JP4617607B2 - Electronic component positioning apparatus and method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to an electronic component positioning apparatus and method, and more particularly to an electronic component positioning apparatus and method for positioning a chip component such as a semiconductor element with respect to a mounted object such as a substrate.
[0002]
[Prior art]
  Semiconductor devices and electronic components have been improved in performance and have been reduced in size. As semiconductor devices and electronic components have been improved in performance and reduced in size, high-density mounting techniques have also been advanced in order to mount these semiconductor devices and electronic components on an object to be mounted.
  That is, as the performance of semiconductor devices and electronic components has been improved and miniaturized, various electronic component positioning devices and techniques related to electronic component positioning methods have been developed and put into practical use.
[0003]
  As one of technologies related to such an electronic component positioning device and electronic component positioning method, for example, disclosed in JP-A No. 04-010551, a flat plate-shaped suction hole made of a transparent material is disclosed. There is technology using collets.
  In this technology, the chip part is sucked and held, the collet is transmitted, the surface pattern of the chip part is observed by the imaging device, the position of the surface pattern is measured by the image processing device, and the position of the surface pattern is shifted. In this case, this positional deviation is corrected to accurately position the chip component.
[0004]
  This collet has a structure in which a suction hole that communicates with the vacuum generator is drilled in a flat plate made of a transparent material, and the chip components are held by suction with a suction force proportional to the vacuum level of the vacuum generator and the area of the suction hole. To do.
  And the electronic component positioning device using this collet is usually soldered on the mounted object in a state where the chip component is held by suction.
[0005]
[Problems to be solved by the invention]
  However, when this collet is applied to the chip component in a direction parallel to the plane part of the collet due to, for example, surface tension generated when the solder melts, this colleting force is applied to the contact between the collet and the chip component. When the frictional force generated in the portion becomes larger, there is a problem that the chip component moves on the collet plane and the position of the chip component is shifted.
[0006]
  Also, quartz glass is usually used as the material for the collet, and gold having a lower hardness than quartz glass has been used as the material for the surface pattern of the chip component.
  For this reason, when the collet adsorbs and holds the chip component and a part of the surface of the collet and the chip component is in contact, if excessive pressure is applied to the contact portion between the collet and the chip component surface, the surface of the chip component There was a problem that the pattern was deformed.
[0007]
  In addition, for example, chip parts made of a gallium arsenide compound, which is harder than gold, are sandwiched between the collet and the chip part, and excessive pressure is applied to the contact portion between the collet and the chip part surface. When it adds, there existed a problem that the surface pattern of a chip component will deform | transform into an indentation shape by a fragment.
[0008]
  In addition, although a transparent material is used as the material for the collet, the surface pattern of the chip component and an image of observing this surface pattern are observed when the chip component is soldered. If it is attached at an intermediate position with respect to the apparatus, a part or all of the surface pattern is hidden by the attached matter and cannot be observed, and the surface pattern of the chip component cannot be accurately measured.
  Furthermore, there has been a problem that it is necessary to meet a demand for further improving the positioning accuracy of the electronic component or improving the reliability of the positioning accuracy.
[0009]
  The present invention has been proposed in order to solve the above-described problems of the prior art, and does not cause misalignment when soldering an electronic component and damages the surface pattern of the electronic component. It is an object of the present invention to provide an electronic component positioning apparatus and method for accurately positioning an electronic component.
[0010]
  In JP-A-8-45970, a semiconductor chip is adsorbed on a collet having a tapered surface, and the amount of positional deviation between the pattern image of the collet end imaged with the semiconductor chip adsorbed and the reference pattern is calculated. A technique of a die bonding apparatus that positions a semiconductor chip by correcting the amount of movement of the collet by this amount of positional deviation has been proposed.
  However, although this technology can accurately attach the semiconductor chip to the mounted object even if the semiconductor chip is not accurately attracted to the collet or the production accuracy of the collet is insufficient, the semiconductor Since the chip is not accurately attracted to the collet, that is, the semiconductor chip is tilted and attracted to the collet, there is room for improvement in further improving the mounting accuracy and improving the reliability of the mounting accuracy. It was.
[0011]
[Means for Solving the Problems]
  To achieve the above object, the present inventionPower ofThe child component positioning deviceSurface pattern is formed on the upper surfaceA preliminary recognition stage on which the electronic component is placed, and provided above the preliminary recognition stage, images the electronic component,TheAn imaging device for electronic parts that outputs image data;A pyramid collet that has a quadrangular pyramid-shaped recess and picks up the electronic component in contact with the opposing inclined surfaces of the quadrangular pyramid,thispyramidA position correction device for correcting the position of the collet; andProvided in the pyramid collet;A mounting head unit having a position recognition unit for recognizing the position of the picked-up electronic component;,in frontA mounting stage on which the object to be mounted is mounted, and the position recognition unit provided above the mounting stage and moved on the mounting stageas well asImage the load,TheAn imaging device for an object to output image data;The electronic component imaging device and the mounted object imaging device are connected, and image data of the electronic component is input, the position of the electronic component, the surface pattern of the electronic component, and the position of the electronic component and the An image processing apparatus that measures a pattern positional deviation with respect to a surface pattern of the electronic component, inputs image data of the position recognition unit and the mounted object, and measures positions of the position recognition unit and the mounted object And input the position data of the electronic component measured by the image processing apparatus and connected to the image processing apparatus and the mounting head unit, and based on the position data of the electronic component, the pyramid collet of the mounting head unit However, after the relative position correction with respect to the electronic component is performed, the electronic component is controlled to be picked up, and the image processing apparatus performs measurement. The position recognition unit, the position data of the mounted object, and the pattern position deviation data are input, the position data of the position recognition unit, the position data of the mounted object, and the electrons picked up by the pyramid collet. The pyramid collet of the mounting head unit corrects the relative position with respect to the mounted object based on the positional relationship data between the component and the position recognition unit, and the pattern positional deviation data. A controller for controlling the electronic component to be mounted on the mounted object;It is set as the structure comprised.
