CN115453330A - Automatic test equipment for laser chip - Google Patents
Automatic test equipment for laser chip Download PDFInfo
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- CN115453330A CN115453330A CN202211226976.1A CN202211226976A CN115453330A CN 115453330 A CN115453330 A CN 115453330A CN 202211226976 A CN202211226976 A CN 202211226976A CN 115453330 A CN115453330 A CN 115453330A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- Environmental & Geological Engineering (AREA)
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses an automatic test device for a laser chip, which comprises: the base is a main platform of the device, and the upper end of the base is provided with a dustproof cover; the upper surface of base passes through rivet fixed mounting and has: the wafer placing table, the high-temperature detecting table, the normal-temperature detecting table, the detecting mechanism, the classification placing table and the transfer detecting table are arranged, the high-temperature detecting table is arranged on the left side of the wafer placing table, the normal-temperature detecting table is arranged on the left side of the high-temperature detecting table, the classification placing table is arranged on the left side of the normal-temperature detecting table, the detecting mechanism is arranged at the front end of the normal-temperature detecting table and the front end of the high-temperature detecting table, and the detecting mechanisms are arranged in two groups; this a detection device for laser chip can utilize three testing platform of group, carries out the detection under high temperature and the normal atmospheric temperature to laser chip to more accurate detection laser chip's physique also has fairly high detection efficiency simultaneously, can satisfy big batch laser chip's short-term test demand.
Description
Technical Field
The invention relates to the technical field of laser chip testing, in particular to automatic testing equipment for a laser chip.
Background
With the increasing demand of internet and multimedia communication and the continuous promotion of the technological level, the hardware demand of various networks is increased, the optical fiber communication is gradually applied to the fields of network communication and the like by virtue of high bandwidth and low delay, the development of optoelectronic devices such as laser chips and the like is also matured, and the physical constitution of the laser chips is different due to the limitation of the production process of the laser chips in the production process, so that detection equipment is required to be used for detecting the physical constitution of the laser chips.
The invention discloses an automatic chip test device as the application number CN2021215581, which comprises a test machine table, a test module and a test module, wherein a plurality of test modules are arranged on the test machine table in an array manner; the feeding and discharging mechanism is arranged on the side edge of the testing machine table and used for placing a material tray of the chip; the device comprises a flying shuttle mechanism, a feeding and discharging end of the flying shuttle mechanism is arranged at a feeding and discharging mechanism, and the other feeding and discharging end of the flying shuttle mechanism is arranged at a test module; the feeding and discharging machine head mechanism is arranged above the feeding and discharging mechanism; and the testing machine head mechanism is arranged above the testing machine table. According to the invention, manual labor is replaced by automatic testing, and the alternate reciprocating motion of the shuttle flying mechanisms of the two material loading platforms is adopted to meet the requirement of high speed and high efficiency of the platform, so that the overall efficiency of the platform is improved, the positioning is accurate, the testing efficiency can be greatly improved, and the advantages of simultaneous feeding, discharging and testing of a plurality of groups of chips are supported.
The laser chip detection device similar to the above has the following disadvantages:
because the laser chip needs to be maintained to operate under the high temperature environment, the temperature resistant quality of laser chip can directly influence its performance level, and laser chip detection demand under the high temperature can't be satisfied to current device.
Therefore, in view of the above, research and improvement are made on the existing structure and defects, and an automatic testing apparatus for a laser chip is proposed to achieve the purpose of higher practical value.
Disclosure of Invention
The present invention is directed to an automatic testing apparatus for laser chips, which solves the above problems.
