TWI834440B - Processing equipment and processing method - Google Patents

Processing equipment and processing method Download PDF

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TWI834440B
TWI834440B TW111149165A TW111149165A TWI834440B TW I834440 B TWI834440 B TW I834440B TW 111149165 A TW111149165 A TW 111149165A TW 111149165 A TW111149165 A TW 111149165A TW I834440 B TWI834440 B TW I834440B
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workpiece
processing
normal direction
mentioned
fixing member
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TW111149165A
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TW202332928A (en
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石井徹
川口容毅
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日商山葉汎提克股份有限公司
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Abstract

本發明之目的在於提供一種可適當處理工件之處理對象部分之處理裝置。本發明之一態樣之處理裝置1具備:攝像部11,其具有自法線方向與板狀或片狀之工件P正對之光學元件11a,自法線方向拍攝設置於工件P之基準位置標記R;工件固定構件12,其於攝像部11之拍攝時,自法線方向觀察,於光學元件11a附近,將工件P固定於法線方向之基準位置;特定部13,其基於攝像部11之攝像結果,特定工件P之處理對象部分;第1處理部14a及第2處理部14b,其等可自兩面側夾入處理對象部分;及第1驅動機構15,其以基準位置、與由第1處理部14a及第2處理部14b夾入時之法線方向位置相同之方式,驅動工件固定構件12。An object of the present invention is to provide a processing device that can appropriately process a portion to be processed of a workpiece. A processing device 1 according to one aspect of the present invention includes an imaging unit 11 having an optical element 11a facing a plate-like or sheet-like workpiece P from the normal direction, and taking pictures from the normal direction at a reference position of the workpiece P. Marked R; the workpiece fixing member 12, which fixes the workpiece P at a reference position in the normal direction near the optical element 11a when viewed from the normal direction when the imaging unit 11 is taking pictures; the specific part 13, which is based on the imaging unit 11 The imaging result specifies the processing target part of the workpiece P; the first processing part 14a and the second processing part 14b, which can sandwich the processing target part from both sides; and the first driving mechanism 15, which is based on the reference position and the The workpiece fixing member 12 is driven so that the positions in the normal direction when the first processing part 14a and the second processing part 14b are sandwiched are the same.

Description

處理裝置及處理方法Treatment device and treatment method

本發明係關於一種處理裝置及處理方法。The present invention relates to a processing device and a processing method.

已知有一種對板狀或片狀之工件進行處理之處理裝置。作為該處理裝置,可列舉例如檢查工件之電特性之電性檢查裝置,或加工工件之加工裝置等。 [先前技術文獻] [專利文獻] There is known a processing device for processing plate-shaped or sheet-shaped workpieces. Examples of the processing device include an electrical inspection device that inspects the electrical characteristics of a workpiece, a processing device that processes the workpiece, and the like. [Prior technical literature] [Patent Document]

專利文獻1:日本專利特開2010-237061號公報Patent Document 1: Japanese Patent Application Publication No. 2010-237061

[發明所欲解決之問題][Problem to be solved by the invention]

該處理裝置中,藉由自工件之法線方向拍攝設置於工件之基準位置標記,而進行工件之處理對象部分之定位。該處理裝置中,若工件存在翹曲或起伏,則無法將工件之處理對象部分正確定位,有無法充分獲得對於工件之處理精度之虞。In this processing device, the processing target portion of the workpiece is positioned by photographing a reference position mark provided on the workpiece from the normal direction of the workpiece. In this processing device, if the workpiece is warped or undulated, the processing target part of the workpiece cannot be correctly positioned, and there is a risk that the processing accuracy of the workpiece cannot be fully obtained.

於專利文獻1中,記載有一種電子零件檢查裝置,其可於藉由托盤自兩面夾持安裝有複數個電子零件之基板之狀態下,將基板之兩面加壓,且檢查複數個電子零件。於專利文獻1中,記載有藉由以托盤夾持基板,即使如基板產生翹曲或起伏之情形時,亦可同時檢查複數個電子零件。Patent Document 1 describes an electronic component inspection device that can inspect a plurality of electronic components by pressing both sides of the substrate with a plurality of electronic components mounted on it held between both sides by a pallet. Patent Document 1 describes that by holding a substrate with a pallet, a plurality of electronic components can be inspected simultaneously even if the substrate warps or undulates.

然而,專利文獻1所記載之電子零件檢查裝置中,由於將基板以托盤強制固定,故於托盤之固定時,有產生起因於基板之翹曲或起伏之位置偏移之虞,或有基板上產生所需以上之應力之虞。其結果,有無法適當檢查基板之測定點之虞。However, in the electronic component inspection device described in Patent Document 1, since the substrate is forcibly fixed with a pallet, there is a risk that positional deviation due to warping or undulation of the substrate may occur when the pallet is fixed, or there may be a problem on the substrate. There is a risk of generating stress that exceeds the required level. As a result, there is a risk that the measurement points of the substrate cannot be properly inspected.

本發明係基於此種狀況而完成者,本發明之目的在於提供一種可適當處理工件之處理對象部分之處理裝置及處理方法。 [解決問題之技術手段] The present invention was completed based on such a situation, and an object of the present invention is to provide a processing device and a processing method that can appropriately process the processing target portion of a workpiece. [Technical means to solve problems]

本發明之一態樣之處理裝置具備:攝像部,其具有自法線方向與板狀或片狀之工件正對之光學元件,自上述法線方向拍攝設置於上述工件之基準位置標記;工件固定構件,其於上述攝像部之拍攝時,自上述法線方向觀察,於上述光學元件附近,將上述工件固定於上述法線方向之基準位置;特定部,其基於上述攝像部之攝像結果,特定上述工件之處理對象部分;第1處理部及第2處理部,其等可自兩面側夾入上述處理對象部分;及第1驅動機構,其以上述基準位置、與由上述第1處理部及上述第2處理部夾入時之法線方向位置相同之方式,驅動上述工件固定構件。A processing device according to one aspect of the present invention includes: an imaging unit having an optical element facing a plate-like or sheet-like workpiece from a normal direction, and imaging a reference position mark provided on the workpiece from the normal direction; and the workpiece. A fixing member that fixes the workpiece at a reference position in the normal direction near the optical element when viewed from the normal direction when the imaging unit is taking pictures; a specific part that is based on the imaging results of the imaging unit, A processing target part of the above-mentioned workpiece is specified; a first processing part and a second processing part, which can sandwich the processing target part from both sides; and a first driving mechanism, with the above-mentioned reference position, and the above-mentioned first processing part The workpiece fixing member is driven in such a manner that the position in the normal direction when the second processing unit is clamped is the same.

本發明之一態樣之處理裝置具備:攝像部,其具有自法線方向與板狀或片狀之工件正對之光學元件,自上述法線方向拍攝設置於上述工件之基準位置標記;工件固定構件,其於上述攝像部之拍攝時,自上述法線方向觀察,於上述光學元件附近,將上述工件固定於上述法線方向之基準位置;特定部,其基於上述攝像部之攝像結果,特定上述工件之處理對象部分;第1處理部及第2處理部,其等可自兩面側夾入上述處理對象部分;及第1驅動機構,其以上述基準位置、與由上述第1處理部及上述第2處理部夾入時之法線方向位置相同之方式,驅動上述工件固定構件。A processing device according to one aspect of the present invention includes: an imaging unit having an optical element facing a plate-like or sheet-like workpiece from a normal direction, and imaging a reference position mark provided on the workpiece from the normal direction; and the workpiece. A fixing member that fixes the workpiece at a reference position in the normal direction near the optical element when viewed from the normal direction when the imaging unit is taking pictures; a specific part that is based on the imaging results of the imaging unit, A processing target part of the above-mentioned workpiece is specified; a first processing part and a second processing part, which can sandwich the processing target part from both sides; and a first driving mechanism, with the above-mentioned reference position, and the above-mentioned first processing part The workpiece fixing member is driven in such a manner that the position in the normal direction when the second processing unit is clamped is the same.

亦可為,上述工件固定構件自上述法線方向觀察,於較上述處理對象部分更靠近上述光學元件之位置,局部固定上述工件。The workpiece fixing member may partially fix the workpiece at a position closer to the optical element than the processing target part when viewed from the normal direction.

亦可為,上述第1驅動機構於由上述第1處理部及上述第2處理部夾入上述處理對象部分之前,以離開上述工件之方式驅動上述工件固定構件。The first driving mechanism may drive the workpiece fixing member away from the workpiece before the first processing part and the second processing part sandwich the processing target part.

