすることができ、これによって、電子
部品の吸着ヘッドに対する位置ずれや回転方向のずれを
なくすことがてき、また光源と対向する撮像機を移動さ
せることで、撮像機の焦点を合せることができて、形状
寸法が異なる電子部品のリードを高精度に計測でき、さ
らに、電子部品の吸着ヘッドによる吸着面に対し光源お
よび光源に対向する撮像機の光軸を傾斜させたことで、
撮像機によって電子部品のリードのピッチだけではな（
、浮き量も画像として得られ、したがって、１台の撮像
機でリードのピッチと浮き量を同時に計測できる。The electronic component inspection device of the present invention can position the electronic component placed on the suction head by pressing it from the outside of the opposite side with opposing claws, thereby preventing misalignment of the electronic component with respect to the suction head. It is possible to eliminate misalignment in the rotational direction, and by moving the imager facing the light source, the imager can be focused, making it possible to measure leads of electronic components with different shapes and dimensions with high precision. By tilting the optical axis of the light source and the image pickup device facing the light source with respect to the suction surface of the electronic component suction head,
Depending on the imager, it is not just the pitch of the electronic component leads (
, the floating amount can also be obtained as an image, and therefore the pitch and floating amount of the lead can be measured simultaneously with one imaging device.
以下、この発明の一実施例を第１図ないし第５図につい
て説明する。An embodiment of the present invention will be described below with reference to FIGS. 1 to 5.
第１図ないし第５図において、第６図と同一符号は、同
一または相当部分を示す。第１図において、８はロボッ
トからなる搬送機構であり、この搬送機構８は、機台９
の後部上に配設した左右方向に直線往復動する第１アー
ム１０と、このアーム１０上に配設した前後方向に直線
往復動する第２アーム１１と、第２アーム１１の先端部
に支持されて上下方向に往復動する搭載ヘッド１２とを
備え、搭載ヘッド１２にこれを縦軸回りに９０’ずつ回
転させろ回転モータ１３が連結されている。In FIGS. 1 to 5, the same reference numerals as in FIG. 6 indicate the same or corresponding parts. In FIG. 1, reference numeral 8 denotes a transport mechanism consisting of a robot, and this transport mechanism 8 has a machine base 9
A first arm 10 disposed on the rear part of the arm 10 that reciprocates linearly in the left-right direction, a second arm 11 disposed on this arm 10 that reciprocates linearly in the front-rear direction, and a support at the tip of the second arm 11. A rotary motor 13 is connected to the mounting head 12 to rotate the mounting head 12 by 90' around a vertical axis.
なお、搭載へ・ソド１２は吸着ヘッド２と同様に図示し
ない排気装置に接続されている。１４ば機台９の高さの
低い前部に設けた位置決め装置であり、位置決め装置１
４は、第２図にも示すように、相対向する爪１５．１６
の２組がモータ１７１８によって回動するねじ軸１９，
２０の互いに反対方向のねじにそれぞれねじ嵌合さｔ゛
シ、爪１５，１６が図示しない固定部材にｔａじ軸１９
，２０の軸方向に沿う直線移動可能に係合されている。Note that, like the suction head 2, the mounting head 12 is connected to an exhaust device (not shown). 14 is a positioning device provided at the lower front part of the machine stand 9, and is a positioning device 14.
4, as shown in FIG. 2, opposite claws 15 and 16.
two sets of screw shafts 19 rotated by a motor 1718;
20 screws in opposite directions, and the claws 15 and 16 are attached to the fixing member (not shown) in the same direction as the shaft 19.
, 20 for linear movement along the axial direction.
