CN115621165A - Wafer sorting machine - Google Patents
Wafer sorting machine Download PDFInfo
- Publication number
- CN115621165A CN115621165A CN202211288113.7A CN202211288113A CN115621165A CN 115621165 A CN115621165 A CN 115621165A CN 202211288113 A CN202211288113 A CN 202211288113A CN 115621165 A CN115621165 A CN 115621165A
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- wafer
- module
- pair
- bearing
- sorting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer sorting machine, comprising: the device comprises a sorting module, a material preparation module, a carrying manipulator and a centrifugal display; the sorting module is arranged on one side of the material preparation module and is used for sorting wafers of different types stored in the material preparation module; the centrifugal display is arranged on the other side of the material preparation module and used for adjusting the placing direction of the wafer; the carrying manipulator is arranged between the material preparation module and the centrifugal display and used for carrying the wafer. The sorting module, the material preparation module, the carrying manipulator and the centrifugal display are matched to realize the sorting operation of the wafers of different models, the defect of low working efficiency in the prior art is overcome, the characteristics of high processing yield and high processing precision are realized, and the production cost of the wafers is saved.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a wafer sorting machine.
Background
In the wafer sorting work, because the specifications of the wafers are different, different wafer boxes can be used for storing the wafers with different specifications and different processes. The Wafer cassettes are classified into horizontal opening Wafer cassettes (e.g., wafer FOUP, wafer POSB, wafer Open cassette) and vertical opening Wafer cassettes (e.g., cake box). Due to the difference of the wafer boxes, in the prior art, wafers in different types of wafer boxes are often taken, identified and stored by manually using the suction pen, so that the labor cost is higher, and the defects of low working efficiency and easy pollution of the wafers exist.
Disclosure of Invention
According to an embodiment of the present invention, there is provided a wafer sorter including: the device comprises a sorting module, a material preparation module, a carrying manipulator and a centrifugal display;
the sorting module is arranged on one side of the material preparation module and is used for sorting wafers of different types stored in the material preparation module;
the centrifugal display is arranged on the other side of the material preparation module and used for adjusting the placing direction of the wafer;
the carrying manipulator is arranged between the material preparation module and the centrifugal display and used for carrying the wafer.
Further, the stock preparation module comprises: the wafer sorting device comprises a first bearing bracket, a wafer sorting box, a first wafer display box, a second wafer display box and a wafer holding platform;
the wafer sorting box is arranged at the top of the first bearing bracket;
the first wafer display box is arranged at the top of the first bearing bracket;
the second wafer display box is arranged at the top of the first bearing bracket, and the second wafer display box, the first wafer display box and the wafer sorting box are arranged in a straight line;
the wafer holding platform is arranged on one side of the first bearing support and is connected with the carrying manipulator and used for holding wafers.
Further, the wafer holding platform comprises: the device comprises a second bearing bracket, a mounting plate, a pair of guide pieces, a motor, a bidirectional screw, a pair of mounting brackets, a pair of sliding blocks, a bearing plate and two pairs of bearing columns;
the bearing plate is arranged at the top of the second bearing bracket;
the mounting plate is arranged on the second bearing bracket and is positioned on one side of the bearing plate;
a pair of guide members are arranged on the top of the mounting plate in parallel;
the pair of mounting brackets are arranged at the tops of the mounting plates in parallel, and the central shafts of the pair of mounting brackets are the same;
two ends of the bidirectional screw are rotationally connected with the pair of guide pieces;
the pair of sliding blocks are arranged on the pair of guide pieces in a sliding manner, and the pair of sliding blocks are respectively meshed with threads at two ends of the bidirectional screw rod;
the motor is arranged on the mounting plate, and the execution end of the motor is connected with one end of the bidirectional screw rod and used for driving the bidirectional screw rod to rotate;
the two pairs of bearing columns are respectively arranged at the tops of the pair of sliding blocks, penetrate through the bearing plate and protrude out of the outer surface of the bearing plate respectively, and are used for bearing the wafer.
Further, the wafer holding platform further comprises: and the coupler is arranged at the execution end of the motor and is connected with the bidirectional screw.
Further, the sorting module comprises: third bearing support, first linear module, connecting piece, second linear module and clamping jaw
The third bearing support is arranged on one side of the material preparation module;
the first linear module is arranged at the top of the third bearing bracket;
the connecting piece is arranged at the execution end of the first linear module;
the second linear module is arranged on the connecting piece;
the clamping jaw is arranged at the execution end of the second linear module and used for carrying the wafer.
Further, the clamping jaw is a sucker clamping jaw.
Further, the method also comprises the following steps: and the distance measuring sensor is arranged on the clamping jaw and used for detecting the distance between the clamping jaw and the wafer.
