JPH0222899A - Device for recognizing position of component - Google Patents

Abstract

PURPOSE:To obtain a component position recognizing device which can pick up a picture of components by means of a camera without stopping a mounting head by providing mark pins corresponding to attraction nozzles to the mounting head at fixed intervals and taking the pictures of the mark pins and components attracted by the nozzles in the same frame by means of the camera. CONSTITUTION:Mark pins 20 are arranged in parallel with each other in corresponding to an attraction nozzles 4 in the main body section 2 of a mounting head 1. Each mark pin 20 coincides in position with its corresponding nozzles 4 in the direction X, but is separated from the nozzle 4 by a fixed distance in the direction Y. In such constitution, the head 1 passes over a camera 10 in the direction X at a fixed speed after attracting chip parts 15 by means of each nozzle 4 from a chip part supplying section, etc. The camera 10 takes a still picture inside a circle Q by opening its high- speed shutter. Then the positional deviations of the pins 20 and camera 100 from the center O of the visual field in the direction X are calculated from the still picture containing the parts 15 and pin 20 and the position of the nozzle 4 paired to the pin 20 is further calculated. Moreover, whether or not the parts 15 are attracted by the nozzle 4 in a proper attitude is discriminated by means of a picture processing means which receives the picture signal of the camera. Therefore, the attitude and position of the parts can be recognized with high accuracy.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention provides a component position recognition device for reliably and quickly recognizing the position of components such as chip capacitors and chip resistors held by a mounting head with a camera. Regarding.

(Prior art) Conventionally, Japanese Patent Application Laid-open Nos. 61-287195 and 62-46382
No., 62-46383, 62-57281, 62-
In No. 60292, a mounting head is provided with a reflecting means, a light source is placed opposite the mounting head, and the chip component is detected by utilizing the fact that the light reflected by the reflecting means is blocked by the chip component attracted by the mounting head. It has been proposed to use a camera to capture images of dark areas.

(Problem to be Solved by the Invention) By the way, the configuration of JP-A No. 61-287195 etc. is based on the premise that the position of the camera and the position of the mounting head are fixed when photographing chip components. It is necessary to determine whether the chip component position (dark area position) in the image obtained by aligning the center of the camera screen and the center of the suction nozzle of the mounting head is appropriate.

However, from the perspective of improving the efficiency of chip component mounting operations, the mounting head that holds the chip component by suction must be stopped in front of the camera, and after the camera captures an image of the chip component, the mounting head is moved again and placed onto the printed circuit board. It is not preferable to carry out mounting of chip parts. In particular, when a mounting head is equipped with multiple suction nozzles, if image capture is performed while the chip components suctioned and held by each suction nozzle are stopped in front of the camera, the problem is that the number of stops increases and it takes too much time. be.

SUMMARY OF THE INVENTION In view of the above points, an object of the present invention is to provide a component position recognition device that allows a camera to capture an image without stopping a mounting head.

(Means for Solving the Problem) In order to achieve the above object, the present invention provides a component position recognition device that recognizes the position of a component sucked by a suction nozzle of a mounting head using an image of the component. In this method, mark bins corresponding to the suction nozzles are provided on the mounting head at a certain interval, and the mark bins and the parts suctioned by the suction nozzles are photographed on the same screen by a camera.

(Function) In the component position recognition device of the present invention, the mark bin that has a certain positional relationship with the suction nozzle of the mounting head is
The image is displayed on the same screen as the picked up parts, and even if the center of the camera screen and the center of the suction nozzle are misaligned, the center of the suction nozzle can be recognized from the position of the mark bin, and the position of the picked up part with the suction nozzle is correct. I can also tell what's going on. Additionally, since there is no need for the center of the camera screen to match the center of the suction nozzle, still images can be captured by opening and closing the camera shutter (e.g. electronic shutter) at high speed while moving the mounting head at a constant speed while facing the camera. It is possible to reduce the time taken by the camera to capture an image of the suction component.

(Example) Hereinafter, an example of the component position recognition device according to the present invention will be described with reference to the drawings.