[0012]
  In this way, the position was corrected based on the position data of the electronic component placed on the preliminary recognition stage.pyramidThe collet picks up the electronic component in a state where the electronic component can be accurately positioned. Further, the position data of the position recognition unit, the position data of the mounted object, andpyramidThe position was corrected based on the positional relationship data between the electronic component picked up by the collet and the position recognition unit.pyramidSince the collet mounts the electronic component on the mounted object, the positioning accuracy of the electronic component and the reliability of the positioning accuracy can be improved..
[0013]
  In addition, since the imaging device for electronic parts directly observes the electronic parts that are not attracted and held by the pyramid collet, for example, even when the attached matter adheres to the pyramid collet, the adverse effect when the image is recognized by the attached matter Can be eliminated.
[0014]
  Also,A quadrangular frustum-shaped recess was formed in the suction part of the electronic component.pyramidSince the collet (appropriately referred to as a pyramid collet) picks up the electronic component in contact with the opposing inclined surface of the quadrangular pyramid, for example, when soldering the electronic component, it occurs when the solder melts. Even when a horizontal displacement force is applied to the electronic component due to surface tension, the reaction force against the displacement force can be generated by the inclined surface of the pyramid collet, and the electronic component is displaced (moved). Can be effectively prevented.
  In addition, since there is no contact between the surface pattern of the electronic component and the pyramid collet, it is possible to reliably prevent problems such as damage to the surface pattern of the electronic component.
[0015]
  AlsoTheProvide a position recognition unit near the electronic component to be backed upBy,pyramidThe accuracy of the positional relationship data between the electronic component picked up by the collet and the position recognition unit can be increased.
[0016]
  Further, even when the surface pattern of the electronic component is misaligned with respect to the outer shape of the electronic component (appropriately referred to as pattern misalignment), the electronic component is mounted on the basis of the surface pattern. Can be positioned on an object.
[0017]
  In addition, since the imaging device for electronic components directly observes the surface pattern of the electronic component, for example, even when the deposit adheres to the collet, the surface pattern of the surface pattern is not adversely affected by the image recognition due to the deposit. The position can be measured accurately.
[0018]
  In the electronic component positioning device of the present invention, the position recognition unit may be a position recognition pin.
  In this way, since the position recognizing part can be made into a simple shape (pin shape), the manufacturing cost can be reduced, and the electronic parts picked up by the pyramid collet and the position recognizing part can be reduced. The positional relationship data can be easily calculated.
[0019]
  Since it is necessary to recognize the coordinate position of the electronic component in the X direction and the Y direction and the rotation angle of the electronic component in the θ direction from this position recognition unit, when using one position recognition pin, Recognize the pin in the horizontal direction, recognize the coordinate position in the X and Y directions at the center of gravity and tip of the position recognition pin, and recognize the rotation angle in the θ direction from the protruding direction of the position recognition pin. To do.
[0020]
  Moreover, the electronic component positioning apparatus of this invention may provide the heating means for melting the solder piece which connects the said electronic component and a to-be-mounted object to the said mounting stage.
If it does in this way, it can solder to a to-be-mounted thing in the state which positioned the electronic component, and can improve production efficiency.
[0021]
  In addition, the present inventionPower ofThe child component positioning method is a preliminary recognition stage.InPlacedSurface pattern is formed on the upper surfaceAn electronic component positioning method for positioning and mounting an electronic component on a mounted object placed on a mounting stage, wherein the electronic component imaging device images the electronic component and outputs image data.The pictureOutput to image processorDrawingAn image processing device inputs the image data, and the position of the electronic component, Surface pattern of the electronic component, and pattern positional deviation between the position of the electronic component and the surface pattern of the electronic componentTo control the mounted head unitRucoThe frontDrawingPlaced on the preliminary recognition stage measured by the image processing deviceAboveEnter the electronic component position data,AbovePicking up the electronic component based on the electronic component position datapyramidThe position of the collet is obtained and the mounting head unit ispyramidCollet picks up the electronic componentpyramidAfter the position is corrected at the collet position, the electronic component is picked up.The aboveThe loaded object was placedAboveMove to the mounting stage, and the imaging device for the mounted objectpyramidImage the position recognition unit provided on the collet and the mounted object,AbovePosition recognition unit andAboveThe image data of the loaded objectAboveOutput to the image processor,The pictureAn image processing apparatus inputs image data of the position recognition unit and the mounted portion, and the position recognition unitAboveMeasure the position of the mounted object and control the mounted head unitAboveThe controller isDrawingThe position recognition unit measured by the image processing apparatus; andAbovePosition data of the load, And data of the pattern position deviationEnterAbovePosition data of the position recognition unit,AbovePosition data of the load,in frontRecordpyramidPosition relationship data between the electronic component picked up by a collet and the position recognition unit, And data of the pattern misalignmentBased on the above, mount the electronic partspyramidThe position of the collet is obtained and the mounting head unitpyramidCollet mounts the electronic componentspyramidAfter the position is corrected at the collet position, the electronic component is mounted on the mounted object.
[0022]
  As described above, the present invention is also effective as an electronic component positioning method, and the collet whose position is corrected based on the position data of the electronic component placed on the preliminary recognition stage can accurately position the electronic component. Further, the collet whose position is corrected based on the position data of the position recognition unit, the position data of the mounted object, and the positional relation data between the electronic component picked up by the collet and the position recognition unit is an electronic component. Therefore, the positioning accuracy of the electronic component and the reliability of the positioning accuracy can be improved.
  Further, even when the surface pattern of the electronic component is misaligned with respect to the outer shape of the electronic component (appropriately referred to as pattern misalignment), the electronic component is mounted on the basis of the surface pattern. Can be positioned on an object.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
  Hereinafter, each embodiment of the present invention will be described with reference to the drawings.
  First, an embodiment of an electronic component positioning device according to the present invention will be described.
[0024]
"Electronic component positioning device"
  FIG. 1 is a schematic configuration diagram for explaining an electronic component positioning apparatus according to the present invention.