According to the wafer sorting machine provided by the embodiment of the invention, the sorting operation of wafers of different models is realized through the matching of the sorting module, the material preparation module, the carrying manipulator and the centrifugal display, the defect of low working efficiency in the prior art is overcome, the wafer sorting machine has the characteristics of high processing yield and high processing precision, and the production cost of the wafers is saved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the claimed technology.
Drawings
FIG. 1 is a perspective view of a wafer handler according to an embodiment of the present invention;
fig. 2 is a partially enlarged view of a portion a in fig. 1.
Detailed Description
The present invention will be further explained by describing preferred embodiments of the present invention in detail with reference to the accompanying drawings.
First, a wafer sorting machine according to an embodiment of the present invention will be described with reference to fig. 1 to 2, which is used for sorting wafers 5 and has a wide application range.
As shown in fig. 1, a wafer handler according to an embodiment of the present invention includes: the device comprises a sorting module, a material preparation module, a carrying manipulator 1 and a centrifugal display 2;
specifically, as shown in fig. 1, the preparation module is used for storing wafers 5 of different models; the centrifugal display 2 is arranged at the other side of the material preparation module and is used for adjusting the placing direction of the wafers 5 so as to keep the placing direction of the randomly placed wafers 5 consistent; the transfer robot 1 is disposed between the stock module and the centrifugal display 2, and transfers the wafer 5.
Further, as shown in fig. 1, the stock preparation module includes: a first carrying rack 31, a wafer sorting box 32, a first wafer display box 33, a second wafer display box 34 and a wafer holding platform; the wafer sorting box 32 is arranged at the top of the first bearing bracket 31 and used for storing a plurality of wafers 5 with different placing directions and different types; a first wafer display box 33 is arranged on the top of the first carrying bracket 31 and used for storing wafers 5 with the same model; the second wafer display box 34 is arranged on the top of the first bearing bracket 31, and the second wafer display box 34, the first wafer display box 33 and the wafer sorting box 32 are arranged in a straight line and used for storing wafers 5 with the same model; the wafer holding platform is arranged on one side of the first bearing support 31, and the wafer holding platform is connected with the carrying manipulator 1 and used for holding wafers 5 of any type.
Further, as shown in fig. 1 to 2, the wafer holding platform includes: a second bearing bracket 351, a mounting plate 352, a pair of guiding members 353, a motor 354, a bidirectional screw 355, a pair of mounting brackets 356, a pair of sliding blocks 357, a bearing plate 358 and two pairs of bearing columns 359; the carrier plate 358 is disposed on top of the second carrier bracket 351; a mounting plate 352 is disposed on the second carrying bracket 351, the mounting plate 352 being located at one side of the carrying plate 358; a pair of guide members 353 provided in parallel on the top of the mounting plate 352 for guiding the pair of sliders 357; a pair of mounting brackets 356 are disposed in parallel on top of the mounting plate 352, the central axes of the pair of mounting brackets 356 being the same for carrying the two-way screw 355; both ends of the bidirectional screw 355 are rotatably connected with a pair of guides 353; the pair of sliders 357 is slidably disposed on the pair of guides 353, the pair of sliders 357 is respectively engaged with the threads at the two ends of the bidirectional screw 355, and the pair of sliders 357 is driven by the reverse screw to move toward or away from each other at the same time, so as to adjust the distance between the two pairs of support columns 359, and enable the two pairs of support columns 359 to be suitable for supporting wafers 5 of different models; the motor 354 is arranged on the mounting plate 352, and the execution end of the motor 354 is connected with one end of the bidirectional screw 355 and is used for driving the bidirectional screw 355 to rotate; two pairs of supporting posts 359 are respectively disposed on top of the pair of sliders 357, and the two pairs of supporting posts 359 respectively penetrate through the supporting plate 358 and protrude from the outer surface of the supporting plate 358 for supporting the wafer 5.
Further, as shown in fig. 2, the wafer holding platform further comprises: the coupler 360 and the coupler 360 are arranged at the actuating end of the motor 354, and the coupler 360 is connected with the bidirectional screw 355 and used for buffering the actuating end of the motor 354, so that the service life of the motor 354 is prolonged.
Specifically, as shown in fig. 1, the sorting module is disposed at one side of the stock preparation module, and is used for sorting wafers 5 of different models stored in the stock preparation module.