In FIGS. 1 to 3, the mounting rod 1 has an elevating part 3 that can be raised and lowered and rotated with respect to the main body part 2, and a suction nozzle 4 for vacuum suctioning parts on the lower end side of the elevating part 3. It was established. Here, as shown in FIG. 2, a plurality of suction nozzles 4 are arranged at equal intervals in the X direction, and each
(and the elevating part 3 to which it is attached) has a structure that allows it to be raised and lowered individually and rotated using a cam mechanism, air cylinder, etc.

Furthermore, mark bins 20 are arranged parallel to each other in the main body 2 of the mounting rod 1 in correspondence with each suction nozzle 4, as shown in the bottom view of Fig. fjS3.

Here, each mark bin 20 has a corresponding suction nozzle 4 and
Their directional positions match, and they are separated by a certain distance in the Y direction.

The tip end surface of the mark bin 20 is treated to be non-reflective or black, and the outer peripheral surface is a diffusely reflective surface, or the entire mark bin 20 is treated to be non-reflective.

Such a mounting head 1 is attached to the lower side of the X-Y table 5, and is movable in the X direction and the Y direction perpendicular thereto.

Further, the lower end surface of the elevating part 3 of the mounting head, which is the background around the suction nozzle 4, is configured as a first reflective surface (including a diffused reflection surface that scatters light) 6. The lower end surface is configured as a second reflective surface 7 (including a diffused reflective surface that scatters light). Specifically, faces 6 and 7
One of the following configurations is used so that the reflection conditions are the same.

(1) Same material, same color, and same surface treatment.

For example, an alumite treatment is performed on a satin finish.

(2) Attach a board or sheet. For example, attach a satin-finished alumite plate, a satin-finished white sheet, or a translucent floating white resin.

(3) Apply white or other paint.

(4) Apply fluorescent paint.

(5) Paste a resin plate or sheet containing a fluorescent agent.

A ring light source 9 having an annular light emitting portion 8 is disposed below the mounting rod 1 opposite to its reflective surface 6.degree. 7, and a camera 10 is further disposed below the ring light source 9. It is preferable that the center of the camera 10 and the center of the ring light source 9 coincide with each other, and these are supported by a holder 11.

Note that when capturing an image, it is preferable that the lower surface of the chip component 15 suctioned and held by the suction nozzle 4 and the tip surface (lower end surface) of the mark bin 20 are at the same height position. This is to enable the camera 10 to focus on both the tip end surface of the mark bottle and the bottom surface of the chip component as clear images. Therefore, it can be seen that if a black mark is provided directly on the reflective surface 7, the camera 10 will not be able to focus, and a clear image cannot be captured.

In the configuration of the above embodiment, after each suction nozzle 4 of the RAD 1 sucks and holds the chip component 15 from the chip component supply section or the like, the mounting head 1 moves the camera 10 over the camera 10 in an X direction.
Pass at a constant speed in the direction.

The camera 10 opens and closes the shutter at high speed to obtain a still image within a circle Q corresponding to the camera field of view in FIG.

This still image includes a chip component 15 held by one suction/slip 4 and one mark bin 20 corresponding to the suction/slip 4. The light is reflected by the first and second reflecting surfaces 6.7 and is parallel to the suction nozzle 4.The light beam is then incident on the camera 10, and the tip surfaces of the suction chip component 15 and the mark bottle 20 become dark areas. , is an image with a bright background. Then, such still images are captured into the camera 10 in correspondence with all the suction nozzles that the RAD 1 has.

In addition, when RAD 1 passes over the camera in the X direction,
The position of the RAD 1 in the Y direction does not change during installation.

For example, the center O of the camera screen and the position of each suction nozzle 4 in the Y direction are made to match.

Then, the positional deviation S in the X direction between the mark bin 20 and the center of field of view O of the camera 10 is calculated from the still image including the suction chip component 15 and the mark bin 20, and the position of the suction nozzle 4 paired with the mark bin 20 is calculated. Calculate the fourth
An image processing means that receives an image signal from the camera 10 determines whether the chip component 15 is being sucked in the correct posture with respect to the suction nozzle 4 as shown in FIG.