亦可為,該處理裝置具備驅動上述第1處理部及上述第2處理部之第2驅動機構,亦可為,上述第2驅動機構於由上述工件固定構件固定上述工件之前,驅動上述第1處理部及上述第2處理部之至少一者,決定上述工件之上述法線方向上之夾入位置,上述第1驅動機構以上述工件位於由上述第2驅動機構決定之法線方向位置之方式,驅動上述工件固定構件。The processing device may include a second driving mechanism that drives the first processing unit and the second processing unit, or the second driving mechanism may drive the first processing unit before the workpiece is fixed by the workpiece fixing member. At least one of the processing part and the second processing part determines the clamping position of the workpiece in the normal direction, and the first driving mechanism positions the workpiece in the normal direction position determined by the second driving mechanism. , drives the above-mentioned workpiece fixing member.

亦可為,該處理裝置進而具備測定部,其可測定上述攝像時之上述工件之法線方向位置、以及由上述第1處理部及上述第2處理部夾入時之上述工件之法線方向位置。The processing device may further include a measuring unit capable of measuring the normal direction position of the workpiece during the imaging and the normal direction of the workpiece when sandwiched between the first processing unit and the second processing unit. Location.

本發明之另一態樣之處理方法使用具備:攝像部,其具有自法線方向與板狀或片狀之工件正對之光學元件;工件固定構件,其自上述法線方向觀察,上述光學元件附近,將上述工件固定於上述法線方向之基準位置;特定部,其特定上述工件之處理對象部分;第1處理部及第2處理部,其等可自兩面側夾入上述處理對象部分;及第1驅動機構,其驅動上述工件固定構件;之處理裝置,以上述基準位置、與由上述第1處理部及上述第2處理部夾入時之法線方向位置相同之方式,驅動上述工件固定構件,於藉由上述工件固定構件將上述工件固定於上述基準位置之狀態下,自上述法線方向拍攝設置於上述工件之基準位置標記,基於上述基準位置標記之攝像結果,特定上述工件之處理對象部分。A processing method according to another aspect of the present invention includes: an imaging unit having an optical element facing a plate-like or sheet-like workpiece from the normal direction; and a workpiece fixing member having the optical element when viewed from the normal direction. Near the component, the above-mentioned workpiece is fixed at the reference position in the above-mentioned normal direction; a specific part specifies the processing target part of the above-mentioned workpiece; and the first processing part and the second processing part can sandwich the above-mentioned processing target part from both sides. ; and a first driving mechanism that drives the processing device of the above-mentioned workpiece fixing member; in such a manner that the above-mentioned reference position is the same as the position in the normal direction when sandwiched by the above-mentioned first processing part and the above-mentioned second processing part. The workpiece fixing member photographs a reference position mark provided on the workpiece from the normal direction while the workpiece is fixed at the reference position by the workpiece fixing member, and specifies the workpiece based on the imaging result of the reference position mark. The processing object part.

另,本發明中,「板狀」與「片狀」之間雖無明確區別,但可將實質上不會產生因自重引起之撓曲者稱為「板狀」,將具有可撓性,因自重而產生撓曲者稱為「片狀」。本發明中,「片狀」包含「薄膜狀」之概念。「自工件之法線方向觀察,於光學元件附近」是指自工件之法線方向觀察之情形時,與工件之攝像區域之間隔為10 mm以下。作為該間隔,較佳為8 mm以下,更佳為5 mm以下。又,作為與工件攝像區域之間隔之下限,並非特別限定者。例如,若為如工件固定構件為透明之情形,則於自法線方向觀察工件之情形時,工件固定構件亦可配置於工件之攝像區域內。In addition, in the present invention, although there is no clear distinction between "plate-like" and "sheet-like", those that do not substantially deflect due to their own weight can be called "plate-like" and have flexibility. Those that bend due to their own weight are called "flaky". In the present invention, "sheet form" includes the concept of "film form". "Viewed from the normal direction of the workpiece, near the optical element" means that when viewed from the normal direction of the workpiece, the distance from the imaging area of the workpiece is 10 mm or less. The distance is preferably 8 mm or less, more preferably 5 mm or less. In addition, the lower limit of the distance from the workpiece imaging area is not particularly limited. For example, if the workpiece fixing member is transparent, the workpiece fixing member may be disposed in the imaging area of the workpiece when the workpiece is viewed from the normal direction.

本發明之一態樣之處理裝置之上述第1驅動機構以於上述第1處理部及上述第2處理部之夾入時與上述攝像部之拍攝時,工件之法線方向位置相同之方式,驅動上述工件固定構件。因此,即使上述工件存在撓曲、翹曲、起伏等之情形時,該處理裝置亦可容易使拍攝時之上述基準位置標記之法線方向位置、與由上述第1處理部及上述第2處理部夾入時之上述處理對象部分之法線方向位置整合。即,該處理裝置可於將工件配置於同一假想平面內之狀態下,進行上述攝像部之拍攝,與上述第1處理部及上述第2處理部之夾入。其結果,該處理裝置藉由容易且正確掌握設置於上述工件之基準位置標記與上述處理對象部分之位置關係,而可適當處理上述處理對象部分。The first driving mechanism of the processing device according to one aspect of the present invention is configured so that the position of the normal direction of the workpiece is the same when the first processing part and the second processing part are sandwiched and when the imaging part is photographing. The above-mentioned workpiece fixing member is driven. Therefore, even if the workpiece is deflected, warped, undulated, etc., the processing device can easily adjust the normal direction position of the reference position mark at the time of photographing to the first processing unit and the second processing unit. The normal direction position of the above-mentioned processing target part when the part is clamped is integrated. That is, this processing device can perform imaging by the imaging unit and sandwiching of the first processing unit and the second processing unit in a state where the workpiece is arranged in the same virtual plane. As a result, the processing apparatus can easily and accurately grasp the positional relationship between the reference position mark provided on the workpiece and the processing target portion, thereby appropriately processing the processing target portion.

以下,適當參照圖式,且詳細說明本發明之實施形態。Hereinafter, embodiments of the present invention will be described in detail with appropriate reference to the drawings.

[第一實施形態] <處理裝置> 圖1及圖2之處理裝置1具備:攝像部11,其具有自法線方向(圖1之Z方向)與板狀或片狀之工件P正對之光學元件11a,自上述法線方向拍攝設置於工件P之基準位置標記R;工件固定構件12,其於攝像部11之拍攝時,自上述法線方向觀察,於光學元件11a附近,將工件P固定於上述法線方向之基準位置;特定部13,其基於攝像部11之攝像結果,特定工件P之處理對象部分;第1處理部14a及第2處理部14b,其等可自兩面側夾入上述處理對象部分;及第1驅動機構15,其以上述基準位置、與由第1處理部14a及第2處理部14b夾入時之法線方向位置相同之方式,驅動工件固定構件12。又,該處理裝置1具備:第2驅動機構16,其驅動第1處理部14a及第2處理部14b;及控制部17,其控制第1驅動機構15及第2驅動機構16之動作。本實施形態中,特定部13包含於控制部17中。另,圖1中,攝像部11及工件固定構件12配置於工件P之兩側。但,攝像部11及工件固定構件12之配置可基於處理裝置1之規格而設定,攝像部11及工件固定構件12之一者或兩者亦可僅配置於工件P之單側。又,圖1中,第1驅動機構15、第2驅動機構16及控制部17與第1處理部14a及第2處理部14b各者一對一對應設置。但,第1驅動機構15、第2驅動機構16及控制部17亦可作為第1處理部14a及第2處理部14b中共通者而構成。 [First Embodiment] <Processing device> The processing device 1 of FIGS. 1 and 2 is provided with an imaging unit 11 having an optical element 11 a facing the plate-like or sheet-like workpiece P from the normal direction (the Z direction in FIG. 1 ), and taking pictures from the normal direction. a reference position mark R provided on the workpiece P; a workpiece fixing member 12 that fixes the workpiece P at the reference position in the normal direction near the optical element 11a when viewed from the normal direction when the imaging unit 11 is photographing; The specifying part 13 specifies the processing target part of the workpiece P based on the imaging result of the imaging part 11; the first processing part 14a and the second processing part 14b, which can sandwich the processing target part from both sides; and the first drive The mechanism 15 drives the workpiece fixing member 12 so that the reference position is the same as the position in the normal direction when sandwiched between the first processing part 14a and the second processing part 14b. Moreover, this processing apparatus 1 is provided with the 2nd driving mechanism 16 which drives the 1st processing part 14a and the 2nd processing part 14b, and the control part 17 which controls the operation|movement of the 1st driving mechanism 15 and the 2nd driving mechanism 16. In this embodiment, the specifying unit 13 is included in the control unit 17 . In addition, in FIG. 1 , the imaging unit 11 and the workpiece fixing member 12 are arranged on both sides of the workpiece P. However, the arrangement of the imaging unit 11 and the workpiece fixing member 12 may be set based on the specifications of the processing device 1 , and one or both of the imaging unit 11 and the workpiece fixing member 12 may be arranged on only one side of the workpiece P. In addition, in FIG. 1 , the first drive mechanism 15 , the second drive mechanism 16 , and the control unit 17 are provided in one-to-one correspondence with each of the first processing unit 14 a and the second processing unit 14 b. However, the first drive mechanism 15, the second drive mechanism 16, and the control unit 17 may be configured as the same components as the first processing unit 14a and the second processing unit 14b.