Further, as shown in fig. 1, the sorting module includes: a third carrying bracket 41, a first linear module 42, a connecting piece 43, a second linear module 44 and a clamping jaw 45; the third bearing bracket 41 is arranged at one side of the stock preparation module; the first linear module 42 is arranged at the top of the third bearing bracket 41 and used for driving the clamping jaw 45 to move transversely, so that the working efficiency of the embodiment is improved, and the occupied space of the embodiment is saved; the connecting piece 43 is arranged at the executing end of the first linear module 42; the second linear module 44 is arranged on the connecting piece 43 and used for driving the clamping jaw 45 to move longitudinally, so that the working efficiency of the embodiment is improved, and the occupied space of the embodiment is saved; the clamping jaw 45 is disposed at an executing end of the second linear module 44 for carrying the wafer 5.
Further, as shown in fig. 1, the clamping jaw 45 is a suction cup clamping jaw, which can effectively prevent the clamping jaw 45 from damaging the wafer 5, thereby improving the processing yield of the embodiment and saving the production cost.
Further, as shown in fig. 1, the wafer handler further includes: distance measuring sensor 46, distance measuring sensor 46 set up on clamping jaw 45 for detect the distance between clamping jaw 45 and the wafer 5, avoid taking place to collide the piece, improved the machining precision and the processing yield of this embodiment, practiced thrift manufacturing cost.
Before the equipment is operated, the driving clamping jaw 45 drives the distance measuring sensor 46 to measure the height of the wafer 5 in the wafer sorting box 32, the first wafer display box 33 and the second wafer display box 34, when the equipment is operated, the distance measuring sensor 46 measures the distance between the clamping jaw 45 and the wafer 5, the second linear module 44 drives the clamping jaw 45 to extend into the wafer sorting box 32, after the clamping jaw 45 grasps the wafer 5 of any model, the second linear module 44 drives the clamping jaw 45 to return to the initial position, the first linear module 42 drives the second linear module 44 to displace to the upper part of the bearing plate 358 through the connecting piece 43, the motor 354 drives the two-way screw 355 to rotate according to the model of the wafer 5, the two-way screw 355 drives the pair of sliding blocks to displace so as to adjust the distance between the two pairs of bearing columns 359, so that the two pairs of bearing columns 359 are suitable for bearing the wafer 5 clamped on the clamping jaw 45, the second linear module 44 drives the clamping jaw 45 to descend to the preset height, the wafer 5 is placed on the two pairs of bearing columns 359, and then, the second linear module 44 drives the clamping jaw 45 to return to the initial position; the carrying manipulator 1 grabs the wafer 5 placed on the two pairs of bearing columns 359 and carries the wafer 5 to the centrifugal display 2, the centrifugal display 2 adjusts the placing direction of the wafer 5, after the centrifugal display 2 is adjusted, the carrying manipulator 1 grabs the wafer 5 on the centrifugal display 2 and puts the wafer 5 back on the two pairs of bearing columns 359, the second linear module 44 drives the clamping jaw 45 to descend and grabs the wafer 5 on the two pairs of bearing columns 359, after the clamping jaw 45 grabs the wafer 5, the second linear module 44 drives the clamping jaw 45 to ascend, the first linear module 42 drives the second linear module 44 to displace to the position above the first wafer display box 33 or the second wafer display box 34 corresponding to the model of the wafer 5 according to the model of the wafer 5, and the second linear module 44 drives the clamping jaw 45 to descend and puts the wafer 5 into the first wafer display box 33 or the second wafer display box 34.
In the above, with reference to fig. 1 to 2, the wafer sorting machine according to the embodiment of the present invention is described, and the sorting module, the material preparation module, the carrying manipulator 1 and the centrifugal display 2 are matched to realize the sorting operation of the wafers 5 of different models, so that the defect of low working efficiency in the prior art is solved, and the wafer sorting machine has the characteristics of high processing yield and high processing precision, and saves the production cost of the wafer 5.
It should be noted that, in the present specification, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be determined from the following claims.
Claims (7)
1. A wafer sorter, comprising: the device comprises a sorting module, a material preparation module, a carrying manipulator and a centrifugal display;
the sorting module is arranged on one side of the material preparation module and is used for sorting wafers of different models stored in the material preparation module;
the centrifugal display is arranged on the other side of the material preparation module and used for adjusting the placing direction of the wafer;
the carrying manipulator is arranged between the material preparation module and the centrifugal display and used for carrying wafers.
2. The wafer sorter of claim 1 wherein the preparation module comprises: the wafer sorting device comprises a first bearing bracket, a wafer sorting box, a first wafer display box, a second wafer display box and a wafer holding platform;
the wafer sorting box is arranged at the top of the first bearing bracket;
the first wafer display box is arranged at the top of the first bearing bracket;
the second wafer display box is arranged at the top of the first bearing bracket, and the second wafer display box, the first wafer display box and the wafer sorting box are arranged in a straight line;
the wafer containing platform is arranged on one side of the first bearing support and is connected with the carrying manipulator and used for containing the wafers.