  In the figure, an electronic component positioning apparatus 1 includes a preliminary recognition stage 2 on which an electronic component 20 is mounted, a mounting stage 3 on which an object 30 is mounted, and an electronic device provided above the preliminary recognition stage 2. From the imaging device for parts 4, the imaging device for mounted object 6 provided so as to be movable up and down by the vertical movement device 5 above the mounting stage 3, the imaging device for electronic parts 4, and the imaging device for mounted object 6 An image processing device 7 that inputs image data and processes the image, a mounting head unit 8 that picks up and mounts the electronic component 20, a preliminary recognition stage 2, a mounting stage 3, a vertical movement device 5, and a controller that controls the mounting head unit 8. 9, the electronic component 20 on the preliminary recognition stage 2 is picked up and positioned on the mounted object 30 on the mounting stage 3.
[0025]
  Here, the electronic component 20 has a square flat plate shape when viewed from the upper surface, and has a structure in which a surface pattern is formed on the upper surface and an external electrode is disposed on the lower surface. Of course, the structure of the electronic component 20 is not limited to this structure.
  Further, although only one electronic component 20 is placed on the preliminary recognition stage 2, for example, it may be placed together in a state of being set on a tray.
  Furthermore, the electronic component 20 is usually a semiconductor element such as a semiconductor chip. However, the electronic component 20 may be a chip component such as a resistor or a capacitor, an electronic component such as a substrate, or a connector, and is particularly limited to a semiconductor element. is not.
[0026]
  The preliminary recognition stage 2 is provided with an angle control motor (not shown) that rotates and moves the upper surface on which the electronic component 20 is placed. This motor is rotated by a control signal from the controller 9 and placed. The position of the electronic component 20 is adjusted in the rotational direction (θ direction).
  In this embodiment, the angle control motor isForecastAlthough it is configured to be provided on the equipment recognition stage 2, for example, it may be configured to be provided on the mounting head unit 8.
  Although not shown, the preliminary recognition stage 2 may be configured to include a suction-type fixing device for fixing the electronic component 20, a clamp for pressing and fixing from the horizontal direction, and the like.
[0027]
  The electronic component imaging device 4 is provided above the preliminary recognition stage 2 and is configured to capture an image of the electronic component 20 and output image data.
  Here, the electronic device imaging device 4 may be configured to have an imaging capability capable of recognizing the outer shape of the electronic component 20 and also recognizing the surface pattern of the electronic component 20, and in this way, the electronic component positioning device 1. Can be positioned with respect to the surface pattern of the electronic component 20 even with respect to the electronic component 20 whose surface pattern is displaced from the outer shape.
[0028]
  The image processing device 7 is electrically connected to the electronic component imaging device 4 and is configured to input image data of the electronic component 20 captured by the electronic component imaging device 4 and measure the position of the electronic component 20. is there.
  In the present embodiment, the image processing device 7 is configured to also input and process image data from the mounting object imaging device 6 to be described later. By doing so, the image processing device is replaced with an electronic component. Therefore, it is not necessary to provide the image pickup device 4 for each object and the image pickup device 6 for the mounted object, so that the cost of the image processing device can be reduced. Of course, the image processing device may be provided for each of the electronic device imaging device 4 and the mounted object imaging device 6.
[0029]
  The mounted head unit 8 is picked up by a pyramid collet 81 for picking up the electronic component 20, a horizontal movement device 82 for correcting the position of the pyramid collet 81 in the X direction and the Y direction, an elevating device 83 for moving the pyramid collet 81 in the vertical direction. The position recognition pin 84 for recognizing the position of the electronic component 20 and the vacuum generator 85 for vacuum-sucking the electronic component 20 are provided, and the electronic component 20 on the preliminary recognition stage 2 is picked up. Then, it is positioned and mounted on the mounted object 30.
[0030]
  Here, the horizontal movement device 82 corrects the position of the pyramid collet 81 in the X direction and the Y direction, and the preliminary recognition stage 2 described above adjusts the position of the electronic component 20 in the rotation direction (θ direction). The electronic component positioning apparatus 1 can correct the position of the pyramid collet 81 with respect to the X direction, the Y direction, and the θ direction of the electronic component 20. That is, in the present embodiment, the horizontal movement device 82 and the preliminary recognition stage 2 function as a position correction device that corrects the position of the pyramid collet 81.
  The horizontal moving device 82 has a horizontal movable stroke including the positions of the preliminary recognition stage 2 and the mounting stage 3, and the lifting device 83 sucks and holds the electronic component 20 and picks it up. It has a vertically movable stroke.
[0031]
  The controller 9 is electrically connected to the image processing device 7, the horizontal movement device 82 of the mounted head unit 8, the lifting / lowering device 83, the vacuum generator 85 and the preliminary recognition stage 2, and the preliminary recognition stage 2 measured by the image processing device 7. The position data (position data in the X direction, Y direction, and θ direction) of the electronic component 20 placed on the electronic component 20 is input, and the pyramid collet 81 is relative to the electronic component 20 based on the position data of the electronic component 20. After the position is corrected, the electronic component 20 is controlled to be picked up.
  The reason for the relative position correction is that the position correction in the θ direction is performed by the preliminary recognition stage 2.
[0032]
  In the present embodiment, the controller 9 is configured to input and process the position data of the mounted object 30 and the position recognition pin 84 from the mounted object imaging device 6 to be described later. By doing this, Since it is not necessary to provide a controller for each of the electronic device imaging device 4 and the mounted object imaging device 6, the cost of the controller can be reduced. Of course, a controller may be provided for each of the electronic device imaging device 4 and the mounted object imaging device 6.
[0033]
  As described above, the electronic component positioning apparatus 1 is in a state in which the pyramid collet 81 whose position is corrected based on the position data of the electronic component 20 can be accurately positioned with respect to the electronic component 20 placed on the preliminary recognition stage 2. Pick up. That is, since the electronic component 20 is accurately attracted to the adsorption position of the pyramid collet 81 (adsorption position that can be accurately positioned), for example, it is possible to prevent the electronic component 20 from being inclined and adsorbed to the pyramid collet 81. The mounting accuracy can be further improved and the reliability of the mounting accuracy can be improved.
