CN106783701A - Wafer bearing device - Google Patents
Wafer bearing device Download PDFInfo
- Publication number
- CN106783701A CN106783701A CN201510799448.9A CN201510799448A CN106783701A CN 106783701 A CN106783701 A CN 106783701A CN 201510799448 A CN201510799448 A CN 201510799448A CN 106783701 A CN106783701 A CN 106783701A
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- China
- Prior art keywords
- chute
- bolster stake
- wafer
- base plate
- top board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
A kind of wafer bearing device, comprising a base plate, a top board, at least 2 first bolster stakes and at least 3 second bolster stakes.The base plate and the top board form at least three bottom chutes and top chute separately respectively, and each bottom chute and top chute all have a first end and one second end.Second bolster stake can be moved between the first end and the second end of the bottom chute and the top chute, when second bolster stake is located at first end, second bolster stake defines one first wafer accommodation space jointly, when second bolster stake is located at the second end, first bolster stake and second bolster stake define one and are more than and cover the second wafer accommodation space of the first wafer accommodation space jointly.Various sizes of wafer just can be carried whereby in the first wafer accommodation space or the second wafer accommodation space.
Description
Technical field
The present invention relates to a kind of bogey, more particularly to a kind of wafer bearing device.
Background technology
In manufacture of semiconductor, wafer bearing device plays the part of a considerable pivotal player.
Due to suitable many, making or the transport for convenience of the number of wafers used in processing procedure, and it is beneficial to
The operation crawl and processing of mechanical arm, it will usually which wafer is neatly emitted on wafer bearing device
On, to facilitate crawl, harvesting and silicon wafer process work to carry out.However, existing wafer holds
Carry to put and be only capable of being placed for the wafer of same size, if the chi of wafer need to be changed because of specific demand
When very little, then the wafer carrying dress placed for another size wafer must be again got the raw materials ready and be replaced as
Put, processing procedure can be proceeded.Therefore, existing wafer bearing device still has the space of improvement.
The content of the invention
Held it is an object of the invention to provide a kind of wafer for being available for various sizes of wafer shared
Carry and put.
Wafer bearing device of the present invention includes a base plate, and the base plate forms at least three separately
Bottom chute, each bottom chute have a first end and one second end；One top board, the top board
Form the bottom chute of at least three top chutes separately, the top runner position and the base plate
Corresponding, each top chute has a first end and one second end；At least two separately
First bolster stake, is arranged in the base plate and top board；And at least three second bolster stakes, it is described
Second bolster stake is arranged in the base plate and the top board by the bottom chute and the top chute,
And can be moved between the first end and the second end of the bottom chute and the top chute, when described
Second bolster stake is located at the bottom chute and the first end of the top chute, and second bolster stake is total to
With defining one first wafer accommodation space, when second bolster stake be located at the bottom chute and
Second end of the top chute, first bolster stake and second bolster stake are defined jointly
One is more than and covers the second wafer accommodation space of the first wafer accommodation space.
Wafer bearing device of the present invention, the top board defines a central point, and the top is slided
The first end of groove is around the central point annular arrangement, and the first end of the top chute and the center
The distance of point is less than second end and the distance of the central point.
The contact of wafer bearing device of the present invention, every 1 first bolster stake and the top board
It is more than the first end of the top chute and the distance of the central point with the distance of the central point.
Wafer bearing device of the present invention, every 1 first bolster stake include a central shaft and
Multiple stacking is set in the first bearing part on the central shaft, the central shaft through the base plate,
First bearing part and the top board and the base plate and the top board are fixed in, every 1 first carries
Part has a top surface and a bottom surface, and, towards top board, the bottom surface is towards base plate for the top surface.
Wafer bearing device of the present invention, second bolster stake is around the central point ring
Shape is arranged, and every 1 second bolster stake includes that a central shaft and multiple stackings are set in the central shaft
On the second bearing part, the central shaft movably wears the base plate, second bearing part
And the top board, the central shaft extends outward one first block holding part and one second block holding part, often
One first block holding part fastens bottom chute corresponding in the base plate, every 1 second block holding part fasten in
The corresponding top chute of the top board, every 1 second bearing part has a top surface and a bottom surface, the top
Facing to top board, the bottom surface is towards base plate.
Wafer bearing device of the present invention, second block holding part has one to fasten section and one
Extension, the area for fastening section top surface is substantially in wide at the top and narrow at the bottom more than the area of bottom surface
Cone, the extension from this fasten a section top surface upwardly extend it is cylindrical, the top chute
First end and the second end form fit this fasten section.