また、ねじ軸１９，２０はＸ、ｙ方向に互いに直交して
立体交差され、さらに一方の組の爪１５ば幅が広く、他
方の組の爪１６は幅が狭く形成され、上端部が吸着へノ
ド２の外側方にそれぞれ配置されている。２１，２２は
機台９の前部に設けた画像計測装置であり、画像計測装
置２１，２２１よ、第３図にも示すように、機台９上の
位置決め措置１４両側方に固定した支脚２３，２４上部
にねじ軸２５゜２６が回動可能に架設され、ねし軸２５
，２６に搭載台２７．２８がねし嵌合され、ねじ軸２５
゜２６の外端部にモータ２９，３０が連結され、モータ
２９，３０の正逆回転によってねし軸２５゜２６を介し
て位置決め装置１４に対する搭載台２７゜２８の距離が
調整されるように構成されている。Further, the screw shafts 19 and 20 are orthogonal to each other in the X and Y directions, and are three-dimensionally intersected, and one set of claws 15 is wide, the other set of claws 16 is narrow, and the upper end is attracted. They are arranged on the outside of the henode 2, respectively. Reference numerals 21 and 22 denote image measuring devices installed at the front of the machine base 9, and the image measuring devices 21 and 221, as shown in FIG. A screw shaft 25° 26 is rotatably installed on the top of 23, 24, and the screw shaft 25
, 26 are screw-fitted to the mounting bases 27 and 28, and the screw shaft 25
Motors 29 and 30 are connected to the outer ends of the mounts 29 and 30, and the distance of the mounting base 27 and 28 to the positioning device 14 is adjusted via the screw shaft 25 and 26 by forward and reverse rotation of the motors 29 and 30, respectively. It is configured.
搭載台２７．２８上には工業用テレビカメラからなる撮
像ＰＡ３１，３２が下向きに傾斜してそれぞれ固定され
、撮像８１３１．３２と対向するランプからなる光源３
３．３４が搭載台２７．２８に上向きに傾斜してそれぞ
れ固定され、光ｉ３３，３４の光軸３５，３６が吸着ヘ
ッド２−ヒに水工に吸着された電子部品１のリード１８
部を経て撮像機３１．３２の光軸と一致している。なお
、第１図中３７は機台９の前後方向中間部上に設けられ
た電子部品１の収納部、第２図中３８は吸着ヘッド２の
排気管である。また、第４図において、３９は撮１１１
３１．３２の画像が映（７出されろ監視用受像機であり
、制御装置に組込まれている。On the mounting bases 27 and 28, imaging PAs 31 and 32 consisting of industrial television cameras are respectively fixed with downward inclinations, and a light source 3 consisting of a lamp facing the imaging 8131 and 32 is fixed.
3.34 are fixed upwardly tilted on the mounting bases 27 and 28, respectively, and the optical axes 35 and 36 of the light beams 33 and 34 are attached to the leads 18 of the electronic component 1 which are sucked by the suction head 2-hi.
The optical axes of the imagers 31 and 32 coincide with each other. Note that 37 in FIG. 1 is a housing portion for the electronic component 1 provided on the intermediate portion of the machine base 9 in the longitudinal direction, and 38 in FIG. 2 is an exhaust pipe of the suction head 2. In addition, in FIG. 4, 39 is the camera 111.
Images 31 and 32 are displayed on the monitor receiver, which is built into the control device.
次に、以上のように構成された実施例の動作について説
明する。Next, the operation of the embodiment configured as above will be explained.
まず、搬送機構８によって収納部３７に収納された第４
図に示す電子部品１の上面を搭載・＼・・ノド１２に吸
着させ、電子部品１を位置決め装置１４の吸着ヘッド２
ヒに搬入、Ｎ置し、搭載−Ｘ７ド１２によろ吸着を解除
する。次に、位置決め装置１４のモータ１７，１８の正
回転によって１１目いている爪１５．１６をねｊ′／軸
１９，２０を介して閉方向に移動させ、を子部品１の各
側辺のリード１ハを２組の対向する爪１５，１６で両側
からそれぞスーシ押付け、を子部品１の吸着ヘッド２に
対する位置ずれ、回転方向のずれを修正して電子部品１
を位置決めする。この場合に、位置決めされろ電子部品