  In addition, since the electronic device imaging device 4 directly observes the electronic component 20 that is not attracted and held by the pyramid collet 81, for example, even when an adhering material adheres to the pyramid collet 81, image recognition by the adhering material is performed. It is possible to eliminate the adverse effects when doing so.
[0034]
  The mounted object 30 is placed on the mounting stage 3.
  Here, the mounted object 30 is usually a mounted substrate or the like, but may be an electronic component such as a semiconductor device, for example, and is not particularly limited to the mounted substrate.
  Moreover, the solder piece 40 is mounted on the upper surface of the mounted object 30. In this way, the electronic component 20 is positioned and mounted on the mounted object 30, and soldering is performed in a proper manner. Can do.
[0035]
  That is, the electronic component positioning device 1 may be configured to include a heating means (not shown) for melting the solder pieces 40 that connect the electronic component 20 and the mounted object 30 to the mounting stage 3. As a result, the electronic component 20 can be soldered to the mounted object 30 in a proper manner with the electronic component 20 positioned.
[0036]
  Similarly to the preliminary recognition stage 2, the mounting stage 3 is attached with an angle control motor (not shown) that rotates and moves the upper surface on which the mounted object 30 is placed. And the position of the mounted object 30 is adjusted in the rotation direction (θ direction).
  It should be noted that the electronic component 20 picked up by the pyramid collet 81 can be set in a state where there is no positional deviation in the θ direction, or when the positional deviation in the θ direction can be ignored. The motor may not be provided.
  Although not shown, the mounting stage 3 may be configured to include a suction-type fixing device for fixing the object to be mounted 30, a clamp for pressing and fixing from the horizontal direction, and the like.
[0037]
  The mounted object imaging device 6 is provided above the mounting stage 3 and images the position recognition pins 84 and the mounted object 30 (including the surface pattern of the mounted object 30) that have moved onto the mounting stage 3. The image data is output to the image processing device 7.
  Here, the imaging device 6 for the mounted object can image the position recognition pin 84 and the mounted object 30 having different focal lengths by moving up and down by the vertical movement device 5 controlled by the controller 9. .
  Of course, the imaging device 6 for a mounted object captures an image so that the mounted position of the mounted object 30 can be recognized when the mounted object 30 is imaged.
[0038]
  The image processing device 7 is electrically connected to the mounted object imaging device 6, and inputs the image data of the position recognition pin 84 and the mounted object 30 captured by the mounted object imaging device 6, The position of the recognition pin 84 and the mounted object 30 (including the surface pattern of the mounted object 30) is measured.
[0039]
  The controller 9 is also electrically connected to the vertical movement device 5 and the mounting stage 3, and the position recognition pin 84 and the position data of the mounted object 30 (position data in the X, Y, and θ directions) measured by the image processing device 7. ) And the position data of the position recognition pin 84, the position data of the mounted object 30, and the positional relationship data between the electronic component 20 picked up by the pyramid collet 81 and the position recognition pin 84. After the eight pyramid collets 81 correct the relative position with respect to the mounted object 30, the electronic component 20 is controlled to be positioned and mounted on the mounted object 30.
  The reason for the relative position correction is that the position correction in the θ direction is performed by the mounting stage 3.
[0040]
  In this way, the electronic component positioning apparatus 1 has the position data of the position recognition pin 84, the position data of the mounted object 30, and the positional relationship data between the electronic component 20 picked up by the pyramid collet 81 and the position recognition pin 84. Since the pyramid collet 81 whose position has been corrected based on the electronic component 20 is positioned and mounted on the mounted object 30, the positioning accuracy of the electronic component 20 and the reliability of the positioning accuracy can be improved.
[0041]
  Further, in the electronic component positioning device 1, the image processing device 7 measures pattern positional deviation data between the position of the electronic component 20 and the surface pattern of the electronic component 20, and the controller 9 connected to the image processing device 7 In consideration of the positional deviation data, the mounting head unit 8 may be configured to correct the position of the pyramid collet 81 with respect to the mounted object 30. In this way, the surface pattern of the electronic component 20 is changed to the electronic component 20. Even if the position of the object 30 is shifted with respect to the outer shape, or the surface pattern of the mounted object 30 is shifted with respect to the outer shape of the mounted object 30, the surface pattern is used as a reference. The electronic component 20 can be accurately positioned on the mounted object 30.
  In the case where the electronic component 20 is a semiconductor element, the positional deviation between the surface pattern and the external connection electrode is normally negligible. Therefore, the external connection electrode of the electronic component 20 is placed on the mounted object 30 by using the surface pattern as a reference. Positioning can be performed with high accuracy.
[0042]
  In addition, since the electronic device imaging apparatus 1 directly observes the surface pattern of the electronic component 20, for example, even when an adhering matter adheres to the pyramid collet 81, it is adversely affected during image recognition by the adhering matter. The position of the surface pattern can be accurately measured.
[0043]
  Next, the pyramid collet 81 will be described with reference to the drawings.
  FIG. 2 is a schematic view for explaining the pyramid collet of the electronic component positioning device according to the present invention, and (a) is a top view for explaining a state in which the electronic component is mounted on the mounted object. (B) is an AA cross-sectional view in (a), and (c) is a BB cross-sectional view in (a).
[0044]
  In FIG. 2A, for easy understanding, the pyramid collet 81 is omitted, and the square flat plate-like electronic component 20 is positioned and mounted on the rectangular flat plate mounted object 30.
[0045]
  Further, the pyramid collet 81 is formed with a quadrangular pyramid-shaped concave portion 811 having inclined surfaces 812 and 814 inclined at 45 °, which is half of 90 °, as shown in FIGS. And it is set as the structure picked up in the state which made the electronic component 20 contact the inclined surface 812 which a square pyramid opposes.