In order to achieve the purpose, the invention provides the following technical scheme: an automatic test equipment for laser chips, comprising:
the base is a main platform of the device, and the upper end of the base is provided with a dustproof cover;
the upper surface of base passes through rivet fixed mounting and has: the wafer placing table, the high-temperature detecting table, the normal-temperature detecting table, the detecting mechanism, the classification placing table and the transfer detecting table are arranged, the high-temperature detecting table is arranged on the left side of the wafer placing table, the normal-temperature detecting table is arranged on the left side of the high-temperature detecting table, the classification placing table is arranged on the left side of the normal-temperature detecting table, the detecting mechanism is arranged at the front end of the normal-temperature detecting table and the front end of the high-temperature detecting table, and the detecting mechanisms are arranged in two groups; the transport is examined test table and is located the wafer place the platform with the high temperature examine test table with the normal atmospheric temperature examine test table and categorised rear of placing the platform, the front of transporting to examine test table has test probe through screw fixed mounting, test probe extends to the wafer place the platform with the high temperature examine test table with the normal atmospheric temperature examines test table's upper end, test probe sets up three groups altogether.
Preferably, four corners of the surface of the base are fixedly provided with universal wheels and positioning feet through screws.
Preferably, an operation panel and an opening and closing door are arranged on the outer side of the dustproof cover.
Preferably, the wafer placing table includes: platform rotary mechanism, horizontal slip table motor, vertical slip table, longitudinal drive motor, longitudinal sliding platform, expand brilliant dish, wherein platform rotary mechanism for the wafer place the platform with coupling mechanism between the base, horizontal slip table fixed mounting in platform rotary mechanism's upper end, longitudinal slip table slidable mounting in the upper end of horizontal slip table, longitudinal slip table with constitute sliding structure between the horizontal slip table, horizontal slip motor fixed mounting in the outside of horizontal slip table, horizontal slip motor with connect through the hold-in range between the longitudinal slip table, longitudinal sliding platform slidable mounting in the upper end of longitudinal slip table, longitudinal sliding platform with constitute sliding structure between the longitudinal slip table, longitudinal drive motor locates the outside of longitudinal sliding platform, longitudinal drive motor with connect through the hold-in range between the longitudinal sliding platform, expand brilliant dish fixed mounting in the upper end of longitudinal sliding platform.
Preferably, the inside of the high temperature detection table is provided with: first rotating electrical machines and first change driving wheel, wherein first change driving wheel with connect through the hold-in range between the first change driving wheel, the upper end of first change driving wheel is equipped with the high temperature and places the platform, the upper end that the high temperature detected the platform still is equipped with first laser range finder, first survey straight ware, first laser range finder is located the rear side that the platform was placed to the high temperature, first survey straight ware install in the upper end of first laser range finder.
Preferably, the inboard that the platform was examined to the normal atmospheric temperature is provided with the second rotating electrical machines and the second rotates the wheel, wherein the second rotate the wheel with the second rotates to be connected through the hold-in range between the wheel, the upper end that the wheel was rotated to the second is equipped with the normal atmospheric temperature awl and places the platform, the normal atmospheric temperature is examined and is still equipped with second laser range finder, second and surveyed straight ware on the platform, second laser range finder locates the rear side that the platform was placed to the normal atmospheric temperature awl, the second survey straight ware install in the upper end of second laser range finder.
Preferably, the detection mechanism further comprises: the detection support frame is detection mechanism's main supporting component, detection mechanism's upper end fixed mounting has lift driver and chip to detect the head, the chip detect the head with detect the connected mode between the support frame and be sliding connection, the chip detects overhead detection probe that is equipped with, detection probe sets up two sets ofly altogether.
Preferably, the upper surface of the classified placing table is provided with a plurality of groups of sliding platforms in a sliding mode, the inner side of the classified placing table is provided with a sliding motor and a driving roller, an output shaft of the sliding motor is connected with the driving roller through a synchronous belt, and the driving roller is connected with the sliding platforms through a synchronous belt.
Preferably, the transport is detected and is equipped with the longitudinal sliding plate on the platform, the longitudinal sliding plate vertically sets up two sets ofly, the sliding is provided with one-way extraction element and two-way extraction element on the longitudinal sliding plate, one-way extraction element extends to the transport detects the front end of platform, one-way extraction element's inboard is equipped with elevating gear, elevating gear's below is provided with the extraction head, two-way extraction element with one-way extraction element's structure is similar, nevertheless be equipped with two sets of extraction heads on two-way extraction element's the elevating gear, still be equipped with two sets of slip driving motor on the transport detects the platform, slip driving motor with one-to-one correspondence between the longitudinal sliding plate, slip driving motor pass through the hold-in range with be connected between one-way extraction element and the two-way extraction element.