Wafer bearing device of the present invention, second bolster stake also includes a trip, should
It is below section and remote from the central shaft of second bolster stake that trip is located at fastening for first block holding part
Extend from axis direction, be used to fasten in the top board to prevent second bolster stake relative to this
Top board upper and lower displacement, the width of the trip is less than the top chute.
Wafer bearing device of the present invention, both the first end of the top chute and the second end
One of which further extends outward out an extension, and the shape size of the extension coordinates the trip.
The beneficial effects of the present invention are：Can be in the bottom chute by second bolster stake
And moved between the first end for pushing up chute and the second end, it is somebody's turn to do when second bolster stake is located at
The first end of bottom chute and the top chute, second bolster stake defines one first wafer appearance
Between being empty；When second bolster stake is located at the bottom chute and the second end of the top chute, institute
State the first bolster stake and second bolster stake defines one and is more than and covers first crystalline substance jointly
Second wafer accommodation space of circle accommodation space.The first wafer accommodation space and second crystalline substance
Circle accommodation space can house various sizes of wafer, and reaching makes the wafer bearing device of the present invention can
For the effect that various sizes of wafer is shared.
Brief description of the drawings
Fig. 1 is a stereogram, illustrates an embodiment of wafer bearing device of the present invention, the implementation
First end of multiple second bolster stakes of example in multiple top chute；
Fig. 2 is a top view, illustrates multiple second bolster stakes of the embodiment in multiple top chute
First end；
Fig. 3 is a front view, illustrates multiple second bolster stakes of the embodiment in multiple top chute
First end；
Fig. 4 is the profile drawn by the IV-IV lines in Fig. 2, illustrates that described second holds
Carry post；
Fig. 5 is a stereogram, illustrates second bolster stake of the embodiment in multiple top chute
The second end；
Fig. 6 is a top view, illustrates second bolster stake of the embodiment in multiple top chute
The second end；
Fig. 7 is the partial enlarged drawing at A in Fig. 1, illustrates the card of wherein one second bolster stake
Tenon is fastened in a top board；And
Fig. 8 to Figure 12 is multiple sectional perspective schematic diagrams, illustrates wherein one second bolster stake certainly
The first end of the top chute is moved to the process at one second end of the top chute.
Specific embodiment
Below in conjunction with the accompanying drawings and embodiment the present invention is described in detail.
Refering to Fig. 1 to Fig. 3, an embodiment of wafer bearing device of the present invention comprising a base plate 1,
One the first bolster stake 3 of 2, four, top board and six the second bolster stakes 4, implement at other certainly
In example, it is also possible to only use at least two the first bolster stakes 3 and at least three the second bolster stakes 4.
Refering to Fig. 1, base plate 1 forms six bottom chutes 11 separately, each bottom chute 11
With a first end 111 and one second end 112.Certainly, in other embodiments, the bottom is slided
The quantity of groove 11 coordinates the second bolster stake 4 and also can only set at least three.
Refering to Fig. 1 and Fig. 2, top board 2 forms six top chutes 21 separately and defines one
Central point 22, the top position of chute 21 is corresponding with the bottom chute 11 of the base plate 1, each
Top chute 21 has a first end 211, one second end 212 and an extension 213, pushes up chute
21 first end 211 pushes up the first end 211 of chute 21 around the annular arrangement of central point 22
With the distance that the distance of central point 22 is less than the second end 212 and central point 22, extension 213
It is to stretch out from both ends 212 of first end 211 and second wherein, prolongs in the present embodiment
It is that both all stretch out from the end 212 of first end 211 and second to stretch section 213, but not as
Limit.Certainly, in other embodiments, top chute 21 quantity coordinate the second bolster stake 4 and
Also at least three can only be set.
Refering to Fig. 1 to Fig. 3, four the first bolster stakes 3 are arranged in base plate 1 and top board 2, often
The contact of one first bolster stake 3 and top board 2 is with the distance of central point 22 more than top chute 21
The distance of first end 211 and central point 22, every 1 first bolster stake 3 includes a central shaft 31
And multiple stackings are set in the first bearing part 32 on the central shaft 31, central shaft 31 runs through bottom
Plate 1, first bearing part 32 and top board 2 and base plate 1 and top board 2 are fixed in, every 1
One bearing part 32 has a top surface 321 and a bottom surface 322, and top surface 321 is towards top board 2, bottom
Face 322 is towards base plate 1.