該處理裝置1例如可作為使用印刷基板作為工件P之電性檢查裝置,或加工工件P之加工裝置等而構成(圖1中,圖示出電性檢查裝置)。第1處理部14a及第2處理部14b之具體構成可根據該處理裝置1所要求之功能而適當設定。該處理裝置1為電性檢查裝置之情形時,第1處理部14a及第2處理部14b具有:複數個探針21,其等可自法線方向與工件P接觸;及支持板22,其具有引導複數個探針21之複數個引導孔(未圖示),可自法線方向與工件P接觸。另,圖1中,第1處理部14a及第2處理部14b各者可檢查工件P之電特性而設置。但,根據該處理裝置1之種類,或該處理裝置1所要求之功能等,第1處理部14a及第2處理部14b之一者亦可僅具有將工件P夾入於與另一處理部之間之功能。This processing device 1 can be configured as an electrical inspection device using a printed circuit board as the workpiece P, or a processing device that processes the workpiece P, for example (the electrical inspection device is shown in FIG. 1 ). The specific configurations of the first processing unit 14 a and the second processing unit 14 b can be appropriately set according to the functions required of the processing device 1 . When the processing device 1 is an electrical inspection device, the first processing part 14a and the second processing part 14b have: a plurality of probes 21 that can contact the workpiece P from the normal direction; and a support plate 22. It has a plurality of guide holes (not shown) for guiding a plurality of probes 21 and can contact the workpiece P from the normal direction. In addition, in FIG. 1 , each of the first processing unit 14 a and the second processing unit 14 b is installed to inspect the electrical characteristics of the workpiece P. However, depending on the type of the processing device 1 or the functions required of the processing device 1, one of the first processing part 14a and the second processing part 14b may only have the function of sandwiching the workpiece P with the other processing part. functions between.

[工件] 如上述,該處理裝置1為電性檢查裝置之情形時,可使用印刷基板作為工件P。該印刷基板於基材上配置有電路圖案,具有可撓性。工件P為印刷基板之情形時,於工件P存在複數個處理對象部分。該處理裝置1構成為連續處理配置於工件P之複數個處理對象部分。 [artifact] As described above, when the processing device 1 is an electrical inspection device, a printed circuit board can be used as the workpiece P. The printed circuit board is configured with a circuit pattern on a base material and is flexible. When the workpiece P is a printed circuit board, there are a plurality of processing target portions in the workpiece P. This processing device 1 is configured to continuously process a plurality of processing target portions arranged on the workpiece P.

工件P例如為俯視矩形狀。工件P於由工件固持具31固持4個角部之狀態下,整體保持水平。工件P因由工件固持具31局部固持其之周緣部而保持於空中,故可能產生因自重引起之撓曲或翹曲、起伏等。該處理裝置1適於在此種可能於工件P產生撓曲或翹曲、起伏等之構成中,適當地處理工件P之處理對象部分。The workpiece P is, for example, rectangular in plan view. The workpiece P is held horizontally as a whole while its four corners are held by the workpiece holder 31 . Since the workpiece P is held in the air by partially holding its peripheral portion with the workpiece holder 31, deflection, warping, heaving, etc. due to its own weight may occur. This processing device 1 is suitable for appropriately processing the processing target portion of the workpiece P in such a structure that the workpiece P may be deflected, warped, undulated, or the like.

於工件P設有基準位置標記R。作為該基準位置標記R,只要為可作為用以特定上述處理對象部分之基準位置使用者,則並非特別限定者,例如可為電路圖案其本身,亦可為與電路圖案分開設置之定位用標記。A reference position mark R is provided on the workpiece P. The reference position mark R is not particularly limited as long as it can be used as a reference position for specifying the portion to be processed. For example, it may be the circuit pattern itself, or it may be a positioning mark provided separately from the circuit pattern. .

(攝像部) 攝像部11具有拍攝數位圖像之相機、與處理該相機所拍攝之數位圖像之圖像處理部。上述相機具有自法線方向與工件P正對之上述光學元件11a。作為光學元件11a,可列舉例如透鏡。 (Camera Department) The imaging unit 11 includes a camera that captures digital images, and an image processing unit that processes the digital images captured by the camera. The above-mentioned camera has the above-mentioned optical element 11a facing the workpiece P from the normal direction. Examples of the optical element 11a include a lens.

上述圖像處理部可包含於控制部17中,亦可與控制部17分開設置。上述圖像處理部包含於控制部17中之情形時,上述圖像處理部亦可為由控制部17處理之程式之一部分。The above-mentioned image processing unit may be included in the control unit 17 , or may be provided separately from the control unit 17 . When the image processing unit is included in the control unit 17, the image processing unit may be a part of the program processed by the control unit 17.

上述相機可獨立保持,亦可以能與第1處理部14a或第2處理部14b一起移動之方式,與第2驅動機構16直接或間接連結。於獨立保持上述相機之情形時,較佳為上述相機以可於工件P之平面方向(圖1之XY平面方向)及工件P之法線方向(圖1之Z軸方向)移動之方式構成。The above-mentioned camera can be maintained independently, or can be directly or indirectly connected to the second driving mechanism 16 in a manner that it can move together with the first processing part 14a or the second processing part 14b. When the camera is independently maintained, it is preferable that the camera is configured to be movable in the plane direction of the workpiece P (the XY plane direction in Figure 1) and the normal direction of the workpiece P (the Z-axis direction in Figure 1).

(工件固定構件) 工件固定構件12具有局部支持工件P之支持面12a。工件固定構件12藉由使支持面12a自法線方向與工件P接觸,而將工件P固定於法線方向之基準位置。例如,若為如工件P具有自重撓曲之情形,則該處理裝置1以工件P位於上述基準位置之方式,將下側(第2處理部14b側)之工件固定構件12向上方上頂,且以將工件P夾入於與下側之工件固定構件12之間之方式,使上側(第1處理部14a側)之工件固定構件12向下方移動。 (workpiece fixing member) The workpiece fixing member 12 has a support surface 12a that partially supports the workpiece P. The workpiece fixing member 12 fixes the workpiece P at a reference position in the normal direction by bringing the support surface 12a into contact with the workpiece P from the normal direction. For example, if the workpiece P deflects under its own weight, the processing device 1 pushes the workpiece fixing member 12 on the lower side (the second processing part 14b side) upward so that the workpiece P is located at the above-mentioned reference position. And the workpiece fixing member 12 on the upper side (the first processing part 14a side) is moved downward so that the workpiece P is sandwiched between the workpiece fixing member 12 on the lower side.

如圖2所示,工件固定構件12以自工件P之法線方向觀察,於光學元件11a附近可局部支持工件P之方式設置。由於工件固定構件12只要局部支持工件P即可,故可充分減小工件P上產生之應力。工件固定構件12亦可以自工件P之法線方向觀察,可於光學元件11a周圍之一部分支持工件P之方式設置。As shown in FIG. 2 , the workpiece fixing member 12 is disposed near the optical element 11 a to partially support the workpiece P when viewed from the normal direction of the workpiece P. Since the workpiece fixing member 12 only needs to partially support the workpiece P, the stress generated on the workpiece P can be sufficiently reduced. The workpiece fixing member 12 can also be viewed from the normal direction of the workpiece P, and can be disposed in such a manner that a portion around the optical element 11a supports the workpiece P.