１の寸法は、第２図の２ ｆｆＪｌの爪１．５．＋６の
それぞれの可動範囲４０．４１で決定され、爪１５に比
へ爪１６の幅が狭いので、多品種の電子部品に対応でき
ろ。その後、電子部品１の下１１１）を吸でｒ・＼ノド
２からの排気によって吸着ヘッド２上１ｆｊに水下に吸
着保持し、電子部品１の形状寸法に応じ、両１９計測装
置２１，２２の撮像機３１，３２と光、ｐ７３３ 、３
４の光軸３５．３６上に電子部品１のリ−ド】ａが位置
するように、電子部品１を吸７ｔヘンド２によって移動
させ、さらに電子部品】の寸法に応じ画像計測装置２１
．２２のモータ２９゜３０の駆動によりねじ軸２５．２
６を介して撮像機３１．３２を搭載台２７．２８と共に
光軸３５゜３６方向の前後に移動させて焦点合せを行う
。２組の光軸３５３６上のリード１ａは光源３３．３４
からの光を遮断するために、撮像機３１，３２に陰影を
結び、第４図に示すように制御装置の監視用受像機３９
には、一方の撮像機３１の影像が上半部に、他方の撮像
４Ｊ３２の影像が下半部にそれぞれ映し出される。この
ため、電子部品１の対向する両側辺のリード１ａを同時
に検査することができる。また、リード１ａの第４図左
右方向および上下方向の座標を読取るととて、リードの
ピッチＰ、、Ｐ２ および浮き量ΔｈＩＦ△）１２ を
同時に計測することができ、これらの計測値と予めめプ
ログラムされたピッチの基準値および浮き量の許容値と
を比較することで、リードの良否を判定し、判定結果の
出力を制御装置から取出すことができる。そして、を子
部品１の吸着ヘッド２による吸着面と傾斜させた光軸上
に、撮像機３１゜３２と光１９３３，３４とを対向させ
て設置したので、１組の撮像機と光源で電子部品１のリ
ード〕ａのピッチとリードの接合面からの浮き量の両方
を検査できる。さらに、上記２側辺のリード１ａの検査
を終った電子部品１を爪１５，１６による押付けおよび
吸竹ヘッド２による吸着を解除した状態で、搭載ヘッド
１２を回転をモータ１３で９０゜回転させろこと（こよ
り、残った他の２側辺のリード１ａの検査を上述した手
順と同様にして検査できる。なお、検査後の電子部品１
は、制御装置の出力信号による搬送８１構８の動作によ
り、良品と不良品とに分けて搬出する。First, the fourth
The upper surface of the electronic component 1 shown in the figure is mounted on the throat 12, and the electronic component 1 is placed on the suction head 2 of the positioning device 14.
Carry it in to H, place it in N, and release the suction with the mounting-X7 door 12. Next, by forward rotation of the motors 17 and 18 of the positioning device 14, the eleventh claws 15 and 16 are moved in the closing direction via the screws/shafts 19 and 20, and the The lead 1 is pressed down from both sides with two sets of opposing claws 15 and 16, and the electronic component 1 is corrected for misalignment and rotational direction of the child component 1 with respect to the suction head 2.
position. In this case, the dimensions of the electronic component 1 to be positioned are 2 ffJl claws 1.5. The width of the claw 16 is narrower than that of the claw 15, so it can accommodate a wide variety of electronic components. After that, the lower part 111) of the electronic component 1 is suctioned and held under water on the upper part 1fj of the suction head 2 by suction and exhaust from the throat 2. image pickup devices 31, 32 and light, p733, 3
The electronic component 1 is moved by the suction hand 2 so that the lead A of the electronic component 1 is positioned on the optical axis 35, 36 of the electronic component 4, and then the image measuring device 21 is moved according to the dimensions of the electronic component.
．． The screw shaft 25.2 is driven by the motor 29°30 of 22.
Focusing is performed by moving the imaging devices 31 and 32 together with the mounting bases 27 and 28 back and forth along the optical axis 35.degree. The leads 1a on the two sets of optical axes 3536 are light sources 33.34
In order to block the light from the camera, a shadow is connected to the image pickup devices 31 and 32, and as shown in FIG.