Refering to Fig. 1, Fig. 2 and Fig. 4, six the second bolster stakes 4 by the bottom chute 11 and
The top chute 21 is arranged in base plate 1 and top board 2, and second bolster stake 4 is around central point
22 annular arrangements, every 1 second bolster stake 4 includes that a central shaft 41, multiple stackings are set in
The second bearing part 42 and a trip 45 on central shaft 41.Central shaft 41 movably wears
Base plate 1, second bearing part 42 and top board 2, central shaft 41 extend outward one first
The block holding part 44 of block holding part 43 and 1 second, every 1 first block holding part 43 is fastened in the correspondence of base plate 1
Bottom chute 11, every 1 second block holding part 44 fasten in top board 2 it is corresponding top chute 21.The
Two block holding parts 44 have one to fasten the extension 442 of section 441 and, fasten the face of the top surface of section 441
Product more than bottom surface area, and substantially be in a cone wide at the top and narrow at the bottom, and fasten section 441 with
The shape of 211 and second end of first end 212 for pushing up chute 21 is engaged, and extension 442 is blocked certainly
The top surface of support segment 441 upwardly extends cylindrical.Every 1 second bearing part 42 has a top surface 421
And a bottom surface 422, towards top board 2, bottom surface 422 is towards base plate 1 for top surface 421.Trip 45
The lower section of section 441 that fastens positioned at the first block holding part 43 extends from central shaft 41 away from axis direction,
It is used to fasten in top board 2 to prevent the second bolster stake 4 relative to the upper and lower displacement of top board 2, trip
45 width is less than top chute 21, and the shape of trip 45 and the extension 213 for pushing up chute 21
It is engaged.
Refering to Fig. 1, Fig. 5 and Fig. 6, second bolster stake 4 can in the bottom chute 11 and
Moved between the first end 111,211 of the top chute 21 and the second end 112,212, work as institute
State the second bolster stake 4 and be located at the bottom chute 11 and the first end 111,211 of the top chute 21,
Second bolster stake 4 defines one first wafer accommodation space S1, such as Fig. 1 and Fig. 2 jointly
It is shown, whereby, the first wafer accommodation space S1 be available for it is a certain there are a specific dimensions, for example
A diameter of 8 cun of wafer 5 is accommodating and is carried on the second bearing part of second bolster stake 4
42 top surface 421；And work as second bolster stake 4 positioned at the bottom chute 11 and the top chute
21 the second end 112,212, first bolster stake 3 and second bolster stake 4 are common
One is defined to be more than and cover the second wafer accommodation space of the first wafer accommodation space S1
S2, as shown in Figures 5 and 6, whereby, the second wafer accommodation space S2 is available for another to be had
More large scale, such as a diameter of 12 cun of wafer 5' is housed and is carried on described first,
The top surface 321,421 of first, second bearing part 32,42 of two bolster stakes 3,4.
Second bolster stake 4 further explained below is slided by the bottom chute 11 and the top
The first end 111,211 of groove 21 is moved to the process at the second end 112,212, refering to Fig. 7
It is first, the extension 442 of the second block holding part 44 of the second bolster stake 4 is counterclockwise to Fig. 9
It is rotated by 90 °, drives trip 45 to rotate to interlock central shaft 41, trip 45 is moved to top
The lower section of the extension 213 (as shown in Figure 8) of chute 21, then by the second bolster stake 4 towards away from
The direction displacement of top board 2, now due to trip 45 shape with top chute 21 extension 213
It is engaged, therefore trip 45 can be upwardly separated from top chute 21 (as shown in Figure 9)；Referring again to figure
10 to Figure 12, then, the second bolster stake 4 is moved to from the first end 211 of top chute 21
Second end 212 (as shown in Figure 10), then by the second bolster stake 4 towards near the direction of top board 2 position
Move, the cooperation of section 441 that fastens of the second block holding part 44 is fastened in the second end 212 of top chute 21
, finally turn 90 degrees for the dextrorotation of extension 442 by (as shown in figure 11), blocks trip 45
Top board 2 (as shown in figure 12) is butted on, said second bolster stake 4 just reaches top chute 21
The second end 112.Wherein, Fig. 8 to Figure 12 is only explained with single the second bolster stake 4,
Because its mode of operation is identical.Therefore, by second bolster stake 4 can in bottom chute 11 and
Moved between the first end 111,211 of top chute 21 and the second end 112,212, the present embodiment
Wafer bearing device just can carry various sizes of wafer.