工件固定構件12以拍攝基準位置標記R時之工件P之攝像區域之法線方向位置(Z軸方向位置),與由第1處理部14a及第2處理部14b處理時之工件P之處理對象部分之法線方向位置整合之方式,固定工件P。工件固定構件12只要僅於攝像部11之拍攝時固定工件P即可,於由第1處理部14a及第2處理部14b夾入上述處理對象部分時,可不固定工件P。因此,較佳為工件固定構件12例如僅配置於工件P之法線方向觀察時之第1處理部14a及第2處理部14b之外緣中,與光學元件11a對向(靠近光學元件11a)之外緣側之一部分。根據該構成,該處理裝置1可謀求工件固定構件12之小型化,可謀求裝置之小型化或低成本化,同時容易抑制對於工件P之應力,且提高工件P之處理效率。The workpiece fixing member 12 uses the normal direction position (Z-axis direction position) of the imaging area of the workpiece P when the reference position mark R is taken, and the processing target of the workpiece P when being processed by the first processing unit 14a and the second processing unit 14b. The workpiece P is fixed by integrating the partial normal direction positions. The workpiece fixing member 12 only needs to fix the workpiece P during imaging by the imaging unit 11, and does not need to fix the workpiece P when the first processing unit 14a and the second processing unit 14b sandwich the processing target portion. Therefore, it is preferable that the workpiece fixing member 12 is disposed only in the outer edge of the first processing part 14a and the second processing part 14b when viewed in the normal direction of the workpiece P, facing the optical element 11a (close to the optical element 11a). Part of the outer edge side. According to this configuration, the processing device 1 can achieve miniaturization of the workpiece fixing member 12, and can achieve miniaturization or cost reduction of the device. At the same time, stress on the workpiece P can be easily suppressed, and the processing efficiency of the workpiece P can be improved.

較佳為工件固定構件12於工件P之法線方向觀察時,於較上述處理對象部分更靠近光學元件11a之位置,局部固定工件P。根據該構成,該處理裝置1可謀求工件固定構件12之小型化,可謀求裝置之小型化或低成本化,且於拍攝基準位置標記R時,可將工件P快速且確實地固定於期望之位置。It is preferable that the workpiece fixing member 12 partially fixes the workpiece P at a position closer to the optical element 11a than the above-mentioned processing target part when viewed in the normal direction of the workpiece P. According to this configuration, the processing device 1 can achieve miniaturization of the workpiece fixing member 12, can achieve downsizing or cost reduction of the device, and can quickly and reliably fix the workpiece P at a desired location when photographing the reference position mark R. Location.

(特定部) 特定部13藉由自由攝像部11之相機拍攝之數位圖像中,特定工件P之特徵點,而求得上述相機與工件P之處理對象部分之相對位置。再者,特定部13基於上述相機之配置,特定XYZ座標系中之上述處理對象部分之絕對位置。 (Special Department) The specifying unit 13 determines the relative position of the camera and the processing target part of the workpiece P by specifying the characteristic points of the workpiece P in the digital image captured by the camera of the free imaging unit 11 . Furthermore, the specifying unit 13 specifies the absolute position of the processing target portion in the XYZ coordinate system based on the arrangement of the camera.

(第1處理部及第2處理部) 第1處理部14a及第2處理部14b各自具有自法線方向與工件P接觸之支持板22。第1處理部14a及第2處理部14b設置成可藉由支持板22自兩側夾入工件P。 (1st Processing Department and 2nd Processing Department) Each of the first processing part 14a and the second processing part 14b has a support plate 22 that is in contact with the workpiece P from the normal direction. The first processing part 14a and the second processing part 14b are provided so that the workpiece P can be sandwiched from both sides via the support plate 22.

(第1驅動機構) 第1驅動機構15至少於工件P之法線方向驅動工件固定構件12。第1驅動機構15亦可構成為還能於工件P之平面方向驅動工件固定構件12。第1驅動機構15構成為可與第1處理部14a及第2處理部14b獨立地驅動工件固定構件12。作為第1驅動機構15之具體構成,並非特別限定者,可列舉例如具有於工件P之法線方向延伸之滑塊、及將該滑塊可於上述法線方向滑動地保持之導軌之構成。 (1st drive mechanism) The first driving mechanism 15 drives the workpiece fixing member 12 in a direction less than the normal line of the workpiece P. The first driving mechanism 15 may be configured to also drive the workpiece fixing member 12 in the plane direction of the workpiece P. The first drive mechanism 15 is configured to drive the workpiece fixing member 12 independently of the first processing unit 14a and the second processing unit 14b. The specific structure of the first driving mechanism 15 is not particularly limited, and may include, for example, a slider extending in the normal direction of the workpiece P and a guide rail that holds the slider slidably in the normal direction.

較佳為第1驅動機構15於由第1處理部14a及第2處理部14b夾入上述處理對象部分之前,以離開工件P之方式驅動工件固定構件12。該處理裝置1於攝像部11拍攝基準位置標記R後,使工件固定構件12離開工件P,使第1處理部14a及第2處理部14b與上述處理對象部分對向後,於與上述基準位置相同之假想平面內夾入工件P之處理對象部分,藉此可快速且穩定地進行期望之處理。It is preferable that the first driving mechanism 15 drives the workpiece fixing member 12 away from the workpiece P before the first processing part 14a and the second processing part 14b sandwich the processing target portion. In this processing device 1, after the imaging unit 11 captures the reference position mark R, the workpiece fixing member 12 is separated from the workpiece P, and the first processing unit 14a and the second processing unit 14b are opposed to the above-mentioned processing target part, and then are at the same position as the above-mentioned reference position. By clamping the processing target part of the workpiece P in the virtual plane, the desired processing can be performed quickly and stably.

(第2驅動機構) 第2驅動機構16構成為可3維驅動第1處理部14a及第2處理部14b。再者,第2驅動機構16亦可構成為能驅動第1處理部14a及第2處理部14b,使之繞與工件P之法線方向平行之軸旋轉。 (Second drive mechanism) The second drive mechanism 16 is configured to drive the first processing unit 14a and the second processing unit 14b in three dimensions. Furthermore, the second driving mechanism 16 may be configured to drive the first processing part 14a and the second processing part 14b to rotate around an axis parallel to the normal direction of the workpiece P.

作為第2驅動機構16,可列舉例如多關節機器人、正交座標驅動系統等。藉由使用正交座標驅動系統作為第2驅動機構16,而容易減少成本及佔有空間。作為上述正交座標驅動系統,例如可設為如下構成,具有:正交座標型機器人,其可於工件P之平面方向進行2軸定位;升降構件,其配置於該正交座標型機器人;及旋轉構件,其配置於該升降構件,構成為可使第1處理部14a及第2處理部14b之一者或兩者旋轉。Examples of the second drive mechanism 16 include a multi-joint robot, an orthogonal coordinate drive system, and the like. By using the orthogonal coordinate drive system as the second drive mechanism 16, the cost and occupied space can be easily reduced. As the above-mentioned orthogonal coordinate drive system, for example, it can be configured as follows: an orthogonal coordinate type robot that can perform two-axis positioning in the plane direction of the workpiece P; a lifting member that is arranged on the orthogonal coordinate type robot; and The rotating member is arranged on the lifting member and is configured to rotate one or both of the first processing part 14a and the second processing part 14b.

較佳為第2驅動機構16於工件固定構件12固定工件P之前,驅動第1處理部14a及第2處理部14b之至少一者,決定工件P之法線方向之夾入位置。又,該構成中,較佳為第1驅動機構15以工件P位於由第2驅動機構16決定之法線方向位置之方式,驅動工件固定構件12。該處理裝置1藉由使第1驅動機構15及第2驅動機構16如此進行驅動,可容易且確實地使攝像部11拍攝時之基準位置標記R之法線方向位置、與第1處理部14a及第2處理部14b處理時之工件P之處理對象部分之法線方向位置整合。其結果,可以更穩定之狀態適當處理上述處理對象部分。Preferably, the second driving mechanism 16 drives at least one of the first processing part 14a and the second processing part 14b to determine the clamping position of the workpiece P in the normal direction before the workpiece fixing member 12 fixes the workpiece P. In addition, in this structure, it is preferable that the first drive mechanism 15 drives the workpiece fixing member 12 so that the workpiece P is located in the normal direction position determined by the second drive mechanism 16 . By driving the first driving mechanism 15 and the second driving mechanism 16 in this way, the processing device 1 can easily and reliably align the normal direction position of the reference position mark R when the imaging unit 11 takes the image with the first processing unit 14a. The normal direction position of the processing target part of the workpiece P during processing by the second processing unit 14b is integrated. As a result, the above-mentioned processing target part can be appropriately processed in a more stable state.

(控制部) 控制部17例如包含電腦而構成,該電腦具有進行資料處理之CPU(Central Processing Unit:中央處理單元),或者,暫時或永久記憶各種資訊之半導體記憶體等記憶部。 (Control Department) The control unit 17 is configured to include, for example, a computer having a CPU (Central Processing Unit) that performs data processing, or a memory unit such as a semiconductor memory that temporarily or permanently stores various information.