  Further, the pyramid collet 81 has a suction hole 813 communicating with the vacuum generator 85 formed on the upper surface of the quadrangular pyramid. When the vacuum generator 85 evacuates, the electronic component 20 is held by suction. Can do.
[0046]
  As described above, the pyramid collet 81 is formed with the quadrangular pyramid-shaped concave portion 811 as the suction portion of the electronic component 20, and the upper peripheral edge of the electronic component 20 is placed on the inclined surface 812 facing the quadrangular pyramid. Pick up in contact.
  Therefore, when the electronic component 20 is soldered, for example, the pyramid collet 81 has a reaction force against the force even when a horizontal displacement force is applied to the electronic component due to surface tension generated when the solder melts. Can be generated via the inclined surface 812, and displacement of the electronic component 20 can be prevented.
  Moreover, since the pyramid collet 81 is not in contact with the surface pattern of the electronic component 20, it is possible to reliably prevent problems such as damaging the surface pattern of the electronic component 20.
[0047]
  In the present embodiment, the electronic component 20 is picked up using a pair of opposing inclined surfaces 812, with the opening distance H2 of the inclined surface 812 being shorter than the opening distance H1 of the inclined surface 814. However, the opening distance H2 and the opening distance H1 may be formed to have the same length, and the remaining upper surface of the electronic component 20 may be brought into contact with the other pair of opposing inclined surfaces 814. Of course.
  Further, the contact state between the opposed inclined surface 812 and the outer peripheral edge of the upper surface of the electronic component 20 is preferably not a point contact, but a line contact composed of two straight lines in which the contact portions are parallel. The electronic component 20 can be held.
[0048]
  Further, the electronic component positioning device 1 may have a configuration in which the position recognition pin 84 which is a position recognition unit is provided in the pyramid collet 81. In this way, the position recognition unit is located near the electronic component 20 to be picked up. Since a certain position recognition pin 84 can be provided, the accuracy of the positional relationship data between the electronic component 20 picked up by the pyramid collet 81 and the position recognition pin 84 can be increased, and as a result, the positioning accuracy of the electronic component 20 can be improved. And the reliability of positioning accuracy can be improved.
[0049]
  Preferably, in the electronic component positioning device 1, the position recognition unit may be the position recognition pin 84, and in this way, the position recognition unit can be formed in a simple shape (pin shape). The cost can be reduced, and the positional relationship data between the electronic component 20 picked up by the pyramid collet 81 and the position recognition unit can be easily calculated.
  In addition, the positional relationship data between the electronic component 20 and the position recognition unit is measured in advance with high accuracy, and the measured positional relationship data is stored in the image processing device 7 and / or the controller 9.
[0050]
  Since it is necessary to recognize the coordinate position of the electronic component 20 in the X direction and the Y direction and the rotation angle of the electronic component 20 in the θ direction from the position recognition unit, a single position recognition pin 84 is used.NoThen, as shown in FIG. 6B, the position recognition pin 84 may be configured to protrude in the horizontal direction. In this way, the position of the position recognition pin 84 in the X direction and The coordinate position of the direction is recognized, and the rotation angle in the θ direction can be recognized by the direction of the position recognition pin 84.
  That is, in order to perform image recognition with high accuracy and high reliability, it is effective that the imaging target has a simple shape, for example, a pin shape as in the present invention.
[0051]
  Next, the operation and action of the electronic component positioning apparatus 1 configured as described above will be described.
  First, as shown in FIG. 1, in the electronic component positioning apparatus 1, the electronic component 20 is fixed to the preliminary recognition stage 2.
Subsequently, the electronic component imaging device 4 images the electronic component 20 and outputs image data. Then, the image processing device 7 inputs the image data of the electronic component 20 and measures the position of the electronic component 20 (that is, creates position data).
[0052]
  The controller 9 inputs position data (position data in the X direction, Y direction, and θ direction) of the electronic component 20 placed on the preliminary recognition stage 2 measured by the image processing device 7, and outputs the position data of the electronic component 20. Basically, the mounting head unit 8 performs control so that the electronic component 20 is picked up after correcting the position of the pyramid collet 81 with respect to the electronic component 20.
  Thereby, even if the pyramid collet 81 is placed on the preliminary recognition stage 2 in a state where the electronic component 20 is displaced, the electronic component 20 can be accurately sucked and held at the sucking position. For example, the electronic component 20 is tilted. Thus, it is possible to prevent problems such as being attracted and held by the pyramid collet 81, further improving the mounting accuracy, and improving the reliability of the mounting accuracy.
[0053]
  Here, as described above, in the electronic component positioning device 1, the image processing device 7 measures the pattern positional deviation data between the position of the electronic component 20 and the surface pattern of the electronic component 20, and is connected to the image processing device 7. The controller 9 causes the mounting head unit 8 to correct the position of the pyramid collet 81 with respect to the mounted object 30 in consideration of the pattern position deviation data.
  However, when the electronic component 20 is picked up, the controller 9 can no longer observe the surface pattern and the outer shape of the electronic component 20, and calculates and stores the pattern position deviation.
  Next, a control method in this case will be described.
[0054]
  First, as shown in FIG. 3, the controller 9 detects the angle θ of the observed surface pattern (abbreviated as observation pattern 92 as appropriate) and the observation pattern 92 with respect to the reference pattern 91 stored in the image processing apparatus 7. The area centroid position (Gx, Gy) is obtained.
  Here, the angle of the reference pattern 91 is an angle at which the outer peripheral edge of the upper surface of the electronic component 20 contacts with two straight lines parallel to the inclined surface 812 without correcting the position of the pyramid collet 81.
[0055]
  Next, the controller 9 rotates the preliminary recognition stage 2 by an angle θ in order to make the angle of the observation pattern 92 coincide with the angle of the reference pattern 91. Further, the area centroid position of the observation pattern 93 after rotation is set to (Gx ′, Gy ′).
  This value can be obtained by calculation from the area centroid position (Gx, Gy) of the observation pattern 92 and the rotation center position (Ctx, Cty) of the preliminary recognition stage 2.
