JPH02269943A - Outward appearance inspecting device for semiconductor device - Google Patents

Abstract

PURPOSE:To reduce the operation for sucking, carrying, and mounting the semiconductor device and to prevent leads from curving by sucking the semiconductor device by a suction nozzle which can be elevated and rotated and rotating the semiconductor device at its elevation position. CONSTITUTION:The suction nozzle 5 which can be elevated and rotated sucking the semiconductor device 1 is provided and the leads of the semiconductor device 1 which is sucked by the nozzle 5 is lighted by a lighting device 6 which emits flash light and picked up by a television camera 4. Then the semiconductor device 1 which is carried to under the nozzle 5 and positioned as to the camera 4 is sucked by the downward movement of the nozzle 5 and carried to an inspection position by the elevation of the nozzle 5. When the nozzle 5 rotates, the lighting device 6 emits flash light with the signal from a sensor and as the nozzle 5 rotates, the leads of the semiconductor device 1 in rotation are picked up by the camera 4 as an image. When the semiconductor device 1 has the leads projecting in four directions, the lighting device 6 emits flash light four times in one rotation of the suction nozzle 5 and the leads in the four directions are picked up by the camera 4 as an image.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a visual inspection device that illuminates a semiconductor device to be inspected (hereinafter referred to as a semiconductor device), simultaneously photographs an image, and performs a visual inspection using the image. be.

[Conventional technology]

FIG. 3 is a schematic front view showing an inspection section of a conventional appearance inspection apparatus for semiconductor devices. In the figure, (1) is a semiconductor device,
(2) is a fixed plate on which the semiconductor device (1) is placed, (3) is a lighting device that illuminates the leads of the semiconductor device (1), and (4) is a semiconductor device M illuminated by the lighting device M (3). (1) This is a television camera that photographs the lead.

Next, the operation will be explained. The semiconductor device (1) is taken out by a suction device from a pallet or the like that stores the semiconductor device e (1), and is positioned with respect to the television camera (4).
It is placed on the fixed plate (2) in a positioned state by a suction device. Semiconductor device (1) placed on fixed plate (21)
This lead is illuminated by an illumination device M (3), and the illuminated lead is photographed as an image by a television camera (4). In the case of a semiconductor device (1) with leads extending in four directions, the fixed plate (2) is rotated 90 degrees at a time, and the leads facing the television camera (4) are photographed four times. The photographed image is inspected by an inspection processing unit, and as a result of the inspection, a good product or a defective product is determined.

[Problem to be solved by the invention]

Conventional external appearance inspection equipment for semiconductor devices is configured as described above, so in order to take a lead image of the semiconductor device, the semiconductor device must be placed on a fixed plate, and the semiconductor device must be picked up and transported. - There is a risk that the number of mounting operations will increase, leading to lead failures in semiconductor devices. Ta. In addition, in the case of a semiconductor device with leads extending in four directions, the fixed plate should be
The lead had to be photographed four times by rotating it in degrees, resulting in a slow inspection speed.

This invention was made to solve the above-mentioned problems, and it reduces the operations of suctioning, transporting, and placing semiconductor devices, and prevents lead bending by taking images of the leads while the semiconductor device is rotating. The purpose is to obtain an appearance inspection device that is difficult to cause damage and has a high inspection speed.

[Means to solve the problem]

The appearance inspection apparatus for semiconductor devices according to the present invention attracts a semiconductor device to a suction nozzle that can be raised and lowered and rotated, rotates it in the raised position, flashes a lighting device that illuminates the leads of the semiconductor device, and at the same time The system is designed to take a lead image of the image.

[Effect]

In this invention, the semiconductor device attracted to the suction nozzle is rotated by rotating the suction nozzle.
The lead can be photographed as an image using the flash of the illumination device.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings. 1st
1 is a schematic front view showing an inspection section of an appearance inspection apparatus for semiconductor devices, and FIG. 2 is a plan view of the inspection section of FIG. 1. In the figure, (1) is the semiconductor device to be inspected, (5) is the suction nozzle that suctions the semiconductor device M (1) and can be raised and lowered and rotated, (6)
) is the semiconductor device @ (1) that is sucked by the suction nozzle (5).
The illumination device (4) that can flash illuminates the leads of the semiconductor device 1 (1) is a television camera that photographs the leads of the semiconductor device 1 (1) illuminated by the illumination device (6).

Next, the operation will be explained. The semiconductor device (1) is taken out by a suction device from a pallet containing the semiconductor device (1), etc., and is transported to below the suction nozzle (5) and positioned with respect to the television camera (4).

The positioned semiconductor device (1) is attached to the suction nozzle (5).
) is sucked by the lowering of the suction nozzle (5), and is carried to the inspection position by the raising of the suction nozzle (5). When the suction nozzle (5) rotates,
Since the positional relationship between the television camera (5) and the semiconductor device (1) is determined in advance, when the lead of the semiconductor device (1) faces the television camera (4), the suction nozzle (
51, a sensor (not shown) outputs a signal, and the detection signal causes the illumination device to flash, and as the suction nozzle (5) rotates, the rotating semiconductor device (1
) is photographed as an image by a television camera (4).

At this time, in the case of a semiconductor device (1) with leads extending in four directions, the illumination device (6) flashes four times during one rotation of the suction nozzle (5), and the leads in the four directions appear as images on the television. Take a picture with the camera (4). The photographed image is inspected by an inspection processing unit, and as a result of the inspection, a non-defective product or a defective product is determined.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to take an image of the lead of the semiconductor device while the suction nozzle is rotating, with the semiconductor device being suctioned to the suction nozzle. This requires fewer operations, reduces the risk of lead bending, and has the effect of increasing inspection speed.

[Brief explanation of drawings]

FIG. 1 shows lA of a semiconductor device according to an embodiment of the present invention.
FIG. 2 is a plan view of the inspection section of FIG. 1, and FIG. 3 is a schematic front view of the inspection section of a conventional visual inspection apparatus for semiconductor devices. In the figure, (1) is a semiconductor device, (4) is a television camera, (5) is a suction nozzle, and (6) is a lighting device. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] A suction nozzle that can be raised and lowered and rotated to suction semiconductor devices,
A lighting device illuminates the lead part of the semiconductor device adsorbed by the suction nozzle at the raised position of the suction nozzle; Appearance inspection equipment for semiconductor devices equipped with a television camera that takes images.