控制部17首先以決定第1處理部14a及第2處理部14b之工件P之法線方向上之夾入位置之方式,使第1處理部14a及第2處理部14b之至少一者移動。接著,控制部17於攝像部11之拍攝時,以將工件P固定於法線方向之基準位置之方式,使工件固定構件12移動。當攝像部11之拍攝結束時,控制部17使工件固定構件12離開工件P後,使第1處理部14a及第2處理部14b以與工件P之處理對象部分對向之方式移動。再者,控制部17使第1處理部14a及第2處理部14b朝對向方向內側(互相靠近之方向)移動,於與上述基準位置相同之法線方向位置夾入工件P。控制部17於第1處理部14a及第2處理部14b之處理結束後,使第1處理部14a及第2處理部14b離開工件P。控制部17對於各處理對象部分,基於上述順序控制工件固定構件12、第1處理部14a及第2處理部14b。該處理裝置1藉由控制部17進行上述控制,可對工件P快速且穩定地進行期望之處理。The control part 17 first moves at least one of the first processing part 14a and the second processing part 14b to determine the clamping position of the workpiece P in the normal direction of the first processing part 14a and the second processing part 14b. Next, the control unit 17 moves the workpiece fixing member 12 so that the workpiece P is fixed at the reference position in the normal direction during imaging by the imaging unit 11 . When the imaging by the imaging unit 11 ends, the control unit 17 moves the workpiece fixing member 12 away from the workpiece P, and then moves the first processing unit 14a and the second processing unit 14b to face the processing target portion of the workpiece P. Furthermore, the control part 17 moves the first processing part 14a and the second processing part 14b inward in the opposite direction (direction approaching each other), and clamps the workpiece P at the same normal direction position as the above-mentioned reference position. After the processing by the first processing part 14a and the second processing part 14b is completed, the control part 17 moves the first processing part 14a and the second processing part 14b away from the workpiece P. The control part 17 controls the workpiece fixing member 12, the 1st processing part 14a, and the 2nd processing part 14b with respect to each processing target part based on the said sequence. This processing device 1 can quickly and stably perform desired processing on the workpiece P by performing the above-mentioned control by the control unit 17 .

<處理方法> 接著,參照圖3至圖9,針對使用圖1及圖2之處理裝置1之處理方法進行說明。 <Processing method> Next, a processing method using the processing device 1 of FIGS. 1 and 2 will be described with reference to FIGS. 3 to 9 .

該處理方法使用處理裝置1進行,該處理裝置1具備:攝像部11,其具有自法線方向與板狀或片狀之工件P正對之光學元件11a;工件固定構件12,其自上述法線方向觀察,於光學元件11a附近,將工件P固定於上述法線方向之基準位置;特定部13,其特定工件P之處理對象部分;第1處理部14a及第2處理部14b,其等可自兩面側夾入上述處理對象部分;第1驅動機構15,其驅動工件固定構件12;第2驅動機構16,其驅動第1處理部14a及第2處理部14b;及控制部17,其控制第1驅動機構15及第2驅動機構16之動作。如圖3所示,該處理方法決定工件P之法線方向上之夾入位置(S1),驅動工件固定構件12(S2),拍攝基準位置標記R(S3),特定工件P之處理對象部分(S4),夾入工件P之處理對象部分(S5)。另,該處理方法於S5之後,具備解除工件P之夾入之順序。該處理方法藉由對工件P之不同之處理對象部分重複進行S2至S5之順序,而可快速且穩定地對工件P進行期望之處理。This processing method is performed using a processing device 1 equipped with: an imaging unit 11 having an optical element 11a facing the plate-like or sheet-like workpiece P from the normal direction; and a workpiece fixing member 12 having the above-mentioned method. Viewed in the linear direction, the workpiece P is fixed at the reference position in the normal direction near the optical element 11a; the specific part 13 specifies the processing target part of the workpiece P; the first processing part 14a and the second processing part 14b, etc. The above-mentioned processing target part can be sandwiched from both sides; the first driving mechanism 15 drives the workpiece fixing member 12; the second driving mechanism 16 drives the first processing part 14a and the second processing part 14b; and the control part 17. The operations of the first driving mechanism 15 and the second driving mechanism 16 are controlled. As shown in Figure 3, this processing method determines the clamping position in the normal direction of the workpiece P (S1), drives the workpiece fixing member 12 (S2), captures the reference position mark R (S3), and specifies the processing target part of the workpiece P. (S4), clamp the processing target part of the workpiece P (S5). In addition, this processing method includes the procedure of releasing the clamping of the workpiece P after S5. This processing method can quickly and stably perform desired processing on the workpiece P by repeating the sequence of S2 to S5 on different processing target parts of the workpiece P.

(S1) S1中,藉由第2驅動機構16,驅動第1處理部14a及第2處理部14b之至少一者,決定工件P之法線方向上之處理對象部分之夾入位置。 (S1) In S1, at least one of the first processing part 14a and the second processing part 14b is driven by the second driving mechanism 16, and the clamping position of the processing target part in the normal direction of the workpiece P is determined.

參照圖4,針對工件P向下方撓曲之情形等之夾入位置之決定順序之一例進行說明。S1中,以第2處理部14b之支持板22之上表面位於由4個工件固持具31之工件P之固持位置規定之假想平面內之方式,使第2處理部14b向上方移動。S1中,為消除工件P之撓曲,將使支持板22之上表面移動至上述假想平面內之狀態之位置資訊記憶於控制部17。Referring to FIG. 4 , an example of the procedure for determining the clamping position when the workpiece P is deflected downward will be described. In S1, the second processing part 14b is moved upward so that the upper surface of the support plate 22 of the second processing part 14b is located in an imaginary plane defined by the holding positions of the workpiece P of the four workpiece holders 31. In S1, in order to eliminate the deflection of the workpiece P, the position information of the state in which the upper surface of the support plate 22 is moved to the above-mentioned virtual plane is stored in the control unit 17.

另,上述順序為一例,S1中,亦可未必使第2處理部14b之支持板22之上表面之位置與上述假想平面一致。In addition, the above-mentioned sequence is an example, and in S1, the position of the upper surface of the support plate 22 of the second processing part 14b does not necessarily need to coincide with the above-mentioned virtual plane.

(S2) S2藉由利用第1驅動機構15驅動工件固定構件12而進行。S2中,以上述基準位置、與由第1處理部14a及第2處理部14b夾入時之法線方向位置相同之方式,驅動工件固定構件12。 (S2) S2 is performed by driving the workpiece fixing member 12 using the first driving mechanism 15 . In S2, the workpiece fixing member 12 is driven so that the above-mentioned reference position is the same as the position in the normal direction when sandwiched between the first processing part 14a and the second processing part 14b.

S2中,以S1中記憶之位置與工件P之法線方向上之固定位置一致之方式,藉由工件固定構件12固定工件P。S2中,例如如圖5所示,亦可由一對工件固定構件12自兩面側夾入工件P,藉此固定工件P。又,S2中,如圖6所示,為局部消除工件P向下方之撓曲,亦可使位於工件P之下方側之工件固定構件12向上方移動,由該工件固定構件12自下方支持工件P,藉此固定工件P。再者,S2中,為局部消除工件P之隆起,亦可使位於工件P之上方側之工件固定構件12向下方移動,由該工件固定構件12自上方支持工件P,藉此固定工件P。In S2, the workpiece P is fixed by the workpiece fixing member 12 in such a manner that the position memorized in S1 coincides with the fixed position in the normal direction of the workpiece P. In S2, for example, as shown in FIG. 5 , the workpiece P may be fixed by sandwiching the workpiece P from both sides by a pair of workpiece fixing members 12 . In addition, in S2, as shown in Fig. 6, in order to partially eliminate the downward deflection of the workpiece P, the workpiece fixing member 12 located on the lower side of the workpiece P can also be moved upward, and the workpiece fixing member 12 supports the workpiece from below. P, thereby fixing the workpiece P. Furthermore, in S2, in order to partially eliminate the bulge of the workpiece P, the workpiece fixing member 12 located above the workpiece P can also be moved downward, and the workpiece fixing member 12 supports the workpiece P from above, thereby fixing the workpiece P.