Compared with the prior art, the invention has the beneficial effects that: the detection device for the laser chip can utilize the three groups of detection platforms to detect the laser chip at high temperature and normal temperature, so that the physique of the laser chip can be detected more accurately, meanwhile, the detection device has quite high detection efficiency, and the requirement for rapid detection of mass laser chips can be met;
1. through the high-temperature detection table, a certain temperature can be manufactured by the high-temperature detection table, the operation condition of a chip at a high temperature is simulated, a probe of a detection mechanism can extend onto the chip to detect and inspect the chip, a detection probe is arranged above the chip to monitor the chip in another direction, and meanwhile the high-temperature detection table can be driven by a first rotating motor, so that the high-temperature placing table carrying the chip can continuously rotate, and the monitoring requirements of multiple angles are met;
2. place the platform through the wafer and place the platform with categorised and transport and examine test table, the staff only need place the chip that needs to detect and place the bench at the wafer, and the wafer is placed the platform and just can the auto-tracing chip position to examine the one-way extraction element and two-way extraction element of test table through the transportation and pick up the chip, detect, finally carry it to categorised the platform of placing, thereby accomplish the detection and the work of putting things in good order of chip fast.
Drawings
FIG. 1 is a schematic overall isometric view of the present invention;
FIG. 2 is a schematic isometric view of the present invention with the dust cap removed;
FIG. 3 is a schematic isometric view of a portion of a wafer positioning table according to the present invention;
FIG. 4 is a schematic isometric view of a high temperature testing table and a normal temperature testing table according to the present invention; .
FIG. 5 is a schematic isometric view of a detection mechanism according to the present invention;
FIG. 6 is an isometric view of a portion of the sorting deck of the present invention;
fig. 7 is a schematic isometric view of a portion of a transport inspection station according to the present invention.
In the figure: 1. a base; 11. a universal wheel; 12. a positioning leg; 2. a dust cover; 21. an operation panel; 22. opening and closing the door; 3. a wafer placing table; 31. a platform rotation mechanism; 32. a transverse sliding table; 33. a transverse sliding motor; 34. a longitudinal sliding table; 35. a longitudinal driving motor; 36. a longitudinally sliding platform; 37. expanding a wafer disc; 4. a high temperature detection table; 41. a first rotating electrical machine; 42. a first rotating wheel; 43. a high-temperature placing table; 44. a first laser range finder; 45. a first straightener; 5. a normal temperature detection table; 51. a second rotating electrical machine; 52. a second rotating wheel; 53. a normal-temperature pointed cone placing table; 54. a second laser range finder; 55. a second straightener; 6. a detection mechanism; 61. detecting a support frame; 62. a lift drive; 63. a chip detection head; 64. detecting the probe; 7. a classification placing table; 71. a sliding platform; 72. a slide motor; 73. a driving roller; 8. a transfer detection table; 81. a longitudinal sliding plate; 82. a slide driving motor; 83. a one-way extraction device; 84. a lifting device; 85. extracting a head; 86. a bidirectional extraction device; 9. and (6) detecting the probe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Referring to fig. 1-7, an apparatus for automatically testing a laser chip includes: the device comprises a base 1 which is a main platform of the device, wherein a dustproof cover 2 is arranged at the upper end of the base 1; the upper surface of base 1 is installed through rivet fixed mounting: the wafer placing table 3, the high-temperature detecting table 4, the normal-temperature detecting table 5, the detecting mechanisms 6, the classification placing table 7 and the transfer detecting table 8 are arranged, the high-temperature detecting table 4 is arranged on the left side of the wafer placing table 3, the normal-temperature detecting table 5 is arranged on the left side of the high-temperature detecting table 4, the classification placing table 7 is arranged on the left side of the normal-temperature detecting table 5, the detecting mechanisms 6 are arranged at the front ends of the normal-temperature detecting table 5 and the high-temperature detecting table 4, and the detecting mechanisms 6 are arranged in two groups; the transfer detection platform 8 is arranged behind the wafer placing platform 3, the high-temperature detection platform 4, the normal-temperature detection platform 5 and the classification placing platform 