3. The wafer handler of claim 2, wherein the wafer holding platform comprises: the device comprises a second bearing bracket, a mounting plate, a pair of guide pieces, a motor, a bidirectional screw, a pair of mounting brackets, a pair of sliding blocks, a bearing plate and two pairs of bearing columns;
the bearing plate is arranged at the top of the second bearing bracket;
the mounting plate is arranged on the second bearing bracket and is positioned on one side of the bearing plate;
the pair of guide members are arranged on the top of the mounting plate in parallel;
the pair of mounting brackets are arranged at the tops of the mounting plates in parallel, and the central axes of the pair of mounting brackets are the same;
two ends of the bidirectional screw are rotationally connected with the pair of guide pieces;
the pair of sliding blocks are arranged on the pair of guide pieces in a sliding mode, and the pair of sliding blocks are meshed with threads at two ends of the bidirectional screw respectively;
the motor is arranged on the mounting plate, and the execution end of the motor is connected with one end of the bidirectional screw rod and used for driving the bidirectional screw rod to rotate;
the two pairs of bearing columns are respectively arranged at the tops of the pair of sliding blocks, penetrate through the bearing plate and protrude out of the outer surface of the bearing plate respectively, and are used for bearing the wafer.
4. The wafer sorter of claim 3 wherein the wafer holding platform further comprises: the shaft coupling, the shaft coupling setting is in the execution end of motor, the shaft coupling with two-way screw rod links to each other.
5. The wafer handler of claim 1, wherein the sorting module comprises: third bearing support, first linear module, connecting piece, second linear module and clamping jaw
The third bearing support is arranged on one side of the stock preparation module;
the first linear module is arranged at the top of the third bearing bracket;
the connecting piece is arranged at the execution end of the first linear module;
the second straight line module is arranged on the connecting piece;
the clamping jaw is arranged at the execution end of the second linear module and used for carrying the wafer.
6. The wafer sorter of claim 5 wherein said gripper is a suction cup gripper.
7. The wafer handler of claim 5, further comprising: and the distance measuring sensor is arranged on the clamping jaw and used for detecting the distance between the clamping jaw and the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211288113.7A CN115621165B (en) | 2022-10-20 | 2022-10-20 | Wafer sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211288113.7A CN115621165B (en) | 2022-10-20 | 2022-10-20 | Wafer sorting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115621165A true CN115621165A (en) | 2023-01-17 |
| CN115621165B CN115621165B (en) | 2023-09-01 |
Family
ID=84864815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211288113.7A Active CN115621165B (en) | 2022-10-20 | 2022-10-20 | Wafer sorting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115621165B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783701A (en) * | 2015-11-19 | 2017-05-31 | 亿力鑫系统科技股份有限公司 | Wafer bearing device |
| CN113921438A (en) * | 2021-10-18 | 2022-01-11 | 麦斯克电子材料股份有限公司 | Multi-size wafer centering device |
| CN216094907U (en) * | 2021-11-01 | 2022-03-22 | 中电科风华信息装备股份有限公司 | Sorting device for front-end integrated wafers of semiconductor equipment |
| WO2022116514A1 (en) * | 2020-12-04 | 2022-06-09 | 苏州天准科技股份有限公司 | Intelligent silicon wafer sorting machine |
| CN217375054U (en) * | 2022-02-21 | 2022-09-06 | 上海世禹精密机械有限公司 | Wafer transporter |
-
2022
- 2022-10-20 CN CN202211288113.7A patent/CN115621165B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783701A (en) * | 2015-11-19 | 2017-05-31 | 亿力鑫系统科技股份有限公司 | Wafer bearing device |
| WO2022116514A1 (en) * | 2020-12-04 | 2022-06-09 | 苏州天准科技股份有限公司 | Intelligent silicon wafer sorting machine |
| CN113921438A (en) * | 2021-10-18 | 2022-01-11 | 麦斯克电子材料股份有限公司 | Multi-size wafer centering device |
| CN216094907U (en) * | 2021-11-01 | 2022-03-22 | 中电科风华信息装备股份有限公司 | Sorting device for front-end integrated wafers of semiconductor equipment |
| CN217375054U (en) * | 2022-02-21 | 2022-09-06 | 上海世禹精密机械有限公司 | Wafer transporter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115621165B (en) | 2023-09-01 |
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Address after: 201615 Room 101, building 3, no.1589, Lianfu Road, Jiuting Town, Songjiang District, Shanghai Applicant after: Shanghai Shiyu Precision Equipment Co.,Ltd. Address before: 201615 Room 101, building 3, no.1589, Lianfu Road, Jiuting Town, Songjiang District, Shanghai Applicant before: SHANGHAI SHIYU PRECISION MACHINERY Co.,Ltd. |
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