  In addition, the rotational movement of the angle θ is performed by the preliminary recognition stage 2 controlled by the controller 9.
[0056]
  Next, the controller 9 determines the difference between the area centroid position (Gx ′, Gy ′) of the observation pattern 93 after rotation and the area centroid position (Gbx, Gby) of the reference pattern 91, that is, dx = Gx′−Gbx and dy. = Find Gy'-Gby.
[0057]
  By the same control method, the controller 9 causes the mounting head unit 8 to correct the position of the pyramid collet 81 relative to the electronic component 20 based on the position data of the outer shape of the electronic component 20 measured by the image processing device 7. Then, the electronic component 20 can be controlled to be picked up.
[0058]
  Further, as described above, when the electronic component 20 is picked up, the controller 9 cannot observe the surface pattern and the outer shape of the electronic component 20 after this point. When the component 20 is mounted, the electronic component 20 is positioned and mounted in consideration of this pattern position shift.
[0059]
  That is, for example, as shown in FIGS. 3 and 4, the controller 9 positions the electronic component 20 in the Y direction when the outer shape of the electronic component 20 and the area center of gravity of the observation pattern 92 are shifted in the Y direction. The image processing apparatus 7 measures the position data of the coordinates E1 and E2 of the outer periphery of the outer periphery.
[0060]
  Subsequently, the controller 9 determines that the position in the Y direction of the surface pattern area center of gravity of the electronic component 20 in the state of being held by the pyramid collet 81 with respect to the central axis of the pyramid collet 81 is δy = (E1 + E2) / 2− The fact that the position has shifted by the distance of Gy ′ is calculated and stored.
As will be described later, in the electronic component positioning device 1, the controller 9 corrects the position of the pyramid collet 81 relative to the mounted object 30 in the mounting head unit 8 by adding δy as a correction value to the horizontal movement device 82. Let it be done.
[0061]
  Next, the controller 9 operates the lifting / lowering device 83 at that position to lower the pyramid collet 81, and when the electronic component 20 and the inclined surface 812 come into contact with each other, the vacuum communicated with the suction hole 813 of the pyramid collet 81. The generator 85 is operated to hold the electronic component 20 by suction.
[0062]
  Next, in the electronic component positioning device 1, the mounted object imaging device 6 moved to the lower position by the vertical movement device 5 images the mounted object 30, and the image data of the mounted object 30 is transferred to the image processing device 7. Output.
  Although not shown, the controller 9 uses the position data of the mounted object 30 from the image processing device 7 in the same manner as that performed on the electronic component 20, and the area gravity center position of the observed mounted object 30 image. And the difference dcx, dcy from the area of the reference image stored in the image processing apparatus 7 and the angle dcθ of the observed mounted object 30 image with respect to the reference image are obtained by calculation.
  When the angle dcθ can be ignored, the controller 9 calculates only dcx and dcy by calculation.
[0063]
  Further, in the electronic component positioning device 1, the horizontal movement device 82 moves the position recognition pin 84 of the pyramid collet 81 picked up the electronic component 20 directly below the imaging device 6 for the mounted object, and the vertical movement device 5 moves the upper position. The mounted object imaging device 6 that has moved to (3) images the position recognition pin 84 and outputs the image data of the position recognition pin 84 to the image processing device 7.
[0064]
  Although not shown, the controller 9 uses the position recognition pin 84 position data from the image processing device 7 in the same manner as that performed for the electronic component 20, and the area centroid position of the observed position recognition pin 84 image. And the difference from the area centroid position of the reference image stored in the image processing device 7, dpx, dpy, and the angle dpθ of the observed position recognition pin 84 image with respect to the reference image are obtained by calculation.
  If the angle dpθ can be ignored, the controller 9 calculates only dpx and dpy by calculation.
[0065]
  Next, the electronic component positioning device 1 adds dcx, dcy, dcθ, dpx, dpy, and dpθ as correction values to the position where the horizontal moving device 82 mounts the electronic component 20, thereby mounting the mounting stage of the mounted object 30. 3, the mounting position error of the electronic component 20 caused by a slight change in the position of the position recognition pin 84 due to the positioning error of the horizontal movement device 82, the positioning error of the horizontal movement device 82, and the thermal expansion of the lifting device 83 is absorbed. It is possible to position and mount with high accuracy on the mounted object 30.
  When the angles dcθ and dpθ can be ignored, the electronic component positioning apparatus 1 adds dcx, dcy, dpx, and dpy as correction values.
  Further, for example, when the position of the outer shape of the electronic component 20 and the observation pattern 92 are shifted by a distance of δy as described above, δy is also added as a correction value. Further, when the outer shape of the mounted object 30 and the observation pattern of the surface pattern of the mounted object 30 are displaced, this amount of displacement is also added as a correction value.
[0066]
  As described above, the electronic component positioning apparatus 1 includes the position data of the position recognition pin 84 and the position data of the mounted object 30., CornerPosition relationship data between electronic component 20 picked up by cone collet 81 and position recognition pin 84, And data of the pattern misalignmentSince the pyramid collet 81 whose position has been corrected based on the electronic component 20 is mounted on the mounted object 30, the positioning accuracy of the electronic component 20 and the reliability of the positioning accuracy can be improved.
[0067]
<Example>
  Next, an embodiment of the electronic component positioning device will be described.
  The electronic component 20 is mainly composed of a gallium arsenide compound and has dimensions of about 0.3 mm in length, about 0.3 mm in width, about 0.15 mm in thickness, about 0.4 mm in length, about 0.4 mm in width, and about 0.4 mm in thickness. Two types of chip parts of 0.15 mm were used.
  In addition, as the mounted object 30, a substrate having ceramic as a main material and having dimensions of about 1.0 mm in length, about 2.0 mm in width, and about 0.5 mm in thickness was used.
[0068]
  Since the pyramid collet 81 attracts and holds the two types of chip parts having different vertical and horizontal dimensions with the same pyramid collet, the opening dimensions of the inclined surfaces 812 and 814 of the recess 811 are about 550 μm in the X direction and about 500 μm in the Y direction. The angle was about 90 ° in both the X and Y directions, and the depth dimension was about 150 μm.