7, the detection probe 9 is fixedly mounted on the front face of the transfer detection platform 8 through screws, the detection probe 9 extends to the upper end of the wafer placing platform 3, the high-temperature detection platform 4 and the normal-temperature detection platform 5, and three groups of detection probes 9 are arranged. The surface four corners of base 1 have universal wheel 11 and location foot 12 through screw fixed mounting, make base 1 can carry out quick adjustment to its position according to the on-the-spot demand. An operation panel 21 and an opening and closing door 22 are arranged on the outer side of the dust cover 2, so that internal detection equipment can be fully protected, and meanwhile, the equipment can be adjusted through the operation panel 21
Referring to fig. 3, an automatic test apparatus for a laser chip includes: the wafer placing table 3 includes: the wafer detection device comprises a platform rotating mechanism 31, a transverse sliding table 32, a transverse sliding motor 33, a longitudinal sliding table 34, a longitudinal driving motor 35, a longitudinal sliding platform 36 and a wafer expansion disc 37, wherein the platform rotating mechanism 31 is a connecting mechanism between a wafer placing table 3 and a base 1, the transverse sliding table 32 is fixedly installed at the upper end of the platform rotating mechanism 31, the longitudinal sliding table 34 is slidably installed at the upper end of the transverse sliding table 32, a sliding structure is formed between the longitudinal sliding table 34 and the transverse sliding table 32, the transverse sliding motor 33 is fixedly installed at the outer side of the transverse sliding table 32, the transverse sliding motor 33 is connected with the longitudinal sliding table 34 through a synchronous belt, the longitudinal sliding platform 36 is slidably installed at the upper end of the longitudinal sliding table 34, a sliding structure is formed between the longitudinal sliding platform 36 and the longitudinal sliding table 34, the longitudinal driving motor 35 is arranged at the outer side of the longitudinal sliding platform 36, the longitudinal driving motor 35 is connected with the longitudinal sliding platform 36 through the synchronous belt, the wafer expansion disc 37 is fixedly installed at the upper end of the longitudinal sliding platform 36, and is combined with the working principle of the wafer expansion disc 37, so that a chip can be primarily detected, when the whole chip is placed on the wafer expansion disc 37, the whole chip can be adjusted according to extract the position of the wafer, and facilitate the chip extraction head 85.
Referring to fig. 4-5, an apparatus for automatically testing a laser chip includes: the inside of high temperature detection platform 4 is provided with: first rotating electrical machines 41 and first rotating wheel 42, wherein be connected through the hold-in range between first rotating wheel 42 and the first rotating wheel 42, the upper end of first rotating wheel 42 is equipped with the high temperature and places platform 43, and the upper end of high temperature detection platform 4 still is equipped with first laser range finder 44, first survey straight ware 45, and the rear side of platform 43 is placed to the high temperature is located to first laser range finder 44, and first survey straight ware 45 is installed in the upper end of first laser range finder 44. The inside of the normal temperature detection table 5 is provided with a second rotating motor 51 and a second rotating wheel 52, wherein the second rotating wheel 52 is connected with the second rotating wheel 52 through a synchronous belt, the upper end of the second rotating wheel 52 is provided with a normal temperature pointed cone placing table 53, the normal temperature detection table 5 is further provided with a second laser distance meter 54 and a second straight meter 55, the second laser distance meter 54 is arranged at the rear side of the normal temperature pointed cone placing table 53, and the second straight meter 55 is arranged at the upper end of the second laser distance meter 54. The detection mechanism 6 further comprises: detect support frame 61 and be the main supporting component of detection mechanism 6, the upper end fixed mounting of detection mechanism 6 has lift driver 62 and chip to detect head 63, the chip detects head 63 and detects the connected mode between support frame 61 and be sliding connection, the chip detects and is equipped with detection probe 64 on the head 63, detection probe 64 sets up two sets ofly altogether, high temperature detects platform 4 and normal atmospheric temperature and detects the chip detection situation that platform 5 can simulate under the high temperature and the normal atmospheric temperature, and can both make the chip carry out multi-angle rotation, thereby be convenient for detect out more comprehensive meticulous detected data.