As shown in FIG. 4(B), the position of the chi-knob part 15 is shifted with respect to the suction nozzle 4, and the positional shift in the X direction is ΔX, Y
If there is a positional deviation ΔY in the direction and a positional deviation 80 in the rotational direction, when the mounting RAD 1 performs the operation of mounting the chip component 15 onto the printed circuit board, the X - Just correct ΔX1ΔY on the Y table 5 side and rotate the suction/zipper 4 to correct Δθ. Note that the suction nozzle 4 for vacuum suctioning chip components usually uses a metal pipe, but alumina etc. It is also possible to employ a translucent adsorption 7x module made of translucent ceramic, translucent resin such as acetal polycomer resin, translucent glass, or the like. This translucent suction nozzle has the property of appropriately scattering incident light and generates light rays parallel to the suction nozzle, so even when a chip component with an external size smaller than the tip surface of the suction nozzle is suctioned and held, the semi-transparent suction nozzle The tip surface of the transparent suction nozzle does not become a dark area, and a still image in which the outline of the small chip component becomes a dark area can be captured.

5 and 6 show modified examples of the mark bin. In the modified example shown in FIG. 5, only the tip end face of the mark bin 20 is formed into a large disc-shaped portion 21, thereby eliminating the influence of the shadow of the outer peripheral surface of the mark bin. be. In the modification shown in Fig. 6, the mark bottle 20 is made of translucent ceramic, translucent resin such as acetal polycomer resin, or translucent glass, and the mark bottle 20 shown in Fig. 6 (B) is formed on the tip surface.
It has a black cross mark 22 or a black circle mark 23 as shown in the same figure (C), and the corresponding suction 7 zuru 4
You can display the location more accurately.

In addition, in the above embodiment, the case where the image is captured with the parts and the mark bin 20 tip surface as the dark part, but the part and the mark bottle 20 tip surface are taken as the bright part, and the elevating part 3 of the mounting head is captured.
The lower surface of the main body 2 may be subjected to anti-reflection treatment, and the image may be captured with the background as a dark area.

(Effects of the Invention) As described above, according to the component position recognition device of the present invention, mark bins corresponding to the suction nozzles are provided on the mounting head with a certain interval between them, and the mark bins and the parts suctioned by the suction nozzles are provided. Since the camera is configured to capture the images on the same screen, the position of the suction nozzle can be determined from the mark pins on the screen, and it can be recognized whether the position of the suction component relative to the suction nozzle is appropriate. Therefore, high accuracy in recognizing the posture and position of the component can be obtained without being affected by a shift in the positional relationship between the camera and the suction nozzle when capturing an image.

Furthermore, images can be captured without stopping the mounting head relative to the camera, and the time required to capture images can be shortened.

[Brief explanation of the drawing]

Fig. 1 is an enlarged side sectional view of the main components of a component position recognition device according to an embodiment of the present invention, Fig. 52 is a front view showing the overall configuration of the embodiment, and Fig. 3 is a suction nozzle in the embodiment. FIG. Fig. 5 (B) is a bottom view of the same, Fig. 6 (A) is a front view of another modification of the mark pin, vJ6 Fig. (B), (C
) is a bottom view showing marks on the tip end surface of the mark pin in another modification. DESCRIPTION OF SYMBOLS 1... Mounting head, 2... Main body part, 3... Lifting part, 4... Suction nozzle, 5... X-Y table, 6,
7... Reflective surface, 9... Ring light source, 10... Camera, 15... Chip component, 20... Mark pin.

Claims (2)

[Claims] (1) In a component position recognition device that recognizes the position of a component picked up by a suction nozzle of a mounting head using an image of the part, the mark pin corresponding to the suction nozzle is spaced apart for a certain period of time and the part is mounted. 1. A component position recognition device, which is provided on a head, and displays the mark pin and the component sucked by the suction nozzle on the same screen using a camera. (2) The component position recognition device according to claim 1, wherein the mounting head has a plurality of suction nozzles, and a mark pin is arranged corresponding to each suction nozzle.