It is noted that in some processing procedures, the wafer bearing device of the present embodiment needs upset
And the accommodating direction of wafer is converted, for example it is changed to be disposed vertically by horizontal positioned, and trip 45
Design just can prevent the second displacement in their extension direction of bolster stake 4, enable wafer 5,5'
The first wafer accommodation space S1 or the second wafer accommodation space S2 is maintained at, positioned at described second
The top surface 421 of the second bearing part 42 of bolster stake 4 and the bottom surface 422 of another second bearing part 42
Between, or positioned at first and second bearing part 32,42 of first and second bolster stake 3,4
Top surface 321,421 and another first and second bolster stake 3,4 first and second bearing part
32nd, between 42 bottom surface 322,422.
In sum, can be on the bottom chute 11 and the top by second bolster stake 4
Moved between the first end 111,211 of chute 21 and the second end 112,212, when described second
Bolster stake 4 is located at the first end 111,211 of bottom chute 11 and top chute 21, and described second holds
Carry post 4 and define one first wafer accommodation space S1, coordinate the top surface 421 of the second bearing part 42
It is available for the wafer 5 of accommodating reduced size；When second bolster stake 4 is located at bottom chute 11 and top
Second end 112,212 of chute 21, first bolster stake 3 and second bolster stake 4
One is defined jointly to be more than and cover the accommodating sky of the second wafer of the first wafer accommodation space S1
Between S2 coordinate the top surface 321,421 of the first bearing part 32 and the second bearing part 42 to be available for housing
The wafer 5' of large-size, reaching makes wafer bearing device of the present invention be available for various sizes of wafer
Shared effect, so the purpose of the present invention can be reached really.
Only as described above, only embodiments of the invention, when this hair can not be limited with this
The scope of bright implementation, it is every according to claims of the present invention and description made it is simple
Equivalence changes and modification, all still belong in the range of the present invention covers.
Claims (8)
1. a kind of wafer bearing device, it is characterised in that the wafer bearing device is included：
One base plate, the base plate forms at least three bottom chutes separately, each bottom chute tool
There are a first end and one second end；
One top board, the top board forms at least three top chutes separately, the top chute position
Put corresponding with the bottom chute of the base plate, each top chute has a first end and one second end；
At least two the first bolster stakes separately, is arranged in the base plate and top board；And
At least three second bolster stakes, second bolster stake is by the bottom chute and described
Top chute is arranged in the base plate and the top board, and can be in the bottom chute and the top chute
Moved between first end and the second end, when second bolster stake is located at the bottom chute and top cunning
The first end of groove, second bolster stake defines one first wafer accommodation space jointly, when
Second bolster stake is located at the bottom chute and the second end of the top chute, and described first carries
Post and second bolster stake define one and are more than and cover the first wafer accommodation space jointly
The second wafer accommodation space.
2. wafer bearing device as claimed in claim 1, it is characterised in that the top board
A central point is defined, the first end of the top chute is somebody's turn to do around the central point annular arrangement
Push up chute first end and the central point distance less than second end and the central point away from
From.
3. wafer bearing device as claimed in claim 2, it is characterised in that every 1
First end of the contact of one bolster stake and the top board with the distance of the central point more than the top chute
With the distance of the central point.
4. wafer bearing device as claimed in claim 1, it is characterised in that every 1
One bolster stake includes that a central shaft and multiple stackings are set in the first carrying on the central shaft
Part, the central shaft is through the base plate, first bearing part and the top board and is fixed in the bottom
Plate and the top board, every 1 first bearing part have a top surface and a bottom surface, top surface direction top
Plate, the bottom surface is towards base plate.
5. wafer bearing device as claimed in claim 1, it is characterised in that described
Two bolster stakes around the central point annular arrangement, every 1 second bolster stake include a central shaft and
Multiple stacking is set in the second bearing part on the central shaft, and the central shaft movably wears
The base plate, second bearing part and the top board, the central shaft extend outward one first card
Support and one second block holding part, every 1 first block holding part fasten bottom chute corresponding in the base plate,
Every 1 second block holding part fastens top chute corresponding in the top board, and every 1 second bearing part has
One top surface and a bottom surface, towards top board, the bottom surface is towards base plate for the top surface.
6. wafer bearing device as claimed in claim 5, it is characterised in that this second
Block holding part has one to fasten section and an extension, and this fastens the area of section top surface more than bottom surface
Area and substantially be in cone wide at the top and narrow at the bottom, the extension fastens a section top surface and prolongs upwards from this
Stretch cylindrical, the first end of the top chute and the second end form fit this fasten section.