Referring to fig. 6-7, an apparatus for automatically testing a laser chip includes: the upper surface that the platform 7 was placed in classification slides and is provided with multiunit sliding platform 71, and the inboard that the platform 7 was placed in classification is equipped with sliding motor 72 and driving roller 73, and sliding motor 72's output shaft passes through the hold-in range and connects in driving roller 73, and driving roller 73 passes through the hold-in range and connects in sliding platform 71, and is different according to the quality good and bad grade of chip, sets up the different sliding platform 71 of multiunit to can make the chip of different qualities can classify and pile up through the testing data, accomplish arrangement work. The transfer detection platform 8 is provided with a longitudinal sliding plate 81, the longitudinal sliding plate 81 is longitudinally provided with two groups, the longitudinal sliding plate 81 is provided with a one-way extraction device 83 and a two-way extraction device 86 in a sliding manner, the one-way extraction device 83 extends to the front end of the transfer detection platform 8, the inner side of the one-way extraction device 83 is provided with a lifting device 84, an extraction head 85 is arranged below the lifting device 84, the two-way extraction device 86 is similar to the one-way extraction device 83 in structure, but the lifting device 84 of the two-way extraction device 86 is provided with two groups of extraction heads 85, the transfer detection platform 8 is also provided with two groups of sliding driving motors 82, the sliding driving motors 82 are in one-to-one correspondence with the longitudinal sliding plate 81, the sliding driving motors 82 are connected with the one-way extraction device 83 and the two-way extraction device 86 through synchronous belts, the one-way extraction device 83 can accurately place the detected chips on the placement platform, and when the two-way extraction device 86 is used, the transfer work of the chips on different detection platforms can be completed with higher efficiency, and the detection efficiency of the equipment can be effectively improved.
To sum up: the device takes a base 1 as a main platform, a dust cover 2 protects working equipment, an operation panel 21 can also control the equipment to a certain function, and a chip to be detected can be placed in the device through an opening and closing door 22;
the wafer placing table 3 is used for placing a chip to be detected, meanwhile, the wafer placing table 3 is subjected to preliminary detection, a one-way extraction device 83 and a two-way extraction device 86 are arranged on a transfer detection table 8 and can extract the chip to move, a detection probe 9 can detect the chip, a high-temperature detection table 4 is used for detecting the high-temperature lower body quality of the chip, a normal-temperature detection table 5 can detect the normal-temperature lower body quality of the chip, the detection is completed through a detection mechanism 6, and finally the chip is conveyed to a classification placing table 7 and placed on different sliding platforms 71 through the quality of the chip;
the wafer placing table 3 can rotate through the platform rotating mechanism 31, the stacking angle of the chips is adjusted, the longitudinal sliding table 34 can slide on the transverse sliding table 32 and is driven by the transverse sliding motor 33, the longitudinal sliding table 36 slides on the longitudinal sliding table 36 under the driving of the longitudinal driving motor 35, and the wafer expanding disc 37 can place the chips, so that the detection of the detection probe 9 is facilitated;
the high-temperature detection table 4 drives a first rotating wheel 42 through a first rotating motor 41, a high-temperature placing table 43 rotates in multiple angles, the high-temperature placing table 43 is used for placing a detected chip, a first laser range finder 44 is used for positioning the position of the chip, and the angle and the position of the chip are tracked through a first straight detector 45;
the structure and the principle of the normal temperature detection table 5 are similar to those of the high temperature detection table 4, and the second rotating wheel 52 can be driven by the second rotating motor 51, so that the normal temperature pointed cone placing table 53 rotates, the chip position is positioned by the second laser range finder 54, and the angle of the chip is tracked by the second straight detector 55;
the detection mechanism 6 is supported by the detection support frame 61, the lifting driver 62 can drive the chip detection head 63 to move in the Shanxi direction, and the detection probes 64 can extend to the high-temperature placing table 43 and the normal-temperature pointed cone placing table 53 to perform detection work;