, the image of one imaging device 31 is displayed in the upper half, and the image of the other imaging device 4J32 is displayed in the lower half. Therefore, the leads 1a on opposite sides of the electronic component 1 can be inspected simultaneously. In addition, by reading the coordinates of the lead 1a in the horizontal and vertical directions in Figure 4, the lead pitch P, , P2 and floating amount ΔhIFΔ)12 can be measured simultaneously, and these measured values and the By comparing the programmed pitch reference value and floating amount tolerance value, it is possible to determine whether the lead is good or not, and output the determination result from the control device. The image pickup device 31° 32 and the lights 1933 and 34 were installed facing each other on the optical axis inclined to the suction surface of the suction head 2 of the child component 1. Both the pitch of lead a of component 1 and the amount of floating of the lead from the joint surface can be inspected. Furthermore, after the inspection of the leads 1a on the two sides has been completed, the electronic component 1 is released from being pressed by the claws 15 and 16 and sucked by the suction head 2, and the mounting head 12 is rotated by 90 degrees by the motor 13. (Thus, the remaining leads 1a on the other two sides can be tested in the same manner as the above-mentioned procedure.The electronic component 1 after the test
The products are separated into good products and defective products and transported out by the operation of the conveyor 81 structure 8 based on the output signal of the control device.
この発明による検査装置は、電子部品の検査過程で、リ
ードのピッチおよび浮きの絶対量がわかるので、回路基
板の所定位置に精度よく電気部品を載置する電子部品搭
載装置に用いてもよい。Since the inspection device according to the present invention can determine the lead pitch and the absolute amount of float during the process of inspecting electronic components, it may be used in an electronic component mounting device that accurately places electrical components at predetermined positions on a circuit board.
また、この発明による検査装置は、対向する１組の側辺
のみからリードが突出した電子部品の場合は、搭載ヘッ
ドを回転させるモータなどの桟構を省（ことができ、ま
たこの回転機構を用いて電子部品を９０°ずっ回動させ
、画像計測装置の光源およびリードｍＩ！ａを１組のみ
にしてもよい。Furthermore, in the case of an electronic component in which leads protrude only from one set of opposing sides, the inspection device according to the present invention can omit a frame structure such as a motor that rotates the mounting head, and can also eliminate this rotation mechanism. The electronic components may be rotated through 90 degrees using the optical system, and there may be only one set of the light source and lead mI!a of the image measuring device.
さらに上記撮像機は工業用テレビカメラに限られるもの
ではなく適宜のものを用いることができる。Furthermore, the above-mentioned image pickup device is not limited to an industrial television camera, and any suitable camera can be used.
以−ヒ説明しｔ二ように、この発明によれば、吸着ヘッ
ドの両側方に相対向させて開閉可能な爪を配設し、これ
らの爪で電子部品を対向側辺外側から揮付けて位置決め
するＬうにしたので、電子部品を吸着・＼ラドに対し高
精度に位置決めして吸着保持させることができ、また光
源と対向する撮像機を移動させろことで、撮像機の焦点
を合せることができるので、形状寸法が異なるｒ電子部
品のリードを、１１精度に計コＤＩでき、さらに７は子
部品の吸着ヘッドによる吸４￥１ｆａに対し光源および
撮像機の光軸を傾斜させたので、１台の撮像機によって
電子部品のリードのピッチと浮き量を同時に計測できろ
という効果が得られる。As explained below, according to the present invention, claws that can be opened and closed are provided on both sides of the suction head, and electronic components are volatilized from the outside of the opposite sides using these claws. Since the positioning is L, it is possible to attract and hold electronic components with high accuracy by positioning them against the radar, and by moving the image pickup device facing the light source, it is possible to focus the image pickup device. As a result, the leads of electronic components with different shapes and dimensions can be measured with 11 accuracy, and the optical axis of the light source and image pickup device is tilted relative to the suction head of the child component. This provides the advantage of being able to simultaneously measure the lead pitch and floating amount of electronic components using a single imaging device.