(S3) S3藉由利用攝像部11拍攝基準位置標記R而進行。S3中,於藉由工件固定構件12將工件P固定於上述基準位置之狀態下,自工件P之法線方向拍攝設置於工件P之基準位置標記R。S3中,例如如圖5及圖6所示,藉由介隔工件P對向之一對攝像部11,拍攝基準位置標記R。 (S3) S3 is performed by photographing the reference position mark R using the imaging unit 11 . In S3, while the workpiece P is fixed at the above-mentioned reference position by the workpiece fixing member 12, the reference position mark R provided on the workpiece P is photographed from the normal direction of the workpiece P. In S3, for example, as shown in FIGS. 5 and 6 , the reference position mark R is captured by a pair of opposing imaging units 11 across the workpiece P.

又,S3中,如圖7所示,亦可藉由配置於工件P之單面側之1個攝像部11,拍攝基準位置標記R。例如,如於工件P之兩面設有電路圖案,該等電路圖案之尺寸互不相同之情形時,藉由使用尺寸較小之電路圖案作為基準位置標記R,而易於由後述之S4特定工件P之處理對象部分。另,即使藉由1個攝像部11拍攝基準位置標記R之情形時,亦可僅藉由配置於工件P之上方側或下方側之一工件固定構件12,僅自單側固定工件P。In addition, in S3, as shown in FIG. 7 , the reference position mark R may be captured by one imaging unit 11 disposed on one side of the workpiece P. For example, if circuit patterns are provided on both sides of the workpiece P and the sizes of the circuit patterns are different from each other, by using the circuit pattern with a smaller size as the reference position mark R, the workpiece P can be easily identified in S4 described below. The processing object part. Even when the reference position mark R is captured by one imaging unit 11, the workpiece P can be fixed from only one side by only one of the workpiece fixing members 12 disposed above or below the workpiece P.

(S4) S4藉由特定部13進行。S4中,基於基準位置標記R之攝像結果,特定工件P之處理對象部分。 (S4) S4 is performed by the specifying unit 13 . In S4, based on the imaging result of the reference position mark R, the processing target part of the workpiece P is specified.

(S5) S5中,於使第1處理部14a及第2處理部14b與工件P之處理對象部分之兩側對向之狀態下,藉由第1處理部14a及第2處理部14b夾入工件P之處理對象部分。S5中,以S1中記憶之位置與工件P之法線方向上之夾入位置一致之方式,藉由第1處理部14a及第2處理部14b夾入工件P之處理對象部分。 (S5) In S5, with the first processing part 14a and the second processing part 14b facing both sides of the processing target part of the workpiece P, the workpiece P is sandwiched between the first processing part 14a and the second processing part 14b. Process object part. In S5, the processing target part of the workpiece P is clamped by the first processing part 14a and the second processing part 14b so that the position memorized in S1 coincides with the clamping position in the normal direction of the workpiece P.

針對S5之工件P之處理對象部分之夾入順序之一例進行說明。首先,S5中,如圖8所示,於解除工件固定構件12對工件P之固定之狀態下,藉由第2驅動機構16,於工件P之平面方向驅動第1處理部14a及第2處理部14b,直至位於與工件P之處理對象部分對向之位置為止。再者,S5中,如圖9所示,藉由第1處理部14a及第2處理部14b,自兩側夾入工件P之處理對象部分。上述處理對象部分之夾入可藉由使第1處理部14a及第2處理部14b同時移動而進行。又,上述夾入亦可藉由以消除上述處理對象部分之撓曲等之方式使第2處理部14b移動至特定位置後,使第1處理部14a移動而進行。An example of the clamping sequence of the processing target part of the workpiece P in S5 will be explained. First, in S5, as shown in FIG. 8, in a state where the fixation of the workpiece P by the workpiece fixing member 12 is released, the first processing part 14a and the second processing part are driven in the plane direction of the workpiece P by the second driving mechanism 16. portion 14b until it is located at a position opposite to the processing target portion of the workpiece P. Furthermore, in S5, as shown in FIG. 9, the processing target part of the workpiece P is pinched from both sides by the 1st processing part 14a and the 2nd processing part 14b. The above-mentioned clamping of the processing target portion can be performed by simultaneously moving the first processing part 14a and the second processing part 14b. In addition, the above-mentioned clamping may be performed by moving the second processing part 14b to a specific position so as to eliminate the deflection of the part to be processed, and then moving the first processing part 14a.

<優點> 該處理裝置1係第1驅動機構15以於第1處理部14a及第2處理部14b之夾入時及攝像部11之拍攝時,工件P之法線方向位置相同之方式,驅動工件固定構件12。因此,該處理裝置1於工件P存在撓曲、翹曲、起伏等之情形時,亦可容易使拍攝時之基準位置標記R之法線方向位置、與第1處理部14a及第2處理部14b夾入時之上述處理對象部分之法線方向位置整合。即,該處理裝置1可於將工件P配置於同一假想平面內之狀態下,進行上述攝像部11之拍攝、與第1處理部14a及第2處理部14b之夾入。其結果,該處理裝置1藉由容易且正確掌握設置於工件P之基準位置標記R與上述處理對象部分之位置關係,而可適當處理上述處理對象部分。 <Advantages> In this processing device 1, the first driving mechanism 15 drives the workpiece fixing member so that the position of the workpiece P in the normal direction is the same when the first processing part 14a and the second processing part 14b are sandwiched and when the imaging part 11 is photographing. 12. Therefore, when the workpiece P is deflected, warped, undulated, etc., the processing device 1 can easily align the normal direction position of the reference position mark R during shooting with the first processing unit 14a and the second processing unit. 14b The normal direction position of the above-mentioned processing target part during clamping is integrated. That is, this processing device 1 can perform imaging by the imaging unit 11 and sandwiching of the first processing unit 14a and the second processing unit 14b while the workpiece P is arranged on the same virtual plane. As a result, the processing device 1 can easily and accurately grasp the positional relationship between the reference position mark R provided on the workpiece P and the processing target portion, thereby appropriately processing the processing target portion.

該處理方法即使於工件P存在撓曲、翹曲、起伏等之情形時,亦可容易使拍攝時之基準位置標記R之法線方向位置、與由第1處理部14a及第2處理部14b夾入時之上述處理對象部分之法線方向位置整合。其結果,該處理方法藉由容易且正確掌握設置於工件P之基準位置標記R與上述處理對象部分之位置關係,而可適當處理上述處理對象部分。This processing method can easily adjust the normal direction position of the reference position mark R at the time of photographing to the first processing unit 14a and the second processing unit 14b even when the workpiece P is deflected, warped, undulated, etc. The normal direction position of the above-mentioned processing object part when clamped is integrated. As a result, this processing method can easily and accurately grasp the positional relationship between the reference position mark R provided on the workpiece P and the processing target portion, thereby making it possible to appropriately process the processing target portion.

[第二實施形態] <處理裝置> 圖10之處理裝置41具備:攝像部11,其具有自法線方向(圖10之Z方向)與板狀或片狀之工件P正對之光學元件11a,自上述法線方向拍攝設置於工件P之基準位置標記R;工件固定構件12,其於攝像部11之拍攝時,自上述法線方向觀察,於光學元件11a附近,將工件P固定於上述法線方向之基準位置;特定部13,其基於攝像部11之攝像結果,特定工件P之處理對象部分;第1處理部14a及第2處理部14b,其等可自兩面側夾入上述處理對象部分;及第1驅動機構15,其以上述基準位置、與由第1處理部14a及第2處理部14b夾入時之法線方向位置相同之方式,驅動工件固定構件12。又,該處理裝置41具備:第2驅動機構16,其驅動第1處理部14a及第2處理部14b;及控制部17,其控制第1驅動機構15及第2驅動機構16之動作。再者,該處理裝置41具備測定部42,其可測定由攝像部11拍攝時之工件P之法線方向位置、以及由第1處理部14a及第2處理部14b夾入時之工件P之法線方向位置。該處理裝置41除具備測定部42以外,可設為與圖1之處理裝置1相同之構成。因此,以下,僅針對測定部42進行說明。 [Second Embodiment] <Processing device> The processing device 41 of Fig. 10 is equipped with an imaging unit 11 having an optical element 11a facing the plate-like or sheet-like workpiece P from the normal direction (Z direction in Fig. 10), and is arranged to take pictures of the workpiece from the normal direction. the reference position mark R of P; the workpiece fixing member 12, which fixes the workpiece P at the reference position in the normal direction near the optical element 11a when viewed from the above-mentioned normal direction when the imaging unit 11 is photographing; the specific part 13 , which specifies the processing target part of the workpiece P based on the imaging result of the imaging unit 11; the first processing part 14a and the second processing part 14b, which can sandwich the processing target part from both sides; and the first driving mechanism 15, The workpiece fixing member 12 is driven so that the above-mentioned reference position is the same as the position in the normal direction when sandwiched between the first processing part 14a and the second processing part 14b. Furthermore, this processing device 41 is provided with: the 2nd driving mechanism 16 which drives the 1st processing part 14a and the 2nd processing part 14b; and the control part 17 which controls the operation|movement of the 1st driving mechanism 15 and the 2nd driving mechanism 16. Furthermore, the processing device 41 is provided with a measuring unit 42 that can measure the normal direction position of the workpiece P when photographed by the imaging unit 11 and the position of the workpiece P when sandwiched between the first processing unit 14a and the second processing unit 14b. Normal direction position. This processing device 41 can have the same structure as the processing device 1 of FIG. 1 except that it is provided with the measurement part 42. Therefore, only the measurement unit 42 will be described below.