the transportation detection table 8 comprises two groups of longitudinal sliding plates 81, the first group of traveling sections is arranged between the wafer placing table 3 and the normal temperature detection table 5, the two-way extraction device 86 moves through the group of longitudinal sliding plates 81, the second group of traveling sections is arranged between the normal temperature detection table 5 and the classification placing table 7, the one-way extraction device 83 moves through the group of longitudinal sliding plates 81, the two-way extraction device 86 and the one-way extraction device 83 can be driven to move transversely through the sliding driving motor 82, the two-way extraction device 86 is arranged on the first group of longitudinal sliding plates 81 in a sliding mode, the two-way extraction device 86 can drive the extraction head 85 to lift up and down through the lifting device 84, two chips are extracted and moved simultaneously, and the other group of one-way extraction device 83 can convey the chips from the normal temperature detection table 5 to the classification placing table 7 to be stacked;
the classification placing table 7 is provided with a plurality of groups of sliding platforms 71, and a sliding motor 72 is utilized to drive a driving roller 73, so that the sliding platforms 71 move back and forth, the chips are classified and stacked, and the whole using process of the device is completed.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. An automatic test equipment for laser chips, comprising:
the device comprises a base (1) which is a main platform of the device, wherein a dustproof cover (2) is arranged at the upper end of the base (1);
the upper surface of base (1) is installed through rivet fixed mounting: the wafer placing table (3), the high-temperature detecting table (4), the normal-temperature detecting table (5), the detecting mechanism (6), the classified placing table (7) and the transferring detecting table (8), wherein the high-temperature detecting table (4) is arranged on the left side of the wafer placing table (3), the normal-temperature detecting table (5) is arranged on the left side of the high-temperature detecting table (4), the classified placing table (7) is arranged on the left side of the normal-temperature detecting table (5), the detecting mechanism (6) is arranged at the front ends of the normal-temperature detecting table (5) and the high-temperature detecting table (4), and the detecting mechanism (6) is provided with two groups; transport and examine test table (8) and locate the wafer place platform (3) with high temperature detect test table (4) with normal atmospheric temperature detect test table (5) and categorised rear of placing platform (7), transport and examine the front of test table (8) and have test probe (9) through screw fixed mounting, test probe (9) extend to the wafer place platform (3) with high temperature detect test table (4) with the normal atmospheric temperature detects the upper end of test table (5), test probe (9) set up three groups altogether.
2. The automatic testing equipment for the laser chips as claimed in claim 1, wherein four corners of the surface of the base (1) are fixedly provided with universal wheels (11) and positioning feet (12) through screws.
3. The automatic testing equipment for laser chips as claimed in claim 1, wherein an operation panel (21) and an opening and closing door (22) are arranged on the outer side of the dust cover (2).
4. The automatic testing equipment for laser chips as claimed in claim 1, wherein said wafer placing table (3) comprises: a platform rotating mechanism (31), a transverse sliding table (32), a transverse sliding motor (33), a longitudinal sliding table (34), a longitudinal driving motor (35), a longitudinal sliding platform (36) and a crystal expansion disc (37), wherein the platform rotating mechanism (31) is a connecting mechanism between the wafer placing table (3) and the base (1), the transverse sliding table (32) is fixedly arranged at the upper end of the platform rotating mechanism (31), the longitudinal slipway (34) is arranged at the upper end of the transverse slipway (32) in a sliding way, a sliding structure is formed between the longitudinal sliding table (34) and the transverse sliding table (32), the transverse sliding motor (33) is fixedly arranged on the outer side of the transverse sliding table (32), the transverse sliding motor (33) is connected with the longitudinal sliding table (34) through a synchronous belt, the longitudinal sliding platform (36) is slidably arranged at the upper end of the longitudinal sliding table (34), a sliding structure is formed between the longitudinal sliding platform (36) and the longitudinal sliding table (34), the longitudinal driving motor (35) is arranged on the outer side of the longitudinal sliding platform (36), the longitudinal driving motor (35) is connected with the longitudinal sliding platform (36) through a synchronous belt, the crystal expansion disc (37) is fixedly arranged at the upper end of the longitudinal sliding platform (36).