第１図はこの発明の一実施例による電子部品の検査装置
を示す斜視図、第２図（よ６７１位置決め装置の斜視図
、第３図ば撮像機と光源との正面図、第４図は監視用受
像機の正面図、第５図は電子部品の平向図、第６図は従
来の電子部品の検査装置を示す斜視図である。
１ 電子部品、１ ａ −’Ｊ−ド、２ 吸着・λラド
、８ 搬送機構、１２ 搭載ヘッド、１３ 回転モータ
、１４ 位置決め装置、１５，１６−爪、１７．１８
モータ、１９，２０ ねじ軸、２１゜２２ 画像計
測装置、２５，２６−ねし軸、２７゜２８ 搭載台、２
９，３０ モータ、３１，３２・撮像機、３３，３４
光源、３９ 監視用受（重機。
なお、図中同一符号は同一または相当部分を示す。
代理人 大 岩 増 ！＃（外２名）
沁 ｌ λ
／゛宅ぜ品
８遡バ費躊
１５ 口
第 ２ 図
２ Ｒ多るＡシト
茅３図
手続補正書（自発）
昭和 年 月 日
０２ ε ど６
特許庁長官殿 と１
、事件の表示 特願昭６１−２４７２０７号′２、
発明の名称
電子部品の検査装置
３、補正をする者
事件との関係 特許出願人
住 所 東京都千代田区丸の内二丁目２番３号名
称 （６０１）三菱電機株式会社代表者志岐守哉
４、代理人
住 所 東京都千代田区丸の内二丁目２番３号、
（−” 、、、：Ｈ′
５、補正の対象
（１）明細書の発明の詳細な説明の欄
（２）図面
６、補正の内容
（１）明細書筒８頁１５行目に「位置決め措置１４」と
あるを、「位置決め装置１４」と補正する。
（２）同第８頁１７行目に「回動可能」とあるを、「回
転可能」と補正する。
（３）同第１０頁１３〜１５行目に「その後、・・・・
・・電子部品１の形状寸法に応じ、コとあるを、［その
後、搭載ヘッド１２が電子部品１の上面を吸着把持する
際、位置ずれ９回転ずれを生じないよう電子部品１の下
面を吸着へンド２からの排気によって吸着ヘッド２上面
に水平に吸着保持し、搭載ヘッド１２が電子部品１の上
面に下降。
吸着把持した後、爪１５．１６による押付けおよび吸着
ヘッド２による吸着を解除した状態で搭載ヘッド１２が
、電子部品１の形状寸法に応じ、」と補正する。
（４）同第１０頁１８〜１９行目に「電子部品１を吸着
ヘッド２によって移動させ」とあるを、「電子部品１を
移動させ」と補正する。
（５）図面第１図を別紙の通り補正する。
７、添付書類FIG. 1 is a perspective view showing an electronic component inspection device according to an embodiment of the present invention, FIG. 2 is a perspective view of a positioning device, FIG. 3 is a front view of an image pickup device and a light source, and FIG. 5 is a plan view of an electronic component, and FIG. 6 is a perspective view of a conventional electronic component inspection device. 1 Electronic component, 1 a-'J-do, 2 Adsorption/λrad, 8 Transport mechanism, 12 Mounting head, 13 Rotating motor, 14 Positioning device, 15, 16-claw, 17.18
Motor, 19, 20 Screw shaft, 21゜22 Image measuring device, 25, 26-Thread shaft, 27゜28 Mounting stand, 2
9, 30 Motor, 31, 32/Imaging device, 33, 34
Light source, 39 Monitoring receiver (heavy equipment. In addition, the same reference numerals in the diagram indicate the same or corresponding parts. Agent: Masu Oiwa! # (2 others) 2nd Figure 2 Written amendment to the procedures for Figure 3 of R, A, and Kaya (voluntary), Showa year, month, day, 02 ε d6 Mr. Commissioner of the Japan Patent Office and 1
, Incident Display Patent Application No. 61-247207'2,
Name of the invention: Electronic component inspection device 3; Relationship with the case of the person making the amendment Patent applicant address: 2-2-3 Marunouchi, Chiyoda-ku, Tokyo Name (601) Moriya Shiki, representative of Mitsubishi Electric Corporation 4; Agent address: 2-2-3 Marunouchi, Chiyoda-ku, Tokyo.
(-” ,,,:H' 5. Subject of amendment (1) Detailed description of the invention column in the specification (2) Drawing 6, contents of amendment (1) "Positioning" on page 8, line 15 of the specification tube ``Measure 14'' is corrected to ``Positioning device 14''. (2) ``Rotatable'' on page 8, line 17 of the same is corrected to ``rotatable.'' (3) 10th page of the same. On page 13-15, it says, “After that...