7. wafer bearing device as claimed in claim 6, it is characterised in that this second
Bolster stake also includes a trip, and the trip fastens section lower section simultaneously certainly positioned at first block holding part
The central shaft of second bolster stake away from axis direction extend, be used to fasten in the top board in case
Only second bolster stake relative to the top board upper and lower displacement, less than the top slide by the width of the trip
Groove.
8. wafer bearing device as claimed in claim 7, it is characterised in that slide on the top
Both the first end of groove and the second end one of which further extend outward out an extension, the extension
The shape size of section coordinates the trip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510799448.9A CN106783701A (en) | 2015-11-19 | 2015-11-19 | Wafer bearing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510799448.9A CN106783701A (en) | 2015-11-19 | 2015-11-19 | Wafer bearing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106783701A true CN106783701A (en) | 2017-05-31 |
Family
ID=58914712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510799448.9A Pending CN106783701A (en) | 2015-11-19 | 2015-11-19 | Wafer bearing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106783701A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993968A (en) * | 2018-01-08 | 2018-05-04 | 中国电子科技集团公司第四十六研究所 | A kind of bogey for special-shaped chip |
| CN110610885A (en) * | 2018-06-14 | 2019-12-24 | 家登精密工业股份有限公司 | Substrate carrier |
| CN112992745A (en) * | 2021-02-08 | 2021-06-18 | 江苏亚电科技有限公司 | Wafer cleaning is with basket of flowers that is applicable to not unidimensional |
| CN115621165A (en) * | 2022-10-20 | 2023-01-17 | 上海世禹精密机械有限公司 | Wafer sorting machine |
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| TW438054U (en) * | 1999-12-17 | 2001-05-28 | Tuochi Technology Co Ltd | Wafer carrying device |
| CN2833883Y (en) * | 2005-11-08 | 2006-11-01 | 深圳市捷佳创精密设备有限公司 | Silicon wafer basket |
| EP1652216B1 (en) * | 2003-07-28 | 2011-10-19 | Semco Engineering S.A. | Convertible pad support for receiving at least two pads of different dimensions |
| CN202189767U (en) * | 2011-08-24 | 2012-04-11 | 苏州日和科技有限公司 | Adjustable liquid crystal sheet carrying frame |
| KR20120114865A (en) * | 2011-04-08 | 2012-10-17 | (주)리드엔지니어링 | Wafer supporting boat for manufacturing solar cell |
| CN103183182A (en) * | 2011-12-29 | 2013-07-03 | 象牙弗隆泰克株式会社 | Glass substrate loading cassette for adjusting interval between slot bars |
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2015
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW438054U (en) * | 1999-12-17 | 2001-05-28 | Tuochi Technology Co Ltd | Wafer carrying device |
| EP1652216B1 (en) * | 2003-07-28 | 2011-10-19 | Semco Engineering S.A. | Convertible pad support for receiving at least two pads of different dimensions |
| CN2833883Y (en) * | 2005-11-08 | 2006-11-01 | 深圳市捷佳创精密设备有限公司 | Silicon wafer basket |
| KR20120114865A (en) * | 2011-04-08 | 2012-10-17 | (주)리드엔지니어링 | Wafer supporting boat for manufacturing solar cell |
| CN202189767U (en) * | 2011-08-24 | 2012-04-11 | 苏州日和科技有限公司 | Adjustable liquid crystal sheet carrying frame |
| CN103183182A (en) * | 2011-12-29 | 2013-07-03 | 象牙弗隆泰克株式会社 | Glass substrate loading cassette for adjusting interval between slot bars |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993968A (en) * | 2018-01-08 | 2018-05-04 | 中国电子科技集团公司第四十六研究所 | A kind of bogey for special-shaped chip |
| CN110610885A (en) * | 2018-06-14 | 2019-12-24 | 家登精密工业股份有限公司 | Substrate carrier |
| CN110610885B (en) * | 2018-06-14 | 2022-08-26 | 家登精密工业股份有限公司 | Substrate carrier |
| CN112992745A (en) * | 2021-02-08 | 2021-06-18 | 江苏亚电科技有限公司 | Wafer cleaning is with basket of flowers that is applicable to not unidimensional |
| CN115621165A (en) * | 2022-10-20 | 2023-01-17 | 上海世禹精密机械有限公司 | Wafer sorting machine |
| CN115621165B (en) * | 2022-10-20 | 2023-09-01 | 上海世禹精密设备股份有限公司 | Wafer sorting machine |
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Application publication date: 20170531 |