5. The automatic testing equipment for laser chips according to claim 1, characterized in that the high temperature detection table (4) is provided with: first rotating electrical machines (41) and first rotation wheel (42), wherein first rotation wheel (42) with connect through the hold-in range between first rotation wheel (42), the upper end of first rotation wheel (42) is equipped with the high temperature and places platform (43), the upper end that the high temperature detected platform (4) still is equipped with first laser range finder (44), first survey straight ware (45), first laser range finder (44) are located the rear side of platform (43) is placed to the high temperature, first survey straight ware (45) install in the upper end of first laser range finder (44).
6. The automatic testing equipment of the laser chip according to claim 1, wherein a second rotating motor (51) and a second rotating wheel (52) are arranged on the inner side of the normal temperature detection table (5), wherein the second rotating wheel (52) is connected with the second rotating wheel (52) through a synchronous belt, a normal temperature pointed cone placing table (53) is arranged at the upper end of the second rotating wheel (52), a second laser distance measuring device (54) and a second straight measuring device (55) are further arranged on the normal temperature detection table (5), the second laser distance measuring device (54) is arranged at the rear side of the normal temperature pointed cone placing table (53), and the second straight measuring device (55) is arranged at the upper end of the second laser distance measuring device (54).
7. The automatic testing equipment for laser chips as claimed in claim 1, wherein said detecting mechanism (6) further comprises: detect support frame (61) and be the main supporting component of detection mechanism (6), the upper end fixed mounting of detection mechanism (6) has lift driver (62) and chip to detect head (63), the chip detect head (63) with detect the connected mode between support frame (61) and be sliding connection, the chip is detected and is equipped with detection probe (64) on head (63), detection probe (64) set up two sets of altogether.
8. The automatic testing equipment for the laser chips as claimed in claim 1, wherein a plurality of sets of sliding platforms (71) are slidably arranged on the upper surface of the classification placing table (7), a sliding motor (72) and a driving roller (73) are arranged on the inner side of the classification placing table (7), an output shaft of the sliding motor (72) is connected to the driving roller (73) through a synchronous belt, and the driving roller (73) is connected to the sliding platforms (71) through a synchronous belt.
9. The automatic testing equipment for the laser chips as claimed in claim 1, wherein the transporting and detecting table (8) is provided with two longitudinal sliding plates (81), two sets of the longitudinal sliding plates (81) are longitudinally arranged, a one-way extraction device (83) and a two-way extraction device (86) are slidably arranged on the longitudinal sliding plates (81), the one-way extraction device (83) extends to the front end of the transporting and detecting table (8), a lifting device (84) is arranged on the inner side of the one-way extraction device (83), an extraction head (85) is arranged below the lifting device (84), the two-way extraction device (86) is similar to the one-way extraction device (83) in structure, but two sets of the extraction heads (85) are arranged on the lifting device (84) of the two-way extraction device (86), two sets of sliding driving motors (82) are arranged on the transporting and detecting table (8), the sliding driving motors (82) and the longitudinal sliding plates (81) are in one-to-one correspondence, and the sliding driving motors (82) are connected with the one-way extraction device (83) and the two-way extraction device (86) through a synchronous belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211226976.1A CN115453330A (en) | 2022-10-09 | 2022-10-09 | Automatic test equipment for laser chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211226976.1A CN115453330A (en) | 2022-10-09 | 2022-10-09 | Automatic test equipment for laser chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115453330A true CN115453330A (en) | 2022-12-09 |
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| CN202211226976.1A Pending CN115453330A (en) | 2022-10-09 | 2022-10-09 | Automatic test equipment for laser chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116626476A (en) * | 2023-07-26 | 2023-08-22 | 珠海市申科谱工业科技有限公司 | Laser chip probe testing mechanism |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116626476A (en) * | 2023-07-26 | 2023-08-22 | 珠海市申科谱工业科技有限公司 | Laser chip probe testing mechanism |
| CN116626476B (en) * | 2023-07-26 | 2023-10-20 | 珠海市申科谱工业科技有限公司 | Laser chip probe testing mechanism |
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