...Depending on the shape and dimensions of the electronic component 1, select [After that, when the mounting head 12 suctions and grips the top surface of the electronic component 1, it suctions the bottom surface of the electronic component 1 to avoid misalignment by 9 rotations. The mounting head 12 is horizontally sucked and held on the top surface of the suction head 2 by the exhaust from the hand 2, and the mounting head 12 is lowered to the top surface of the electronic component 1. After the electronic component 1 is gripped by suction, the mounting head 12 corrects the electronic component 1 according to its shape and size while the pressing by the claws 15 and 16 and the suction by the suction head 2 are released. (4) On page 10, lines 18-19, the phrase "electronic component 1 is moved by suction head 2" is corrected to "electronic component 1 is moved." (5) Amend Figure 1 of the drawing as shown in the attached sheet. 7. Attached documents
Claims (5)
を吸着保持する吸着ヘッドの両側方に上記電子部品を押
付けて位置決めする少なくとも１組の相対向した開閉可
能な爪を配設した位置決め装置と、上記吸着ヘッドに対
し電子部品を出し入れする搬送機構と、上記電子部品の
吸着ヘッドによる吸着面と傾斜した光軸上に電子部品の
一側方に配置した光源および電子部品の他側方に電子部
品との距離調節可能に配置したリード撮像機を対向配置
した画像計測装置と、この画像計画装置で得た画像と予
めプログラムされた上記リードの形状精度の値とから良
否判定の出力をする制御装置とを備えたことを特徴とす
る電子部品の検査装置。(1) Positioning with at least one set of opposing claws that can be opened and closed to press and position the electronic component on both sides of a suction head that suction holds one side of the electronic component with multiple leads protruding from the sides. a device, a transport mechanism for loading and unloading electronic components into and out of the suction head, a light source disposed on one side of the electronic component on an optical axis inclined to the suction surface of the electronic component suction head, and the other side of the electronic component. An image measurement device has a lead imager placed facing the electronic component so that the distance can be adjusted, and an output of a pass/fail judgment is made from the image obtained by this image planning device and the shape accuracy value of the lead programmed in advance. An electronic component inspection device comprising: a control device for controlling electronic components;
せて２組設け、電子部品の対向する側辺から突出したリ
ードを同時に検査するものである特許請求の範囲第１項
に記載の電子部品の検査装置。(2) The image measuring device is provided with two sets of light sources and lead imagers facing each other, and simultaneously inspects the leads protruding from opposite sides of the electronic component. Electronic component inspection equipment.
の軸方向に移動する搭載台に固定してある特許請求の範
囲第１項または第２項に記載の電子部品の検査装置。(3) The electronic component inspection device according to claim 1 or 2, wherein the lead imager is fixed to a mounting base that moves in the axial direction of the screw shaft as the screw shaft rotates.
２組の相対向した爪を有している特許請求の範囲第１項
、第２項または第３項に記載の電子部品の検査装置。(4) The electronic component inspection device according to claim 1, 2 or 3, wherein the positioning device has two sets of opposing claws that open and close in directions perpendicular to each other.
０°ずつ回動する搭載ヘッドを有している特許請求の範
囲第１項、第２項、第３項または第４項に記載の電子部
品の検査装置。(5) The conveyance device picks up the electronic components and places them on the suction head at 9
The electronic component inspection device according to claim 1, 2, 3, or 4, which has a mounting head that rotates by 0°.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61247207A JPH0770879B2 (en) | 1986-10-17 | 1986-10-17 | Electronic component inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61247207A JPH0770879B2 (en) | 1986-10-17 | 1986-10-17 | Electronic component inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63102294A true JPS63102294A (en) | 1988-05-07 |
| JPH0770879B2 JPH0770879B2 (en) | 1995-07-31 |
Family
ID=17160038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61247207A Expired - Lifetime JPH0770879B2 (en) | 1986-10-17 | 1986-10-17 | Electronic component inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0770879B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02269943A (en) * | 1989-04-11 | 1990-11-05 | Mitsubishi Electric Corp | Outward appearance inspecting device for semiconductor device |