  Further, the pyramid collet 81 was made of a stainless steel material and subjected to a quenching process after processing for ease of processing of the inclined surface 812 and suppression of wear due to contact with the chip component.
  Further, the pyramid collet 81 protrudes the position recognition pin 84 outward in the direction perpendicular to the central axis of the pyramid collet 81.
[0069]
  Here, the required mounting accuracy of the chip parts is high accuracy within ± 10 μm in the Y direction compared to within ± 30 μm in the X direction. On the other hand, the opening dimension in the X direction of the pyramid collet 81 is made approximately 50 μm larger than the opening dimension in the Y direction, and the outer periphery of the upper surface of the chip component on the side related to the positioning of the chip component in the Y direction is surely inclined 812. By being brought into contact with and held by suction, positioning accuracy in the Y direction can be performed with very high accuracy, and the above-described high-accuracy positioning can be realized with high reliability.
[0070]
  Further, since the mounting stage 30 can be set on the electronic component 20 picked up by the pyramid collet 81 at a level at which the positional deviation in the θ direction can be ignored, the angle control is performed on the mounting stage 3. The motor is not provided.
  Other structures and operations are the same as those of the electronic component positioning apparatus 1 in the above embodiment.
[0071]
  The electronic component positioning apparatus in this example was able to satisfy the required mounting accuracy of chip components (within ± 30 μm in the X direction and within ± 10 μm in the Y direction).
  The positioning in the X direction may be shifted within a range of ± about 25 μm, but it is within the required mounting accuracy, and there was no particular problem.
[0072]
"Electronic component positioning method"
  The present invention also provides a preliminary recognition stage.InPlacedSurface pattern is formed on the upper surfaceIt is also effective as an electronic component positioning method in which an electronic component is positioned and mounted on a mounted object placed on a mounting stage.
  Next, this electronic component positioning method will be described with reference to FIG.
  FIG. 5 is a schematic flowchart for explaining the electronic component positioning method according to the present invention.
[0073]
  In the figure, first, an electronic component imaging device provided above the preliminary recognition stage on which the electronic component is placed picks up the electronic component and outputs image data.The pictureThe image is output to the image processing apparatus (step S1).
  continue, PaintingThe image processing device inputs the image data of the electronic component, and the position of the electronic component, Electronic component surface pattern, and pattern position deviation between electronic component position and electronic component surface patternIs measured (step S2).
[0074]
  Next, control the installed head unit.RucoThe controller, PaintingThe position data of the electronic component placed on the preliminary recognition stage measured by the image processing apparatus is input, and the electronic component is picked up based on the position data of the electronic component.pyramidThe collet position is obtained (step S3).
  Next, the installed head unitpyramidCollet picks up electronic componentspyramidAfter the position is corrected to the collet position, pick up the electronic components., CoveredIt moves to the mounting stage on which the load is placed (step S4).
[0075]
  Here, according to the electronic component positioning apparatus method of the present invention, the position of the electronic component placed on the preliminary recognition stage is corrected based on the position data of the electronic component.pyramidSince the collet picks up the electronic componentspyramidThe pickup is picked up in a state where it is accurately positioned at the pickup position of the collet, so that the positioning accuracy of the electronic component is improved and the reliability of the positioning accuracy is also improved.
  In addition, the imaging device for electronic parts ispyramidIn order to directly observe electronic parts not held in the collet, for example,pyramidEven when an adhering substance adheres to the collet, it is possible to eliminate an adverse effect when the image is recognized by the adhering substance.
[0076]
  Next, an imaging device for a mounted object provided above the mounting stage,pyramidThe position recognition unit and the mounted object provided on the collet are imaged, and the image data of the position recognition unit and the mounted objectThe pictureThe image is output to the image processing apparatus (step S5).
  Next, thisPaintingThe image processing apparatus inputs image data of the position recognition unit and the mounted object, and measures the positions of the position recognition unit and the mounted object (step S6).
[0077]
  Next, control the installed head unit.RucoThe controller, PaintingPosition recognition unit measured by image processing deviceas well asPosition data of the loadAs well as pattern position deviation data, Position data of position recognition unit, position data of mounted object,pyramidPosition relation data between electronic parts picked up by collet and position recognition unit, And pattern misalignment dataInstall electronic components based onpyramidThe collet position is obtained (step S7).
  Next, the installed head unitpyramidCollet mounts electronic componentspyramidAfter the position is corrected at the collet position, the electronic component is mounted on the mounted object (step S8).
[0078]
  As described above, according to the electronic component positioning method, the position is corrected based on the position data of the position recognition unit, the position data of the mounted object, and the positional relationship data between the electronic component picked up by the collet and the position recognition unit. Since the collet mounts the electronic component on the mounted object, the positioning accuracy of the electronic component and the reliability of the positioning accuracy can be improved.
[0079]
  In the electronic component positioning device according to the present invention, an electronic component positioning device using a pyramid collet, an electronic component positioning device provided with a position recognition unit on the collet, an electronic component positioning device using the position recognition unit as a position recognition pin, and Of course, the electronic component positioning device having the heating means can be implemented independently, and can also be implemented as a combination thereof, and can exhibit the respective effects.
  Moreover, although demonstrated as an electronic component positioning apparatus, the same effect can be exhibited also as an electronic component positioning method.
[0080]
【The invention's effect】
  As described above, according to the electronic component positioning apparatus and the electronic component positioning method of the present invention, the collet whose position is corrected based on the position data of the electronic component placed on the preliminary recognition stage can accurately A collet that is picked up in a positionable state and further corrected based on the position recognition unit position data, the position data of the mounted object, and the positional relationship data between the electronic components picked up by the collet and the position recognition unit. However, since the electronic component is mounted on the mounted object, the positioning accuracy of the electronic component and the reliability of the positioning accuracy can be improved.