(測定部) 測定部42包含非接觸感測器。作為上述非接觸感測器,可列舉例如雷射距離感測器、超音波距離感測器等距離感測器。測定部42藉由測定工件P之法線方向上與工件P之測定點之距離,而求得該測定點相對於測定部42之相對位置。測定部42基於測定部42之位置,特定XYZ座標系中之上述測定點之絕對位置。測定部42亦可以能測定與期望之測定點之距離之方式,可移動地設置於工件P之平面方向(圖10之XY平面方向)。 (Measurement Department) The measurement unit 42 includes a non-contact sensor. Examples of the non-contact sensor include distance sensors such as laser distance sensors and ultrasonic distance sensors. The measuring unit 42 determines the relative position of the measuring point with respect to the measuring unit 42 by measuring the distance in the normal direction of the workpiece P and the measuring point of the workpiece P. The measuring unit 42 specifies the absolute position of the above-mentioned measuring point in the XYZ coordinate system based on the position of the measuring unit 42 . The measuring unit 42 may be movably provided in the plane direction of the workpiece P (the XY plane direction in FIG. 10 ) so that the distance to a desired measurement point can be measured.

<處理方法> 使用該處理裝置41之處理方法與使用圖1之處理裝置1之處理方法同樣,決定工件P之法線方向上之夾入位置(S1),驅動工件固定構件12(S2),拍攝基準位置標記R(S3),特定工件P之處理對象部分(S4),夾入工件P之處理對象部分(S5)。 <Processing method> The processing method using this processing device 41 is the same as the processing method using the processing device 1 in Fig. 1 . The clamping position in the normal direction of the workpiece P is determined (S1), the workpiece fixing member 12 is driven (S2), and the reference position mark is photographed. R (S3) specifies the processing target part of the workpiece P (S4), and clamps the processing target part of the workpiece P (S5).

該處理方法中,藉由測定部42測定由S1決定之工件P之法線方向上之夾入預定位置、及S2中工件P之法線方向上之固定位置。又,該處理方法中,亦可藉由測定部42測定S5中工件P之法線方向上之夾入位置。該處理方法中,以S1或S5中之測定值與S2中之測定值一致之方式,於S2中驅動工件固定構件12,或者,於S1或S5中驅動第1處理部14a及第2處理部14b。In this processing method, the measuring unit 42 measures the scheduled clamping position in the normal direction of the workpiece P determined in S1 and the fixed position in the normal direction of the workpiece P in S2. In addition, in this processing method, the clamping position in the normal direction of the workpiece P in S5 may also be measured by the measuring unit 42 . In this processing method, the workpiece fixing member 12 is driven in S2 so that the measured value in S1 or S5 matches the measured value in S2, or the first processing unit 14a and the second processing unit are driven in S1 or S5. 14b.

<優點> 由於該處理裝置41具備測定部42,故即使工件P存在撓曲、翹曲、起伏等之情形時,亦可以更穩定之狀態快速且適當處理工件P。 <Advantages> Since the processing device 41 is provided with the measuring unit 42, even if the workpiece P is deflected, warped, undulated, etc., the workpiece P can be processed quickly and appropriately in a more stable state.

該處理方法藉由測定部42測定工件P之法線方向位置,藉此,即使工件P存在撓曲、翹曲、起伏等之情形時,亦可以更穩定之狀態快速且適當處理工件P。This processing method uses the measuring unit 42 to measure the normal direction position of the workpiece P. Therefore, even if the workpiece P is deflected, warped, undulated, etc., the workpiece P can be processed quickly and appropriately in a more stable state.

[其他實施形態] 上述實施形態並非限定本發明之構成者。因此,上述實施形態可基於本說明書之記載及技術常識,而省略、置換或追加上述實施形態各部之構成要件,該等當解釋為全部屬於本發明之範圍內者。 [Other embodiments] The above-mentioned embodiment does not limit the structure of this invention. Therefore, the above-described embodiments may omit, replace, or add constituent elements of each part of the above-described embodiments based on the description of this specification and technical common sense, and these shall be construed as falling within the scope of the present invention.

上述實施形態中,已針對於水平方向保持工件之構成進行說明。但,工件之保持方向可根據裝置之規格而變更。又,上述實施形態中,已針對藉由工件固持具固持工件之角部之構成進行說明,但該處理裝置之工件之固持方向並非限定於上述構成者。In the above embodiment, the structure of holding the workpiece in the horizontal direction has been described. However, the holding direction of the workpiece can be changed according to the specifications of the device. Furthermore, in the above-mentioned embodiment, the structure in which the corner portion of the workpiece is held by the workpiece holder has been described, but the holding direction of the workpiece in this processing device is not limited to the above-mentioned structure.

上述實施形態中,已針對第2驅動機構於由工件固定構件固定工件之前,驅動第1處理部及第2處理部之至少一者,決定工件之法線方向上之夾入位置之構成進行說明。但,若為如第1處理部及第2處理部之工件之法線方向上之夾入位置已知之情形,則亦可不由第2驅動構決定工件之法線方向上之夾入位置。 [產業上之可利用性] In the above embodiment, the structure in which the second driving mechanism drives at least one of the first processing part and the second processing part to determine the clamping position in the normal direction of the workpiece before fixing the workpiece by the workpiece fixing member has been explained. . However, if the clamping position of the workpiece in the normal direction of the first processing part and the second processing part is known, the clamping position of the workpiece in the normal direction does not need to be determined by the second driving mechanism. [Industrial availability]

如上所說明,本發明之一態樣之處理裝置適於適當處理工件之處理對象部分。As described above, the processing device according to one aspect of the present invention is suitable for appropriately processing the processing target portion of the workpiece.

1:處理裝置 11:攝像部 11a:光學元件 12:工件固定構件 12a:支持面 13:特定部 14a:第1處理部 14b:第2處理部 15:第1驅動機構 16:第2驅動機構 17:控制部 21:探針 22:支持板 31:工件固持具 41:處理裝置 42:測定部 P:工件 R:基準位置標記 S1~S5:步驟 1: Processing device 11:Camera Department 11a: Optical components 12: Workpiece fixing component 12a:Support surface 13:Specific department 14a: 1st Processing Department 14b: 2nd Processing Department 15: 1st drive mechanism 16: 2nd drive mechanism 17:Control Department 21:Probe 22:Support board 31: Workpiece holder 41: Processing device 42: Measurement Department P: workpiece R: reference position mark S1~S5: steps