| JP2002532701A (en) * | 1998-12-15 | 2002-10-02 | コンパニー ジェネラール デ マチエール ヌクレイル | A method for controlling the verticality of cylindrical elements such as nuclear fuel pellets |
| US6545866B2 (en) | 1998-02-04 | 2003-04-08 | Fujitsu Limited | Electronic device |
| JP2004510975A (en) * | 2000-10-02 | 2004-04-08 | テラダイン・インコーポレーテッド | Optical inspection system integrating element learning |
| JP2015172575A (en) * | 2014-03-05 | 2015-10-01 | タイコ エレクトロニクス （シャンハイ） カンパニー リミテッド | programmable digital machine vision inspection system |
| CN111829948A (en) * | 2019-04-17 | 2020-10-27 | 台达电子工业股份有限公司 | Electronic component detection system and method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5946179A (en) * | 1982-09-09 | 1984-03-15 | 株式会社日立製作所 | Recognizer for chip part |
| JPS60148196A (en) * | 1984-01-13 | 1985-08-05 | 日本電気株式会社 | Apparatus for producing semiconductor device |
| JPS60155325A (en) * | 1984-01-20 | 1985-08-15 | Sanyo Electric Co Ltd | Positioner of electronic parts |
-
1986
- 1986-10-17 JP JP61247207A patent/JPH0770879B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5946179A (en) * | 1982-09-09 | 1984-03-15 | 株式会社日立製作所 | Recognizer for chip part |
| JPS60148196A (en) * | 1984-01-13 | 1985-08-05 | 日本電気株式会社 | Apparatus for producing semiconductor device |
| JPS60155325A (en) * | 1984-01-20 | 1985-08-15 | Sanyo Electric Co Ltd | Positioner of electronic parts |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02269943A (en) * | 1989-04-11 | 1990-11-05 | Mitsubishi Electric Corp | Outward appearance inspecting device for semiconductor device |
| US6545866B2 (en) | 1998-02-04 | 2003-04-08 | Fujitsu Limited | Electronic device |
| JP2002532701A (en) * | 1998-12-15 | 2002-10-02 | コンパニー ジェネラール デ マチエール ヌクレイル | A method for controlling the verticality of cylindrical elements such as nuclear fuel pellets |
| JP2004510975A (en) * | 2000-10-02 | 2004-04-08 | テラダイン・インコーポレーテッド | Optical inspection system integrating element learning |
| JP2015172575A (en) * | 2014-03-05 | 2015-10-01 | タイコ エレクトロニクス （シャンハイ） カンパニー リミテッド | programmable digital machine vision inspection system |
| CN111829948A (en) * | 2019-04-17 | 2020-10-27 | 台达电子工业股份有限公司 | Electronic component detection system and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0770879B2 (en) | 1995-07-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5559727A (en) | Apparatus and method for determining the position of a component prior to placement | |
| US6055055A (en) | Cross optical axis inspection system for integrated circuits | |
| JP2001136000A (en) | Jig for detecting attaching accuracy of attaching apparatus and method for detecting attaching accuracy | |
| CN110581096B (en) | LED chip photoelectric and appearance integrated detection equipment | |
| CN109524320B (en) | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device | |
| JP2011066041A (en) | Electronic component mounting device | |
| JPS63102294A (en) | Electronic component tester | |
| JPH0653694A (en) | Electronic component mounting machine | |
| JPH01284744A (en) | Inspecting device for electronic component | |
| JP2000164626A (en) | Method and device for bonding components | |
| JP2000046747A (en) | Method and apparatus for inspecting appearance of liquid crystal substrate | |
| JP3277531B2 (en) | Substrate condition measuring device | |
| KR20020029853A (en) | Pcb inspection system | |
| CN218974154U (en) | Appearance detection device | |
| JP2890568B2 (en) | QFPIC lead bending inspection device | |
| JPS59103464A (en) | Picture automatic checker | |
| TWI834440B (en) | Processing equipment and processing method | |
| WO2022062057A1 (en) | Motion control device capable of automatically adjusting depth of field and automated optical inspection machine | |
| JP2830235B2 (en) | Inspection device and inspection method | |
| WO2023157061A1 (en) | Inspection device, mounting device, inspection method, and program | |
| WO2021079543A1 (en) | External appearance inspection apparatus and external appearance inspection method | |
| JPH0726832B2 (en) | IC visual inspection device | |
| KR20230067199A (en) | Apparatus for inspecting metal mask | |
| JPH0613962B2 (en) | IC wafer automatic positioning device | |
| JP3191058B2 (en) | IC transport device |