[0081]
  In addition, the electronic device imaging device directly observes the electronic components that are not attracted and held by the collet. For example, even if an adhering material adheres to the collet, the adverse effect of image recognition due to the adhering material is eliminated. can do.
  In addition, the use of the pyramid collet can effectively prevent the displacement (movement) of the electronic component, and there is no contact between the surface pattern of the electronic component and the pyramid collet, thereby damaging the surface pattern of the electronic component. It is possible to reliably prevent problems such as giving.
[0082]
  Also, by providing a position recognition unit near the electronic component to be picked up, the accuracy of the positional relationship data between the electronic component and the position recognition unit can be improved, and the position recognition unit should be a position recognition pin. Thus, the manufacturing cost can be reduced.
  Furthermore, even if the surface pattern of the electronic component is displaced with respect to the outer shape of the electronic component by correcting the position of the collet with respect to the mounted object based on the pattern positional deviation data, With the surface pattern as a reference, the electronic component can be accurately positioned on the mounted object.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram for explaining an electronic component positioning apparatus according to the present invention.
FIG. 2 is a schematic diagram for explaining a pyramid collet of the electronic component positioning device according to the present invention, and FIG. 2 (a) is a diagram for explaining a state in which the electronic component is mounted on a mounted object. The top view, (b) shows an AA cross-sectional view in (a), and (c) shows a BB cross-sectional view in (a).
FIG. 3 is a schematic view for explaining correction of the position of a pyramid collet based on a surface pattern of an electronic component.
FIG. 4 is a schematic diagram for explaining correction of the position of a pyramid collet with respect to an electronic component having a pattern misalignment. FIG. 4 (a) is a schematic diagram of the external shape and observation pattern of the electronic component. ) Is a cross-section for explaining the state of picking up electronic componentsFigureShow.
FIG. 5 is a schematic flowchart for explaining an electronic component positioning method according to the present invention.
[Explanation of symbols]
  1 Electronic component positioning device
  2 Preliminary recognition stage
  3 On-board stage
  4 Imaging device for electronic parts
  5 Vertical movement device
  6 Imaging device for mounted objects
  7 Image processing device
  8 On-board head unit
  9 Controller
  20 Electronic components
  30 Load
  40 Solder pieces
  81 pyramid collet
  82 Horizontal movement device
  83 Lifting device
  84 Position recognition pin
  85 Vacuum generator
  91 Reference pattern
  92 Observation pattern
  93 Observation pattern after rotation
  811 recess
  812,814 Inclined surface
  813 Adsorption hole

Claims (2)

A preliminary recognition stage on which an electronic component having a surface pattern formed thereon is placed;
Provided above the preliminary recognition stage, imaging the electronic component, the electronic component image pickup device that outputs the image data,
A pyramid-shaped concave part is formed, and a pyramid collet that picks up the electronic component in a state of being in contact with an opposing inclined surface of the square pyramid , a position correcting device that corrects the position of the pyramid collet, and A mounting head unit that is provided on the pyramid collet and includes a position recognition unit for recognizing the position of the picked-up electronic component ;
And placed on the mounting stage of pre-Symbol to be mounted object,
An imaging device for a mounted object that is provided above the mounting stage, images the position recognition unit and the mounted object that have moved on the mounting stage, and outputs the image data;
The electronic component imaging device and the mounted object imaging device are connected, and image data of the electronic component is input, the position of the electronic component, the surface pattern of the electronic component, and the position of the electronic component and the An image processing apparatus that measures a pattern positional deviation with respect to a surface pattern of the electronic component, inputs image data of the position recognition unit and the mounted object, and measures positions of the position recognition unit and the mounted object When,
Connected to the image processing device and the mounting head unit, the position data of the electronic component measured by the image processing device is input, and based on the position data of the electronic component, the pyramid collet of the mounting head unit is After performing relative position correction with respect to the electronic component, the electronic component is controlled to be picked up, and the position recognition unit and the position data of the mounted object measured by the image processing apparatus, and the Inputs position displacement data, position data of the position recognition unit, position data of the mounted object, position relation data between the electronic component picked up by the pyramid collet and the position recognition unit, and the pattern Based on the displacement data, the pyramid collet of the mounting head unit is relative to the mounted object. After performing Do positional correction, and a controller for controlling so as to mount the electronic component on the object to be mounted object,
An electronic component positioning device comprising: An electronic component positioning method for positioning and mounting an electronic component placed on a preliminary recognition stage and having a surface pattern formed on an upper surface thereof on a mounted object placed on the mounting stage,
Electronic component imaging device, by imaging the electronic component, and outputs the image data to the image picture processor,
Pre outs image processing apparatus, said image data is input, the position of the electronic component, the surface pattern of the electronic component, and, measuring the pattern position shift of the position of the electronic component and the electronic component of the surface pattern And
Mounting head unit controls to Turkey controller is pre-outs image processing apparatus inputs the position data of the electronic component placed on the preliminary recognition stage measured, on the basis of the position data of the electronic component, wherein Find the position of the pyramid collet to pick up the electronic parts,
Pyramid collet of the mounting head unit, the position of the pyramid collet for picking up the electronic component, since the position correction, and pick up the electronic component, moves to the placed the mounting stage of the object to be mounted object,
The payload imaging device, wherein the position recognition unit provided in the pyramidal collet and imaging the object payload, and outputs the image data of the position recognition unit and the object to be mounted object in the image processing apparatus,
The picture image processing apparatus inputs the image data of the position recognition section and the mountable portion, measuring the position of the object to be mounted object and the position recognizing unit,
Said controller for controlling the mounting head unit, front position data of the position recognition section and the mountable product Kiga image processing apparatus is measured, and inputs the data of the pattern position shift of the position recognition unit position data, the position data of the payload, the positional relationship data with the previous SL the electronic component picked up in the pyramid collet and the position identification unit, and, based on the data of the pattern position shift, mounting the electronic component Find the position of the pyramid collet
The pyramidal collet mounting head unit, the position of the pyramid collet for mounting the electronic component, since the position correction, electronic component positioning method characterized by mounting the electronic component on the object payload.

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