圖1係自相對於工件之法線方向垂直之方向觀察本發明之一實施形態之處理裝置之模式性側視圖。 圖2係圖1之處理裝置之II-II線剖視圖。 圖3係顯示使用圖1之處理裝置之處理方法之流程圖。 圖4係顯示圖3之處理方法中決定工件之法線方向之夾入位置之順序之模式性側視圖。 圖5係顯示圖3之處理方法中於藉由工件固定構件固定工件之狀態下,拍攝基準位置標記之順序之模式性側視圖。 圖6係顯示圖3之處理方法中於藉由工件固定構件固定工件之狀態下,拍攝基準位置標記之順序之圖5之變化例的模式性側視圖。 圖7係顯示圖3之處理方法中於藉由工件固定構件固定工件之狀態下,拍攝基準位置標記之順序之圖5及圖6之變化例的模式性側視圖。 圖8係顯示圖3之處理方法中藉由第1處理部及第2處理部夾入工件之處理對象部分前之狀態之模式性側視圖。 圖9係顯示圖3之處理方法中藉由第1處理部及第2處理部夾入工件之處理對象部分之狀態之模式性側視圖。 圖10係自相對於工件之法線方向垂直之方向觀察與圖1之處理裝置不同之實施形態之處理裝置之模式性側視圖。 FIG. 1 is a schematic side view of a processing device according to an embodiment of the present invention, viewed from a direction perpendicular to the normal direction of the workpiece. Figure 2 is a cross-sectional view of the processing device in Figure 1 taken along line II-II. FIG. 3 is a flow chart showing a processing method using the processing device of FIG. 1 . FIG. 4 is a schematic side view showing the sequence of clamping positions for determining the normal direction of the workpiece in the processing method of FIG. 3 . FIG. 5 is a schematic side view showing the sequence of photographing the reference position mark in a state where the workpiece is fixed by the workpiece fixing member in the processing method of FIG. 3 . FIG. 6 is a schematic side view of a modified example of FIG. 5 showing the sequence of photographing the reference position mark in a state where the workpiece is fixed by the workpiece fixing member in the processing method of FIG. 3 . FIG. 7 is a schematic side view of a modification example of FIG. 5 and FIG. 6 showing the sequence of photographing the reference position mark in a state where the workpiece is fixed by the workpiece fixing member in the processing method of FIG. 3 . FIG. 8 is a schematic side view showing a state before the processing target portion of the workpiece is sandwiched between the first processing part and the second processing part in the processing method of FIG. 3 . FIG. 9 is a schematic side view showing a state in which the processing target portion of the workpiece is sandwiched between the first processing part and the second processing part in the processing method of FIG. 3 . FIG. 10 is a schematic side view of a processing device of an embodiment different from the processing device of FIG. 1 , viewed from a direction perpendicular to the normal direction of the workpiece.

1:處理裝置 1: Processing device

11:攝像部 11:Camera Department

11a:光學元件 11a: Optical components

12:工件固定構件 12: Workpiece fixing component

12a:支持面 12a:Support surface

13:特定部 13:Specific department

14a:第1處理部 14a: 1st Processing Department

14b:第2處理部 14b: 2nd Processing Department

15:第1驅動機構 15: 1st drive mechanism

16:第2驅動機構 16: 2nd drive mechanism

17:控制部 17:Control Department

21:探針 21:Probe

22:支持板 22:Support board

31:工件固持具 31: Workpiece holder

P:工件 P: workpiece

R:基準位置標記 R: reference position mark

Claims (8)

一種處理裝置,其具備: 攝像部,其具有自法線方向與板狀或片狀之工件正對之光學元件,自上述法線方向拍攝設置於上述工件之基準位置標記; 工件固定構件,其於上述攝像部之拍攝時,自上述法線方向觀察,於上述光學元件附近,將上述工件固定於上述法線方向之基準位置; 特定部,其基於上述攝像部之攝像結果,特定上述工件之處理對象部分; 第1處理部及第2處理部,其等可自兩面側夾入上述處理對象部分;及 第1驅動機構,其以上述基準位置、與由上述第1處理部及上述第2處理部夾入時之法線方向位置相同之方式,驅動上述工件固定構件。 A processing device having: The imaging unit has an optical element facing the plate-like or sheet-like workpiece from the normal direction, and takes pictures of the reference position mark provided on the workpiece from the normal direction; A workpiece fixing member that fixes the workpiece at a reference position in the normal direction near the optical element when viewed from the normal direction when the imaging unit is taking pictures; A specifying unit that specifies the processing target portion of the workpiece based on the imaging result of the imaging unit; The first processing part and the second processing part can sandwich the above-mentioned processing target part from both sides; and A first driving mechanism drives the workpiece fixing member so that the reference position is the same as the position in the normal direction when sandwiched between the first processing part and the second processing part. 如請求項1之處理裝置,其中上述工件固定構件自上述法線方向觀察,於較上述處理對象部分更靠近上述光學元件之位置,局部固定上述工件。The processing device of claim 1, wherein the workpiece fixing member partially fixes the workpiece at a position closer to the optical element than the processing target part when viewed from the normal direction. 如請求項1之處理裝置,其中上述第1驅動機構於由上述第1處理部及上述第2處理部夾入上述處理對象部分之前,以離開上述工件之方式驅動上述工件固定構件。The processing device according to claim 1, wherein the first driving mechanism drives the workpiece fixing member away from the workpiece before the first processing part and the second processing part sandwich the processing target part. 如請求項2之處理裝置,其中上述第1驅動機構於由上述第1處理部及上述第2處理部夾入上述處理對象部分之前,以離開上述工件之方式驅動上述工件固定構件。The processing device according to claim 2, wherein the first driving mechanism drives the workpiece fixing member away from the workpiece before the first processing part and the second processing part sandwich the processing target part. 如請求項1至4中任一項之處理裝置,其具備:驅動上述第1處理部及上述第2處理部之第2驅動機構, 上述第2驅動機構於由上述工件固定構件固定上述工件之前,驅動上述第1處理部及上述第2處理部之至少一者,決定上述工件之上述法線方向上之夾入位置, 上述第1驅動機構以上述工件位於由上述第2驅動機構決定之法線方向位置之方式,驅動上述工件固定構件。 The processing device according to any one of claims 1 to 4, which is provided with: a second driving mechanism that drives the above-mentioned first processing part and the above-mentioned second processing part, The above-mentioned second driving mechanism drives at least one of the above-mentioned first processing part and the above-mentioned second processing part to determine the clamping position of the above-mentioned workpiece in the above-mentioned normal direction before the above-mentioned workpiece is fixed by the above-mentioned workpiece fixing member, The first driving mechanism drives the workpiece fixing member so that the workpiece is positioned in a normal direction determined by the second driving mechanism. 如請求項1至4中任一項之處理裝置,其進而具備:測定部,其可測定上述攝像時之上述工件之法線方向位置、以及由上述第1處理部及上述第2處理部夾入時之上述工件之法線方向位置。The processing device according to any one of claims 1 to 4, further comprising: a measuring unit capable of measuring the normal direction position of the workpiece during the imaging, and being sandwiched between the first processing unit and the second processing unit. The normal direction position of the above-mentioned workpiece at the time of entry. 如請求項5之處理裝置,其進而具備:測定部,其可測定上述攝像時之上述工件之法線方向位置、以及由上述第1處理部及上述第2處理部夾入時之上述工件之法線方向位置。The processing device of claim 5, further comprising: a measuring unit capable of measuring the normal direction position of the workpiece during the imaging and the position of the workpiece when sandwiched between the first processing unit and the second processing unit. Normal direction position. 一種處理方法,其使用具備: 攝像部,其具有自法線方向與板狀或片狀之工件正對之光學元件; 工件固定構件,其自上述法線方向觀察,於上述光學元件附近,將上述工件固定於上述法線方向之基準位置; 特定部,其特定上述工件之處理對象部分; 第1處理部及第2處理部,其等可自兩面側夾入上述處理對象部分;及 第1驅動機構,其驅動上述工件固定構件 之處理裝置, 以上述基準位置、與由上述第1處理部及上述第2處理部夾入時之法線方向位置相同之方式,驅動上述工件固定構件, 於藉由上述工件固定構件將上述工件固定於上述基準位置之狀態下,自上述法線方向拍攝設置於上述工件之基準位置標記, 基於上述基準位置標記之攝像結果,特定上述工件之處理對象部分。 A treatment method that uses: The imaging part has an optical element facing the plate-shaped or sheet-shaped workpiece from the normal direction; A workpiece fixing member, which is located near the optical element when viewed from the normal direction, and fixes the workpiece at a reference position in the normal direction; The specific part specifies the processing target part of the above-mentioned workpiece; The first processing part and the second processing part can sandwich the above-mentioned processing target part from both sides; and A first driving mechanism that drives the above-mentioned workpiece fixing member processing device, The above-mentioned workpiece fixing member is driven so that the above-mentioned reference position is the same as the position in the normal direction when sandwiched between the above-mentioned first processing part and the above-mentioned second processing part, With the workpiece fixed at the reference position by the workpiece fixing member, the reference position mark provided on the workpiece is photographed from the normal direction, Based on the imaging result of the reference position mark, the processing target part of the workpiece is specified.
TW111149165A 2022-01-31 2022-12-21 Processing equipment and processing method TWI834440B (en)

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PCT/JP2022/003681 WO2023145091A1 (en) 2022-01-31 2022-01-31 Processing apparatus and processing method
WOPCT/JP2022/003681 2022-01-31

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TWI834440B true TWI834440B (en) 2024-03-01

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201337291A (en) 2012-02-13 2013-09-16 Nidec Read Corp Alignment method of substrate inspection apparatus and substrate inspection apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201337291A (en) 2012-02-13 2013-09-16 Nidec Read Corp Alignment method of substrate inspection apparatus and substrate inspection apparatus

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